CN109722635A - The manufacturing method of evaporation source, film formation device, film build method and electronic equipment - Google Patents
The manufacturing method of evaporation source, film formation device, film build method and electronic equipment Download PDFInfo
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- CN109722635A CN109722635A CN201810844797.1A CN201810844797A CN109722635A CN 109722635 A CN109722635 A CN 109722635A CN 201810844797 A CN201810844797 A CN 201810844797A CN 109722635 A CN109722635 A CN 109722635A
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- crucible
- evaporation source
- substrate
- evaporation
- baffle
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
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- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The present invention provides the manufacturing method of a kind of evaporation source, film formation device, film build method and electronic equipment.Evaporation source of the invention includes: multiple crucibles, and the multiple crucible includes the first crucible and the second crucible, stores evaporation material；Anti-adhesion plate, the anti-adhesion plate covers first crucible, and has opening on second crucible；And movable evaporation source baffle, second crucible is set as shielding status or open state by changing position by the evaporation source baffle, the evaporation source is characterized in that, when second crucible is set as open state by the evaporation source baffle, the evaporation source baffle is Chong Die with the anti-adhesion plate and the first crucible covered by the anti-adhesion plate.
Description
Technical field
The present invention relates to the manufacturing methods of evaporation source, film formation device, film build method and electronic equipment.
Background technique
The organic electronic devices such as organic el display via the vapor deposition process for making the vapor depositions such as organic material or metal material and
It is manufactured.The evaporation source used in vapor deposition process has multiple crucibles, by heating the vapor deposition material being accommodated in crucible
Material makes the temperature of evaporation material rise and evaporate evaporation material and be attached to the surface of substrate and form a film.
Patent document 1 discloses a kind of vacuum deposition apparatus, which has vacuum chamber, in substrate
One of the upper multiple evaporation sources (crucible) for forming film and the steam for opening or covering the material evaporated from evaporation source
Baffle.Describing can prevent from producing between each other in multiple evaporation sources and successively opening a baffle in multiple evaporation sources
Raw pollution.
In addition, patent document 2 has multiple evaporation sources, first heater, secondary heating mechanism and vapor deposition masking
Plate.In the past, the evaporation source with multiple evaporation sources was heated to the evaporation material for being accommodated in evaporation source to improve it
In the case where temperature, if (main heating) just begins to warm up evaporation material in vapor deposition, the time is expended in terms of heating.Cause
This, in preheating of the temperature for before being deposited, carrying out improving evaporation source to evaporation material as the temperature of steam.That is, more
It include that the temperature for carrying out preheating evaporation source and stored evaporation material being maintained to become steam is used in combination in a evaporation source
In the evaporation source of the main heating to form a film to substrate surface.In the structure of patent document 2, vapor deposition shield covering is located at pre-
The evaporation source of heating location.
Citation
Patent document
[patent document 1] Japanese Unexamined Patent Publication 2007-332433 bulletin
[patent document 2] Japanese Unexamined Patent Publication 2006-249575 bulletin
Summary of the invention
Subject to be solved by the invention
But due to the heating temperature of evaporation source height, even if under vacuum, also due to the radiation from evaporation source
Heat influence and make configured substrate, mask generate heat prolong (heat prolongs び) etc. deformation, thus generate film-forming accuracy reduce, film forming
The projects such as the quality reduction of caudacoria.As above-mentioned previous example, when the only arrangement of baffles on the evaporation source without vapor deposition
Or when vapor deposition shield, it is difficult to sufficiently reduce influence of the evaporation source to the radiant heat of substrate.Especially, from carrying out pre-add
The influence of the radiant heat of the evaporation source of heat or the rigid evaporation source for terminating vapor deposition is big.
The present invention makes in view of the above subject.The purpose of the present invention is to provide a kind of reduction radiant heat to the shadow of substrate
Loud evaporation source.
Solution for solving the problem
To achieve the goals above, the present invention uses following structures.That is,
A kind of evaporation source, comprising:
Multiple crucibles, the multiple crucible include the first crucible and the second crucible, store evaporation material；
Anti-adhesion plate, the anti-adhesion plate covers first crucible, and has opening on second crucible；With
And
Second crucible is set as covering by movable evaporation source baffle, the evaporation source baffle by changing position
State or open state,
The evaporation source is characterized in that,
When second crucible is set as open state by the evaporation source baffle, the evaporation source baffle with it is described prevent it is attached
Plate and the first crucible for being covered by the anti-adhesion plate be overlapped.
Invention effect
In accordance with the invention it is possible to provide a kind of evaporation source of influence of the reduction radiant heat to substrate.
Detailed description of the invention
Fig. 1 is the schematic diagram for showing a part of the structure of manufacturing device of organic electronic device；
Fig. 2 is (a) shielding status of the structure of evaporation source that shows embodiment 1 and (b) open state shows
It is intended to；
Fig. 3 is the schematic diagram for showing the structure of evaporation source baffle of embodiment 2；
Fig. 4 is the schematic diagram for showing the structure of evaporation source baffle of embodiment 3；
Fig. 5 is the schematic diagram for showing the structure of evaporation source of embodiment 4；
Fig. 6 is the schematic diagram for showing the structure of evaporation source of embodiment 5；
Fig. 7 is the signal from the form laterally observed for showing the evaporation source baffle of the evaporation source of embodiment 5
Figure；
Fig. 8 is the schematic diagram for showing the structure of evaporation source of embodiment 6；
Fig. 9 is the figure for showing the construction of organic EL display device.
Description of symbols
1: evaporation source
2: the second crucibles
3: the first crucibles
4: anti-adhesion plate
5: evaporation source baffle
6: film formation device
7,63: substrate
8: substrate supporting frame
9: mask
10: mask bearing support
11: substrate baffle
12: magnetic sheet
13: vacuum chamber
14: cooling body
15: surface processing
16: reflecting plate
17: mobile supporting mass
18: rotary support member
Specific embodiment
Hereinafter, being described with reference to the preferred embodiment of the present invention and embodiment.But the following embodiments and the accompanying drawings with
And embodiment is only to illustrate preferred structure of the invention, and the scope of the present invention is not defined in these structures.In addition,
The hardware configuration of the device in explanation and software configuration, process flow, manufacturing condition, size, material, shape etc. are not having below
In the case where having special specific record, it is not intended that the scope of the present invention to be only defined in the hardware configuration of above-mentioned apparatus and soft
Part structure, process flow, manufacturing condition, size, material, shape etc..
About evaporation source and its control method of the invention, it is particularly suitable for being formed on vapor deposition body by being vaporized on
The evaporation source and its control method of film.Also, even if as making computer execute the program of control method, storing the journey
The storage medium of sequence, the present invention are also included within interior.Storage medium can be the permanent storage media that can be read by computer.
The present invention is for example preferably applied to as being formed desired pattern by vacuum evaporation on the surface of the substrate of vapor deposition body
Film (material layer) device.As the material of substrate, it can choose any materials such as glass, resin, metal.It needs to illustrate
, film formation device is not limited to flat substrate by vapor deposition body.For example, it is also possible to will have concave-convex or opening machinery zero
Part is used as by vapor deposition body.In addition, also can choose organic material, inorganic material (metal, metal oxide as evaporation material
Deng) etc. any materials.In addition, can not only form a film to organic film, can also form a film to metal film.Skill of the invention
Art can specifically be suitable for organic electronic device (such as organic EL display device, thin-film solar cells), optical component
Deng manufacturing device.
1 > of < embodiment
The outline structure > of < film formation device
Fig. 1 is the cross-sectional view for schematically showing the structure of evaporation coating device (film formation device).Film formation device 6 has vacuum chamber
13.The inside of vacuum chamber 13 is maintained the non-active gas atmosphere such as vacuum or nitrogen.
The inside of vacuum chamber 13 be substantially provided with by substrate supporting frame 8 keep by vapor deposition body i.e. substrate 7, by covering
The mask 9 of the holding of die support frame 10, the magnetic sheet 12 and evaporation source 1 that mask 9 is attracted to substrate 7 using magnetic force.
Substrate supporting frame 8 keeps substrate by supporting members such as receiving pawls (manipulator) for supporting substrates 7, for pressing
The pressing pieces such as fixture (not shown) keep substrate.In addition, substrate 7 is being transported to vacuum chamber by transfer robot (not shown)
It after in room 13, is kept, and is fixed into film forming parallel with horizontal plane (X/Y plane) by substrate supporting frame 8.Mask 9 is that have
The mask of patterns of openings corresponding with the Thinfilm pattern of predetermined pattern formed on substrate 7, e.g. metal mask.At
Substrate 7 is placed on mask 9 when film.
In addition, being equipped with the first crucible 3, the second crucible, the anti-adhesion plate 4 with opening and evaporation in evaporation source 1
Source baffle 5.First crucible 3 is covered by anti-adhesion plate 4, and the second crucible 2 configures under the opening of anti-adhesion plate 4.First crucible 3
Evaporation material is stored respectively in the second crucible 2, generates steam and heating to the evaporation material.In turn, evaporation source
Baffle 5 is the top that the opening of anti-adhesion plate 4 is arranged in, and makes the opening of anti-adhesion plate 4 in open state or shielding status
Movable baffle.
Substrate 7 is reached for controlling the steam from evaporation source 1 in addition, can also have in vacuum chamber 13
The substrate baffle 11 of open and close type.(do not scheme in addition, can also have the coldplate for inhibiting the temperature of substrate 7 to rise in magnetic sheet 12
Show).In turn, can also have the mechanism of the alignment for substrate 7 and mask 9, such as X-direction or Y on vacuum chamber 13
The driving mechanisms such as the actuator in direction, substrate supporting frame actuator for keeping substrate, the camera shooting that substrate 7 is imaged
Head (not shown).
Multiple crucibles including the first crucible 3 and the second crucible 2 are equipped in evaporation source 1.Crucible is the one of evaporation source
A example.In addition, having in evaporation source 1 can be such that the first crucible 3 and the mobile supporting mass of the second crucible 2 movement (does not scheme
Show).In the present embodiment, the main heating for vapor deposition is carried out to one in multiple crucibles.In addition, in multiple crucibles
One preheating carried out for preparing vapor deposition.
For convenience, the crucible for carrying out main heating or configuration are recorded in the crucible for being used to carry out the position of main heating
For the second crucible 2.In addition, for convenience, preheating crucible or configuration will be being carried out in the earthenware for carrying out preheating position
Crucible is recorded as the first crucible 3.That is, the first crucible 3 is to carry out preheating crucible, in preheating, using heater etc. to receipts
The evaporation material being contained in crucible is heated, and so that the temperature of crucible is risen to evaporation material becomes the temperature of steam.In addition, the
Two crucibles 2 are the crucibles for carrying out main heating, in main heating, continue to heat using heater etc., to be accommodated in crucible
Interior evaporation material maintains to become the temperature of steam.
After preheating, the first crucible of mobile supporting mass (not shown) Lai Yidong 3 can use, change it to use
In the position for carrying out main heating.Position for carrying out main heating refers to the position under the opening of anti-adhesion plate 4.It is each as a result,
Evaporation material in a crucible becomes steam by preheating and main this two-step heating of heating.
The detailed construction > of < evaporation source
Fig. 2 shows the movable forms of the evaporation source baffle 5 of evaporation source 1.
Fig. 2 (a) shows the form of the shielding status of evaporation source baffle 5.At this point, being accommodated in the evaporation source in the second crucible 2
The steam of material is evaporated the masking of source baffle 5, and the first crucible 3 is covered by anti-adhesion plate 4.As long as the shielding status comes from second
At least part of the steam of the material of crucible 2 cannot directly reach the state of substrate because being evaporated source baffle 5 and covering,
It is not limited to the whole state that evaporation source baffle 5 covers the second crucible 2.In addition, between the second crucible 2 and evaporation source baffle 5
There can be gap.Preferably, when from substrate-side, the entirety of the second crucible 2 is evaporated the covering of source baffle 5.
It should be noted that the first crucible 3 can be the crucible being preheated or be moved to cold to crucible progress after vapor deposition
But the crucible of position.
Fig. 2 (b) shows the form of the open state of evaporation source baffle 5.At this point, being accommodated in the evaporation source in the second crucible 2
The most of of the steam of material reaches substrate 7.
When evaporation source baffle 5 is in open state, evaporation source baffle 5 is moved to and anti-adhesion plate 4 and anti-adhesion
The position for 3 both sides of the first crucible overlapping that plate 4 covers.From certain viewpoint, the imaginary line for linking the first crucible 3 and substrate 7 is worn
Cross anti-adhesion plate 4 and evaporation source baffle 5.It is further preferred, that when from substrate-side, anti-adhesion plate 4 and evaporation source
Baffle 5 is Chong Die with the entirety of the first crucible 3.
Overlapped sequential can be when from the first crucible 3, anti-adhesion plate 4, evaporation source baffle 5 or evaporation source gear
Plate 5, anti-adhesion plate 4.In addition, in the case where overlapped sequential is evaporation source baffle 5, anti-adhesion plate 4, in the first crucible 3 and
Evaporation source baffle 5 is equipped between second crucible 2 and anti-adhesion plate 4.
According to above structure, from the first crucible 3 to being folded with 5 both sides of anti-adhesion plate 4 and evaporation source baffle substrate 7.
Therefore, influence of the radiant heat from the first crucible 3 to substrate 7 can be reduced.
In the above description, to be illustrated for the structure of a piece of anti-adhesion plate 4 with opening is arranged, but prevent attached
Plate 4 be also possible to 2,3 overlapping, in this case, by using evaporation source baffle moving structure as described above, also can
It is enough more effectively to reduce influence of the radiant heat from the first crucible 3 to substrate 7.
2 > of < embodiment
It is described with reference to embodiments of the present invention 2.Identical attached drawing is marked for structure same as embodiment 1
It marks and omits the description.
Fig. 3 be the element of the cooling body of the evaporation source baffle 5 in the evaporation source of present embodiment is shown, from upper
The schematic sectional view (Fig. 3 (a), Fig. 3 (c)) and the schematic sectional view (Fig. 3 (b), Fig. 3 (d)) from side of face observation.
Fig. 3 (a) and Fig. 3 (b) schematically shows the cooling water being arranged in evaporation source baffle 5 as cooling body
The configuration on road 14.Even if as a result, evaporation source baffle 5 due to from the radiant heat of the first crucible 3 etc. with heat, can also be by cold
But heat is shed from evaporation source baffle 5 with circulation cooling medium in water route 14.
In turn, evaporation source baffle 5 shown in Fig. 3 (c) and Fig. 3 (d) has cooling water road 14, and keeps off to evaporation source
Implement easily to absorb heat compared to the face of the opposite side in the face opposite with the first crucible 3 in the face opposite with the first crucible 3 of plate 5
Surface processing 15.Specific surface processing 15 is the coating of the high material of radiance (black material) or polytetrafluoroethylene (PTFE) (includes
The resin of hydrogen fluoride) overlay film etc..
As another example, the component in the face opposite with the first crucible 3 of evaporation source baffle 5 can be used compared to
The high component (not shown) of the pieces conduct heat rate in the face of the opposite side in the opposite face of one crucible 3.
By above-mentioned surface processing 15 or the component high using thermal conductivity, it is easy the radiation being subject to from first crucible 3 etc.
The heat transfer of heat gives the cooling body 14 set on evaporation source baffle 5, so as to reduce influence of the radiant heat to substrate 7.
3 > of < embodiment
It is described with reference to embodiments of the present invention 3.Identical attached drawing is marked for structure same as embodiment 1
It marks and omits the description.
Fig. 4 is the schematic sectional view (figure viewed from above of the evaporation source baffle 5 in the evaporation source of present embodiment
4 (a)) schematic sectional view (Fig. 4 (b)) and from side.The evaporation source baffle 5 shown in Fig. 4 (b) with the first crucible 3
Reflecting plate 16 is provided on opposite face.
The structure of specific reflecting plate 16 is low compared to the opposite surface radiation rate of opposite side in face of the first crucible 3
Surface processing applies the low material of radiance.As the structure of another specific reflecting plate 16 and it is with the following construction, that is, exist
Across spatially configuring radiance between the main body of evaporation source baffle 5 on the face opposite with the first crucible 3 of evaporation source baffle 5
Another plate that low surface processing or configuration are formed by the low material of radiance.
As specific material, it may be considered that molybdenum or tantalum.
In addition, mirror finish is carried out by the way that material is set as stainless steel or aluminium and is ground to these materials, thus
It is capable of forming the low surface of radiance.
By as described above on evaporation source baffle 5 be arranged reflecting plate 16 and to the radiant heat from the first crucible 3 etc.
It is reflected, thus, it is possible to reduce influence of the radiant heat to substrate 7.
In turn, by making radiant heat return to the first crucible 3, to have the effect for the thermal efficiency for improving the first crucible of heating
Fruit.
It should be noted that the cooling body recorded in embodiment 2 can be combined in the evaporation source of present embodiment
Baffle 5.
4 > of < embodiment
It is described with reference to embodiments of the present invention 4.Identical attached drawing is marked for structure same as embodiment 1
It marks and simplifies explanation.
Fig. 5, which is shown, to be provided with comprising including the first crucible 3 and the second crucible 2 on the mobile supporting mass 17 that can be moved
The form viewed from above arrived of the evaporation source baffle 5 of the evaporation source 1 of four crucibles.It should be noted that Fig. 5 shows steaming
The baffle 5 that rises is the form of open state and the position for making evaporation source baffle 5 of the opening of anti-adhesion plate 4 in open state when
It sets.
The mobile supporting mass that can be moved is respectively arranged at comprising four crucibles including the first crucible 3 and the second crucible 2
17.Mobile supporting mass 17 for example makes each earthenware and the arrow direction of the moving direction of the mobile supporting mass to diagram moves together
The position of crucible is mobile.It should be noted that the moving direction of mobile supporting mass 17 is also possible to the direction opposite with arrow.
There are four crucibles for tool in the embodiment 4 of Fig. 5.One in four crucibles is located at the opening of anti-adhesion plate 4
Lower section, and in position for carrying out main heating.The crucible is set as the second crucible 2.In addition, other than above-mentioned second crucible
Three crucibles in one in the position that is covered by anti-adhesion plate 4 and evaporation source baffle 5, in for carrying out preheating
Position.Another crucible is set as the first crucible 3.
It should be noted that evaporation source baffle 5 by the opening and closing direction of the evaporation source baffle along diagram is moved can
In shielding status.
In the present embodiment, influence of the radiant heat to substrate 7 can also be reduced in the same manner as Embodiments 1 to 3.
5 > of < embodiment
It is described with reference to embodiments of the present invention 5.Identical attached drawing is marked for structure same as embodiment 1
It marks and simplifies explanation.
Fig. 6, which is shown, to be equipped in the rotary support member 18 that can be rotated comprising seven including the first crucible 3 and the second crucible 2
The form viewed from above arrived of the evaporation source baffle 5 of the evaporation source 1 of a crucible.It should be noted that Fig. 6 shows evaporation
Source baffle 5 is the form of open state and the position for making evaporation source baffle 5 of the opening of anti-adhesion plate 4 in open state when.
Fig. 7 shows the open state of the opening that anti-adhesion plate 4 is shown from the form laterally observed, (a) of evaporation source baffle 5, (b) shows
The shielding status of the opening of anti-adhesion plate 4 out.
Comprising seven crucibles including the first crucible 3 and the second crucible 2 along the week for the rotary support member 18 that can be rotated
To setting.Rotary support member 18 for example makes and the arrow direction of the rotation of the rotary support member to diagram rotates along rotation
The position for each crucible of supporting mass 18 being circumferentially arranged is mobile.It should be noted that the direction of rotation of rotary support member 18
It can be the direction opposite with the arrow of the rotation of rotary support member.
There are seven crucibles in the embodiment 5 of Fig. 6.One in seven crucibles is located at the opening of anti-adhesion plate 4
Lower section, and in position for carrying out main heating.The crucible is set as the second crucible 2.In addition, other than above-mentioned second crucible
Six crucibles in one in the position that is covered by anti-adhesion plate 4 and evaporation source baffle 5, in for carrying out preheating
Position.Another crucible is set as the first crucible 3.
In addition, in the present embodiment, by being formed between the second crucible 2 and the first crucible 3 configured with other crucibles
Positional relationship, thus be configured to reduce preheating and it is main heating respectively heat when heat affecting.
It should be noted that evaporation source baffle 5 by the opening and closing direction of the evaporation source baffle along diagram is moved can
In shielding status.
In the present embodiment, influence of the radiant heat to substrate 7 can also be reduced in the same manner as Embodiments 1 to 4.
6 > of < embodiment
It is described with reference to embodiments of the present invention 6.Identical attached drawing is marked for structure same as embodiment 1
It marks and simplifies explanation.
Fig. 8, which is shown, to be equipped in the rotary support member 18 that can be rotated comprising seven including the first crucible 3 and the second crucible 2
The form viewed from above arrived of the evaporation source baffle 5 of the evaporation source 1 of a crucible.It should be noted that Fig. 6 shows evaporation
Source baffle 5 is the form of open state and the position for making evaporation source baffle 5 of the opening of anti-adhesion plate 4 in open state when.
Comprising seven crucibles including the first crucible 3 and the second crucible 2 along the week for the rotary support member 18 that can be rotated
To setting.Rotary support member 18 for example makes and the arrow direction of the rotation of the rotary support member to diagram rotates along rotation
The position for each crucible of supporting mass 18 being circumferentially arranged is mobile.It should be noted that the direction of rotation of rotary support member 18
It can be the direction opposite with the arrow of the rotation of rotary support member.
Present embodiment 6 is to reduce the structure of the influence of radiant heat of the evaporation source after just terminating vapor deposition.It is being deposited
Position carries out the crucible of main heating at the end of the vapor deposition from the crucible, is moved to pair using above-mentioned rotary support member 18
Crucible carries out cooling position, and the crucible for being located at preheating position is moved to vapor deposition position and continues to be deposited, but mobile
State of the crucible that vapor deposition to cooling position finishes due to waste heat and still in heat.In present embodiment 6, it can reduce
This just terminates influence of the crucible after being deposited to the radiant heat of substrate 7.
That is, having seven crucibles in the embodiment 6 of Fig. 8.One in seven crucibles is located at opening for anti-adhesion plate 4
The lower section of mouth, and in the position for carrying out main heating.The crucible is set as the second crucible 2.In addition, above-mentioned second crucible with
One in six outer crucibles is that vapor deposition terminates and is rotatably moved to just terminating for cooling position using rotary support member 18
Crucible after vapor deposition, in the position covered by anti-adhesion plate 4 and evaporation source baffle 5.In the present embodiment, by the crucible
It is set as the first crucible 3.
In addition, in the present embodiment, by being formed between the second crucible 2 and the first crucible 3 configured with other crucibles
Positional relationship, thus be configured to reduce preheating and it is main heating respectively heat when heat affecting.
It should be noted that evaporation source baffle 5 by the opening and closing direction of the evaporation source baffle along diagram is moved can
In shielding status.In present embodiment and embodiment 5, for moving evaporation source baffle 5 on opening and closing direction
Rotary shaft as shown in Figure 8 can be located at evaporation source outside (in the circumferential equipped with crucible rotary support member 18 diameter it is outside
Portion), can also as shown in Figure 6 positioned at evaporation source inside (in the circumferential equipped with crucible rotary support member 18 diameter it is inside
Portion).
In the present embodiment, influence of the radiant heat to substrate 7 can also be reduced in the same manner as Embodiments 1 to 5, especially
It is the influence that can reduce the radiant heat of the evaporation source after just terminating vapor deposition.
The embodiment > of the film build method of < film formation device
In the following, referring to Figures 1 and 2 to the film build method for the evaporation source or film formation device for having used present embodiment
An example is illustrated.
The film build method of the present embodiment includes the first crucible 3 of evaporation source 1 and the heating process of the second crucible 2.It is first
First, as preheating process, there are following processes: to the evaporation material stored in the first crucible 3 for being set to preheating position
It is heated, the temperature of crucible is made to rise to process of the evaporation material as the temperature of steam.In addition, as main heating process,
There are following processes: the crucible being heated in preheating process is moved to main heating location, be set as the second crucible 2, maintaining should
Temperature in second crucible 2, so as to maintain to make to be accommodated in evaporation material in second crucible 2 to become the temperature of steam
Process.
In turn, the film build method of the present embodiment includes the evaporation source in the opening setting of the anti-adhesion plate 4 of evaporation source 1
The opening and closing process of baffle 5.Firstly, the masking process as evaporation source baffle 5, there is the vapor deposition being heated made in the second crucible 2
The process that the steam of material is in shielding status.In addition, as open process, there is following processes: evaporation source baffle 5 with prevented it is attached
The first crucible 3 overlapping that covers of plate 4, so that the steam of the evaporation material being heated in the second crucible 2 is in open shape
State, the process to form a film on the substrate 7 kept by substrate supporting frame 8.
As a result, during being formed a film, evaporation source baffle 5 covers the first crucible 3 covered by anti-adhesion plate 4, so as to
A kind of film build method that can reduce influence of the radiant heat from the first crucible 3 to substrate 7 is enough provided.
As a result, due to radiant heat thermal deformation reduces the substrate 7 being able to suppress in film forming so as to cause film-forming accuracy
The situation that situation and the quality of the film to be formed a film are reduced by radiant heat.
The embodiment > of the manufacturing method of < electronic equipment
In the following, being illustrated to an example of the manufacturing method of the electronic equipment for the film build method for using present embodiment.With
Under, as the example of electronic equipment, instantiate the structure and manufacturing method of organic EL display device.
Firstly, being illustrated to the organic EL display device to be manufactured.Fig. 9 (a) is the entirety of organic EL display device 60
Figure, Fig. 9 (b) indicate the profile construction of 1 pixel.
As shown in Fig. 9 (a), the display area of organic EL display device 60 61 be arranged in a matrix it is multiple have it is multiple
The pixel 62 of light-emitting component.Each light-emitting component has the construction for having the organic layer clamped by a pair of electrodes, and details will
It is explained below.It should be noted that pixel described herein refers to show desired face in display area 61
The minimum unit of color.In the case where the organic EL display device of the present embodiment, by showing mutually different luminous first
Light-emitting component 62R, the second light-emitting component 62G, the 3rd light-emitting component 62B combination and constitute pixel 62.Pixel 62 is mostly sent out by red
Optical element, green luminousing element, blue light emitting device combination and constitute but it is also possible to be yellow emitting light elements, cyan shine
The combination of element, white-light luminescent component, as long as more than at least one kind of color being not particularly limited.
Fig. 9 (b) is the partial cutaway schematic at the A-B line of Fig. 9 (a).Pixel 62 has organic EL element, this is organic
EL element on substrate 63 with first electrode (anode) 64, hole transporting layer 65, luminescent layer 66R, 66G, 66B any layer,
Electron supplying layer 67 and second electrode (cathode) 68.Wherein, hole transporting layer 65, luminescent layer 66R, 66G, 66B, electronics are defeated
Layer 67 is sent to be equivalent to organic layer.In addition, in the present embodiment, luminescent layer 66R is the organic EL layer of rubescent color, luminescent layer 66G
It is the organic EL layer of green-emitting, luminescent layer 66B is the organic EL layer of color of turning blue.Luminescent layer 66R, 66G, 66B are formed and are sent out respectively
Red out, green, blue the corresponding pattern of light-emitting component (being also described as organic EL element sometimes).In addition, first electrode
64 are formed separately according to each light-emitting component.Hole transporting layer 65, electron supplying layer 67 and second electrode 68 both can be with
A plurality of light-emitting elements 62R, 62G, 62B are collectively formed, and can also be formed according to each light-emitting component.It should be noted that in order to
It prevents first electrode 64 and second electrode 68 short-circuit due to foreign matter, insulating layer 69 is equipped between first electrode 64.In addition, due to
Organic EL layer can aging due to moisture, oxygen, therefore be equipped with for protecting organic EL element from moisture, the protective layer of oxygen attack
70。
In order to which organic EL layer is formed as light-emitting component unit, the method to form a film via mask is used.In recent years, it shows
The High precision of showing device continues to develop, the mask for the use of opening width being tens of μm when forming organic EL layer.Using this
In the case that the mask of sample is formed a film, thermal deformation occurs if mask is heated from evaporation source in film forming procedure, mask
It can deviate with the position of substrate, the pattern of the film formed on substrate can deviate to be formed from desired position.Therefore,
It is preferable to use film formation device of the invention (vacuum deposition apparatus) in the film forming of above-mentioned organic EL layer.
In the following, illustrating the example of the manufacturing method of organic EL display device.
Firstly, preparing the base for being formed with the circuit (not shown) for driving organic EL display device and first electrode 64
Plate 63.
On the substrate 63 for be formed with first electrode 64 using spin coating formed acrylic resin, and utilize photoetching process, with
The part for being formed with first electrode 64 forms the mode being open and is patterned to acrylic resin and form insulating layer 69.This is opened
Oral area is equivalent to the practical light emitting region to shine of light-emitting component.
The substrate 63 that insulating layer 69 has been patterned inputs the first film formation device, keeps substrate using substrate supporting frame,
Hole transporting layer 65 is formed a film in the first electrode of display area 64 as common layer.Hole transporting layer 65 passes through
Vacuum evaporation forms a film.Since actually hole transporting layer 65 is formed as the size bigger than display area 61, do not need
The mask of fine.
Then, the substrate 63 formed to hole transporting layer 65 is inputted into the second film formation device, is carried out using substrate supporting frame
It keeps.The alignment for carrying out substrate and mask, by substrate-placing on mask, in the portion of the element of the rubescent color of configuration of substrate 63
It is divided into the luminescent layer 66R of the rubescent color of film.According to this example, mask and substrate can be made to be overlapped well, be able to carry out high-precision
Film forming.
In the same manner as the film forming of luminescent layer 66R, the luminescent layer 66G, Jin Erli of third film formation device film forming green-emitting are utilized
It is turned blue the luminescent layer 66B of color with the 4th film formation device film forming.After the film forming of luminescent layer 66R, 66G, 66B terminate, is utilized
Whole film forming electron supplying layer 67 of five film formation devices in display area 61.Electron supplying layer 67 for 3 colors luminescent layer 66R,
66G, 66B are formed as common layer.
It is moved to spraying and splashing facility by being formed to the substrate of electron supplying layer 65, form a film second electrode 68, is moved to later
Ion CVD device and the protective layer 70 that forms a film complete organic EL display device 60.
Film forming after inputting film formation device from the substrate 63 for being patterned insulating layer 69 to protective layer 70 terminates
Only, if be exposed to comprising moisture, oxygen atmosphere in, the luminescent layer being made of organic EL Material is possible to due to moisture, oxygen
Aging.Thus, in this example, it is defeated that input of the substrate between film formation device is carried out under vacuum or non-active gas atmosphere
Out.
The organic EL display device obtained in this way accurately forms luminescent layer according to each light-emitting component.Thus, if
Using above-mentioned manufacturing method, then be able to suppress causes organic EL display device generation bad because the position of luminescent layer is deviateed.
It should be noted that above-described embodiment shows an example of the invention, the structure that the present invention is not limited to the above embodiments,
It can of course suitably be deformed in the range of its technical concept.For example, in the above-described embodiments, making substrate using substrate supporting frame
It is mobile, but can also make mobile as the mask or substrate of bearing member and mask both sides.In this case, in addition to the shifting of substrate
Outside motivation structure, the mobile mechanism of bearing member is set.
Claims (15)
1. a kind of evaporation source, comprising:
Multiple crucibles, the multiple crucible include the first crucible and the second crucible, store evaporation material；
Anti-adhesion plate, the anti-adhesion plate covers first crucible, and has opening on second crucible；And
Second crucible is set as shielding status by changing position by movable evaporation source baffle, the evaporation source baffle
Or open state,
The evaporation source is characterized in that,
When second crucible is set as open state by the evaporation source baffle, the evaporation source baffle and the anti-adhesion plate
And it is overlapped by the first crucible that the anti-adhesion plate covers.
2. evaporation source according to claim 1, which is characterized in that
The multiple crucible is made of first crucible, second crucible and other crucibles.
3. evaporation source according to claim 1 or 2, which is characterized in that
The cooling body of the cooling evaporation source baffle is equipped in the evaporation source baffle.
4. evaporation source according to claim 3, which is characterized in that
The face opposite with the multiple crucible of the evaporation source baffle is compared to the evaporation source baffle and the multiple earthenware
The face of the opposite side in the opposite face of crucible, thermal conductivity is high or radiance is high.
5. evaporation source according to claim 1 or 2, which is characterized in that
The reflecting mechanism of reflective thermal is equipped on the face opposite with the multiple crucible of the evaporation source baffle.
6. evaporation source according to claim 1 or 2, which is characterized in that
The multiple crucible is arranged on the mobile supporting mass that can be moved,
Using the movement of the mobile supporting mass, it is used to carry out pre-add by the way that a crucible in the multiple crucible to be configured at
Heat position and a crucible is set as first crucible, by the way that another crucible in the multiple crucible is configured at
Another crucible is set as second crucible for carrying out the position of main heating.
7. evaporation source according to claim 1 or 2, which is characterized in that
The multiple crucible is arranged along the circumferential direction for the rotary support member that can be rotated,
Using the rotation of the rotary support member, it is used to carry out pre-add by the way that a crucible in the multiple crucible to be configured at
Heat position and a crucible is set as first crucible, by the way that another crucible in the multiple crucible is configured at
Another crucible is set as second crucible for carrying out the position of main heating.
8. evaporation source according to claim 1 or 2, which is characterized in that
The multiple crucible is arranged on the mobile supporting mass that can be moved,
Using the movement of the mobile supporting mass, it is used to become just knot by the way that a crucible in the multiple crucible to be configured at
The position of beam vapor deposition rear and a crucible is set as first crucible, by by another in the multiple crucible
Crucible is configured at the position for carrying out main heating and another crucible is set as second crucible.
9. evaporation source according to claim 1 or 2, which is characterized in that
The multiple crucible is arranged along the circumferential direction for the rotary support member that can be rotated,
Using the rotation of the rotary support member, it is used to become just knot by the way that a crucible in the multiple crucible to be configured at
The position of beam vapor deposition rear and a crucible is set as first crucible, by by another in the multiple crucible
Crucible is configured at the position for carrying out main heating and another crucible is set as second crucible.
10. a kind of film formation device characterized by comprising
Evaporation source of any of claims 1 or 2；
In the substrate supporting frame of the position configuration substrate opposite with the evaporation source；And
Between the substrate supporting frame and the evaporation source, by the substrate of the substrate supporting frame relative to the evaporation
Source device is set as the substrate baffle of open state or closed state.
11. a kind of film build method is being set to and the evaporation source using evaporation source described in as claimed in claim 1 or 22
Film forming is accommodated in the evaporation material of the crucible on the substrate of opposite position,
The film build method is characterised by comprising:
The evaporation material stored in first crucible is heated, the temperature of crucible is made to rise to evaporation material as steam
Temperature preheating process；
The evaporation material stored in second crucible is maintained to become the main heating process of temperature of steam；
The steam of the evaporation material being heated in second crucible is set to be in the masking process of shielding status；And
The evaporation source baffle is made in second crucible and Chong Die with the first crucible covered by the anti-adhesion plate
The steam for the evaporation material being heated is in open state, with the opening process to form a film on the substrate.
12. the manufacturing method of a kind of electronic equipment, which has the organic film being formed on substrate, the electronic equipment
Manufacturing method be characterized in that,
The organic film is formed by the film build method described in claim 11.
13. the manufacturing method of a kind of electronic equipment, which has the metal film being formed on substrate, the electronic equipment
Manufacturing method be characterized in that,
The metal film is formed by the film build method described in claim 11.
14. the manufacturing method of electronic equipment according to claim 12, which is characterized in that
The electronic equipment is the display panel of organic EL display device.
15. the manufacturing method of electronic equipment according to claim 13, which is characterized in that
The electronic equipment is the display panel of organic EL display device.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2017-0144276 | 2017-10-31 | ||
| KR1020170144276A KR101901072B1 (en) | 2017-10-31 | 2017-10-31 | Evaporation source device, film formation apparatus, film formation method and manufacturing method of electronic device |
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| Publication Number | Publication Date |
|---|---|
| CN109722635A true CN109722635A (en) | 2019-05-07 |
| CN109722635B CN109722635B (en) | 2021-11-16 |
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| CN201810844797.1A Active CN109722635B (en) | 2017-10-31 | 2018-07-27 | Evaporation source device, film forming method, and method for manufacturing electronic device |
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| Country | Link |
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| JP (1) | JP2019081949A (en) |
| KR (1) | KR101901072B1 (en) |
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| CN111004998A (en) * | 2019-12-05 | 2020-04-14 | 深圳市华星光电半导体显示技术有限公司 | Evaporation device and preparation method of mask plate thereof |
| CN112442660A (en) * | 2019-09-02 | 2021-03-05 | 佳能特机株式会社 | Shutter device, film forming apparatus, film forming method, and method of manufacturing electronic device |
| CN112824558A (en) * | 2019-11-20 | 2021-05-21 | 佳能特机株式会社 | Film forming apparatus, film forming method using film forming apparatus, and method for manufacturing electronic device |
| CN112831753A (en) * | 2019-11-25 | 2021-05-25 | 合肥欣奕华智能机器有限公司 | Multiple evaporation source shelters from mechanism and film evaporation equipment |
| CN113088918A (en) * | 2021-04-19 | 2021-07-09 | 辽宁分子流科技有限公司 | Intelligent evaporation coating machine |
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Also Published As
| Publication number | Publication date |
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| CN109722635B (en) | 2021-11-16 |
| KR101901072B1 (en) | 2018-09-20 |
| JP2019081949A (en) | 2019-05-30 |
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