CN109563610A - For the equipment and system of processing substrate in vacuum chamber and for making substrate carrier relative to the method for mask carrier alignment - Google Patents
For the equipment and system of processing substrate in vacuum chamber and for making substrate carrier relative to the method for mask carrier alignment Download PDFInfo
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- CN109563610A CN109563610A CN201780032189.4A CN201780032189A CN109563610A CN 109563610 A CN109563610 A CN 109563610A CN 201780032189 A CN201780032189 A CN 201780032189A CN 109563610 A CN109563610 A CN 109563610A
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- Prior art keywords
- substrate
- assembly parts
- barebone
- carrier
- mask
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
- C23C16/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4587—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially vertically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A kind of equipment (100) for processing substrate (10) in vacuum chamber (101) is described.The equipment includes to Barebone (20) and screening arrangement (105).It include the first assembly parts (21), the second assembly parts (22) and aligned units (25) to Barebone (20), first assembly parts (21) are for making substrate carrier (11) installation be used to make mask carrier (13) installation to described to Barebone to Barebone, the second assembly parts (22) to described, and aligned units (25) are for making to be moved relative to each other the first assembly parts (21) and the second assembly parts (22) of Barebone (20).It further, is moveable relative to each other in first direction (Z) to Barebone (20) and screening arrangement (105).Further, a kind of system for handling substrate is provided, and a kind of method for making substrate carrier relative to mask carrier alignment is provided.
Description
Technical field
The embodiment of present disclosure is related to a kind of equipment and system for processing substrate in vacuum chamber, and relates to
And it is a kind of in make in vacuum chamber substrate carrier relative to the method for mask carrier alignment.More specifically, describing one kind in true
Cavity indoor transporting, positioning and the method for being directed at substrate carrier and mask carrier.The embodiment of present disclosure specifically relates to
And the mask-type deposition material on substrate, wherein the substrate is relative to mask registration before deposition.Side described herein
Method and equipment can be used for manufacturing Organic Light Emitting Diode (organic light-emitting diode, OLED) device.
Background technique
The technology that layer is deposited on substrate includes such as thermal evaporation (thermal evaporation), physical vapour deposition (PVD)
(PVD) and chemical vapor deposition (CVD).The substrate being applied can be used for several applications and several technical fields.For example, being applied
Substrate can be used for the field of Organic Light Emitting Diode (OLED) device.OLED can be used for manufacturing video screen, computer monitor,
Mobile phone, other hand-held devices and such, to show information.OLED device, such as OLED display, it may include all heavy
Product is located at two interelectrode organic material layers in one or more on substrate.
In coating material deposition during on substrate, the substrate can be kept by substrate carrier, and mask can be carried by mask
Body is immobilizated in front of substrate.Therefore, patterns of material (for example, the multiple pixels for corresponding to the aperture pattern of mask) can be deposited on base
On plate.
The function of OLED device typically depends on the coating thickness of organic material, which must fall in scheduled range
It is interior.In order to obtain high-resolution OLED device, it is necessary to overcome the technological challenge of the deposition about evaporation material.In particular, in vacuum
Accurate and smooth transport substrate carrier and mask carrier are challenging in system.Further, make substrate relative to mask
Being accurately aimed at is the key that acquisition high quality deposition results, such as to produce high-resolution OLED device.Further, have
Effect is beneficial using coating material, and system idle time (idle time) will keep as far as possible of short duration.
In view of above, provide for positioning substrate and mask accurately and reliably relative to each other
Equipment and system with alignment are beneficial.Further, the vacuum deposition system for effectively using standby time short can be beneficial
's.
Summary of the invention
In view of above, a kind of equipment for handling substrate, a kind of system and one kind for handling substrate are provided in true
Make substrate carrier relative to the method for mask carrier alignment in plenum chamber.Other aspect, benefit and the feature of present disclosure
It is obvious according to claims, specification and attached drawing.
According to the one side of present disclosure, a kind of equipment for handling substrate in vacuum chamber is provided.It is described to set
Standby includes to Barebone, includes the first assembly parts, the second assembly parts and aligned units to Barebone.First assembly parts are for making base
Onboard body is installed to Barebone, and the second assembly parts are for installing mask carrier to Barebone, and aligned units are for making the
One assembly parts are moved relative to each other with the second assembly parts.The equipment further comprises screening arrangement, wherein to Barebone with
Screening arrangement can be moved relative to each other in first direction.
Specifically, can be able to be for can move towards screening arrangement or screening arrangement to Barebone can be towards to Barebone
Mobile, to reduce between screening arrangement and install to the gap between the mask carrier to Barebone.
According to another aspect of the present disclosure, a kind of equipment for handling substrate in vacuum chamber is provided.It is described
Equipment includes to Barebone；And it is connected to the driving device to Barebone and vacuum chamber.It include the first assembly to Barebone
Part, the second assembly parts and the aligned units for being connected to the first assembly parts and the second assembly parts.
In some embodiments, driving device can be configured to make mobile relative to vacuum chamber to Barebone, specifically
It is directed towards and is set to the indoor shielding assembly parts movement of vacuum chamber.
According to another aspect of the present disclosure, a kind of system for handling substrate in vacuum chamber is provided.It is described
System includes the equipment for handling substrate according to any embodiment described herein.The equipment includes having the first dress
Accessory, the second assembly parts and aligned units to Barebone.Further, substrate carrier is mounted to the first dress to Barebone
Accessory, and mask carrier is mounted to the second assembly parts to Barebone.
According to another aspect of the present disclosure, it provides a kind of for making substrate carrier relative to the side of mask carrier alignment
Method.The method includes make mask carrier install to Barebone the second assembly parts, substrate carrier is installed to Barebone
The first assembly parts, using the aligned units to Barebone be moved relative to each other the first assembly parts and the second assembly parts so that
Substrate carrier relative to mask carrier alignment and making be provided in vacuum chamber it is indoor to Barebone and screening arrangement relative to that
This movement.
Embodiment is also related to the equipment for executing disclosed method, and including in terms of for implementing each description method
Part of appliance.In terms of these methods can by hardware component, by appropriate software programming computer, both any combination or appoint
Other methods of anticipating are implemented.Furthermore it is also related to the method to manipulate the equipment according to the embodiment of the present disclosure.To
The method for manipulating the equipment includes the method aspect to execute each function of equipment.
Detailed description of the invention
The features described above of present disclosure described herein, and the above letter can be understood in detail by referring to embodiment
The related present disclosure to be summarized more specifically describes.Attached drawing is related to the embodiment of present disclosure, and is described as follows:
Figure 1A is painted the equipment for handling substrate according to embodiment described herein, in the schematic of first position
Sectional view；
Figure 1B is painted schematic sectional view of the equipment in the second position of Figure 1A；
Fig. 2A is painted the equipment for handling substrate according to embodiment described herein, in the schematic of first position
Sectional view；
Fig. 2 B is painted schematic sectional view of the equipment in the second position of Fig. 2A；
Fig. 3 A to Fig. 3 E is painted the method for making substrate carrier relative to mask carrier alignment according to method described herein
Several follow-up phases；
Fig. 4 is a flow chart, is painted according to embodiment described herein, makes substrate carrier relative to mask carrier alignment
Method；With
Fig. 5 is a flow chart, is painted according to embodiment described herein, makes substrate carrier relative to mask carrier alignment
Method.
Specific embodiment
It will be explained in the various embodiments of present disclosure now, and the one or more of these embodiments show
Example is shown in the accompanying drawings.Below in the description of attached drawing, identical reference number represents identical component.In general, only retouching
It states at the difference of individual embodiments.The each citing provided is not intended to explain present disclosure in the disclosure
The limitation of appearance.
Further, describe or describe and can be used for other embodiment party as the feature of a part of an embodiment
Formula or in conjunction with other embodiments, to generate another embodiment again.This specification is intended to include these modifications and variations.
Figure 1A is painted according to embodiment described herein for handling the equipment 100 of substrate 10, in first position
Schematic sectional view.Figure 1B is illustrated in the equipment 100 of Figure 1A of the second position.
It shows to meaning property as shown in Figure 1A, equipment 100 includes vacuum chamber 101, wherein being provided in very to Barebone 20
In plenum chamber 101.Barebone 20 can be configured to make substrate 10 relative to mask registration.In some embodiments, it deposits
Source 110 is provided in vacuum chamber 101.Material can pass through masked-deposition on substrate 10 by sedimentary origin 110.
It include for making the installation of substrate carrier 11 to the first assembly parts 21 to Barebone 20 and for making to Barebone 20
Mask carrier 13 is installed to the second assembly parts 22 to Barebone 20.Further, include aligned units 25 to Barebone 20, use
In being moved relative to each other the first assembly parts 21 and the second assembly parts 22 so that substrate carrier 11 and mask carrier 13 relative to
It is aligned with each other.Therefore, via the aligned units 25 to Barebone 20, the substrate 10 transported by substrate carrier 11 can be relative to by covering
The mask registration that mould carrier 13 transports.
Term " substrate carrier " used herein specifically can be related to carrier arrangement, and carrier arrangement is configured in vacuum system
Substrate 10 is transported along substrate transport path in system.Substrate carrier can keep substrate in coating material deposition during on substrate.?
In some embodiments, during transport and/or deposition, substrate 10 non-horizontal can be orientated and be held at substrate carrier 11, have
It is held at substrate carrier 11 with substantive vertical orientation to body.
For example, (such as making substrate relative to covering during vacuum chamber indoor transporting, during vacuum chamber indoor positioning substrate
Mould positioning), and/or during material is deposited on substrate, substrate 10 can be held at the holding surface of substrate carrier 11.Specifically
Ground, substrate 10 can be held at substrate carrier 11 by gripping mechanism (chucking device), such as by electrostatic chuck
And/or by magnetic chuck.Gripping mechanism can be integrally formed with substrate carrier 11.
Substrate carrier 11 may include carrier element, and carrier element, which has, keeps surface, to keep substrate 10, specifically with non-
Horizontal alignment keeps substrate 10.In some embodiments, carrier element can be by substrate transport system along substrate transport path
Mobile, substrate transport system is for example including linear motor.In some embodiments, substrate carrier can be non-contact during transport
It is held at guide structure, such as by magnetic suspension system (magnetic levitation system) likes.
Similarly, " mask carrier " used herein can be related to configure to transport the carrier arrangement of mask, in vacuum chamber
Mask is transported along mask transportation route in interior.Mask carrier can during transport, relative to during base plate alignment and/or being deposited on
Mask is transported during on substrate.In some embodiments, during transport and/or deposition, mask can non-horizontal orientation guarantor
It is held at mask carrier, is specifically held at mask carrier with substantive vertical orientation.Mask can be held in by gripping mechanism
At mask carrier 13, gripping mechanism is, for example, mechanical chuck (such as clamping piece (clamp)), electrostatic chuck and/or magnetic chuck.
Other kinds of gripping mechanism can also be used, can be connected to mask carrier or be integrally formed with mask carrier.
For example, mask can be edge exclusion mask (edge exclusion mask) or shadow mask (shadow
mask).Edge exclusion mask is a kind of mask of one or more fringe regions for being configured to masking substrate, so
One, during coated substrates, no material is deposited on one or more fringe region.Shadow mask is a kind of matched
It sets for sheltering multiple masks by the feature being deposited on substrate.For example, shadow mask may include multiple small openings, such as lattice
The small opening of grating.
" transport " used herein, " movement ", " transmission ", " rotation ", " positioning " or " alignment " substrate or mask can indicate
It keeps the substrate carrier of substrate or keeps each autokinesis of the mask carrier of mask.
" essence vertically oriented " used herein can be regarded as between vertical orientation (i.e. with gravity vector (gravity
Vector between)) orientation with 10 ° or less deviations, specifically there is 5 ° or less deviation.For example, substrate (or mask)
Main surface and gravity vector between angle can be between+10 ° and -10 °, specifically between 0 ° and -5 °.Some
In embodiment, substrate (or mask) be oriented in transport during and/or deposition during can not for precise perpendicularity, but relative to
Vertical axis slight inclination, such as the inclination with the inclination angle between 0 ° and -5 °, specifically between -1 ° and -5 °
Angle.Negative angle indicates the orientation of substrate (or mask), and wherein substrate (or mask) tilts down.During deposition, substrate
Deviation between being orientated gravity vector can be beneficial, and can produce more stable deposition process or face-down orientation and can fit
For reducing the particle on substrate during depositing.However, being also possible to be orientated for precise perpendicularity during transport and/or deposition (+/-
1°).In other embodiments, substrate and mask can non-perpendicular orientation transport, and/or substrate can non-perpendicular be orientated and by
Coating, such as substantial level orientation.
It include install substrate carrier to the first assembly parts 21 to Barebone 20 to Barebone 20.First assembly parts
21 can keep substrate carrier 11 to Barebone by magnetic force and/or mechanical force.Specifically, the first assembly parts 21 can be magnetism
Assembly parts.For example, the first assembly parts 21 may include magnetic chuck, to make 11 magnetism of substrate carrier be clamped in the first assembly parts
21。
It in some embodiments, include multiple first assembly parts to Barebone 20, to keep substrate carrier 11 in right
At Barebone.Such as, it is possible to provide at least four first assembly parts, to keep substrate carrier in four corners of substrate carrier.
It include to make the installation of mask carrier 13 to the second assembly parts 22 to Barebone to Barebone 20.Second assembly parts
22 can keep mask carrier 13 to Barebone by magnetic force and/or mechanical force, specifically keep covering so that essence is vertically oriented
Mould carrier 13.Specifically, the second assembly parts 22 can be Magnetic mounts.For example, the second assembly parts 22 may include magnetic chuck, use
So that 13 magnetism of mask carrier is clamped in the second assembly parts 22.
First assembly parts 21 and/or the second assembly parts 22 can be at least partially disposed at mask carrier 13 and substrate carrier 11
Between.Specifically, at least part of that Barebone 20 can be disposed between mask carrier and substrate carrier.For example, substrate carries
Body can mount to the first side to Barebone, and mask carrier can mount to second side to Barebone, second side and the first side
Relatively.
It in some embodiments, include multiple second assembly parts to Barebone 20, to keep mask carrier 13.Example
Such as, it is possible to provide at least four second assembly parts, to keep mask carrier in four corners of mask carrier.
In some embodiments, at least one of the first assembly parts 21 and the second assembly parts 22 may include magnetic fixed dress
It sets, specially electromagnetic fixing device or electric permanent magnetism (EPM) component.
It further, include aligned units 25, specially multiple aligned units to Barebone 20.Aligned units 25 are configured
So that the first assembly parts 21 and the second assembly parts 22 are moved relative to each other, so that substrate carrier 11 is right relative to mask carrier 13
It is quasi-.First assembly parts 21 can be connected with the second assembly parts 22 by mechanical fastener, and wherein aligned units 25 are formed as described
At least part of mechanical fastener.To which the second assembly parts 22 can be by aligned units 25 relative to the first assembly parts 21
It is mobile.
In some embodiments, aligned units 25 include at least one piezoelectric actuator, and piezoelectric actuator is configured to
Keep the first assembly parts 21 mobile relative to the second assembly parts 22 at least one direction.
Aligned units 25 can be configured so that substrate carrier 11 is aligned relative to mask carrier 13.Sedimentary origin 110 can provide
In vacuum chamber 101, it is deposited on pass through coating material by mask that mask carrier 13 is kept by substrate carrier 11
On the substrate 10 of holding.Have when mask carrier 13 and substrate carrier 11 precisely align relative to each other, such as away from target position
Less than 10 microns (μm), less than 5 microns or even less than 2 microns of deviation, patterns of material can be accurately deposited on via mask
On substrate.For example, patterns of material may include multiple electronics or electrooptical device, such as pixel.
According to embodiment described herein, screening arrangement 105 is provided in vacuum chamber, specifically between sedimentary origin
110 and between Barebone 20.When the installation of mask carrier 13 to the second assembly parts 22 to Barebone 20, screening arrangement 105
Between sedimentary origin 110 and mask carrier 13.Therefore, at least partly blocking mask carrier 13 of screening arrangement 105, to reduce
The pollution of mask carrier 13 or the pollution of the vacuum chamber 101 with coating material itself.For example, screening arrangement 105 can be moulded
Shape, so that the outside of mask carrier 13 is protected by the barricade of screening arrangement 105.Screening arrangement 105 at least partly stops
Towards the coating material of the external orientation of mask carrier 13.The coating material being oriented to towards substrate 10 may pass through screening arrangement 105
It is propagated in a manner of uncrossed.
For example, screening arrangement 105 may include 106 (Figure 1A of shielding frame 107 and the opening being provided in shielding frame 107
In be represented by dotted lines).Shielding frame 107 be configured at least partly to cover with blocking mask carrier 13, and be open and 106 matched
It sets to allow coating material 112 to pass through screening arrangement 105 towards substrate 10.The opening 106 of screening arrangement 105 can have 0.5m2
Or bigger size, specifically for 1m2Or bigger size.The size of opening 106 can be greater than the area that substrate will be applied.
It is some can in the embodiment in conjunction with other embodiments described herein, screening arrangement 105 include be used for
The opening 106 of coating material 112 and around it is described opening 106 shielding frame 107.Opening 106 can be concentrated on by substrate carrier
In front of 11 substrates kept, so that coating material may pass through opening 106 and propagate towards substrate 10.The surface of shielding frame 107 can
Be substantially parallel to the surface of mask carrier 13, i.e., it is substantially vertical with first direction Z.For example, shielding frame 107 can have rectangle to open
Mouthful, the shape of split shed 106 is adaptable to the shape of substrate, and the shape of shielding frame 107 is adaptable to mask carrier 13
It will be shielded and protected against the part of pollution.
In some embodiments, screening arrangement 105 includes multiple frame parts being connected to each other.The dismantling of screening arrangement
It can be convenient with cleaning.In some embodiments, screening arrangement may include the single type (one- containing opening 106
Piece) plate component, opening 106 are specially a substantially rectangular opening.
Coating material is likely to enter the gap 108 between screening arrangement 105 and mask carrier 13 and pollutes mask
Carrier 13.For example, first position as shown in Figure 1A, gap 108 has sizable width in first direction Z.Therefore, it comes from
The coating material of sedimentary origin 110 can strike against on mask carrier 13, make mask carrier 13 that may be entered the painting in the gap 108
Cloth material pollution.Further, the coating material into the gap 108 can pollute the inner wall and/or vacuum of vacuum chamber 101
Other devices or object in chamber.By the coat window that is limited by mask without striking against the coating material pair on substrate
Deposition results might have negative effect.Further, vacuum chamber polluted surface and mask carrier polluted surface
It must may often clean, so may cause additional cost and depositing system and frequently stop work.
According to embodiment described herein, being to Barebone 20 and screening arrangement 105 can be in first direction Z relative to that
This movement.First direction Z is the direction for being substantially perpendicular to the extension of substrate 10.Specifically, first direction Z can be substantially perpendicular to cover
Mould carrier 13 and/or screening arrangement 105 extend.Therefore, can be mobile towards screening arrangement 105 in first direction Z to Barebone 20,
Width with the gap 108 reduced between screening arrangement 105 and mask carrier 13.
In some embodiments, after deposition, Barebone 20 can also be moved backward in first direction Z, far from screen
Cover device 105.Specifically, to Barebone 20 can in first direction Z towards sedimentary origin 110 and far from sedimentary origin 110 be removable
Dynamic.
For example, can be mobile towards screening arrangement 105 to Barebone 20, so that gap 108 is in the width reduction of first direction Z
To 3 millimeters or less value, in particular 1 millimeter or less.In some embodiments, mask carrier 13 can be filled towards shielding
105 movements are set, until mask carrier 13 contacts screening arrangement.Therefore, it can avoid coating material 112 to pass through between screening arrangement
It propagates in gap 108 between 105 and mask carrier 13.
Figure 1B is illustrated in the equipment 100 of the second position, mobile to screening arrangement 105 to Barebone 20 in the second position,
So that the width reduction in the gap 108 between screening arrangement 105 and mask carrier 13 is to 1 millimeter or less value.It can drop
It is low or avoid pollution of the coating material 112 to mask carrier.
Screening arrangement 105 can be cleaned simply, such as by temporarily from vacuum chamber removal screening arrangement 105.Long
It can be enough for cleaning screening arrangement 105 in time interval.For example, screening arrangement 105 can after the sedimentation time of a few days
It unloads from vacuum chamber 101 to clean.The downtime of depositing system can be reduced and cleaning can be convenient.Specifically, such as Figure 1B
Shown in meaning property shown in, the inner wall of vacuum chamber can be polluted essentially without coating material because deposition during screening arrangement
Essentially without gap between 105 and mask carrier 13.
As shown in FIG. 1A and 1B shown in meaning property, equipment can further comprise sedimentary origin 110, and sedimentary origin 110 is configured
To guide coating material 112 towards deposition region 111, Barebone 20 is arranged in deposition region 111.
Sedimentary origin 110 can be vapour source, be configured to the material of guiding evaporation towards substrate 10.Sedimentary origin 110 can be along
Source conveying track be it is moveable, source conveying track is provided in vacuum chamber 101.Specifically, sedimentary origin 110 can be in substantially vertical
Directly in the second direction X of first direction Z be moveable.Second direction X used herein can correspond to the width side of substrate 10
To the i.e. direction perpendicular to the paper plane of Figure 1A.Therefore, sedimentary origin 110 can move through substrate in the width direction of substrate 10
10, so that coating material 112 is deposited on substrate 10.
Sedimentary origin 110 can be used as the linear sources offer in substantially vertical extension.Vertical direction can also be indicated in herein
For third direction Y, that is, it is substantially perpendicular to the direction of first direction Z and second direction X.Sedimentary origin 110 is in the height of vertical direction
It is adaptable to the height of vertically oriented substrate, so that substrate can be described by sedimentary origin 110 is moved through in second direction X
Substrate and be applied.
Sedimentary origin 110 may include the distribution pipe with multiple steam openings or nozzle, to guide 112 direction of coating material
Deposition region 111.Further, sedimentary origin 110 may include crucible (crucible), and crucible is configured to heat and evaporate to apply
Cloth material.Crucible can be connected to distribution pipe, make itself and distribution fluid communication.
It is some can be in the embodiment in conjunction with other embodiments described herein, sedimentary origin 110 can be rotatable
's.For example, sedimentary origin can be rotated from first orientation to second orientation, the steam openings of sedimentary origin are along first orientation towards crystallizing field
Domain 111 is oriented to, and steam openings are oriented to along second orientation towards the second deposition region (Figure 1A is not shown).Deposition region 111 and
Two deposition regions can be located on the opposite side of sedimentary origin, and sedimentary origin can be that can revolve between deposition region and the second deposition region
Turn about 180 ° of angle.
As shown in Figure 1A, screening arrangement 105 can be disposed at sedimentary origin 110 and between Barebone 20.Therefore, coating material
112 project from sedimentary origin 110, and the opening 106 across screening arrangement 105 is propagated, and enters deposition region 111.Deposition region 111
In, Barebone 20 is arranged to keep substrate carrier after mask carrier.
In some embodiments, equipment further comprises driving device 30, and driving device 30 is configured so as to be directed at system
System 20 is mobile towards screening arrangement 105 in first direction Z.Therefore, can make between screening arrangement 105 and installation to Barebone 20
Mask carrier 13 between gap 108 width reduction.
Driving device 30 can be configured to that Barebone 20 will be moved together together with mask carrier 13 and substrate carrier 11, cover
Mould carrier 13 is mounted to the second assembly parts 22, and substrate carrier 11 is mounted to the first assembly parts 21.Including aligned units therefore,
25, the entire unit including first and second assembly parts, the substrate carrier and mask carrier that are also installed at this, can be by drive
Dynamic device 30 is in first direction Z towards screening arrangement 105 or far from the movement of screening arrangement 105.
It is some can in the embodiment in conjunction with other embodiments described herein, to Barebone 20 be can be in first
Direction Z is relative to mobile 1 millimeter of screening arrangement 105 or more, and/or 100 millimeters or less distance, and specifically 5 millimeters
Or more, and/or 30 millimeters or less distance.For example, driving device 30 can be configured to make to Barebone 20 from Figure 1A institute
The first position shown is towards shown in mobile 5 millimeters of screening arrangement 105 or more and 15 millimeters or less distance to Figure 1B the
Two positions.
Driving device 30 may include one or more actuators, to make alignment system 20 and screening arrangement 105 in the
One direction Z is moved relative to each other.One or more actuator may include piezoelectric actuator, linear motor, servo horse
Up at least the one of (servomotor), mandrel driving (spindle drive), pneumatic actuator and voice coil (voice coil)
Person.In some embodiments, driving device 30 can be at least partially disposed at 101 outside of vacuum chamber.In other embodiment party
In formula, driving device 30 can be disposed at 101 the inside of vacuum chamber.
For example, driving device 30 may include the actuator being provided in outside vacuum chamber, such as under atmospheric pressure, wherein
It can provide feedthrough component (feed-through), be sent to the movement of actuator in vacuum chamber, with Mobile vacuum chamber
It is interior to Barebone 20.Feedthrough component may include flexible member, such as bellows (bellow) element, wherein the dimension of flexible member
(dimension) movement of actuator can be followed.Power transmission element can make in actuator and vacuum chamber outside vacuum chamber
Face connects Barebone 20.
In some embodiments, driving device 30 can be disposed in vacuum chamber.For example, driving device 30 may include mentioning
For the indoor piezoelectric actuator of vacuum chamber, such as it is connected to the wall of vacuum chamber, and piezoelectric actuator is configured in first
Direction Z makes mobile relative to vacuum chamber 101 to Barebone 20.
Support knot can be included to Barebone 20 in the embodiment in conjunction with other embodiments described herein some
Structure 50.The sustainable one, two or more aligned units 25 to Barebone 20 of support construction 50, and/or alignment system can be made
System 20 may be movably attached to vacuum chamber 101.
In some embodiments, support construction 50 includes braced frame 51, wherein aligned units 25 and it is optional in addition
Aligned units attach to braced frame.To which braced frame 51 can be formed for several aligned units to Barebone 20
Common support.In figure 1A, braced frame 51 is indicated with dotted line vertical connecting, can be disposed at different cross section between two
Between aligned units.
In some embodiments, the top of braced frame 51 is movably coupled to via at least one first actuator 31
To vacuum chamber 101, and the lower part of braced frame 51 may be movably attached to vacuum chamber via at least one second actuator 32
Room 101.It is right by making the braced frame 51 to Barebone 20 may be movably attached to vacuum chamber 101 at several attachment points
Barebone 20 can be stably kept in vacuum chamber.Further, by two or more actuators of offer, such as at least one
A first actuator 31 and at least one second actuator 32, can synchronous manipulation so as to Barebone 20 towards screening arrangement
105 and/or mobile far from screening arrangement 105, it is ensured that Barebone 20 in the precise motion of first direction Z.
It is some can in the embodiment in conjunction with other embodiments described herein, to Barebone 20 include it is multiple right
Quasi- unit 25, so that substrate carrier 11 is aligned relative to mask carrier 13.Upper aligned units 26 and lower aligned units 27 are exemplary
Ground is illustrated in Figure 1A and Figure 1B.It can provide more other aligned units.For example, at least four aligned units may be provided in pair
At the spaced disconnected position of Barebone 20, so that substrate carrier 11 is aligned relative to mask carrier 13, such as it is provided in base
Four corners of onboard body 11.
It further, may include to make the installation of substrate carrier 11 to multiple first assembly to Barebone to Barebone 20
Part and to make the installation of mask carrier 13 to multiple second assembly parts to Barebone 20.Each alignment in multiple aligned units
Unit can be configured so that corresponding first assembly parts are mobile relative to corresponding second assembly parts, so that substrate carrier 11 is opposite
It is aligned in mask carrier 13.In an exemplary embodiment, multiple second assembly parts are fixed on the support frame to Barebone
Frame 51, and multiple first assembly parts may be movably attached to the multiple second assembly parts via multiple aligned units.
Multiple aligned units 25 are attached to the common support construction to Barebone 20, such as are attached to support construction 50
Braced frame 51.Braced frame 51 can stable alignment system 20, so can provide and maintain the comprehensive accurate of entire substrate surface
Alignment.It is mobile towards screening arrangement 105 to Barebone 20 in order to make, it can be in first direction Z to the braced frame 51 of Barebone 20
It is mobile.Aligned units and the first and second assembly parts can be connected directly or indirectly to braced frame 51.
In some embodiments, aligned units 25 can be configured so that the first assembly parts 21 in first direction Z relative to
Second assembly parts 22 are mobile.To which the distance between mask carrier 13 and substrate carrier 11 can be by 25 appropriate adjustments of aligned units.
Alternately or in addition, aligned units 25 can be configured so that the first assembly parts 21 are in the second direction X perpendicular to first direction
It is mobile relative to the second assembly parts 22.Second direction X can be the horizontal direction perpendicular to first direction Z.Specifically, second direction
X can correspond to the width direction of substrate.To which the relative position in the width direction of substrate between mask and substrate can
By 25 appropriate adjustment of aligned units.Alternately or in addition, aligned units 25 can be configured so that the first assembly parts 21 are in vertical
It is mobile relative to the second assembly parts 22 in the third direction Y of first direction Z and second direction X.Third direction Y can be vertical for essence
Direction.Specifically, third direction Y can essentially correspond to the short transverse of substrate.To between covering in the short transverse of substrate
Relative position between mould and substrate can be by 25 appropriate adjustment of aligned units.
At least one aligned units 25 can be configured so that the first assembly parts 21 are opposite in second direction X and third direction Y
It is mobile in the second assembly parts 22.To which mask can be correctly aligned in the extension plane of substrate relative to substrate.
Aligned units 25 may include one or more piezoelectric actuators, to make the first assembly parts in one or more
Direction is mobile relative to the second assembly parts.Alternatively, aligned units can be selected from by step actuator (stepper actuator), nothing
Brush actuator (brushless actuator), direct current electric actuator (direct current actuator, DC
Actuator), the group that voice coil actuator (voice coil actuator) and pneumatic actuator are constituted.
After alignment, mask can be attracted towards substrate, such as via magnetic chuck, so that substrate and being masked in coating material
Material 112 contacts each other between being deposited on substrate last issue.The exact pattern of structure with dimension lower than 10 microns can be deposited on substrate
On, such as the TFT transistor of pixel array and/or display.
In some embodiments, it is possible to provide multiple aligned units.At least one aligned units can be configured so that first
Assembly parts are aligned in only one direction or in only both direction relative to the second assembly parts, and aligned units 25 can be relative to residue
Float (floating) in direction.Term " floating relative to a direction ", which can be regarded as aligned units, moves carrier in said direction
It is dynamic, such as driven by another aligned units.As an example, the first aligned units are configured to actively move base in first direction
Onboard body, and be configured to passively make substrate carrier 11 mobile in second direction and/or third direction.In some embodiments
In, term " floating " can be regarded as " moving freely ".
In some embodiments, Barebone 20 is arranged at least partially flat between first limited by substrate carrier
Region between face and the second plane limited by mask carrier.Specifically, the first assembly parts 21 and the second assembly parts 22 are extremely
Few one is provided between the first plane and the second plane.
It is noted that according to embodiment described herein, a part of the not necessarily equipment of screening arrangement 105.
Specifically, in some embodiments, equipment include to Barebone, to Barebone include the first assembly parts, the second assembly parts with
And it is connected to the aligned units of the first assembly parts and the second assembly parts.Further, equipment includes being connected to Barebone and true
The driving device of plenum chamber, wherein driving device can be configured to make mobile relative to vacuum chamber to Barebone, specifically court
Mobile to shielding assembly parts, shielding assembly parts are configured as being installed on screening arrangement in vacuum chamber.
Specifically, equipment may include to Barebone 20, include to make the installation of substrate carrier 11 to alignment to Barebone 20
First assembly parts 21 of system, to make mask carrier 13 installation to the second assembly parts 22 to Barebone and to make first
The aligned units 25 that assembly parts 21 and the second assembly parts 22 are moved relative to each other.The equipment further comprises driving device
30, driving device 30 is configured so as to be directed at system 20 in first direction Z relative to the movement of vacuum chamber 101, specially direction
Sedimentary origin and/or separate sedimentary origin are mobile.
Driving device 30 can be configured to that Barebone 20 to the substrate carrier 11 to Barebone 20 and will be covered together with installation
It is mobile that mould carrier 13 arises from first direction Z.Specifically, driving device 30 can be configured so that be aligned system 20 relative to
The shielding assembly parts for installing screening arrangement 105 are mobile, wherein shielding assembly parts are provided in vacuum chamber 101.Shield assembly parts
It can be configured in making screening arrangement 105 be installed on sedimentary origin and between Barebone 20 in vacuum chamber 101.
Screening arrangement 105 can at least partly stop the coating material 112 not being oriented to towards substrate.Further, shielding dress
Open coat window can be provided for the coating material being oriented to towards mask and/or substrate by setting 105.
According to some embodiments described herein, a kind of system for handling substrate in vacuum chamber is described.Institute
The system of stating includes the base of the equipment 100 of any embodiment described herein, installation to the first assembly parts 21 to Barebone 20
Onboard body 11 and installation to the second assembly parts 22 to Barebone mask carrier 13.
Fig. 2A is painted according to a kind of for handling the equipment 200 of substrate 10 of embodiment described herein, in first
The schematic sectional view set.Fig. 2 B is illustrated in the equipment 200 of Fig. 2A of the second position.Equipment 200 essentially corresponds to Figure 1A and figure
The equipment 100 of 1B, so can refer to above description, is not repeated herein.Specifically, identical reference number corresponds to referring to figure
The individual features of 1A and Figure 1B description.
As shown in Figure 2 A shown in meaning property, equipment includes vacuum chamber 101, wherein being provided in vacuum chamber to Barebone 20
In 101.Barebone 20 is configured so that substrate 10 is relative to mask registration.Sedimentary origin 110 may be provided in vacuum chamber 101
It is interior.Material can pass through masked-deposition on substrate 10 by sedimentary origin 110.
Further, screening arrangement 105 is provided in vacuum chamber 101.Screening arrangement 105 in first direction Z relative to
Be to Barebone 20 it is moveable, i.e., towards to Barebone 20 and/or far from mobile to Barebone.
As shown in Figure 2 A shown in meaning property, equipment 200 includes driving device 35, and driving device 35 is configured so as to shield dress
105 are set in first direction Z towards to the movement of Barebone 20.Further, driving device 35 can be configured so that screening arrangement 105
In first direction Z far from mobile to Barebone 20.Therefore, during coating material 112 is deposited on substrate 10, it can reduce or close
Between screening arrangement 105 and install to the gap 108 between the mask carrier 13 to Barebone 20.
In fig. 2, screening arrangement 105 is arranged in first position, separates with interval with mask carrier 13.In Fig. 2 B
In, screening arrangement 105 is mobile towards mask carrier 13 by driving device 35, e.g. 5 millimeters or more of distance, such as
This one, substantial gapless between mask carrier 13 and screening arrangement 105.Therefore, deposition results can be improved and can be reduced and be
The downtime of system.
Similar to embodiment shown in figure 1A, driving device 35 may include one or more actuators, actuator quilt
It is configured at least one of piezoelectric actuator, linear motor, servo motor, mandrel driving, pneumatic actuator and voice coil.Actuating
Device may be provided in 101 outside of vacuum chamber, under atmosphere.It can be relatively simple for being arranged in the maintenance of the actuator under atmospheric condition
, and the space requirement outside vacuum chamber can be less stringent.Alternatively, actuator can be disposed inside vacuum chamber, make to cause
Dynamic device is provided in inside vacuum chamber be beneficial, because less complex arrangement can be used, such as without mechanical feedthrough component.
It is some can be in the embodiment in conjunction with other embodiments described herein, equipment can further comprise substrate
Transport device 60, substrate transport device 60 are configured to transport substrate carrier 11 along substrate transport track 61 in second direction X.
Second direction X can be substantially perpendicular to first direction Z, and can correspond to the width direction of substrate.Alternately or in addition, it is possible to provide
Mask transport device 62, mask transport device 62 are configured to transport mask load along mask conveying track 63 in second direction X
Body.
Substrate transport device 60 can be configured to transport substrate carrier 11 in a non-contact manner along substrate transport track 61,
And/or mask transport device 62 can be configured to transport mask carrier in a non-contact manner along mask conveying track 63.For example, the
One magnetic suspension system can be configured to transport substrate carrier in a non-contact manner along substrate transport track 61, and the second magnetic suspension system
System can be configured to transport mask carrier in a non-contact manner along mask conveying track 63.
In some embodiments, equipment can further comprise the first driving and the second driving, and the first driving is configured to
So that substrate carrier 11 is moved to the first assembly parts 21 from substrate transport track 61, the second driving be configured so that mask carrier 13 from
Mask conveying track 63 is moved to the second assembly parts 22, specially moves respectively on first direction Z.
Mask carrier 13 and substrate carrier 11 can be transported by mask transport device and substrate transport device to alignment respectively
System 20 to side position.First driving can be configured so that substrate carrier 11 is mobile from the first side towards the first assembly parts 21,
And second driving can be configured so that mask carrier is mobile from second side opposite with the first side towards the second assembly parts 22.
In some embodiments, substrate transport track and mask conveying track are provided in Barebone 20 at least partially
Between.Specifically, at least one of the first assembly parts 21 and the second assembly parts 22 may be provided in substrate transport track and mask is transported
Between defeated track.It is put down for example, the first assembly parts 21 can be disposed at the plane limited by mask carrier with what is limited by substrate carrier
Between face.
Fig. 3 A to Fig. 3 E is painted according to the method described herein for being directed at substrate carrier 11 relative to mask carrier 13
Several stages, the method can sequentially be executed according to shown in Fig. 3 A to Fig. 3 E.Alternatively, the sequence in variable some stages.
In figure 3 a, mask transport device 62 transports the mask carrier 13 for transporting mask in second direction X along mask
In the transport to the indoor deposition region 111 (Fig. 3 A is not shown) of vacuum chamber of track 63.Mask transport device 62 can be to be configured to
The transport device for transporting mask carrier in a non-contact manner, for example including magnetic suspension system.
Mask carrier 13 stops at first position shown in Fig. 3 A, and in first position, mask carrier 13 is arranged in alignment
On first side of system 20, specially between between Barebone 20 and screening arrangement 105.
In figure 3b, by the second driving 67, mask carrier 13 is in the first direction Z court for being substantially perpendicular to second direction X
To the second assembly parts 22 lateral movement to Barebone 20.Second driving 67 can be configured to cross-drive (crossdrive),
It may include the side guiding element to make mask carrier 13 mobile towards the second assembly parts 22 in a non-contact manner.
As shown in Figure 3B, the second driving 67 can make mask carrier 13 in first direction Z far from screening arrangement 105 towards right
Barebone 20 is mobile, until the second assembly parts 22 of 13 contact float system 20 of mask carrier.For example, the second driving 67 can be in the
One direction Z makes 4 millimeters of mask carrier movement or more and 10 millimeters or less distance.
Mask carrier 13 can mount to the second assembly parts 22, such as by the magnet of the second assembly parts 22 of activation, so that covering
Mould carrier 13 is held in by the second assembly parts to Barebone 20 towards the magnetic clamping of the second assembly parts 22.
Further, in figure 3b, substrate transport device 60 will transport the substrate carrier 11 of substrate 10 in the edge second direction X
The transport of substrate transport track 61 in deposition region 111.Substrate transport device 60 can be to be configured to transport in a non-contact manner
The transport device of substrate carrier, for example including magnetic suspension system.
Substrate carrier 11 stops at first position shown in Fig. 3 B, and in first position, substrate carrier 11 is arranged in alignment system
In second side of system 20, second side is opposite with the first side that mask carrier 13 is arranged.Specifically, substrate carrier 11 can be disposed at
To between the wall (Fig. 3 B is not shown) of Barebone 20 and vacuum chamber.
In fig. 3 c, by the first driving 68, substrate carrier 11 is in the first direction Z court for being substantially perpendicular to second direction X
To the first assembly parts 21 lateral movement to Barebone 20.First driving 68 can be configured to cross-drive, may include to
Make the side guiding element that substrate carrier 11 is mobile towards the first assembly parts 21 in a non-contact manner.For example, the first driving 68 can be such that substrate carries
Body is in first direction Z towards to 4 millimeters of Barebone movement or more and 10 millimeters or less distance.
As shown in Fig. 3 B and Fig. 3 C, the second driving 67 can be configured so that mask carrier 13 drives 68 moving substrates toward first
The opposite direction of carrier is mobile.Therefore, via the first driving and the second driving, substrate carrier 11 and mask carrier 13 can courts respectively
It is mobile to the opposite side to Barebone 20.
Substrate carrier 11 can mount to the first assembly parts 21, such as by the magnet of the first assembly parts 21 of activation, so that base
Onboard 11 magnetism of body is clamped in the first assembly parts 21, and the first assembly parts are held in substrate carrier 11 at Barebone 20.
In fig. 3d, aligned units 25 are directed at substrate carrier 11 relative to mask carrier 13, and aligned units 25 are provided in
In mechanical connection path between the first assembly parts and the second assembly parts.Therefore, mask is opposite with pinpoint accuracy with substrate
In aligned with each other.
Further, in fig. 3d, in order to reduce or close the gap between screening arrangement 105 and mask carrier 13
108, it is mobile towards screening arrangement 105 to Barebone 20.Alternately or in addition, screening arrangement 105 can be towards to Barebone 20
It is mobile.
In fig. 3e, coating material 112 is deposited on substrate, and wherein coating material passes through the opening 106 of screening arrangement 105
It is propagated towards substrate.A part of coating material can be stopped by the shielding frame 107 of screening arrangement, thus can reduce or keep away
Exempt from the pollution of mask carrier, the specially pollution of the perimeter of mask carrier.
Fig. 4 is painted a kind of stream of method that the substrate carrier 11 made in vacuum chamber 101 is aligned relative to mask carrier 13
Cheng Tu.Substrate carrier 11 can transport substrate 10, and mask carrier 13 can transport mask.
In square 410, the installation of mask carrier 13 to the second assembly parts 22 to Barebone 20.Second assembly parts 22 can be magnetic
Property assembly parts, and mask carrier can be clamped in the second assembly parts 22 by magnetism.
In square 420, the installation of substrate carrier 11 to the first assembly parts 21 to Barebone 20.First assembly parts 21 can be magnetic
Property assembly parts, and substrate carrier can be clamped in the first assembly parts 21 by magnetism.
It may include aligned units 25 to Barebone 20, aligned units 25 are configured so that the first assembly parts 21 and the second assembly
Part 22 is moved relative to each other.For example, the first assembly parts and the second assembly parts can mechanically be connected via aligned units.
In square 430, aligned units 25 are moved relative to each other the first assembly parts 21 and the second assembly parts 22, so that base
Onboard body 11 is aligned relative to mask carrier 13.
In square 440, driving device makes to be provided in opposite to Barebone 20 and screening arrangement 105 in vacuum chamber 101
In moving each other.Specifically, can be mobile towards screening arrangement 105 to Barebone 20, to reduce or close between mask carrier 13
Gap 108 between screening arrangement 105, and/or screening arrangement can be moved towards to Barebone 20, to reduce or close Jie
Gap 108 between mask carrier 13 and screening arrangement.
In optional square 450, coating material deposition is on the substrate 10 kept by substrate carrier 11.Coating material
Can be from sedimentary origin towards substrate guided, and may pass through the opening of screening arrangement 105 and pass through mask and propagated towards substrate.Not towards substrate
A part of coating material of guiding can be stopped by the shielding frame of screening arrangement 105.Due to screening arrangement and mask carrier it
Between the gap that reduces, therefore the pollution of mask carrier can be reduced or avoided.
It is noted that the sequence of square 410 to square 450 can change.For example, substrate carrier can be in mask carrier
It installs before installation to the second assembly parts to the first assembly parts.In other examples, make substrate carrier and mask in aligned units
Before carrier is aligned relative to each other, by making the width that can reduce gap 108 relative to screening arrangement movement to Barebone.
Fig. 5 be painted according to a kind of substrate carrier 11 made in vacuum chamber 101 of embodiment described herein relative to
The flow chart for the method that mask carrier 13 is aligned.Substrate carrier 11 can transport substrate 10, and mask carrier 13 can transport mask.
In square 510, mask carrier 13 is transported to vacuum chamber 101 along mask conveying track in second direction X
In deposition region.Second direction X can also indicate " transporting direction " herein.For example, can be transported along mask by magnetic suspension system
Track transports mask carrier in a non-contact manner.Mask carrier 13 can be transported to position as shown in fig. 3, when this position,
Mask carrier 13 is arranged between the second assembly parts 22 and screening arrangement 105 to Barebone 20, and with to Barebone 20
Two assembly parts 22 and screening arrangement 105 keep certain distance.
In square 520, mask carrier 13 can from mask conveying track in the first direction Z perpendicular to transporting direction towards second
Assembly parts 22 are mobile.Such as, it is possible to provide cross-drive is so that mask carrier 13 is moved in first direction X towards the second assembly parts 22
It is dynamic.Cross-drive can be such that mask carrier 13 guides in first direction Z to the second assembly parts 22 in a non-contact manner, until the second assembly
Part 22 is magnetic to grasp mask carrier, so that the second assembly parts 22 steadily maintain mask carrier.Cross-drive may include magnetic side
Guiding element, the magnetic side guiding element are configured to apply the magnetic force that repels each other in mask carrier, make mask carrier in the in a non-contact manner
One direction Z is mobile.
In square 530, the installation of mask carrier 13 to the second assembly parts 22 to Barebone 20.Second assembly parts 22 can be magnetic
Property assembly parts, and mask carrier can magnetism be clamped in the second assembly parts 22.For example, the second assembly parts 22 may include electromagnet
(electromagnet) or electric permanent-magnet component (EPM component).
In square 540, substrate carrier 11 is in second direction X, i.e., in transporting direction, along substrate transport rail transport.Base
Plate conveying track and mask conveying track can be in substantially extending parallel to each other in vacuum chamber 101.
Substrate carrier 11 can be by magnetic suspension system in a non-contact manner along substrate transport rail transport.Substrate carrier 11 can
It is transported to position as shown in Figure 3B, when this position, substrate carrier 11 is arranged to keep one with the first assembly parts 21
Set a distance.Specifically, substrate carrier 11 can be disposed in compared to mask carrier 13 on the opposite side to Barebone 20.
In some embodiments, substrate transport track and mask conveying track are extended with identical height.In other implementations
In mode, substrate transport track is extended with mask conveying track with different height.For example, when mask carrier has in vertical direction
When bigger than substrate carrier extension, mask conveying track can height more lower than substrate transport track extend.
In square 550, substrate carrier 11 can be moved to the first assembly parts 21 from substrate transport track in first direction Z.When
When substrate carrier 11 and mask carrier 13 are provided on the opposite side to Barebone 20, substrate carrier 11 is along direction direction first
Assembly parts 21 are mobile, this direction is opposite towards the moving direction of the second assembly parts 22 with mask carrier in square 520.
Such as, it is possible to provide cross-drive in addition is so that substrate carrier 11 is mobile towards the first assembly parts 21.It is described in addition
Cross-drive can guide substrate carrier 11 towards the first assembly parts 21 in a non-contact manner, shown in example as shown in Figure 3 C.The
One assembly parts 21 magnetic can grasp substrate carrier, so that the first assembly parts 21 steadily maintain substrate carrier.The other friendship
Fork driving may include magnetic side guiding element, and the magnetic side guiding element is configured to apply the magnetic force that repels each other in substrate carrier, non-contact
Make substrate carrier mobile towards the first assembly parts 21 in first direction Z likes.
In square 560, the installation of substrate carrier 11 to the first assembly parts 21 to Barebone 20.First assembly parts 21 can be magnetic
Property assembly parts, and substrate carrier can magnetism be clamped in the first assembly parts 21.For example, the first assembly parts 21 may include electromagnet or electricity
Permanent-magnet component (EPM component).
It may include aligned units 25 to Barebone 20, aligned units 25 are configured so that the first assembly parts 21 and the second assembly
Part 22 is moved relative to each other.For example, the first assembly parts 21 and the second assembly parts 22 can mechanically be connected via aligned units.
In square 570, aligned units 25 are moved relative to each other the first assembly parts 21 with the second assembly parts 22, to make
Substrate carrier 11 is aligned relative to mask carrier 13.
In some embodiments, when mask carrier and substrate carrier are installed to Barebone, via the first assembly parts,
Aligned units and the second assembly parts, it is possible to provide the direct mechanical connection path between mask carrier and substrate carrier.Change speech
It, may be provided between mask carrier and substrate carrier via path to Barebone, is directly mechanically connected, wherein the link road
Diameter does not extend past the indoor other parts of vacuum chamber.Therefore, the vibration of vacuum chamber or be provided in vacuum chamber it is indoor other
The vibration of device can be aligned system 20 and weaken (decoupled).Deposition accuracy can be improved.
In square 580, driving device makes to be provided in opposite to Barebone 20 and screening arrangement 105 in vacuum chamber 101
In moving each other.Specifically, can be mobile towards screening arrangement 105 to Barebone 20, to reduce or close between mask carrier 13
Gap 108 between screening arrangement 105, and/or screening arrangement can towards mobile to Barebone 20, with reduce or close between
Gap 108 between mask carrier 13 and screening arrangement.
In square 590, coating material can be deposited on substrate 10.Coating material can be oriented to substrate from sedimentary origin, and can wear
It crosses the opening of screening arrangement 105 and passes through mask and propagated towards substrate 10.The coating material that a part is not oriented to substrate can be shielded
Device 105 is covered to be stopped.Due to the gap 108 reduced between screening arrangement and mask carrier, can be reduced or avoided
The pollution of mask carrier.For example, evaporation material can be deposited on substrate by vapour source.
It is noted that the sequence of square 510 to square 590 is changeable.
According to it is some can may include electrostatic card with the embodiment in conjunction with other embodiments described herein, substrate carrier
Disk (E-chuck), the electrostatic chuck are provided to make substrate be held in the electrostatic force of substrate carrier.For example, substrate carrier packet
Electrode arrangement is included, the electrode arrangement is configured to provide the attraction acted on substrate.
According to some embodiments, substrate carrier includes the electrode arrangement with multiple electrodes, and the electrode arrangement is through matching
It sets to provide the attraction kept at surface to make substrate be held in substrate carrier.The controller of substrate carrier can be configured
To apply one or more voltages in electrode arrangement, to provide attraction (being also indicated as " clamping force ").
The embeddable main body of the multiple electrodes of electrode arrangement, or may be provided in main body, such as be placed in main body.According to one
It can be a bit dielectric substance (dielectric body) with the embodiment in conjunction with other embodiments described herein, main body, such as
Dielectric sheet.Dielectric substance can be manufactured with dielectric material, preferably the high dielectric material of the coefficient of heat conduction, such as pyrolytic boron nitride, nitrogen
Change aluminium, silicon nitride, aluminium oxide or other equivalent materials, but can the manufacture of the material as such as polyimides.In some realities
It applies in mode, multiple electrodes such as grating type precise metal strip can be placed on dielectric sheet and be covered by thin dielectric layer.
According to it is some can include one or more with the embodiment in conjunction with other embodiments described herein, substrate carrier
Multiple voltage sources, one or more voltage source are configured to apply one or more voltages in multiple electrodes.One
In a little embodiments, one or more voltage source is configured so that at least some electrodes of multiple electrodes are grounded.For example,
One or more voltage source can be configured to apply with the first polar first voltage, have second polar second
Voltage, and/or it is grounded multiple electrodes.
It can be configured to substrate with the embodiment in conjunction with other embodiments described herein, equipment according to some
The contactless suspension and/or contactless transport of carrier 11 and/or mask carrier 13.For example, equipment may include guide structure,
The guide structure is configured for the contactless suspension of substrate carrier 11 and/or mask carrier 13.Similarly, equipment can wrap
Driving structure is included, the driving structure is configured for the contactless transport of substrate carrier 11 and/or mask carrier 13.Specifically
Ground, can be with magnetic force rather than mechanical force makes carrier be held in suspension or quick condition.For example, in some embodiments, carrier with
There is no Mechanical Contact between conveying track, specifically during the suspension, movement and positioning of substrate carrier and/or mask carrier.
The contactless suspension and/or contactless transport of carrier, which are had an advantage that during transport, does not have particle generation, example
Such as since the particle contacted with guide mechanism generates.When using contactless suspension and/or contactless transport, because of particle
Generation is preferably minimized, therefore can provide the improvement of the purity and the uniformity of the layer being deposited on substrate.
One or more sedimentary origins 110 may be provided in vacuum chamber 101.Substrate carrier 11 can be configured in vacuum
Substrate 10 is kept during depositing operation.Vacuum system can be configured to for evaporating such as the organic material for manufacturing OLED device.
As an example, one or more sedimentary origin can be evaporation source, specially make one or more of organic materials heavy
Product is on substrate, to form the evaporation source of the layer of OLED device.Substrate carrier for transporting substrate can be conveyed into vacuum
In chamber and by vacuum chamber, and specifically enters and/or pass through along transportation route (such as linear transportation route) and sink
Product region.
Material can be projected from one or more sedimentary origins, in projecting direction towards by the deposition where the substrate being applied
Region.For example, one or more sedimentary origin can provide for it is multiple opening and/or nozzle linear sources, it is described more
A opening and/or nozzle along the length of one or more sedimentary origins are arranged as at least one line.Material can be by described more
A opening and/or nozzle project.
Embodiment described herein can be used for the evaporation on large-area substrates, such as manufacturing OLED display.Tool
Body, the substrate for providing the structures and methods for embodiment described herein is large-area substrates, such as with 0.5m2Or
Bigger surface area, specifically 1m2Or bigger surface area.For example, large-area substrates or carrier can for corresponding to surface area about
0.67m2In 4.5 generations (GEN 4.5) of (0.73x 0.92m), correspond to surface area about 1.4m25 generation (the GEN of (1.1m x 1.3m)
5), correspond to surface area about 4.29m2In 7.5 generations (GEN 7.5) of (1.95m x 2.2m), correspond to surface area about 5.7m2(2.2m
X 2.5m) 8.5 generations (GEN 8.5) or correspond to surface area about 8.7m210 generations (GEN 10) of (2.85m x 3.05m).Very
It extremely can similarly be implemented on the correspondence surface area in a bigger generation such as 11 generations (GEN 11) and 12 generations (GEN 12) Ji Geng great.GEN generation
Half-size scale also may be provided in the manufacture of OLED display.
According to it is some can with the embodiment in conjunction with other embodiments described herein, the thickness of substrate can for 0.1 to
1.8 millimeters (mm).The thickness of substrate can be about 0.9 millimeter or smaller, for example, 0.5 millimeter.Term " substrate " used herein
It may particularly include substantive non-flexible substrate, such as chip, transparent crystal piece (slices of transparent crystal),
Such as sapphire or the like or glass plate.However, the present invention is not limited thereto, and term " substrate " also may include flexibility
Substrate, such as net (web) or foil (foil).Term " essence is non-flexible " is interpreted as to be different from " flexibility ".Specifically, essence
Non-flexible substrate can have the flexibility of certain degree, such as the glass plate with 0.9 millimeter or less thickness, and such as 0.5 millimeter
Or it is less, wherein the flexibility of the essence non-flexible substrate is small compared to flexible base board.
According to embodiment described herein, substrate can be by manufacturing suitable for any materials of material deposition.For example, base
Plate can be by being selected from: glass (such as soda-lime glass, Pyrex is such), metal, polymer, ceramics, composite material, carbon fiber
The material manufacture for the group that dimension material or any other materials that can be coated with deposition process or combined material are constituted.
Term " masking " may include reducing and/or material being hindered to be deposited on one or more regions of substrate 10.It covers
It can be useful for covering, such as in order to limit the region that will be applied.In some applications, substrate is only partially applied, and
The part not being applied, which is masked, to be covered.
A kind of method may include using keeping substrate carrier and mask carrier right relative to each other the aligned units of Barebone
It is quasi-.It may be transferred to from vacuum chamber to Barebone: mechanicalness noise, the vibration from system and the vibration from building
At least one of (i.e. dynamic and static deformation), can be arranged in the machinery in the connecting line between Barebone and vacuum chamber
Independent component compensates or mitigates.
There is machinery with by Barebone via the prealignment of contactless transportation system (such as magnetic suspension system)
The combination of the fine registration of contact makes to be directed at system complexity reduction, and to make the cost of holder reduce.For example, can be by
Prealignment with magnetic suspension system provides.
According to embodiment described herein, for alignment in vacuum chamber and/or transport substrate carrier and mask carrier
Method computer program, software, computer software product and interconnection controller can be used to be managed, these computer journeys
Sequence, software, computer software product and interconnection controller can have CPU, memory, user interface, and corresponding with equipment
Component communication outputs and inputs device.
Present disclosure provides the second transport device for the first transport device of substrate carrier and for mask carrier,
This first transport device can be identical size at least one dimension with the second transport device.In other words, mask carrier can assemble
In the first transport device, and substrate carrier can be assemblied in the second transport device.When the first transport device and the second transport dress
Set provide carrier it is accurate and smooth when being transported by vacuum system, the first transport device and the second transport device can elasticity transport
With.Precisely align substrate relative to mask Barebone, vice versa.It can get high quality processing result, such as to life
Produce high-resolution OLED device.
In other embodiments, mask carrier and substrate carrier can be different sizes, for example, mask carrier can be greater than base
Onboard body, specially in vertical direction be greater than substrate carrier.
Although foregoing teachings are related to each embodiment of present disclosure, in the base region for not departing from present disclosure
In the case where, it can be designed other and further embodiment of present disclosure, and scope of the present disclosure by appended
Claims determine.
Claims (15)
1. equipment (100) of the one kind for processing substrate (10) in vacuum chamber (101), the equipment (100) include:
To Barebone (20), described includes the first assembly parts (21), the second assembly parts (22) and aligned units to Barebone (20)
(25), first assembly parts (21) are for making substrate carrier (11) installation to described to Barebone, second assembly parts
(22) for making mask carrier (13) installation to described to Barebone, the aligned units (25) are for making first assembly parts
(21) it is moved relative to each other with second assembly parts (22)；With
Screening arrangement (105),
Described is moveable relative to each other in first direction (Z) to Barebone (20) and the screening arrangement (105).
2. equipment as described in claim 1 further comprises driving device (30,35), the driving device (30,35) is through matching
It sets so that described move Barebone (20) towards the screening arrangement (105) and/or make the screening arrangement (105) towards institute
It states mobile to Barebone (20).
3. equipment as claimed in claim 1 or 2 further comprises sedimentary origin (110), the sedimentary origin (110) is configured to
Guiding coating material (112) is described to be arranged in the deposition region (111) to Barebone (20) towards deposition region (111).
4. equipment as claimed any one in claims 1 to 3, wherein the screening arrangement (105) includes being used for coating material
(112) opening (106) and the shielding frame (107) around the opening (106).
5. equipment according to any one of claims 1 to 4, wherein the alignment system (20) is to fill relative to the shielding
The mobile distance of (105) Yu Suoshu first direction (Z) is set, the distance is 1 millimeter or more and/or 100 millimeters or less.
6. the equipment as described in any one of claims 1 to 5, including one or more actuators, one or more
A actuator for make it is described to Barebone (20) and the screening arrangement (105) Yu Suoshu first direction (Z) relative to each other
It is mobile, wherein one or more actuator include piezoelectric actuator, it is linear motor, servo motor, mandrel driving, pneumatic
At least one of actuator and voice coil.
7. such as equipment described in any one of claims 1 to 6, wherein the alignment system (20) includes braced frame (51),
Wherein the top of the braced frame may be movably attached to the vacuum chamber via at least one first actuator (31)
(101), and the lower part of the braced frame via at least one second actuator (32) may be movably attached to the vacuum chamber
Room (101).
8. the equipment as described in any one of claims 1 to 7, wherein the aligned units (25) are configured as making described first
Assembly parts (21) Yu Suoshu first direction (Z), second direction (X) and/or third direction (Y) are relative to second assembly parts
(22) mobile, the second direction (X) is perpendicular to the first direction (Z), and the third direction (Y) is perpendicular to the first party
To (Z) and perpendicular to the second direction (X).
9. such as equipment described in any item of the claim 1 to 8, wherein the alignment system (20) includes multiple first assembly
Part, multiple second assembly parts and multiple aligned units (25), the multiple aligned units (25) are for making corresponding first assembly
Part is mobile relative to corresponding second assembly parts.
10. equipment as claimed in any one of claims 1-9 wherein, further comprise it is following at least one:
Substrate transport device, the substrate transport device are configured in the second party for being substantially perpendicular to the first direction (Z)
To (X) along substrate transport rail transport substrate carrier；And/or
Mask transport device, the mask transport device are configured to transport in the second direction (X) along mask conveying track
Mask carrier.
11. equipment as claimed in claim 10 further comprises the first driving and/or the second driving, the first driving warp
Configuration is so that substrate carrier (11) Yu Suoshu first direction (Z) is moved to first assembly parts from the substrate transport track
(21), second driving is configured so that mask carrier (13) Yu Suoshu first direction (Z) is moved from the mask conveying track
It moves to second assembly parts (22).
12. equipment (100) of the one kind for processing substrate (10) in vacuum chamber (101), the equipment (100) include:
To Barebone (20), described includes the first assembly parts (21), the second assembly parts (22) and aligned units to Barebone (20)
(25), the aligned units (25) are connected to first assembly parts (21) and second assembly parts (22)；With
Driving device (30), the driving device (30) are connected to described to Barebone (20) and the vacuum chamber (101).
13. a kind of system for handling substrate, the system comprises:
Equipment (100) as described in any one of claims 1 to 12；
Substrate carrier (11), substrate carrier (11) installation to first assembly parts (21)；With
Mask carrier (13), mask carrier (13) installation to second assembly parts (22).
14. method of the one kind for being directed at substrate carrier (11) relative to mask carrier (13) in vacuum chamber (101), institute
The method of stating includes:
The mask carrier (13) is installed to the second assembly parts (22) to Barebone (20)；
The substrate carrier (11) are installed to first assembly parts (21) to Barebone (20)；
Make first assembly parts (21) and second assembly parts (22) phase using the aligned units (25) to Barebone (20)
For moving each other, so that the substrate carrier (11) is aligned relative to the mask carrier (13)；With
Make to be provided in vacuum chamber (101) described is moved relative to each other Barebone (20) and screening arrangement (105).
15. method as claimed in claim 14, wherein the alignment system (20) is mobile towards the screening arrangement (105),
Or the screening arrangement (105) moves Barebone (20) towards described, to reduce between the mask carrier (13) and institute
State the gap (108) between screening arrangement (105).
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP2017/068657 WO2019020166A1 (en) | 2017-07-24 | 2017-07-24 | Apparatus and system for processing a substrate in a vacuum chamber, and method of aligning a substrate carrier relative to a mask carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109563610A true CN109563610A (en) | 2019-04-02 |
Family
ID=59581860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780032189.4A Pending CN109563610A (en) | 2017-07-24 | 2017-07-24 | For the equipment and system of processing substrate in vacuum chamber and for making substrate carrier relative to the method for mask carrier alignment |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2019526700A (en) |
| KR (1) | KR102107973B1 (en) |
| CN (1) | CN109563610A (en) |
| TW (1) | TWI680196B (en) |
| WO (1) | WO2019020166A1 (en) |
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| CN112117230A (en) * | 2020-10-19 | 2020-12-22 | 北京航空航天大学杭州创新研究院 | Substrate-mask plate in-situ holding device for high-density patterning |
| CN112626475A (en) * | 2019-09-24 | 2021-04-09 | 佳能特机株式会社 | Film forming apparatus and film forming method, information acquisition apparatus, alignment method, and electronic device manufacturing apparatus and manufacturing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20200017381A (en) * | 2018-08-06 | 2020-02-18 | 어플라이드 머티어리얼스, 인코포레이티드 | Deposition apparatus having a mask aligner, mask arrangement for masking a substrate, and method for masking a substrate |
| US11538706B2 (en) | 2019-05-24 | 2022-12-27 | Applied Materials, Inc. | System and method for aligning a mask with a substrate |
| US11189516B2 (en) | 2019-05-24 | 2021-11-30 | Applied Materials, Inc. | Method for mask and substrate alignment |
| US10916464B1 (en) | 2019-07-26 | 2021-02-09 | Applied Materials, Inc. | Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency |
| US11196360B2 (en) | 2019-07-26 | 2021-12-07 | Applied Materials, Inc. | System and method for electrostatically chucking a substrate to a carrier |
| US11756816B2 (en) | 2019-07-26 | 2023-09-12 | Applied Materials, Inc. | Carrier FOUP and a method of placing a carrier |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112626475A (en) * | 2019-09-24 | 2021-04-09 | 佳能特机株式会社 | Film forming apparatus and film forming method, information acquisition apparatus, alignment method, and electronic device manufacturing apparatus and manufacturing method |
| CN112626475B (en) * | 2019-09-24 | 2024-01-02 | 佳能特机株式会社 | Film forming apparatus, film forming method, information acquiring apparatus, alignment method, and electronic device manufacturing apparatus and electronic device manufacturing method |
| CN112117230A (en) * | 2020-10-19 | 2020-12-22 | 北京航空航天大学杭州创新研究院 | Substrate-mask plate in-situ holding device for high-density patterning |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI680196B (en) | 2019-12-21 |
| KR102107973B1 (en) | 2020-05-07 |
| KR20190087968A (en) | 2019-07-25 |
| WO2019020166A1 (en) | 2019-01-31 |
| JP2019526700A (en) | 2019-09-19 |
| TW201918571A (en) | 2019-05-16 |
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