KR101901072B1 - Evaporation source device, film formation apparatus, film formation method and manufacturing method of electronic device - Google Patents

Abstract

The present invention relates to an evaporation source device for reducing influence of radiant heat on a substrate. The evaporation source device comprises a plurality of crucibles including a first crucible and a second crucible and accommodating a deposition material; an anti-deposition plate covering the first crucible and having an opening on the second crucible; and an evaporation source shutter turning the second crucible into a shielded state and an open state by changing the position thereof. When the evaporation source shutter turns the second crucible into the open state, the evaporation source shutter overlaps the anti-deposition plate and the first crucible covered by the anti-deposition plate.

Description

TECHNICAL FIELD [0001] The present invention relates to an evaporation source device, a film forming device, a film forming method, and a manufacturing method of an electronic device. BACKGROUND OF THE INVENTION 1. Field of the Invention [0001]

The present invention relates to an evaporation source device, a film forming device, a film forming method, and a method of manufacturing an electronic device.

An organic electronic device such as an organic EL display is manufactured through a deposition process for depositing an organic material or a metal material. The evaporation source device used in the deposition process has a plurality of crucibles, and the evaporation material stored in the crucible is heated to raise the temperature of the evaporation material to evaporate and adhere to the surface of the substrate.

Patent Document 1 discloses a vacuum evaporation apparatus having a vacuum chamber, a plurality of evaporation sources (crucibles) for forming a thin film on a substrate, and a shutter for opening and shielding vapor of material evaporated from the evaporation source have. It is described that the shutter can prevent the occurrence of contamination among a plurality of evaporation sources by sequentially opening one of the plurality of evaporation sources.

Further, Patent Document 2 includes a plurality of evaporation sources, a first heating device, a second heating device, and a vapor deposition shielding plate. Conventionally, when the evaporation source device having a plurality of evaporation sources increases the temperature by heating the evaporation material stored in the evaporation source, it takes time to start heating the evaporation material at the time of vapor deposition (main heating). Therefore, the preheating is carried out to raise the temperature of the evaporation source to a temperature at which the evaporation material becomes a vapor before use for vapor deposition. That is, the plurality of evaporation sources include an evaporation source that is subjected to preliminary heating and an evaporation source of main heating used for film formation on the substrate surface while maintaining the temperature at which the accommodated evaporation material becomes vapor. In the configuration of Patent Document 2, the evaporation shielding plate covers the evaporation source at the position of the preliminary heating.

Japanese Patent Application Laid-Open No. 2007-332433 Japanese Patent Application Laid-Open No. 2006-249575

However, since the heating temperature of the evaporation source is high, even if the vacuum is high, due to the influence of radiant heat from the evaporation source, the substrates and masks to be disposed cause deformation such as thermal expansion, It happens. It is difficult to sufficiently reduce the influence of radiant heat from the evaporation source to the substrate when only the shutter or the evaporation shielding plate is disposed on the evaporation source which does not perform evaporation as in the conventional example. Particularly, the influence of radiant heat from an evaporation source which is subjected to preheating or an evaporation source immediately after evaporation is large.

The present invention has been made in view of the above problems. An object of the present invention is to provide an evaporation source device that reduces the influence of radiant heat on a substrate.

To this end, the present invention employs the following configuration. In other words,

A plurality of crucibles including a first crucible and a second crucible,

A discharge preventing plate covering the first crucible and having an opening above the second crucible,

And an evaporation source shutter of a movable type in which said second crucible is brought into a shielding state and an open state by changing a position of said evaporation source shutter,

And the evaporation source shutter overlaps with the first crucible covered with the blocking plate and the blocking plate when the evaporation source shutter is in the open state of the second crucible.

According to the present invention, it is possible to provide an evaporation source device that reduces the influence of radiant heat on a substrate.

1 is a schematic view showing a part of the configuration of an organic electronic device manufacturing apparatus.
2 is a schematic view showing (a) a shielded state and (b) an open state of the configuration of the evaporation source device according to Embodiment 1. FIG.
3 is a schematic view showing a configuration of an evaporation source shutter according to Embodiment 2;
4 is a schematic view showing a configuration of an evaporation source shutter according to Embodiment 3;
5 is a schematic view showing a configuration of an evaporation source device according to Embodiment 4;
6 is a schematic view showing a configuration of an evaporation source device according to Embodiment 5. [Fig.
7 is a schematic view showing a state in which the evaporation source shutter of the evaporation source device according to Embodiment 5 is viewed from the side.
8 is a schematic view showing a configuration of an evaporation source device according to Embodiment 6;
9 is a view showing a structure of an organic EL display device.

Hereinafter, preferred embodiments and examples of the present invention will be described with reference to the drawings. However, the following embodiments and examples are merely illustrative of preferred configurations of the present invention, and the scope of the present invention is not limited to such configurations. It is to be understood that the hardware configuration, software configuration, processing flow, manufacturing conditions, dimensions, materials, shape, and the like of the apparatus in the following description are not limited to the scope of the present invention unless otherwise specified. It is not.

The present invention relates to an evaporation source device and a control method thereof, and more particularly to an evaporation source device and a control method thereof for forming a thin film on an evaporation material by vapor deposition. The present invention can also be understood as a program for causing a computer to execute the control method or a storage medium storing the program. The storage medium may be a non-temporary storage medium readable by a computer. The present invention can be preferably applied to an apparatus for forming a thin film (material layer) of a desired pattern by, for example, vacuum evaporation on the surface of a substrate to be vapor-deposited. As the material of the substrate, any material such as glass, resin, and metal can be selected. Further, the material to be deposited of the film forming apparatus is not limited to a plate-like substrate. For example, a mechanical part having a concavity and convexity or an opening may be used as an evaporation material. Also, as the evaporation material, any material such as an organic material and an inorganic material (metal, metal oxide, etc.) can be selected. It is also possible to form a metal film as well as an organic film. Specifically, the technique of the present invention is applicable to an organic electronic device (for example, an organic EL display, a thin film solar cell), an optical member, and the like.

≪ Embodiment 1 >

<Schematic Configuration of Film-Forming Apparatus>

1 is a cross-sectional view schematically showing the configuration of a deposition apparatus (deposition apparatus). The film forming apparatus 6 has a vacuum chamber 13. The inside of the vacuum chamber 13 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas.

Inside the vacuum chamber 13 is schematically provided a substrate 7 which is a deposition source held by the substrate holder 8 and a mask 9 held by the mask holder 10 and a mask 9 A magnet plate 12 for attracting the magnet plate 12 to the substrate 7 by a magnetic force and an evaporation source device 1 are provided.

The substrate holder 8 holds the substrate by a support such as a finger or the like for supporting the substrate 7 or a pressing member such as a clamp (not shown) for pressing and supporting the substrate. The substrate 7 is transported into the vacuum chamber 13 by a transport robot (not shown), and held by the substrate holder 8, so that it is parallel to the horizontal plane (XY plane) . The mask 9 is a mask having an opening pattern corresponding to a thin film pattern of a predetermined pattern to be formed on the substrate 7, and is, for example, a metal mask. At the time of film formation, the substrate 7 is placed on the mask 9.

The evaporation source device 1 is also provided with a first crucible 3, a second crucible 2, a deposition preventing plate 4 having an opening and an evaporation source shutter 5. The first crucible 3 is covered on the discharge plate 4 and the second crucible 2 is disposed under the opening of the discharge plate 4. [ An evaporation material is stored in each of the first crucible 3 and the second crucible 2, and the vapor is generated by heating the evaporation material. The evaporation source shutter 5 is a movable shutter which is provided above the opening of the discharge plate 4 and makes the opening of the discharge plate 4 open and shielded.

In addition, the vacuum chamber 13 may be provided with an opening / closing type substrate shutter 11 for controlling the vapor from the evaporation source device 1 to reach the substrate 7. [ The magnet plate 12 may be provided with a cooling plate (not shown) for suppressing the temperature rise of the substrate 7. A driving mechanism such as an actuator for aligning the substrate 7 and the mask 9, for example, an actuator in the X direction or Y direction, or an actuator for a substrate holder for holding the substrate, is provided on the vacuum chamber 13 , And a camera (not shown) for picking up the substrate 7 may be provided.

In the evaporation source apparatus 1, a plurality of crucibles including a first crucible 3 and a second crucible 2 are provided. Crucibles are an example of evaporation sources. The evaporation source device 1 is also provided with a moving support member (not shown) capable of moving the first crucible 3 and the second crucible 2. In this embodiment, one of a plurality of crucibles is subjected to main heating for use in vapor deposition. Further, one of the plurality of crucibles is subjected to preliminary heating for preparing for deposition.

The crucible in which the heating is performed or the crucible disposed at the position for performing the main heating is described as the second crucible 2 for convenience. In addition, the crucible preheating or the crucible disposed at the position where the preheating is performed is described as the first crucible (3) for the sake of convenience. That is, the first crucible 3 is a crucible for heating the evaporation material contained in the crucible with a heater or the like to perform preheating to raise the temperature of the crucible to a temperature at which the evaporation material becomes a vapor. The second crucible 2 is a crucible for performing the main heating in which the heating is continued by a heater or the like so as to maintain the temperature at which the evaporation material contained in the crucible becomes a vapor.

After completion of the preliminary heating, the first crucible 3 is moved by a moving support (not shown) and can be changed to a position for performing the main heating. The position for performing the main heating is a position under the opening of the discharge plate 4. [ Therefore, the evaporation material in each crucible becomes a vapor by heating in two stages of preheating and main heating.

<Detailed configuration of the evaporation source device>

2 shows a state in which the evaporation source shutter 5 of the evaporation source device 1 is operated.

2 (a) shows a state in which the evaporation source shutter 5 is in a shielded state. At this time, the vapor of the evaporation source material stored in the second crucible 2 is shielded by the evaporation source shutter 5, and the first crucible 3 is covered with the deposition plate 4. [ This shielding state is a state in which at least a part of the vapor of the material from the second crucible 2 is covered by the evaporation source shutter 5 so as not to directly reach the substrate and the evaporation source shutter 5 is in the second crucible 2). Further, there may be a gap between the second crucible 2 and the evaporation source shutter 5. [ Preferably, the entire second crucible 2 is covered with the evaporation source shutter 5 when viewed from the substrate side.

The first crucible 3 may be a crucible to be preliminarily heated or a crucible moved to a position where the crucible is cooled after vapor deposition.

2 (b) shows a state in which the evaporation source shutter 5 is opened. At this time, most of the vapor of the evaporation source material stored in the second crucible 2 reaches the substrate 7.

When the evaporation source shutter 5 is in an open state, the evaporation source shutter 5 moves to a position where it overlaps with both the discharge plate 4 and the first crucible 3 covered by the discharge plate 4. In other words, a virtual line connecting the first crucible 3 and the substrate 7 passes through the deposition plate 4 and the evaporation source shutter 5. In addition, it is preferable that the blocking plate 4 and the evaporation source shutter 5 are overlapped over the entire first crucible 3 when viewed from the substrate side.

The overlapping order when viewed from the first crucible 3 may be in the order of the deposition plate 4 and the evaporation source shutter 5 or in the order of the evaporation source shutter 5 and the deposition plate 4. [ When the overlapping order is the order of the evaporation source shutter 5 and the discharge plate 4, an evaporation source shutter 5 (see FIG. 5) is provided between the first crucible 3 and the second crucible 2, ) Are installed.

According to the above configuration, both the discharge plate 4 and the evaporation source shutter 5 are interposed between the first crucible 3 and the substrate 7. Therefore, the influence of radiant heat from the first crucible 3 on the substrate 7 can be reduced.

In the above description, the description has been made by taking an example in which a single blocking plate 4 having an opening is provided. However, two or three pieces of the blocking plate 4 may be overlapped with each other. In this case, The influence of radiant heat from the first crucible 3 on the substrate 7 can be more effectively reduced.

&Lt; Embodiment 2 &gt;

Embodiment 2 of the present invention will be described with reference to the drawings. The same reference numerals are assigned to the components common to the first embodiment, and a description thereof will be omitted.

Fig. 3 is a schematic sectional view (Figs. 3 (a) and 3 (c)) showing the elements of the cooling mechanism of the evaporation source shutter 5 from among the evaporation source devices of this embodiment and a schematic cross- 3 (b) and 3 (d)).

Figs. 3 (a) and 3 (b) schematically show the arrangement of the cooling water channel 14 provided as a cooling mechanism in the evaporation source shutter 5. Fig. Thus, even if the evaporation source shutter 5 is heated by the radiant heat from the first crucible 3 or the like, the cooling medium can be supplied to the cooling water channel 14 to emit heat from the evaporation source shutter 5 have.

The evaporation source shutter 5 shown in Figs. 3 (c) and 3 (d) is provided with a cooling water channel 14 and is provided with a cooling water channel 14, which faces the first crucible 3 of the evaporation source shutter 5 (15) which is easy to absorb heat in comparison with the surface opposite to the surface facing the first crucible (3). The specific surface treatment 15 is a coating of a material having a high emissivity (a black material) or a coating of Teflon (a resin containing hydrogen fluoride).

As another example, a member of the surface of the evaporation source shutter 5 opposite to the first crucible 3 may be provided with a member having a higher thermal conductivity than the member on the opposite side of the surface facing the first crucible 3 ) May be used.

By using the surface processing 15 or the member having a high thermal conductivity, the heat of the radiant heat received from the first crucible 3 or the like can be easily transmitted to the cooling mechanism 14 provided in the evaporation source shutter 5, The influence of radiant heat can be reduced.

&Lt; Embodiment 3 &gt;

Embodiment 3 of the present invention will be described with reference to the drawings. The same reference numerals are assigned to the components common to the first embodiment, and a description thereof will be omitted.

4 is a schematic sectional view (FIG. 4 (a)) from a top surface of the evaporation source shutter 5 and a schematic sectional view (FIG. 4 (b)) from a side surface of the evaporation source device of the present embodiment. A reflector 16 is provided on a surface of the evaporation source shutter 5 facing the first crucible 3 shown in Fig. 4 (b).

The specific configuration of the reflector 16 is to apply a surface treatment or a material having a low emissivity to the surface opposite to the surface facing the first crucible 3. Another specific structure of the reflector 16 is a structure in which the surface of the evaporation source shutter 5 facing the first crucible 3 faces the body of the evaporation source shutter 5 through a space, There is a structure in which the other formed plate members are arranged.

Specifically, molybdenum or tantalum is considered as a material.

In addition, a material having a low emissivity can be formed by making stainless steel or aluminum as a material and polishing and mirror-polishing these materials.

By providing the reflector 16 in the evaporation source shutter 5 as described above, the radiation heat from the first crucible 3 or the like is reflected, thereby reducing the influence of the radiation heat on the substrate 7. [

Further, the radiant heat is returned to the first crucible 3, thereby improving the thermal efficiency of heating the first crucible.

The cooling mechanism described in Embodiment 2 may be combined with the evaporation source shutter 5 of the present embodiment.

&Lt; Fourth Embodiment &gt;

Embodiment 4 of the present invention will be described with reference to the drawings. The same reference numerals are assigned to the components common to those of the first embodiment, and the description will be simplified.

5 shows the appearance of the evaporation source device 1 having four crucibles including the first crucible 3 and the second crucible 2 as seen from the upper surface of the evaporation source shutter 5, . 5 shows the position of the evaporation source shutter 5 when the evaporation source shutter 5 is in the open state and the opening of the discharge plate 4 is in the open state.

Four crucibles including the first crucible 3 and the second crucible 2 are provided on a movable supporting body 17, respectively. The movable support body 17 can move the positions of the respective crucibles, for example, by simultaneously moving in the arrow direction of the moving direction of the illustrated movable support body. Further, the moving direction of the movable support body 17 may be the direction opposite to the arrow.

In the fourth embodiment of Fig. 5, there are four crucibles. One of the four crucibles is located below the opening of the deposition plate 4 and is also in a position for performing the main heating. And the crucible is referred to as a second crucible (2). One of the three crucibles other than the second crucible is a position covered by the deposition plate 4 and the evaporation source shutter 5 and is in a position for preliminary heating. The other crucible is referred to as a first crucible (3).

In addition, the evaporation source shutter 5 is moved along the opening / closing direction of the evaporation source shutter shown in the drawing, whereby the evaporation source shutter 5 can be shielded.

Also in the present embodiment, as in the first to third embodiments, the influence of radiant heat on the substrate 7 can be reduced.

&Lt; Embodiment 5 &gt;

Embodiment 5 of the present invention will be described with reference to the drawings. The same reference numerals are assigned to the components common to those of the first embodiment, and the description will be simplified.

6 shows the appearance of the evaporation source device 1 in which seven crucibles including the first crucible 3 and the second crucible 2 are provided on the rotatable rotary support 18 from the top surface of the evaporation source shutter 5 . 6 shows the position of the evaporation source shutter 5 when the evaporation source shutter 5 is in the open state and the opening of the discharge plate 4 is in the open state. 7 is a side view of the evaporation source shutter 5. Fig. 7 (a) shows the open state of the opening of the discharge plate 4, and Fig. 7 (b) shows the shielded state of the opening of the discharge plate 4. Fig.

Seven crucibles including the first crucible 3 and the second crucible 2 are provided along the circumferential direction of the rotatable rotary support 18. [ The rotary support 18 can move the position of each crucible provided along the circumferential direction of the rotary support 18, for example, by rotating in the direction of the arrow of rotation of the rotary support shown in the figure. The direction of rotation of the rotary support 18 may be opposite to the direction of rotation of the rotary support.

In the fifth embodiment shown in Fig. 6, there are seven crucibles. One of the seven crucibles is located below the opening of the antifouling plate 4 and is also in a position for performing the main heating. And the crucible is referred to as a second crucible (2). One of the six crucibles other than the second crucible is located at a position covered by the deposition plate 4 and the evaporation source shutter 5 and is in a position for preliminary heating. The other crucible is referred to as a first crucible (3).

In addition, in the present embodiment, by setting the other crucibles between the second crucible 2 and the first crucible 3, it is possible to reduce the heat effect in each of the preheating and main heating .

In addition, the evaporation source shutter 5 is moved along the opening / closing direction of the evaporation source shutter shown in the drawing, whereby the evaporation source shutter 5 can be shielded.

Also in the present embodiment, as in the first to fourth embodiments, the influence of radiant heat on the substrate 7 can be reduced.

&Lt; Embodiment 6 >

Embodiment 6 of the present invention will be described with reference to the drawings. The same reference numerals as in the first embodiment denote the same components, and the description thereof is simplified.

8 shows a state in which the evaporation source shutter 5 of the evaporation source device 1 provided with seven crucibles including the first crucible 3 and the second crucible 2 on the rotatable rotary support 18 is viewed from above . 6 shows the position of the evaporation source shutter 5 when the evaporation source shutter 5 is in the open state and the opening of the discharge plate 4 is in the open state.

Seven crucibles including the first crucible 3 and the second crucible 2 are provided along the circumferential direction of the rotatable rotary support 18. [ The rotary support 18 can move the positions of the respective crucibles provided along the circumferential direction of the rotary support 18, for example, by rotating in the direction of arrows indicated by the rotary support shown in the figure. The rotation direction of the rotary support 18 may be opposite to the rotation arrow of the rotary support.

The sixth embodiment is configured to reduce the influence of radiant heat from the evaporation source immediately after deposition. When the evaporation from the crucible is completed, the crucible heated at the deposition position is moved to the position where the crucible is cooled by the rotary support body 18, and the crucible in the preliminary heating position moves to the evaporation position to continue evaporation The crucible for the completion of the deposition moved to the cooling position is still hot due to the remaining heat. In Embodiment 6, the influence of radiant heat on the substrate 7 due to the crucible immediately after the deposition can be reduced.

That is, in the sixth embodiment of Fig. 8, there are seven crucibles. One of the seven crucibles is located below the opening of the antifouling plate 4 and is also in a position for performing the main heating. And the crucible is used as the second crucible. One of the six crucibles other than the second crucible is a crucible immediately after the deposition in which the deposition is completed and moved to a position where it is cooled by the rotation of the rotary support 18. This is a crucible after the deposition plate 4 and the evaporation source shutter 5 As shown in Fig. In this embodiment, this crucible is referred to as a first crucible 3. [

Further, in the present embodiment, by setting the positional relationship in which other crucibles are disposed between the second crucible 2 and the first crucible 3, it is possible to reduce the heat effect in the heating of each of the preheating and main heating .

In addition, the evaporation source shutter 5 is moved along the opening / closing direction of the evaporation source shutter shown in the drawing, whereby the evaporation source shutter 5 can be shielded. 8, the rotation axis for moving the evaporation source shutter 5 in the opening and closing direction is the outer side of the evaporation source (the radially outer side of the rotary support 18 provided in the crucible circumferential direction) in the present embodiment and the fifth embodiment, . (The crucible is provided in the circumferential direction and is radially inward of the rotary support 18) as shown in Fig.

Also in the present embodiment, it is possible to reduce the influence of the radiant heat on the substrate 7 as in Embodiments 1 to 5, and in particular, it is possible to lower the influence of the radiant heat from the evaporation source immediately after the deposition.

&Lt; Embodiment of film forming method of film forming apparatus &gt;

Next, an example of a film forming method using the evaporation source device or the film forming apparatus of the present embodiment will be described with reference to Figs. 1 and 2. Fig.

The film forming method of this embodiment includes a heating step of the first crucible 3 and the second crucible 2 of the evaporation source device 1. [ First, as a preliminary heating step, there is a step of heating the evaporation material accommodated in the first crucible 3 provided at the preliminary heating position to raise the temperature of the crucible to a temperature at which the evaporation material becomes a vapor. In this heating step, the crucible heated in the preliminary heating step is moved to the main heating position to be the second crucible 2, and the temperature at which the evaporation material accommodated in the second crucible 2 becomes a vapor There is a step of maintaining the temperature in the second crucible 2.

The film forming method of the present embodiment includes an opening and closing process of the evaporation source shutter 5 provided in the opening of the discharge plate 4 of the evaporation source device 1. [ First, as a step of shielding the evaporation source shutter 5, there is a step of putting the vapor of the evaporated evaporation material in the second crucible 2 in a shielded state. The evaporation source shutter 5 overlaps with the first crucible 3 covered by the discharge plate 4 to open the vapor of the heated evaporation material in the second crucible 2, There is a step of forming a film on the substrate 7 held by the substrate holder 8.

Thus, during the film formation, the evaporation source shutter 5 covers the first crucible 3 covered with the barrier plate 4, thereby reducing the influence of radiant heat from the first crucible 3 to the substrate 7 The film forming method can be provided.

As a result, it is possible to suppress the film formation accuracy which is caused by the thermal deformation of the substrate 7 during film formation by radiant heat, but to prevent the quality of the film formed from being lowered by radiant heat.

&Lt; Embodiment of Manufacturing Method of Electronic Device &gt;

Next, an example of a method of manufacturing an electronic device using the film forming method of the present embodiment will be described. Hereinafter, the configuration and manufacturing method of the organic EL display device will be exemplified as an example of the electronic device.

First, an organic EL display device to be manufactured will be described. 9 (a) is an overall view of the organic EL display device 60, and Fig. 9 (b) shows a cross-sectional structure of one pixel.

9A, in the display area 61 of the organic EL display device 60, a plurality of pixels 62 having a plurality of light emitting elements are arranged in a matrix. Although the details are described below, each of the light emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. The term &quot; pixel &quot; as used herein refers to a minimum unit that enables display of a desired color in the display area 61. [ In the case of the organic EL display device according to the present embodiment, the pixel 62 is constituted by a combination of the first light emitting element 62R, the second light emitting element 62G, and the third light emitting element 62B, . The pixel 62 is often constituted by a combination of a red light emitting element, a green light emitting element and a blue light emitting element. However, a combination of a yellow light emitting element, a cyan light emitting element and a white light emitting element may be used in combination. no.

Fig. 9 (b) is a partial sectional schematic view taken along the line A-B in Fig. 9 (a). The pixel 62 includes a first electrode (anode) 64, a hole transporting layer 65 and either one of the light emitting layers 66R, 66G, and 66B, an electron transporting layer 67, , And a second electrode (cathode) 68. Of these, the hole transport layer 65, the light emitting layers 66R, 66G, and 66B, and the electron transport layer 67 are organic layers. In the present embodiment, the light emitting layer 66R is an organic EL layer emitting red, the light emitting layer 66G is an organic EL layer emitting green, and the light emitting layer 66B is an organic EL layer emitting blue. The light emitting layers 66R, 66G, and 66B are formed in a pattern corresponding to light emitting elements (also referred to as organic EL elements) emitting red, green, and blue, respectively. In addition, the first electrode 64 is formed separately for each light emitting element. The hole transport layer 65, the electron transport layer 67 and the second electrode 68 may be formed in common with the plurality of light emitting devices 62R, 62G, and 62B or may be formed for each light emitting device. An insulating layer 69 is provided between the first electrodes 64 to prevent the first electrode 64 and the second electrode 68 from being short-circuited by foreign matter. Further, since the organic EL layer is deteriorated by moisture or oxygen, a protective layer 70 for protecting the organic EL element from moisture or oxygen is provided.

In order to form the organic EL layer by a light emitting element unit, a method of forming a film through a mask is used. 2. Description of the Related Art In recent years, a display with a high resolution has been developed, and a mask having a width of several tens of micrometers is used for forming an organic EL layer. In the case of film formation using such a mask, if the mask receives heat from the evaporation source during film formation and is thermally deformed, the mask and the substrate are displaced from each other, and the thin film pattern formed on the substrate is displaced from the desired position. Therefore, the film forming apparatus (vacuum vapor deposition apparatus) of the present invention is suitably used for film formation of these organic EL layers.

Next, an example of a manufacturing method of the organic EL display device will be described in detail.

First, a circuit (not shown) for driving the organic EL display device and a substrate 63 on which the first electrode 64 is formed are prepared.

An acrylic resin is formed on the substrate 63 on which the first electrode 64 is formed by spin coating and an acrylic resin is patterned by an lithography method so as to form an opening in a portion where the first electrode 64 is formed to form an insulating layer 69 ). This opening corresponds to a light emitting region where the light emitting element actually emits light.

The substrate 63 on which the insulating layer 69 is patterned is carried into the first film forming apparatus to hold the substrate by the substrate holder and the hole transport layer 65 is formed as a common layer on the first electrode 64 in the display region To the tabernacle. The hole transport layer 65 is formed by vacuum evaporation. In practice, since the hole transport layer 65 is formed to have a size larger than that of the display region 61, a high-precision mask is unnecessary.

Next, the substrate 63 formed up to the hole transporting layer 65 is carried into the second film forming apparatus and held by the substrate holder. Alignment of the substrate and the mask is performed, the substrate is placed on the mask, and a light emitting layer 66R that emits red is formed on the portion where the red emitting element of the substrate 63 is arranged. According to this example, the mask and the substrate can be satisfactorily superimposed on each other, and high-precision film formation can be performed.

Similar to the formation of the light emitting layer 66R, the light emitting layer 66G that emits green light is formed by the third film forming apparatus, and further the light emitting layer 66B that emits blue light by the fourth film forming apparatus is formed. After the film formation of the light emitting layers 66R, 66G, and 66B is completed, the electron transport layer 67 is formed over the entire display region 61 by the fifth film forming apparatus. The electron transporting layer 67 is formed as a common layer in the three color light emitting layers 66R, 66G, and 66B.

The substrate formed with the electron transport layer 65 is moved by the sputtering apparatus to form the second electrode 68 and then moved to the plasma CVD apparatus to form the protective layer 70 so that the organic EL display device 60 Is completed.

If the substrate 63 on which the insulating layer 69 is patterned is brought into the film forming apparatus and then exposed to an atmosphere containing moisture or oxygen until the formation of the protective layer 70 is completed, It may be deteriorated by moisture or oxygen. Therefore, in this example, the carrying-in and carrying-out of the substrate between the film forming apparatuses is performed in a vacuum atmosphere or an inert gas atmosphere.

In the organic EL display device thus obtained, the light emitting layer is formed with high precision for each light emitting element. Therefore, when the above manufacturing method is used, it is possible to suppress the occurrence of defects in the organic EL display device due to the positional deviation of the light emitting layer.

It should be noted that the present invention is not limited to the above-described embodiment, and may be modified as appropriate within the scope of the technical idea of the present invention. For example, in the above embodiment, the substrate is moved by the substrate holder, but both the mask and the substrate or the mask may be moved. In this case, a means for moving the substrate may be provided in addition to the means for moving the substrate.

1: evaporation source device
2: second crucible
3: first crucible
4:
5: evaporation source shutter
6: Deposition device
7, 63: substrate
8: substrate holder
9: Mask
10: Mask holder
11: substrate shutter
12: Magnet plate
13: Vacuum chamber
14: cooling mechanism
15: Surface machining
16: Reflector
17:
18:

Claims (16)

A plurality of crucibles including a first crucible and a second crucible,
A discharge preventing plate covering the first crucible and having an opening above the second crucible,
And an evaporation source shutter of a movable type in which said second crucible is brought into a shielding state and an open state by changing a position of said evaporation source shutter,
Wherein the evaporation source shutter has a portion overlapping with the second crucible when the second crucible is in a shielded state,
Wherein when the evaporation source shutter is in the open state of the second crucible, the portion of the evaporation source shutter overlaps with the first crucible covered with the discharge plate and the discharge plate. The method according to claim 1,
Wherein the plurality of crucibles are constituted by the first crucible, the second crucible, and other crucibles. 3. The method according to claim 1 or 2,
Wherein the evaporation source shutter is provided with a cooling mechanism for cooling the evaporation source shutter. The method of claim 3,
Wherein the surfaces of the evaporation source shutters facing the plurality of crucibles have higher thermal conductivity or higher emissivity than the surfaces of the evaporation source shutters opposite to the surfaces facing the crucibles. 3. The method according to claim 1 or 2,
Wherein a reflector mechanism for reflecting heat is provided on a surface of the evaporation source shutter which faces the plurality of crucibles. 3. The method according to claim 1 or 2,
Wherein the plurality of crucibles are provided on a movable movable support body and the crucible of one of the plurality of crucibles is placed at a position for preliminary heating by the movement of the movable support body so that the one crucible is made into the first crucible And arranging the other crucibles of the plurality of crucibles at a position where the crucibles are to be heated, thereby making the other crucibles into the second crucible. 3. The method according to claim 1 or 2,
Wherein the plurality of crucibles are provided along a circumferential direction of a rotatable supporter,
The crucible of one of the plurality of crucibles is placed at a position for preheating by the rotation of the rotary support so that the one crucible is used as the first crucible and the other crucible of the plurality of crucibles is heated And the other crucible is used as the second crucible. 3. The method according to claim 1 or 2,
Wherein the plurality of crucibles are provided on a movable movable support body, and by moving the crucible, a crucible of one of the plurality of crucibles is disposed at a position to be a spot immediately after the deposition, And another crucible of the plurality of crucibles is disposed at a position for heating the crucible, whereby the other crucible is used as the second crucible. 3. The method according to claim 1 or 2,
Wherein the plurality of crucibles are provided along a circumferential direction of a rotatable supporter,
Wherein one crucible of the plurality of crucibles is placed at a position to be a spot immediately after vapor deposition by rotation of the rotary support so that one crucible is used as a first crucible and another crucible of the plurality of crucibles And the other crucible is used as the second crucible. An evaporation source device according to claim 1 or 2,
A substrate holder for disposing a substrate at a position facing the evaporation source device;
And a substrate shutter for bringing the substrate of the substrate holder into an open state and a closed state with respect to the evaporation source device, between the substrate holder and the evaporation source device. A film forming method for forming an evaporation material on a substrate,
A plurality of crucibles including a first crucible and a second crucible and in which an evaporation material is accommodated; a confinement plate covering the first crucible and having an opening above the second crucible; A movable type evaporation source shutter which is made to be in a shielded state and an open state, a step of providing the substrate on which the evaporation material is formed,
A heating step of maintaining a temperature at which the evaporation material contained in the second crucible becomes a vapor,
A shielding step of putting the vapor of the heated evaporation material in the second crucible in the shielding state,
The evaporation source shutter is brought into the open state so that the evaporation source shutter overlaps with the first crucible covered with the deposition plate and the deposition plate so that the vapor of the heated evaporation material in the second crucible And an opening step of forming a film on the substrate,
Wherein the temperature of the first crucible is raised to a temperature at which the evaporation material accommodated in the first crucible becomes a vapor when the evaporation source shutter and the deposition plate are overlapped with the first crucible. A method of manufacturing an electronic device having a film of at least one of an organic film and a metal film formed on a substrate,
A method for manufacturing an electronic device, characterized in that at least one of the films is formed by the film forming method according to claim 11. A film forming method for forming an evaporation material on a substrate,
A plurality of crucibles including a first crucible and a second crucible and in which an evaporation material is accommodated; a confinement plate covering the first crucible and having an opening above the second crucible; A movable type evaporation source shutter which is made to be in a shielded state and an open state, a step of providing the substrate on which the evaporation material is formed,
A heating step of maintaining a temperature at which the evaporation material contained in the second crucible becomes a vapor,
A shielding step of putting the vapor of the heated evaporation material in the second crucible in the shielding state,
The evaporation source shutter is brought into the open state so that the evaporation source shutter overlaps with the first crucible covered with the deposition plate and the deposition plate so that the vapor of the heated evaporation material in the second crucible And an opening step of forming a film on the substrate,
Wherein the evaporation source shutter has a portion overlapping with the second crucible when the second crucible is in a shielded state and when the evaporation source shutter is in the open state of the second crucible, , The deposition plate, and the first crucible covered by the deposition plate. A method of manufacturing an electronic device having a film of at least one of an organic film and a metal film formed on a substrate,
A method for manufacturing an electronic device, characterized in that at least one of the films is formed by the film forming method according to claim 13. 13. The method of claim 12,
Wherein the electronic device is a display panel of an organic EL display device. 15. The method of claim 14,
Wherein the electronic device is a display panel of an organic EL display device.

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