WO2019192678A1

WO2019192678A1 - Apparatus and vacuum system for carrier alignment in a vacuum chamber, and method of aligning a carrier

Info

Publication number: WO2019192678A1
Application number: PCT/EP2018/058469
Authority: WO
Inventors: Matthias HEYMANNS; Tommaso Vercesi; Stefan Bangert
Original assignee: Applied Materials, Inc.
Priority date: 2018-04-03
Filing date: 2018-04-03
Publication date: 2019-10-10
Also published as: KR20190116970A; JP2020518123A; CN110557953B; CN110557953A; KR102167534B1

Abstract

An apparatus (100) for aligning a carrier in a vacuum chamber (101) is described. The apparatus includes a first carrier transport system (120) configured to transport a first carrier (10) along a first transport path in a first direction (X), and an alignment system (130). The alignment system comprises a first mount (152) for mounting the first carrier (10) to the alignment system (130), an alignment device (151) configured to move the first mount (152) in at least one alignment direction, and a first shifting device (141) configured to move the alignment device (151) together with the first mount (152) in a second direction (Z) transverse to the first direction (X). Further, a vacuum system and a method for aligning a carrier are described.

Description

APPARATUS AND VACUUM SYSTEM FOR CARRIER ALIGNMENT IN A VACUUM CHAMBER, AND METHOD OF ALIGNING A CARRIER

FIELD

[0001] Embodiments of the present disclosure relate to an apparatus and a vacuum system for aligning a carrier in a vacuum chamber, and to a method of aligning a carrier in a vacuum chamber. More specifically, a method of transporting, positioning, and aligning a substrate carrier carrying a substrate in a vacuum chamber is described. Embodiments of the present disclosure particularly relate to a vacuum deposition system for depositing a material on a substrate carried by a carrier, wherein the substrate is aligned with respect to a mask before the deposition. Methods and apparatuses described herein may be used in the manufacture of organic light-emitting diode (OLED) devices.

BACKGROUND

[0002] Techniques for layer deposition on a substrate include, for example, thermal evaporation, physical vapor deposition (PVD), and chemical vapor deposition (CVD). Coated substrates may be used in several applications and in several technical fields. For instance, coated substrates may be used in the field of organic light emitting diode (OLED) devices. OLEDs can be used for the manufacture of television screens, computer monitors, mobile phones, other hand-held devices and the like, e.g. for displaying information. An OLED device, such as an OLED display, may include one or more layers of an organic material situated between two electrodes that are all deposited on a substrate.

[0003] During the deposition of a coating material on a substrate, the substrate may be held by a substrate carrier, and a mask may be held by a mask carrier in front of the substrate. A material pattern, e.g. a plurality of pixels, corresponding to an opening pattern of the mask can be deposited on the substrate, e.g. by evaporation.

[0004] The functionality of an OLED device typically depends on the accuracy of the coating pattern and the thickness of the organic material, which have to be within a predetermined range. For obtaining high-resolution OLED devices, technical challenges with respect to the deposition of evaporated materials need to be mastered. In particular, an accurate and smooth transport of a substrate carrier carrying a substrate and/or of a mask carrier carrying a mask through a vacuum system is challenging. Further, a precise alignment of the substrate with respect to the mask is crucial for achieving high quality deposition results, e.g. for producing high-resolution OLED devices. Yet further, an efficient utilization of the coating material is beneficial, and idle times of the system are to be kept as short as possible.

[0005] In view of the above, it would be beneficial to provide apparatuses, systems and methods for accurately and reliably transporting, positioning and/or aligning carriers for carrying substrates and/or masks in a vacuum chamber.

SUMMARY

[0006] In light of the above, an apparatus and a vacuum system for carrier alignment in a vacuum chamber, and a method of aligning a carrier in a vacuum chamber are provided. Further aspects, benefits, and features of the present disclosure are apparent from the claims, the description, and the accompanying drawings.

[0007] According to an aspect of the present disclosure, an apparatus for carrier alignment in a vacuum chamber is provided. The apparatus includes a first carrier transport system configured to transport a first carrier along a first transport path in a first direction, and an alignment system. The alignment system includes a first mount for mounting the first carrier to the alignment system, an alignment device configured to move the first mount in at least one alignment direction, and a first shifting device configured to move the alignment device together with the first mount in a second direction transverse to the first direction. [0008] In embodiments, the first carrier is a substrate carrier configured to carry a substrate. In some embodiments, the alignment system is configured to align a first carrier, e.g. a substrate carrier, with respect to a second carrier, e.g. a mask carrier, for depositing a material on a substrate that is carried by the first carrier. [0009] According to another aspect of the present disclosure, a vacuum system for carrier alignment in a vacuum chamber is provided. The vacuum system includes a vacuum chamber with a side wall, and an alignment system. The alignment system includes a first mount for mounting the first carrier to the alignment system, an alignment device configured to move the first mount in at least one alignment direction, and a first shifting device configured to move the alignment device together with the first mount in a second direction transverse to the first direction. The alignment system extends through the side wall and is flexibly connected to the side wall, e.g. via at least one vibration damping element or vibration isolation element, particularly via an elastic or flexible sealing element, such as a bellow element which may reduce or prevent a transfer of deformations of the side to wall to the alignment system.

[0010] In some embodiments, the vacuum system is a vacuum deposition system including a deposition source for depositing a material on a substrate carried by the first carrier in the vacuum chamber.

[0011] According to a further aspect of the present disclosure, a method of aligning a carrier in a vacuum chamber is provided. The method includes transporting a first carrier along a first transport path in a first direction, and mounting the first carrier to a first mount of an alignment system, the alignment system including an alignment device configured to move the first mount in at least one alignment direction, and a first shifting device configured to move the alignment device together with the first mount in a second direction transverse to the first direction. The method further includes moving the first carrier that is mounted to the first mount in the second direction with the first shifting device, and aligning the first carrier in at least one alignment direction with the alignment device.

[0012] In some embodiments, the first carrier is a substrate carrier which holds a substrate, and aligning the first carrier includes aligning the substrate carrier with respect to a second carrier which holds a mask.

[0013] In some embodiments, the alignment system extends through a side wall of the vacuum chamber, and is flexibly connected to the side wall, e.g. via at least one vibration damping element or vibration isolation element. Accordingly, vibrations or other deformations of the side wall are not directly transferred to the alignment system. The alignment accuracy can be improved.

[0014] Embodiments are also directed at apparatuses for carrying out the disclosed methods and include apparatus parts for performing each described method aspect. These method aspects may be performed by way of hardware components, a computer programmed by appropriate software, by any combination of the two or in any other manner. Furthermore, embodiments according to the disclosure are also directed at methods for operating the described apparatus. The methods for operating the described apparatus include method aspects for carrying out every function of the apparatus.

BRIEF DESCRIPTION OF THE DRAWINGS

[0015] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the disclosure and are described in the following: FIG. 1 shows a schematic sectional view of an apparatus for aligning a carrier according to embodiments described herein;

FIG. 2 shows a schematic sectional view of a vacuum system for aligning a carrier according to embodiments described herein;

FIG. 3 shows a schematic sectional view of an apparatus for aligning a carrier according to embodiments described herein in a transport position;

FIG. 4A shows the embodiment of FIG. 3 in a second position; FIG. 4B shows the embodiment of FIG. 3 in a third position;

FIG. 5 shows an exploded view of an alignment system of an apparatus according to embodiments described herein; FIG. 6 shows a perspective view of the alignment system of FIG.

5; and

FIG. 7 is a flow diagram illustrating a method of aligning a carrier in a vacuum chamber according to embodiments described herein.

DETAILED DESCRIPTION OF EMBODIMENTS

[0016] Reference will now be made in detail to the various embodiments of the disclosure, one or more examples of which are illustrated in the figures. Within the following description of the drawings, same reference numbers refer to same components. Generally, only the differences with respect to individual embodiments are described. Each example is provided by way of explanation of the disclosure and is not meant as a limitation of the disclosure.

[0017] Further, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. It is intended that the description includes such modifications and variations.

[0018] FIG. 1 is a schematic sectional view of an apparatus 100 for aligning a first carrier 10 in a vacuum chamber 101 according to embodiments described herein. The term “aligning” refers to a positioning of the carrier exactly at a predetermined position in the vacuum chamber, particularly at a predetermined position relative to a second carrier. The first carrier is aligned in at least one alignment direction, particularly in two or three alignment directions which may be essentially perpendicular with respect to each other.

[0019] In the following description, the term“first carrier” is used to designate a substrate carrier which is configured to carry a substrate 11 , as is schematically depicted in FIG. 1. The term“second carrier” is used to designate a mask carrier which is configured to carry a mask 21 (see FIG. 3). However, it is to be understood that, alternatively, the first carrier 10 may be a carrier configured to hold a different object, e.g. a mask or a shield.

[0020] A“substrate carrier” relates to a carrier device configured to carry a substrate 11 along a first transport path in the vacuum chamber 101. The substrate carrier may hold the substrate 11 during the deposition of a coating material on the substrate 11. In some embodiments, the substrate 11 may be held at the substrate carrier in a non-horizontal orientation, particularly in an essentially vertical orientation, e.g. during transport, alignment and/or deposition. In the embodiment depicted in FIG. 1, the substrate 11 is held at the first carrier 10 in an essentially vertical orientation. For example, an angle between the substrate surface and the gravity vector may be less than 10°, particularly less than 5°.

[0021] For example, the substrate 11 may be held at a holding surface of the first carrier 10 during the transport through a vacuum chamber 101, during the alignment in the vacuum chamber 101, and/or during the deposition of a coating material on the substrate. In particular, the substrate 11 may be held at the first carrier 10 by a chucking device, e.g. by an electrostatic chuck (ESC) or by a magnetic chuck. The chucking device may be integrated in the first carrier 10, e.g. in an atmospheric enclosure provided in the first carrier.

[0022] The first carrier 10 may include a carrier body with a holding surface configured to hold the substrate 11 , particularly in a non-horizontal orientation, more particularly in an essentially vertical orientation. The first carrier may be movable along the first transport path by a first carrier transport system 120. In some embodiments, the first carrier 10 may be contactlessly held during the transport, e.g. by a magnetic levitation system. In particular, the first carrier transport system 120 may be a magnetic levitation system configured to contactlessly transport the first carrier 10 along the first transport path in the vacuum chamber. The first carrier transportation system 120 may be configured to transport the first carrier into a deposition area of the vacuum chamber where the alignment system and a deposition source are arranged.

[0023] A“mask carrier” as used herein relates to a carrier device configured to carry a mask for the transport of the mask along a mask transport path in the vacuum chamber. The mask carrier may carry the mask during transport, during alignment and/or during deposition on the substrate through the mask. In some embodiments, the mask may be held at the mask carrier in a non-horizontal orientation, particularly in an essentially vertical orientation during transport and/or alignment. The mask may be held at the mask carrier by a chucking device, e.g. a mechanic chuck such as a clamp, an electrostatic chuck or a magnetic chuck. Other types of chucking devices may be used which may be connected to or integrated in the mask carrier.

[0024] For instance, the mask may be an edge exclusion mask or a shadow mask. An edge exclusion mask is a mask which is configured for masking one or more edge regions of the substrate, such that no material is deposited on the one or more edge regions during the coating of the substrate. A shadow mask is a mask configured for masking a plurality of features which are to be deposited on the substrate. For instance, the shadow mask can include a plurality of small openings, e.g. an opening pattern with 10.000 or more openings, particularly 1.000.000 or more openings.

[0025] An“essentially vertical orientation” as used herein may be understood as an orientation with a deviation of 10° or less, particularly 5° or less from a vertical orientation, i.e. from the gravity vector. For example, an angle between a main surface of a substrate (or mask) and the gravity vector may be between +10° and -10°, particularly between 0° and -5°. In some embodiments, the orientation of the substrate (or mask) may not be exactly vertical during transport and/or during deposition, but slightly inclined with respect to the vertical axis, e.g. by an inclination angle between 0° and -5°, particularly between -1° and -5°. A negative angle refers to an orientation of the substrate (or mask) wherein the substrate (or mask) is inclined downward. A deviation of the substrate orientation from the gravity vector during deposition may be beneficial and might result in a more stable deposition process, or a facing down orientation might be suitable for reducing particles on the substrate during deposition. However, an exactly vertical orientation (+/-l°) during transport and/or during deposition is also possible. In other embodiments, the substrates and masks may be transported in a non-vertical orientation, and/or the substrates may be coated in a non-vertical orientation, e.g. an essentially horizontal orientation.

[0026] The apparatus 100 according to embodiments described herein includes a first carrier transport system 120, particularly a magnetic levitation system, that is configured to transport the first carrier 10 along the first transport path in a first direction X. The first direction X may be an essentially horizontal direction. In FIG. 1, the first direction X is perpendicular to the paper plane. [0027] The apparatus 100 further includes an alignment system 130 configured to align the first carrier 10 in the vacuum chamber 101. The alignment system 130 may be configured to accurately position the first carrier 10 in the vacuum chamber. In some embodiments, a deposition source 105 is provided in the vacuum chamber 101. The deposition source 105 is configured for depositing a coating material on the substrate 11 that is held by the first carrier 10.

[0028] The alignment system 130 includes a first mount 152 for mounting the first carrier 10 to the alignment system 130, and an alignment device 151 configured to move the first mount 152 in at least one alignment direction. The alignment system 130 further includes a first shifting device 141 configured to move the alignment device 151 together with the first mount 152 in a second direction Z transverse to the first direction X, particularly essentially perpendicular to the first direction.

[0029] Accordingly, the first mount 152 can be moved by the first shifting device 141 in the second direction Z, e.g. for performing a coarse positioning of the first carrier that is mounted to the first mount, and the first mount 152 can additionally be moved by the alignment device 151, e.g. for performing a fine positioning of the first carrier that is mounted to the first mount.

[0030] The second direction Z may be an essentially horizontal direction. The second direction Z may be essentially perpendicular to the first direction X along which the first carrier is transported by the first carrier transport system 120. After the transport of the first carrier in the first direction X, the first carrier can be mounted to the first mount 152 and be shifted in the second direction Z away from the first transport path, e.g. toward the deposition source 105 or toward a second carrier carrying a mask.

[0031] In some embodiments, the at least one alignment direction may essentially correspond to the second direction Z. Accordingly, the first carrier can be moved in the second direction Z by the first shifting device 141 and by the alignment device 151. The first shifting device 141 may be configured to perform a displacement of the first carrier in the second direction Z, and the alignment device 151 may be configured to perform a fine alignment of the first carrier in at least one of the first direction X, the second direction Z, and the third direction Y which may be an essentially vertical direction. [0032] In some embodiments, the alignment device 151 is configured to move the first mount 152 in the second direction Z, and optionally in at least one of the first direction X and a third direction Y transverse to the first and second direction. The third direction Y may be an essentially vertical direction. Accordingly, the first carrier can be exactly positioned by the alignment device 151 in the first direction X, the second direction Z and/or the third direction Y. In other embodiments, the alignment device 151 can move the first mount only in two directions, e.g. in the second direction Z and in the third direction Y. In yet further embodiments, the alignment device 151 can move the first mount only in one direction, particularly in the second direction Z.

[0033] The alignment device 151 and the first mount 152 may be fixed to a driven part 143 of the first shifting device 141, such that the alignment device 151 and the first mount 152 can be moved by the first shifting device 141 in the second direction Z. In some embodiments, which can be combined with other embodiments described herein, the first shifting device 141 includes a driving unit 142 and a driven part 143 that can be moved by the driving unit 142 in the second direction Z. The alignment device 151 together with the first mount 152 may be provided at the driven part 143, e.g. at a front end of the driven part 143 such as to be movable together with the driven part 143 in the second direction Z. The driven part 143 may comprise a linearly extending bar or arm extending from outside the vacuum chamber into the vacuum chamber in the second direction Z and can be moved by the driving unit 142.

[0034] In some embodiments, which can be combined with other embodiments described herein, the driving unit 142 of the first shifting device 141 may include a linear actuator configured to move the driven part 143 in the second direction Z by a distance of 10 mm or more, particularly 20 mm or more, more particularly 30 mm or more. For example, the driving unit 142 may include a mechanical actuator, an electro -mechanical actuator, e.g. a stepper motor, an electric motor, a hydraulic actuator and/or a pneumatic actuator configured to move the driven part 143 in the second direction Z by a distance of 10 mm or more.

[0035] In some embodiments, which may be combined with other embodiments described herein, the alignment device 151 may include at least one precision actuator, e.g. at least one piezo actuator, configured to move the first mount in the at least one alignment direction. In particular, the alignment device 151 includes two or three piezo actuators configured to move the first mount in two or three alignment directions. The piezo actuator of the alignment device 151 may be configured to move the first mount 152 in the second direction Z, and optionally in the first direction X and/or in the third direction Y. The alignment device 151 may be configured for a fine positioning (or fine alignment) of the first mount 152 having the first carrier mounted thereon in the at least one alignment direction. For example, the alignment device may be configured for a positioning of the first carrier with a sub-5 -pm accuracy, particularly with a sub-pm accuracy. Accordingly, by having the alignment device 151 together with the first mount 152 provided at the driven part 143 of the first shifting device, a coarse positioning of the first mount can be performed by the first shifting device 141, and a fine positioning of the first mount can be provided by the alignment device 151.

[0036] In some embodiments, which may be combined with other embodiments described herein, the first mount 152 includes a magnetic chuck configured to magnetically hold the first carrier 10 at the first mount 152. For example, the first mount 152 may include an electropermanent magnet device configured to magnetically hold the first carrier at the first mount. An electropermanent magnet device can be switched between a holding state and a releasing state by applying an electric pulse to a coil of the electropermanent magnet device. In particular, a magnetization of at least one magnet of the electropermanent magnet device can be changed by applying the electric pulse.

[0037] A method of aligning the first carrier 10 in the vacuum chamber may include (i) transporting the first carrier 10 along a first transport path in a first direction X into a deposition area of the vacuum chamber 101. The first carrier 10 may be contactlessly transported by the first carrier transport system 120, particularly by a magnetic levitation system having at least one magnet unit 121. The at least one magnet unit 121 may be an actively controlled magnet unit configured to contactlessly hold the first carrier 10 at a guiding rail (ii) Mounting the first carrier to a first mount 152 of an alignment system 130 in the deposition area. The alignment system 130 includes an alignment device 151 configured to move the first mount in at least one alignment direction, and a first shifting device 141 configured to move the alignment device together with the first mount in the second direction Z. Mounting the first carrier to the first mount 152 may include moving the first mount 152 toward the first carrier 10 that is positioned on the first transport path until the first mount 152 contacts the first carrier and attaches to the first carrier. For example, the first mount 152 is magnetically attached to the first carrier.

[0038] (iii) Moving the first carrier together with the alignment device 151 in the second direction Z with the first shifting device 141. For example, the driven part 143 of the first shifting device 141 may move the first carrier 10 in the second direction Z by a distance of 10 mm or more toward a deposition source 105 or toward a second carrier (iv) Aligning the first carrier in at least one alignment direction with the alignment device 151. Aligning the first carrier 10 may include a fine positioning of the first carrier 10 in the second direction Z, and optionally in at least one of the first direction X and the third direction Y, particularly via at least one piezo actuator which is provided at the driven part 143 of the first shifting device 141 inside the vacuum chamber 101. Accordingly, an accurate alignment of the first carrier 10 can be provided with the apparatus 100 described herein.

[0039] FIG. 2 shows an apparatus 200 for carrier alignment in a vacuum chamber 101 according to some embodiments described herein in a schematic sectional view. The apparatus 200 is similar to the apparatus 100 shown in FIG. 1, such that reference can be made to the above explanations, which are not repeated here.

[0040] The apparatus 200 includes a first carrier transport system 120 configured to transport the first carrier 10 in the first direction X. The first carrier transport system 120 may include a magnetic levitation system with at least one magnet unit 121, particularly with at least one actively controlled magnet unit configured to contactlessly hold the first carrier 10 at a guiding structure.

[0041] The apparatus 200 further includes an alignment system 130 with a first mount 152 configured to mount the first carrier 10 to the alignment system 130, an alignment device 151 configured to move the first mount 152 in at least one alignment direction, and a first shifting device 141 configured to move the alignment device together with the first mount in the second direction Z which may be essentially perpendicular to the first direction X. [0042] The first shifting device 141 includes a driving unit 142 and a driven part 143 that can be moved by the driving unit 142 in the second direction Z. The alignment device 151 and the first mount 152 are provided at the driven part 143 of the first shifting device 141 to be movable together with the driven part 143.

[0043] In some embodiments, which can be combined with other embodiments described herein, the driving unit 142 of the first shifting device 141 is provided to be arranged outside the vacuum chamber 101, and/or the driven part 143 is provided to extend from the driving unit 142 into the vacuum chamber 101, particularly through an opening in a side wall 102 of the vacuum chamber 101.

[0044] When the driving unit 142 is arranged outside the vacuum chamber, i.e. under atmospheric pressure, a non- vacuum compatible driving unit can be used which is typically more cost-efficient and easier to handle than a vacuum-compatible driving unit. Further, an arbitrary type of driving unit 142, e.g. including an electric motor or a stepper motor can be provided. The generation of particles inside the vacuum chamber by the driving unit which may include mechanical bearings can be avoided. For example, a linear Z-actuator can be used. Maintenance of the driving unit can be facilitated.

[0045] In some embodiments, which may be combined with other embodiments described herein, the apparatus 200 further comprises a vibration damping element 103 or a vibration isolation element for providing a vibration damping or a vibration isolation between the alignment system and a wall, particularly a side wall 102, of the vacuum chamber 101. For example, the alignment system 130 may extend through the wall of the vacuum chamber 101 and may be flexibly connected to the wall via the vibration damping element 103. The term“flexibly connected” as used herein relates to a connection between the alignment system 130 and the side wall 102 of the vacuum chamber 101 which allows a relative movement, e.g. a deformation or a vibration, between the side wall 102 and the alignment system 130. In other words, the whole alignment system (including the driving unit which is arranged outside the vacuum chamber) is movably mounted with respect to the side wall such that vibrations and other deformations of the side wall are not substantially transferred from the side wall to the alignment system. This is in contrast to conventional bellow-sealed motion feedthroughs which allow for movement of a positioner in a vacuum chamber while having the driving unit of the positioner fixed at a side wall of the vacuum chamber. Accordingly, conventional motion feedthroughs are rigidly fixed to the side wall of the vacuum chamber through which they extend and there is no vibration damping with respect to the side wall.

[0046] The vibration damping element 103 may seal the opening in the side wall of the vacuum chamber through which the alignment system 130 extends in a vacuum-tight manner.

[0047] The vibration damping element 103 or vibration isolation element may include at least one flexible or elastic element, particularly at least one expandable element, e.g. an axially expandable element such as a bellow element. For example, the vibration damping element 103 may include an elastic and vacuum-tight sealing acting between the side wall 102 of the vacuum chamber and the alignment system 130. In some embodiments, the longitudinal axis of the axially expandable element may extend in the second direction Z. For example, an elastic and/or expandable element such as a bellow element may connect the alignment system 130 with the side wall 102 of the vacuum chamber such that an opening in the side wall 102 through which the alignment system 130 extends is closed in a vacuum-tight manner. Accordingly, vibrations and other deformations of the side wall 102 do not directly transfer to the alignment system 130 because the vibration damping element allows for a relative movement between the side wall 102 and the alignment system 130. In particular, the (stationary) main body 131 of the alignment system 130 extends through the side wall and is movably mounted with respect to the side wall via the vibration damping element 103.

[0048] The side wall 102 of the vacuum chamber 101 through which the alignment system 130 extends may be a wall different from the top and bottom walls of the vacuum chamber 101, e.g. an essentially vertically extending side wall. A side wall 102 of the vacuum chamber is typically less stable than the top wall which may be enforced by stabilizing elements such as reinforcing beams or reinforcing ribs. Accordingly, the side wall 102 may at least deform or vibrate in sections, e.g. when the pressure inside the vacuum chamber changes. Accordingly, it is beneficial to mechanically isolate the alignment system 130 from the side wall 102, such that deformations and other movements of the side wall are not (directly) transferred on the alignment system. Rather, the alignment system 130 may be rigidly fixed to a separate support 110 which may be fixed to the top wall of the vacuum chamber. Accordingly, the alignment accuracy can be improved, and the position of the alignment system 130 can be maintained even if the side wall 102 moves during a pressure change inside the vacuum chamber.

[0049] In some embodiments, at least one further flexible element 104, e.g. an axially expandable element such as a bellow element, may flexibly connect a main body 131 of the alignment system 130 with the driven part 143 of the first shifting device 141. The further flexible element 104 may allow a movement of the driven part 143 in the second direction Z inside the vacuum chamber 101 while the driving unit 142 can be placed outside the vacuum chamber 101. For example, the driving unit 142 can be (rigidly) fixed to the main body 131 of the alignment system 130 outside the vacuum chamber. The further flexible element 104 may separate a vacuum environment which surrounds the further flexible element from an atmosphere environment inside the further flexible element. A movable bar or arm of the driven part 143 may axially extend through the further flexible element.

[0050] According to embodiments described herein, the first mount 152 can be moved together with the alignment device 151 in the second direction Z by the first shifting device 141. In particular, the first mount 152 can be moved by the first shifting device 141 toward the first carrier 10 that is positioned on the first transport path until the first mount 152 comes in contact with and attaches to the first carrier 10. The first mount with the first carrier mounted thereon can then be moved by the first shifting device 141 in the second direction Z toward a deposition source 105 or toward a second carrier. Thereafter, a fine alignment of the first carrier via the alignment device 151 may follow.

[0051] The driving unit 142 (e.g. provided as a linear Z-actuator) of the first shifting device 141 may be arranged outside the vacuum chamber 101. A front part of the driven part 143 of the first shifting device 141 which carries the alignment device 151 and the first mount 152 may be arranged inside the vacuum chamber. Movements of the side wall 102 of the vacuum chamber 101 through which the driven part 143 extends are not transferred to the alignment system 130 because the alignment system 130 is connected to the side wall via the vibration damping element 103. An accurate and reproducible alignment of the first carrier can be provided, even if the pressure in the vacuum chamber varies or if the vacuum chamber is flooded and/or evacuated. [0052] FIG. 2 shows a vacuum system for carrier alignment in a vacuum chamber according to embodiments described herein. The vacuum system includes a vacuum chamber 101 with a side wall 102, wherein the side wall may extend in an essentially vertical direction (+/- 20°). An alignment system 130 as described herein extends through the side wall 102 and is flexibly connected to the side wall 102 via a vibration damping element 103, particularly via a flexible and/or expandable element such as a bellow element. A driving unit 142 of the alignment system 130 may be arranged outside the vacuum chamber, and an alignment device 151 of the alignment system 130 which can be moved by the driving unit 142 may be arranged inside the vacuum chamber. A first mount 152 of the alignment system 130 can be moved by the alignment device 151 and is configured for the attachment of the first carrier 10.

[0053] The alignment system 130 may be (rigidly) fixed to a support 110 that is provided in the vacuum chamber, e.g. attached to the top wall of the vacuum chamber. In some embodiments, which may be combined with other embodiments described herein, the support 110 extends in the first direction X and carries or supports the at least one magnet unit 121 of the first carrier transport system 120. Accordingly, both the at least one magnet unit 121 and the alignment system 130 are fixed to the same mechanical support inside the vacuum chamber, such that vibrations or other movements of the vacuum chamber are transferred to the alignment system 130 and to the levitation magnets of the magnetic levitation system to the same extent. The alignment accuracy can be further improved and the carrier transport can be facilitated.

[0054] The vacuum system may be a vacuum deposition system configured to deposit one or more materials on a substrate carried by the first carrier 10. A deposition source 105, particularly a vapor source configured to evaporate an organic material, may be provided in the vacuum chamber. The deposition source 105 may be arranged such that a material can be directed from the deposition source 105 toward the first carrier that is mounted to the first mount 152 of the alignment system.

[0055] The deposition source 105 may be a movable deposition source. In particular, the deposition source 105 may be movable in the first direction X past a substrate that is carried by the first carrier. A drive may be provided for providing a translational movement of the deposition source 105 in the first direction X. [0056] Alternatively or additionally, the deposition source may include a rotatable distribution pipe provided with vapor outlets. The distribution pipe may extend essentially in a vertical direction and may be rotatable around an essentially vertical rotation axis. The deposition material may be evaporated in a crucible of the evaporation source and may be directed toward the substrate through the vapor outlets which are provided in the distribution pipe.

[0057] In particular, the deposition source 105 may be provided as a line source extending in an essentially vertical direction. The height of the deposition source 105 in the vertical direction may be adapted to a height of the vertically oriented substrate such that the substrate can be coated by moving the deposition source 105 past the substrate in the first direction X.

[0058] In some embodiments, the first carrier transport system 120 may be configured to transport the first carrier 10 into a deposition area in the vacuum chamber 101 in which the substrate 11 faces the deposition source 105, such that a coating material can be deposited on the substrate. After the deposition of the coating material on the substrate, the first carrier transport system 120 may transport the first carrier 10 out of the deposition area, e.g. for unloading the coated substrate from the vacuum chamber or for depositing a further coating material on the substrate in a further deposition area.

[0059] The deposition source 105 may include a distribution pipe with a plurality of vapor openings or nozzles for directing the coating material into the deposition area. Further, the deposition source may include a crucible configured for heating and evaporating the coating material. The crucible may be connected to the distribution pipe such as to be in fluid communication with the distribution pipe.

[0060] In some embodiments, which may be combined with other embodiments described herein, the deposition source may be rotatable. For example, the deposition source may be rotatable from a first orientation in which the vapor openings of the deposition source are directed toward the deposition area to a second orientation in which the vapor openings are directed toward a second deposition area. The deposition area and the second deposition area may be located on opposite sides of the deposition source, and the deposition source may be rotatable by an angle of about 180° between the deposition area and the second deposition area.

[0061] The first carrier transport system 120 may be configured for a contactless transport of the first carrier 10 in the vacuum chamber 101. For example, the first carrier transport system 120 may hold and transport the first carrier 10 by magnetic forces. In particular, the first carrier transport system 120 may include a magnetic levitation system.

[0062] In the exemplary embodiment of FIG. 2, the first carrier transport system 120 includes at least one magnet unit 121 arranged at least partially above the first carrier 10 and configured to carry at least a part of the weight of the first carrier 10. The at least one magnet unit 121 may include an actively controlled magnet unit configured to contactlessly hold the first carrier 10. The first carrier transport system 120 may further include a drive device configured to contactlessly move the first carrier 10 in the first direction X. In some embodiments, the drive device may be arranged at least partially below the first carrier 10. The drive device may include a drive such as a linear motor configured to move the first carrier by applying a magnetic force on the first carrier (not depicted).

[0063] FIG. 3 shows an apparatus 300 for carrier alignment in a vacuum chamber 101 according to embodiments described herein. The apparatus 300 is similar to the apparatus 200 depicted in FIG. 2, such that reference can be made to the above explanations, which are not repeated here. [0064] The alignment system 130 of the apparatus 300 includes the first mount 152 for mounting the first carrier 10 to the alignment system, a second mount 153 for mounting a second carrier 20 to the alignment system, the first shifting device 141 configured to move the first mount together with the alignment device 151 in the second direction Z, and a second shifting device 144 configured to move the second mount in the second direction Z. [0065] The first carrier 10 is typically a substrate carrier which carries a substrate 11 to be coated, and the second carrier 20 is typically a mask carrier which carries a mask 21 to be arranged in front of the substrate 11 during deposition. The first carrier 10 and the second carrier 20 can be aligned relative to each other with the alignment system 130, such that an evaporated material can be deposited exactly in a predetermined pattern on the substrate as defined by the mask.

[0066] In particular, the second carrier 20 which is mounted to the second mount 153 can be moved to a predetermined position in the second direction Z with the second shifting device 144. The first carrier 10 can be moved to a predetermined position adjacent to the second carrier 20 in the second direction Z with the first shifting device 141. The first carrier 10 can then be aligned with the alignment device 151 in the alignment direction, particularly in the second direction Z, and/or optionally in one or more further alignment directions.

[0067] In some embodiments, which may be combined with other embodiments described herein, the alignment system 130 extends through a side wall 102 of the vacuum chamber 101 and is flexibly connected to the side wall 102, e.g. via the at least one vibration damping element 103 or vibration isolation element. The vibration damping element may be an axially expandable element such as a bellow element. The vibration damping element may be a flexible or elastic sealing element which reduces the transfer of deformations of the side wall to the alignment system. The flexible or elastic sealing element may act as a vacuum-tight sealing between the side wall and the alignment system. Reference is made to the above explanations, which are not repeated here.

[0068] In some embodiments, the second shifting device 144 includes a second driving unit 145, e.g. a linear actuator or motor, and a second driven part 146 which is moved by the second driving unit 145 in the second direction Z. The second mount 153 is provided at the second driven part 146 to be movable together with the second driven part 146.

[0069] The second driving unit 145 may be arranged outside the vacuum chamber 101, and the second driven part 146 may extend into the vacuum chamber 101, particularly through the opening provided in the side wall 102 of the vacuum chamber. The second mount 153 is provided inside the vacuum chamber 101 at a front end of the second driven part 146. Accordingly, the second carrier 20 can be mounted to the second mount 153 which is provided inside the vacuum chamber. Further, the second carrier 20 can be moved inside the vacuum chamber 101 in the second direction Z by the second shifting device 144 having a second driving unit 145 arranged outside the vacuum chamber. [0070] In some embodiments, the alignment system 130 comprises a main body 131 which is fixed to a support 110 provided inside the vacuum chamber. The driving unit 142 of the first shifting device 141 and the second driving unit 145 of the second shifting device 144 may be fixed to the main body 131 of the alignment system 130. The main body 131 of the alignment system 130 may provide a feed-through through the side wall 102 for the driven part 143 of the first shifting device and for the second driven part 146 of the second shifting device. The main body 131 of the alignment system 130 may be flexibly connected to the side wall 102 of the vacuum chamber 101 via the vibration damping element 103.

[0071] The main body 131 of the alignment system 130 may be fixed to the support 110. The support 110 may be (directly or indirectly) fixed to a top wall of the vacuum chamber and/or may be provided as a support rail or support girder which may extend in the first direction X. The top wall of the vacuum chamber is typically more strongly reinforced and less movable than the vertically extending side walls.

[0072] In some embodiments, which may be combined with other embodiments described herein, the first carrier transportation system 120 may be provided for transporting the first carrier along a first transport path in the first direction X, and a second carrier transportation system 122 may be provided for transporting the second carrier 20 along a second transport path parallel to the first transport path in the first direction X. The first carrier transportation system 120 and/or the second carrier transportation system 122 may be configured as magnetic levitation systems for a contactless carrier transport. In particular, the first carrier transportation system 120 may include at least one magnet unit 121, particularly an actively controlled magnet unit, for contactlessly holding the first carrier 10. The second carrier transportation system 122 may include at least one second magnet unit 123, particularly an actively controlled magnet unit, for contactlessly holding the second carrier 20. Typically, each magnetic levitation system includes a plurality of actively controlled magnet units which may be arranged along the first direction X at an essentially equal spacing. For example, the actively controlled magnet units may be fixed to the support 110.

[0073] In the schematic sectional view of FIG. 3, the first carrier 10 and the second carrier 20 are contactlessly held by actively controlled magnet units of the first carrier transportation system 120 and the second carrier transportation system 122. The first mount 152 is provided at a distance from the first carrier 10 in the second direction Z, and the second mount 153 is provided at a distance from the second carrier 20 in the second direction Z. [0074] FIG. 4A shows the apparatus 300 of FIG. 3 in a second position. The second carrier 20 has been mounted to the second mount 153 by moving the second mount to the second carrier 20 in the second direction Z and magnetically attaching the second carrier 20 to the second mount 153. The second carrier 20 is then moved by the second shifting device 144 in the second direction Z to a predetermined position, e.g. by a distance of 20 mm or more. In particular, the mask 21 that is carried by the second carrier 20 is positioned at a predetermined position facing the deposition source 105.

[0075] As is further depicted in FIG. 4A, the first carrier 10 carrying the substrate 11 is transported by the first carrier transport system 120 into the deposition area, and the first mount 152 is mounted to the first carrier by moving the first mount 152 to the first carrier 10 with the first shifting device 141.

[0076] As is schematically depicted in FIG. 4B, the first carrier 10 is then moved in the second direction Z toward the second carrier 20 by the first shifting device 141 until the substrate 11 is positioned close to the mask 21. Subsequently, the first carrier 10 is aligned in at least one alignment direction, particularly in the second direction Z, with the alignment device 151. The first carrier 10 may be positioned exactly at a predetermined position by the alignment device 151 which may include one or more piezo actuators.

[0077] One or more materials can be deposited on the substrate 11 by the deposition source 105 through the openings of the mask 21. An accurate material pattern can be deposited on the substrate. [0078] FIG. 5 is an exploded view of an alignment system 130 of an apparatus according to embodiments described herein. The alignment system 130 is similar to the alignment system of the apparatus shown in FIG. 3, such that reference can be made to the above explanations, which are not repeated here. [0079] The alignment system 130 includes the main body 131 which is flexibly connectable to a side wall 102 of a vacuum chamber 101 (not shown in FIG. 5) via a vibration damping element 103, e.g. via a bellow element. A driving unit 142 (e.g. a first Z-actuator) and a second driving unit 145 (e.g. a second Z-actuator) are fixed to the main body 131 outside the vacuum chamber 101. In some embodiments, the main body 131 is rigidly fixed to a support inside the vacuum chamber (not depicted in FIG. 5), e.g. via screws or bolts 108, and flexibly connected to the side wall 102.

[0080] The driving unit 142 is configured to move a first driven part 143 which extends through the main body 131 into the vacuum chamber in the second direction Z, and the second driving unit 145 is configured to move a second driven part 146 which extends through the main body 131 into the vacuum chamber in the second direction Z. A first mount 152 for mounting a first carrier to the alignment system is provided at a front end of the first driven part 143, and a second mount 153 for mounting a second carrier to the alignment system is provided at a front end of the second driven part 146. Accordingly, the first mount 152 and the second mount 153 can be moved independently of each other in the second direction Z by the respective shifting device, in order to position the first and second carriers at respective predetermined positions in the second direction Z.

[0081] The second driven part 146 protrudes further into the vacuum chamber than the first driven part 143, such that the first carrier and the second carrier can be held adjacent to each other at the second mount and the first mount which are provided at the front ends of the driven parts.

[0082] The first mount 152 is connected to the first driven part 143 via an alignment device 151, particularly including at least one piezo actuator. Accordingly, a fine positioning (or fine alignment) of the first carrier with respect to the second carrier can be performed by accurately positioning the first mount 152 at a predetermined position with the alignment device 151.

[0083] FIG. 6 shows a perspective view of the alignment system 130 of FIG. 5. A small gap is provided between the main body 131 of the alignment system 130 and the side wall 102 of the vacuum chamber such that the main body 131 does not move together with the side wall 102, e.g. when the side wall vibrates or when the side wall moves due to a pressure change inside the vacuum chamber.

[0084] In some embodiments, the apparatus includes two or more alignment systems in the deposition area which are spaced-apart from each other in the first direction X. Each alignment system may be configured in accordance with the alignment system 130 according to embodiments described herein. For example, the first mount of a first alignment system may be configured to hold an upper front part of the first carrier, and the first mount of a second alignment system may be configured to hold an upper rear part of the first carrier. Each alignment system may extend through the side wall 102 of the vacuum chamber, such that the respective driving units of the respective shifting devices are positioned outside the vacuum chamber. Further, each alignment system may be flexibly connected to the side wall of the vacuum system via a respective vibration isolation element. In some embodiments, each alignment system is mechanically fixed to the same support that is provided inside the vacuum chamber, e.g. fixed to the top wall of the vacuum chamber.

[0085] The alignment device of the first alignment system may be configured to align the first carrier in the first direction X, the second direction Z, and the third direction Y, and the alignment device of the second alignment system may be configured to align the first carrier in the first direction Z and in the third direction Y. Further alignment systems with further alignment devices may be provided. Accordingly, the first carrier, being a three- dimensional object, can be positioned and rotated exactly to a predetermined translational and rotational position in the deposition area with respect to the second carrier.

[0086] In some embodiments, which may be combined with other embodiments described herein, the driven part 143 of the first shifting device is configured to feed a supply element such as a cable to a component arranged inside the vacuum chamber 101. In particular, the driven part 143 comprises a hollow tube element configured as a cable passage for a cable extending from outside the vacuum chamber to a component arranged at a front end of the driven part 143 inside the vacuum chamber 101. For example, at least one cable connected to at least one of the alignment device 151 and the first mount 152 may extend through a hollow tube element of the driven part 143. Thus, a component which is movable in the second direction Z inside the vacuum chamber can be supplied with electrical power. For example, a piezo actuator of the alignment device 151 and/or a magnetic chuck of the first mount 152 may be supplied with electrical power from outside the vacuum chamber through the driven part 143.

[0087] In some embodiments, the second driven part 145 of the second shifting device is also configured to feed a supply element such as a cable to a component arranged inside the vacuum chamber, e.g. to a component provided at a front end of the second driven part 145 inside the vacuum chamber. For example, the second mount 153 can be supplied with electrical power from outside the vacuum chamber through the driven part 145.

[0088] FIG. 7 is a flow diagram illustrating a method of aligning a first carrier in a vacuum chamber according to embodiments described herein.

[0089] In box 830, a first carrier which may carry a substrate to be coated is transported along a first transport path in a first direction X in a vacuum chamber 101. The first carrier may be transported into a deposition area where a deposition source 105 and an alignment system 130 are arranged. In some embodiments, the first carrier 10 is contactlessly transported by a magnetic levitation system including a plurality of actively controlled magnet units.

[0090] In box 840, the first carrier is mounted to a first mount of the alignment system 130. The alignment system includes: an alignment device configured to move the first mount in at least one alignment direction, and a first shifting device configured to move the alignment device together with the first mount in a second direction transverse to the first direction. The second direction may be a horizontal direction essentially perpendicular to the first direction.

[0091] In box 850, the first carrier is moved (together with the alignment device) in the second direction by the first shifting device, particularly toward a previously positioned mask that is carried by a second carrier.

[0092] In box 860, the first carrier is aligned in at least one alignment direction with the alignment device, particularly in the second direction and optionally in at least one of the first direction and the third direction. In particular, the substrate that is carried by the first carrier 10 is moved into contact with a mask that is carried by a second carrier. [0093] In optional box 870, a material is deposited on the substrate that is carried by the first carrier. In particular, an evaporated organic material is deposited on the substrate by a vapor source which may be movable past the substrate.

[0094] In embodiments, which can be combined with other embodiments described herein, the first carrier is a substrate carrier carrying a substrate, and aligning the first carrier comprises aligning the first carrier with respect to a second carrier mounted to a second mount of the alignment system. In particular, the second carrier is a mask carrier carrying a mask.

[0095] In optional box 810, a second carrier 20 carrying a mask 21 is transported along a second transport path which extends parallel to the first transport path in the first direction X into the deposition area. The second carrier 20 may be contactlessly transported by a magnetic levitation system including a plurality of actively controlled magnet units.

[0096] In optional box 820, the second carrier 20 is mounted to a second mount of the alignment system 130, and the second carrier is moved in the second direction Z by a second shifting device of the alignment system 130, particularly toward the deposition source. The method may then proceed with box 830.

[0097] The apparatus described herein can be configured for evaporation of e.g. an organic material for the manufacture of OLED devices. For example, the deposition source can be an evaporation source, particularly an evaporation source for depositing one or more organic materials on a substrate to form a layer of an OLED device.

[0098] The embodiments described herein can be utilized for evaporation on large area substrates, e.g., for OLED display manufacturing. Specifically, the substrates for which the structures and methods according to embodiments described herein are provided, are large area substrates, e.g. having a surface area of 0.5 m² or more, particularly 1 m² or more. For instance, a large area substrate or carrier can be GEN 4.5, which corresponds to a surface area of about 0.67 m² (0.73 x 0.92m), GEN 5, which corresponds to a surface area of about

1.4 m² (1.1 m x 1.3 m), GEN 7.5, which corresponds to a surface area of about 4.29 m² (1.95 m x 2.2 m), GEN 8.5, which corresponds to a surface area of about 5.7m² (2.2 m x

2.5 m), or even GEN 10, which corresponds to a surface area of about 8.7 m² (2.85 m x 3.05 m). Even larger generations such as GEN 11 and GEN 12 and corresponding surface areas can similarly be implemented. Half sizes of the GEN generations may also be provided in OLED display manufacturing.

[0099] According to some embodiments, which can be combined with other embodiments described herein, the substrate thickness can be from 0.1 to 1.8 mm. The substrate thickness can be about 0.9 mm or below, such as 0.5 mm. The term“substrate” as used herein may particularly embrace substantially inflexible substrates, e.g., a wafer, slices of transparent crystal such as sapphire or the like, or a glass plate. However, the present disclosure is not limited thereto, and the term“substrate” may also embrace flexible substrates such as a web or a foil. The term“substantially inflexible” is understood to distinguish over“flexible”. Specifically, a substantially inflexible substrate can have a certain degree of flexibility, e.g. a glass plate having a thickness of 0.9 mm or below, such as 0.5 mm or below, wherein the flexibility of the substantially inflexible substrate is small in comparison to the flexible substrates.

[00100] According to embodiments described herein, the substrate may be made of any material suitable for material deposition. For instance, the substrate may be made of a material selected from the group consisting of glass (for instance soda-lime glass, borosilicate glass, and the like), metal, polymer, ceramic, compound materials, carbon fiber materials or any other material or combination of materials which can be coated by a deposition process.

[00101] According to embodiments described herein, the method for transporting and aligning of a substrate carrier and a mask carrier in a vacuum chamber can be conducted using computer programs, software, computer software products and the interrelated controllers, which can have a CPU, a memory, a user interface, and input and output devices being in communication with the corresponding components of the apparatus.

[00102] The present disclosure provides a first carrier transport system for a first carrier and a second carrier transport system for a second carrier that may be equally sized in at least one dimension. In other words, the second carrier may fit into the first carrier transport system and the first carrier may fit into the second carrier transport system. The first carrier transport system and the second carrier transport system can be flexibly used while providing an accurate and smooth transportation of the carriers through the vacuum system. The alignment system allows for a precise alignment of the substrate with respect to the mask, or vice versa. High quality processing results, e.g. for production of high resolution OLED devices, can be achieved. [00103] In other embodiments, the mask carriers and the substrate carriers may be differently sized. For example, the mask carriers may be larger than the substrate carriers, particularly in a vertical direction, as is schematically depicted in FIG. 3.

[00104] While the foregoing is directed to embodiments of the disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims

1. An apparatus for carrier alignment in a vacuum chamber (101), comprising: a first carrier transport system (120) configured to transport a first carrier (10) along a first transport path in a first direction (X); and an alignment system (130), comprising: a first mount (152) for mounting the first carrier (10) to the alignment system (130); an alignment device (151) configured to move the first mount (152) in at least one alignment direction; and a first shifting device (141) configured to move the alignment device (151) together with the first mount (152) in a second direction (Z) transverse to the first direction

(X).

2. The apparatus according to claim 1, wherein the first shifting device (141) comprises a driving unit (142) and a driven part (143), wherein the alignment device (151) and the first mount (152) are provided at the driven part (143) to be movable together with the driven part.

3. The apparatus according to claim 2, wherein the driving unit (142) comprises a linear actuator configured to move the driven part (143) in the second direction (Z) by a distance of 10 mm or more, particularly 20 mm or more, more particularly 30 mm or more.

4. The apparatus according to claim 2 or 3, wherein the driving unit (142) is arranged outside the vacuum chamber (101), and the driven part (143) extends from outside the vacuum chamber into the vacuum chamber.

5. The apparatus according to any of claims 2 to 4, wherein the driven part (143) comprises a hollow tube element configured to feed a cable to a component arranged inside the vacuum chamber (101), particularly to at least one of the alignment device (151) and the first mount (152).

6. The apparatus according to any of claims 1 to 5, wherein the alignment system (130) extends through a wall of the vacuum chamber and is flexibly connected to the wall via at least one vibration damping element (103).

7. The apparatus according to claim 6, wherein the vibration damping element (103) comprises at least one flexible and/or elastic sealing element, particularly a bellow element, configured to reduce or prevent a transfer of movements of the wall to the alignment system.

8. The apparatus according to any of claims 1 to 7, wherein the alignment device (151) comprises at least one piezo actuator. 9. The apparatus according to any of claims 1 to 8, wherein the alignment device

(151) is configured to move the first mount (152) in the second direction (Z), and optionally in the first direction (X) and/or in a third direction (Y) transverse to the first and second directions.

10. The apparatus according to any of claims 1 to 9, wherein the first mount (152) comprises a magnetic chuck configured to magnetically hold the first carrier at the first mount, particularly comprising an electropermanent magnet device.

11. The apparatus according to any of claims 1 to 10, the alignment system (130) further comprising: a second mount (153) for mounting a second carrier to the alignment system (130); and a second shifting device (144) configured to move the second mount (153) in the second direction (Z).

12. The apparatus according to claim 11, wherein the second shifting device (144) comprises a second driving unit (145) and a second driven part (146), the second mount being provided in the vacuum chamber at the driven part.

13. The apparatus according to any of claims 1 to 12, wherein the first carrier transport system (120) is a magnetic levitation system configured to contactlessly transport the first carrier (10) in the first direction (X) and comprising a plurality of actively controlled magnet units.

14. A vacuum system for carrier alignment in a vacuum chamber, comprising: a vacuum chamber (101) with a side wall (102); and an alignment system (130), comprising: a first mount (152) for mounting the first carrier (10) to the alignment system (130); an alignment device (151) configured to move the first mount (152) in at least one alignment direction; and a first shifting device (141) configured to move the alignment device (151) together with the first mount (152) in a second direction (Z) transverse to the first direction (X), the alignment system (130) extending through the side wall (102) and being flexibly connected to the side wall (102). 15. A method of aligning a carrier in a vacuum chamber, comprising: transporting a first carrier (10) along a first transport path in a first direction (X); mounting the first carrier to a first mount (152) of an alignment system (130), the alignment system comprising an alignment device (151) configured to move the first mount in at least one alignment direction, and a first shifting device (141) configured to move the alignment device together with the first mount in a second direction (Z) transverse to the first direction; moving the first carrier in the second direction (Z) with the first shifting device (141); and aligning the first carrier in at least one alignment direction with the alignment device (151).

16. The method of claim 15, wherein the first carrier (10) is a substrate carrier carrying a substrate (11), and aligning the first carrier comprises aligning the first carrier with respect to a second carrier (20) mounted to a second mount of the alignment system, particularly wherein the second carrier is a mask carrier carrying a mask (21).