JP2013211139A - Deposition device and deposition method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a deposition device and a deposition method which can perform vapor deposition with high accuracy even for a large-sized substrate.SOLUTION: In the deposition device or the deposition method of aligning, in a non-pixel region existing at least around a pixel region, a mask which has check vapor deposition openings and a substrate on which a deposition material is vapor deposited on a surface, and vacuum-depositing the deposition material on the substrate, the substrate is a substrate having substrate units obtained by division of the substrate into a plurality of substrates; a pattern formed on the substrate in the vapor deposition by the check vapor deposition openings which correspond to division positions is imaged: a position gap is detected based on the imaging result; a correction amount of the alignment is calculated based on the detection result; and correcting an alignment amount based on the correction amount to align the mask and the substrate.

Description

The present invention relates to a film forming apparatus and a film forming method for forming a vacuum deposited film, and more particularly to a film forming apparatus and a film forming method suitable for forming a thin film having a uniform thickness on a large substrate.

  An organic EL element used in an organic EL display device or a lighting device has a structure in which an organic layer made of an organic material is sandwiched between a pair of electrodes of an anode and a cathode from above and below, and holes are applied from the anode side by applying a voltage to the electrodes. However, electrons are injected from the cathode side into the organic layer and recombined to emit light.

This organic layer has a structure in which a multilayer film including a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and a charge injection layer is laminated.
Each laminated structure of the multilayer film needs to be deposited with high accuracy. Therefore, a technique is required in which the substrate and the mask are aligned with high accuracy, vapor deposition is performed, and the position is confirmed after the vapor deposition.

  As such a conventional technique, Patent Document 1 discloses a reference having a plurality of openings on the outside of a pixel region and a frame such as a metal film showing an inspection region at the position of the substrate corresponding to the positional relationship with the openings. A method is disclosed in which a position is provided, a positional shift is detected with reference to the frame, and a position after the deposition is confirmed.

JP 2009-158328 A

  With recent organic EL display devices showing signs of switching from the main mobile phones to TVs and the like, the demand for larger substrates has increased, and the need for position confirmation after deposition has become more important. This is because the mask is also enlarged with an increase in the size of the substrate, and the positional deviation during vapor deposition may be larger than the thermal expansion of the mask / substrate, particularly the mask.

  However, in the above prior art, it is disclosed to provide inspection regions at two locations on the diagonal of the substrate, and to arrange other than on the diagonal, but in order to deposit with high accuracy with the large size of the substrate, It is not described how to arrange other than the above.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a film forming apparatus or a film forming method capable of highly accurate vapor deposition even when a substrate is enlarged.

  In order to achieve the above object, the present invention aligns the mask having a test vapor deposition opening for detecting at least a positional deviation of the mask in a non-pixel region existing around the pixel region and the substrate, and forms the substrate. In the film-forming apparatus or film-forming method for vacuum-depositing a film material, the substrate is a substrate having a substrate unit divided into a plurality of substrates after the vapor deposition, and the inspection vapor deposition provided corresponding to the division position Imaging a pattern that is an inspection deposit formed on the substrate by the vapor deposition through the opening, detecting the positional deviation based on the imaging result, determining the alignment correction amount based on the detection result, The first feature is to perform alignment by correcting the alignment amount based on the correction amount.

In order to achieve the above object, according to the present invention, in addition to the first feature, the non-pixel region has a quadrangle, and the inspection vapor deposition openings are provided at least on the diagonal line or at the four corners of the substrate unit. It is characterized by.
Furthermore, in order to achieve the above object, according to the second aspect of the present invention, in addition to the first feature, two or more inspection vapor deposition openings are provided at equal intervals on at least one side of the non-pixel region. Features.

In addition to the first feature, the present invention has a third feature that, in addition to the first feature, the detection obtains the positional deviation as a reference position with an alignment mark provided on the substrate.
Furthermore, in order to achieve the above object, according to the fourth aspect of the present invention, in addition to the first feature, the inspection determines the correction amount based on the positional deviation result of a plurality of the substrates. Features.
In order to achieve the above object, according to the present invention, in addition to the first feature, the inspection is characterized in that the correction amount predicts a defective deposition time from a trend.

  ADVANTAGE OF THE INVENTION According to this invention, the film-forming apparatus or film-forming method which can be vapor-deposited with high precision even if a board | substrate becomes large can be provided.

It is the figure which showed one Embodiment of the structure of the organic electroluminescent display apparatus manufacturing apparatus. FIG. 2 is a diagram showing an outline of internal configurations of a transfer chamber and a processing chamber in the apparatus shown in FIG. FIG. 3 is a diagram showing a first embodiment of a mask that is one of the features of the present invention. It is a figure which shows mainly the outline | summary of the internal structure of the conveyance chamber which has one Embodiment of the test | inspection unit which measures the position shift which arises by the thermal expansion etc. of a mask and a board | substrate. It is a figure which shows the flow of the inspection process of the alignment and vapor deposition in a vacuum vapor deposition chamber and a conveyance chamber of this embodiment, and position shift. It is a figure which shows typically the state after vapor deposition containing the board | substrate unit divided into four. FIG. 3 is a diagram mainly showing alignment misalignment correction in a series of alignment and vapor deposition flows from a hole injection layer to an electron injection layer in order to manufacture an organic EL display device. 2 shows a second embodiment of a mask which is one of the features of the present invention. It is the figure which provided the test | inspection area | region around the mask which does not need board | substrate division | segmentation.

  As an example of the vacuum film forming apparatus according to the present invention, an example applied to the manufacture of an organic EL display device will be described. A device for manufacturing an organic EL display device vacuums a thin film layer of various materials such as a hole injection layer, a hole transport layer, and a light emitting layer (organic film layer) on the anode, and an electron injection layer and a transport layer on the cathode. It is an apparatus that forms multiple layers by vapor deposition.

  FIG. 1 shows an embodiment of a configuration of an organic EL display device manufacturing apparatus. The organic EL display device manufacturing apparatus 100 according to the present embodiment is roughly divided into a load cluster 3 that carries a substrate 200 to be processed, four clusters (A to D) that process the substrate 200, and adjacent clusters 2a to 2d. Alternatively, it is configured to include five delivery chambers 4a to 4e installed between the cluster and the load cluster 3 or the next process (sealing process).

  The load cluster 3 includes a load lock chamber 31 having a gate valve 10 in order to maintain a vacuum in front and back, and a transfer robot 5R that receives the substrate 200 from the load lock chamber 31 and turns to carry the substrate 200 into the delivery chamber 4a. ing. Each load lock chamber 31 and each delivery chamber 4a have a gate valve 10 in the front and rear, while controlling the opening and closing of the gate valve 10 and maintaining a vacuum (the figure of a means for maintaining a vacuum, for example, a vacuum exhaust pump is shown in FIG. (Omitted) Deliver the board to the load cluster 3 or the next cluster.

  Each cluster (A to D) includes a transfer chamber 2a to d having transfer robots 5a to 5d, and two processes arranged on the top and bottom of the drawing for receiving a substrate from the transfer robots 5a to 5d and performing a predetermined process. It has chambers 1a to d, u or d (first subscripts a to d indicate clusters, and second subscripts u and d indicate upper and lower sides). Gate valves 10 are respectively provided between the transfer chambers 2a to 2d and the processing chambers (1au to 1du, 1ad to 1dd).

  FIG. 2 shows an outline of the internal configuration of the transfer chamber (2a to 2d) and the processing chamber (1au to 1du, 1ad to 1dd). Although the configuration of the processing chambers (2a to 2d) varies depending on the processing contents, a vacuum deposition chamber 1bu that deposits a light emitting material and forms an EL layer will be described as an example. A transfer robot 5b installed inside the transfer chamber 2b has an arm 51 having a structure that can be turned left and right, and a comb-like hand 52 for transferring a substrate is attached to the tip of the arm 51.

  On the other hand, as shown in FIG. 2, the vacuum evaporation chamber 1 bu is roughly divided along the substrate 200 where the evaporation source part 71 for evaporating the luminescent material (see the drawing symbol 73) and evaporating it on the substrate 200 is held vertically. Comb teeth for transferring the substrate 200 between a vertical drive unit 72 for driving vertically in parallel, a mask 81 for depositing a light emitting material on a necessary portion of the substrate 200, and a comb-shaped hand 61 for a processing chamber. A hand 51 and a substrate turning means 60 for turning the substrate 200 received by the comb-shaped hand 51 upright and moving it to the substrate holding means 82 are provided.

  Next, the alignment unit will be described. In this embodiment, the alignment optical system 83 is used to determine whether or not the mask 81 is set at a desired position. The alignment is controlled so that the alignment mark 84 provided on the substrate 200 overlaps with the vicinity of the center of the alignment window 85 provided on the mask 81. In order to move so as to overlap, the mask 81 has a vertical drive mechanism that moves in the vertical direction using the slope guide 90 and the vertical movement motors 91a and 91b, and a horizontal drive mechanism that moves in the horizontal direction by the horizontal movement motor 92. .

  Next, an embodiment of the mask 81 which is one of the features of the present invention is shown in FIG. A mask 81 shown in FIG. 3 is a mask applied when the substrate 200 is divided into four as an example of division.

  The mask 81 includes a mask portion 81M having a pixel region 86, and a frame portion 81F that applies a certain tension to the mask portion and supports the mask portion. Since the substrate 200 is divided into four parts, the four pixel regions 86 also exist in the mask portion 81M. That is, a non-pixel area 88 that is not a pixel area exists in the peripheral area 88a and the cross-shaped divided area 88b of the mask portion 81M. In order to obtain a high-definition substrate, it is important to manage so that the positional deviation of the pixel region is small in units to be divided.

  Therefore, in the present embodiment, the inspection area 87 for detecting the positional deviation is provided in the non-pixel area 88 existing outside the four corners of the four pixel areas. As shown in FIG. 3, the inspection area in the present embodiment is provided at a total of nine places because it is shared by the boundary areas of the pixel areas. Then, alignment is performed so that, for example, the positional deviations of the four pixel regions are averaged based on the nine positional deviation inspection results.

  Next, the configuration of the inspection area 87 will be described. As shown in the drawing A, the inspection region is provided with an inspection vapor deposition hole 87h as an inspection vapor deposition opening of about several μm, for example. The mask 81 has red (R), G (green), and B (blue) masks that constitute pixels. If the mask shown in FIG. 3 is for R, an inspection vapor deposition hole 87hr indicated by a solid line is provided. Is provided. The inspection and vapor deposition holes 87hg and 87hb are provided in the G and B masks so as to be vapor-deposited at positions shifted on the substrate as indicated by broken lines. In this embodiment, the inspection vapor deposition hole is, for example, about several μm, but the shape of the inspection vapor deposition opening may be rectangular or cross-shaped, and the size is determined by, for example, the required definition. In addition, an inspection area | region here means the opening area for inspection vapor deposition, or the peripheral area | region containing the inspection vapor deposition mentioned later.

  Note that the drawing B shows the configuration of the pixel region 86. In the drawing B, all the pixel vapor deposition openings 86hr, 86hg, 86hb corresponding to R, G, B out of the rectangular pixel vapor deposition openings 86h constituting the pixel are drawn. For example, in the case of depositing a red deposition material, pixel deposition openings 86hr are provided at regular intervals (for example, several hundred μm).

  On the other hand, as shown in FIG. 3, the frame part 81F has alignment mark windows 85 that look into the metal film alignment marks 84 provided at the four corners of the substrate at positions that overlap the four corners of the substrate. Is provided.

  Next, an embodiment of an inspection unit 300 that measures a positional deviation caused by thermal expansion of a mask / substrate will be described with reference to FIG. The inspection unit 300 is provided in the upper part of the transfer chamber 2b. The inspection unit includes an inspection shaft 301 that moves a fixed shaft 302 fixed to the transfer chamber in the direction of arrow 303. Inspection optical systems 301a, 301b and 301c are provided at both ends and the center of the inspection shaft. Each inspection optical system includes an irradiation part (not shown) for irradiating an inspection deposit (89 in FIG. 6 to be described later) existing in the inspection region and a line sensor (not shown) for capturing fluorescence from the irradiation part. Have. Therefore, the substrate 200 is unloaded from the vacuum deposition chamber 1bu by the transfer robot 5b, comes under the inspection unit 300, and stops. The inspection unit moves the inspection axis 301 along the fixed axis 302, scans the inspection area on the substrate 200 with each line sensor, images the inspection area, and transmits the imaging result to the processing device 400 existing in the cluster 2a. .

  Next, the processing flow of the alignment / vapor deposition and positional deviation inspection in the vacuum deposition chamber 1bu and the transfer chamber 2b will be described with reference to FIG. 4 mainly with reference to FIG. In FIG. 5, the left side of the alternate long and short dash line indicates processing in a processing chamber such as a vacuum deposition chamber, and the right side of the alternate long and short dash line indicates processing in a processing apparatus.

  First, the alignment vapor deposition process will be described. In step S10, the transfer robot 5b installed inside the transfer chamber 2b transfers the substrate 200 to the processing chamber comb-shaped hand 61 in the vacuum deposition chamber 1bu by the comb-shaped hand 52. In step S <b> 11, the received substrate 200 is turned upright by the substrate turning means 60 and moved to the substrate holding means 82.

  Next, in step S12, in order to confirm whether the mask 81 and the substrate 200 have been set at desired positions, first, the substrate 200 is brought close to a certain distance, for example, several mm away from the mask 81. Next, alignment amounts (ΔX, ΔY, Δθ) of the substrate 200 and the mask 81 at the center of the substrate are obtained by the alignment optical system 83 provided at the upper part of the alignment marks 84 near the four corners of the substrate 200 at two places at the bottom and four places in total. Is detected. Based on this result, alignment is performed by the vertical drive mechanism, left / right drive mechanism, and θ drive mechanism provided on the mask 81. In the vertical drive (ΔX), the vertical movement motors 91 a and 91 b are simultaneously driven, and the mask 81 is passively moved by the slope guide 90. The left / right drive (ΔY) drives the left / right moving motor 92, and the mask 81 is passively moved by the slope guide 90. Further, the θ drive moves one of the vertical movement motors 90 a and 90 b, and the mask 81 is passively moved by the slope guide 90.

In step S13, the substrate turning means 60 is brought close to a certain distance in the front-rear direction, and then the substrate 200 and the mask 81 are brought into close contact with each other. Next, vapor deposition is performed by moving the line-shaped deposition source 71 up or down.
In step S14, the substrate turning means 60 is used to level the substrate 200. The transfer robot 5b installed in the transfer chamber 2b receives the substrate from the processing chamber comb-shaped hand 61 to the comb-shaped hand 52 of the transfer robot 5b. After receipt, the substrate is moved to the inspection chamber. In this embodiment, the transfer chamber is an inspection chamber, the substrate 200 is moved to the lower part of the inspection unit 300 fixed to the upper part of the transfer chamber, and the process proceeds to the inspection process.

In step S50 of the inspection process, the inspection shaft 301 of the inspection unit 300 is moved to scan the inspection optical systems 301a, 301b, and 301c, and the nine inspections shown in FIG. 6 deposited in the inspection vapor deposition holes 87h shown in FIG. The four alignment marks 84 on the deposit 89 and the substrate 200 are imaged, and the imaging data is taken into the processing device 400.
In step S51, the position of the alignment mark is detected based on the imaging data, and the positions of the nine inspection deposits 89 are detected with the alignment mark 84UL at the upper left as the reference position.

In step 52, the position of each inspection deposit 89 on the first substrate loaded in the vacuum deposition chamber 1bu or the average position of each inspection deposit 89 on a certain number of substrates is determined as each inspection deposit. It is determined as the specified position. The positional deviation amounts ΔX and ΔY in the vertical (X) direction and the horizontal (Y) direction are obtained as positional deviation amounts from the specified position with respect to each inspection deposit 89 on the substrate to be processed. Then, positional deviation amount ΔX of nine test deposit 89, the average positional deviation amount △ X _AVE the [Delta] _Y, △ Y seek _AVE, the positional deviation amount of the substrate center position which defines the alignment position. The angle shift Δθ of the center position due to the position shift from the average position shift amounts ΔX _AVE and ΔY _AVE is defined as an average angle shift amount Δθ _AVE . The average position displacement amount △ _{X AVE,} △ _{Y AVE} and the average angle deviation amount △ theta _AVE alignment correction amount △ Xh, △ Yh, the △ [theta] h.

There is a possibility that the amount of the positional deviation is larger as the inspection deposit is located far from the alignment mark 84UL as the reference position or at the center of the mask portion 81. In that case, the average positional deviation amounts ΔX _AVE and ΔY _AVE may be obtained by weighting depending on the position.
In the above case, only the upper left substrate alignment mark 84UL is used as the reference position, but the above-described average positional deviation amounts ΔX _AVE and ΔY _AVE are obtained for the four alignment marks 84, and the four average positional deviations are obtained. An average value of the amounts ΔX _AVE and ΔY _AVE may be used as a final average positional deviation amount, that is, a correction amount.
Further, from the four inspection organic units 89 surrounding the divided substrate unit 200c shown in FIG. 6, the average positional deviation amount etc. of each substrate unit etc. ΔX _AVE , ΔY _AVE , Δ θ _AVE may be obtained, and the average value of _{ΔX AVE} , ΔY _AVE , _{Δθ AVE} , etc., for the average position shift amount of four substrates may be used as the final average position shift amount, that is, the correction amount.

  In step 52, the alignment misalignment was obtained using the substrate alignment mark 84 as a reference position. When the alignment mark is used as the reference position, the correction amount can be obtained in a direct relationship with the alignment to be corrected, so that the correction amount can be obtained with high accuracy. However, a correction amount may be obtained by providing a metal film frame on the substrate corresponding to the inspection area 87 in the drawing A of FIG. 3, using the frame as a reference position, and using a shift from the metal film as a position shift.

  If the average deviation obtained in step 52 is larger than the allowable range, the process goes to step 58 described later to perform error processing. If so, go to step 54.

In this embodiment, in order to suppress errors due to variations in the imaging measurement of the vapor deposition in S13 and the inspection deposit and alignment mark in S50, whether or not the alignment amount is corrected after inspection for a specified number of sheets, for example, 100 sheets. to decide. Therefore, in step 54, an average positional deviation amount obtained in step 52 △ X _AVE, △ Y _AVE and average integrated value of the specified number of sheets of the angle shift amount △ theta _AVE, the average of the specified number of sheets divided by the designated number Average values of the positional deviation amounts are obtained as correction amounts ΔXh, ΔYh, and Δθh.

In step 55, for the reason described in step 54, it is determined whether or not the specified number of sheets have been inspected. If not inspected, go to step 59 to transport the inspected substrate to the next process. If yes, go to step 56.
In step 56, it is determined whether the correction amount is within a specified threshold that does not require correction of the alignment amount. If it is within the threshold value, the process goes to step 59 to transport the inspected substrate to the next process. If it is outside the threshold, go to step 57.

In step 57, it is determined whether the correction amount is within an allowable range, that is, whether the mask is distorted to the extent that correction is possible. If it is outside the permissible range, go to step 58, and if it is within the permissible range, go to step 59 to transport the inspected substrate to the next process and go to step 10 of the vapor deposition process.
In step 58, the operator is notified of this, and at least the determined substrate 200 is regarded as an error and is discharged from the apparatus. Thereafter, if error processing continues continuously, error processing such as production stop is performed in order to ensure product reliability. If not continued, the count for the specified number of sheets is reset.

  In the alignment processing unit, the alignment amount is detected by the alignment mark 84 and the alignment window 85 in step 20. In step 21, the presence or absence of a correction amount is confirmed. If there is no correction amount, the procedure goes to step 24 to perform alignment. If there is a correction amount, the correction amount is fetched from the inspection processing unit in step 22, the alignment amount is corrected in step 22, and alignment is performed in step 24. In order to prevent an excessive correction in the correction of the alignment amount in step 23, the correction amount may be multiplied by a fixed multiplication rate specified for the correction amount.

  Also, in step 23, it is possible to monitor the trend of the feedback amount that is the correction amount, for example, whether it always shifts in the same direction, predict the time when vapor deposition becomes defective from the feedback amount, and output a warning. It is.

  FIG. 7 is a diagram showing a series of alignment and deposition processes from the hole injection layer to the electron injection layer for manufacturing an organic EL display device, mainly for alignment misalignment correction, and steps 53 to 57 in FIG. Steps 22 and 23 are extracted and shown. The description with reference to FIGS. 3 to 5 shows an example of the light emitting layer red (R) shown in steps 300 to 312 of FIG. 7. However, as shown in FIG. be able to.

  As described above with reference to FIGS. 1 to 7, according to the present embodiment, the inspection region 87 for detecting a positional shift in the non-pixel region 88 existing outside the four corners of the four pixel regions to be cut is provided. By providing it, the positional deviation after deposition can be corrected by reflecting the information for each pixel area due to the thermal expansion of the mask / substrate, so that the manufacturing apparatus of an organic EL display device that can be deposited with high accuracy even if the substrate becomes large And a manufacturing method can be provided.

  In the above-described embodiment, the inspection areas are provided at the four corners of the substrate unit to be divided. However, information on the substrate unit to be divided can be obtained by providing at least two diagonal regions. Further, although the alignment marks are provided at the four corners of the substrate before being divided, it is sufficient to provide at least two positions on the diagonal line of the substrate as in the inspection region.

  FIG. 8 shows a second embodiment of a mask which is one of the features of the present invention. In the second embodiment, a plurality of inspection areas 87 are provided at equal intervals around the four sides of the substrate unit to be divided, and the correction amount is obtained from the positional deviation of these many inspection areas. Also in this embodiment, it is possible to obtain the correction amount of the alignment misalignment by the same method as the processing flow performed in the first embodiment.

According to the second embodiment, since it is possible to obtain the amount of positional deviation of the inspection areas of many inspection areas, it is possible to know the overall tendency of the positional deviation. For example, it is possible to know the location where the thermal displacement of the mask is large from the fact that the positional displacement expands and contracts as a whole or the distribution of the positional displacement of the inspection region. In the former case, it is determined that the alignment amount is normally performed and correction is not necessary.
Moreover, according to 2nd Embodiment, there can exist an effect similar to 1st Embodiment other than the effect shown above.

Furthermore, according to the second embodiment, even in the mask shown in FIG. 9 that does not require substrate division, at least the effects specific to the second embodiment can be obtained by providing an inspection region around the mask.
Further, in the case of vapor deposition using a mask that does not have the divided area 88b shown in FIG. 3 or FIG. 8 as shown in FIG. 9 on the substrate to be divided after vapor deposition, the non-pixel area in the area corresponding to the divided area is inspected area. By doing, the effect which 1st or 2nd embodiment has can be show | played.

In the first and second embodiments, the inspection unit 300 is fixed to the transfer chamber, but may be fixed to the transfer robot 5b.
Furthermore, although the line sensor is used as the imaging means of the inspection optical system, an area camera such as a CCD camera may be used.

  In the above description, an example of an organic EL display device manufacturing apparatus that manufactures an organic EL display device has been described. However, the present invention can also be applied to a film forming apparatus and a film forming method that perform vapor deposition on the same background as the organic EL display device.

3: Load cluster A to D: Processing cluster 1au to 1du, 1ad to 1dd: Processing chamber 2a to 2d: Transfer chamber 4a to 4e: Delivery chamber 10: Gate valve 31: Load lock chamber 51: Robot arm 52: Comb teeth Hands 5R, 5a to 5d: Transfer robot 60: Substrate turning means 61: Comb-shaped hand for processing chamber 71: Evaporation source unit 72: Evaporation source unit vertical drive unit 81: Mask 81M: Mask unit 81F: Mask frame Portion 82: Substrate holding means 84: Substrate alignment mark 85: Mask alignment window 86: Pixel region 86h: Pixel vapor deposition opening 87: Inspection region 87h: Inspection vapor deposition hole (opening) 88: Non-pixel region 88a: Mask portion 81M Peripheral area 88b: Divided area of mask part 81M 89: Inspection deposit (pattern) 90: Slope guy 91a, 91b: Vertical movement motor 92: Left / right movement motor 100: Organic EL display device manufacturing apparatus 200: Substrate 200c: Divided substrate unit 300: Inspection unit 301a, 301b, 301c: Inspection optical system 400: Processing device .

Claims (12)

At least a mask having an inspection vapor deposition opening in a non-pixel region existing around the pixel region, a substrate for depositing a film deposition material on the surface, an alignment means for aligning the mask, and depositing the film deposition material on the substrate In a film forming apparatus having a vacuum evaporation chamber,
The said board | substrate is a board | substrate which has a board | substrate unit divided | segmented into a several board | substrate, Comprising: The imaging which images the pattern formed on the said board | substrate by said vapor deposition by the said test | inspection vapor deposition opening provided corresponding to the said division | segmentation position Means for detecting a positional deviation between the mask and the substrate based on the imaging result and determining a correction amount for the alignment based on the detection result, and the alignment means includes the correction amount. A film forming apparatus having a control means for correcting and aligning the alignment amount based on the above.   2. The film forming apparatus according to claim 1, wherein the inspection vapor deposition openings are provided on at least diagonal lines or four corners of the substrate unit.   The film forming apparatus according to claim 1, wherein three or more inspection vapor deposition openings are provided on at least one side of the non-pixel region.   2. The film forming apparatus according to claim 1, wherein a part of the inspection vapor deposition opening is a pixel vapor deposition opening formed in the pixel region.   The film forming apparatus according to claim 1, wherein the inspection unit obtains the misalignment as an alignment mark provided on the substrate.   2. The film forming apparatus according to claim 1, wherein the inspection unit obtains the positional deviation using a frame of a metal film provided at a position of the substrate corresponding to an inspection vapor deposition opening as a reference position.   The film forming apparatus according to claim 1, wherein the inspection unit determines the correction amount based on the positional deviation result of the plurality of substrates.   The film forming method according to claim 1, wherein the inspection unit predicts a defective deposition time from the trend of the correction amount. At least the mask having the inspection vapor deposition opening in the non-pixel region existing around the pixel region, the substrate on which the film deposition material is deposited on the surface, and the mask are aligned, and the film deposition material is vacuum deposited on the substrate. In the membrane method,
The substrate is a substrate having a substrate unit that is divided into a plurality of substrates after the vapor deposition, and a pattern formed on the substrate by the vapor deposition by the inspection vapor deposition opening provided corresponding to the division position. Imaging, detecting the positional deviation based on the imaging result, determining a correction amount of the alignment based on the detection result, correcting the alignment amount based on the correction amount, and performing alignment. Membrane method.   The film formation method according to claim 9, wherein the detection is performed by using an alignment mark provided on the substrate as the reference position.   The film forming method according to claim 9, wherein in the inspection, the correction amount is determined based on the positional deviation result of a plurality of the substrates.   The film formation method according to claim 9, wherein in the inspection, the correction amount predicts a vapor deposition defect time from a trend.

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