WO2020030242A1

WO2020030242A1 - Deposition apparatus having a mask aligner, mask arrangement for masking a substrate, and method for masking a substrate

Info

Publication number: WO2020030242A1
Application number: PCT/EP2018/071267
Authority: WO
Inventors: Matthias HEYMANNS
Original assignee: Applied Materials, Inc.
Priority date: 2018-08-06
Filing date: 2018-08-06
Publication date: 2020-02-13
Also published as: KR20200017381A; CN111010877A; TW202031914A; JP2020535304A

Abstract

The present disclosure provides a deposition apparatus (100) for depositing one or more layers on a substrate (10). The deposition apparatus comprises a vacuum chamber (60), a transport system (50) for transporting a mask carrier (23) configured for supporting a mask frame (21) having a mask (22) mounted to the mask frame (21), and an aligner system (40) comprising a plurality of first aligner devices (41) at least partially provided in the vacuum chamber (60), the plurality of first aligner devices (41) contacting the mask carrier (23) or a mask support, and a plurality of second aligner devices (42) at least partially provided in the vacuum chamber (60), the plurality of second aligner devices (42) contacting the mask frame (21).

Description

DEPOSITION APPARATUS HAVING A MASK ALIGNER, MASK

ARRANGEMENT FOR MASKING A SUBSTRATE, AND METHOD FOR MASKING

A SUBSTRATE

TECHNICAL FIELD

[0001] Embodiments of the present disclosure relate to a deposition apparatus having a mask aligner for adjusting the position of a mask, more specifically for compensating for in plane and out-of-plane deformation of a mask. Embodiments of the present disclosure further relate to a mask arrangement for masking a substrate to be deposited in a processing chamber. Furthermore, the embodiments of the present disclosure relate to a method for masking a substrate to be deposited in a processing chamber, more specifically a method for compensating for in-plane and out-of-plane deformation of a mask.

BACKGROUND

[0002] Opto-electronic devices that make use of organic materials, such as organic light- emitting diodes (OLED), are becoming increasingly popular for a number of reasons. OLEDs are a special type of light-emitting diode in which the emissive layer includes a thin-film of certain organic compounds. Organic light emitting diodes (OLEDs) are used in the manufacture of television screens, computer monitors, mobile phones, other hand-held devices, etc., for displaying information. OLEDs can also be used for general space illumination. The range of colors, brightness and viewing angles possible with OLED displays is greater than that of traditional LCD displays because OLED pixels directly emit light and do not involve a back light. The energy consumption of OLED displays is considerably less than that of traditional LCD displays. Further, the fact that OLEDs can be manufactured onto flexible substrates results in further applications.

[0003] OLEDs are realized by depositing a material on a substrate. Several methods are known for this purpose. As an example, substrates may be coated by using an evaporation process, a physical vapor deposition (PVD) process, such as a sputtering process, a spraying process, etc., or a chemical vapor deposition (CVD) process. The process can be performed in a processing chamber of a deposition apparatus, where the substrate to be coated is located. A deposition material is provided in the processing chamber. The particles can for example pass through a mask having a boundary or a specific pattern to deposit material at desired positions on the substrate, e.g. to form an OLED pattern on the substrate. A plurality of materials, such as organic material, molecules, metals, oxides, nitrides, and carbides may be used for deposition on a substrate. Further, other processes like etching, structuring, annealing, or the like can be conducted in processing chambers. [0004] For example, coating processes may be considered for large area substrates, e.g. in display manufacturing technology. Coated substrates can be used in several applications and in several technical fields. For instance, an application can be organic light emitting diode (OLED) panels. Further applications include insulating panels, microelectronics, such as semiconductor devices, substrates with thin film transistors (TFTs), color filters, or the like. OLEDs are solid-state devices composed of thin films of (organic) molecules that create light with the application of electricity. As an example, OLED displays can provide bright displays on electronic devices and use reduced power compared to, for example, liquid crystal displays (LCDs). In the processing chamber, the organic molecules are generated (e.g., evaporated, sputtered, or sprayed etc.) and deposited as layer on the substrates. The material can for example pass through a mask having a boundary or a specific pattern to deposit material at desired positions on the substrate, e.g. to form an OLED pattern on the substrate.

[0005] An aspect related to the quality of the processed substrate, in particular of the deposited layer, is the alignment of the substrate with respect to the mask. As an example, the alignment should be accurate and repeatable in order to achieve good process results. Accordingly, devices are used - which are coupled to the substrate and/or the mask carrier - for aligning the substrate relative to the mask. However, alignment of a mask may be problematic when a mask is subjected to in-plane or out-of-plane deformation due to a variety of factors such as, for example, variations in temperature, clamping forces, gravitational forces or pre-deformations due to manufacturing processes. [0006] In view of the above, there is a need for aligners, arrangements, apparatuses and methods, which can compensate for in-plane and out-of-plane deformations of a mask.

SUMMARY [0007] In light of the above, a deposition apparatus, a mask arrangement and method for masking a substrate are provided. Further aspects, advantages, and features of the present disclosure are apparent from the dependent claims, the description, and the accompanying drawings.

[0008] According to a first embodiment or aspect, a deposition apparatus is provided. The deposition apparatus comprises a vacuum chamber, a transport system for transporting a mask carrier configured for supporting a mask frame having a mask mounted to the mask frame, and an aligner system comprising a plurality of first aligner devices at least partially provided in the vacuum chamber, the plurality of first aligner devices contacting the mask carrier or a mask support supporting the mask frame, and a plurality of second aligner devices at least partially provided in the vacuum chamber, the plurality of second aligner devices contacting the mask frame.

[0009] According to a second embodiment or aspect, a mask arrangement is provided. The mask arrangement comprises a mask carrier or mask support configured for supporting a mask frame having a mask mounted to the mask frame, wherein the mask carrier or mask support is configured for contacting a plurality of first aligner devices, and wherein the mask frame is configured for contacting a plurality of second aligner devices.

[0010] According to a third embodiment or aspect, a use of the mask arrangement of the second embodiment or aspect for masking a substrate in a deposition apparatus according to the first embodiment or aspect is provided. [0011] According to a fourth embodiment or aspect, a method of masking a substrate is provided. The method comprises clamping a mask carrier or a mask support supporting a mask frame having a mask mounted to the mask frame, aligning the substrate to the mask, and levelling the mask by applying at least one adjustment force to the mask frame.

BRIEF DESCRIPTION OF THE DRAWINGS [0012] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the disclosure and are described in the following:

FIG. 1 shows a schematic view of a deposition process using a mask for manufacturing OLEDs on a substrate;

FIG. 2a and 2b show schematic views of a mask mounted to a mask frame;

FIG. 3 shows a schematic front view of a pattern distortion due to mask deformation;

FIG. 4 shows a schematic side view of a deposition apparatus according to embodiments of the present disclosure;

FIGS. 5 and 6 show schematic front views of a mask arrangement for masking a substrate in a processing chamber according to embodiments of the present disclosure; and

FIG. 7 shows a flow chart illustrating a method for masking a substrate in a processing chamber according to embodiments of the present disclosure. DETAILED DESCRIPTION

[0013] Reference will now be made in detail to the various embodiments of the disclosure, one or more exampl es of which are illustrated in the figures. Within the following description of the drawings, the same reference numbers refer to same components. Generally, only the differences with respect to individual embodiments are described. Each example is provided by way of explanation of the disclosure and is not meant as a limitation. Further, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. It is intended that the description includes such modifications and variations. [0014] FIG. 1 shows a schematic view of a deposition process using a mask for manufacturing OFEDs on a substrate 10. For manufacturing OFEDs, organic molecules are generated by a deposition source 30 and deposited on the substrate 10. A mask 22 is positioned between the substrate 10 and the deposition source 30. The deposition source 30 may be, for example, an evaporation source, a sputtering source or a spraying source. The mask 22 has a specific pattern, e.g., provided by a plurality of openings 22a, so that organic molecules pass through the openings 22a, for example along a deposition path 32, to deposit a layer or film of an organic compound on the substrate 10. A plurality of layers or films can be deposited on the substrate 10 using different masks or positions of the mask 22 with respect to the substrate 10, e.g., to generate pixels with different color characteristics. As an example, a first layer or film can be deposited to generate red pixels 34, a second layer or film can be deposited to generate green pixels 36, and a third layer or film can be deposited to generate blue pixels 38. The layer or film, or the plurality of layers or films, may be arranged between two electrodes, such as an anode and a cathode (not shown), so as to form an organic semiconductor. At least one electrode of the two electrodes may be transparent. [0015] The substrate 10 and the mask 22 can be arranged in a vertical orientation during the deposition process. In FIG. 1, arrows indicate a vertical direction 101 and a horizontal direction 102.

[0016] As used throughout the present disclosure, the term“vertical direction” or“vertical orientation” is understood to distinguish over “horizontal direction” or “horizontal orientation”. That is, the“vertical direction” or“vertical orientation” relates to a substantially vertical orientation e.g. of the mask arrangement/mask and the substrate, wherein a deviation of a few degrees, e.g. up to 10° or even up to 15°, from an exact vertical direction or vertical orientation is still considered as a“vertical direction” or a“vertical orientation”. The exact vertical direction is parallel to the force of gravity. A vertical or substantially vertical direction may allow for the above-described deviations.

[0017] Although embodiments described herein particularly relate to substrates and masks oriented in a vertical orientation, the present disclosure is not limited thereto. For example, embodiments described in the present disclosure are also applicable to substrates and/or masks, as well as substrate carriers and/or mask carriers, oriented in a horizontal orientation.

[0018] As used throughout the present disclosure, the mask 22 when arranged in a vertical orientation lies in a mask plane defined by first direction 101 and second direction 102. First direction 101 may be aligned substantially parallel to a transport direction in which the mask 22 is transported by a transport system. Second direction 102 may be aligned substantially parallel to the vertical direction mentioned above, particularly substantially parallel to the force of gravity. Particularly, first direction 101 and second direction 102 are substantially perpendicular to each other. Further, a third direction 103 may be aligned substantially normal to the mask plane defined by first direction 101 and second direction 102. Particularly, third direction 103 is aligned substantially parallel to the deposition path 32.

[0019] The embodiments described herein can be utilized for coating large area substrates, e.g., for manufactured displays. The substrates or substrate receiving areas for which the apparatuses and methods described herein are configured can be large area substrates having a size of e.g. 1 m² or above. For example, a large area substrate or carrier can be GEN 4.5, which corresponds to about 0.67 m² substrates (0.73x0.92m), GEN 5, which corresponds to about 1.4 m² substrates (1.1 m x 1.3 m), GEN 7.5, which corresponds to about 4.29 m² substrates (1.95 m x 2.2 m), GEN 8.5, which corresponds to about 5.7m² substrates (2.2 m x 2.5 m), or even GEN 10, which corresponds to about 8.7 m² substrates (2.85 m x 3.05 m). Even larger generations such as GEN 11 and GEN 12 and corresponding substrate areas can similarly be implemented. For example, for OLED display manufacturing, half sizes of the above mentioned substrate generations, including GEN 6, can be coated by evaporation of an apparatus for evaporating material. The half sizes of the substrate generation may result from some processes running on a full substrate size, and subsequent processes running on half of a substrate previously processed.

[0020] The term“substrate” as used herein may particularly embrace substantially inflexible substrates, for example, a wafer, slices of transparent crystal such as sapphire or the like, or a glass plate. However, the present disclosure is not limited thereto and the term“substrate” may embrace flexible substrates such as a web or a foil. The term“substantially inflexible” is understood to distinguish over“flexible”. Specifically, a substantially inflexible substrate can have a certain degree of flexibility, e.g. a glass plate having a thickness of 0.5 mm or below, wherein the flexibility of the substantially inflexible substrate is small in comparison to the flexible substrates.

[0021] A substrate may be made of any material suitable for material deposition. For example, the substrate may be made of a material selected from the group consisting of glass (for instance soda-lime glass, borosilicate glass etc.), metal, polymer, ceramic, composite materials, carbon fiber materials, metal or any other material or combination of materials which can be coated by a deposition process.

[0022] An aspect of a deposition process is the alignment of the substrate 10 with respect to the mask 22. Accurate alignment of the substrate 10 increases the quality and accuracy of the deposited layers, leading to an improved product. The alignment should be accurate and repeatable in order to achieve good process results. However, alignment of a substrate may be problematic when a mask is subjected to in-plane or out-of-plane deformation.

[0023] In some processing systems, the mask may typically be oriented in a horizontal orientation. Having the mask oriented horizontally allows for some types of mask deformation to be partially or completely compensated by the force of gravity, which acts in the direction normal to the mask. However, a mask arranged in a vertical orientation according to some embodiments described herein is advantageous in that the number of particles collecting on the surface of a substrate or mask is reduced, leading to improved quality of deposited layers. Further, a vertical orientation allows for a processing system to use floor space more efficiently. Since the force of gravity is not acting substantially normal to a mask arranged in a vertical orientation, the problem of compensating in-plane and out-of- plane deformation of the mask remains. Furthermore, even in processing systems where the mask is oriented horizontally, other types of mask deformation which may not be compensated by the force of gravity can be problematic. [0024] FIGS. 2a and 2b show schematic views of a mask 22 mounted to a mask frame 21.

Therein, two examples of out-of-plane deformations of the mask 22 are shown. Mask 22 is exemplarily shown to be oriented in a vertical orientation. In FIG. 2a, mask 22 exhibits an out-of-plane deformation where the mask 22 is bowed in the third direction 103. Similarly, in FIG. 2b, mask 22 exhibits another out-of-plane deformation where the mask 22 has become rippled in the third direction 103 and in a direction opposite to the third direction 103.

[0025] The effects of in-plane or out-of-plane deformation of mask 22 on the resulting deposited pattern is exemplarily shown in FIG. 3. Therein, a target deposition pattern 25 is shown. Target deposition pattern 25 may be, for example, a two -dimensional array of pixel elements (not shown) to be deposited on a substrate 10. The target deposition pattern 25 as exemplarily shown in FIG. 3 is indicated by the outer bounds of the pattern and the vertical and horizontal midlines of the pattern. Further shown is an exaggerated illustration of a deformed deposition pattern 26 which is the resulting pattern obtained on the substrate 10 by depositing the pattern on substrate 10 in a deposition process using mask 22. As shown by the exaggerated illustration, the deformed deposition pattern 26 may deviate from the target deposition pattern 25 in a manner such that one region of the deformed deposition pattern 26 deviates in a different direction and with a different magnitude than other regions. Accordingly, such deviation of the deformed deposition pattern 26 from the target deposition pattern 25 cannot be compensated by simply aligning the substrate 10 to the mask 22 due to the in-plane and out-of-plane deformation of mask 22. [0026] Mask deformation may arise from a number of sources. For example, a change in temperature of the mask or a portion of the mask may introduce a thermal expansion of the mask or a portion of the mask. A thermal expansion of the mask 22 which is different to the mask frame 21 may result in mask 22 to bow or ripple in an out-of-plane direction normal to the mask 22, i.e. in the third direction 103. [0027] A further source of mask deformation may be supporting of the mask frame 21 to which the mask 22 is mounted. For example, clamping of the mask frame 21 to a mask carrier may induce non-uniform loadings at the clamping points of the mask frame 21 where the mask frame 21 is clamped. These non-uniform loadings may cause deformation of the mask frame 21, and subsequently in-plane or out-of-plane deformation of the mask 22.

[0028] Another source of mask deformation may be from inherent deformations of the mask 22 due to the manufacturing process used to produce the mask 22 or the mask frame 21. For example, non-uniform material properties of the material used for the mask 22 may be caused by microscopic cracking in the material or heat generated in the material during a manufacturing pro cess.

[0029] Yet another source of mask deformation may be from changing the orientation of the mask 22 from a horizontal orientation to a vertical orientation. For example, during preparation of a mask 22 for use in a deposition apparatus, the mask frame 21 to which mask 22 is mounted may be arranged on a mask carrier in a horizontal orientation, e.g. on a flat workbench. The mask carrier supporting mask frame 21 may then be re-oriented into a vertical orientation and inserted into a processing system. Due to, for example, the effects of gravity changing directions between a horizontal orientation and a vertical orientation, in plane or out-of-plane deformation of the mask 22 may be caused as eigentensions present in mask 22 can no longer be compensated by gravity acting in the direction normal to the mask. [0030] FIG. 4 shows a schematic side view of a deposition apparatus 100 for depositing one or more layers on a substrate 10 according to embodiments of the present disclosure. The deposition apparatus 100 comprises a vacuum chamber 60, a transport system 50 for transporting a mask carrier 23 configured for supporting a mask frame 21 having a mask 22 mounted to the mask frame 21, and an aligner system 40 comprising a plurality of first aligner devices 41 at least partially provided in the vacuum chamber 60, the plurality of first aligner devices 41 contacting the mask carrier 23, and a plurality of second aligner devices 42 at least partially provided in the vacuum chamber 60, the plurality of second aligner devices 42 contacting the mask frame 21. [0031] Deposition apparatus 100 includes a vacuum chamber 60, in which deposition of a substrate 10 takes place. Vacuum chamber 60 may be provided with, for example, one or more vacuum pumps configured for maintaining a vacuum environment in the vacuum chamber 60. The vacuum environment may include a processing gas maintained at a lower pressure than an ambient pressure. Provided within vacuum chamber 60 is a deposition source 30 configured for depositing material on substrate 10 along deposition path 32. Deposition source 30 may include, for example, an evaporation source, a sputter source, or any other material source suitable for depositing a layer of material on the substrate 10.

[0032] Deposition apparatus 100 may further include substrate aligner device 11. Substrate 10 may be supported directly or indirectly by substrate aligner device 11. For example, a substrate carrier may be provided for supporting substrate 10, with substrate carrier being configured to be clamped by substrate aligner device 11. Substrate aligner device 11 may include at least one actuator for accurately positioning substrate 10 with respect to mask 22.

[0033] Deposition apparatus 100 may further include a transport system 50. In particular, transport system 50 may be configured for transporting a mask carrier 23 configured for supporting a mask frame 21 having a mask 22 mounted to the mask frame 21. In the present disclosure, transport system 50 is arranged such that the mask carrier 23 with the mask frame 21 and mask 22 mounted thereon are vertically oriented and transported on a track in a transport direction substantially parallel to the second direction 102. Transport system 50 may be configured for contactless or contacting transport. For example, a contactless transport system may include a track including a plurality of electromagnetic actuators configured for supporting the mask carrier 23 in the first direction 101 and transporting the mask carrier 23 in the second direction 102. Alternatively, a contacting transport system may include a track including a plurality of roll ers configured for supporting the mask carrier 23 in the first direction 101 and transporting the mask carrier 23 in the second direction 102.

[0034] Transport system 50 may be further configured for transporting a substrate 10. Particularly, transport system 50 may be configured for transporting a substrate carrier configured for supporting a substrate 10. The transport system 50 may include a further track separate from the track configured for transporting mask carrier 23. In a similar fashion as for transporting mask carrier 23, transport system 50 may include a track configured for contactless or contacting transport of a substrate 10 or a substrate carrier configured for supporting a substrate 10.

[0035] According to further embodiments, which may be combined with other embodiments described herein, a mask arrangement 200 is provided. As shown in FIG. 5, mask arrangement 200 comprises a mask carrier 23 or a mask support configured for supporting a mask frame 21 having a mask 22 mounted to the mask frame 21, wherein the mask carrier 23 or the mask support is configured for contacting a plurality of first aligner devices 41, and wherein the mask frame 21 is configured for contacting a plurality of second aligner devices 42. [0036] Mask carrier 23 is configured for supporting mask frame 21 having a mask 22 mounted thereto. Particularly, mask carrier 23 is configured for supporting the mask frame 21 in a substantially vertical orientation. The mask carrier 23 may also be considered to be a mask support in general, i.e. a mask frame 21 having mask 22 mounted thereto may be supported by a mask support configured for supporting the mask frame 21 in a substantially vertical orientation. The mask support may be included in mask carrier 23 or may be an alternative element. One or more mask frame holders 24 provided on mask carrier 23 or the mask support are configured for mounting mask frame 21 to mask carrier 23 or the mask support. The one or more mask frame holders 24 may be contact points where mask frame 21 may rest on mask carrier 23. For example, the lower edge of mask frame 21 may be supported by a point contact at one end and a line contact at the other end. The one or more mask frame holders 24 may include a groove, such that mask frame 21 is supported therein. Alternatively, the one or more mask frame holders 24 may include protrusions on mask carrier 23, such as pins, engaging with a corresponding hole in mask frame 21, such that mask frame 21 rests on the protrusions. [0037] Alternatively, the one or more mask frame holders 24 may support mask frame 21 securely, for example, by using permanent magnet elements, electromagnetic elements, threaded fasteners, or friction clamps. As exemplarily shown in FIG. 5, four mask frame holders 24 are provided for securing mask frame 21 at each comer of mask frame 21. [0038] Mask carrier 23 or the mask support is configured for contacting a plurality of first aligner devices 41. Mask carrier 23 or the mask support is therefore further provided with at least one clamping interface. As exemplarily shown in FIG. 5, mask carrier 23 is provided with four clamping interfaces for contacting a plurality of first aligner devices 41 in each comer of mask carrier 23. The at least one clamping interface may be, for example, a region where a first aligner device 41 clamps the mask carrier 23 or the mask support such that the plurality of first aligner devices 41 can maintain mask carrier 23 or the mask support in a specific position. The at least one clamping interface may be further configured for accepting one or more aligning forces in at least one direction for coarse or fine alignment of the mask carrier 23. The at least one clamping interface may be, for example, a flat area, a hole or depression, or a protrusion configured for interfacing with a clamping device. The at least one clamping interface may include a ferromagnetic material configured for being clamped by a magnetic element.

[0039] Mask frame 21 having a mask 22 mounted thereto is configured for masking a substrate 10 for depositing one or more patterned layers of material. Mask frame 21 may include a first horizontal element 2 la, a second horizontal element 2 lb, a first vertical element 2lc and a second vertical element 2ld, wherein the first and second horizontal elements 2 la, 2 lb and the first and second vertical elements 2lc, 2ld form mask frame 21 with an opening provided therein. Mask 22 is mounted to mask frame 21 such that the opening provided in mask frame 21 is partially or completely covered. As discussed previously with respect to FIG. 1, mask 22 may be provided with a plurality of openings 22a arranged to form a pattern such that material from deposition source 30 may be selectively deposited in a pattern on the surface of substrate 10.

[0040] Mask 22 and mask frame 21 may be manufactured from materials with a substantially equal thermal expansion coefficient. For example, mask 22 and mask frame 21 may both be manufactured from a material having a low thermal expansion coefficient, such as invar. Matching the thermal expansion coefficients of the mask 22 and the mask frame 21 reduces the effects of temperature change causing in-plane or out-of-plane deformation of the mask 22. [0041] Mask frame 21 is configured for contacting a plurality of second aligner devices 42. Mask frame 21 is therefore further provided with at least one manipulating interface. As exemplarily shown in FIG. 5, first and second horizontal elements 2la, 2lb are each provided with a respective manipulating interface located approximately at the midpoint of first and second horizontal elements 2 la, 2 lb. The at least one manipulating interface may be, for example, a region where a second aligner device 42 clamps the mask frame 21 such that the plurality of second aligner devices 42 can manipulate mask frame 21. The at least one manipulating interface may be configured for accepting one or more manipulating forces in at least one direction, such that the plurality of second aligner devices 42 can, through elastic deformation of mask frame 21, accurately compensate in-plane or out-of-plane deformations of mask 22 so that substrate 10 may be accurately aligned to mask 22. The at least one correcting interface may be, for example, a flat area, a hole or depression, or a protrusion configured for interfacing with a clamping device. The at least one manipulating interface may include a ferromagnetic material configured for being clamped by a magnetic element. [0042] According to further embodiments, mask arrangement 200 is used for masking a substrate 10 in the deposition apparatus 100 of embodiments described above.

[0043] Referring once again to FIG. 4, deposition apparatus 100 further includes an aligner system 40 according to embodiments described herein. Aligner system 40 comprises a plurality of first aligner devices 41 at least partially provided in the vacuum chamber 60, the plurality of first aligner devices 41 contacting the mask carrier 23, and a plurality of second aligner devices 42 at least partially provided in the vacuum chamber 60, the plurality of second aligner devices 42 contacting the mask frame 21.

[0044] In the present disclosure, an aligner device is a device which may maintain the position of an element by, for example, clamping the element. Further, an aligner device may adjust the position of an element by translating or rotating the element. Furthermore, an aligner device may manipulate an element, for example, elastically deform an element, by applying a load to the element. An aligner device, in the context of the present disclosure, may therefore be thought of as any one of a clamp, an aligner, or a manipulator. [0045] First aligner devices 41 and second aligner devices 42 may respectively include at least one of the group comprising a clamping device, and at least one actuator. First and second aligner devices 41, 42 may therefore be configured for at least one of clamping an element, moving/ aligning an element, or applying a force to an element. First and second aligner devices 41, 42 may be of a substantially similar construction, appropriately sized for positioning the mask carrier 23 or mask support and manipulating the mask frame 21, respectively.

[0046] In order to clamp an element such as mask carrier 32, the mask support or mask frame 21, first or second aligner devices 41, 42 may include a clamping device. The clamping device is configured for securely attaching the first or second aligner device 41, 42 to the element being clamped. The clamping device may include any one of the group comprising an electromagnetic element, a permanent magnet, a threaded fastener, or a friction clamp. The clamping device may further include an interface corresponding to the aligning interface of mask carrier 23, the mask support or the correcting interface of mask frame 21. [0047] The clamping device may be configured to constrain the element being clamped in at least one of the group comprising three linear directions and three rotational directions. For example, the clamping device may be configured for constraining the mask carrier 23, the mask support or mask frame 21 in three linear directions and three rotational directions. Alternatively, the clamping device may be configured for constraining the mask carrier 23, the mask support or mask frame 21 in only two linear directions and two rotational directions, such that the clamping device allows for free movement of the element being clamped in one linear direction and one rotational direction (i.e. a sliding hinge).

[0048] Accordingly, the plurality of first aligner devices 41 and/or the plurality of second aligner devices 42 may include a subset of aligner devices having a first number of degrees of freedom, and a subset of aligner devices having a second number of degrees of freedom. For example, the subset of aligner devices having a first number of degrees of freedom may fix the element being clamped, while the subset of aligner devices having a second number of degrees of freedom may support the element being clamped while allowing the element to move in a number of directions. Such an arrangement may reduce the effects of, for example, aligning or clamping forces distorting or deforming the mask carrier 23 and/or the mask frame 21, or the effects of thermal expansion.

[0049] Alternatively, the at least one clamping interface of mask carrier 23 may be configured to allow for movement in at least one direction. For example, mask carrier 23 may include at least one clamping interface including a ferromagnetic plate which is allowed to slide within mask carrier 23 in at least one direction. As a further example, the at least one clamping interface of mask carrier 23 may include a cylindrical element which may be clamped by first aligner devices 41 such that the at least one clamping interface allows for sliding and/or rotation about the cylindrical element, e.g. as a hinge. [0050] In order to move/align an element or to apply a force to an element, first and second aligner devices 41, 42 may be provided with at least one actuator. The at least one actuator is configured to move in one of three linear directions or one of three rotational directions. Accordingly, the at least on actuator may be a linear actuator for translation or applying a force in a linear direction, or a rotational actuator for rotation or applying a torque in a rotational direction. The at least one actuator may include any one of a group comprising an electromagnetic actuator, a piezoceramic actuator, a pneumatic actuator or a hydraulic actuator. The at least one actuator may be provided within the first and second aligner devices 41, 42, such that the actuator directly acts on the aligner device. Alternatively, the at least one actuator may be provided in a position outside of the first and second aligner devices 41, 42, such that the actuator acts on a lever, a rod or a shaft connecting the actuator to the aligner device. In the case where the actuator is provided in a position outside the aligner device, the actuator may be positioned outside or partially outside of the vacuum chamber in order to reduce the effects of electromagnetic interference or contamination of the vacuum environment. [0051] The aligner system may be further provided with at least one sensor configured for sensing one or more parameters. The at least one sensor may include at least one of the group comprising an optical sensor, a force sensor, a torque sensor or a temperature sensor. The at least one sensor may be configured for measuring at least one parameter from the group comprising the position of substrate 10, the position of mask carrier 32, the position of mask frame 21, a misalignment between mask 22 and substrate 10, a temperature, or a force or torque in an element of mask frame 21.

[0052] According to some embodiments, which may be combined with other embodiments described herein, the plurality of first aligner devices 41 and the plurality of second aligner devices 42 may be mounted to the vacuum chamber 60. Mounting first and second aligner devices 41, 42 to the vacuum chamber 60, particularly to an inner wall of the vacuum chamber 60, allows for the connection between the first and second aligner devices 41, 42 to be short and to have a high stiffness. Further, the relative positions of the first and second aligner devices 41, 42 may be accurately maintained. [0053] Alternatively, the aligner system 40 may include an aligner support element 43 to which the plurality of first aligner devices 41 and the plurality of second aligner devices 42 are mounted. The aligner support element 43 allows for the relative positions of the plurality of first aligner devices 41 and the plurality of second aligner devices 42 to be accurately maintained. [0054] The aligner support element 43 may be mounted to vacuum chamber 60, particularly to an inner wall of vacuum chamber 60. In the case where transport system 50 and deposition source 30 of deposition system 100 are also mounted to the vacuum chamber 60, mounting the aligner support element 43 to the vacuum chamber 60 allows for the positional relationships between the plurality of first aligner devices 41, the plurality of second aligner devices 42, deposition source 30 and transport system 50 to be accurately maintained.

[0055] Similarly to the plurality of first and second aligner devices 41, 42, substrate aligner device 11 may be mounted to vacuum chamber 60. Alternatively, as exemplarily shown in Fig. 4, substrate aligner device 11 may be mounted to aligner support element 43. As with the first and second aligner devices 41, 42, mounting the substrate aligner device 11 to the vacuum chamber 60 allows for the connection between substrate aligner device 11 and first and second aligner devices 41, 42 to be short and to have a high stiffness, and to accurately maintain the relative positions therebetween. This allows for the substrate aligner device 11 , and hence substrate 10, to be used as a fixed reference point for manipulating mask frame 21 with second aligner devices 42. [0056] The plurality of first and second aligner devices 41, 42 may be configured to be moveable with respect to transport system 50 and/or substrate 10. For example, the plurality of first and second aligner devices 41, 42 may be positioned in a home position away from transport system 50 during transportation of a mask carrier 23 into vacuum chamber 60. After mask carrier 23 is transported into vacuum chamber 60, the plurality of first and second aligner devices 41, 42 may be moved from the home position to a clamping position near transport system 50 such that the plurality of first and second aligner devices 41, 42 may clamp the mask carrier 23 and/or mask frame 21, respectively. This prevents collision between the mask carrier 23 and the aligner system 40 such that damage to the mask 22 or other components of the deposition system 100 is avoided. After clamping mask carrier 23 and/or mask frame 21, the plurality of first and second aligner devices 41, 42 may, for example, be configured to further move to a processing position.

[0057] Similarly, in the case where the plurality of first and second aligner devices 41, 42 are mounted to an aligner support element 43, aligner support element 43 may be moveable with respect to transport system 50. For example, aligner support element 43, and hence the complete aligner system 40, may be positioned in the home position during transportation of a mask carrier 23 into vacuum chamber 60, and moved from the home position to the clamping position after transportation of mask carrier 23 such that the plurality of first aligner devices 41 and/or the plurality of second aligner devices 42 may clamp the mask carrier 23 and mask frame 21, respectively. After clamping mask carrier 23 and/or mask frame 21, the aligner support element 43 may, for example, be configured to further move to the processing position.

[0058] Referring once again to FIG. 5, at least one second aligner device 42 of the plurality of second aligner devices 42 includes at least one actuator, wherein the at least one actuator applies a force to the mask frame 21. According to some embodiments, which can be combined with other embodiments described herein, the mask frame 21 defines a mask plane such that the mask frame 21 lies substantially coplanar to the mask plane, and the force includes at least one of the group consisting of a force applied in a substantially vertical direction parallel to the mask plane, a force applied in a substantially horizontal direction parallel to the mask plane, a force applied in a direction substantially normal to the mask plane, and a torque applied about an axis substantially normal to the mask plane.

[0059] Applying one or more forces using one or more actuators of the plurality of second aligner devices 42 causes mask frame 21 to be manipulated, i.e. elastically deformed, in order to compensate for in-plane and out-of-plane deformations of mask 22. Accordingly, correct alignment of substrate 10 with respect to mask 22 can be achieved accurately and reliably.

[0060] As defined previously, the mask plane defined by first direction 101 and second direction 102, and third direction 103 may be aligned substantially normal to the mask plane defined by first direction 101 and second direction 102. Therefore, the force may be a force applied in the first direction 101, a force applied in the second direction 102, a force applied in the third direction 103, or a torque applied about an axis substantially parallel to third direction 103.

[0061] As exemplarily shown in FIG. 5, the plurality of second aligner devices 42 may include two second aligner devices 42 configured to contact mask frame 21 substantially at the midpoint of first horizontal element 2la and second horizontal element 2 lb, respectively. The second aligner devices 42 are exemplarily configured for manipulating mask frame 21 by applying a force in the first direction 101, a force in the second direction 102 and a torque about the axis parallel to the third direction 103.

[0062] However, the present disclosure is not limited to manipulating mask frame 21 at only two points. Rather, the present disclosure includes applying forces at any number of locations on mask frame 21. For example, as exemplarily shown in FIG. 6, the plurality of second aligner devices 42 includes six second aligner devices 42, wherein two second aligner devices 42 apply a load at two points along first horizontal element 2 la, two second aligner devices 42 apply a load at two points along second horizontal element 2 lb, and two second aligner devices 42 apply a force substantially at the midpoint of first vertical element 2lc and second vertical element 2 I d, respectively. Providing an increased number of second aligner devices 42 at various positions around mask frame 21 allows for finer, more accurate compensation of in-plane and out-of-plane deformations of mask 22. [0063] Referring now to FIG. 7, according to a further embodiment of the present disclosure, a method 300 for masking a substrate 10 in a vacuum chamber 60 is provided. Method 300 commences at block 301. The method comprises clamping a mask carrier 23 or a mask support supporting a mask frame 21 having a mask 22 mounted to the mask frame 21 (block 302), aligning the substrate 10 to the mask 22 (block 303), and levelling the mask 22 by applying at least one adjustment force to the mask frame 21 (block 304). Method 300 concludes at block 305.

[0064] Clamping the mask carrier 23 or the mask support at block 302 includes contacting a clamping device to the mask carrier 23 or the mask support and operating the clamping device such that the mask carrier 23 or the mask support is securely attached to the clamping device. The clamping device may be, for example, a clamping device of a first aligner device 41. The clamping device may include any one of the group comprising an electromagnetic element, a permanent magnet, a threaded fastener, or a friction clamp. The clamping device may further include an interface corresponding to a clamping interface of mask carrier 23 or the mask support. The clamping device may be configured to constrain the element being clamped in at least one of the group comprising three linear directions and three rotational directions.

[0065] Once mask carrier 23 or the mask support has been clamped, the substrate 10 may be aligned to the mask 22. Aligning the substrate 10 to the mask 22 at block 303 includes operating at least one actuator in at least one direction to accurately position the substrate 10 with respect to the mask 22. The at least one actuator may be, for example, an actuator of a substrate aligner device 11. The at least one actuator may include any one of the group comprising an electromagnetic actuator, a piezoceramic actuator, a pneumatic actuator or a hydraulic actuator. The at least one actuator may translate the substrate 10 in any one of first direction 101, second direction 102 or third direction 103, or may rotate the substrate 10 about an axis substantially parallel to third direction 103.

[0066] In the context of the present disclosure, aligning the substrate 10 to the mask 22 may include moving substrate 10, or moving a substrate carrier configured for supporting substrate 10. For example, substrate 10 may include a rigid glass substrate, and may be transported without a substrate carrier and may be directly clamped, positioned or manipulated by a substrate aligner device 11. As a further example, substrate 10 may be supported on a substrate carrier such that the substrate carrier is clamped, positioned or manipulated by a substrate aligner device 11.

[0067] In order to align substrate 10 to the mask 22, method 300 may further include sensing one or more parameters using at least one sensor. The one or more parameters can include at least one of the group comprising the position of substrate 10, the position of mask carrier 32 or the mask support, the position of mask frame 21, a temperature, or a misalignment between mask 22 and substrate 10. For example, substrate 10 may include at least one substrate fiducial and mask 22 may include at least one mask fiducial, and the one or more parameters may include a positional error determined by comparing the position of the at least one substrate fiducial to the position of the at least one mask fiducial. The one or more parameters sensed by the at least one sensor may be compared to a predetermined value, or may be compared to another parameter measured by the at least one sensor, to determine a required translation or rotation to be applied to the substrate 10 by the substrate aligner device 11 to substrate 10 to mask 22. The at least one sensor and at least one actuator may be comprised in a feedback loop.

[0068] The sensing one or more parameters may be performed in-situ, for example, by using at least one sensor positioned within the vacuum chamber 60. For example, in-situ sensing may include sensing parameters relating to the alignment of substrate 10 to mask 22, such as a positional error determined by comparing the position of the at least one substrate fiducial to the position of the at least one mask fiducial. Further, the sensing one or more parameters may be performed after deposition has been completed by using at least one sensor positioned downstream of the vacuum chamber 60, such that the parameter is used in a feedback loop for aligning the next substrate 10 to be processed. Furthermore, the sensing one or more parameters may be performed before deposition has been completed by using at least one sensor positioned upstream of the vacuum chamber 60, such that the parameter is used in a feed forward loop for aligning the next substrate 10 to be processed. The sensing one or more parameters may be include a combination of in-situ sensing, sensing before deposition, and/or sensing after deposition.

[0069] After mask carrier 23 or the mask support has been clamped and the substrate 10 has been aligned to the mask 22, any in-plane or out-of-plane deformation of mask 22 may be compensated such that the mask 22 is levelled. Levelling mask 22 at block 304 includes applying at least one adjustment force to mask frame 21. The at least one adjustment force may be a force applied in first direction 101, a force applied in second direction 102, a force applied in third direction 103, or a torque applied about an axis parallel to third direction 103. Applying at least one adjustment force to mask frame 21 causes an elastic deformation of mask frame 21 such that in-plane or out-or-plane deformation of mask 22 can be compensated. Accordingly, mask 22 is levelled and accurate alignment and positioning of mask 22 with respect to substrate 10 can be achieved. The method 300 concludes at block 305. [0070] The levelling of mask 22 may further include clamping the mask frame 21 and operating at least one actuator.

[0071] Clamping mask frame 21 includes contacting a clamping device to mask frame 21 and operating the clamping device such that mask frame 21 is securely attached to the clamping device. The clamping device may be, for example, a clamping device of a second aligner device 42. The clamping device may include any one of the group comprising an electromagnetic element, a permanent magnet, a threaded fastener, or a friction clamp. The clamping device may further include an interface corresponding to an aligning interface of mask carrier 23 or the mask support. The clamping device may be configured to constrain the element being clamped in at least one of the group comprising three linear directions and three rotational directions.

[0072] Once mask frame 21 has been clamped, at least one actuator is operated in at least one direction to apply at least one adjustment force to the mask frame 21. The at least one actuator may be, for example, an actuator of a second aligner device 42. The at least one actuator may include any one of the group comprising an electromagnetic actuator, a piezoceramic actuator, a pneumatic actuator or a hydraulic actuator. The at least one actuator may apply a force to mask frame 21 in any one of first direction 101, second direction 102 or third direction 103, or may apply a torque to mask frame 21 about an axis substantially parallel to third direction 103. [0073] Applying at least one adjustment force to mask frame 21 may further include sensing one or more parameters using at least one sensor. The one or more parameters can include at least one of the group comprising the position of substrate 10, the position of mask carrier 32 or the mask support, the position of mask frame 21, a misalignment between mask 22 and substrate 10, a temperature, or a force or torque in an element of mask frame 21. The one or more parameters sensed by the at least one sensor may be compared to a predetermined value, or may be compared to another parameter measured by the at least one sensor, to determine a required force to be applied to mask frame 21 to compensate in-plane or out-of-plane deformation of mask 22. The at least one sensor and at least one actuator may be comprised in a feedback loop.

[0074] Prior to clamping the mask carrier 23 or mask support at block 302, method 300 may further include transporting a mask carrier 23 into the vacuum chamber 60 by operating the transport system 50. Transporting the mask carrier 23 may further include coarse positioning of the mask carrier 23 prior to clamping the mask carrier 23, for example, by adjusting the position of the mask carrier 23 in the second direction 102, i.e. the transport direction, or by adjusting the position of the mask carrier 23 in the first direction 101 by adjusting an air gap between the mask carrier 23 and the transport system 50.

[0075] After the mask carrier 23 has been positioned by the transport system 50, the plurality of first and second aligner devices 41, 42 may be moved in the third direction 103 from a home position to a clamping position, such that the mask carrier 23 and/or mask frame 21 may be clamped. Alternatively, if the plurality of first and second aligner devices 41, 42 are mounted to an aligner support 23, the aligner support 23 may be moved such that the entire aligner system 40 moves from a home position to a clamping position such that the mask carrier 23 and/or the mask frame 21 may be clamped.

[0076] After levelling the mask 22 at block 304, method 300 may further include moving the substrate 10 from a home position to an aligning position. When the substrate 10 is being aligned to the mask 22 in block 303, the substrate 10 is positioned in the third direction 103 such that substrate 10 does not contact mask 22 so as to prevent damage to either substrate 10 or mask 22 during the alignment process. After mask 22 has been levelled and substrate 10 has been aligned to mask 22, substrate 10 may be further moved from the aligning position to an attach position by moving substrate 10 in the third direction 103 such that the mask 22 contacts, or attaches to, substrate 10 so that deposition can commence. This may be referred to as full face contact deposition.

[0077] Embodiments are also directed at apparatuses for carrying out the disclosed methods and include apparatus parts for performing each described method aspect. These method aspects may be performed by way of hardware components, a computer programmed by appropriate software, by any combination of the two or in any other manner.

[0078] According to some embodiments, which can be combined with other embodiments described herein, a first deposition apparatus is configured to deposit a first material and a second depositions apparatus is configured to deposit a second material different from the first material. One or more deposition apparatuses in a deposition system, particularly a vacuum deposition system, can be provided according to embodiments described herein.

[0079] While the foregoing is directed to embodiments of the disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims

1. A deposition apparatus (100) for depositing one or more layers on a substrate (10), comprising: a vacuum chamber (60); a transport system (50) for transporting a mask carrier (23) configured for supporting a mask frame (21) having a mask (22) mounted to the mask frame (21); and an aligner system (40), comprising: a plurality of first aligner devices (41) at least partially provided in the vacuum chamber (60), the plurality of first aligner devices (41) contacting the mask carrier (23) or a mask support supporting the mask frame; and a plurality of second aligner devices (42) at least partially provided in the vacuum chamber (60), the plurality of second aligner devices (42) contacting the mask frame

(21).

2. The deposition apparatus (100) according to claim 1, wherein the mask carrier (23) or the mask support supports the mask frame (21) in a substantially vertical orientation.

3. The deposition apparatus according to any one of claims 1 and 2, wherein at least one first aligner device (41) of the plurality of first aligner devices (41) includes at least one first clamping device and at least one second aligner device (42) of the plurality of second aligner devices (42) includes at least one second clamping device.

4. The deposition apparatus according to claim 3, wherein the at least one first clamping device clamps the mask carrier (23) or the mask support and the at least one second clamping device clamps the mask frame (21).

5. The deposition apparatus (100) according to any one of claims 3 or 4, wherein the at least one first and second clamping device comprises an electromagnetic clamp.

6. The deposition apparatus (100) according to any of claims 1 to 5, wherein at least one second aligner device (42) includes at least one actuator, wherein the at least one actuator applies a force to the mask frame (21).

7. The deposition apparatus (100) according to claim 6, wherein: the mask frame (21) defines a mask plane such that the mask frame (21) lies substantially coplanar to the mask plane; and the force includes at least one of the group consisting of a force applied in a substantially vertical direction parallel to the mask plane, a force applied in a substantially horizontal direction parallel to the mask plane, a force applied in a direction substantially normal to the mask plane, and a torque applied about an axis substantially normal to the mask plane.

8. The deposition apparatus (100) according to any one of claims 1 to 7, wherein the plurality of first aligner devices (41) and the plurality of second aligner devices (42) are mounted to the vacuum chamber (60).

9. The deposition apparatus (100) according to any one of claims 1 to 7, wherein the aligner system (40) further comprises an aligner support element (43), wherein the plurality of first aligner devices (41) and the plurality of second aligner devices (42) are mounted to the aligner support element (43).

10. A mask arrangement (200) for masking a substrate (10) in a processing chamber, comprising: a mask carrier (23) or mask support configured for supporting a mask frame (21) having a mask (22) mounted to the mask frame (21), wherein the mask carrier (23) or mask support is configured for contacting a plurality of first aligner devices (41), and wherein the mask frame (21) is configured for contacting a plurality of second aligner devices (42).

11. Use of the mask arrangement (200) according to claim 10 for masking a substrate (10) in a deposition apparatus (100) according to any one of claims 1 to 9.

12. Method for masking a substrate (10) in a vacuum chamber (60), comprising: clamping a mask carrier (23) or a mask support supporting a mask frame (21) having a mask (22) mounted to the mask frame (21); aligning the substrate (10) to the mask (22); and levelling the mask (22) by applying at least one adjustment force to the mask frame

(21).

13. Method according to claim 12, wherein the mask carrier (23) or the mask support supports the mask frame (21) in a substantially vertical orientation.

14. Method according to any one of claims 12 and 13, wherein applying at least one adjustment force to the mask frame (21) includes: clamping the mask frame (21); and operating at least one actuator.

15. Method according to any one of claims 12 to 14, wherein the mask frame (21) defines a mask plane such that the mask frame (21) lies substantially coplanar with the mask plane; and the at least one adjustment force includes at least one of the group consisting of a force applied in a substantially vertical direction parallel to the mask plane, a force applied in a substantially horizontal direction parallel to the mask plane, a force applied in a direction substantially normal to the mask plane, and a torque applied about an axis substantially normal to the mask plane.