WO2023160836A1 - Substrate support assembly, substrate processing apparatus method for fixing an edge support frame to a table frame, and method of manufacturing a portion of a display device - Google Patents

Substrate support assembly, substrate processing apparatus method for fixing an edge support frame to a table frame, and method of manufacturing a portion of a display device Download PDF

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Publication number
WO2023160836A1
WO2023160836A1 PCT/EP2022/070532 EP2022070532W WO2023160836A1 WO 2023160836 A1 WO2023160836 A1 WO 2023160836A1 EP 2022070532 W EP2022070532 W EP 2022070532W WO 2023160836 A1 WO2023160836 A1 WO 2023160836A1
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WO
WIPO (PCT)
Prior art keywords
substrate
frame
pins
support frame
support assembly
Prior art date
Application number
PCT/EP2022/070532
Other languages
French (fr)
Inventor
Reiner Hinterschuster
Lokesha REDDY
Suhas Bhoski
Ujwal Mukkati NANJAPPA
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Publication of WO2023160836A1 publication Critical patent/WO2023160836A1/en

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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50Substrate holders
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32715Workpiece holder
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/35Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/352Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target

Definitions

  • Embodiments of the present disclosure relate to supporting a substrate, for example, on a substrate support assembly. Particularly, embodiments of the present disclosure relate to a substrate being masked and fixed to a substrate support assembly. Further, a substrate support assembly can be configured to move around an axis, e.g. to rotate. Embodiments include movable pins. Embodiments of the present disclosure specifically relate to a substrate support assembly, a substrate processing apparatus, a method of fixing an edge support frame to a table frame, and a method of manufacturing a portion of a display device.
  • a substrate may be coated by using an evaporation process, a physical vapor deposition (PVD) process, such as a sputtering process, a spraying process, etc., or a chemical vapor deposition (CVD) process.
  • PVD physical vapor deposition
  • CVD chemical vapor deposition
  • a substrate on which material is deposited i.e. a substrate to be coated, is introduced into a vacuum chamber of a vacuum processing system and is positioned relative to a processing area of the vacuum chamber of the vacuum processing system.
  • a coating process can take place in the vacuum chamber.
  • Coating processes i.e. material deposition processes
  • Coated substrates can be used further in several technical fields with applications e.g. in microelectronics, in the production of semiconductor devices, for substrates with thin film transistors, but also for insulating panels, etc.
  • the tendency towards larger substrates, e.g. in manufacturing larger displays results in larger vacuum processing systems.
  • substrates may be held in a substrate support. Couplings of a substrate to a substrate support can involve mechanical fixtures which perform a clamping function.
  • the substrate might be masked by a mask such as an edge exclusion mask.
  • the mask might mask an edge of a substrate, and/or particularly an edge of a display device to be manufactured on a substrate.
  • Some substrate processing applications particularly during display manufacturing, include a horizontal substrate loading and a vertical substrate processing. Accordingly, a substrate swing module or substrate rotation module to change the substrate orientation from horizontal to vertical and vice versa is provided in a substrate processing apparatus.
  • a substrate support assembly for supporting a substrate.
  • the substrate support assembly includes a table body having a surface configured to face the substrate; a table frame coupled to the table body; an edge support frame movable with respect to the table frame; and one or more pins coupled to the table body or the table frame and movable with respect to the table body and configured to exert a force on the substrate.
  • a substrate processing apparatus includes a substrate support assembly according to any of the embodiments described herein, wherein the table frame and the edge support frame are provided within a vacuum chamber of the substrate processing apparatus.
  • a method of fixing an edge support frame to a table frame of a substrate processing apparatus includes lowering a substrate towards a surface of the table body, the surface being configured to face the substrate; lowering the edge support frame towards the table frame; moving a plurality of pins towards the table frame or a table body upon lowering at least one of the substrate and the edge support frame; and fixing the edge support frame to the table frame.
  • a method of manufacturing a portion of a display device includes a method of fixing an edge support frame to a table frame of a substrate processing apparatus according to any of the embodiments described herein; and depositing a material layer on a substrate provided partially between the table body and the edge support frame.
  • FIG. 1 shows a schematic sectional side view of a portion of a substrate support assembly according to embodiments of the present disclosure
  • FIG. 2 shows a further schematic sectional side view of a portion of a substrate support assembly according to embodiments of the present disclosure
  • FIG. 3 shows a schematic top-down view of a substrate support assembly according to embodiments of the present disclosure
  • FIG. 4 shows a schematic side view of a substrate support assembly with a plurality of movable pins according to embodiments of the present disclosure
  • FIG. 5 shows a schematic view of a substrate processing apparatus according to embodiments of the present disclosure.
  • FIG. 6 shows a flow chart illustrating one or more methods of supporting a substrate in a deposition apparatus according to embodiments of the present disclosure.
  • Deposition systems can include a substrate support assembly, often including a substrate support table such as a table body, and a table frame coupled to the table body.
  • the table frame can be reversibly coupled to an edge support frame (ESF).
  • ESF edge support frame
  • the ESF can support a mask, such as a mask for edge exclusion, particularly for edge exclusion for a display device edge of one or more displays devices on a substrate.
  • a substrate can be positioned between the table body and the edge support frame or the mask.
  • a substrate is typically arranged between the table frame and the ESF.
  • the ESF is coupled to the table frame. This may partially hold the mask and the substrate in place for processing.
  • the processing can involve tilting of the substrate support assembly for coating, i.e. a movement between different substrate orientations.
  • the ESF is separated from the table frame and the coated substrate is exchanged.
  • the coupling between the table frame and the ESF should be stable during processing and easily separable for exchanging the substrate.
  • a substrate support assembly can include magnetic clamps to hold the mask against the substrate.
  • the design of the mask includes e.g. device openings. Particularly at or around mask openings, the mask may not make enough contact with the substrate uniformly over the entire area. This affects process uniformity and shadow effect at the device openings.
  • the relative position of the substrate and the mask and sufficient contact of the substrate and the mask can be provided in a vertical substrate orientation for embodiments of the present disclosure, particularly when including a change in substrate orientation.
  • Embodiments of the present disclosure include pins providing a passive force, for example, the pins are movable along a direction of the force.
  • the pins can be spring-loaded pins.
  • the pins can be provided below a substrate bottom and are configured to exert force in a direction towards the mask, e.g. in an upward direction to hold the substrate against the mask during a horizontal substrate orientation.
  • Embodiments described herein particularly relate to components of substrate processing apparatuses, e.g. of deposition systems for the deposition of materials, e.g. for display manufacturing on large area substrates or on a plurality of coupons, i.e. smaller substrate pieces, that can be provided on a carrier or coupon tray.
  • substrate processing apparatuses e.g. of deposition systems for the deposition of materials, e.g. for display manufacturing on large area substrates or on a plurality of coupons, i.e. smaller substrate pieces, that can be provided on a carrier or coupon tray.
  • large area substrates or carriers supporting one or more substrates may have a size of at least 0.5 m 2
  • the deposition system may be adapted for processing large area substrates, such as substrates of GEN 5, which corresponds to about 1.4 m 2 substrates (1.1 m x 1.3 m), GEN 7.5, which corresponds to about 4.29 m 2 substrates (1.95 m x 2.2 m), GEN 8.5, which corresponds to about 5.7 m 2 substrates (2.2 m x 2.5 m), or even GEN 10, which corresponds to about 8.7 m 2 substrates (2.85 m x 3.05 m).
  • Even larger generations such as GEN 11 and GEN 12 and corresponding substrate areas can similarly be implemented.
  • half sizes of the above-mentioned substrate generations can be processed.
  • semiconductor wafers may be processed and coated in deposition systems according to the present disclosure.
  • substrates may in particular have a surface of 1 m2 or above.
  • substrate may particularly embrace substrates like glass substrates for display manufacturing.
  • substrate may also embrace substrates like wafers, slices of transparent crystal such as sapphire or the like.
  • substrate may embrace other substrates that can be inflexible or flexible, like e.g. a foil or a web.
  • the substrate may be formed by any material suitable for material deposition.
  • a substrate can be provide as a large area glass plate.
  • a substrate can be or can include a plurality of smaller substrates or substrate pieces, such as coupons, which can be provided on a carrier or a coupon tray.
  • the coupons might be arranged in a 2 x 2, 2 x 3, 3 x 3, 4 x 3, or 4 x 4 array. Also, a larger number of coupons might be provided, for example, in an array.
  • the coupon tray can be provided having a metal plate with outside dimensions as compared to a glass substrate, i.e. a large area glass substrate.
  • the coupon tray may have 4, 6, 9, 12, or a larger number of cut outs or openings for the smaller coupons, e.g. coupon glasses.
  • the pins or movable pins according to embodiments of the present disclosure allow for securing the coupons in the tray and provide a force against a mask to have friction for tilting and improved shadow effect.
  • Some embodiments described herein can particularly relate to components of a deposition system in which substrates, which can be substrates as described above, are loaded and unloaded in a horizontal orientation and in which the substrates are processed, e.g. coated, in a vertical orientation.
  • the components of the deposition system according to embodiments described herein are suitable for use in a deposition apparatus in which a substrate is supported in different orientations, particularly in a deposition apparatus including a tilt drive for moving a substrate between a horizontal and a vertical orientation.
  • Embodiments described herein relate to the masking of a substrate, and particularly to have appropriate force of a substrate against a mask to have friction for tilting and improved shadow effect, particularly for fixtures which can be reversibly coupled and decoupled. Further, glass breakage can be reduced by a controlled force of the movable pins.
  • a decoupling typically involves a motion which separates an ESF from a table frame. The ESF and the table frame can be provided horizontally, and the motion of the ESF can be performed in a vertical direction.
  • FIG. 1 shows a portion of the substrate support assembly 100.
  • the substrate support assembly 100 is configured to support the substrate 10.
  • the substrate 10 can be a substrate for display manufacturing as described herein.
  • the substrate support assembly 100 includes a table body 102 having a surface configured to face the substrate.
  • Table frame 106 is coupled to the table body 102.
  • An edge support frame 112 is supported to be movable with respect to the table frame. Accordingly, the edge support frame supporting the shadow frame 114 or the edge exclusion mask, respectively, can move the edge exclusion mask relative to the substrate. For example, the edge exclusion mask is moved relative to the substrate and/or the surface of the table body for loading or unloading of the substrate.
  • the edge support frame 112 can be fixed to the table frame by one or more fixtures, for example, magnetic fixtures 120.
  • the one or more magnetic fixtures include a respective first member 122 including a magnet and a respective second member 124 including a magnetic element.
  • the one or more magnetic fixtures provide a force to support the substrate 10 between the table body and the mask. Supporting the substrate between the table body and the mask is advantageous to have contact of the substrate with the mask and to provide friction for the substrate to have a stable position, particularly when the substrate support assembly moves between a horizontal orientation and a vertical orientation.
  • one or more pins 150 are provided.
  • the pins are movable as indicated by the arrow in FIG. 1, the pins provide additional force from the substrate towards the mask. In a horizontal loading orientation, the additional force is provided from the substrate bottom.
  • improved contact with the mask can be provided.
  • the improved contact of the substrate with the mask is provided at the front side of the substrate, i.e. at a side of the substrate to be processed.
  • the substrate processing can be a layer deposition, particularly with a PVD process such as a sputtering process.
  • a sputtering process may include sputtering from an array of rotatable sputter cathodes.
  • the rotatable sputter cathodes can be cylindrical.
  • the additional force generated by the pins provide more friction between the substrate and the mask.
  • An improved alignment with openings in the mask, for example, device openings on the mask can be provided in the process position.
  • a substrate support assembly for supporting a substrate.
  • the substrate support assembly includes a table body having a surface configured to face the substrate and a table frame coupled to the table body. Further, an edge support frame movable with respect to the table frame is provided.
  • the substrate support assembly includes one or more pins movable with respect to the table body, for example, towards and away from the edge support frame.
  • the one or more pins are configured to exert a force on the substrate, particularly to enhance contact of the substrate with the mask.
  • the one or more pins are coupled to the table body or the table frame.
  • the one or more pins can be movable in a direction perpendicular to the surface of the table body.
  • the one or more pins can be movable to protrude from the surface of the table body towards the edge support frame. Having the one or more pins being movable, glass breakage can be reduced or avoided. Glass breakage may occur due to over compression of the mask against the substrate for a stationary pin or solid pin, particularly as manufacturing tolerances may stack up.
  • the one or more pins can be spring-loaded pins.
  • the spring-loaded pins can provide at least one mechanical force.
  • the spring-loaded pins can include a mechanical spring or an elastomer providing an elastic force.
  • the spring-load is indicated by reference numeral 152 in FIG. 1.
  • the spring-loaded pins or spring-loaded support pins exert uniform pressure or force from one side of the substrate towards the opposing side of the substrate contacting the mask. Accordingly, a force in addition to the clamping force by the plurality of magnetic fixtures can be provided.
  • the clamping force by the magnetic fixtures is provided from the top while the edge support frame 112 is clamped to the table frame 106 by the magnetic fixtures 120.
  • a magnetic fixture 120 can include a first member 122 including, for example, a magnet. Further, a second member 124 including a magnetic element is provided. At least one of the first member and the second member is provided in the recess within the table frame 106. Magnetic forces between the first member and the second member fix the edge support frame to the table frame.
  • the magnet may include a permanent magnet.
  • the magnetic element can include ferromagnetic material.
  • the first member 122 includes a magnet.
  • the magnet produces a magnetic field, particularly when the magnetic fixture 120 is in the coupled state.
  • the magnet can be a permanent magnet, such as a neodymium magnet, particularly aN38 NdFeB magnet.
  • Other permanent magnets can be suitable, such as samarium-cobalt magnets or an alnico magnet.
  • the magnet can be an electromagnet, particularly a switchable electromagnet.
  • the electromagnet can have a coil. The coil can be adapted for interacting with a magnetic element, such as ferromagnetic element, particularly a ferromagnetic pin.
  • the coil can be toroidal or a hollow cylinder, such that the coil has an interior hollow portion.
  • the coil can be adapted for having a ferromagnetic pin at least partially inserted into a central hollow portion of the coil, such that the ferromagnetic pin interacts with the magnetic field produced by the electromagnet, particularly such that the ferromagnetic pin is attracted by the electromagnet.
  • the electromagnet can be driven by a driving circuit.
  • the second member 124 includes a magnetic element.
  • the magnetic element can be the second member 124.
  • the magnetic element can be a ferromagnetic component, e.g. a metal component, such as a steel component, particularly a stainless- steel component, such as a component including DIN 1.2083 steel.
  • the magnetic element can comprise a ferromagnetic material.
  • the second member can include further materials or material combinations, such as a ferrite material, provided that the second member 124 interacts with the magnetic field produced by the magnet when the magnetic fixture 120 is in the coupled state such that an attracting force, e.g. a magnetic force, is exerted between the first member and the second member.
  • the first member can be partially or fully provided in a recess within the table frame, which can have the same beneficial effect as providing the second member within a recess.
  • FIG. 2 shows a further schematic view of a portion of a substrate support assembly.
  • Three pins 150 which are movable with respect to the table frame or with respect to the table body 102 are shown. The movement is indicated by the arrows in the pins 150.
  • reference numeral 152 illustrates the spring load of the pins 150.
  • the substrate 10 is supported between the surface 104 of the table body 102.
  • the pins 150 are movable towards and away from the edge support frame and are configured to exert a force on the substrate. For example, as exemplarily shown in FIG. 2, in the horizontal orientation, an upwards force is provided by the spring-loaded pins from the bottom of the substrate 10 towards the mask 20.
  • the one or more pins are movable in a direction perpendicular to the surface. Further, the one or more pins can be moved to protrude from the surface towards the edge support frame, i.e. upwardly in FIG. 2. Accordingly, before loading of the substrate is completed, the pins protrude from the surface. During loading of the substrate, the substrate is lowered and the clamp force of the magnetic fixtures is provided. When the clamp force is applied, the substrate moves down and moves the pin. The spring-loaded pins receive the load and/or are compressed.
  • the spring-load provides additional force from the bottom to allow for better contact of the substrate with the mask.
  • the improved contact improves a shadow effect and reduces under-coating of a deposition material below the edge exclusion mask.
  • the support pin can be provided at the mask position having a device opening 22, for example a device opening with a dimension 23.
  • the shadow frame can provide an edge exclusion mask for one or more devices, i.e. display devices, to be manufactured on the substrate.
  • the mask can include Invar or other nickel-iron alloys with a thermal expansion coefficient of below 10' 5 K' 1 .
  • FIG. 3 shows a schematic view from the top of the substrate support assembly 100.
  • the edge support frame 112 includes a plurality of openings, which may correspond to a plurality of device openings 22 in the shadow frame or mask. Further, the plurality of magnetic fixtures 120 are provided to couple the edge support frame 112 to the table frame (not shown).
  • a plurality of pins 150 for example, spring-loaded pins can be provided. As shown in FIG. 3, pins can be provided at positions of a device opening 22 and/or at positions of the edge support frame 112. The pins 150 provide a force from a first side of the substrate facing the table body towards a second side of the substrate, the second side facing the mask or the edge support frame 112, respectively.
  • Spring-loaded pins may also be referred to as a clamp, particularly a clamp for clamping a substrate between the table body and the edge support frame.
  • a clamp can be referred to as a fastening device used to hold or secure the substrate between the substrate support surface and the edge support frame, for example, to prevent movement or separation. Particularly, the movement relative to the edge exclusion mask can be reduced.
  • a substrate support assembly 100 including a plurality of magnetic fixtures 120 and a plurality of pins 150 according to embodiments described herein is shown schematically in a side view.
  • the substrate support assembly 100 includes a table body with a table frame 106.
  • the first members 122 of the plurality of magnetic fixtures are provided within recesses within the table frame.
  • the substrate support assembly includes an ESF 112.
  • the ESF 112 is drawn in a coupled configuration with solid lines.
  • the ESF 112 includes a plurality of second members 124 of magnetic fixtures according to an embodiment described herein.
  • the second members can be arranged such that they are opposite the first members 122 when the substrate support assembly is in the coupled configuration.
  • the plurality of second members can be provided within a plurality of recesses within the ESF 112.
  • the substrate support assembly 100 can have a substrate (not shown) arranged between the table frame 106 and the ESF 112.
  • the substrate can be fixed between the table frame and the ESF.
  • the substrate can be fixed, e.g. clamped between the table frame and the ESF, by the force provided by the plurality of magnetic fixtures.
  • the force provided between the substrate and the ESF is increased by the pins 150, for example, spring-loaded pins.
  • the pins 150 can be movable and can provide a defined force on the substrate towards the edge support frame 112.
  • the substrate support assembly 100 can include a tilt drive 420 for tilting a portion of the substrate support assembly 100, particularly the portion including a substrate, e.g. the table body with table frame 106 and the ESF 112 in the coupled configuration. Tilting the portion of the substrate support assembly can involve a tilt motion 424. The tilt motion can involve rotating, along a defined angular range, the portion of the substrate support assembly around a common axis. Tilting of the substrate support assembly can bring the portion of the substrate support assembly from a horizontal orientation into a vertical orientation, such as the vertical orientation 426 shown in FIG. 4.
  • the vertical orientation can be used advantageously for operations of a substrate processing, such as a material deposition operation.
  • the horizontal orientation can be used advantageously for other operations of a substrate processing, such as loading and/or unloading of the substrate.
  • the substrate support assembly may also include a linear actuator.
  • a sweep drive to move the table body in a direction parallel to the axis of the tilt drive shown in FIG. 5 can be provided.
  • a linear actuator to move the table body towards and away from the substrate processing area can be provided. Accordingly, a movement, such as a linear movement, of the substrate can occur, particularly when the substrate is provided in a vertical orientation.
  • the sweep drive may be utilized to move the substrate relative to a cathode array.
  • the force on the substrate is beneficially large enough to maintain the substrate position relative to the mask during tilting and/or during linear movement, e.g. in a vertical orientation during coating.
  • the forces on the substrate e.g. the residual spring forces of the movable pins, push the substrate against the mask.
  • the created friction force is bigger than the substrate weight (in vertical table position) and any other acceleration forces of tilt table motion or sweeping motion.
  • the substrate support assembly 100 can include a lift pin assembly including lift pins 410 and lift pin drive 412.
  • the lift pin assembly can be configured for specifically lifting portions of the substrate support assembly 100, particularly for lifting the ESF 112 along a direction of ESF motion 414.
  • the direction of ESF motion 414 can be an axial direction according to embodiments described herein.
  • the action of the lift pin assembly can bring the substrate support assembly 100 from a coupled state into an uncoupled state 416 by lifting the ESF in an axial direction with respect to the table frame 106.
  • This can separate the first members of the plurality of magnetic fixtures from the second members of the plurality of magnetic fixtures. Separating the plurality of first members from the plurality of second members can bring each of the plurality of magnetic fixtures from a coupled state into an uncoupled state.
  • the uncoupled state can be utilized for loading and/or unloading of the substrate.
  • a substrate support assembly can include a plurality of lift pins for at least one of reversibly lifting and lowering the edge support frame with respect to the table frame and/or for at least one of reversibly lifting and lowering the substrate onto the plurality of pins.
  • lift pins reversibly lifting and lowering the edge support frame lifting the edge support frame separates the magnetic fixtures between the table frame and the edge support frame and lowering the edge support frame applies the edge support frame to the table frame such that the elements of the magnetic fixtures are coupled to each other.
  • the substrate support assembly can include a tilt drive wherein the tilt drive is configured to move the table body between a horizontal and a vertical orientation.
  • a sweep drive can be provided, e.g. for a linear movement along a cathode array.
  • a horizontal orientation may deviate by +- 15° from an exactly horizontal orientation and a vertical orientation may deviate by +- 15° from an exactly vertical orientation.
  • Embodiments of the present disclosure including pins for generating a force of the substrate towards the mask can be particularly advantageous for substrate processing apparatuses including the swing module or substrate rotation module (or tilt drive 420), for example, a PVD system with rotatable sputter cathodes for low damage deposition, wherein the substrates are loaded in a horizontal orientation and a material layer deposited in a vertical orientation.
  • the swing module or tilt drive respectively, the clamping force generated by the magnetic fixtures might not be sufficient during the tilting movement or in the vertical orientation.
  • the pins according to embodiments of the present disclosure improve the contact between the substrate and the mask, e.g., for better mask alignment.
  • FIG. 5 shows a substrate processing apparatus 500.
  • the substrate processing apparatus 500 includes a vacuum chamber 520.
  • the substrate support assembly 100 is provided in the vacuum chamber 520.
  • the substrate 10 located on the table body or pins coupled to the table body 102 can be moved by the tilt drive 420 generating the tilt motion 424 into a processing orientation, particularly a vertical processing orientation. In the processing orientation, material may be deposited on the substrate by the sputter cathode 510.
  • a substrate processing apparatus includes a substrate support assembly according to embodiments of the present disclosure.
  • the table frame and the edge support frame are provided within a vacuum chamber of the substrate processing apparatus.
  • a substrate support assembly as described herein, particularly a substrate support assembly 100 can be configured to be operated inside a vacuum chamber, particularly a vacuum chamber of a substrate processing apparatus, such as a deposition apparatus.
  • FIG. 5 shows a schematic view of a substrate processing apparatus 500 for material deposition on a substrate 10.
  • a substrate is moved relative to a processing area inside a vacuum chamber 520.
  • FIG. 5 shows a material deposition source.
  • the material deposition source can be a sputter cathode 510 of an array of cathodes, such as rotatable sputter cathodes.
  • the processing area is provided in an area in front of the material deposition source.
  • the edge exclusion mask may include an edge support frame and the shadow mask.
  • the shadow mask can include device openings for masking edges of one or more display devices to be manufactured on the substrate.
  • Embodiments described herein can relate to components of a deposition system in which substrates, which can be substrates as described above, are loaded and unloaded in a horizontal configuration and in which the substrates are processed, e.g. coated, in a vertical configuration.
  • a deposition system are suitable for use in a deposition apparatus in which a substrate is supported in different configurations, particularly in a deposition apparatus including a tilt drive for moving a substrate between a horizontal and a vertical configuration.
  • a vacuum processing apparatus or vacuum deposition apparatus as described in FIG. 5 can be provided in a cluster system, in which one or more vacuum processing apparatuses are coupled to a central transfer chamber, particularly a central vacuum transfer chamber.
  • FIG. 6 shows a flow chart illustrating methods according to the present disclosure.
  • the method of fixing an edge support frame to a table frame of a substrate processing apparatus is provided.
  • the substrate is moved onto the pins of the substrate support assembly. For example, the substrate is lowered towards the pins.
  • an edge support frame is moved towards the table frame. For example, the edge support frame is lowered towards the table frame.
  • the pins are moved towards the table frame or the table body, respectively.
  • the pins are moved by lowering at least one of the substrate and the edge support frame.
  • the pins are pushed by the substrate and/or the edge support frame.
  • glass breakage can be reduced, particularly as manufacturing tolerances may stack up and the pin positioned at a device opening may break the glass for a pin that is not movable.
  • the pins do not move or essentially not move by the weight (gravity force) of the substrate and moves, e.g. moves essentially only, when the ESF couples to the table frame.
  • a method of fixing an edge support frame to a table frame of a substrate processing apparatus includes lowering a substrate towards a table body and lowering an edge support frame towards a table frame. Further, the method includes moving a plurality of pins towards the table frame or a table body upon lowering at least one of the substrate and the edge support frame and fixing the edge support frame to the table frame.
  • fixing the edge support frame to the table frame can be provided by a magnetic fixture.
  • the method may further include generating a force on the substrate in the direction of the edge support frame by the plurality of pins.
  • the force can be generated by the plurality of pins comprising one or more spring-loaded pins.
  • a method of manufacturing a portion of a display device includes a method of fixing an edge support frame to a table frame of a substrate processing apparatus according to any of the embodiments of the present disclosure and deposition of a material layer on a substrate provided partially between the table frame and the edge support frame.
  • a substrate support assembly according to any of the embodiments described herein may be provided for manufacturing a portion of a display device.
  • the method of manufacturing a portion of a display device can include moving the substrate support assembly from a horizontal orientation to a vertical orientation. Particularly, the substrate support assembly may be moved the substrate is provided on the substrate support assembly. The movement can be provided by a tilt drive, i.e. drive providing a movement around an axis.
  • Embodiments of the present disclosure can provide a plurality of advantages as described herein.
  • Pin movement can reduce or nullify manufacturing tolerances that stack up and can thus reduce glass breakage.
  • the force that can be provided by the movable pins improves alignment of the substrate with respect to the mask and/or improves process uniformity. Further, the shadow effect of the mask may be improved and/or under-coating, which may in turn result in particles (contamination particles), can be reduced.
  • the substrate support assemblies and methods utilizing a substrate support assembly may be utilized for low damage deposition (LDD).
  • LDD low damage deposition
  • Facing target sputtering (FTS) systems provide plasma confinement regions facing each other, i.e. pointing directly or at least partially towards the other, opposing target. Since the plasma confinement of one or more targets is not directed towards the substrate but parallel or essentially parallel with a deviation of some degrees, e.g. up to 30°, away from the substrate or towards the substrate, damage that may occur at the substrate due to the energy of the particles being deposited on the substrate or UV radiation is reduced.
  • Low damage deposition (LDD) can be provided.
  • a method of depositing a material on a substrate can include: sputtering at least a component of the material from a first rotary target with a first magnet assembly and a second rotary target with a second magnet assembly, the first magnet assembly within the first rotary target providing a first plasma confinement in a first direction facing towards the second rotary target, and the second magnet assembly within the second rotary target providing a second plasma confinement in a second direction facing towards the first rotary target.
  • off-centric LDD can be provided to improve the damage-to-deposition-rate ratio of facing target sputtering.
  • Off-centric LDD blocks the shortest sputter paths between the plasma confinement region and the substrate by an aperture plate having centric positioned shielding portion(s).
  • An off-centric aperture can be provided with respect to the facing targets.
  • An aperture is provided, for example, exclusively provided, for longer sputter paths to reduce the kinetic particle energy and/or to block the most intense UV radiation which is emitted out of the center of the facing target, particularly on a short mean free path.
  • a substrate support assembly as described herein include a method of depositing a material on a substrate including a first deposition having sputtering from a first rotary target having a first magnet assembly having a first plasma confinement and with an aperture plate; and sputtering simultaneously from a second rotary target having a second magnet assembly having a second plasma confinement and with the aperture plate, the first plasma confinement facing the second rotary target and the second plasma confinement facing the first rotary target, the first plasma confinement and the second plasma confinement providing a plasma region between the first rotary target and the second rotary target having a center line perpendicular to a substrate surface of the substrate, the aperture plate having a body with a shielding portion configured to shield a region between the plasma region and the substrate at least at the center line.

Abstract

According to one embodiment, a substrate support assembly for supporting a substrate is provided. The substrate support assembly, includes a table body having a surface configured to face the substrate; a table frame coupled to the table body; an edge support frame movable with respect to the table frame; and one or more pins coupled to the table body or the table frame and movable with respect to the table body and configured to exert a force on the substrate.

Description

SUBSTRATE SUPPORT ASSEMBLY, SUBSTRATE PROCESSING APPARATUS METHOD FOR FIXING AN EDGE SUPPORT FRAME TO A TABLE FRAME, AND METHOD OF MANUFACTURING A PORTION OF A DISPLAY DEVICE
FIELD
[1] Embodiments of the present disclosure relate to supporting a substrate, for example, on a substrate support assembly. Particularly, embodiments of the present disclosure relate to a substrate being masked and fixed to a substrate support assembly. Further, a substrate support assembly can be configured to move around an axis, e.g. to rotate. Embodiments include movable pins. Embodiments of the present disclosure specifically relate to a substrate support assembly, a substrate processing apparatus, a method of fixing an edge support frame to a table frame, and a method of manufacturing a portion of a display device.
BACKGROUND
[2] Several methods are known for the deposition of a material on a substrate. For example, a substrate may be coated by using an evaporation process, a physical vapor deposition (PVD) process, such as a sputtering process, a spraying process, etc., or a chemical vapor deposition (CVD) process. A substrate on which material is deposited, i.e. a substrate to be coated, is introduced into a vacuum chamber of a vacuum processing system and is positioned relative to a processing area of the vacuum chamber of the vacuum processing system. For example, a coating process can take place in the vacuum chamber.
[3] Coating processes, i.e. material deposition processes, may be considered for large area substrates, e.g. in display manufacturing technology. Coated substrates can be used further in several technical fields with applications e.g. in microelectronics, in the production of semiconductor devices, for substrates with thin film transistors, but also for insulating panels, etc. The tendency towards larger substrates, e.g. in manufacturing larger displays results in larger vacuum processing systems. [4] In a coating process, substrates may be held in a substrate support. Couplings of a substrate to a substrate support can involve mechanical fixtures which perform a clamping function. The substrate might be masked by a mask such as an edge exclusion mask. For example, the mask might mask an edge of a substrate, and/or particularly an edge of a display device to be manufactured on a substrate.
[5] Some substrate processing applications, particularly during display manufacturing, include a horizontal substrate loading and a vertical substrate processing. Accordingly, a substrate swing module or substrate rotation module to change the substrate orientation from horizontal to vertical and vice versa is provided in a substrate processing apparatus.
[6] In light of the above, it is beneficial to provide an improved support for a substrate such as a large area substrate for a masked substrate processing and/or a substrate processing with orientation changes.
SUMMARY
[7] According to one embodiment, a substrate support assembly for supporting a substrate is provided. The substrate support assembly, includes a table body having a surface configured to face the substrate; a table frame coupled to the table body; an edge support frame movable with respect to the table frame; and one or more pins coupled to the table body or the table frame and movable with respect to the table body and configured to exert a force on the substrate.
[8] According to one embodiment, a substrate processing apparatus is provided. The substrate processing apparatus includes a substrate support assembly according to any of the embodiments described herein, wherein the table frame and the edge support frame are provided within a vacuum chamber of the substrate processing apparatus.
[9] According to one embodiment, a method of fixing an edge support frame to a table frame of a substrate processing apparatus is provided. The method includes lowering a substrate towards a surface of the table body, the surface being configured to face the substrate; lowering the edge support frame towards the table frame; moving a plurality of pins towards the table frame or a table body upon lowering at least one of the substrate and the edge support frame; and fixing the edge support frame to the table frame.
[10] According to one embodiment, a method of manufacturing a portion of a display device is provided. The method includes a method of fixing an edge support frame to a table frame of a substrate processing apparatus according to any of the embodiments described herein; and depositing a material layer on a substrate provided partially between the table body and the edge support frame.
BRIEF DESCRIPTION OF THE DRAWINGS
[11] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the disclosure and are described in the following.
[12]FIG. 1 shows a schematic sectional side view of a portion of a substrate support assembly according to embodiments of the present disclosure;
[13] FIG. 2 shows a further schematic sectional side view of a portion of a substrate support assembly according to embodiments of the present disclosure;
[14]FIG. 3 shows a schematic top-down view of a substrate support assembly according to embodiments of the present disclosure;
[15] FIG. 4 shows a schematic side view of a substrate support assembly with a plurality of movable pins according to embodiments of the present disclosure;
[16] FIG. 5 shows a schematic view of a substrate processing apparatus according to embodiments of the present disclosure; and
[17] FIG. 6 shows a flow chart illustrating one or more methods of supporting a substrate in a deposition apparatus according to embodiments of the present disclosure. DETAILED DESCRIPTION OF EMBODIMENTS
[18] Deposition systems can include a substrate support assembly, often including a substrate support table such as a table body, and a table frame coupled to the table body. The table frame can be reversibly coupled to an edge support frame (ESF). The ESF can support a mask, such as a mask for edge exclusion, particularly for edge exclusion for a display device edge of one or more displays devices on a substrate. A substrate can be positioned between the table body and the edge support frame or the mask.
[19] For processing, a substrate is typically arranged between the table frame and the ESF. The ESF is coupled to the table frame. This may partially hold the mask and the substrate in place for processing. The processing can involve tilting of the substrate support assembly for coating, i.e. a movement between different substrate orientations. After processing, the ESF is separated from the table frame and the coated substrate is exchanged. The coupling between the table frame and the ESF should be stable during processing and easily separable for exchanging the substrate.
[20] According to some embodiments, a substrate support assembly can include magnetic clamps to hold the mask against the substrate. The design of the mask includes e.g. device openings. Particularly at or around mask openings, the mask may not make enough contact with the substrate uniformly over the entire area. This affects process uniformity and shadow effect at the device openings. The relative position of the substrate and the mask and sufficient contact of the substrate and the mask can be provided in a vertical substrate orientation for embodiments of the present disclosure, particularly when including a change in substrate orientation. Embodiments of the present disclosure include pins providing a passive force, for example, the pins are movable along a direction of the force. The pins can be spring-loaded pins. The pins can be provided below a substrate bottom and are configured to exert force in a direction towards the mask, e.g. in an upward direction to hold the substrate against the mask during a horizontal substrate orientation.
[21] Reference will now be made in detail to the various embodiments, one or more examples of which are illustrated in each figure. Each example is provided by way of explanation and is not meant as a limitation. For example, features illustrated or described as part of one embodiment can be used on or in conjunction with any other embodiment to yield yet a further embodiment. It is intended that the present disclosure includes such modifications and variations. Within the following description of the drawings, the same reference numbers refer to the same or to similar components. Generally, only the differences with respect to the individual embodiments are described. Unless specified otherwise, the description of a part or aspect in one embodiment can apply to a corresponding part or aspect in another embodiment as well.
[22] Embodiments described herein particularly relate to components of substrate processing apparatuses, e.g. of deposition systems for the deposition of materials, e.g. for display manufacturing on large area substrates or on a plurality of coupons, i.e. smaller substrate pieces, that can be provided on a carrier or coupon tray. According to some embodiments, large area substrates or carriers supporting one or more substrates may have a size of at least 0.5 m2 For instance, the deposition system may be adapted for processing large area substrates, such as substrates of GEN 5, which corresponds to about 1.4 m2 substrates (1.1 m x 1.3 m), GEN 7.5, which corresponds to about 4.29 m2 substrates (1.95 m x 2.2 m), GEN 8.5, which corresponds to about 5.7 m2 substrates (2.2 m x 2.5 m), or even GEN 10, which corresponds to about 8.7 m2 substrates (2.85 m x 3.05 m). Even larger generations such as GEN 11 and GEN 12 and corresponding substrate areas can similarly be implemented. According to yet further implementations, half sizes of the above-mentioned substrate generations can be processed. Alternatively or additionally, semiconductor wafers may be processed and coated in deposition systems according to the present disclosure.
[23] The apparatuses and systems described herein are configured in order to mask substrates that may in particular have a surface of 1 m2 or above. The term “substrate” may particularly embrace substrates like glass substrates for display manufacturing. The term “substrate” may also embrace substrates like wafers, slices of transparent crystal such as sapphire or the like. However, the term “substrate” may embrace other substrates that can be inflexible or flexible, like e.g. a foil or a web. The substrate may be formed by any material suitable for material deposition.
[24] According to some embodiments, which can be combined with other embodiments described herein, a substrate can be provide as a large area glass plate. Alternatively, a substrate can be or can include a plurality of smaller substrates or substrate pieces, such as coupons, which can be provided on a carrier or a coupon tray. The coupons might be arranged in a 2 x 2, 2 x 3, 3 x 3, 4 x 3, or 4 x 4 array. Also, a larger number of coupons might be provided, for example, in an array. The coupon tray can be provided having a metal plate with outside dimensions as compared to a glass substrate, i.e. a large area glass substrate.
[25] According to some embodiments, the coupon tray may have 4, 6, 9, 12, or a larger number of cut outs or openings for the smaller coupons, e.g. coupon glasses. The pins or movable pins according to embodiments of the present disclosure allow for securing the coupons in the tray and provide a force against a mask to have friction for tilting and improved shadow effect.
[26] Some embodiments described herein can particularly relate to components of a deposition system in which substrates, which can be substrates as described above, are loaded and unloaded in a horizontal orientation and in which the substrates are processed, e.g. coated, in a vertical orientation. Particularly, the components of the deposition system according to embodiments described herein are suitable for use in a deposition apparatus in which a substrate is supported in different orientations, particularly in a deposition apparatus including a tilt drive for moving a substrate between a horizontal and a vertical orientation.
[27] Embodiments described herein relate to the masking of a substrate, and particularly to have appropriate force of a substrate against a mask to have friction for tilting and improved shadow effect, particularly for fixtures which can be reversibly coupled and decoupled. Further, glass breakage can be reduced by a controlled force of the movable pins. A decoupling typically involves a motion which separates an ESF from a table frame. The ESF and the table frame can be provided horizontally, and the motion of the ESF can be performed in a vertical direction.
[28] FIG. 1 shows a portion of the substrate support assembly 100. The substrate support assembly 100 is configured to support the substrate 10. The substrate 10 can be a substrate for display manufacturing as described herein. The substrate support assembly 100 includes a table body 102 having a surface configured to face the substrate. Table frame 106 is coupled to the table body 102. An edge support frame 112 is supported to be movable with respect to the table frame. Accordingly, the edge support frame supporting the shadow frame 114 or the edge exclusion mask, respectively, can move the edge exclusion mask relative to the substrate. For example, the edge exclusion mask is moved relative to the substrate and/or the surface of the table body for loading or unloading of the substrate.
[29] After loading of the substrate, the edge support frame 112 can be fixed to the table frame by one or more fixtures, for example, magnetic fixtures 120. The one or more magnetic fixtures include a respective first member 122 including a magnet and a respective second member 124 including a magnetic element. The one or more magnetic fixtures provide a force to support the substrate 10 between the table body and the mask. Supporting the substrate between the table body and the mask is advantageous to have contact of the substrate with the mask and to provide friction for the substrate to have a stable position, particularly when the substrate support assembly moves between a horizontal orientation and a vertical orientation.
[30] According to embodiments of the present disclosure, one or more pins 150 are provided. The pins are movable as indicated by the arrow in FIG. 1, the pins provide additional force from the substrate towards the mask. In a horizontal loading orientation, the additional force is provided from the substrate bottom. Accordingly, improved contact with the mask can be provided. The improved contact of the substrate with the mask is provided at the front side of the substrate, i.e. at a side of the substrate to be processed. For example, the substrate processing can be a layer deposition, particularly with a PVD process such as a sputtering process. A sputtering process may include sputtering from an array of rotatable sputter cathodes. The rotatable sputter cathodes can be cylindrical.
[31] The additional force generated by the pins provide more friction between the substrate and the mask. An improved alignment with openings in the mask, for example, device openings on the mask can be provided in the process position.
[32] According to an embodiment, a substrate support assembly for supporting a substrate is provided. The substrate support assembly includes a table body having a surface configured to face the substrate and a table frame coupled to the table body. Further, an edge support frame movable with respect to the table frame is provided. The substrate support assembly includes one or more pins movable with respect to the table body, for example, towards and away from the edge support frame. The one or more pins are configured to exert a force on the substrate, particularly to enhance contact of the substrate with the mask. The one or more pins are coupled to the table body or the table frame. For example, the one or more pins can be movable in a direction perpendicular to the surface of the table body. Additionally or alternatively, the one or more pins can be movable to protrude from the surface of the table body towards the edge support frame. Having the one or more pins being movable, glass breakage can be reduced or avoided. Glass breakage may occur due to over compression of the mask against the substrate for a stationary pin or solid pin, particularly as manufacturing tolerances may stack up.
[33] According to some embodiments, which can be combined with other embodiments described herein, the one or more pins can be spring-loaded pins. For example, the spring-loaded pins can provide at least one mechanical force. For example, the spring-loaded pins can include a mechanical spring or an elastomer providing an elastic force. The spring-load is indicated by reference numeral 152 in FIG. 1.
[34] The spring-loaded pins or spring-loaded support pins exert uniform pressure or force from one side of the substrate towards the opposing side of the substrate contacting the mask. Accordingly, a force in addition to the clamping force by the plurality of magnetic fixtures can be provided. The clamping force by the magnetic fixtures is provided from the top while the edge support frame 112 is clamped to the table frame 106 by the magnetic fixtures 120.
[35] As shown in FIG. 1, a magnetic fixture 120 can include a first member 122 including, for example, a magnet. Further, a second member 124 including a magnetic element is provided. At least one of the first member and the second member is provided in the recess within the table frame 106. Magnetic forces between the first member and the second member fix the edge support frame to the table frame. For example, the magnet may include a permanent magnet. Additionally or alternatively, the magnetic element can include ferromagnetic material.
[36] The first member 122 includes a magnet. The magnet produces a magnetic field, particularly when the magnetic fixture 120 is in the coupled state. The magnet can be a permanent magnet, such as a neodymium magnet, particularly aN38 NdFeB magnet. Other permanent magnets can be suitable, such as samarium-cobalt magnets or an alnico magnet. According to embodiments, which can be combined with other embodiments described herein, the magnet can be an electromagnet, particularly a switchable electromagnet. The electromagnet can have a coil. The coil can be adapted for interacting with a magnetic element, such as ferromagnetic element, particularly a ferromagnetic pin. The coil can be toroidal or a hollow cylinder, such that the coil has an interior hollow portion. The coil can be adapted for having a ferromagnetic pin at least partially inserted into a central hollow portion of the coil, such that the ferromagnetic pin interacts with the magnetic field produced by the electromagnet, particularly such that the ferromagnetic pin is attracted by the electromagnet. The electromagnet can be driven by a driving circuit.
[37] According to embodiments, which can be combined with other embodiments described herein, the second member 124 includes a magnetic element. The magnetic element can be the second member 124. The magnetic element can be a ferromagnetic component, e.g. a metal component, such as a steel component, particularly a stainless- steel component, such as a component including DIN 1.2083 steel. The magnetic element can comprise a ferromagnetic material. The second member can include further materials or material combinations, such as a ferrite material, provided that the second member 124 interacts with the magnetic field produced by the magnet when the magnetic fixture 120 is in the coupled state such that an attracting force, e.g. a magnetic force, is exerted between the first member and the second member.
[38] According to embodiments, which can be combined with other embodiments described herein, the first member can be partially or fully provided in a recess within the table frame, which can have the same beneficial effect as providing the second member within a recess.
[39] The additional force provided by the pins 150 improve the mask alignment and result in a reduced shadow effect, i.e. reduced undercoating and, thus, particle generation. FIG. 2 shows a further schematic view of a portion of a substrate support assembly. Three pins 150, which are movable with respect to the table frame or with respect to the table body 102 are shown. The movement is indicated by the arrows in the pins 150. Further, reference numeral 152 illustrates the spring load of the pins 150. The substrate 10 is supported between the surface 104 of the table body 102. The pins 150 are movable towards and away from the edge support frame and are configured to exert a force on the substrate. For example, as exemplarily shown in FIG. 2, in the horizontal orientation, an upwards force is provided by the spring-loaded pins from the bottom of the substrate 10 towards the mask 20.
[40] According to some embodiments, which can be combined with other embodiments described herein, the one or more pins are movable in a direction perpendicular to the surface. Further, the one or more pins can be moved to protrude from the surface towards the edge support frame, i.e. upwardly in FIG. 2. Accordingly, before loading of the substrate is completed, the pins protrude from the surface. During loading of the substrate, the substrate is lowered and the clamp force of the magnetic fixtures is provided. When the clamp force is applied, the substrate moves down and moves the pin. The spring-loaded pins receive the load and/or are compressed. In the processing position of the substrate relative to the edge support frame and the table body, the spring-load provides additional force from the bottom to allow for better contact of the substrate with the mask. The improved contact improves a shadow effect and reduces under-coating of a deposition material below the edge exclusion mask.
[41] According to some embodiments, which can be combined with other embodiments described herein, the support pin can be provided at the mask position having a device opening 22, for example a device opening with a dimension 23. According to some embodiments, which can be combined with other embodiments described herein, the shadow frame can provide an edge exclusion mask for one or more devices, i.e. display devices, to be manufactured on the substrate. According to some embodiments, which can be combined with other embodiments described herein, the mask can include Invar or other nickel-iron alloys with a thermal expansion coefficient of below 10'5 K'1 .
[42] FIG. 3 shows a schematic view from the top of the substrate support assembly 100. The edge support frame 112 includes a plurality of openings, which may correspond to a plurality of device openings 22 in the shadow frame or mask. Further, the plurality of magnetic fixtures 120 are provided to couple the edge support frame 112 to the table frame (not shown). According to embodiments of the present disclosure, a plurality of pins 150, for example, spring-loaded pins can be provided. As shown in FIG. 3, pins can be provided at positions of a device opening 22 and/or at positions of the edge support frame 112. The pins 150 provide a force from a first side of the substrate facing the table body towards a second side of the substrate, the second side facing the mask or the edge support frame 112, respectively.
[43] Spring-loaded pins according to embodiments of the present disclosure may also be referred to as a clamp, particularly a clamp for clamping a substrate between the table body and the edge support frame. A clamp can be referred to as a fastening device used to hold or secure the substrate between the substrate support surface and the edge support frame, for example, to prevent movement or separation. Particularly, the movement relative to the edge exclusion mask can be reduced.
[44] Referring to FIG. 4, a substrate support assembly 100 including a plurality of magnetic fixtures 120 and a plurality of pins 150 according to embodiments described herein is shown schematically in a side view. The substrate support assembly 100 includes a table body with a table frame 106. According to the embodiment shown in FIG. 4, the first members 122 of the plurality of magnetic fixtures are provided within recesses within the table frame.
[45] As shown in FIG. 4, according to embodiments, the substrate support assembly includes an ESF 112. The ESF 112 is drawn in a coupled configuration with solid lines. According to embodiments, which can be combined with other embodiments described herein, the ESF 112 includes a plurality of second members 124 of magnetic fixtures according to an embodiment described herein. The second members can be arranged such that they are opposite the first members 122 when the substrate support assembly is in the coupled configuration. The plurality of second members can be provided within a plurality of recesses within the ESF 112.
[46] According to embodiments, which can be combined with other embodiments described herein, the substrate support assembly 100 can have a substrate (not shown) arranged between the table frame 106 and the ESF 112. The substrate can be fixed between the table frame and the ESF. The substrate can be fixed, e.g. clamped between the table frame and the ESF, by the force provided by the plurality of magnetic fixtures. The force provided between the substrate and the ESF is increased by the pins 150, for example, spring-loaded pins. The pins 150 can be movable and can provide a defined force on the substrate towards the edge support frame 112. [47] As shown in FIG. 4, according to embodiments, the substrate support assembly 100 can include a tilt drive 420 for tilting a portion of the substrate support assembly 100, particularly the portion including a substrate, e.g. the table body with table frame 106 and the ESF 112 in the coupled configuration. Tilting the portion of the substrate support assembly can involve a tilt motion 424. The tilt motion can involve rotating, along a defined angular range, the portion of the substrate support assembly around a common axis. Tilting of the substrate support assembly can bring the portion of the substrate support assembly from a horizontal orientation into a vertical orientation, such as the vertical orientation 426 shown in FIG. 4. The vertical orientation can be used advantageously for operations of a substrate processing, such as a material deposition operation. The horizontal orientation can be used advantageously for other operations of a substrate processing, such as loading and/or unloading of the substrate.
[48] According to yet further additional or alternative modifications of a substrate support assembly, the substrate support assembly may also include a linear actuator. For example, a sweep drive to move the table body in a direction parallel to the axis of the tilt drive shown in FIG. 5 can be provided. Additionally or alternatively, a linear actuator to move the table body towards and away from the substrate processing area can be provided. Accordingly, a movement, such as a linear movement, of the substrate can occur, particularly when the substrate is provided in a vertical orientation. For example, the sweep drive may be utilized to move the substrate relative to a cathode array. The force on the substrate, for example, provide by the combined action of the fixtures between the table frame and the ESF and the pins, is beneficially large enough to maintain the substrate position relative to the mask during tilting and/or during linear movement, e.g. in a vertical orientation during coating. The forces on the substrate, e.g. the residual spring forces of the movable pins, push the substrate against the mask. The created friction force is bigger than the substrate weight (in vertical table position) and any other acceleration forces of tilt table motion or sweeping motion.
[49] As shown in FIG. 4, the substrate support assembly 100 can include a lift pin assembly including lift pins 410 and lift pin drive 412. The lift pin assembly can be configured for specifically lifting portions of the substrate support assembly 100, particularly for lifting the ESF 112 along a direction of ESF motion 414. The direction of ESF motion 414 can be an axial direction according to embodiments described herein.
[50] As shown in FIG. 4, according to embodiments, the action of the lift pin assembly can bring the substrate support assembly 100 from a coupled state into an uncoupled state 416 by lifting the ESF in an axial direction with respect to the table frame 106. This can separate the first members of the plurality of magnetic fixtures from the second members of the plurality of magnetic fixtures. Separating the plurality of first members from the plurality of second members can bring each of the plurality of magnetic fixtures from a coupled state into an uncoupled state. According to embodiments, which can be combined with other embodiments described herein, the uncoupled state can be utilized for loading and/or unloading of the substrate.
[51] According to some embodiments, which can be combined with other embodiments described herein, a substrate support assembly can include a plurality of lift pins for at least one of reversibly lifting and lowering the edge support frame with respect to the table frame and/or for at least one of reversibly lifting and lowering the substrate onto the plurality of pins. Particularly, for lift pins reversibly lifting and lowering the edge support frame, lifting the edge support frame separates the magnetic fixtures between the table frame and the edge support frame and lowering the edge support frame applies the edge support frame to the table frame such that the elements of the magnetic fixtures are coupled to each other. Further, additionally or alternatively the substrate support assembly can include a tilt drive wherein the tilt drive is configured to move the table body between a horizontal and a vertical orientation. Additionally or alternatively, a sweep drive can be provided, e.g. for a linear movement along a cathode array. According to embodiments of the present disclosure, a horizontal orientation may deviate by +- 15° from an exactly horizontal orientation and a vertical orientation may deviate by +- 15° from an exactly vertical orientation.
[52] Embodiments of the present disclosure including pins for generating a force of the substrate towards the mask can be particularly advantageous for substrate processing apparatuses including the swing module or substrate rotation module (or tilt drive 420), for example, a PVD system with rotatable sputter cathodes for low damage deposition, wherein the substrates are loaded in a horizontal orientation and a material layer deposited in a vertical orientation. With the swing module or tilt drive, respectively, the clamping force generated by the magnetic fixtures might not be sufficient during the tilting movement or in the vertical orientation. Accordingly, the pins according to embodiments of the present disclosure improve the contact between the substrate and the mask, e.g., for better mask alignment.
[53] FIG. 5 shows a substrate processing apparatus 500. The substrate processing apparatus 500 includes a vacuum chamber 520. The substrate support assembly 100 is provided in the vacuum chamber 520. The substrate 10 located on the table body or pins coupled to the table body 102 can be moved by the tilt drive 420 generating the tilt motion 424 into a processing orientation, particularly a vertical processing orientation. In the processing orientation, material may be deposited on the substrate by the sputter cathode 510.
[54] According to an embodiment, a substrate processing apparatus is provided. The substrate processing apparatus includes a substrate support assembly according to embodiments of the present disclosure. The table frame and the edge support frame are provided within a vacuum chamber of the substrate processing apparatus.
[55] According to embodiments, which can be combined with embodiments described herein, a substrate support assembly as described herein, particularly a substrate support assembly 100, can be configured to be operated inside a vacuum chamber, particularly a vacuum chamber of a substrate processing apparatus, such as a deposition apparatus.
[56] FIG. 5 shows a schematic view of a substrate processing apparatus 500 for material deposition on a substrate 10. A substrate is moved relative to a processing area inside a vacuum chamber 520. FIG. 5 shows a material deposition source. Particularly, the material deposition source can be a sputter cathode 510 of an array of cathodes, such as rotatable sputter cathodes. The processing area is provided in an area in front of the material deposition source.
[57] The substrate 10 supported on the support surface of the substrate support assembly is partially covered by an edge exclusion mask according to embodiments described herein. As described above, the edge exclusion mask may include an edge support frame and the shadow mask. The shadow mask can include device openings for masking edges of one or more display devices to be manufactured on the substrate. [58] Embodiments described herein can relate to components of a deposition system in which substrates, which can be substrates as described above, are loaded and unloaded in a horizontal configuration and in which the substrates are processed, e.g. coated, in a vertical configuration. A deposition system according to some embodiments described herein are suitable for use in a deposition apparatus in which a substrate is supported in different configurations, particularly in a deposition apparatus including a tilt drive for moving a substrate between a horizontal and a vertical configuration. A vacuum processing apparatus or vacuum deposition apparatus as described in FIG. 5 can be provided in a cluster system, in which one or more vacuum processing apparatuses are coupled to a central transfer chamber, particularly a central vacuum transfer chamber.
[59] FIG. 6 shows a flow chart illustrating methods according to the present disclosure. According to one embodiment, the method of fixing an edge support frame to a table frame of a substrate processing apparatus is provided. At operation 602, the substrate is moved onto the pins of the substrate support assembly. For example, the substrate is lowered towards the pins. At operation 604, an edge support frame is moved towards the table frame. For example, the edge support frame is lowered towards the table frame.
[60] At operation 606, the pins are moved towards the table frame or the table body, respectively. The pins are moved by lowering at least one of the substrate and the edge support frame. The pins are pushed by the substrate and/or the edge support frame. As the pins move, glass breakage can be reduced, particularly as manufacturing tolerances may stack up and the pin positioned at a device opening may break the glass for a pin that is not movable. According to an advantageous embodiments, which can be combined with other embodiments described herein, the pins do not move or essentially not move by the weight (gravity force) of the substrate and moves, e.g. moves essentially only, when the ESF couples to the table frame. Additionally or alternatively, when the pins are moved, a spring-load of spring-loaded pins can generate a force on the substrate towards the edge support frame. Accordingly, improved contact between the substrate and the mask can be provided. At operation 608, the edge support frame is fixed to the mask, for example, with magnetic fixtures as described herein. [61] According to one embodiment, a method of fixing an edge support frame to a table frame of a substrate processing apparatus is provided. The method includes lowering a substrate towards a table body and lowering an edge support frame towards a table frame. Further, the method includes moving a plurality of pins towards the table frame or a table body upon lowering at least one of the substrate and the edge support frame and fixing the edge support frame to the table frame. According to some embodiments, which can be combined with other embodiments described herein, fixing the edge support frame to the table frame can be provided by a magnetic fixture. According to some embodiments, which can be combined with other embodiments described herein, the method may further include generating a force on the substrate in the direction of the edge support frame by the plurality of pins. For example, the force can be generated by the plurality of pins comprising one or more spring-loaded pins.
[62] According to yet further embodiments, which can be combined with other embodiments described herein, a method of manufacturing a portion of a display device is provided. The method of manufacturing a portion of a display device includes a method of fixing an edge support frame to a table frame of a substrate processing apparatus according to any of the embodiments of the present disclosure and deposition of a material layer on a substrate provided partially between the table frame and the edge support frame. Further, additionally or alternatively, a substrate support assembly according to any of the embodiments described herein may be provided for manufacturing a portion of a display device. According to some embodiments, which can be combined with other embodiments described herein, the method of manufacturing a portion of a display device can include moving the substrate support assembly from a horizontal orientation to a vertical orientation. Particularly, the substrate support assembly may be moved the substrate is provided on the substrate support assembly. The movement can be provided by a tilt drive, i.e. drive providing a movement around an axis.
[63] Embodiments of the present disclosure can provide a plurality of advantages as described herein. Pin movement can reduce or nullify manufacturing tolerances that stack up and can thus reduce glass breakage. The force that can be provided by the movable pins, improves alignment of the substrate with respect to the mask and/or improves process uniformity. Further, the shadow effect of the mask may be improved and/or under-coating, which may in turn result in particles (contamination particles), can be reduced.
[64] According to some embodiments, the substrate support assemblies and methods utilizing a substrate support assembly according to embodiments described herein, may be utilized for low damage deposition (LDD). Facing target sputtering (FTS) systems provide plasma confinement regions facing each other, i.e. pointing directly or at least partially towards the other, opposing target. Since the plasma confinement of one or more targets is not directed towards the substrate but parallel or essentially parallel with a deviation of some degrees, e.g. up to 30°, away from the substrate or towards the substrate, damage that may occur at the substrate due to the energy of the particles being deposited on the substrate or UV radiation is reduced. Low damage deposition (LDD) can be provided. According to one example, a method of depositing a material on a substrate can include: sputtering at least a component of the material from a first rotary target with a first magnet assembly and a second rotary target with a second magnet assembly, the first magnet assembly within the first rotary target providing a first plasma confinement in a first direction facing towards the second rotary target, and the second magnet assembly within the second rotary target providing a second plasma confinement in a second direction facing towards the first rotary target. As another example, off-centric LDD can be provided to improve the damage-to-deposition-rate ratio of facing target sputtering. Off-centric LDD blocks the shortest sputter paths between the plasma confinement region and the substrate by an aperture plate having centric positioned shielding portion(s). An off-centric aperture can be provided with respect to the facing targets. An aperture is provided, for example, exclusively provided, for longer sputter paths to reduce the kinetic particle energy and/or to block the most intense UV radiation which is emitted out of the center of the facing target, particularly on a short mean free path. Thus, further embodiments that may utilize a substrate support assembly as described herein include a method of depositing a material on a substrate including a first deposition having sputtering from a first rotary target having a first magnet assembly having a first plasma confinement and with an aperture plate; and sputtering simultaneously from a second rotary target having a second magnet assembly having a second plasma confinement and with the aperture plate, the first plasma confinement facing the second rotary target and the second plasma confinement facing the first rotary target, the first plasma confinement and the second plasma confinement providing a plasma region between the first rotary target and the second rotary target having a center line perpendicular to a substrate surface of the substrate, the aperture plate having a body with a shielding portion configured to shield a region between the plasma region and the substrate at least at the center line.
[65] While the foregoing is directed to implementations of the present disclosure, other and further implementations of the disclosure may be devised without departing from the scope thereof, and the scope thereof is determined by the claims that follow.

Claims

1. A substrate support assembly for supporting a substrate, comprising: a table body having a surface configured to face the substrate; a table frame coupled to the table body; an edge support frame movable with respect to the table frame; and one or more pins coupled to the table body or the table frame and movable with respect to the table body and configured to exert a force on the substrate.
2. The substrate support assembly according to claim 1, wherein the one or more pins are movable in a direction perpendicular to the surface.
3. The substrate support assembly according to any of claims 1 to 2, wherein the one or more pins are movable to protrude from the surface towards the edge support frame.
4. The substrate support assembly according to any of claims 1 to 3, wherein the one or more pins include spring-loaded pins.
5. The substrate support assembly according to claim 4, wherein the spring-loaded pins provide at least one of a mechanical force or an elastic force.
6. The substrate support assembly according to any of claims 1 to 5, further comprising: a plurality of magnetic fixtures, comprising: a plurality of first members comprising magnets, a plurality of second members comprising magnetic elements, wherein at least one of the first members and the second members are provided in a plurality of recesses within the table frame, wherein magnetic forces between the first member and the second member are configured to fix the edge support frame to the table frame.
7. The substrate support assembly according to claim 6, wherein the magnets comprise a permanent magnet and the magnetic elements comprise a ferromagnetic material.
8. The substrate support assembly according to any of claims 6 to 7, the substrate support assembly comprising a plurality of lift pins for at least one of reversibly lifting and lowering the edge support frame with respect to the table frame, particularly wherein lifting the edge support frame separates the plurality of magnetic fixtures between the table frame and the edge support frame, and wherein lowering the edge support frame applies the edge support frame to the table frame such that the plurality of magnetic fixtures is formed.
9. The substrate support assembly according to any of the claims 1 to 8, wherein the substrate support assembly comprises a tilt drive, wherein the tilt drive is configured for tilting the table body between a horizontal and a vertical orientation.
10. A substrate processing apparatus, comprising: a substrate support assembly according to any of claims 1 to 9, wherein the table frame and the edge support frame are provided within a vacuum chamber of the substrate processing apparatus.
11. A method of fixing an edge support frame to a table frame of a substrate processing apparatus, comprising: lowering a substrate towards a surface of the table body, the surface being configured to face the substrate; lowering the edge support frame towards the table frame; moving a plurality of pins towards the table frame or a table body upon lowering at least one of the substrate and the edge support frame; and fixing the edge support frame to the table frame.
12. The method of claim 11, wherein fixing the edge support frame to the table frame is provided by a magnetic fixture.
13. The method of any of claims 11 to 12, further comprising: generating a force on the substrate in the direction of the edge support frame by the plurality of pins.
14. The method of claim 13, wherein the force is generated by the plurality of pins comprising one or more spring-loaded pins.
15. A method of manufacturing a portion of a display device, comprising: a method of fixing an edge support frame to a table frame of a substrate processing apparatus according to any of claims 11 to 14; and depositing a material layer on a substrate provided partially between the table body and the edge support frame.
16. The method of claim 15, further comprising: moving the table frame from a horizontal orientation to a vertical orientation while the substrate is provided on the substrate support assembly.
PCT/EP2022/070532 2022-02-25 2022-07-21 Substrate support assembly, substrate processing apparatus method for fixing an edge support frame to a table frame, and method of manufacturing a portion of a display device WO2023160836A1 (en)

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WO2018141366A1 (en) * 2017-01-31 2018-08-09 Applied Materials, Inc. Substrate carrier and method of processing a substrate
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WO2022002385A1 (en) * 2020-07-01 2022-01-06 Applied Materials, Inc. Apparatus for moving a substrate, deposition apparatus, and processing system

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WO2018141366A1 (en) * 2017-01-31 2018-08-09 Applied Materials, Inc. Substrate carrier and method of processing a substrate
CN206692727U (en) * 2017-04-28 2017-12-01 京东方科技集团股份有限公司 A kind of base plate carrying component and magnetic control sputtering device
WO2019082868A1 (en) * 2017-10-24 2019-05-02 株式会社アルバック Substrate treatment device and support pin
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