CN103966554A - Vacuum evaporation device and vacuum evaporation method - Google Patents
Vacuum evaporation device and vacuum evaporation method Download PDFInfo
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- CN103966554A CN103966554A CN201410037012.1A CN201410037012A CN103966554A CN 103966554 A CN103966554 A CN 103966554A CN 201410037012 A CN201410037012 A CN 201410037012A CN 103966554 A CN103966554 A CN 103966554A
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- evaporating materials
- nozzle member
- evaporation
- peristome
- nozzle
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
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- Organic Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention provides a vacuum evaporation device and a vacuum evaporation method that can improve overall thickness uniformity of organic EL films. The vacuum evaporation device comprises a guide passageway and a release component. The guide passageway is used for conveying vaporization materials obtained by the vaporization source, and the vaporization materials that inflow from the guide passageway are released to a component to be subjected to evaporation by the release component. The release component comprises a dispersion container (7) which is used for diffusing the vaporization materials, and a plurality of spray nozzle components (8) that protrude toward the component to be subjected to evaporation, wherein the front ends of the spray nozzle components are provided with contractible opening parts that are used for releasing vaporization materials to the component to be subjected to evaporation. Each spray nozzle component (8) has the inner diameter (D) of the spray nozzle component (8), the length (L) of the spray nozzle component (8), and the diameter (D') of the contractible opening parts (8a). The release component is provided with a device (13) used for adjusting the flow of each vaporization material for each spray nozzle component (8), the flow of each vaporization material for each spray nozzle component (8) is set as a specified value; the inner diameter (D) (mm) of the spray nozzle component (8), the length (L) (mm) of the spray nozzle component (8) and the diameter (D') (mm) of the spray nozzle component (8) satisfy the following relation expression of L>/=9D and D'</=2.7D2/L, or L<9D and D'</=D/3.
Description
Technical field
The present invention relates to be used to form vacuum deposition apparatus and the vacuum deposition method of organic EL (Electro Luminescence) film.
Background technology
The vacuum deposition apparatus that is used to form organic EL film in the past comprises: evaporation source, obtains evaporating materials for heating deposition material; Guiding channel, carries the evaporating materials that utilizes evaporation source to obtain; And release component, to discharged the evaporating materials (for example, with reference to patent documentation 1) flowing into from guiding channel by evaporation member.
Above-mentioned release component comprises: dispersion cup, for diffusive evaporation material; And multiple nozzle members, towards being given prominence to and arrange by evaporation member, and have for the contraction peristome to discharged evaporating materials by evaporation member at front end.
As the method for isotropism that improves thickness, can enumerate the diameter of the contraction peristome by changing each nozzle and adjust the amount from each nozzle member to the evaporating materials being discharged by evaporation member.
Patent documentation 1: No. 2007-332458, Japanese Patent Publication communique JP
But, thering is the situation that amount from from each nozzle member to the evaporating materials being discharged by evaporation member and diffusion significantly change because of the diameter of the contraction peristome of nozzle member simultaneously, thickness is subject to the amount of evaporating materials and the impact of diffusion simultaneously and changes.Therefore, the diameter that is difficult to the contraction peristome by changing each nozzle member accurately adjusts amount and the diffusion from each nozzle member to the evaporating materials being discharged by evaporation member simultaneously, thereby is difficult to improve the thickness isotropism of film entirety.
Summary of the invention
Therefore, the object of this invention is to provide vacuum deposition apparatus and vacuum deposition method, can accurately adjust amount from each nozzle member to the evaporating materials being discharged by evaporation member and diffusion from, thereby improve the thickness isotropism of organic EL film entirety.
The invention provides a kind of vacuum deposition apparatus, it comprises: evaporation source, and heating is used to form the deposition material of organic EL film and obtains evaporating materials; Guiding channel, carries the evaporating materials that utilizes described evaporation source to obtain; And release component, to discharged the evaporating materials flowing into from described guiding channel by evaporation member, described release component comprises: dispersion cup, for spreading described evaporating materials; And multiple nozzle members, given prominence to and arrange by evaporation member towards described, and have for being discharged the contraction peristome of evaporating materials to described by evaporation member at front end, wherein, each nozzle member has the length L (mm) of interior diameter D (mm), nozzle member of nozzle member and the diameter D ' that shrinks peristome (mm), and the length L (mm) of the interior diameter D (mm) of described nozzle member, described nozzle member and the diameter D ' of described contraction peristome (mm) meet relational expression: L>=9D and D '≤2.7D
2/ L, or L<9D and D '≤D/3, described release component has the mode that becomes prescribed value with the flow of the evaporating materials in each nozzle member adjusts the device of the flow of the evaporating materials in each nozzle member.
And, the invention provides a kind of vacuum deposition method, it uses vacuum deposition apparatus, and described vacuum deposition apparatus comprises: evaporation source, heating is used to form the deposition material of organic EL film and obtains evaporating materials; Guiding channel, carries the evaporating materials that utilizes described evaporation source to obtain; And release component, to discharged the evaporating materials flowing into from described guiding channel by evaporation member, described release component comprises: dispersion cup, for spreading described evaporating materials; And multiple nozzle members, given prominence to and arrange by evaporation member towards described, and have for being discharged the contraction peristome of evaporating materials to described by evaporation member at front end, wherein, the each nozzle member using has the length L (mm) of interior diameter D (mm), nozzle member of nozzle member and the diameter D ' of contraction peristome (mm), and the length L (mm) of the interior diameter D (mm) of described nozzle member, described nozzle member and the diameter D ' of described contraction peristome (mm) meet relational expression: L>=9D and D '≤2.7D
2/ L, or L<9D and D '≤D/3, the mode that becomes prescribed value with the flow of the evaporating materials in each nozzle member is adjusted the flow of the evaporating materials in each nozzle member.
According to the present invention, following vacuum deposition apparatus and vacuum deposition method can be provided, can accurately adjust amount from each nozzle member to the evaporating materials being discharged by evaporation member and diffusion from, thereby improve the thickness isotropism of organic EL film entirety.
Brief description of the drawings
Fig. 1 represents (length L of nozzle member) × (shrinking the diameter D ' of peristome)/(interior diameter D of nozzle member)
2with cos
nthe figure of relation between the n value of θ rule.
Fig. 2 represents (shrinking the diameter D ' of peristome)/(the interior diameter D of nozzle member) and cos
nthe figure of relation between the n value of θ rule.
Fig. 3 is from shrinking the figure of angular distribution of the evaporating materials that peristome discharges while representing L=30mm, D=7mm, D '=2mm.
Fig. 4 is from shrinking the figure of angular distribution of the evaporating materials that peristome discharges while representing L=30mm, D=7mm, D '=4mm.
Fig. 5 is the brief configuration figure that represents the vacuum deposition apparatus of one embodiment of the present invention.
Fig. 6 has amplified to want portion's sectional view near the nozzle member of release component of the vacuum deposition apparatus shown in Fig. 5.
Fig. 7 be each nozzle member of the vacuum deposition apparatus shown in presentation graphs 5 state in the time of flow measurement want portion's sectional view.
Fig. 8 has amplified to want portion's sectional view near the nozzle member of release component of the vacuum deposition apparatus of other embodiments of the present invention.
Fig. 9 is near the sectional view of contraction peristome that has amplified the nozzle member shown in Fig. 6.
Description of reference numerals
1 vacuum deposition apparatus
2 evaporating materials
3 crucibles
4 guiding channels
5 substrates
5a substrate carrier
6 release components
7 manifolds
8 nozzle members
8a shrinks peristome
9 container for evaporation
10 well heaters
11 gates
12 thickness detecting sensors
13 needle-valves
14 thickness detecting sensors
15 dividing walls
23 shutters
23a turning axle
Embodiment
Vacuum deposition apparatus of the present invention comprises: evaporation source, thus the deposition material heating that is used to form organic EL film is obtained to evaporating materials; Guiding channel, carries the evaporating materials that utilizes evaporation source to obtain; And release component, by the evaporating materials flowing into from guiding channel to being discharged by evaporation member.Release component comprises: dispersion cup, for diffusive evaporation material; And multiple nozzle members, towards being given prominence to and arrange by evaporation member, and have for the contraction peristome to discharged evaporating materials by evaporation member at front end.
Multiple nozzle members that vacuum deposition apparatus of the present invention uses have roughly the same each other shape and size.Multiple nozzle members both can be configured to row also can configure multiple row side by side.
Above-mentioned evaporation carries out under vacuum state.Thus, as long as nozzle member is towards by the outstanding setting of evaporation member, can be for example horizontal direction or above-below direction from nozzle member to the direction that is discharged evaporating materials by evaporation member.
Each nozzle member has the length L (mm) of interior diameter D (mm), nozzle member of nozzle member and the diameter D ' that shrinks peristome (mm).The length L of nozzle member refers to the length of the inner side of nozzle member.For example, in the case of the device shown in Fig. 6, the length L of nozzle member refer to represented by the L in Fig. 6, in the inner side of nozzle member 8 along the axial length dimension of nozzle member 8.
And the interior diameter D (mm) of nozzle member, the length L (mm) of nozzle member and the diameter D ' that shrinks peristome (mm) meet following relational expression (1):
L>=9D and D '≤2.7D
2/ L, or L<9D and D '≤D/3.
Above-mentioned formula (1) obtains for the organic materials that is used to form organic EL film.(L × D '/D shown in Fig. 1 (when L>=9D) in the time meeting above-mentioned formula (1)
2be greater than 0 and be the region below 2.7, or the D '/D shown in Fig. 2 (when L<9D) be greater than 0 and be the region below 1/3), defer to cos from the contraction peristome of each nozzle member to the diffusion of the evaporating materials being discharged by evaporation member
nθ rule., by cos
nθ curve approximation.At this moment, the evaporating materials discharging from the contraction peristome of each nozzle member, fully to being piled up by the surface diffusion of evaporation member, therefore can improve the isotropism of thickness.As shown in Figure 1, in the time of L>=9D, at L × D '/D
2be greater than 0 and be in the region below 2.7, cos
nthe n value of θ rule is approximately 4～4.25.And, as shown in Figure 2, in the time of L<9D, in the region of D '≤D/3, cos
nthe n value of θ rule is approximately 4.05～4.25.
Cos
nthe n value of θ rule is less, and evaporating materials is easier of being piled up by the surface diffusion of evaporation member, and can improve the isotropism of thickness.Preferably cos
nthe n value of θ rule is approximately 4～4.1, in order further to improve the isotropism of thickness, and in the time of L>=9D, D '≤2D
2/ L.Preferably cos
nthe n value of θ rule is approximately 4.05～4.1, in order further to improve the isotropism of thickness, and in the time of L<9D, D '≤0.2D.
Consider from the viewpoint of dimensional precision of the diameter D ' that shrinks peristome, it is for example more than 1mm shrinking the diameter D ' of peristome.
If L>=9D and D ' >2.7D
2/ L or L<9D and D ' >D/3, do not defer to cos from the contraction peristome of each nozzle member to the diffusion of the evaporating materials being discharged by evaporation member
nθ rule.Therefore the evaporating materials, discharging from the contraction peristome of each nozzle member is insufficient to being piled up by the surface diffusion of evaporation member.Consequently, the quantitative change that evaporating materials is piled up in the region relative by contraction peristome evaporation member and each nozzle member obtains too much, and the isotropism of thickness declines.
At this, an example of the angular distribution of the evaporating materials discharging from contraction peristome when Fig. 3 represents to meet formula (1).One example of the angular distribution of the evaporating materials discharging from contraction peristome when Fig. 4 sufficient formula with thumb down (1).Transverse axis in figure represents the radiation angle of evaporating materials from the nozzle center of contraction peristome, and the longitudinal axis represents the burst size of the evaporating materials corresponding with radiation angle.Solid line in figure is cos
nθ curve, stain represents the amount of the evaporating materials corresponding with each radiation angle.
Radiation angle refers to, in the case of the device shown in Fig. 5 and Fig. 6, in the amplification shown in Fig. 9 shrink near sectional view peristome 8a, evaporating materials 2 from the contraction peristome 8a of nozzle member 8 respectively to the angle θ of the left and right expansion of the direction just (direction of substrate 5).Radiation angle θ maximum is 90 °.For example radiate angle θ and be 45 ° and refer to, evaporating materials 2 from the contraction peristome 8a of nozzle member 8 respectively to the angle of 45 ° of the left and right expansions of the direction just, discharge evaporating materials 2 from shrinking peristome 8a to substrate 5 with the angle of 90 ° in fact.
Fig. 3 represents the situation of L=30mm, D=7mm, D '=2mm, meets D '≤D/3 in the time of L<9D.At this moment, as shown in Figure 3, obtained along cos
nthe angular distribution of θ curve.On the other hand, Fig. 4 represents the situation of L=30mm, D=7mm, D '=4mm, does not meet D '≤D/3 in the time of L<9D.At this moment, as shown in Figure 4, near little region being 20 ° than radiation angle, has obtained from cos
nthe angular distribution that θ curve significantly departs from.
When Fig. 3 and Fig. 4 are illustrated in L<9D from shrinking the example of angular distribution of the evaporating materials that peristome discharges, but in the time of L >=9D the also expression tendency identical with Fig. 3 and Fig. 4.Specifically, in the time of L>=9D, meet D '≤2.7D
2in the situation of/L, as shown in Figure 3, obtain and cos in all regions
nthe angular distribution of curve approximation.In the time of L>=9D, do not meet D '≤2.7D
2in the situation of/L, as shown in Figure 4, obtain from cos in the radiation little region of angle
nthe angular distribution that θ curve significantly departs from.
In the time that the size of L is enough large than the size of D, the molecule of evaporating materials uprises with the probability that nozzle inner walls is collided.Therefore, discharge the molecular change of evaporating materials and obtain difficultly from shrinking peristome, and from the molecule that shrinks the evaporating materials that peristome discharges, the ratio of the molecule of the evaporating materials discharging along the direction of the inwall of nozzle increases.,, the molecule of the evaporating materials discharging from nozzle contraction peristome, the ratio of the molecule of the evaporating materials discharging directly over nozzle increases.Consequently, become large by the indiffusible tendency of evaporating materials of shrinking peristome release.It is more obvious that nozzle becomes longer this tendency.
To this, in the present invention, even in the value of L than the value of D enough when large L>=9D, also can be little of 2.7D by making to shrink the diameter D ' of peristome
2thereby the ratio of the following molecule that increases the evaporating materials colliding with contraction peristome of/L, so that the evaporating materials diffusion discharging from shrinking peristome, thereby make the diffusion of evaporating materials approach cos
nθ curve.
Even in the time that use meets above-mentioned formula (1) and has multiple nozzle member of roughly the same shape and size, also because of link position, the shape of dispersion cup etc. of distributing style, guiding channel and the dispersion cup of multiple nozzle members of dispersion cup, the amount that the evaporating materials discharging occurs there are differences between each nozzle member.
Therefore, in vacuum deposition apparatus of the present invention, use and comprise the release component of above-mentioned nozzle member, and the device that the flow of adjusting the evaporating materials in each nozzle member is set is so that the flow of the evaporating materials in each nozzle member is prescribed value.Near mechanism's (for example needle-valve or shutter that can slide) of the extent of opening base portion of dispersion cup side that can adjust each nozzle is for example set, as above-mentioned device.
Set the flow of the regulation that each nozzle member is adjusted, to reduce above-mentioned difference.For example, in the time that use meets above-mentioned formula (1) and has multiple nozzle member of roughly the same shape and size, before actual using appts, in advance to simulating for the film thickness distribution that reduces above-mentioned difference, obtain thus the flow of regulation.Obtain film thickness distribution from the contraction peristome of each nozzle member to amount and the diffusion of the evaporating materials being discharged by evaporation member by synthetic.
Can meet by use the nozzle member (size of shrinking the diameter of peristome is fixed) of above-mentioned formula (1), and adjust the flow of each nozzle member inside, accurately adjust amount from the contraction peristome of nozzle member to the evaporating materials being discharged by evaporation member and diffusion from.Consequently, can significantly improve the thickness isotropism in the film entirety being formed by the surface sediment evaporating materials of evaporation member.In the present invention, can be at fixing release component and under by the state of evaporation member, obtain the film of approximate equality.
For example can use the device of the amount of measuring the evaporating materials discharging from each nozzle member, be confirmed whether the flow of nozzle member to be adjusted into the value based on simulation.Preferably, the device of measuring the amount of the evaporating materials discharging from each nozzle member be measure be formed at nozzle member outlet (contraction peristome) directly over the film thickness detecting device of thickness of vapor-deposited film.Film thickness detecting device can be enumerated the thickness detecting sensor of quartz resonator type.Thickness detecting sensor be arranged at respectively each nozzle member outlet (contraction peristome) directly over.In the time that being used, reality removes the device of the thickness of measuring vapor-deposited film.
Vacuum deposition method of the present invention is the method that has used vacuum deposition apparatus, and vacuum deposition apparatus comprises: evaporation source, obtains evaporating materials thereby heating is used to form the deposition material of organic EL film; Guiding channel, carries the evaporating materials that utilizes evaporation source to obtain; And release component, to discharged the evaporating materials flowing into from guiding channel by evaporation member.Release component comprises: dispersion cup, for diffusive evaporation material; And multiple nozzle members, towards being given prominence to and arrange by evaporation member, and have for the contraction peristome to discharged evaporating materials by evaporation member at front end.
And each nozzle member uses the nozzle member using in above-mentioned vacuum deposition apparatus of the present invention.And, utilize the device of the flow of the evaporating materials in the each nozzle member of adjustment in above-mentioned vacuum deposition apparatus of the present invention, carry out the adjustment of the flow of the evaporating materials in each nozzle member.
Thus, can easily and accurately adjust the contraction peristome of the multiple nozzle members from being arranged at dispersion cup to amount and the diffusion of the evaporating materials being discharged by evaporation member.Consequently, can improve significantly the thickness isotropism in the film entirety being formed by the surface sediment evaporating materials of evaporation member.
Preferably, the measuring result obtaining based on measuring the amount of the evaporating materials discharging from each nozzle member, carries out the flow adjustment of above-mentioned evaporating materials.Thus, can be adjusted into the flow that utilizes in advance the regulation that the simulation of film thickness distribution tries to achieve.
Preferably, be formed at based on measurement nozzle member outlet (contraction peristome) directly over vapor-deposited film thickness and the measuring result that obtains is carried out the measurement of the amount of above-mentioned evaporating materials.Can be by utilizing the such film thickness detecting device of the thickness detecting sensor of quartz resonator type etc. to measure the thickness of vapor-deposited film, thus easily obtain the amount of the evaporating materials discharging from nozzle member.
At this, with reference to Fig. 5 and Fig. 6, vacuum deposition apparatus of the present invention embodiment is described.
As shown in Figure 5, vacuum deposition apparatus 1 comprises: as the crucible 3 of evaporation source, heating is used to form the deposition material 2 of organic EL film and obtains evaporating materials; Guiding channel 4, carries the evaporating materials that utilizes crucible 3 to obtain; And release component 6, using the evaporating materials flowing into from guiding channel 4 to as being discharged by the substrate 5 of evaporation member.Release component 6 comprises: as the roughly columned manifold 7 of dispersion cup, for diffusive evaporation material; And multiple nozzle members 8, towards the outstanding setting of substrate 5.
In addition, vacuum deposition apparatus 1 comprises: substrate carrier 5a, for keeping substrate 5; Well heater 10, as the device that the crucible 3 of having put into deposition material 2 is heated; Gate 11, as the device that the path that discharges evaporating materials from each nozzle member 8 to substrate 5 is carried out to switch; And thickness detecting sensor 12, as the device that the thickness of the vapor-deposited film that is formed at substrate 5 surfaces (organic EL film of manufacture) is measured.The above-mentioned various member of formation that form vacuum deposition apparatus 1 are accommodated in container for evaporation 9.Vacuum deposition apparatus 1 is connected with inside for making container for evaporation 9 becomes the degasifying device of vacuum state.Degasifying device for example uses vacuum pump.
As shown in Figure 6, multiple nozzle members 8 are axially equally spaced configured to row along columned manifold 7 roughly.Each nozzle member 8 has the contraction peristome 8a for discharge evaporating materials to substrate 5 at front end.Multiple nozzle members 8 have roughly the same each other shape and size.It is roughly cylindric that the shape of each nozzle member 8 is, and the shape of shrinking peristome 8a is circular.Each nozzle member 8 has interior diameter D, the length L of nozzle member 8 and the diameter D ' of contraction peristome 8a of nozzle member 8.
The interior diameter D (mm) of nozzle member 8, the length L (mm) of nozzle member 8 and the diameter D ' that shrinks peristome 8a (mm) meet following relational expression (1):
L>=9D and D '≤2.7D
2/ L, or L<9D and D '≤D/3.
Release component 6 has leading section for cone shape needle-valve 13 roughly, as the device of flow of evaporating materials of adjusting each nozzle member 8, so that the flow of the evaporating materials of each nozzle member 8 is prescribed value.More particularly, needle-valve 13 is arranged at respectively multiple nozzle members 8, and near the opening of the base portion of dispersion cup 7 sides of each nozzle member 8, is configured to adjust the degree of opening.By such configuration, can accurately adjust the flow of the evaporating materials of the internal feed from manifold 7 to each nozzle member 8.Consequently, can not change the amount of shrinking the diameter of peristome 8a and accurately adjust the evaporating materials from shrinking peristome 8a release.
In the device shown in Fig. 5 and Fig. 6, in the time being confirmed whether the flow of each nozzle member 8 to be adjusted into the value based on simulation, example as shown in Figure 7, as long as be provided as the thickness detecting sensor 14 of the quartz resonator type of film thickness detecting device directly over the outlet of each nozzle member 8 (shrinking peristome 8a).At this moment,, in order not to be subject to the impact of the evaporating materials discharging from adjacent nozzle member 8, be provided for isolating the dividing wall 15 of each nozzle member 8.Thickness detecting sensor 14 and dividing wall 15 arrange and remove in the time that reality is used in the time detecting thickness.
The concrete example of the vacuum deposition method of the vacuum deposition apparatus that has used present embodiment is below shown.
Use the vacuum deposition apparatus shown in Fig. 5 and Fig. 6, and configure crucible 3 and guiding channel 4 at the central part of manifold 7.The length L of each nozzle member 8 is 30mm, and the interior diameter D of each nozzle member 8 is 7mm, and the diameter D ' that shrinks peristome 8a is 2mm.Contraction peristome 8a and the substrate 5(of nozzle member 8 are of a size of 100mm × 100mm) interval be 50mm.In release component 6, with 16 nozzle members 8 of arranged spaced that specify.
In advance with
evaporation speed, carry out the simulation of film thickness distribution taking thickness isotropism as the mode below ± 3%, thereby obtain the suitable burst size of evaporating materials from each nozzle member 8.
The simulation of film thickness distribution is for example undertaken by following step.
The evaporating materials discharging from a nozzle is pressed cos
nthe diffusion of θ rule.Obtain the film thickness distribution that is attached to the amount of the evaporating materials of substrate, utilizes the evaporating materials of a nozzle release to form on the surface of substrate because of such diffusion.For example use known method (for example, with reference to new edition vacuum handbook, ULVAC Co., Ltd. compiles, 250 pages) to try to achieve film thickness distribution by calculating.
Obtain respectively the adhesion amount (film thickness distribution) of above-mentioned evaporating materials for each nozzle.At substrate each several part, the adhesion amount that arrives the evaporating materials of substrate from each nozzle is carried out to integration.Obtain maximum value and the minimum value of the integrated value of the adhesion amount of the evaporating materials of substrate each several part, thereby try to achieve thickness isotropism by following formula.
Thickness isotropism (%)=(maximum value-minimum value)/(maximum value+minimum value) × 100
And, change gradually the burst size of evaporating materials from each nozzle, thereby obtain the burst size of thickness isotropism for the evaporating materials below ± 3%.
Directly over the outlet of nozzle member 8 (shrinking peristome 8a), the thickness detecting sensor 14 of quartz resonator type is set, and the division board 15 of the each nozzle member 8 of isolation is set.
Then, three (oxine) aluminium (hereinafter referred to as Alq3) as deposition material to the interior input of crucible 3 of vacuum deposition apparatus 1.Utilize thickness detecting sensor 14 to measure the amount of the evaporating materials discharging from each nozzle member 8.Based on this measuring result, to become the mode of flow of the regulation of trying to achieve by simulation, adjust near the needle-valve 13 of the peristome base portion of the dispersion cup side that is arranged at nozzle member 8.
Remove the thickness detecting sensor 14 of quartz resonator type.Afterwards, with
evaporation speed on substrate 5, generate the vapor-deposited film of Alq3.At this moment, the thickness isotropism of vapor-deposited film can be remained on ± 3% in.
In the present embodiment, it is roughly cylindric that the shape of manifold 7 is, but the shape of manifold 7 is not limited to this.Can be also for example roughly oval column or the roughly roughly polygonal column such as quadrangular prism shape.
In the present embodiment, equally spaced multiple nozzle members 8 are configured to row, but the distributing style of multiple nozzle member 8 is not limited to this.For example also can and row arrangement multiple row.
In the present embodiment, use needle-valve 13 as the device of flow of the evaporating materials of adjusting each nozzle member 8, but also can substitute needle-valve 13, and as shown in Figure 8, used roughly discoideus shutter 23.By the turning axle 23a rotation that makes to be connected with the end of shutter 23, and shutter 23 is slided, adjust the extent of opening of nozzle member 8.
And although used roughly discoideus shutter 23 in Fig. 8, as long as adjusting the shape of extent of opening of nozzle member 8, the shape of shutter 23 can be also the shape beyond roughly discoideus.
Claims (3)
1. a vacuum deposition apparatus, comprising:
Evaporation source, heating is used to form the deposition material of organic EL film and obtains evaporating materials;
Guiding channel, carries the evaporating materials that utilizes described evaporation source to obtain; And
Release component, to discharged the evaporating materials flowing into from described guiding channel by evaporation member,
Described release component comprises:
Dispersion cup, for spreading described evaporating materials; And
Multiple nozzle members, are arranged by evaporation member is outstanding towards described, and have for to the described contraction peristome that is discharged evaporating materials by evaporation member at front end,
Described vacuum deposition apparatus is characterised in that,
Each nozzle member has the length L (mm) of interior diameter D (mm), nozzle member of nozzle member and the diameter D ' that shrinks peristome (mm),
The length L (mm) of the interior diameter D (mm) of described nozzle member, described nozzle member and the diameter D ' of described contraction peristome (mm) meet relational expression:
L>=9D and D '≤2.7D
2/ L, or L<9D and D '≤D/3,
Described release component has the mode that becomes prescribed value with the flow of the evaporating materials in each nozzle member adjusts the device of the flow of the evaporating materials in each nozzle member.
2. a vacuum deposition method, uses vacuum deposition apparatus, and described vacuum deposition apparatus comprises:
Evaporation source, heating is used to form the deposition material of organic EL film and obtains evaporating materials;
Guiding channel, carries the evaporating materials that utilizes described evaporation source to obtain; And
Release component, to discharged the evaporating materials flowing into from described guiding channel by evaporation member,
Described release component comprises:
Dispersion cup, for spreading described evaporating materials; And
Multiple nozzle members, are arranged by evaporation member is outstanding towards described, and have for to the described contraction peristome that is discharged evaporating materials by evaporation member at front end,
Described vacuum deposition method is characterised in that,
The each nozzle member using has the length L (mm) of interior diameter D (mm), nozzle member of nozzle member and the diameter D ' of contraction peristome (mm), and the length L (mm) of the interior diameter D (mm) of described nozzle member, described nozzle member and the diameter D ' of described contraction peristome (mm) meet relational expression:
L>=9D and D '≤2.7D
2/ L, or L<9D and D '≤D/3,
The mode that becomes prescribed value with the flow of the evaporating materials in each nozzle member is adjusted the flow of the evaporating materials in each nozzle member.
3. vacuum deposition method according to claim 2, is characterized in that, measures the amount of the evaporating materials discharging from each nozzle member, adjusts the flow of the evaporating materials in each nozzle member based on measuring result.
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| CN108198957A (en) * | 2017-12-29 | 2018-06-22 | 信利（惠州）智能显示有限公司 | Organic light-emitting display device and preparation method thereof |
| CN108754448A (en) * | 2018-05-31 | 2018-11-06 | 昆山国显光电有限公司 | Linear evaporation source, vaporizing-source system and evaporation coating device |
| TWI685580B (en) * | 2017-11-30 | 2020-02-21 | 大陸商上海微電子裝備（集團）股份有限公司 | Vacuum evaporation device, evaporation head and vacuum evaporation method |
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| CN107002221B (en) * | 2014-11-07 | 2020-03-03 | 应用材料公司 | Material deposition arrangement and material distribution arrangement for vacuum deposition |
| CN104617223B (en) | 2015-02-03 | 2017-12-08 | 京东方科技集团股份有限公司 | Organic light emitting diode device and preparation method thereof and evaporated device |
| JP6543664B2 (en) * | 2017-09-11 | 2019-07-10 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | Vacuum deposition chamber |
| JP2020176284A (en) * | 2019-04-16 | 2020-10-29 | 株式会社アルバック | Vapor deposition source, vacuum processing apparatus and film deposition method |
| JP7434261B2 (en) * | 2021-12-02 | 2024-02-20 | 長州産業株式会社 | Vapor deposition equipment and vapor deposition method |
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| CN1699619A (en) * | 2004-05-20 | 2005-11-23 | 日本东北先锋公司 | Film formation source, vacuum film formation apparatus, method of manufacturing organic EL device, and organic EL device |
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| CN103966554B (en) | 2018-08-07 |
| TWI604076B (en) | 2017-11-01 |
| TW201430157A (en) | 2014-08-01 |
| KR102192495B1 (en) | 2020-12-17 |
| KR20140098693A (en) | 2014-08-08 |
| JP6300544B2 (en) | 2018-03-28 |
| JP2014167165A (en) | 2014-09-11 |
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