JP2020518123A - Device and vacuum system for aligning carriers in a vacuum chamber, and method for aligning carriers - Google Patents

Abstract

An apparatus (100) for aligning a carrier within a vacuum chamber (101) is described. The apparatus comprises a first carrier transport system (120) configured to transport a first carrier (10) along a first transport path in a first direction (X), and an alignment system (130). ) And. The alignment system includes a first mount (152) for attaching the first carrier (10) to the alignment system (130) and moving the first mount (152) in at least one alignment direction. The alignment device (151) configured as described above, and the alignment device (151) are moved together with the first mount (152) in a second direction (Z) lateral to the first direction (X). A first shift device (141) configured as described above. Additionally, a vacuum system and method of aligning the carrier are described. [Selection diagram] Figure 1

Description

[0001] Embodiments of the present disclosure relate to an apparatus and vacuum system for aligning a carrier within a vacuum chamber, and a method for aligning a carrier within a vacuum chamber. More specifically, a method of transporting, positioning, and aligning a substrate carrier holding a substrate in a vacuum chamber is described. Embodiments of the present disclosure particularly relate to a vacuum deposition system for depositing material on a substrate held by a carrier, where the substrate is aligned with a mask prior to deposition. The methods and apparatus described herein can be used in the manufacture of organic light emitting diode (OLED) devices.

Techniques for layer deposition on [0002] substrates include, for example, thermal evaporation, physical vapor deposition (PVD), and chemical vapor deposition (CVD). The coated substrate can be used in some applications and in some technical fields. For example, the coated substrate can be used in the field of organic light emitting diode (OLED) devices. OLEDs can be used in the manufacture of television screens, computer monitors, cell phones, other handheld devices, and the like, for example for displaying information. OLED devices such as OLED displays can include one or more layers of organic material located between two electrodes, all deposited on a substrate.

[0003] During the deposition of the coating material on the substrate, the substrate may be held by the substrate carrier and the mask may be held by the mask carrier in front of the substrate. A material pattern, for example a plurality of pixels, corresponding to the opening pattern of the mask can be deposited on the substrate, for example by evaporation.

[0004] The functionality of OLED devices typically depends on the accuracy of the coating pattern and the thickness of the organic material, which must be within a given range. In order to obtain high resolution OLED devices, it is necessary to overcome the technical challenges of vaporized material deposition. In particular, it is difficult to accurately and smoothly transport the substrate carrier supporting the substrate and/or the mask carrier supporting the mask through the vacuum system. In addition, accurate alignment of the substrate with respect to the mask is extremely important to achieve high quality deposition results, eg for making high resolution OLED devices. Furthermore, it is beneficial to utilize the coating material efficiently and the idle time of the system should be kept as short as possible.

[0005] In view of the above, there is provided an apparatus, system and method for accurately and reliably transporting, positioning and/or aligning a carrier for supporting a substrate and/or mask in a vacuum chamber. That would be beneficial.

[0006] In light of the above, apparatus and vacuum systems for aligning carriers in a vacuum chamber, and methods of aligning carriers in a vacuum chamber are provided. Further aspects, advantages and features of the disclosure will be apparent from the claims, the description and the accompanying drawings.

[0007] According to one aspect of the present disclosure, an apparatus for aligning a carrier within a vacuum chamber is provided. The apparatus includes a first carrier transport system configured to transport a first carrier in a first direction along a first transport path, and an alignment system. An alignment system, a first mount for attaching a first carrier to the alignment system, an alignment device configured to move the first mount in at least one alignment direction, and an alignment device And a first shift device configured to move with the first mount in a second direction transverse to the first direction.

[0008] In an embodiment, the first carrier is a substrate carrier configured to hold a substrate. In some embodiments, the alignment system includes a first carrier, eg, a substrate carrier, onto a second carrier, eg, a mask carrier, to deposit material on the substrate held by the first carrier. Configured to register relative to each other.

[0009] According to another aspect of the present disclosure, a vacuum system for aligning a carrier within a vacuum chamber is provided. The vacuum system includes a vacuum chamber having a sidewall and an alignment system. An alignment system, a first mount for attaching a first carrier to the alignment system, an alignment device configured to move the first mount in at least one alignment direction, and an alignment device A first shift device configured to move with the first mount in a second direction transverse to the first direction. The alignment system extends through the sidewall and reduces or prevents transmission of deformation of the sidewall to the alignment system, for example via at least one vibration damping element or vibration isolation element. It is flexibly connected to the side wall via an elastic or flexible sealing element, such as a bellows element that can

[0010] In some embodiments, the vacuum system is a vacuum deposition system that includes a deposition source for depositing material on a substrate held by a first carrier in a vacuum chamber.

[0011] According to a further aspect of the present disclosure, a method of aligning a carrier in a vacuum chamber is provided. The method includes transporting a first carrier in a first direction along a first transport path and mounting the first carrier on a first mount of an alignment system for alignment. The system comprises an alignment device configured to move the first mount in at least one alignment direction, and the alignment device with the first mount in a second direction transverse to the first direction. A first shift device configured to be moved to. The method comprises moving a first carrier mounted on a first mount in a second direction using a first shift device and using a registration device in at least one registration direction in a first direction. Further comprising aligning the one carrier.

[0012] In some embodiments, the first carrier is a substrate carrier that holds the substrate, and aligning the first carrier causes the substrate carrier to be relative to the second carrier that holds the mask. Including aligning.

[0013] In some embodiments, the alignment system extends through a sidewall of the vacuum chamber and is flexibly connected to the sidewall, eg, via at least one vibration damping element or vibration isolation element. There is. Therefore, sidewall vibrations or other deformations are not directly transmitted to the alignment system. Positioning accuracy can be improved.

[0014] Embodiments are also directed to apparatus for performing the disclosed methods and include apparatus portions for performing each described method aspect. These method aspects may be performed by hardware components, by a computer programmed by suitable software, by any combination of the two, or in any other manner. Moreover, embodiments according to the present disclosure are also directed to methods for operating the described apparatus. The method of operating the described device includes method aspects for performing any function of the device.

[0015] For a better understanding of the above features of the present disclosure, a more detailed description of the present disclosure, briefly summarized above, may be made with reference to embodiments. The accompanying drawings relate to embodiments of the present disclosure and are described below.

FIG. 6 shows a schematic cross-sectional view of an apparatus for aligning carriers according to embodiments described herein. FIG. 6 shows a schematic cross-sectional view of a vacuum system for aligning carriers according to embodiments described herein. FIG. 7 shows a schematic cross-sectional view of an apparatus for aligning carriers according to embodiments described herein in a transport position. 4 shows the embodiment of FIG. 3 in a second position. 4 shows the embodiment of FIG. 3 in a third position. FIG. 6 shows an exploded view of an alignment system for a device, according to embodiments described herein. 6 shows a perspective view of the alignment system of FIG. 6 is a flow chart illustrating a method of aligning a carrier within a vacuum chamber, according to embodiments described herein.

[0016] Reference will now be made in detail to various embodiments of the present disclosure, one or more examples of which are illustrated in the figures. Within the following description of the drawings, the same reference numbers refer to the same components. In general, only the differences with respect to the individual embodiments are described. Each example is provided by way of explanation of the disclosure and is not meant as a limitation of the disclosure.

[0017] Furthermore, features illustrated or described as part of one embodiment, can be used on or in combination with other embodiments to yield yet another embodiment. This description is intended to cover such modifications and variations.

[0018] FIG. 1 is a schematic cross-sectional view of an apparatus 100 for aligning a first carrier 10 within a vacuum chamber 101, according to embodiments described herein. The term "aligning" refers to the precise positioning of the carrier in position within the vacuum chamber, in particular with respect to the second carrier. The first carrier is aligned in at least one alignment direction, in particular in two or three alignment directions which may be essentially perpendicular to each other.

[0019] In the following description, the term "first carrier" is used to refer to a substrate carrier configured to hold a substrate 11, as schematically shown in FIG. The term "second carrier" is used to refer to a mask carrier configured to hold the mask 21 (see Figure 3). However, it should be appreciated that, alternatively, the first carrier 10 may be a carrier configured to hold a different object, such as a mask or shield.

[0020] "Substrate carrier" refers to a carrier device configured to transport a substrate 11 within a vacuum chamber 101 along a first transport path. The substrate carrier can hold the substrate 11 during the deposition of the coating material on the substrate 11. In some embodiments, the substrate 11 may be held on the substrate carrier in a non-horizontal orientation, for example during transport, alignment and/or deposition, in particular in an essentially vertical orientation. In the embodiment shown in FIG. 1, the substrate 11 is held on the first carrier 10 in an essentially vertical orientation. For example, the angle between the substrate surface and the gravity vector may be less than 10°, in particular less than 5°.

[0021] For example, the substrate 11 is retained on the retaining surface of the first carrier 10 during transport through the vacuum chamber 101, during alignment within the vacuum chamber 101, and/or during deposition of coating material on the substrate. May be done. In particular, the substrate 11 may be held on the first carrier 10 by a chucking device, for example by an electrostatic chuck (ESC) or by a magnetic chuck. The chucking device may be integrated in the first carrier 10, for example, in an atmosphere container provided in the first carrier.

[0022] The first carrier 10 comprises a carrier body having a retaining surface configured to retain the substrate 11, particularly in a non-horizontal orientation, and more particularly in an essentially vertical orientation. You can The first carrier may be movable along the first transport path by the first carrier transport system 120. In some embodiments, the first carrier 10 may be held contactless during transport, such as by a magnetic levitation system. In detail, the first carrier transfer system 120 may be a magnetic levitation system configured to transfer the first carrier 10 in a non-contact manner along the first transfer path in the vacuum chamber. The first carrier transfer system 120 may be configured to transfer the first carrier to a deposition region of a vacuum chamber where an alignment system and a deposition source are located.

[0023] As used herein, "mask carrier" relates to a carrier device configured to hold a mask for transporting the mask along a mask transport path within a vacuum chamber. The mask carrier can hold the mask during transport, alignment, and/or deposition on the substrate through the mask. In some embodiments, the mask may be held on the mask carrier during transport and/or alignment in a non-horizontal orientation, particularly an essentially vertical orientation. The mask may be held on the mask carrier by a chucking device, for example a mechanical chuck such as a clamp, an electrostatic chuck or a magnetic chuck. Other types of chucking devices may be used, which may be connected to the mask carrier or integrated within the mask carrier.

[0024] For example, the mask may be an edge exclusion mask or a shadow mask. An edge exclusion mask is a mask configured to mask one or more edge areas of a substrate so that material is not deposited on the one or more edge areas during coating of the substrate. A shadow mask is a mask configured to mask features to be deposited on a substrate. For example, the shadow mask can include an opening pattern having a plurality of small openings, such as 10,000 or more openings, especially 1,000,000 or more openings.

[0025] As used herein, "essentially vertical orientation" may be understood as an orientation having a deviation from the vertical orientation, i.e., less than or equal to 10 degrees, especially less than or equal to 5 degrees, from the gravity vector. For example, the angle between the major surface of the substrate (or mask) and the gravity vector can be between +10° and −10°, in particular between 0° and −5°. In some embodiments, the orientation of the substrate (or mask) may not be exactly perpendicular during transport and/or deposition, and may be slightly with respect to the vertical axis, for example between 0° and -5°. , In particular by an angle of inclination between -1° and -5°. A negative angle refers to the orientation of the substrate (or mask) with the substrate (or mask) tilting downwards. Deviation of the substrate orientation from the gravity vector during deposition may be beneficial and may result in a more stable deposition process, or face-down orientation is suitable for reducing particles on the substrate during deposition. May be However, exactly vertical orientations (+/−1°) during transport and/or during deposition are also possible. In other embodiments, the substrate and mask may be transported in a non-vertical orientation, and/or the substrate may be coated in a non-vertical orientation, eg, an essentially horizontal orientation.

[0026] The apparatus 100 according to embodiments described herein is configured to transport a first carrier 10 in a first direction X along a first transport path, a first carrier transport system 120. , In particular including magnetic levitation systems. The first direction X can be an essentially horizontal direction. In FIG. 1, the first direction X is perpendicular to the paper surface.

[0027] The apparatus 100 further includes an alignment system 130 configured to align the first carrier 10 within the vacuum chamber 101. The alignment system 130 may be configured to accurately position the first carrier 10 within the vacuum chamber. In some embodiments, the deposition source 105 is provided within the vacuum chamber 101. The deposition source 105 is configured to deposit the coating material on the substrate 11 held by the first carrier 10.

[0028] The alignment system 130 is configured to move the first mount 152 in at least one alignment direction and a first mount 152 for attaching the first carrier 10 to the alignment system 130. Alignment device 151. The alignment system 130 moves the alignment device 151 with the first mount 152 in a second direction Z transverse to the first direction X, in particular essentially perpendicular to the first direction. Further included is a first shift device 141 configured to.

[0029] Accordingly, the first mount 152 is moved in the second direction Z by the first shift device 141, for example, to perform a coarse positioning of the first carrier attached to the first mount. The first mount 152 can be further moved by the alignment device 151, for example to perform precise positioning of the first carrier attached to the first mount.

[0030] The second direction Z may be an essentially horizontal direction. The second direction Z may be essentially perpendicular to the first direction X along which the first carrier is transported by the first carrier transport system 120. After transporting the first carrier in the first direction X, the first carrier is attached to the first mount 152 and away from the first transport path, eg, towards the deposition source 105 or in a mask. Can be shifted in the second direction Z towards the second carrier holding.

[0031] In some embodiments, the at least one alignment direction may essentially correspond to the second direction Z. Therefore, the first carrier can be moved in the second direction Z by the first shift device 141 and the alignment device 151. The first shift device 141 may be configured to perform displacement of the first carrier in the second direction Z, and the alignment device 151 may include the first direction X, the second direction Z, and It may be arranged to perform a fine alignment of the first carrier in at least one of the third directions Y, which may be essentially vertical.

[0032] In some embodiments, the alignment device 151 includes a first mount 152 in a second direction Z, and optionally a first direction X and first and second directions. It is configured to move in at least one of the third lateral directions Y. The third direction Y may be an essentially vertical direction. Therefore, the first carrier can be accurately positioned by the alignment device 151 in the first direction X, the second direction Z and/or the third direction Y. In other embodiments, the alignment device 151 can move the first mount in only two directions, eg, the second direction Z and the third direction Y. In a further embodiment, the alignment device 151 can move the first mount only in one direction, in particular only in the second direction Z.

[0033] The alignment device 151 and the first mount 152 are coupled to the first mount 152 so that the alignment device 151 and the first mount 152 can be moved in the second direction Z by the first shift device 141. The shift device 141 may be fixed to the driven portion 143. In some embodiments that can be combined with other embodiments described herein, the first shift device 141 can be moved by the drive unit 142 and the drive unit 142 in the second direction Z. The driven part 143 is included. The alignment device 151 together with the first mount 152 may be provided on the driven part 143, for example, at the front end of the driven part 143, so as to be movable in the second direction Z together with the driven part 143. .. The driven part 143 may include a bar or an arm that linearly extends in the second direction Z from the outside of the vacuum chamber into the vacuum chamber, and can be moved by the driving unit 142.

[0034] In some embodiments that may be combined with other embodiments described herein, the drive unit 142 of the first shift device 141 causes the driven portion 143 to be 10 mm or more in the second direction Z. It may include a linear actuator configured to move, in particular, a distance of 20 mm or more, more particularly 30 mm or more. For example, the drive unit 142 includes a mechanical actuator, an electromechanical actuator such as a stepping motor, an electric motor, a hydraulic actuator, and the like configured to move the driven part 143 in the second direction Z by a distance of 10 mm or more. And/or may include pneumatic actuators.

[0035] In some embodiments, which may be combined with other embodiments described herein, the alignment device 151 is configured to move the first mount in at least one alignment direction. It may include at least one precision actuator, for example at least one piezo actuator. In particular, the alignment device 151 comprises two or three piezo actuators configured to move the first mount in two or three alignment directions. The piezo actuator of the alignment device 151 may be configured to move the first mount 152 in the second direction Z, and optionally in the first direction X and/or the third direction Y. .. The alignment device 151 may be configured to finely position (or finely align) the first mount 152 having the first carrier attached thereto in at least one alignment direction. For example, the alignment device may be configured to position the first carrier with an accuracy of less than 5 μm, in particular submicron accuracy. Accordingly, since the alignment device 151 is provided on the driven portion 143 of the first shift device together with the first mount 152, rough positioning of the first mount is performed by the first shift device 141. The precise positioning of the first mount can be provided by the alignment device 151.

[0036] In some embodiments that may be combined with other embodiments described herein, the first mount 152 is configured to magnetically retain the first carrier 10 to the first mount 152. And a magnetic chuck configured as described above. For example, the first mount 152 may include an electropermanent magnet device configured to magnetically retain the first carrier on the first mount. By applying an electrical pulse to the coil of the permanent electromagnet device, the permanent electromagnet device can be switched between a held state and a released state. In particular, the application of electrical pulses can change the magnetization of at least one magnet of the electromagnet device.

[0037] The method of aligning the first carrier 10 in the vacuum chamber includes (i) transporting the first carrier 10 along the first transport path in the first direction X to the deposition region of the vacuum chamber 101. Can be included. The first carrier 10 may be transported contactlessly by the first carrier transport system 120, in particular by a magnetic levitation system having at least one magnet unit 121. The at least one magnet unit 121 may be an actively controlled magnet unit configured to hold the first carrier 10 in a contactless manner on the guide rail. (Ii) Attach the first carrier to the first mount 152 of the alignment system 130 at the deposition area. The alignment system 130 includes an alignment device 151 configured to move the first mount in at least one alignment direction, and an alignment device that moves the alignment device with the first mount in the second direction Z. And a configured first shift device 141. Attaching the first carrier to the first mount 152 means that the first mount 152 is located on the first transport path until the first mount 152 contacts the first carrier and adheres to the first carrier. Moving the first mount 152 toward the carrier 10 can be included. For example, the first mount 152 is magnetically attached to the first carrier.

[0038] (iii) Use the first shift device 141 to move the first carrier with the alignment device 151 in the second direction Z. For example, even if the driven part 143 of the first shift device 141 moves the first carrier 10 in the second direction Z by a distance of 10 mm or more toward the deposition source 105 or toward the second carrier. Good. (Iv) Align the first carrier with the alignment device 151 in at least one alignment direction. Aligning the first carrier 10 is performed in particular in the second direction Z via the at least one piezo actuator provided in the driven part 143 of the first shift device 141 in the vacuum chamber 101. And, optionally, at least one of the first direction X and the third direction Y, may include precision positioning of the first carrier 10. Thus, the device 100 described herein can be used to provide accurate alignment of the first carrier 10.

[0039] FIG. 2 illustrates, in schematic cross-sectional view, an apparatus 200 for carrier alignment within a vacuum chamber 101, according to some embodiments described herein. The device 200 is similar to the device 100 shown in FIG. 1, so that it is possible to refer to the above description, although not repeated here.

[0040] The apparatus 200 includes a first carrier transport system 120 configured to transport a first carrier 10 in a first direction X. The first carrier transport system 120 comprises at least one magnet unit 121, in particular at least one actively controlled magnet configured to hold the first carrier 10 in a guiding structure in a contactless manner. A magnetic levitation system having a unit may be included.

[0041] The apparatus 200 is configured to move the first mount 152 in at least one alignment direction, and a first mount 152 configured to attach the first carrier 10 to the alignment system 130. An alignment device 151 and a first shift device 141 configured to move the alignment device with the first mount in a second direction Z, which may be essentially perpendicular to the first direction X. Further comprising an alignment system 130 having

[0042] The first shift device 141 includes a drive unit 142 and a driven portion 143 that can be moved in the second direction Z by the drive unit 142. The alignment device 151 and the first mount 152 are provided on the driven portion 143 of the first shift device 141 and are movable together with the driven portion 143.

[0043] In some embodiments that may be combined with other embodiments described herein, the drive unit 142 of the first shift device 141 is provided to be located outside the vacuum chamber 101. In particular, the driven part 143 is provided so as to penetrate the opening of the side wall 102 of the vacuum chamber 101 in detail and extend from the drive unit 142 into the vacuum chamber 101.

[0044] If the drive unit 142 is located outside the vacuum chamber, ie, at atmospheric pressure, a non-vacuum capable drive unit may be used, which is typically more costly than a vacuum capable drive unit. High efficiency and easy handling. Further, any type of drive unit 142 may be provided, including, for example, an electric motor or a stepper motor. Generation of particles in the vacuum chamber by the drive unit, which may include mechanical bearings, can be avoided. For example, a linear Z actuator can be used. Maintenance of the drive unit can be facilitated.

[0045] In some embodiments, which may be combined with other embodiments described herein, the apparatus 200 includes vibration damping between the alignment system and the walls of the vacuum chamber 101, particularly the sidewalls 102. Alternatively, a vibration damping element 103 or a vibration isolation element for providing vibration isolation is further included. For example, the alignment system 130 may extend through the wall of the vacuum chamber 101 and may be flexibly connected to the wall via the vibration damping element 103. The term "flexibly connected" as used herein allows for relative movement between the sidewalls 102 and the alignment system 130, eg, deformation or vibration, and the alignment system 130 and vacuum. It relates to the connection between the side wall 102 of the chamber 101. In other words, the entire alignment system (including the drive unit located outside the vacuum chamber) may be moved relative to the sidewall so that vibrations and other deformations of the sidewall are substantially not transmitted from the sidewall to the alignment system. It is movably attached. This is in contrast to conventional bellows seal motion feedthroughs which allow movement of the positioner within the vacuum chamber while securing the drive unit of the positioner to the side wall of the vacuum chamber. Therefore, conventional motion feedthroughs are rigidly fixed to the sidewalls of the vacuum chamber they penetrate and there is no vibration damping to the sidewalls.

[0046] The vibration damping element 103 may seal the opening in the sidewall of the vacuum chamber through which the alignment system 130 is vacuum tight.

[0047] The vibration damping element 103 or vibration isolation element may include at least one flexible or elastic element, in particular at least one extensible element, for example an axially extensible element such as a bellows element. it can. For example, the vibration dampening element 103 can include a resilient vacuum tight seal that acts between the sidewall 102 of the vacuum chamber and the alignment system 130. In some embodiments, the longitudinal axis of the axially extensible element may extend in the second direction Z. For example, an elastic and/or extensible element, such as a bellows element, connects the alignment system 130 with the sidewall 102 of the vacuum chamber such that the opening in the sidewall 102 through which the alignment system 130 passes is vacuum tight. Can be made Thus, vibration and other deformations of the sidewall 102 are not directly transmitted to the alignment system 130 because the vibration dampening elements allow relative movement between the sidewall 102 and the alignment system 130. In particular, the (stationary) body 131 of the alignment system 130 extends through the sidewall and is movably mounted to the sidewall via the vibration damping element 103.

[0048] The sidewalls 102 of the vacuum chamber 101 through which the alignment system 130 extends may be different than the top and bottom walls of the vacuum chamber 101, eg, sidewalls that extend essentially vertically. The sidewalls 102 of the vacuum chamber are typically less stable than the top wall, which can be reinforced by stabilizing elements such as stiffening beams or ribs. Thus, for example, when the pressure in the vacuum chamber changes, the sidewall 102 may at least partially deform or vibrate. Therefore, it is beneficial to mechanically separate the alignment system 130 from the sidewalls 102 so that deformations and other movements of the sidewalls are not (directly) transferred to the alignment system. Rather, the alignment system 130 may be rigidly fixed to a separate support 110 that may be fixed to the top wall of the vacuum chamber. This can improve the alignment accuracy and maintain the position of the alignment system 130 even if the sidewall 102 moves during pressure changes in the vacuum chamber.

[0049] In some embodiments, at least one additional flexible element 104, e.g., an axially extensible element, such as a bellows element, causes the body 131 of the alignment system 130 to be driven by the first shift device 141. It can be flexibly connected to the portion 143. The further flexible element 104 may allow the drive unit 142 to be located outside the vacuum chamber 101, while allowing the driven part 143 to move inside the vacuum chamber 101 in the second direction Z. For example, the drive unit 142 can be (stiffly) fixed to the body 131 of the alignment system 130 outside the vacuum chamber. The additional flexible element 104 may separate the vacuum environment surrounding the additional flexible element from the atmospheric environment inside the additional flexible element. The movable bar or arm of the driven part 143 may extend axially through the further flexible element.

[0050] According to the embodiments described herein, the first mount 152 can be moved in the second direction Z with the alignment device 151 by the first shift device 141. Specifically, until the first mount 152 contacts and adheres to the first carrier 10, the first mount 152 moves toward the first carrier 10 located on the first transport path. It can be moved by the first shift device 141. The first mount, on which the first carrier is attached, can then be moved by the first shift device 141 in the second direction Z towards the deposition source 105 or towards the second carrier. .. Then, the fine alignment of the first carrier by the alignment device 151 may be subsequently performed.

[0051] The drive unit 142 of the first shift device 141 (eg, provided as a linear Z actuator) may be located outside the vacuum chamber 101. The front of the driven part 143 of the first shift device 141, which holds the alignment device 151 and the first mount 152, can be arranged in a vacuum chamber. Since the alignment system 130 is connected to the side wall via the vibration damping element 103, movement of the side wall 102 of the vacuum chamber 101 through which the driven part 143 penetrates is not transmitted to the alignment system 130. Whether the pressure in the vacuum chamber changes or the vacuum chamber fills and/or is evacuated, accurate and reproducible alignment of the first carrier can be provided.

[0052] FIG. 2 illustrates a vacuum system for aligning a carrier within a vacuum chamber, according to embodiments described herein. The vacuum system includes a vacuum chamber 101 having a sidewall 102, which can extend in an essentially vertical direction (+/−20°). The alignment system 130 described herein extends through the sidewall 102 and to the sidewall 102 via a vibration damping element 103, particularly a flexible and/or extensible element such as a bellows element. Flexible connection. The drive unit 142 of the alignment system 130 may be located outside the vacuum chamber, and the alignment device 151 of the alignment system 130 that may be moved by the drive unit 142 may be located within the vacuum chamber. The first mount 152 of the alignment system 130 can be moved by the alignment device 151 and is configured to mount the first carrier 10.

[0053] The alignment system 130 may be (stiffly) fixed to a support 110 provided within the vacuum chamber, for example attached to the top wall of the vacuum chamber. In some embodiments that can be combined with other embodiments described herein, the support 110 extends in the first direction X and at least one magnet unit of the first carrier transfer system 120. Holds or supports 121. Thus, both the at least one magnet unit 121 and the alignment system 130 are fixed to the same mechanical support in the vacuum chamber so that vibrations or other movements of the vacuum chamber cause the alignment system 130 and the magnetic levitation. It is equally transmitted to the levitation magnets of the system. The positioning accuracy can be further improved, and the carrier can be easily transported.

[0054] The vacuum system may be a vacuum deposition system configured to deposit one or more materials on the substrate held by the first carrier 10. A deposition source 105, specifically a vapor source configured to vaporize organic materials, may be provided in the vacuum chamber. The deposition source 105 may be arranged such that the material can be directed from the deposition source 105 toward a first carrier mounted to the first mount 152 of the alignment system.

[0055] The deposition source 105 may be a movable deposition source. In particular, the deposition source 105 may be moveable in a first direction X past a substrate carried by a first carrier. A drive may be provided for translating the deposition source 105 in the first direction X.

[0056] Alternatively or additionally, the deposition source may include a rotatable distribution tube with a vapor outlet. The distribution pipe may extend in an essentially vertical direction and may be rotatable about an essentially vertical axis of rotation. The deposited material can be evaporated in the crucible of the evaporation source and can be directed towards the substrate through a vapor outlet provided in the distribution tube.

[0057] In particular, the deposition source 105 may be provided as a linear source extending in an essentially vertical direction. The vertical height of the deposition source 105 is the height of a vertically oriented substrate such that the substrate can be coated by moving the deposition source 105 past the substrate in a first direction X. Can be adapted.

[0058] In some embodiments, the first carrier transfer system 120 can transfer the first carrier 10 to a deposition region within the vacuum chamber 101 where coating material is deposited on a substrate. Thus, the substrate 11 may be configured to face the deposition source 105. After depositing the coating material on the substrate, the first carrier transport system 120 may, for example, remove the coated substrate from the vacuum chamber or deposit another coating material on the substrate in another deposition area. Alternatively, the first carrier 10 may be transported outside the deposition area.

[0059] The deposition source 105 can include a distribution tube having a plurality of vapor openings or nozzles for directing coating material to the deposition area. In addition, the deposition source can include a crucible configured to heat and vaporize the coating material. The crucible can be connected to the distribution pipe in fluid communication with the distribution pipe.

[0060] In some embodiments, which may be combined with other embodiments described herein, the deposition source may be rotatable. For example, the deposition source may be rotatable from a first orientation in which the vapor openings of the deposition source are directed toward the deposition area to a second orientation in which the vapor openings are directed toward the second deposition area. May be. The deposition region and the second deposition region may be located on opposite sides of the deposition source, and the deposition source may be rotatable about 180° between the deposition region and the second deposition region.

[0061] The first carrier transfer system 120 may be configured to contactlessly transfer the first carrier 10 within the vacuum chamber 101. For example, the first carrier transfer system 120 may hold and transfer the first carrier 10 by magnetic force. In particular, the first carrier transport system 120 may include a magnetic levitation system.

[0062] In the exemplary embodiment of FIG. 2, the first carrier transport system 120 is disposed at least partially above the first carrier 10 and bears at least a portion of the weight of the first carrier 10. At least one magnet unit 121 configured as described above. The at least one magnet unit 121 may include an actively controlled magnet unit configured to hold the first carrier 10 in a contactless manner. The first carrier transfer system 120 may further include a driving device configured to move the first carrier 10 in the first direction X in a non-contact manner. In some embodiments, the drive may be located at least partially below the first carrier 10. The drive device may include a drive device (not shown) such as a linear motor configured to move the first carrier by applying a magnetic force to the first carrier (not shown).

[0063] FIG. 3 illustrates an apparatus 300 for aligning a carrier within a vacuum chamber 101, according to embodiments described herein. The device 300 is similar to the device 200 shown in FIG. 2, so that the above description can be referred to and will not be repeated here.

[0064] The alignment system 300 of the apparatus 300 includes a first mount 152 for attaching the first carrier 10 to the alignment system, a second mount 153 for attaching the second carrier 20 to the alignment system, A first shift device 141 configured to move the first mount with the alignment device 151 in the second direction Z, and a first shift device configured to move the second mount in the second direction Z. 2 shift devices 144 are included.

[0065] The first carrier 10 is typically a substrate carrier that holds the substrate 11 to be coated, and the second carrier 20 is typically placed in front of the substrate 11 during deposition. A mask carrier for holding the mask 21 to be formed. The alignment system 130 is used to move the first carrier 10 and the second carrier 20 relative to each other so that the evaporated material can be accurately deposited on the substrate in a predetermined pattern defined by the mask. Can be aligned.

[0066] Specifically, the second carrier 20 mounted on the second mount 153 can be moved to a predetermined position in the second direction Z using the second shift device 144. The first carrier 10 can be moved to a predetermined position adjacent to the second carrier 20 in the second direction Z by using the first shift device 141. The first carrier 10 is then aligned with the alignment device 151 in the alignment direction, in particular in the second direction Z and/or optionally in one or more further alignment directions. can do.

[0067] In some embodiments that may be combined with other embodiments described herein, the alignment system 130 extends through the sidewall 102 of the vacuum chamber 101 and may include, for example, at least one vibration damping element. It is flexibly connected to the side wall 102 via 103 or a vibration isolation element. The vibration damping element may be an axially extensible element, such as a bellows element. The vibration damping element may be a flexible or elastic sealing element that reduces the transmission of sidewall deformations to the alignment system. The flexible or elastic sealing element can function as a vacuum tight seal between the sidewall and the alignment system. Reference is made to the above description and will not be repeated here.

[0068] In some embodiments, the second shift device 144 includes a second drive unit 145, such as a linear actuator or motor, and a second drive unit 145 that moves the second shift device 144 in a second direction Z. 2 driven parts 146. The second mount 153 is provided on the second driven portion 146 so as to be movable together with the second driven portion 146.

[0069] The second drive unit 145 is disposed outside the vacuum chamber 101, and the second driven part 146 penetrates an opening provided in the side wall 102 of the vacuum chamber in detail, and the second driven unit 145 penetrates the vacuum chamber 101. It may extend into 101. The second mount 153 is provided in the vacuum chamber 101 at the front end of the second driven portion 146. As a result, the second carrier 20 can be attached to the second mount 153 provided in the vacuum chamber. Further, the second carrier 20 can be moved inside the vacuum chamber 101 in the second direction Z by the second shift device 144 having the second drive unit 145 arranged outside the vacuum chamber.

[0070] In some embodiments, the alignment system 130 includes a body 131 secured to a support 110 provided within a vacuum chamber. The drive unit 142 of the first shift device 141 and the second drive unit 145 of the second shift device 144 may be fixed to the body 131 of the alignment system 130. The body 131 of the alignment system 130 can provide a feedthrough through the sidewall 102 for the driven portion 143 of the first shift device and the second driven portion 146 of the second shift device. .. The body 131 of the alignment system 130 may be flexibly connected to the sidewall 102 of the vacuum chamber 101 via a vibration damping element 103.

[0071] The body 131 of the alignment system 130 may be fixed to the support 110. The support 110 may be fixed (directly or indirectly) to the top wall of the vacuum chamber and/or may be provided as a support rail or spar that may extend in the first direction X. Good. The top wall of the vacuum chamber is usually more reinforced and less mobile than the vertically extending side walls.

[0072] In some embodiments, which may be combined with other embodiments described herein, the first carrier transfer system 120 may transfer a first carrier along a first transfer path to a first position. A second carrier transport system 122 is provided for transporting in the direction X so that the second carrier transport system 122 transports the second carrier 20 in the first direction X along a second transport path parallel to the first transport path. May be provided. The first carrier transfer system 120 and/or the second carrier transfer system 122 may be configured as a magnetic levitation system for contactless carrier transfer. In particular, the first carrier transport system 120 can include at least one magnet unit 121, in particular an actively controlled magnet unit, for holding the first carrier 10 in a contactless manner. The second carrier transport system 122 can include at least one second magnet unit 123, in particular an actively controlled magnet unit, for holding the second carrier 20 in a contactless manner. Each magnetic levitation system typically includes a plurality of actively controlled magnet units that can be arranged along the first direction X at essentially equal intervals. For example, the actively controlled magnet unit may be fixed to the support 110.

[0073] In the schematic cross-sectional view of FIG. 3, the first carrier 10 and the second carrier 20 are decoupled by the actively controlled magnet units of the first carrier transport system 120 and the second carrier transport system 122. Held in contact. The first mount 152 is provided so as to be separated from the first carrier 10 in the second direction Z, and the second mount 153 is provided so as to be separated from the second carrier 20 in the second direction Z. There is.

[0074] FIG. 4A shows the apparatus 300 of FIG. 3 in a second position. By moving the second mount in the second direction Z to the second carrier 20 and magnetically attaching the second carrier 20 to the second mount 153, the second carrier 20 is Mounted on the mount 153. Next, the second carrier 20 is moved by the second shift device 144 in the second direction Z to a predetermined position, for example, a distance of 20 mm or more. Specifically, the mask 21 held by the second carrier 20 is positioned at a predetermined position facing the deposition source 105.

[0075] As further shown in FIG. 4A, a first carrier 10 holding a substrate 11 is transferred into a deposition region by a first carrier transfer system 120 and first using a first shift device 141. The first mount 152 is attached to the first carrier by moving the mount 152 to the first carrier 10.

[0076] As shown schematically in FIG. 4B, the first carrier 10 is then moved by the first shift device 141 in the second direction Z until the substrate 11 is positioned near the mask 21. It is moved towards the second carrier 20. Subsequently, the first carrier 10 is aligned with the alignment device 151 in at least one alignment direction, in particular in the second direction Z. The first carrier 10 can be accurately positioned in position by an alignment device 151, which can include one or more piezo actuators.

[0077] One or more materials may be deposited on substrate 11 by deposition source 105 through openings in mask 21. The exact material pattern can be deposited on the substrate.

[0078] FIG. 5 is an exploded view of an alignment system 130 of an apparatus, according to embodiments described herein. Alignment system 130 is similar to the alignment system of the device shown in FIG. 3, so reference can be made to the above description, although not repeated here.

[0079] The alignment system 130 includes a body 131 that is flexible to the sidewall 102 of the vacuum chamber 101 (not shown in FIG. 5) via a vibration damping element 103, eg, a bellows element. Can be connected to. The drive unit 142 (for example, the first Z actuator) and the second drive unit 145 (for example, the second Z actuator) are fixed to the main body 131 outside the vacuum chamber 101. In some embodiments, the body 131 is rigidly secured to the support in a vacuum chamber (not shown in FIG. 5) and flexibly connected to the sidewalls 102, eg, via screws or bolts 108. There is.

[0080] The drive unit 142 is configured to move the first driven portion 143 extending through the body 131 into the vacuum chamber in the second direction Z, and the second drive unit 145 is The second driven part 146 extending through the main body 131 into the vacuum chamber is configured to move in the second direction Z. A first mount 152 for attaching the first carrier to the alignment system is provided at the front end of the first driven part 143, and a second mount 153 for attaching the second carrier to the alignment system is provided. , And is provided at the front end of the second driven portion 146. Therefore, in order to position the first and second carriers in their respective predetermined positions in the second direction Z, the first mount 152 and the second mount 153 are moved by the respective shift devices in the second direction Z. Can be moved independently of each other.

[0081] The second driven portion 146 so that the first carrier and the second carrier can be held adjacent to each other on the second mount and the first mount provided at the front end of the driven portion. Protrudes into the vacuum chamber more than the first driven part 143.

[0082] The first mount 152 is connected to the first driven portion 143 via an alignment device 151, which specifically includes at least one piezo actuator. Thus, performing the precise positioning (or precise alignment) of the first carrier with respect to the second carrier by accurately positioning the first mount 152 in position using the alignment device 151. You can

[0083] FIG. 6 illustrates a perspective view of the alignment system 130 of FIG. The body 131 of the alignment system 130 and the side wall 102 of the vacuum chamber are arranged such that the body 131 does not move with the side wall 102 when the side wall vibrates or moves due to pressure changes in the vacuum chamber. There is a small gap in between.

[0084] In some embodiments, the apparatus includes two or more alignment systems within the deposition region that are spaced apart from each other in the first direction X. Each alignment system can be configured according to the alignment system 130 according to the embodiments described herein. For example, the first mount of the first alignment system is configured to hold the front upper portion of the first carrier, and the first mount of the second alignment system is rear upper portion of the first carrier. May be configured to hold. Each alignment system may extend through the sidewall 102 of the vacuum chamber such that the respective drive unit of the respective shift device is located outside the vacuum chamber. Furthermore, each alignment system may be flexibly connected to the sidewall of the vacuum system via a respective vibration isolation element. In some embodiments, each alignment system is mechanically fixed to the same support provided within the vacuum chamber, for example fixed to the top wall of the vacuum chamber.

[0085] The alignment device of the first alignment system may be configured to align the first carrier in a first direction X, a second direction Z, and a third direction Y, The alignment device of the second alignment system may be configured to align the first carrier in the first direction Z and the third direction Y. Additional alignment systems may be provided that have additional alignment devices. As a result, the first carrier, which is a three-dimensional object, can be accurately positioned and rotated to a predetermined translational and rotational position within the deposition region relative to the second carrier.

[0086] In some embodiments that may be combined with other embodiments described herein, the driven portion 143 of the first shift device includes a cable, etc., for components disposed within the vacuum chamber 101. Is configured to feed the supply element of. In particular, the driven part 143 includes a hollow tube element configured as a cable passage for a cable extending from outside the vacuum chamber to a component located at the front end of the driven part 143 in the vacuum chamber 101. . For example, at least one cable connected to at least one of the alignment device 151 and the first mount 152 can extend through the hollow tube element of the driven part 143. This makes it possible to supply electric power to the component movable in the second direction Z in the vacuum chamber. For example, the piezo actuator of the alignment device 151 and/or the magnetic chuck of the first mount 152 can be powered from outside the vacuum chamber through the driven part 143.

[0087] In some embodiments, the second driven portion 145 of the second shift device also provides a feed element, such as a cable, to a component disposed within the vacuum chamber, such as the first in the vacuum chamber. The second driven part 145 is configured to be fed into the component provided at the front end of the driven part 145. For example, power can be supplied to the second mount 153 from outside the vacuum chamber through the driven part 145.

[0088] FIG. 7 is a flow chart illustrating a method of aligning a first carrier within a vacuum chamber, according to embodiments described herein.

[0089] At box 830, a first carrier capable of holding a substrate to be coated is transported in the vacuum chamber 101 in a first direction X along a first transport path. The first carrier may be transported to the deposition area where the deposition source 105 and the alignment system 130 are located. In some embodiments, the first carrier 10 is carried contactlessly by a magnetic levitation system that includes a plurality of actively controlled magnet units.

[0090] At box 840, the first carrier is mounted to the first mount of the alignment system 130. The alignment system includes an alignment device configured to move the first mount in at least one alignment direction and a second mount laterally to the first mount with the alignment device. A first shift device configured to move in the direction of. The second direction can be a horizontal direction that is essentially perpendicular to the first direction.

[0091] In box 850, the first carrier is positioned in a second direction by the first shifting device, specifically toward the previously positioned mask held by the second carrier (position Be moved (along with the matching device).

[0092] In box 860, the first carrier is in at least one alignment direction with the alignment device, in particular in the second direction, and optionally in the first and third directions. In at least one of the two. In particular, the substrate carried by the first carrier 10 is moved into contact with the mask carried by the second carrier.

[0093] In optional box 870, material is deposited on the substrate carried by the first carrier. In particular, the vaporized organic material is deposited on the substrate by a vapor source that may be movable past the substrate.

[0094] In an embodiment that can be combined with other embodiments described herein, the first carrier is a substrate carrier that holds the substrate, and aligning the first carrier is an alignment. Aligning the first carrier with a second carrier mounted on a second mount of the system. Specifically, the second carrier is a mask carrier that holds the mask.

[0095] In optional box 810, the second carrier 20 holding the mask 21 is transported into the deposition region in the first direction X along a second transport path extending parallel to the first transport path. To be done. The second carrier 20 may be contactlessly transported by a magnetic levitation system that includes a plurality of actively controlled magnet units.

[0096] In optional box 820, the second carrier 20 is mounted on a second mount of the alignment system 130 and the second carrier is second mounted by the second shift device of the alignment system 130. In the direction Z, in particular towards the deposition source. The method can then proceed to box 830.

[0097] The apparatus described herein can be configured to evaporate organic materials, such as for OLED device fabrication. For example, the deposition source can be an evaporation source, in particular an evaporation source for depositing one or more organic materials on a substrate to form a layer of an OLED device.

[0098] The embodiments described herein can be utilized for vapor deposition on large area substrates, for example, for OLED display fabrication. Specifically, the substrate provided with the structure and method according to the embodiments described herein is a large-area substrate having a surface area of, for example, 0.5 m ² or more, particularly 1 m ² or more. For example, a large area substrate or carrier may have a GEN4.5 corresponding to a surface area of about 0.67 m ² (0.73 x 0.92 m), a surface area of about 1.4 m ² (1.1 m x 1.3 m). GEN5 corresponding, GEN7.5 corresponding to a surface area of about 4.29 m ² (1.95 m x 2.2 m), GEN8.5 corresponding to a surface area of about 5.7 m ² (2.2 m x 2.5 m), Or it could even be GEN10 which corresponds to a surface area of about 8.7 m ² (2.85 m x 3.05 m). Larger generations such as GEN11 and GEN12 and corresponding surface areas can be implemented as well. Half the size of the GEN generation can also be provided in OLED display manufacturing.

[0099] According to some embodiments, which may be combined with other embodiments described herein, the thickness of the substrate may be 0.1 mm to 1.8 mm. The thickness of the substrate can be about 0.9 mm or less, such as 0.5 mm. As used herein, the term “substrate” may specifically include a substantially non-flexible substrate, eg, a wafer, a slice of transparent crystals such as sapphire, or a glass plate. However, the present disclosure is not so limited and the term "substrate" may also include flexible substrates such as webs or foils. The term "substantially inflexible" is taken to be distinct from "flexible". Specifically, a substantially non-flexible substrate may have some flexibility, such as a glass plate having a thickness of 0.9 mm or less, such as 0.5 mm or less, but is substantially The flexibility of a non-flexible substrate is smaller than that of a flexible substrate.

[00100] According to the embodiments described herein, the substrate can be made of any material suitable for material deposition. For example, the substrate can be glass (eg, soda lime glass, borosilicate glass, etc.), metal, polymer, ceramic, compound material, carbon fiber material, or any other material or combination of materials that can be coated by a deposition process. It can be made of a material selected from the group consisting of:

[00101] According to embodiments described herein, a method for transporting and aligning a substrate carrier and a mask carrier in a vacuum chamber is provided in a computer program, software, computer software product, and CPU, memory, user. It can be implemented using an interface and an interrelated controller that can have input and output devices in communication with corresponding components of the apparatus.

[00102] The present disclosure provides a first carrier transport system for a first carrier and a second carrier transport system for a second carrier that may be of equal size in at least one dimension. In other words, the second carrier may be compatible with the first carrier transport system and the first carrier may be compatible with the second carrier transport system. The first carrier transport system and the second carrier transport system can be used flexibly while providing accurate and smooth transport of carriers through the vacuum system. The alignment system allows for accurate alignment of the substrate with respect to the mask, and vice versa. High quality processing results can be achieved, for example for the production of high resolution OLED devices.

[00103] In other embodiments, the mask carrier and the substrate carrier may be of different sizes. For example, as shown schematically in FIG. 3, the mask carrier may be larger than the substrate carrier, particularly in the vertical direction.

[00104] While the above is directed to the embodiments of the present disclosure, other additional embodiments of the present disclosure can be devised without departing from the basic scope of the present disclosure, and the scope of the present disclosure. , As determined by the following claims.

Claims (16)

A device for aligning carriers in a vacuum chamber (101), comprising:
A first carrier transport system (120) configured to transport a first carrier (10) along a first transport path in a first direction (X);
An alignment system (130),
And the alignment system (130) comprises
A first mount (152) for attaching the first carrier (10) to the alignment system (130);
An alignment device (151) configured to move the first mount (152) in at least one alignment direction;
A first shift configured to move the alignment device (151) with the first mount (152) in a second direction (Z) transverse to the first direction (X). Device (141),
A device. The first shift device (141) includes a drive unit (142) and a driven part (143), and the alignment device (151) and the first mount (152) include the driven part (152). 143) The device according to claim 1, which is provided at 143) and is movable together with the driven part. The drive unit (142) is configured to move the driven part (143) in the second direction (Z) by a distance of 10 mm or more, specifically 20 mm or more, and more specifically 30 mm or more. The device of claim 2, comprising an actuator. The drive unit (142) is arranged outside the vacuum chamber (101), and the driven part (143) extends from the outside of the vacuum chamber into the vacuum chamber. The described device. The driven part (143) to a component arranged in the vacuum chamber (101), in particular to at least one of the alignment device (151) and the first mount (152), the cable An apparatus according to any one of claims 2 to 4, comprising a hollow tube element configured to deliver the. The alignment system (130) extends through a wall of the vacuum chamber and is flexibly connected to the wall via at least one vibration damping element (103). The apparatus according to claim 1. The vibration damping element (103) comprises at least one flexible and/or elastic sealing element, in particular a bellows element, configured to reduce or prevent the transmission of movement of the wall to the alignment system. The device according to claim 6. 8. Apparatus according to any one of the preceding claims, wherein the alignment device (151) comprises at least one piezo actuator. The alignment device (151) moves the first mount (152) in the second direction (Z) and optionally in the first direction (X) and/or the first and the first 9. A device according to any one of the preceding claims, configured to move in a third direction (Y) transverse to the second direction. The first mount (152) comprises a magnetic chuck configured to magnetically hold the first carrier to the first mount, in particular comprising a permanent electromagnet device. 9. The device according to any one of 9 above. The alignment system (130)
A second mount (153) for attaching a second carrier to the alignment system (130);
A second shift device (144) configured to move the second mount (153) in the second direction (Z);
The apparatus according to any one of claims 1 to 10, further comprising: The second shift device (144) comprises a second drive unit (145) and a second driven part (146), and the second mount comprises the second mount within the vacuum chamber. The device according to claim 11, which is provided in the driving unit. The first carrier transport system (120) is configured to transport the first carrier (10) in the first direction (X) in a non-contact manner, and comprises a plurality of actively controlled magnet units. 13. The apparatus according to any one of claims 1-12, which is a magnetic levitation system comprising. A vacuum system for carrier alignment in a vacuum chamber, comprising:
A vacuum chamber (101) having a sidewall (102),
An alignment system (130),
And the alignment system (130) comprises
A first mount (152) for attaching the first carrier (10) to the alignment system (130);
An alignment device (151) configured to move the first mount (152) in at least one alignment direction;
A first shift configured to move the alignment device (151) with the first mount (152) in a second direction (Z) transverse to the first direction (X). Device (141),
Equipped with
A vacuum system wherein the alignment system (130) extends through the sidewall (102) and is flexibly connected to the sidewall (102). A method of aligning a carrier in a vacuum chamber, the method comprising:
Transporting the first carrier (10) in the first direction (X) along the first transport path;
An alignment device (151) configured to move a first mount (152) in at least one alignment direction, and the alignment device together with the first mount transverse to the first direction. Mounting the first carrier on the first mount of an alignment system (130) comprising a first shift device (141) configured to move in a second direction (Z) of directions. When,
Moving the first carrier in the second direction (Z) using the first shift device (141);
Aligning the first carrier in at least one alignment direction using the alignment device (151);
Including the method. The first carrier (10) is a substrate carrier holding a substrate (11), and aligning the first carrier is a second mount mounted on a second mount of the alignment system. 16. The method according to claim 15, comprising aligning the first carrier with respect to a carrier (20), in particular the second carrier is a mask carrier carrying a mask (21).

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