TWI641709B - Material deposition arrangement, distrbution pipe, vacuum deposition chamber and method for vacuum deposition - Google Patents

Abstract

A material deposition arrangement (100) for depositing evaporated material on a substrate (121) in a vacuum chamber (110) is described. This material deposition configuration includes two material sources (100a, 100b), each having a distribution tube (106a, 106b) and one or more nozzles (712). Furthermore, a vacuum deposition chamber including a material deposition configuration and a method for depositing an evaporated material on a substrate are described.

Description

Material deposition configuration, distribution tube, vacuum deposition chamber and method for vacuum deposition law

Embodiments relate to a material deposition arrangement, a distribution tube for a material deposition arrangement, a deposition apparatus having a material deposition arrangement, and a method for depositing a material on a substrate. Embodiments relate in particular to a material deposition arrangement for a vacuum deposition chamber, a vacuum deposition apparatus having a material deposition arrangement, and a material for depositing a material on a substrate in a vacuum deposition chamber Method.

Organic vaporizers are devices used to produce organic light-emitting diodes (OLEDs). OLEDs are a special form of light-emitting diodes. In OLEDs, the light-emitting layer includes a thin film of a specific organic compound. OLEDs are used to make TV screens, computer screens, mobile phones, and other handheld devices used to display information. OLEDs can also be used for general space lighting. The range of possible colors, brightness, and viewing angles of OLED displays is larger than that of traditional liquid crystal displays (LCDs), because OLED pixels emit light directly without With backlight. Therefore, the energy loss of the OLED display is much smaller than that of the conventional liquid crystal display. In addition, OLEDs can be manufactured on flexible substrates, resulting in more applications. An example of a typical OLED display may include several organic material layers located between two electrodes. All of the organic material layers are deposited on a substrate to form a matrix display panel with individual enabled pixels. The OLED is generally placed between two glass panels, and the edges of the glass panel are sealed to encapsulate the OLED therein.

Manufacturing such display devices faces many challenges. OLED displays or OLED lighting applications include stacks formed from several organic materials, such as evaporating in a vacuum. Organic materials are deposited in a sequential manner via shadow masks. In order to manufacture OLED stacks with high efficiency, it is necessary to co-deposition or co-evaporation two or more materials to become a mixed / doped layer. Two or more materials are exemplified as the host ( host) and dopants. Furthermore, many processing conditions used to evaporate very sensitive organic materials must be considered.

To deposit the material on the substrate, the material is heated until the material evaporates. Furthermore, for example, in order to keep the evaporated material at a controlled temperature or to prevent the evaporated material from condensing in the tube, the tube that guides the material to the substrate may be heated. When the material evaporates, the material is guided to the substrate, for example, by a distribution tube, which has an outlet or nozzle for the evaporated material. Over the past few years, the accuracy of deposition processes has increased, such as being able to provide smaller and smaller pixel sizes. However, the shadowing effects of the mask, the spread of the evaporated material, and the like make it difficult to further increase the accuracy and predictability of the evaporation process.

In view of the foregoing, one object of the embodiments described herein is to provide a material deposition arrangement, a vacuum deposition chamber, a distribution tube, and a method for depositing material on a substrate to overcome at least some problems in this field. .

In view of the above, according to the scope of independent patent applications, A material deposition arrangement (several), a deposition chamber, a distribution tube, and a method provided on a substrate are provided. Other aspects, advantages, and features of several embodiments are made clearer by the scope, description, and accompanying drawings of the accompanying patent applications.

According to an embodiment, a material deposition arrangement for depositing evaporated material on a substrate in a vacuum chamber is provided. The evaporated material is, in particular, two or more evaporated materials. The material deposition configuration includes a first material source, including a first material evaporator, configured to evaporate a first material to be deposited on a substrate, particularly one of the two or more materials; A first distribution pipe includes a first distribution pipe housing, wherein the first distribution pipe system is in fluid communication with the first material evaporator; and a plurality of first nozzles are located in the first distribution pipe housing. One or more nozzles of a nozzle include an opening length and an opening size, wherein a length to size ratio of the one or more nozzles of the first nozzles is equal to or greater than 2: 1. The material deposition configuration further includes a second material source, including a second material evaporator, configured to evaporate a second material to be deposited on the substrate, particularly one of the two or more materials. A second distribution pipe including a second distribution pipe housing, wherein the second distribution pipe is in fluid communication with the second material evaporator; and a plurality of second nozzles are located in the second distribution pipe housing. One of these first nozzles One of these second nozzles has a distance between the second nozzles equal to or less than 30 mm.

According to another embodiment, a material deposition arrangement for depositing evaporated material on a substrate in a vacuum chamber is provided. The evaporated material is, in particular, two or more evaporated materials. The material deposition configuration includes a first material source, including a first material evaporator, configured to evaporate a first material to be deposited on a substrate, particularly one of the two or more materials; A first distribution pipe includes a first distribution pipe housing, wherein the first distribution pipe system is in fluid communication with the first material evaporator; and a plurality of first nozzles are located in the first distribution pipe housing. One or more nozzles include an opening length and an opening size and are assembled to provide a first distribution direction, wherein the length to size ratio of the one or more nozzles of the first nozzles is equivalent to Or greater than 2: 1. The material deposition configuration further includes a second material source, including a second material evaporator, configured to evaporate a second material to be deposited on the substrate, particularly one of the two or more materials. A second distribution pipe, including a second distribution pipe housing, wherein the second distribution pipe system is in fluid communication with the second material evaporator; and a plurality of second nozzles, which are located in the second distribution pipe housing, among which One or more of the second nozzles are assembled to provide a second distribution direction. The first distribution direction of the one or more nozzles of the first nozzles and the second distribution direction of the one or more nozzles of the second nozzles are aligned parallel to each other, or aligned from a parallel arrangement with a deviation of up to 5 ° .

According to yet another embodiment, a distribution pipe system for depositing evaporated material on a substrate in a vacuum chamber is provided. The distribution tube includes a distribution tube A casing; and a nozzle located in the distribution pipe casing, wherein the nozzle includes an opening length and an opening size. The nozzle length to size ratio is equal to or greater than 2: 1, and the nozzle includes a material that is chemically inert to an evaporated organic material.

According to other embodiments, a material deposition arrangement for depositing evaporated material on a substrate in a vacuum chamber is provided. The evaporated material is particularly two or more evaporated materials. The material deposition configuration includes a first material source, including a first material evaporator, configured to evaporate a first material to be deposited on a substrate, particularly one of the two or more materials; And a distribution pipe configured for a material distribution of a first distribution pipe configured according to the material deposition described herein, wherein the first distribution pipe is in fluid communication with the first material evaporator. The material deposition configuration further includes a second material source, including a second material evaporator, configured to evaporate a second material to be deposited on the substrate, particularly one of the two or more materials; And a second distribution pipe comprising a distribution pipe housing, wherein the second distribution pipe system is in fluid communication with the second material evaporator; and a plurality of second nozzles are located in the second distribution pipe housing. A distance between the nozzle of the first distribution pipe and the second nozzle of one of the second nozzles of the second distribution pipe is equal to or less than 30 mm. The nozzles of the first distribution pipe are additionally or selectively assembled to provide a first distribution direction and one of the second nozzles of the second distribution pipe is assembled to provide a second distribution direction, wherein the first distribution The direction and the second distribution direction are arranged parallel to each other or are arranged with a deviation of up to 5 ° from the parallel arrangement.

According to other embodiments, a vacuum deposition chamber is provided. The vacuum deposition chamber includes a material deposition configuration according to the embodiments described herein. Vacuum deposition chamber The chamber further includes a substrate support for supporting the substrate during the deposition. The distance between at least one of the distribution tubes of the material deposition configuration and the substrate support is less than 250 mm.

According to other embodiments, a method for depositing an evaporated material on a substrate in a vacuum deposition chamber is provided. The vacuum deposition chamber has a chamber space. The method includes using a first material evaporator disposed in a chamber space to evaporate a first material. The method further includes providing the evaporated first material to a first distribution pipe. The first distribution pipe includes a first distribution pipe housing, wherein the first distribution pipe is in fluid communication with the first material evaporator. Providing the evaporated first material to the first distribution pipe generally includes providing a pressure in the first distribution pipe of about 10 ^-2 -10 ^-1 mbar. The method further includes directing the evaporated first material through one or more nozzles of a plurality of first nozzles in the first distribution tube housing. The one or more nozzles of the first nozzles include an opening length and an opening size, wherein guiding the evaporated first material through the one or more nozzles includes guiding the evaporated first material through Or one or more nozzles with a length to size ratio greater than 2: 1. The method further includes releasing the evaporated first material toward the volume of the chamber toward the substrate in the chamber space, wherein the chamber space provides a pressure of about 10 ^-5 to 10 ^-7 mbar.

Several embodiments are directed to a device for performing the disclosed methods, and the device includes device components for performing each of the described method features. These method features may be implemented by hardware components, by a computer suitable for software programming, by any combination of the two, or by any other means. Furthermore, several embodiments are directed to a method of operating the described device. It includes method features for performing each function of the device. In order to better understand the above and other aspects of the present invention, the following specific implementations are preferred Examples, combined with the attached drawings, will be described in detail as follows:

100‧‧‧Material deposition configuration

100a‧‧‧First material source

100b‧‧‧Second material source

100c‧‧‧Third material source

100d‧‧‧Material source

101, 200‧‧‧ distance

102‧‧‧ support

102a‧‧‧First material evaporator

102b‧‧‧Second Material Evaporator

102c‧‧‧Third Material Evaporator

104‧‧‧Evaporation crucible

106‧‧‧ Distribution tube

106a‧‧‧first distribution tube

106b‧‧‧Second distribution tube

106c‧‧‧Third distribution tube

107, 713‧‧‧ opening

108‧‧‧Extended wall

109‧‧‧wall

110‧‧‧vacuum chamber

111‧‧‧ Maintenance Vacuum Chamber

112‧‧‧Alignment unit

116‧‧‧Distribution tube housing

121‧‧‧ substrate

126‧‧‧ substrate support

131‧‧‧Mask frame

132‧‧‧Mask

136‧‧‧first direction

201, 202, 203‧‧‧ Longitudinal axis

205, 207‧‧‧ valve

206‧‧‧First nozzle material

208‧‧‧Second nozzle material

210‧‧‧ First distribution direction

211‧‧‧Second distribution direction

212‧‧‧Third distribution direction

300‧‧‧ Deposition equipment

320‧‧‧ Linear Guide

322, 324, 326‧‧‧ wall

352, 354, 355‧‧‧ arrows

380‧‧‧Heating element

400‧‧‧flow chart

410, 420, 430, 440‧‧‧ blocks

700‧‧‧ Nozzle

702‧‧‧Evaporator control housing

703‧‧‧ flange unit

710‧‧‧Hollow interior

712‧‧‧Nozzle

714‧‧‧cut length

715‧‧‧Heating unit

716‧‧‧cut size

717‧‧‧Heating shield

722‧‧‧ suppository

725‧‧‧External heating unit

726‧‧‧central heating element

727‧‧‧Mask

732‧‧‧Steam duct

800, 801‧‧‧ curves

802, 803‧‧‧‧ evaporated material

804‧‧‧First wiring

805‧‧‧Second wiring

806‧‧‧Third wiring

879‧‧‧Insulator

A‧‧‧Area

B, C‧‧‧Partial map

In order to understand the above-mentioned features of several embodiments in detail, the more specific descriptions briefly summarized above can refer to the embodiments. The attached drawings are related to several embodiments and are described below: Figures 1a to 1f show schematic diagrams of material deposition configurations and some more detailed schematic diagrams of material deposition configurations according to the embodiments described herein; Figures 2a to 2c are schematic diagrams of the distribution tubes of the material deposition configuration according to the embodiment described herein; Figure 3a is a schematic diagram of the materials distribution of the distribution tube and nozzle according to the embodiment described herein; Figure 3b is A schematic diagram showing the material distribution of a distribution pipe of a known system; Figure 3c shows a comparison diagram of the material distribution of a distribution pipe according to an embodiment described herein with a known system; Figure 4a shows an implementation according to the description herein Schematic illustration of a material deposition configuration for example; Figure 4b illustrates a schematic view of a known deposition system; Figures 5a and 5b illustrate side and top views of a material deposition configuration according to the embodiments described herein; Figures 6a and 6b A side view of the material deposition configuration according to the embodiment described here and a more detailed schematic of the distribution pipes and nozzles of the material deposition configuration according to the embodiment described here; Figures 7a to 7d show examples according to the embodiment described herein For distribution A schematic configuration of a nozzle with a material deposition; Figures 8a to 8c show schematics of material deposition arrangements and distribution tubes according to the embodiments described herein; Figures 9a and 9b show schematics of distribution tubes according to the embodiments described herein; Figure 10 shows A schematic view of the vacuum deposition chamber of the embodiment described herein; and FIG. 11 shows a flowchart of a method for depositing a material on a substrate according to the embodiment described herein.

Detailed reference will be made in various embodiments, one or more examples of which are illustrated in the drawings. In the description of the drawings below, the same reference numerals refer to the same elements. Generally, only the differences between the individual embodiments are described. The examples are provided by way of illustration and are not meant to be limiting. Furthermore, the features described or described as part of one embodiment can be used in or combined with other embodiments to obtain still other embodiments. This means that this description includes such adjustments and changes.

As used herein, the term "fluid communication" can be understood as meaning that two elements in fluid communication can exchange fluid via a connector to allow fluid to flow between the two elements. In one example, such elements that are in fluid communication may include a hollow structure, and fluid may flow through the hollow structure. According to some embodiments, at least one of such elements in fluid communication may be a tube-like element.

Furthermore, in the description below, a source of material can be understood as providing A source integrated on a substrate. In particular, the material source may be assembled for providing a material to be deposited on a substrate in a vacuum chamber, such as a vacuum deposition chamber or equipment. According to some embodiments, the material source may provide material to be deposited on a substrate by being assembled to evaporate the material to be deposited. For example, the source of material may include an evaporator or crucible. The evaporator or crucible evaporates the material to be deposited on the substrate, and in particular releases the evaporated material in a direction that is toward the substrate or into the material source. In the distribution tube. In some embodiments, the evaporator may be in fluid communication with the distribution tube, for example to distribute the evaporated material.

According to some embodiments described herein, the distribution tube may be understood as a tube for guiding and distributing the evaporated material. In particular, the distribution pipe can direct the evaporated material from the evaporator to an outlet or opening in the distribution pipe. A linearly distributed tube can be understood as a tube extending in the first, especially in the longitudinal direction. In some embodiments, the linear distribution tube includes a tube having a cylindrical shape, and the column may have a circular bottom shape or any other suitable bottom shape.

The nozzle referred to herein can be understood as a device for guiding a fluid, in particular for controlling the direction or characteristics of a fluid (for example, the flow rate, velocity, shape, and / or pressure of the fluid emerging from the nozzle). According to some embodiments described herein, the nozzle may be a device for guiding or directing steam, such as steam of evaporated material to be deposited on a substrate. The nozzle may have an inlet for receiving a fluid, an opening (such as a bore or passage) for guiding the fluid through the nozzle, and an outlet for releasing the fluid. Generally speaking, the openings or channels of the nozzle may include a defined geometry to allow the fluid flowing through the nozzle to achieve the desired direction or characteristic. Sex. According to some implementations, the nozzle may be part of a distribution pipe or may be connected to a distribution pipe providing evaporated material and may receive evaporated material from the distribution pipe.

According to the embodiments described herein, a material deposition arrangement for depositing evaporated material on a substrate in a vacuum chamber is provided. For some embodiments, the material deposition configuration may be configured for depositing two or more evaporated materials on a substrate in a vacuum chamber. The material deposition configuration includes a first material source, the first material source includes a first material evaporator, and the first material evaporator is configured to evaporate the first material to be deposited on the substrate. According to some embodiments, the first material may be a first material from the two or more materials to be deposited on the substrate. The first material source further includes a first distribution tube, and the first distribution tube includes a first distribution tube housing. The first distribution tube system is in fluid communication with the first material evaporator, and the first material source further includes a first distribution tube. Several first nozzles in a tube housing. Generally, one or more of the first nozzles includes an opening length and an opening size, wherein the length to size ratio of the one or more nozzles of the first nozzles is equal to or greater than 2: 1. . The material deposition configuration includes a second material source, the second material source includes a second material evaporator, and the second material evaporator is configured to evaporate the second material to be deposited on the substrate. According to some embodiments, the second material may be a second material from the two or more materials to be deposited on the substrate. The second material source further includes a second distribution pipe, and the second distribution pipe includes a second distribution pipe housing, wherein the second distribution pipe system is in fluid communication with the second material evaporator. The second material source further includes a plurality of second nozzles located in the second distribution tube housing. According to the embodiment described herein, the distance between the first nozzle of one of the first nozzles and the second nozzle of one of the second nozzles is equal to or less than 30 mm. According to some embodiments, the first material and the second material It may be the same material, or it may alternatively be a different material.

FIG. 1a illustrates a side view of a material deposition arrangement 100 according to the embodiments described herein. An embodiment of the material deposition configuration as shown in Figure 1a may include a first material source having a first material evaporator 102a, a second material source having a second material evaporator 102b, and a third material evaporator 102c The third source of material. In one embodiment, each of the first material evaporator 102a, the second material evaporator 102b, and the third material evaporator 102c may provide different materials. In another embodiment, each material evaporator may provide the same material, or a part of the material evaporator may provide the same material, and another part of the material evaporator may provide a different material. According to some embodiments, the first material evaporator 102a, the second material evaporator 102b, and the third material evaporator 102c may be crucibles, configured to evaporate the material to be deposited on the substrate. The first material evaporator 102a, the second material evaporator 102b, and the third material evaporator 102c are in fluid communication with the first distribution pipe 106a, the second distribution pipe 106b, and the third distribution pipe 106c, respectively. The material evaporated by one of these material evaporators can be released from the material evaporator and flow into the respective distribution pipes.

As can be seen in FIG. 1, each of the first distribution pipe 106 a, the second distribution pipe 106 b, and the third distribution pipe 106 c includes a distribution pipe housing, and the distribution pipe housing includes a plurality of nozzles 712. Through these nozzles, the evaporated material is released and guided to a substrate (not shown) to be coated. According to some embodiments, the nozzle 712 may be a combined part of the distribution pipe, such as an opening formed in the distribution pipe housing, or may be provided by a nozzle connected to the distribution pipe housing to perform a defined The process, for example, directs the evaporated material toward the substrate to be coated. In one example, the nozzle can be locked by Fixing, plugging, or shrinking processes are connected to the distribution tube. In one embodiment, the nozzle may be a distribution tube that is exchangeably connected to the material deposition configuration.

FIG. 1b shows an enlarged view of the area A of the third distribution pipe 106c shown in FIG. 1a. The partial diagram shown in FIG. 1b shows a nozzle 712 of the third distribution pipe 106c and the third distribution pipe 106c. The nozzle 712 is provided with an opening 713, or channel, through which the evaporated material can pass. The opening 713 of the nozzle 712 provides an opening length 714, as shown in FIG. 1b. According to some embodiments, the opening length 714 may be measured along the longitudinal or length axis of the nozzle, particularly in a direction corresponding to the average fluid direction away from the nozzle. In an embodiment, the opening length 714 of the nozzle may be substantially perpendicular to the longitudinal (or linear) direction of the distribution pipe.

The name "substantially perpendicular" can be understood to include deviations up to 15 ° from an absolute vertical arrangement. According to some embodiments, other names expressed as "substantially" in the following description may include a deviation of up to 15 ° from the indicated angle, or a deviation of about 15% from a dimension.

FIG. 1c shows a front view of the material deposition configuration 100. The previous view may correspond to the material deposition configuration shown in FIG. 1a, but is rotated by about 90 °. The first material evaporator 102a, the second material evaporator 102b, and the third material evaporator 102c are in fluid communication with the first distribution pipe 106a, the second distribution pipe 106b, and the third distribution pipe 106c, respectively. The opening of the nozzle 712 is visible in the front view. The nozzles 712 of the first distribution pipe 106a, the second distribution pipe 106b, and the third distribution pipe 106c are separated by a distance of 200 from each other. According to the embodiment described here, the distance between these nozzles Li can be less than 50 mm, more representative is less than 30 mm, and even more representative is less than 25 mm.

According to some embodiments, the distances between the nozzles 712 of the different first distribution pipes 106a, second distribution pipes 106b, and third distribution pipes 106c are measured from the center points of the openings of the respective nozzles. In one example, the center point of the opening of the nozzle can be defined as the geometric center point of the opening. In the case where the opening is circular, the center point of the circle is a point equidistant from the point on the edge. For example, if the opening of the nozzle has a symmetrical shape, the center point of the opening can be described as a point that is invariant in the symmetrical movement. For example, the center point of a square, rectangle, rhombus, or parallelogram is located at the intersection of the diagonals, and the center point is a fixed point of rotation symmetry. Similarly, the center point of the ellipse is at the intersection of the axes. According to some embodiments, the center point may be understood as the center of gravity of the shape.

In some embodiments, the distance 200 between such nozzles of the distribution tube may be a substantially horizontal distance. For example, the first distribution pipe 106a, the second distribution pipe 106b, and the third distribution pipe 106c may extend in a substantially vertical direction. Such nozzles may have an evaporation direction, that is, a direction in which a substantially horizontal nozzle releases evaporated material. According to some embodiments, a substantially horizontal distance between such nozzles of different distribution tubes can be understood to include a deviation of about 15 ° from an absolute horizontal configuration.

According to some embodiments, the distance between the nozzles may be described as the distance between different distribution pipes, for example, measurement is performed from the longitudinal axis of the distribution pipes. In one embodiment, the distribution pipes are separated by a distance of 200 from each other.

Figures 1d to 1f show a partial view B in the view before Figure 1c Schematic illustration of the embodiment. In the figures 1d to 1f, the opening size 716 of the nozzle 712 is marked. The opening size of the nozzle can be determined by the shape of the nozzle. In an embodiment, the size of the opening can be understood as a dimension of the opening, and this dimension of the opening is not the length of the opening. According to some embodiments, the size of the opening may be the smallest dimension of the cross-section of the opening, especially the smallest dimension of the cross-section of the nozzle exit (the nozzle exit is located where the evaporated material leaves the nozzle).

Fig. 1d is a schematic diagram showing an example of the nozzle opening and the opening size 716. The opening size corresponds to the cross section, especially the opening diameter. Figure 1e illustrates an example in which the nozzle opening has an oval-like shape and the size of the opening is defined by the smallest dimension of the cross section of the opening. Figure 1f shows an example in which the nozzle opening has an elongated circular shape, and the size of the opening is defined by the smallest dimension of the cross section of the opening. Those with ordinary knowledge will understand that the embodiments shown in Figures 1a to 1f are only examples, and are not limited to the illustrated examples of the size, shape, and length of the nozzle openings, or are not limited to use as distribution pipes and material sources. An example of the configuration is shown in detail below.

According to the embodiments described herein, each nozzle of the first distribution pipe may have an opening length to size ratio of 2: 1 or more, or the nozzles of only a portion of the first distribution pipe may have the length to size described. ratio. According to some embodiments, the second and / or third distribution tube of the material deposition configuration described above may also include one or more nozzles having an opening length to size ratio of 2: 1 or greater.

According to some embodiments that may be combined with other embodiments described herein, the distribution tube may have a substantially triangular cross-section. Figure 2a shows a section of the distribution pipe 106 Schematic of an example. The distribution pipe 106 has walls 322, 326, and 324, and the walls 322, 326, and 324 surround the inner hollow space 710. The wall 322 is provided on the exit side of the material source where the nozzle 712 is provided. The profile of the distribution pipe can be described as a cost-effective triangle, that is, the main area of the distribution pipe corresponds to a part of the triangle and / or the profile of the distribution pipe can have rounded corners and / or cut-off corners ) Of the triangle. As shown in Fig. 2a, the corners of the triangle on the exit side are exemplified by chamfered corners.

The width of the outlet side of the distribution pipe, for example, is indicated by the arrow 352 as the dimension of the wall 322 in the section shown in Figure 2a. Further, other dimensions of the cross section of the distribution pipe 106 are indicated by arrows 354 and 355. According to the embodiment described here, the width of the outlet side of the distribution pipe is 30% or less of the largest dimension of the section, for example, 30% or less of the larger dimension marked by arrows 354 and 355. In view of the dimensions and shape of the distribution pipes, the nozzles 712 of the adjacent distribution pipes 106 can be provided at a smaller distance. This smaller distance improves the mixing of organic materials that are evaporated next to each other.

FIG. 2b is a schematic diagram of an embodiment in which two distribution pipe systems are adjacent to each other. Therefore, a material deposition arrangement having two distribution tubes as shown in Fig. 2b can evaporate two organic materials adjacent to each other. Such a material deposition configuration may also mean a material deposition array. As shown in Figure 2b, the cross-sectional shape of the distribution pipe 106 is such that the nozzles of adjacent distribution pipes are placed close to each other. According to some embodiments that can be combined with other embodiments described herein, the first nozzle of the first distribution pipe and the second nozzle of the second distribution pipe may have a distance of 30 mm or less, such as from 5 mm to 25 mm. More specifically, the distance from the first outlet or nozzle to the second outlet or nozzle may be 10 mm or less.

According to some embodiments described herein, the distance between the first nozzle of the first distribution pipe and the second nozzle of the second distribution pipe may be measured as the minimum distance between the longitudinal axes of the respective nozzles. In one example, the minimum distance between the longitudinal axes of the respective nozzles is at the exit of the nozzle (ie, where the evaporated material leaves the nozzle). Figure 2c shows a schematic diagram of a partial view C of the configuration shown in Figure 2b. The enlarged partial view C in FIG. 2c shows an example of two first distribution pipes 106a and the second distribution pipe 106b. The distance 200 between these nozzles is the first of the first distribution pipes 106a. The outlets of the respective nozzles are measured between the longitudinal axis 201 of the nozzle and the longitudinal axis 202 of the second nozzle of the second distribution pipe 106b. According to some embodiments, the longitudinal axis of the nozzle referred to here extends along the length of the nozzle.

According to the embodiments described herein, the material deposition configuration described herein can be used in a high-accuracy process, such as an organic light-emitting diode (OLED) production process. Figures 3a and 4a are schematic diagrams illustrating the efficacy of a material deposition arrangement according to the embodiments described herein. Figures 3b and 4b are schematic diagrams showing the efficacy of a comparative example of known material deposition configurations. In Figure 3a, the test data of the distribution of the evaporated material released from the material deposition configuration according to the embodiment described herein is shown. Curve 800 is an experimental result showing the release of evaporated material from a nozzle having a length to size ratio of 2: 1 or higher. The example in Figure 3a shows that the distribution of the evaporated material is approximately mimicking the shape of cos ⁶ . The comparison with the known material deposition configuration shown in Figure 3b shows that the distribution of the conventional material deposition configuration corresponds to the shape of cos ¹ shown by curve 801. The difference between the curve 800 and the curve 801 of the known system is essentially the width of the plume of the evaporated material and the concentrated distribution of the evaporated material in the plume. The material deposition configuration of the embodiment is generated. For example, if the mask is used to deposit materials on a substrate, such as in an OLED production system, the mask may be a pixel mask with pixel openings, and the pixel openings may have a size of about 50 μm x 50 μm or even less. The size is, for example, the dimension of a pixel opening having a cross section of about 30 μm or less, or about 20 μm (for example, the minimum size of the cross section). In one example, the pixel mask may have a thickness of about 40 μm. Considering the thickness of the mask and the size of the pixel openings, a masking effect may occur. The wall of the pixel openings in the mask is to block the pixel openings. Material deposition arrangements and / or distribution tubes and / or nozzles according to embodiments described herein may help reduce shadowing effects.

The high directivity that can be achieved by using the evaporation of the material deposition configuration according to the embodiments described herein is to improve the usability of the evaporated material because more evaporated material actually reaches the substrate (and, for Not the area above and below the substrate).

FIG. 3c is a schematic diagram showing the distribution of the evaporated material in one pixel of a mask and three different lines. All three lines represent the distribution of evaporated material over a defined distance between the nozzle and the substrate. In one example, the distance between the nozzle outlet (where the evaporated material leaves the nozzle) and the substrate or substrate support may be 250 mm or less, such as about 200 mm, or about 150 mm. The first wiring 804 represents the distribution of evaporated material in one pixel opening of a mask provided by a known material deposition configuration. The distribution of the first wiring 804 corresponds to a similar cos ¹ distribution. With the material deposition configuration or distribution tube according to the embodiments described herein, the distribution of the evaporated material may correspond to a similar cos ⁶ distribution, as shown by the second wiring 805. In particular, the slope of the second wiring 805 is steeper than that of the first wiring 804. Those with ordinary knowledge can see from Figure 3c that the cos ⁶ distribution is better than the cos ¹ distribution on the edge of the pixel opening of the mask. The third connection 806 represents the result of an experimental test using a material deposition pipe or a distribution pipe according to the embodiments described herein. The third connection 806 is substantially a copy of the second connection 805 with a similar cos ⁶ distribution of the evaporated material. When using a material deposition arrangement or distribution tube according to the embodiments described herein, the shadowing effect can be reduced.

FIG. 4a is a schematic diagram illustrating an exemplary material deposition configuration including a first material source 100a, a second material source 100b, and a third material source 100c according to the embodiments described herein. The material deposition configuration may be a material deposition configuration as described in the examples herein. The deposition system in FIG. 4a further illustrates the substrate 121 coated with the evaporated material and a mask 132 for shielding the substrate 121. Figure 4a shows how the evaporated material 802 exits and leaves the first material source 100a, the second material source 100b, and the third material source 100c of the material deposition configuration, especially the first material deposition configuration. The nozzles of the material source 100a, the second material source 100b, and the third material source 100c. According to the embodiment described herein, the evaporated material 802 is dispersed when it leaves the first material source 100a, the second material source 100b, and the third material source 100c of the material deposition configuration and enters the vacuum space of the deposition chamber. Nozzles having a length-to-size ratio of 2: 1 or more allow the vaporized material to have a restricted spread, for example a restricted spread including an angle of about 30 ° or less. The known sedimentary system shown in Figure 4b By comparison, the evaporated material 803 contains an angle of about 60 °.

As can be seen in the examples shown in Figures 3a, 3b, 4a, and 4b, the material deposition configuration according to the embodiments described herein can provide a smaller distribution of evaporated material and provide more accurate guidance of the evaporated material. The material reaches the substrate, and in particular, the mask openings for coating the substrate are more accurately reached with high accuracy.

The nozzles that arrange the distribution tubes at a distance of less than 30 mm further provide the option to mix different materials of different first material sources 100a, second material sources 100b, and third material sources 100c. By using a specially-shaped distribution tube, such as a triangle-like shape as exemplarily shown in Fig. 4a, reducing the distance between these nozzles of the material deposition arrangement can be more improved.

Evaporated materials with a similar cos ⁶ distribution can provide smaller mask openings and improve the accuracy of smaller structures to be coated on substrates, such as pixels used in OLED products.

According to some embodiments, a material deposition arrangement for depositing evaporated material on a substrate in a vacuum chamber is provided. According to some embodiments, a material deposition configuration may be assembled for depositing two or more evaporated materials on a substrate in a vacuum chamber. The material deposition configuration includes a first material source, the first material source includes a first material evaporator, and is configured to vaporize the first material to be deposited on the substrate. According to some embodiments, the first material may be a first material of two or more materials to be deposited on a substrate. The first material source further includes a first distribution pipe, and the first distribution pipe includes a first distribution pipe housing, wherein the first distribution pipe system is in fluid communication with the first material evaporator. Furthermore, the first material source includes a plurality of first nozzles located in the first distribution tube housing. One or more of the first nozzles include an opening length and an opening size, and are assembled to provide a first distribution direction. The length to size ratio of the one or more nozzles of the first nozzles is equal to or greater than 2: 1. The material deposition configuration further includes a second material source, and the second material source includes a second material evaporator, which is assembled to evaporate the second material to be deposited on the substrate. According to some embodiments, the second material may be a second material of two or more materials to be deposited on the substrate. The second material source further includes a second distribution tube. The second distribution pipe includes a second distribution pipe housing, wherein the second distribution pipe system is in fluid communication with the second material evaporator. The second material source further includes a plurality of second nozzles located in the second distribution tube housing, wherein one or more second nozzles are assembled to provide a second distribution direction. According to several embodiments described herein that can be combined with other embodiments described herein, the first distribution direction of the one or more nozzles of the first nozzles and the one or more of the second nozzles The second distribution direction of the nozzles is arranged in parallel with each other, or the deviation from the parallel arrangement is as high as 5 °. According to some embodiments, the first material and the second material may be the same material, or may be different materials selectively.

Figure 5a shows a schematic diagram of a material deposition configuration having a first distribution direction of nozzles in a first distribution tube housing and a first distribution direction of nozzles in a second distribution tube housing arranged substantially parallel. Second distribution direction. An exemplary material deposition configuration shown in FIG. 5a shows a first material source 100a and a second material source 100b. Each of the first material source 100a and the second material source 100b includes a first material evaporator 102a and a second material evaporator 102b, respectively. In one example, each material evaporator can provide different materials. In another embodiment, each material evaporator may provide the same material, or a part of the material evaporator may provide the same material, and another part The material evaporator provides different materials. According to the embodiments described herein, the first material source 100a includes a first distribution tube 106a, and the second material source 100b includes a second distribution tube 106b. The first and second distribution pipes each have a distribution pipe housing, and the nozzle 712 is disposed in the distribution pipe housing. In particular, the first distribution tube includes a plurality of first nozzles and the second distribution tube includes a plurality of second nozzles for releasing the evaporated material from the respective distribution tube housings toward the coated substrate.

According to the embodiment described herein, one or more of the nozzles of the first distribution pipe and / or the second distribution pipe may have a length-to-size ratio of the nozzles of 2: 1 or more, such as 2.5: 1, 3: 1, 5: 1 or even greater than 5: 1. The size and length of the openings of the nozzle can be understood as the detailed description of the figures 1a to 1f described above. In some embodiments, one or more nozzles of the first distribution pipe provide a first distribution direction and one or more nozzles of the second distribution pipe provide a second distribution direction.

According to the embodiments described herein, the distribution direction of the nozzles can be understood as the average distribution direction of the nozzles. In some embodiments, the average distribution direction may substantially correspond to one of the plumes of the evaporated material, and the plumes of the evaporated material are released from the nozzle toward the coated substrate, especially the average distribution direction may be Essentially corresponds to wiring along one of the largest of the feathers of the evaporated material along the concentration of evaporated material. According to some embodiments, the average distribution direction of the nozzles can be understood as corresponding to the geometric centerline of the feathers of the evaporated material, and the feathers of the evaporated material are released from the nozzle toward the substrate to be deposited. In some embodiments, the centerline of the steam plume may be described as corresponding to the wiring including the geometric center of gravity of the evaporated material, and a point on the length or longitudinal axis of the nozzle, such as the point of the nozzle exit. according to In still other embodiments, the average distribution direction of the nozzles can be described as extending along a line having the nozzle outlet and the shortest distance between the coated substrates, and particularly, it can be described as having a point at the nozzle outlet and the The shortest distance between the wires extends, and this point of the nozzle exit is located on the length axis or the longitudinal axis of the nozzle.

Figure 5b illustrates a top view of a material deposition configuration including a first material source 100a and a second material source 100b according to some embodiments. As can be seen from the examples in Figures 5a and 5b, the nozzle 712 of the first distribution pipe 106a provides a first distribution direction 210 and the nozzle 712 of the second distribution pipe 106b provides a second distribution direction 211. Generally, the nozzle systems in the first distribution pipe and the second distribution pipe are arranged so that the first distribution direction and the second distribution direction are parallel to each other. According to some embodiments, the first distribution direction and the second distribution direction may deviate from the absolute parallel arrangement by up to 5 °, such as about 3 ° or about 2 ° from the absolute parallel arrangement. According to some embodiments, the first distribution direction 210 and the second distribution direction 211 as marked in FIGS. 5a and 5b may have a distance of about 30 mm or less between each other.

As described above, the first distribution pipe and the second distribution pipe shown in the material deposition arrangement shown in FIGS. 5a and 5b may have a triangle-like shape. 6a and 6b are schematic diagrams of a substantially triangular material deposition configuration. In the material deposition configuration, the distribution directions of the nozzles of the first distribution pipe and the second distribution pipe are substantially parallel to each other.

Figure 6a shows a cross-sectional view of an embodiment in which a first material source having a first distribution tube 106a, a second material source having a second distribution tube 106b, and a third material tube having a third distribution tube 106c are provided. Third material source. According to some real In an embodiment, such distribution pipes may be equipped with heating elements 380 and adiabatic heaters 879 to improve heating efficiency and prevent condensation of evaporated materials in the distribution pipes. An evaporator control housing 702 is provided adjacent to the distribution pipes and connected to the distribution pipes via a heat insulator 879. The arrows above the first distribution pipe 106a, the second distribution pipe 106b, and the third distribution pipe 106c (when seen in the plane of projection) show that the evaporated organic material leaves the first distribution pipe 106a, the second distribution Tube 106b, and third distribution tube 106c. The average distribution directions of the respective nozzles of these distribution pipes are marked with reference signs 210, 211, and 212. As can be seen in Figure 6a, the distribution directions of the different distribution tubes are substantially parallel.

The partial and schematic diagrams of the nozzles 712 of the three first distribution pipes 106a, the second distribution pipe 106b, and the third distribution pipe 106c are shown in Figure 6b. The three nozzles 712 shown by way of example have a longitudinal axis or a longitudinal axis 201, 202, 203. The nozzle 712 may face the substrate to be coated (not shown) from the first distribution pipe 106a, the second distribution pipe 106b, and the third distribution pipe 106c in the first distribution direction 210, the second distribution direction 211, and the third distribution direction 212. (Shown) guide the evaporated material. In the embodiment shown in Figure 6b, the three distribution directions are parallel to each other, or can be offset by up to 5 ° from an absolutely parallel arrangement.

According to the embodiment described here, for example, the different distribution pipes of the first, second and third distribution pipes referred to herein may be fluidly connected to different evaporators. For example, in the case of three distribution pipes, three different evaporations Device. In some embodiments, different distribution tubes may be in fluid communication with the same form of evaporator, but vaporize different materials. For example, three different components can be fluidly connected to three distributions of three evaporators Tube provided. In one example, a material deposition configuration as described herein can be used to produce OLEDs. The evaporated material can include three ingredients used to produce OLEDs.

The use of different nozzles according to the embodiments described herein is arranged in parallel, and the use of nozzles having a length-to-size ratio of 2: 1 or larger can help improve the consistency of the characteristics of the evaporated material released from the nozzles. Uniformity and predictability. For example, the direction of the evaporated material that is substantially parallel to another or adjacent evaporated material may allow the evaporated material to have a normal and consistent effect on the mask and / or substrate. In one example, different components of different distribution tubes may have substantially the same impact angle to the mask and / or the substrate, especially the substantially perpendicular impact angle to the mask and / or the substrate. Manufacturing of one or more components can be performed in a more precise manner using a material deposition configuration according to the embodiments described herein. Furthermore, when different material sources have a defined angle between the distribution directions, a material source with a parallel arrangement of the distribution directions can reduce the fixing and computational effort that is exemplified in known systems. Furthermore, if different components are used in different material sources, according to the embodiment described herein, the material deposition configuration including the above-mentioned parallel arrangement of the distribution direction can uniformly mix the different components.

According to some embodiments, a distribution tube system for depositing evaporated material on a substrate in a vacuum chamber is provided. The distribution pipe includes a distribution pipe housing and a nozzle, and the nozzle is located in the distribution pipe housing. The nozzle includes an opening length and an opening size, wherein a length to size ratio of the nozzle is equal to or greater than 2: 1. According to some embodiments that can be combined with other embodiments described herein, the nozzle includes a material that is chemically inert to the evaporated organic material. In one example, the evaporated organic material may be representative There are temperatures between about 150 ° C and about 650 ° C, and more typically temperatures between about 100 ° C and 500 ° C.

Figures 7a to 7d show schematic diagrams of examples of nozzles for distribution pipes according to the embodiments described herein. The nozzle 700 as shown in FIGS. 7a to 7d includes an opening 713 (or a channel or a hole 713) for guiding the evaporated material through the nozzle. According to the embodiment described herein, the nozzle 700 has an opening length 714 and an opening size 716. The length-to-size ratio of the nozzles in the embodiments described herein may be 2: 1 or greater, as exemplified above. The names "opening length" and "opening size" can be understood as described above with respect to the description of the drawings 1a to 1f.

FIG. 7 a is a schematic diagram of a nozzle including a first nozzle material 206 and a second nozzle material 208. For example, the first nozzle material 206 may be a material having a thermal conductivity value greater than 21 W / mK, such as copper. In some embodiments, the second nozzle material 208 may be provided inside the opening or channel 713 and may be chemically inert to the evaporated organic material. For example, the second nozzle material may be selected from tantalum (Ta), niobium (Nb), titanium (Ti), diamond-like coating (DLC), stainless steel, quartz glass, and graphite. As can be seen in the embodiment in Figure 7a, the second nozzle material 208 may be provided as a thin coating on the inside of the channel 713.

FIG. 7b illustrates a schematic diagram of an embodiment having a first nozzle material 206 and a second nozzle material 208. The example of the nozzle shown in Fig. 7b is composed of a first part and a second part. The first part is made of the first nozzle material 206 (having a heat conduction value of, for example, greater than 21 W / mk), and the second part is Made of a second nozzle material 208, which can be chemically Inert. In one example, the first and second nozzle materials may be selected from the descriptions regarding FIG. 7a. As can be seen in Figure 7b, the second nozzle material 208 is part of the nozzle, and in particular is not just a coating on the inner channel side.

According to some embodiments, the thickness of the second nozzle material may be representative in the range of some nanometers to several micrometers. In an example, the thickness of the second nozzle material in the nozzle opening may be representatively between about 10 nm and about 50 μm, more typically between about 100 nm and about 50 μm, and even more typically between about 500 nm and about 50 μm. between. In one example, the thickness of the second nozzle material may be about 10 μm.

Figure 7c shows a schematic diagram of an embodiment of the nozzle 700 (labeled in Figure 7d). The nozzle 700 is made of a first nozzle material, and the first nozzle material has a heat transfer rate greater than the thermal conductivity of the distribution tube. Or higher than 21W / mk thermal conductivity, this nozzle can be connected to the distribution pipe. In the embodiment described herein, the first nozzle material 206 is inert to the evaporated organic material. In one example, the first nozzle material may be selected from Ta, Nb, Ti, DLC, or graphite.

Fig. 7d shows a schematic diagram of a nozzle as shown in Fig. 7a according to the embodiment described herein. The second nozzle material 208 is visible in the opening 713, and the first nozzle material 206 is shown on the outside of the nozzle 700.

According to some embodiments described herein, the opening or channel of the nozzle may have a size representative of about 1 mm to about 10 mm, more representative size of about 1 mm to about 6 mm, and even more representative size of 2 mm to about 5 mm, The evaporated material passes through the openings or channels of the nozzle during the evaporation process to reach the substrate to be coated. According to some embodiments, the size of the channel or opening may mean the smallest rule of the profile Inch, for example, the diameter of a channel or opening. In one embodiment, the size of the opening or channel is measured at the outlet of the nozzle. According to some embodiments described herein that can be combined with other embodiments described herein, the openings or channels can be made in the tolerance region H7, for example, with a tolerance of about 10 μm to 18 μm.

According to some embodiments described herein, the nozzles used for the material deposition configuration or distribution tube according to the embodiments described herein may include threads to repeatedly connect the nozzles to the distribution tube and disconnect the nozzles from the distribution tube. The deposition configuration is used to deposit material on the substrate in the vacuum deposition chamber. In some embodiments, the nozzle having a thread for connecting to the distribution pipe may have an internal thread and / or an external thread, so as to be able to repeatedly connect the nozzle to the distribution pipe, especially without damaging the distribution pipe or the nozzle. For example, a first nozzle having a defined characteristic may be connected to a distribution tube for a first process. After the first process is completed, the first nozzle can be disconnected and the second nozzle can be connected to the distribution pipe for the second process. If the first process is to be performed again, the second nozzle may be disconnected from the distribution pipe and the first nozzle may be connected to the distribution pipe again to perform the first process. According to some embodiments, the distribution tube may also include threads for interchangeable connection of the nozzle to the distribution tube, such as by fitting the threads of the nozzle.

According to some embodiments described herein, the material deposition configuration as in the embodiment described herein and the distribution tube as in the embodiment described herein can be seen in Figures 8a to 8c. The distribution tube 106 may be in fluid communication with the crucible for distributing the evaporated material provided by the crucible. The distribution tube may be exemplified as an extended cube with a heating unit 715. Evaporation crucible can be a reservoir for using an external heating unit 725 Organic material that will evaporate. According to a typical embodiment that can be combined with other embodiments described herein, the distribution tube 106 provides a wiring source. According to some embodiments described herein, the material deposition arrangement 100 further includes a plurality of openings and / or outlets for releasing the evaporated material toward the substrate, such as nozzles arranged along at least one line.

According to some embodiments that can be combined with other embodiments described herein. The nozzle of the distribution pipe can be adapted to release the evaporated material in a direction which is different from the length direction of the distribution pipe and is, for example, a direction substantially perpendicular to the length direction of the distribution pipe. According to some embodiments, the outlets (for example, nozzles) are arranged to have a main evaporation direction of + -20 ° to horizontal. According to some specific embodiments, the evaporation direction may be oriented slightly upward, for example, in a range of 15 ° from the horizontal upward, for example, from 3 ° to 7 ° upward. Therefore, the substrate may be slightly inclined so as to be substantially perpendicular to the evaporation direction. With an inclined substrate, the generation of unwanted particles can be reduced. However, the nozzle and material deposition arrangement according to the embodiments described herein may also be used in a deposition apparatus that is assembled for depositing material on a horizontally oriented substrate.

In one example, the length of the distribution tube 106 corresponds at least to the height of the substrate to be deposited in the deposition device. In many cases, the length of the distribution tube 106 will be at least 10% or even 20% longer than the height at which the substrate will be deposited. The distribution tube having a height longer than the substrate can provide uniform deposition at the upper end of the substrate and / or the lower end of the substrate.

According to some embodiments that can be combined with other embodiments described herein, the length of the distribution tube may be 1.3 m or more, for example 2.5 m or more. According to a configuration, as shown in Figure 8a, the evaporation crucible 104 is provided below the distribution tube 106 end. The organic material is evaporated in the evaporation crucible 104. The vapor of the organic material enters the distribution pipe 106 at the bottom of the distribution pipe, and is essentially sideways guided through the nozzles in the distribution pipe toward the substantially vertical substrate, for example.

FIG. 8b shows an enlarged view of a part of the material source, in which the distribution pipe 106 is connected to the evaporation crucible 104. A flange unit 703 is provided, and the flange unit 703 is assembled to provide a connection between the evaporation crucible 104 and the distribution pipe 106. For example, the evaporation crucible and the distribution pipe are provided as a separation unit, and can be separated and connected or assembled to the flange unit, for example, for the operation of a material source.

The distribution pipe 106 has an internal hollow space 710. A heating unit 715 may be provided to heat the distribution pipe. Therefore, the distribution pipe 106 can be heated to a temperature so that the vapor of the organic material does not condense inside the wall of the distribution pipe 106, and the vapor of the organic material is provided by the evaporation crucible 104.

For example, the distribution tube can be maintained at a temperature that is typically about 1 ° C to about 20 ° C, more typically about 5 ° C to about 20 ° C, and even more typically about 10 ° C to about 15 ° C higher than Evaporation temperature of the material to be deposited on the substrate. Two or more heating shields 717 are provided around the tubes of the distribution tube 106.

During operation, the distribution tube 106 may be connected to the evaporation crucible 104 at the flange unit 703. The evaporation crucible 104 is assembled to receive the organic material to be evaporated and to evaporate the organic material. According to some embodiments, the material to be evaporated may include at least one of indium tin oxide (ITO), NPD, Alq ₃ , Quinacridone, Mg / AG, starburst material, and the like. FIG. 8b shows a cross-sectional view of the casing passing through the evaporation crucible 104. FIG. The refill opening is provided above the example of the evaporation crucible. The refill opening can be closed with a plug 722, lid, cover, or the like to close the internal space of the evaporation crucible 104 ( enclosure).

The external heating unit 725 is provided in the internal space of the evaporation crucible 104. The external heating unit may extend along at least a portion of the wall of the evaporation crucible 104. According to some embodiments that may be combined with other embodiments described herein, one or more central heating elements 726 may be additionally or selectively provided. Figure 8b shows two central heating elements 726. According to some applications, the evaporation crucible 104 may further include a shield 727.

According to some embodiments, the evaporation crucible 104 is provided on the lower side of the distribution tube 106 if it is shown by way of example in FIGS. 8a to 8b. According to still other embodiments that can be combined with other embodiments described herein, the steam duct 732 may be provided at the central portion of the distribution pipe to the distribution pipe 106, or may be another between the lower end of the distribution pipe and the upper end of the distribution pipe. The position is provided on the distribution pipe 106. FIG. 8c is a schematic diagram showing an example of a material source having a distribution pipe 106 and a steam duct 732 provided at a central portion of the distribution pipe. The vapor of the organic material is generated in the evaporation crucible 104 and guided through the steam duct 732 to the center of the distribution pipe 106. The steam leaves the distribution pipe 106 via a number of nozzles 712. These nozzles 712 may be the nozzles described with reference to Figures 7a to 7d. According to yet other embodiments that may be combined with other embodiments described herein, two or more steam ducts 732 may be provided at different locations along the length of the distribution pipe 106. In some embodiments, the steam conduit 732 may be connected to one evaporation crucible 104 or several evaporation crucibles 104. For example, each steam conduit 732 may have a corresponding evaporation crucible 104. Alternatively, the evaporation crucible 104 may be in fluid communication with two or more steam conduits 732 that are connected to the distribution pipe 106.

As described herein, the distribution tube may be a hollow cylinder. The name cylinder can be understood as generally accepted as having a circular bottom shape and a circular top shape, and a curved area or shell connecting the top circle and the bottom circle. According to other additional or alternative embodiments that can be combined with other embodiments described herein, the name cylinder can be better understood in mathematical sense as having any bottom shape and a consistent top shape, and connecting the top shape and the bottom A curved area or shell of a shape. Therefore, the cylinder does not have to have a circular cross section. Instead, the bottom surface and the top surface may have a shape other than a circle.

Figures 9a and 9b show cross-sectional views of an embodiment of a distribution tube 106 for a material deposition arrangement according to the embodiments described herein. According to some embodiments, the distribution pipe 106 includes a distribution pipe housing 116, which includes the first housing material or is made of the first housing material. As can be seen from the embodiments in Figures 9a and 9b, the distribution pipe is a linear distribution pipe extending along the first direction 136.

Fig. 9a shows a schematic diagram of a distribution pipe having a plurality of openings 107, and these openings 107 are arranged along a first direction in the distribution pipe housing. In some embodiments, the perforated wall 109 in the distribution pipe can be understood as a nozzle according to the embodiments described herein. In one example, the wall 109 of the opening 107 may include a first nozzle material (for example, coated with the first nozzle material), wherein the thermal conductivity value of the first nozzle material may be greater than the thermal conductivity of the first distribution pipe material in some examples. Rate or greater than 21W / mK. In one example, the wall 109 of the opening 107 may be covered with copper. In one embodiment, the wall may be covered with copper and a second nozzle material. The second nozzle material is, for example, a material that is chemically inert to the evaporated organic material.

FIG. 9b is a schematic diagram of an embodiment of a distribution tube according to the embodiment described herein. The distribution pipe 106 shown in FIG. 9b includes an opening 107 provided with an extension wall 108. Generally, the extension wall 108 of the opening 107 extends along a direction substantially perpendicular to the first direction 136 of the distribution tube housing 116. According to some embodiments, the extension wall 108 of the opening 107 may extend from the distribution pipe at any suitable angle. In some embodiments, the extension wall 108 of the opening 107 of the distribution pipe housing 116 may provide a nozzle for the distribution pipe 106 according to the embodiments described herein. For example, the extension wall 108 may include, or may be made of, a first nozzle material. According to some embodiments, the extension wall 108 may be coated on the inside with a first and / or a second nozzle material, such as a material that is chemically inert to the evaporated organic material.

In some embodiments, the extension wall 108 provides a fixing aid for fixing the nozzles to the distribution pipe housing 116. The nozzles are exemplified as the nozzles shown in FIGS. 8a to 8d. According to some embodiments, the extension wall 108 may provide threads for locking the nozzles to the distribution tube housing 116.

According to some embodiments that can be combined with other embodiments described herein, the nozzles of the material deposition configuration or distribution tube referred to herein may be designed to form plumes with a contour similar to cos ⁿ shape, where n in particular Greater than 4. In one example, the nozzle is designed to form a feather with a contour similar to that of a cos ⁶ shape. If a narrow-shaped feather is needed, a nozzle for the evaporated material that achieves a cos ^n- shaped feather can be useful. For example, a deposition process including a mask with small openings (for example, openings having a size of about 20 μm) for a substrate can benefit from narrow cos ^n- shaped feathers, and since the feathers of the material have evaporated The objects are not scattered on the mask but through the openings of the mask, and the material utilization can be increased. According to some embodiments, the nozzle may be designed so that the relationship between the length of the nozzle and the diameter of the channel of the nozzle is a defined relationship, such as 2: 1 or higher. According to additional or alternative embodiments, the channels of the nozzle may include steps, bevels, collimator structures, and / or pressure stages to achieve the desired plume shape.

According to some embodiments described herein, a vacuum deposition chamber is illustrated. The vacuum deposition chamber includes a material deposition arrangement according to any of the embodiments described above. The vacuum deposition chamber further includes a substrate support for supporting the substrate during deposition. Generally, the distance between at least one of the plurality of distribution tubes arranged in the material deposition and the substrate support is less than 250 mm. According to some embodiments, the distance between the distribution tube and the substrate support can be measured from a nozzle outlet of the distribution tube and a position of the substrate support, and this position of the substrate support is located on a plane having the substrate (for example, a contact point , Clips or the like).

In some embodiments, the vacuum deposition chamber may include a material deposition configuration having a nozzle having an opening size to opening length ratio of 2: 1 or greater. According to some embodiments that may be combined with other embodiments described herein, the vacuum deposition chamber may include a material deposition configuration having a first material source and a second material source, such as the first and Two material sources (the first and second material sources are exemplified by having a first distribution pipe and a second distribution pipe, the first distribution pipe has a plurality of first nozzles, and the second distribution pipe has a plurality of second nozzles). Generally, between one of the first nozzles and one of the second nozzles The distance is equal to or less than 30mm.

According to some embodiments that may be combined with other embodiments described herein, the vacuum deposition chamber may include a material deposition configuration having a nozzle having an opening size to opening length ratio of 2: 1 or greater. According to some embodiments that may be combined with other embodiments described herein, the vacuum deposition chamber may include a material deposition configuration having a first material source and a second material source, such as the above The first and second material sources described (the first and second material sources are exemplified by having a first distribution tube and a second distribution tube, the first distribution tube has several first nozzles, and the second distribution tube has several second nozzle). Generally, at least one of the first nozzles of the first distribution pipe provides a first distribution direction, and at least one of the second nozzles provides a second distribution direction. In some embodiments, the first distribution direction of the one or more nozzles of the first nozzles and the second distribution direction of the one or more nozzles of the second nozzles are arranged in parallel with each other or deviated from the parallel arrangement. Arranged up to 5 °.

According to some embodiments, the vacuum deposition chamber may include a material deposition configuration having a distribution tube, the distribution tube having a distribution tube housing and a nozzle, and the nozzle is located in the distribution tube housing. The length-to-size ratio of the openings of the nozzle is 2: 1 or greater and the nozzle includes a material that is chemically inert to the evaporated organic material. The evaporated organic material is, for example, the organic material referred to above.

FIG. 10 is a schematic diagram of the deposition apparatus 300. The material deposition configuration, distribution pipe, or nozzle according to the embodiment described herein can be used in the deposition apparatus 300. The elements referred to below, such as nozzles or distribution tubes, may be as described above with regard to 1a Elements to 9b. For example, as long as the combination of the embodiments does not contradict each other, the distribution pipe referred to below may be the distribution pipe described with reference to FIGS. 1a to 9b.

The deposition apparatus 300 of FIG. 10 includes a material source 100d, which is located at a position of the vacuum chamber 110. According to some embodiments that may be combined with other embodiments described herein, the material source is assembled for translational motion or rotation about an axis. The material source 100d has one or more evaporation crucibles 104 and one or more distribution tubes 106. Two evaporation crucibles and two distribution pipes are shown in Figure 10. The distribution pipe 106 is supported by a support 102. Furthermore, according to some embodiments, the evaporation crucible 104 may also be supported by the support 102. Two substrates 121 are provided in the vacuum chamber 110. In general, a mask 132 for masking layer deposition on a substrate may be provided between the substrate and the material source 100d. In some embodiments, the mask may be a pixel mask, for example, a pixel mask with openings, and the openings have a size (for example, the diameter or the smallest dimension of the cross section), typically between about 10 μm and about 50 μm. More representative is between about 15 μm and about 40 μm, and even more representative is between about 15 μm and about 30 μm. In one example, the size of the mask opening is about 20 μm. In another example, the mask opening has an extension of about 50 μm x 50 μm. The organic material is evaporated from the distribution pipe 106.

According to the embodiments described herein, the substrate is coated with an organic material in a substantially vertical position. The viewing angle shown in FIG. 10 is a top view of the device including the material source 100d. Generally speaking, the distribution pipe system is a linear steam distribution nozzle. According to some embodiments, the distribution piping provides a wiring source that extends substantially vertically. According to several embodiments which can be combined with other embodiments described herein, essentially means substrate In the direction, it is particularly understood to allow a deviation of 20 ° or less from the vertical direction, for example, 10 ° or less. For example, this deviation may be provided because the substrate support has some deviation from the vertical direction, which may result in a more stable substrate position. However, the substrate orientation during the deposition of organic materials is considered to be essentially vertical, and is different from the horizontal substrate orientation. In some embodiments, the surface of the substrate is coated by a wiring source. The wiring source extends in a direction corresponding to a substrate dimension and a translational movement, and the translational movement is along other directions corresponding to other substrate dimensions. According to other embodiments, the deposition apparatus may be a deposition apparatus for depositing material on a substrate that is substantially horizontal. For example, coating a substrate in a deposition apparatus may be performed in an up or down direction.

FIG. 10 is a schematic diagram of an embodiment of a deposition apparatus 300 for depositing an organic material in a vacuum chamber 110. The material source 100d is provided on one of the tracks in the vacuum chamber 110, such as a circular track or a linear guide 320. The orbit or linear guide 320 is assembled for translational movement of the material source 100d. According to different embodiments that can be combined with other embodiments described herein, a driver for translational motion may be provided in a material source 100d, provided in a track or linear guide 320, provided in a vacuum chamber 110, or a combination thereof. FIG. 10 shows a valve 205, which is an example of a gate valve. The valve 205 is provided with a vacuum seal to an adjacent vacuum chamber (not shown in FIG. 10). The valve can be opened to transfer the substrate 121 or the mask 132 into or out of the vacuum chamber 110.

According to some embodiments that can be combined with other embodiments described herein, for example, other vacuum chambers for maintaining the vacuum chamber 111 are provided adjacent to the vacuum chamber 110. In some embodiments, the vacuum chamber 110 and the maintenance vacuum chamber 111 are It is connected by a valve 207. The valve 207 is assembled to open and close the vacuum seal between the vacuum chamber 110 and the maintenance vacuum chamber 111. When the valve 207 is in the open state, the material source 100d can be transferred to the maintenance vacuum chamber 111. Thereafter, the valve may be closed to provide a vacuum seal between the vacuum chamber 110 and the maintenance vacuum chamber 111. If the valve 207 is closed, the maintenance vacuum chamber 111 can be vented and opened to maintain the material source 100d without breaking the vacuum in the vacuum chamber 110.

In the embodiment shown in FIG. 10, two substrates 121 are supported on respective transfer tracks in the vacuum chamber 110. According to some embodiments, the distance between the at least one distribution tube and the substrate support is less than 250 mm. In FIG. 10, this distance is represented by the distance 101 between the substrate support 126 and the outlet of the nozzle of the distribution tube 106 of the material source 100d. Furthermore, two rail systems are provided for placing a mask 132 thereon. The coating of the substrate 121 may be masked by a respective mask 132. According to a typical embodiment, the masks 132 are provided in a mask frame 131 to support the mask 132 in a predetermined position. The masks 132 are also first masks corresponding to the first substrate 121 (on the right-hand side). The cover 132 corresponds to a second cover 132 corresponding to the (left-hand side) second substrate 121.

According to some embodiments that can be combined with other embodiments described herein, the substrate 121 may be supported by a substrate support 126, which is connected to the alignment unit 112. The alignment unit 112 can adjust the position of the substrate 121 relative to the cover 132. FIG. 10 is a schematic diagram illustrating an embodiment in which the substrate support 126 is connected to the alignment unit 112. Therefore, the substrate is moved relative to the mask 132 to provide proper alignment between the substrate and the mask during the deposition of the organic material. According to other embodiments described herein In a further embodiment, the mask 132 and / or the mask frame 131 supporting the mask 132 may be selectively or additionally connected to the alignment unit 112. According to some embodiments, the mask may be positioned relative to the substrate 121 or both the mask 132 and the substrate 121 may be positioned relative to each other. The alignment unit 112, which is assembled to adjust the position of the substrate 121 and the mask 132 relative to each other, provides a properly aligned mask during deposition, which is beneficial to the manufacture of high-quality, light-emitting diode (LED) displays , Or OLED display manufacturing.

As shown in Figure 10, the linear guide 320 provides the direction of translational movement of the material source 100d. A mask 132 is provided on both sides of the material source 100d. The mask 132 may extend substantially parallel to the direction of the translational motion. Furthermore, the substrate 121 on the opposite side of the material source 100d may also extend substantially parallel to the direction of the translational movement. According to a typical embodiment, the substrate 121 may be moved into and out of the vacuum chamber 110 via the valve 205. The deposition apparatus 300 may include a respective transfer track to transfer each substrate 121. For example, the transfer track may extend parallel to the substrate position as shown in FIG. 10 and enter or leave the vacuum chamber 110.

Generally, other rails are provided to support the mask frame 131 and the mask 132. Therefore, some embodiments that may be combined with other embodiments described herein may include four tracks in the vacuum chamber 110. In order to move one of these masks 132 out of the chamber, for example, a cleaning mask, the mask frame 131 and the mask can be moved to the transport track of the substrate 121. The respective mask frames may then leave or enter the vacuum chamber 110 on a transfer track for the substrate. Although it is possible to provide a separate transfer track to cover the frame 131 to enter and leave the vacuum chamber 110, it is possible The cost of ownership of the deposition apparatus 300 if only two track systems extend into and out of the vacuum chamber 110 and further the mask frame 131 can be moved to a respective one of the transport tracks for the substrate by a suitable actuator or robot Can be reduced, these two tracks are also the transfer tracks of the substrate.

FIG. 10 is a schematic diagram of an exemplary embodiment of the material source 100d. The material source 100d includes a support 102. The mount 102 is assembled for translational movement along the linear guide 320. The support 102 supports two evaporation crucibles 104 and two distribution pipes 106, and the distribution pipes 106 are provided above the evaporation crucible 104. The steam generated in the evaporation crucible can move upwards and leave one or more nozzles or outlets of the distribution tube.

According to the embodiments described herein, the material source includes one or more evaporation crucibles and one or more distribution tubes, wherein each of the one or more distribution tubes can be in fluid communication with the one or more evaporation crucibles. Each one of them. Several applications for OLED device manufacturing include processing features in which one, two or more organic materials are evaporated simultaneously. Therefore, as shown in FIG. 10, for example, two distribution pipes and corresponding evaporation crucibles may be provided adjacent to each other. Therefore, the material source 100d may also mean an array of material sources, for example, where more than one organic material is evaporated at the same time. As described herein, the material source array itself may mean a material source for two or more organic materials. For example, the material source array may provide three materials for evaporation and deposition onto a substrate. According to some embodiments, the array of material sources may be assembled for simultaneously providing the same material from different material sources.

The one or more nozzles of the distribution pipe may include, for example, one or more nozzles that may be provided in a spray head or another vapor distribution system. The nozzle provided in the distribution pipe described herein may be the nozzle described in the embodiment described herein, for example, the nozzle described with reference to Figures 8a to 8d. The distribution tube can be understood as including an internal space with several openings, so that the pressure in the distribution tube is higher than the pressure on the outside of the distribution tube, for example, at least one order of magnitude. In one example, the pressure in the distribution pipe may be between about 10 ^-2 to about 10 ^-3 mbar.

According to several embodiments that can be combined with other embodiments described herein, the rotation of the distribution tube can be provided by the rotation of the evaporator control casing, at least the distribution tube is fixed on the evaporator control casing. By moving the source of material along the curved portion of the circular orbit, the distribution tube rotation can be additionally or selectively provided. Generally, the evaporation crucible is also fixed on the evaporator control housing. Therefore, the material source includes a distribution tube and an evaporation crucible, and the distribution tube and the evaporation crucible are rotatably fixed together, for example.

According to some embodiments that can be combined with other embodiments described herein, the distribution tube or evaporation tube can be designed in a triangular shape so that the openings or nozzles of the distribution tube can be as close to each other as possible. Having the openings or nozzles of the distribution tubes as close as possible to each other provides, for example, improved mixing of different organic materials, for example for the case of co-evaporating two, three, or even multiple different organic materials.

According to several embodiments described herein, the width of the outlet side of the distribution pipe (including the side of the distribution pipe with openings) is 30% or less of the largest dimension of the section. In view of this, the opening of the distribution pipe or the nozzle of the adjacent distribution pipe can be provided at a small distance. This smaller distance improves the mixing of several organic materials, which are evaporated next to each other. Furthermore, independent of improving the mixing of organic materials, the width of the wall facing the substrate in an essentially parallel manner can be additionally or selectively reduced less. Therefore, the surface area of the wall facing the substrate in a substantially parallel manner can be reduced. This configuration reduces the heat load provided to the mask or substrate, which is supported in, or slightly before, the deposition area.

Due to the shape of the triangle of the material source, the area radiating towards the mask is additionally or selectively reduced. In addition, stacking of metal plates can be provided to reduce heat transfer from the source of material to the mask. Stacking of metal plates is exemplified by up to 10 metal plates. According to some embodiments that may be combined with other embodiments described herein, a heating shield or a metal plate may be provided with orifices for nozzles and may be attached to at least the front side of the source, i.e. facing Side of the substrate.

Although the embodiment shown in FIG. 10 is provided with a deposition device having a movable source, those having ordinary knowledge will understand that the above embodiment may also be provided in several deposition devices, and the substrate is attached to these deposition devices during processing. Mobile. For example, a substrate to be coated can be guided and driven along a source of static material.

The embodiments described herein are particularly related to the deposition of organic materials. The deposition of organic materials is exemplified by the manufacture of OLED displays on large-area substrates. According to some embodiments, a large-area substrate or a carrier supporting one or more substrates, that is, a large-area carrier, may have a size of at least 0.174 m ² . For example, the deposition equipment can be suitable for processing large-area substrates, such as the 5th generation, 7.5th generation, 8.5th generation, or even the 10th generation. The 5th generation corresponds to a substrate of about 1.4m ² (1.1mx 1.3 m), 7.5G corresponding to the substrate ² of about 4.29m (1.95mx 2.2m), corresponding to about 8.5 Generation of 5.7m ² substrate (2.2mx 2.5m), the first passage 10 ² corresponding to the substrate of about 8.7m (2.85m x 3.05m). Even higher generations and corresponding substrate areas such as the 11th and 12th generations can be applied in a similar manner. According to a typical embodiment that can be combined with other embodiments described herein, the substrate thickness can be from 0.1 to 1.8 mm and the supporting arrangement for the substrate can be adapted to such substrate thickness. However, in particular, the substrate thickness may be about 0.9 mm or less, such as 0.5 mm or 0.3 mm, and the support arrangement is suitable for such a substrate thickness. Generally, the substrate may be made of any material suitable for material deposition. For example, the substrate may be selected from the group consisting of glass (for example, soda lime glass, borosilicate glass, etc.), metal, polymer, ceramic, composite material, carbon fiber material, or any other material or a combination of materials that can be coated by a deposition process. Made of materials.

According to some embodiments, a method for depositing an evaporated material on a substrate in a vacuum deposition chamber is provided, and the vacuum deposition chamber has a chamber space. The cavity space can be understood as the space contained in the cavity wall, and especially the space provided at the same pressure specification. A flowchart 400 illustrating the method described herein is shown in FIG. 11. The method in block 410 includes using a first material evaporator to evaporate the first material, the first material evaporator being arranged in the chamber space. For example, the first material evaporator may be a source for evaporating organic materials. In one example, the evaporator may be adapted to evaporate a material having an evaporation temperature of about 150 ° to about 500 °. In some embodiments, the source of material may be a crucible.

At block 420, the method includes providing the evaporated first material to a first distribution tube, the first distribution tube including a first distribution tube housing. According to the embodiments described herein, the first distribution pipe system is in fluid communication with the first material evaporator. According to some embodiments, the distribution pipe may be a distribution pipe as described above, such as a linear distribution pipe, or a distribution pipe as shown in FIGS. 1a to 9b. Providing the evaporated first material to the first distribution pipe further includes providing a pressure in the first distribution pipe of about 10 ^-2 -10 ^-1 mbar. At a block 430, the evaporated material is directed through one or more of the first nozzles in the first distribution tube housing. Generally, the one or more nozzles of the first nozzles have an opening length and an opening size, wherein guiding the evaporated material through the one or more nozzles further includes guiding the evaporated material through a length-to-size The ratio is equal to or greater than one or more nozzles of 2: 1. According to some embodiments, the nozzle that guides the evaporated material through may be a nozzle as described in the above embodiments. In one example, the nozzle may be lockable to the distribution tube housing. In one embodiment that can be combined with other embodiments described herein, the nozzle may include a material that is chemically inert to the evaporated organic material, such as the nozzles shown in Figures 7a to 7d. According to some embodiments, the nozzle may be part of a distribution tube, as shown and illustrated by way of example in relation to Figures 9a and 9b.

At block 440, the evaporated material is released into the chamber space toward the substrate in the chamber space. Generally, the chamber space is provided with a pressure of 10 ^-5 to 10 ^-7 mbar, more typically about 10 ^-6 to about 10 ^-7 mbar. For example, the vacuum chamber may include pumps, seals, and the like to be able to vent the chamber to a pressure of about 10 ^-5 to 10 ^-7 mbar and to maintain the pressure in the vacuum chamber. . In some embodiments, the steam plumes released from the nozzle may have a similar cos ⁶ distribution. According to some embodiments described herein, a steam plume with a similar cos ⁶ distribution may provide a smaller shielding effect than a steam plume with a similar cos ¹ distribution. This effect is illustrated, for example, in Figures 3a to 3c. In the case of evaporated material with a similar cos ⁶ distribution, the uniformity of material deposition on the substrate and the accuracy of deposition can be increased.

According to some embodiments, the method further includes using a second material evaporator in the chamber space to evaporate the second material to provide the evaporated second material to the second distribution pipe, and the second distribution pipe includes a second distribution pipe housing. According to some embodiments, the second material may be the same material as the first material. In other embodiments, the second material is different from the first material. In some embodiments, the second distribution pipe may be a distribution pipe as described above. Generally, the second distribution pipe system is in fluid communication with the second material evaporator, and providing the evaporated second material to the second distribution pipe system includes providing a pressure in the second distribution pipe of about 10 ^-2 -10 ^-1 mbar . Vacuum chambers and / or material deposition configurations can be provided with pumps, seals, valves, and the like to provide and maintain the pressure in the distribution tube. The method may further include directing the evaporated material through one or more of the plurality of second nozzles in the second distribution tube housing. In some embodiments, the evaporated first material and the evaporated second material are respectively guided through the one or more first nozzles of the first distribution tube and the one of the second distribution tube in a distance of less than 30 mm. Or multiple second nozzles. A distance of less than 30 mm allows accurate deposition of different evaporated materials on the substrate, such as manufacturing OLED displays or the like.

According to several embodiments that can be combined with other embodiments described herein, the evaporated first material is released from the one or more first nozzles of the first distribution tube in the first distribution direction, the first distribution direction It is parallel to the second distribution direction of the one or more second nozzles of the second distribution pipe, or a deviation of up to 5 ° from the parallel arrangement. The parallel arrangement of the distribution directions can provide defined deposition and mixing characteristics of different evaporated materials from different material sources.

In still other embodiments that can be combined with other embodiments described herein, the one or more nozzles of at least one of the first distribution pipe and the second distribution pipe include A material that is chemically inert to evaporated organic materials. The nozzle includes an inert material (for example, a coated inert material as a nozzle opening), and the evaporated material passing through the nozzle is not affected by the nozzle material and is maintained in a desired state. For example, the composition of the evaporated material remains the same before and after the nozzle. In one example, the direction, flow rate, and pressure may still be affected by the nozzle.

In some embodiments, the method includes heating the distribution tube to a temperature above the evaporation temperature of the material to be deposited on the substrate. The heating of the distribution tube can be performed by a heating device. In one example, the effectiveness of the heating device can be supported by the heating shield. For example, the above description is illustrated in Figures 8a to 8c.

According to some embodiments, the use of a material deposition arrangement as described herein and / or the use of a distribution tube as described herein is provided.

In summary, although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention pertains can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the scope of the attached patent application.

Claims (25)

A material deposition configuration (100) is used to deposit an evaporated material on a substrate (121) in a vacuum chamber (110). The material deposition configuration includes: a first material source (100a), including: a first A material evaporator (102a), configured to evaporate a first material to be deposited on the substrate (121); a first distribution pipe (106a), including a first distribution pipe housing (116), wherein The first distribution pipe is in fluid communication with the first material evaporator; and a plurality of first nozzles (712) are located in the first distribution pipe housing (116), wherein one or more of the first nozzles The nozzle includes an opening length (714) and an opening size (716), wherein a length to size ratio of the one or more nozzles of the first nozzles is equal to or greater than 2: 1; and a second material The source (100b) includes: a second material evaporator (102b) assembled for evaporating a second material to be deposited on the substrate; a second distribution tube (106b) including a second distribution tube shell Body, wherein the second distribution pipe is in fluid communication with the second material evaporator; and a plurality of second nozzles (712) are located in the first Two distribution tube housings; a distance (200) between one of the first nozzles of the first nozzles and one of the second nozzles of the second nozzle is equal to or less than 30 mm; and wherein the first The width of the outlet side of the distribution pipe is 30% or less of the maximum dimension of the cross section of the first distribution pipe. The material deposition arrangement according to item 1 of the scope of the patent application, wherein the distance (200) between the first nozzle of the first nozzles and the second nozzle of the second nozzles is a horizontal distance. The material deposition arrangement according to any one of the foregoing claims 1 and 2, wherein a distance between the first distribution pipe (106a) and the second distribution pipe (106b) is equal to or less than 30mm. The material deposition arrangement according to any one of claims 1 and 2 of the scope of patent application, wherein the distance between the first nozzles of the first nozzles and the second nozzle of the second nozzles (200) It is a distance between a first center point of the first nozzle and a second center point of the second nozzle. The material deposition arrangement according to any one of claims 1 and 2, wherein the one or more nozzles (712) of the first nozzles of the first distribution pipe (106a) are assembled to provide a The first distribution direction (210), and wherein the one or more nozzles (712) of the second nozzles of the second distribution pipe (106b) are assembled to provide a second distribution direction (211), and wherein the The first distribution direction (210) and the second distribution direction (211) are arranged parallel to each other, or are arranged in parallel with a deviation of up to 5 °. A material deposition configuration (100) is used to deposit an evaporated material on a substrate (121) in a vacuum chamber (110). The material deposition configuration includes: a first material source (100a), including: a first A material evaporator (102a), configured to evaporate a first material to be deposited on the substrate (121); a first distribution pipe (106a), including a first distribution pipe housing (116), wherein The first distribution pipe (106a) is in fluid communication with the first material evaporator (102a); and a plurality of first nozzles (712) are located in the first distribution pipe housing (116), where the first One or more nozzles include an opening length (714) and an opening size (716) and are assembled to provide a first distribution direction (210), wherein the one or more nozzles of the first nozzles The length-to-size ratio is equal to or greater than 2: 1; and a second material source (100b) includes: a second material evaporator (102b), which is assembled for evaporation to be deposited on the substrate (121) A second material; a second distribution pipe (106b), including a second distribution pipe housing (116), wherein the second distribution pipe (106b) is in fluid communication The second material evaporator (102b); and a plurality of second nozzles (712) located in the second distribution tube housing (116), wherein one or more of the second nozzles are assembled to provide a A second distribution direction (211); wherein the first distribution direction (210) of the one or more nozzles (712) of the first nozzles and the one or more nozzles (712) of the second nozzles The second distribution direction (211) is arranged parallel to each other, or is arranged from a parallel arrangement with a deviation of up to 5 °; and wherein the width of the exit side of the first distribution pipe is 30% of the maximum dimension of the section of the first distribution pipe Or less. The material deposition arrangement according to item 6 of the scope of the patent application, wherein the first distribution direction (210) corresponds to the The length direction, and wherein the second distribution direction (211) corresponds to the length direction of the one or more nozzles (712) of the second nozzles of the second distribution pipe (106b). The material deposition arrangement according to item 6 of the scope of the patent application, wherein the first distribution direction (210) corresponds to the one or more nozzles (712) from the first nozzles of the first distribution pipe (106a). An average distribution direction of the plume of the evaporated material released, and wherein the second distribution direction (211) corresponds to the one or the second nozzles from the second distribution pipe (106b) An average distribution direction of the plumes of the evaporated material released by the plurality of nozzles (712). The material deposition arrangement according to any one of claims 6 to 8, wherein a distance between a first nozzle of one of the first nozzles and a second nozzle of one of the second nozzles is equal to Or less than 30mm. The material deposition arrangement according to any one of claims 6 to 8, in which the one or more of the nozzles of at least one of the first distribution pipe (106a) and the second distribution pipe (106b) The plurality of nozzles (712) includes a material that is chemically inert to an evaporated organic material. A distribution tube (106a; 106b; 106c) for depositing evaporated material on a substrate (121) in a vacuum chamber (110). The distribution tube includes: a distribution tube housing (116); and A nozzle (712) located in the distribution pipe housing (116), wherein the nozzle (712) includes an opening (713), the opening has an opening length (714) and an opening size (716); The nozzle has a length-to-size ratio equal to or greater than 2: 1; and the nozzle (712) includes a material that is chemically inert to an evaporated organic material. The distribution tube according to item 11 of the scope of the patent application, wherein the material which is chemically inert to the evaporated organic material is chemically inert at a temperature of up to 650 ° C. The distribution pipe according to item 11 of the scope of the patent application, wherein the inside of the opening (713) of the nozzle (712) is coated with the material, and the material is chemically inert to the evaporated organic material. The distribution pipe according to any one of claims 11 to 13, wherein the material which is chemically inert to the evaporated organic material is selected from the group consisting of stainless steel, quartz glass, titanium, tantalum, niobium, and diamond-like coatings. A group of layers (DLCs). A material deposition configuration (100) is used to deposit an evaporated material on a substrate (121) in a vacuum chamber (110). The material deposition configuration includes: a first material source (100a), including: a first A material evaporator (102a) assembled for evaporating a first material to be deposited on the substrate (121); and a patent application for a first distribution tube (106a) configured for the material deposition (100) The distribution pipe (106a, 106b, 106c) according to any one of items 11 to 14, wherein the first distribution pipe (106a) is in fluid communication with the first material evaporator (102a); and a second The material source (100b) includes: a second material evaporator (102b), configured to evaporate a second material to be deposited on the substrate (121); and a second distribution pipe (106b), including a A distribution pipe housing (116), wherein the second distribution pipe (106b) is in fluid communication with the second material evaporator (102b); and a plurality of second nozzles (712) located in the second distribution pipe housing ( 116); wherein a distance between the nozzle of the first distribution pipe (106a) and one of the second nozzles of the second distribution pipe (106b) (200) is equal to or less than 30mm; or wherein the nozzle (712) of the first distribution pipe (106a) is assembled to provide a first distribution direction (210) and the second distribution pipe (106b) of the One of the second nozzles (712) is assembled to provide a second distribution direction (211), wherein the first distribution direction (210) and the second distribution direction (211) are arranged parallel to each other or from The parallel arrangement has a deviation of up to 5 °. The material deposition configuration according to any one of the claims 1, 2, 6, 7, 8 and 15, wherein the length-to-size ratio is dimensionless. According to the material deposition configuration described in any one of claims 1, 2, 6, 7, 8, and 15, wherein the opening size (716) of the nozzle (712) is determined by the cross-section of the opening Definition of minimum size. The material deposition configuration according to any one of claims 1, 2, 6, 7, 8 and 15, wherein the first distribution tube (106a) and the second material source (100a) of the first material source (100a) At least one of the second distribution pipes (106b) of the material source (100b) is a distribution pipe for an evaporated organic material. The material deposition arrangement according to any one of the claims 1, 2, 6, 7, 8 and 15, wherein the nozzle (712) having the length-to-size ratio of at least 2: 1 forms a A cos ⁶ -shaped steam plume that evaporates organic material. A vacuum deposition chamber (110) includes: a material deposition configuration (100) according to any one of the aforementioned patent application scopes; and a substrate support (126) for supporting the substrate (121) during deposition; The distance between at least one of the distribution pipes (106a, 106b, 106c) of the material deposition arrangement (100) and the substrate support (126) is less than 250 mm. The vacuum deposition chamber according to item 20 of the patent application scope further includes a pixel mask (132) located between the substrate support (126) and the material deposition configuration (100). The vacuum deposition chamber according to item 21 of the patent application scope, wherein the pixel mask (132) includes a plurality of pixel openings, and the pixel openings have a size of 50 μm x 50 μm or less. The vacuum deposition chamber according to any one of claims 20 to 22, wherein the material deposition configuration (100) is movable in the vacuum deposition chamber (110). A method for depositing an evaporated material on a substrate (121) in a vacuum deposition chamber (110). The vacuum deposition chamber has a chamber space, and the method includes: using the space disposed in the chamber space. One of the first material evaporators (102a) evaporates a first material; providing the evaporated first material to a first distribution tube (106a), the first distribution tube including a first distribution tube housing (116) ), Wherein the first distribution pipe (106a) is in fluid communication with the first material evaporator (102a), and providing the evaporated first material to the first distribution pipe is included in the first distribution pipe (106a) Provide a pressure of about 10 ^-2 -10 ^-1 mbar; direct the evaporated first material through one or more nozzles of the plurality of first nozzles (712) in the first distribution tube housing (116) Wherein the one or more nozzles of the first nozzles include an opening length (714) and an opening size (716), wherein the evaporated first material is guided through the one or more nozzles (712) Including directing the evaporated first material through the one or more nozzles having a length-to-size ratio equal to or greater than 2: 1; And the orientation space in the chamber of the substrate (121) to release the vaporized material to the chamber a first volume, wherein one of the chamber space to provide a pressure of about ^10-5 mbar to ^10-7. The method according to item 24 of the scope of patent application, further comprising: using a second material evaporator (102b) in the chamber space to evaporate a second material; providing the evaporated second material to a second material A distribution pipe (106b), the second distribution pipe includes a second distribution pipe housing (116), wherein the second distribution pipe (106b) is in fluid communication with the second material evaporator (102b), wherein the Evaporating the second material to the second distribution pipe includes providing a pressure of about 10 ^-2 -10 ^-1 mbar in the second distribution pipe; and directing the evaporated second material through the second distribution pipe housing (116) One or more nozzles of the plurality of second nozzles (712); wherein the evaporated first material and the evaporated second material are respectively guided through the first at a distance of less than 30 mm The one or more first nozzles of the distribution pipe (106a) and the one or more second nozzles of the second distribution pipe (106b); and / or wherein the evaporated first material is from a first distribution The one or more first nozzles of the first distribution pipe (106a) in the direction (210) are released, and the first distribution direction is parallel to the One of the one or more second nozzles of the two distribution pipes (106b), the second distribution direction (211), or a deviation of up to 5 ° from a parallel arrangement; and / or wherein the first distribution pipe (106a) and the second The one or more nozzles of at least one of the distribution tubes (106b) include a material that is chemically inert to the evaporated material.