JP2019210495A - Vapor deposition method, production method of electronic device, and vapor deposition apparatus - Google Patents

Abstract

To provide a vapor deposition method, a production method of an electronic device, and a vapor deposition apparatus that can suppress film blurs even for a large-sized substrate.SOLUTION: In a vapor deposition method, a mask composed of a plurality of mask strips 310 is arranged on the principal surface side of a substrate standing erect and a film is deposited on the principal surface of the substrate through a plurality of openings 311 formed on each of a plurality of the mask strips 310 from a vaporization source moving relatively to the substrate and the mask. A plurality of the openings 311 have each a rectangular shape and the vaporization source moves in the longer direction of the openings 311 in film deposition.SELECTED DRAWING: Figure 14

Description

  The present invention relates to an evaporation method for forming a film on a substrate, an electronic device manufacturing method, and an evaporation apparatus.

  In recent years, in an electronic device such as an organic EL, the size of a substrate has been increased. For this reason, when a film is formed on the substrate, the bending due to the weight of the substrate and the mask cannot be ignored. That is, when an organic film is formed on a substrate while the substrate or mask is bent, a so-called “film blur” occurs in which the film is not formed according to the shape and dimensions of the opening provided in the mask. End up. For this reason, for example, in a display device or the like, as a result of film blurring, color mixture occurs and luminance decreases, and it becomes difficult to achieve high definition of an image.

  Therefore, as a countermeasure against the bending of the substrate, a technique for performing vapor deposition with the substrate standing upright, a technique for arranging a plurality of strip-shaped masks side by side as a countermeasure against the bending of the mask, and the like have been developed.

  However, in order to suppress film blur, there is no technique that can be combinedly considered for a plurality of conditions, and there is still room for improvement.

Korean Published Patent No. 10-2018-7430

  An object of the present invention is to provide a vapor deposition method, an electronic device manufacturing method, and a vapor deposition apparatus that can suppress film blur even when the substrate is enlarged.

  The present invention employs the following means in order to solve the above problems.

The vapor deposition method of the present invention comprises:
The substrate is positioned in an upright state, and a plurality of strip-shaped masks are arranged on the main surface side of the substrate, and a plurality of the strips are formed by an evaporation source that moves relative to the substrate and the mask. A vapor deposition method for forming a film on the main surface of the substrate through a plurality of openings formed in the mask,
Each of the plurality of openings is configured by a rectangular opening,
When film formation is performed, the evaporation source is moved in a direction that coincides with the longitudinal direction of the opening.

In addition, the other vapor deposition method of the present invention,
The substrate is positioned in an upright state, and a plurality of strip-shaped masks are arranged on the main surface side of the substrate, and a plurality of the strips are formed by an evaporation source that moves relative to the substrate and the mask. A vapor deposition method for forming a film on the main surface of the substrate through a plurality of openings formed in the mask,
A plurality of the evaporation sources are provided so as to form a row aligned in the longitudinal direction of the strip-shaped mask, and a plurality of the evaporation sources are parallel to the main surface of the substrate and perpendicular to the longitudinal direction of the strip-shaped mask. The film formation is performed while moving the film.

And the manufacturing method of the electronic device of this invention is as follows.
Transporting the substrate and mask into a chamber provided with an evaporation source;
Using the vapor deposition method according to any one of the above, a step of forming an organic film on the substrate;
It is characterized by having.

Moreover, the vapor deposition apparatus of the present invention comprises:
A substrate positioning mechanism for positioning the substrate in an upright state;
A mask positioning mechanism for arranging a mask composed of a plurality of strip-shaped masks on the main surface side of the substrate positioned by the substrate positioning mechanism;
An evaporation source moving mechanism for moving the evaporation source in parallel and linearly with the main surface of the substrate positioned by the substrate positioning mechanism;
With
A deposition apparatus that deposits a film on a main surface of the substrate through a plurality of openings formed in the plurality of strip-shaped masks while moving the evaporation source by the evaporation source moving mechanism;
The plurality of openings are all configured by rectangular openings,
The moving direction of the evaporation source by the evaporation source moving mechanism is coincident with the longitudinal direction of the opening.

Furthermore, the other vapor deposition apparatus of the present invention includes:
A substrate positioning mechanism for positioning the substrate in an upright state;
A mask positioning mechanism for arranging a mask composed of a plurality of strip-shaped masks on the main surface side of the substrate positioned by the substrate positioning mechanism;
An evaporation source moving mechanism for moving the evaporation source in parallel and linearly with the main surface of the substrate positioned by the substrate positioning mechanism;
With
A deposition apparatus that deposits a film on a main surface of the substrate through a plurality of openings formed in the plurality of strip-shaped masks while moving the evaporation source by the evaporation source moving mechanism;
A plurality of the evaporation sources are provided so as to form a row aligned in the longitudinal direction of the strip mask,
A direction in which the plurality of evaporation sources are moved by the evaporation source moving mechanism is a direction perpendicular to a longitudinal direction of the strip-shaped mask.

  As described above, according to the present invention, film blur can be suppressed even when the substrate is enlarged.

FIG. 1 is a schematic configuration diagram of a vapor deposition apparatus according to Example 1 of the present invention as viewed from above. FIG. 2 is a schematic configuration diagram of the vapor deposition apparatus according to Example 1 of the present invention as viewed from the back side. FIG. 3 is a schematic configuration diagram of the vapor deposition apparatus according to Example 1 of the present invention viewed from the side surface side. FIG. 4 is an explanatory diagram of a substrate positioning mechanism according to Embodiment 1 of the present invention. FIG. 5 is an explanatory diagram of the mask positioning mechanism according to Embodiment 1 of the present invention. FIG. 6 is an explanatory diagram of the mask positioning mechanism according to Embodiment 1 of the present invention. FIG. 7 is a schematic configuration diagram of the evaporation source according to the first embodiment of the present invention as viewed from above. FIG. 8 is a schematic configuration diagram of the evaporation source according to the first embodiment of the present invention viewed from the front side. FIG. 9 is an explanatory view showing a specific example of the organic film formed on the substrate according to Example 1 of the present invention. FIG. 10 is a schematic configuration diagram of the vapor deposition apparatus according to Example 2 of the present invention as viewed from above. FIG. 11: is the schematic block diagram which looked at the vapor deposition apparatus which concerns on Example 2 of this invention from the back side. FIG. 12: is the schematic block diagram which looked at the vapor deposition apparatus which concerns on Example 2 of this invention from the side surface side. FIG. 13 is an explanatory diagram of the film forming accuracy associated with the positional relationship between the opening and the evaporation source. FIG. 14 is an explanatory diagram showing the relationship between the longitudinal direction of the opening and the moving direction of the evaporation source. FIG. 15 is an explanatory diagram showing the relationship between the longitudinal direction of the strip-shaped mask and the longitudinal direction of the opening. FIG. 16 is an explanatory diagram showing the relationship between the longitudinal direction of the strip-shaped mask and the vertical direction. FIG. 17 is an explanatory diagram showing the relationship between the longitudinal direction of the strip mask and the moving direction of the evaporation source. FIG. 18 is a table summarizing whether various conditions are satisfied.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be exemplarily described in detail with reference to the drawings. However, the dimensions, materials, shapes, relative arrangements, and the like of the components described in this embodiment are not intended to limit the scope of the present invention only to those unless otherwise specified. .

  The vapor deposition method according to the embodiment of the present invention can be applied to a vapor deposition apparatus configured to move the evaporation source in the vertical direction or a vapor deposition apparatus configured to move the evaporation source in the horizontal direction. . First, these vapor deposition apparatuses (the former will be referred to as Example 1 and the latter as Example 2) will be described. In the following description, the main surface of the substrate refers to the surface of the substrate on which film formation is performed. In the vapor deposition apparatus, a mask is disposed on the main surface side of the substrate, and an evaporation source is disposed on the opposite side of the substrate across the mask. In the following description, the case where various configurations are viewed from the substrate side toward the mask and the evaporation source is assumed to be “viewed from the front side”, and the case where various configurations are viewed from the opposite side is “viewed from the back side”. Shall.

<Example 1 of a vapor deposition apparatus>
With reference to FIGS. 1-8, the vapor deposition apparatus which concerns on Example 1 of this invention is demonstrated. 1-3 is a schematic block diagram of the vapor deposition apparatus which concerns on Example 1 of this invention, and is the figure which showed roughly the main structures of the vapor deposition apparatus. 1 is a view of the vapor deposition apparatus as viewed from above, FIG. 2 is a view of the vapor deposition apparatus as viewed from the back side, and FIG. 3 is a view of the vapor deposition apparatus as viewed from the side. FIG. 4 is an explanatory diagram of the substrate positioning mechanism according to the first embodiment of the present invention, and FIG. 4A is a diagram of the substrate in the vapor deposition apparatus and the substrate positioning mechanism as seen from the back side of the vapor deposition apparatus. FIG. 2B is a view of the substrate in the vapor deposition apparatus and the substrate positioning mechanism as viewed from the side of the vapor deposition apparatus. 5 and 6 are explanatory views of the mask positioning mechanism according to Embodiment 1 of the present invention. FIG. 5A is a view of the mask positioning mechanism in the vapor deposition apparatus as viewed from the back side of the vapor deposition apparatus, and FIG. 5B is a view of the mask positioning mechanism in the vapor deposition apparatus as viewed from the side of the vapor deposition apparatus. is there. FIG. 6 is a view showing how to attach the strip mask. 7 and 8 are schematic configuration diagrams of the evaporation source according to the first embodiment of the present invention, and are diagrams schematically showing the main configuration of the evaporation source. 7 is a view of the evaporation source as viewed from above, and FIG. 8 is a view of the evaporation source as viewed from the front side.

  The vapor deposition apparatus 10 includes a chamber 100 that is configured to be in a state close to vacuum by a vacuum pump (not shown), and an evaporation source device 400 that is disposed inside the chamber 100. The chamber 100 is configured such that the substrate 200 is positioned in an upright state, and the mask 300 is disposed on the main surface side of the substrate 200. The evaporation source device 400 plays a role of injecting the evaporated or sublimated material O toward the substrate 200 by heating or sublimating the material of the substance to be deposited on the substrate 200.

  Here, in each figure, the arrows X and Y indicate the horizontal direction, and the arrow Z indicates the vertical direction. An arrow Y indicates a direction normal to the main surface of the substrate 200 and indicates a direction from the evaporation source device 400 toward the substrate 200, and an arrow X indicates a direction perpendicular to the direction.

<< Substrate positioning mechanism >>
In particular, a positioning mechanism for the substrate 200 will be described with reference to FIG. The substrate 200 is fixed to a substrate frame 210 configured to reciprocate in the arrow X direction. A guide bar 220 is fixed to the lower end of the substrate frame 210, and a guide rail 240 is fixed to the upper end. The guide bar 220 is configured to be movable while being guided by a plurality of first guide rollers 230 arranged in a line in the X direction. The guide rail 240 is configured to be movable while being guided by a plurality of second guide rollers 250 arranged in a line in the X direction. Further, the first guide roller 230, the guide rod 220, the guide rail 240, and the second guide roller 250 are arranged in a line in the vertical direction. With the configuration as described above, the substrate 200 fixed to the substrate frame 210 can be positioned in an upright state in the vertical direction and can reciprocate in the arrow X direction.

<< Mask positioning mechanism >>
In particular, the positioning mechanism of the mask 300 will be described with reference to FIGS. The mask 300 is fixed to a mask frame 320 configured to reciprocate in the arrow X direction. A guide bar 330 is fixed to the lower end of the mask frame 320, and a guide rail 360 is fixed to the upper end. The guide bar 330 is configured to be movable while being guided by a plurality of third guide rollers 340 arranged in a line in the X direction. The guide rail 360 is configured to be movable while being guided by a plurality of fourth guide rollers 370 arranged in a line in the X direction. Further, the third guide roller 340, the guide bar 330, the guide rail 360, and the fourth guide roller 370 are arranged in a line in the vertical direction. With the configuration as described above, the mask 300 fixed to the mask frame 320 can be positioned in an upright state in the vertical direction and can reciprocate in the arrow X direction.

  The plurality of third guide rollers 340 and the fourth guide roller 370 are configured to be adjusted by the first alignment mechanism 350 and the second alignment mechanism 380, respectively. Thereby, the mask frame 320 is configured such that the position can be adjusted in each of the X direction, the Z direction, and the direction of rotation in the XZ plane. The mechanism for performing such alignment adjustment is a known technique as disclosed in, for example, Japanese Patent Application Laid-Open No. 2012-72478 and Japanese Patent Application Laid-Open No. 2012-140671. As described above, since the position of the mask frame 320 can be adjusted by the first alignment mechanism 350 and the second alignment mechanism 380, the mask 300 can be aligned with the substrate 200.

  The mask 300 according to this embodiment is composed of a plurality of strip-shaped masks 310. This configuration will be described particularly with reference to FIG. The mask frame 320 is configured by a plate-like member having a rectangular outer shape and a rectangular hole 321 provided in the center. A plurality of strip-shaped masks 310 are fixed to the mask frame 320 configured in this manner so as to be adjacent to each other. Each strip-shaped mask 310 is pulled in the longitudinal direction of the strip-shaped mask 310 and both ends thereof are fixed to the mask frame 320 by welding or the like. Each of the plurality of strip-shaped masks 310 is provided with a plurality of openings 311. Each of the plurality of openings 311 is a rectangular opening.

<< Evaporation source device >>
In particular, the evaporation source device 400 will be described with reference to FIGS. 1 to 3, 7 and 8. The evaporation source device 400 is connected to the evaporation source unit 410 including a plurality of evaporation sources 413, a pair of linear guides 420 and a pair of ball screws 430 provided on both sides of the evaporation source unit 410, and the evaporation source unit 410, respectively. An atmospheric arm 440 and a drive mechanism 450 that rotates the ball screw 430 are provided. The drive mechanism 450 includes a drive source such as a motor and a plurality of gears that transmit power from the drive source to the ball screw 430. The evaporation source unit 410 can be reciprocated along the linear guide 420 by rotating the ball screw 430 by the drive mechanism 450. Further, the inside of the atmospheric arm 440 is kept in an atmospheric state. Various signal lines connected to the evaporation source 413, water cooling flow paths, and the like are provided in the atmosphere arm 440. However, a configuration in which a connection bellows is provided instead of the atmospheric arm 440 may be employed.

  The evaporation source unit 410 includes a plurality of cases 411, a crystal monitor 412 provided at an end of each case 411, and a plurality of evaporation sources 413 provided in a row inside each case 411. The evaporation source 413, as shown in an enlarged view in a circled portion in FIG. 8, is a crucible 413a for vaporizing the material, a material reservoir 413b for accumulating the vaporized material, and jetting the vaporized material. Nozzle 413c. In this embodiment, the cases 411 are arranged in three rows in the vertical direction, and the evaporation sources 413 provided in the upper and lower cases 411 are used to inject the dopant material, and are provided in the middle case 411. The evaporation source 413 is used to inject the host material. In this embodiment, the dopant material is injected by the upper and lower evaporation sources 413 and the host material is injected by the middle evaporation source 413. However, this is only an example, and injection is performed by each evaporation source. The material to be made is not limited to this. The crystal monitor 412 plays a role of indirectly measuring the thickness of the film formed on the substrate 200.

In the case of the present embodiment, the evaporation source device 400 configured as described above performs evaporation on the substrate 200 while the evaporation source unit 410 moves in the vertical direction. 2 and 3, the evaporation source unit 410X in the standby state before vapor deposition is indicated by a dotted line. Further, in FIG. 2, a range F indicates a moving range of the evaporation source unit 410 when performing vapor deposition. As illustrated, the evaporation source unit 410 is configured to move from a position below the lower end in the vertical direction of the substrate 200 and the mask 300 to a position above the upper end in the vertical direction of the substrate 200 and the mask 300. . Thereby, a film having a certain thickness can be formed at a desired position with respect to the substrate 200. Further, the lateral width L1 of the evaporation source unit 410 is configured to be smaller than the lateral width L2 of the mask 300 (the total lateral width of the plurality of strip-shaped masks 310) (see FIG. 1). That is, in the evaporation source unit 410 according to the present embodiment, as shown in FIGS. 7 and 8, the nozzle 413 c of the evaporation source 413 disposed on the outer side in the width direction faces the outer side and evaporates disposed on the inner side in the width direction. The nozzle 413c of the source 413 is configured to face inward. Thereby, the material injected from the plurality of evaporation sources 413 is uniformly injected over a range wider than the lateral width of the evaporation source unit 410. Therefore, as described above, a film having a certain thickness can be formed at a desired position on the substrate 200 even if the width L1 <the width L2.

<Method for manufacturing electronic device>
A method for manufacturing an electronic device using the above-described vapor deposition apparatus and vapor deposition method will be described. Here, an example of an organic EL used for a display device or the like will be described as an example of an electronic device. The step of manufacturing the organic EL includes at least a step of transporting the substrate and the mask, a step of forming an organic film on the substrate, and a step of forming a metal film after the step of forming the organic film. Yes. Hereinafter, these steps will be described.

<< Conveyance process >>
First, the substrate 200 is transferred into the chamber 100 by the substrate positioning mechanism. Then, the substrate 200 is positioned in an upright state. Next, the mask 300 is transported into the chamber 100 by the mask positioning mechanism. The mask 300 is aligned with the substrate 200. As a result, the mask 300 composed of the plurality of strip-shaped masks 310 is arranged on the main surface side of the substrate 200. In this embodiment, the configuration in which the alignment adjustment of the mask 300 is performed with respect to the substrate 200 inside the chamber 100 is adopted. However, after the alignment adjustment is performed outside the chamber, the substrate and the mask are placed in the chamber. A configuration in which the sheet is conveyed into the inside of the apparatus can also be adopted.

<< Organic film formation process >>
In a state where the substrate 200 and the mask 300 are positioned inside the chamber 100, the evaporation source unit 410 is deposited while moving in the vertical direction with respect to the substrate 200 and the mask 300 (a plurality of strip-shaped masks 310). That is, the vaporized material is sprayed from the plurality of evaporation sources 413 provided in the evaporation source unit 410 and the main body of the substrate 200 is passed through the plurality of openings 311 respectively formed in the plurality of strip-shaped masks 310. A film is formed on the surface.

  In addition, when manufacturing organic EL used for a display apparatus etc., the above conveyance process and the film-forming process of an organic film are repeated at least 3 times. That is, in the case of the organic EL, it is necessary to form an organic film for a red pixel, an organic film for a green pixel, and an organic film for a blue pixel on the substrate 200. FIG. 9 shows a partially enlarged view of the substrate 200X and partially enlarged views of the masks 300X, 300Y, and 300Z. As shown in the drawing, the organic film R for red pixels, the organic film G for green pixels, and the organic film B for blue pixels need to be arranged on the substrate 200X. Therefore, after forming the organic film R with a material corresponding to the red pixel using the mask 300X for red pixels, the organic film with the material corresponding to the green pixels using the mask 300Y for green pixels. After forming G, it is necessary to form the organic film B with a material corresponding to the blue pixel using the mask 300Z for the blue pixel. Of course, the order of red, green, and blue is not limited to this order. As described above, since it is necessary to form three types of organic films R, G, and B, it is necessary to repeat the above-described transport process and organic film formation process at least three times.

<< Metal Film Formation Process >>
After three types of organic films R, G, and B are formed on the substrate 200, an electron transport layer, an electron injection layer, and the like are formed on these organic films R, G, and B. Thereafter, a metal film is further deposited. Thereby, an electron transport layer or the like is formed on these organic films R, G, and B, and a metal film is further formed thereon. In addition, about the vapor deposition method of a metal film, the vapor deposition method similar to the time of vapor-depositing said organic film can also be employ | adopted, and another well-known technique can also be employ | adopted.

(Example 2 of a vapor deposition apparatus)
10 to 12 show a vapor deposition apparatus according to Example 2 of the present invention. In the first embodiment, the configuration in the case where vapor deposition is performed while moving the evaporation source unit (evaporation source) in the vertical direction has been described. However, in this embodiment, the evaporation source unit (evaporation source) is moved in the horizontal direction. The structure in the case of performing vapor deposition is shown. Since other basic configurations and operations are the same as those in the first embodiment, the same components are denoted by the same reference numerals, and the description thereof is omitted as appropriate.

  FIGS. 10-12 is a schematic block diagram of the vapor deposition apparatus based on Example 2 of this invention, and is the figure which showed roughly the main structures of the vapor deposition apparatus. 10 is a view of the vapor deposition apparatus as viewed from above, FIG. 11 is a view of the vapor deposition apparatus as viewed from the back side, and FIG. 12 is a view of the vapor deposition apparatus as viewed from the side.

  The vapor deposition apparatus 10 </ b> A according to the present embodiment also includes the chamber 100 and the evaporation source apparatus 400 disposed inside the chamber 100. In addition, the above embodiment is also configured so that the substrate 200 is positioned in an upright state inside the chamber 100 and the mask 300 is disposed on the main surface side of the substrate 200. This is the same as the case of 1. 10 to 12, arrows X and Y indicate the horizontal direction, and arrow Z indicates the vertical direction. An arrow Y indicates a direction normal to the main surface of the substrate 200 and indicates a direction from the evaporation source device 400 toward the substrate 200, and an arrow X indicates a direction perpendicular to the direction.

  Since the substrate positioning mechanism and the mask positioning mechanism are as described in the first embodiment, description thereof will be omitted. The basic configuration of the evaporation source device 400 is the same as that of the first embodiment, and a detailed description thereof will be omitted. However, in the case of the evaporation source device 400 according to the present embodiment, only the point that the evaporation source unit 410 is configured to reciprocate in the horizontal direction (X direction in FIGS. 10 and 11), not in the vertical direction. However, this is different from the configuration of the first embodiment. Since the configuration and operation of various members constituting the evaporation source device 400 are as described in the first embodiment, description thereof is omitted. In the first embodiment, the plurality of evaporation sources 413 are arranged in a line in the horizontal direction. In the present embodiment, the plurality of evaporation sources 413 are arranged in a line in the vertical direction. Are arranged as follows.

  In the case of the evaporation source device 400 according to the present embodiment, as described above, the evaporation source unit 410 is deposited on the substrate 200 while moving in the horizontal direction. In FIGS. 10 and 11, the evaporation source unit 410X in the standby state before vapor deposition is indicated by a dotted line. Further, in FIG. 11, a range F indicates a moving range of the evaporation source unit 410 when performing vapor deposition. As shown in FIG. 11, the evaporation source unit 410 moves from a position on the substrate 200 and the mask 300 on the left side of the left end in the horizontal direction to a position on the right side of the substrate 200 and the mask 300 in the horizontal direction on the right side in the drawing. It is configured as follows. Thereby, a film having a certain thickness can be formed at a desired position with respect to the substrate 200. Further, the point that the lateral width L1 of the evaporation source unit 410 is configured to be smaller than the lateral width L2 of the mask 300 (the total lateral width of the plurality of strip masks 310) (see FIG. 12) is described in the above embodiment. This is the same as the case of 1.

  Since the method for manufacturing an electronic device using the vapor deposition apparatus 10A according to the present embodiment is the same as that in the first embodiment, description thereof will be omitted.

<Consideration on the effect of suppressing film blur>
The influence of the relationship between the longitudinal direction D1 of the rectangular opening 311 provided in the strip-shaped mask 310, the moving direction D2 of the evaporation source 413, and the longitudinal direction D3 of the strip-shaped mask 310 on the effect of suppressing film blur. The result of having considered about is demonstrated.

The evaporation source 413 is configured to move in parallel and linearly with respect to the main surface of the substrate 200. That is, the evaporation source 413 is configured to move in parallel and linearly with the surface of the strip-shaped mask 310. The evaporation source 413 moves in the vertical direction when the vapor deposition apparatus 10 according to the first embodiment is used, and moves in the horizontal direction when the vapor deposition apparatus 10A according to the second embodiment is used. Accordingly, the longitudinal direction D1 of the opening 311 and the longitudinal direction D3 of the strip-shaped mask 310 are also considered to be two directions, that is, the vertical direction or the horizontal direction. Therefore, since the above three types of directions D1, D2, and D3 are all in the vertical direction or the horizontal direction, there are a total of eight possible combinations.

  Next, discussion will be made on the result of consideration of the influence of the combination conditions of the directions of the respective parts on the effect of suppressing film blur.

<< Condition 1 >>
The consideration result about the influence which the relationship between the longitudinal direction D1 of the rectangular opening part 311 and the moving direction D2 of the evaporation source 413 has on the suppression effect of film | membrane blur is demonstrated with reference to FIG.13 and FIG.14. FIG. 13 is an explanatory diagram regarding the accuracy of film formation associated with the positional relationship between the opening and the evaporation source, and FIG. 14 is an explanatory diagram showing the relationship between the longitudinal direction of the opening and the moving direction of the evaporation source.

  It is desirable that the substrate 200 and the mask 300 are in close contact with each other. However, generally, due to the deformation of each component due to its own weight, a minute gap S is generated between the substrate 200 and the mask 300 as shown in FIG. Therefore, the more the position of the evaporation source is away from the opening 311 formed in the mask 300 in the surface direction of the main surface of the substrate 200, the more easily film blurring occurs. That is, in FIG. 13, the comparison is made from the opening 311 than the incident angle of the material injected from the evaporation source 413A located at a relatively close distance from the opening 311 through the opening 311 toward the main surface of the substrate 200. The incident angle of the material ejected from the evaporation source 413B located at a far distance through the opening 311 toward the main surface of the substrate 200 becomes smaller. In the former case, the film position can be displaced by T1 in FIG. 13 from the desired position, whereas in the latter case, T2 in FIG. 13 (T2> Only at T1), the film position can be displaced. Therefore, in the latter case, the film thickness tends to be unstable, and film blurring tends to occur.

  Here, a rectangular film corresponding to the shape and size of the opening 311 is formed on the substrate 200. For the rectangular film formed on the substrate 200, it is often important to increase the dimensional accuracy in the short direction rather than the dimensional accuracy in the longitudinal direction. This point will be described by taking as an example the case of an organic EL used in the above display device or the like. As described above, the organic film R for red pixels, the organic film G for green pixels, and the organic film B for blue pixels are formed side by side on the substrate 200X. These organic films R, G, and B are formed on the substrate 200X so that the lateral direction is adjacent. Therefore, if the dimensional accuracy in the short direction of these organic films R, G, B is low, colors may be mixed or the brightness may be lowered in a display device or the like. On the other hand, even if the dimensional accuracy in the longitudinal direction of the organic films R, G, B decreases, such a problem hardly occurs.

From the above, it is considered desirable to make the longitudinal direction D1 of the rectangular opening 311 coincide with the movement direction D2 of the evaporation source 413 (this case is referred to as “condition 1”). This point will be described in more detail with reference to FIG. 14A shows a case where the condition 1 is satisfied, and FIG. 14B shows a case where the condition 1 is not satisfied (when the longitudinal direction D1 of the rectangular opening 311 and the moving direction D2 of the evaporation source 413 are orthogonal to each other). ). As can be seen from the description of Examples 1 and 2, the moving range F of the evaporation source 413 is wider than the longitudinal direction of the strip mask 310. Therefore, for example, in FIG. 14B, the distance to the opening 311 </ b> X located farthest from the evaporation source unit 410 c located at the extreme end of the movement range F is considerably long. For this reason, the dimensional accuracy in the short-side direction of the rectangular organic film formed of the material sprayed onto the substrate 200 through the opening 311X is lowered. On the other hand, when the condition 1 is satisfied, the distance to the opening 311Y located farthest from the evaporation source unit 410c located at the end of the movement range F in FIG. . However, the rectangular organic film formed of the material injected onto the substrate 200 through the opening 311Y hardly affects the dimensional accuracy in the short direction. Therefore, it is considered that film blurring is less likely to occur when the condition 1 is satisfied. In addition, when the evaporation source 413 is moved along the longitudinal direction 311 of the opening 311, compared to when the evaporation source 413 is moved so as to cross perpendicularly to the longitudinal direction 311 of the opening 311, the film The thickness can be made constant. From this point of view, film blurring is less likely to occur when the condition 1 is satisfied.

<< Condition 2 >>
With reference to FIG. 15, description will be given of a result of a study on the influence of the relationship between the longitudinal direction D1 of the rectangular opening 311 and the longitudinal direction D3 of the strip mask 310 on the effect of suppressing film blur. FIG. 15 is an explanatory diagram showing the relationship between the longitudinal direction of the opening and the longitudinal direction of the strip-shaped mask.

  As described in the above mask positioning mechanism, the strip-shaped mask 310 is fixed to the mask frame 320 by welding or the like while being pulled in the longitudinal direction of the strip-shaped mask 310. Therefore, the influence of the tensile force can also occur on the plurality of openings 311 formed in the strip mask 310. The opening 311 is not easily deformed even when a tensile force is applied to the rectangular opening 311 in the longitudinal direction, whereas the opening 311 is easily deformed when a pulling force is applied in the short direction.

  From the above, it is considered desirable to make the longitudinal direction D1 of the rectangular opening 311 coincide with the longitudinal direction D3 of the strip mask 310 (this case is referred to as “condition 2”). 15A shows a case where the condition 2 is satisfied, and FIG. 15B shows a case where the condition 2 is not satisfied (the longitudinal direction D1 of the rectangular opening 311 and the longitudinal direction D3 of the strip-shaped mask 310 are orthogonal to each other. Case). As shown in the enlarged view of a part of the opening 311 in FIG. 15B, when the condition 2 is not satisfied, the opening 311 may be deformed relatively large. Therefore, it is considered that film blurring is less likely to occur when the condition 2 is satisfied.

<< Condition 3 >>
A consideration result of the influence of the relationship between the longitudinal direction D3 of the strip-shaped mask 310 and the vertical direction on the effect of suppressing film blur will be described with reference to FIG. FIG. 16 is an explanatory diagram showing the relationship between the longitudinal direction of the strip-shaped mask and the vertical direction.

  The strip-shaped mask 310 may be deformed due to its own weight. Therefore, it is considered desirable to make the longitudinal direction D3 of the strip-shaped mask 310 coincide with the vertical direction (this case is referred to as “condition 3”). FIG. 16A shows a case where the condition 3 is satisfied, and FIG. 16B shows a case where the condition 3 is not satisfied (when the longitudinal direction D3 of the strip mask 310 coincides with the horizontal direction).

  When the condition 3 is satisfied, the strip mask 310 has a small deformation amount due to its own weight. In contrast, when the condition 3 is not satisfied, the strip-shaped mask 310 is deformed so that the vicinity of the center protrudes downward in the vertical direction due to its own weight (see arrow G). Accordingly, the opening 311 formed in the strip-shaped mask 310 is also deformed, so that it is considered that film blurring is likely to occur. Therefore, it is considered that film blurring is less likely to occur when the condition 3 is satisfied.

<< Condition 4 >>
The consideration result about the influence which the relationship between the longitudinal direction D3 of the strip-shaped mask 310 and the moving direction D2 of the evaporation source 413 has on the suppression effect of film | membrane blur is demonstrated with reference to FIG. FIG. 17 is an explanatory diagram showing the relationship between the longitudinal direction of the strip mask and the moving direction of the evaporation source.

  Since the evaporation source 413 generates heat, the strip mask 310 is heated by the evaporation source 413. Therefore, when a part of the strip-shaped mask 310 is locally heated, the strip-shaped mask 310 is deformed so as to be curved, and film blurring is likely to occur. Therefore, it is considered desirable to make the longitudinal direction D3 of the strip-shaped mask 310 perpendicular to the moving direction D2 of the evaporation source 413 (this case is referred to as “condition 4”). That is, a plurality of evaporation source units 410 (a plurality of rows arranged in the longitudinal direction D3 of the strip-shaped mask 310 are formed in parallel to the main surface of the substrate 200 and perpendicular to the longitudinal direction D3 of the strip-shaped mask 310. It may be desirable to form the film while moving the evaporation source 413).

  Thereby, since the whole of the longitudinal direction D3 of the strip-shaped mask 310 is uniformly heated by the evaporation source 413, it is suppressed that a part of strip-shaped mask 310 is heated locally. Therefore, deformation of the strip-shaped mask 310 so as to be curved is suppressed. On the other hand, when the longitudinal direction D3 of the strip-shaped mask 310 and the moving direction D2 of the evaporation source 413 are matched, the strip-shaped mask 310 is heated by the evaporation source 413 from one end side to the other end side. Will move. Thereby, a part of the strip-shaped mask 310 is locally heated and may be deformed to be curved. Therefore, it is considered that film blurring is less likely to occur when the condition 4 is satisfied.

<< Comprehensive consideration results >>
A comprehensive consideration result will be described with reference to FIG. FIG. 18 shows whether the longitudinal direction D1 of the rectangular opening 311, the moving direction D2 of the evaporation source 413, and the longitudinal direction D3 of the strip-shaped mask 310 are each a vertical direction or a horizontal direction. 1 is a table summarizing whether or not conditions 1 to 4 are satisfied. Note that a circle is entered for cases that satisfy the conditions, and a cross is entered for cases that do not satisfy the conditions. Cases 1 to 8 are weighted in the order of condition 1, condition 2 and condition 3, and are arranged in order of priority. And about the determination, it was set as the pass (OK) about the case which satisfy | fills two or more conditions among the conditions 1-4. As a result, Case 7 and Case 8 were rejected (NG).

  DESCRIPTION OF SYMBOLS 10,10A ... Vapor deposition apparatus, 200 ... Substrate, 300 ... Mask, 310 ... Strip-shaped mask, 311 ... Opening, 400 ... Evaporation source apparatus, 410 ... Evaporation source unit, 413 ... Evaporation source

Claims (10)

The substrate is positioned in an upright state, and a plurality of strip-shaped masks are arranged on the main surface side of the substrate, and a plurality of the strips are formed by an evaporation source that moves relative to the substrate and the mask. A vapor deposition method for forming a film on the main surface of the substrate through a plurality of openings formed in the mask,
Each of the plurality of openings is configured by a rectangular opening,
An evaporation method characterized by moving the evaporation source in a direction coinciding with the longitudinal direction of the opening when forming a film. The substrate is positioned in an upright state, and a plurality of strip-shaped masks are arranged on the main surface side of the substrate, and a plurality of the strips are formed by an evaporation source that moves relative to the substrate and the mask. A vapor deposition method for forming a film on the main surface of the substrate through a plurality of openings formed in the mask,
A plurality of the evaporation sources are provided so as to form a row aligned in the longitudinal direction of the strip-shaped mask, and a plurality of the evaporation sources are parallel to the main surface of the substrate and perpendicular to the longitudinal direction of the strip-shaped mask. A vapor deposition method characterized in that film formation is performed while moving the film.   Each of the plurality of openings is configured by a rectangular opening, and using a strip-shaped mask configured such that the longitudinal direction of these openings matches the longitudinal direction of the strip-shaped mask, 3. The vapor deposition method according to claim 1, wherein film formation is performed by the evaporation source.   The film formation is performed by the evaporation source in a state where a plurality of the strip-shaped masks are positioned so that the longitudinal direction and the vertical direction of the strip-shaped mask coincide with each other. The vapor deposition method as described. Transporting the substrate and mask into a chamber provided with an evaporation source;
A step of forming an organic film on the substrate using the vapor deposition method according to claim 1;
A method for manufacturing an electronic device, comprising:   6. The method of manufacturing an electronic device according to claim 5, further comprising a step of depositing a metal film after the step of forming the organic film on the substrate. A substrate positioning mechanism for positioning the substrate in an upright state;
A mask positioning mechanism for arranging a mask composed of a plurality of strip-shaped masks on the main surface side of the substrate positioned by the substrate positioning mechanism;
An evaporation source moving mechanism for moving the evaporation source in parallel and linearly with the main surface of the substrate positioned by the substrate positioning mechanism;
With
A deposition apparatus that deposits a film on a main surface of the substrate through a plurality of openings formed in the plurality of strip-shaped masks while moving the evaporation source by the evaporation source moving mechanism;
The plurality of openings are all configured by rectangular openings,
The evaporation apparatus according to claim 1, wherein a moving direction of the evaporation source by the evaporation source moving mechanism coincides with a longitudinal direction of the opening. A substrate positioning mechanism for positioning the substrate in an upright state;
A mask positioning mechanism for arranging a mask composed of a plurality of strip-shaped masks on the main surface side of the substrate positioned by the substrate positioning mechanism;
An evaporation source moving mechanism for moving the evaporation source in parallel and linearly with the main surface of the substrate positioned by the substrate positioning mechanism;
With
A deposition apparatus that deposits a film on a main surface of the substrate through a plurality of openings formed in the plurality of strip-shaped masks while moving the evaporation source by the evaporation source moving mechanism;
A plurality of the evaporation sources are provided so as to form a row aligned in the longitudinal direction of the strip mask,
The direction in which the plurality of evaporation sources move by the evaporation source moving mechanism is a direction perpendicular to the longitudinal direction of the strip mask.   9. The plurality of openings are all configured by rectangular openings, and the longitudinal direction of these openings coincides with the longitudinal direction of the strip mask. Vapor deposition equipment.   The vapor deposition apparatus according to claim 7, 8 or 9, wherein a plurality of the strip-shaped masks arranged by the mask positioning mechanism has a longitudinal direction of each strip-shaped mask coinciding with a vertical direction.