CN110578116A - Vapor deposition apparatus, vapor deposition method, and method for manufacturing electronic device - Google Patents
Vapor deposition apparatus, vapor deposition method, and method for manufacturing electronic device Download PDFInfo
- Publication number
- CN110578116A CN110578116A CN201810579012.2A CN201810579012A CN110578116A CN 110578116 A CN110578116 A CN 110578116A CN 201810579012 A CN201810579012 A CN 201810579012A CN 110578116 A CN110578116 A CN 110578116A
- Authority
- CN
- China
- Prior art keywords
- baffle
- vapor deposition
- evaporation source
- shielding
- deposition device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Disclosed is a vapor deposition device (1) which can prevent a vapor deposition material from leaking from a gap between evaporation source shutters when the evaporation source shutters are closed. The evaporation device (1) is provided with an evaporation source (3) and an evaporation source shielding assembly (4) arranged above the evaporation source (3), wherein the evaporation source shielding assembly (4) comprises at least two baffle plates, at least one baffle plate can move between a shielding position and an opening position, and when the baffle plates are positioned at the shielding position, the at least two baffle plates are spliced into a baffle plate so as to form a barrier between the evaporation source (3) and an evaporated substrate (2); the vapor deposition device (1) is characterized in that a shielding part (5) is arranged between at least one pair of baffle components which are adjacent to each other in a split state.
Description
Technical Field
The present invention relates to a vapor deposition device, a vapor deposition method, and a method for manufacturing an electronic device, and more particularly, to a vapor deposition device, a vapor deposition method, and a method for manufacturing an electronic device, which can prevent a vapor deposition material from leaking from a gap between evaporation source shutters when the evaporation source shutters are closed.
Background
When a member to be vapor-deposited is vapor-deposited by a vapor deposition device, an evaporation source shielding assembly located above an evaporation source is opened to expose the evaporation source located below, and the evaporation source is heated to evaporate a vapor deposition material in the evaporation source and adhere the vapor deposition material to the member to be vapor-deposited, for example, a substrate. And when the evaporation of the substrate positioned above the evaporation source is finished, closing the evaporation source shielding assembly and transferring the substrate which finishes the evaporation to other positions.
the evaporation source shielding assembly is generally configured by combining a plurality of evaporation source baffles, and after the evaporation operation is completed, the plurality of evaporation source baffles are partially overlapped and closed to form an integrated evaporation source shielding assembly, thereby shielding the evaporation material from entering the evaporation area. During which the evaporated substrate is transferred away.
Disclosure of Invention
The invention aims to provide a vapor deposition device which can prevent a vapor deposition material from leaking from a gap between evaporation source baffles when the evaporation source baffles are closed.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
An evaporation apparatus having an evaporation source and an evaporation source shield assembly disposed above the evaporation source, the evaporation source shield assembly comprising at least two baffle members, at least one baffle member being movable between a shield position and an open position, the at least two baffle members being assembled to form a baffle when in the shield position so as to form a barrier between the evaporation source and a substrate being evaporated; the vapor deposition device is characterized in that a shielding part is arranged between at least one pair of baffle plate members which are adjacent to each other in a split state.
Preferably, the at least two shutter members are movable between a blocking position and an open position.
preferably, a gap is provided between the at least one pair of baffle members, and the shielding portion is disposed so as to fill the gap.
Preferably, the shielding portion is provided on one of the at least one pair of shutter members.
preferably, the shielding portions are provided at edge positions of the respective shutter members.
Preferably, in the assembled state, the at least one pair of shutter members partially overlap to form an overlapping region in which the shielding portion is located.
Preferably, the shielding portion has a strip shape.
preferably, a rib is provided on a periphery of at least one of the shutter members, and a protruding direction of the rib is away from the evaporation source.
Preferably, the evaporation source shielding assembly includes N baffle members, which are a first baffle member, a second baffle member, … …, and an nth baffle member; wherein, in a split state, the first baffle member, the second baffle member, … …, the Nth baffle member are adjacent in sequence, and the first baffle member is adjacent to the Nth baffle member; further, the distances from the first, second, … …, and nth baffle members to the evaporation source are sequentially increased, and the shielding portion is provided between the first and nth baffle members.
preferably, the first and second shutter members are disposed in a plane parallel to the first and second shutter members, and the first and second shutter members are disposed in parallel to each other.
Preferably, a height dimension of the shielding portion is equal to a sum of height dimensions of the remaining shutter members excluding the first shutter member and the nth shutter member.
Preferably, said N is equal to 3.
Preferably, each said baffle member is rotatably mounted and configured with a pivot shaft and a pivot arm, said baffle member being fixed to said pivot arm, said pivot arm rotating about said pivot shaft.
Preferably, the evaporation source shielding assembly includes two baffle members having different fan shapes, and the two baffle members overlap each other when in the open position.
Preferably, the evaporation apparatus includes a vacuum vessel in which the evaporation source and the evaporation source shielding assembly are located, wherein a sidewall of the vacuum vessel has a projection portion projecting outward, and an inner side of the projection portion forms a shutter receiving space for receiving the shutter member in the open position.
preferably, in the baffle receiving space, at a position near an opening of the baffle receiving space, an adhesion preventing plate for preventing an evaporation material from entering the baffle receiving space is provided.
preferably, the barrier receiving space includes a first receiving space at one side of the vacuum container and a second receiving space at the other side of the vacuum container; the evaporation source shielding assembly comprises a first baffle plate part, a second baffle plate part and a third baffle plate part, when the baffle plates are at an opening position, the first baffle plate part and the third baffle plate part are received in the first receiving space, and the second baffle plate part is received in the second receiving space; the anti-attachment plate includes a first anti-attachment plate disposed in the first receiving space, the first anti-attachment plate being located between the first shutter member and the third shutter member when the shutter member is in the open position; and/or, prevent that the attachment plate is including setting up second in the second accommodation space prevents attachment plate and third prevention attachment plate, works as when the baffle part is in the open position, second baffle part is located the second prevent the attachment plate with between the third prevention attachment plate.
Preferably, the first baffle member or the third baffle member is provided with a shielding portion, and the first adhesion preventing plate has a notch portion for the shielding portion to pass through; and/or a shielding part is arranged on the second baffle part, and the second adhesion-preventing plate or the third adhesion-preventing plate is provided with a notch part for the shielding part to pass through.
an evaporation method includes an adhesion step of adhering an evaporation material evaporated from an evaporation source to a substrate; a shielding step of shielding the evaporation material from the evaporation source toward the substrate; and a moving step of moving the substrate, wherein the masking step includes the steps of: a plurality of baffle members arranged between an evaporation source and a substrate are combined to form a barrier between the evaporation source and the substrate, and a shielding portion is arranged between at least a pair of the baffle members in the combined state.
A method for manufacturing an electronic device having at least one film of an organic film and a metal film formed on a substrate, wherein the at least one film is formed by the above-described vapor deposition method.
according to the present invention, since the shielding portion for shielding the gap between at least one pair of the baffle members adjacent to each other in the state of being fitted is provided between the at least one pair of the baffle members, it is possible to prevent the evaporation material from leaking from the gap between the evaporation source baffles by the labyrinth seal structure at the overlapping portion of the plurality of evaporation source baffles in the case where the evaporation source baffles are closed, so that it is possible to reduce the amount of the evaporation material entering the evaporation region from the gap at the overlapping portion of the plurality of evaporation source baffles.
drawings
Fig. 1 is a schematic view of a vapor deposition device according to a first embodiment of the present invention;
Fig. 2 is a schematic view of a vapor deposition device according to a first embodiment of the present invention;
fig. 3 is a schematic view of a first modification of the first embodiment of the vapor deposition device according to the present invention;
Fig. 4 is a schematic view of a second modification of the first embodiment of the vapor deposition device according to the present invention;
Fig. 5 is a plan view of a vapor deposition device according to a first embodiment of the present invention, with a shutter member closed;
Fig. 6 is a plan view of a vapor deposition device according to a first embodiment of the present invention, with a shutter member open;
Fig. 7 is a perspective view of a vapor deposition device according to a first embodiment of the present invention, with a shutter member closed;
Fig. 8 is a perspective view of a vapor deposition device according to a first embodiment of the present invention, with a shutter member opened;
Fig. 9 is a schematic view of a third modification of the first embodiment of the vapor deposition device according to the present invention;
Fig. 10 is a schematic view of a fourth modification of the first embodiment of the vapor deposition device according to the present invention;
Fig. 11 is a schematic diagram of a vapor deposition device according to a second embodiment of the present invention.
Description of the reference numerals
1 vapor deposition apparatus
2 base plate
3 Evaporation source
4 evaporation source shelters from subassembly
41 first baffle member
42 second baffle component
43 third baffle component
5 shield part
6 overlapping area
7 convex rib
8 pivoting arm
9 pivoting axis
10 anti-adhesion plate
101 first anti-adhesion plate
102 second anti-adhesion plate
103 third prevention attachment plate
11 vacuum container
12 baffle plate containing space
121 first receiving space
122 second receiving space
OL attachments
Detailed Description
(first embodiment)
A first embodiment of a vapor deposition device according to the present invention will be described with reference to fig. 1 to 10. The vapor deposition device 1 of the present embodiment is used for vapor deposition of a substrate 2 in a vacuum chamber (vacuum chamber) 11, and includes an evaporation source 3, the substrate 2, and an evaporation source shielding member 4 disposed between the evaporation source 3 and the substrate 2. The arrows in fig. 1 to 4 indicate the rough travel locus of the evaporation material.
As shown in fig. 1 to 10, the evaporation source shielding assembly 4 includes three baffle members (a first baffle member 41, a second baffle member 42, and a third baffle member 43, which are collectively referred to as "baffle members" when a certain baffle member is not specified), and the first baffle member 41, the second baffle member 42, and the third baffle member 43 are movable between a shielding position and an opening position. As shown in fig. 5 to 8, first, second, and third shutter members 41, 42, and 43 are provided with a pivot shaft 9 and a pivot arm 8, respectively, each shutter member being fixed to the pivot arm 8, the pivot arm 8 rotating about the pivot shaft 9. The shutter member may be mounted in a translational manner by disposing a slide rail or the like. However, the configuration having the pivot shaft 9 and the pivot arm 8 is preferable because the movement can be easily performed and the control is simple.
After the completion of the deposition operation on one substrate, the deposition area needs to be replaced with another new substrate. During substrate replacement, the evaporation source 3 must be isolated from the deposition area, and at this time, the pivot arm 8 is rotated about the pivot shaft 9 so that the shutter member fixed to the pivot arm 8 is in the shielding position. As shown in fig. 5 and 7, when the first, second, and third shutter members 41, 42, 43 are in the shielding position, the three shutter members are pieced together to form a shutter, thereby forming a barrier between the evaporation source 3 and the substrate 2 to be evaporated. As shown in fig. 1 and 7, a shielding portion 5 is provided between the first shutter member 41 and the third shutter member 43, which are farthest from each other in the vertical direction in the assembled state, and this shielding portion 5 shields a gap between the first shutter member 41 and the third shutter member 43. Since the shielding section 5 fills the gap between the first shutter member 41 and the third shutter member 43, the vapor deposition material can be prevented from entering the vapor deposition region, and the vapor deposition material in the vapor deposition region during substrate replacement can be reduced as much as possible.
In the present embodiment, all three shutter members of the first shutter member 41, the second shutter member 42, and the third shutter member 43 are movable between the shielding position and the open position, but the present invention is not limited thereto as long as at least one shutter member is movable between the shielding position and the open position.
In the vapor deposition device shown in fig. 1 to 3, the shielding section 5 is provided at the edge of the third shutter member 43 and is suspended from the edge of the third shutter member 43 (i.e., in the direction toward the evaporation source 3). With such an arrangement, as shown in fig. 2, the vapor deposition material adheres to a portion where the shielding section 5 and the third shutter member 43 are joined, and the deposition material OL adhering to the portion can be prevented from falling. As shown in fig. 4, the shielding portion 5 may be provided at the edge of the first shutter member 41 and may be provided upward from the edge of the first shutter member 41.
in the assembled state where the first shutter member 41, the second shutter member 42, and the third shutter member 43 are in the blocking position, the first shutter member 41 and the third shutter member 43 are partially overlapped to form the overlapping region 6, and the shielding portion 5 may be located in the overlapping region 6 and not located at the edge of the first shutter member 41 or the third shutter member 43. With this arrangement, the vapor deposition material can be prevented from entering the vapor deposition region even when the shutter member is at the shielding position.
the shape of the shielding portion 5 is preferably a band shape. The advantage of the strip-like shape is that the strip-like shielding part has the smallest volume and the lightest weight under the same shielding area because the thickness of the strip-like shape is extremely thin. Of course, the shape of the shielding portion 5 may be a rib, a ridge, or the like, and is not limited to a band shape.
In the above description, the shielding portion 5 is provided on the first shutter member 41 or the third shutter member, but the present invention is not limited to this, and the shielding portion 5 may be a movable member provided independently, and may be moved to a corresponding position simultaneously with the movement of the shutter members to reduce the gap between the shutter members and thereby shield the evaporation material when the evaporation material needs to be shielded, without being attached to any shutter member.
as shown in fig. 3, ribs 7 are provided on the upper peripheral edges of the first shutter member 41, the second shutter member 42, and the third shutter member 43, and the ribs 7 protrude in a direction away from the evaporation source 3, that is, toward the substrate 2. By arranging the convex rib 7, the structural strength and rigidity of the baffle plate parts can be increased, the deformation is reduced, in addition, the convex rib 7 can also enable the baffle plate parts which are positioned at the shielding position and are adjacent up and down to be in close contact, and the effect of shielding evaporation materials can also be achieved to a certain extent. In addition, the rib is provided on the side of the baffle member facing the substrate 2, and the lower side surface of the baffle member is formed to be a smooth surface, which is advantageous for reducing the adhesion of the evaporation material. In the present embodiment, the ribs 7 are provided on the peripheral edges of the first shutter member 41, the second shutter member 42, and the third shutter member 43, but the present invention is not limited thereto, and the ribs 7 may be provided on only one or two shutter members.
As shown in fig. 7 and 8, other ribs are provided on the surface of the baffle member on which the ribs 7 are provided, but these ribs only function as ribs and do not function to shield the evaporation material.
The evaporation source 3 and the evaporation source shielding member 4 of the present embodiment are located in the vacuum chamber 11 of the vapor deposition device 1. As shown in fig. 9 and 10, the side wall of the vacuum chamber 11 has a projection projecting outward, and a shutter housing space 12 is formed inside the projection to house the shutter member in the open position. As shown in fig. 9 and 10, the barrier housing space 12 includes a first housing space 121 located at one side of the vacuum vessel 11 and a second housing space 122 located at the other side of the vacuum vessel 11. When the first shutter member 41, the second shutter member 42, and the third shutter member 43 are in the open position, the first shutter member 41 and the third shutter member 43 are housed in the first housing space 121, and the second shutter member 42 is housed in the second housing space 122.
In the baffle receiving space 12, an adhesion preventing plate 10 mounted on a wall surface of the vacuum vessel 11 is provided at a position near an opening thereof, the adhesion preventing plate 10 for preventing the evaporation material from entering into the baffle receiving space 12.
The adhesion preventing plate 10 includes a first adhesion preventing plate 101 disposed in the first housing space 121, and the first adhesion preventing plate 101 is located between the first shutter member 41 and the third shutter member 43, and fixes both ends in the longitudinal direction to the wall surface of the vacuum chamber 11 in a bridging manner. In addition, the adhesion preventing plate 10 further includes a second adhesion preventing plate 102 and a third adhesion preventing plate 103 disposed in the second receiving space 122. The second flap member 42 is positioned between the second adhesion prevention plate 102 and the third adhesion prevention plate 103. The second adhesion preventing plate 102 and the third adhesion preventing plate 103 may be fixed to the wall surface of the vacuum chamber 11 at both ends in the longitudinal direction as in the first adhesion preventing plate 101. The second adhesion preventing plate 102 may fix the upper end in the height direction to the wall surface of the vacuum chamber 11, and the third adhesion preventing plate 103 may fix the lower end in the height direction to the wall surface of the vacuum chamber 11.
As shown in fig. 9, the shielding portion 5 is provided on the third shutter member 43, and the first adhesion preventing plate 101 has a cutout portion. The cutout portion is used for the shielding portion 5 to pass through when the shutter member is opened or closed. Of course, as described above, the shielding portion 5 may be provided on the first shutter member 41.
As shown in fig. 10, the second shutter member 42 may be provided with a shielding portion 5, and the second adhesion preventing plate 102 or the third adhesion preventing plate 103 may have a cutout. The cutout portion is used for the shielding portion 5 provided on the second shutter member 42 to pass through when the shutter member is opened or closed. Specifically, when the shielding portion 5 is provided above the second shutter member 42, the second adhesion preventing plate 102 located above has a cutout, and when the shielding portion 5 is provided below the second shutter member 42, the third adhesion preventing plate 103 located below has a cutout.
In addition, in order to prevent the evaporation material from entering the baffle receiving space 12, as indicated by the dotted line ellipse on the upper right of the upper drawing of fig. 9, a labyrinth structure is preferably provided between the received baffle member and the adhesion preventing plate 10. When the shutter member is in the open position, the evaporation material is prevented from entering the shutter housing space by the labyrinth structure formed between the housed shutter member and the adhesion preventing plate 10.
In the present embodiment, the evaporation source shield assembly 4 includes three baffle members, i.e., the first baffle member 41, the second baffle member 42, and the third baffle member 43, but the present invention is not limited to this, and may include N baffle members, i.e., the first baffle member, the second baffle member, … …, and the nth baffle member, where N is 4 or more. In the state where the shutter members are assembled, the first shutter member, the second shutter member, … …, and the nth shutter member are sequentially adjacent to each other, and the first shutter member and the nth shutter member are adjacent to each other. By "sequentially adjacent" herein is meant that the first baffle member and the second baffle member are adjacent, the second baffle member and the third baffle member are adjacent, … …, the nth-1 baffle member and the nth baffle member are adjacent. The distances from the first, second, … …, and nth baffle members to the evaporation source 3 are sequentially increased, and the shielding part 5 is provided between the first and nth baffle members with the largest gap therebetween. As in the case where the evaporation source shield assembly 4 has three baffle members, the shield portion 5 may be provided at least on one of the first baffle member and the nth baffle member. In the first to nth shutter members, the portions of the first shutter member and the nth shutter member adjacent to each other are in contact with each other, that is, there is substantially no gap therebetween, except for the portions of the first shutter member and the nth shutter member adjacent to each other, and thus no shielding portion is provided. However, the present invention is not limited to this, and a shielding portion may be provided in another adjacent shutter member so as to shield the vapor deposition material more effectively.
The height of the shielding portion 5 provided in the first shutter member or the nth shutter member is equal to the sum of the heights of the other shutter members (the height is a dimension measured in the height direction of the vapor deposition device) excluding the first shutter member and the nth shutter member. I.e. equal to the height of the gap between the first and nth baffle members. In this way, the shielding section 5 can completely shield the gap between the first shutter member and the nth shutter member, and effectively prevent the leakage of the vapor deposition material.
(second embodiment)
next, a second embodiment of a vapor deposition device according to the present invention will be described with reference to fig. 11. The vapor deposition device 1 of this embodiment has substantially the same basic configuration as that of the first embodiment, and also includes an evaporation source 3, a substrate 2, and an evaporation source shielding member 4 disposed between the evaporation source 3 and the substrate 2. The present embodiment is different from the first embodiment in that the evaporation source shield assembly 4 includes two baffle members, and the evaporation source shield assembly 4 of the first embodiment includes three or more baffle members. Accordingly, in the present embodiment, there is one shutter housing space that houses the shutter member.
the present embodiment will be described in detail below with a focus on differences between the present embodiment and the first embodiment.
In the present embodiment, as shown in fig. 11, the two shutter members have fan shapes with different sizes, and in the open position, the two shutter members overlap each other (shown in the right of fig. 11), and in the blocking position, the two shutter members are combined to form a complete circle (shown in the left of fig. 11). A shielding portion (not shown in the drawings) is also provided between the two shutter members in the assembled state, and the shielding portion may be formed on either one of the two shutter members.
the vacuum chamber 11 of the vapor deposition device 1 according to the second embodiment has a single projection projecting outward on a side wall thereof, and a shutter housing space 12 is formed inside the projection to house two shutter members in the open position.
in the above-described baffle receiving space 12, an adhesion preventing plate (not shown in the drawings) for preventing the evaporation material from entering into the baffle receiving space 12 is provided at a position near the opening thereof.
The adhesion preventing plate of the present embodiment is also provided with a notch portion through which the shielding portion passes when the shutter member is opened or closed, as in the adhesion preventing plate of the first embodiment.
According to the vapor deposition device 1 of the second embodiment, the same effect of preventing the vapor deposition material from entering the vapor deposition region as in the first embodiment can be obtained, and in addition, since only one baffle plate housing space 12 is provided in the vacuum chamber 11, the volume of the vapor deposition device 1 can be reduced, and the device can be downsized.
(third embodiment)
A vapor deposition method for depositing an evaporation material on a member to be vapor deposited (substrate) will be described with reference to the vapor deposition device 1 of the first embodiment or the second embodiment.
the vapor deposition method of the present embodiment includes an adhesion step of adhering an evaporation material evaporated from an evaporation source to a substrate; a shielding step of shielding the evaporation material from the evaporation source toward the substrate; and a moving step of moving the substrate.
in the deposition step, when the vapor deposition device 1 is used to deposit a vapor deposition target member, the evaporation source shielding assembly 4 located above the evaporation source 3 is turned on to expose the evaporation source 3 located below, and the evaporation source 3 is heated to evaporate the evaporation material in the evaporation source 3, thereby depositing the evaporation material on the vapor deposition target member, for example, a substrate.
In the shielding step, after the completion of vapor deposition on the substrate positioned above the evaporation source 3, the evaporation source shielding assembly 4 is set in a shielding state in order to shield the evaporation material from the evaporation source 3 toward the substrate. After that, the substrate on which the deposition has been completed is moved to another position. Here, in order to set the evaporation source shielding assembly 4 to the shielding state, the plurality of baffle members of the evaporation source shielding assembly 4 are joined together, thereby forming a barrier between the evaporation source 3 and the substrate.
In the present embodiment, the shielding portion 5 is further disposed between at least a pair of shutter members in a state where a plurality of shutter members are combined. By disposing the shielding portion 5, the evaporated substance can be suppressed from leaking between the split shutter members.
In the vapor deposition method according to the present embodiment, any of the vapor deposition devices described in the first and second embodiments may be used.
(fourth embodiment)
Next, a method for manufacturing an organic EL display device will be described as an example of a method for manufacturing an electronic device.
First, a circuit for driving the organic EL display device and a first electrode are formed on a substrate using a vapor deposition apparatus. A patterned insulating layer is formed on a substrate on which a circuit and a first electrode are formed, so that an opening is formed in a portion where the first electrode is formed. The opening corresponds to a light-emitting region where the light-emitting element actually emits light. The substrate was transferred to the deposition apparatus again, and a hole transport layer, a light-emitting layer, and an electron transport layer were formed in this order. And finally, forming a second electrode and a protective layer, and finishing the organic EL display device.
in the method for manufacturing an electronic device according to the present embodiment, any of the vapor deposition devices described in the first and second embodiments may be used.
It should be noted that the above-mentioned embodiments are only illustrative and not restrictive, and that various obvious or equivalent modifications or alterations made to the above-mentioned details by those skilled in the art are intended to be included within the scope of the appended claims without departing from the basic principle of the invention.
Claims (20)
1. An evaporation apparatus (1) having an evaporation source (3) and an evaporation source shield assembly (4) arranged above the evaporation source (3), the evaporation source shield assembly (4) comprising at least two baffle members, at least one of which is movable between a shield position and an open position, the at least two baffle members, when in the shield position, merging into a baffle so as to form a barrier between the evaporation source (3) and a substrate (2) being evaporated; the vapor deposition device (1) is characterized in that,
A shielding part (5) is arranged between at least one pair of baffle parts which are adjacent to each other in a split state.
2. The vapor deposition device (1) according to claim 1,
The at least two shutter members are movable between a blocking position and an open position.
3. The vapor deposition device (1) according to claim 1,
A gap is provided between the at least one pair of baffle members, and the shielding part (5) is arranged to fill the gap.
4. The vapor deposition device (1) according to claim 1,
The shielding portion (5) is provided on one of the at least one pair of shutter members.
5. The vapor deposition device (1) according to claim 4,
The shielding portion (5) is provided at an edge position of the corresponding shutter member.
6. The vapor deposition device (1) according to claim 1,
In the assembled state, the at least one pair of shutter members partially overlap to form an overlapping region (6), and the shielding portion (5) is located in the overlapping region (6).
7. The vapor deposition device (1) according to claim 1,
The shielding part (5) is in a strip shape.
8. the vapor deposition device (1) according to claim 1,
and a convex rib (7) is arranged on the periphery of at least one baffle plate part, and the convex direction of the convex rib (7) is deviated from the evaporation source (3).
9. The vapor deposition device (1) according to any one of claims 1 to 8,
The evaporation source shielding assembly (4) comprises N baffle plates, namely a first baffle plate, a second baffle plate, … … and an Nth baffle plate;
Wherein, in a split state, the first baffle member, the second baffle member, … …, the Nth baffle member are adjacent in sequence, and the first baffle member is adjacent to the Nth baffle member; the distances from the first, second, … …, and N-th baffle members to the evaporation source (3) are sequentially increased, and the shielding section (5) is provided between the first and N-th baffle members.
10. The vapor deposition device (1) according to claim 9,
The other portions of the baffle members adjacent to each other are in contact with each other except for the portions of the first baffle member and the nth baffle member adjacent to each other.
11. The vapor deposition device (1) according to claim 10,
The height dimension of the shielding part (5) is equal to the sum of the height dimensions of the rest baffle parts except the first baffle part and the Nth baffle part.
12. the vapor deposition device (1) according to claim 9,
said N is equal to 3.
13. The vapor deposition device (1) according to claim 1,
Each of said baffle members is rotatably mounted and is provided with a pivot shaft (9) and a pivot arm (8), said baffle members being fixed to said pivot arm (8), said pivot arm (8) rotating around said pivot shaft (9).
14. the vapor deposition device (1) according to claim 13,
The evaporation source shielding assembly (4) comprises two baffle plates which are fan-shaped and have different sizes, and when the two baffle plates are in an opening position, the two baffle plates are mutually overlapped.
15. The vapor deposition device (1) according to any one of claims 1 to 8,
the evaporation device (1) comprises a vacuum container (11), wherein the evaporation source (3) and the evaporation source shielding assembly (4) are positioned in the vacuum container (11), the side wall of the vacuum container (11) is provided with a convex part protruding outwards, and a baffle plate accommodating space (12) is formed on the inner side of the convex part and used for accommodating the baffle plate component in the opening position.
16. the vapor deposition device (1) according to claim 15,
In the baffle receiving space (12), at a position near the opening of the baffle receiving space (12), an adhesion preventing plate (10) for preventing an evaporation material from entering the baffle receiving space (12) is provided.
17. The vapor deposition device (1) according to claim 16,
The baffle receiving space (12) comprises a first receiving space (121) located at one side of the vacuum container (11) and a second receiving space (122) located at the other side of the vacuum container (11);
The evaporation source shielding assembly (4) comprises a first baffle plate member (41), a second baffle plate member (42) and a third baffle plate member (43), when the baffle plates are at open positions, the first baffle plate member (41) and the third baffle plate member (43) are received in the first receiving space (121), and the second baffle plate member (42) is received in the second receiving space (122);
The adhesion preventing plate (10) includes a first adhesion preventing plate (101) provided in the first housing space (121), the first adhesion preventing plate (101) being located between the first shutter member (41) and the third shutter member (43) when the shutter member is in the open position; and/or the adhesion prevention plate (10) comprises a second adhesion prevention plate (102) and a third adhesion prevention plate (103) which are arranged in the second receiving space (122), and when the baffle member is at the opening position, the second baffle member (42) is positioned between the second adhesion prevention plate (102) and the third adhesion prevention plate (103).
18. The vapor deposition device (1) according to claim 17,
A shielding part (5) is arranged on the first baffle part (41) or the third baffle part (43), and the first anti-adhesion plate (101) is provided with a notch part for the shielding part (5) to pass through;
And/or, a shielding part (5) is arranged on the second baffle component (42), and the second adhesion preventing plate (102) or the third adhesion preventing plate (103) is provided with a notch part for the shielding part (5) to pass through.
19. An evaporation method includes an adhesion step of adhering an evaporation material evaporated from an evaporation source to a substrate; a shielding step of shielding the evaporation material from the evaporation source toward the substrate; and a moving step of moving the substrate, the vapor deposition method being characterized in that,
The shielding step includes the steps of: a plurality of baffle members arranged between an evaporation source and a substrate are combined to form a barrier between the evaporation source and the substrate, and a shielding portion is arranged between at least a pair of the baffle members in the combined state.
20. a method of manufacturing an electronic device having at least one of an organic film and a metal film formed on a substrate, the method being characterized in that,
The at least one film is formed by the evaporation method according to claim 19.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810579012.2A CN110578116A (en) | 2018-06-07 | 2018-06-07 | Vapor deposition apparatus, vapor deposition method, and method for manufacturing electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810579012.2A CN110578116A (en) | 2018-06-07 | 2018-06-07 | Vapor deposition apparatus, vapor deposition method, and method for manufacturing electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110578116A true CN110578116A (en) | 2019-12-17 |
Family
ID=68810049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810579012.2A Pending CN110578116A (en) | 2018-06-07 | 2018-06-07 | Vapor deposition apparatus, vapor deposition method, and method for manufacturing electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110578116A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111118454A (en) * | 2020-03-18 | 2020-05-08 | 郑州科探仪器设备有限公司 | Vacuum evaporation equipment |
| CN111809145A (en) * | 2020-06-29 | 2020-10-23 | 昆山国显光电有限公司 | Evaporation plating device |
| CN113106412A (en) * | 2021-04-15 | 2021-07-13 | 江苏集萃有机光电技术研究所有限公司 | Baffle mechanism of production line is produced in coating by vaporization |
| CN114574815A (en) * | 2020-11-30 | 2022-06-03 | 佳能特机株式会社 | Film forming apparatus |
| CN114622165A (en) * | 2020-12-10 | 2022-06-14 | 佳能特机株式会社 | Film forming apparatus, film forming method, and method for manufacturing electronic device |
| CN115537763A (en) * | 2021-06-29 | 2022-12-30 | 鑫天虹(厦门)科技有限公司 | Open-close type shielding component and film deposition machine station with same |
-
2018
- 2018-06-07 CN CN201810579012.2A patent/CN110578116A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111118454A (en) * | 2020-03-18 | 2020-05-08 | 郑州科探仪器设备有限公司 | Vacuum evaporation equipment |
| CN111809145A (en) * | 2020-06-29 | 2020-10-23 | 昆山国显光电有限公司 | Evaporation plating device |
| CN111809145B (en) * | 2020-06-29 | 2023-07-18 | 昆山国显光电有限公司 | Vapor deposition device |
| CN114574815A (en) * | 2020-11-30 | 2022-06-03 | 佳能特机株式会社 | Film forming apparatus |
| CN114574815B (en) * | 2020-11-30 | 2023-11-28 | 佳能特机株式会社 | Film forming apparatus |
| CN114622165A (en) * | 2020-12-10 | 2022-06-14 | 佳能特机株式会社 | Film forming apparatus, film forming method, and method for manufacturing electronic device |
| CN114622165B (en) * | 2020-12-10 | 2023-10-31 | 佳能特机株式会社 | Film forming apparatus, film forming method, and method for manufacturing electronic device |
| CN113106412A (en) * | 2021-04-15 | 2021-07-13 | 江苏集萃有机光电技术研究所有限公司 | Baffle mechanism of production line is produced in coating by vaporization |
| CN115537763A (en) * | 2021-06-29 | 2022-12-30 | 鑫天虹(厦门)科技有限公司 | Open-close type shielding component and film deposition machine station with same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110578116A (en) | Vapor deposition apparatus, vapor deposition method, and method for manufacturing electronic device | |
| KR100696547B1 (en) | Method for depositing film | |
| JP5330107B2 (en) | Aperture device | |
| KR20060109627A (en) | Mask used for forming an electroluminescent layer | |
| US20090166195A1 (en) | Sputtering apparatus | |
| US20110220022A1 (en) | Thin film deposition apparatus | |
| JPH10321372A (en) | Organic el display panel and its manufacture | |
| US20210043872A1 (en) | Display panel, display device and method for manufacturing the same | |
| KR101074792B1 (en) | Apparatus for thin layer deposition | |
| TW201816149A (en) | Method for producing vapor deposition mask, method for producing organic semiconductor element, and method for producing organic el display | |
| EP1394869A2 (en) | Method of forming protection film for covering electronic component and electronic device having protection film | |
| CN106282930B (en) | Evaporation plating device | |
| TWI444486B (en) | Mask positioning optical system | |
| KR102608846B1 (en) | Deposition sorce and method of manufacturing the same | |
| JP2012229462A (en) | Multipoint evaporation source device | |
| KR102334409B1 (en) | Mask stack and the control method thereof | |
| KR102303994B1 (en) | Method for manufacturing substrate for organic light emitting diode | |
| JP6276804B2 (en) | Vapor deposition equipment | |
| JP2004300495A (en) | Evaporation mask and evaporation method using the same | |
| KR20200029670A (en) | Depositing apparatus and method for manufacturing organic light emitting diode display using the same | |
| KR20100004783A (en) | Heating crucible and deposition apparatus with the same | |
| KR20140087820A (en) | Substrate Tray for Thin Layer Deposition and Thin Layer Deposition Equipment Having the Same | |
| JP2017014616A5 (en) | ||
| CN112442661B (en) | Vapor deposition device | |
| JP4177021B2 (en) | Method for controlling vapor deposition apparatus and vapor deposition apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20191217 |
|
| WD01 | Invention patent application deemed withdrawn after publication |