JP2010138467A - Alignment apparatus, alignment method, apparatus for manufacturing organic el device, and film-forming apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an alignment apparatus and an alignment method that enable precise alignment, and an apparatus for manufacturing an organic EL device and a film-forming apparatus that are capable of carrying out high-precision vapor deposition using the alignment apparatus and the alignment method, and to provide an apparatus for manufacturing an organic EL device and a film-forming apparatus that are capable of offering high productivity by reducing dust and heat generation in vacuum by disposing a driving part etc. required for alignment at the atmosphere side or offering high operating rate by increasing maintainability. <P>SOLUTION: The alignment apparatus has a shadow mask having a through-hole for alignment and an alignment part having an alignment optical system and a control part. The alignment optical system has a light source that emits light from one end of the through-hole and an imaging means that takes an image of the other end, while the control part carries out alignment based on an output from the imaging means. In addition, the through-hole is a hole that penetrates the shadow mask from its anterior surface to its posterior surface, and the alignment optical system has a blocking means for blocking deposition of a treating material onto the through-hole at least during the treatment of the substrate. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an alignment apparatus, an alignment method, an organic EL device manufacturing apparatus, and a film forming apparatus, and more particularly to an alignment apparatus and alignment method, an organic EL device manufacturing apparatus, and a film forming apparatus suitable for alignment of a large substrate.

  There exists a vacuum evaporation method as an influential method of manufacturing an organic EL device. In vacuum deposition, alignment between the substrate and the mask is necessary. As the size of the processing substrate increases, the size of the G6 generation substrate becomes 1500 mm × 1800 mm. Naturally, the mask becomes larger as the substrate size increases, and the size of the mask reaches about 2000 mm × 2000 mm. In particular, when a steel mask is used, an organic EL device has a weight of 300 kg. In addition, the alignment accuracy has become stricter due to the increase in size, and the demand is high. As a prior art regarding alignment, there is Patent Document 1 below.

JP 2006-302896 A

  Conventionally, as shown in FIG. 9, in order to prevent the deposition material from adhering to the alignment mark, a light source that illuminates vertically or obliquely and the reflection is received on the side opposite to the deposition side, and an imaging camera is disposed. The so-called reflective optical system is used to detect alignment marks and perform alignment. In the conventional organic EL device manufacturing apparatus, a rectangular recess provided in a steel mask as shown in the blow-out diagram of FIG. 3 and a metal part provided on a transparent substrate are used as alignment marks, and the metal part is at the center of the square. Aligned to come. However, the reflective optical system has the following problems, and there is a problem that alignment cannot be performed accurately. (1) Although the bottom surface of the recess is mirror-finished, the illumination intensity cannot be increased due to halation and the like, and if it is lowered, the metal part cannot be detected. (2) It is necessary to provide a gap of about 0.5 mm from the mask so as not to damage the substrate surface. However, if the depth of field is small, the image is blurred.

  Further, in the method disclosed in Patent Document 1, since the entire mechanism for aligning the substrate and the mask is installed in a vacuum, the dust and heat accompanying the movement of the alignment optical system and the driving unit for driving them are not generated. In the former case, leakage into the vacuum causes leaked dust to adhere to the substrate or mask, resulting in poor deposition, and the latter heat generation promotes thermal expansion with the mask and changes the deposition size. That is, there is a problem of lowering productivity.

  In addition, since the entire mechanism for aligning the substrate and the mask is installed in a vacuum, once a failure occurs in the drive unit or the like, maintenance takes time and the operating rate of the apparatus is lowered.

Accordingly, a first object of the present invention is to provide an alignment apparatus and an alignment method that can perform alignment with high accuracy.
In addition, a second object of the present invention is to provide an organic EL device manufacturing apparatus and a film forming apparatus that can be deposited with high accuracy using the alignment apparatus or the alignment method.
Furthermore, the third object of the present invention is to provide an organic EL device manufacturing apparatus and a film forming apparatus with high productivity by reducing the dust and heat generation in the vacuum by arranging the drive unit and the like on the atmosphere side. is there.
In addition, an object of the present invention 4 is to provide an organic EL device manufacturing apparatus and a film forming apparatus with high maintainability by arranging a drive unit and the like on the atmosphere side and having a high operation rate.

In order to achieve the above object, the shadow mask has a through hole for alignment, and the alignment unit has an alignment optical unit that includes a light source that enters light from one end side of the through hole and an imaging unit that images the other end. A first feature is that the system includes a system and a control unit that performs alignment based on the output of the imaging means.
In order to achieve the above object, in addition to the first feature, the through hole is a hole penetrating before and after the shadow mask, and the alignment optical system is configured to transmit the through hole at least when processing the substrate. The alignment apparatus according to claim 1, further comprising a shielding unit that shields the treatment material from adhering to the substrate.
In order to achieve the above object, in addition to the second feature, the alignment optical system further includes shielding moving means for moving the shielding means to a processing position during processing and to an alignment position during alignment. The third feature.

In order to achieve the above object, in addition to the first feature, one end of the through hole is an opening for alignment, and an optical fiber is connected or inserted into the opening at the other end, and the other end of the optical fiber is connected. Is connected to the light source or the imaging means.
In order to achieve the above object, in addition to the second feature, the fifth feature is that one end of the through hole is an opening for alignment, and the through hole has an L-shaped portion. And

In order to achieve the above object, the alignment optical system includes a light source that irradiates light to alignment marks provided on a substrate and a shadow mask, and an imaging unit that images the alignment mark. Is characterized in that at least one of the light source and the imaging means has a following means for moving following the alignment operation of the substrate or the shadow mask. Further, in order to achieve the above object, In addition to the sixth feature, a seventh feature is that the following means is means for linking to movement of a drive unit that drives the alignment operation.

  In order to achieve the above object, an alignment optical system comprising a light source for irradiating light to an alignment mark provided on a substrate and a shadow mask, and an imaging means for imaging the alignment mark, A plurality of (at least three or more) are provided correspondingly, a plurality of the alignment optical systems are provided for the respective alignment marks, and alignment is performed based on the center position of the substrate based on the outputs of the plurality of imaging means. Is the eighth feature.

  Furthermore, in order to achieve the above object, in addition to the eighth feature, the plurality is 4, and the alignment is provided near the four corners of the substrate and the shadow mask.

In order to achieve the above object, in addition to the above first to ninth characteristics, the alignment base substrate and a shadow mask are provided in an upright position. The tenth characteristic is also achieved. Therefore, in addition to the above first to tenth features, the eleventh feature is that the alignment is performed in a vacuum chamber, and has a vacuum deposition chamber for performing a deposition process on a substrate with a deposition material in an evaporation source.
Furthermore, in order to achieve the above object, in addition to the above eleventh feature, at least the imaging means of the alignment optical system is built in a concave portion protruding from the atmosphere side above the vacuum chamber, A twelfth feature is that an optical window is provided.

  In order to achieve the above object, in addition to the eleventh feature, the shield moving means connects the drive means provided on the atmosphere side, and the drive means and the shield means via a vacuum seal means. It has a thirteenth feature that it has connecting means.

  In order to achieve the above object, in addition to the above eleventh feature, a driving means for driving the shadow mask for the alignment, an alignment base for holding the shadow mask or the shadow mask, and the driving means are provided. A fourteenth feature is that the device has an alignment shaft to be connected, the driving means is provided on the atmosphere side, and the alignment shaft operates via a vacuum sealing means.

  Finally, in order to achieve the above object, in addition to the above-mentioned eleventh to fourteenth features, a film-forming apparatus characterized by using an organic EL as the vapor deposition material.

ADVANTAGE OF THE INVENTION According to this invention, the alignment apparatus and the alignment method which can align accurately can be provided.
Moreover, according to this invention, the organic EL device manufacturing apparatus and film-forming apparatus which can be vapor-deposited with high precision using the said alignment apparatus or the alignment method can be provided.
Furthermore, according to the present invention, it is possible to provide an organic EL device manufacturing apparatus and a film forming apparatus with high productivity by reducing the dust and heat generation in the vacuum by arranging the drive unit and the like on the atmosphere side.
In addition, according to the present invention, it is possible to provide an organic EL device manufacturing apparatus and a film forming apparatus with high maintainability by arranging the driving unit and the like on the atmosphere side and having a high operation rate.

  A first embodiment of the invention will be described with reference to FIGS. Organic EL device manufacturing equipment is not simply a structure in which a light emitting material layer (EL layer) is formed and sandwiched between electrodes, but a hole injection layer or transport layer on the anode, and an electron injection layer or transport layer on the cathode. A multilayer structure in which various materials are formed as a thin film is formed, and a substrate is cleaned. FIG. 1 shows an example of the manufacturing apparatus.

  The organic EL device manufacturing apparatus 100 according to the present embodiment is roughly divided into a load cluster 3 that carries a substrate 6 to be processed, four clusters (A to D) that process the substrate 6, between each cluster, or between the cluster and the load cluster 3. Or it is comprised from the six delivery chambers 4 installed between the following processes (sealing process). In this embodiment, the substrate is transported with the deposition surface of the substrate as the upper surface, and the substrate is erected and deposited when vapor deposition is performed.

  The load cluster 3 receives a substrate 6 (hereinafter simply referred to as a substrate) from the load lock chamber 31 having the gate valve 10 and the load lock chamber 31 in order to maintain a vacuum in the front-rear direction, and rotates to receive the substrate 6 in the delivery chamber 4a. Is composed of a transfer robot 5R. Each load lock chamber 31 and each delivery chamber 4 have a gate valve 10 in the front and rear, and deliver the substrate to the load cluster 3 or the next cluster or the like while maintaining the vacuum by controlling the opening and closing of the gate valve 10.

  Each cluster (A to D) includes a transfer chamber 2 having a single transfer robot 5 and two processing chambers 1 (first) arranged on the top and bottom of the drawing for receiving a substrate from the transfer robot 5 and performing a predetermined process. 1 subscripts a to d indicate clusters, and second subscripts u and d indicate upper and lower sides). A gate valve 10 is provided between the transfer chamber 2 and the processing chamber 1.

FIG. 2 shows an outline of the configuration of the transfer chamber 2 and the processing chamber 1. Although the configuration of the processing chamber 1 varies depending on the content of processing, a vacuum deposition chamber 1bu that deposits a luminescent material in vacuum to form an EL layer will be described as an example. FIG. 3 is a schematic diagram and an operation explanatory diagram of the configuration of the transfer chamber 2b and the vacuum deposition chamber 1bu at that time. The transfer robot 5 in FIG. 2 has a three-link structure arm 57 that can move up and down as a whole (see arrow 59 in FIG. 3) and can turn left and right. Two hands 58 are provided in two upper and lower stages. In the case of a single hand, a rotation operation for transferring the substrate to the next process, a rotation operation for receiving the substrate from the previous process, and an accompanying gate valve opening / closing operation are necessary during the loading / unloading process. By making the upper and lower two stages, the substrate to be carried into one hand is held, the substrate is carried out from the vacuum deposition chamber with the other hand not holding the substrate, and then the carrying-in operation is continuously performed. be able to.
Whether to use two hands or one hand depends on the required production capacity. In the following description, a single hand is used for the sake of simplicity.

  On the other hand, the vacuum deposition chamber 1bu is roughly divided into a vapor deposition unit 7 for sublimating a luminescent material and depositing it on the substrate 6, an alignment unit 8 for aligning the substrate 6 and the shadow mask, and depositing on a necessary part of the substrate 6, And the transfer robot 5 and the processing delivery unit 9 that transfers the substrate to the vapor deposition unit 7. The alignment unit 8 and the processing delivery unit 9 are provided in two systems, a right R line and a left L line.

FIG. 4 shows the alignment unit 8 according to the present embodiment. In the present embodiment, as shown in FIG. 4, the substrate 6 and the shadow mask are set up substantially vertically. Further, as much as possible, the mechanism for alignment is provided on the atmosphere side outside the vacuum deposition chamber 1, specifically, on the upper wall 1T of the vacuum deposition chamber 1 or below the lower wall 1Y. Moreover, what must be provided in the vacuum evaporation chamber 1bu is provided with a convex portion provided from the atmosphere portion.
In this embodiment, at the time of alignment, the substrate 6 is fixed, the shadow mask 81 is moved, and alignment is performed so that vapor deposition can be performed on a necessary portion of the substrate 6.

Hereinafter, the mechanism and operation of the alignment unit 8 will be described.
The alignment unit 8 holds a shadow mask 81, an alignment base 82 that fixes the shadow mask 81, and an alignment base 82, and an alignment driving unit 83 that defines the orientation of the alignment base 82, that is, the shadow mask 81 in the XZ plane, and an alignment base 82. , An alignment follower 84 for defining the posture of the shadow mask 81 in cooperation with the alignment drive unit 83, an alignment optical system 85 for detecting an alignment mark (described later) provided on the substrate 6 and the shadow mask 81, The image processing apparatus includes a control device 60 (see FIG. 7) that processes the image of the alignment mark, obtains the alignment amount, and controls the alignment driving unit 83.

  First, the shadow mask 81 is shown in FIG. The shadow mask 81 includes a mask 81M and a frame 81F. For example, a size of G6 with respect to a substrate size of 1500 mm × 1800 mm is about 2000 mm × 2000 mm, and its weight is also 300 kg. The mask 81M has a window for defining the deposition position. For example, when forming a deposited film that emits red (R), there is a window at a portion corresponding to R. The size of the window varies depending on the color, but on average is about 30 μm in width and about 150 μm in height. The thickness of the mask 81M is about 50 μm and tends to be thinner in the future. On the other hand, in the overlapping portion of the mask 81M with the frame 81F, there are four precision alignment marks 81m and two sparse alignment marks 81mr, and six alignment marks 81m. Correspondingly, alignment marks 6m are provided at a total of six locations, including four fine alignment marks 6ms and two sparse alignment marks 6mr.

  The alignment base 82 has holding portions 82 u and 82 d for holding the upper and lower portions of the shadow mask 81, and the back side of the shadow mask 81 is hollow like a round shape so that it can be deposited on the substrate 6. The alignment base 82 is rotatably supported by four rotation support portions in total near the four corners, two locations 81a and 81b at the top, and 81c and 81d provided below each of the two locations. ing.

  Next, the alignment driving unit 83 and the alignment driven unit 84 that define the posture of the shadow mask 81 will be described. First, the movement of the four rotation support portions will be described, and the configuration and operation of the alignment drive portion 83 and the alignment follower portion 84 that drive the four rotation support portions or follow the movement of the rotation support portion will be described.

Of the four rotation support portions, when the rotation support portion 81a is mainly driven (actively driven) in the Z direction and the rotation support portion 81b is mainly driven in the Z direction and the X direction, the rotation support portion 81a is moved via the alignment base 82. Following the X direction, the rotation support portions 81c and 81d rotate following the rotation support portion 81a as a fulcrum by the combined action of the main motion.
Alignment shafts 83a and 84a that connect each rotation support portion and an action point of a driving portion or a driven portion to be described later are translated in the vertical direction in the Z direction and / or in the X direction without being inclined by the splines 83s and 84s. For this purpose, each rotation support portion is rotatably attached to the alignment base 82. Therefore, the driven rotation of the rotation support portions 81c and 81d described above is a movement that is decomposed in the X direction and the Z direction.
That is, in this embodiment, the Z position is corrected by the movement of the rotation support portions 81a and 81b in the Z direction, the rotation correction is performed by the difference between the two, and the X position correction is performed by the movement of the rotation support portion 81b in the X direction. . Further, the longer the distance between both of the rotation support portions 81a and 81b, there is an advantage that the rotation correction can be accurately performed for the same movement in the Z direction.

  The above-described shadow mask drive unit 83 that drives the rotation support units 81a and 81b is provided in the atmosphere on the upper wall 1T (see also FIG. 2) of the vacuum deposition chamber 1bu, and moves the rotation instruction unit 81a in the Z direction. The left drive part 83L having the Z drive part 83Z, the Z drive part 83Z for moving the rotation support part 81b in the Z direction similarly to the left drive part 83L, and the entire Z drive part are moved in the X direction (left and right direction in FIG. Z). And right drive unit 83R having X drive unit 83X. Since the Z drive units of the left and right drive units 83L and 83R are basically the same and configured, the same numbers are given and some numbers are omitted. Hereinafter, the numbering and omission methods are the same in the mechanism section.

  The Z drive unit 83Z will be described by taking the left drive unit 83L as an example. As described above, the Z drive unit 83Z is fixed to the Z drive unit fixing plate 83k that follows the rail 83r in the X direction, and the Z direction drive motor 83zm moves the connecting rod 83j in the Z direction via the ball screw 83n and the taper 83t. Moving. The alignment shaft 83a is moved in the Z direction by a connecting rod 83j connected at the top thereof. The taper 83t is provided to prevent the lost motion in the Z direction using the gravity of the alignment base 82 or the like, and as a result, there is an effect that the hysteresis is eliminated and the target value is converged quickly. Each alignment shaft 83a operates through a bellows 83v having one end fixed to a seal portion (not shown) provided on the upper wall 1T of the vacuum deposition chamber 1bu.

  In addition to the Z drive unit 83Z, the right drive unit 83R is fixed to the upper wall 1T of the vacuum deposition chamber 1bu, and the Z drive unit fixing plate 83k on which the Z drive unit 83Z is mounted extends along the X-axis rail 83r. And an X driving unit 83X for driving the motor. The driving method of the X driving unit 83X is basically the same as that of the Z-axis driving unit 83Z, such as the rotational force of the X direction driving motor 83xm via the ball screw 83n, but the driving force rotates and aligns the alignment base 82. Power is required to move other drive units or follower units through the base. Since the alignment 83a axis of the right drive unit 83R also moves in the X direction, the bellows 83v also has a degree of freedom in the X direction, and has flexibility in the right and left as well as expansion and contraction.

  The alignment follower 84 includes left and right followers 84L and 84R that can move the respective alignment shafts 84a in the Z direction and the X direction so as to correspond to the above-described driven rotation of the rotation support portions 81c and 81d. There may be one follower portion at the center, but in this embodiment, two followers are provided for stable operation. Since both driven parts basically have the same structure symmetrical with respect to the left and right lines, 84R will be described as a representative. The alignment shaft 84a is connected to the X-axis via a bellows 84v for sealing the vacuum of the chamber 1bu and a spline 84s in the same manner as the bellows 83v having one end fixed to a seal portion 84c provided on the lower wall 1Y of the vacuum deposition chamber 1bu. It is fixed to the driven plate 84k. Therefore, the X direction is driven by moving the rail 84r laid on the alignment support portion fixing base 84b for fixing the alignment driven portion 84, and the Z direction is passively performed by the spline 84s.

  In the embodiment of the alignment unit described above, of the four rotation support units 81, two rotation support units provided at the upper part of the vacuum deposition chamber are driven (actively driven) in the Z direction and one of them is driven in the X direction. Thus, alignment of the shadow mask is performed. In addition, various driving methods can be mentioned. For example, rotation support portions are provided at three upper portions, the center rotation support portion is rotated, and alignment is performed by moving the left and right rotation support portions in the Z direction and the X direction. Provide at the bottom and at least one follower. Alternatively, as in the above embodiment, two upper rotation support portions are provided, the rotation, the main movements in the Z direction and the X direction are concentrated at one place, and the others are driven. In the above embodiment, the upper part is basically driven and the lower part is driven, but this may be reversed.

  Next, the alignment optical system 85 will be described. The alignment optical system includes four precision alignment optical systems 85s for the four precision alignment marks 81ms and two sparse alignment optical systems 85r for the two sparse alignment marks 81m so that the alignment marks described above can be imaged independently. These are composed of a total of six optical systems.

  FIG. 6 shows the basic configuration of six alignment optical systems. The basic configuration of the optical system is that a light source 85k is housed in a light source housing cylinder 85ts having an optical window 85ws at the tip on the side of the alignment base 82 with the shadow mask 81 in between and protruding inside the vacuum in the atmosphere. And a light source side reflecting mirror 85 km fixed to a blocking arm 85 as described later, and is housed in the imaging camera side reflecting mirror 85 cm and the imaging camera housing cylinder 85 t attached to the arm 85 a from the imaging camera housing cylinder 85 t on the substrate 6 side. It has a so-called transmission type configuration provided with an imaging camera 85c which is an imaging means. For this purpose, a rectangular through-hole alignment mark 81m is provided in the mask 81M so that light can pass, and a cylindrical through-hole 81k is also provided in the frame 81F. On the other hand, the alignment mark 6m of the substrate 6 is a square and black metal on the light-transmitting substrate, and is sufficiently smaller than the alignment mark 81m of the shadow mask.

  If the through hole 81k is provided, the vapor deposition material enters the through hole during vapor deposition and is vapor deposited on the alignment mark. Therefore, alignment cannot be performed from the next step. In order to prevent this, the vapor deposition material is shielded from entering the through hole 81k during vapor deposition. In this embodiment, the arm to which the light source side reflecting mirror is attached during alignment blocks an effective area for vapor deposition during vapor deposition, so that the arm can be moved and has a structure that shields the through hole 81k during vapor deposition. 85 as. The shielding arm 85as is expanded and contracted by a connecting rod 85b driven up and down by a drive motor (not shown) provided on the atmosphere side, and one end thereof is driven via a bellows 85v fixed to the seal portion 85s. The broken line shown in FIG. 6 shows the shielding state, and the solid line shows the alignment state.

FIG. 7 shows another embodiment. As shown in FIG. 7A, if the thickness of the shadow mask frame 81F is sufficient, an L-shaped through-hole 81k may be provided in the frame 81F, and the light source 85k may be incorporated together with the light source side reflection mirror 85km. Is possible. In that case, since the frame 81F itself serves as a shield, a shield-type arm is unnecessary.
In addition, as shown in FIG. 7B, when the light source side reflection mirror 85 km does not block the vapor deposition region during alignment, the shield arm can be fixed to the alignment base 82 and can always be in a shield state. .

  Further, as shown in FIG. 7B, on the imaging camera side, the imaging camera storage cylinder 85t may be lengthened and a light source side reflection mirror 85km may be incorporated.

  Further, as shown in FIG. 7 (c), one end of the optical fiber 85f is fixed to the light source side opening while being shielded, and the other end is connected to the light source 85k provided on the atmosphere side. In the present embodiment, the light source as a heating element can be provided on the atmosphere side with a simple structure, and there is no need to provide a special shield.

  Furthermore, if the structure provided in the vacuum deposition chamber 1bu for other purposes serves as a shield during vapor deposition, it is not necessary to provide a new shield.

  On the other hand, the camera storage cylinder 85t has a structure protruding from the upper part 1T of the vacuum deposition chamber 1bu as shown in FIG. 4, and an optical window 85w is provided at the tip to maintain the imaging camera 85c on the atmosphere side and alignment. The marks 6m and 81m can be imaged (see FIG. 6 for numbers).

  Moreover, although the light source was provided in the vapor deposition surface side, you may provide an imaging camera by changing a position.

  The difference in configuration between the precision alignment optical system 85s and the sparse alignment optical system 85r is that the former has a high magnification lens 85h that images the alignment with a small field of view and high resolution in order to perform alignment with high accuracy. is there. Accordingly, the dimensions of the alignment marks 6m and 81m of the substrate and the shadow mask shown in FIG. 3 are different. In the case of precision, it is smaller than the sparse by one digit or more, and finally alignment of the order of μm is possible.

  Therefore, at the time of precision alignment, the precision alignment optical system 85s needs to be moved in accordance with the movement of the alignment 81m of the shadow mask 81 so that the field of view does not deviate. The fixed plates 85p and 85ps for fixing the imaging camera 85c and the light source 85k are connected to the Z driving unit fixing plate 83k or the X-axis driven plate 84k to be followed. The sparse alignment optical system 85r is provided with a camera alignment stage 85d so that the position can be adjusted at the time of initial attachment.

  In the above embodiment, six alignment optical types are used. However, depending on the required accuracy of alignment, there is no need to provide a sparse alignment optical system, and no four precision alignment optical systems are required. There should be at least two.

In the embodiment of the alignment unit 8, the alignment driving unit 83, the alignment driven unit 84, and the alignment optical system 85 are provided on the atmosphere side above or below the vacuum deposition chamber 1bu. It may be provided. Of course, it may be dispersed in the upper part, the lower part, and the side wall part. Next, a mechanism will be described in which the substrate is erected before the alignment is performed and the substrate 6 is brought close to the shadow mask after the alignment is completed. The processing delivery unit 9 shown in FIG. 3 has a comb-like hand 91 that can deliver the substrate 6 without interfering with the comb-like hand 58 of the transfer robot 5, and the substrate 6 on the comb-like hand 91. There is a substrate turning approaching means 93 that is fixedly mounted, turns the substrate 6 upright, and further approaches the alignment unit 8. The fixing means is constituted by electrostatic adsorption or mechanical clamp in consideration of being in a vacuum, and is provided at least on the upper side 94u when the substrate is erected.

FIG. 8 shows the substrate turning approaching means 93 in detail, and further, there is no problem of outgas from the coating material of the wiring, and there is no fear of fluid leakage that causes damage to the piping fatigue. FIG.
First, the substrate turning function of the substrate turning approach means 93 will be described. The substrate turning approach means 93 includes a placing table 93d for placing the substrate 6, a cooling jacket 93j for cooling the substrate 6 during vapor deposition, and a substrate turning driving unit for integrally rotating the substrate 6, the placing table 93d and the cooling jacket 93j. 93b, a rotation support base 93k that rotatably supports the cooling jacket 93j and the like. Cooling water pipes 43 and 44 are laid on the cooling jacket 93j. The substrate turning drive unit 93b includes a turning motor 93sm provided on the atmosphere side, a hollow first link 41 that turns in the direction of arrow A via the gears 93h ₁ and 93h ₂ by the turning motor 93sm, The first link 41 is fixed so as to have a hollow portion continuous with the hollow portion of the first link, and has a second link 42 provided along the side surface portion of the cooling jacket 93J. The first link is interposed by a bellows 93v having one end fixed to a seal portion 93s provided on the side wall of the vacuum deposition chamber 1bu, and is rotatably supported by a rotation support base 93k. The turning motor 93sm is controlled by a control device 60 provided on the atmosphere side.

In the above description, by supporting the substrate 6 standing only by the fixing means 94u provided on the upper part of the fixing means 94 shown in FIG. After the bending is eliminated, the whole may be fixed by fixing means 94d provided at the lower part of the substrate. Further, when the substrate 6 is set up vertically, there is a possibility that a minute gap is generated between the substrate 6 and the mounting table 93d. For example, the substrate 6 is stably inclined with a slight inclination of about 1 degree, and the bending thereof is ensured. Can be eliminated.
In this embodiment, since the substrate deposition surface is the upper surface, the substrate 6 is transported, so that the substrate 6 can be aligned as it is.

  Next, the approach function will be described. Further, the substrate turning approaching means 93 has a substrate approaching drive portion 93g for performing this function. The board approach driving unit 93g fixes the board turning drive unit 93b and moves on the rail 93r in the direction of arrow B on the turning drive unit mounting table 93t, and the approaching motor that drives the turning drive unit mounting table 93t via the ball screw 93n. Has 93 dm. By controlling such a mechanism by the control device 60, the substrate 6 can be brought close to the shadow mask 81 and brought into close contact if necessary.

  According to the above embodiment, it is possible to eliminate the bending of the substrate during vapor deposition. In addition, the distance between the substrate and the shadow mask can be maintained and aligned, and then the substrate is brought close to or in close contact with the shadow mask, thereby reducing blurring in vapor deposition and enabling highly accurate vapor deposition.

Further, the substrate turning approaching means 93 has an in-vacuum wiring / piping mechanism in which there is no problem of outgas from the coating material of the wiring, and there is no fear of fluid leakage that causes damage to the piping fatigue.
The in-vacuum wiring / piping mechanism 40 is composed of the first link 41 and the second link 42, and the cooling water for the supply 43 and the recovery 44 is provided in the hollow portion so that the cooling water flows through the cooling jacket 93J. Piping is provided. Each link is made of a metal that is strong against rust and has sufficient strength, such as stainless steel and aluminum, and the hollow motor 93 sm side of the hollow portion of the first link 41 is open to the atmosphere. The two cooling water pipes are made of a material having flexibility that is generally used in the atmosphere or made of metal, and the first link 41 has no flexible part in the link. And it pipes in the L shape which is the shape formed with the 2nd link 42, and a flexible part is provided in the atmosphere side. If the latter is used, piping with less fatigue damage can be constructed. In addition, the connection part at the side wall of the vacuum deposition chamber 1bu is made lower than the connection part at the cooling jacket 93J so that even if the cooling water leaks from the cooling water pipes 43 and 44, it is drained to the atmosphere side.

According to the in-vacuum wiring / piping mechanism 40 of the present embodiment, one end is opened to the atmosphere, a pipe is provided in the hollow portion of the link mechanism in which multiple ends are connected to the moving unit, and the rotating portion of the link mechanism is vacuum-sealed, Since it is completely cut off from the vacuum side, even if water leaks from the cooling water pipe, it does not leak to the vacuum side, and the hollow part of the link mechanism does not need to be evacuated. Further, since the link mechanism is made of stainless steel or aluminum, no outgas is generated. In addition, since the in-vacuum wiring / piping mechanism constitutes a part of the substrate turning drive unit, the overall structure can be simplified. In the above example, the pipe is laid on the link. However, even if the signal line is wired in the link, a configuration that does not enter into the vacuum of the outgas generated from the signal line can be provided. Therefore,
High vacuum can be maintained and highly reliable vapor deposition processing can be performed.

  Finally, the processing operation in the vacuum deposition chamber using this mechanism will be described mainly with respect to the alignment operation.

  Hereinafter, a processing flow after the substrate is carried into the vacuum deposition chamber 1bu is shown. (1) First, the upper part of the substrate 6 carried in the R line shown in FIG. 3 is fixed to the substrate mounting table, and then it is raised substantially vertically to eliminate the bending. (2) Sparse alignment is performed with a sparse alignment mark in a state where the substrate 6 is separated from the substrate 6, a positional shift in the sparse alignment is detected, and a sparse correction amount is obtained. (2) Based on the sparse correction amount, the shadow mask 81 is moved on the ZX plane shown in FIG. (3) Precise alignment is performed with a precision alignment mark while maintaining a certain distance, and a positional deviation in the precision alignment is detected to obtain a precision correction amount. (4) Based on the precision correction amount, the shadow mask 81 is moved on the ZX plane shown in FIG. (5) The substrate 6 and the shadow mask 81 are brought into close contact with each other. (6) The alignment result (position shift) of (3) is detected. (7) If the positional deviation amount is within an allowable range, the process waits for the completion of the deposition of the L-line substrate shown in FIG. (8) When the deposition of the L line is completed, the evaporation source 71 is moved to the R line for deposition. (9) If the amount of misalignment is outside the allowable range in (7), release both and return to (3) for precise alignment. (10) During the R line deposition in (7), the substrate is unloaded from the L line, and the processes (1) to (9) are performed in parallel on the new substrate.

  In the above, the alignment of the sparse alignment is imaged by the two imaging cameras 85c, and the shadow mask 81 and the alignment marks 81mr and 6mr of the substrate 6 are imaged as shown in the drawing of FIG. It is possible to perform unambiguous alignment based on the midpoint between the two alignment marks. On the other hand, in precision alignment, four alignment marks are provided near the four corners of the substrate, and correction is performed based on the center point of the substrate. Theoretically, it is uniquely determined by two, but the reason for providing four locations is as follows. This is because the information on the four corners determines the center point of the substrate so that the four corners are minimized, thereby reducing the difference between the substrate 6 and the shadow mask 81 and increasing the area that can be effectively used as a product. It is for taking. If the upper middle point is used as a reference for sparse alignment, the distortion on the lower side increases and the area available as a product decreases.

  For example, as a method of aligning the center point of the substrate as the center, the average deviation value at the two upper and lower positions in the ZX coordinate is obtained on the left and right sides, the correction rotation amount is obtained from the deviation average value at the two right and left positions, and further the ZX coordinate is obtained. There is a method in which an average deviation value of four alignment positions is obtained and correction values in the Z direction and the X direction are obtained from the average value of the four positions and the correction rotation amount.

  According to this embodiment described above, it is possible to provide an organic EL device manufacturing apparatus that can perform alignment in a state where the substrate and the shadow mask are vertical or substantially vertical. As a result, it is possible to eliminate the influence of bending due to the weight of the substrate and shadow mask, to eliminate positional deviation and film blurring due to the inability of the substrate and shadow mask to be close to each other, and to deposit high-precision, and to produce a high-definition substrate A device manufacturing apparatus can be provided.

  In addition, according to the present embodiment, in a mechanism necessary for alignment, by providing a driving device in the atmosphere, generation of dust can be suppressed, defective deposition due to dust can be reduced, and a highly productive EL device manufacturing apparatus can be provided. .

  Furthermore, according to the present embodiment, it is possible to provide an organic EL device manufacturing apparatus capable of providing a driving device that cannot be provided in a vacuum in the atmosphere in a mechanism necessary for alignment.

  Further, according to the present embodiment, in a mechanism necessary for alignment, a drive device, a mechanism that generates heat, or many alignment optical system components are provided in the atmosphere, so that an organic EL device with high maintainability and high operation rate is manufactured. Equipment can be provided.

  Further, by performing alignment around the substrate, it is possible to perform vapor deposition with a high effective area as a product, that is, it is possible to provide an EL device manufacturing apparatus with high yield, that is, high productivity.

  Furthermore, according to the above-described embodiment, it is possible to provide a highly reliable EL device manufacturing apparatus that can reliably detect the substrate and the shadow mask by using the alignment mark as a transmission type.

  In the embodiment described above, the alignment is performed in an upright state. However, the alignment mark is transmissive, has a shielding structure for vapor deposition, the alignment optical system is provided on the atmosphere side, and the alignment is performed. The optical system following the alignment operation of the shadow mask and the substrate, the four alignments, and the alignment based on the center position of the value substrate can also be applied to a method or structure for horizontal alignment.

  In the above description, the organic EL device has been described as an example. However, the present invention can also be applied to a film forming apparatus and a film forming method that perform vapor deposition processing in the same background as the organic EL device.

Further, the alignment mechanism can be applied to alignment of a liquid crystal display device or the like performed in the atmosphere.

It is a figure which shows the organic EL device manufacturing apparatus which is embodiment of this invention. It is a figure which shows the outline | summary of a structure of the conveyance chamber 2 and the processing chamber 1 which are embodiment of this invention. It is the schematic diagram and operation | movement explanatory drawing of a structure of the conveyance chamber and processing chamber which are embodiment of this invention. It is a figure which shows the structure of the alignment part which is embodiment of this invention. It is a figure which shows the shadow mask which is embodiment of this invention. It is a figure which shows the basic composition of the alignment optical system which is embodiment of this invention. It is a figure which shows the basic composition of the alignment optical system which is other embodiment of this invention. It is a figure which shows the structure of the board | substrate rotation approach means 93 which is embodiment of this invention. It is a figure explaining the subject of a prior art.

Explanation of symbols

1: Processing chamber 1bu: Vacuum deposition chamber 2: Transfer chamber 3: Load cluster 6: Substrate 6m: Substrate alignment mark 7: Deposition unit 8: Alignment unit 9: Processing delivery unit 60: Controller 71: Evaporation source 81: Shadow Mask 81a-d: Rotation support part 81m: Shadow mask alignment mark 82: Alignment base 83: Alignment drive part 83Z: Z-axis drive part 83X: X-axis drive part 84: Alignment driven part 85: Alignment optical system 81a-d: Alignment support part 81m: Shadow mask alignment mark 81k: Through hole 82 provided in the shadow mask frame: Alignment base 83: Alignment drive part 83Z: Z-axis drive part 83X: X-axis drive part 84: Alignment support part 85: Alignment optics System 85as: Shielding type 85c: imaging camera 85cm: imaging camera side reflecting mirror 85k: light source 85km: light source side reflecting mirror 85r: sparse alignment optical system 85s: precision alignment optical system 93: substrate turning approaching means 93b: substrate turning driving unit 93g: substrate approaching Drive unit 100: Organic EL device manufacturing apparatus AD: Cluster.

Claims (19)

In an alignment apparatus that performs alignment between a substrate and a shadow mask,
The shadow mask has an alignment through-hole, and the alignment unit includes an alignment optical system having a light source that enters light from one end of the through-hole and an imaging unit that images the other end, and the imaging unit And a control unit that performs alignment based on the output of the above.   The through hole is a hole that passes through the shadow mask before and after the shadow mask, and the alignment optical system includes a shielding unit that shields the processing material from adhering to the through hole at least when processing the substrate. The alignment apparatus according to claim 1.   3. The alignment apparatus according to claim 2, wherein the alignment optical system includes shielding moving means for moving the shielding means to a processing position during processing and to an alignment position during alignment.   The alignment apparatus according to claim 3, wherein the shielding unit is provided with a reflection mirror that reflects light from a light source and / or to the imaging unit.   The one end of the through hole is an opening for alignment, an optical fiber is connected or inserted into the opening of the other end, and the other end of the optical fiber is connected to a light source or an imaging unit. Alignment equipment.   The alignment apparatus according to claim 1, wherein one end of the through hole is an opening for alignment, and the through hole has an L-shaped portion.   The alignment apparatus according to claim 6, wherein a mirror is provided at a corner of the L-shaped part. In an alignment apparatus that performs alignment between a substrate and a shadow mask,
An alignment optical system comprising: a light source that irradiates light to alignment marks provided on the substrate and the shadow mask; and an imaging unit that images the alignment mark, wherein the alignment optical system includes the light source or the imaging unit. At least one of the alignment apparatuses has a tracking unit that moves following the alignment operation of the substrate or the shadow mask.   The alignment apparatus according to claim 8, wherein the following unit is a unit linked to movement of a driving unit that drives the alignment operation. In an alignment apparatus that performs alignment between a substrate and a shadow mask,
An alignment optical system comprising a light source for irradiating light to alignment marks provided on the substrate and the shadow mask and an image pickup means for picking up the alignment mark, each of which corresponds to a plurality (at least three or more) of the alignment marks A plurality of alignment optical systems for each alignment mark, and control means for aligning with reference to the center position of the substrate based on outputs of the plurality of imaging means. apparatus.   The alignment apparatus according to claim 10, wherein the plurality is 4, and the alignment is provided near four corners of the substrate and the shadow mask. In an alignment apparatus that performs alignment between a substrate and a shadow mask in a vacuum chamber, and a film forming apparatus that has a vacuum evaporation chamber that performs evaporation processing on an evaporation material in an evaporation source.
12. A film forming apparatus using the alignment apparatus according to claim 1 as the alignment apparatus.   The film forming apparatus according to claim 12, wherein the alignment apparatus is provided upright.   13. The alignment optical system according to claim 12, wherein at least the imaging means is built in a recess protruding from the atmosphere above the vacuum chamber, and an optical window is provided at the concave tip. Deposition device.   The component according to claim 12, wherein the shielding moving means includes a driving means provided on the atmosphere side, and a connecting means for connecting the driving means and the shielding means via a vacuum sealing means. Membrane device.   The alignment apparatus includes a driving unit that drives the shadow mask to perform the alignment, an alignment base that holds the shadow mask or the alignment base that holds the shadow mask, and the driving unit, and the driving unit is an atmosphere. The film forming apparatus according to claim 12, wherein the film forming apparatus is provided on a side, and the alignment shaft operates via a vacuum sealing means.   17. The film forming apparatus according to claim 12, wherein the film forming apparatus is an organic EL device manufacturing apparatus using an organic EL as the vapor deposition material. In an alignment method in which a set of alignment marks provided corresponding to a substrate and a shadow mask is irradiated with light, the irradiated alignment marks are imaged, and alignment is performed based on the output of the imaging means. An alignment method, wherein a plurality (at least three or more) of alignment marks are provided on a peripheral portion of a substrate, and alignment is performed based on a center position of the substrate based on a detection result of the plurality of alignment marks.   The alignment method according to claim 18, wherein the plurality is provided at four locations, and the peripheral portion is near four corners of the substrate.

Images