JP2006083423A - Shutter for evaporation source in vapor deposition apparatus, and the vapor deposition apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a shutter for an evaporation source in a vapor deposition apparatus capable of prolonging the maintenance period and depositing a thin film of high quality, and the vapor deposition apparatus. <P>SOLUTION: In the shutter for the evaporation source capable of blocking the movement of a film deposition material 2 to the side of a substrate 3 to be evaporated from an evaporation source 1 in a vapor deposition apparatus to deposit a thin film on the substrate 3 by heating and evaporating the film deposition material 2 filled in the evaporation source 1 and depositing the material vapor on the substrate 3, a plurality of closing parts 4 to close paths to the substrate 3 from the evaporation source 1 of the film deposition material 2 are juxtaposed with a space in the turning direction of a turning shaft, and shutter parts 5 forming spaces between the closing parts 4 as opening parts 7 to open the paths are provided on the turning shaft. The shutter parts are provided in a turn-switching manner between a state of blocking deposition of the film deposition material 2 on the substrate by closing the paths by one closing part of the shutter part 5 by turning the turning shaft, and a state of permitting deposition of the film deposition material 2 on the substrate 3 by opening the paths by the opening parts 7 between the closing parts 4. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a shutter for an evaporation source in a vapor deposition apparatus and the vapor deposition apparatus.

  Conventionally, when a plurality of evaporation sources are provided in one chamber (vacuum tank) and different film forming materials are vapor-deposited on the substrate, or vapor deposition is sequentially performed from different evaporation sources (so-called multi-source vapor deposition). In order to expose only an arbitrary evaporation source to the substrate, a shutter for the evaporation source is provided at a position substantially directly above the evaporation source so as to be opened and closed.

  Further, the shutter for the evaporation source is mainly used to attach the film forming material evaporated from each evaporation source to the substrate separately as described above. In the case of evaporation, heat insulation is also added for the purpose.

  This is because the high-frequency induction heating evaporation source emits larger radiation than other evaporation sources, so the temperature rise of the evaporation source shutter itself, the substrate shutter that shields the substrate, and peripheral components is very large, and these temperature increases are indirect. This is because the temperature of the substrate / deposition mask is urged.

  Therefore, Japanese Patent Application No. 2003-197935 (Patent Document 1) related to the prior application of the applicant discloses that a cooling mechanism is provided in each part in order to suppress this temperature increase.

  Particularly in the case of manufacturing an organic EL element, since the temperature of the organic EL element is a device in which the process temperature greatly affects the optical / electrical characteristics, reliability, and productivity, the temperature rise during the manufacturing is possible Therefore, it is necessary to provide a cooling mechanism for the evaporation source shutter.

Japanese Patent Application No. 2003-197935 JP 2003-155557 A

  However, the evaporation source shutter as described above receives a film forming material that evaporates from the evaporation source near the evaporation source side between the evaporation source and the substrate in a vacuum chamber. The deposition amount is larger than the shutter for the substrate provided closer to the substrate (the deposited film thickness increases exponentially as the distance to the evaporation source becomes shorter), and the film deposition material deposited on the shutter falls. This may cause various problems such as fluctuations in the evaporation rate and the degree of vacuum. Therefore, it is necessary to frequently remove the deposited film forming material from the shutter, and the maintenance cycle is shortened. Inevitable.

  Therefore, as disclosed in Japanese Patent Application Laid-Open No. 2003-155557 (Patent Document 2), a plurality of shutters are provided on the same shaft, and the plurality of shutters are alternately opened and closed to open and close the evaporation source. In this case, the structure is complicated and the cost is increased, and for example, when each of the shutters is provided with a water-cooled cooling mechanism, for example, A movable part is required for the seal part of the cooling water, which leads to shortening of the life of the apparatus and complicated structure, which is extremely troublesome.

  The present invention pays attention to the above-mentioned problems and solves them, and a plurality of closing portions for closing the path from the evaporation source of the film forming material to the substrate are arranged in parallel in the rotation direction of the rotation shaft. Thus, it is possible to easily and cost-effectively realize a configuration in which the film forming material can be dispersed and adhered to a plurality of closed portions, and to open portions and other closed portions that easily open the path by a rotating operation. Can be switched, the maintenance cycle can be extended, productivity can be improved, and the film deposition material adhering to the shutter is less likely to fall, and high-quality thin film deposition is possible. In addition, for example, even when a water-cooled cooling mechanism is provided, there is no need for a movable part in the sealing part of the cooling water, and the structure can be simplified. Provided is a shutter and a deposition apparatus therefor. For the purpose of theft.

  The gist of the present invention will be described with reference to the accompanying drawings.

  The film forming material 2 filled in the evaporation source 1 is heated and evaporated to adhere to the substrate 3, whereby the film forming material 2 evaporated from the evaporation source 1 in the vapor deposition apparatus for forming a thin film on the substrate 3. In the shutter for the evaporation source that can prevent the movement to the substrate 3 side, the closing portion 4 that closes the path from the evaporation source 1 to the substrate 3 of the film forming material 2 is arranged in the rotation direction of the rotation shaft 9. A plurality of shutters 5 are arranged in parallel with each other, and a shutter part 5 serving as an opening part 7 that opens the path between the closed parts 4 is provided on the rotating shaft 9, and the shutter part 5 rotates the rotating shaft 9. The path is closed by one closing part 4 of the shutter part 5 to prevent the deposition material 2 from adhering to the substrate 3, and the opening part 7 between the closing parts 4 allows the path to be closed. If it is provided so that it can be rotated and switched to a state in which it is opened and allows the deposition material 2 to adhere to the substrate 3. In the evaporation source shutter in the vapor deposition apparatus, the rotation shaft 9 is further rotated so that the path can be closed by the closing part 4 different from the one closing part 4. It is concerned.

  The shutter portion 5 is formed in a propeller shape by arranging a plurality of blade portions 8 as the closing portion 4 at intervals in the rotation direction of the rotation shaft 9. Is positioned on the path from the evaporation source 1 of the film forming material 2 to the substrate 3 so as to close the path, the space between the blades 8 is set as the opening 7, and the rotation shaft 9 A plurality of the blade portions 8 and the opening portions 7 arranged in parallel in one rotation direction are sequentially positioned on the route so that the route can be closed or opened. This relates to a shutter for an evaporation source in the vapor deposition apparatus according to 1.

  The shutter unit 5 is provided with a cooling mechanism for cooling the shutter unit 5. The evaporation source shutter according to claim 1, wherein the shutter unit 5 is provided with a cooling mechanism. is there.

  The cooling mechanism is provided in the shutter unit 5 and is provided in the cooling path 10 through which the refrigerant flows to cool the shutter part 5 and the shaft 9 to supply the refrigerant to the cooling path 10. 4. A shutter for an evaporation source in a vapor deposition apparatus according to claim 3, wherein the refrigerant supply passage is connected to the cooling passage and the refrigerant supply passage without a moving part. It is.

  5. The evaporation source 1 according to claim 1, wherein the evaporation source 1 comprises a container 1a filled with a film forming material and an induction coil 1b disposed around the container 1a. The present invention relates to a shutter for an evaporation source in the vapor deposition apparatus described in any one of the items.

  Further, the present invention relates to a vapor deposition apparatus characterized in that one or more evaporation source shutters according to any one of claims 1 to 5 are arranged in a vacuum chamber.

  Since the present invention is configured as described above, it is possible to realize a configuration capable of dispersing and adhering a film forming material to a plurality of closed portions in a simple and cost-effective manner, and easily opening the path by a rotating operation. It can be switched to an open part and another closed part, the maintenance cycle can be prolonged and productivity can be improved, and a high-quality thin film can be formed. For example, even when a water-cooling type cooling mechanism is provided, the shutter structure for the evaporation source in the vapor deposition apparatus and its vapor deposition apparatus, which are extremely excellent in practicality, such as a simple cooling water sealing structure, can be obtained.

  Further, in the invention described in claim 2, the film can be formed more efficiently and is more practical than the case.

  In the inventions according to the third and fourth aspects, the present invention is more practical than the high temperature of the shutter portion can be prevented.

  Further, in the invention described in claim 5, the present invention can be realized more easily and more excellent in practicality.

  Embodiments of the present invention that are considered suitable (how to carry out the invention) will be briefly described with reference to the drawings, illustrating the operation of the present invention.

  In order to prevent the deposition material 2 evaporating from the evaporation source 1 from adhering to the substrate 3, the rotation shaft 9 is rotated and the path is closed by the closing portion 4 of the shutter portion 5 to the substrate 3. The adhesion of the film forming material 2 is prevented.

  Further, when allowing the film forming material 2 to adhere to the substrate 3, the rotation shaft 9 is rotated to switch from the closing portion 4 that is located on the path and closes the path to the opening portion 7. Thus, the path is opened by the open portion 7 between the closed portions 4 to allow the deposition material 2 to adhere to the substrate 3.

  At this time, when the path opened by the opening portion 7 is closed again, the rotation shaft 9 is further rotated so that it can be closed by the closing portion 4 different from the one closing portion 4. .

  That is, the path of the film forming material 2 from the evaporation source 1 to the substrate 3 can be blocked by alternately positioning different blocking portions 4 on this path, and a plurality of blocking portions 4 can be blocked from the evaporation source 1. Since the evaporated film forming material 2 can be dispersed and adhered, the amount of the film forming material 2 adhering to the individual closed portions 4 of the shutter unit 5 can be reduced.

  Accordingly, the deposition rate of the film forming material 2 adhering to the blocking portion 4 can be slowed down, and the maintenance cycle can be lengthened accordingly to improve the productivity.

  That is, once the deposition apparatus (vacuum chamber) is opened to the atmosphere for maintenance, etc., it takes time for cleaning, evacuation, etc., and if the maintenance cycle is short, production is significantly hindered. For example, the maintenance cycle can be extended with an extremely simple configuration, and therefore the productivity can be improved.

  In addition, since the amount of the film forming material 2 deposited on each closed portion 4 is reduced, naturally, the risk of the film forming material deposited on the closed portion 4 is reduced, and the vapor deposition rate and the degree of vacuum are accordingly increased. Film formation can be performed in a stable state, and a high-quality thin film can be formed.

  In addition, the shutter 5 can be simply switched between the closing portion 4 and the opening portion 7 by simply rotating the rotation shaft 9 and does not require a complicated drive mechanism. It is less likely to break down and has excellent durability.

  Further, for example, when it is desired to cool the shutter unit 5, the cooling unit is provided in the shutter unit 5 as a cooling mechanism for preventing the temperature of the shutter unit 5 from rising. There is a passage 10 and a refrigerant supply portion 11 provided in the rotating shaft 9 for supplying the cooling passage 10 with a refrigerant. The cooling passage 10 and the refrigerant supply passage 11 are not connected to a movable portion. What is connected can be adopted, and there is no need for a movable part in the seal part for preventing leakage of the refrigerant (for example, tap water), and cooling can be performed with a structure that is simple and excellent in maintainability. .

  Further, as the evaporation source 1, a container 1a filled with a film forming material 2 and an induction coil 1b disposed around the container 1a are employed to perform vapor deposition using a high frequency induction heating method. In this case, since it takes time to start up the evaporation source 1, even when the high frequency induction heating evaporation source is closed with respect to the substrate, the film forming material is always evaporated without stopping heating. For this reason, there is a problem that the deposition amount of the film deposition material on the shutter is large and the maintenance cycle is shortened. However, according to the present invention, the film deposition material 2 can be dispersed and adhered to the plurality of closed portions 4. Therefore, the maintenance cycle can be prolonged (that is, the operation time can be prolonged), and the cooling mechanism can be easily provided as described above, so that the structure for enhancing the heat shielding effect can be easily realized. Become.

  Therefore, according to the present invention, it is possible to easily and cost-effectively realize a configuration capable of dispersing and adhering a film forming material to a plurality of closed portions, and to easily open the path by a rotating operation and another configuration. It is possible to switch to a closed part, realize a long maintenance cycle, improve productivity, and form a high-quality thin film, and for example, water-cooled cooling Even in the case where the mechanism is provided, the shutter structure for the evaporation source in the vapor deposition apparatus and its vapor deposition apparatus are extremely excellent in practicality, for example, the cooling water sealing structure is simple.

  Specific embodiments of the present invention will be described with reference to the drawings.

  In the present embodiment, the film forming material 2 filled in the evaporation source 1 is heated and evaporated, and is deposited on the substrate 3 to evaporate from the evaporation source 1 in a vapor deposition apparatus for forming a thin film on the substrate 3. In a shutter for an evaporation source that can prevent the film forming material 2 from moving toward the substrate 3, a closing portion 4 that closes the path from the evaporation source 1 to the substrate 3 of the film forming material 2 is provided with a rotation shaft 9. A plurality of shutters 5 are arranged in parallel at intervals in the rotation direction, and a shutter part 5 is provided on the rotation shaft 9 as an opening part 7 that opens the path between the closed parts 4. A state in which the moving shaft 9 is rotated and the path is closed by one closing part 4 of the shutter part 5 to prevent the deposition material 2 from adhering to the substrate 3, and an opening part between the closing parts 4 7 can open and turn the path to allow the film forming material 2 to adhere to the substrate 3. In addition to the above, the rotation shaft 9 is further rotated so that the path can be closed by the closing part 4 different from the one closing part 4. Device.

  In this embodiment, the evaporation source 1 includes a container 1a filled with a metal material (Al in the present embodiment) as a film forming material 2, and an induction coil 1b disposed around the container 1a. The thing is adopted.

  In addition, although a present Example is the structure which provided one evaporation source as mentioned above, it is good also as a structure which provided multiple evaporation sources. Further, any vapor deposition means such as EB vapor deposition or resistance heating vapor deposition may be adopted.

  The container 1a of this embodiment is not made of metal that is heated by high frequency induction, but is made of ceramic or the like that does not generate eddy current even when magnetic flux is transmitted. In this case, since the container 1a is not subjected to high-frequency induction heating, only the metal material filled in the container 1a can be subjected to high-frequency induction heating. Therefore, the high melting point metal material such as Al having a high melting point and wettability is used. However, vapor deposition can be performed satisfactorily.

  Since the shutter unit 5 is provided between the substrate 3 and the evaporation source 1 and closer to the evaporation source 1 side, the shutter unit 5 is naturally formed in comparison with the substrate shutter 13 provided in front of the substrate 3. The adhesion amount of the film material is increased, and the film formation material deposited on the shutter unit 5 may be dropped, and maintenance is required frequently. According to this embodiment, a plurality of the film formation materials are provided. Therefore, the amount of film-forming material adhering to each of the closed portions 4 can be reduced, and the deposition rate can be reduced accordingly, and the maintenance cycle can be prolonged. And productivity can be improved.

  Reference numeral A in the figure indicates that the deposition material 2 that evaporates from the evaporation source 1 that blocks the deposition material 2 from adhering to the substrate 3 by being blocked by the closing portion 4 of the shutter portion 5 is applied to the substrate 3. It is an area on the route. The position of the region A closed by the closing portion 4 is a position immediately above the evaporation source 1 in this embodiment, but changes depending on the positional relationship between the evaporation source 1 and the substrate 3.

  Each part will be specifically described. The shutter portion 5 of the present embodiment has a propeller shape in plan view, and a central portion thereof is connected to the upper portion of the rotating shaft 9. Specifically, the shutter unit 5 is connected to the rotation shaft 9 by a fastening member such as a set screw, and is configured to rotate integrally with the rotation of the rotation shaft 9.

  More specifically, the shutter portion 5 has a configuration in which four blade portions 8 as the closing portions 4 are arranged side by side at a predetermined interval on the same plane, and the space between the blade portions 8 is set as the open portion 7. Then, by alternately closing the path from the evaporation source 1 of the film-forming material 2 to the substrate 3 by the four blade portions 8, the film-forming material 2 evaporated from the evaporation source 1 is removed from each blade portion 8. It is configured to disperse and adhere to the lower surface and prevent the film forming material 2 from moving to the substrate 3 side.

  Therefore, unlike the conventional configuration in which a plurality of shutters are provided on the same axis, the configuration does not have a plurality of shutters in the vertical direction (because the configuration has a plurality of closed portions 4 in the horizontal direction). It is excellent in safety without being pinched.

  In addition, it is good also as a structure which provided in the shutter part 5 the cover body which covers at least the lower surface whole surface of this shutter part 5 (blade part 8) so that attachment or detachment was possible. In this case, the deposited film forming material 2 can be easily removed simply by replacing the cover.

  Moreover, it is good also as a structure which provided the blade | wing part 8 at 3 sheets or less or 5 sheets or more. In particular, since the present embodiment has a simple structure, the number of the blade portions 8 can be arbitrarily set, and an evaporation source shutter having an appropriate number of closed portions 4 can be obtained very easily.

  In this embodiment, the rotation shaft 9 is connected to an appropriate actuator, for example, a drive shaft of a motor 15 via a known drive mechanism 16 having a Geneva gear, and is rotated by driving of the motor 15. However, other drive mechanisms 16 and other actuators such as a rotating cylinder may be employed. At this time, only one actuator is necessary, and the configuration is simple and inexpensive. The actuator and drive mechanism 16 may be provided inside the vacuum chamber 12 or may be provided outside.

  In the present embodiment, the rotation shaft 9 is rotated within a range of 360 degrees so that the blade portion 8 and the opening portion 7 are sequentially positioned on the path. In addition, it is good also as a structure rotated beyond 360 degree | times.

  According to the shutter unit 5 according to the present embodiment, the one blade unit 8 is positioned on the path to prevent the deposition material 2 evaporated from the evaporation source 1 from adhering to the substrate 3. The evaporation source 1 is started up (preliminary heating until the evaporation rate of the film forming material 2 is stabilized), and the rotating shaft 9 is rotated in order to perform film formation, and adjacent to the one blade portion 8. After the film is formed with the opening portion 7 on the rotation direction side of the rotation shaft 9 positioned on the path, the path is not closed by the one blade section 8 when the path is closed again. The film forming material 2 can be blocked by the other blades 8 on the rotation direction side of the rotation shaft 9 provided adjacent to the opening 7, and is thus dispersed in a plurality of the blocking portions 4. Can be attached.

  In this embodiment, one evaporation source 1 is provided. However, a plurality of evaporation sources may be provided, and a film may be sequentially formed on the substrate by these evaporation sources.

  The shutter unit 5 is provided with a cooling mechanism. Even when the path is closed at a position almost directly above the high-frequency induction heating type evaporation source 1 that prevents the temperature of the shutter unit 5 from rising due to this cooling mechanism, the shutter unit 5 is heated and radiant heat is generated. The substrate 3 and the thin film formed on the substrate 3 (for example, when forming an organic EL element, before forming the Al layer as the cathode, the ITO layer and the organic material as the anode are formed on the substrate 3. The organic light-emitting layer made of (a) is heated as much as possible, and deterioration of this thin film (especially organic thin film) can be prevented.

  Therefore, even if the high-frequency induction heating type evaporation source 1 is used, for example, a high-quality organic EL element can be manufactured.

  Specifically, the cooling mechanism is provided in the shutter unit 5, and is provided in the cooling path 10 through which the refrigerant flows and cools the shutter unit 5, and in the rotary shaft 9. The refrigerant supply path 11 for supplying the refrigerant is connected, and the cooling path 10 and the refrigerant supply path 11 are connected without a movable part.

  More specifically, the refrigerant supply path 11 includes a feeding part 11a for sending the refrigerant to the shutter part 5 and a return part 11b for returning the refrigerant from the shutter part 5, and the ends of the feeding part 11a and the return part 11b. Each part is connected to a refrigerant supply source (not shown) via a hose 21, and this refrigerant supply source is configured to cool (warm) the refrigerant from the return part 11b and circulate it to the feed part 11a. ing.

  The cooling path 10 is provided inside the shutter unit 5 and is provided in a meandering state so as to cover substantially the entire area of the shutter unit 5. In this embodiment, tap water that can be obtained at low cost is used as the refrigerant, but other fluids may be used. Further, the cooling path 10 may be provided outside the shutter unit 5.

  Further, since the shutter unit 5 is connected to the rotating shaft 9 and rotates integrally there is no movable portion between the cooling path 10 of the shutter unit 5 and the refrigerant supply path 11 of the rotating shaft 9. Therefore, the cooling water sealing structure necessary for the connecting portion between the cooling passage 10 and the refrigerant supply passage 11 is simple and the risk of water leakage is reduced as much as possible, thereby extending the life of the device and improving the safety. Can be planned.

  The feed part 11a and the return part 11b and the hose 21 may be connected via a rotary joint (rotary fluid joint). In this case, the rotary shaft 9 is rotated 360 degrees or more. However, the rotating shaft 9 can be rotated well without the hose 21 being tangled.

  Therefore, in the present embodiment, the refrigerant supply path 11 is provided inside the rotating shaft 9, so that the rotating shaft 9 is different from the case where it is provided outside the rotating shaft 9 (by a hose or the like). In addition, the cooling water seal structure is simplified, and the structure is simple and excellent in maintainability.

  In this embodiment, not only the shutter unit 5 but also other members are provided with a cooling mechanism (cooling pipe 17 through which cooling water flows), so that other members are heated by heat radiation from the evaporation source 1. In other words, the substrate 3 and the thin film formed on the substrate 3 are prevented from being heated by radiant heat from these other members. In the figure, reference numeral 18 denotes an adhesion-preventing plate that closes the space between the shutter 13 for the substrate and the inner wall of the vacuum chamber 12, 19 denotes a fixing portion for fixing the substrate 3, and 20 surrounds the periphery of the evaporation source 1 to dissipate heat. Reference numeral 14 denotes a heat insulating plate for blocking heat radiation by blocking the upper part of the evaporation source 1 while leaving the portion through which the film forming material 2 passes, and 22 is a cooling plate provided with a cooling mechanism.

  Since the present embodiment is configured as described above, in order to prevent the deposition material 2 evaporating from the evaporation source 1 from adhering to the substrate 3, the shutter shaft 5 is closed by rotating the rotating shaft 9. The path is closed by the portion 4 to prevent the deposition material 2 from adhering to the substrate 3.

  Here, when the deposition of the film forming material 2 on the substrate 3 is allowed, the rotating shaft 9 is rotated to be positioned on the path to close the path from the closing part 4 to the opening part 7. By switching, the path is opened by the open portion 7 between the closed portions 4 to allow the deposition material 2 to adhere to the substrate 3.

  Further, when the opened path is closed again, the rotating shaft 9 is further rotated so that the closed path 4 can be closed by another closing part 4.

  That is, the path of the film forming material 2 from the evaporation source 1 to the substrate 3 can be blocked by alternately positioning different blocking portions 4 on this path, and a plurality of blocking portions 4 can be blocked from the evaporation source 1. Since the evaporated film forming material 2 can be dispersed and adhered, the amount of the film forming material 2 adhering to the individual closed portions 4 of the shutter unit 5 can be reduced.

  Accordingly, the deposition rate of the film forming material 2 adhering to the blocking portion 4 can be slowed down, and the maintenance cycle can be lengthened accordingly to improve the productivity.

  That is, once the deposition apparatus (vacuum tank) is opened to the atmosphere for maintenance, etc., it takes time to clean up, evacuate, start up the heating means, etc., and if the maintenance cycle is short, production is significantly hindered. However, according to the present embodiment, the maintenance cycle can be lengthened with a very simple configuration, and therefore the productivity can be improved.

  In addition, since the amount of the film forming material 2 deposited on each closed portion 4 is reduced, naturally, the risk of the film forming material deposited on the closed portion 4 is reduced, and the vapor deposition rate and the degree of vacuum are accordingly increased. Film formation can be performed in a stable state, and a high-quality thin film can be formed.

  In addition, the shutter 5 can be simply switched between the closing portion 4 and the opening portion 7 by simply rotating the rotating shaft 9, so that failure and the like hardly occur, and the durability is excellent. It will be.

  Further, the shutter unit 5 is provided with the shutter unit 5 as a cooling mechanism in order to prevent the shutter unit 5 from being overheated. Provided with a refrigerant supply section 11 for supplying a refrigerant to the cooling path 10, and the cooling path 10 and the refrigerant supply path 11 are connected without a movable part. There is no need for a movable part in the seal part for preventing leakage of refrigerant (tap water), and cooling can be performed with a simple structure with excellent maintainability.

  Further, as the evaporation source 1, a container 1a filled with a film forming material 2 and an induction coil 1b disposed around the container 1a are employed to perform vapor deposition using a high frequency induction heating method. In this case, since it takes time to start up the evaporation source 1, when film formation is performed using the plurality of evaporation sources 1, heating is not stopped even when the high-frequency induction heating evaporation source is closed with respect to the substrate. Since the film material is constantly evaporated, there is a problem that the amount of the film deposition material adhering to the shutter is large and the maintenance cycle is shortened. However, according to the present embodiment, the film material is dispersed in the plurality of closed portions 4. Since the film forming material 2 can be adhered, it is possible to realize a long maintenance cycle (that is, a long operation time), and it is possible to easily provide a cooling mechanism as described above. High frequency induction heating steaming Source by can be favorably prevented that the shutter unit 5 will be the heat source of, it would be easily realized a structure with enhanced heat shielding effect.

  Therefore, this embodiment can realize a simple and cost-effective configuration capable of dispersing and adhering the film forming material to the plurality of closed portions, and can easily open the path by rotating operation. It is possible to switch to the closed part of the product, improve the productivity by prolonging the maintenance cycle, enable the formation of high-quality thin films, and use water-cooled cooling. Even when the mechanism is provided, the cooling water sealing structure is simple, and thus it is extremely excellent in practicality.

  The present invention is not limited to this embodiment, and the specific configuration of each component can be designed as appropriate.

It is a schematic explanatory sectional drawing of a present Example. It is a schematic explanatory top view of the principal part of a present Example. It is a schematic explanatory sectional drawing of the principal part of a present Example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Evaporation source 1a Container 1b Induction coil 2 Film-forming material 3 Substrate 4 Blocking part 5 Shutter part 7 Opening part 8 Blade part 9 Rotating shaft
10 Cooling path
11 Refrigerant supply path

Claims (6)

  The deposition material filled in the evaporation source is heated to evaporate and adhere to the substrate, thereby moving the deposition material evaporated from the evaporation source to the substrate side in a deposition apparatus that forms a thin film on the substrate. In the shutter for the evaporation source that can prevent the film formation, a plurality of closing portions that close the path from the evaporation source of the film forming material to the substrate are arranged in parallel in the rotation direction of the rotation shaft. A shutter part having an opening part for opening the path is provided on the rotating shaft, and the shutter part rotates the rotating shaft and closes the path by one closing part of the shutter part. In addition, it is possible to switch between a state in which the deposition material is prevented from adhering to the substrate and a state in which the path is opened by the opening between the closed portions and the deposition material is allowed to adhere to the substrate. The rotating shaft is further rotated, and the closed portion different from the one closing portion is closed. Shutter for the evaporation source in a vapor deposition apparatus characterized by being configured so as to close the path by parts.   The shutter portion is formed in a propeller shape by arranging a plurality of blade portions as the closing portion in parallel in the rotation direction of the rotation shaft, and this one blade portion is formed by evaporation of the film forming material. It is configured to close the path by being positioned on the path from the source to the substrate, and the plurality of blades are set in the open portion and arranged in parallel in one rotation direction of the rotation shaft. The shutter for the evaporation source in the vapor deposition apparatus according to claim 1, wherein the blade portion and the opening portion are sequentially positioned on the path so that the path can be closed or opened.   The evaporation source shutter in the vapor deposition apparatus according to claim 1, wherein the shutter unit is provided with a cooling mechanism for cooling the shutter unit.   The cooling mechanism includes a cooling path that is provided in the shutter section and that cools the shutter section when the refrigerant flows therethrough, and a refrigerant supply path that is provided in the shaft and supplies the refrigerant to the cooling path. 4. The evaporation source shutter in the vapor deposition apparatus according to claim 3, wherein the cooling path and the refrigerant supply path are connected without a movable part.   The said evaporation source employ | adopted what consists of the container with which film-forming material is filled, and the induction coil arrange | positioned around this container. The shutter for the evaporation source in the evaporation apparatus. 6. A vapor deposition apparatus, wherein one or more evaporation source shutters according to claim 1 are arranged in a vacuum chamber.

Images