KR20170083592A - Material deposition arrangement and material distribution arrangement for vacuum deposition - Google Patents

Abstract

A material deposition arrangement 100 for depositing vaporized materials on a substrate 121 in a vacuum chamber 110 is described. The material deposition arrangement includes two material deposition sources 100a, 100b having distribution pipes 106a, 106b and one or more nozzles 712, respectively. In addition, a vacuum deposition chamber including a material deposition arrangement, and a method for depositing a vaporized material on a substrate in a vacuum deposition chamber are described.

Description

{MATERIAL DEPOSITION ARRANGEMENT AND MATERIAL DISTRIBUTION ARRANGEMENT FOR VACUUM DEPOSITION FOR VACUUM VAPOR DEPOSITION [0001]

[0001] Embodiments of the present invention relate to a material deposition arrangement, a distribution pipe for material deposition arrangement, a deposition apparatus having a material deposition arrangement, and a method for depositing material on a substrate will be. Embodiments of the present invention are particularly directed to material deposition arrangements for vacuum deposition chambers, vacuum deposition apparatuses with material deposition arrangements, and methods for depositing material on substrates in vacuum deposition chambers.

Organic vaporizers are tools for the production of organic light-emitting diodes (OLEDs). OLEDs are special types of light emitting diodes in which the light emitting layer comprises a thin film of certain organic compounds. Organic light-emitting diodes (OLEDs) are used in the manufacture of television screens, computer monitors, mobile phones, other hand-held devices, etc. to display information. OLEDs can also be used for general spatial lighting. Since OLED pixels emit light directly and do not use a backlight, the range of colors, brightness, and viewing angles available in OLED displays is greater than the available colors, brightness, and viewing angle of conventional LCD displays. Thus, the energy consumption of OLED displays is much less than the energy consumption of conventional LCD displays. In addition, the fact that an OLED can be fabricated on flexible substrates results in additional applications. Typical OLED displays include layers of organic material positioned between two electrodes that are all deposited on a substrate in a manner that, for example, forms a matrix display panel with individually energizable pixels can do. The OLED is generally disposed between two glass panels, and the edges of the glass panels are sealed to encapsulate the OLED therein.

[0003] There are many challenges encountered in the manufacture of such display devices. OLED displays or OLED lighting applications include a stack of several organic materials that evaporate, for example, in a vacuum state. The organic materials are deposited in a subsequent manner through shadow masks. For the fabrication of OLED stacks with high efficiency, two or more materials, such as co-deposition or co-evaporation (co) deposition of host and dopant, resulting in mixed / -evaporation is preferred. In addition, it should be considered that there are several process conditions for the evaporation of highly sensitive organic materials.

[0004] In order to deposit a material on a substrate, the material is heated until evaporated. Also, for example, to keep the evaporated material at a controlled temperature or to prevent condensation of evaporated material in the pipes, the pipes that guide the material to the substrate may be heated. When the material is evaporated, the material is guided to the substrate, for example, by passing through dispensing pipes with outlets or nozzles for the evaporated material. Over the past several years, for example, the precision of the deposition process has been increased to provide increasingly smaller pixel sizes. However, the shadowing effects of the mask, the diffusion of the evaporated material, etc., make it difficult to further increase the precision and predictability of the evaporation process.

SUMMARY OF THE INVENTION [0005] In view of the foregoing, it is an object of embodiments described herein to provide a method and apparatus for depositing material on a substrate, such as a material deposition arrangement, a vacuum deposition chamber, a distribution pipe, and a substrate that overcomes at least some of the problems in the art. And to provide a method for deposition.

[0006] In view of the foregoing, there is provided, in accordance with the independent claims, a material deposition arrangement (s), a deposition chamber, a distribution pipe, and a method for depositing material on a substrate. Additional aspects, advantages, and features of the present invention are apparent from the dependent claims, the description, and the accompanying drawings.

[0007] According to one embodiment, there is provided a material deposition arrangement for depositing evaporated materials, particularly two or more evaporated materials, on a substrate in a vacuum chamber. The material deposition arrangement includes a first material source, wherein the first material source is a first material evaporator configured to evaporate a first material to be deposited on the substrate, in particular a first one of two or more materials, ; A first distribution pipe comprising a first distribution pipe housing, a first distribution pipe in fluid communication with the first material evaporator; And a plurality of first nozzles in a first distribution pipe housing, wherein one or more of the plurality of first nozzles includes an opening length and an opening size, wherein the plurality of first The length to size ratio of one or more of the nozzles is equal to or greater than 2: 1. The material deposition arrangement further comprises a second material source and the second material source comprises a second material to be deposited on the substrate and in particular a second material configured to vaporize the second material of the two or more materials evaporator; A second distribution pipe comprising a second distribution pipe housing, a second distribution pipe in fluid communication with the second material evaporator; And a plurality of second nozzles in the second distribution pipe housing. The distance between the first one of the plurality of first nozzles and the second one of the plurality of second nozzles is equal to or less than 30 mm.

[0008] According to another embodiment, there is provided a material deposition arrangement for depositing evaporated materials, particularly two or more evaporated materials, on a substrate in a vacuum chamber. The material deposition arrangement includes a first material source, wherein the first material source is a first material evaporator configured to evaporate a first material to be deposited on the substrate, in particular a first one of two or more materials, ; A first distribution pipe comprising a first distribution pipe housing, a first distribution pipe in fluid communication with the first material evaporator; And a plurality of first nozzles in a first distribution pipe housing, wherein one or more of the plurality of first nozzles includes an opening length and an opening size, Wherein the length to size ratio of one or more of the plurality of first nozzles is equal to or greater than 2: 1. The material deposition arrangement further comprises a second material source and the second material source comprises a second material to be deposited on the substrate and in particular a second material configured to vaporize the second material of the two or more materials evaporator; A second distribution pipe comprising a second distribution pipe housing, a second distribution pipe in fluid communication with the second material evaporator; And a plurality of second nozzles in the second distribution pipe housing, wherein one or more of the second nozzles are configured to provide a second dispense direction. The first distribution direction of one or more of the plurality of first nozzles and the second distribution direction of one or more of the plurality of second nozzles may be arranged parallel to each other, With a deviation of up to 5 [deg.

[0009] According to a further embodiment, there is provided a dispensing pipe for depositing a material to be vaporized on a substrate in a vacuum chamber. The distribution pipe comprises a distribution pipe housing; And a nozzle in the distribution pipe housing, wherein the nozzle includes an opening length and an opening size. The length to size ratio of the nozzles is equal to or greater than 2: 1, and the nozzles include materials that are chemically inert with respect to the organic material to be evaporated.

[0010] According to a further embodiment, there is provided a material deposition arrangement for depositing evaporated materials, in particular two or more evaporated materials, on a substrate in a vacuum chamber. The material deposition arrangement includes a first material source, wherein the first material source is a first material evaporator configured to evaporate a first material to be deposited on the substrate, in particular a first one of two or more materials, ; A distribution pipe in accordance with embodiments described herein that is a first distribution pipe of material deposition arrangement wherein the distribution pipe is in fluid communication with the first material evaporator. The material deposition arrangement further comprises a second material source and the second material source comprises a second material to be deposited on the substrate and in particular a second material configured to vaporize the second material of the two or more materials evaporator; A second distribution pipe comprising a distribution pipe housing, a second distribution pipe in fluid communication with the second material evaporator; And a plurality of second nozzles in the second distribution pipe housing. The distance between the nozzle of the first distribution pipe and the second one of the plurality of second nozzles of the second distribution pipe is equal to or less than 30 mm. Additionally or alternatively, the nozzles of the first distribution pipe are configured to provide a first dispensing direction, and the second one of the plurality of second nozzles of the second dispensing pipe is configured to provide a second dispensing direction , Wherein the first dispensing direction and the second dispensing direction are arranged parallel to each other or with a deviation of up to 5 [deg.] From a parallel arrangement.

[0011] According to a further embodiment, a vacuum deposition chamber is provided. The vacuum deposition chamber includes a material deposition arrangement according to the embodiments described herein. The vacuum deposition chamber further includes a substrate support for supporting the substrate during deposition. The distance between at least one of the distribution pipes of the material deposition arrangement and the substrate support is less than 250 mm.

[0012] According to a further embodiment, a method is provided for depositing a vaporized material on a substrate in a vacuum deposition chamber having a chamber volume. The method includes evaporating the first material by a first material evaporator arranged in the chamber volume. The method further includes providing a first material vaporized to a first distribution pipe comprising a first distribution pipe housing wherein the first distribution pipe is in fluid communication with the first material vaporizer. Providing the first material vaporized to the first distribution pipe typically includes providing a pressure of about 10 ^-2 to 10 ^-1 mbar in the first distribution pipe. The method further includes guiding the evaporated material through one or more of the plurality of first nozzles in the first distribution pipe housing. One or more of the plurality of first nozzles includes an aperture length and an aperture size, wherein guiding the vaporized material through one or more nozzles is equal to or less than 2: 1 Lt; RTI ID = 0.0 > length / size < / RTI > The method further includes discharging the evaporated material to a chamber volume toward the substrate at the chamber volume, wherein the chamber volume provides a pressure of about 10 ^-5 to 10 ^-7 mbar.

[0013] Embodiments also relate to apparatus for performing the disclosed methods, and include apparatus portions for performing each of the described method steps. The method steps may be performed by hardware components, a computer programmed by appropriate software, any combination of the two, or any other method. In addition, embodiments in accordance with the present invention also relate to methods for operating the described apparatus. This includes method steps for performing all the respective functions of the device.

[0014] In the manner in which the above-recited features of the present invention can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the present invention and are described below.
Figures 1A-1F show a schematic diagram of a material deposition arrangement and partial more detailed drawings of a material deposition arrangement, in accordance with the embodiments described herein.
Figures 2A-2C show schematic diagrams of distribution pipes of a material deposition arrangement according to embodiments described herein.
Figure 3a shows a view of the distribution of material in the dispensing pipe and nozzle, in accordance with the embodiments described herein.
Figure 3b shows a view of the distribution of the material in the distribution pipe of the known system.
Figure 3c shows a comparative diagram of the distribution of materials in a distribution pipe and a known system in accordance with the embodiments described herein.
Figure 4A illustrates a material deposition arrangement according to embodiments described herein.
Figure 4b shows a deposition system as is known.
Figures 5A and 5B show schematic side and plan views of material deposition arrangements in accordance with the embodiments described herein.
Figures 6A and 6B show a schematic side view of a material deposition arrangement according to embodiments described herein and a more detailed view of the distribution pipes and nozzles of a material deposition arrangement according to the embodiments described herein.
7A-7D show schematic views of material deposition arrangements and nozzles used in distribution pipes, in accordance with the embodiments described herein.
Figures 8A-8C illustrate a material deposition arrangement and a distribution pipe, according to embodiments described herein.
Figures 9A and 9B illustrate a dispensing pipe according to embodiments described herein.
Figure 10 shows a vacuum deposition chamber in accordance with the embodiments described herein.
11 shows a flow diagram of a method for depositing material on a substrate, according to embodiments described herein.

[0015] Now, various embodiments will be referenced in detail, and one or more examples of such various embodiments are illustrated in the figures. In the following description of the drawings, like reference numerals refer to like components. In general, only differences for the individual embodiments are described. Each example is provided by way of illustration and is not intended as a limitation. In addition, features illustrated or described as part of one embodiment may also be used in conjunction with other embodiments or with other embodiments to produce further embodiments. The description is intended to cover such modifications and variations.

As used herein, the term "fluid communication" is understood to mean that two elements in fluid communication can exchange fluids through a connection that allows the fluid to flow between the two elements . In one example, the elements in fluid communication can include a hollow structure, and the fluid can flow through such hollow structure. According to some embodiments, at least one of the elements in fluid communication may be an element such as a pipe.

[0017] In addition, in the following description, a material source can be understood as a source for providing a material to be deposited on a substrate. In particular, the material source may be configured to provide a material to be deposited on the substrate in a vacuum chamber, such as a vacuum deposition chamber or apparatus. According to some embodiments, a material source may be configured to evaporate the material to be deposited, thereby providing a material to be deposited on the substrate. For example, the source of material may comprise an evaporator or crucible, which evaporates the material to be deposited on the substrate and, in particular, evaporates the evaporated material into the distribution pipe of the material source or toward the substrate Lt; / RTI > In some embodiments, the evaporator may be in fluid communication with the dispensing pipe, e.g., to dispense evaporated material.

[0018] According to some embodiments described herein, a distribution pipe can be understood as a pipe for guiding and distributing the evaporated material. In particular, the distribution pipe can guide the evaporated material from the evaporator to the outlet or openings in the distribution pipe. The linear distribution pipe can be understood as a first, in particular a longitudinal, directionally extending pipe. In some embodiments, the linear distribution pipe includes a pipe having the shape of a cylinder, wherein the cylinder may have a round bottom shape or any other suitable bottom shape.

[0019] A nozzle as referred to herein may be used to control fluid properties, such as, for example, the flow rate, velocity, shape, and / or pressure of fluid emerging from the nozzle, Device. ≪ / RTI > According to some embodiments described herein, the nozzle may be a device for guiding or directing a vapor, such as vapor of vaporized material to be deposited on a substrate. The nozzle may have an inlet for receiving the fluid, an opening (e.g., bore or passage) for guiding the fluid through the nozzle, and an outlet for discharging the fluid. Typically, the openings or passageways of a nozzle may include a geometric shape defined to achieve a desired direction or characteristic of the fluid flowing through the nozzle. According to some embodiments, the nozzle may be part of a distribution pipe, or it may be connected to a distribution pipe providing the evaporated material and may receive the evaporated material from the distribution pipe roll.

[0020] According to embodiments described herein, material deposition arrangements are provided for depositing evaporated materials on a substrate in a vacuum chamber. According to some embodiments, the material deposition arrangement may be configured to deposit two or more evaporated materials on a substrate in a vacuum chamber. The material deposition arrangement includes a first material source comprising a first material evaporator configured to evaporate a first material to be deposited on a substrate. According to some embodiments, the first material may be the first material from two or more materials to be deposited on the substrate. Wherein the first material source further comprises a first distribution pipe comprising a first distribution pipe housing wherein the first distribution pipe is in fluid communication with a first material evaporator wherein the material source is a first distribution pipe housing, Further comprising a plurality of first nozzles. Typically, one or more of the plurality of first nozzles or nozzles includes an opening length and an opening size, wherein the length to size ratio of one or more of the plurality of first nozzles is 2: 1 < / RTI > The material deposition apparatus includes a second material source including a second material evaporator configured to evaporate a second material to be deposited on the substrate. According to some embodiments, the second material is a second material of two or more of the materials to be deposited on the substrate. The second source of material further comprises a second distribution pipe comprising a second distribution pipe housing wherein the second distribution pipe is in fluid communication with the second material evaporator. The second material source further comprises a plurality of second nozzles in the second distribution pipe housing. According to embodiments described herein, the distance between the first of the plurality of first nozzles and the second of the plurality of second nozzles is equal to or less than 30 mm. According to some embodiments, the first material and the second material may be the same material, or alternatively, they may be different materials.

[0021] FIG. 1a illustrates a side view of a material deposition arrangement 100 in accordance with embodiments described herein. An embodiment of the material deposition arrangement as shown in FIG. 1A includes a first material source having a first material evaporator 102a, a second material source having a second material evaporator 102b, and a third material evaporator 102c. Lt; RTI ID = 0.0 > a < / RTI > In one embodiment, each of the material evaporators 102a, 102b, and 102c may provide different materials. In other embodiments, each of the material evaporators may provide the same material, or some of the material evaporators may provide the same material, while other portions of the material evaporators provide different materials. According to some embodiments, the material evaporators 102a, 102b, and 102c may be crucibles configured to evaporate the material to be deposited on the substrate. The material evaporators 102a, 102b, and 102c are in fluid communication with the distribution pipes 106a, 106b, and 106c, respectively. The material evaporated by one of the material evaporators can be discharged from the material evaporator and flow into each of the distribution pipes.

[0022] As shown in FIG. 1A, each of the distribution pipes 106a, 106b, and 106c includes a distribution pipe housing that includes a plurality of nozzles 712. Through the plurality of nozzles, the evaporated material is discharged and is guided to a substrate (not shown) to be coated. According to some embodiments, the nozzles 712 may be an integral part of the distribution pipes, such as openings formed in the distribution pipe housing, or may be formed to meet defined processes, for example, By means of a nozzle connected to the distribution pipe housing for guiding it towards the discharge pipe housing. In one example, the nozzles may be connected to the dispensing pipe by a screwing, plugging, or shrinking process. In one embodiment, the nozzles may be exchangeably connected to a distribution pipe of the material deposition arrangement.

[0023] FIG. 1B shows an enlarged view of section A of the third distribution pipe 106c shown in FIG. 1A. The partial view shown in FIG. 1B shows the dispensing pipe 106c and the nozzle 712 of one of the plurality of nozzles of the dispensing pipe 106c. The nozzle 712 provides an opening 713 or passageway through which the vaporized material can pass. As shown in FIG. 1B, the opening 713 of the nozzle 712 provides an opening length 714. According to some embodiments, the aperture length 714 can be measured along the longitudinal or longitudinal axis of the nozzle, especially in a direction corresponding to the average fluid direction exiting the nozzle. In one embodiment, the nozzle opening length 714 may be substantially perpendicular to the longitudinal (or linear) direction of the dispensing pipe.

[0024] The term "substantially vertical" can be understood to include deviations as high as 15 ° from a strictly vertical arrangement. According to some embodiments, additional terms indicated as "substantially" in the following description may include deviations of up to 15 [deg.] From the indicated angular array, or deviations of about 15% of one dimension have.

[0025] FIG. 1C shows a material deposition arrangement 100 in a front view, which may correspond to the material deposition arrangement shown in FIG. 1A but is turned by about 90.degree. The material evaporators 102a, 102b, and 102c are in fluid communication with the distribution pipes 106a, 106b, and 106c, respectively. The openings of the nozzles 712 are seen in the front view. The nozzles 712 of the different distribution pipes 106a, 106b, and 106c provide a distance 200 to each other. According to the embodiments described herein, the distance between the first nozzles can typically be less than 50 mm, more typically less than 30 mm, and even more typically less than 25 mm.

[0026] According to some embodiments, the distance between the nozzles 712 of the different distribution pipes 106a, 106b, and 106c is measured from the center point of the opening of each nozzle. In one example, the center point of the opening of the nozzle may be defined as being the geometric center point of the opening. In the case of an aperture case, the center point of the circle is a point that is equidistant from the points on the edge. For example, in the case where the openings of the nozzles have a symmetrical shape, the center point of the aperture can be described as a point that is maintained unchanged by symmetry. For example, the center point of a square, rectangle, rhombus, or parallelogram is where the diagonals cross, and the center point is a fixed point of rotation symmetries. Similarly, the center of the ellipse is where the axes intersect. According to some embodiments, the center point can be understood as being the centroid of the feature.

[0027] In some embodiments, the distance 200 between the nozzles of the distribution pipes may be a substantially horizontal distance. For example, the distribution pipes 106a, 106b, and 106c may extend in a substantially vertical direction. The nozzles may have a direction of evaporation, i. E., A direction in which the nozzles emit the evaporated material, which direction is substantially horizontal. According to some embodiments, a substantially horizontal distance between the nozzles of different distribution pipes can be understood as including a deviation of about 15 degrees from a strictly horizontal arrangement.

[0028] According to some embodiments, the distance between the nozzles can be described as being, for example, the distance between the different distribution pipes, measured from the longitudinal axis of the distribution pipes. In one embodiment, the distribution pipes have a distance 200 to each other.

[0029] Figures 1d-1f illustrate embodiments of a partial view (B) as shown in the front view of Figure Ic. 1D-1F, the aperture size 716 of the nozzle 712 is shown. The opening size of the nozzle may depend on the shape of the nozzle. In one embodiment, the aperture size is understood to be one dimension of the aperture, not the aperture length. According to some embodiments, the opening size may be the minimum dimension of the cross-section of the opening, particularly the cross-section at the outlet of the nozzle (where the evaporation material exits the nozzle).

[0030] FIG. 1d shows an example of a nozzle opening and opening size 716, wherein the opening size corresponds to the cross section, particularly the opening diameter. 1E shows an example in which the nozzle opening has an elliptical shape and the size of the opening is defined by the minimum dimension of the cross section of the opening. 1F shows an example in which the nozzle opening has the shape of an elongated circle, wherein the size of the opening is defined by the smallest dimension of the cross section of the opening. Those skilled in the art will appreciate that the illustrated embodiments of FIGS. 1A-1F are merely examples and that the illustrated examples of the size, shape, and length of the nozzle openings, or illustrated examples of arrangements of material sources and distribution pipes Quot; and < / RTI >

[0031] According to the embodiments described herein, each nozzle of the first distribution pipe may have a ratio of opening length to size of 2: 1 or more, or only a part of the nozzles of the first distribution pipe Length-to-size ratio. According to some embodiments, the second and / or third distribution pipes of the material deposition arrangement as described herein may also include one or more nozzles having a ratio of opening length to size of 2: 1 or more .

[0032] According to some embodiments that may be combined with other embodiments described herein, the dispensing pipe may have a substantially triangular cross-section. 2A shows an example of a cross section of a distribution pipe 106. Fig. The distribution pipe 106 has walls 322, 326, and 324 surrounding the inner hollow space 710. The wall 322 is provided at the outlet side of the material source, where the nozzles 712 are provided. The cross-section of the dispensing pipe can be described as being essentially triangular, i.e. the main section of the dispensing pipe corresponds to a part of the triangle and / or the cross-section of the dispensing pipe has rounded corners and / or cut- off < / RTI > As shown in Fig. 2A, for example, the corner of the triangle at the discharge side is cut off.

[0033] The dimension of the wall 322 at the outlet side of the distribution pipe, for example, the cross section shown in FIG. 2A, is indicated by the arrow 352. In addition, other dimensions of the cross-section of the distribution pipe 106 are indicated by arrows 354 and 355. [ According to the embodiments described herein, the width of the outlet side of the distribution pipe is 30% or less of the largest dimension of the cross section, e.g., 30% of the larger of the dimensions indicated by arrows 354 and 355, to be. Considering the shape and dimensions of the dispensing pipe, the nozzles 712 of the neighboring dispensing pipes 106 may be provided with a smaller distance. The smaller distances improve the mixing of the organic materials evaporated immediately next to each other.

[0034] FIG. 2b shows an embodiment in which two distribution pipes are provided next to each other. Thus, a material deposition arrangement having two distribution pipes as shown in FIG. 2B can evaporate two organic materials next to each other. Such a material deposition arrangement may also be referred to as a material deposition array. As shown in FIG. 2B, the shape of the cross-section of the distribution pipes 106 allows the nozzles of neighboring distribution pipes to be disposed in close proximity to each other. According to some embodiments that may be combined with other embodiments described herein, the first nozzle of the first distribution pipe and the second nozzle of the second distribution pipe may have a diameter of 30 mm or less, such as 5 mm to 25 mm . ≪ / RTI > More specifically, the distance of the first outlet or nozzle to the second outlet or nozzle may be 10 mm or less.

[0035] According to some embodiments described herein, the distance between the first nozzle of the first distribution pipe and the second nozzle of the second distribution pipe may be measured as the minimum distance between the longitudinal axes of the respective nozzles . In one example, the minimum distance between the longitudinal axes of each of the nozzles is a measure of the outlet of the nozzles (i.e., the location where the evaporated material exits the nozzle). Figure 2c shows a partial view (C) of the arrangement shown in Figure 2b. 2C shows an example of two nozzles 106a and 106b, wherein the distance 200 between the nozzles, at the outlet of each nozzle, Is measured between the longitudinal axis 201 of the first nozzle of the second distribution pipe 106a and the longitudinal axis 202 of the second nozzle of the second distribution pipe 106b. According to some embodiments, the longitudinal axis of the nozzle as referenced herein extends along the longitudinal direction of the nozzle.

[0036] According to the embodiments described herein, material deposition arrangements as described herein can be used in high precision processes such as OLED production processes. Figures 3A and 4A illustrate the effects of material deposition arrangement according to the embodiments described herein. Figures 3b and 4b illustrate the effects of a comparative example of a known material deposition arrangement. In Figure 3a, test data for the distribution of evaporated material as emitted from a material deposition arrangement in accordance with the embodiments described herein is shown. Curve 800 shows experimental results of evaporated material ejected from a nozzle having a length to size ratio of 2: 1 or greater. The example of FIG. 3A shows that the distribution of the evaporated material follows a roughly cos ⁶ shape. A comparison with a known material deposition arrangement as shown in FIG. 3B shows that the distribution of conventional material deposition arrangements corresponds to a cos ¹ shape as shown by curve 801. The difference between the curve 800 generated by the material deposition arrangement and the curve 801 of the known systems in accordance with the embodiments described herein is substantially the difference between the width of the plume of vaporized material and the evaporation Lt; / RTI > For example, in the case where masks are used to deposit material on a substrate in, for example, an OLED production system, the mask may have a cross-sectional dimension (e.g., a minimum dimension of the cross-section) of about 30 μm or less, Such as a pixel opening having a size of about 50 [mu] m x 50 [mu] m, or even less. In one example, the pixel mask may have a thickness of about 40 [mu] m. Taking into account the thickness of the mask and the size of the pixel apertures, a shadowing effect may occur where the walls of the pixel apertures in the mask shadow the pixel aperture. Material deposition arrangement and / or distribution pipes and / or nozzles, in accordance with the embodiments described herein, may assist in reducing the shadowing effect.

The high directionality that can be achieved by using evaporation by material deposition arrangement according to the embodiments described herein is that the more material of the material to be vaporized is deposited on the substrate (and, for example, ), Thereby improving the utilization of the evaporated material.

[0038] FIG. 3C shows the distribution of evaporated material in the pixels of the mask and shows three different lines. All three lines illustrate the distribution of evaporated material at a defined distance between the nozzle and the substrate. In one example, the distance between the nozzle outlet (where vaporized material exits the nozzle) and the substrate or substrate support may be 250 mm or less, such as about 200 mm, or about 150 mm. The first line 804 shows the distribution of evaporated material in the pixel opening of the mask, as provided by known material deposition arrangements. The distribution of the first line 804 corresponds to a distribution such as cos ¹ . In the case of a material deposition arrangement or distribution pipe, according to embodiments described herein, the distribution of vaporized material may correspond to a distribution such as cos ⁶ as shown by second line 805. In particular, the slope of the second line 805 is steeper than the slope of the first line 804. From FIG. 3c one skilled in the art can see that the edges of the pixel opening of the mask are better filled by the cos ⁶ distribution than by the cos ¹ distribution. The third line 806 shows the results of the experimental tests using the material deposition arrangement or distribution pipe, according to the embodiments described herein. The third line 806 follows a second line 805 with a distribution such as cos ⁶ of the evaporated material. In the case of using a material deposition arrangement or distribution pipe, according to the embodiments described herein, the shadowing effect can be reduced.

[0039] FIG. 4A illustrates a material deposition arrangement according to embodiments described herein, which illustratively includes three material deposition arrangements 100a, 100b, and 100c. The material deposition arrangement may be a material deposition arrangement as described in the embodiments herein. The deposition system of FIG. 4A additionally shows a substrate 121 to be coated with the vaporized material and a mask 132 to mask the substrate 121. 4A schematically illustrates how the vaporized material 802 exits and exits the nozzles of the material deposition arrangements 100a, 100b, and 100c, particularly, the material deposition arrangements. According to the embodiments described herein, the evaporated material 802 diffuses when it exits the material deposition arrangement and enters the vacuum volume of the deposition chamber. Nozzles having a length-to-size ratio of 2: 1 or greater allow to have a limited diffusion of the evaporated material, for example, by including an angle of about 30 degrees or less. A comparison with a known deposition system as shown in FIG. 4B shows that the evaporated material 803 includes an angle of about 60 degrees.

[0040] As shown by the examples shown in Figures 3a, 3b, 4a, and 4b, the material deposition arrangements according to the embodiments described herein can provide a smaller distribution spread of the evaporated material And allows the vaporized material to be more precisely guided to the substrate, and more specifically to mask openings for coating the substrate with high precision.

[0041] Arranging the nozzles of the distribution pipes at a distance of less than 30 mm additionally provides options for mixing different materials of different material sources 100a, 100b, and 100c. The reduced distance between the nozzles of the material deposition arrangements can be further improved by using a special shape for the distribution pipes, such as a shape like a triangle as shown exemplarily in FIG. 4A.

Having a distribution such as cos ⁶ of the evaporated material allows the use of smaller mask openings and improved precision for smaller structures to be coated on the substrate, such as pixels for OLED products can do.

[0043] According to some embodiments, a material deposition arrangement for depositing evaporated materials on a substrate in a vacuum chamber is provided. According to some embodiments, the material deposition arrangement may be configured to deposit two or more evaporated materials on a substrate in a vacuum chamber. The material deposition arrangement includes a first material source comprising a first material evaporator configured to evaporate a first material to be deposited on a substrate. According to some embodiments, the first material may be the first of two or more materials to be deposited on the substrate. The first material source further comprises a first distribution pipe comprising a first distribution pipe housing, wherein the first distribution pipe is in fluid communication with the first material evaporator; In addition, the first material source includes a plurality of first nozzles in the first distribution pipe housing, wherein one or more of the plurality of first nozzles includes an opening length and an opening size, In a first dispense direction. The length to size ratio of one or more of the plurality of first nozzles is equal to or greater than 2: 1. The material deposition arrangement further includes a second material source comprising a second material evaporator configured to evaporate a second material to be deposited on the substrate. According to some embodiments, the second material may be a second material of two or more of the materials to be deposited on the substrate. The second material source further comprises a second distribution pipe: the second distribution pipe comprises a second distribution pipe housing, wherein the second distribution pipe is in fluid communication with the second material evaporator. The second material source further comprises a plurality of second nozzles in a second distribution pipe housing wherein one or more of the second nozzles are configured to provide a second dispense direction. According to embodiments described herein, which may be combined with other embodiments described herein, a first dispensing direction of one or more of the first nozzles and a second dispensing direction of the plurality of second nozzles The second dispensing direction of one or more of the nozzles is arranged parallel to each other, or arranged with a deviation of up to 5 [deg.] From a parallel arrangement. According to some embodiments, the first material and the second material may be the same material, or alternatively, they may be different materials.

[0044] FIG. 5a shows a material deposition arrangement having a substantially parallel arrangement of a first dispensing direction of the nozzles in the first dispensing pipe housing and a second dispensing direction of the nozzles in the second dispensing pipe housing. The material deposition arrangement illustrated by way of example in FIG. 5A illustrates a first material source 100a and a second material source 100b. Material sources 100a and 100b each include material evaporators 102a and 102b, respectively. In one embodiment, each of the material evaporators may provide a different material. In another embodiment, each of the material evaporators may provide the same material, or some of the material evaporators may provide the same material, while other portions of the material evaporators provide different materials. According to the embodiments described herein, the first material source 100a comprises a first distribution pipe 106a and the second material source 100b comprises a second distribution pipe 106b. The first and second distribution pipes each have a distribution pipe housing, and nozzles 712 are arranged in such distribution pipe housing. In particular, the first distribution pipe comprises a plurality of first nozzles and the second distribution pipe comprises a plurality of second nozzles, in order to discharge the evaporated material from each distribution pipe housing towards the substrate to be coated.

[0045] According to the embodiments described herein, one or more of the nozzles of the first and / or second distribution pipe may have a ratio of 2: 1 or more, such as 2.5: 1, 3: 1, 5 : 1, or even greater than 5: 1. The size and length of the nozzle openings can be understood as described in detail above with respect to Figures 1A-1F. In some embodiments, one or more nozzles of the first distribution pipe provide a first dispense direction, and one or more nozzles of the second dispense pipe provide a second dispense direction.

[0046] According to the embodiments described herein, the dispensing direction of the nozzles can be understood as the average dispensing direction of the nozzles. In some embodiments, the average direction of dispensing is substantially such that the line in the plume of evaporated material that is discharged from the nozzle toward the substrate to be coated, particularly the line in the plume of evaporated material reaching a maximum in the plume of evaporated material Line. According to some embodiments, the average distribution direction of the nozzles can be understood as corresponding to the geometric center line of the plume of evaporated material being ejected from the nozzle toward the substrate to be deposited. In some embodiments, the center line of the vapor plume is described as corresponding to a line that includes the geometric center of the plume of vaporized material and a point on the longitudinal axis or the longitudinal axis of the nozzle, e.g., at the outlet of the nozzle . According to further embodiments, the average distribution direction of the nozzles is between the nozzle outlet and the substrate to be coated, in particular with a minimum distance between the point of the nozzle outlet situated on the longitudinal axis or the longitudinal axis of the nozzle and the substrate to be coated Can be described as following along the line.

[0047] FIG. 5b shows a top view of a material arrangement including material sources 100a and 100b, according to some embodiments. 5A and 5B, the nozzles 712 of the first distribution pipe 106a provide a first dispensing direction 210 and the nozzles 712 of the second dispensing pipe 106b 712 provide a second dispensing direction 211. Typically, the nozzles in the first distribution pipe and the second distribution pipe are arranged so that the first dispensing direction and the second dispensing direction are parallel to each other. According to some embodiments, the first dispensing direction and the second dispensing direction may have a deviation of up to 5 [deg.] From a strictly parallel arrangement, e.g., about 3 [deg.] Or about 2 [deg.] From a strictly parallel arrangement. According to some embodiments, the first dispense direction 210 and the second dispense direction 211, as shown in Figures 5A and 5B, may have a distance between each other of about 30 mm or less.

[0048] As already described above, the first distribution pipe and the second distribution pipe of the material deposition arrangement shown in FIGS. 5A and 5B can have a triangular-like shape. Figures 6A and 6B show a material deposition arrangement in which the dispensing directions of the nozzles of the first distribution pipe and the second distribution pipe are substantially triangular in shape substantially parallel to each other.

[0049] Figure 6a provides a third material source having a first material source having a first distribution pipe 106a, a second material source having a second distribution pipe 106b, and a third distribution pipe 106c Lt; RTI ID = 0.0 > embodiment. ≪ / RTI > According to some embodiments, the heating elements 380 and the heat insulator 879 may be equipped in the distribution pipes to improve heating efficiency and to avoid condensation of evaporated material in the distribution pipes. An evaporator control housing 702 is provided near the distribution pipes and is connected to such distribution pipes through a thermal insulation 879. The arrows (as viewed in the plane of projection) over the distribution pipes 106a, 106b, and 106c illustrate the evaporated organic material exiting the distribution pipes 106a, 106b, and 106c. The average distribution direction of each of the nozzles of the distribution pipes is indicated by reference numerals 210, 211, and 212. As shown in Figure 6a, the dispensing directions of the different dispense pipes are substantially parallel.

[0050] A partial and simplified view of the nozzles 712 of the three distribution pipes 106a, 106b, and 106c is shown in Figure 6b. The three nozzles 712 illustrated by way of example have length axes or longitudinal axes 201, 202, 203. The nozzles 712 are connected to the substrate to be coated (not shown) from the distribution pipes 106a, 106b, and 106c in the first dispense direction 210, the second dispense direction 211, and the third dispense direction 212. [ The vaporized material can be guided to the < RTI ID = 0.0 > As shown in the embodiment shown in FIG. 6B, the three dispensing directions are parallel to each other and can deviate by up to 5 degrees from a strictly parallel arrangement.

[0051] According to the embodiments described herein, different dispense pipes, such as the first, second, and third dispense pipes as referred to herein, may be dispensed with different evaporators, such as three dispense pipes And may be in fluid communication with different evaporators. In some embodiments, different dispense pipes may be in fluid communication with the same type but with evaporators that vaporize different materials. For example, three different components may be provided by three distribution pipes in fluid communication with three evaporators. In one example, material deposition arrangements as described herein can be used to produce OLEDs. The evaporated material may comprise three components used to produce OLEDs.

[0052] In accordance with the embodiments described herein, using a parallel arrangement of dispensing directions of different nozzles and using a nozzle having a length-to-size ratio of 2: 1 or more, To assist in improving the predictability and uniformity of the behavior of the evaporated material. For example, the direction of the evaporated material may be substantially parallel to the direction of another or adjacent evaporated material to allow for regular and uniform collision of the evaporated material on the mask and / or the substrate. In one example, different components of different dispense pipes may have substantially the same impingement angle on the mask and / or substrate, particularly a substantially vertical impingement angle on the mask and / or the substrate. The creation of a coating of one or more components can be performed in a more precise manner with the material deposition arrangement according to the embodiments described herein. In addition, material sources having a parallel arrangement of dispensing directions can be used to reduce mounting and computational effort, as is done, for example, in known systems, when different material sources have defined angles between dispensing directions have. Additionally, material deposition arrangements that include the parallel arrangement described above of dispensing directions, in accordance with the embodiments described herein, provide a uniform mixture of different components when different components are used in different material sources .

[0053] According to some embodiments, a distribution pipe is provided for depositing evaporated material on a substrate in a vacuum chamber. The dispensing pipe includes a dispensing pipe housing, and a nozzle in the dispensing pipe housing. The nozzle includes an opening length and an opening size, wherein the length to size ratio of the nozzle is equal to or greater than 2: 1. According to some embodiments that may be combined with other embodiments described herein, the nozzle comprises a material that is chemically inert with respect to the organic material to be evaporated. In one example, the evaporated organic material may typically have a temperature of about 150 ° C and about 650 ° C, more typically about 100 ° C to 500 ° C.

[0054] Figures 7A-7D illustrate examples of nozzles in a dispensing pipe according to embodiments described herein. The nozzles 200 shown in Figures 7A-7D include an opening 203 (or passageway or bore 203) for guiding the material vaporized through the nozzle. According to the embodiments described herein, the nozzles 200 have an opening length 714 and an opening size 716. For example, as described above, the length to size ratio of the nozzles in the embodiments described herein may be 2: 1 or greater. The terms "aperture length" and "aperture size" can be understood as described herein with respect to Figures 1A-1F.

[0055] FIG. 7A illustrates a nozzle comprising a first nozzle material 206 and a second nozzle material 208. For example, the first nozzle material 206 may be a material having a thermal conductivity value greater than 21 W / mK, such as copper. In some embodiments, the second nozzle material 208 may be provided on the interior side of the opening or passage 203, and may be chemically inert with respect to the evaporated organic material. For example, the second nozzle material may be selected from Ta, Nb, Ti, DLC, stainless steel, quartz glass, and graphite. The second nozzle material 208 may be provided as a thin coating on the inner side of the passageway 203, as shown in the embodiments shown in Fig. 7A.

[0056] FIG. 7B illustrates an embodiment of a nozzle having a first nozzle material 206 and a second nozzle material 208. An example of the nozzle shown in Fig. 7B is a first portion made of a first nozzle material 206 (e.g. having a thermal conductivity value of greater than 21 W / mK) and a second portion made of a second And a second portion made of a nozzle material 208. In one example, the first and second nozzle materials may be selected as described with respect to FIG. 7A. 7B, the second nozzle material 208 is part of the nozzle, and in particular, is not the only coating on the inner passageway side.

[0057] According to some embodiments, the thickness of the second nozzle material may typically range from a few nanometers to a few micrometers. In one example, the thickness of the second nozzle material at the nozzle opening is typically from about 10 nm to about 50 占 퐉, more typically from about 100 nm to about 50 占 퐉, and even more typically from about 500 nm to about 50 占 퐉 Lt; / RTI > In one example, the thickness of the second nozzle material may be about 10 [mu] m.

[0058] FIG. 7C illustrates an embodiment of a nozzle 200, wherein the nozzle 200 has a thermal conductivity greater than the thermal conductivity of the distribution pipe to which the nozzle can be connected, or a thermal conductivity greater than 21 W / mK And is made of a first nozzle material having a conductivity. In the embodiment described herein, the first nozzle material 206 is inert to the evaporated organic materials. In one example, the first nozzle material may be selected from Ta, Nb, Ti, DLC, or graphite.

[0059] FIG. 7d shows a perspective view of the nozzle shown in FIG. 7a, in accordance with the embodiments described herein. At the opening 713, the second nozzle material 208 is visible while the outer side of the nozzle 200 shows the first nozzle material 206.

[0060] According to some embodiments described herein, the opening or passageway of the nozzle flowing during the evaporation process to reach the substrate to be vaporized material is typically about 1 mm to about 10 mm, more typically May have a size of from about 1 mm to about 6 mm, and even more typically from 2 mm to about 5 mm. According to some embodiments, the dimensions of the passageway or opening may refer to the smallest dimension of the cross-section, e.g., the diameter of the passageway or opening. In one embodiment, the size of the opening or passage is measured at the outlet of the nozzle. According to some embodiments described herein, which may be combined with other embodiments described herein, an opening or passage may be created in the tolerance zone H7, for example, from about 10 [mu] m to about 18 [ Can be generated.

[0061] According to some embodiments described herein, a nozzle for material vapor deposition for depositing material on a substrate in a vacuum deposition chamber, or for a distribution pipe, according to embodiments described herein, And a thread for repeatedly connecting and disconnecting the nozzle to the pipe. In some embodiments, a nozzle having a thread to be connected to a distribution pipe may be provided with an inner thread and / or an outer thread to allow the nozzles to be repeatedly connected to the distribution pipe, in particular, without destroying the distribution pipe or nozzle Lt; / RTI > For example, a first nozzle having defined characteristics may be connected to the distribution pipe for the first process. After the first process is completed, the first nozzle can be disconnected and the second nozzle can be connected to the distribution pipe for the second process. If the first process is to be performed again, the second nozzle can be disconnected from the distribution pipe, and the first nozzle can again be connected to the distribution pipe to perform the first process. According to some embodiments, the dispensing pipe may also include a thread for interchangeable connection of the nozzle to the dispensing pipe, for example, by fitting to the thread of the nozzle.

[0062] According to some embodiments described herein, a material distribution arrangement as described in the embodiments herein and a distribution pipe as described in the embodiments described herein are shown in Figures 8a-8c see. The distribution pipe 106 may be in fluid communication with the crucible to dispense the evaporated material provided by the Fig. The dispensing pipe may be, for example, a elongated cube having a heating unit 715. And may be a reservoir for the organic material to be evaporated into the evaporation furnace heating unit 725. [ According to exemplary embodiments that may be combined with other embodiments described herein, the distribution pipe 106 provides a line source. According to some embodiments described herein, the material deposition arrangement 100 includes a plurality of openings and / or a plurality of openings for discharging evaporated material towards the substrate, such as nozzles arranged along at least one line Outlet.

[0063] According to some embodiments that may be combined with other embodiments described herein, the nozzles of the dispensing pipe may be different from the longitudinal direction of the dispensing pipe, such as a direction substantially perpendicular to the longitudinal direction of the dispensing pipe Direction, to release the evaporated material. According to some embodiments, the outlets (e.g., the nozzles) are arranged to have a main evaporation direction to be + - 20 ° horizontal. According to some specific embodiments, the evaporation direction may be oriented slightly upward, e.g., horizontally to 15 degrees upward, e.g., 3 degrees to 7 degrees upward. Correspondingly, the substrate may be slightly inclined so as to be substantially perpendicular to the evaporation direction. Due to the inclined substrate, unwanted particle generation can be reduced. However, according to the embodiments described herein, the nozzle and material deposition arrangement may also be used in a deposition apparatus configured to deposit material on a horizontally oriented substrate.

[0064] In one example, the length of the distribution pipe 106 corresponds at least to the height of the substrate to be deposited in the deposition apparatus. In many cases, the length of the distribution pipe 106 will be at least 10% or even 20% greater than the height of the substrate to be deposited. Due to the distribution pipe being longer than the height of the substrate, uniform deposition at the upper end of the substrate and / or at the lower end of the substrate can be provided.

[0065] According to some embodiments that may be combined with other embodiments described herein, the length of the distribution pipe may be 1.3 m or more, such as 2.5 m or more. According to one configuration, as shown in FIG. 1A, a vaporizing crucible 104 is provided at the lower end of the distribution pipe 106. The organic material is evaporated in the evaporation crucible 104. The vapor of organic material enters the distribution pipe 106 at the bottom of the distribution pipe and is essentially sideways through the plurality of nozzles in the distribution pipe, e.g., essentially essentially perpendicular to the substrate.

[0066] FIG. 8b shows an enlarged schematic view of a portion of a material source, wherein the distribution pipe 106 is connected to the evaporation crucible 104. A flange unit 703 configured to provide a connection between the evaporation crucible 104 and the distribution pipe 106 is provided. For example, the evaporation crucible and the distribution pipe are provided as separate units that can be detached and connected to the flange unit or assembled, for example, for operation of a material source.

[0067] The distribution pipe 106 has an inner hollow space 710. A heating unit 715 may be provided for heating the distribution pipe. Thus, the distribution pipe 106 can be heated to a temperature such that the vapor of organic material provided by the evaporation crucible 104 is not condensed in the interior portion of the wall of the distribution pipe 106.

[0068] For example, the distribution pipe may be configured to have a temperature of from about 1 ° C. to about 20 ° C., more typically from about 5 ° C. to about 20 ° C., and more typically, from about 1 ° C. to about 20 ° C., Lt; RTI ID = 0.0 > 15 C < / RTI > Two or more heat shields 717 are provided around the tubes of the distribution pipe 106.

[0069] During operation, the distribution pipe 106 may be connected to the evaporation crucible 104 in the flange unit 703. The evaporation crucible 104 is configured to receive the organic material to be evaporated and to evaporate the organic material. According to some embodiments, the material to be evaporated may comprise at least one of ITO, NPD, Alq ₃ , Quinacridone, Mg / AG, starburst materials, and the like. 8B shows a cross section through the housing of the evaporation crucible 104. Fig. A refill opening that can be closed using a plug 722, a cover, a cover or the like is provided at the upper portion of the evaporation crucible, for example, to close the enclosure of the evaporation crucible 104. [

An external heating unit 725 is provided in the enclosure of the evaporation crucible 104. The outer heating element may extend at least along a portion of the wall of the evaporation crucible 104. According to some embodiments that may be combined with other embodiments described herein, one or more central heating elements 726 may additionally or alternatively be provided. Fig. 8b shows two central heating elements 726. Fig. According to some implementations, the evaporation furnace 104 may further include a shield 727.

[0071] According to some embodiments, an evaporation crucible 104 is provided on the lower side of the distribution pipe 106, as exemplarily shown in FIGS. 8A-8B. According to still further embodiments, which may be combined with other embodiments described herein, the steam conduit 732 may be located at a central portion of the distribution pipe, or at another location between the upper end of the distribution pipe and the lower end of the distribution pipe To the distribution pipe 106, as shown in FIG. 8C illustrates an example of a material source having a distribution pipe 106 and a vapor conduit 732 provided in a central portion of the distribution pipe. Vapor of the organic material is produced in the evaporation crucible 104 and is guided through the vapor conduit 732 to the central portion of the distribution pipes 106. The vapor exits the dispensing pipe 106 through a plurality of nozzles 712, which may be nozzles as described with respect to Figs. 7A-7D. According to still further embodiments, which may be combined with other embodiments described herein, two or more steam conduits 732 may be provided at different locations along the length of the distribution pipe 106 have. In some embodiments, the vapor conduits 732 may be connected to one evaporation crucible 104, or may be connected to several evaporation crucibles 104. For example, each vapor conduit 732 may have a corresponding evaporation furnace 104. Alternatively, the evaporation crucible 104 may be in fluid communication with two or more of the vapor conduits 732 connected to the distribution pipe 106.

[0072] As described herein, the dispensing pipe may be a hollow cylinder. The term cylinder can be understood as being generally accepted as having a circular bottom shape and a circular top shape and a curved surface area or shell connecting the upper and lower lower circles. According to further or alternative embodiments that can be combined with other embodiments described herein, the term cylinder further includes any bottom shape and the same top shape, and a top shape and a bottom shape It can be understood in a mathematical sense as having a curved surface area or shell. Therefore, the cylinder does not necessarily have a circular cross section. Instead, the base surface and the top surface may have a different shape than the circle.

[0073] Figures 9a and 9b illustrate cross-sectional views of embodiments of a distribution pipe 106 for material deposition arrangements in accordance with the embodiments described herein. According to some embodiments, the distribution pipe 106 includes a first housing material or a distribution pipe housing 116 made of a first housing material. As shown in the embodiments shown in Figs. 9A and 9B, the dispensing pipe is a linear dispensing pipe extending along the first direction 136.

[0074] FIG. 9a shows a dispensing pipe having a plurality of openings 107 arranged in a first direction in a dispensing pipe housing. In some embodiments, the walls 109 of the openings in the distribution pipe can be understood as being nozzles according to the embodiments described herein. In one example, the walls 109 of the openings 107 may comprise a first nozzle material (e.g., by being coated with a first nozzle material), wherein the thermal conductivity value of the first nozzle material In the examples, it may be greater than the thermal conductivity of the first distribution pipe material, or it may be greater than 21 W / mK. In one example, the walls 109 of the openings 107 may be covered with copper. In one embodiment, the walls may be covered with a second nozzle material, such as a chemically inert material for the evaporated organic material, and copper.

[0075] FIG. 9b illustrates an embodiment of a dispensing pipe according to embodiments described herein. The distribution pipe 106 shown in Figure 9b includes openings 107 in which extension walls 108 are provided. The extension walls 108 of the openings 107 extend in a direction substantially perpendicular to the first direction 136 of the distribution pipe housing 116. [ According to some embodiments, the walls 108 of the openings 107 may extend from the dispensing pipe at any suitable angle. In some embodiments, the walls 108 of the openings 107 of the distribution pipe housing 116 may provide the nozzles of the distribution pipe 106 in accordance with the embodiments described herein. For example, the walls 108 may comprise a first nozzle material, or may be made of a first nozzle material. According to some embodiments, the walls 108 may be coated on the inner side with a first and / or second nozzle material, e.g., a chemically inert material for the evaporated organic materials.

[0076] In some embodiments, the walls 108 provide mounting assistance to the distribution pipe housing 116 for mounting nozzles, such as nozzles, as illustratively shown in FIGS. 8A-8D . According to some embodiments, the walls 108 may provide threads to the distribution pipe housing 116 for scribing the nozzle.

[0077] According to some embodiments that may be combined with other embodiments described herein, the nozzles of the distribution pipes or material deposition arrangements referred to herein may be configured to form a plume having a profile of a shape such as cos ⁿ Where n is greater than 4 in particular. In one example, the nozzle is designed to form a plume having a profile of a shape such as cos ⁶ . Nozzles that achieve a cos ⁿ type of plume of material to be evaporated may be useful if a narrow shape of the plume is desired. For example, a deposition process that includes masks for a substrate with small openings (e.g., openings having a size of about 20 μm) can benefit from a plume of narrow cos ⁿ shape, Is not diffused onto the mask but passes through the openings of the mask, so that the material utilization can be increased. According to some embodiments, the nozzle may be designed such that the relationship between the length of the nozzle and the diameter of the passage of the nozzle is in a defined relationship such as 2: 1 or more. According to additional or alternative embodiments, the passage of the nozzle may include steps, slopes, collimator structure (s), and / or pressure stages to achieve the desired plume shape.

[0078] According to some embodiments described herein, a vacuum deposition chamber is described. The vacuum deposition chamber includes a material deposition arrangement according to any of the embodiments described above. The vacuum deposition chamber further includes a substrate support for supporting the substrate during deposition. Typically, the distance between at least one of the distribution pipes of the substrate support and the material deposition arrangements is less than 250 mm. According to some embodiments, the distance between the substrate support and the dispensing pipe may be measured from the position of the substrate support (e.g., contact point, clamp, etc.) placed in a plane having the substrate and the nozzle outlet of the dispensing pipe.

[0079] In some embodiments, the vacuum deposition chamber may include a material deposition arrangement having a nozzle having an opening size to aperture ratio of 2: 1 or more. According to some embodiments, which may be combined with other embodiments described herein, a vacuum deposition chamber may be provided (e.g., with a first distribution pipe having a plurality of first nozzles and a second distribution pipe having a plurality of second nozzles Such as first and second material sources as described above, with a first source of material and a second source of material. Typically, the distance between the first of the plurality of first nozzles and the second of the plurality of second nozzles is equal to or less than 30 mm.

[0080] According to some embodiments, which may be combined with other embodiments described herein, the vacuum deposition chamber includes a material deposition arrangement having a nozzle having an opening size to opening ratio of 2: 1 or greater can do. According to some embodiments, which may be combined with other embodiments described herein, a vacuum deposition chamber may be provided (e.g., with a first distribution pipe having a plurality of first nozzles and a second distribution pipe having a plurality of second nozzles Such as first and second material sources as described above, with a first source of material and a second source of material. Typically, at least one of the plurality of first nozzles of the first distribution pipe provides a first dispensing direction, and at least one of the plurality of second nozzles provides a second dispensing direction. In some embodiments, the first dispensing direction of one or more of the plurality of first nozzles and the second dispensing direction of one or more of the plurality of second nozzles are parallel to each other Aligned, or arranged with a deviation of up to 5 degrees from a parallel arrangement.

[0081] According to some embodiments, the vacuum deposition chamber may comprise a material distribution arrangement having a distribution pipe housing and a distribution pipe with nozzles in the distribution pipe housing. The length to size ratio of the nozzle openings is 2: 1 or greater, and the nozzles include materials that are chemically inert with respect to the evaporated organic material, such as the organic materials referred to above.

[0082] FIG. 10 illustrates a deposition apparatus 300 in which a material deposition arrangement, a distribution pipe, or a nozzle can be used, in accordance with the embodiments described herein. The elements referenced below, such as nozzles or distribution pipes, may be elements as described in detail above with respect to Figs. 1-9. For example, a dispensing pipe as referenced below may be a dispensing pipe as illustratively described with respect to Figs. 1-9, unless the combined embodiments conflict with each other.

[0083] The deposition apparatus 300 of FIG. 10 includes a material source 100 in place in a vacuum chamber 110. According to some embodiments that may be combined with other embodiments described herein, the material source is configured for translational motion and rotation about an axis. The material source 100 has one or more evaporation crucibles 104 and one or more distribution pipes 106. Two evaporation crucibles and two distribution pipes are shown in Fig. The distribution pipes 106 are supported by the support 102. Additionally, according to some embodiments, the evaporation crucibles 104 may also be supported by the support 102. [ Two substrates 121 are provided in the vacuum chamber 110. Typically, a mask 132 for masking layer deposition on a substrate may be provided between the substrate and the material source 100. In some embodiments, the mask has a size of a pixel mask, such as typically from about 10 μm to about 50 μm, more typically from about 15 μm to 40 μm, and even more typically from about 15 μm to about 30 μm (E.g., the smallest dimension or diameter of the cross-section). In one example, the size of the mask openings is about 20 μm. In another example, the mask openings have an extension of about 50 [mu] m x 50 [mu] m. The organic material is evaporated from the distribution pipes 106.

[0084] According to the embodiments described herein, the substrates are coated with an organic material in an essentially vertical position. 10 is a top view of an apparatus including a material source 100. As shown in FIG. Typically, the dispensing pipe is a linear vapor dispensing showerhead. According to some embodiments, the distribution pipe provides an essentially vertically extending line source. According to the embodiments described herein, which may be combined with other embodiments described herein, the vertical in nature may be 20 [deg.] Or less, such as 10 [deg. Lt; RTI ID = 0.0 > vertical direction. ≪ / RTI > For example, deviations can be provided because the substrate support having some deviation from the vertical orientation can generate a more stable substrate position. It is also contemplated that the substrate orientation during deposition of the organic material is essentially vertical, which is considered to be different from the horizontal substrate orientation. In some embodiments, the surfaces of the substrates are coated by translational movement along a line source extending in one direction corresponding to one substrate dimension, and another direction corresponding to another substrate dimension. According to other embodiments, the deposition apparatus may be a deposition apparatus for depositing material on an essentially horizontally oriented substrate. For example, the coating of the substrate in the deposition apparatus can be performed in the upward or downward direction.

[0085] FIG. 10 illustrates an embodiment of a deposition apparatus 300 for depositing an organic material in a vacuum chamber 100. The material source 100 is provided in a vacuum chamber 110, e.g., on a track such as a looped track or a linear guide 320. The track or linear guide 320 is configured for translational movement of the material source 100. According to different embodiments that can be combined with other embodiments described herein, a drive for translational motion is provided to the material source 100, to the track or linear guide 320, to the vacuum chamber 110 ), Or a combination thereof. Figure 10 shows a valve 205, such as a gate valve, for example. Valve 205 allows vacuum sealing for adjacent vacuum chambers (not shown in FIG. 10). The valve may be opened for transport of the substrate 121 or the mask 132 into or out of the vacuum chamber 110.

[0086] According to some embodiments, which may be combined with other embodiments described herein, additional vacuum chambers, such as maintenance vacuum chambers 210, are provided near the vacuum chamber 110. In some embodiments, vacuum chamber 110 and maintenance vacuum chamber 210 are connected to valve 207. The valve 207 is configured to open and close the vacuum seal between the vacuum chamber 110 and the maintenance vacuum chamber 210. The material source 100 can be transferred to the maintenance vacuum chamber 210 while the valve 207 is in the open state. Thereafter, the valve may be closed to provide a vacuum seal between the vacuum chamber 110 and the maintenance vacuum chamber 210. When the valve 207 is closed, the maintenance vacuum chamber 210 is vented and opened for maintenance of the material source 100, without destroying the vacuum in the vacuum chamber < RTI ID = 0.0 & .

[0087] In the embodiment shown in FIG. 10, two substrates 121 are supported on respective transport tracks in the vacuum chamber 110. According to some embodiments, the distance between the substrate support and at least one of the distribution pipes is less than 250 mm. 10, the distance is indicated by the distance 101 between the outlet of the nozzle of the distribution pipe 106 of the material source 100 and the substrate support 126. In addition, two tracks are provided for providing masks 132 on top. The coating of the substrates 121 may be masked by respective masks 132. According to exemplary embodiments, the mask 132, i.e., the first mask 132 corresponding to the first substrate 121, and the second mask 132 corresponding to the second substrate 121, And is provided to the mask frame 131 to hold the mask 132 in position.

[0088] According to some embodiments that may be combined with other embodiments described herein, the substrate 121 may be supported by a substrate support 126 coupled to the alignment unit 112. The alignment unit 112 can adjust the position of the substrate 121 with respect to the mask 132. [ Figure 10 illustrates an embodiment in which the substrate support 126 is connected to the alignment unit 112. [ Thus, the substrate is moved relative to the mask 132 to provide proper alignment between the substrate and the mask during deposition of the organic material. According to a further embodiment, which may be combined with other embodiments described herein, alternatively or additionally, a mask frame 131 holding the mask 132 and / Lt; RTI ID = 0.0 > 112 < / RTI > According to some embodiments, the mask may be positioned relative to the substrate 121, or both the mask 132 and the substrate 121 may be positioned relative to each other. Alignment units 112 configured to adjust the position between the substrate 121 and the mask 132 with respect to each other allow for proper alignment of the masking during the deposition process, which is suitable for high quality, LED display fabrication, or OLED display fabrication It is beneficial for.

[0089] As shown in Figure 10, the linear guide 320 provides a direction of translational movement of the material source 100. A mask 132 is provided on both sides of the material source 100. The masks 132 may extend essentially parallel to the direction of translational motion. In addition, the substrates 121 on opposite sides of the material source 100 may also extend essentially parallel to the direction of translational motion. According to typical embodiments, the substrate 121 may be moved into and out of the vacuum chamber 110 via the valve 205. The deposition apparatus 300 may include a respective transport track for transporting each of the substrates 121. For example, the transport track may extend parallel to the substrate position shown in FIG. 10 and into and out of the vacuum chamber 110.

[0090] Typically, additional tracks are provided to support mask frames 131 and masks 132. Accordingly, some embodiments that may be combined with other embodiments described herein may include four tracks in the vacuum chamber 100. [ For example, to clean one of the masks, the mask frame 131 and the mask may be moved onto the transport track of the substrate 121 to move one of the masks 132 out of the chamber. Thereafter, each mask frame may exit the vacuum chamber 110 on the transport track for the substrate, or may enter the vacuum chamber 110. It will be possible to provide separate transport tracks into and out of the vacuum chamber 110 for the mask frames 131, but only two tracks, i.e., transport tracks for the substrate, into and out of the vacuum chamber 110 The cost of ownership of the deposition apparatus 200 can be reduced when the mask frames 131 are extended and can be moved onto each of the transport tracks for the substrate by a suitable actuator or robot.

[0091] FIG. 10 illustrates an exemplary embodiment of a material source 100. The material source (100) includes a support (102). The support 102 is configured for translational movement along the linear guide 320. The support 102 supports two evaporation crucibles 104 and two distribution pipes 106 provided above the evaporation crucible 104. The vapors produced in the evaporation crucible can move upward and out of one or more nozzles or outlets of the distribution pipe.

[0092] According to the embodiments described herein, the material source comprises one or more evaporation crucibles and one or more distribution pipes, wherein one or more of the distribution pipes are each one Or more of each of the evaporation crucibles. Various applications for OLED device fabrication include processing steps in which one, two, or more organic materials are evaporated simultaneously. Thus, for example, as shown in Figure 10, two distribution pipes and corresponding evaporation crucibles can be provided next to each other. Thus, material source 100 may also be referred to as a material source array, e.g., where more than one kind of organic material is evaporated at the same time. As described herein, a material source array itself may be referred to as a material source for two or more organic materials, for example, a material source array may be used to evaporate and deposit three materials on one substrate . ≪ / RTI > According to some embodiments, the material source array may be configured to simultaneously provide the same material from different material sources.

[0093] One or more nozzles of the dispensing pipe may include one or more nozzles that may be provided, for example, in a showerhead or other vapor distribution system. The nozzles provided for the dispensing pipe described herein may be nozzles as described in the embodiments herein, such as the nozzles described with respect to Figures 8A-8D. The dispensing pipe may be understood herein to include an enclosure having openings such that the pressure in the dispensing pipe is, for example, at least one order of magnitude higher than the pressure outside the dispensing pipe. In one example, the pressure in the dispensing pipe may be about 10 ^-2 to about 10 ^-3 mbar.

[0094] According to the embodiments described herein, which may be combined with other embodiments described herein, rotation of the distribution pipe may be provided by rotation of the evaporator control housing, and such evaporator control housing At least a distribution pipe is mounted. Additionally or alternatively, rotation of the dispensing pipe may be provided by moving the material source along the curved portion of the looped track. Typically, further, an evaporation crucible is mounted on the evaporator control housing. Thus, the material sources include a distribution pipe and an evaporation crucible, both of which may be rotatable, e.g., together, mounted.

[0095] According to some embodiments, which may be combined with other embodiments described herein, the distribution pipe or evaporation tube may be configured to allow the apertures or nozzles of the distribution pipe to be as close as possible to one another, It can be designed in a triangular shape. Making the apertures or nozzles of the dispensing pipe as close as possible to one another may be advantageous, for example, in the case of simultaneous evaporation of two, three, or even more different organic materials, Mixing is allowed to be achieved.

[0096] According to the embodiments described herein, the width of the dispensing pipe at the outlet side (which is the side of the dispensing pipe including the openings) is 30% or less of the largest dimension of the cross-section. With this in mind, the nozzles of neighboring distribution pipes or the openings of the distribution pipes may be provided with a smaller distance. The smaller distances improve the mixing of the organic materials evaporated immediately next to each other. Additionally, additionally, or alternatively, and independently of the improved mixing of the organic materials, the width of the wall facing the substrate in an essentially parallel manner can be reduced. Correspondingly, the surface area of the wall facing the substrate in an essentially parallel manner can be reduced. The arrangement reduces the heat load applied to the mask or substrate being supported in the deposition area or just before the deposition area.

[0097] Additionally or alternatively, considering the triangular shape of the material source, the area to be copied toward the mask is reduced. Additionally, a stack of metal plates of, for example, up to ten metal plates may be provided to reduce heat transfer from the material source to the mask. According to some embodiments that may be combined with other embodiments described herein, orifices for nozzles may be provided on the heat shields or metal plates, and such heat shields or metal plates may be provided, At least on the front side of the source, i.e., on the side facing the substrate.

[0098] While the embodiment shown in FIG. 10 provides a deposition apparatus with a moveable source, those skilled in the art will appreciate that the embodiments described above can also be applied in deposition apparatuses in which the substrate is moved during processing. For example, substrates to be coated may be guided and driven along stationary material sources.

[0099] The embodiments described herein are particularly directed to the deposition of organic materials, for example, for the manufacture of OLED displays on large area substrates. According to some embodiments, large area substrates, or carriers supporting one or more substrates, i.e., large area carriers, may have a size of at least 0.174 m ² . For example, the deposition apparatus may include GEN 5 corresponding to about 1.4 m ² substrates (1.1 mx 1.3 m), GEN 7.5 corresponding to about 4.29 m ² substrates (1.95 mx 2.2 m), about 5.7 m ² substrates (2.2 such as GEN 8.5, which corresponds to a width of about 2.5 m, or even GEN 8.5, corresponding to about 8.7 m 2 substrates (2.85 mx 3.05 m). Larger generations such as GEN 11 and GEN 12 and corresponding substrate areas can similarly be implemented. According to exemplary embodiments, which may be combined with other embodiments described herein, the substrate thickness may be 0.1 to 1.8 mm, and the holding arrangement for the substrate may be adapted for such substrate thicknesses. However, in particular, the substrate thickness may be about 0.9 mm or less, such as 0.5 mm or 0.3 mm, and the holding arrangement is adapted for such substrate thicknesses. Typically, the substrate may be made of any material suitable for material deposition. For example, the substrate may be made of any suitable material or material that can be coated by a deposition process, such as glass (e.g., soda-lime glass, borosilicate glass, etc.), metal, polymer, ceramic, compound materials, ≪ / RTI > and combinations thereof.

[00100] According to some embodiments, a method is provided for depositing evaporated material on a substrate in a vacuum deposition chamber having a chamber volume. The chamber volume can be understood as the volume enclosed by the chamber walls and, in particular, the volume providing the same pressure regime. A flowchart 400 illustrating a method according to embodiments described herein is shown in FIG. The method includes, at block 410, evaporating the first material by a first material evaporator arranged in the chamber volume. For example, the first material evaporator may be a source for evaporating organic materials. In one example, the evaporator may be adapted to evaporate the material with an evaporation temperature of about 150 ° C to about 500 ° C. In some embodiments, the material source may be a crucible.

[00101] At block 420, the method includes providing a first evaporated material to a first distribution pipe comprising a first distribution pipe housing. According to embodiments described herein, the first distribution pipe is in fluid communication with the first material evaporator. According to some embodiments, the distribution pipe may be a distribution pipe as described above, e.g., a linear distribution pipe, or a distribution pipe as shown and described with respect to Figs. 1-9. Providing the first material vaporized to the first distribution pipe further comprises providing a pressure of about 10 ^-2 to 10 ^-1 mbar in the first distribution pipe. At block 430, the evaporated material is guided through one or more of the plurality of first nozzles in the first distribution pipe housing. Typically, one or more of the plurality of first nozzles have an opening length and an opening size, wherein guiding the evaporated material through one or more nozzles is equivalent to 2: 1 Further comprising guiding the vaporized material through one or more nozzles having a length-to-size ratio that is greater than or equal to the length-to-size ratio. According to some embodiments, the nozzles to which the vaporized material is guided may be nozzles as described in the above embodiments. In one example, the nozzle can be screwable to the distribution pipe housing. In an embodiment that may be combined with other embodiments described herein, the nozzle may comprise a material that is chemically inert with respect to the evaporated organic material, such as the nozzles shown in Figures 7A-7D. According to some embodiments, the nozzles may be part of a distribution pipe as illustrated and described with respect to Figures 9A and 9B by way of example.

[00102] At block 440, the evaporated material is discharged into the chamber volume toward the substrate at the chamber volume. Typically, the chamber volume provides a pressure of about 10 ^-5 to 10 ^-7 mbar, more typically about 10 ^-6 to about 10 ^-7 . For example, the vacuum chamber may include pumps, seals, etc., to evacuate the chamber to a pressure of about 10 ^-5 to 10 ^-7 mbar, and to maintain pressure in the vacuum chamber. In some embodiments, the vapor plume emitted from the nozzles may have a distribution such as cos ⁶ . According to some embodiments described herein, a vapor plume with a distribution such as cos ⁶ may provide a smaller shadowing effect than a vapor plume with a distribution such as cos ¹ , for example. The effect is shown, for example, in Figs. 3A to 3C. Due to the distribution such as cos ⁶ of the evaporated material, the uniformity of the material deposition on the substrate, as well as the accuracy of the deposition can be increased.

[00103] According to some embodiments, the method includes providing a second material evaporator using a second material evaporator at a chamber volume, providing a second evaporated material to a second distribution pipe comprising a second distribution pipe housing . According to some embodiments, the second material may be the same material as the first material. In other embodiments, the second material is different from the first material. In some embodiments, the second distribution pipe may be a distribution pipe as described above. Typically, the second distribution pipe is in fluid communication with the second material evaporator, and providing the second vaporized material to the second distribution pipe provides a pressure of about 10 ^-2 to 10 ^-1 mbar in the second distribution pipe . In order to provide and maintain pressure in the dispensing pipe, pumps, seals, sluices, etc. may be provided in the vacuum chamber and / or material deposition arrangement. The method may further include guiding the evaporated material through one or more of the plurality of second nozzles in the second distribution pipe housing. In some embodiments, the first evaporated material and the second evaporated material may each have, at a distance of less than 30 mm, one or more first nozzles of the first distribution pipe and one or more of the second distribution pipes And is guided through the second nozzles in excess thereof. Distances of less than 30 mm may allow for precise deposition of different evaporated materials on the substrate, for example for production of OLED displays and the like.

[00104] According to embodiments that may be combined with other embodiments described herein, the first evaporated material may be parallel to the second dispensing direction of one or more second nozzles of the second distribution pipe Or from one or more first nozzles of the first distribution pipe, with a first dispense having a deviation of up to 5 degrees from a parallel arrangement. A parallel arrangement of dispensing directions may allow for defined deposition and mixing characteristics of different evaporated materials resulting from different material sources.

[00105] In yet further embodiments, which may be combined with other embodiments described herein, one or more of the nozzles of at least one of the first and second distribution pipes may be chemically Inactive material. The vaporized material passing through the nozzle containing an inert material (e.g., an inert material as a coating of the nozzle opening) is not affected by the nozzle material and remains in the desired state. For example, the composition of the evaporated material remains the same before and after the nozzle. In one example, the direction, flow rate, and pressure may nevertheless be unaffected by the nozzle.

[00106] In some embodiments, the method includes heating the dispensing pipe at or above the evaporation temperature of the material to be deposited on the substrate. Heating of the distribution pipe can be performed by heating devices. In one example, the performance of the heating devices is supported by thermal shields, for example as described above with respect to Figures 8A-8C.

[00107] According to some embodiments, use of a material deposition arrangement as described herein, and / or use of a distribution pipe as described herein, is provided.

While the foregoing is directed to some embodiments, other and further embodiments may be devised without departing from the basic scope thereof, and the scope of the present invention is determined by the claims that follow.

Claims (25)

A material deposition arrangement (100) for depositing a vaporized material on a substrate (121) in a vacuum chamber (110)
A first material source 100a; And
The second material source 100b,
/ RTI >
The first material source (100a)
A first material evaporator (102a) configured to evaporate a first material to be deposited on the substrate (121);
A first distribution pipe (106a) comprising a first distribution pipe housing (116), said first distribution pipe being in fluid communication with said first material evaporator; And
A plurality of first nozzles 712 in the first distribution pipe housing 116,
Lt; / RTI >
Wherein one or more of the plurality of first nozzles includes an aperture length (714) and an aperture size (716), wherein a length to size ratio of one or more of the plurality of first nozzles 2: 1, < / RTI >
The second material source (100b)
A second material evaporator (102b) configured to evaporate a second material to be deposited on the substrate;
A second distribution pipe (106b) comprising a second distribution pipe housing, said second distribution pipe being in fluid communication with said second material evaporator; And
A plurality of second nozzles 712 in the second distribution pipe housing,
/ RTI >
Wherein a distance (200) between a first one of the plurality of first nozzles and a second one of the plurality of second nozzles is equal to or less than 30 mm,
Material Deposition Arrangement. The method according to claim 1,
Wherein a distance (200) between a first one of the plurality of first nozzles and a second one of the plurality of second nozzles is a horizontal distance,
Material Deposition Arrangement. 3. The method according to claim 1 or 2,
The distance between the first distribution pipe 106a and the second distribution pipe 106b is equal to or less than 30 mm,
Material Deposition Arrangement. 4. The method according to any one of claims 1 to 3,
A distance (200) between a first one of the plurality of first nozzles and a second one of the plurality of second nozzles is between a first central point of the first nozzle and a second central point of the second nozzle ,
Material Deposition Arrangement. 5. The method according to any one of claims 1 to 4,
One or more of the plurality of nozzles (712) of the first distribution pipe (106a) are configured to provide a first dispensing direction (210), and the plurality of nozzles One or more of the nozzles 712 are configured to provide a second dispensing direction 211 and the first dispensing direction 210 and the second dispensing direction 211 are arranged to be parallel Or arranged in a deviation of up to 5 [deg.] From a parallel arrangement,
Material Deposition Arrangement. A material deposition arrangement (100) for depositing a vaporized material on a substrate (121) in a vacuum chamber (110)
A first material source 100a; And
The second material source 100b,
/ RTI >
The first material source (100a)
A first material evaporator (102a) configured to evaporate a first material to be deposited on the substrate (121);
A first distribution pipe (106a) comprising a first distribution pipe housing (116), said first distribution pipe (106a) being in fluid communication with said first material evaporator (102a); And
A plurality of first nozzles 712 in the first distribution pipe housing 116,
/ RTI >
Wherein one or more of the plurality of first nozzles includes an aperture length 714 and an aperture size 716 and is configured to provide a first dispense direction 210, The length to size ratio of one or more of the nozzles is equal to or greater than 2: 1,
The second material source (100b)
A second material evaporator (102b) configured to evaporate a second material to be deposited on the substrate (121);
A second distribution pipe (106b) comprising a second distribution pipe housing (116), said second distribution pipe (106b) being in fluid communication with said second material evaporator (102b); And
A plurality of second nozzles 712 in the second distribution pipe housing 116,
/ RTI >
One or more of the second nozzles are configured to provide a second dispense direction 211,
Wherein a first dispensing direction (210) of one or more of the plurality of first nozzles (712) and a second dispensing direction of one or more of the plurality of second nozzles (712) (211) are arranged parallel to one another, or arranged with deviations of up to 5 [deg.] From a parallel arrangement,
Material Deposition Arrangement. The method according to claim 6,
The first evaporation direction 210 corresponds to the longitudinal direction of one or more of the plurality of first nozzles 712 of the first distribution pipe 106a, Corresponding to the longitudinal direction of one or more of the plurality of second nozzles 712 of the second distribution pipe 106b,
Material Deposition Arrangement. 8. The method according to claim 6 or 7,
The first evaporation direction 210 is defined by the average evaporation direction of the plume of evaporated material discharged from one or more of the plurality of first nozzles 712 of the first distribution pipe 106a And the second evaporation direction 211 corresponds to an average evaporation of the plume of evaporated material discharged from one or more of the plurality of second nozzles 712 of the second distribution pipe 106b, ≪ / RTI >
Material Deposition Arrangement. 9. The method according to any one of claims 6 to 8,
Wherein a distance between a first one of the plurality of first nozzles and a second one of the plurality of second nozzles is equal to or less than 30 mm,
Material Deposition Arrangement. 10. The method according to any one of claims 1 to 9,
One or more of the plurality of nozzles (712) of at least one of the first distribution pipe (106a) and the second distribution pipe (106b) comprises a chemically inert material for the evaporated organic material doing,
Material Deposition Arrangement. A distribution pipe (106a; 106b; 106c) for depositing evaporated material on a substrate (121) in a vacuum chamber (110)
A distribution pipe housing 116; And
The nozzle 712 in the distribution pipe housing 116,
/ RTI >
The nozzle 712 includes an opening 713 having an opening length 714 and an opening size 716,
The length to size ratio of the nozzle is equal to or greater than 2: 1,
The nozzle 712 includes a chemically inert material for the evaporated organic material.
Distribution pipe. 12. The method of claim 11,
Wherein the chemically inert material for the evaporated organic material is chemically inert at a temperature of at most < RTI ID = 0.0 > 650 C. <
Distribution pipe. 13. The method according to claim 11 or 12,
The inner side of the opening 713 of the nozzle 712 is coated with a chemically inert material for the evaporated organic material,
Distribution pipe. 14. The method according to any one of claims 11 to 13,
Wherein the chemically inert material for the evaporated organic material is selected from the group consisting of stainless steel, quartz glass, titanium, tantalum, Nb, and DLC.
Distribution pipe. A material deposition arrangement (100) for depositing vaporized materials on a substrate (121) in a vacuum chamber (110)
A first material source 100a; And
The second material source 100b,
/ RTI >
The first material source (100a)
A first material evaporator (102a) configured to evaporate a first material to be deposited on the substrate (121); And
The distribution pipe (106a, 106b, 106c) according to any one of claims 11 to 14, being a first distribution pipe (106a) of the material deposition arrangement (100)
Lt; / RTI >
The distribution pipe 106a is in fluid communication with the first material evaporator 102a,
The second material source (100b)
A second material evaporator (102b) configured to evaporate a second material to be deposited on the substrate (121);
A second distribution pipe (106b) comprising a distribution pipe housing (116), said second distribution pipe (106b) being in fluid communication with said second material evaporator (102b); And
A plurality of second nozzles 712 in the second distribution pipe housing 116,
/ RTI >
The distance 200 between the nozzle of the first distribution pipe 106a and the second one of the plurality of second nozzles of the second distribution pipe 106b is equal to or less than 30 mm,
Wherein a nozzle 712 of the first distribution pipe 106a is configured to provide a first dispense direction 210 and a second nozzle 712 of a plurality of second nozzles of the second dispense pipe 106b And wherein the first dispensing direction (210) and the second dispensing direction (211) are arranged parallel to each other, or a deviation of up to 5 degrees from a parallel arrangement Lt; / RTI >
Material Deposition Arrangement. 16. The method according to any one of claims 1 to 15,
The length to size ratio is dimensionless,
Material Deposition Arrangement. 17. The method according to any one of claims 1 to 16,
The size 716 of the opening 713 of the nozzle 712 is defined by the minimum dimension of the cross-
Material Deposition Arrangement. 18. The method according to any one of claims 1 to 17,
At least one of the first distribution pipe 106a of the first material source 100a and the second distribution pipe 106b of the second material source 100b is a distribution pipe for the evaporated organic material,
Material Deposition Arrangement. 19. The method according to any one of claims 1 to 18,
The nozzle 712 having a length to size ratio of at least 2: 1 forms a vapor plume of the cos ⁶ shape of the evaporated organic material,
Material Deposition Arrangement. As the vacuum deposition chamber 110,
20. A material deposition arrangement (100) as claimed in any one of claims 1 to 19; And
A substrate support 126 for supporting the substrate 121 during deposition,
/ RTI >
Wherein a distance between at least one of the distribution pipes (106a, 106b, 106c) of the material deposition arrangement (100) and the substrate support (126)
Vacuum deposition chamber. 21. The method of claim 20,
Further comprising a pixel mask (132) between the substrate support (126) and the material deposition arrangement (100)
Vacuum deposition chamber. 22. The method of claim 21,
The pixel mask 132 includes pixel apertures having a size of 50 [mu] m x 50 [mu] m or less.
Vacuum deposition chamber. 23. The method according to any one of claims 20 to 22,
The material deposition arrangement 100 is movable within the vacuum deposition chamber 110,
Vacuum deposition chamber. 1. A method for depositing a vaporized material on a substrate (121) in a vacuum deposition chamber (110) having a chamber volume,
Evaporating the first material by a first material evaporator (102a) arranged in the chamber volume;
Providing a vaporized first material to a first distribution pipe (106a) comprising a first distribution pipe housing (116), the first distribution pipe (106a) being in fluid communication with the first material vaporizer (102a) Wherein providing the first material vaporized to the first distribution pipe comprises providing a pressure of about 10 ^-2 to 10 ^-1 mbar in the first distribution pipe 106a;
Guiding the vaporized material through one or more of a plurality of first nozzles (712) in the first distribution pipe housing (116), wherein one or more of the plurality of first nozzles The nozzles include an opening length 714 and an opening size 716 and the step of guiding the vaporized material through the one or more nozzles 712 may be performed at a temperature equal to or greater than 2: Comprising: guiding the vaporized material through one or more nozzles having a length to size ratio; And
Releasing the vaporized material to the chamber volume toward the substrate (121) in the chamber volume
/ RTI >
The chamber volume to provide from about 10 ^-5 to 10 ^-7 mbar pressure,
A method for depositing a vaporized material. 25. The method of claim 24,
Evaporating a second material in the chamber volume by a second material evaporator 102b;
Providing a second vaporized material to a second distribution pipe (106b) comprising a second distribution pipe housing (116), the second distribution pipe (106b) being in fluid communication with the second material vaporizer (102b) Wherein providing the second vaporized material to the second distribution pipe comprises providing a pressure of about 10 ^-2 to 10 ^-1 mbar in the second distribution pipe; And
Guiding the vaporized material through one or more of a plurality of second nozzles (712) in the second distribution pipe housing (116)
Further comprising:
The first evaporated material and the second evaporated material are disposed at a distance of less than 30 mm from one or more first nozzles of the first distribution pipe 106a and the second nozzles of the second distribution pipe 106b , And / or < / RTI >
The first evaporated material may have a deviation of up to 5 [deg.] From a parallel or parallel arrangement with respect to a second dispensing direction 211 of one or more second nozzles of the second distribution pipe 106b In a first dispensing direction 210 with one or more first nozzles of the first distribution pipe 106a and /
Wherein one or more of the nozzles of at least one of the first distribution pipe (106a) and the second distribution pipe (106b) comprises a chemically inert material for the evaporated organic material,
A method for depositing a vaporized material.

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