KR20200017381A - Deposition apparatus having a mask aligner, mask arrangement for masking a substrate, and method for masking a substrate - Google Patents

Abstract

The present disclosure provides a deposition apparatus 100 for depositing one or more layers on a substrate 10. The deposition apparatus transfers a vacuum system 60, a transfer system 50 for transferring a mask carrier 23 configured to support the mask frame 21, wherein the mask frame 21 is a mask 22 mounted to the mask frame 21. ), And a plurality of first aligner devices 41 at least partially provided in the vacuum chamber 60, the plurality of first aligner devices 41 contacting the mask carrier 23 or the mask support. And a aligner system 40 including a plurality of second aligner devices 42 at least partially provided within the vacuum chamber 60, wherein the plurality of second aligner devices 42 In contact with the mask frame 21.

Description

Deposition apparatus having a mask aligner, mask arrangement for masking a substrate, and method for masking a substrate

[0001] Embodiments of the present disclosure relate to a deposition apparatus having a mask aligner for adjusting the position of the mask, more specifically for compensating in-plane and out-of-plane deformation of the mask. . Embodiments of the present disclosure further relate to a mask arrangement for masking a substrate to be deposited in a processing chamber. Moreover, embodiments of the present disclosure relate to a method for masking a substrate to be deposited in a processing chamber, and more particularly, to compensate for in-plane and out-of-plane deformation of a mask.

[0002] Optoelectronic devices using organic materials, such as organic light-emitting diodes (OLEDs), are becoming increasingly popular for many reasons. OLEDs are a special type of light emitting diode in which the light emitting layer comprises a thin film of certain organic compounds. Organic light emitting diodes (OLEDs) are used in the manufacture of television screens, computer monitors, mobile phones, other handheld devices, and the like for displaying information. OLEDs can also be used for general spatial lighting. Since OLED pixels emit light directly and do not involve back light, the range of possible colors, brightness and viewing angles in OLED displays is wider than in conventional LCD displays. The energy consumption of OLED displays is much less than that of conventional LCD displays. In addition, the fact that OLEDs can be fabricated on flexible substrates results in further applications.

[0003] OLEDs are realized by depositing material on a substrate. Various methods are known for this purpose. In one example, the substrates may be coated by using an evaporation process, a physical vapor deposition (PVD) process, such as a sputtering process, a spraying process, or the like, or a chemical vapor deposition (CVD) process. This process can be performed in the processing chamber of the deposition apparatus in which the substrate to be coated is located. A deposition material is provided in the processing chamber. The particles may, for example, pass through a mask having a boundary or a specific pattern to deposit material at desired positions on the substrate, such as to form an OLED pattern on the substrate. A plurality of materials such as organic materials, molecules, metals, oxides, nitrides and carbides can be used for deposition on the substrate. In addition, other processes such as etching, structuring, annealing, and the like may be performed in the processing chambers.

[0004] For example, coating processes can be considered for large area substrates, such as in display manufacturing technology. Coated substrates may be used in many applications and in various technical fields. For example, the application may be organic light emitting diode (OLED) panels. Further applications include insulating panels, microelectronics such as semiconductor devices, substrates with thin film transistors (TFTs), color filters, and the like. OLEDs are solid state devices composed of thin films of (organic) molecules that produce light by the application of electricity. In one example, OLED displays can provide bright displays on electronic devices and use reduced power as compared to liquid crystal displays (LCDs), for example. In the processing chamber, organic molecules are produced (eg, evaporated, sputtered or sprayed, etc.) and deposited as layers on the substrates. The material may, for example, pass through a mask having a boundary or specific pattern to deposit the material at desired positions on the substrate, such as to form an OLED pattern on the substrate.

[0005] An aspect related to the quality of the treated substrate, in particular the deposited layer, is the alignment of the substrate with respect to the mask. In one example, the alignment must be accurate and repeatable to obtain good process results. Accordingly, devices are used to align the substrate with respect to the mask, which are coupled to the substrate and / or the mask carrier. However, when the mask undergoes in-plane or out-of-plane deformation due to various factors such as changes in temperature, clamping forces, gravity or pre-deformation due to manufacturing processes, alignment of the mask is a problem. Can be

[0006] In view of the above, there is a need for aligners, arrangements, devices and methods that can compensate for in-plane and out-of-plane deformations of the mask.

[0007] In view of the above, a deposition apparatus, a mask arrangement, and a method for masking a substrate are provided. Further aspects, advantages and features of the disclosure are apparent from the dependent claims, the description and the accompanying drawings.

[0008] According to a first embodiment or aspect, a deposition apparatus is provided. The deposition apparatus includes a vacuum chamber, a transfer system for transferring a mask carrier configured to support a mask frame, the mask frame having a mask mounted to the mask frame, and a plurality of first aligner devices at least partially provided within the vacuum chamber. The plurality of first aligner devices are in contact with a mask carrier or mask support supporting the mask frame, and the plurality of second aligner devices provided at least partially in the vacuum chamber; In contact with the frame.

[0009] According to a second embodiment or aspect, a mask arrangement is provided. The mask arrangement comprises a mask carrier or mask support configured to support the mask frame, the mask frame having a mask mounted to the mask frame, the mask carrier or mask support being configured to contact the plurality of first aligner devices, The mask frame is configured to contact the plurality of second aligner devices.

[0010] According to third embodiments or aspects, use of the mask arrangement of the second embodiment or aspect for masking a substrate in a deposition apparatus according to the first embodiments or aspects is provided.

[0011] According to a fourth embodiment or aspect, a method of masking a substrate is provided. The method includes clamping a mask carrier or mask support supporting the mask frame, the mask frame having a mask mounted to the mask frame, aligning the substrate to the mask, and at least one adjustment to the mask frame. leveling the mask by applying a force.

In a manner in which the above-listed features of the present disclosure may be understood in detail, a more detailed description briefly summarized above may be made with reference to the embodiments. The accompanying drawings relate to embodiments of the present disclosure and are described next.
1 shows a schematic diagram of a deposition process using a mask to fabricate OLEDs on a substrate.
2A and 2B show schematic views of a mask mounted to a mask frame.
3 shows a schematic front view of pattern distortion due to mask deformation.
4 shows a schematic side view of a deposition apparatus according to embodiments of the present disclosure.
5 and 6 show schematic front views of a mask arrangement for masking a substrate in a processing chamber in accordance with embodiments of the present disclosure.
7 shows a flow diagram illustrating a method for masking a substrate in a processing chamber in accordance with embodiments of the present disclosure.

[0013] DETAILED DESCRIPTION Reference will now be made in detail to various embodiments of the present disclosure, with one or more examples of various embodiments illustrated in the drawings. Within the following description of the drawings, like reference numerals refer to like components. In general, only the differences relating to the individual embodiments are described. Each example is provided by way of explanation of the disclosure and is not to be considered limiting. In addition, features illustrated or described as part of one embodiment may be used with or in conjunction with other embodiments to cause further embodiments. The description is intended to include such modifications and variations.

[0014] 1 shows a schematic diagram of a deposition process using a mask to fabricate OLEDs on a substrate 10. To produce OLEDs, organic molecules are produced by the deposition source 30 and deposited on the substrate 10. Mask 22 is positioned between substrate 10 and deposition source 30. Deposition source 30 may be, for example, an evaporation source, a sputtering source or a spraying source. The mask 22 has, for example, a particular pattern provided by the plurality of openings 22a such that organic molecules pass over the openings 22a along the deposition path 32, for example, on the substrate 10. A layer or film of organic compound is deposited on the film. A plurality of layers or films may be deposited on the substrate 10 using different masks or positions of the mask 22 relative to the substrate 10 to produce, for example, pixels with different color characteristics. In one example, a first layer or film may be deposited to produce red pixels 34, a second layer or film may be deposited to produce green pixels 36, and a third layer or film may be deposited to blue pixels. Field 38 may be generated. A layer or film, or a plurality of layers or films, may be arranged between two electrodes, such as an anode and a cathode (not shown), to form an organic semiconductor. At least one of the two electrodes may be transparent.

[0015] Substrate 10 and mask 22 may be disposed in a vertical orientation during the deposition process. In FIG. 1, the arrows indicate the vertical direction 101 and the horizontal direction 102.

[0016] As used throughout this disclosure, the terms "vertical direction" or "vertical orientation" are understood to be distinct from "horizontal direction" or "horizontal orientation". That is, "vertical direction" or "vertical orientation" relates to, for example, the substantial vertical orientation of the mask arrangement / mask and the substrate, where a deviation of several degrees, such as up to 10 ° or even up to 15 ° from the exact vertical or vertical orientation Is still considered a "vertical direction" or a "vertical orientation". The exact vertical direction is parallel to gravity. The vertical or substantial vertical direction may allow for the deviations described above.

[0017] Embodiments described herein relate in particular to substrates and masks oriented in a vertical orientation, but the disclosure is not so limited. For example, the embodiments described in this disclosure are applicable to substrate carriers and / or mask carriers oriented in a horizontal orientation as well as substrates and / or masks.

[0018] As used throughout the present disclosure, the mask 22 lies in a mask plane defined by the first direction 101 and the second direction 102 when arranged in a vertical orientation. The first direction 101 can be aligned substantially parallel to the conveying direction in which the mask 22 is conveyed by the conveying system. The second direction 102 can be aligned substantially parallel to the aforementioned vertical direction, in particular substantially parallel to gravity. In particular, the first direction 101 and the second direction 102 are substantially perpendicular to each other. In addition, the third direction 103 may be aligned substantially perpendicular to the mask plane defined by the first direction 101 and the second direction 102. In particular, the third direction 103 is aligned substantially parallel to the deposition path 32.

[0019] Embodiments described herein can be used to coat large area substrates, such as for manufactured displays. Substrates or substrate receiving regions in which the devices and methods described herein are constructed may be, for example, large area substrates having a size of at least 1 m 2. For example, a large area substrate or carrier may comprise GEN 4.5 corresponding to about 0.67 m 2 substrates (0.73 m × 0.92 m), GEN 5 corresponding to about 1.4 m 2 substrates (1.1 m × 1.3 m), and about 4.29 m 2 substrate. GEN 7.5 corresponding to s (1.95m × 2.2m), GEN 8.5 corresponding to about 5.7m 2 substrates (2.2m × 2.5m), or even GEN corresponding to about 8.7m 2 substrates (2.85m × 3.05m) May be ten. Even larger generations, such as GEN 11 and GEN 12 and corresponding substrate areas, can similarly be implemented. For example, for OLED display manufacture, half sizes of the aforementioned substrate generations, including GEN 6, can be coated by evaporation of the device for evaporating the material. Half sizes of substrate generation can result from some processes executed for the entire substrate size, and subsequent processes executed for half of the previously processed substrate.

[0020] The term "substrate" as used herein may include, in particular, substrates that are substantially inflexible, such as transparent crystal slices, such as wafers, sapphires, or the like. However, the present disclosure is not so limited, and the term "substrate" may include flexible substrates such as webs or foils. The term "substantially inflexible" is understood to be distinguished from "flexible". Specifically, a substrate that is substantially inflexible, such as a glass plate having a thickness of 0.5 mm or less, may have some degree of flexibility, wherein the flexibility of the substrate that is substantially inflexible is small compared to flexible substrates.

[0021] The substrate can be made of any material suitable for material deposition. For example, the substrate can be glass (eg, soda lime glass, borosilicate glass, etc.), metal, polymer, ceramic, composites, carbon fiber materials, metal or any other material or material that can be coated by a deposition process. It can be made of a material selected from the group consisting of a combination of these.

[0022] One aspect of the deposition process is the alignment of the substrate 10 with respect to the mask 22. Correct alignment of the substrate 10 improves the quality and accuracy of the deposited layers, leading to improved products. The alignment must be accurate and repeatable to get good process results. However, the alignment of the substrate can be a problem when the mask experiences in-plane or out-of-plane deformation.

[0023] In some processing systems, the mask may typically be oriented in a horizontal orientation. The horizontal orientation of the mask allows some types of mask deformation to be partially or fully compensated for by gravity acting in a direction perpendicular to the mask. However, masks arranged in a vertical orientation in accordance with some embodiments described herein are advantageous in that the number of particles that collect on the substrate or the surface of the mask is reduced, leading to improved quality of the deposited layers. In addition, the vertical orientation allows the treatment system to use the floor space more efficiently. Since gravity is not acting substantially perpendicular to a mask arranged in a vertical orientation, a problem remains to compensate for in-plane and out-of-plane deformations of the mask. Moreover, even in processing systems in which the mask is oriented horizontally, other types of mask deformation that may not be compensated by gravity may be problematic.

[0024] 2A and 2B show schematic views of the mask 22 mounted to the mask frame 21. Here, two examples of out-of-plane deformations of the mask 22 are shown. Mask 22 is illustratively shown as oriented in a vertical orientation. In FIG. 2A, the mask 22 represents an out-of-plane deformation in which the mask 22 is bent in the third direction 103. Likewise, in FIG. 2B, the mask 22 represents another out-of-plane deformation in which the mask 22 ripples in the third direction 103 and in the opposite direction to the third direction 103.

[0025] As a result the effects of in-plane or out-of-plane deformation of the mask 22 on the deposited pattern are exemplarily shown in FIG. 3. Here, the target deposition pattern 25 is shown. The target deposition pattern 25 may be, for example, a two dimensional array of pixel elements (not shown) to be deposited on the substrate 10. The target deposition pattern 25 as illustratively shown in FIG. 3 is represented by the outer boundaries of the pattern and the vertical and horizontal midlines of the pattern. An exaggerated illustration of the modified deposition pattern 26, which is the resulting pattern obtained on the substrate 10 by depositing the pattern on the substrate 10 in the deposition process using the mask 22, is further shown. As shown in the exaggerated example, the modified deposition pattern 26 may deviate from the target deposition pattern 25 in such a way that one region of the modified deposition pattern 26 deviates in another direction and in a different size from the other regions. . Accordingly, this deflection of the modified deposition pattern 26 from the target deposition pattern 25 can be compensated for by simply aligning the substrate 10 to the mask 22 due to the in-plane and out-of-plane deformation of the mask 22. none.

[0026] Mask deformation can occur from a number of causes. For example, a change in temperature of the mask or part of the mask can cause thermal expansion of the mask or part of the mask. Thermal expansion of the mask 22 different from the mask frame 21 may cause the mask 22 to bend or ripple in an out-of-plane direction, ie, in the third direction 103, perpendicular to the mask 22.

[0027] A further cause of the mask deformation may be the support of the mask frame 21 on which the mask 22 is mounted. For example, clamping of the mask frame 21 against the mask carrier may cause non-uniform loads at the clamping points of the mask frame 21 to which the mask frame 21 is clamped. These non-uniform loads can cause deformation of the mask frame 21, which in turn can cause in-plane or out-of-plane deformation of the mask 22.

[0028] Another cause of deformation of the mask may be inherent deformations of the mask 22 due to the manufacturing process used to produce the mask 22 or the mask frame 21. For example, non-uniform material properties of the material used in the mask 22 may be caused by fine cracking of the material or heat generated in the material during the manufacturing process.

[0029] Another cause of mask deformation may be a change in orientation of the mask 22 from a horizontal orientation to a vertical orientation. For example, during the preparation of the mask 22 for use in the deposition apparatus, the mask frame 21 on which the mask 22 is mounted may be arranged on the mask carrier in a horizontal orientation, for example on a flat work surface. The mask carrier supporting the mask frame 21 can then be reoriented in a vertical orientation and inserted into the processing system. For example, due to the effects of gravity changing the directions between the horizontal and vertical orientations, the inherent tensions present in the mask 22 are no longer compensated for by the gravity acting in a direction perpendicular to the mask. Because of this, in-plane or out-of-plane deformation of the mask 22 can be caused.

[0030] 4 shows a schematic side view of a deposition apparatus 100 for depositing one or more layers on a substrate 10 in accordance with embodiments of the present disclosure. The deposition apparatus 100 carries a vacuum chamber 60, a transfer system 50 for transferring a mask carrier 23 configured to support the mask frame 21, wherein the mask frame 21 is mounted to the mask frame 21. Having a mask 22, and a plurality of first aligner devices 41 at least partially provided in the vacuum chamber 60, wherein the plurality of first aligner devices 41 are in contact with the mask carrier 23. And a aligner system 40 including a plurality of second aligner devices 42 at least partially provided within the vacuum chamber 60, wherein the plurality of second aligner devices 42 In contact with the mask frame 21.

[0031] Deposition apparatus 100 includes a vacuum chamber 60, where deposition of substrate 10 takes place. Vacuum chamber 60 may be provided, for example, with one or more vacuum pumps configured to maintain a vacuum environment within vacuum chamber 60. The vacuum environment may include a process gas maintained at a pressure lower than atmospheric pressure. Within the vacuum chamber 60 is provided a deposition source 30 configured to deposit material on the substrate 10 along the deposition path 32. Deposition source 30 may include, for example, an evaporation source, a sputter source, or any other material source suitable for depositing a layer of material on substrate 10.

[0032] The deposition apparatus 100 may further include a substrate aligner device 11. Substrate 10 may be supported directly or indirectly by substrate aligner device 11. For example, a substrate carrier may be provided to support the substrate 10, which is configured to be clamped by the substrate aligner device 11. The substrate aligner device 11 can include at least one actuator for accurately positioning the substrate 10 with respect to the mask 22.

[0033] The deposition apparatus 100 may further include a transfer system 50. In particular, the conveying system 50 may be configured to convey a mask carrier 23 configured to support the mask frame 21, which has a mask 22 mounted to the mask frame 21. . In the present disclosure, the conveying system 50 is provided in a conveying direction in which the mask frame 21 and the mask carrier 23 on which the mask 22 is mounted are oriented vertically and substantially parallel to the second direction 102. Arranged to be transported on the track. The transport system 50 can be configured for non-contact or contact transport. For example, the non-contact transfer system may include a track comprising a plurality of electromagnetic actuators configured to support the mask carrier 23 in the first direction 101 and to transport the mask carrier 23 in the second direction 102. Can be. Alternatively, the contact conveying system may comprise a track comprising a plurality of rollers configured to support the mask carrier 23 in the first direction 101 and to convey the mask carrier 23 in the second direction 102. have.

[0034] The transfer system 50 can be further configured to transfer the substrate 10. In particular, the transfer system 50 may be configured to transfer a substrate carrier configured to support the substrate 10. The transport system 50 may comprise additional tracks separate from the tracks configured to transport the mask carrier 23. In a manner similar to transferring the mask carrier 23, the transfer system 50 may include a substrate carrier configured to support a track or substrate 10 configured for non-contact or contact transfer of the substrate 10.

[0035] According to further embodiments, which may be combined with other embodiments described herein, a mask arrangement 200 is provided. As shown in FIG. 5, the mask arrangement 200 includes a mask carrier 23 or a mask support configured to support the mask frame 21, and the mask frame 21 is a mask mounted to the mask frame 21. (22), the mask carrier 23 or mask support is configured to be in contact with the plurality of first aligner devices 41, the mask frame 21 with the plurality of second aligner devices 42 Configured to contact.

[0036] The mask carrier 23 is configured to support the mask frame 21 on which the mask 22 is mounted. In particular, the mask carrier 23 is configured to support the mask frame 21 in a substantially vertical orientation. The mask carrier 23 may also be generally considered to be a mask support, ie the mask frame 21 on which the mask 22 is mounted is provided by a mask support configured to support the mask frame 21 in a substantially vertical orientation. Can be supported. The mask support may be included in the mask carrier 23 or may be an alternative element. One or more mask frame holders 24 provided on the mask carrier 23 or the mask support are configured to mount the mask frame 21 to the mask carrier 23 or the mask support. The one or more mask frame holders 24 may be contact points at which the mask frame 21 may rest on the mask carrier 23. For example, the lower edge of the mask frame 21 can be supported by point contact at one end and line contact at the other end. One or more mask frame holders 24 may comprise a groove, in which the mask frame 21 is supported. Alternatively, the one or more mask frame holders 24 may include protrusions on the mask carrier 23, such as pins that engage with corresponding holes of the mask frame 21, such that the mask frame 21 may have protrusions. Is put on.

[0037] Alternatively, the one or more mask frame holders 24 can reliably support the mask frame 21 by using, for example, permanent magnet elements, electromagnetic elements, threaded fasteners, or friction clamps. As illustratively shown in FIG. 5, four mask frame holders 24 are provided for securing the mask frame 21 at each corner of the mask frame 21.

[0038] The mask carrier 23 or mask support is configured to contact the plurality of first aligner devices 41. Thus, the mask carrier 23 or the mask support is further provided with at least one clamping interface. As illustratively shown in FIG. 5, the mask carrier 23 is provided with four clamping interfaces for contacting the plurality of first aligner devices 41 at each corner of the mask carrier 23. The at least one clamping interface may include, for example, the first aligner device 41 such that the plurality of first aligner devices 41 may maintain the mask carrier 23 or the mask support at a particular position. ) Or an area for clamping the mask support. The at least one clamping interface may be further configured to receive one or more alignment forces in at least one direction for coarse or fine alignment of the mask carrier 23. The at least one clamping interface can be, for example, a flat area, a hole or depression, or a protrusion configured to interface with the clamping device. The at least one clamping interface may comprise a ferromagnetic material configured to be clamped by the magnetic element.

[0039] The mask frame 21, on which the mask 22 is mounted, is configured to mask the substrate 10 to deposit one or more patterned material layers. The mask frame 21 may comprise a first horizontal element 21a, a second horizontal element 21b, a first vertical element 21c and a second vertical element 21d, where the first horizontal element 21a ), The second horizontal element 21b and the first vertical element 21c and the second vertical element 21d form a mask frame 21 provided with an opening therein. The mask 22 is mounted to the mask frame 21 such that the opening provided in the mask frame 21 is partially or completely covered. As discussed above with respect to FIG. 1, the mask 22 has a plurality of openings arranged to form a pattern such that material from the deposition source 30 can be selectively deposited in a pattern on the surface of the substrate 10. 22a may be provided.

[0040] Mask 22 and mask frame 21 may be made of materials having substantially the same coefficient of thermal expansion. For example, the mask 22 and the mask frame 21 may both be made of a material having a low coefficient of thermal expansion, such as invar. Matching the coefficients of thermal expansion of mask 22 and mask frame 21 reduces the effects of temperature variations that cause in-plane or out-of-plane deformation of mask 22.

[0041] The mask frame 21 is configured to contact the plurality of second aligner devices 42. Thus, the mask frame 21 is further provided with at least one manipulation interface. As exemplarily shown in FIG. 5, the first horizontal element 21a and the second horizontal element 21b are positioned approximately at the midpoints of the first horizontal element 21a and the second horizontal element 21b, respectively. Each operation interface is provided. The at least one manipulation interface is, for example, an area in which the second aligner device 42 clamps the mask frame 21 such that the plurality of second aligner devices 42 can manipulate the mask frame 21. Can be. The at least one manipulation interface can be configured to receive one or more manipulation forces in at least one direction such that the plurality of second aligner devices 42 are mask framed so that the substrate 10 can be accurately aligned with the mask 22. The elastic deformation of 21 can accurately compensate for in-plane or out-of-plane deformations of the mask 22. The at least one correction interface can be, for example, a flat area, a hole or depression, or a protrusion configured to interface with the clamping device. The at least one manipulation interface may comprise a ferromagnetic material configured to be clamped by the magnetic element.

[0042] According to further embodiments, a mask arrangement 200 is used to mask the substrate 10 in the deposition apparatus 100 of the embodiments described above.

[0043] Referring again to FIG. 4, the deposition apparatus 100 further includes an aligner system 40 in accordance with embodiments described herein. The aligner system 40 includes a plurality of first aligner devices 41 at least partially provided in the vacuum chamber 60, the plurality of first aligner devices 41 in contact with the mask carrier 23. And a plurality of second aligner devices 42 at least partially provided in the vacuum chamber 60, wherein the plurality of second aligner devices 42 are in contact with the mask frame 21.

[0044] In the present disclosure, a aligner device is a device that can maintain the position of an element, for example by clamping the element. The aligner device can also adjust the position of the element by translating or rotating the element. Moreover, the aligner device can manipulate the element by applying a load to the element, for example to elastically deform the element. Thus, in connection with the present disclosure, the aligner device may be considered as either a clamp, aligner or manipulator.

[0045] The first aligner devices 41 and the second aligner devices 42 may each comprise at least one of a group comprising at least one actuator and a clamping device. The first and second aligner devices 41, 42 may thus be configured for at least one of clamping the element, moving / aligning the element, or applying force to the element. The first and second aligner devices 41, 42 may each be of a substantially similar configuration suitably sized to position the mask carrier 23 or the mask support and to manipulate the mask frame 21.

[0046] To clamp an element such as mask carrier 32, mask support or mask frame 21, the first or second aligner devices 41, 42 may comprise a clamping device. The clamping device is configured to firmly attach the first aligner device 41 or the second aligner device 42 to the element to be clamped. The clamping device may comprise any one of a group comprising an electromagnetic element, a permanent magnet, a threaded fastener or a friction clamp. The clamping device may further comprise an interface corresponding to the alignment interface of the mask carrier 23, the mask support or the correction interface of the mask frame 21.

[0047] The clamping device can be configured to constrain the element clamped in at least one of the group comprising three linear directions and three rotational directions. For example, the clamping device can be configured to constrain the mask carrier 23, mask support or mask frame 21 in three linear directions and three rotation directions. Alternatively, the clamping device can be configured to constrain the mask carrier 23, the mask support or the mask frame 21 in only two linear directions and two rotation directions, such that the clamping device is in one linear direction and one in one. It allows free movement of the element (ie the sliding hinge) which is clamped in the direction of rotation of.

[0048] Accordingly, the plurality of first aligner devices 41 and / or the plurality of second aligner devices 42 may generate a subset of the aligner devices having a first number of degrees of freedom, and a second number of degrees of freedom. And a subset of aligner devices having the same. For example, a subset of the aligner devices having a first number of degrees of freedom may secure the element to be clamped, while a subset of the aligner devices having a second number of degrees of freedom may cause the element to be clamped in multiple directions. It can support the element while allowing it to move to. Such an arrangement may, for example, reduce the effects of alignment forces or fastening forces, or the effects of thermal expansion, which distort or deform the mask carrier 23 and / or the mask frame 21.

[0049] Alternatively, at least one clamping interface of the mask carrier 23 can be configured to allow movement in at least one direction. For example, the mask carrier 23 may include at least one clamping interface comprising a ferromagnetic plate that is allowed to slide in at least one direction within the mask carrier 23. As a further example, the at least one clamping interface of the mask carrier 23 can comprise a cylindrical element, which allows the at least one clamping interface to slide and / or rotate about the cylindrical element, for example as a hinge. It can be clamped by the first aligner devices 41 to make it.

[0050] At least one actuator may be provided in the first and second aligner devices 41, 42 to move / align the element or to force the element. At least one actuator is configured to move in one of three linear directions or in one of three rotation directions. Accordingly, the at least one actuator may be a linear actuator for force or translation in a linear direction, or a rotary actuator for torque or rotation in a rotational direction. The at least one actuator may comprise any one of a group comprising an electromagnetic actuator, a piezoelectric ceramic actuator, a pneumatic actuator or a hydraulic actuator. At least one actuator may be provided in the first and second aligner devices 41, 42 such that the actuator acts directly on the aligner device. Alternatively, at least one actuator can be provided in a position external to the first and second aligner devices 41, 42 such that the actuator can act on a lever, rod or shaft that connects the actuator to the aligner device. . When the actuator is provided at a position outside the aligner device, the actuator can be positioned outside or partially outside the vacuum chamber to reduce the effects of contamination or electromagnetic interference in the vacuum environment.

[0051] The aligner system may further be provided with at least one sensor configured to sense one or more parameters. At least one sensor may comprise at least one of a group comprising an optical sensor, a force sensor, a torque sensor, or a temperature sensor. At least one sensor may include a position of the substrate 10, a position of the mask carrier 32, a position of the mask frame 21, a misalignment between the mask 22 and the substrate 10, a temperature, or a position of the mask frame 21. It may be configured to measure at least one parameter from the group that includes the force or torque at the element.

[0052] According to some embodiments, which may be combined with other embodiments described herein, the plurality of first aligner devices 41 and the plurality of second aligner devices 42 may be vacuum chambers 60. It can be mounted on. Mounting the first and second aligner devices 41, 42 in the vacuum chamber 60, in particular on the inner wall of the vacuum chamber 60, may be achieved between the first and second aligner devices 41, 42. Make the connection short and have high strength. In addition, the relative positions of the first and second aligner devices 41, 42 can be maintained accurately.

[0053] Alternatively, the aligner system 40 may include a aligner support element 43 on which the plurality of first aligner devices 41 and the plurality of second aligner devices 42 are mounted. The aligner support element 43 allows the relative positions of the plurality of first aligner devices 41 and the plurality of second aligner devices 42 to be maintained accurately.

[0054] The aligner support element 43 can be mounted in the vacuum chamber 60, in particular in the inner wall of the vacuum chamber 60. When the transfer system 50 and deposition source 30 of the deposition system 100 are also mounted to the vacuum chamber 60, mounting the aligner support element 43 to the vacuum chamber 60 may be a plurality of firsts. Position relationships between the aligner devices 41, the plurality of second aligner devices 42, the deposition source 30 and the transfer system 50 can be maintained accurately.

[0055] Similar to the plurality of first and second aligner devices 41, 42, the substrate aligner device 11 may be mounted in the vacuum chamber 60. Alternatively, as exemplarily shown in FIG. 4, the substrate aligner device 11 may be mounted to the aligner support element 43. As with the first and second aligner devices 41, 42, mounting the substrate aligner device 11 to the vacuum chamber 60 may be achieved by using the substrate aligner device 11 and the first and second aligners. The connection between the devices 41, 42 is short and has a high strength, allowing the relative positions between them to be kept accurate. This allows the substrate aligner device 11 and thus the substrate 10 to be used as a fixed reference point for manipulating the mask frame 21 with the second aligner devices 42.

[0056] The plurality of first and second aligner devices 41, 42 may be configured to be movable relative to the transfer system 50 and / or the substrate 10. For example, the plurality of first and second aligner devices 41, 42 may be positioned at a home position away from the transfer system 50 while transferring the mask carrier 23 into the vacuum chamber 60. have. After the mask carrier 23 is transferred into the vacuum chamber 60, the plurality of first and second aligner devices 41, 42 may clamp the mask carrier 23 and / or the mask frame 21, respectively. The plurality of first and second aligner devices 41, 42 can be moved from the home position to the clamping position near the transfer system 50. This prevents a collision between the mask carrier 23 and the aligner system 40 to prevent damage to the mask 22 or other components of the deposition system 100. After clamping the mask carrier 23 and / or the mask frame 21, the plurality of first and second aligner devices 41, 42 may be configured to move further into the processing position, for example.

[0057] Likewise, when a plurality of first and second aligner devices 41, 42 are mounted to the aligner support element 43, the aligner support element 43 may be movable relative to the transport system 50. have. For example, the aligner support element 43 and thus the complete aligner system 40 may be positioned at the home position while transferring the mask carrier 23 into the vacuum chamber 60, and the plurality of first alignments. Clamping at the home position after transfer of the mask carrier 23 such that the devices 41 and / or the plurality of second aligner devices 42 can respectively clamp the mask carrier 23 and the mask frame 21. Can be moved to position. After clamping the mask carrier 23 and / or the mask frame 21, the aligner support element 43 can be configured to move further into the processing position, for example.

[0058] Referring again to FIG. 5, at least one second aligner device 42 of the plurality of second aligner devices 42 includes at least one actuator, and at least one actuator includes a mask frame 21. To exert strength. According to some embodiments, which can be combined with other embodiments described herein, the mask frame 21 defines a mask plane such that the mask frame 21 lies substantially coplanar with the mask plane, Is a force applied in a substantially vertical direction parallel to the mask plane, a force applied in a substantially horizontal direction parallel to the mask plane, a force applied in a direction substantially perpendicular to the mask plane, and about an axis substantially perpendicular to the mask plane. It includes at least one of the group consisting of the torque applied to.

[0059] To compensate for in-plane and out-of-plane deformations of the mask 22, exerting one or more forces using one or more actuators of the plurality of second aligner devices 42 causes the mask frame 21 to be manipulated, ie elastic To be deformed. Thus, accurate alignment of the substrate 10 with respect to the mask 22 can be achieved accurately and reliably.

[0060] As previously determined, the mask plane defined by the first direction 101 and the second direction 102 and the third direction 103 is a mask defined by the first direction 101 and the second direction 102. May be aligned substantially perpendicular to the plane. Thus, the force may be a force applied in the first direction 101, a force applied in the second direction 102, a force applied in the third direction 103, or about an axis substantially parallel to the third direction 103. It may be a torque applied to.

[0061] As exemplarily shown in FIG. 5, the plurality of second aligner devices 42 are each substantially mask frame 21 at the midpoint of the first horizontal element 21a and the second horizontal element 21b. And two second aligner devices 42 configured to be in contact with. The second aligner devices 42 apply the mask frame 21 by applying a force in the first direction 101, a force in the second direction 102, and torque about an axis parallel to the third direction 103. By way of example.

[0062] However, the present disclosure is not limited to manipulating the mask frame 21 at only two points. Rather, the present disclosure involves applying forces to any number of positions on the mask frame 21. For example, as exemplarily shown in FIG. 6, the plurality of second aligner devices 42 includes six second aligner devices 42, where two second aligner devices The fields 42 load two points along the first horizontal element 21a and the two second aligner devices 42 load two points along the second horizontal element 21b. And the two second aligner devices 42 apply a force substantially at the midpoint of the first vertical element 21c and the second vertical element 21d, respectively. Providing an increased number of second aligner devices 42 at various positions around the mask frame 21 allows finer and more accurate compensation of in-plane and out-of-plane deformations of the mask 22.

[0063] Referring now to FIG. 7, in accordance with a further embodiment of the present disclosure, a method 300 is provided for masking a substrate 10 in a vacuum chamber 60. The method 300 begins at block 301. The method comprises the steps of clamping a mask carrier 23 or a mask support for supporting the mask frame 21, the mask frame 21 having a mask 22 mounted to the mask frame 21-(block 302 )), Aligning the substrate 10 to the mask 22 (block 303), and leveling the mask 22 by applying at least one adjustment force to the mask frame 21 (block 304). ). The method 300 ends at block 305.

[0064] Clamping the mask carrier 23 or the mask support at block 302 includes contacting the clamping device to the mask carrier 23 or the mask support, and securely attaching the mask carrier 23 or the mask support to the clamping device. Actuating the clamping device if possible. The clamping device can be for example a clamping device of the first aligner device 41. The clamping device may comprise any one of a group comprising an electromagnetic element, a permanent magnet, a threaded fastener or a friction clamp. The clamping device may further comprise an interface corresponding to the clamping interface of the mask carrier 23 or the mask support. The clamping device may be configured to limit the element clamped in at least one direction of the group comprising three linear directions and three rotation directions.

[0065] Once the mask carrier 23 or mask support is clamped, the substrate 10 may be aligned with the mask 22. Aligning the substrate 10 with the mask 22 at block 303 includes actuating the at least one actuator in at least one direction to accurately position the substrate 10 relative to the mask 22. The at least one actuator can be, for example, an actuator of the substrate aligner device 11. The at least one actuator may comprise any one of a group comprising an electromagnetic actuator, a piezoelectric ceramic actuator, a pneumatic actuator or a hydraulic actuator. At least one actuator may translate the substrate 10 in any one of the first direction 101, the second direction 102, or the third direction 103, or substantially in the third direction 103. The substrate 10 may be rotated about a parallel axis.

[0066] In connection with the present disclosure, aligning the substrate 10 to the mask 22 may include moving the substrate 10, or moving a substrate carrier configured to support the substrate 10. . For example, substrate 10 may comprise a rigid glass substrate, may be transported without a substrate carrier, and may be clamped, positioned or manipulated directly by substrate aligner device 11. As a further example, the substrate 10 may be supported on the substrate carrier such that the substrate carrier is clamped, positioned or manipulated by the substrate aligner device 11.

[0067] In order to align the substrate 10 to the mask 22, the method 300 may further include sensing one or more parameters using at least one sensor. One or more parameters may be included in the group including the position of the substrate 10, the position of the mask carrier 32 or the mask support, the position of the mask frame 21, the temperature, or misalignment between the mask 22 and the substrate 10. It may include at least one. For example, the substrate 10 may include at least one substrate reference point, the mask 22 may include at least one mask reference point, and the one or more parameters may include at least one position of the at least one substrate reference point. The position error determined by comparing with the position of the mask reference point of may be included. One or more parameters sensed by the at least one sensor may be compared with a predetermined value or compared with other parameters measured by the at least one sensor, such that the substrate 10 is provided by the substrate aligner device 11. The necessary translation or rotation to be applied can be determined. At least one sensor and at least one actuator may be included in a feedback loop.

[0068] Sensing one or more parameters may be performed in-situ, for example, by using at least one sensor positioned within vacuum chamber 60. For example, in-situ sensing detects a position error determined by comparing parameters related to the alignment of the substrate 10 with respect to the mask 22, such as the position of at least one substrate reference point with the position of the at least one mask reference point. It may include doing. In addition, sensing of one or more parameters may be performed after the deposition is completed by using at least one sensor positioned downstream of the vacuum chamber 60, such that the parameter is placed in a feedback loop for aligning the next substrate 10 to be processed. Used. Furthermore, by using at least one sensor positioned upstream of the vacuum chamber 60, sensing of one or more parameters may be performed before deposition is completed, so that the feedforward loop for aligning the next substrate 10 to be processed is performed. The parameter is used. Sensing one or more parameters may include a combination of in-situ sensing, pre-deposition sensing and / or post-deposition sensing.

[0069] After the mask carrier 23 or mask support is clamped and the substrate 10 is aligned with the mask 22, any in-plane or out-of-plane deformation of the mask 22 may be compensated for so that the mask 22 is leveled. Leveling the mask 22 at block 304 includes applying at least one adjustment force to the mask frame 21. The at least one adjustment force is a force applied in the first direction 101, a force applied in the second direction 102, a force applied in the third direction 103, or about an axis parallel to the third direction 103. It may be a torque applied to. Applying at least one adjustment force to the mask frame 21 causes elastic deformation of the mask frame 21 so that in-plane or out-of-plane deformation of the mask 22 can be compensated for. Thus, the mask 22 is leveled and accurate alignment and positioning of the mask 22 relative to the substrate 10 can be achieved. The method 300 ends at block 305.

[0070] The leveling of the mask 22 may further comprise clamping the mask frame 21 and actuating at least one actuator.

[0071] Clamping the mask frame 21 includes contacting the clamping device to the mask frame 21, and actuating the clamping device such that the mask frame 21 is firmly attached to the clamping device. The clamping device can be, for example, a clamping device of the second aligner device 42. The clamping device may comprise any one of a group comprising an electromagnetic element, a permanent magnet, a threaded fastener or a friction clamp. The clamping device may further comprise an interface corresponding to the alignment interface of the mask carrier 23 or the mask support. The clamping device may be configured to limit the element clamped in at least one direction of the group comprising three linear directions and three rotation directions.

[0072] When the mask frame 21 is clamped, at least one actuator is actuated in at least one direction to exert at least one adjustment force on the mask frame 21. The at least one actuator can be, for example, an actuator of the second aligner device 42. The at least one actuator may comprise any one of a group comprising an electromagnetic actuator, a piezoelectric ceramic actuator, a pneumatic actuator or a hydraulic actuator. At least one actuator may exert a force on the mask frame 21 in any of the first direction 101, the second direction 102, or the third direction 103, or substantially in the third direction 103. Torque can be applied to the mask frame 21 around the parallel axis.

[0073] Applying at least one adjustment force to the mask frame 21 may further include sensing one or more parameters using at least one sensor. One or more parameters may be a position of the substrate 10, a position of the mask carrier 32 or mask support, a position of the mask frame 21, a misalignment between the mask 22 and the substrate 10, a temperature, or a mask frame 21. At least one of the group including the force or torque at the element of. One or more parameters sensed by the at least one sensor may be compared with a predetermined value or compared with other parameters measured by the at least one sensor to compensate for in-plane or out-of-plane deformation of the mask 22. The necessary force to be applied to the mask frame 21 can be determined. At least one sensor and at least one actuator may be included in a feedback loop.

[0074] Before clamping the mask carrier 23 or mask support at block 302, the method 300 may further include transferring the mask carrier 23 to the vacuum chamber 60 by operating the transfer system 50. Can be. The conveying of the mask carrier 23 may be carried out before the clamping of the mask carrier 23, for example by adjusting the position of the mask carrier 23 in the second direction 102, ie in the conveying direction, or the mask carrier 23. ) May further comprise an approximate positioning of the mask carrier 23 by adjusting the position of the mask carrier 23 in the first direction 101 by adjusting the void between the feed system 50 and the transfer system 50.

[0075] After the mask carrier 23 is positioned by the transfer system 50, the plurality of first and second aligner devices 41, 42 so that the mask carrier 23 and / or the mask frame 21 can be clamped. ) May move from the home position to the clamping position in the third direction 103. Alternatively, if the plurality of first and second aligner devices 41, 42 are mounted to the aligner support 23, the aligner support 23 may cause the entire aligner system 40 to be clamped in the home position. The mask carrier 23 and / or the mask frame 21 can be moved to be clamped.

[0076] After leveling the mask 22 at block 304, the method 300 may further include moving the substrate 10 from a home position to an alignment position. When the substrate 10 is in alignment with the mask 22 in block 303, the substrate 10 may be removed from the mask 10 to prevent damage to the substrate 10 or the mask 22 during the alignment process. 22) so that it is positioned in the third direction 103 so as not to contact it. After the mask 22 is leveled and the substrate 10 is aligned with the mask 22, the mask 22 contacts or adheres to the substrate 10 so that deposition can begin in the third direction 103 so that deposition can begin. ) May be further moved from the alignment position to the attachment position. This may be referred to as front contact deposition.

[0077] Embodiments also relate to apparatuses for performing the disclosed methods and include apparatus portions for performing each method aspect described. Such method aspects may be performed by a hardware component, by a computer programmed by appropriate software, by any combination of the two, or in any other manner.

[0078] According to some embodiments, which can be combined with other embodiments described herein, the first deposition apparatus is configured to deposit a first material, and the second deposition apparatus is configured to deposit a second material different from the first material. Configured to deposit. One or more deposition apparatuses of a deposition system, in particular a vacuum deposition system, may be provided in accordance with embodiments described herein.

[0079] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the present disclosure may be devised without departing from the basic scope thereof, and the scope of the present disclosure is set forth below. Determined by the claims of

Claims (15)

As a deposition apparatus 100 for depositing one or more layers on a substrate 10,
Vacuum chamber 60;
A conveying system 50 for conveying a mask carrier 23 configured to support a mask frame 21, the mask frame 21 having a mask 22 mounted to the mask frame 21; And
A aligner system 40,
The aligner system 40,
A plurality of first aligner devices 41 at least partially provided in the vacuum chamber 60, wherein the plurality of first aligner devices 41 are the mask carrier 23 or mask that supports the mask frame. In contact with the support; And
A plurality of second aligner devices 42 at least partially provided in the vacuum chamber 60,
The plurality of second aligner devices 42 are in contact with the mask frame 21,
Deposition apparatus 100 for depositing one or more layers on a substrate 10. According to claim 1,
The mask carrier 23 or the mask support for supporting the mask frame 21 in a substantially vertical orientation,
Deposition apparatus 100 for depositing one or more layers on a substrate 10. The method according to claim 1 or 2,
At least one first aligner device 41 of the plurality of first aligner devices 41 includes at least one first clamping device,
At least one second aligner device 42 of the plurality of second aligner devices 42 includes at least one second clamping device,
Deposition apparatus 100 for depositing one or more layers on a substrate 10. The method of claim 3, wherein
The at least one first clamping device clamps the mask carrier 23 or the mask support,
The at least one second clamping device clamps the mask frame 21,
Deposition apparatus 100 for depositing one or more layers on a substrate 10. The method according to claim 3 or 4,
Said at least one first and second clamping device comprising an electromagnetic clamp,
Deposition apparatus 100 for depositing one or more layers on a substrate 10. The method according to any one of claims 1 to 5,
At least one second aligner device 42 comprises at least one actuator,
The at least one actuator exerts a force on the mask frame 21,
Deposition apparatus 100 for depositing one or more layers on a substrate 10. The method of claim 6,
The mask frame (21) defines the mask plane such that the mask frame (21) lies substantially coplanar with the mask plane; And
The force is applied in a substantially vertical direction parallel to the mask plane, a force applied in a substantially horizontal direction parallel to the mask plane, a force applied in a direction substantially perpendicular to the mask plane, and the mask plane At least one of a group consisting of torque applied about a substantially perpendicular axis,
Deposition apparatus 100 for depositing one or more layers on a substrate 10. The method according to any one of claims 1 to 7,
The plurality of first aligner devices 41 and the plurality of second aligner devices 42 are mounted to the vacuum chamber 60,
Deposition apparatus 100 for depositing one or more layers on a substrate 10. The method according to any one of claims 1 to 7,
The aligner system 40 further includes a aligner support element 43,
The plurality of first aligner devices 41 and the plurality of second aligner devices 42 are mounted to the aligner support element 43,
Deposition apparatus 100 for depositing one or more layers on a substrate 10. As a mask arrangement 200 for masking a substrate 10 in a processing chamber,
A mask carrier 23 or mask support configured to support the mask frame 21,
The mask frame 21 has a mask 22 mounted to the mask frame 21,
The mask carrier 23 or mask support is configured to be in contact with the plurality of first aligner devices 41,
The mask frame 21 is configured to be in contact with a plurality of second aligner devices 42,
Mask arrangement 200 for masking substrate 10 in the processing chamber. Use of a mask arrangement (200) according to claim 10 for masking a substrate (10) in a deposition apparatus (100) according to any one of the preceding claims. As a method for masking a substrate 10 in a vacuum chamber 60,
Clamping a mask carrier 23 or mask support for supporting a mask frame 21, the mask frame 21 having a mask 22 mounted to the mask frame 21;
Aligning the substrate (10) with the mask (22); And
Leveling the mask 22 by applying at least one adjustment force to the mask frame 21,
A method for masking a substrate (10) in a vacuum chamber (60). The method of claim 12,
The mask carrier 23 or the mask support for supporting the mask frame 21 in a substantially vertical orientation,
A method for masking a substrate (10) in a vacuum chamber (60). The method according to claim 12 and 13,
Applying at least one adjustment force to the mask frame 21,
Clamping the mask frame (21); And
Comprising operating at least one actuator,
A method for masking a substrate (10) in a vacuum chamber (60). The method according to any one of claims 12 to 14,
The mask frame (21) defines the mask plane such that the mask frame (21) lies substantially coplanar with the mask plane; And
The at least one adjustment force is a force applied in a substantially vertical direction parallel to the mask plane, a force applied in a substantially horizontal direction parallel to the mask plane, a force applied in a direction substantially perpendicular to the mask plane, and the At least one of a group consisting of torque applied about an axis substantially perpendicular to the mask plane,
A method for masking a substrate (10) in a vacuum chamber (60).

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