KR102253563B1 - Method and apparatus for non-contact alignment - Google Patents

Abstract

The method includes contactlessly floating the substrate arrangement 210. The substrate arrangement 210 includes a substrate 10. This method includes the step of contactlessly floating the mask arrangement 220. The mask arrangement 220 includes a masking device 20 for masking the substrate 10. The method includes non-contact alignment of the substrate arrangement 210 and the mask arrangement 220 with respect to each other.

Description

Method and apparatus for non-contact alignment

[0001] Embodiments of the present disclosure relate to apparatus and methods for alignment of substrates and masks, and more particularly arrangements including large area substrates. More specifically, embodiments described herein relate to alignment of vertically oriented large area substrates and masking devices for their masking.

[0002] Several methods are known for depositing a material on a substrate. For example, the substrates may be coated by using an evaporation process, a physical vapor deposition (PVD) process, such as a sputtering process, a spraying process, or the like, or a chemical vapor deposition (CVD) process. This process can be performed in a processing chamber of a deposition apparatus in which the substrate to be coated is located. A deposition material is provided within the processing chamber. A plurality of materials such as small molecules, metals, oxides, nitrides and carbides can be used for deposition on the substrate. In addition, other processes such as etching, structuring, annealing, etc. may be performed in the processing chambers.

For example, coating processes may be considered for large area substrates, such as in display manufacturing technology. Coated substrates can be used in many applications and in many fields of technology. For example, the application may be organic light emitting diode (OLED) panels. Additional applications include insulating panels, microelectronics, such as semiconductor devices, substrates with thin film transistors (TFTs), color filters, and the like. OLEDs are solid state devices made up of thin films of (organic) molecules that produce light by the application of electricity. As an example, OLED displays can provide bright displays on electronic devices and can use reduced power compared to, for example, liquid crystal displays (LCDs). In the processing chamber, organic molecules are generated (eg, evaporated, sputtered or sprayed, etc.) and deposited as a layer on the substrates. The particles can deposit material at target locations on the substrate, for example, passing through a border or a mask with a specific pattern, such as forming an OLED pattern on the substrate.

[0004] The alignment of the substrate to the mask and the quality of the treated substrate, in particular the deposited layer, can be provided. For example, the alignment must be accurate and stable to get good process results. Systems used for alignment of substrates and masks can be susceptible to external interferences such as vibrations. In addition, systems for alignment can increase the cost of ownership.

In view of the above, there is a need for apparatus and methods that can provide improved alignment of substrates or masks during a layer deposition process.

According to one embodiment, a method is provided. The method includes the step of contactlessly floating the substrate arrangement. The substrate arrangement includes a substrate. The method includes the step of contactlessly floating the mask arrangement. The mask arrangement includes a masking device for masking the substrate. The method includes non-contact alignment of the substrate arrangement and the mask arrangement with respect to each other.

According to another embodiment, a method is provided. The method includes the step of contactlessly floating the first arrangement. The first arrangement is one of a substrate arrangement including a substrate and a mask arrangement including a masking device. The method includes contactlessly aligning the first arrangement with an alignment precision of 500 μm or less.

According to another embodiment, an apparatus is provided. The device includes a magnetic levitation system comprising a plurality of magnetic units. The plurality of magnetic units are configured to non-contactly float a substrate arrangement including a substrate and a mask arrangement including a masking device. The apparatus is configured to non-contact alignment of the substrate arrangement and the mask arrangement with respect to each other.

According to another embodiment, an apparatus is provided. The apparatus includes a magnetic levitation system comprising a plurality of magnetic units configured to non-contactly float at least one of a substrate arrangement comprising a substrate and a mask arrangement comprising a masking device. The device includes a first position sensor connected to a first of the plurality of magnetic units. The first position sensor is configured to measure the position with an accuracy of 1 μm or less.

According to another embodiment, an apparatus is provided. The device comprises a plurality of magnetic units including at least a first magnetic unit and a second magnetic unit. The plurality of magnetic units are configured to non-contactly float at least one of a substrate arrangement including a substrate and a mask arrangement including a masking device. The device comprises a first position sensor connected to a first magnetic unit. The first position sensor is configured to measure the position with a first precision. The device includes a second position sensor connected to the second magnetic unit, the second position sensor being configured to measure the position with a second precision. The second precision is different from the first precision.

[0011] In such a way that the above-listed features of the present disclosure may be understood in detail, a more specific description of the present disclosure briefly summarized above may be made with reference to embodiments. The accompanying drawings relate to embodiments of the present disclosure and are described in the following.
1 illustrates a deposition process for fabricating OLEDs on a substrate.
2 illustrates a deposition process in which a substrate is masked by a masking device.
3 shows an example of a mask arrangement described herein in a side view.
4 shows an example of a substrate arrangement described herein in a side view.
5 shows an example of a mask arrangement described herein in a front view.
6 shows an example of a substrate arrangement described herein in a front view.
7A-7B illustrate a method according to embodiments described herein.
8 shows a substrate arrangement and a mask arrangement connected to each other.
9 shows an example of a plurality of magnetic units described herein.
10A-10B illustrate a non-contact vertical alignment of an arrangement described herein.
11A-11B illustrate the non-contact angular alignment of the arrangement described herein.
12A-12B illustrate a non-contact horizontal alignment of an arrangement described herein.
13A-13C illustrate a method according to embodiments described herein, involving a support structure.
14 shows an example of a control unit described herein.
15 shows an apparatus including a first position sensor according to embodiments described herein.
16A-16B illustrate an apparatus including a first position sensor and a second position sensor according to embodiments described herein.
17A-17B illustrate an apparatus according to embodiments described herein.

[0012] Reference will now be made in detail to various embodiments of the present disclosure, and one or more examples of various embodiments are illustrated in the drawings. Within the following description of the drawings, like reference numbers refer to like components. Only differences relating to the individual embodiments are described. Each example is provided as a description of the disclosure and is not to be considered a limitation of the disclosure. In addition, features illustrated or described as part of an embodiment may be used with respect to or in conjunction with other embodiments to result in further further embodiments. The description is intended to include such modifications and variations.

In the present disclosure, the term of substantially parallel directions may include directions forming small angles of at most 10 degrees or even at most 15 degrees to each other. The terms of substantially perpendicular directions may include directions forming an angle of less than 90 degrees to each other, such as at least 80 degrees or at least 75 degrees. Similar considerations apply to concepts such as axes, planes, regions, orientations, etc. that are substantially parallel or perpendicular.

[0014] Some embodiments described herein involve concepts such as a direction, plane, orientation, etc. that are substantially vertical. A direction substantially perpendicular is considered a direction substantially parallel to the direction of gravity. The substantially vertical direction can deviate from the exact vertical (the vertical is determined by gravity), for example by an angle of up to 15 degrees. For example, the y direction described herein (indicated by “Y” in the drawings) is a substantially vertical direction.

[0015] The embodiments described herein may further involve concepts such as a substantially horizontal direction, a plane, and an orientation. It should be understood that a substantially horizontal direction is distinct from a substantially vertical direction. The substantially horizontal direction may be substantially perpendicular to the exact vertical direction determined by gravity. For example, the x and z directions described herein (indicated by “X” and “Z” in the drawings) are substantially horizontal directions.

[0016] Embodiments described herein relate to non-contact floating, transport and/or alignment of an arrangement such as a substrate arrangement and/or a mask arrangement. The term "non-contact" as used throughout the present disclosure may be understood to mean that the weight of the arrangement is held by magnetic forces, not by mechanical contact or mechanical forces. Specifically, the arrangement is maintained in a floating or floating state using magnetic forces instead of mechanical forces. For example, the devices described herein may not have mechanical means, such as machine rails, to support the weight of the arrangement. In some implementations, there may be no mechanical contact between the arrangement and the rest of the device during the rise of the arrangement in the system and, for example, in motion.

[0017] Non-contact floating, transfer and/or alignment according to the embodiments described herein is between an arrangement, such as a substrate arrangement or a mask arrangement, and sections of the device, such as machine rails during transfer or alignment of the arrangement. It is advantageous in that no particles are generated due to mechanical contact. Accordingly, embodiments described herein provide improved purity and uniformity of layers deposited on a substrate, since particle generation is minimized, particularly when using non-contact flotation, transport and/or alignment.

[0018] An additional advantage compared to mechanical means for guiding an arrangement, such as a substrate arrangement or a mask arrangement, for example, is that the embodiments described herein do not suffer from friction affecting the linearity and/or precision of the movement of the arrangement. Is not. Non-contact floating, transport, and alignment of the substrate arrangement and the mask arrangement according to the embodiments described herein enable frictionless movement, where the alignment of the substrate with respect to the mask can be controlled and maintained with high precision. In addition, the levitating allows rapid acceleration or deceleration of the speed of the arrangement and/or fine adjustment of the speed of the arrangement.

In addition, the material of the machine rails undergoes deformations that may be caused by temperature, use, wear, etc., typically by evacuation of the chamber. These variations affect the location of the carrier assembly and thus the quality of the deposited layers. In contrast, the embodiments described herein enable compensation for potential deformations present, for example, in the guiding structure described herein. In terms of the non-contact manner in which the arrangements are floated and transported, the embodiments described herein enable non-contact alignment. Accordingly, improved and/or more efficient alignment of the substrate relative to the mask may be provided.

[0020] According to embodiments that may be combined with other embodiments described herein, the apparatus described herein may be substantially perpendicular to the direction, such as along the y direction and/or one or more substantially It is configured for non-contact translation of the substrate arrangement and/or the mask arrangement along horizontal directions, for example the x direction.

[0021] The embodiments described herein may be used to process, such as coat, large area substrates, such as for display manufacturing. The substrates or substrate receiving regions on which the devices and methods described herein are provided may be large area substrates. For example, a large-area substrate or carrier is GEN 4.5 corresponding to about 0.67m2 substrates (0.73m × 0.92m), GEN 5 corresponding to about 1.4m2 substrates (1.1m × 1.3m), about 4.29m2 substrate GEN 7.5 corresponding to the field (1.95m × 2.2m), GEN 8.5 corresponding to about 5.7m2 substrates (2.2m × 2.5m), or even GEN corresponding to about 8.7m2 substrates (2.85m × 3.05m) May be 10. Even larger generations, such as GEN 11 and GEN 12 and the corresponding substrate areas, can be similarly implemented.

The substrate 10 described herein may be a large-area substrate. The masking device 20 described herein may be configured to mask a large area substrate.

[0023] The term "substrate" as used herein may in particular include substantially inflexible substrates, such as transparent crystal slices such as a wafer, sapphire, or the like, or a glass plate. However, the present disclosure is not limited thereto, and the term “substrate” may include flexible substrates such as a web or foil. The term “substantially not flexible” is understood to be distinct from “flexible”. Specifically, a substantially non-flexible substrate, such as a glass plate having a thickness of 0.5 mm or less, may have a certain degree of flexibility, and the flexibility of the substantially non-flexible substrate is compared with the flexible substrates. small.

[0024] The substrate can be made of any material suitable for material deposition. For example, the substrate may be glass (e.g., soda lime glass, borosilicate glass, etc.), metal, polymer, ceramic, compound materials, carbon fiber materials, metal or any other material or combination of materials that may be coated by a deposition process. It can be made of a material selected from the group consisting of.

1 shows a schematic diagram of a deposition process for manufacturing OLEDs on a substrate 10.

In order to manufacture OLEDs, organic molecules are generated (eg, evaporated, sputtered, sprayed, etc.) by the deposition source 30 and deposited on the substrate 10. A masking device 20, such as a shadow mask, is positioned between the substrate 10 and the deposition source 30. The masking device 20 may have a specific pattern provided by, for example, a plurality of openings or holes 23, such that organic molecules pass through the openings or holes 23 (e.g., along the path 32). Thus, a layer or film of an organic compound is deposited on the substrate 10. A plurality of layers or films are deposited on the substrate 10 using different masking devices or different positions of the masking device 20 relative to the substrate 10 to create pixels with different color characteristics, for example. can do. For example, a first layer or film may be deposited to generate red pixels 34, a second layer or film may be deposited to generate green pixels 36, and a third layer or film may be deposited to generate blue Pixels 38 can be created. A layer(s) or film(s), such as an organic semiconductor, may be disposed between two electrodes, such as an anode and a cathode (not shown). At least one of the two electrodes may be transparent.

[0027] The substrate 10 and masking device 20 may be disposed in a substantially vertical orientation during the deposition process. In FIG. 1, arrows indicate a vertical Y direction, a horizontal X direction, and a horizontal Z direction.

2 illustrates the deposition process. Material is emitted towards the substrate 10 by the deposition source 250 to coat the substrate 10. During the deposition process, the substrate 10 is masked by a masking device 20, such as a shadow mask, to form a pattern on the substrate 10.

2 shows the substrate arrangement 210 and the mask arrangement 220 in a side view. The substrate arrangement 210 includes a substrate 10. The mask arrangement 220 includes a masking device 20. 2, the substrate arrangement 210 may include a substrate carrier 215. The substrate 10 is supported by a substrate carrier 215. 2, the mask arrangement 220 may include a mask carrier 225. The masking device 20 is supported by a mask carrier 225.

The substrate arrangement 210 and the mask arrangement 220 shown in FIG. 2 are connected to each other. For example, the substrate carrier 215 and the mask carrier 225 may be attached to each other by a clamping device (not shown) or other attachment devices. Having the substrate arrangement 210 and the mask arrangement 220 attached to each other ensures that the masking device 20 remains in a fixed position relative to the substrate 10 during the deposition process. The fixed position of the masking device 20 relative to the substrate 10 can provide a high quality and high precision patterned layer.

3 shows a mask arrangement 220 in a side view.

4 shows the substrate arrangement 210 in a side view.

5 shows a mask arrangement 220 in a front view.

6 shows the substrate arrangement 210 in a front view.

[0035] Before the substrate arrangement 210 and the mask arrangement 220 are connected to each other for the deposition process, the mask arrangement 220 to ensure that the masking device 20 is in a well-aligned position with respect to the substrate 10 Alignment of the and the substrate arrangement 210 with each other may be performed.

7A-7B illustrate a method according to embodiments described herein. 7A shows an apparatus 701 comprising a plurality of magnetic units 700. As shown, the plurality of magnetic units 700 may include one or more first magnetic units 710 and/or one or more second magnetic units 720. The apparatus 701 shown in FIGS. 7A-7B includes a substrate arrangement 210 and a mask arrangement 220. The substrate arrangement 210 may be non-contactly floated by a plurality of magnetic units, in particular by one or more first magnetic units 710. One or more first magnetic units 710 may provide a magnetic levitation force acting on the substrate arrangement 210. The mask arrangement 220 is floated contactlessly by a plurality of magnetic units 700, in particular by one or more second magnetic units 720. One or more second magnetic units 720 may provide a magnetic levitation force acting on the mask arrangement 220.

7A shows a configuration in which misalignment exists between the mask arrangement 220 and the substrate arrangement 210. For example, as indicated by vertical offsets 752 and 754 between the mask arrangement 220 and the substrate arrangement 210 in FIG. 7A, misalignment may exist in the vertical direction.

By controlling the magnetic levitation force or magnetic levitation forces provided by the plurality of magnetic units 700, the position of the substrate arrangement 210, such as a vertical or angular position, can be controlled and/or adjusted in a non-contact manner. For example, by controlling one or more of the first magnetic units 710, the substrate arrangement 210 may be provided at a target position during non-contact floating. 7B shows the substrate arrangement 210 provided at the target position. Compared with the substrate arrangement 210 shown in FIG. 7A, the substrate arrangement 210 shown in FIG. 7B has been moved, for example, in a vertical direction to align the substrate arrangement 210.

Additionally or alternatively, by controlling the magnetic levitation or magnetic levitation forces provided by the plurality of magnetic units 700, the position of the mask arrangement 220, such as a vertical or angular position, is controlled in a non-contact manner and /Or can be adjusted. For example, by controlling one or more of the second magnetic units 720, the mask arrangement 220 can be provided at the target position during non-contact floating. 7B shows a mask arrangement 220 provided at a target position. Compared with the mask arrangement 220 shown in FIG. 7A, the mask arrangement 220 shown in FIG. 7B has been moved, for example, in a vertical direction to align the mask arrangement 220.

As shown in FIG. 7B, by controlling the plurality of magnetic units 700, the substrate arrangement 210 and the mask arrangement 220 may be aligned with each other. Alignment is a non-contact alignment. For example, as shown in FIG. 7B, by controlling the magnetic levitation forces acting on the mask arrangement 220 and the substrate arrangement 210, the upper part of the substrate carrier 215 and the upper part of the mask carrier 225 are respectively referenced. It may be aligned non-contact with the shaft 762. Similarly, the lower portion of the substrate carrier 215 and the lower portion of the mask carrier 225 may be aligned with the reference axis 764, respectively. The substrate arrangement 210 and the mask arrangement 220 shown in FIG. 7B are well aligned with each other. Taking this into account, the substrate 10 and the masking device 20 are well aligned with each other. Alignment can only be provided in a non-contact manner.

7A-7B, before and/or during non-contact alignment, the substrate arrangement 210 is separated from the mask arrangement 220. There may be no mechanical contact between the mask arrangement 220 and the substrate arrangement 210 during non-contact alignment.

In the embodiment illustrated in FIGS. 7A-7B, both the substrate arrangement 210 and the mask arrangement 220 are displaced to align the substrate arrangement 210 and the mask arrangement 220 with respect to each other. Alternatively, a contactless alignment may be provided by non-contactly adjusting only the position of the mask arrangement 220 while keeping the position of the substrate arrangement 210 constant, or vice versa.

After aligning the substrate arrangement 210 and the mask arrangement 220 in a non-contact manner with respect to each other, the substrate arrangement 210 or the mask arrangement 220, or both the substrate arrangement 210 and the mask arrangement 220 Both arrangements can be moved to connect each other.

8 shows the configuration of the arrangements after the substrate arrangement 210 and the mask arrangement 220 are non-contactly aligned according to the procedure illustrated in FIGS. 7A-7B, for example. 8 shows the substrate arrangement 210 connected to the mask arrangement 220 by, for example, a clamping device (not shown). The substrate arrangement 210 and the mask arrangement 220 may be connected to each other to fix the relative position of the masking device 20 with respect to the substrate 10 for a deposition process.

When compared with FIG. 7B, the alignment of the substrate arrangement 210 and the mask arrangement 220 shown in FIG. 8 with respect to each other was substantially unchanged. As shown, the substrate arrangement 210 and the mask arrangement 220 shown in FIG. 8 are well aligned with each other.

[0046] The movement of both the substrate arrangement 210 or the mask arrangement 220, or the substrate arrangement 210 and the mask arrangement 220 is abbreviated herein as a connection movement, where the substrate arrangement 210 and the mask The two arrangements are provided in adjacent positions with respect to each other in order to allow all of the arrangements 220 to be connected to each other. The connection movement may be a movement of the substrate arrangement 210 and/or the mask arrangement 220 in a substantially horizontal direction, for example, in the z direction shown in the drawings. The connection movement can be provided by a mechanical device, for example a support structure according to the embodiments described herein.

The connection movement for connecting the mask arrangement 220 to the substrate arrangement 210 may not form part of the alignment of the substrate arrangement 210 and the mask arrangement 220 with each other. During the connection movement, the alignment of the masking device 20 with respect to the substrate 10 may not change. For example, the vertical position and/or the angular position of the substrate arrangement 210 and/or the mask arrangement 220 may be maintained substantially constant during the connection movement. During the connection movement, the substrate arrangement 210 and the mask arrangement 220 can continue to be well aligned with each other. Only the horizontal position of the substrate arrangement 210 and/or the mask arrangement 220 along the z direction may be changed during the connection movement.

9 shows an example of a plurality of magnetic units 700 in a plan view. 9, the plurality of magnetic units 700 may include one or more first magnetic units 710. Individual magnetic units of one or more first magnetic units 710 are denoted by reference numeral 915. One or more of the first magnetic units 710 may be a linear array of magnetic units extending in a substantially horizontal direction, such as the x direction.

As shown in FIG. 9, the plurality of magnetic units 700 may include one or more second magnetic units 720. Individual magnetic units of one or more second magnetic units 720 are denoted by reference numeral 925. One or more second magnetic units 720 may be a linear array of magnetic units that may be parallel to one or more first magnetic units 710. One or more second magnetic units 720 may face one or more first magnetic units 710.

[0050] For example, one or more first magnetic units 710 described herein may be configured to non-contactly float the substrate arrangement 210, and one or more described herein The second magnetic units 720 may be configured to float the mask arrangement 220 in a non-contact manner, or vice versa. During non-contact floating, the substrate arrangement 210 may face the mask arrangement 220.

9 shows a plurality of position sensors 1450 connected to a plurality of magnetic units 700. The plurality of position sensors 1450 may include one or more first position sensors 950 and/or one or more second position sensors 960. Individual position sensors of one or more first position sensors 950 are denoted by reference numeral 955 in FIG. 9. Individual position sensors of one or more second position sensors 960 are denoted by reference numeral 965 in FIG. 9.

As shown in FIG. 9, one or more first position sensors 950 may be connected to one or more first magnetic units 710. One or more of the first position sensors 950 may be configured to measure the position of the substrate arrangement during non-contact floating. Based on the position data measured by one or more first position sensors 950, non-contact floating, alignment and/or transport of the substrate arrangement may be controlled.

As shown in FIG. 9, one or more second position sensors 960 may be connected to one or more second magnetic units 720. One or more second position sensors 960 may be configured to measure the position of the mask arrangement during a non-contact injury. Based on the position data measured by one or more second position sensors 960, the non-contact floating, alignment and/or transport of the mask arrangement may be controlled.

According to one embodiment, a method is provided. This method includes the step of contactlessly floating the substrate arrangement 210. The substrate arrangement 210 includes a substrate 10. This method includes the step of contactlessly floating the mask arrangement 220. The mask arrangement 220 includes a masking device 20 for masking the substrate 10. The method includes non-contact alignment of the substrate arrangement 210 and the mask arrangement 220 with respect to each other.

As described herein, an alignment that is non-contact may be understood as an alignment provided without contacting the substrate arrangement 210 or mask arrangement 220. Non-contact alignment may be understood to mean that mechanical alignment devices in contact with the substrate arrangement 210 or mask arrangement 220 are not used to provide their alignment. Contactless alignment may be provided by non-contact forces, more specifically magnetic forces, and more specifically magnetic levitation forces acting on the substrate arrangement 210 and/or on the mask arrangement.

[0056] The non-contact alignment of the substrate arrangement 210 and the mask arrangement 220 with respect to each other described herein is a relative alignment. For example, the non-contact alignment described herein can be provided by displacing only the substrate arrangement 210 within the processing chamber while holding the mask arrangement stationary, or vice versa. In other situations, providing contactless alignment may include displacing both the substrate arrangement 210 and the mask arrangement 220 within the processing chamber to their respective target positions.

[0057] Providing a non-contact alignment of the substrate arrangement 210 and the mask arrangement 220 to each other includes: controlling or adjusting the position of the substrate arrangement 210; Controlling or adjusting the position of the mask arrangement 220; Or it may include at least one of a combination of these.

For example, as illustrated in FIGS. 13A-13C, providing a non-contact alignment of the substrate arrangement 210 and the mask arrangement 220 to each other may include at least one of the following: a substrate Aligning the arrangement 210 with respect to the support structure 1300, eg, displacing the substrate arrangement 210 so that the substrate arrangement 210 is positioned at a target position with respect to the support structure 1300; Aligning the mask arrangement 220 with respect to the support structure 1300, eg, displacing the mask arrangement 220 to position the mask arrangement 220 in a target position with respect to the support structure 1300; And a combination of them. For example, the substrate arrangement 210 may be aligned with one or more first fastening elements 1310 of the support structure 1300. The mask arrangement 220 may be aligned with respect to one or more second fastening elements 1320 of the support structure 1300. The support structure 1300 may be in a fixed position within the processing chamber.

The non-contact alignment of the substrate arrangement 210 and the mask arrangement 220 described herein ensures that the masking device 20 is aligned with the substrate 10.

[0060] The methods and apparatuses described herein can provide a non-contact alignment of a mask arrangement and/or a substrate arrangement with high precision. According to embodiments that can be combined with other embodiments described herein, an alignment precision of 500 μm or less, more specifically 100 μm or less, or even 20 μm or less may be provided. have.

For example, in some implementations, the positional repeatability of a stationary single carrier may be 100 μm or less or even 20 μm or less.

An alignment precision of 500 μm may be sufficient for successful clamping of the substrate arrangement and the mask arrangement. For example, an alignment precision of 500 μm is as described herein, for one or more first receptacles and one or more second receptacles, one or more first fastening elements and It may be sufficient to accurately position one or more second fastening elements.

According to some embodiments described herein, the influence of temperature drift may be reduced. For example, by using the central controller described herein and/or by including several high-precision sensors described herein, the effects of temperature drift can be reduced or even extinguished, so that alignment accuracy can be improved even further. have. Accordingly, a non-contact alignment accuracy much higher than 20 μm can be provided, such as an alignment accuracy of 5 μm or less, more specifically 1 μm or less, or even 0.1 μm or less.

[0064] The high non-contact alignment accuracy provided according to the embodiments described herein can be obtained by performing high-precision position measurements of the substrate arrangement and/or the mask arrangement during non-contact floating. High precision position measurements can be performed by the position sensors described herein, having a position sensor precision of 1 μm or less, specifically 0.5 μm or less, more specifically 0.1 μm or less. Based on these high-precision position measurements, the position of the substrate arrangement and/or the mask arrangement during non-contact floating can be controlled with high precision, so that high-precision non-contact alignment thereof can be provided.

[0065] In view of the high-precision non-contact alignment provided according to the embodiments described herein, a masking device 20, for example, a shadow mask for providing a pattern with a plurality of very small features on the substrate 10, is It can be accurately aligned with respect to the substrate 10 only by non-contact forces. Apart from the non-contact alignment of the substrate arrangement 210 and the mask arrangement 220 provided according to the embodiments described herein, additional mechanical alignment is required to align the substrate arrangement 210 and the mask arrangement 220 I can't. The alignment of the substrate arrangement 210 and the mask arrangement 220 provided by the embodiments described herein may be provided only in a non-contact manner.

Since no mechanical alignment devices other than contactless alignment are required, the embodiments described herein provide the advantage that the entire alignment procedure can be provided in a simplified time saving and cost saving manner.

Additionally, an alignment method involving additional mechanical fine alignment by a mechanical alignment device is more susceptible to errors and disturbances. After the initial non-contact alignment, the non-contact floating substrate arrangement and mask arrangement can be transferred to a mechanical alignment device to perform its fine alignment. This delivery procedure can be complex, time consuming, and susceptible to errors and failures. In the worst case, the transfer of the non-contact floating substrate arrangement and mask arrangement to the mechanical alignment device may fail, causing the substrate arrangement or mask arrangement to fall and be damaged. Complex monitoring systems may be required to avoid these errors. In contrast, embodiments described herein provide a high-precision, non-contact alignment that makes it possible to perform the entire alignment procedure in a non-contact manner, providing the advantage that complex and dangerous transfers to the mechanical alignment device can be eliminated. to provide.

[0068] The substrate arrangement 210 described herein may be floated non-contact and/or may be aligned in a vertical or substantially vertical orientation. The substrate arrangement 210 may define a plane. During non-contact floating and/or alignment, this plane may be provided in a vertical or substantially vertical orientation.

[0069] The mask arrangement 220 described herein may be floated non-contact and/or may be aligned in a vertical or substantially vertical orientation. The mask arrangement 220 may define a plane. During non-contact floating and/or alignment, this plane may be provided in a vertical or substantially vertical orientation.

The method described herein may include measuring the position of the substrate arrangement 210 using one or more first position sensors 950 as described herein. Each of the one or more first position sensors 950 may be a high precision position sensor as described herein. Each position sensor of the one or more first position sensors 950 may have a position sensor precision of 1 μm or less, specifically 0.5 μm or less, more specifically 0.1 μm or less. .

[0071] The methods described herein may include measuring the position of the mask arrangement 220 using one or more second position sensors 960 as described herein. Each of the one or more second position sensors 960 may be a high precision position sensor as described herein. Each position sensor of one or more second position sensors 960 may have a position sensor precision of 1 μm or less, specifically 0.5 μm or less, more specifically 0.1 μm or less. .

[0072] Measuring the position of the substrate arrangement 210 and/or the position of the mask arrangement 220 may include measuring a vertical position of the substrate arrangement 210 and/or the mask arrangement 220 have. Measuring the position may include measuring a distance, particularly a vertical distance, such as a distance from the position sensor to the substrate arrangement 210 and/or the mask arrangement 220.

[0073] Measuring the position of the substrate arrangement 210 may include measuring a plurality of distances, such as vertical distances, such as, for example, 2, 3, 4, 5, 6 or even more distances. It may include steps. The plurality of distances to the substrate arrangement 210 may be measured by the plurality of position sensors 1450 described herein, in particular one or more first position sensors 950 described herein.

[0074] Measuring the position of the mask arrangement 220 includes measuring a plurality of distances, such as vertical distances, such as, for example, 2, 3, 4, 5, 6 or even more distances. It may include steps. The plurality of distances to the mask arrangement 220 may be measured by the plurality of position sensors 1450 described herein, in particular one or more second position sensors 960 described herein.

While the substrate arrangement 210 and/or the mask arrangement 220 is floating in a non-contact manner, the position of the substrate arrangement 210 may be measured. While the substrate arrangement 210 and/or the mask arrangement is floating in a non-contact manner, the position of the mask arrangement 220 may be measured. Providing a non-contact alignment of the substrate arrangement 210 and/or of the mask arrangement 220 may be based at least on the measured position of the substrate arrangement 210 and/or of the mask arrangement 220.

[0076] The methods described herein may include controlling and/or adjusting at least one magnetic levitation force acting on the substrate arrangement 210 to provide contactless alignment as described herein. . The method may include controlling and/or adjusting a plurality of magnetic levitation forces acting on the substrate arrangement 210 to provide contactless alignment. For example, two, three, or even more magnetic levitation forces cooperatively acting on the substrate arrangement 210 may be controlled and/or adjusted to provide a non-contact alignment.

[0077] Additionally or alternatively, the method described herein controls and/or adjusts at least one magnetic levitation force acting on the mask arrangement 220 to provide a contactless alignment as described herein. It may include steps. The method may include controlling and/or adjusting a plurality of magnetic levitation forces acting on the mask arrangement 220 to provide contactless alignment. For example, two, three, or even more magnetic levitation forces acting in concert on the mask arrangement 220 may be controlled and/or adjusted to provide a non-contact alignment.

[0078] The substrate arrangement 210 described herein may include a carrier, such as the substrate carrier 215 shown in the figures. The substrate 10 may be supported by a carrier. The carrier can define a plane. The carrier may include a substrate receiving surface. The carrier may be a substrate carrier. The carrier may include one or more first receiving portions 1312 of the substrate arrangement 210 as described herein. The substrate arrangement 210 may be a substrate carrier assembly including a substrate 10 and a carrier supporting the substrate 10.

[0079] The substrate arrangement 210 described herein may include one or more passive magnetic units, such as one or more bars made of a ferromagnetic material. For example, one or more passive magnetic units may be connected or attached to the substrate carrier. The magnetic levitation force acting on the substrate arrangement 210 is caused by the interaction between the magnetic field provided by the plurality of magnetic units 700 and the magnetic properties of one or more passive magnetic units included in the substrate arrangement 210. Can be provided by Interaction may provide magnetic attraction between the plurality of magnetic units 700 and one or more passive magnetic units. The magnetic attraction provides an upward force, that is, a magnetic levitation force acting on the substrate arrangement 210.

[0080] The mask arrangement 220 described herein may include a carrier, such as the mask carrier 225 shown in the figures. The masking device 20 may be supported by a carrier. The carrier can define a plane. The carrier may provide a mask receiving area. The carrier may be a mask carrier. The carrier may include one or more second receiving portions 1322 of the mask arrangement 220 as described herein. The mask arrangement 220 may be a mask carrier assembly including a masking device 20 and a carrier supporting the masking device 20. The mask arrangement may include a mask support, such as a mask frame. The masking device 20 may be supported by a mask support. The mask support may be supported by a carrier.

Similar to the substrate arrangement 210, the mask arrangement 220 may include one or more passive magnetic units, such as one or more bars made of a ferromagnetic material. For example, one or more passive magnetic units may be connected or attached to the mask carrier. The magnetic levitation force acting on the mask arrangement 220 depends on the interaction between the magnetic field provided by the plurality of magnetic units 700 and the magnetic properties of one or more passive magnetic units included in the mask arrangement 220. Can be provided by

[0082] The masking device 20 described herein may include a plurality of openings. The masking device 20 may be configured to provide a pattern on the substrate 10. The pattern can include a plurality of features. The masking device 20 may be configured to provide a plurality of pixels on the substrate 10. The masking device 20 may be a shadow mask. The masking device 20 may be a fine metal mask having a pattern.

10A-10B illustrate vertical non-contact alignment according to embodiments described herein. 10A-10B illustrate an arrangement 1000 that is non-contactly floated by a plurality of magnetic units 700.

The arrangement 1000 described herein may be a substrate arrangement or a mask arrangement as described herein.

10A-10B show a reference axis 1012 representing a target vertical position relative to the arrangement 1000. The reference axis 1012 is a substantially horizontal reference axis. The arrangement 1000 shown in FIG. 10A is not in the target vertical position, as indicated by the vertical offset 1022. The arrangement 1000 shown in FIG. 10A is located below the target position. By adjusting the magnetic levitation force provided by the plurality of magnetic units 700, the vertical position of the arrangement 1000 will be adjusted in a non-contact manner to align the arrangement 1000 with the target vertical position indicated by the reference axis 1012. I can. In order to bring the arrangement 1000 shown in FIG. 10A to a target vertical position, the magnitude of at least one magnetic levitation force acting on the arrangement 1000 may be changed, for example increased. By increasing the magnetic levitation force, upward movement of the arrangement 1000 may be provided to vertically align the arrangement 1000 without contacting the arrangement 1000. 10B shows the arrangement 1000 after the upward movement. The arrangement 1000 shown in FIG. 10B is vertically aligned with the reference axis 1012 and is in a target vertical position.

10A-10B illustrate an example of a non-contact vertical alignment of the arrangement 1000, and an upward movement of the arrangement 1000 is provided to align the arrangement 1000 vertically. Similarly, non-contact vertical alignment may entail any other vertical movement, such as downward movement of the arrangement 1000 to vertically align the arrangement 1000.

11A-11B illustrate the angular contactless alignment described herein. The arrangement 1000 shown in FIGS. 11A to 11B is non-contactly floated by a plurality of magnetic units 700. 11A-11B show a reference axis 1130 indicating a target angular position with respect to the arrangement 1000. The reference axis 1130 is a substantially horizontal reference axis. The reference axis 1130 may define, for example, a target direction with respect to the upper edge of the arrangement 1000. The arrangement 1000 shown in FIG. 11A is not at the target angular position, as indicated by the angle 1132. By adjusting one or more magnetic levitation forces provided by the plurality of magnetic units 700, the angular position of the arrangement 1000 aligns the arrangement 1000 with the target angular position defined by the reference axis 1130 It can be adjusted in a non-contact manner so as to be. For example, by reducing the magnitude of the magnetic levitation force 1112 provided by the magnetic unit 1110 and/or increasing the magnitude of the magnetic levitation force 1122 provided by the magnetic unit 1120, the arrangement 1000 May be rotated in a non-contact manner with respect to a rotation axis perpendicular to the page surface, as indicated by arrow 1150. The axis of rotation may be substantially perpendicular to the plane defined by the arrangement 1000. 11B shows the arrangement 1000 after non-contact rotation. The arrangement 1000 shown in FIG. 11B is angularly aligned with the reference axis 1130 and is at a target angular position.

12A-12B illustrate the horizontal non-contact alignment described herein. The arrangement 1000 shown in FIGS. 12A to 12B is non-contactly floated by a plurality of magnetic units 700. 12A-12B illustrate the magnetic drive system 1210 described herein. The magnetic drive system 1210 may include a plurality of additional magnetic units. The magnetic drive system is configured to non-contactly transport the arrangement 1000 in a horizontal direction, for example in a direction substantially parallel to the plurality of magnetic units 700.

12A-12B show a reference axis 1230 indicating a target horizontal position with respect to the arrangement 1000. The reference axis 1230 is a substantially vertical reference axis. The arrangement 1000 shown in FIG. 12A is not in the target vertical position, as indicated by the horizontal offset 1232. By adjusting the magnetic force provided by the magnetic drive system 1210, in particular a substantially horizontal magnetic force, the horizontal position of the arrangement 1000 is non-contact to align the arrangement 1000 with the target horizontal position indicated by the reference axis 1230. Can be adjusted in a way. A horizontal movement parallel to the plurality of magnetic units 700 may be provided. 12B shows the arrangement 1000 after horizontal movement. The arrangement 1000 shown in FIG. 12B is horizontally aligned with the reference axis 1230 and is in a target horizontal position.

[0090] As described herein, the non-contact alignment of the substrate arrangement 210 and/or the mask arrangement 220 may include at least one of vertical alignment, angular alignment, horizontal alignment, or any combination thereof. have.

Providing vertical alignment may include controlling and/or adjusting the vertical position of the substrate arrangement 210 and/or the mask arrangement 220. Vertical alignment may be provided by controlling the magnetic levitation or magnetic levitation forces acting on the substrate arrangement 210 and/or the mask arrangement 220. Magnetic levitation or magnetic levitation may be provided by the plurality of magnetic units 700.

Providing angular alignment includes a substantially horizontal axis of rotation, such as a rotation axis substantially perpendicular to the plane defined by the substrate arrangement 210 and/or a rotation axis substantially perpendicular to the plane defined by the mask arrangement 220 It may include controlling and/or adjusting the angular position of the substrate arrangement 210 and/or the mask arrangement 220 with respect to. Angular alignment may be provided by controlling a plurality of magnetic levitation forces acting on the substrate arrangement 210 and/or the mask arrangement 220. For example, the angular position of the substrate arrangement 210 may be adjusted by controlling the magnitudes of several levitation forces that act in common on the substrate arrangement 210. Similarly, the angular position of the mask arrangement 220 can be adjusted.

Providing horizontal alignment may include controlling and/or adjusting the horizontal position of the substrate arrangement 210 and/or the mask arrangement 220, such as along the x direction. Horizontal alignment may be provided by controlling magnetic forces or magnetic forces acting on the substrate arrangement 210 and/or the mask arrangement 220 in a substantially horizontal direction. For example, horizontal alignment may be provided by controlling the magnetic force in the x direction provided by the magnetic drive system 1210 as described herein.

13A-13C illustrate a method and apparatus according to embodiments described herein. 13A-13C show the support structure 1300. As shown, the support structure 1300 may include one or more first fastening elements 1310 for fastening the substrate arrangement 210, for example one or more pins, which may be conical. The support structure 1300 may include one or more second fastening elements 1320 for fastening the mask arrangement 220, for example one or more additional pins, which may be conical.

13A-13C, the substrate arrangement 210 includes one or more first accommodating portions for accommodating one or more first fastening elements 1310 of the support structure 1300 (1312) may be included. One or more first receiving portions 1312 may include one or more holes provided in the substrate carrier 215. Each hole may be configured to receive one or more corresponding pins of the first fastening elements 1310. The mask arrangement 220 may include one or more second accommodating portions 1322 for accommodating one or more second fastening elements 1320 of the support structure 1300. One or more second receiving portions 1322 may include one or more holes provided in the mask carrier 225. Each hole may be configured to receive one or more corresponding pins of the second fastening elements 1320.

The substrate arrangement 210 and the mask arrangement 220 shown in FIG. 13A are not well aligned with each other. As described herein, by controlling the magnetic levitation forces acting on the substrate arrangement 210 and/or on the mask arrangement 220, a non-contact alignment of the substrate arrangement 210 and the mask arrangement 220 may be provided. have.

For example, by controlling the plurality of magnetic units 700, as illustrated in FIG. 13B, one or more first receiving portions 1312 of the substrate arrangement 210 are supported by the support structure 1300 The substrate arrangement 210 may be provided at a position to be aligned with one or more of the first fastening elements 1310. Alternatively or additionally, by controlling the plurality of magnetic units 700, as illustrated in FIG. 13B, one or more of the second receiving portions 1322 of the mask arrangement 220 are The mask arrangement 220 may be provided at a position to be aligned with one or more second fastening elements 1320.

The substrate arrangement 210 and the mask arrangement 220 shown in FIG. 13B are well aligned with respect to the support structure 1300, respectively. One or more first receptacles 1312 are aligned with horizontal axes 1314 defined by one or more first fastening elements 1310. One or more second receptacles 1322 shown in FIG. 13B are aligned with horizontal axes 1324 defined by one or more second fastening elements 1320. The substrate arrangement 210 and the mask arrangement 220, which are each well aligned with respect to the support structure 1300, are well aligned with each other.

[0099] For example, one or more first fastening elements to fasten with one or more first receiving portions 1312 of the substrate arrangement 210 after providing the non-contact alignment described with respect to FIGS. 13A-13B The 1310 may be moved in, for example, a substantially horizontal direction. Likewise, one or more second fastening elements 1320 may be moved in a substantially horizontal direction, for example, to fasten one or more second receiving portions 1322 of the mask arrangement 220.

One or more first fastening elements 1310 and one or more second fastening elements 1320 are one or more first receiving portions 1312 and one or more second receiving portions ( After each fastening with 1322, the support structure 1300 may be configured to horizontally move the substrate arrangement 210 and the mask arrangement 220 toward each other. The horizontal movement provided by the support structure 1300 may not substantially change the relative alignment of the substrate arrangement 210 and the mask arrangement 220. The horizontal movement provided by the support structure 1300 may be a connection movement as described herein.

13C shows the arrangements after the substrate arrangement 210 and the mask arrangement 220 are moved horizontally toward each other. The relative alignment of the substrate arrangement 210 and the mask arrangement 220 illustrated in FIG. 13C is substantially the same as the relative alignment of the substrate arrangement 210 and the mask arrangement 220 illustrated in FIG. 13B. As compared with FIG. 13B, which shows the substrate arrangement 210 and the mask arrangement 220 separated from each other, the substrate arrangement 210 and the mask arrangement 220 shown in FIG. 13C are adjacent to each other.

The substrate arrangement 210 shown in FIG. 13C is supported by a support structure 1300. One or more first fastening elements 1310 are fastened with one or more first receiving portions 1312. The mask arrangement 220 shown in FIG. 13C is supported by the support structure 1300. One or more second fastening elements 1320 are fastened with one or more second receiving portions. 13C, the support structure 1300 is configured to provide the substrate arrangement 210 at a position adjacent to the mask arrangement 220, in particular, the substrate arrangement 210 at a position in contact with the mask arrangement 220. I can.

The substrate arrangement 210 and the mask arrangement 220 having the configuration shown in FIG. 13C may be attached to each other. After attaching both arrangements to each other, the resulting assembly comprising the substrate arrangement 210 attached to the mask arrangement 220 can be removed from the support structure 1300 for further processing, such as for a deposition process.

[00104] The methods described herein include, inter alia, connecting the substrate arrangement 210 to the mask arrangement 220 after non-contact alignment of the substrate arrangement 210 and the mask arrangement 220 is provided with respect to each other. can do. The substrate arrangement 210 arranged in a non-contact manner may be connected to the mask arrangement 220 arranged in a non-contact manner. Connecting the substrate arrangement 210 to the mask arrangement 220 may be or may include attaching the substrate arrangement 210 to the mask arrangement 220. The substrate arrangement 210 may be connected to the mask arrangement 220 by one or more connection devices, for example one or more attachment devices, such as one or more clamping devices.

The substrate arrangement 210 may be connected to the mask arrangement 220 to fix the relative position of the masking device 20 with respect to the substrate 10. By connecting the substrate arrangement 210 to the mask arrangement 220, the substrate 10 and the masking device 20 can be fixed in a well-aligned configuration. After providing the connection, the combined assembly comprising the substrate arrangement 210 connected to the mask arrangement can be further processed, for example, in a deposition process.

The methods described herein may include fastening the substrate arrangement 210 with the support structure 1300 and/or fastening the mask arrangement 220 with the support structure 1300. The fastening step may be provided after non-contact alignment. The support structure 1300 may include one or more first fastening elements 1310 and/or one or more second fastening elements 1320. This method includes fastening the substrate arrangement 210 with one or more first fastening elements 1310 and/or fastening the mask arrangement 220 with one or more second fastening elements 1320. It may include steps. The method may include receiving one or more first fastening elements 1310 in one or more first receiving portions 1312, such as openings, of the substrate arrangement 210. The method may include receiving one or more second fastening elements 1320 in one or more second receptacles 1322, such as openings, of mask arrangement 220.

The method may include supporting the substrate arrangement 210 and/or supporting the mask arrangement 220 by the support structure 1300. The supporting step may be provided after non-contact alignment. The method may include connecting the mask arrangement 220 to the substrate arrangement 210 while the substrate arrangement 210 and/or the mask arrangement 220 is supported by the support structure 1300.

14 shows an apparatus 701 according to embodiments described herein. This device 701 includes a control unit 1400. The control unit 1400 is connected to a plurality of magnetic units 700. The exemplary plurality of magnetic units 700 shown in FIG. 14 includes three magnetic units 1432, 1434, and 1436. More than three or less than three magnetic units may also be provided.

14, the control unit 1400 may include a plurality of local controllers 1420. 14 shows three local controllers 1422, 1424, 1426. More than three or less than three local controllers may also be provided. Each local controller may be connected to an individual magnetic unit among the plurality of magnetic units 700. In FIG. 14, local controllers 1422, 1424, 1426 are connected to magnetic units 1432, 1434, 1436, respectively. Each local controller can be configured to control each magnetic unit. For example, the local controller may be configured to control the magnetic levitation force provided by a magnetic unit connected to the local controller.

14, the device 701 may include a plurality of position sensors 1450. The exemplary plurality of position sensors 1450 shown in FIG. 14 includes three position sensors 1452, 1454, and 1456. More than three or less than three position sensors may be provided. One or more of the position sensors may be high precision position sensors as described herein.

[00111] As shown in FIG. 14, each of the plurality of position sensors 1450 is in an individual magnetic unit among the plurality of magnetic units 700 and/or a plurality of local controllers 1420 It can be connected to each of the local controllers. The position sensors 1452, 1454, and 1456 shown in FIG. 14 are connected to the magnetic units 1432, 1434, and 1436, respectively. The position sensors 1452, 1454, 1456 shown in FIG. 14 are connected to local controllers 1422, 1424, 1426, respectively.

[00112] The position sensor may be configured to measure local coordinates of each of the arrangement 1000 floating in a non-contact manner. For example, each position sensor may be configured to measure a respective vertical distance, eg, a distance from the non-contact floating arrangement 1000 to the plurality of magnetic units 700. The position sensors 1452, 1454, 1456 shown in FIG. 14 are configured to measure vertical distances 1472, 1474, 1476, respectively.

[00113] Local coordinates measured by the position sensor may be provided to a local controller connected to the position sensor. Based on the measured position data, the local controller can control the magnetic unit connected to the local controller. For example, based on the location data, the local controller may control or adjust the magnetic levitation force acting on the arrangement 1000 to align the arrangement 1000 in a non-contact manner.

As shown in FIG. 14, the control unit 1400 may include a central controller 1410. Each local controller can be connected to the central controller 1410. The exemplary apparatus 701 shown in FIG. 14 includes both a central controller 1410 and a plurality of local controllers 1420. Alternatively, the control unit 1400 described herein may include at least one of a plurality of local controllers 1420 and a central controller 1410.

The central controller 1410 may be configured to receive a plurality of local coordinates measured by the plurality of position sensors 1450. For example, the plurality of local coordinates may include vertical distances 1472, 1474, and 1476 measured by the position sensors 1452, 1454, and 1456, respectively. The central controller 1410 may be configured to perform coordinate transformation for a plurality of local coordinates. Coordinate transformation may include mapping a plurality of local coordinates to a central coordinate system. For example, the central coordinate system may provide central coordinates for indicating the position of the arrangement 1000 in terms of 6 degrees of freedom of the arrangement 1000. The central controller 1410 may treat the substrate arrangement 210 and/or the mask arrangement as a rigid body.

After performing the coordinate transformation, the non-contact alignment of the arrangement 1000 in the central coordinate system may be controlled. For example, the user may set a target position for the arrangement 1000 with respect to target center coordinates of the arrangement 1000. The central controller 1410 may receive target central coordinates and perform a backward coordinate transformation from the central coordinate system to the local coordinate system. The central controller 1410 may map target central coordinates to target local coordinates. Target local coordinates can be provided to respective local controllers. Based on the target local coordinates, each local controller can control and/or adjust each magnetic unit to provide the arrangement 1000 at a target location initially set by the user. In consideration of this, a non-contact alignment of the arrangement 1000 may be provided. According to embodiments that can be combined with other embodiments described herein, the control unit may include at least one of a plurality of local controllers 1420 and a central controller 1410 connected to a plurality of magnetic units. And the central controller is connected to a plurality of local controllers, the central controller being configured to map the plurality of local coordinates to the central coordinate system and, in particular, to control the alignment of the substrate arrangement with respect to the mask arrangement in the central coordinate system.

[00117] The method described herein may include measuring a plurality of local coordinates of the substrate arrangement 210 while the substrate arrangement 210 is floating in a non-contact manner. Additionally or alternatively, the method may include measuring a plurality of local coordinates of the mask arrangement 220 while the mask arrangement 220 is floating in a non-contact manner.

[00118] The plurality of local coordinates of an arrangement, such as, for example, the substrate arrangement 210 or the mask arrangement 220 may include a plurality of locations and/or distances, such as vertical distances. A plurality of local coordinates may be measured by a plurality of position sensors 1450 as described herein. For example, a plurality of local coordinates of the substrate arrangement 210 may be measured by one or more first position sensors 950 as described herein. For example, a plurality of local coordinates of the mask arrangement 220 may be measured by one or more second position sensors 960 as described herein.

[00119] Local coordinates are spatial coordinates. The concept of local coordinates as described herein is used to differentiate against the concept of central coordinates. For example, a plurality of local coordinates of an arrangement such as the substrate arrangement 210 or the mask arrangement 220 may be provided according to the embodiments described herein. The local coordinates may be associated with each of the plurality of magnetic units 700. For example, the local coordinates can be measured by each position sensor connected to the magnetic unit. The local coordinates can be controlled by each local controller connected to the magnetic unit.

[00120] A plurality of local coordinates of an arrangement, such as, for example, the substrate arrangement 210 or the mask arrangement 220 may at least partially determine the position and/or orientation of the arrangement at, for example, a given time point. For example, a plurality of local coordinates, such as a plurality of vertical distances, may be sufficient to completely determine the vertical position of the arrangement and/or the angular position of the arrangement with respect to a substantially horizontal axis of rotation.

[00121] A plurality of local coordinates of the substrate arrangement 210 and/or a plurality of local coordinates of the mask arrangement 220 may be controlled by a plurality of local controllers 1420 as described herein.

The method described herein may include mapping a plurality of measured local coordinates of the substrate arrangement 210 and/or of the mask arrangement 220 to a central coordinate system. The central coordinate system can be controlled by the central controller 1410 as described herein.

[00123] The central coordinate system may refer to the central coordinates to indicate the location of an arrangement such as the substrate arrangement 210 or the mask arrangement 220. The center coordinates can represent the location of the arrangement in an alternative way to the local coordinates. The local coordinates of the arrangement and the center coordinates of the arrangement may be linked to each other by coordinate transformation. Coordinate transformation can convert local coordinates to central coordinates and/or vice versa.

Mapping a plurality of measured local coordinates of the substrate arrangement 210 and/or of the mask arrangement 220 to the central coordinate system may include performing coordinate transformation.

[00125] The central coordinates of the arrangement may provide a way to indicate the position of the arrangement in terms of 6 degrees of freedom of the arrangement. The center coordinates of the arrangement are: vertical position with respect to the vertical direction; A first horizontal position with respect to a first horizontal direction; A second horizontal position with respect to a second horizontal direction perpendicular to the first horizontal direction; A first angular position with respect to the vertical axis of rotation; A second angular position with respect to the first horizontal axis of rotation; A third angular position with respect to the second horizontal rotation axis perpendicular to the first horizontal rotation axis; Or any combination thereof.

The central coordinate system may provide central coordinates for the substrate arrangement 210 in terms of 6 degrees of freedom of the substrate arrangement 210. Additionally or alternatively, the central coordinate system may provide central coordinates for the mask arrangement 220 in terms of six degrees of freedom of the mask arrangement 220.

The method described herein may include controlling the alignment of the substrate arrangement 210 and the mask arrangement 220 with respect to each other in a central coordinate system. This method may include controlling the position of the substrate arrangement 210 in a central coordinate system to provide contactless alignment. Alternatively or additionally, providing a contactless alignment may include controlling the position of the mask arrangement 220 in a central coordinate system to provide a contactless alignment.

[00128] The methods described herein may include at least one of the following: measuring a plurality of local coordinates of the substrate arrangement 210 while the substrate arrangement 210 is non-contactly floating; Measuring a plurality of local coordinates of the mask arrangement 220 while the mask arrangement 220 is floating in a non-contact manner; Mapping a plurality of measured local coordinates of the substrate arrangement 210 and/or of the mask arrangement 220 to a central coordinate system; Controlling the position of the substrate arrangement 210 and/or the position of the mask arrangement 220 in the central coordinate system; Or any combination thereof.

[00129] As described herein, controlling the position of the substrate arrangement 210 and/or the position of the mask arrangement 220 in the central coordinate system provides the advantage that contention of local controllers can be avoided.

[00130] A further advantage is that the operator can interact directly with the central controller. It may not be necessary for the operator to interact with multiple local controllers. In consideration of this, the control procedure can be simplified.

[00131] A further advantage is that the conversion of the coordinates to the central coordinate system makes it possible to determine whether components of the device, such as a plurality of magnetic units, magnetic drive systems, safety bearings, etc., are well aligned with each other to be. Any misalignment of these components can be detected and corrected, so errors in magnetic levitation can be avoided.

[00132] A further advantage is that a central controller can be used to calculate whether a given position of the substrate arrangement or mask arrangement is feasible during non-contact floating, or whether this position will lead to contact or even collision with the magnetic drive system or safety bearings. Is that there is. Taking this into account, it can be ensured that the non-contact flotation, alignment and transfer process can be performed without errors.

According to a further embodiment, a method is provided. The method includes the step of contactlessly floating the first arrangement. The first arrangement is one of the substrate arrangement 210 including the substrate 10 and the mask arrangement 220 including the masking device 20. The method includes contactlessly aligning the first arrangement with an alignment precision of 500 μm or less, more specifically 100 μm or less, or even 20 μm or less. In some implementations, even higher non-contact alignment precision may be provided, such as an alignment precision of 5 μm or less, more specifically 1 μm or less, or even 0.1 μm or less.

The first arrangement described herein may be one of the substrate arrangement 210 and the mask arrangement 220 as described herein. Features and aspects described herein in connection with the substrate arrangement 210 may also be applied to the first arrangement. Features and aspects described herein in connection with the mask arrangement 220 may also be applied to the first arrangement.

[00135] The first arrangement described herein may be provided in a substantially vertical orientation while floating the first arrangement in a non-contact manner.

[00136] The method described herein includes measuring a position of a first arrangement using a first position sensor 1552 described herein, for example, a first position sensor 1552 as shown in FIG. 15 It may include.

[00137] Measuring the position of the first arrangement may include measuring a vertical position of the first arrangement. Measuring the position may include measuring a distance, particularly a vertical distance, equal to the distance from the first position sensor 1552 to the first arrangement.

[00138] Measuring the position of the first arrangement includes measuring a plurality of distances, such as vertical distances, such as, for example, 2, 3, 4, 5, 6 or even more distances. Can include. A plurality of distances for the first arrangement may be measured by a plurality of position sensors 1450 as described herein.

[00139] While the first arrangement is injured in a non-contact manner, the position of the first arrangement may be measured. The non-contact alignment of the first arrangement may be provided based at least on the measured position of the first arrangement.

Aligning the first arrangement in a non-contact manner may include controlling and/or adjusting a position of the first arrangement without contacting the first arrangement.

[00141] Non-contact aligning of the first arrangement includes: vertically aligning the first arrangement; Aligning the first arrangement horizontally; Angular alignment of the first arrangement; Or it may include at least one of any combination thereof.

[00142] Aligning the first arrangement in a non-contact manner may include controlling and/or adjusting at least one magnetic levitation force acting on the first arrangement. At least one magnetic levitation force may be provided by a plurality of magnetic units 700 as described herein. Providing a non-contact alignment may include controlling and/or adjusting a plurality of magnetic levitation forces acting on the first arrangement. For example, two, three, or even more magnetic levitation forces co-acting on the first arrangement can be controlled and/or adjusted to provide a non-contact alignment.

[00143] The alignment of the first arrangement may be provided only in a non-contact manner.

[00144] The method described herein may include measuring a plurality of local coordinates of the first arrangement while the first arrangement is non-contactly floating. A plurality of local coordinates of the first arrangement may be controlled by a plurality of local controllers 1420 as described herein.

The method may include mapping the measured plurality of local coordinates to a central coordinate system. Mapping the measured local coordinates of the first arrangement to the central coordinate system may include performing coordinate transformation. The central coordinate system may provide coordinates for the first arrangement in terms of 6 degrees of freedom of the first arrangement.

[00146] Providing a contactless alignment may include aligning the first arrangement in a central coordinate system. The method may include controlling the position of the first arrangement in the central coordinate system.

[00147] The methods described herein may include contactlessly floating the second arrangement. The second arrangement may be another one of the substrate arrangement 210 and the mask arrangement 220. For example, the first arrangement may be the substrate arrangement 210, the second arrangement may be the mask arrangement 220, or vice versa.

The method may include contactlessly aligning the second arrangement. The method may include controlling and/or adjusting the position of the second arrangement without contacting the second arrangement.

[00149] The second arrangement may be non-contact arrangement with alignment precision of numerical ranges according to embodiments described herein.

The second arrangement may be a substrate arrangement 210 or a mask arrangement 220. Features and aspects described herein in connection with the substrate arrangement 210 may also be applied to the second arrangement. Features and aspects described herein in connection with the mask arrangement 220 may also be applied to the second arrangement.

[00151] For example, as illustrated in FIGS. 7A-7B, according to a further embodiment, an apparatus 701 is provided. The device 701 comprises a magnetic levitation system comprising a plurality of magnetic units 700. The plurality of magnetic units 700 are adapted to non-contactly float the substrate arrangement 210 including the substrate 10 and the mask arrangement 220 including the masking device 20. The apparatus is configured to non-contact alignment of the substrate arrangement 210 and the mask arrangement 220 with respect to each other.

[00152] The apparatus 701 described herein may be configured to non-contact alignment of the substrate arrangement 210 and the mask arrangement 220 with respect to each other, where the alignment is performed only in a non-contact manner.

[00153] The apparatus 701 described herein may be configured to non-contactly float the substrate arrangement 210 and/or the mask arrangement 220 in a substantially vertical orientation.

[00154] The apparatus 701 described herein may be configured to provide non-contact alignment with an alignment precision of 500 μm or less, more specifically 100 μm or less, or even 20 μm or less. . In some implementations, even higher non-contact alignment precision may be provided, such as an alignment precision of 5 μm or less, more specifically 1 μm or less, or even 0.1 μm or less.

The apparatus 701 described herein may include a substrate arrangement 210 and/or a mask arrangement 220.

The plurality of magnetic units 700 described herein may be configured to provide at least one magnetic levitation force acting on the substrate arrangement 210, in particular a plurality of magnetic levitation forces. Additionally or alternatively, the plurality of magnetic units 700 may be configured to provide at least one magnetic levitation force acting on the mask arrangement 220, in particular a plurality of magnetic levitation forces.

[00157] Each of the plurality of magnetic units 700 may be an active magnetic unit. The plurality of magnetic units 700 may be a plurality of active magnetic units. The active magnetic unit may be configured to generate a magnetic field to provide a magnetic levitation force extending in a vertical direction, such as in the y direction shown in the figures. The active magnetic unit can be controlled to provide an adjustable magnetic field. The adjustable magnetic field can be a static or dynamic magnetic field. The active magnetic unit comprises: an electromagnetic device; Solenoid; coil; Superconducting magnets; Or it may be an element selected from the group consisting of any combination thereof, or may include such an element.

[00158] The term "active" magnetic unit is used herein to distinguish it from the concept of a "passive" magnetic unit. A passive magnetic unit may mean an element with magnetic properties that are not subject to active control or regulation, at least during not in operation of the device. For example, the magnetic properties of the passive magnetic unit may not be actively controlled during non-contact levitation of the mask assembly. The passive magnetic unit may be a magnetic material, such as a ferromagnetic material, a permanent magnet, or may have permanent magnetic properties.

[00159] Compared with the passive magnetic unit, the active magnetic unit provides greater flexibility and precision, taking into account the tunability and controllability of the magnetic field generated by the active magnetic unit.

The plurality of magnetic units 700 may be disposed so that the plurality of magnetic units 700 are on the substrate arrangement 210 during non-contact floating of the substrate arrangement 210. Additionally or alternatively, the plurality of magnetic units 700 may be disposed such that the plurality of magnetic units 700 are above the mask arrangement 220 during non-contact floating of the mask arrangement 220.

[00161] The plurality of magnetic units 700 may include one or more first magnetic units 710 and/or one or more second magnetic units 720, as described herein. I can. One or more first magnetic units 710 may be configured to float the substrate arrangement 210 in a non-contact manner. One or more second magnetic units 720 may be configured to float the mask arrangement 220 in a non-contact manner.

[00162] The plurality of magnetic units 700 may extend in a first direction, for example, in the x direction. One or more first magnetic units 710 may extend in a first direction. One or more second magnetic units 720 may extend in the first direction. One or more first magnetic units 710 and one or more second magnetic units 720 may be two linear arrays of magnetic units arranged side by side.

[00163] A plurality of magnetic units 700 are 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, up to 24 or even It may contain more magnetic units. One or more first magnetic units 710 are 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12 or even more magnetic units. May contain units. One or more second magnetic units 720 can be 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12 or even more magnetic units. May contain units.

[00164] The apparatus 701 described herein may include one or more position sensors. One or more position sensors may be configured to measure the position of the substrate arrangement 210 and/or to measure the position of the mask arrangement 220.

[00165] The position sensor described herein may be configured to measure the position of an arrangement, such as the substrate arrangement 210 or the mask arrangement 220. The position can be measured during non-contact injuries of the arrangement. The position sensor can be configured to measure a distance, such as a vertical distance. The position sensor may be a distance sensor.

[00166] The position sensor described herein may be configured to measure a position and/or distance with high precision. According to embodiments that can be combined with other embodiments described herein, a position sensor precision of 1 μm or less, specifically 0.5 μm or less, more specifically 0.1 μm or less, is provided. Can be. For example, in some implementations, a position sensor precision of 305 nm or even 153 nm may be provided.

[00167] The term "high-precision position sensor" described herein refers to a position sensor having a position sensor precision of 1 μm or less, specifically 0.5 μm or less, more specifically 0.1 μm or less can do.

[00168] The position sensor precision described herein may be a position sensor resolution. Position sensor precision or resolution may be measured in units of length (eg, μm) per Digital Signal Processor Unit (DSPU). Here, the DSPU may be associated with the steps of the position signal identified by the control algorithm. For example, according to the embodiments described herein, the position sensor is a position sensor of 1 μm/DSPU or less, specifically 0.5 μm/DSPU or less, more specifically 0.1 μm/DSPU or less. It can have precision or position sensor resolution. Depending on the implementation, the position sensor precision may be different from the alignment precision.

[00169] The position sensor described herein may be provided with an analog-to-digital converter. The analog-to-digital converter can be connected to the position sensor. The analog-to-digital converter can be integrated with or separated from the position sensor. Position sensors, in particular high-precision position sensors, can be provided, for example, with 16-bit analog-to-digital converters.

[00170] The position sensor described herein may have a measurement range. The measuring range of the position sensor, in particular the high precision position sensor, may be 10 mm or less.

[00171] One or more position sensors described herein may be disposed such that one or more position sensors are on the substrate arrangement 210 during non-contact floating of the substrate arrangement 210. One or more position sensors may be disposed such that one or more position sensors are over the mask arrangement 220 during non-contact floating of the mask arrangement 220.

[00172] During the non-contact floating of the substrate arrangement 210, one, two or more of the one or more position sensors may face the substrate arrangement 210. During the non-contact floating of the mask arrangement 220, one, two or more of the one or more position sensors may face the mask arrangement 220.

[00173] One or more of the position sensors described herein may be or include a plurality of position sensors 1450. The plurality of position sensors 1450 may include 2, 3, 4, 5, 6, 7, 8, 9, 10, or even more position sensors. The plurality of position sensors 1450 may be configured to measure a plurality of distances, such as vertical distances. Each of the plurality of position sensors is a vertical distance from the magnetic unit of the plurality of magnetic units 700 to the non-contact floating substrate arrangement 210 and/or the non-contact floating mask arrangement 220 Can be configured to measure.

A plurality of position sensors 1450 may be connected to a plurality of magnetic units 700. Each of the plurality of position sensors 1450 may be connected to an individual magnetic unit among the plurality of magnetic units 700.

[00175] The plurality of position sensors 1450 may include one or more first position sensors 950 as described herein and/or one or more second position sensors as described herein. (960) may be included. One or more of the first position sensors may include 2, 3, 4, 5, 6, 7, 8, 9, 10, or even more position sensors. One or more second position sensors 960 may include 2, 3, 4, 5, 6, 7, 8, 9, 10, or even more position sensors. have.

One or more of the first position sensors 950 may be configured to measure the position of the substrate arrangement 210. For example, each position sensor of one or more first position sensors 950 is to measure the vertical distance from the magnetic unit of the plurality of magnetic units 700 to the non-contact floating substrate arrangement 210. Can be configured. One or more of the second position sensors 960 may be configured to measure the position of the mask arrangement 220. For example, each position sensor of one or more second position sensors 960 is to measure the vertical distance from the magnetic unit of the plurality of magnetic units 700 to the non-contact floating mask arrangement 220. Can be configured.

[00177] Each of the plurality of position sensors 1450 may be connected to an individual magnetic unit among the plurality of magnetic units 700.

[00178] At least one, two, three or four position sensors, or even each of the plurality of position sensors 1450, the position sensor precision within the numerical range according to the embodiments described herein For example, it may have a position sensor precision of 1 μm or less, specifically 0.5 μm or less, more specifically 0.1 μm or less. By measuring the position of the substrate arrangement 210 and/or the mask arrangement 220 with high precision, a high precision non-contact alignment can be provided, eliminating the need for additional mechanical alignment devices.

[00179] The apparatus 701 described herein may include a control unit 1400. The control unit 1400 may be connected to a plurality of magnetic units 700. The control unit 1400 may be configured to control a plurality of magnetic units 700 to provide contactless alignment as described herein. The control unit 1400 may be configured to control the positions of the substrate arrangement 210 and/or the mask arrangement 220.

The control unit 1400 may be configured to receive measured data regarding the position of the non-contact floating substrate arrangement 210 and/or the position of the non-contact floating mask arrangement 220. Position may be measured by one or more position sensors as described herein.

[00181] The control unit 1400 may be configured to control one or more magnetic levitation forces acting on the substrate arrangement 210, such as two, three, four or more. The control unit 1400 may be configured to control one or more magnetic levitation forces acting on the mask arrangement 220, such as two, three, four or more. By controlling the magnetic levitation forces, a non-contact alignment can be provided according to embodiments described herein.

The control unit 1400 may include a plurality of local controllers 1420 as described herein. A plurality of local controllers 1420 may be connected to a plurality of magnetic units 700. Each of the plurality of local controllers 1420 may be connected to a respective magnetic unit of the plurality of magnetic units 700. A plurality of local controllers 1420 may be connected to a plurality of position sensors 1450. Each of the plurality of local controllers 1420 may be connected to a respective one of the plurality of position sensors 1450.

[00183] The plurality of local controllers 1420 may be configured to receive a plurality of local coordinates measured by the plurality of position sensors 1450. The plurality of local controllers 1420 may be configured to receive a plurality of local coordinates of the mask arrangement 220 and/or a plurality of local coordinates of the substrate arrangement 210 during a non-contact injury. Each local controller may be configured to receive local coordinates measured by individual position sensors connected to the local controller, such as a measured position or distance. Based at least on the measured local coordinates, the local controller can control and/or adjust the magnetic levitation force provided by the magnetic unit connected to the local controller. In view of this, the positions of the substrate arrangement 210 and/or the mask arrangement 220 may be controlled by the control unit 1400 to provide non-contact alignment according to the embodiments described herein.

[00184] The control unit 1400 may include a central controller 1410. The central controller 1410 may be connected to a plurality of local controllers 1420. The central controller 1410 may control a plurality of local controllers 1420 by a control cascade. The central controller 1410 may be configured to receive a plurality of local coordinates of the substrate arrangement 210 and/or a plurality of local coordinates of the mask arrangement 220. The central controller 1410 may be configured to map a plurality of local coordinates to a central coordinate system as described herein. The central controller 1410 may be configured to control non-contact alignment of the substrate arrangement 210 with respect to the mask arrangement 220 in a central coordinate system.

The device 701 described herein may include a support structure 1300. The support structure 1300 may be configured for at least one of the following: supporting the substrate arrangement 210; Supporting the mask arrangement 220; In particular, providing the substrate arrangement 210 at a position adjacent to the mask arrangement 220 while the substrate arrangement 210 and/or the mask arrangement 220 is supported by the support structure 1300; Or any combination thereof. The support provided by the support structure 1300 is a mechanical support.

[00186] The support structure 1300 may not be configured to perform an alignment operation of the substrate arrangement 210 with respect to the mask arrangement 220.

[00187] The support structure 1300 may be disposed at a fixed position in the processing chamber. For example, the support structure can be fixed to the chamber wall of the processing chamber.

[00188] The support structure 1300 may include one or more first fastening elements 1310, such as one or more conical pins extending in a substantially horizontal direction. One or more first fastening elements 1310 may be configured to fasten the substrate arrangement 210. One or more first fastening elements 1310 may be configured to engage with one or more first receiving portions 1312 of the substrate arrangement 210, such as openings provided in the substrate carrier.

[00189] The support structure 1300 may include one or more second fastening elements 1320, such as one or more conical pins extending in a substantially horizontal direction. One or more second fastening elements 1320 may be configured to couple the mask arrangement 220. One or more second fastening elements 1320 may be configured to fasten one or more second receiving portions 1322 of the mask arrangement 220, such as openings provided in the mask carrier.

The apparatus 701 described herein may include a processing chamber 1790. The processing chamber 1790 may be a vacuum chamber. Any of the following, and any combination of the following, may be disposed within the processing chamber: a plurality of magnetic units 700; Any of the position sensors described herein; Substrate arrangement 210; Mask arrangement 220; A support structure 1300; And magnetic drive system 1210.

[00191] The device 701 described herein may include a magnetic drive system 1210. The magnetic drive system 1210 may be disposed under the plurality of magnetic units 700. The magnetic drive system 1210 may extend in a direction substantially parallel to the plurality of magnetic units 700. The magnetic drive system 1210 may be particularly configured to magnetically drive at least one of the substrate arrangement 210 and the mask arrangement 220 in a substantially horizontal direction, for example, in the x direction as described herein. have. The magnetic drive system 1210 may be connected to the control unit 1400.

[00192] Figure 15 shows an apparatus 701 according to embodiments described herein. The apparatus 701 shown in FIG. 15 includes a magnetic levitation system comprising a plurality of magnetic units 700. The exemplary plurality of magnetic units 700 shown in FIG. 15 includes magnetic units 1532, 1534, and 1536. The plurality of magnetic units 700 are adapted to float the arrangement 1000 in a non-contact manner. The arrangement 1000 may be a substrate arrangement 210 as described herein or a mask arrangement 220 as described herein. The plurality of magnetic units 700 may be adapted to jointly float both the substrate arrangement 210 and the mask arrangement 220 in a non-contact manner.

[00193] As shown in FIG. 15, the device 701 may include a first position sensor 1552. The first position sensor 1552 may be connected to the first magnetic unit 1532 of the plurality of magnetic units 700. The first position sensor 1552 may be a high-precision position sensor. The first position sensor may have a position sensor precision of 1 μm or less, specifically 0.5 μm or less, more specifically 0.1 μm or less. The first position sensor 1552 may be configured to measure a vertical position, eg, a height, of the arrangement 1000 while the arrangement 1000 is in a non-contact manner.

[00194] Arrangement by controlling the plurality of magnetic units 700 in response to the position measurement performed by the first position sensor 1552 based on the high-precision position data provided by the first position sensor 1552 1000) of high precision alignment can be provided. Control may be provided by the control unit 1400 (not shown in FIG. 15) as described herein. The precision of the non-contact alignment obtained in this way may be the alignment precision of numerical ranges according to the embodiments described herein. The high precision of non-contact alignment eliminates the need for additional mechanical alignment.

[00195] According to a further embodiment, an apparatus 701 is provided. The apparatus 701 includes a magnetic levitation system comprising a plurality of magnetic units 700 configured to contactlessly float at least one of a substrate arrangement comprising a substrate and a mask arrangement comprising a masking device. The device 701 includes a first position sensor 1552 connected to a first magnetic unit 1532 of a plurality of magnetic units 700. The first position sensor 1552 is configured to measure the position with an accuracy of 1 μm or less, specifically 0.5 μm or less, more specifically 0.1 μm or less.

[00196] The magnetic levitation system described herein may be configured to float the substrate arrangement 210 and the mask arrangement 220 in a non-contact manner.

The first position sensor 1552 described in the specification may be configured to measure the position of the substrate arrangement 210 and/or to measure the position of the mask arrangement 220.

[00198] The first position sensor 1552 may be connected to a plurality of magnetic units 700 as described herein.

[00199] The first position sensor 1552 may be disposed so that the first position sensor 1552 is on the substrate arrangement 210 during non-contact floating of the substrate arrangement 210. The first position sensor 1552 may be disposed so that the first position sensor 1552 is on the mask arrangement 220 during non-contact floating of the mask arrangement 220.

The first position sensor 1552 may be a position sensor of the plurality of position sensors 1450 as described herein. The first position sensor 1552 may be a position sensor of one or more first position sensors 950 as described herein. The first position sensor 1552 may be a position sensor of one or more second position sensors 960 as described herein.

The first position sensor 1552 may be configured to measure the position of the substrate arrangement 210. The device 701 described herein may include an additional position sensor. An additional position sensor may be configured to measure the position of the mask arrangement 220. The additional position sensor may have a position sensor precision of 1 μm or less, specifically 0.5 μm or less, more specifically 0.1 μm or less. The additional position sensor may be a high precision position sensor as described herein.

[00202] The first position sensor 1552 may be connected to the control unit 1400 as described herein. The control unit 1400 may be configured to control non-contact alignment of the substrate arrangement 210 and the mask arrangement 220 with each other based on measured data provided by the first position sensor 1552.

[00203] The control unit 1400 may be configured to receive measured data regarding the position of the non-contact floating substrate arrangement 210 and/or the position of the non-contact floating mask arrangement 220. At least a part of the measured data may be measured by the first position sensor 1552. The measured data may be provided to the control unit 1400 by the first position sensor 1552. Based on the measured data, the control unit 1400 may provide non-contact alignment of the substrate arrangement 210 and/or the mask arrangement 220.

In consideration of the high-precision position data provided by the first position sensor 1552, a high-precision non-contact alignment may be provided. Additional mechanical alignment may not be required.

The first position sensor 1552 may be connected to a local controller of a plurality of local controllers 1420 as described herein. The local controller may be connected to the first magnetic unit 1532 connected to the first position sensor 1552. The local controller may be configured to receive local coordinates, such as a location or distance, measured by the first position sensor 1552. The local coordinates may be local coordinates of the substrate arrangement 210 and/or of the mask arrangement 220. Based at least on the measured local coordinates, the local controller may control and/or adjust the magnetic levitation force provided by the first magnetic unit 1532 connected to the first position sensor 1552. In view of this, the positions of the substrate arrangement 210 and/or the mask arrangement 220 may be controlled by the control unit 1400 to provide non-contact alignment as described herein. A local controller connected to the first position sensor 1552 may be connected to the central controller 1410 as described herein.

16A-16B show an apparatus 701 according to embodiments described herein. The device 701 includes a plurality of magnetic units 700. The exemplary plurality of magnetic units 700 includes a first magnetic unit 1532 and a second magnetic unit 1636. As shown, the plurality of magnetic units 700 may include additional magnetic units 1630, 1634, and 1638. As shown, the second magnetic unit 1636 may be at a predetermined distance from the first magnetic unit 1532 in a substantially horizontal direction, for example, an x direction.

As shown in FIGS. 16A-16B, the device 701 may include an arrangement 1000 as described herein. The plurality of magnetic units 700 are configured to float the arrangement 1000 in a non-contact manner.

16A-16B, the device 701 may include a first position sensor 1552. The first position sensor 1552 may be configured to measure a position, for example, a vertical position of the arrangement 1000 floating in a non-contact manner with a first precision. The first precision may be 1 μm or less, specifically 0.5 μm or less, more specifically 0.1 μm or less. The first position sensor 1552 may be a high-precision position sensor as described herein. 16A-16B, the first position sensor 1552 may be connected to the first magnetic unit 1532.

16A-16B, the device 701 may include a second position sensor 1656. The second position sensor 1656 may be configured to measure a position, for example, a vertical position of the non-contact floating arrangement 1000 with a second precision. The second precision may be different from the first precision. The second precision may be lower than the first precision. The second position sensor 1656 may not be a high-precision position sensor as described herein. The second precision may be at least 1.2 μm, in particular at least 1.4 μm, such as for example 1.456 μm. Alternatively and/or additionally, the second precision can be 2 μm or less. 16A-16B, the second position sensor 1656 may be connected to the second magnetic unit 1636. As shown, the second position sensor 1656 may be at a predetermined distance from the first position sensor 1552 in a substantially horizontal direction, for example, in the X direction.

[00210] The second position sensor having a lower precision than the first precision may have the advantage of being less expensive and reducing cost compared to a high-precision sensor.

[00211] The second position sensor 1656 may have a measurement range of 4 mm or less. The second position sensor 1656 may be provided with an analog-to-digital converter having, for example, 12-bit resolution.

[00212] The first position sensor 1552 and/or the second position sensor 1656 may be connected to the control unit 1400 (not shown in FIGS. 16A-16B) as described herein.

16A shows the arrangement 1000 in a non-contact floating state. In the exemplary configuration shown in FIG. 16A, the arrangement 1000 is non-contactly floated by magnetic units 1630, 1532, 1634. The first position sensor 1552 faces the arrangement 1000 floating in a non-contact manner. The first position sensor 1552 may be used to measure the position of the arrangement 1000 floating in a non-contact manner with high precision. The high-precision position data may be used to provide high-precision non-contact alignment of the arrangement 1000 according to embodiments described herein. Based on the high precision position data, high precision alignment can be provided without the use of any mechanical alignment devices.

16B shows the arrangement 1000 in a non-contact floating state. In the exemplary configuration shown in Fig. 16B, the arrangement 1000 is non-contactly floated by magnetic units 1634, 1636, 1638. Compared with the configuration shown in FIG. 16A, the arrangement 1000 shown in FIG. 16B has been moved in a predetermined transport direction, eg, the x direction, by the plurality of magnetic units 700. The arrangement 1000 may be moved in a transport direction in a non-contact manner by a magnetic drive system (not shown in Figs. 16A-16B) as described herein.

The non-contact floating arrangement 1000 shown in FIG. 16B faces the second position sensor 1656. The second position sensor 1656 may be used to measure the position of the arrangement 1000 floating in a non-contact manner. The measured position may be used to control non-contact floating and/or transport of the arrangement 1000 at the position of the second position sensor 1656. At the location of the second position sensor 1656, the device 701 may not be configured to provide high precision non-contact alignment of the arrangement 1000.

[00216] In view of the above, the apparatus shown in FIGS. 16A-16B includes one or more high-precision sensors, such as a first precision sensor 1552, for providing high-precision non-contact alignment as described herein. Has a designated area. In other areas of the device, the device is configured only to provide non-contact floatation and transfer, not to provide high-precision non-contact alignment. In the latter areas, one or more position sensors of lower precision, such as the second position sensor 1656, may be used, which has the advantage that cost can be reduced. Accordingly, by having regions comprising high precision sensors and other regions having lower precision position sensors, embodiments described herein provide a combination of both high precision contactless alignment and cost savings.

According to a further embodiment, an apparatus 701 is provided. The device 701 comprises a plurality of magnetic units 700 including at least a first magnetic unit 1532 and a second magnetic unit 1636. The plurality of magnetic units 700 are configured to non-contactly float at least one of the substrate arrangement 210 including the substrate 10 and the mask arrangement 220 including the masking device 20. The device 701 comprises a first position sensor 1552 connected to a first magnetic unit 1532. The first position sensor 1552 is configured to measure the position with a first precision. The device 701 includes a second position sensor 1656 connected to a second magnetic unit 1636, the second position sensor 1656 being configured to measure the position with a second precision. The second precision is different from the first precision.

The apparatus 701 described herein may be configured for non-contact transfer of the substrate arrangement 210 and/or the mask arrangement 220. The non-contact conveying can be provided in the conveying direction, for example in the x direction shown in the figures. The transport direction may be a substantially horizontal direction.

[00219] A plurality of magnetic units 700 may be disposed in a transport direction. The first magnetic unit 1532 and the second magnetic unit 1636 may be spaced apart from each other in the transport direction. The first position sensor 1552 and the second position sensor 1656 may be spaced apart from each other in a transport direction.

The first position sensor 1552 may be a high-precision position sensor. The first precision of the first position sensor 1552 may be higher than the second precision of the second position sensor 1656.

[00221] At the location of the first magnetic unit 1532, the apparatus 701 described herein may be configured to provide a non-contact alignment of the substrate arrangement 210 and the mask arrangement to each other. The apparatus 701 may be configured to provide non-contact alignment of the substrate arrangement 210 and the mask arrangement to each other based on measurement data provided by the first position sensor 1552.

At the location of the second magnetic unit 1636, the apparatus 701 may be configured to provide non-contact floating and/or transfer of the substrate arrangement 210 and/or of the mask arrangement. In the second magnetic unit, the device 701 may not be configured to provide high precision contactless alignment. The apparatus 701 may be configured to provide non-contact floating and/or transfer of the substrate arrangement 210 and/or the mask arrangement based on measurement data provided by the second position sensor 1656.

[00223] The apparatus 701 described herein may include two, three, four, five, six or more high-precision position sensors.

[00224] The device 701 described herein has 2, 3, 4, 5, 6 or more positions with a position sensor precision of at least 1.2 μm, in particular at least 1.4 μm, such as 1.456 μm. Sensors, such as position sensors to provide non-contact floating and/or transport of substrate arrangement 210 and mask arrangement 220 may be included.

[00225] The apparatus 701 described herein may be configured to perform any of the method features described herein.

17A-17B show an apparatus 701 according to embodiments described herein. 17A shows a front view of the device 701. 17B shows a top view of the device 701. The apparatus 701 is configured to provide high precision non-contact alignment of the substrate arrangement 210 and the mask arrangement 220 to each other.

[00227] The apparatus 701 shown in FIGS. 17A-17B includes a plurality of magnetic units 700. 17B, the plurality of magnetic units 700 may include one or more first magnetic units 710. One or more first magnetic units 710 are not visible in FIG. 17A. One or more of the first magnetic units 710 may be adapted to float the substrate arrangement 210 in a non-contact manner. The exemplary one or more first magnetic units 710 shown in FIG. 17B include magnetic units 1742, 1744, 1746, 1748.

17A-17B, the plurality of magnetic units 700 may include one or more second magnetic units 720. One or more of the second magnetic units 720 may be adapted to float the mask arrangement 220 in a non-contact manner. The exemplary one or more second magnetic units 720 shown in FIGS. 17A-17B include magnetic units 1732, 1734, 1736, 1738.

[00229] The device 701 may include a plurality of position sensors. 17B, the plurality of position sensors may include one or more first position sensors 950 connected to one or more first magnetic units 710. The exemplary one or more first position sensors 950 shown in FIG. 17B include position sensors 1762, 1764, 1766, 1768 respectively connected to magnetic units 1742, 1744, 1746, 1748. . One or more first position sensors 950 are configured to measure the position of the substrate arrangement 210 while the substrate arrangement 210 is non-contactly floating by the one or more first magnetic units 710 Can be.

As shown in FIG. 17B, the plurality of position sensors may include one or more second position sensors 960 connected to one or more second magnetic units 720. One or more of the second position sensors 960 shown in FIG. 17B include position sensors 1752, 1754, 1756 and 1758 respectively connected to magnetic units 1732, 1734, 1736, 1738. One or more second position sensors 960 are configured to measure the position of the mask arrangement 220 while the mask arrangement 220 is non-contactly floated by the one or more second magnetic units 720 Can be.

[00231] The plurality of position sensors may include one or more high-precision sensors. The apparatus shown in FIGS. 17A-17B includes position sensors 1762 and 1764 configured to measure the position of the non-contact floating substrate arrangement 210 with high precision. The apparatus shown in FIGS. 17A-17B includes position sensors 1752 and 1754 configured to accurately measure the position of the mask arrangement 220 floating in a non-contact manner. Based on the measured position data provided by the position sensors 1762, 1764, 1752, 1754, the non-contact alignment of the substrate arrangement 210 and the mask arrangement 220 with each other may be provided with high alignment accuracy. . Contactless alignment may be controlled by a control unit 1400 (not shown in FIGS. 17A-17B) that may include a plurality of local controllers and/or a central controller, as described herein.

[00232] Based on the measured position data provided by the position sensors 1766, 1768, 1756, 1758, non-contact floating and/or transport of the substrate arrangement 210 and the mask arrangement 220 may be provided. . The position sensors 1766, 1768, 1756, 1758 may not be high-precision position sensors to provide high-precision non-contact alignment.

As shown in FIG. 17A, the device 701 may include a magnetic drive system 1210 as described herein. During non-contact floating, the substrate arrangement 210 and/or the mask arrangement 220 are above the magnetic drive system 1210.

17A-17B, the apparatus 701 may include a processing chamber 1790, which may be a vacuum chamber. As shown, a plurality of magnetic units 700 may be disposed in the processing chamber 1790. A plurality of position sensors may be disposed within the processing chamber 1790. A magnetic drive system 1210 may be disposed within the processing chamber 1790. During non-contact floating, transfer, and/or alignment, the substrate arrangement 210 and/or the mask arrangement 220 may be within the processing chamber 1790.

[00235] The above description relates to embodiments of the present disclosure, but other embodiments and additional embodiments of the present disclosure may be devised without departing from the basic scope of the present disclosure. The scope is determined by the following claims.

Claims (20)

As a method,
Floating the substrate arrangement 210 including the substrate 10 in a non-contact manner;
Contactlessly floating a mask arrangement (220) comprising a masking device (20) configured to mask the substrate;
Measuring the position of the substrate arrangement using one or more first position sensors having a position sensor precision of 1 μm or less, and
Measuring the position of the mask arrangement using one or more second position sensors having a position sensor precision of 1 μm or less
At least one of the steps;
Aligning the substrate arrangement and the mask arrangement with respect to each other in a non-contact manner based on at least one of the measured position of the substrate arrangement and the measured position of the mask arrangement; And
After the substrate arrangement and the mask arrangement are aligned with respect to each other in a non-contact manner, connecting the substrate arrangement to the mask arrangement,
The substrate arrangement and the mask arrangement are arranged only in a non-contact manner before the substrate arrangement and the mask arrangement are connected to each other,
Way. delete The method of claim 1,
At least one of the substrate arrangement and the mask arrangement is non-contact floating in a substantially vertical orientation,
Way. The method of claim 1,
The non-contact alignment step,
Controlling at least one magnetic levitation force acting on the substrate arrangement to provide a non-contact alignment; And
Controlling at least one magnetic levitation force acting on the mask arrangement to provide non-contact alignment.
Containing at least one of,
Way. The method of claim 1,
The above method,
Measuring a plurality of local coordinates (1472, 1474, 1476) of the substrate arrangement while the substrate arrangement is non-contactly floating; And
Measuring a plurality of local coordinates (1472, 1474, 1476) of the mask arrangement while the mask arrangement is non-contact floating
Further comprising at least one of,
Way. The method of claim 5,
The above method,
Mapping at least one of a plurality of measured local coordinates of the substrate arrangement and a plurality of measured local coordinates of the mask arrangement to a central coordinate system; And
Further comprising controlling alignment of the substrate arrangement and the mask arrangement with respect to each other in the central coordinate system,
Way. delete The method of claim 1,
The substrate arrangement and the mask arrangement are aligned with each other with an alignment precision of 500 μm or less,
Way. The method of claim 1,
The masking device is a shadow mask,
Way. delete delete As device 701,
Magnetic levitation system including a plurality of magnetic units 700-The plurality of magnetic units include a substrate arrangement 210 including a substrate 10 and a mask arrangement 220 including a masking device 20 in a non-contact manner. Constructed to rise as ―; And
One or more first position sensors having a position sensor precision of 1 μm or less for measuring the position of the substrate arrangement, and
One or more second position sensors having a position sensor precision of 1 μm or less for measuring the position of the mask arrangement
Including at least one of the position sensors,
The device,
Aligning the substrate arrangement and the mask arrangement with respect to each other in a non-contact manner based on at least one of the position data measured by the one or more first position sensors and the position data measured by the one or more second position sensors Is configured to, and
After the substrate arrangement and the mask arrangement are aligned with respect to each other in a non-contact manner, it is configured to connect the substrate arrangement to the mask arrangement,
The substrate arrangement and the mask arrangement are configured to be aligned only in a non-contact manner before the substrate arrangement and the mask arrangement are connected to each other,
Device. As device 701,
Magnetic levitation system comprising a plurality of magnetic units 700 configured to non-contactly float at least one of the substrate arrangement 210 including the substrate 10 and the mask arrangement 220 including the masking device 20 ;
A first position sensor 1552 connected to a first magnetic unit 1532 of the plurality of magnetic units, the first position sensor configured to measure a position with an accuracy of 1 μm or less; And
A second position sensor (1656) connected to a second magnetic unit, the second position sensor configured to measure a position with a precision lower than that of the first position sensor,
The apparatus is configured to non-contactly align the substrate arrangement and the mask arrangement with respect to each other based at least on position data provided by the first position sensor,
Device. As device 701,
A plurality of magnetic units 700 including at least a first magnetic unit 1532 and a second magnetic unit 1636-the plurality of magnetic units comprises a substrate arrangement 210 including a substrate 10 and a masking device (20) configured to float at least one of the mask arrangement 220 including the non-contact;
A first position sensor 1552 connected to the first magnetic unit 1532, the first position sensor configured to measure a position with a first precision; And
A second position sensor (1656) connected to the second magnetic unit, wherein the second position sensor is configured to measure a position with a second precision lower than the first precision,
The apparatus is configured to non-contactly align the substrate arrangement and the mask arrangement with respect to each other based at least on position data provided by the first position sensor,
Device. delete The method of claim 12,
The device,
Further comprising a control unit (1400) connected to the plurality of magnetic units,
The control unit is configured to control the plurality of magnetic units to provide a non-contact alignment of the substrate arrangement and the mask arrangement to each other,
Device. The method of claim 13 or 14,
The device,
Further comprising a control unit (1400) connected to the plurality of magnetic units and to the first position sensor,
The control unit is configured to control the plurality of magnetic units to provide a non-contact alignment of the substrate arrangement and the mask arrangement to each other,
Device. The method of claim 16,
The control unit,
A plurality of local controllers (1420) connected to the plurality of magnetic units; And
Central Controller(1410)
Including at least one of,
The central controller is connected to the plurality of local controllers,
The central controller is configured to map a plurality of local coordinates 1472, 1474, 1476 to a central coordinate system,
Device. The method according to any one of claims 12 to 14,
The plurality of magnetic units includes one or more first magnetic units 710 configured to non-contactly floating the substrate arrangement and one or more second magnetic units configured to non-contactly floating the mask arrangement ( 720), including,
Device. The method according to any one of claims 12 to 14,
The masking device is a shadow mask,
Device.

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