TW201336140A - Organic el device manufacturing apparatus, film forming apparatus - Google Patents

Abstract

The invention provides an organic EL device manufacture apparatus or deposition apparatus that can reduce affection of flexing of substrate and mask or warping of shadow mask, can reduce the generation of powder dust and gas in the vacuum by high precision deposition or configuring the drive part at the atmosphere side, and has high production character, high maintenance character and high work efficiency. Also provided is an alignment device and alignment method that can perform high precision positioning. The invention is characterized in that: firstly, the shadow mask is in contraposition to the substrate in a dependent pose to deposit the deposition material on the substrate; secondly, a permeation type using the light incident on the positioning through hole arranged on the shadow mask to perform positioning; and thirdly, the deposition is performed by reducing the warping of the shadow mask.

Description

Organic electroluminescence manufacturing device and film forming device

The present invention relates to an organic electroluminescence manufacturing apparatus, a film forming apparatus, a film forming method therefor, a liquid crystal display substrate manufacturing apparatus, a calibration apparatus, and a calibration method, and more particularly to an organic electroluminescence manufacturing apparatus suitable for calibration of a large substrate. And a film forming apparatus and a liquid crystal display substrate manufacturing apparatus.

As a powerful method for manufacturing an organic electroluminescent device, there is a vacuum evaporation method. In vacuum evaporation, calibration of the substrate and the mask must be performed. The wave of large-scale processing of substrates is handled every year, and the substrate size of the G6 generation is 1500 mm × 1800 mm. When the size of the substrate is increased, the size of the mask is also increased, and the size thereof is also about 2000 mm × 2000 mm. In particular, when a steel photomask is used, the weight of the organic electroluminescence device is also 300 kg. In the past, the substrate and the mask were horizontally leveled, and calibration (position adjustment) was performed. In addition, the calibration has become stricter through the enlargement, and the demand is high. As a prior art regarding such calibration, Patent Documents 1 and 2 listed below are available. Further, regarding the correction of the calibration, Patent Document 2 discloses a method of performing calibration by adding a difference between the calibration detection amount and the actual correction amount in the horizontal calibration.

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2006-302896

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2008-004358

However, the method of calibrating the substrate and the photomask of Patent Document 1 as a lateral direction is disclosed. As shown in FIG. 14, the substrate and the photomask are greatly curved by their thinness and their own weight. If the curvature is the same, it is sufficient to prepare the photomask in consideration of this, but of course, the center is larger, and when the substrate size is larger, the production system becomes difficult. In addition, generally, the amount of bending at the center point is d1 > d2 when the curvature of the substrate is d1 and the curvature of the mask is d2. When the substrate is bent, the vapor deposition surface of the substrate is in contact with the photomask. During the calibration, the organic film which is in contact with the vapor deposition is generated in the prior art, and it is necessary to enlarge the spacer substrate and the mask during the calibration. However, when the interval is equal to or greater than the depth of field of view, the accuracy is deteriorated, and there is a problem that it becomes a defective product. In particular, in a substrate for a display device, a person who is not able to obtain a high-quality screen cannot be obtained.

In order to cope with the problem, there is a method in which a substrate and a photomask are formed to be slightly vertical and vapor-deposited. By being a vertical person, the bending of the self weight through the substrate or the shadow mask can be greatly reduced.

However, in the case of the mask, the thickness of the mask portion is 20 to 50 μm. When it is manufactured, as shown in Fig. 11, the entire mask is bent from the center toward the periphery, and the effect is large in the end portion of the mask portion. . Fig. 11 is a diagram exaggeratingly depicting the state in which it is understood that a gap of several tens of μm is formed between the substrate and the shadow mask, and the gap causes vapor deposition blurring, and steaming cannot be performed with high precision. Plating problem.

In addition, as shown in FIG. 15, the conventional method described in Patent Document 1 uses a light source that receives illumination from vertical or oblique directions and reflects on the opposite side of the vapor deposition side in order to prevent the vapor deposition material from adhering to the alignment mark. The so-called reflective optical system of the camera is configured to detect calibration marks and perform calibration. In the conventional organic electroluminescence manufacturing apparatus, as shown in the circled diagram of FIG. 3, the rectangular portion provided in the steel mask and the metal portion provided on the transparent substrate are used as calibration marks to form a metal. The part is calibrated to the center of the quadrangle. However, the reflective optical system has the following problems, and there is a problem that calibration cannot be performed accurately. (1) When the surface of the mask is caused by a mirror surface, it is caused by halation or the like, and when the illumination intensity cannot be increased and lowered, the metal portion cannot be detected. (2) At the time of calibration, it is necessary to provide a gap of about 0.5 mm between the mask and the substrate, but the depth of the field of view of the reflective optical system is small and the image becomes blurred.

Next, in the method disclosed in Patent Document 1, in order to provide the entire structure of the calibration substrate and the photomask as vacuum, there is dust or heat generated by the movement of the driving portion or the like, or from the driving unit or the like. The gas of the wiring, the gas from the lubricant, and the gas from the surface of the member reduce the possibility of vacuum. In the dust in the first vacuum, the dust adheres to the substrate or the mask, causing poor vapor deposition, and the second heat generation promotes thermal expansion of the mask to change the vapor deposition size, and the third air system reduces the vacuum. At the same time, there is a problem of reducing productivity, that is, productivity.

In addition, in order to set the entire mechanism of the calibration substrate and the photomask as a vacuum, it takes time to repair when a failure occurs in the drive unit or the like. And there is a problem of the decline in the rate of utilization of the device.

A first object of the present invention is to provide an organic electroluminescence light-producing apparatus, a film-forming apparatus, and a liquid crystal display board manufacturing apparatus which can reduce the curvature of a substrate or a reticle and perform vapor deposition with high precision.

Further, a second object of the present invention is to provide an organic electroluminescence light-producing apparatus, a film-forming apparatus, and a film forming method which can reduce the influence of the bending of the shadow mask and perform vapor deposition with high precision.

Furthermore, a third object of the present invention is to provide a calibration apparatus and a calibration method that can be accurately calibrated.

Further, a fourth object of the present invention is to provide an organic electroluminescence light-producing apparatus and a film-forming apparatus which can perform vapor deposition with high precision using the above-described calibration apparatus or calibration method.

Furthermore, a fifth object of the present invention is to provide an organic electroluminescence light-producing device and a film-forming apparatus which are capable of reducing the generation of dust or gas in a vacuum by arranging the drive unit to be equal to the atmosphere side.

Further, a sixth object of the present invention is to provide an organic electroluminescence light-producing device and a film-forming device which have a high degree of maintenance and a high utilization rate by arranging the drive unit to be equal to the atmosphere side.

In order to achieve the above-described object, the first feature includes a substrate holding means for holding the substrate in a standing position, and a female cover hanging means for holding the female cover down; and imaging is provided on the substrate and The calibration optical means of the calibration mark of the shadow mask, and the shape of the hanging posture described above And a control driving means for driving the aforementioned shadow mask, and controlling the control means of the calibration driving means according to the result of the calibration optical means.

Further, in order to achieve the above object, the second feature is added to the first feature, and the female cover hanging means is rotatably supported by the shade cover or the calibration base holding the shadow cover. a plurality of rotation support portions of the shadow mask, wherein the calibration driving means includes an active driving means for driving at least one of the plurality of rotation support portions, and the organic electroluminescence manufacturing device further includes The transmission rotation support portion of the other rotation support portion other than the active rotation support portion is calibrated with the operation of the active rotation support portion.

Further, in order to achieve the above object, the third feature is added to the second feature, and the active rotation support portion is provided on the upper portion and both ends of the shadow mask or the calibration substrate holding the shadow mask. The second side of the side.

Further, in order to achieve the above-described object, the fourth feature is added to the second feature, and the calibration driving means includes: a driving means for independently driving the two in the up-and-down direction, and two of the two. The above-described active driving means for driving the right and left driving means in the left-right direction, and the other one of the above-mentioned ones for the left and right direction of the transmission.

Further, in order to achieve the above object, the fifth feature is added to the first to fourth features, and the calibration driving means and/or the calibration transmission means are provided outside the vacuum chamber.

Furthermore, in order to achieve the above object, the sixth feature is added to the first to fifth features, and the calibration driving means is provided to the yin The upper side of the mask is provided on the lower side of the shadow mask.

In addition, in order to achieve the above-described object, the seventh feature is added to the first to sixth features, and the substrate holding means has a means for raising the substrate from a horizontal state.

In addition, in order to achieve the above object, the eighth feature is added to the first to sixth features, and the substrate holding means has a means of bringing the substrate up and close to or close to the shadow mask. .

Furthermore, in order to achieve the above object, the ninth feature is directed to a calibration method having a calibration of the substrate and the shadow mask in the vacuum chamber, and a vacuum evaporation of the vapor deposition material in the evaporation source on the substrate. The film forming apparatus of the vapor deposition chamber includes: a substrate holder that holds the substrate, holds the upright posture, and a shade cover holding means that holds the shadow mask in the substrate in the rising posture; and The means for correcting the influence of the bending through the aforementioned shadow mask is reduced.

In addition, in order to achieve the above-described object, the tenth feature is added to the ninth feature, and the correction means includes a substrate holder that presses and holds the substrate, or a pressing means of the shadow mask.

Furthermore, in order to achieve the above object, the eleventh feature is added to the tenth feature, and the correction means has a measuring means for measuring a distance between the substrate holder and the shadow mask, and is based on the measuring means. As a result, the above-described pressing means is controlled based on the amount of correction prescribed in advance.

In addition, in order to achieve any of the above purposes, its 12th feature is added In the eleventh aspect, the pressing means presses the pressing position of the substrate holder to be around the outer side of the end portion vapor deposition portion of the substrate, or the pressing means presses the pressing position of the female cover to correspond to the substrate The position around the outer side of the end vapor deposition section.

Further, in order to achieve the above object, the thirteenth feature is added to the twelfth feature, and the pressing position is provided at four places in the vicinity of the four corners of the substrate holder or the shadow mask.

In addition, in order to achieve the above object, the fourteenth feature is a method for forming a film by depositing a vapor deposition material on the substrate by aligning the substrate and the shadow mask in a vacuum chamber, and correcting the shadow mask. The correction of the bending of the engineer.

Furthermore, in order to achieve the above object, the fifteenth feature is added to the fourteenth feature, and the correction is performed by a substrate holder or a shadow mask that holds the substrate.

Further, in order to achieve the above object, the sixteenth feature is added to the fourteenth feature, and the correction process is performed before or after calibration.

Further, in order to achieve the above object, the seventeenth feature is the feature of any one of the fourteenth to sixteenth, and that the substrate is tightly attached to the shadow mask after the calibration.

Further, in order to achieve the above object, the eighteenth feature is added to the tenth feature, and the correction project is provided in a hollow cover, and one end is opened to the hollow cover and the other end is open to the atmosphere. The connecting portion is required to be laid by the connecting portion in the above-mentioned correcting means Wiring person.

Furthermore, in order to achieve the above-described first object, the ninth feature is added to the ninth feature, and the substrate holding means and the correction means are formed in a state in which the horizontal state is established.

Further, in order to achieve the above object, the twentieth feature is added to the nineteenth feature, and the substrate rotating means is a means for rotating the connecting portion.

Further, in order to achieve the above object, the twenty-first feature is that the shadow mask has a through hole for calibration, and the calibration portion includes a light source that emits light from one end side of the through hole and the other end of the photographing The calibration optical system of the photographing means and the control unit that performs calibration based on the output of the photographing means.

Further, in order to achieve the above object, the twenty-second feature is the twenty-first feature, wherein the through hole is a hole that penetrates before and after the shadow mask, and the calibration optical system has the aforementioned at least for the substrate At the time of the treatment, the shielding means for shielding the adhesion to the processing material of the through hole is shielded.

Further, in order to achieve the above object, the twenty-third feature is the twenty-second feature, wherein the calibration optical system has the shielding means moved to a processing position during processing, and moves to calibration during calibration. The position of the shadow moving means.

Further, in order to achieve the above object, the twenty-fourth feature is the twenty-first feature, wherein one end of the through hole is an opening for calibration, and an optical fiber is connected or inserted at an opening of the other end, and the optical fiber is used of The other end is connected to a light source or a photographic means.

Further, in order to achieve the above object, the twenty-fifth feature is the twenty-second feature, wherein one end of the through hole is an opening for calibration, and the through hole has an L-shaped portion.

Further, in order to achieve the above object, the twenty-sixth feature includes: a light source including a light source that emits light to a calibration mark provided on the substrate and the shadow mask; and a calibration optical system that photographs the calibration mark; the calibration optical The system has a follow-up means in which at least one of the light source or the photographing means moves in accordance with the alignment operation of the substrate or the shadow mask.

Furthermore, in order to achieve the above object, the twenty-seventh feature is added to the twenty-sixth feature, and the following means is connected to a means for driving the driving of the calibration operation.

Further, in order to achieve the above object, the twenty-eighth feature includes: a light source provided with a light source for irradiating light to a calibration mark provided on the substrate and the shadow mask; and a calibration optical system for photographing means for photographing the calibration mark; The plurality of calibration marks are provided, and for each of the calibration marks, a plurality of the calibration optical systems are provided, and the center position of the substrate is calibrated to a reference based on the output of the plurality of imaging means.

Further, in order to achieve the above object, the twenty-ninth feature is added to the twenty-eighth feature, and the plural number is four, and the calibration is provided in the vicinity of the four corners of the substrate and the shadow mask.

Further, in order to achieve the above object, the 30th feature is added to the above-described 21st to 29th features, and the calibration of the substrate is performed And the shade cover.

Furthermore, in order to achieve the above object, the thirty-first feature is added to the above-mentioned 21st to 30th features, and the calibration is performed in a vacuum chamber, and the vapor deposition material in the evaporation source is vapor-deposited on the substrate. Vacuum evaporation chamber.

Further, in order to achieve the above-described object, the thirty-third feature is the above-described thirty-third feature, and that the imaging device includes at least the imaging means from the atmosphere side of the upper portion of the vacuum chamber. The recessed portion is provided with an optical window for the concave front end.

Furthermore, in order to achieve the above object, the thirty-third feature is the 31st feature, wherein the shielding movement means has a driving means provided on the atmosphere side, and the driving means is coupled to the driving means by a vacuum sealing means. The means for connecting the aforementioned shielding means.

Further, in order to achieve the above object, the thirty-first feature is the same as the above-mentioned thirty-first feature, comprising: driving means for driving the female cover for performing the calibration, and connecting the female cover or holding the shadow The calibration substrate of the cover and the calibration axis of the driving means; the driving means is disposed on the atmosphere side, and the calibration axis is activated by a vacuum sealing means.

Finally, in order to achieve the above object, the 35th feature is added to the above-described 11th to 14th features, and an organic electroluminescent material is used as the vapor deposition material.

According to the present invention, it is possible to provide an organic electroluminescence light-producing device or a film-forming device or a liquid crystal display substrate-manufacturing device which can reduce the curvature of a substrate or a reticle, and which is highly vapor-deposited.

Further, according to the present invention, it is possible to provide an organic electroluminescence light-producing apparatus, a film-forming apparatus, and a manufacturing method and a film-forming method which can reduce the influence of the curvature of the shadow mask, and which are vapor-deposited with high precision.

Moreover, according to the present invention, it is possible to provide a calibration apparatus and a calibration method which can be accurately calibrated.

Further, according to the present invention, it is possible to provide an organic electroluminescence light-producing device and a film-forming device which can be vapor-deposited with high precision using the above-described calibration device or calibration method.

Further, according to the present invention, it is possible to provide an organic electroluminescence light-generating device or a film-forming device which is capable of reducing the generation of dust or gas in a vacuum by the arrangement of the drive unit and the atmosphere side.

Further, according to the present invention, it is possible to provide an organic electroluminescence light-producing device or a film-forming device which has a high degree of maintenance and a high rate of productivity by arranging the drive unit to be equal to the atmosphere side.

The first embodiment of the invention will be described using the drawings. The organic electroluminescence excitation manufacturing device not only forms a luminescent material layer (electroluminescence layer), but also has an electrode clamping structure, and above the anode, a hole is implanted into the layer or the transport layer, and the electron is placed above the cathode. The implant layer or the transport layer or the like forms a multilayer structure in which various materials are formed as a film, and the substrate is cleaned. Figure 1 shows it A diagram of an example of a manufacturing device.

In the organic electroluminescence light-producing apparatus 100 of the present embodiment, the load group 3 of the substrate 6 to be processed is processed, and the group (A to D) of the substrate 6 is processed, and each group or group is processed. It is composed of six delivery rooms 4 arranged between the load group 3 and the next engineering (closed project). In the present embodiment, the vapor deposition surface of the substrate is transported on the upper surface, and when vapor deposition is performed, the substrate is lifted up and vapor-deposited.

The load group 3 is a transfer robot 31 having a gate valve 10 for maintaining a vacuum before and after, and a transfer robot that receives the substrate 6 (hereinafter referred to as a substrate) from the load chamber 31 and rotates to input the substrate 6 to the delivery chamber 4a. 5R made. Each of the load chambers 31 and the respective delivery chambers 4 has a gate valve 10 in front and rear, and the switch of the gate valve 10 is controlled to maintain a vacuum, and the substrate is delivered to the load group 3 or the next group or the like.

Each group (A to D) has a transfer chamber 2 having one transport robot arm 5, and a substrate that receives the substrate from the transport robot 5, and is disposed on the upper and lower processing chambers on the plane for performing specific processing. 1 (The first added word a to d is the display group, the second added word u, and the d is the upper side of the upper side). A gate valve 10 is provided between the transfer chamber 2 and the processing chamber 1.

2 is a view showing the outline of the configuration of the transfer chamber 2 and the processing chamber 1. The configuration of the processing chamber 1 differs depending on the processing contents, but a vacuum vapor deposition chamber 1bu in which an electroluminescent layer is formed by vacuum-evaporating a luminescent material is exemplified. Fig. 3 is a schematic view and an operation explanatory view showing a configuration of the transfer chamber 2b and the vacuum vapor deposition chamber 1bu at this time. In the transport robot 5 of Fig. 2, the whole body can be moved up and down (see arrow 59 in Fig. 3), and has a link that can be rotated to the left and right. The holder 57 of the structure has two comb-shaped handles 58 for transporting the substrate in the upper and lower stages. The case of one handle is to transfer the substrate to the rotation of the next project, in order to The rotation operation of the substrate is performed, and the opening and closing operation of the gate valve is required between the input and the process. However, when the upper and lower stages are formed, the substrate input to the one-side handle is maintained. After the output operation of the substrate is performed from the vacuum evaporation chamber without holding the shank on the substrate side, the input actor can be continuously input.

The two handles or one handle are determined by the required production capacity. In the following description, in order to simplify the description, one handle portion will be described.

On the other hand, the vacuum vapor deposition chamber 1bu is roughly etched by evaporating the luminescent material, vapor-deposited on the vapor deposition portion 7 of the substrate 6, and adjusting the position of the substrate 6 and the shadow mask to be vapor-deposited on the necessary portion of the substrate 6. The portion 8, and the delivery of the transport robot 5 and the substrate, are moved to the process delivery portion 9 of the vapor deposition portion 7. The calibration unit 8 and the processing delivery unit 9 are provided with two systems of a right R line and a left L line.

Therefore, the basic method of the processing in the present embodiment is to perform vapor deposition between one line (for example, R line), and to perform input and output of the substrate in the other L line, and to perform the substrate 6 and the shadow mask 81. The calibration is completed, and the preparer who performs the vapor deposition is finished. When this process is performed by interaction, the time for excess sublimation can be reduced without vapor deposition on the substrate.

First, an embodiment of the aligning unit 8 according to the first feature of the present invention will be described. In this embodiment, as shown in FIG. 4, the substrate 6 and the shadow are shielded. The cover is erected vertically. Further, the mechanism for calibrating is provided on the atmosphere side outside the vacuum vapor deposition chamber 1 as much as possible, specifically, on the upper wall 1T of the vacuum deposition chamber 1, or under the lower wall 1Y. In addition, it is necessary to provide a configuration in the vacuum vapor deposition chamber 1bu, and a convex portion is provided from the atmosphere portion and provided therein.

In the present embodiment, during the calibration, the substrate 6 is fixed, the shadow mask 81 is moved, and the position is adjusted by being necessary to be vapor-deposited on the substrate 6.

Hereinafter, the mechanism of the calibration unit 8 and its operation will be described.

The aligning portion 8 is provided with a squeegee 81, a calibrating base 82 for fixing the hood 81, a calibrating substrate 82, and a calibrating substrate 82, that is, a calibrating driving portion 83 in the XZ plane of the hood 81, and supporting from below. The calibration substrate 82, the calibration transmission portion 84 that coordinates the posture of the shadow mask 81 in coordination with the calibration driving portion 83, the calibration optical system 85 that detects the calibration marks provided on the substrate 6 and the aforementioned shadow mask 81, and the processing calibration mark The image is obtained by obtaining the calibration amount and controlling the control device 60 (see FIG. 8) of the calibration drive unit 83.

First, FIG. 5 shows a shadow mask 81. The shadow mask 81 is formed by the mask 81M and the frame 81F. For example, the size of the substrate of the G6 is 1500 mm × 1800 mm, and the size is about 2000 mm × 2000 mm, and the weight is also 300 kg. The mask 81M has a window for defining a vapor deposition position. For example, when a vapor deposited film which emits red (R) is formed, there is a window corresponding to the portion corresponding to R. The size of this window varies depending on the color, but the average width is 30 μm and the height is 150 μm. The thickness of the photomask 81M is about 50 μm, and tends to be thinner in the future. On the other hand, right In the mask 81M, the precision alignment mark 81m is four, and the coarse calibration mark 81mr is two, and six points are provided, and the calibration mark 81m is provided. Corresponding to this, the substrate is also provided with four calibration marks 6ms and six coarse calibration marks 6mr at two places, and a calibration mark 6m is provided.

The calibration substrate 82 has holding portions 82u and 82d that hold the upper and lower portions of the shadow mask 81. The back side of the shadow mask 81 is a cavity that can be vapor-deposited on the substrate 6 and has a shape like a letter. Further, the calibration base 82 is rotatably supported by a rotation support portion which is disposed at four corners 81a and 81b at the upper portions 2, 81a, 81b, and at the lower portions 81c and 81d of the two places.

Next, the calibration drive unit 83 and the calibration transmission unit 84 that define the posture of the shadow mask 81 will be described. First, the operation of the four rotation support portions will be described, and the configuration and operation of the calibration drive unit 83 and the calibration transmission unit 84 in accordance with the operation of the drive or rotation support unit by the four rotation support portions will be described.

Among the four rotation support portions, the rotation support portion 81a is actively (actively driven) in the Z direction, and when the rotation support portion 81b is activated in the Z direction and the X direction, the rotation support portion 81a is calibrated by the base 82. In the X direction, the rotation support portions 81c and 81d perform transmission rotation by using the rotation support portion 81a of the active combined action as a fulcrum.

The alignment shafts 83a and 84a that connect the respective rotation support portions and the action points of the drive unit or the transmission unit to be described later are not inclined via the pin grooves 83s and 84s, and are perpendicular to the Z direction and/or parallel to the X direction. Therefore, each of the rotation support portions is rotatably attached to the calibration base 82. Accordingly, the transmission rotation of the rotation support portions 81c and 81d is decomposed into the X direction. And the action in the Z direction.

In other words, in the present embodiment, the Z position is corrected by the movement of the rotation support portions 81a and 81b in the Z direction, and the rotation correction is performed via the difference between the two, and the movement in the X direction via the rotation support portion 81b. , X position correction. Further, the distance between the rotation support portions 81a and 81b is long, and the rotation in the same Z direction has an advantage that the rotation can be accurately corrected.

The shade cover driving unit 83 that drives the above-described rotation support portions 81a and 81b is provided in the atmosphere on the upper wall portion 1T (see also FIG. 2) of the vacuum vapor deposition chamber 1bu, and has a movement rotation instruction portion 81a in the Z direction. The left drive unit 83L of the Z drive unit 83Z has a Z drive unit 83Z that moves the rotation support unit 81b in the Z direction in the same manner as the left drive unit 83L, and moves the entire Z drive unit in the X direction (FIG. Z). In the left-right direction, the right drive unit 83R of the X drive unit 83X is formed. The Z drive units of the left and right drive units 83L and 83R have substantially the same configuration, and the same reference numerals are attached thereto, and a part of the symbols are omitted. Hereinafter, the manner in which the symbols are added and the omitted modes are the same in the mechanism portion.

The Z drive unit 83Z will be described by exemplifying the left drive unit 83L. The Z driving unit 83Z is fixed to the Z driving unit fixing plate 83k that is driven in the X direction on the rail 83r as described above, and drives the motor 83zm via the Z direction, and the moving screw 83n is pushed and pulled 83t to move the connecting rod 83j to the Z. direction. The calibration shaft 83a is moved in the Z direction via a connecting rod 83j connected at its upper portion. The push 83t system uses the gravity of the calibration substrate 82 or the like, and is configured to prevent the idling in the Z direction. As a result, the hysteresis disappears and there is an early The effect of reaching the target value. Further, each of the calibration shafts 83a is operated by a telescopic tube 83v having a sealing portion (not shown) provided at one end portion 1T of the vacuum vapor deposition chamber 1bu.

The right driving unit 83R is further provided on the Z-drive unit 83Z, and has a wall portion 1T fixed to the vacuum vapor deposition chamber 1bu, and the Z-drive portion fixing plate 83k on which the Z-drive portion 83Z is mounted is mounted along the X-axis rail 83r. The X drive unit 83X is driven. The driving method of the X driving unit 83X is to rotate the driving force of the motor 83xm in the X direction, and the substrate is the same as the Z driving unit 83Z by the rolling screw 83n or the like. However, the driving force is required to rotate the driving substrate 82 by the rotation and Calibrate the substrate to move the power of the other drive or transmission. Since the calibration shaft 83a of the right driving portion 83R is also moved in the X direction, the telescopic tube 83v also has a degree of freedom in the X direction, and has flexibility in the right and left while stretching.

The calibration transmission portion 84 has transmission portions 84L and 84R that move the respective calibration shafts 84a to the left and right in the Z direction and the X direction in accordance with the above-described transmission rotation of the rotation support portions 81c and 81d. The transmission unit may be provided at one center portion. However, in the present embodiment, two positions are provided for the operation in stability. The two transmission portions are basically the same structure in the left and right line symmetry, and 84R is explained as a representative. Similarly to the bellows 83v in which the fixed end is fixed to the sealing portion 84c of the wall portion 1Y of the vacuum vapor deposition chamber 1bu, the calibration shaft 84a is fixed to the bellows 84v and the bolt groove 84s which seal the vacuum of the processing chamber 1bu. X-axis drive plate 84k. Therefore, the drive train in the X direction is moved on the rail 84r of the calibration support portion fixing base 84b of the fixed calibration transmission portion 84, and the passive direction in the Z direction is passed. The pinning groove 84s is performed.

In the embodiment of the aligning unit described above, one of the four rotating support portions 81 is placed in the upper portion of the vacuum vapor deposition chamber, and the one is actively activated (actively driven) in the Z direction. In the X direction, the calibration of the shadow mask is performed. In addition to this, various driving methods can be cited. For example, at the upper portion 3, a rotation support portion is provided, and the rotation support portion at the center is rotated, and the left and right rotation support portions are actively or calibrated in the Z direction and the X direction. In the lower part, at least one transmission portion is provided. Alternatively, as in the above-described embodiment, two upper rotation support portions are provided, and one of them is rotated to concentrate the Z direction and the X direction, and other systems are also used as the transmission method. Further, in the above-described embodiment, basically, the upper portion is taken as the active and the lower portion is used as the transmission, but this may be reversed.

In the embodiment of the calibration unit 8, the calibration drive unit 83, the calibration transmission unit 84, and the calibration optical system 85 are provided on the air side of the upper portion or the lower portion of the vacuum deposition chamber 1bu, but may be provided in the vacuum evaporation chamber. The atmospheric side of the side wall of 1bu. Of course, it can also be dispersed in the upper part, the lower part and the side wall part.

Next, an embodiment of the calibration optical system 85 according to the second feature of the present invention will be described. The calibration optical system of the present embodiment is capable of independently photographing each of the aforementioned calibration marks, from four precision calibration optical systems 85s for four precision calibration marks 81ms, and for two coarse calibration marks 81mr. The two coarse calibration optical systems 85r are composed of six optical systems.

The basic configuration of the six calibration optical systems is shown in FIG. The basic structure of the optical system is provided with a nip mask 81, on the side of the calibration substrate 82, having an optical window 85ws at the front end, fixed to the upper portion 1T of the vacuum evaporation chamber 1bu, and a light source 85k and fixed by the optical window 85w. A light source side mirror 85 km of the blocking bracket 85 as described later is provided, and a camera side mirror 85 cm attached to the holder 85 a of the camera housing tube 85 t and a camera 85 c mounted in the camera storage unit 85 t are provided on the substrate 6 side. It has a so-called transmissive structure. The camera housing tube 85t, the holder 85a, and the like are not obstructed by the rail K when the substrate is in the vertical posture, and can be moved to the position of the holder 85a indicated by a broken line via the extension tube 85v or the like.

Because of the transmission type, the alignment mark 81m of the through-hole of the rectangular shape is provided in the mask 81M, and the cylindrical through-hole 81k is also provided in the frame 81F. On the other hand, the alignment mark 6m of the substrate 6 is a relatively small mark as a calibration mark 81m which is a metallic quadrangular shadow mask above the light-transmitting substrate.

When the through hole 81k is provided, the vapor deposition material enters the through hole at the time of vapor deposition, and is vapor-deposited on the calibration mark, so that calibration cannot be performed from the next process. In order to prevent this, it is shielded as a vapor deposition material from entering the through hole 81k at the time of vapor deposition. In the present embodiment, the holder for providing the light source side mirror during the calibration is effective in the vapor deposition interruption during vapor deposition, and the holder is made movable, and the vapor deposition is shielded. A shield bracket 85as constructed of a hole 81k. The shielding bracket 85as is driven by a driving motor (not shown) provided on the atmosphere side. The upper and lower connecting rods 85b are expanded and contracted, and one end thereof is driven by a telescopic tube 85v fixed to the sealing portion 85s. The dotted line shown in Fig. 6 shows the occlusion state, and the solid line shows the calibration state.

Another embodiment is shown in FIG. As shown in Fig. 7 (a), the thickness of the frame 81F of the shadow mask is sufficient, and the L-shaped through hole 81k is provided in the frame 81F, and the light source 85k and the light source side mirror 85 km may be simultaneously accommodated. In this case, the frame body 81F itself functions as a shielding body, and a shield type bracket is not required.

Further, as shown in FIG. 7(b), at the time of calibration, the light source side mirror 85 km does not interrupt the vapor deposition range, and the shield base can be fixed to the calibration base 82, and can be often shielded. State.

Further, as shown in FIG. 7(b), the camera housing tube 85t is lengthened on the camera side, and the light source side mirror 85 km may be incorporated.

Further, as shown in FIG. 7(c), the light source side opening portion is fixed in a state in which one end of the optical fiber 85f is shielded, and the other end is connected to the light source 85k provided on the atmosphere side. In the present embodiment, the light source of the heat generating body can be installed on the atmosphere side with a simple structure, and it is not necessary to provide a special shielding body.

Further, for other purposes, when the structure provided in the vacuum deposition chamber 1bu is vapor-deposited, it is not necessary to provide a new shielding body as long as the shielding body is achieved.

On the other hand, as shown in FIG. 4, the camera housing tube 85t has a structure that protrudes from the upper portion 1T of the vacuum vapor deposition chamber 1bu, and an optical window 85w is provided at the distal end to hold the camera 85c on the atmospheric side while being photographable. Calibration marks 6m, 81m (see Figure 6 for symbols).

Further, a light source is provided on the vapor deposition surface side, but a camera may be provided to change the position.

The difference between the precision calibration optical system 85s and the coarse calibration optical system 85r is that the former has a narrow field of view and a high magnification lens 85h that is calibrated with high resolution photography for high precision calibration. Along with this, the dimensions of the alignment marks 6m and 81m of the substrate and the shadow mask shown in FIG. 3 are different. The field of view is precisely calibrated. Compared with the coarse calibration, it is less than one digit, and finally it can be calibrated in μm.

Accordingly, during the precision calibration, the movement of the alignment 81m of the shadow mask 81 is performed without leaving the field of view, and the precision calibration optical system 85s also has to follow the movement. The fixed cameras 85c and the fixed plates 85p and 85ps of the light source 85k are connected to the Z drive unit fixing plate 83k or the X-axis drive plate 84k to follow. Further, the rough calibration optical system 85r is provided with a camera position adjustment platform 85d at the time of initial installation and position adjustment.

In the foregoing embodiment, six calibration optical forms are used, and the required accuracy is not required to be set, and there is no need to provide a coarse calibration optical system, and for the precision calibration optical system, four are not required, and the thickness is included. Precision, the minimum is 2.

Next, an embodiment in which the substrate is raised and the substrate 6 is brought close to the shadow mask after the calibration is completed will be described before the calibration of the third feature of the present invention. The process delivery unit 9 shown in Fig. 3 has a comb-like hand 91 that can deliver the substrate 6 without interfering with the comb-like hand 58 of the transport robot 5, and is fixed on the comb-shaped hand 91. Place a substrate 6 The substrate rotating means 93 for rotating the substrate 6 and the substrate rotating approach means 93A formed by the substrate approach means 93G close to the aligning portion 8 are further provided. The means for fixing is a vacuum suction or a mechanical clamp, and is provided on the upper side 94u when the substrate is raised at least.

Fig. 8 is a view showing the substrate rotation approach means 93A in detail, and shows a vacuum inner wiring which is a problem of exhaust gas which is not provided with a wiring material such as wiring, or a fluid leakage which is damaged by wiring fatigue. Applicable diagram of the piping mechanism.

First, the substrate rotation means 93 of the substrate rotation approach means 93A will be described. The substrate rotating means 93 is a mounting table 93d on which the substrate 6 is placed, a cooling jacket 93j for cooling the substrate 6 during vapor deposition, and a substrate rotation driving portion 93b for integrally rotating the substrate 6, the mounting table 93d, and the cooling jacket 93j. The rotation support table 93k such as the cooling jacket 93j is rotatably supported. Cooling water pipes 43, 44 are applied to the cooling jacket 93j. Further, the substrate rotation driving unit 93b includes a rotation motor 93sm provided on the atmosphere side, and a first link 41 that is hollow in the direction of the arrow A via the rotation motor 93sm by the gears 93h1, 93h2, and The first link 41 is fixed to the hollow portion continuous with the hollow portion of the first link, and is provided along the side surface portion of the cooling jacket 93j. However, the first link is attached to the seal portion 93s provided on the side wall of the vacuum vapor deposition chamber 1bu, and the extension tube 93v having the fixed end is interposed, and is rotatably supported via the rotation support table 93k. However, the rotation motor 93sm is controlled by the control device 60 provided on the atmospheric side.

In the above, when the substrate 6 which is provided by the fixing means 94u on the upper portion of the substrate is supported by the fixing means 94 shown in FIG. 3, the substrate 6 is bent and bent by its own weight. After the bending is digested, the fixing means 94d provided on the lower portion of the substrate may be fixed. Further, when the substrate 6 is vertically erected, there is a possibility that a slight gap is generated between the substrate 6 and the mounting table 93d. For example, the degree of tilting is stable at the same time as 1 degree, and can be surely eliminated. These benders.

In the present embodiment, the substrate vapor deposition surface is formed as an upper surface and transported. If the substrate 6 is raised, the calibration can be performed directly.

Next, the substrate approach means 93G will be described. The substrate approaching means 93G (substrate approaching drive unit 93g) has a fixed substrate rotation drive unit 93b, a rotation drive unit mounting table 93t that moves on the rail 93r in the direction of the arrow B, and a rotation drive unit mounting table 93t. 93n is driven by the proximity motor 93dm. By controlling such a mechanism via the control device 60, the substrate 6 is brought close to the shadow mask 81, and if necessary, it can be tight.

According to the above embodiment, the bending of the substrate can be eliminated at the time of vapor deposition. In addition, the distance between the substrate and the shadow mask can be kept, and the substrate can be calibrated. Then, when the substrate is brought close to or close to the shadow mask, the blurring of the vapor deposition can be reduced, and the vapor deposition can be performed with high precision.

Further, the substrate rotation approach means 93A has a problem of a vacuum inner wiring which is a problem of exhaust gas which is not provided with a wiring material, or a fluid which is damaged by wiring fatigue. Piping mechanism. Wiring within the vacuum. The piping mechanism 40 is configured by the first link 41 and the second link 42 described above. In the hollow portion, a cooling water pipe for the supply 43 and the recovery 44 is disposed in order to flow the cooling water to the cooling jacket 93j. Each of the links is made of a metal having a strong rust resistance and a relatively high strength, for example, stainless steel or aluminum, and the rotating motor 93sm side of the hollow portion of the first link 41 is opened to the atmosphere. The two cooling water piping systems are generally composed of a material having flexibility used in the atmosphere, or are made of a metallic material, and have no flexible portion in the connecting rod, and the piping is formed by the first link 41. The L-shaped shape of the second link 42 is formed, and the flexible portion is provided on the air side. If the latter is used, it can constitute a pipe with less fatigue damage. In addition, if the cooling water leaks from the cooling water pipes 43, 44, it may be drained to the atmosphere side, and the connection portion of the side wall of the vacuum vapor deposition chamber 1bu may be lower than the connection portion of the cooling jacket 93j.

Such as the vacuum inner wiring according to the embodiment. The piping mechanism 40 is open to the atmosphere at one end, and is connected to the hollow portion of the link mechanism of the moving portion at a plurality of ends, and a pipe is provided. The rotating portion of the link mechanism is vacuum-sealed and completely blocked from the vacuum side. In the event that water leaks from the cooling water pipe, it does not leak to the vacuum side, and it is not necessary to make the hollow portion of the link mechanism vacuum. Further, since the link mechanism is made of stainless steel or aluminum, the generation of exhaust gas is small. In addition, wiring inside the vacuum. The piping mechanism constitutes a part of the substrate rotation driving unit, and can be configured as a simple unit as a whole. In the above-described example, there is an example in which the piping is laid on the connecting rod. However, even if the signal line is wired in the connecting rod, it is possible to provide a configuration in which the exhaust gas generated from the signal line is not generated in the vacuum. Accordingly, it is possible to maintain a high vacuum and perform a highly reliable vapor deposition process.

Next, the processing operation of the vacuum vapor deposition chamber having the calibration unit 8, the calibration optical system 85S, and the substrate rotation approach means 93A described above will be mainly described with reference to the calibration operation.

Hereinafter, a flow chart of the process after the substrate is input to the vacuum evaporation chamber 1bu is shown. (1) First, the upper portion of the substrate 6 that is input to the R line shown in FIG. 3 is fixed to the substrate stage, and then it is erected vertically to be bent and bent. (2) The rough calibration is performed by the coarse calibration mark from the state in which the substrate 6 is separated by a certain distance, and the position at the coarse calibration is detected to be offset, and the coarse correction amount is obtained. (2) The coarse position adjustment is performed by moving the shadow mask 81 on the ZX plane shown in Fig. 4 in accordance with the rough correction amount. (3) By maintaining a certain distance, precise calibration marks are used to perform precision calibration, and the position of the precision calibration is offset to obtain a precise correction amount. (4) According to the precision correction amount, the shadow mask 81 is moved in the ZX plane shown in Fig. 4 to perform precise position adjustment. (5) The compact substrate 6 and the shadow mask 81. (6) Detect the calibration result (position offset) of (3). (7) If the positional shift amount is an allowable range, the vapor deposition of the substrate of the L line shown in Fig. 3 is waited for. (8) After the vapor deposition of the L line is completed, the evaporation source 71 is moved on the R line to perform vapor deposition. (9) In (7), if the positional shift amount is outside the allowable range, the two are temporarily separated, and the process returns to (3) for precise calibration.

In the above, the position adjustment of the coarse calibration is performed by two cameras 85c, and is disposed on the substrate 6. As shown in the guide diagram of FIG. 3, the calibration marks 81mr and 6mr of the photographic mask 81 and the substrate 6 will be The middle point of the two calibrations is fundamentally adjusted to the baseline. On the other hand, precision calibration is placed near the four corners of the substrate, and four calibration marks are placed to center the substrate. Point correction is the benchmark. In theory, for the case of two fundamental decisions, four are too much information. This is based on the information of the four corners, and the offset of the four corners is minimized. When the center point of the substrate is determined to be centered, the offset between the substrate 6 and the shadow mask 81 is reduced, and the product can be made large in order to obtain a large size. The area of effective use. When the upper midpoint is made into a reference as in the rough calibration, the offset on the lower side becomes large, and the area available as a product becomes small.

According to the embodiment described above, it is possible to provide an organic electroluminescence light-producing device which can be calibrated by making the substrate and the shadow mask vertical or substantially vertical. As a result, it is possible to eliminate the influence of the bending of the self-weight via the substrate or the shadow mask, to eliminate the positional deviation, or to blur the film through the inaccessible substrate and the shadow mask, thereby enabling high-precision evaporation and high fabrication. An organic electroluminescence manufacturing device for a wonderful substrate.

Further, according to the present embodiment, in the mechanism necessary for the calibration, the generation of the driving device in the atmosphere suppresses the generation of dust or gas, and further reduces the vapor deposition by dust or gas, thereby providing high productivity. Organic electroluminescence excitation device.

Further, according to the present embodiment, in the mechanism necessary for the calibration, a mechanism for providing a driving device or a heat generating device or a plurality of components for calibrating the optical system in the atmosphere can provide an organic electric device having excellent maintainability and high yield. Excitation light manufacturing device.

In addition, it is possible to provide a calibrator having a substrate as a center, and as a product, it is possible to carry out vapor deposition with high effective area, that is, an organic electroluminescence manufacturing apparatus having high yield, that is, high productivity.

Moreover, as according to the above embodiment, it may be provided by For the transmissive type, it is possible to reliably detect an organic electroluminescence light-emitting device having high reliability of the substrate and the shadow mask.

The embodiment described so far is an embodiment in which the substrate 6 and the shadow mask 81 are erected and calibrated, and then held upright and vapor-deposited. It is not necessary to carry out vapor deposition from the standing state, and when the mechanism for delivering the shadow mask to the substrate side is added, the state of the calibration is maintained, and the level is temporarily set, and then vapor deposition may be performed. For example, the first method is a method of performing vapor deposition from the upper portion via the substrate rotating means 93 shown in FIG.

As a second method, one of the two processing lines shown in FIG. 3 is used as a calibration dedicated line (for example, an R line), and the other line (L line) is used as a dedicated line for vapor deposition. After the R line is calibrated, it is moved to the L line via the transfer robot 5. Thereafter, the substrate rotating means 93 provided on the L line is rotated by 180 degrees to perform vapor deposition from below. In this method, how much processing time is required, but it is also possible to perform processing on the sides of the calibration dedicated line by setting a dedicated evaporation line.

In the embodiment in which the vapor deposition is performed at the above-described level, the same effects as those of the embodiment in which the vapor deposition is performed in the standing state can be obtained.

In the embodiment described above, the case where the substrate is horizontally transported to the process delivery unit has been described. However, the substrate may be transported vertically, and then calibration may be performed.

Furthermore, according to the present embodiment, it is possible to provide a driving device that cannot be installed in a vacuum in a mechanism required for calibration, and can be installed in the atmosphere. Medium organic electroluminescence excitation device.

Furthermore, the above calibration mechanism can also be applied to calibration of a liquid crystal display device or the like performed in the atmosphere.

In addition, it is possible to provide a calibrator having a substrate as a center, and as a product, it is possible to carry out vapor deposition with high effective area, that is, an organic electroluminescence manufacturing apparatus having high yield, that is, high productivity.

Further, according to the above embodiment, it is possible to provide an organic electroluminescence light-producing device which can reliably detect the reliability of the substrate and the shadow mask by using the calibration mark as the transmission type.

The embodiment described so far is an embodiment in which the substrate 6 and the shadow mask 81 are erected and calibrated, and then held upright and vapor-deposited. It is not necessary to carry out vapor deposition from the standing state, and when the mechanism for delivering the shadow mask to the substrate side is added, the state of the calibration is maintained, and the level is temporarily set, and then vapor deposition may be performed. For example, the first method is a method of performing vapor deposition from the upper portion via the substrate rotating means 93 shown in FIG.

As a second method, one of the two processing lines shown in FIG. 3 is used as a calibration dedicated line (for example, an R line), and the other line (L line) is used as a dedicated line for vapor deposition. After the R line is calibrated, it is moved to the L line via the transfer robot 5. Thereafter, the substrate rotating means 93 provided on the L line is rotated by 180 degrees to perform vapor deposition from below. In this method, how much processing time is required, but it is also possible to perform processing on the sides of the calibration dedicated line by setting a dedicated evaporation line.

In the embodiment in which the vapor deposition is performed at the above-described level, the same effects as those of the embodiment in which the vapor deposition is performed in the standing state can be obtained.

In the embodiment described above, the case where the substrate is horizontally transported to the process delivery unit has been described. However, the substrate may be transported vertically, and then calibration may be performed.

In the above-described embodiment, the alignment is performed in a state of being erected, but the calibration mark is used as a transmissive type, and in order to perform vapor deposition, the shielding structure is provided, the calibration optical system is installed on the atmosphere side, and The calibration optical system is a method or structure for performing calibration by following the calibration of the mask or the substrate, setting four calibrations, and adjusting the center position and position of the substrate to the reference.

Next, an embodiment of a substrate end tightness method for correcting the bending of the shadow mask according to the fourth feature of the present invention will be described. Fig. 9 is a flow chart showing the processing after the input substrate is applied to the vacuum evaporation chamber 1bu described above, and further shows a processing flow of the process of correcting the bending of the shadow mask. In the present embodiment, as shown in FIG. 9, even if the substrate size is large, the gap between the substrate and the shadow mask is vapor-depositable several microseconds. First, (1) the substrate is input to the processing and delivery unit 9, Then, (2) the substrate is raised to be slightly vertical, and then (3) the substrate 6 is approached from the shadow mask 81 to a certain distance, for example, 0.5 mm, (4) corrected and passed through the shadow mask. The gap between the curved substrates, (5) is calibrated in this state. After the calibration is completed, (6) the compact substrate 6 and the shadow mask 81, and (7) the vapor deposition material is vapor-deposited on the substrate.

After the vapor deposition is completed, (8) the substrate 6 is separated from the shadow mask 81 by a certain distance. The distance is (9) the correction of (4) is released, (10) the substrate and the other are leveled, and (11) the substrate is output from the processing delivery unit 9.

In the above steps, step (4) is performed before the calibration of (5), but may be performed after the calibration or after the step (6), and after the step (9), the step (9) may be performed. (8) Previous implementation.

Therefore, the steps and operations of the steps (2) to (6) and (8) to (10) are realized in the steps of the above-described embodiment. Fig. 10 is a view showing the substrate rotating means 93 for realizing (2) and (10), the substrate approaching means 93G for realizing (3) (6) and (8), and the substrate end portion of the realization (4) (9) among the above steps. A diagram of the processing delivery unit 9 shown in FIG. 3 of the close means 94 is shown, and a diagram showing a vacuum internal wiring mechanism for applying an exhaust problem of the coating material from the wiring is shown.

First, the substrate rotating means 93 for realizing (2) (10) will be described using FIG. The substrate rotating means 93 is a substrate holder 91 that mounts and holds the substrate 6 that is input to the processing and delivery unit 9, the substrate 6, and a substrate end closer means 94, which will be described later, and is vertically vertical before being integrally calibrated. After the calibration is completed, it has the function of returning to a horizontal state. The means for fixing as described above is considered to be in the case of vacuum, and is constituted by electrostatic absorption or mechanical clamp or the like.

In FIG. 10, the substrate rotating means 93 is a vacuum inner wiring link mechanism 92L which is substantially rotated by the substrate 6 to be rotated, the substrate end tight means 94, and the rotating portion of the substrate holder, and the rotating object. The direction of the arrow A is formed by the substrate rotation driving unit 93b that is rotationally driven by the above mechanism.

The vacuum inner wiring link mechanism 93L is formed by the first link 93L1 and the second link 93L2, and the sealing portion 93S which is isolated from the vacuum side and maintained in the atmosphere. The first link 93L1 has one end supported by the rotation support table 93k, and the other end is connected to the substrate end tight means 94, which will be described later, and has a hollow portion. The second link 93L2 is provided on the side opposite to the first link 93L1, and the one end is connected to the first link 93L1 in the same manner as the first link 93L1. The substrate end tight means 94 connects the other end to the support portion 11A provided in the spacer 11 shown in Fig. 1 . The sealing portion 93S has a connecting portion that connects one end to the substrate end portion close means, and the other end is connected to the side wall of each vacuum vapor deposition chamber 1bu, and the first sealing portion 93S1 of the support portion 11A, and the second portion. The sealing portion 93S2 is formed. Each of the sealing portions 93S1 and 93S2 has a telescopic tube 93Sv1 and 93Sv2 that connect the respective ends, and the connection portion on the side of the substrate end portion close means 94 of each of the sealing portions 93S1 and 93S2 rotatably supports the first link 93L1 and the first portion. 2 link 93L2.

In the above embodiment, in order to lay the wiring 94f in the connecting rod, the inside of the connecting rod is made hollow, but the sealing portion 93S is configured to include the respective links, and is connected to the connecting rod and the vacuum sealing portion. Between, it is also possible to lay wiring. In this case, it is not necessary to make the connecting rod hollow.

On the other hand, the substrate rotation driving unit 93b includes a rotation motor 93sm provided on the atmosphere side, and a rotation motor 93sm that transmits rotation to the gears 93h1 and 93h2 of the first link 93L1, and supports the first link. A rotation support table 93k at one end of L1. However, the motor for rotation 93sm It is controlled by a control device 60 provided on the atmosphere side.

In addition, FIG. 10 is the R line of the vacuum vapor deposition chamber 1bu, and the spacer 11 shown in FIG. 1 is the center of the surface object, and the same structure is also disposed on the L line. Accordingly, the first link 93L1 of the R line, the substrate end closer means 94, the first link 93L1 of the second link 93L2 and the L line, the substrate end closer means 94, and the hollow portion of the second link 93L2 The structure is connected by the atmosphere by the support portion 11A provided in the partition portion 11. The second link 93L2 is not necessarily required to be hollow. However, as will be described later, the second link 93L2 needs to move to the B direction shown in FIG. 10 in the hollow portion of the partition portion 11, and dust may appear in the moving portion. A part of the hollow portion of the support portion 11A is formed as a structure connected to the atmosphere.

In the above, when the substrate 6 is erected vertically, a slight gap may occur between the substrate 6 and the substrate holder 91. For example, the degree of tilting is stably placed at a distance of 1 degree, and the substrate is passed through the substrate. Its own weight can reliably eliminate the bending of the substrate. In the present embodiment, the substrate vapor deposition surface is formed as an upper surface and transported. If the substrate 6 is raised, the above calibration can be directly performed.

Secondly, the configuration and operation of the calibration for achieving the step (5) have been described using FIG. 4, and the description thereof is omitted here.

Next, the configuration and operation of the substrate approaching means 93G of the substrate (6) (6) and (8) and the substrate cover 86 of the shadow mask 81 will be described with reference to FIG. When the substrate approach means 93G moves back and forth in the direction of the arrow B in the entire direction of the arrow B, the substrate 6 is first brought to a certain distance from the shadow mask 81, and then compacted, vapor-deposited, and returned to the original state. The means of location. Therefore, the substrate approaching means 93G (the substrate approaching drive unit 93g) includes the rotary drive unit mounting table 93t on which the substrate rotating means 93 is placed, the track 93r for operating the rotary drive unit mounting table 93t, and the rolling spiral 93n. The proximity motor 93m of the rotary drive unit mounting table 93t is driven. In the hollow portion of the partition portion 11, the second link 93L2 of the substrate rotating means 93 is moved to the track (not shown) in the B direction in accordance with the operation of the rotation driving portion mounting table 93t. Although it is a track, its length is about 2mm. By controlling such a mechanism via the control device 60, the substrate 6 can be brought close to, tightly, and detached from the shadow mask 81.

According to the above embodiment, the bending of the substrate can be eliminated at the time of vapor deposition. In addition, the substrate and the shadow mask are not in contact with each other, for example, 0.5 mm before and after, and the calibration can be performed. Thereafter, the substrate is tightly attached to the shadow mask, and the blur in the vapor deposition can be reduced, so that high precision can be achieved. Evaporation.

Finally, using FIG. 10, a substrate end tight means 94 for achieving a tighter gap with the curved substrate via the shadow mask of (4) (9) will be described. Even if the substrate 6 is tightly attached to the shadow mask 81 via the substrate approaching means 93G, as shown in FIG. 11, the curvature of the shadow mask 81 is used, and in the end portion of the substrate, the vapor deposition range and the shadow mask 81 are also A gap of several tens of μm is generated. Therefore, in the present embodiment, the distance between the substrate holder 91 and the shadow mask is measured, and the periphery of the outer surface of the end portion of the substrate holder 91 is pressed, and the gap between the substrate 6 and the shadow mask 81 is corrected. The substrate 6 is tightly packed along the shadow mask 81.

Figure 10 shows an embodiment of the substrate end compacting means 94 for achieving this. state. The substrate end tightness means 94 is attached to the inside of the cover 94H, and correction means 94A to 94D at the upper portion 2 and the lower portion 2 are provided along the substrate in order to correct the bending of the female cover. In the correction means 94A to 94D of the fourth place, the upper portion is bent at the upper portion, the lower portion of the lower portion 2 is bent, the right portion 2 is bent at the right portion, and the left portion 2 is bent at the left portion. Make corrections.

Fig. 11 is a view showing a configuration of an embodiment of the correction means 94A to 94D, and shows 94A as a representative. The configuration of each means is the same, and the additional words (A to D) of the respective constituent elements are omitted. The correction means 94A is formed by the measurement sensing unit 94K that measures the distance, the pressing mechanism portion 94P that presses the substrate holder 91, and the sealing portion 94S that seals the vacuum. The sealing portion 94S is formed by a cover 94H, seals 94s1 and 94s2 provided in the substrate holder 91, and a sealing telescopic tube 94sv connected thereto. The sensing unit 94K is formed by a laser distance meter 94kr that measures the distance from the shadow mask 81 and an optical path pit 94kh and an optical window 94kw that are provided in the substrate holder 91 in order to secure the optical path. On the other hand, the pressing mechanism portion (pressing means) 94P is a pressing portion 94pp of the substrate holder, and a pressing rod 94pb that is rotatably attached to the front end of the pressing portion, and a pressing screw 94p that moves the pressing rod to the front and rear. , the nut 94pt, the drive nut guide 94pg and the rolling screw servo motor 94pm.

The control device 60 presses the substrate holder 91 in accordance with the detection result from the laser distance meter 94kr, and the substrate 6 is placed along the shadow mask 81. The target gap is, for example, 10 μm or less. When it is not below the target gap, the average of the four gaps is taken and corrected.

According to the substrate end portion fastening means of the above embodiment, the substrate can be bent with high precision along the shadow mask, and as a result, vapor deposition can be performed with high precision without blurring the film at the end portion of the substrate.

In the above-described embodiment, the curvature of the shadow mask is corrected at four places. For example, the curvature of the upper portion is smaller than the target gap, and one portion may be provided at the center of the upper portion.

Further, in the above-described embodiment, the substrate end portion fastening means 94 and the substrate holder 91 are integrated. However, for example, when the sensing portion of the substrate end portion close means is measured by the distance between the substrate holder and the shadow mask, Such a difference can measure the distance between the substrate and the shadow mask, and does not necessarily need to be integrated. In this case, for example, the substrate holder 91 that is erected slightly, the substrate end portion fastening means 94 has a rotation axis on the upper portion of the substrate, and is rotated from the upper portion, and the end portion can be closely corrected along the substrate holder 91. .

Further, in the above-described embodiment, the distance between the substrate holder and the shadow mask is measured by the sensor from the amount of correction. However, the distance is measured in advance for many of the shadow masks, and the correction is based on the statistical processing distance. The amount is also OK.

In the above embodiment, the same effects as those of the embodiment described in detail can be obtained.

Further, in the embodiment shown in FIG. 10, the inside of the cover 94H is opened to the atmosphere side by the first link 93L1 as explained in the case of the substrate rotating means 93. As a result, dust such as a motor is discharged to the atmosphere with the pressing, and this does not adversely affect the vacuum deposition. In addition, due to Now, the driving line of the motor and the signal line 94f from the sensing unit are connected to the vacuum internal wiring mechanism of the control device by the cover 94H and the first link 93L1, and there is no row passing through the wiring material from the wiring. Gas causes a problem of a decrease in vacuum. Further, the cover 94H or the link is made of a metal having a strong rust resistance and having a relatively high strength, such as stainless steel or aluminum, and no exhaust gas is generated.

As a result, according to the present embodiment, a high vacuum can be maintained, and a highly reliable vapor deposition process can be performed.

The substrate end portion fastening means according to the embodiment described above is such that the substrate is placed along the shadow mask, but conversely the shadow mask may be along the substrate.

Fig. 12 is a view showing the aligning portion 8 of the second embodiment of the substrate end closer means, and Fig. 13 is a view showing the means for correcting the four corners of the squeegee cover 81. In Figs. 12 and 13, the same functions as those of the first embodiment are obtained, and the same reference numerals are attached.

In Fig. 12, the L-shaped correction means cover 94H has one end provided at four corners (94A, 94D, not shown) of the shadow mask, and has a sealed vacuum at the position where the vacuum cover is pressed. The sealing portion 94S is shown, and the other end is connected to the atmosphere side.

The four correction means basically have the same structure, and the correction means on the upper side will be described as an example. In Fig. 13, the difference from Fig. 11 is the point at which the shadow mask is provided with the optical path pit 94kh and the optical window 94kw, the laser distance meter 94kr is the point at which the distance to the substrate holder 91 is measured, and the sealing portion 94S. It is provided at a point between the correction means cover 94H and the shadow cover. For other points, basically the same as FIG.

In the second embodiment, as in the first embodiment, a high vacuum can be maintained, and a highly reliable vapor deposition process can be performed.

Further, in the above description, the organic electroluminescence device has been described by way of example, but it is also applicable to a film formation device and a film formation method which perform vapor deposition treatment in the same background as the organic electroluminescence device.

Further, in the above description, the organic electroluminescence device has been described by way of example, but it is also applicable to a film formation device and a film formation method which perform vapor deposition treatment in the same background as the organic electroluminescence device.

Furthermore, the above calibration mechanism can also be applied to calibration of a liquid crystal display device or the like performed in the atmosphere.

1‧‧‧Processing room

1bu‧‧‧vacuum evaporation chamber

2‧‧‧Transport room

3‧‧‧Load group

6‧‧‧Substrate

6m‧‧‧ substrate calibration mark

7‧‧‧Decanting Department

8‧‧‧ Calibration Department

9‧‧‧Processing and Delivery Department

60‧‧‧Control device

71‧‧‧ evaporation source

81‧‧‧ Shadow cover

81a~d‧‧‧Rotation Support

Calibration mark for 81m‧‧‧ shadow mask

81k‧‧‧through hole in the cover of the shadow mask

82‧‧‧ Calibration substrate

83‧‧‧Calibration drive department

83Z‧‧‧Z-axis drive unit

83X‧‧‧X-axis drive unit

84‧‧‧ Calibration drive

85‧‧‧ Calibration optical system

85as‧‧‧Shaping bracket

85c‧‧‧ camera

85cm‧‧‧ camera side mirror

85k‧‧‧Light source

85km‧‧‧Light source side mirror

85r‧‧‧ coarse calibration optical system

91‧‧‧Substrate holder

93‧‧‧Substrate rotation means

93b‧‧‧Substrate rotary drive unit

93A‧‧‧Substrate rotation approach

93G‧‧‧Substrate approach (93g: substrate close to the drive)

94‧‧‧ Closer means of the end of the substrate

94A~94D‧‧‧Remedy means

94H‧‧‧Revision means cover

94K‧‧‧Measurement Department

94P‧‧‧ Pressing Mechanism Department

94S‧‧‧Revision means seal

100‧‧‧Manufacturing device for organic electroluminescent device

A~D‧‧‧ group

Fig. 1 is a view showing an apparatus for producing an organic electroluminescence light according to an embodiment of the present invention.

Fig. 2 is a schematic view showing the configuration of the transfer chamber 2 and the processing chamber 1 according to the embodiment of the present invention.

Fig. 3 is a schematic view and an operation explanatory view showing a configuration of a transfer chamber and a processing chamber according to an embodiment of the present invention.

Fig. 4 is a view showing the configuration of a aligning unit according to an embodiment of the present invention.

Fig. 5 is a view showing a shadow mask according to an embodiment of the present invention.

Fig. 6 is a view showing the basic configuration of a calibration optical system according to an embodiment of the present invention.

Fig. 7 is a view showing the basic configuration of a calibration optical system according to another embodiment of the present invention.

Fig. 8 is a view showing the configuration of a substrate rotation approach means according to an embodiment of the present invention.

Fig. 9 is a flow chart showing the operation of a process for correcting the bending of the shadow mask of the embodiment of the present invention.

Fig. 10 is a view showing a substrate rotating means, a substrate tight means, and a substrate end tight means according to an embodiment of the present invention.

Fig. 11 is a view showing a first embodiment of a correction means according to an embodiment of the present invention.

Fig. 12 is a view showing a calibration unit according to a second embodiment of the correction means according to the embodiment of the present invention.

Fig. 13 is a view showing a second embodiment of the correcting means according to the embodiment of the present invention.

Fig. 14 is a view for explaining the problem of the prior art (horizontal calibration).

Fig. 15 is a view for explaining the problem of the prior art (calibration via a reflective optical system).

1T‧‧‧ upper wall

1Y‧‧‧ lower wall

60‧‧‧Control device

81‧‧‧ Shadow cover

81a~d‧‧‧Rotation Support

82‧‧‧ Calibration substrate

83‧‧‧Calibration drive department

83L‧‧‧Left Drive

83R‧‧‧Right Drive

83X‧‧‧X-axis drive unit

83Z‧‧‧Z-axis drive unit

83a, 84a‧‧‧ calibration axis

83j‧‧‧Links

83n‧‧‧ rolling spiral

83v‧‧‧ telescopic tube

83s, 84s‧‧‧

83k‧‧‧Z drive fixing plate

83r‧‧ track

83t‧‧‧ push

83zm‧‧‧Z direction drive motor

83xm‧‧‧X direction drive motor

84‧‧‧ Calibration drive

84b‧‧‧Support Department Station

84c‧‧‧ Sealing Department

84k‧‧‧X-axis drive plate

84r‧‧‧ Track

85d‧‧‧Camera Position Adjustment Platform

85r‧‧‧ coarse calibration optical system

85s‧‧‧Precision calibration optical system

85p‧‧‧ fixed plate

Claims (12)

An organic electroluminescence light-generating device belongs to a calibration device having a calibration of a substrate and a shadow mask in a vacuum chamber, and an organic electroluminescence light for vapor-depositing the vapor deposition material in the evaporation source in a vacuum evaporation chamber of the substrate. A manufacturing apparatus characterized by comprising: a substrate holder on which the substrate is placed and held in a posture; and a mask holding means for holding the shadow mask in the substrate in the standing posture; and reducing the passage The means for correcting the influence of the bending of the aforementioned shadow mask. The apparatus for producing an organic electroluminescence according to the first aspect of the invention, wherein the correction means includes: a pressing means for pressing the substrate holder. The apparatus for manufacturing an organic electroluminescence light according to the first aspect of the invention, wherein the correction means comprises: a pressing means for pressing the shadow mask. The apparatus for producing an organic electroluminescence according to the second or third aspect of the invention, wherein the correction means includes: a measuring means for measuring a distance between the substrate holder and the shadow mask; As a result, the aforementioned pressing means is controlled. The organic electroluminescence manufacturing apparatus according to the second or third aspect of the invention, wherein the correction means controls the pressing means in accordance with a correction amount set in advance. The apparatus for manufacturing an organic electroluminescence device according to claim 2, wherein the pressing means presses a pressing position of the substrate holder The periphery of the outer side of the end vapor deposition portion of the substrate is placed. The apparatus for manufacturing an organic electroluminescence device according to claim 3, wherein the pressing means presses the pressing position of the shadow mask to correspond to a position around the outer side of the end portion vapor deposition portion of the substrate. The organic electroluminescence manufacturing apparatus according to claim 6 or 7, wherein the pressing position is provided at four places in the vicinity of the four corners of the substrate holder or the shadow mask. The apparatus for producing an organic electroluminescence according to the invention of claim 2, wherein the correction means is provided in the hollow cover, and has one end connected to the hollow cover and the other end open to the atmosphere. a hollow connecting portion; for the correction means, a necessary wiring is laid by the connecting portion. The apparatus for manufacturing an organic electroluminescence device according to the first aspect of the invention, wherein the substrate holder and the correction means are formed by a substrate rotation means in a state of being raised from a horizontal state. The apparatus for manufacturing an organic electroluminescence device according to claim 10, wherein the substrate rotation means is a means for rotating the connection portion. A film forming apparatus is a film forming apparatus having a calibration means for performing calibration of a substrate and a shadow mask in a vacuum chamber, and a vapor deposition material for vaporizing the vapor deposition material in the evaporation source on the substrate, wherein the film forming apparatus is characterized in that a substrate holder for holding the substrate and holding the up position; and a shade cover holding means for holding the shade cover in the substrate in the rising posture; and reducing bending by the shadow mask Complement of influence Positive means.