CN103966554B - Vacuum deposition apparatus and vacuum deposition method - Google Patents
Vacuum deposition apparatus and vacuum deposition method Download PDFInfo
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- CN103966554B CN103966554B CN201410037012.1A CN201410037012A CN103966554B CN 103966554 B CN103966554 B CN 103966554B CN 201410037012 A CN201410037012 A CN 201410037012A CN 103966554 B CN103966554 B CN 103966554B
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- nozzle arrangement
- evaporation material
- opening portion
- evaporation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
Abstract
The present invention provides the vacuum deposition apparatus and vacuum deposition method for the thickness isotropism that can improve organic EL films entirety.Vacuum deposition apparatus includes：Guiding channel conveys the evaporation material obtained using evaporation source；And release component, to the evaporation material flowed into from guiding channel by the release of vapor deposition component.Release component includes：Dispersion cup (7) is used for diffusive evaporation material；And multiple nozzle arrangements (8), direction are provided projectingly by vapor deposition component, and have for by the contraction opening portion of vapor deposition component release evaporation material in front end.Each nozzle arrangement (8) has the diameter (D ') of the length (L) and contraction opening portion (8a) of the interior diameter (D) of nozzle arrangement (8), nozzle arrangement (8).Release component has the device (13) of the flow for the evaporation material for adjusting each nozzle arrangement (8), so that the flow of the evaporation material of each nozzle arrangement (8) is specified value.The diameter (D ') (mm) of the interior diameter (D) (mm) of nozzle arrangement (8), the length (L) (mm) of nozzle arrangement (8) and contraction opening portion meets relational expression：L >=9D and D '≤2.7D2/ L or L<9D and D '≤D/3.
Description
Technical field
The present invention relates to the vacuum deposition apparatus and vacuum that are used to form organic EL (Electro Luminescence) film
Evaporation coating method.
Background technology
The previous vacuum deposition apparatus for being used to form organic EL films includes：Evaporation source is obtained for heating evaporation material
To evaporation material；Guiding channel conveys the evaporation material obtained using evaporation source；And release component, it is released to by vapor deposition component
Put the evaporation material flowed into from guiding channel (referring for example to patent document 1).
Above-mentioned release component includes：Dispersion cup is used for diffusive evaporation material；And multiple nozzle arrangements, towards quilt
Vapor deposition component is provided projectingly, and is had for by the contraction opening portion of vapor deposition component release evaporation material in front end.
As the method for the isotropism for improving film thickness, can enumerate the diameter of the contraction opening portion by changing each nozzle come
Adjust the amount from each nozzle arrangement to the evaporation material discharged by vapor deposition component.
Patent document 1：Japanese Laid-Open Patent Publication 2007-332458
But have from each nozzle arrangement to the amount of the evaporation material discharged by vapor deposition component and diffusion because of nozzle structure
The diameter of the contraction opening portion of part and simultaneously significantly change the case where, film thickness is simultaneously by the amount and diffusion of evaporation material
It influences and changes.Therefore, it is difficult to accurately be adjusted from each simultaneously by the diameter for the contraction opening portion for changing each nozzle arrangement
Nozzle arrangement is to the amount and diffusion for evaporating material discharged by vapor deposition component, to be difficult the thickness equalization for improving film entirety
Property.
Invention content
Therefore, the purpose of the present invention is to provide vacuum deposition apparatus and vacuum deposition method, can accurately adjust from each
Nozzle arrangement is to the amount and diffusion for evaporating material discharged by vapor deposition component, to which the thickness for improving organic EL films entirety is equal
Etc. property.
The present invention provides a kind of vacuum deposition apparatus comprising：Evaporation source, heating are used to form the vapor deposition material of organic EL films
Expect to obtain evaporation material；Guiding channel conveys the evaporation material obtained using the evaporation source；And release component, to quilt
Vapor deposition component discharges the evaporation material flowed into from the guiding channel, and the release component includes：Dispersion cup, for spreading
State evaporation material；And multiple nozzle arrangements, it is provided projectingly towards described by vapor deposition component, and have for described in front end
The contraction opening portion of evaporation material is discharged by vapor deposition component, the inside of the nozzle arrangement forms the stream for making evaporation material circulate
Road, the runner are shunk by the contraction opening portion in the front end of the nozzle arrangement, wherein each nozzle arrangement has
The interior diameter D (mm) of nozzle arrangement, the length L (mm) of nozzle arrangement and the diameter D ' (mm) for shrinking opening portion, the nozzle structure
The interior diameter D (mm) of part, the length L (mm) of the nozzle arrangement and the diameter D ' (mm) for shrinking opening portion meet relationship
Formula：L >=9D and D '≤2.7D2/ L or L<9D and D '≤D/3, the release component have with the evaporation in each nozzle arrangement
The flow of material adjusts the device of the flow of the evaporation material in each nozzle arrangement as the mode of specified value.
Also, the present invention provides a kind of vacuum deposition method, uses vacuum deposition apparatus, the vacuum deposition apparatus packet
It includes：Evaporation source, heating are used to form the evaporation material of organic EL films and obtain evaporation material；Guiding channel conveys described in utilizing
The evaporation material that evaporation source obtains；And release component, to the evaporation material flowed into from the guiding channel by the release of vapor deposition component
Material, the release component include：Dispersion cup, for spreading the evaporation material；And multiple nozzle arrangements, towards the quilt
Vapor deposition component be provided projectingly, and front end have for it is described by vapor deposition component discharge evaporation material contraction opening portion, institute
The inside for stating nozzle arrangement forms the runner for making evaporation material circulate, and the runner is by the contraction opening portion in the nozzle
It the front end of component shrinks, wherein each nozzle arrangement used has the interior diameter D (mm) of nozzle arrangement, nozzle arrangement
Length L (mm) and the diameter D ' (mm) for shrinking opening portion, the interior diameter D (mm) of the nozzle arrangement, the length of the nozzle arrangement
Degree L (mm) and the diameter D ' (mm) for shrinking opening portion meet relational expression：L >=9D and D '≤2.7D2/ L or L<9D and D '
≤ D/3 adjusts the evaporation material in each nozzle arrangement in such a way that the flow of the evaporation material in each nozzle arrangement becomes specified value
The flow of material.
According to the present invention, it is capable of providing following vacuum deposition apparatus and vacuum deposition method, can accurately be adjusted from each
Nozzle arrangement is to the amount and diffusion for evaporating material discharged by vapor deposition component, to which the thickness for improving organic EL films entirety is equal
Etc. property.
Description of the drawings
Fig. 1 is to indicate (the length L of nozzle arrangement) × (the diameter D ' for shrinking opening portion)/(interior diameter D of nozzle arrangement)2
With cosnThe figure of relationship between the n values of θ rules.
Fig. 2 is to indicate and (shrink the diameter D ' of opening portion)/(the interior diameter D of nozzle arrangement) and cosnBetween the n values of θ rules
The figure of relationship.
Fig. 3 is to indicate L=30mm, D=7mm, D '=2mm when from shrink opening portion discharge evaporation material angular distribution
Figure.
Fig. 4 is to indicate L=30mm, D=7mm, D '=4mm when from shrink opening portion discharge evaporation material angular distribution
Figure.
Fig. 5 is the brief configuration figure for the vacuum deposition apparatus for indicating one embodiment of the present invention.
Fig. 6 is the cross-sectional view of a main portion near the nozzle arrangement for the release component for being exaggerated vacuum deposition apparatus shown in fig. 5.
Fig. 7 is to indicate that the mian part of the state of each nozzle arrangement of vacuum deposition apparatus shown in fig. 5 in flow measurement is cutd open
View.
Fig. 8 is near the nozzle arrangement of the release component for the vacuum deposition apparatus for being exaggerated other embodiment of the present invention
Cross-sectional view of a main portion.
Fig. 9 is the sectional view shunk near opening portion for being exaggerated nozzle arrangement shown in fig. 6.
Reference sign
1 vacuum deposition apparatus
2 evaporation materials
3 crucibles
4 guiding channels
5 substrates
5a substrate carriers
6 release components
7 manifolds
8 nozzle arrangements
8a shrinks opening portion
9 container for evaporation
10 heaters
11 gates
12 film thickness detection sensors
13 needle-valves
14 film thickness detection sensors
15 dividing walls
23 shutters
23a rotary shafts
Specific implementation mode
The present invention vacuum deposition apparatus include：Evaporation source, will be used to form organic EL films evaporation material heating to
Obtain evaporation material；Guiding channel conveys the evaporation material obtained using evaporation source；And release component, it will be from guiding channel
The evaporation material of inflow is discharged to by vapor deposition component.Release component includes：Dispersion cup is used for diffusive evaporation material；And it is more
A nozzle arrangement, direction are provided projectingly by vapor deposition component, and are had for discharging evaporation material to by vapor deposition component in front end
Shrink opening portion.
Multiple nozzle arrangements used in the vacuum deposition apparatus of the present invention have shape and size substantially identical to each other.
Multiple nozzle arrangements both can be configured to a row can also configure multiple row side by side.
Above-mentioned vapor deposition carries out under vacuum conditions.As long as nozzle arrangement direction is provided projectingly i.e. by vapor deposition component as a result,
Can, it can be for example horizontally oriented or upper and lower directions from nozzle arrangement to the direction for being discharged evaporation material by vapor deposition component.
Each nozzle arrangement has the interior diameter D (mm) of nozzle arrangement, the length L (mm) of nozzle arrangement and contraction opening portion
Diameter D ' (mm).The length L of nozzle arrangement refers to the length of the inside of nozzle arrangement.Such as the case where shown in Fig. 6 device
Under, the length L of nozzle arrangement refers to axial direction indicated by the L in Fig. 6, in the inside of nozzle arrangement 8 along nozzle arrangement 8
Length dimension.
Also, the interior diameter D (mm) of nozzle arrangement, the length L (mm) of nozzle arrangement and the diameter D ' for shrinking opening portion
(mm) meet following relationship (1)：
L >=9D and D '≤2.7D2/ L or L<9D and D '≤D/3.
Above-mentioned formula (1) is to be directed to be used to form obtained from the organic material of organic EL films.Meeting above-mentioned formula (1)
When (L × D '/D shown in Fig. 1 (when L >=9D)2More than 0 and it is 2.7 regions below or Fig. 2 (L<When 9D) shown in D '/D
More than 0 and it is 1/3 region below), evaporate material from the contractions opening portion of each nozzle arrangement to what is discharged by vapor deposition component
Diffusion defers to cosnθ rules.That is, by cosnθ curve approximations.At this moment, from the steaming of each nozzle arrangement shunk opening portion and discharged
Hair material is fully accumulated to by the diffusion into the surface of vapor deposition component, therefore can improve the isotropism of film thickness.As shown in Figure 1,
In L >=9D, in L × D '/D2More than 0 and it is cos in 2.7 regions belownThe n values of θ rules are about 4~4.25.Also,
As shown in Fig. 2, in L<When 9D, in the region of D '≤D/3, cosnThe n values of θ rules are about 4.05~4.25.
cosnThe n values of θ rules are smaller, and material is easier is accumulated to by the diffusion into the surface of vapor deposition component for evaporation, and can
Improve the isotropism of film thickness.It is preferred that cosnThe n values of θ rules are about 4~4.1, in order to further increase the equalization of film thickness
Property, in L >=9D, D '≤2D2/L.It is preferred that cosnThe n values of θ rules are about 4.05~4.1, in order to further increase film
Thick isotropism, in L<When 9D, D '≤0.2D.
From the viewpoint of the dimensional accuracy of diameter D ' for shrinking opening portion, the diameter D ' for shrinking opening portion is, for example, 1mm
More than.
If L >=9D and D '>2.7D2/ L or L<9D and D '>D/3, then from the contraction opening portion of each nozzle arrangement to quilt
The diffusion of the evaporation material of vapor deposition component release does not defer to cosnθ rules.Therefore, from the contraction opening portion of each nozzle arrangement
The evaporation material of release is insufficient to be accumulated to by the diffusion into the surface of vapor deposition component.As a result, evaporation material stacking is in being steamed
Plating the amount in the region opposite with the contraction opening portion of each nozzle arrangement of component becomes excessive, and the isotropism of film thickness declines.
Here, from an example for the angular distribution for shrinking the evaporation material that opening portion discharges when Fig. 3 indicates to meet formula (1).Fig. 4
From an example for the angular distribution for shrinking the evaporation material that opening portion discharges when foot formula (1) with thumb down.Horizontal axis in figure indicates to steam
Rotation angle of the material from the nozzle center for shrinking opening portion is sent out, the longitudinal axis indicates releasing for evaporation material corresponding with rotation angle
High-volume.Solid line in figure is cosnθ curves, stain indicate the amount of evaporation material corresponding with each rotation angle.
Rotation angle refers to, in the case of Fig. 5 and device shown in fig. 6, opening portion is shunk in shown in Fig. 9 being exaggerated
In sectional view near 8a, evaporation material 2 is from the contraction opening portion 8a of nozzle arrangement 8 respectively to the direction (side of substrate 5 on just
To) left and right extension angle, θ.Rotation angle θ maximums are 90 °.Such as it refers to evaporating material 2 from spray that rotation angle θ, which is 45 °,
The contraction opening portion 8a of nozzle member 8 extends 45 ° of angle, i.e. substantially with 90 ° of angle to the left and right in the direction on just respectively
From opening portion 8a is shunk evaporation material 2 is discharged to substrate 5.
Fig. 3 indicates the case where L=30mm, D=7mm, D '=2mm, in L<Meet D '≤D/3 when 9D.At this moment, such as Fig. 3 institutes
Show, has obtained along cosnThe angular distribution of θ curves.On the other hand, Fig. 4 indicates the feelings of L=30mm, D=7mm, D '=4mm
Condition, in L<D '≤D/3 is unsatisfactory for when 9D.At this moment, as shown in figure 4, region small near than rotation angle for 20 °, obtains
From cosnThe angular distribution that θ curves substantially deviate.
Fig. 3 and Fig. 4 is indicated in L<From an example for the angular distribution for shrinking the evaporation material that opening portion discharges when 9D, but
Tendency identical with Fig. 3 and Fig. 4 is also illustrated that when L >=9D.Specifically, meeting D '≤2.7D in L >=9D2In the case of/L,
As shown in figure 3, having been obtained and cos in all regionsnThe angular distribution of curve approximation.D '≤2.7D is unsatisfactory in L >=9D2/
In the case of L, as shown in figure 4, having been obtained from cos in the small region of rotation anglenThe angular distribution that θ curves substantially deviate.
When the size of the size ratio D of L is sufficiently large, evaporates the probability that the molecule of material is collided with nozzle inner walls and get higher.Cause
This, becomes difficult from the molecule for shrinking opening portion release evaporation material, and in point from the evaporation material for shrinking opening portion release
In son, the ratio along the molecule of the evaporation material of the direction release of the inner wall of nozzle increases.That is, from nozzle contraction opening portion
In the molecule of the evaporation material of release, the ratio of the molecule of the evaporation material discharged towards nozzle surface increases.As a result,
The indiffusible tendency of evaporation material by shrinking opening portion release becomes larger.It is more apparent that nozzle becomes the longer tendency.
In this regard, in the present invention, even if can be by making contraction open if in value sufficiently large L >=9D of the value ratio D of L
The diameter D ' of oral area is small to arrive 2.7D2The ratio of the molecule for the evaporation material that/L or less collides to increase with contraction opening portion, with
Make from the evaporation material diffusion shunk opening portion and discharged, to make the diffusion of evaporation material close to cosnθ curves.
Even if when use meets above-mentioned formula (1) and has multiple nozzle arrangements of same shape and size,
Also because of the configuration mode of multiple nozzle arrangements of dispersion cup, the link position of guiding channel and dispersion cup, dispersion cup
The amount of shape etc., the evaporation material discharged has differences between each nozzle arrangement.
Therefore, in the vacuum deposition apparatus of the present invention, using including the release component of above-mentioned nozzle arrangement, and it is arranged
The device of the flow of the evaporation material in each nozzle arrangement is adjusted so that the flow of the evaporation material in each nozzle arrangement is regulation
Value.Such as setting can adjust each nozzle dispersion cup side base portion near extent of opening mechanism (such as needle-valve or
The shutter that can be slided), as above-mentioned device.
The defined flow adjusted to each nozzle arrangement is set, to reduce above-mentioned difference.For example, meeting in use above-mentioned
Formula (1) and when multiple nozzle arrangements with same shape and size, before actually using device, in advance to
It is simulated in the film thickness distribution for reducing above-mentioned difference, thus obtains defined flow.By synthesizing from each nozzle arrangement
It shrinks opening portion and obtains amount from film thickness distribution to the evaporation material that is discharged by vapor deposition component and diffusion.
Can by using the nozzle arrangement (size of diameter for shrinking opening portion is fixed) for meeting above-mentioned formula (1), and
The flow inside each nozzle arrangement is adjusted, accurately to adjust from the contraction opening portion of nozzle arrangement to being discharged by vapor deposition component
Evaporate the amount and diffusion of material.As a result, can greatly improve by vapor deposition component surface accumulation evaporation material and
The thickness isotropism of the film entirety of formation.In the present invention, it can be obtained in the state of fixing release component and by vapor deposition component
To substantially uniform film.
The device that the amount for measuring the evaporation material discharged from each nozzle arrangement can be used for example, to be confirmed whether nozzle
The flow of component is adjusted to value based on simulation.Preferably, the dress of the amount of the evaporation material discharged from each nozzle arrangement is measured
Set the film thickness detecting device of the thickness for the evaporation film for being the surface for measuring the outlet (shrinking opening portion) for being formed in nozzle arrangement.
Film thickness detecting device can enumerate the film thickness detection sensor of quartz vibrator type.Film thickness detection sensor is respectively arranged at each nozzle
The surface of the outlet (shrinking opening portion) of component.The device for the thickness for measuring evaporation film is removed in actual use.
The vacuum deposition method of the present invention is the method for having used vacuum deposition apparatus, and vacuum deposition apparatus includes：Evaporation
Source, heating are used to form the evaporation material of organic EL films to obtain evaporation material；Guiding channel, conveying are obtained using evaporation source
Evaporation material；And release component, to the evaporation material flowed into from guiding channel by the release of vapor deposition component.Release component packet
It includes：Dispersion cup is used for diffusive evaporation material；And multiple nozzle arrangements, direction are provided projectingly by vapor deposition component, and in front end
With for by the contraction opening portion of vapor deposition component release evaporation material.
Also, each nozzle arrangement uses the nozzle arrangement used in the vacuum deposition apparatus of the above-mentioned present invention.And
And the device of the flow using the evaporation material in each nozzle arrangement of adjustment in the vacuum deposition apparatus of the above-mentioned present invention,
Carry out the adjustment of the flow of the evaporation material in each nozzle arrangement.
Thereby, it is possible to easily and accurately adjust from the contraction opening portion for the multiple nozzle arrangements for being set to dispersion cup to
The amount and diffusion of the evaporation material discharged by vapor deposition component.As a result, can be significantly increased by vapor deposition component
Surface accumulation evaporation material and the thickness isotropism of film entirety formed.
Preferably, it based on measurement result obtained from the amount for measuring the evaporation material discharged from each nozzle arrangement, carries out
The flow adjustment of above-mentioned evaporation material.The defined stream acquired thereby, it is possible to be adjusted to advance with the simulation of film thickness distribution
Amount.
Preferably, the thickness of the evaporation film based on the surface for measuring the outlet (shrinking opening portion) for being formed in nozzle arrangement
Measurement result obtained from degree carries out the measurement of the amount of above-mentioned evaporation material.It can be by using the film thickness of quartz vibrator type
Film thickness detecting device as detection sensor etc. measures the thickness of evaporation film, is discharged from nozzle arrangement to easily find out
Evaporate the amount of material.
Here, being illustrated referring to figure 5 and figure 6 to an embodiment of the vacuum deposition apparatus of the present invention.
As shown in figure 5, vacuum deposition apparatus 1 includes：As the crucible 3 of evaporation source, heating is used to form organic EL films
Evaporation material 2 and obtain evaporation material；Guiding channel 4 conveys the evaporation material obtained using crucible 3；And release component 6,
The evaporation material flowed into from guiding channel 4 is discharged to as by the substrate 5 of vapor deposition component.Release component 6 includes：As dispersion
The generally cylindrical manifold 7 of container is used for diffusive evaporation material；And multiple nozzle arrangements 8, it is provided projectingly towards substrate 5.
In addition, vacuum deposition apparatus 1 includes：Substrate carrier 5a, for keeping substrate 5；Heater 10, as to being put into
The device that the crucible 3 of evaporation material 2 is heated；Gate 11, as to the release evaporation material from each nozzle arrangement 8 to substrate 5
The device that is switched of path；And film thickness detection sensor 12, as the evaporation film (manufacture to being formed in 5 surface of substrate
Organic EL films) the device that measures of thickness.The above-mentioned various member of formation for constituting vacuum deposition apparatus 1 are accommodated in
In container for evaporation 9.Vacuum deposition apparatus 1 is connected with the depassing unit for making the inside of container for evaporation 9 become vacuum state.It removes
Device of air is for example using vacuum pump.
As shown in fig. 6, multiple nozzle arrangements 8 are equally spaced configured to a row along the axial direction of generally cylindrical manifold 7.
Each nozzle arrangement 8 has the contraction opening portion 8a for discharging evaporation material to substrate 5 in front end.Multiple nozzle arrangements 8 have
Shape and size substantially identical to each other.The shape of each nozzle arrangement 8 shrinks the shape of opening portion 8a in big in substantially cylindrical shape
It causes round.Each nozzle arrangement 8 has the diameter of the interior diameter D of nozzle arrangement 8, the length L of nozzle arrangement 8 and contraction opening portion 8a
D’。
The interior diameter D (mm) of nozzle arrangement 8, the length L (mm) of nozzle arrangement 8 and the diameter D ' (mm) for shrinking opening portion 8a
Meet following relationship (1)：
L >=9D and D '≤2.7D2/ L or L<9D and D '≤D/3.
It is substantially coniform needle-valve 13 that release component 6, which has front end, as the evaporation material for adjusting each nozzle arrangement 8
Flow device so that each nozzle arrangement 8 evaporation material flow be specified value.More specifically, needle-valve 13 is set respectively
Multiple nozzle arrangements 8 are placed in, and are configured to adjust near the opening of the base portion in 7 side of the dispersion cup of each nozzle arrangement 8
The degree of opening.It configures in this way, can accurately adjust the evaporation material supplied from manifold 7 to the inside of each nozzle arrangement 8
The flow of material.As a result, the diameter for shrinking opening portion 8a can not be changed and accurately adjusted from contraction opening portion 8a releases
Evaporation material amount.
In Fig. 5 and device shown in fig. 6, it is being confirmed whether that the flow by each nozzle arrangement 8 is adjusted to based on simulation
When value, such as shown in Fig. 7, as long as being arranged above for outlet (shrinking opening portion 8a) in each nozzle arrangement 8 is examined as film thickness
Survey the film thickness detection sensor 14 of the quartz vibrator type of device.At this moment, in order not to by discharging from adjacent nozzle arrangement 8
The influence of material is evaporated, the dividing wall 15 for each nozzle arrangement 8 to be isolated is set.Film thickness detection sensor 14 and dividing wall 15 exist
It is arranged when detecting film thickness and removes in actual use.
The concrete example of the vacuum deposition method of the vacuum deposition apparatus described below for having used present embodiment.
Crucible 3 and guiding channel 4 are configured using Fig. 5 and vacuum deposition apparatus shown in fig. 6, and in the central portion of manifold 7.
The length L of each nozzle arrangement 8 is 30mm, and the interior diameter D of each nozzle arrangement 8 is 7mm, and the diameter D ' for shrinking opening portion 8a is 2mm.
The contraction opening portion 8a of nozzle arrangement 8 and the interval of substrate 5 (size is 100mm × 100mm) are 50mm.In release component 6,
16 nozzle arrangements 8 are configured at a prescribed interval.
In advance withEvaporation rate, by film thickness isotropism be ± 3% it is below in a manner of carry out film thickness distribution
Simulation, so as to find out evaporation appropriate burst size of the material from each nozzle arrangement 8.
The simulation of film thickness distribution is for example carried out by following step.
The evaporation material discharged from a nozzle presses cosnθ rules are spread.It finds out and is attached to substrate because of such diffusion
Evaporation material amount, utilize the film thickness distribution that is formed on the surface of the substrate of evaporation material of nozzle release.Such as make
(referring for example to new edition vacuum handbook, ULVAC Co., Ltd. compiles, page 250) acquires film thickness distribution by calculating by known method.
It is directed to the adhesion amount (film thickness distribution) that each nozzle finds out above-mentioned evaporation material respectively.In substrate each section to from each
The adhesion amount that nozzle reaches the evaporation material of substrate is integrated.Find out the integral of the adhesion amount of the evaporation material of substrate each section
The maximum value and minimum value of value, to acquire film thickness isotropism by formula below.
Film thickness isotropism (%)=(maximum value-minimum value)/(maximum value+minimum value) × 100
Also, evaporation burst size of the material from each nozzle is gradually changed, is ± 3% below so as to find out film thickness isotropism
Evaporate the burst size of material.
The film thickness detection sensor for being arranged above quartz vibrator type in the outlet (shrinking opening portion 8a) of nozzle arrangement 8
14, and the isolation board 15 that each nozzle arrangement 8 is isolated is set.
Then, into the crucible 3 of vacuum deposition apparatus 1, input is (following as three (8-hydroxyquinoline) aluminium of evaporation material
Referred to as Alq3).The amount of the evaporation material discharged from each nozzle arrangement 8 is measured using film thickness detection sensor 14.Based on the measurement
As a result, in a manner of as by simulating the defined flow acquired, adjustment is set to the base of the dispersion cup side of nozzle arrangement 8
The needle-valve 13 of opening portion near portion.
Remove the film thickness detection sensor 14 of quartz vibrator type.Later, withEvaporation rate give birth on the substrate 5
At the evaporation film of Alq3.At this moment, the film thickness isotropism of evaporation film can be maintained within ± 3%.
In the present embodiment, the shape of manifold 7 is in substantially cylindric, but the shape of manifold 7 is without being limited thereto.Such as
It can be the generally oblong column either substantially substantially polygonal column such as quadrangle column.
In the present embodiment, multiple nozzle arrangements 8 equally spaced are configured to a row, but multiple nozzle arrangements 8 are matched
It is without being limited thereto to set mode.Such as multiple row can also be arranged side-by-side.
In the present embodiment, the device as the flow for the evaporation material for adjusting each nozzle arrangement 8 has used needle-valve 13,
But needle-valve 13 can also be substituted, and as shown in figure 8, use substantially disk-shaped shutter 23.By making and shutter 23
The rotary shaft 23a rotations of end connection, and shutter 23 is made to slide, to adjust the extent of opening of nozzle arrangement 8.
Also, although substantially disk-shaped shutter 23 has been used in fig. 8, as long as nozzle arrangement can be adjusted
The shape of 8 extent of opening, the shape of shutter 23 can also be it is substantially disk-shaped other than shape.
Claims (3)
1. a kind of vacuum deposition apparatus, including：
Evaporation source, heating are used to form the evaporation material of organic EL films and obtain evaporation material；
Guiding channel conveys the evaporation material obtained using the evaporation source；And
Release component discharges the evaporation material that is flowed into from the guiding channel to by vapor deposition component,
The release component includes：
Dispersion cup, for spreading the evaporation material；And
Multiple nozzle arrangements are provided projectingly towards described by vapor deposition component, and front end have for described by vapor deposition component
The contraction opening portion of release evaporation material,
The inside of the nozzle arrangement forms the runner for making evaporation material circulate,
The runner is shunk by the contraction opening portion in the front end of the nozzle arrangement,
The vacuum deposition apparatus is characterized in that,
Each nozzle arrangement has the diameter of the interior diameter D (mm) of nozzle arrangement, the length L (mm) of nozzle arrangement and contraction opening portion
D ' (mm),
The interior diameter D (mm) of the nozzle arrangement, the length L (mm) of the nozzle arrangement and the diameter D ' for shrinking opening portion
(mm) meet relational expression：
L >=9D and D '≤2.7D2/ L or L<9D and D '≤D/3,
The release component has adjusts each nozzle in such a way that the flow of the evaporation material in each nozzle arrangement becomes specified value
The device of the flow of evaporation material in component.
2. a kind of vacuum deposition method, using vacuum deposition apparatus, the vacuum deposition apparatus includes：
Evaporation source, heating are used to form the evaporation material of organic EL films and obtain evaporation material；
Guiding channel conveys the evaporation material obtained using the evaporation source；And
Release component discharges the evaporation material that is flowed into from the guiding channel to by vapor deposition component,
The release component includes：
Dispersion cup, for spreading the evaporation material；And
Multiple nozzle arrangements are provided projectingly towards described by vapor deposition component, and front end have for described by vapor deposition component
The contraction opening portion of release evaporation material,
The inside of the nozzle arrangement forms the runner for making evaporation material circulate,
The runner is shunk by the contraction opening portion in the front end of the nozzle arrangement,
The vacuum deposition method is characterized in that,
Each nozzle arrangement used has the interior diameter D (mm) of nozzle arrangement, the length L (mm) of nozzle arrangement and contraction opening portion
Diameter D ' (mm), the interior diameter D (mm) of the nozzle arrangement, the length L (mm) of the nozzle arrangement and the contraction opening
The diameter D ' (mm) in portion meets relational expression：
L >=9D and D '≤2.7D2/ L or L<9D and D '≤D/3,
The evaporation material in each nozzle arrangement is adjusted in such a way that the flow of the evaporation material in each nozzle arrangement becomes specified value
Flow.
3. vacuum deposition method according to claim 2, which is characterized in that measure the evaporation material discharged from each nozzle arrangement
The amount of material adjusts the flow of the evaporation material in each nozzle arrangement based on measurement result.
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| CN104617223B (en) * | 2015-02-03 | 2017-12-08 | 京东方科技集团股份有限公司 | Organic light emitting diode device and preparation method thereof and evaporated device |
| JP6543664B2 (en) * | 2017-09-11 | 2019-07-10 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | Vacuum deposition chamber |
| CN108570645B (en) * | 2017-11-30 | 2023-09-29 | 上海微电子装备（集团）股份有限公司 | Vacuum evaporation device, evaporation head thereof and vacuum evaporation method |
| CN108198957B (en) * | 2017-12-29 | 2019-11-12 | 信利（惠州）智能显示有限公司 | Organic light-emitting display device and preparation method thereof |
| CN108754448A (en) * | 2018-05-31 | 2018-11-06 | 昆山国显光电有限公司 | Linear evaporation source, vaporizing-source system and evaporation coating device |
| JP2020176284A (en) * | 2019-04-16 | 2020-10-29 | 株式会社アルバック | Vapor deposition source, vacuum processing apparatus and film deposition method |
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| JP4545010B2 (en) * | 2005-02-18 | 2010-09-15 | 日立造船株式会社 | Vapor deposition equipment |
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