KR102195796B1 - Method for non-contact floating masking device - Google Patents

Abstract

The method includes contactlessly floating the mask assembly 200. The mask assembly includes a carrier 210 and a masking device 20 supported by the carrier. The method includes controlling the shape of the carrier while the mask assembly is non-contactly floating.

Description

Method for non-contact floating masking device

Embodiments described herein relate to contactless levitation of a masking device, and more particularly to a masking device for masking a substrate. More specifically, embodiments described herein relate to non-contact floating of masking devices configured to mask large area substrates in a vertical orientation.

[0001] Several methods are known for depositing material on a substrate. For example, the substrates may be coated using an evaporation process, such as a physical vapor deposition (PVD) process, a chemical vapor deposition (CVD) process, a sputtering process, a spraying process, and the like. The process can be performed in a processing chamber of a deposition apparatus in which the substrate to be coated is located. A deposition material is provided in the processing chamber. Multiple materials, such as small molecules, metals, oxides, nitrides, and carbides, may be used for deposition on a substrate. Additionally, other processes such as etching, structuring, annealing, etc. may be performed in the processing chambers.

[0002] Coated substrates can be used in many applications and in many fields of technology. For example, the application is in the field of organic light emitting diode (OLED) panels. Additional applications include insulating panels, microelectronics, such as semiconductor devices, substrates with TFTs, color filters and the like.

[0003] OLEDs are solid-state devices composed of thin films of (organic) molecules that generate light by application of electricity. OLEDs can provide clear displays on electronic devices, and can use less power than, for example, light-emitting diodes (LEDs) or liquid crystal displays (LCDs). In the processing chamber, organic molecules are produced (eg, evaporated, sputtered, or sprayed, etc.) and can be condensed as thin films on substrates. The particles pass through a mask with a specific pattern, forming an OLED pattern on the substrate.

[0004] In order to reduce the footprint of the deposition apparatuses, deposition apparatuses exist that allow processing of a masked substrate in a vertical orientation. In other words, the substrate and mask are arranged vertically within the processing chamber. It is beneficial for the mask to be precisely aligned with the target position, since a misaligned mask can lead to a deterioration in the quality of the layers deposited on the substrate. For example, in order to manufacture an OLED, for example, to provide patterns with very small dimensions on a substrate, precise alignment of the masking device is required.

[0005] In view of the above, there is a need for methods and apparatuses that can provide improved alignment of a masking device.

[0006] According to an embodiment, a method is provided. The method includes contactlessly floating the mask assembly. The mask assembly includes a carrier and a masking device supported by the carrier. The method includes controlling the shape of the carrier while the mask assembly is non-contactly floating.

[0007] According to a further embodiment, a method is provided. The method includes contactlessly floating the first mask assembly by a first plurality of magnetic levitation forces. The first mask assembly includes a first carrier and a first masking device supported by the first carrier. The method includes measuring an alignment of the first masking device while the first mask assembly is non-contactly floating by the first plurality of magnetic levitation forces. The method includes calculating a second plurality of magnetic levitation forces. The method includes contactlessly floating the mask assembly by a second plurality of magnetic levitation forces. The mask assembly includes a carrier and a masking device supported by the carrier. The mask assembly is a first mask assembly or a second mask assembly. The second plurality of magnetic levitation forces provide for deformation of the carrier.

[0008] According to a further embodiment, an apparatus is provided. The apparatus includes a magnetic levitation system comprising a plurality of magnetic units. The apparatus includes a mask assembly including a carrier and a masking device supported by the carrier. The apparatus includes a control unit connected to a plurality of magnetic units. The device is configured to control the shape of the carrier while the mask assembly is non-contact floating.

[0009] The entire disclosure, which enables one of ordinary skill in the art to practice, is set forth in more detail in the remainder of this specification including reference to the accompanying drawings.
1 illustrates a deposition process for manufacturing an OLED.
2 shows the mask assembly in a horizontal orientation.
3 shows a mask assembly in a horizontal orientation, the mask assembly including a mask support.
4 shows the mask assembly in a vertical orientation.
5 shows a mask assembly in a vertical orientation, the mask assembly including a mask support.
6 and 7 illustrate a method according to embodiments described herein.
8A and 8B illustrate variations of the carrier provided by a plurality of magnetic levitation forces.
9A and 9B illustrate a method according to embodiments described herein.
10-12 illustrate an apparatus according to embodiments described herein.

[0010] Reference will now be made to various embodiments in detail, and one or more examples of the various embodiments are illustrated in the drawings. Within the following description of the drawings, like reference numbers refer to like components. In general, only the differences for the individual embodiments are described. Each example is provided as an explanation and is not intended to be limiting. Additionally, features illustrated or described as part of an embodiment may be used in conjunction with or with other embodiments to create further additional embodiments. It is intended that this description include such modifications and variations.

[0011] Embodiments described herein involve non-contact lifting of a mask assembly. The term “non-contact” as used throughout the present disclosure may be understood to mean that the weight of the mask assembly is held by magnetic force rather than by mechanical contact or mechanical forces. Specifically, the mask assembly may be held in a floating or floating state using magnetic forces instead of mechanical forces. In some implementations, there may be no mechanical contact between the mask assembly and the rest of the device, such as during the rise of the mask assembly in the system, and such as during alignment.

Compared to mechanical devices for guiding a mask assembly in a processing system, an advantage is that the non-contact injury is not affected from friction that affects the precision and/or linearity of the positioning and alignment of the mask assembly. The non-contact floating of the mask assembly enables frictionless movement of the mask assembly, where, for example, the position of the mask assembly relative to the masked substrate by the masking device in the deposition process can be controlled and maintained with high precision. .

[0013] For example, non-contact floating of the mask assembly during the deposition process is beneficial in that no particles are generated due to mechanical contact between sections of the device, such as mechanical rails and the mask assembly. Thus, since particle generation is minimized, especially when using non-contact flotation, the non-contact flotation provides improved purity and uniformity of the layers deposited on the substrate.

[0014] According to embodiments that can be combined with other embodiments described herein, the deposition or coating process may be or include a thermal evaporation process, a PVD process, a CVD process, and/or a sputter process. have. A deposition source can be provided to perform the deposition process.

[0015] In the present disclosure, the term “substantially parallel” directions may include directions forming a small angle of up to 10 degrees or even up to 15 degrees between each other. The term “substantially perpendicular” directions may include directions that form an angle between each other of less than 90 degrees, such as at least 80 degrees or at least 75 degrees. Similar considerations apply for concepts of substantially parallel or vertical axes, planes, regions, orientations, etc.

Some embodiments described herein involve concepts of “substantially vertical” orientation, plane, orientation, and the like. The substantially perpendicular direction is considered to be a direction substantially parallel to the direction in which gravity extends. The substantially vertical direction can deviate from the exact vertical (the exact vertical is defined by gravity), for example by an angle of up to 15 degrees.

[0017] The embodiments described herein may further involve the concept of a “substantially horizontal” direction, a plane, or an orientation. It should be understood that the substantially horizontal direction is to be distinguished from the substantially vertical direction. The substantially horizontal direction can be substantially perpendicular to the exact vertical direction defined by gravity.

1 shows a schematic diagram of a deposition process for manufacturing OLEDs on a substrate 10.

To manufacture OLEDs, organic molecules are generated by the deposition source 30 (eg, evaporated, sputtered, sprayed, etc.) and deposited on the substrate 10. A masking device 20 is positioned between the substrate 10 and the deposition source 30. The masking device 20 may, for example, have a specific pattern provided by a plurality of openings or holes 23, and thus, to deposit a layer or film of an organic compound on the substrate 10, organic molecules are It passes through openings or holes 23 (eg, along path 32 ). Using different masking devices, or different positions of the masking device 20 relative to the substrate 10, for example to create pixels with different color characteristics, a plurality of layers or films may be deposited on the substrate 10. I can. For example, a first layer or film may be deposited to create red pixels 34, a second layer or film may be deposited to create green pixels 36, and create blue pixels 38 A third layer or film may be deposited to do so. The layer(s) or film(s), such as an organic semiconductor, may be arranged between two electrodes, such as an anode and a cathode (not shown). At least one of the two electrodes may be transparent.

[0020] The substrate 10 and masking device 20 may be arranged in a substantially vertical orientation during the deposition process. In FIG. 1, arrows indicate a vertical direction 40 and two horizontal directions 50 and 60.

According to embodiments that may be combined with other embodiments described herein, the masking device 20 is configured to mask the substrate 10, such as in a deposition process. Masking device 20 may prevent one or more portions of substrate 10 from being coated in the deposition process. During deposition, the deposition material is released toward the substrate 10. The masking device may be arranged in such a way that a portion of the deposition material emitted towards the substrate 10 impinges on the masking device 20 to prevent a portion of the substrate 10 from being coated.

According to embodiments that may be combined with other embodiments described herein, the masking device 20 may comprise a plurality of openings. The plurality of openings may be configured to allow the deposition material to pass through the masking device 20 and be deposited on the substrate 10 masked by the masking device 20. The plurality of openings may define a pattern.

According to embodiments that can be combined with other embodiments described herein, the masking device 20 may be a flexible masking device. The masking device 20 may have mechanical properties similar to a foil or sheet. The masking device 20 may be a sheet of masking material or may comprise a sheet of masking material. According to embodiments described herein, the masking device 20 may be supported by a mask support, such as a mask frame.

[0024] According to embodiments that may be combined with other embodiments described herein, the masking device 20 may be configured to mask a large area substrate.

2 shows a mask assembly 200 according to embodiments described herein. The mask assembly 200 includes a carrier 210. The mask assembly 200 includes a masking device 20 supported by a carrier 210. The mask assembly 200 shown in FIG. 2 is oriented substantially horizontally.

According to embodiments that may be combined with other embodiments described herein, the carrier 210 may be a carrier adapted to carry or support the masking device 20. The carrier 210 may define a plane.

[0027] The carrier 210 shown in FIG. 2 is in an unmodified state. For example, the carrier 210 may be a carrier 210 seated on a flat support with the carrier 210 in a horizontal orientation. No forces are applied to the carrier 210 that act to change the shape of the carrier 210. As shown in FIG. 2, the periphery of the undeformed carrier may include substantially straight edges. The masking device 20 shown in FIG. 2 is in an unmodified state. The unmodified masking device 20 may have a rectangular shape. As shown in FIG. 2, the periphery of the unmodified masking device may include substantially straight edges.

[0028] According to embodiments that may be combined with other embodiments described herein, the mask assembly 200 may include a mask support. 3 shows a mask assembly 200 including a mask support 310. In the exemplary embodiment shown in FIG. 3, the mask support 310 is a mask frame. The masking device 20, such as a flexible masking device, is supported by the mask support 310. The masking device 20 is connected to the mask support 310 by, for example, spot welding. The mask support 310 is attached to the carrier 210, for example by means of one or more fasteners, such as screws or bolts. The mask assembly 200 shown in FIG. 3 is provided in a substantially horizontal orientation. The carrier 210, the mask support 310, and the masking device 20 shown in FIG. 3 are in an unmodified state. As shown in FIG. 3, the undeformed mask support, eg, the periphery of the mask frame, may include substantially straight edges.

Parts of the mask assembly, such as the carrier 210, the masking device 20, and/or the mask support 310 may be connected to each other to assemble the mask assembly. Assembly of the mask assembly 200 may be performed in a state in which the mask assembly 200 is in a substantially horizontal orientation. After assembling the mask assembly 200, the mask assembly 200 may be provided in a substantially vertical orientation, such as for a subsequent coating process. Before, during, or after assembly of the mask assembly 200, the substrate may be positioned and/or fixed relative to the mask assembly 200 or masking device 20. Additional devices, such as at least one of a carrier, a substrate frame, and a substrate holding arrangement, may be provided and may be used to position and hold the substrate.

4 shows a mask assembly 200 comprising a carrier 210 and a masking device 20, according to embodiments described herein. The mask assembly 200 is provided in a substantially vertical orientation. According to embodiments described herein, the mask assembly 200 may include a mask support (not shown). For example, the masking device 20 may be a flexible masking device connected to the mask frame.

[0031] The substantially vertically oriented masking device 20 shown in FIG. 4 is in a deformed state. The shape of the masking device 20 shown in FIG. 4 is different from the shape of the unmodified masking device, for example, the masking device 20 shown in FIG. 3. The deformed state of the masking device 20 is schematically represented in FIG. 4 by the curved shape of the upper and lower edges of the masking device 20. Deformation of the masking device 20 may be caused by gravity (illustrated by arrow 450) acting on parts of the mask assembly, such as the masking device or mask support. The modified masking device 20 may comprise at least one curved edge, such as a curved horizontal edge.

[0032] Deformation of the masking device may be due to the connection of the masking device to a mask support, such as a mask frame. 5 shows a mask assembly 200 according to embodiments described herein. The mask assembly 200 is provided in a substantially vertical orientation. The mask assembly 200 includes a mask frame 510. The mask frame 510 is connected to the carrier 210 by fasteners, such as screws. Two fasteners 515 are shown in FIG. 5. Additional fasteners may be provided. The mask assembly 200 includes a masking device 20 (not shown in FIG. 5) connected to the mask frame 510. The mask frame 510 has one or more frame elements, such as a first frame element 522, a second frame element 524, a third frame element 526, and a fourth frame element 528. I can.

[0033] Gravity acts on the mask assembly 200 and may cause deformation, such as bending, of at least a portion of the masking device 20 and/or the mask frame 510. Gravity may in particular lead to a deformation, such as bending (indicated by solid lines) of horizontally oriented frame elements, such as the first frame element 522 and the second frame element 524. The undeformed shape of the mask frame 510 is indicated by broken lines in FIG. 5. The masking device 20 shown in FIG. 5 is deformed. The masking device 20 may be deformed due to the connection of the masking device 20 to the mask frame 510.

[0034] The modified masking device and the modified mask frame shown in the figures are shown in a schematic manner. The modified masking device may have a shape different from the shape shown in FIG. 4. The modified mask frame may have a shape different from the shape shown in FIG. 5.

[0035] For example, tension forces may be present. Tensile forces can affect the shape of the mask frame and/or masking device. Tensile forces can be provided to manage the thermal expansion of the mask, such as during the deposition process. In the case where sufficient tension is present, increasing the temperature changes only the mask tension, not the pixel position.

Deformation of the masking device 20 may result in misalignment of the masking device 20 with respect to the substrate. The quality and/or alignment of the deposited layer(s) may be degraded. For example, in the case of a flexible mask attached to the mask frame, the misalignment of the masking element caused by the deformation of the mask frame is an order of magnitude comparable to the size of structures on the substrate provided by the masking device. magnitude). For example, for a mask device thickness of about 50 microns, the mask positioning precision can be about 2 microns, and the vertical deformation of the masking device can be at least 2.5 microns.

[0037] Figure 6 illustrates a method according to embodiments described herein.

6 shows a plurality of magnetic units 610. Individual magnetic units among the plurality of magnetic units 610 are denoted by reference numeral 615. The plurality of magnetic units 610 provides a plurality of magnetic levitation forces 620. Individual magnetic levitation forces among the plurality of magnetic levitation forces 620 are denoted by reference numeral 625. Each of the magnetic levitation forces 625 among the plurality of magnetic levitation forces 620 extends in a substantially vertical direction, for example, a second direction 694.

6 shows a first direction 692. The first direction may be a substantially horizontal direction. 6 shows a second direction 694. The second direction 694 may be a substantially vertical direction.

6 shows a mask assembly 200 including a carrier 210 and a masking device 20 supported by the carrier 210. A plurality of magnetic levitation forces 620 act on the mask assembly 200. The mask assembly 200 is floated in a non-contact manner by a plurality of magnetic levitation forces 620.

[0041] According to embodiments that can be combined with other embodiments described herein, for example, by a plurality of magnetic levitation forces 620, while the mask assembly 200 is non-contactly floating, the carrier ( 210) has a substantially vertical orientation.

During the non-contact levitation of the mask assembly 200 by a plurality of magnetic levitation forces 620, the carrier 210 is deformed. The non-contact floating carrier has a different shape compared to the non-deformed carrier.

According to embodiments that may be combined with other embodiments described herein, the deformation of the carrier 210 may be provided by a plurality of magnetic levitation forces 620. The magnitudes of the plurality of magnetic levitation forces can be controlled, for example, by a control unit according to embodiments described herein to provide a target deformation of the carrier 210.

[0044] Two or more of the plurality of magnetic levitation forces 620 may have different sizes. In Fig. 6, different magnitudes of the magnetic levitation forces are indicated by upward arrows having different lengths. Magnetic levitation forces with different sizes can provide deformation of the carrier 210. In FIG. 6, the modified carrier 210 includes a curved upper edge 630.

A variation of the carrier 210 may be provided to align the masking device 20 supported by the carrier 210. The masking device 20 is mechanically coupled to the carrier 210 in a manner that allows the shape, position, and/or alignment of the masking device 20 to be adjusted and/or controlled by deforming the carrier 210. do.

[0046] For example, according to embodiments described herein, the masking device may be attached to a mask support (not shown in FIG. 6), such as a mask frame. The mask support may be attached to the carrier 210. By deforming the carrier 210, the shape, position, and/or alignment of the mask support connected to the carrier 210 can be adjusted and/or controlled. The connection of the masking device to the mask support makes it possible to align the masking device.

In FIG. 6, the masking device 20 of the non-contact floating mask assembly 200 is in a well-aligned position. The masking device 20 shown in FIG. 6 has a rectangular shape. The masking device 20 is in a substantially unmodified state. The upper edge 640 of the masking device 20 is straight. The upper edge 640 is aligned with a reference axis 642 that defines the target alignment of the masking device 20. The lower edge 650 of the masking device 20 is straight. The lower edge 650 is aligned with a reference axis 652 that defines the target alignment of the masking device 20. The well-aligned position of the masking device 20 is provided by the deformation of the carrier 210 provided by a plurality of magnetic levitation forces 620.

[0048] In view of the above, a method is provided. The method includes contactlessly floating the mask assembly 200. The mask assembly 200 may be floated in a non-contact manner by, for example, a plurality of magnetic levitation forces 620. The plurality of magnetic levitation forces 620 may be provided by the plurality of magnetic units 610. The mask assembly includes a carrier 210 and a masking device 20 supported by the carrier. The masking device 20 may be adapted to mask a substrate. The method includes controlling the shape of the carrier while the mask assembly is non-contactly floating.

By controlling the shape of the carrier 210, the embodiments described herein enable the masking device 20 to be aligned. Misalignment of the masking device 20 may be compensated or corrected.

The misalignment, which may be corrected by the method according to the embodiments described herein, is the masking device 20 and/or the mask support 310 supporting the masking device 20, such as a mask frame 510. ). For example, the vertically oriented masking device 20 can be deformed during non-contact floating, since the masking device 20 is connected to the mask frame, which can bend under the influence of gravity acting on the mask frame. The method according to the embodiments described herein makes it possible to compensate for the deformation of the mask support. By controlling the shape of the carrier, a well-aligned masking device 20 can be provided. Controlling the shape of the carrier 210 may include deforming the carrier 210, for example, to compensate for the deformation of the mask support and/or the masking device. The well-aligned masking device 20 has the advantage that an improved quality of the layers deposited on the substrate can be provided.

According to embodiments that can be combined with other embodiments described herein, the mask assembly 200 may be non-contactly floated by a plurality of magnetic levitation forces 620. The shape of the carrier can be controlled by controlling a plurality of magnetic levitation forces 620. The shape of the carrier 210 can be controlled by controlling the magnitudes of the plurality of magnetic levitation forces 620 acting on the carrier. The shape of the carrier 210 may be controlled in a non-contact manner. For example, the deformation of the carrier can be provided in a non-contact manner. No mechanical parts, such as actuators for example, are required to control the shape of the carrier 210.

[0052] According to embodiments that can be combined with other embodiments described herein, the shape of the carrier can be controlled exclusively by non-contact forces, such as magnetic levitation forces. The deformation of the carrier 210 may be provided solely by non-contact forces. The deformation of the carrier 210 may be a non-contact deformation.

[0053] Contactless control of the shape of the carrier has the advantage that the generation of particles can be prevented, so that the quality and purity of the layers deposited on the substrate are improved.

In addition, the deformation of the carrier 210 provided by the plurality of magnetic levitation forces 620 may be provided by appropriately configuring and controlling the plurality of magnetic units 610. No additional components or devices for deforming the carrier 210, such as mechanical actuators, are required to provide the deformation, which provides a simple set-up and saves time, energy costs, and other resources. It has an advantage that can be.

According to embodiments that may be combined with other embodiments described herein, controlling the shape of the carrier 210 may include providing a deformation of the carrier 210.

[0056] The deformed carrier 210, for example, the carrier 210 deformed by a plurality of magnetic levitation forces 620, is the shape of the carrier 210 when the carrier 210 is not deformed Have different shapes. Magnetic levitation forces may act on the carrier 210 to change the shape of the carrier 210. The carrier 210 in the deformed state may include at least one edge having a curved shape. In particular, the horizontal edge of the deformed carrier, for example, the upper edge 630 shown in FIG. 6 may have a curved shape. The edge may be a straight line when the carrier is in an undeformed state. For example, FIG. 4 shows the carrier 210 in an undeformed state, where the upper edge 630 is straight.

[0057] According to embodiments that can be combined with other embodiments described herein, deformation of the carrier 210 provided by a plurality of magnetic levitation forces 620 to align the masking device 20 The silver carrier 210 may be a target modification. The magnitudes of the plurality of magnetic levitation forces, in particular the plurality of magnetic levitation forces, can be controlled, for example by the control unit 1010, to provide for deformation of the carrier 210.

In some implementations, controlling the shape of the carrier 210 may include maintaining the carrier 210 in a substantially undeformed state while the carrier 210 is floating in a non-contact manner. In such cases, a deformation of the non-contact floating carrier may not be provided. For example, by keeping the carrier undeformed, the upper edge of the carrier can be kept substantially straight during non-contact floating. The masking device 20 may be configured such that the masking device 20 is well-aligned when the non-contact floating carrier remains substantially undeformed.

[0059] According to embodiments described herein, the shape of the carrier may be controlled to align the masking device. For example, in order to align the masking device 20, a variation of the carrier 210 may be provided.

[0060] The alignment of the masking device 20 according to the embodiments described herein may be an alignment of the shape of the masking device 20. The shape of the carrier 210 can be controlled to align the shape of the masking device with the target shape. For example, by deforming the carrier 210, the shape of the masking device 20 can be controlled so that the masking device 20 has an unmodified shape, such as a substantially rectangular shape. Aligning the masking device 20 may include controlling the shape of the masking device such that at least one edge of the masking device, such as a horizontal edge, is substantially straight.

[0061] As described herein, the alignment of the masking device 20 involving affecting the shape of the masking device 20 and/or controlling the shape of the masking device 20 is the shape of the masking device 20 It differs from the alignment of the masking device 20, in which the position or orientation of the masking device is changed simply by translating or rotating the masking device without affecting the. For example, the alignment of the masking device 20 in which only the vertical position of the masking device 20 is adjusted is not possible to be used to control the shape of the masking device 20.

[0062] According to embodiments that can be combined with other embodiments described herein, the edge of the masking device 20, such as the upper edge 640 shown in FIG. 6, is moved in a substantially horizontal direction, such as a first direction. To align with 692, the shape of the carrier 210 can be controlled. For example, in order to align the edge of the masking device with a substantially horizontal direction, a deformation of the carrier 210 may be provided.

7 illustrates a method of aligning the masking device 20 according to embodiments described herein. 7 shows the mask assembly 200. The mask assembly 200 includes a mask frame 510. The masking device 20 is connected to the mask frame 510. The mask frame 510 is connected to the carrier 210. The deformation of the carrier 210 provided by the plurality of magnetic levitation forces 620 makes it possible to compensate for the deformation of the mask frame 510. While the mask assembly 200 is floating by the plurality of magnetic levitation forces 620, the mask frame and masking device are in a substantially undeformed state. The deformation of the carrier 210 allows the mask frame 510 to be aligned. For example, by providing a deformation of the carrier 210, the first frame element 522 and the second frame element 524 can be well-aligned with the horizontal reference axes 742 and 752, respectively. Warpage of the first frame element 522 and the second frame element 524 may be compensated by deformation of the carrier 210. The masking device 20 connected to the mask support 310 is well-aligned while the mask assembly 200 is floating by a plurality of magnetic levitation forces 620.

According to embodiments that may be combined with other embodiments described herein, the mask assembly 200 may include a mask support 310. The masking device 20 may be connected to the mask support. The mask support 310 may be connected to the carrier 210. The mask support 310 may be a mask frame 510.

[0065] The masking device 20 may be supported by the mask support 310 and/or may be attached to the mask support 310. The mask support 310 may be, for example, a rigid mask support for supporting the flexible masking device.

The mask support 310 may define a plane. The masking device 20 supported by the mask support 310 may define a plane. The plane defined by the masking device 20 supported by the mask support 310, the plane defined by the mask support 310, and/or the plane defined by the carrier supporting the masking device 20 are each other. They may be parallel or may be substantially parallel to each other.

The mask support 310 may be a mask frame 510. The mask frame 510 may define a window or an opening. The area of the window or opening may be 60% to 100% of the area of the masking device 20 supported by the mask frame 510. The masking device 20 may be attached to a mask support 310, such as a mask frame, at two or more peripheral portions of the masking device 20.

The mask frame 510 may include one or more frame elements. The window defined by the mask frame 510 may be surrounded by one or more frame elements. The frame element of the mask frame may have a bar-shape. The mask frame 510 may include a first frame element 522. The mask frame 510 may include a second frame element 524. The mask frame 510 may include a third frame element 526. The mask frame 510 may include a fourth frame element 528. The third frame element 526 may be adjacent to or connected to the first frame element 522. The second frame element 524 may be adjacent to or connected to the third frame element 526. The fourth frame element 528 may be adjacent to or connected to the second frame element. The first frame element 522 may be adjacent to or connected to the fourth frame element 528. When the mask frame 510 is in a substantially vertical orientation, e.g., while the mask assembly is floating non-contact as described herein, the first frame element 522 and/or the second frame element 524 It may extend in a horizontal direction or a substantially horizontal direction. When the mask frame 510 is in a substantially vertical orientation, the third frame element 526 and/or the fourth frame element 528 may extend in a vertical direction or a substantially vertical direction.

The mask support 310 may be supported by the carrier 210. The mask support 310 may be attached to the carrier 210. The mask support 310 may be attached to the carrier 210 at a plurality of coupling points. The mask support 310, for example the mask frame 510, may be attached to the carrier 210 by a plurality of fasteners, such as screws or bolts. For example, to attach the mask frame 510 to the carrier 210, at least two, for example, three or more fasteners may be used. The mask support 310 may be arranged between the carrier 210 and the masking device 20.

[0070] According to embodiments that can be combined with other embodiments described herein, the mask support 310 is, the deformation of the carrier 210 is the shape, alignment, and/or position of the mask support 310 It can be mechanically coupled to the carrier 210 in such a way that it is adjustable. For example, when the mask frame is attached to the carrier by a plurality of screws, the alignment of the mask support 310 can be changed by deforming the carrier 210.

[0071] According to embodiments that can be combined with other embodiments described herein, the masking device 20 supported by the carrier 210, the deformation of the carrier 210 is It can be mechanically coupled to the carrier 210 in a manner that allows adjustment of shape, alignment, and/or position. For example, when the flexible masking device is attached to the mask frame (here, the mask frame is attached to the carrier by a plurality of screws), the alignment of the masking device can be changed by deforming the carrier.

[0072] According to embodiments that can be combined with other embodiments described herein, the deformation of the mask support 310, in particular, the deformation of the mask support caused by gravity acting on the mask support 310 To compensate for, the shape of the carrier 210 may be controlled. For example, in order to compensate for the deformation of the mask support 310, the deformation of the carrier 210 may be provided.

[0073] The shape of the carrier 210 may be controlled to align the first frame element 522 of the mask frame 510 with a substantially horizontal direction, for example, the first direction 692. For example, in order to compensate for the deformation of the first frame element 522, the deformation of the carrier 210 may be provided. In order to align the first frame element 522 with a substantially horizontal direction, a deformation of the carrier 210 may be provided.

According to embodiments that can be combined with other embodiments described herein, the magnetic levitation force is a force acting on the mask assembly 200. The magnetic levitation force is configured to counter gravity acting on the mask assembly 200. The magnetic levitation force may be provided by one of the plurality of magnetic units 610. The magnetic levitation force extends in a vertical direction or in a substantially vertical direction.

According to embodiments that may be combined with other embodiments described herein, a plurality of magnetic levitation forces 620 together levitate the mask assembly 200.

According to embodiments that can be combined with other embodiments described herein, the plurality of magnetic levitation forces 620 are configured to provide a deformation of the carrier 210, in particular a target deformation. Variations may be provided to align the masking device 20 supported by the carrier 210.

According to embodiments that can be combined with other embodiments described herein, a plurality of magnetic levitation forces 620 are 2, 3, 4, 5, 6, 7, May contain 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20 or more maglev .

[0078] According to embodiments that can be combined with other embodiments described herein, the first magnetic levitation force among the plurality of magnetic levitation forces 620 is the first magnetic levitation force among the plurality of magnetic units 610 It can be provided by the unit. The second magnetic levitation force may be provided by the second magnetic unit among the plurality of magnetic units. The third magnetic levitation force may be provided by a third magnetic unit among the plurality of magnetic units 610. Each of the plurality of magnetic units 610 may provide one of the plurality of magnetic levitation forces 620.

Each of the plurality of magnetic levitation forces 620 has a magnitude. The magnitudes of the plurality of magnetic levitation forces 620 are provided and/or controlled to provide for deformation of the carrier 210. According to embodiments that can be combined with other embodiments described herein, at least two, particularly at least three, of the plurality of magnetic levitation forces 620 may have different magnitudes. Different sizes of the plurality of magnetic levitation forces 620 may provide deformation of the carrier 210.

[0080] The plurality of magnetic levitation forces 620 may include a first magnetic levitation force; Second magnetic levitation force; And it may include at least one of the third magnetic levitation force.

According to embodiments that may be combined with other embodiments described herein, the magnitude of the first magnetic levitation force may be different from the magnitude of the second magnetic levitation force.

According to embodiments that can be combined with other embodiments described herein, the magnitude of the second magnetic levitation force may be different from the magnitude of the first magnetic levitation force. The magnitude of the second magnetic levitation force may be different from the magnitude of the third magnetic levitation force.

[0083] The magnitudes of the plurality of magnetic levitation forces 620 may have several possible distributions or profiles. The distribution of sizes may depend on the target deformation of the carrier 210 to be provided by the plurality of magnetic levitation forces 620. 8A and 8B show two examples of possible distributions of the magnitudes of a plurality of magnetic levitation forces 620. Additional distributions may also be considered.

[0084] The plurality of magnetic levitation forces 620 shown in FIGS. 8A and 8B includes magnetic levitation forces 821, 822, 823, 824, and 825. As shown in Figure 8a, the magnitude of the magnetic levitation force 823 acting on the central portion of the carrier 210, the magnetic levitation forces acting on the outer left and outer right portions of the carrier 210, respectively May be larger than the sizes of 821 and 825 respectively. Alternatively, as shown in FIG. 8B, the magnetic levitation forces 821 and 825 may each have a magnitude greater than the magnitude of the magnetic levitation force 823.

[0085] As shown, the deformation of the carrier 210 provided by the plurality of magnetic levitation forces 620 shown in FIG. 8A is caused by the plurality of magnetic levitation forces 620 shown in FIG. 8B. It is different from the deformation of the carrier 210 provided. In both cases, a deformation of the carrier 210 is provided to align the masking device 20.

[0086] In order to provide a target deformation of the carrier 210 for aligning the masking device 20, information regarding which specific distribution of the magnitudes of the magnetic levitation forces is suitable, the mask assembly 200 is non-contact Can be obtained by performing one or more measurements while there is.

[0087] For example, one or more detectors, such as cameras, may be used to measure the alignment of a non-contact floating masking device. In some cases, it may be determined that there is a misalignment of the masking device 20. Misalignment can be corrected by providing suitable deformation of the carrier 210. Based on the measured misalignment of the masking device 20, a target distribution for the magnitudes of the magnetic levitation forces may be calculated to provide a target deformation of the carrier 210 to correct the misalignment. The magnitudes of the maglev forces that levitate the mask assembly 200 can then be adapted to match the calculated target distribution. By target distribution of force, the magnetic levitation forces that levitate the mask assembly provide a target deformation of the carrier 210. The deformation of the floated carrier 210 compensates for the misalignment of the masking device 20, and thus, the masking device 20 is now well-aligned.

[0088] The process may involve processing, for example, several mask assemblies of the same type and size, each of which includes carriers, masking devices, and optionally mask supports. Thus, the initial misalignment of the masking device caused, for example by gravity causing the mask support to bend, may be the same misalignment for all mask assemblies being processed. If the target deformation for one given carrier is determined to correct the misalignment, and the corresponding target distribution of the magnitudes of the maglev forces is calculated to provide the target deformation of that carrier, then repeat the measurement of the misalignment of subsequent masking devices. Without the need to, the same target distribution of sizes can be applied to subsequent mask assemblies that are floated and processed. The target distribution for the magnitudes of the magnetic levitation forces may be calculated once for one given mask assembly, and then applied to a plurality of subsequent mask assemblies that are non-contactly levitation by the plurality of magnetic units.

9A and 9B illustrate a method for aligning a masking device, according to embodiments described herein.

9A shows a mask assembly 200 that is non-contactly floated by a first plurality of magnetic levitation forces 910 provided by a plurality of magnetic units 610. Individual magnetic levitation forces among the first plurality of magnetic levitation forces 910 are denoted by reference numeral 915. The first plurality of magnetic levitation forces 910 may be an initial plurality of magnetic levitation forces not configured to provide deformation of the carrier 210. As shown in FIG. 9A, while the mask assembly 200 is non-contactly floating by the first plurality of magnetic levitation forces 910, the carrier 210 may be in a substantially unmodified state. For example, the magnitudes of the first plurality of magnetic levitation forces 910 may all be substantially the same. Each of the first plurality of magnetic levitation forces 910 may support the total weight of the mask assembly 200 at the same ratio.

9A, while the mask assembly 200 is non-contactly floating by the first plurality of magnetic levitation forces 910, the masking device and optionally the mask support 310 (not shown) Si) may be in a deformed state, for example caused by gravity acting on the masking device 20 and/or the mask support 310. As shown in FIG. 9A, while the mask assembly 200 is non-contactly floating by the first plurality of magnetic levitation forces 910, misalignment of the masking device 20 may exist. In the example shown in FIG. 9A, the upper edge of the masking device 20 is not well-aligned with the reference axis 642. The lower edge of the masking device 20 is not well-aligned with the reference axis 652. The misalignment of the masking device 20 may be due to a deformed state of the masking device 20 and/or the mask support part 310.

[0092] According to embodiments that may be combined with other embodiments described herein, the alignment of the masking device and/or the mask support is measured by one or more measurement devices, such as cameras or sensors. Can be. 9A shows two measurement devices 912 and 914 for measuring the alignment of the masking device. A single measurement device, or two or more measurement devices may also be provided. While the mask assembly 200 is non-contactly floating by the first plurality of magnetic levitation forces 910, the measurement device 912 and/or the measurement device 914 will be used to measure the alignment of the masking device. I can. Misalignment of the masking device 20 may be detected. In particular, from the measured alignment of the masking device 20, a deviation of the shape of the masking device 20 with respect to the target shape of the masking device 20 can be determined.

[0093] In order to compensate for the misalignment of the masking device 20, a target deformation of the carrier 210 may be determined. In particular, the second plurality of magnetic levitation forces 920 may be determined. The magnitudes of the second plurality of magnetic levitation forces 920 may, at least, be calculated from the measured alignment of the masking device 20. The second plurality of magnetic levitation forces 920 may be configured to provide deformation of the carrier 210 to compensate for misalignment of the masking device 20.

9B shows a second plurality of magnetic levitation forces 920 that non-contactly levitates the mask assembly 200. The second plurality of magnetic levitation forces 920 are provided by the plurality of magnetic units 610. Individual magnetic levitation forces of the second plurality of magnetic levitation forces 920 are denoted by reference numeral 925.

As shown in FIG. 9B, while the mask assembly 200 is non-contactly floating by the second plurality of magnetic levitation forces 920, the carrier 210 is in a deformed state. For example, the distribution of the magnitudes of the second plurality of magnetic levitation forces 920 may be non-uniform to provide a target deformation of the carrier 210. 9B, while the mask assembly 200 is non-contactly floating by the second plurality of magnetic levitation forces 920, the masking device 20, and optionally the mask support 310 (FIG. 9b) may be in a substantially unmodified state. As shown in FIG. 9B, while the mask assembly 200 is non-contactly floating by the second plurality of magnetic levitation forces 920, the masking device 20 is well-aligned. In the example shown in FIG. 9B, the upper edge of the masking device 20 is aligned with the reference axis 642. The lower edge of the masking device 20 is aligned with the reference axis 652.

[0096] As described above, if the magnitudes of the second plurality of magnetic levitation forces 920 are calculated for the masking device 20, there is no need to repeat the measurement of misalignment and calculation of the distribution of magnetic levitation forces, The second plurality of magnetic levitation forces may also be applied to levitate and align one or more additional mask assemblies.

[0097] According to an embodiment, a method of aligning a masking device is provided. The method includes contactlessly floating a first mask assembly, eg, mask assembly 200, by a first plurality of magnetic levitation forces 910. The first mask assembly includes a first carrier and a first masking device supported by the first carrier. The first plurality of magnetic levitation forces may be provided by the plurality of magnetic units 610. The method includes measuring the alignment of the first masking device while the first mask assembly is non-contactly floating by the first plurality of magnetic levitation forces 910. The method includes, in particular, calculating, at least, from the measured alignment of the first masking device, a second plurality of magnetic levitation forces 920. The second plurality of magnetic levitation forces 920 may be calculated for the plurality of magnetic units 610. For example, the method can include calculating, at least, from the measured alignment of the first masking device, the magnitudes of the second plurality of magnetic levitation forces 920. The method includes contactlessly floating the mask assembly by a second plurality of magnetic levitation forces 920. The mask assembly includes a carrier and a masking device supported by the carrier. The mask assembly is a first mask assembly or a second mask assembly. The second plurality of magnetic levitation forces 920 provides deformation of the carrier. For example, a modification of the carrier can be provided to align the masking device.

The first mask assembly according to the embodiments described herein may be the mask assembly 200 according to the embodiments described herein. The first carrier according to the embodiments described herein may be the carrier 210 according to the embodiments described herein. The first masking device according to the embodiments described herein may be the masking device 20 according to the embodiments described herein. The first mask assembly may include the mask support 310 according to the embodiments described herein. Features and aspects described herein with respect to the mask assembly 200, the carrier 210, and the masking device 20, according to the embodiments described herein, also, in accordance with the embodiments described herein, It is applied to a first mask assembly, a first carrier, and a first masking device.

[0099] The second plurality of magnetic levitation forces 920 according to embodiments described herein may be a plurality of magnetic levitation forces 620 according to embodiments described herein. The second mask assembly according to the embodiments described herein may be the mask assembly 200 according to the embodiments described herein. The second mask assembly may include a carrier 210, a masking device 20 and/or a mask support 310, according to embodiments described herein. Features and aspects described herein with respect to the plurality of magnetic levitation forces 620 and the mask assembly 200 also include a second plurality of magnetic levitation forces 920 and It is applied to the second mask assembly.

[00100] According to embodiments that may be combined with other embodiments described herein, at least two of the second plurality of magnetic levitation forces may have different magnitudes.

[00101] According to embodiments that may be combined with other embodiments described herein, the method comprises, at least, from the measured alignment of the first masking device, the deviation of the shape of the first masking device from the target shape. It may include the step of determining. The shape of the first masking device for which the deviation is determined may be the shape of the first masking device during non-contact levitation of the first masking device by the first plurality of magnetic levitation forces 910. The target shape may be a shape of the first masking device that is not substantially deformed.

[00102] According to embodiments that may be combined with other embodiments described herein, the second plurality of magnetic levitation forces 920 are provided to non-contactly levitate the first mask assembly. The method may include changing from a first plurality of magnetic levitation forces to a second plurality of magnetic levitation forces while the first mask assembly is non-contactly floating.

According to a further embodiment and as illustrated in FIG. 10, an apparatus 1000 is provided. The apparatus 1000 comprises a magnetic levitation system comprising a plurality of magnetic units 610. The device 1000 includes a mask assembly 200. The mask assembly 200 includes a carrier 210 and a masking device 20 supported by the carrier. The apparatus 1000 includes a control unit 1010 connected to a plurality of magnetic units 610. The apparatus 1000 is configured to control the shape of the carrier 210 while the mask assembly 200 is floating in a non-contact manner.

[00104] According to embodiments that can be combined with other embodiments described herein, the control unit 1010 controls the shape of the carrier 210 while the mask assembly 200 is floating in a non-contact manner. To do this, it may be configured to control a plurality of magnetic units 610.

[00105] According to embodiments that can be combined with other embodiments described herein, a plurality of magnetic units 610 may non-contactly float the mask assembly 200, a plurality of magnetic levitation forces ( 620). The control unit 1010 may be configured to control a plurality of magnetic levitation forces 620 to control the shape of the carrier 210, eg, to provide a deformation of the carrier 210. The control unit 1010 may be configured to control a plurality of magnetic levitation forces 620 to align the masking device 20, to provide a deformation of the carrier 210.

[00106] The apparatus 1000 according to the embodiments performs any of the method features according to the embodiments of the methods described herein, in particular, any of the features described in the dependent method claims. Can be adapted to do. The control unit as described herein may be adapted to perform any of the method features of the embodiments of the methods described herein, in particular any of the features described in the dependent method claims.

[00107] According to embodiments that can be combined with other embodiments described herein, the plurality of magnetic units 610 may include a first magnetic unit. The plurality of magnetic units 610 may include a second magnetic unit. The plurality of magnetic units 610 may include a third magnetic unit. The plurality of magnetic units 610 may include additional magnetic units. A plurality of magnetic units 610 are 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15 , 16, 17, 18, 19, 20 or more magnetic units. For example, the plurality of magnetic units 610 may include 5 to 20 magnetic units with one degree of freedom.

[00108] According to embodiments that may be combined with other embodiments described herein, any of the plurality of magnetic units 610 may be an active magnetic unit. The plurality of magnetic units 610 may be a plurality of active magnetic units.

[00109] According to embodiments that can be combined with other embodiments described herein, the active magnetic unit provides a magnetic levitation force extending in a vertical direction, such as a second direction 694 shown in the figures. It can be configured to generate a magnetic field for The active magnetic unit can be controlled to provide an adjustable magnetic field. The adjustable magnetic field can be a static or dynamic magnetic field. The active magnetic unit includes: an electromagnetic device; Solenoid; coil; Superconducting magnets; Or it may be an element selected from the group consisting of any combination thereof, or may include the element.

[00110] The term "active" magnetic unit is used herein to distinguish it from the concept of a "passive" magnetic unit. A passive magnetic unit may refer to an element having magnetic properties that are not subject to active control or regulation, at least that are not subject to active control or regulation during operation of the device. For example, the magnetic properties of the passive magnetic unit may not be actively controlled during non-contact levitation of the mask assembly. The passive magnetic unit may be a magnetic material, such as a ferromagnetic material, may be a permanent magnet, or may have permanent magnetic properties.

[00111] Compared to the passive magnetic unit, the active magnetic unit provides more flexibility and precision, taking into account the tunability and controllability of the magnetic field generated by the active magnetic unit.

[00112] While the mask assembly 200 is non-contactly floating by the plurality of magnetic units 610, the plurality of magnetic units 610 may be arranged on the mask assembly 200.

[00113] According to embodiments that may be combined with other embodiments described herein, the apparatus 1000 includes one or more measurement devices, such as measurement devices 912 and 914 shown in FIG. 11. It may include. One or more measurement devices may be configured to measure the alignment of the masking device 20 and/or the mask support 310. One or more measurement devices are used to measure the alignment of the masking device 20 and/or the mask support 310 while the mask assembly 200 is non-contactly floating by the plurality of magnetic units 610. Can be configured. The control unit 1010 can be connected to one or more measuring devices. The control unit 1010 may be configured to calculate the magnitudes of the plurality of magnetic levitation forces 620. The sizes may be calculated based on the alignment of the masking device 20 measured by at least one or more measurement devices.

According to embodiments that may be combined with other embodiments described herein, apparatus 1000 may include a processing chamber 1120. 11 shows the processing chamber 1120. A plurality of magnetic units 610 may be arranged in the processing chamber 1120. One or more measurement devices, such as measurement devices 912 and/or 914, may be arranged in the processing chamber 1120.

[00115] The processing chamber 1120 may be a vacuum chamber. The processing chamber can be a vacuum deposition chamber.

According to embodiments that can be combined with other embodiments described herein, apparatus 1000 includes a deposition source, in particular, a deposition source for coating a substrate masked by the masking device 20. can do. During coating, the substrate may be supported by a carrier 210 or an additional carrier. During coating, the substrate can be floated contactlessly. The deposition source may be arranged in the processing chamber 1120. The deposition source may include, for example, a target with the deposition material thereon, or any other arrangement that allows the material to be released for deposition onto a substrate. The deposition source may comprise a rotatable target. The deposition material may be selected depending on the deposition process and the future application of the coated substrate. For example, the deposition material can be an organic material used in the manufacture of OLEDs. For example, the deposition material of the deposition source may be a material including small molecules, polymers, and phosphorescent materials. For example, the evaporation material includes chelates (e.g., Alq ₃ ), fluorescent and phosphorescent dyes (e.g., perylene, rubrene, quinacridone derivatives, etc.), and conjugated dendrimers. ) Can be selected from the group containing.

12 shows an apparatus 1000 according to embodiments described herein. The apparatus 1000 shown in FIG. 12 comprises a magnetic levitation system comprising a plurality of magnetic units 610, such as active magnetic units, such as electromagnetic devices, solenoids, coils or superconducting magnets. The magnetic levitation system extends in a first direction 692, which may be a substantially horizontal direction. The mask assembly 200 may be movable in the first direction 692 with respect to the plurality of magnetic units 610. As shown in FIG. 12, the mask assembly 200 may be connected, eg attached to, a first passive magnetic unit 1210, such as a bar of ferromagnetic material.

[00118] According to embodiments that may be combined with other embodiments described herein, the mask assembly 200 includes one or more magnetic units, such as a first passive magnetic unit as shown in FIG. 12. Can be connected to (1210). The magnetic field provided by the plurality of magnetic units 610, such as active magnetic units, and the magnetic properties of one or more magnetic units connected to the mask assembly 200, such as the first passive magnetic unit 1210 By interaction, a magnetic levitation force acting on the mask assembly 200 may be provided. The interaction provides magnetic attraction between the plurality of magnetic units 610 and the first passive magnetic unit 1210. The magnetic attraction provides an upward force acting on the first passive magnetic unit 1210. The mask assembly 200 connected to the first passive magnetic unit 1210 is floated in a non-contact manner by an upward force.

[00119] For example, the carrier 210 of the mask assembly 200 may be mechanically coupled, eg attached, to the first passive magnetic unit 1210. The plurality of magnetic levitation forces 620 may act on the carrier 210 through mechanical coupling of the carrier 210 to the first passive magnetic unit 1210. The action of the plurality of magnetic levitation forces 620 on the carrier 210 through the connection of the carrier 210 to the first passive magnetic unit 1210 can be controlled to provide deformation of the carrier 210. For example, by providing a plurality of magnetic levitation forces 620 having different sizes, upward forces acting on the carrier 210 may be provided, where the upward forces are the carrier 210 in the first direction 692. ) Have different sizes along the length. Upward forces with different sizes can be configured to provide a target deformation of the carrier 210.

According to embodiments that can be combined with other embodiments described herein, a plurality of magnetic units 610 may be arranged in a first direction 692. The plurality of magnetic units 610 may be a linear array of magnetic units extending in the first direction 692.

[00121] The plurality of magnetic levitation forces 620 may be spaced apart from each other in the first direction 692. The first magnetic levitation force of the plurality of magnetic levitation forces may be spaced apart from the second magnetic levitation force of the plurality of magnetic levitation forces in the first direction 692. The third magnetic levitation force among the plurality of magnetic levitation forces may be spaced apart from the second magnetic levitation force in the first direction 692.

According to embodiments that can be combined with other embodiments described herein, the plurality of magnetic units 610 may extend in the first direction 692. The plurality of magnetic levitation forces may include a first magnetic levitation force and a second magnetic levitation force. The second magnetic levitation force may be spaced apart from the first magnetic levitation force in the first direction 692. The magnitude of the second magnetic levitation force may be different from the magnitude of the first magnetic levitation force. The plurality of magnetic levitation forces 620 may include a third magnetic levitation force spaced apart from the second magnetic levitation force in the first direction 692.

[00123] According to embodiments that can be combined with other embodiments described herein, the substrate 10 may be a large area substrate. The large area substrate may have a size of at least 0.67 m ² . The size can be about 0.67 m ² (0.73 x 0.92 m-Gen 4.5) to about 8 m ² , more specifically about 2 m ² to about 9 m ² , or even up to 12 m ² . For example, a large area substrate is GEN 4.5 corresponding to about 0.67 m ² substrates (0.73 x 0.92 m), GEN 5 corresponding to about 1.4 m ² substrates (1.1 mx 1.3 m), about 4.29 m ² substrates ( GEN 7.5 corresponding to 1.95 mx 2.2 m), GEN 8.5 corresponding to about 5.7 m ² substrates (2.2 mx 2.5 m), or even 10 days GEN corresponding to about 8.7 m ² substrates (2.85 mx 3.05 m) I can. Even larger generations such as GEN 11 and GEN 12 and corresponding substrate areas can similarly be implemented.

[00124] The term “substrate” as used herein refers to non-flexible substrates, such as glass substrates, wafers, transparent crystals, such as slices or glass plates such as sapphire, and flexible substrates, such as web or foil. Includes all. According to embodiments that can be combined with other embodiments described herein, the embodiments described herein can be utilized for display PVD, such as sputter deposition on large area substrates for the display market. have.

[00125] Although the foregoing relates to the embodiments of the present disclosure, other and additional embodiments may be devised without departing from the basic scope of the present disclosure, and the scope of the present disclosure is covered by the following claims. Is determined by

Claims (15)

A method of masking a substrate in a substantially vertical orientation, comprising:
Contactlessly floating a mask assembly (200) comprising a carrier (210) and a masking device (20) supported in a substantially vertical orientation by the carrier; And
Controlling the shape of the carrier to compensate or correct for misalignment or deformation of the masking device while the mask assembly is non-contact floating.
Containing,
A method of masking a substrate in a substantially vertical orientation. The method of claim 1,
The mask assembly is non-contact floating by a plurality of magnetic levitation forces (620, 920), the shape of the carrier is controlled by controlling the plurality of magnetic levitation forces,
A method of masking a substrate in a substantially vertical orientation. The method of claim 2,
At least two of the plurality of magnetic levitation forces have different magnitudes,
A method of masking a substrate in a substantially vertical orientation. The method of claim 1,
Controlling the shape of the carrier comprises providing a deformation of the carrier,
A method of masking a substrate in a substantially vertical orientation. The method of claim 1,
The shape of the carrier is controlled to align the masking device,
A method of masking a substrate in a substantially vertical orientation. The method according to any one of claims 1 to 5,
The mask assembly further includes mask support portions 310 and 510,
The masking device is connected to the mask support, and the mask support is connected to the carrier,
A method of masking a substrate in a substantially vertical orientation. The method of claim 6,
The shape of the carrier is controlled to compensate for the deformation of the mask support,
A method of masking a substrate in a substantially vertical orientation. The method of claim 6,
The mask support part is a mask frame 510,
The mask frame comprises a first frame element (522), and the shape of the carrier is controlled to align the first frame element with a substantially horizontal direction (692),
A method of masking a substrate in a substantially vertical orientation. The method according to any one of claims 1 to 5,
The shape of the carrier is controlled solely by contactless forces,
A method of masking a substrate in a substantially vertical orientation. As a method,
Floating the first mask assembly 200 in a non-contact manner by the first plurality of magnetic levitation forces 910-The first mask assembly includes a first carrier 210 and a first carrier supported by the first carrier. 1 including masking device 20 -;
Measuring the alignment of the first masking device while the first mask assembly is non-contactly floating by the first plurality of magnetic levitation forces;
Calculating a second plurality of magnetic levitation forces 920; And
Non-contact levitation of the mask assembly by the second plurality of magnetic levitation forces
Including,
The mask assembly includes a carrier and a masking device supported by the carrier, the mask assembly being the first mask assembly or the second mask assembly,
The second plurality of magnetic levitation forces provide for deformation of the carrier,
Way. The method of claim 10,
At least two magnetic levitation forces of the second plurality of magnetic levitation forces have different sizes,
Way. The method of claim 10 or 11,
At least, from the measured alignment of the first masking device, determining a deviation of the shape of the first masking device from a target shape,
Way. As the device 1000,
A magnetic levitation system including a plurality of magnetic units 610;
A mask assembly 200 comprising a carrier 210 and a masking device 20 supported by the carrier in a substantially vertical orientation; And
A control unit 1010 connected to the plurality of magnetic units
Including,
The apparatus is configured to control the shape of the carrier to compensate or correct for misalignment or deformation of the masking device while the mask assembly is non-contactly floating,
Device. The method of claim 13,
The control unit is configured to control the plurality of magnetic units, in order to control the shape of the carrier, while the mask assembly is non-contactly floating,
Device. The method of claim 13 or 14,
Further comprising one or more measurement devices (912, 914) configured to measure the alignment of the masking device,
Device.

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