JP6852018B2 - Thin-film deposition method, electronic device manufacturing method, and thin-film deposition equipment - Google Patents

Description

The present invention relates to a vapor deposition method for forming a film on a substrate, a method for manufacturing an electronic device, and a vapor deposition apparatus.

In recent years, in electronic devices such as organic EL, the size of the substrate has been increasing. Therefore, when the film is formed on the substrate, the bending due to the weight of the substrate and the mask cannot be ignored. That is, if an organic film is formed on the substrate while the substrate or mask is bent, so-called "film blurring" occurs in which the film is not formed according to the shape and dimensions of the openings provided in the mask. Will end up. Therefore, for example, in a display device or the like, as a result of film blurring, color mixing occurs and brightness decreases, and it becomes difficult to realize high definition of an image.

Therefore, as a countermeasure against the bending of the substrate, a technique of performing vapor deposition in an upright state of the substrate, and a technique of arranging a plurality of strip-shaped masks side by side as a countermeasure against the bending of the mask have been developed.

However, in order to suppress the film blur, there is no technique in which a plurality of conditions are considered in a complex manner, and there is still room for improvement.

Korean Publication No. 10-2018-7430 Gazette

An object of the present invention is to provide a thin-film deposition method, an electronic device manufacturing method, and a thin-film deposition apparatus capable of suppressing film blur even if the substrate becomes large.

The present invention employs the following means to solve the above problems.

The vapor deposition method of the present invention
Is positioned upright substrate, and, on the principal surface side of the substrate, is composed of a plurality of strip-shaped mask, and the plurality of strip-shaped mask, the longitudinal direction so as to be adjacent to each other by aligning their longitudinal direction The masks arranged side by side in the direction perpendicular to the screen are arranged, and the substrate and the evaporation source moving with respect to the masks are used through a plurality of openings formed in the plurality of strip-shaped masks. A vapor deposition method for forming a film on the main surface of the substrate.
Each of the plurality of openings is formed by a rectangular opening.
When the film is formed, the evaporation source is moved in a direction that coincides with the longitudinal direction of the opening.

Further, the other vapor deposition method of the present invention is
Is positioned upright substrate, and, on the principal surface side of the substrate, is composed of a plurality of strip-shaped mask, and the plurality of strip-shaped mask, the longitudinal direction so as to be adjacent to each other by aligning their longitudinal direction The masks arranged side by side in the direction perpendicular to the screen are arranged, and the substrate and the evaporation source moving with respect to the masks are used through a plurality of openings formed in the plurality of strip-shaped masks. A vapor deposition method for forming a film on the main surface of the substrate.
A plurality of the evaporation sources are provided so as to form a row arranged in the longitudinal direction of the strip-shaped mask, and the plurality of evaporation sources are parallel to the main surface of the substrate and perpendicular to the longitudinal direction of the strip-shaped mask. It is characterized in that a film is formed while moving.

Then, the method for manufacturing the electronic device of the present invention is:
The process of transporting the substrate and mask into the chamber provided with the evaporation source,
A step of forming an organic film on the substrate by using the vapor deposition method described in any one of the above, and
It is characterized by having.

Further, the vapor deposition apparatus of the present invention is
A board positioning mechanism that positions the board in an upright position,
The main surface of the substrate that is positioned by the substrate positioning mechanism is constituted by a plurality of strip-shaped mask, and the plurality of strip-shaped mask, and perpendicular the longitudinal direction so as to be adjacent to each other by aligning their longitudinal direction A mask positioning mechanism that arranges masks that are arranged side by side in the direction,
An evaporation source moving mechanism that moves the evaporation source in parallel and linearly with the main surface of the substrate positioned by the substrate positioning mechanism.
With
A thin-film deposition apparatus for forming a film on the main surface of a substrate through a plurality of openings formed in a plurality of strip-shaped masks while moving the evaporation source by the evaporation source moving mechanism.
Each of the plurality of openings is formed by a rectangular opening, and the plurality of openings are formed.
The moving direction of the evaporation source by the evaporation source moving mechanism is characterized to coincide with the longitudinal direction of the opening.

Further, the other vapor deposition apparatus of the present invention is
A board positioning mechanism that positions the board in an upright position,
The main surface of the substrate that is positioned by the substrate positioning mechanism is constituted by a plurality of strip-shaped mask, and the plurality of strip-shaped mask, and perpendicular the longitudinal direction so as to be adjacent to each other by aligning their longitudinal direction A mask positioning mechanism that arranges masks that are arranged side by side in the direction,
An evaporation source moving mechanism that moves the evaporation source in parallel and linearly with the main surface of the substrate positioned by the substrate positioning mechanism.
With
A thin-film deposition apparatus for forming a film on the main surface of a substrate through a plurality of openings formed in a plurality of strip-shaped masks while moving the evaporation source by the evaporation source moving mechanism.
A plurality of evaporation sources are provided so as to form rows arranged in the longitudinal direction of the strip-shaped mask, and the evaporation sources are provided.
The direction in which the plurality of evaporation sources are moved by the evaporation source moving mechanism is perpendicular to the longitudinal direction of the strip-shaped mask.

As described above, according to the present invention, film blurring can be suppressed even if the size of the substrate is increased.

FIG. 1 is a schematic configuration diagram of a vapor deposition apparatus according to a first embodiment of the present invention as viewed from above. FIG. 2 is a schematic configuration diagram of the vapor deposition apparatus according to the first embodiment of the present invention as viewed from the back side. FIG. 3 is a schematic configuration diagram of the vapor deposition apparatus according to the first embodiment of the present invention as viewed from the side surface. FIG. 4 is an explanatory view of the substrate positioning mechanism according to the first embodiment of the present invention. FIG. 5 is an explanatory diagram of the mask positioning mechanism according to the first embodiment of the present invention. FIG. 6 is an explanatory diagram of the mask positioning mechanism according to the first embodiment of the present invention. FIG. 7 is a schematic configuration diagram of the evaporation source according to the first embodiment of the present invention as viewed from above. FIG. 8 is a schematic configuration diagram of the evaporation source according to the first embodiment of the present invention as viewed from the front side. FIG. 9 is an explanatory diagram showing a specific example of the organic film formed on the substrate according to the first embodiment of the present invention. FIG. 10 is a schematic configuration diagram of the vapor deposition apparatus according to the second embodiment of the present invention as viewed from above. FIG. 11 is a schematic configuration diagram of the vapor deposition apparatus according to the second embodiment of the present invention as viewed from the back side. FIG. 12 is a schematic configuration diagram of the vapor deposition apparatus according to the second embodiment of the present invention as viewed from the side surface. FIG. 13 is an explanatory diagram of the accuracy of film formation due to the positional relationship between the opening and the evaporation source. FIG. 14 is an explanatory view showing the relationship between the longitudinal direction of the opening and the moving direction of the evaporation source. FIG. 15 is an explanatory view showing the relationship between the longitudinal direction of the strip-shaped mask and the longitudinal direction of the opening. FIG. 16 is an explanatory view showing the relationship between the longitudinal direction and the vertical direction of the strip-shaped mask. FIG. 17 is an explanatory view showing the relationship between the longitudinal direction of the strip-shaped mask and the moving direction of the evaporation source. FIG. 18 is a table summarizing whether or not various conditions are satisfied.

Hereinafter, embodiments for carrying out the present invention will be described in detail exemplarily based on examples with reference to the drawings. However, the dimensions, materials, shapes, relative arrangements, etc. of the components described in this embodiment are not intended to limit the scope of the present invention to those, unless otherwise specified. ..

The vaporization method according to the embodiment of the present invention may be applied to a vapor deposition apparatus in which the evaporation source is configured to move in the vertical direction or a vapor deposition apparatus in which the evaporation source is configured to move in the horizontal direction. .. First, each of these vapor deposition apparatus (the former is referred to as Example 1 and the latter is referred to as Example 2) will be described. In the following description, the main surface of the substrate means the surface of the substrate on which the film is formed. Further, in the vapor deposition apparatus, a mask is arranged on the main surface side of the substrate, and an evaporation source is arranged on the side opposite to the substrate with the mask interposed therebetween. In the following description, the case where various configurations are viewed from the substrate side toward the mask and the evaporation source is defined as "viewed from the front side", and the case where various configurations are viewed from the opposite side is "viewed from the back side". It shall be.

<Example 1 of thin-film deposition apparatus>
The vapor deposition apparatus according to the first embodiment of the present invention will be described with reference to FIGS. 1 to 8. 1 to 3 are schematic configuration diagrams of the vapor deposition apparatus according to the first embodiment of the present invention, and are diagrams schematically showing the main configuration of the vapor deposition apparatus. Note that FIG. 1 is a view of the vapor deposition apparatus from above, FIG. 2 is a view of the vapor deposition apparatus from the back side, and FIG. 3 is a view of the vapor deposition apparatus from the side surface. FIG. 4 is an explanatory view of the substrate positioning mechanism according to the first embodiment of the present invention, and FIG. 4A is a view of the substrate in the vapor deposition apparatus and the positioning mechanism of the substrate as viewed from the back side of the vapor deposition apparatus. FIG. (B) is a view of the substrate in the vapor deposition apparatus and the positioning mechanism of the substrate as viewed from the side surface side of the vapor deposition apparatus. 5 and 6 are explanatory views of the mask positioning mechanism according to the first embodiment of the present invention. FIG. 5A is a view of the mask positioning mechanism in the vapor deposition apparatus viewed from the back side of the vapor deposition apparatus, and FIG. 5B is a view of the mask positioning mechanism in the vapor deposition apparatus viewed from the side surface of the vapor deposition apparatus. is there. FIG. 6 is a diagram showing how to attach the strip-shaped mask. 7 and 8 are schematic configuration diagrams of the evaporation source according to the first embodiment of the present invention, and are diagrams schematically showing the main configuration of the evaporation source. Note that FIG. 7 is a view of the evaporation source viewed from above, and FIG. 8 is a view of the evaporation source viewed from the front side.

The vapor deposition apparatus 10 includes a chamber 100 configured so that the inside is in a state close to vacuum by a vacuum pump (not shown), and an evaporation source apparatus 400 arranged inside the chamber 100. Inside the chamber 100, the substrate 200 is configured to be positioned in an upright state, and the mask 300 is arranged on the main surface side of the substrate 200. The evaporation source device 400 has a role of heating the material of the substance to be vapor-deposited on the substrate 200 to evaporate or sublimate the material, and inject the evaporated or sublimated material O toward the substrate 200.

Here, in each figure, the arrows X and Y indicate the horizontal direction, and the arrows Z indicate the vertical direction. Further, the arrow Y is a normal direction with respect to the main surface of the substrate 200, and indicates a direction from the evaporation source device 400 toward the substrate 200, and an arrow X indicates a direction perpendicular to the direction.

<< Board positioning mechanism >>
In particular, the positioning mechanism of the substrate 200 will be described with reference to FIG. The substrate 200 is fixed to a substrate frame 210 configured to reciprocate in the X direction of the arrow. A guide rod 220 is fixed to the lower end of the board frame 210, and a guide rail 240 is fixed to the upper end. The guide rod 220 is configured to be movable while being guided by a plurality of first guide rollers 230 arranged so as to line up in the X direction. Further, the guide rail 240 is configured to be movable while being guided by a plurality of second guide rollers 250 arranged so as to line up in the X direction. Further, the first guide roller 230, the guide rod 220, the guide rail 240, and the second guide roller 250 are arranged so as to be lined up in a vertical direction. With the above configuration, the substrate 200 fixed to the substrate frame 210 can be positioned upright in the vertical direction and reciprocate in the arrow X direction.

<< Mask Positioning Mechanism >>
In particular, the positioning mechanism of the mask 300 will be described with reference to FIGS. 5 and 6. The mask 300 is fixed to a mask frame 320 configured to reciprocate in the X direction of the arrow. A guide rod 330 is fixed to the lower end of the mask frame 320, and a guide rail 360 is fixed to the upper end. The guide rod 330 is configured to be movable while being guided by a plurality of third guide rollers 340 arranged so as to line up in the X direction. Further, the guide rail 360 is configured to be movable while being guided by a plurality of fourth guide rollers 370 arranged so as to line up in the X direction. Further, the third guide roller 340, the guide rod 330, the guide rail 360, and the fourth guide roller 370 are arranged so as to be lined up in a vertical direction. With the above configuration, the mask 300 fixed to the mask frame 320 can be positioned upright in the vertical direction and reciprocate in the direction of the arrow X.

Further, the plurality of third guide rollers 340 and the fourth guide roller 370 are configured so that the positions are adjusted by the first alignment mechanism 350 and the second alignment mechanism 380, respectively. As a result, the mask frame 320 is configured so that the positions can be adjusted in the X direction, the Z direction, and the direction of rotation in the XZ plane, respectively. Since the mechanism for performing such alignment adjustment is a known technique as disclosed in, for example, Japanese Patent Application Laid-Open No. 2012-72478 and Japanese Patent Application Laid-Open No. 2012-140671, detailed description thereof will be omitted. As described above, since the position of the mask frame 320 can be adjusted by the first alignment mechanism 350 and the second alignment mechanism 380, the position of the mask 300 can be aligned with the substrate 200.

The mask 300 according to this embodiment is composed of a plurality of strip-shaped masks 310. This configuration will be described in particular with reference to FIG. The mask frame 320 is composed of a plate-shaped member having a rectangular outer shape and a rectangular hole 321 in the center. A plurality of strip-shaped masks 310 are fixed to the mask frame 320 configured in this manner so as to be adjacent to each other. Each strip-shaped mask 310 is pulled in the longitudinal direction of the strip-shaped mask 310, and both ends thereof are fixed to the mask frame 320 by welding or the like. Further, each of the plurality of strip-shaped masks 310 is provided with a plurality of openings 311. Each of the plurality of openings 311 is formed by a rectangular opening.

<< Evaporation source device >>
In particular, the evaporation source device 400 will be described with reference to FIGS. 1 to 3, 7 and 8. The evaporation source device 400 is connected to an evaporation source unit 410 having a plurality of evaporation sources 413, a pair of linear guides 420 and a pair of ball screws 430 provided on both sides of the evaporation source unit 410, and an evaporation source unit 410. It includes an atmospheric arm 440 and a drive mechanism 450 that rotates the ball screw 430. The drive mechanism 450 is composed of a drive source such as a motor and a plurality of gears for transmitting power from the drive source to the ball screw 430. By rotating the ball screw 430 by this drive mechanism 450, the evaporation source unit 410 can be reciprocated along the linear guide 420. Further, the inside of the atmospheric arm 440 is maintained in an atmospheric state. Inside the atmosphere arm 440, various signal lines connected to the evaporation source 413, a water cooling flow path, and the like are provided. However, a configuration in which a connecting bellows is provided instead of the atmospheric arm 440 can also be adopted.

The evaporation source unit 410 includes a plurality of cases 411, a crystal monitor 412 provided at the end of each case 411, and a plurality of evaporation sources 413 provided in a row inside each case 411. The evaporation source 413 injects a crucible 413a for vaporizing the material, a material reservoir 413b for storing the vaporized material, and a vaporized material as shown in an enlarged manner in the circled portion in FIG. It is equipped with a nozzle 413c. Further, in this embodiment, the cases 411 are arranged in three rows in the vertical direction, and the evaporation sources 413 provided in the upper and lower cases 411 are used to inject the dopant material and are provided in the middle case 411. The evaporation source 413 is used to inject the host material. In this embodiment, the case where the dopant material is injected by the upper and lower evaporation sources 413 and the host material is injected by the middle evaporation source 413 is shown, but this is only an example and is injected by each evaporation source. The material to be made is not limited to this. The crystal monitor 412 plays a role of indirectly measuring the thickness of the film formed on the substrate 200.

In the case of this embodiment, the evaporation source device 400 configured as described above performs vapor deposition on the substrate 200 while the evaporation source unit 410 moves in the vertical direction. In FIGS. 2 and 3, the evaporation source unit 410X in the standby state before vapor deposition is shown by a dotted line. Further, in FIG. 2, the range F indicates the moving range of the evaporation source unit 410 when performing vaporization. As shown in the figure, the evaporation source unit 410 is configured to move from a position below the lower end of the substrate 200 and the mask 300 in the vertical direction to a position above the upper end of the substrate 200 and the mask 300 in the vertical direction. .. This makes it possible to form a film having a certain thickness at a desired position on the substrate 200. Further, the width L1 of the evaporation source unit 410 is configured to be smaller than the width L2 of the mask 300 (the total width of the plurality of strip-shaped masks 310) L2 (see FIG. 1). That is, in the evaporation source unit 410 according to the present embodiment, as shown in FIGS. 7 and 8, the nozzles 413c of the evaporation source 413 arranged on the outer side in the width direction face outward and the evaporation is arranged on the inner side in the width direction. The nozzle 413c of the source 413 is configured to face inward. As a result, the materials injected from the plurality of evaporation sources 413 are uniformly injected over a range wider than the width of the evaporation source unit 410. Therefore, as described above, even if the width L1 <width L2, a film having a constant thickness can be formed at a desired position on the substrate 200.

<Manufacturing method of electronic devices>
A method of manufacturing an electronic device by using the above-mentioned vapor deposition apparatus and vapor deposition method will be described. Here, as an example of an electronic device, the case of an organic EL used in a display device or the like will be described as an example. The step of manufacturing the organic EL includes at least a step of transporting the substrate and the mask, a step of forming an organic film on the substrate, and a step of forming a metal film after the step of forming the organic film. There is. Hereinafter, these steps will be described.

<< Transport process >>
First, the substrate 200 is conveyed to the inside of the chamber 100 by the substrate positioning mechanism described above. Then, the substrate 200 is positioned in an upright state. Next, the mask 300 is conveyed inside the chamber 100 by the mask positioning mechanism. Then, the mask 300 is aligned with the substrate 200. As a result, the mask 300 composed of a plurality of strip-shaped masks 310 is arranged on the main surface side of the substrate 200. In this embodiment, the configuration in which the alignment of the mask 300 is adjusted with respect to the substrate 200 inside the chamber 100 is adopted, but after the alignment adjustment is performed outside the chamber, the substrate and the mask are placed in the chamber. It is also possible to adopt a configuration in which the material is conveyed inside the.

<< Organic film film formation process >>
With the substrate 200 and the mask 300 positioned inside the chamber 100, the evaporation source unit 410 is subjected to vapor deposition while moving vertically with respect to the substrate 200 and the mask 300 (a plurality of strip-shaped masks 310). That is, the vaporized material is ejected from the plurality of evaporation sources 413 provided in the evaporation source unit 410, and the main substrate 200 is formed through the plurality of openings 311 formed in the plurality of strip-shaped masks 310, respectively. A film is formed on the surface.

In the case of manufacturing an organic EL used for a display device or the like, the above transfer step and the organic film film forming step are repeated at least three times. That is, in the case of the organic EL, it is necessary to form an organic film for red pixels, an organic film for green pixels, and an organic film for blue pixels on the substrate 200. FIG. 9 shows a partially enlarged view of the substrate 200X and a partially enlarged view of the masks 300X, 300Y, and 300Z. As shown in the drawing, it is necessary to arrange the organic film R for red pixels, the organic film G for green pixels, and the organic film B for blue pixels on the substrate 200X. Therefore, after forming the organic film R with the material corresponding to the red pixels using the mask 300X for the red pixels, the organic film is made of the material corresponding to the green pixels using the mask 300Y for the green pixels. It is necessary to form G, and then use the mask 300Z for blue pixels to form the organic film B with the material corresponding to the blue pixels. Of course, the order of red, green, and blue is not limited to this order. As described above, since it is necessary to form three types of organic films R, G, and B, it is necessary to repeat the above transfer step and the organic film forming step at least three times.

<< Metal film film formation process >>
After three types of organic films R, G, and B are formed on the substrate 200, an electron transport layer, an electron injection layer, and the like are formed on these organic films R, G, and B. After that, a metal film is further deposited. As a result, an electron transport layer or the like is formed on these organic films R, G, B, and a metal film is further formed on the electron transport layer. As for the vapor deposition method of the metal film, the same vapor deposition method as in the case of vapor deposition of the organic film described above can be adopted, or other known techniques can be adopted.

(Example 2 of thin-film deposition apparatus)
10 to 12 show a thin-film deposition apparatus according to a second embodiment of the present invention. In the first embodiment, the configuration in which vaporization is performed while moving the evaporation source unit (evaporation source) in the vertical direction is shown, but in this embodiment, the evaporation source unit (evaporation source) is moved in the horizontal direction. However, the configuration in the case of performing vaporization is shown. Since other basic configurations and operations are the same as those in the first embodiment, the same components are designated by the same reference numerals, and the description thereof will be omitted as appropriate.

10 to 12 are schematic configuration diagrams of the vapor deposition apparatus according to the second embodiment of the present invention, and are diagrams schematically showing the main configuration of the vapor deposition apparatus. 10 is a view of the vapor deposition apparatus from above, FIG. 11 is a view of the vapor deposition apparatus from the back side, and FIG. 12 is a view of the vapor deposition apparatus from the side surface side.

The vapor deposition apparatus 10A according to this embodiment also includes a chamber 100 and an evaporation source apparatus 400 arranged inside the chamber 100. Further, the above-described embodiment is also configured so that the substrate 200 is positioned in an upright state inside the chamber 100 and the mask 300 is arranged on the main surface side of the substrate 200. It is the same as the case of 1. Further, also in FIGS. 10 to 12, arrows X and Y indicate the horizontal direction, and arrows Z indicate the vertical direction. Further, the arrow Y is a normal direction with respect to the main surface of the substrate 200, and indicates a direction from the evaporation source device 400 toward the substrate 200, and an arrow X indicates a direction perpendicular to the direction.

Since the substrate positioning mechanism and the mask positioning mechanism are as described in the first embodiment, the description thereof will be omitted. Further, since the basic configuration of the evaporation source device 400 is the same as that of the first embodiment, detailed description thereof will be omitted. However, in the case of the evaporation source device 400 according to the present embodiment, only the point that the evaporation source unit 410 is configured to reciprocate in the horizontal direction (X direction in FIGS. 10 and 11) instead of the vertical direction. However, it is different from the configuration of the first embodiment. Since the configurations and operations of the various members constituting the evaporation source device 400 are as described in the first embodiment, the description thereof will be omitted. In the case of the first embodiment, the plurality of evaporation sources 413 are arranged in a row in the horizontal direction, but in the case of the present embodiment, the plurality of evaporation sources 413 are arranged in a row in the vertical direction. Arranged like this.

In the case of the evaporation source device 400 according to the present embodiment, as described above, vapor deposition is performed on the substrate 200 while the evaporation source unit 410 moves in the horizontal direction. In FIGS. 10 and 11, the evaporation source unit 410X in the standby state before vapor deposition is shown by a dotted line. Further, in FIG. 11, the range F indicates the moving range of the evaporation source unit 410 when performing vaporization. As shown in FIG. 11, the evaporation source unit 410 moves from a position on the left side of the horizontal view of the substrate 200 and the mask 300 to a position on the right side of the right end of the horizontal direction of the substrate 200 and the mask 300. It is configured as follows. This makes it possible to form a film having a certain thickness at a desired position on the substrate 200. Further, the above-described embodiment is described in that the width L1 of the evaporation source unit 410 is configured to be smaller than the width L2 of the mask 300 (the total width of the plurality of strip-shaped masks 310) L2 (see FIG. 12). It is the same as the case of 1.

The method of manufacturing an electronic device using the thin-film deposition apparatus 10A according to the present embodiment is the same as that of the first embodiment, and thus the description thereof will be omitted.

<Consideration on the effect of suppressing film blur>
The effect of the relationship between the longitudinal direction D1 of the rectangular opening 311 provided in the strip-shaped mask 310, the moving direction D2 of the evaporation source 413, and the longitudinal direction D3 of the strip-shaped mask 310 on the effect of suppressing film blurring. The result of considering about is explained.

The evaporation source 413 is configured to move parallel and linearly with respect to the main surface of the substrate 200. That is, the evaporation source 413 is configured to move parallel and linearly to the surface of the strip-shaped mask 310. Further, the evaporation source 413 moves in the vertical direction when the vapor deposition apparatus 10 according to the first embodiment is used, and moves in the horizontal direction when the vapor deposition apparatus 10A according to the second embodiment is used. Therefore, the longitudinal direction D1 of the opening 311 and the longitudinal direction D3 of the strip-shaped mask 310 can also be oriented in the vertical direction or in the horizontal direction. Therefore, since the above three types of directions D1, D2, and D3 are all in the vertical direction and the horizontal direction, a total of eight combinations can be considered.

Next, the results of consideration of the effect on the effect of suppressing film blurring will be described for each combination condition of the directions of each part.

<< Condition 1 >>
The results of consideration of the effect of the relationship between the longitudinal direction D1 of the rectangular opening 311 and the moving direction D2 of the evaporation source 413 on the effect of suppressing film blur will be described with reference to FIGS. 13 and 14. FIG. 13 is an explanatory diagram showing the accuracy of film formation according to the positional relationship between the opening and the evaporation source, and FIG. 14 is an explanatory diagram showing the relationship between the longitudinal direction of the opening and the moving direction of the evaporation source.

It is desirable that the substrate 200 and the mask 300 are in close contact with each other. However, in general, as shown in FIG. 13, a minute gap S is generated between the substrate 200 and the mask 300 due to deformation due to the own weight of each configuration. Therefore, the farther the position of the evaporation source is from the opening 311 formed in the mask 300 in the surface direction of the main surface of the substrate 200, the more easily the film blurring occurs. That is, in FIG. 13, the angle of incidence of the material injected from the evaporation source 413A located at a relatively short distance from the opening 311 toward the main surface of the substrate 200 through the opening 311 is compared with the angle of incidence of the material from the opening 311. The angle of incidence of the material injected from the evaporation source 413B located at a distant distance through the opening 311 toward the main surface of the substrate 200 is smaller. In the former case, the film formation position may be displaced by T1 in FIG. 13 from the desired position, whereas in the latter case, T2 (T2>) in FIG. 13 is more than the desired position. Only in T1), the position of the film formation may be displaced. Therefore, in the latter case, the film thickness tends to be unstable and film blurring tends to occur.

Here, a rectangular film is formed on the substrate 200 according to the shape and dimensions of the opening 311. For the rectangular film formed on the substrate 200, it is often important to improve the dimensional accuracy in the lateral direction rather than the dimensional accuracy in the longitudinal direction. This point will be described by taking the case of an organic EL used in the above-mentioned display device or the like as an example. As described above, the organic film R for red pixels, the organic film G for green pixels, and the organic film B for blue pixels are formed side by side on the substrate 200X. Then, these organic films R, G, and B are formed on the substrate 200X so that the lateral directions are adjacent to each other. Therefore, if the dimensional accuracy of these organic films R, G, and B in the lateral direction is low, a phenomenon such as color mixing or a decrease in brightness occurs in a display device or the like. On the other hand, even if the dimensional accuracy of the organic films R, G, and B in the longitudinal direction is lowered, such a problem hardly occurs.

From the above, it is considered desirable that the longitudinal direction D1 of the rectangular opening 311 and the moving direction D2 of the evaporation source 413 match (this case is referred to as “condition 1”). This point will be described in more detail with reference to FIG. FIG. 14A shows a case where condition 1 is satisfied, and FIG. 14B shows a case where condition 1 is not satisfied (the longitudinal direction D1 of the rectangular opening 311 and the moving direction D2 of the evaporation source 413 are orthogonal to each other. ) Is shown. As can be seen from the description of Examples 1 and 2, the moving range F of the evaporation source 413 is a wider range than the longitudinal direction of the strip-shaped mask 310. Therefore, for example, in FIG. 14B, the distance from the evaporation source unit 410c located at the end of the moving range F to the opening 311X located at the farthest position is considerably long. Therefore, with respect to the rectangular organic film formed of the material injected onto the substrate 200 through the opening 311X, the dimensional accuracy in the lateral direction is lowered. On the other hand, when the condition 1 is satisfied, the distance from the evaporation source unit 410c located at the end of the moving range F to the opening 311Y located at the farthest position in FIG. 14A becomes considerably longer. .. However, the rectangular organic film formed by the material injected onto the substrate 200 through the opening 311Y has almost no effect on the dimensional accuracy in the lateral direction. Therefore, it is considered that the film blur is less likely to occur when the condition 1 is satisfied. Further, moving the evaporation source 413 along the longitudinal direction 311 of the opening 311 is more likely than moving the evaporation source 413 so as to cross perpendicular to the longitudinal direction 311 of the opening 311. The thickness can be constant. From this point of view, it is less likely that film blurring will occur if condition 1 is satisfied.

<< Condition 2 >>
The results of consideration on the effect of the relationship between the longitudinal direction D1 of the rectangular opening 311 and the longitudinal direction D3 of the strip-shaped mask 310 on the effect of suppressing film blur will be described with reference to FIG. FIG. 15 is an explanatory view showing the relationship between the longitudinal direction of the opening and the longitudinal direction of the strip-shaped mask.

As described in the above-mentioned mask positioning mechanism, the strip-shaped mask 310 is fixed to the mask frame 320 by welding or the like at both ends in a state of being pulled in the longitudinal direction of the strip-shaped mask 310. Therefore, the pulling force may also affect the plurality of openings 311 formed in the strip-shaped mask 310. The opening 311 is difficult to be deformed even if a tensile force acts on the rectangular opening 311 in the longitudinal direction, whereas the opening 311 is easily deformed when the tensile force acts on the rectangular opening 311.

From the above, it is considered desirable to match the longitudinal direction D1 of the rectangular opening 311 with the longitudinal direction D3 of the strip-shaped mask 310 (this case is referred to as “condition 2”). FIG. 15A shows a case where the condition 2 is satisfied, and FIG. 15B shows a case where the condition 2 is not satisfied (the longitudinal direction D1 of the rectangular opening 311 and the longitudinal direction D3 of the strip-shaped mask 310 are orthogonal to each other. Case) is shown. As shown in an enlarged view of a part of the opening 311 in FIG. 15B, if the condition 2 is not satisfied, the opening 311 may be deformed relatively significantly. Therefore, it is considered that the film blur is less likely to occur when the condition 2 is satisfied.

<< Condition 3 >>
The results of consideration of the effect of the relationship between the longitudinal direction D3 and the vertical direction of the strip-shaped mask 310 on the effect of suppressing film blur will be described with reference to FIG. FIG. 16 is an explanatory view showing the relationship between the longitudinal direction and the vertical direction of the strip-shaped mask.

The strip-shaped mask 310 may be deformed due to the influence of its own weight. Therefore, it is considered desirable to match the longitudinal direction D3 of the strip-shaped mask 310 with the vertical direction (this case is referred to as "condition 3"). FIG. 16A shows a case where the condition 3 is satisfied, and FIG. 16B shows a case where the condition 3 is not satisfied (the case where the longitudinal direction D3 of the strip-shaped mask 310 coincides with the horizontal direction).

When the condition 3 is satisfied, the amount of deformation of the strip-shaped mask 310 due to its own weight is small. On the other hand, if the condition 3 is not satisfied, the strip-shaped mask 310 is deformed so that the vicinity of the center thereof protrudes downward in the vertical direction due to its own weight (see arrow G). As a result, the opening 311 formed in the strip-shaped mask 310 is also deformed, so that it is considered that film blurring is likely to occur. Therefore, it is considered that the film blur is less likely to occur when the condition 3 is satisfied.

<< Condition 4 >>
The results of consideration on the effect of the relationship between the longitudinal direction D3 of the strip-shaped mask 310 and the moving direction D2 of the evaporation source 413 on the effect of suppressing film blur will be described with reference to FIG. FIG. 17 is an explanatory view showing the relationship between the longitudinal direction of the strip-shaped mask and the moving direction of the evaporation source.

Since the evaporation source 413 generates heat, the strip-shaped mask 310 is heated by the evaporation source 413. Therefore, if a part of the strip-shaped mask 310 is locally heated, the strip-shaped mask 310 is deformed so as to be curved, and film blurring is likely to occur. Therefore, it is considered desirable that the longitudinal direction D3 of the strip-shaped mask 310 and the moving direction D2 of the evaporation source 413 are perpendicular to each other (this case is referred to as “condition 4”). That is, a plurality of evaporation source units 410 (a plurality of rows arranged in the longitudinal direction D3 of the strip-shaped mask 310) are provided so as to be parallel to the main surface of the substrate 200 and perpendicular to the longitudinal direction D3 of the strip-shaped mask 310. It is considered desirable to carry out the film formation while moving the evaporation source 413).

As a result, since the entire longitudinal direction D3 of the strip-shaped mask 310 is uniformly heated by the evaporation source 413, it is possible to prevent a part of the strip-shaped mask 310 from being locally heated. Therefore, it is possible to prevent the strip-shaped mask 310 from being deformed so as to be curved. On the other hand, when the longitudinal direction D3 of the strip-shaped mask 310 and the moving direction D2 of the evaporation source 413 are matched, the strip-shaped mask 310 is heated by the evaporation source 413 from one end side to the other end side. Will move. As a result, a part of the strip-shaped mask 310 may be locally heated and deformed so as to be curved. Therefore, it is considered that the film blur is less likely to occur when the condition 4 is satisfied.

<< Comprehensive consideration results >>
The results of comprehensive consideration will be described with reference to FIG. FIG. 18 shows conditions as to whether the longitudinal direction D1 of the rectangular opening 311, the moving direction D2 of the evaporation source 413, and the longitudinal direction D3 of the strip-shaped mask 310 are the vertical direction or the horizontal direction, respectively. It is a table summarizing whether or not 1 to condition 4 is satisfied. Cases that meet the conditions are marked with a circle, and cases that do not meet the conditions are marked with a cross. Further, in cases 1 to 8, the priorities are weighted in the order of condition 1, condition 2, and condition 3, and the cases are arranged in descending order of priority. As for the judgment, the cases where two or more of the conditions 1 to 4 are satisfied are passed (OK). As a result, Case 7 and Case 8 were rejected (NG).

10, 10A ... Evaporation device, 200 ... Substrate, 300 ... Mask, 310 ... Strip mask, 311 ... Opening, 400 ... Evaporation source device, 410 ... Evaporation source unit, 413 ... Evaporation source

Claims (10)

Is positioned upright substrate, and, on the principal surface side of the substrate, is composed of a plurality of strip-shaped mask, and the plurality of strip-shaped mask, the longitudinal direction so as to be adjacent to each other by aligning their longitudinal direction The masks arranged side by side in the direction perpendicular to the screen are arranged, and the substrate and the evaporation source moving with respect to the masks are used through a plurality of openings formed in the plurality of strip-shaped masks. A vapor deposition method for forming a film on the main surface of the substrate.
Each of the plurality of openings is formed by a rectangular opening.
A vaporization method characterized by moving the evaporation source in a direction coincide with the longitudinal direction of the opening when forming a film. Is positioned upright substrate, and, on the principal surface side of the substrate, is composed of a plurality of strip-shaped mask, and the plurality of strip-shaped mask, the longitudinal direction so as to be adjacent to each other by aligning their longitudinal direction The masks arranged side by side in the direction perpendicular to the screen are arranged, and the substrate and the evaporation source moving with respect to the masks are used through a plurality of openings formed in the plurality of strip-shaped masks. A vapor deposition method for forming a film on the main surface of the substrate.
A plurality of the evaporation sources are provided so as to form a row arranged in the longitudinal direction of the strip-shaped mask, and the plurality of evaporation sources are parallel to the main surface of the substrate and perpendicular to the longitudinal direction of the strip-shaped mask. A vaporization method characterized by forming a film while moving. Each of the plurality of openings is formed by a rectangular opening, and a strip-shaped mask configured so that the longitudinal direction of these openings coincides with the longitudinal direction of the strip-shaped mask is used. The vapor deposition method according to claim 1 or 2, wherein a film is formed by the evaporation source. The first, second or third aspect of the present invention, wherein a film is formed by the evaporation source in a state where a plurality of the strip-shaped masks are positioned so that the longitudinal direction and the vertical direction of the strip-shaped masks coincide with each other. The described vapor deposition method. The process of transporting the substrate and mask into the chamber provided with the evaporation source,
A step of forming an organic film on the substrate by using the vapor deposition method according to any one of claims 1 to 4.
A method for manufacturing an electronic device, which comprises. The method for manufacturing an electronic device according to claim 5, further comprising a step of depositing a metal film after the step of forming an organic film on the substrate. A board positioning mechanism that positions the board in an upright position,
The main surface of the substrate that is positioned by the substrate positioning mechanism is constituted by a plurality of strip-shaped mask, and the plurality of strip-shaped mask, and perpendicular the longitudinal direction so as to be adjacent to each other by aligning their longitudinal direction A mask positioning mechanism that arranges masks that are arranged side by side in the direction,
An evaporation source moving mechanism that moves the evaporation source in parallel and linearly with the main surface of the substrate positioned by the substrate positioning mechanism.
With
A thin-film deposition apparatus for forming a film on the main surface of a substrate through a plurality of openings formed in a plurality of strip-shaped masks while moving the evaporation source by the evaporation source moving mechanism.
Each of the plurality of openings is formed by a rectangular opening, and the plurality of openings are formed.
A vapor deposition apparatus characterized in that the moving direction of the evaporation source by the evaporation source moving mechanism coincides with the longitudinal direction of the opening. A board positioning mechanism that positions the board in an upright position,
The main surface of the substrate that is positioned by the substrate positioning mechanism is constituted by a plurality of strip-shaped mask, and the plurality of strip-shaped mask, and perpendicular the longitudinal direction so as to be adjacent to each other by aligning their longitudinal direction A mask positioning mechanism that arranges masks that are arranged side by side in the direction,
An evaporation source moving mechanism that moves the evaporation source in parallel and linearly with the main surface of the substrate positioned by the substrate positioning mechanism.
With
A thin-film deposition apparatus for forming a film on the main surface of a substrate through a plurality of openings formed in a plurality of strip-shaped masks while moving the evaporation source by the evaporation source moving mechanism.
A plurality of evaporation sources are provided so as to form rows arranged in the longitudinal direction of the strip-shaped mask, and the evaporation sources are provided.
A vapor deposition apparatus characterized in that the direction in which the plurality of evaporation sources are moved by the evaporation source moving mechanism is a direction perpendicular to the longitudinal direction of the strip-shaped mask. The invention according to claim 7 or 8, wherein each of the plurality of openings is formed by a rectangular opening, and the longitudinal direction of these openings coincides with the longitudinal direction of the strip-shaped mask. Deposition equipment. The vapor deposition apparatus according to claim 7, 8 or 9, wherein the plurality of strip-shaped masks arranged by the mask positioning mechanism have the longitudinal direction of each strip-shaped mask coincided with the vertical direction.

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