KR101322530B1 - Organic el device manufacturing device and method of manufacturing the same, film forming device and film forming method - Google Patents

Abstract

Industrial Applicability The present invention can reduce the warpage of a substrate or a mask and deposit it with high accuracy, or the transport chamber can be miniaturized, or by arranging a drive unit or the like on the air side, the generation of dust and gas in the vacuum can be reduced, and the productivity is high. Another object is to provide an organic EL device manufacturing apparatus having high operation rate, a manufacturing method thereof, or a film forming apparatus or a film forming method. The present invention performs alignment of a substrate and a mask in a vacuum chamber in a suspended state as the substrate or a suspension provided with the mask, and when the vapor deposition material is deposited on the substrate, the contact portion on the suspension is It moves and makes the said suspension body vertical, conveys it in a vacuum chamber, sets it to the said position registration position, separates the conveyance contact part of the suspension body contact part of the said suspension body, and the said suspension body contact part of the said conveyance means, and After that, the alignment is performed.

Description

ORGANIC EL DEVICE MANUFACTURING DEVICE AND METHOD OF MANUFACTURING THE SAME, FILM FORMING DEVICE AND FILM FORMING METHOD}

BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to an organic EL device manufacturing apparatus, a manufacturing method thereof, a film forming apparatus and a film forming method, and more particularly, to an organic EL device manufacturing apparatus suitable for alignment of a large substrate, a manufacturing method thereof, a film forming apparatus and a film forming method.

A viable method for producing an organic EL device is the vacuum deposition method. Vacuum deposition requires alignment of the substrate with the mask. Each year, the flow of process substrates increases in size, and the substrate size of the G6 generation is 1500 mm x 1800 mm. If the substrate size is enlarged, the mask is also enlarged naturally, and the dimensions thereof are about 2000 mm x 2000 mm. In particular, using a mask made of steel, the weight is 300 kg. In the prior art, the substrate and the mask were horizontally aligned. As such a prior art, the following patent document 1 is mentioned.

In addition, in the vacuum vapor deposition method, as shown in FIG. 4, the mask which has an opening part in the place to vapor-deposit is made to adhere to the board | substrate to be processed. This mask needs to be replaced every half day to one day because the shape of the hole changes due to the deposition of the vapor deposition material. Conventionally, as shown in FIG. 14, the mask storage chamber H which is a vacuum chamber which stores the mask M used for exchange | exchange and used is installed in the cluster C which has the process chamber S which performs vacuum vapor deposition, and the conveyance robot R which carries out a board | substrate conveyance is carried out. It conveyed and set to the process chamber S by this (patent document 2).

In addition, Patent Document 3 discloses that a heating chamber that warms the mask in advance adjacent to the processing chamber in order to make the mask dimension a desired range is replaced with a mask of the processing chamber when necessary. However, only the heating facilities are described in the heating chamber, and the carry-in / out is considered to be carried out using a transfer robot or the like that transfers the substrate as in Patent Document 2, as described in the first embodiment of Patent Document 3. do.

[Patent Document 1] Japanese Patent Laid-Open No. 2006-302896 [Patent Document 2] Japanese Unexamined Patent Publication No. 2003-027213 [Patent Document 3] Japanese Unexamined Patent Publication No. 2006-196360

However, in the method of horizontally aligning the substrate and the mask disclosed in Patent Document 1, as shown in Fig. 13, the substrate and the mask were largely thinned by their thinness and their own weight. If the warpage is constant, a mask may be produced in consideration of the warpage. However, if the center is larger, the larger the substrate size, the more difficult the production. In general, the amount of warpage at the center point is d1> d2 when the warpage of the substrate is d1 and the warpage of the mask is d2. If the substrate warpage is large, contact damage occurs due to contact with the mask on the substrate deposition surface, and thus it cannot be brought into close contact. Therefore, when spaced apart more than the depth of field and aligning, there exists a subject that a precision will worsen and become a defective product. In particular, a high definition screen cannot be obtained from a substrate for a display device.

In addition, in the method disclosed in Patent Document 1, since the entire mechanism for aligning the substrate and the mask is provided in a vacuum, there is a possibility that dust and heat accompanying movement of the driving unit or the like may be generated, Leakage causes leakage dust to adhere to the substrate or the mask, resulting in poor deposition, and the latter heat generation encourages the mask and thermal expansion to change the deposition size, thereby all lowering the yield, that is, the productivity.

Moreover, since the whole mechanism which aligns a board | substrate and a mask is provided in a vacuum, when a failure occurs in a drive part etc. once, it requires time to repair and the operation rate of an apparatus falls.

In addition, in the methods disclosed in Patent Documents 2 and 3, a transfer robot capable of carrying a mask is required, but a realistic size corresponding to the size of a processing chamber capable of accommodating a transfer robot that satisfies the above requirements, for example, It is a difficult subject to produce a 5m x 5m conveyance chamber.

In addition, in the method disclosed by patent documents 2 and 3, a conveyance robot conveys a mask and conveys a board | substrate. Therefore, there is a problem that the mask cannot be transported during the exchange of the substrate, and not only the processing chamber required for the replacement of the mask can be processed, but also the processing chamber located downstream thereof, whereby the operation rate is lowered and the productivity is lowered. .

Therefore, the 1st object of this invention is to provide the organic electroluminescent device manufacturing apparatus which can reduce the curvature of a board | substrate and a mask, and can deposit with high precision, and its manufacturing method, and film-forming apparatus, and film-forming method.

Moreover, the 2nd objective of this invention is providing the organic electroluminescent device manufacturing apparatus which can miniaturize a conveyance chamber, its manufacturing method, or the film-forming apparatus, or the film-forming method.

Further, a third object of the present invention is to provide a high-productivity organic EL device manufacturing apparatus or a manufacturing method or a film forming apparatus or a film forming method by reducing the generation of dust and gas in a vacuum by arranging a driving section or the like on the atmospheric side. will be.

Moreover, the 4th objective of this invention is providing an organic electroluminescent device manufacturing apparatus, its manufacturing method, or the film-forming apparatus or the film-forming method which improves water retention by arrange | positioning a drive part etc. to an atmospheric side.

In order to achieve the said 1st or 2nd objective, this invention performs alignment of a board | substrate and a mask in a vacuum chamber in the state suspended as a suspension provided with the said board | substrate or the said mask, and a vapor deposition material on the board | substrate. When depositing, the contact portion on the suspension body is moved, the suspension body is placed vertically, conveyed in a vacuum chamber, set in the position alignment position, and the suspension contact portion of the suspension body and the conveying means of conveying means. The 1st characteristic is that the conveyance contact part with the said suspension body contact part is spaced, and the said alignment is performed after that.

Moreover, in order to achieve the said 1st or 2nd objective, this invention is a 2nd characteristic that the said space | interval is performed by the means which raises and lowers the said suspension body which the alignment part which performs the said alignment has in addition to a 1st characteristic.

Further, in order to achieve the first or second object, in addition to the first feature, the separation is characterized by the third feature of separating the conveying contact portion from the suspension contact portion.

Moreover, in order to achieve the said 1st or 2nd objective, in addition to a 1st characteristic, the said suspension body is a suspension body provided with a mask, the said suspension body contact part is a rack provided along the said mask, and the said conveyance contact part is a finisher It is the fourth feature that it is on.

Moreover, in order to achieve the said 3rd or 4th objective, in addition to a 1st characteristic, it is a 5th feature that the drive means of the spaced apart space | interval mechanism was provided in air atmosphere.

According to the present invention, it is possible to provide an organic EL device manufacturing apparatus or a film forming apparatus which can reduce the warpage of a substrate and a mask and can be deposited with high accuracy.

Moreover, according to this invention, the organic electroluminescent device manufacturing apparatus which can miniaturize a conveyance chamber, its manufacturing method, or the film-forming apparatus or the film-forming method can be provided.

Further, according to the present invention, by arranging the driving unit or the like on the air side, generation of dust and gas in the vacuum can be reduced, and an organic EL device manufacturing apparatus, a manufacturing method thereof, or a film forming apparatus or a film forming method having high productivity can be provided. .

Moreover, according to this invention, by providing a drive part etc. to an atmospheric side, water retention can be improved and the organic EL device manufacturing apparatus, its manufacturing method, or the film-forming apparatus or the film-forming method with high operation rate can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS The figure which shows the organic electroluminescent device manufacturing apparatus which is 1st Embodiment of this invention.
It is a schematic diagram and operation explanatory drawing of the structure of a conveyance chamber and a processing chamber which are 1st Embodiment of this invention.
FIG. 3 is a diagram showing one embodiment of the present invention of a mask conveyance mechanism for carrying in and carrying out a mask between a processing chamber and a mask replacement chamber. FIG.
4 is a diagram illustrating a mask that is one embodiment of the present invention.
Fig. 5 is a diagram showing an alignment portion which is one embodiment of the present invention.
(A) is a figure which shows the state in which the rack and pinion of a conveyance mechanism are engaged at the time of conveyance, (b) is the figure which shows the state where the rack and pinion of a conveyance mechanism are spaced apart at the time of alignment. .
7 is a diagram illustrating a basic configuration of an alignment optical system according to one embodiment of the present invention.
The figure which shows the conveyance mechanism and the space | interval mechanism which are 2nd Embodiment of this invention.
9 is a diagram showing an organic EL device manufacturing apparatus according to a second embodiment of the present invention.
It is a figure which shows the structure of the mask exchange chamber which is an organic electroluminescent device manufacturing apparatus which is 2nd Embodiment of this invention, and its operation | movement.
The figure which shows the structure and operation | movement of the mask carrying-in chamber in the organic electroluminescent device manufacturing apparatus which is 2nd Embodiment of this invention.
It is a figure which shows the organic electroluminescent device manufacturing apparatus which is 3rd Embodiment of this invention.
Fig. 13 is a view for explaining the problems of the prior art in which the mask and the substrate are horizontally deposited.
Fig. 14 is a diagram for explaining the prior art in mask exchange.

A first embodiment in the organic EL device manufacturing apparatus of the present invention will be described with reference to FIGS. 1 to 7. The organic EL device manufacturing apparatus is not merely a structure in which a light emitting material layer (EL layer) is formed and sandwiched between electrodes, but various materials such as a hole injection layer or a transport layer on the anode and an electron injection layer or a transport layer on the cathode are thin films. The multilayer structure which consists of these is formed, or a board | substrate is exchanged. 1 shows an example of the manufacturing apparatus.

In the organic EL device manufacturing apparatus 100 according to the present embodiment, each of the load clusters 13 carrying the substrate 6 to be processed, the four clusters A to D processing the substrate 6, and each It consists of five exchange chambers 14 provided between clusters or between the cluster and the load cluster 13, or the next process (sealing process). In this embodiment, the vapor deposition surface of the substrate is transported as an upper surface, and the vapor deposition is carried out while the substrate is raised.

The rod cluster 13 receives the substrate from the load lock chamber 13R having the gate valve 10 and the load lock chamber 13R in order to maintain the vacuum before and after, and turns the substrate 6 to the exchange chamber 14a. ) Is made up of a transfer robot 15R. Each of the load lock chambers 13R and the exchange chambers 14 has a gate valve 10 before and after, and controls the opening and closing of the gate valve 10 to maintain the vacuum to provide a substrate to the load cluster 13 or the next cluster or the like. To pass.

Each cluster A-D receives the board | substrate from the conveyance chamber 2 which has one conveyance robot 15, and the conveyance robot 15, and is two processes arrange | positioned up and down on the figure which performs predetermined | prescribed process. It has a chamber 1 (first subscripts a to d represent clusters, and second subscripts u and d represent upper and lower sides). A gate valve 10 is provided between the transfer chamber 2 and the processing chamber 1.

Although the configuration of the processing chamber 1 varies depending on the processing contents, a description will be given by taking an example of a vacuum deposition chamber 1bu which forms an EL layer by depositing a light emitting material as a deposition material in a vacuum. FIG. 2: is a schematic diagram and operation | movement explanatory drawing of the structure of the conveyance chamber 2b and the vacuum vapor deposition chamber 1bu at that time. The conveyance robot 15 in FIG. 2 can move the whole up and down (refer arrow 159), and has the arm 157 of the link structure which can be rotated left and right, and the comb-shaped hand 158 for board | substrate conveyance is at the front-end | tip. Has

The basic idea of the process of this embodiment is that, as shown in Fig. 2, two processing lines are provided in one vacuum deposition chamber and the other lines are deposited in one line (for example, R line). In the L line on the side, the substrate is carried in and out, and the substrate 6 and the mask 81 are aligned with each other to prepare for deposition. By alternately performing these processes, it is possible to reduce the time of evaporation (sublimation) unnecessarily without deposition on the substrate. In order to realize the above, the vacuum deposition chamber 1bu is aligned with the substrate 6 and the mask, and an alignment portion 8 for depositing on a necessary portion of the substrate 6, the transfer robot 15, and the substrate. Two lines of the right R line and the left L line are formed to transfer the substrate 6 to the vapor deposition unit 7, and the light emitting material is moved between the two lines. It has a vapor deposition part 7 which vaporizes (sublimates) and deposits on the board | substrate 6. As shown in FIG.

Therefore, first, the process exchange part 9 is demonstrated. The process exchange part 9 can receive the board | substrate 6 without interfering with the comb-shaped hand 158 of the conveyance robot 15, and has the comb-shaped hand which has a means 94 which fixes the board | substrate 6 ( 91 and the hand turning drive means 93 which rotates the comb-shaped hand 91 so that the board | substrate 6 can stand up and moves to the alignment part 8. As shown in FIG. As the means 94 for fixing the substrate 6, a means such as electrostatic adsorption or a mechanical clamp is used in consideration of being in a vacuum.

The vapor deposition unit 7 moves up and down drive means 76 for moving the evaporation source 71 in the up and down direction along the rail 76r and moves the left and right alignment portions along the rail 75 over the evaporation source 71. It has a left and right drive base 74. The evaporation source 71 has a light emitting material which is a vapor deposition material therein, and a stable evaporation rate is obtained by heating control (not shown) of the vapor deposition material, and is formed in the evaporation source 71 as shown in the drawing figure of FIG. It has a structure which injects from the some hole 73. FIG. As needed, in order to improve the characteristic of a vapor-deposited film, an additive is also heated and vapor-deposited simultaneously. In this case, the vapor deposition source is formed in parallel with the evaporation source and a pair or a plurality of evaporation sources.

Before explaining the alignment part 8, the structure and operation | movement of the mask exchange chamber 5 which are the big feature of this embodiment are demonstrated using FIG. 3, referring FIG. 5 which shows an alignment part. FIG. 3: is a figure which shows one Embodiment of the mask conveyance mechanism which carries in and out the mask 81 which comprises a suspension body between the process chamber 1 and the mask exchange chamber 5, FIG. 5 is an alignment part It is a figure which shows one Embodiment.

As shown in the drawing figure of FIG. 1, in this embodiment, the mask exchange chamber 5 is provided through the gate valve 10B adjacent to the processing chamber 1 to vapor-deposit. The mask changing chamber 5 is a chamber capable of maintaining at least the same degree of vacuum as the processing chamber 1 at the time of mask changing. In the following description, the mask exchange chamber 5bd in charge of the exchange of the mask 81 of the L line of the vacuum deposition chamber 1ad and the R line of the vacuum deposition chamber 1bd shown in the drawing view of FIG. 1 is taken as an example. Listen and explain.

Note that the L and R lines of the vacuum deposition chamber 1ad and the vacuum deposition chamber 1bd are referred to in the drawing because they are upside down from those of the lines of the vacuum deposition chamber 1bu shown in FIG. 2. . In addition, the subscripts, such as a mask exchange chamber in FIG. 1, have a 1st subscript in order from abc to left, and a 2nd subscript in the upper part u and the lower end d. However, subscripts are omitted unless necessary to avoid confusion in the description.

First, an example of the mask 81 used by this embodiment shown in FIG. 4 is demonstrated. The mask 81 is roughly composed of a mask portion 81M and a frame 81F supporting the mask portion. As shown in the drawing view, the mask portion 81M has an opening 81h at a portion corresponding to the portion to be deposited on the substrate 6. In this example, an opening corresponding to red is shown among masks for depositing red (R), green (G), and blue (B) light emitting materials. The size of a mask is 2000 mm x 2000 mm, and the weight exceeds 300 kg with the enlargement of a board | substrate. The size of the window varies depending on the color, but on average it is about 30 µm wide and 150 µm high. The thickness of the mask 81M is about 50 micrometers, and it tends to become thinner in the future. On the other hand, the mask 81M has four precision alignment marks 81ms, two rough alignment marks 81mr, and an alignment mark 81m is provided in six locations in total. Correspondingly, the alignment mark 6m is provided in the board | substrate in four precision alignment marks 6ms, and the rough alignment mark 6mr is six places in total of two.

Next, the structure and operation | movement of the mask conveyance mechanism which carries in / out the mask 81 between the processing chamber 1 which is a vacuum deposition chamber, and the mask exchange chamber 5 are demonstrated. In FIG. 3, parts other than a conveyance mechanism are abbreviate | omitted in order to avoid complexity. The process chamber 1 is shown on the left side of FIG. 3, and the mask exchange chamber 5 is shown on the right side, and the mask 81 shows the state set in the process chamber 1 by a solid line. Between the two chambers is a gate valve 10B for partitioning them. There are each conveyance part (exchange chamber conveyance part 56, processing chamber conveyance part 86) for conveying the mask 81 on both sides of a gate valve. Since each conveyance part basically has the same structure, the vacuum chamber chamber is mainly related to the mask exchange chamber 5 regarding the structure, and the mask conveyance drive means described later with reference to FIG. 5 in the following description. (1) is mainly explained. Therefore, in FIG. 3, some drawing and code are abbreviate | omitted in order to avoid the trouble.

Each conveyance part 56 and 86 is a base (set base: 52, alignment base: 82) which hold | maintains the mask 81, and mask conveyance drive means (exchange chamber conveyance drive part 56B, processing chamber conveyance drive part 86B). Is done. The base is a mask upper fixing part 52u, 82u which supports a mask upper part when the mask 81 carries in to a base, and the some roller-shaped conveyance rail 56r, 82r which conveys the mask 81 to the lower part. Has The mask has a mask lower fixing portion 81k which is integrally moved by mounting the mask on the lower portion thereof. The mask lower fixing portion 81k has a rack 81r which is a suspension contact portion in which the pinion (small gears 56g, 86g) serving as the conveying contact portion is engaged at the bottom of the convex portion of the fixing portion. The spacing of the pinion which is the drive gear of the two mask conveyance parts is arrange | positioned so that it may become space | interval LD shorter than the horizontal length LS of the mask 81. As shown in FIG. Therefore, since LS> LD, at least one pinion meshes with the rack 81r, the mask can be advanced back and forth by cooperatively controlling the two pinions.

In order to be able to convey the mask 81 smoothly, the conveyance guide 56h which consists of several left and right guide rollers 56ur and 56ul is provided in the upper part of a mask upper fixing part as shown to the drawing degree A. FIG. On the other hand, as shown in the drawing degree B, the mask lower fixing part 81k cooperates with the pinion on the base on the side opposite to the rack side, and conveys the plurality of rollers 56dr while sandwiching the mask 81 therebetween. ) Is installed. In addition, the conveyance rails 56r and 82r have an H-shaped shape as shown in the drawing degree B so that a mask may be conveyed smoothly even if there is a rack 81r.

The guide rollers 86ur and 86ul (not shown) of the processing chamber conveyance unit 86 corresponding to the guide rollers 56ur and 56ul of the exchange chamber conveyance unit 56 serve to grip and fix the mask during alignment. have. Therefore, the degree of fitting between the guide rollers 86ur and 86ul is slightly tighter than that between the guide rollers 56ur and 56ul so that the mask can be stably maintained at the time of alignment. The conveying roller 82r and the guide roller use a low grease bearing in order to reduce the gas which adversely affects vacuum deposition. In addition, in order to detachably and reliably fix the mask 81 to the said mask lower part fixing part 81k, the triangular pyramid in which the triangular pyramidal-shaped protrusion provided in the mask lower part is accommodated in the said mask lower part fixing part 81k. Plural recesses (not shown) are formed in plural.

As shown in FIG. 5, the process chamber conveyance drive part 86B is a pinion which engages with the conveyance drive motor 86m provided under the lower wall 1Y of the chamber 1 on the atmospheric side, and the rack 81r of the mask. It consists of two bevel gears 86k1 and 86k2 for turning on 86g, a 90 degree rotational axis, a gear support 86h and a seal portion 86s for vacuum sealing. Thus, the process chamber conveyance drive part 86B is provided in the air | atmosphere side similarly to the alignment mechanism part 83, and does not carry in the dust etc. which adversely affect vacuum deposition in vacuum.

Although the seal part 86s of the process chamber conveyance drive part 86B was provided between the conveyance drive motor 86m and the bevel gear 86k1 in the said embodiment, it protruded from the lower wall 1Y of the process chamber 1. A bevel gear housing may be provided in the cylindrical body, and a vacuum seal, for example, a magnetic fluid seal may be provided between the bevel gear housing and the pinion. The exchange chamber conveyance drive part 56B also has the structure similar to the process chamber conveyance drive part 86B.

In addition, in this embodiment, the alignment optical system 85 shown in FIG. 5 mentioned later uses the mask 81 whether it is set to the desired position of the alignment base 82 by such a conveyance mechanism. As shown in FIG. 4, alignment controls so that the alignment marks 6m and 81m provided in the board | substrate 6 and the mask 81 may overlap. Therefore, when both alignment marks 6m and 81m are imaged by the camera of the alignment optical system 85, it determines with being set. Of course, you may provide a sensor, such as a switch, in the edge part of the mask upper part 82u.

According to the embodiment of the present conveyance mechanism, at the time of exchanging the mask, the mask held in the mask on both sides of the gate valve 10B between the processing chamber 1 such as the vacuum deposition chamber and the mask exchanging chamber 5. It is a simple mechanism provided with the drive part which drives the rack provided in the lower fixed part, and can move a mask reliably, and after processing, the process chambers, such as a vacuum deposition chamber, are completely closed from a mask exchange chamber by closing the gate valve 10B. Can be separated.

According to embodiment of the conveyance mechanism demonstrated above, since a mask can be set to an alignment base reliably, the organic electroluminescent device manufacturing apparatus which can deposit with high precision can be provided.

Next, the alignment part 8 which is another characteristic of this embodiment is demonstrated using FIG. In FIG. 5, the wall and gate valve of the vacuum deposition chamber which is a processing chamber are abbreviate | omitted. In this embodiment, alignment is performed by carrying in a mask from the exterior of a vacuum vapor deposition chamber, fixing the board | substrate 6 substantially vertically or vertically, suspending the mask 81, and changing the attitude | position of a mask. For that purpose, a mechanism for performing alignment is provided in the upper part of the figure, and a carrier 86 is provided in the lower part, which is a transport mechanism for carrying in a mask from the outside of the vacuum deposition chamber. The mechanism part for alignment and mask conveyance is provided in the atmospheric side which is outside of a vacuum deposition chamber as possible, specifically, on the upper wall 1T or below the lower wall 1Y of a vacuum deposition chamber. In addition, the thing which should be provided in the vacuum deposition chamber forms the convex part from the atmospheric part, and installs in it.

The alignment unit 8 holds the mask 81, the alignment base 82 for fixing the mask 81, and the alignment base 82, and the posture in the XZ plane of the alignment base 82, that is, the mask 81. The alignment driving unit 83 and the alignment base 82 which support the alignment driving unit 83 and the alignment base 82 are supported from below, and cooperate with the alignment driving unit 83 to define the attitude of the mask 81. The control apparatus 20 (FIG. 1) which processes the alignment optical system 85 which detects the alignment mark shown in FIG. 4 provided in the mask 81, and the image of an alignment mark, calculates the amount of alignment, and controls the alignment drive part 83 (FIG. 1). Reference).

Hereinafter, the basic structure which implements the alignment method in this embodiment is demonstrated, Then, the alignment method based on a basic structure, and the drive mechanism which implements it are demonstrated in order.

The upper part of the mask 81 is fixed to the alignment base 82 by the holding | maintenance part 82u, and is supported by the some roller-shaped conveyance rail 82r fixed by the alignment base 82. As shown in FIG. The alignment base is suspended by two rotatable support portions 81a and 81b provided on the upper portion, and the support portions 81a and 81b are pivoted (actively driven) in the Z direction or the X direction. (82) That is, the attitude | position in the XZ plane of a mask is prescribed | regulated and aligned. Moreover, in order to support the alignment base 82 at the time of defining the posture from below, the rotatable support parts 81c and 81d provided below each of the support parts 81a and 81b are provided, and the support parts 81c and 81d are provided. It is driven operatively with respect to the movement of the support parts 81a and 81b. In addition, the alignment base 82 is hollow like a rotator so that it can deposit on the board | substrate 6 through a mask.

Next, the alignment method is demonstrated. Position misalignment (ΔX, ΔZ, θ) of the substrate 6 and the mask 81 at the center of the substrate is detected by the alignment optical system 85 provided in four places shown in FIG. 5. Based on this result, the coarse support part 81b provided in the upper part of the alignment base 82 is moved to X direction, Z direction, and the coarse support part 81a installed at the upper part similarly is moved to Z direction. At this time, θ correction is a value in which the θ correction is caused by the movement difference in the Z direction of the support portions 81a and 81b to reflect the influence of θ correction on the movement in both Z directions. [Delta] X correction is performed to the value which takes into account the influence of the correction, and is aligned. In the above, the longer distance between both the main support parts 81a and 81b has the advantage that the θ correction can be made precise with respect to the movement in the same Z direction.

Moreover, with the said movement of the alignment base 82, the driven support part 81a moves to X direction, and the driven support parts 81c and 81d provided in the lower part of the alignment base 82 move to X and Z direction follow-up. do. The driving of the main driving support 81b includes an alignment driving unit 83R having a driving motor provided on the upper wall 1T of the vacuum deposition chamber 1bu, the driving and manual driving of the main driving support 81a, and an alignment driving unit 83L. And follower support portions 81c and 81d are performed at alignment follower portions 84R and 84L provided under lower wall 1Y of vacuum deposition chamber 1bu.

Although the alignment of this mask is performed by suspending the mask, as shown in Fig. 6A, when the rack 81r and the pinion 86g of the mask are engaged with each other in the state of conveyance, the smooth alignment is hindered. . Therefore, at the time of alignment, it is necessary to separate both by the space | interval mechanism and to align after that. In the separation operation in the present embodiment, the mask 81 is slightly lower than the alignment position, and the rack 81r, that is, the alignment base 82 is pulled up by a predetermined distance as shown in FIG. 6B. Pulling is performed by moving coarse support parts 81a and 81b to Z direction. Therefore, the space | gap mechanism 40 is comprised by the Z drive part 83Z mentioned later which moves coarse support parts 81a and 81b to Z direction. The amount of pulling up in the Z direction described above does not have to be too large because the amount of the alignment does not interfere at all. Along with the pulling operation, it is necessary to take the moving range of the main support members 81a and 81b and the driven support members 81c and 81d in the Z-direction somewhat longer.

In the method described above, the mask is used to separate the mask and the pinion by using the degree of freedom of movement in the Z direction of the alignment section 8, but the mask and the pinion may be separated by lowering the pinion.

According to the separation mechanism of the present embodiment described above, the mask 81 is conveyed to the processing chamber 1 and set in the alignment base 82, and the mask and the pinion are separated from each other, so that the alignment can be performed smoothly and accurately. The organic electroluminescent device manufacturing apparatus which can be deposited with high precision can be provided.

In addition, a smooth alignment can be realized by a simple mechanism by using the degrees of freedom originally included in the alignment portion as the separation mechanism.

Next, the alignment drive part 83 and the alignment follower 84 which define the attitude | position of the mask 81 are returned to FIG. 5, and it demonstrates in more detail.

The alignment driver 83 is provided in the atmosphere on the upper wall 1T (see FIG. 2) of the vacuum deposition chamber 1bu and has a left side having a Z driver 83Z for moving the rotation support 81a in the Z direction. The Z drive part 83Z which moves the drive part 83L, the rotation support part 81b to Z direction similarly to the left drive part 83L, and the X drive part which moves the said Z drive part whole to the X direction (left-right direction of FIG. 5) ( Right side drive portion 83R having 83X). Since the Z drive parts of the left and right drive parts 83L and 83R are basically the same configuration, the same numbers are given, and some numbers are omitted. Hereinafter, the method of numbering and the method of omission are also the same in other mechanism parts.

The Z driver 83Z will be described taking the left driver 83L as an example. As described above, the Z drive unit 83Z is fixed to the Z drive unit fixing plate 83k that follows the rail 83r in the X direction, and the ball screw 83n and the taper 83t by the Z direction drive motor 83zm. ) Moves the connecting rod 83j in the Z direction. The alignment shaft 83a moves in the Z direction by the connecting rod 83j connected at the upper portion thereof. The taper 83t is provided in order to prevent the loss motion in the Z direction by using gravity such as the alignment base 82, so that hysteresis is eliminated as a result, and the convergence to the target value can be effected quickly. In addition, the alignment shaft 83a operates through the bellows 83v whose one end is fixed to the seal part (not shown) provided in the upper wall 1T of the vacuum deposition chamber 1bu, and is inclined by the spline 83s. Vertically in the Z direction and / or parallel to the X direction without holding.

The right drive unit 83R is further fixed to the upper wall 1T of the vacuum deposition chamber 1 in addition to the Z drive unit 83Z, and the X drive unit fixing plate 83k on which the Z drive unit 83Z is mounted is formed on the X axis. It has the X drive part 83X which drives along the rail 83r. The driving method of the X driving unit 83X is basically the same as that of the Z axis driving unit 83Z such as the rotational force of the X direction driving motor 83xm through the ball screw 83n and the taper 83t, but the driving force is alignment. Power is required to move the base 82 to another drive or follower through rotational and alignment bases. The alignment shaft 83a is vertically moved in the Z direction and / or parallel to the X direction without being inclined by the spline 83s similarly to the alignment axis 83a of the left driver 83L. In addition, since the alignment shaft 83a also moves in the X direction, the bellows 83v also has a degree of freedom in the X direction, and flexibly moves from side to side with expansion and contraction.

The alignment follower 84 is a left and right follower 84L and 84R capable of moving the alignment shaft 84a in the Z and X directions so as to correspond to the above-described driven rotation of the rotation support portions 81c and 81d. Has Although one driven part may be provided in a center part, in this embodiment, it installs two places in order to operate stably. Since both driven parts basically have the same structure in left and right linear symmetry, the reference numeral 84R is representatively described. The alignment shaft 84a is a bellows 84v and a spline 84s for sealing the vacuum of the vacuum deposition chamber 1 having one end fixed to the seal portion 84c provided on the lower wall 1Y of the vacuum deposition chamber 1. Is fixed to the X-axis driven plate 84k through Accordingly, the follower in the X direction is performed by moving the rail 84r laid on the alignment support part fixing stand 84b for fixing the alignment follower 84. In addition, the follower of a Z direction is performed by the said spline 84s.

In the above-described embodiment of the alignment portion, by rotating (actively driving) the rotational support portion provided in two positions in the upper portion of the vacuum deposition chamber among the four rotational support portions 81 in the Z direction and one of them in the X direction, The mask is aligned. In addition, various driving methods can be mentioned.

For example, the rotation support part is provided in three upper parts, the center rotation support part is rotated, and it drives or aligns in the Z direction and X direction by left and right rotation support parts, and is aligned. And at least one follower is provided in the lower part. Alternatively, as in the above embodiment, two upper rotary support parts are provided, the rotation, the Z direction and the main direction in the X direction are concentrated in one place, and the other is the method of following. In addition, in the said embodiment, although the upper part was driven mainly and the lower part was driven, you may reverse this.

According to the embodiment of the mechanism part for alignment, it is provided in the air | atmosphere side through a seal part, and it is made to prevent the dust etc. which adversely affect vacuum deposition into a vacuum, and can provide a high productivity organic EL device manufacturing apparatus. have.

Moreover, according to embodiment of the said mechanism part for alignment, arranging a drive part etc. to an atmospheric side can improve water retention and can provide the organic electroluminescent device manufacturing apparatus with high operation rate.

Next, the alignment optical system 85 is demonstrated. The alignment optical system includes four precision alignment optical systems 85s for four precision alignment marks 81ms and two rough alignments for two rough alignment marks 81mr, so that each of the aforementioned alignment marks can be independently captured. It consists of six optical systems in total with the alignment optical system 85r.

The basic structure of six alignment optical systems is shown in FIG. The basic configuration of the optical system includes a light source 85k fixed to the upper portion 1T of the vacuum deposition chamber 1bu on the alignment base 82 side with the mask 81 therebetween and irradiated through the optical window 85w. An imaging camera side reflection mirror provided with a light source side reflection mirror (85 km) fixed to a blocking arm 85as to be described later and attached to the arm 85a from the imaging camera storage chamber 85t on the substrate 6 side ( 85 cm) and an imaging camera 85c which is an imaging means housed in the imaging camera storage cylinder 85t. In addition, the imaging camera storage chamber 85t, the arm 85a, and the like can be moved by the bellows 85v or the like to the arm 85a position indicated by the broken line so as not to obstruct the trajectory K when the substrate is in the vertical position. have.

Since it is a transmission type, the alignment mark 81m of the rectangular through hole is provided in the mask 81M so that light may pass, and the cylindrical through hole 81k is formed also in the frame 81F. On the other hand, the alignment mark 6m of the board | substrate 6 is a mark small enough compared with the alignment mark 81m of a metallic rectangular mask on a light transmissive board | substrate.

When the through holes 81k are formed, the deposition material enters the through holes at the time of vapor deposition and is deposited on the alignment mark, so that alignment cannot be performed from the next step. To prevent this, during deposition, the deposition material is shielded from entering the through hole 81k. In this embodiment, since the arm attached with the light source side reflection mirror at the time of alignment blocks the effective area for vapor deposition at the time of vapor deposition, the structure which makes the arm moveable and shields the through-hole 81k at the time of vapor deposition is provided. It was set as the shielding arm 85as which has. The shielding arm 85as is stretched and contracted by a connecting rod 85b driven up and down by a drive unit (not shown) provided on the atmosphere side, and one end thereof is connected through a bellows 85v fixed to the seal portion 85s. Drive it. The broken line shown in FIG. 7 shows a shielding state, and a solid line shows the alignment state.

In the above embodiment, the light source side reflection mirror 85km is attached to the blocking arm 85as. However, if the thickness of the mask 81F of the mask is sufficient, an L-shaped through hole 81k is formed in the frame 81F. It is also possible to incorporate a light source side reflection mirror (85 km). In that case, the shielding arm is unnecessary.

In addition, in the said embodiment, since the shielding arm was moved because the light source side reflection mirror (85 km) blocks the deposition area at the time of alignment, when not shielding, a shielding arm can be fixed.

On the other hand, the camera accommodating chamber 85t has a structure which protrudes from the upper part 1T of the vacuum deposition chamber 1, as shown in FIG. 5, forms the optical window 85w in the front end, and the imaging camera 85c ) Is held at the atmospheric side, and alignment marks 6m and 81m can be captured (see FIG. 7 for reference).

In the said embodiment, although the imaging camera side reflection mirror was provided in the vacuum, you may lengthen the imaging camera storage cylinder 85, and may incorporate the said mirror.

The difference in the configuration between the precision alignment optical system 85s and the coarse alignment optical system 85r is that the electrons have a high magnification lens 85h for imaging the alignment at high resolution with a small field of view in order to align the electrons with high accuracy. In connection with this, the dimension of the alignment marks 6m and 81m of the board | substrate and mask which are shown in FIG. 7 differs. In the case of precision, it is smaller by one or more digits compared with the rough one, and finally, the order of the micrometer order is possible.

Therefore, at the time of fine alignment, it is necessary to follow the fine alignment optical system 85s also and to move according to the movement of the alignment mark 81m of the mask 81 so that a visual field may not depart. Therefore, as shown in FIG. 5, in the precision alignment optical system 85s of the upper side of the alignment base, the fixed board 85p which fixes the imaging camera 85c is Z drive part fixed board 83k or X-axis driven board 84k. Follow and follow). Or you may provide the stage with a motor, and follow it by numerical control. Moreover, about the rough alignment optical system 85r, the camera position alignment stage 85d is provided so that position adjustment at the time of initial attachment may be performed.

In the above embodiment, six alignment optics are used, but depending on the required accuracy of alignment, it is not necessary to provide a coarse alignment optical system, and even four precision alignment optical systems are not required. You just need

In the embodiment of the alignment unit 8, the alignment driving unit 83, the alignment follower 84, and the alignment optical system 85 are provided on the atmospheric side of the upper or lower portion of the vacuum deposition chamber 1bu. You may provide in the air of the side wall side of 1bu. Of course, you may disperse | distribute to upper part, lower part, and side wall part.

According to the embodiment of the alignment optical system 85, the camera and the light source are housed in a storage container in the atmosphere where the inside protruding to the vacuum side prevents dust or the like, which adversely affects vacuum deposition, from being carried into the vacuum, thereby improving productivity. This high organic EL device manufacturing apparatus can be provided.

Next, 2nd Embodiment of a conveyance mechanism and a space | interval mechanism is demonstrated using FIG. Although the mask exchange chamber 5 is not shown in FIG. 8, it is basically the same. In FIG. 8, reference numerals not related to the description are omitted.

The second embodiment is different from the first embodiment as follows. First, the rack 81r is provided on the side of the mask lower fixing part 81k for fixing the mask 81. Second, with the first change, since the rotational axis of the pinion 86g (56g) does not need to be changed 90 degrees, the rotational axis of the conveyance drive motor 86m (56m) is not used without the bevel gear. (56g)). Third, with the first change, the shape of the conveyance rails 82r (56r) does not need to be H-shaped and may be flat. Fourthly, as the separation mechanism 45, in order to separate the pinion 86g from the mask, a driving portion separation means 87 for driving the entire processing chamber conveyance driving portion 86B is provided. The drive part separation means 87 moves the spacer plate 87k on which the drive part separation means 87 is placed by turning the ball joint 87b by the drive motor 87m to move on the rail 87r. Fifth, the process chamber conveyance drive part 86B also has the bellows 86v on the seal 86s so that it may respond to a spaced operation. In addition, in the above description, the drive unit separation means 87 for separating the pinion 86 is provided as the separation mechanism, but the mask side may be spaced apart.

Also in the second embodiment, as in the first embodiment, the mask can be reliably exchanged, and by separating the pinion and the mask, the organic EL device can be aligned with high precision and can be deposited with high precision. A device can be provided.

Although 1st and 2nd embodiment of the above conveying mechanism was demonstrated using what is called a rack and a pinion, you may convey by driving with a roller on the flat rail provided in the mask. In that case, when sufficient friction force is not obtained, a rail or roller surface is processed and a friction force is enlarged and used.

Next, 2nd Embodiment in the organic electroluminescent device manufacturing apparatus of this invention is demonstrated using FIGS. The difference between the second embodiment and the first embodiment is that the mask replacement chamber has a mask loading / unloading chamber 12 that can be replaced with a new mask adjacent to the mask replacement chamber 5. Adjacent positions are front or rear or top or bottom. In this embodiment, it is assumed that the mask conveyance mechanism shown in FIG. 3 is provided in the rear in consideration of the space factor. Therefore, the mask exchange chamber 5 has the direction switching mechanism, for example, the turntable mechanism 57 which changes a mask by 90 degrees.

In the following order, the configuration and operation of the mask exchange chamber 5 and the mask loading / unloading chamber 12 will be described.

The mask exchange chamber 5 in FIG. 9 is a type having the exchange chamber conveyance part 56 shown in FIG. 3, and has a turntable mechanism 57 and a mask loading / unloading chamber 12 that rotate the exchange chamber conveyance part 90 degrees. It has the structure which added the gate valve 10A in between.

FIG. 10: is a figure which shows the more detailed structure and operation | movement of the mask exchange chamber 5 which is 2nd Embodiment of this invention, and shows the exchange chamber conveyance part 56 and the turntable mechanism 57. As shown in FIG. The basic configuration of the exchange chamber conveyance unit 56 has already been described with reference to FIG. 3. The point different from FIG. 3 is that the exchange chamber conveyance part 56 other than the partial conveyance drive motor 56m of the exchange chamber conveyance drive part 56B is being fixed on the turntable 57t. The exchange chamber conveyance drive part 56B is arrange | positioned at the cross position of the dashed-dotted line of FIG. 9, in order to carry in and out the mask 81 between the left and right vacuum deposition chamber 1 or the mask loading / unloading chamber 12 in the back. Needs to be. For example, the rotation center of the conveyance drive motor 56m of the exchange chamber conveyance drive part 56B is arrange | positioned so that it may be located in the rotation center position of the turntable 57t. By arranging the drive motor at the rotation center position of the turntable 57t, the drive motor does not have to be provided on the turntable. As a result, the drive motor can be provided on the atmospheric side.

The turntable mechanism 57 also includes a turntable 57t having a gear 57r around it and a turntable driver 57B. The turntable drive unit 57B is a turntable drive motor 57m provided below the lower wall 5Y of the mask exchange chamber 5 on the atmospheric side, a seal portion 57s for vacuum sealing, and a gear 57r of the turntable 57t. ) And a plurality of traveling wheels 57k running on the lower wall 5Y of the mask replacement chamber 5.

According to the present embodiment, the mask carried in to the mask exchange chamber 5 can be carried in and out of the left and right processing chamber 1 or the mask loading / unloading chamber 12.

Next, the structure and operation | movement of the mask carrying-in chamber 12 shown in FIG. 9 are demonstrated using FIG. The mask carry-in / out chamber 12 has the mask storage part 121 (it abbreviates as a storage part hereafter). The storage part 121 has the structure similar to the set base 52 fundamentally, and has the storage base 122 arrange | positioned in multiple numbers, the storage stand 121d and mask which mount a storage base, and the turntable 57t and the storage stand ( It consists of the carrying-in / out room conveyance drive part 126B which has the same structure as the exchange chamber conveyance drive part 56B shown in FIG. 5 which moves 121d). Carry-in / out room conveyance drive part 126B (drive motor 126m) connects process chamber conveyance drive part 86B (conveyance drive motor 86m) and exchange chamber conveyance drive part 56B (conveyance drive motor 56m). The straight line and the straight line connecting the exchange chamber conveyance drive part 56B (conveyance drive motor 56m) and the carry-in / out room conveyance drive part 126B (drive motor 126m) are arrange | positioned so that it may become perpendicular. The turntable 57t side of the storage base 122 is provided in the state which protruded from the storage stand 121d by (alpha) = carrying-in / out room conveyance drive part 126B + (beta) width. Therefore, by moving the storage stand 121d in the arrow A direction and moving in the arrow B direction, all the storage base 122 can be made to mesh with the carry-in / out room conveyance drive part 126B. Reference numeral 121r denotes a travel rail of the storage table 121d.

FIG. 11: is the figure which looked at the mask carrying-in chamber 12 shown in FIG. 9 from the arrow C direction, and shows only one storage base 122, and shows the carry-in / out room conveyance part 126 mainly. 11 shows the mask exchange chamber 5 on the left side with the gate valve 10A as the boundary, and the processing chamber 1 or the transfer chamber 2 on the right side. The carry-in / out room conveyance part 126 is basically the same as the exchange chamber conveyance part 56, but differs in the following point.

First, the arrangement position of the carry-in / out room conveyance drive part 126B needs to be in the same position as the process chamber conveyance drive part 86B of FIG. 3 from the viewpoint of a conveyance means. By this position, the carry-in / out chamber conveyance drive part 126B can receive the exchange chamber conveyance part 56 and a mask.

Secondly, the mask upper fixing part 122u can be opened and closed. This is for carrying out the mask 81 from a opening / closing opening part (not shown) provided in the ceiling of the mask carrying-in chamber 12 with a crane (not shown), and being prevented when it sets in the conveyance roller 122r. After the set, the set hook 122t provided in the mask upper fixing part 122u is inserted into the set hole 122h to hold the mask 81 and can be stably conveyed by the guide roller 126ur.

The mask carry-in / out chamber 12 may be an atmosphere atmosphere, but the vacuum of the mask exchange chamber 5 is increased when the gate valve 10A is opened by the vacuum chamber, that is, the mask is not lowered without lowering the vacuum degree of the processing chamber 1. I can exchange it. As a result, the time for pulling into a vacuum can be shortened and the organic EL device manufacturing apparatus with high operation rate can be provided.

Although the storage part 121 was provided in the mask carrying-in chamber 12 in the said embodiment, you may provide it in the mask exchange chamber 5.

According to the second embodiment of the organic EL device manufacturing apparatus of the present invention, an organic EL device manufacturing apparatus or a manufacturing method having high operation rate and high productivity can be processed at the time of mask replacement without affecting the substrate transfer system. Can be provided.

Moreover, according to the 2nd Embodiment in the organic electroluminescent device manufacturing apparatus of the said invention, the fall of the vacuum degree of a vacuum deposition chamber can be suppressed by providing the mask carry-in / out chamber 12 which becomes a closed space as a place to carry in / out of a mask. As such, other processing within the same vacuum deposition chamber is still possible. Therefore, the organic EL device manufacturing apparatus or manufacturing method with high operation rate can be provided.

In addition, since at least the replacement time of the mask can be shortened, an organic EL device manufacturing apparatus or a manufacturing method having high operation rate and high productivity can be provided.

Next, the organic electroluminescent device manufacturing apparatus which is 3rd Embodiment of this invention is demonstrated using FIG. In the organic EL device manufacturing apparatus 200 of the present embodiment, an exchange chamber 14f in which clusters A to D of the organic EL device manufacturing apparatus illustrated in FIG. 1 are provided on two sides of the hexagonal transfer chamber 2 and the hexagon diagonally. And 14g) and a processing chamber 1 such as a vacuum deposition chamber having one line as a processing line on the remaining four sides.

Also in this organic EL device manufacturing apparatus 200, as shown in FIG. 3, it is an apparatus which deposits a board | substrate and a mask substantially vertically or vertically. Either may be carried out by carrying out horizontally and board | substrate to the board | substrate, or it may convey in a vertical posture from the beginning. In FIG. 12, as in FIG. 9, a mask exchange chamber 5 is provided in the horizontal direction of each vacuum deposition chamber 1, and a mask carry-in / out chamber 12 is provided adjacent to the mask exchange chamber 5. The mask exchange chamber 5 performs mask conveyance with the vacuum deposition chamber 1 through the gate valve 10B, and mask conveyance with the mask carry-in / out chamber 12 through the gate valve 10A. And the conveyance mechanism, the space | interval mechanism, and the alignment mechanism which were shown by the 1st or 2nd embodiment of the organic electroluminescent device manufacturing apparatus of this invention to this organic electroluminescent device manufacturing apparatus 200 are applied.

Therefore, also in 3rd Embodiment, the effect shown by 1st or 2nd Embodiment can be exhibited.

In the above description, the embodiment which provides the mask exchange chamber adjacent to processing chambers, such as a vacuum deposition chamber, was described. For example, the organic electroluminescent device manufacturing apparatus which conveys the conveyance mechanism shown in FIG. 3 between process chambers between a plurality of process chambers like a relay type, separates and arrange | positions to each process chamber, and performs a process is provided. It can apply and can exhibit the same effect as the above embodiment.

In addition, in the above description, embodiment which conveyed the mask and suspended and aligned the mask was described. The substrate applied to the mask may be reversed, and the substrate may be suspended and aligned.

In addition, although the organic EL device has been described as an example in the above description, the present invention can also be applied to a film forming apparatus for performing vapor deposition on the same background as the organic EL device.

1: processing chamber
1ad, 1bd, 1bu: vacuum deposition chamber
2: conveying chamber
3: load cluster
5: mask exchange chamber
6: substrate
6m: substrate alignment mark
7: deposition unit
8: alignment part
9: processing exchange unit
10, 10A, 10B: Gate Valve
12: Mask import and export room
20: Control device
40, 45: spacer
56: exchange chamber conveying unit
56B: exchange chamber conveyance drive part (mask conveyance drive means)
56g, 86g: pinion
71: evaporation source
81: mask
81a-d: rotation support part
81m: Alignment mark of the mask
81r: rack
82: alignment base
83: alignment drive unit
83Z: Z axis drive part
83X: X axis drive part
84: alignment follower
85: alignment optical system
86: process chamber conveyance
86B: Process chamber conveyance drive part (mask conveyance drive means)
87: drive unit separation means
100, 200: manufacturing apparatus of organic EL device
A to D: cluster

Claims (20)

An organic chamber having a vacuum chamber including an alignment portion for performing alignment of the substrate with the mask as a suspension having the substrate or the mask; and a vacuum deposition chamber including a vapor deposition portion for depositing a vapor deposition material on the substrate. As an EL device manufacturing apparatus,
A suspension contact portion in contact with the suspension body, the suspension contact portion being a contact portion of the suspension body and the transfer contact portion in contact with the suspension body, and the suspension body in a vertical position from the adjacent chamber adjacent to the vacuum chamber to the vacuum chamber. After the conveyance mechanism to convey is provided in the said vacuum chamber and the adjacent chamber, and the said suspension body is suspended in the said alignment part, before the position alignment of the said board | substrate and a mask is performed, the said suspension body contact part and the said conveyance contact part are carried out. A spaced apart space mechanism is installed in the vacuum chamber,
The said suspension contact part is a rack provided in the lower part of the bottom face or side surface of the said suspension body, and the said conveyance contact part is a pinion, The organic electroluminescent device manufacturing apparatus characterized by the above-mentioned. The method of claim 1,
The conveyance rail which conveys the said mask is provided in the said suspension body, The organic electroluminescent device manufacturing apparatus characterized by the above-mentioned. The method of claim 1,
A drive means for the separation mechanism is provided in an air atmosphere, characterized in that the organic EL device manufacturing apparatus. delete The method of claim 1,
The alignment portion includes vertical driving means for moving the suspension body up and down, and the separation mechanism is the vertical driving means. delete The method of claim 1,
The separation mechanism is a means for separating the conveyance contact portion from a suspension contact portion. delete The method according to any one of claims 1 to 3, 5, and 7,
And the vacuum chamber and the vacuum deposition chamber are the same chamber. The method of claim 1,
And the adjacent chamber is a mask exchange chamber for exchanging the mask. The method of claim 10,
And the mask replacement chamber maintains a predetermined degree of vacuum during the replacement. 12. The method of claim 11,
And a mask loading / unloading chamber in an atmospheric atmosphere for carrying in and out of the mask adjacent to the mask exchange chamber. The method of claim 1,
And the adjacent chamber is another vacuum deposition chamber. 14. The method according to any one of claims 1, 10 or 13,
An organic EL device manufacturing apparatus, wherein a vacuum interrupter is provided between the vacuum chamber and the adjacent chamber. A method of manufacturing an organic EL device in which an alignment between a substrate and a mask in a vacuum chamber is suspended as the substrate or a suspension provided with the mask, and a vapor deposition material is deposited on the substrate.
By using the conveying means which has the conveyance contact part which can contact the said suspension body, the suspension body is conveyed in a vacuum chamber vertically, and the said suspension body is made in the state which contacted the suspension body contact part which is a contact part of the said suspension body, and the said conveyance contact part. Setting the sieve at the position of the alignment, separating the suspension contact portion of the suspension body from the conveying contact portion of the conveying means, and performing the alignment after the separating step,
The said suspension contact part is a rack provided in the lower part of the bottom face or side surface of the said suspension body, and the said conveyance contact part is a pinion, The organic electroluminescent device manufacturing method characterized by the above-mentioned. 16. The method of claim 15,
The said separation is performed by the means which moves the said suspension body up and down, The organic electroluminescent device manufacturing method characterized by the above-mentioned. 16. The method of claim 15,
The said separation spaces the said conveyance contact part from the suspension contact part, The organic electroluminescent device manufacturing method characterized by the above-mentioned. delete A film formation having a vacuum chamber including an alignment portion for performing alignment of a substrate and a mask with the substrate or a suspension provided with the mask and a vapor deposition portion for depositing a deposition material on the substrate. As a device,
A suspension contact portion in contact with the suspension body, the suspension contact portion being a contact portion of the suspension body and the transfer contact portion in contact with the suspension body, and the suspension body in a vertical position from the adjacent chamber adjacent to the vacuum chamber to the vacuum chamber. After the conveyance mechanism to convey is provided in the said vacuum chamber and the adjacent chamber, and the said suspension body is suspended in the said alignment part, before the position alignment of the said board | substrate and a mask is performed, the said suspension body contact part and the said conveyance contact part are carried out. A spaced apart space mechanism is installed in the vacuum chamber,
And the suspension contact portion is a rack provided below the bottom or side surface of the suspension body, and the conveyance contact portion is a pinion. A film forming method in which an alignment between a substrate and a mask in a vacuum chamber is suspended as the substrate or a suspension provided with the mask, and a vapor deposition material is deposited on the substrate.
By using the conveying means which has the conveyance contact part which can contact the said suspension body, the suspension body is conveyed in a vacuum chamber vertically, and the said suspension body is made in the state which the suspension contact part which is a contact part of the said suspension body and the said conveyance contact part contacted. Setting a sieve at the position of the alignment, separating the suspension contact portion of the suspension body from the conveying contact portion of the conveying means, and performing the alignment after the separating step,
The said film contact part is a rack provided in the lower part of the bottom face or side surface of the said suspension body, and the said conveyance contact part is a pinion, The film-forming method characterized by the above-mentioned.

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