CN114622165B

CN114622165B - Film forming apparatus, film forming method, and method for manufacturing electronic device

Info

Publication number: CN114622165B
Application number: CN202111437356.8A
Authority: CN
Inventors: 砂川贵宏; 佐藤功康
Original assignee: Canon Tokki Corp
Current assignee: Canon Tokki Corp
Priority date: 2020-12-10
Filing date: 2021-11-30
Publication date: 2023-10-31
Anticipated expiration: 2041-11-30
Also published as: JP2022092406A; KR20220082739A; CN114622165A; JP7216064B2

Abstract

The invention provides a film forming apparatus, a film forming method and a manufacturing method of an electronic device, which can improve the maintenance operation performance of an adhesion preventing plate and prevent the reduction of the adhesion preventing performance. The film forming apparatus includes: a vapor deposition source for discharging a vapor deposition material to a substrate; and an adhesion preventing plate unit for limiting a discharge range of the vapor deposition material from the vapor deposition source, wherein the adhesion preventing plate unit includes a plurality of adhesion preventing plates disposed adjacent to each other in a circumferential direction of the vapor deposition source, and edges of the adjacent adhesion preventing plates in the circumferential direction overlap each other.

Description

Film forming apparatus, film forming method, and method for manufacturing electronic device

Technical Field

The present invention relates to a film forming apparatus, a film forming method, and a method for manufacturing an electronic device.

Background

In the manufacture of organic EL displays and the like, vapor deposition substances such as organic materials and metal materials are deposited on a substrate using a mask. There is known a device in which an adhesion preventing plate is provided around a vapor deposition source in order to prevent vapor deposition material discharged from the vapor deposition source from adhering to the inner wall of a chamber or other mechanism (patent document 1).

Prior art literature

Patent literature

Patent document 1: japanese patent application laid-open No. 2012-77375

As the deposition of the vapor deposition substance progresses, the deposition preventing plate is cleaned or replaced. In a large-sized film forming apparatus, the size of the adhesion preventing plate also increases, and the maintenance workability thereof deteriorates. In order to improve maintenance workability, it is generally considered to arrange adhesion preventing plates of small size, but there is a case where vapor deposition substances leak out from gaps between adjacent adhesion preventing plates, resulting in degradation of adhesion preventing performance.

Disclosure of Invention

The invention provides a technology capable of improving maintenance workability of an adhesion preventing plate and preventing adhesion performance from being reduced.

Means for solving the problems

According to the present invention, there is provided a film forming apparatus comprising:

a vapor deposition source for discharging a vapor deposition material to a substrate; and

an adhesion preventing plate unit for limiting the discharge range of the vapor deposition material from the vapor deposition source,

it is characterized in that the method comprises the steps of,

the adhesion preventing plate unit comprises a plurality of adhesion preventing plates adjacently arranged in the circumferential direction of the vapor deposition source,

the peripheral edges of the adjacent adhesion preventing plates overlap each other.

Further, according to the present invention, there is provided a film forming method using an in-line type film forming apparatus which includes a conveying device for conveying the substrate and performs vapor deposition while conveying the substrate by the conveying device,

The film forming method comprises the following steps:

a conveying step of conveying the substrate by the conveying device; and

and a vapor deposition step of vapor-depositing the transported substrate by the vapor deposition source.

Further, according to the present invention, there is provided a method for manufacturing an electronic device, comprising using a film forming apparatus having a transport device for transporting the substrate and performing vapor deposition while transporting the substrate by the transport device,

the manufacturing method of the electronic device comprises the following steps:

a conveying step of conveying the substrate by the conveying device; and

ADVANTAGEOUS EFFECTS OF INVENTION

According to the present invention, it is possible to prevent deterioration of the adhesion preventing performance while improving the maintenance workability of the adhesion preventing plate.

Drawings

FIG. 1 is a front view of a film forming apparatus according to an embodiment of the present invention.

Fig. 2 is a side view of the film forming apparatus of fig. 1.

Fig. 3 is an explanatory diagram showing an internal structure of the film forming apparatus of fig. 1.

Fig. 4 (a) to (C) are explanatory diagrams of movement operations of the vapor deposition device by the movement device.

Fig. 5 is a perspective view and a partial enlarged view of the upper and lower adhesion preventing plate units.

Fig. 6 is an explanatory view of each supporting structure of the upper and lower adhesion preventing plate unit of fig. 5.

Fig. 7 (a) is an explanatory view of a fixing structure between the adhesion preventing plates, (B) is a perspective view of the mounting portion, and (C) is an explanatory view of a fixing structure of the support member and the mounting portion.

Fig. 8 is a view showing a state in which a part of the adhesion preventing plate is detached.

Fig. 9 is a diagram showing a state in which the upper adhesion preventing plate unit of fig. 5 is detached in units of units.

Fig. 10 is a diagram showing a state in which the lower adhesion preventing plate unit of fig. 5 is detached in units of units.

Fig. 11 (a) is an overall view of the organic EL display device, and (B) is a view showing a cross-sectional structure of 1 pixel.

Fig. 12 (a) to (C) are diagrams showing another example of the overlapping structure of the edge portions.

Description of the reference numerals

1 a film forming apparatus, 2 a conveying apparatus, 3 a vapor deposition apparatus, 6 a vapor deposition source, 7 an adhesion preventing plate unit, and 8 an adhesion preventing plate unit.

Detailed Description

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. The following embodiments do not limit the invention according to the claims. In the embodiments, a plurality of features are described, but all of the plurality of features are not limited to the features necessary for the invention, and a plurality of features may be arbitrarily combined. In the drawings, the same or similar structures are denoted by the same reference numerals, and repetitive description thereof will be omitted.

[ outline of film Forming apparatus ]

Fig. 1 is a front view of a film forming apparatus 1 according to an embodiment of the present invention, and fig. 2 is a side view of the film forming apparatus 1. Fig. 3 is an explanatory diagram showing an internal structure of the film forming apparatus 1. In each figure, arrows X and Y indicate mutually orthogonal horizontal directions, and arrow Z indicates a vertical direction (vertical direction). The film forming apparatus 1 includes a conveyor 2 and a plurality of vapor deposition devices 3. The plurality of vapor deposition devices 3 are arranged in the X direction, and the conveying device 2 is supported by the frame 4 so as to be positioned above the vapor deposition devices 3. The frame 4 includes a plurality of columns 4a and a plurality of beams 4b supported by the plurality of columns 4a, and the conveying device 2 is fixed to the beams 4b.

The conveying device 2 includes a conveying chamber 20 in which a conveying chamber 20c that is maintained in vacuum during use is formed. A carry-in port 20a is provided at one end of the transfer chamber 20 in the X direction, and a carry-out port 20b is provided at the other end, so that the object to be processed is carried into the transfer chamber 20c from the carry-in port 20a, and is carried out from the carry-out port 20b to the outside after processing. Gate valves are provided at the carry-in port 20a and the carry-out port 20 b.

The conveyance chamber 20c is provided with a plurality of conveyance rollers 21 aligned in the X direction. The rows of the conveying rollers 21 are arranged in two rows separated in the Y direction. Each of the conveying rollers 21 rotates about a rotation axis in the Y direction. The object to be conveyed is placed on two rows of the conveying rollers 21 at both ends in the Y direction, and is conveyed in a horizontal posture in the X direction by the rotation of the conveying rollers 21. In the present embodiment, the roller mechanism is used as the conveying mechanism for the object to be processed, but other kinds of conveying mechanisms such as magnetic levitation conveying may be used.

Each vapor deposition apparatus 3 includes a source chamber 3a that forms an internal space that is maintained in vacuum during use. The source chamber 3a has a box shape with an opening formed in an upper portion, and the transfer chamber 20c and the internal space of the source chamber 3a communicate through the opening. The vapor deposition device 3 includes a vapor deposition source 6 that emits a vapor deposition material 6a upward. The vapor deposition source 6 according to the present embodiment is a so-called line source, and is provided so as to extend in a direction (in the present embodiment, the Y direction orthogonal to the conveyance direction) intersecting the conveyance direction (X direction) of the object to be processed in the conveyance device 2. The vapor deposition source 6 includes a crucible for storing a material of the vapor deposition material 6a, a heater for heating the crucible, and the like, and heats the material to discharge the vapor deposition material as vapor into the transport chamber 20c.

Around the vapor deposition source 6, adhesion preventing plate units 7 and 8 are provided. The adhesion preventing plate units 7 and 8 constitute shielding walls for limiting the discharge range so that the vapor deposition material 6a from the vapor deposition source 6 does not adhere to the wall portion of the source chamber 3a or other mechanism around the wall portion. The adhesion preventing plate unit 8 is located at the lower side, the adhesion preventing plate unit 7 is located at the upper side, and the upper portion of the adhesion preventing plate unit 7 enters the conveyance chamber 20c. In the case of the present embodiment, the adhesion preventing plate units 7 and 8 are supported by the source chamber 3a. In the present embodiment, the two units 7 and 8 are used as the adhesion preventing plate unit, but one unit may be used.

The film forming apparatus 1 is an in-line film forming apparatus capable of performing a film forming method of depositing a vapor deposition material (vapor deposition process) on a processing object by a vapor deposition apparatus 3 while conveying the processing object by a conveying apparatus 2 (conveying process). The film forming apparatus 1 is applicable to, for example, a manufacturing apparatus that performs a manufacturing method for manufacturing an electronic device such as a display device (flat panel display or the like), a thin film solar cell, an organic photoelectric conversion element (organic thin film image pickup element), or an electronic device such as an optical member. In fig. 3, a substrate 10 is illustrated as a processing target. The substrate 10 is transported in the X direction together with the mask 11, and a thin film of the vapor deposition material having a predetermined pattern can be formed on the substrate 100 by vapor deposition of the vapor deposition material on the substrate 10 through the mask 11 positioned below the substrate 10. The substrate 10 is a plate made of a material such as glass, resin, or metal, and the vapor deposition material is an organic material, an inorganic material (metal, metal oxide, or the like), or the like.

In the present embodiment, the plurality of vapor deposition devices 3 are arranged along the conveyance direction of the substrate 10. When different types of vapor deposition materials are discharged by the vapor deposition device 3, the different vapor deposition materials can be continuously deposited on the substrate 10. The number of vapor deposition devices 3 is not limited to 3, and may be 1 or 2, or may be 4 or more.

Each vapor deposition device 3 is provided with a moving device 7 for moving the vapor deposition device 3. By moving the vapor deposition device 3, maintenance thereof is facilitated. In addition, maintenance of the conveying device 2 is also facilitated. The moving device 7 includes a traveling unit 5a and a pair of elevating units 5b. The traveling unit 5a includes, for example, a driving source such as a motor and wheels that roll by the driving force of the driving source, and is capable of reciprocating in the Y direction along a guide portion 5c such as a rail member that is laid on the floor of the factory. A pair of lifting units 5b are mounted on the traveling unit 5a. The vapor deposition device 3 is located between a pair of elevating units 5b, and is elevated by the pair of elevating units 5b. Each of the elevating units 5b includes a driving source such as a motor and a mechanism for elevating the vapor deposition device 3 by a driving force of the driving source, and the pair of elevating units 5b are driven in synchronization.

Fig. 4 is an explanatory view of the movement operation of the vapor deposition device 3 by the movement device 7. Fig. 4 (a) shows a state in which the vapor deposition device 3 is located at a position during the film formation process. In this position, the vapor deposition device 3 and the conveying device 2 are in the positional relationship of fig. 3. When the vapor deposition device 3 is moved, as shown in fig. 4 (B), the vapor deposition device 3 is lowered downward from the position shown in fig. 4 (a) by a pair of elevating units 5B. Thereby, the adhesion preventing plate unit 7 having the upper portion entered the conveyance chamber 20c is retracted from the conveyance chamber 20 c. Next, the travel unit 5a is driven to move the vapor deposition device 3 in the Y direction. As a result, as shown in fig. 4 (C), the vapor deposition device 3 moves to a position offset in the Y direction from the lower side of the conveyor 2. The conveyor 2 and the vapor deposition device 3 are exposed to the inside, and maintenance of them can be performed efficiently.

[ adhesion-preventing plate Unit ]

The structure of the adhesion preventing plate units 7 and 8 will be described with reference to fig. 3 and 5. Fig. 5 is a perspective view and a partially enlarged view of the adhesion preventing plate units 7 and 8. The adhesion preventing plate unit 7 is a cylindrical member formed to surround a discharge space of the vapor deposition material from the vapor deposition source 6 to the substrate 10 (in other words, a space above the vapor deposition source 6), and is made of metal, for example. In the present embodiment, the vapor deposition source 6 is a line source extending in the Y direction, and therefore, the adhesion preventing plate unit 7 has a prismatic shape (in the present embodiment, a rectangular shape as a whole in a plan view) along the shape of the vapor deposition source 6.

The adhesion preventing plate unit 8 is a cylindrical member formed to surround the discharge space of the vapor deposition material from the vapor deposition source 6 to the substrate 10 and the vapor deposition source 6, and is made of metal, for example. In the case of the present embodiment, the adhesion preventing plate unit 8 has a prismatic shape as in the adhesion preventing plate unit 7. The lower end portion of the adhesion preventing plate unit 7 enters the inside of the adhesion preventing plate unit 8, and the lower end portion of the adhesion preventing plate unit 7 and the upper end portion of the adhesion preventing plate unit 8 overlap each other in the vertical direction (Z direction). This eliminates the gap in the Z direction between the adhesion preventing plate unit 7 and the adhesion preventing plate unit 8, and can prevent the vapor deposition material from leaking out from between the adhesion preventing plate unit 7 and the adhesion preventing plate unit 8.

[ adhesion-preventing plate Unit 7]

The structure of the adhesion preventing plate unit 7 will be described in detail. The adhesion preventing plate unit 7 includes a plurality of adhesion preventing plates 71 to 78 arranged in a row in the circumferential direction (X direction and Y direction in the present embodiment) of the vapor deposition source 6. By configuring the adhesion preventing plate unit 7 by the plurality of adhesion preventing plates 71 to 78, the size of each adhesion preventing plate can be reduced, and maintenance workability in cleaning or replacement can be improved in units of adhesion preventing plates. The adhesion preventing plate unit 7 has a pair of long side portions along the extending direction (Y direction in the present embodiment) of the vapor deposition source 6 and a pair of short side portions along the direction intersecting the extending direction (X direction in the present embodiment), the pair of long side portions being formed by the adhesion preventing plates 72 to 77, and the pair of short side portions being formed by the adhesion preventing plates 71 and 78, in a plan view.

Here, when the adhesion preventing plates are arranged to form the adhesion preventing plate unit 7, the vapor deposition substance may leak from the gaps between adjacent adhesion preventing plates. In the present embodiment, the edges of the adhesion preventing plates adjacent to each other in the circumferential direction of the vapor deposition source 6 overlap each other in the circumferential direction of the vapor deposition source 6, and thus, the gap between the adjacent adhesion preventing plates can be eliminated to prevent leakage of the adhesion preventing substance. A structural example adopted in the present embodiment will be described.

Focusing on the P1 part. The adhesion preventing plate 72 and the adhesion preventing plate 74 are adjacent to each other in the circumferential direction (Y direction) of the vapor deposition source 6, and the edges thereof overlap in the Y direction. The adhesion preventing plate 72 has a plate-like body portion 72a and an overlapping portion 72b which are L-shaped in plan view. The overlapping portion 72b is formed as an edge portion overlapping the adhesion preventing plate 74, and is formed so as to be offset inward of the adhesion preventing plate unit 7 in the plate thickness direction (in this case, the X direction) of the body portion 72a with respect to the body portion 72 a. The edge of the plate-like body portion 74a of the adhesion preventing plate 74 overlaps the overlapping portion 72b. The abutting portion of the adhesion preventing plate 72 and the adhesion preventing plate 74 is formed in a labyrinth structure having an L-shaped gap in a plan view, and prevents the vapor deposition material from leaking from the inside to the outside of the adhesion preventing plate unit 7. Since the overlapping portion 72b is located inside the adhesion preventing plate unit 7 with respect to the body portion 72a, the body portion 72a of the adhesion preventing plate 72 is coplanar with the outer surface of the body portion 74a of the adhesion preventing plate 74. Since a gap may be formed in the Y direction between the body portion 72a of the adhesion preventing plate 72 and the body portion 74a of the adhesion preventing plate 74, the positional accuracy in the Y direction between the adhesion preventing plate 72 and the adhesion preventing plate 74 is relaxed, and the workability of assembling the adhesion preventing plate unit 7 is improved.

Focusing on the P2 part. The adhesion preventing plate 74 and the adhesion preventing plate 76 are adjacent to each other in the circumferential direction (Y direction) of the evaporation source 6, and the edges thereof overlap in the Y direction. The adhesion preventing plate 74 has a plate-like body portion 74a and an overlapping portion 74b. The overlapping portion 74b is formed as an edge portion overlapping the adhesion preventing plate 76, and is formed so as to be offset inward of the adhesion preventing plate unit 7 in the plate thickness direction (in this case, the X direction) of the body portion 74a with respect to the body portion 74 a. The edge of the L-shaped body 76a of the adhesion preventing plate 76 overlaps the overlapping portion 74b in a plan view. The abutting portion of the adhesion preventing plate 74 and the adhesion preventing plate 76 is formed in a labyrinth structure having an L-shaped gap in a plan view, and prevents the vapor deposition material from leaking from the inside to the outside of the adhesion preventing plate unit 7. Since the overlapping portion 74b is located inside the adhesion preventing plate unit 7 with respect to the body portion 74a, the body portion 74a of the adhesion preventing plate 74 is coplanar with the outer surface of the body portion 76a of the adhesion preventing plate 76. Since a gap may be formed in the Y direction between the body portion 74a of the adhesion preventing plate 74 and the body portion 76a of the adhesion preventing plate 76, the positional accuracy in the Y direction between the adhesion preventing plate 74 and the adhesion preventing plate 76 is relaxed, and the workability of assembling the adhesion preventing plate unit 7 is improved.

Focusing on the P3 part. The adhesion preventing plates 73 and 75 are adjacent in the circumferential direction (Y direction) of the evaporation source 6, and the edges thereof overlap in the Y direction. The adhesion preventing plate 75 has a plate-like main body portion 75a and an overlapping portion 75b. The overlapping portion 75b is formed as an edge portion overlapping the adhesion preventing plate 73, and is formed so as to be offset inward of the adhesion preventing plate unit 7 with respect to the main body portion 75a in the plate thickness direction (in this case, the X direction) of the main body portion 75 a. The adhesion preventing plate 73 overlaps the overlapping portion 75b at the edge of the L-shaped body 73a in a plan view. The abutting portion of the adhesion preventing plate 73 and the adhesion preventing plate 75 is formed in a labyrinth structure having an L-shaped gap in a plan view, and prevents the vapor deposition material from leaking from the inside to the outside of the adhesion preventing plate unit 7. Since the overlapping portion 75b is located inside the adhesion preventing plate unit 7 with respect to the body portion 75a, the body portion 73a of the adhesion preventing plate 73 is coplanar with the outer surface of the body portion 75a of the adhesion preventing plate 75. Since a gap may be formed in the Y direction between the body portion 73a of the adhesion preventing plate 73 and the body portion 75a of the adhesion preventing plate 75, the positional accuracy in the Y direction between the adhesion preventing plate 73 and the adhesion preventing plate 75 is relaxed, and the workability of assembling the adhesion preventing plate unit 7 is improved.

Focusing on the P4 part. The adhesion preventing plate 75 is adjacent to the adhesion preventing plate 77 in the circumferential direction (Y direction) of the evaporation source 6, and the edges thereof overlap in the Y direction. The adhesion preventing plate 77 has a plate-like body portion 77a and an overlapping portion 77b which are L-shaped in plan view. The overlapping portion 77b is formed as an edge portion overlapping the adhesion preventing plate 75, and is formed so as to be offset inward of the adhesion preventing plate unit 7 with respect to the body portion 77a in the plate thickness direction (in this case, the X direction) of the body portion 77 a. The edge of the plate-like body portion 75a of the adhesion preventing plate 75 overlaps the overlapping portion 77b. The abutting portion of the adhesion preventing plate 75 and the adhesion preventing plate 77 is formed in a labyrinth structure having an L-shaped gap in a plan view, and prevents the vapor deposition material from leaking from the inside to the outside of the adhesion preventing plate unit 7. Since the overlapping portion 77b is located inside the adhesion preventing plate unit 7 with respect to the body portion 77a, the body portion 77a of the adhesion preventing plate 77 is coplanar with the outer surface of the body portion 75a of the adhesion preventing plate 75. Since a gap may exist between the body portion 75a of the adhesion preventing plate 75 and the body portion 77a of the adhesion preventing plate 77 in the Y direction, the positional accuracy in the Y direction of the adhesion preventing plate 75 and the adhesion preventing plate 77 is relaxed, and the workability of assembling the adhesion preventing plate unit 7 is improved.

Focusing on the P5 part. The adhesion preventing plate 71 is adjacent to the adhesion preventing plate 72 in the circumferential direction (X direction) of the evaporation source 6, and the edges thereof overlap in the X direction. The adhesion preventing plate 72 has a plate-like body portion 72a and an overlapping portion 72b which are L-shaped in plan view. That is, the adhesion preventing plate 72 has overlapping portions 72b at both edges in the circumferential direction of the vapor deposition source 6. The overlapping portion 72b is formed as an edge portion overlapping the adhesion preventing plate 71, and is formed so as to be offset inward of the adhesion preventing plate unit 7 with respect to the body portion 72a in the plate thickness direction (here, Y direction) of the body portion 72 a. The edge of the plate-like body portion 71a of the adhesion preventing plate 71 overlaps the overlapping portion 72b. The abutting portion of the adhesion preventing plate 71 and the adhesion preventing plate 72 is formed in a labyrinth structure having an L-shaped gap in a plan view, and prevents the vapor deposition material from leaking from the inside to the outside of the adhesion preventing plate unit 7. Since the overlapping portion 72b is located inside the adhesion preventing plate unit 7 with respect to the body portion 72a, the body portion 71a of the adhesion preventing plate 71 is coplanar with the outer surface of the body portion 72a of the adhesion preventing plate 72. Since a gap may exist between the body portion 71a of the adhesion preventing plate 71 and the body portion 72a of the adhesion preventing plate 72 in the X direction, the positional accuracy of the adhesion preventing plate 71 and the adhesion preventing plate 72 in the X direction is relaxed, and the workability of assembling the adhesion preventing plate unit 7 is improved.

Focusing on the P6 part. The adhesion preventing plate 71 is adjacent to the adhesion preventing plate 73 in the circumferential direction (X direction) of the evaporation source 6, and the edges thereof overlap in the X direction. The adhesion preventing plate 73 has a plate-like body portion 73a and an overlapping portion 73b which are L-shaped in plan view. The overlapping portion 73b is formed as an edge portion overlapping the adhesion preventing plate 71, and is formed so as to be offset inward of the adhesion preventing plate unit 7 with respect to the main body portion 73a in the plate thickness direction (here, Y direction) of the main body portion 73 a. The edge of the plate-like body portion 71a of the adhesion preventing plate 71 overlaps the overlapping portion 73b. That is, the adhesion preventing plate 71 does not have an overlapping portion. The abutting portion of the adhesion preventing plate 71 and the adhesion preventing plate 73 is formed in a labyrinth structure having an L-shaped gap in a plan view, and prevents the vapor deposition material from leaking from the inside to the outside of the adhesion preventing plate unit 7. Since the overlapping portion 73b is located inside the adhesion preventing plate unit 7 with respect to the body portion 73a, the body portion 71a of the adhesion preventing plate 71 is coplanar with the outer surface of the body portion 73a of the adhesion preventing plate 73. Since a gap may exist between the body portion 71a of the adhesion preventing plate 71 and the body portion 73a of the adhesion preventing plate 73 in the X direction, the positional accuracy of the adhesion preventing plate 71 and the adhesion preventing plate 73 in the X direction is relaxed, and the workability of assembling the adhesion preventing plate unit 7 is improved.

Focusing on the P7 part. The adhesion preventing plate 76 is adjacent to the adhesion preventing plate 78 in the circumferential direction (X direction) of the vapor deposition source 6, and the edges thereof overlap in the X direction. The adhesion preventing plate 76 has a plate-like body portion 76a and an overlapping portion 76b which are L-shaped in plan view. The overlapping portion 76b is formed as an edge portion overlapping the adhesion preventing plate 71, and is formed so as to be offset inward of the adhesion preventing plate unit 7 in the plate thickness direction (here, Y direction) of the body portion 76a with respect to the body portion 76 a. The edge of the plate-like body portion 78a of the adhesion preventing plate 78 overlaps the overlapping portion 76b. The abutting portion of the adhesion preventing plate 76 and the adhesion preventing plate 78 is formed in a labyrinth structure having an L-shaped gap in a plan view, and prevents the vapor deposition material from leaking from the inside to the outside of the adhesion preventing plate unit 7. Since the overlapping portion 76b is located inside the adhesion preventing plate unit 7 with respect to the body portion 76a, the body portion 76a of the adhesion preventing plate 76 is coplanar with the outer surface of the body portion 78a of the adhesion preventing plate 78. Since a gap may exist between the body portion 76a of the adhesion preventing plate 76 and the body portion 78a of the adhesion preventing plate 78 in the X direction, the positional accuracy of the adhesion preventing plate 76 and the adhesion preventing plate 78 in the X direction is relaxed, and the workability of assembling the adhesion preventing plate unit 7 is improved.

Focusing on the P8 part. The adhesion preventing plate 77 is adjacent to the adhesion preventing plate 78 in the circumferential direction (X direction) of the vapor deposition source 6, and its edge overlaps in the X direction. The adhesion preventing plate 77 has a plate-like body portion 77a and an overlapping portion 77b which are L-shaped in plan view. That is, the adhesion preventing plate 77 has overlapping portions 72b at both edges in the circumferential direction of the vapor deposition source 6. The overlapping portion 77b is formed as an edge portion overlapping the adhesion preventing plate 78, and is formed so as to be offset inward of the adhesion preventing plate unit 7 with respect to the body portion 77a in the plate thickness direction (here, Y direction) of the body portion 77 a. The edge of the plate-like body portion 78a of the adhesion preventing plate 78 overlaps the overlapping portion 77b. That is, the adhesion preventing plate 78 does not have an overlapping portion. The abutting portion of the adhesion preventing plate 77 and the adhesion preventing plate 78 is formed in a labyrinth structure having an L-shaped gap in a plan view, and prevents the vapor deposition material from leaking from the inside to the outside of the adhesion preventing plate unit 7. Since the overlapping portion 77b is located inside the adhesion preventing plate unit 7 with respect to the body portion 77a, the body portion 77a of the adhesion preventing plate 77 is coplanar with the outer surface of the body portion 78a of the adhesion preventing plate 78. Since a gap may exist between the body portion 77a of the adhesion preventing plate 77 and the body portion 78a of the adhesion preventing plate 78 in the X direction, the positional accuracy of the adhesion preventing plate 77 and the adhesion preventing plate 77 in the X direction is relaxed, and the workability of assembling the adhesion preventing plate unit 7 is improved.

In the present embodiment, the adhesion preventing plates 71 to 78 include a plurality of adhesion preventing plates, and the adhesion preventing plate unit 7 is configured using a plurality of adhesion preventing plates of the same kind (same structure). Specifically, the adhesion preventing plate 71 and the adhesion preventing plate 78 are used by turning the same type of adhesion preventing plate. The adhesion preventing plate 72 and the adhesion preventing plate 77 are also used by turning the same type of adhesion preventing plate. The adhesion preventing plate 73 and the adhesion preventing plate 76 are used by turning the same type of adhesion preventing plate. The adhesion preventing plate 74 and the adhesion preventing plate 75 are also used by turning the same type of adhesion preventing plate. With this structure, the number of kinds of the adhesion preventing plates can be reduced. In the present embodiment, all of the same kind of adhesion preventing plates are used, but at least some kinds of adhesion preventing plates of 3 or more kinds of the same kind of adhesion preventing plates may be used.

[ adhesion-preventing plate Unit 8]

The construction of the adhesion preventing plate unit 8 will be described in detail. The adhesion preventing plate unit 8 has the same structure as the adhesion preventing plate unit 7. The adhesion preventing plate unit 8 includes a plurality of adhesion preventing plates 81 to 88 arranged in a row in the circumferential direction (X direction and Y direction in the present embodiment) of the vapor deposition source 6. By configuring the adhesion preventing plate unit 8 from the plurality of adhesion preventing plates 81 to 88, the size of each adhesion preventing plate can be reduced, and maintenance workability in cleaning or replacement can be improved in units of adhesion preventing plates. The adhesion preventing plate unit 8 has a pair of long side portions along the extending direction (Y direction in the present embodiment) of the vapor deposition source 6 and a pair of short side portions along the direction intersecting the extending direction (X direction in the present embodiment) in a plan view, the pair of long side portions being formed by the adhesion preventing plates 82 to 87 and the pair of short side portions being formed by the adhesion preventing plates 81 and 88.

In the adhesion preventing plate unit 8, the edges of the adhesion preventing plates adjacent to each other in the circumferential direction of the vapor deposition source 6 are also overlapped with each other, and the structure thereof can be the same as that described for the P1 portion to the P8 portion of the adhesion preventing plate unit 7. However, in the adhesion preventing plate unit 7, the overlapping portions 72b to 77b are arranged inside the adhesion preventing plate unit 7 with respect to the main body portions 72a to 77a, but may be arranged outside the adhesion preventing plate unit 8. According to this configuration, the inner surfaces of the adhesion preventing plate units 8 are flush with each other, and the adhesion preventing plates of the adhesion preventing plate units 8 can be disposed closer to the outer surfaces of the adhesion preventing plate units 7 that are flush with each other. This helps prevent adhesion of the prevention substance from leaking.

Also in the adhesion preventing plate unit 8, the adhesion preventing plates 81 to 88 include a plurality of types of adhesion preventing plates, and are constituted by using a plurality of adhesion preventing plates of the same kind (the same configuration). Specifically, the adhesion preventing plate 81 and the adhesion preventing plate 88 are used by turning the same type of adhesion preventing plate. The adhesion preventing plate 82 and the adhesion preventing plate 87 are also used by turning the same kind of adhesion preventing plate. The adhesion preventing plate 83 and the adhesion preventing plate 86 are used by turning the same type of adhesion preventing plate. The adhesion preventing plate 84 and the adhesion preventing plate 85 are used by turning the same type of adhesion preventing plate. With this structure, the number of kinds of the adhesion preventing plates can be reduced. In the present embodiment, all of the same kind of adhesion preventing plates are used, but at least some kinds of adhesion preventing plates of 3 or more kinds of the same kind of adhesion preventing plates may be used.

[ connection-supporting Structure ]

The connection-support structure of the adhesion preventing plates in the adhesion preventing plate unit 7 and the adhesion preventing plate unit 8 will be described with reference to fig. 5, 6, and 7 (a) to 7 (C). Is a perspective view showing the respective support structures 12, 13 of the adhesion preventing plate unit 7 and the adhesion preventing plate unit 8.

The adhesion preventing plate unit 7 is fixed to the source chamber 3a by a support structure 12. The support structure 12 includes a pair of attachment/detachment support members 12a, a pair of fixed support members 12b, and a plurality of arm members 12c. A rectangular frame is formed by the pair of attachment/detachment support members 12a and the pair of fixed support members 12b, and the adhesion preventing plate unit 7 is located inside the rectangular frame. The attachment/detachment support member 12a is a rod-shaped member (extending in the Y direction) extending along the long side portion of the adhesion preventing plate unit 7, and in the present embodiment, is a square steel pipe. The fixed support member 12b is a rod-shaped member (extending in the X direction) extending along the short side portion of the adhesion preventing plate unit 7, and is a square steel pipe in the case of the present embodiment. The respective ends of the attachment/detachment support member 12a and the fixed support member 12b are detachably fixed by fastening means such as bolts. The arm member 12c connects the fixed support member 12b and the wall portion of the source chamber 3a. The adhesion preventing plate unit 7 covers the entire parts of the attaching/detaching support member 12a, the fixing support member 12, and the arm member 12c with respect to the vapor deposition source 6, and therefore, can prevent the vapor deposition material from adhering to these parts.

The adhesion preventing plates 71 and the adhesion preventing plates 72 and 73 of the adhesion preventing plates 71 to 78 of the adhesion preventing plate unit 7 are detachably fixed to the connecting portion 10, and the adhesion preventing plates 78 and the adhesion preventing plates 76 and 77 are detachably fixed to the connecting portion 10. Fig. 7 (a) is a cross-sectional view of the connecting portion 10. The connecting portion 10 is constructed by overlapping the fixing portion 10a and the fixing portion 10b and fastening them with a bolt 10 c. A hole through which the screw portion of the bolt 10c is inserted is formed in the fixing portion 10a, and a screw hole into which the screw portion of the bolt 10c is screwed is formed in the fixing portion 10 b. As illustrated in fig. 8 described later, the adhesion preventing plate 71 is provided with a plate-like fixing portion 10a, and the adhesion preventing plates 72 and 73 are respectively formed with fixing portions 10b in recesses, and the fixing portions 10a are overlapped with the fixing portions 10b in the fixing portions 10. The adhesion preventing plate 78 is similar to the connecting portion 10 of the adhesion preventing plates 76 and 77. The fixing portion 10 may be any structure as long as it can detachably fix the adhesion preventing plate.

The adhesion preventing plate 74 and the adhesion preventing plate 75 of the adhesion preventing plate unit 7 are not directly connected to other adhesion preventing plates. The adhesion preventing plate 74 and the adhesion preventing plate 75 are connected to other adhesion preventing plates via the attachment/detachment support member 12a. The attachment prevention plates 72 to 77 are provided with attachment portions 9, and the attachment portions 9 are aligned in the Y direction and detachably fixed to the detachable support member 12a. Fig. 7 (B) is a perspective view of the mounting portion 9. The attachment portion 9 is a plate-like member protruding outward from the outer side surfaces of the adhesion preventing plates 72 to 77, and the end portion 9a is joined to the outer side surfaces of the adhesion preventing plates 72 to 77. The mounting portion 9 has: a plate-like fixed plate portion 9b having a cutout 9 c; and vertical wall portions 9d rising from both end portions of the fixing plate portion 9b in the Y direction.

Fig. 7 (C) shows an example of a fixing structure of the mounting portion 9 and the detachable support member 12 a. The fixing plate portion 9b of the mounting portion 9 is interposed between the attachment/detachment support member 12a and the pressing plate 15, and the mounting portion 9 is fixed to the attachment/detachment support member 12a by the fastening bolt 14. A screw hole that is screwed with the screw portion of the bolt 14 is formed in the attachment/detachment support member 12 a. The fixing plate portion 9b can be adjusted in position relative to the bolt 14 according to the size of the cutout 9 c. That is, the fixed positions of the adhesion preventing plates 72 to 77 with respect to the X direction and the Y direction of the attachment/detachment support member 12a can be adjusted. The fixing structures of the adhesion preventing plates 72 to 77 and the attachment/detachment support member 12a may be any structures as long as they can be fixed separately from each other.

In the present embodiment, a structure (coupling portion 10) for coupling the adhesion preventing plates to each other and a structure for coupling the adhesion preventing plates via the attachment/detachment support member 12a are used in combination. However, all the adhesion preventing plates may be directly connected to the adjacent adhesion preventing plates. Conversely, all the adhesion preventing plates may be connected via the detachable support member 12 a.

The adhesion preventing plate unit 8 is fixed to the source chamber 3a by a support structure 13. The support structure 13 includes a pair of attachment/detachment support members 13a and a plurality of arm members 13b. The adhesion preventing plate unit 8 is located between the pair of attachment/detachment support members 13 a. The attachment/detachment support member 13a is a rod-shaped member (extending in the Y direction) extending along the long side portion of the adhesion preventing plate unit 8, and in the present embodiment, is a square steel pipe. The arm member 13b connects the attachment/detachment support member 13a and the wall portion of the source chamber 3a. The detachable support member 13a is detachably fixed to the arm member 13b by a fastening structure such as a bolt.

Since the adhesion preventing plate unit 8 covers the entire members of the detachable support member 13a and the arm member 13b with respect to the vapor deposition source 6, the vapor deposition material can be prevented from adhering to these members.

The adhesion preventing plates 81 and 82 and 83 of the adhesion preventing plates 81 to 88 of the adhesion preventing plate unit 8 are detachably fixed by the connecting portion 10, and the adhesion preventing plates 88 and 86 and 87 are detachably fixed by the connecting portion 10. The structure of the connecting portion 10 is shown in fig. 7 (a). As illustrated in fig. 8 described later, the adhesion preventing plate 81 is provided with a plate-like fixing portion 10a, and the adhesion preventing plates 82 and 83 are respectively formed with fixing portions 10b in recesses, and the fixing portion 10a is overlapped with the fixing portion 10b (in the lateral direction), as shown in the fixing portion 10 of the adhesion preventing plates 81 and 82 and 83. The adhesion preventing plate 88 is similar to the connecting portion 10 of the adhesion preventing plates 86 and 87. In the adhesion preventing plate unit 8, the fixing portion 10 may be any structure as long as the adhesion preventing plate can be detachably fixed.

The adhesion preventing plate 84 and the adhesion preventing plate 85 of the adhesion preventing plate unit 8 are not directly connected to other adhesion preventing plates. Is connected to other adhesion preventing plates via the detachable support member 13a. The attachment prevention plates 82 to 87 are provided with attachment portions 9, and the attachment portions 9 are aligned in the Y direction and detachably fixed to the detachable support member 13a. The structure of the attachment portion 9 of the attachment prevention plate unit 8 and the fixing structure of the attachment portion 9 and the attachment/detachment support member 13a are the same as those illustrated in fig. 7 (B) and 7 (C). In the adhesion preventing plate unit 8, the adhesion preventing plates 82 to 87 may be of any structure as long as they are fixed to the detachable support member 13a so as to be detachable from each other. The adhesion preventing plate unit 8 may have a structure in which all the adhesion preventing plates are directly connected to the adjacent adhesion preventing plates, or may have a structure in which all the adhesion preventing plates are connected via the attachment/detachment support member 13a.

[ detachment in units of adhesion-preventing plates and detachment in units of units ]

In the present embodiment, the adhesion preventing plates 71 to 78 of the adhesion preventing plate unit 7 can be detached individually, or the adhesion preventing plate unit 7 as a whole can be detached from the source chamber 3 a. In this way, by enabling the selection of the detachment in units of the adhesion preventing plate and the detachment in units of the unit, the maintainability can be improved. For example, when the amount of the deposition material is large, the deposition preventing plate unit 7 can be replaced at a time by selecting and replacing the deposition preventing plate unit. The detachment operation in units of the adhesion preventing plate can be performed in the state of fig. 4 (B) or the state of fig. 4 (C), for example, and the detachment operation in units of the unit can be performed in the state of fig. 4 (C). The same applies to the adhesion preventing plate unit 8.

Fig. 8 shows an example of removing the adhesion preventing plate unit. In the illustrated example, the adhesion preventing plate 71 and the adhesion preventing plate 72 are detached from the adhesion preventing plate unit 7. The adhesion preventing plate 71 can be detached by releasing the fixing of the fixing portion 10. The adhesion preventing plate 72 can be detached by releasing the fixation of the fixing portion 10 and releasing the fixation of the attachment/detachment support member 12a and the mounting portion 9.

The order of the attachment prevention plates 71 to 78 is limited to a predetermined order by the overlapping relationship of the edges in the portions P1 to P8 and the direction of detachment from the attachment/detachment support member 12a (the inner side of the attachment prevention plate unit 7 in the X direction in the present embodiment) of the attachment prevention plate unit 7. When the order of decomposition is expressed in the order of priority, the order of the adhesion preventing plate 71 and the adhesion preventing plate 78 is the first (first order of priority). The adhesion preventing plates 72 are sequentially ordered (second order of priority) in that the adhesion preventing plates 71 need to be removed, and the adhesion preventing plates 77 are sequentially ordered (second order of priority) in that the adhesion preventing plates 78 need to be removed. The adhesion preventing plate 74 is sequentially reused (third order of priority) in the point that the adhesion preventing plate 72 needs to be detached, and similarly, the adhesion preventing plate 75 is sequentially reused (third order of priority) in the point that the adhesion preventing plate 77 needs to be detached. The order of the adhesion preventing plate 73 and the adhesion preventing plate 76 is the latest (lowest priority order). The order of assembly is reversed.

In the present embodiment, the order of decomposition of the adhesion preventing plate 71 and the adhesion preventing plate 78 is first. The adhesion preventing plates 71 and 78 are located at the end periphery of the evaporation source 6 in the extending direction. The periphery of the end portion of the vapor deposition source 6 in the extending direction often serves as a space for disposing other mechanisms (various sensors, actuators, and the like). That is, the adhesion preventing plate 71 and the adhesion preventing plate 78 are portions that have a high possibility of being detached during the internal maintenance of the vapor deposition device 3, and have a high decomposition priority (no need to detach other adhesion preventing plates), thereby improving the maintenance workability.

In the example of fig. 8, the adhesion preventing plate 81 is detached in the adhesion preventing plate unit 8. The adhesion preventing plate 81 can be detached by releasing the fixing of the fixing portion 10. In the adhesion preventing plate unit 8 as well, the order of the disassembly of the adhesion preventing plates 81 to 88 is limited to a predetermined order due to the overlapping relationship of the edge portions and the direction of detachment from the attachment/detachment support member 13a (the inside of the adhesion preventing plate unit 8 in the X direction in the present embodiment) as in the adhesion preventing plate unit 7. The order of priority of the decomposition order is the same as the order of the adhesion preventing plate unit 7, the order of the adhesion preventing plate 81 and the adhesion preventing plate 88 is first (first order of priority), the order of the adhesion preventing plate 82 and the adhesion preventing plate 87 is next (second order of priority), the order of the adhesion preventing plate 84 and the adhesion preventing plate 85 is next (third order of priority), and the order of the adhesion preventing plate 83 and the adhesion preventing plate 86 is latest (lowest order of priority). The order of assembly is reversed. The reason why the order of decomposition of the adhesion preventing plates 81 and 88 is the first is the same as that of the adhesion preventing plates 71 and 78.

Fig. 9 shows an example of detachment of the adhesion preventing plate unit 7 in units of units. The attachment prevention plate unit 7 is lifted up together with the attachment support member 12a by a crane or the like by releasing the attachment support member 12a and the attachment support member 12b, whereby the entire attachment prevention plate unit 7 can be detached from the source chamber 3 a.

Fig. 10 shows an example of detachment of the adhesion preventing plate unit 8 in units of units. The attachment prevention plate unit 8 is lifted up together with the attachment support member 13a by a crane or the like by releasing the attachment support member 13a and the arm member 13b, whereby the entire attachment prevention plate unit 8 can be detached from the source chamber 3 a. In the present embodiment, when the entire adhesion preventing plate unit 8 is detached from the source chamber 3a, the adhesion preventing plate unit 7 needs to be detached first.

[ electronic device ]

Next, an example of the electronic device will be described. Hereinafter, as an example of an electronic device, a structure of an organic EL display device is illustrated.

First, an organic EL display device to be manufactured is explained. Fig. 11 (a) shows an overall view of the organic EL display device 500, and fig. 11 (B) shows a cross-sectional structure of 1 pixel.

As shown in fig. 11 (a), a plurality of pixels 52 each including a plurality of light emitting elements are arranged in a matrix in a display region 51 of an organic EL display device 500. As will be described in detail later, the light-emitting elements each have a structure including an organic layer sandwiched between a pair of electrodes.

The pixel herein refers to the smallest unit that can display a desired color in the display area 51. In the case of the color organic EL display device 500, the pixel 52 is configured by a combination of a plurality of sub-pixels that display mutually different light-emitting elements 1, 52R, 52G, and 52B. The pixel 52 is often constituted by a combination of three sub-pixels of a red (R) light emitting element, a green (G) light emitting element, and a blue (B) light emitting element, but the present invention is not limited thereto. The pixel 52 may include at least one type of sub-pixel, preferably two or more types of sub-pixels, and more preferably three or more types of sub-pixels. As the sub-pixels constituting the pixel 52, for example, a combination of four sub-pixels of a red (R) light-emitting element, a green (G) light-emitting element, a blue (B) light-emitting element, and a yellow (Y) light-emitting element may be used.

Fig. 11 (B) is a partial cross-sectional schematic view at line a-B of fig. 11 (a). The pixel 52 includes a plurality of sub-pixels each including an organic EL element including a 1 st electrode (anode) 54, a hole transport layer 55, one of a red layer 56R, a green layer 56G, and a blue layer 56B, an electron transport layer 57, and a 2 nd electrode (cathode) 58 on a substrate 53. Among them, the hole transport layer 55, the red layer 56R, the green layer 56G, the blue layer 56B, and the electron transport layer 57 correspond to organic layers. The red layer 56R, the green layer 56G, and the blue layer 56B are formed in a pattern corresponding to light-emitting elements (also sometimes referred to as organic EL elements) that emit red light, green light, and blue light, respectively.

Further, the 1 st electrode 54 is separately formed for each light emitting element. The hole transport layer 55, the electron transport layer 57, and the 2 nd electrode 58 may be formed in common with the plurality of light-emitting elements 52R, 52G, and 52B, or may be formed for each light-emitting element. That is, as shown in fig. 11 (B), the hole transport layer 55 may be formed as a common layer over a plurality of sub-pixel regions, the red layer 56R, the green layer 56G, and the blue layer 56B may be formed separately for each sub-pixel region, and the electron transport layer 57 and the 2 nd electrode 58 may be formed as a common layer over a plurality of sub-pixel regions.

In addition, in order to prevent a short circuit between the adjacent first electrodes 54, an insulating layer 59 is provided between the first electrodes 54. Further, since the organic EL layer is degraded by moisture or oxygen, a protective layer 60 for protecting the organic EL element from the moisture or oxygen is provided.

In fig. 11 (B), the hole transport layer 55 and the electron transport layer 57 are shown as one layer, but may be formed in a plurality of layers having a hole blocking layer and an electron blocking layer according to the structure of the organic EL display element. In addition, a hole injection layer having a band structure that allows holes to be smoothly injected from the 1 st electrode 54 into the hole transport layer 55 may be formed between the 1 st electrode 54 and the hole transport layer 55. Similarly, an electron injection layer may be formed between the 2 nd electrode 58 and the electron transport layer 57.

The red layer 56R, the green layer 56G, and the blue layer 56B may be formed of a single light-emitting layer, or may be formed by stacking a plurality of layers. For example, the red layer 56R may be formed of two layers, the upper layer may be formed of a red light-emitting layer, and the lower layer may be formed of a hole-transporting layer or an electron-blocking layer. Alternatively, the lower layer may be formed of a red light-emitting layer, and the upper layer may be formed of an electron transport layer or a hole blocking layer. By providing a layer below or above the light-emitting layer in this manner, the effect of improving the color purity of the light-emitting element by adjusting the light-emitting position in the light-emitting layer and the optical path length can be obtained.

Although the red layer 56R is shown here as an example, the green layer 56G and the blue layer 56B may have the same structure. The number of layers may be 2 or more. Further, layers of different materials such as a light-emitting layer and an electron blocking layer may be stacked, or layers of the same material as, for example, 2 or more light-emitting layers may be stacked.

In the production of such an electronic device, the film forming apparatus 1 described above can be applied, and the production method can include: a conveying step of conveying the substrate 53 by the conveying device 2; and a vapor deposition step of vapor depositing at least any one of the layers on the conveyed substrate 53 by the vapor deposition device 3.

Other embodiments

The vapor deposition source 6 may be a point source other than a line source. The adhesion preventing plate units 7 and 8 can be applied to a film forming apparatus or a vapor deposition apparatus other than an in-line film forming apparatus.

The structure of overlapping the edge portions of the adjacent adhesion preventing plates may be other than the structure illustrated in fig. 5. Fig. 12 (a) to 12 (C) show an example thereof. Fig. 12 (a) to 12 (C) show structures of portions corresponding to the P1 portion in fig. 5 in plan view, and show structures in which the adhesion preventing plate 72 'instead of the adhesion preventing plate 72 and the edges of the adhesion preventing plate 74' instead of the adhesion preventing plate 74 overlap. Fig. 12 (a) shows an example in which the adhesion preventing plate 72 'and the adhesion preventing plate 74' do not have a structure corresponding to the overlapping portion 72b, but are overlapped with each other in the thickness direction. Has the advantage of being simple in construction. Fig. 12 (B) is an example of a structure in which thin portions are provided at the respective end portions of the adhesion preventing plate 72 'and the adhesion preventing plate 74', and the thin portions are overlapped with each other. The effect of preventing leakage of the vapor deposition material can be improved. Fig. 12 (C) shows an example in which a convex portion is provided at an end of the adhesion preventing plate 72 'and a concave portion is provided at an end of the adhesion preventing plate 74', and the convex portions are inserted into the concave portions and overlapped. The effect of preventing leakage of the vapor deposition material can be improved.

The present invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Accordingly, to disclose the scope of the present invention, the following claims are appended.

Claims

1. A film forming apparatus includes:

it is characterized in that the method comprises the steps of,

the peripheral edges of the adjacent adhesion preventing plates overlap each other,

the film forming apparatus includes a support member for connecting and supporting the plurality of adhesion preventing plates,

the first adhesion preventing plate and the second adhesion preventing plate included in the plurality of adhesion preventing plates are detachable from the support member,

the support member is configured to be attachable to and detachable from the film forming apparatus in a state where the first adhesion preventing plate and the second adhesion preventing plate are coupled and supported.

2. The film forming apparatus according to claim 1, wherein,

the second adhesion preventing plate includes:

A first portion including an edge portion overlapping the first adhesion preventing plate; and

a second portion which does not overlap with the first adhesion preventing plate,

the first portion is formed offset in a plate thickness direction with respect to the second portion.

3. The film forming apparatus according to claim 1 or 2, wherein,

the adhesion preventing plate unit covers the entire support member with respect to the vapor deposition source.

4. The film forming apparatus according to claim 1 or 2, wherein,

the plurality of adhesion preventing plates includes a third adhesion preventing plate that is not mounted to the support member but mounted to the first adhesion preventing plate.

5. The film forming apparatus according to claim 1 or 2, wherein,

the adhesion preventing plate unit is configured to include a plurality of kinds of adhesion preventing plates as the plurality of adhesion preventing plates, and to use a plurality of kinds of adhesion preventing plates.

6. The film forming apparatus according to claim 1 or 2, wherein,

the evaporation source is a line source,

the adhesion preventing plate unit has a prismatic shape having a long side portion along an extending direction of the vapor deposition source and a short side portion along a crossing direction crossing the extending direction,

The adhesion preventing plate unit is capable of being decomposed into the plurality of adhesion preventing plates in a predetermined order,

the order of the adhesion preventing plates constituting the short side portion among the plurality of adhesion preventing plates precedes the order of the adhesion preventing plates constituting the long side portion.

7. The film forming apparatus according to claim 1 or 2, wherein,

the film forming apparatus includes a conveying device for conveying the substrate,

the film forming apparatus is an in-line type film forming apparatus that performs vapor deposition while conveying the substrate by the conveying apparatus.

8. A film forming method using the film forming apparatus according to claim 7, characterized in that,

the film forming method comprises the following steps:

a conveying step of conveying the substrate by the conveying device; and

9. A method for manufacturing an electronic device, which uses the film forming apparatus according to claim 7, characterized in that,

a conveying step of conveying the substrate by the conveying device; and