KR20220082739A - Film forming apparatus, film forming method, and manufacturing method of electronic device - Google Patents

Abstract

[Problem] While improving the maintenance workability of the deposition-preventing plate, the deterioration of the deposition-preventing performance is prevented.
[Solutions] A film forming apparatus comprising: an evaporation source for discharging a deposition material to a substrate; and a deposition preventing plate unit for regulating an emission range of the deposition material by the deposition source, wherein the deposition preventing plate unit is disposed in a circumferential direction of the deposition source A plurality of deposition-preventing plates disposed adjacent to each other are provided, and edge portions of the adjacent deposition-preventing plates in the circumferential direction overlap each other.

Description

A film-forming apparatus, a film-forming method, and the manufacturing method of an electronic device TECHNICAL FIELD

The present invention relates to a film forming apparatus, a film forming method, and a manufacturing method of an electronic device.

In manufacture of an organic electroluminescent display etc., vapor deposition substances, such as an organic material and a metal material, are vapor-deposited on a board|substrate using a mask. In order to prevent the vapor deposition material discharged|emitted from an evaporation source from adhering to a chamber inner wall or other mechanism, the apparatus which provided the deposition prevention plate around the evaporation source is known (patent document 1).

Patent Document 1: Japanese Patent Laid-Open No. 2012-77375

When the deposition of the deposition material proceeds, the deposition-preventing plate is cleaned or replaced. In a large-sized film forming apparatus, the size of the deposition-preventing plate also becomes large, and the maintenance workability thereof is deteriorated. In order to improve maintenance workability, it is conceivable to arrange small size deposition-preventing plates side by side. However, deposition material leaks from the gap between adjacent deposition-preventing plates, and deposition-preventing performance may be deteriorated.

The present invention, while improving the maintenance workability of the deposition-preventing plate, to provide a technique capable of preventing the deterioration of the deposition-preventing performance.

According to the present invention,

an evaporation source for emitting a deposition material to the substrate;

As a film forming apparatus having a deposition preventing plate unit for regulating the emission range of the deposition material by the deposition source,

The anchoring plate unit,

and a plurality of deposition-preventing plates disposed adjacent to the deposition source in a circumferential direction,

There is provided a film forming apparatus characterized in that the peripheral portions of the adjacent deposition-preventing plates overlap each other.

According to the present invention, while improving the maintenance workability of the deposition-preventing plate, it is possible to prevent the deterioration of the deposition-preventing performance.

BRIEF DESCRIPTION OF THE DRAWINGS It is a front view of the film-forming apparatus which concerns on one Embodiment of this invention.
FIG. 2 is a side view of the film forming apparatus of FIG. 1 .
FIG. 3 is an explanatory diagram showing the internal structure of the film forming apparatus of FIG. 1 .
4(A) to 4(C) are explanatory views of the movement operation of the vapor deposition apparatus by the movement apparatus.
5 is a perspective view and a partially enlarged view of an upper and lower mounting plate unit.
6 is an explanatory view of each support structure of the upper and lower deposition-preventing plate units of FIG. 5 .
Fig. 7(A) is an explanatory view of the fixing structure between the deposition-preventing plates, (B) is a perspective view of the mounting part, and (C) is an explanatory view of the fixing structure of the supporting member and the mounting part.
It is a figure which shows the aspect which removed some deposition prevention plate of FIG.
FIG. 9 is a view showing a mode in which the deposition-preventing plate unit of the upper side of FIG. 5 is removed as a unit.
FIG. 10 is a view showing a state in which the deposition-preventing plate unit of the lower side of FIG. 5 is removed as a unit.
Fig. 11A is an overall view of an organic EL display device, and Fig. 11B is a diagram showing a cross-sectional structure of one pixel.
12A to 12C are views showing another example of the overlapping structure of the edge portion.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment is described in detail with reference to an accompanying drawing. In addition, the following embodiments do not limit the invention according to the claims. Although a plurality of features are described in the embodiment, not all of these plurality of features are necessarily essential to the invention, and a plurality of features may be arbitrarily combined. Furthermore, in the accompanying drawings, the same reference numerals are attached to the same or the same structures, and overlapping descriptions are omitted.

<Outline of film forming apparatus>

1 is a front view of a film forming apparatus 1 according to an embodiment of the present invention, and FIG. 2 is a side view of the film forming apparatus 1 . 3 : is explanatory drawing which shows the internal structure of the film-forming apparatus 1. As shown in FIG. Meanwhile, in each figure, arrows X and Y indicate a horizontal direction orthogonal to each other, and arrow Z indicates a vertical direction (vertical direction). The film forming apparatus 1 is equipped with the conveying apparatus 2 and the some vapor deposition apparatus 3 . The some vapor deposition apparatuses 3 are arrange|positioned side by side in the X direction, and the conveyance apparatus 2 is supported by the frame 4 so that it may be located above these vapor deposition apparatuses 3 . The frame 4 is provided with the some post 4a and the some beam 4b supported by the some post 4a, The conveying apparatus 2 is being fixed to the beam 4b.

The conveying apparatus 2 is provided with the conveying chamber 20 which forms the conveyance chamber 20c maintained in vacuum at the time of use therein. A carry-in port 20a is provided at one end of the transfer chamber 20 in the X direction, and a carry-out port 20b is provided at the other end. , is carried out from the discharge port 20b after the treatment. Gate valves are provided in the inlet 20a and the outlet 20b.

In the transfer chamber 20c, a plurality of transfer rollers 21 arranged in the X direction are provided. The rows of this conveyance roller 21 are spaced apart in the Y direction, and two rows are arrange|positioned. Each conveying roller 21 rotates around a rotational axis in the Y direction. The both ends of the Y-direction are mounted on the row|line|column of the conveyance rollers 21 of 2 rows, and a conveyance target object is conveyed in a horizontal attitude|position in the X direction by rotation of the conveyance roller 21. As shown in FIG. Although the roller mechanism is used as the conveyance mechanism of the object to be processed in this embodiment, other types of conveyance mechanisms, such as magnetic levitation conveyance, may be sufficient.

Each vapor deposition apparatus 3 is provided with a source chamber 3a forming an internal space maintained in a vacuum during use. The source chamber 3a has a box shape with an opening formed at an upper portion thereof, and the transfer chamber 20c and the internal space of the source chamber 3a communicate with each other through the opening. The vapor deposition apparatus 3 is provided with the vapor deposition source 6 which discharge|emits the vapor deposition material 6a upward. The deposition source 6 of this embodiment is a so-called line source, and extends in a direction (the Y direction orthogonal to the conveying direction in this embodiment) intersecting the conveyance direction (X direction) of the object to be processed in the conveying apparatus 2 . installed. The vapor deposition source 6 includes a crucible for accommodating the raw material of the vapor deposition material 6a, a heater for heating the crucible, and the like, and heats the raw material to discharge the vapor deposition material as a vapor to the transfer chamber 20c.

Deposition-preventing plate units 7 and 8 are provided around the evaporation source 6 . The deposition-preventing plate units 7 and 8 constitute a shielding wall that regulates the emission range so that the deposition material 6a from the deposition source 6 does not adhere to the wall portion of the source chamber 3a or other devices in the vicinity. . The deposition-preventing plate unit 8 is located on the lower side, the deposition-proof plate unit 7 is located on the upper side, and the upper part of the deposition-proof plate unit 7 is entering the transfer chamber 20c. In the case of this embodiment, the deposition-preventing plate units 7 and 8 are supported by the source chamber 3a. In addition, in this embodiment, although two units 7 and 8 were used as a deposition-preventing plate unit, you may use one unit.

The film forming apparatus 1 is capable of carrying out a film forming method, in which the object to be treated is conveyed by the transfer apparatus 2 (transport process), and a vapor deposition material is deposited on the object to be treated by the vapor deposition apparatus 3 (deposition process); It is an in-line type film-forming apparatus. The film forming apparatus 1 is, for example, a display apparatus (a flat panel display, etc.), an electronic device such as a thin film solar cell, an organic photoelectric conversion element (organic thin film imaging element), or an electronic device for manufacturing an optical member. It is applicable to the manufacturing apparatus which implements the manufacturing method. In FIG. 3 , the substrate 10 is exemplified as the object to be processed. The substrate 10 is transferred together with the mask 11 in the X-direction, and the deposition material is deposited on the substrate 10 through the mask 11 positioned below the substrate 10 , thereby forming a predetermined pattern of the deposition material. A thin film may be formed on the substrate 10 . The board|substrate 10 is a board|plate material which consists of materials, such as glass, resin, and a metal, for example, and is a substance, such as an organic material, an inorganic material (metal, metal oxide, etc.) as a vapor deposition material.

In this embodiment, the some vapor deposition apparatus 3 is arrange|positioned in the conveyance direction of the board|substrate 10. As shown in FIG. When different types of deposition materials are emitted by the deposition apparatus 3 , different deposition materials may be continuously deposited on the substrate 10 . In addition, the number of the vapor deposition apparatuses 3 is not limited to three, One or two may be sufficient, and four or more may be sufficient as it.

Each vapor deposition apparatus 3 is provided with a moving apparatus 7 which moves the vapor deposition apparatus 3, respectively. By moving the vapor deposition apparatus 3, its maintenance becomes easy. Moreover, the maintenance of the conveying apparatus 2 also becomes easy. The moving device 7 includes a traveling unit 5a and a pair of lifting units 5b. The traveling unit 5a includes, for example, a driving source such as a motor, and wheels that are driven by a driving force of the driving source, and a guide portion 5c such as a rail member installed on the floor of a factory. It is possible to reciprocate along the Y direction. A pair of lifting units 5b is mounted on the traveling unit 5a. The vapor deposition apparatus 3 is located between a pair of raising/lowering units 5b, and is raised and lowered by a pair of raising/lowering units 5b. Each lifting unit 5b includes a drive source such as a motor and a mechanism for raising and lowering the vapor deposition apparatus 3 by the driving force of the drive source, and the pair of lifting units 5b is driven synchronously.

4 : is explanatory drawing of the movement operation|movement of the vapor deposition apparatus 3 by the movement apparatus 7 . FIG. 4A shows a state in which the vapor deposition apparatus 3 is positioned at a position during the film forming process. In this position, the vapor deposition apparatus 3 and the conveying apparatus 2 are in the positional relationship of FIG. When moving the vapor deposition apparatus 3, as shown in FIG. 4(B) from the position of FIG. make it Thereby, the deposition-preventing plate unit 7 whose upper part has entered the transfer chamber 20c is retracted from the transfer chamber 20c. Then, the traveling unit 5a is driven to move the vapor deposition apparatus 3 in the Y direction. Thereby, as shown to FIG.4(C), the vapor deposition apparatus 3 moves to the position shifted from the lower side of the conveyance apparatus 2 to the Y direction. The conveying apparatus 2 and the vapor deposition apparatus 3 will be in the state in which the inside is exposed, respectively, and these maintenance can be performed efficiently.

<Equipment plate unit>

The configuration of the deposition-preventing plate units 7 and 8 will be described with reference to FIGS. 3 and 5 . 5 is a perspective view and a partially enlarged view of the deposition-preventing plate units 7 and 8 . The deposition-preventing plate unit 7 is a cylindrical member configured to surround the deposition material emission space from the deposition source 6 to the substrate 10 (in other words, the space above the deposition source 6 ), for example, , made of metal. In the case of this embodiment, since the deposition source 6 is in the form of a line source extending in the Y direction, the deposition preventing plate unit 7 has a rectangular cylindrical shape along the shape of the deposition source 6 (this embodiment). In the case of the shape, when viewed in a plan view, it has a rectangular shape as a whole).

The deposition-preventing plate unit 8 is a cylindrical member configured to surround the deposition source 6 and the emission space of the deposition material from the deposition source 6 to the substrate 10 , and is, for example, made of metal. In the case of this embodiment, similarly to the deposition-preventing plate unit 7 , the deposition-preventing plate unit 8 also has a rectangular cylindrical shape. The lower end of the anti-caking plate unit 7 enters the inside of the anti-caking plate unit 8, and the lower end of the anti-caking plate unit 7 and the upper end of the anti-caking plate unit 8 are mutually in the vertical direction (Z direction). overlap Thereby, between the deposition prevention plate unit 7 and the deposition prevention plate unit 8, the gap in the Z direction disappears, and the deposition material is prevented from leaking from between the deposition prevention plate unit 7 and the deposition prevention plate unit 8. can be prevented

<Equipment plate unit (7)>

The structure of the deposition-preventing plate unit 7 will be described in detail. The deposition-preventing plate unit 7 includes a plurality of deposition-preventing plates 71 to 78 arranged side by side in the circumferential direction (the X-direction and the Y-direction in this embodiment) of the deposition source 6 . By configuring the deposition-preventing plate unit 7 with a plurality of deposition-preventing plates 71 to 78, the size of each deposition-preventing plate can be reduced, and maintenance workability when cleaning or replacing the deposition-preventing plate can be improved. have. The deposition-preventing plate unit 7 includes a pair of long sides along the extension direction (the Y direction in this embodiment) of the deposition source 6 in a plan view, and a direction intersecting the extension direction (this embodiment) has a pair of short sides along the X-direction), a pair of long sides are formed of deposition-preventing plates 72 to 77 , and a pair of short sides are formed of deposition-preventing plates 71 and 78 .

Here, when the deposition-preventing plate unit 7 is constituted by arranging the deposition-preventing plates, the deposition material may leak from the gap between the adjacent deposition-preventing plates. In the present embodiment, the edge portions of the deposition-preventing plates adjacent in the circumferential direction of the deposition source 6 overlap each other in the circumferential direction of the deposition source 6, thereby eliminating the gap between the adjacent deposition-preventing plates to prevent leakage of the deposition-preventing material. can be prevented It demonstrates with the structural example employ|adopted in this embodiment.

Pay attention to part P1. The deposition-preventing plate 72 and the deposition-preventing plate 74 are adjacent to the deposition source 6 in the circumferential direction (Y direction), and their edge portions overlap in the Y direction. The deposition-preventing plate 72 has an L-shaped plate-shaped body portion 72a and an overlapping portion 72b in plan view. The overlapping portion 72b forms an edge portion overlapping the deposition-preventing plate 74, and with respect to the body portion 72a, in the plate thickness direction (here, the X direction) of the body portion 72a, the inside of the deposition-preventing plate unit 7 is formed by shifting to . As for the deposition-preventing plate 74, the edge portion of the plate-shaped body portion 74a overlaps the overlapping portion 72b. The butt portion of the deposition-preventing plate 72 and the deposition-preventing plate 74 forms a labyrinth structure in which the gap becomes L-shaped in plan view, and the deposition material is deposited from the inside of the deposition-preventing plate unit 7 to the outside. prevent it from leaking. Since the overlapping portion 72b with respect to the body portion 72a is located inside the deposition prevention plate unit 7, the body portion 72a of the deposition prevention plate 72 and the body portion 74a of the deposition prevention plate 74 are There are no steps on the outside. Since there may be a gap in the Y direction between the body portion 72a of the deposition prevention plate 72 and the body portion 74a of the deposition prevention plate 74 , the Y direction of the deposition prevention plate 72 and the deposition prevention plate 74 . position accuracy is relaxed, and the assembly workability of the deposition-preventing plate unit 7 is improved.

Pay attention to part P2. The deposition-preventing plate 74 and the deposition-preventing plate 76 are adjacent to each other in the circumferential direction (Y direction) of the deposition source 6 , and their edge portions overlap in the Y direction. The deposition preventing plate 74 has a plate-shaped body portion 74a and an overlapping portion 74b. The overlapping portion 74b forms an edge portion overlapping the deposition-preventing plate 76, and with respect to the body portion 74a, in the plate thickness direction of the body portion 74a (here, in the X direction), the inside of the deposition-preventing plate unit 7 is formed by shifting to . As for the deposition-preventing plate 76 , the edge portion of the L-shaped body portion 76a overlaps the overlapping portion 74b in plan view. The butt portion of the deposition-preventing plate 74 and the deposition-preventing plate 76 forms a labyrinth structure in which the gap becomes L-shaped in plan view, and the deposition material leaks from the inside of the deposition-preventing plate unit 7 to the outside. to prevent Since the overlapping portion 74b with respect to the body portion 74a is located inside the deposition-preventing plate unit 7 , the body portion 74a of the deposition-preventing plate 74 and the body portion 76a of the deposition-preventing plate 76 are There are no steps on the outside. Since there may be a gap in the Y direction between the body portion 74a of the deposition prevention plate 74 and the body portion 76a of the deposition prevention plate 76 , the Y direction of the deposition prevention plate 74 and the deposition prevention plate 76 . position accuracy is relaxed, and the assembly workability of the deposition-preventing plate unit 7 is improved.

Pay attention to part P3. The deposition-preventing plate 73 and the deposition-preventing plate 75 are adjacent to each other in the circumferential direction (Y direction) of the deposition source 6 , and their edge portions overlap in the Y direction. The deposition preventing plate 75 has a plate-shaped body portion 75a and an overlapping portion 75b. The overlapping portion 75b forms an edge portion overlapping the deposition-preventing plate 73, and with respect to the body portion 75a, in the plate thickness direction of the body portion 75a (here, the X direction), the inside of the deposition-preventing plate unit 7 is formed by shifting to . As for the deposition-preventing plate 73 , the edge portion of the L-shaped body portion 73a overlaps the overlapping portion 75b in plan view. The butt portion of the deposition-preventing plate 73 and the deposition-preventing plate 75 forms a labyrinth structure in which the gap becomes L-shaped in plan view, and the deposition material leaks from the inside of the deposition-preventing plate unit 7 to the outside. to prevent Since the overlapping part 75b with respect to the body part 75a is located inside the deposition prevention plate unit 7, the body part 73a of the deposition prevention plate 73, and the body part 75a of the deposition prevention plate 75 There are no steps on the outside. Since there may be a gap in the Y direction between the body portion 73a of the deposition prevention plate 73 and the body portion 75a of the deposition prevention plate 75 , the Y direction of the deposition prevention plate 73 and the deposition prevention plate 75 . position accuracy is relaxed, and the assembly workability of the deposition-preventing plate unit 7 is improved.

Pay attention to part P4. The deposition-preventing plate 75 and the deposition-preventing plate 77 are adjacent to each other in the circumferential direction (Y direction) of the deposition source 6 , and their edge portions overlap in the Y direction. The deposition preventing plate 77 has an L-shaped plate-shaped body portion 77a and an overlapping portion 77b in plan view. The overlapping portion 77b forms an edge portion overlapping the deposition-preventing plate 75, and with respect to the body portion 77a, in the plate thickness direction of the body portion 77a (here, in the X direction), the inside of the deposition-preventing plate unit 7 is formed by shifting to . In the deposition preventing plate 75, the edge portion of the plate-shaped body portion 75a overlaps the overlapping portion 77b. The butt portion of the deposition-preventing plate 75 and the deposition-preventing plate 77 forms a labyrinth structure in which the gap becomes L-shaped in plan view, and the deposition material leaks from the inside of the deposition-preventing plate unit 7 to the outside. to prevent Since the overlapping portion 77b with respect to the body portion 77a is located inside the deposition-preventing plate unit 7 , the body portion 77a of the deposition-preventing plate 77 and the body portion 75a of the deposition-preventing plate 75 are There are no steps on the outside. Since there may be a gap in the Y direction between the body portion 75a of the deposition prevention plate 75 and the body portion 77a of the deposition prevention plate 77 , the Y direction of the deposition prevention plate 75 and the deposition prevention plate 77 . position accuracy is relaxed, and the assembly workability of the deposition-preventing plate unit 7 is improved.

Pay attention to part P5. The deposition-preventing plate 71 and the deposition-preventing plate 72 are adjacent to each other in the circumferential direction (X-direction) of the deposition source 6 , and their edge portions overlap in the X-direction. The deposition-preventing plate 72 has an L-shaped plate-shaped body portion 72a and an overlapping portion 72b in plan view. That is, the deposition-preventing plate 72 has overlapping portions 72b on both edges of the deposition source 6 in the circumferential direction. The overlapping portion 72b forms an edge portion overlapping the deposition-preventing plate 71, and with respect to the body portion 72a, in the plate thickness direction of the body portion 72a (here, the Y direction), the inside of the deposition-preventing plate unit 7 . is formed by shifting to . In the deposition-preventing plate 71 , the edge portion of the plate-shaped body portion 71a overlaps the overlapping portion 72b. The butt portion of the deposition-preventing plate 71 and the deposition-preventing plate 72 forms a labyrinth structure in which the gap becomes L-shaped in plan view, and the deposition material leaks from the inside of the deposition-preventing plate unit 7 to the outside. to prevent Since the overlapping portion 72b with respect to the body portion 72a is located inside the deposition-preventing plate unit 7, the body portion 71a of the deposition-preventing plate 71 and the body portion 72a of the deposition-preventing plate 72 There are no steps on the outside. Since there may be a gap in the X-direction between the body portion 71a of the deposition-preventing plate 71 and the body portion 72a of the deposition-preventing plate 72 , the X-direction of the deposition-preventing plate 71 and the deposition-preventing plate 72 . position accuracy is relaxed, and the assembly workability of the deposition-preventing plate unit 7 is improved.

Pay attention to part P6. The deposition-preventing plate 71 and the deposition-preventing plate 73 are adjacent to each other in the circumferential direction (X direction) of the deposition source 6 , and their edge portions overlap in the X direction. The deposition preventing plate 73 has an L-shaped plate-shaped body portion 73a and an overlapping portion 73b in plan view. The overlapping portion 73b forms an edge portion overlapping the deposition-preventing plate 71, and with respect to the body portion 73a, in the plate thickness direction of the body portion 73a (here, the Y direction), the inside of the deposition-preventing plate unit 7 . is formed by shifting to . In the deposition-preventing plate 71 , the edge portion of the plate-shaped body portion 71a overlaps the overlapping portion 73b. That is, the deposition-preventing plate 71 does not have an overlapping portion. The butt portion of the deposition-preventing plate 71 and the deposition-preventing plate 73 forms a labyrinth structure in which the gap becomes L-shaped in plan view, and the deposition material leaks from the inside of the deposition-preventing plate unit 7 to the outside. to prevent Since the overlapping portion 73b with respect to the body portion 73a is located inside the deposition-preventing plate unit 7 , the body portion 71a of the deposition-preventing plate 71 and the body portion 73a of the deposition-preventing plate 73 are There are no steps on the outside. Since there may be a gap in the X-direction between the body portion 71a of the deposition-preventing plate 71 and the body portion 73a of the deposition-preventing plate 73 , the X-direction of the deposition-preventing plate 71 and the deposition-preventing plate 73 . position accuracy is relaxed, and the assembly workability of the deposition-preventing plate unit 7 is improved.

Pay attention to part P7. The deposition-preventing plate 76 and the deposition-preventing plate 78 are adjacent to each other in the circumferential direction (X-direction) of the deposition source 6 , and their edge portions overlap in the X-direction. The deposition preventing plate 76 has an L-shaped plate-shaped body portion 76a and an overlapping portion 76b in plan view. The overlapping portion 76b forms an edge portion overlapping the deposition-preventing plate 78, and with respect to the body portion 76a, in the plate thickness direction of the body portion 76a (here, the Y direction), the inside of the deposition-preventing plate unit 7 is formed by shifting to . As for the deposition-preventing plate 78, the edge portion of the plate-shaped body portion 78a overlaps the overlapping portion 76b. The butt portion of the deposition-preventing plate 76 and the deposition-preventing plate 78 forms a labyrinth structure in which the gap becomes L-shaped in plan view, and the deposition material leaks from the inside of the deposition-preventing plate unit 7 to the outside. to prevent Since the overlapping portion 76b is located inside the deposition-preventing plate unit 7 with respect to the body portion 76a, the body portion 76a of the deposition-preventing plate 76 and the body portion 78a of the deposition-preventing plate 78 are There are no steps on the outside. Since there may be a gap in the X direction between the body portion 76a of the deposition-preventing plate 76 and the body portion 78a of the deposition-preventing plate 78 in the X direction of the deposition-preventing plate 76 and the deposition preventing plate 78 . position accuracy is relaxed, and the assembly workability of the deposition-preventing plate unit 7 is improved.

Pay attention to part P8. The deposition-preventing plate 77 and the deposition-preventing plate 78 are adjacent to each other in the circumferential direction (X-direction) of the deposition source 6 , and their edge portions overlap in the X-direction. The deposition preventing plate 77 has an L-shaped plate-shaped body portion 77a and an overlapping portion 77b in plan view. That is, the deposition-preventing plate 77 has the overlapping portions 77b on both edges of the deposition source 6 in the circumferential direction. The overlapping portion 77b forms an edge portion overlapping the deposition-preventing plate 78, and with respect to the body portion 77a, in the plate thickness direction of the body portion 77a (here, the Y direction), the inside of the deposition-preventing plate unit 7 is formed by shifting to . As for the deposition-preventing plate 78, the edge portion of the plate-shaped body portion 78a overlaps the overlapping portion 77b. That is, the deposition-preventing plate 78 does not have an overlapping portion. The butt portion of the deposition-preventing plate 77 and the deposition-preventing plate 78 forms a labyrinth structure in which the gap becomes L-shaped in plan view, and the deposition material leaks from the inside of the deposition-preventing plate unit 7 to the outside. to prevent Since the overlapping portion 77b with respect to the body portion 77a is located inside the deposition-preventing plate unit 7, the body portion 77a of the deposition-preventing plate 77 and the body portion 78a of the deposition-preventing plate 78 are There are no steps on the outside. Since there may be a gap in the X direction between the body portion 77a of the deposition-preventing plate 77 and the body portion 78a of the deposition-preventing plate 78 in the X direction of the deposition-preventing plate 77 and the deposition preventing plate 77 . position accuracy is relaxed, and the assembly workability of the deposition-preventing plate unit 7 is improved.

In the present embodiment, the deposition-preventing plates 71 to 78 include a plurality of types of deposition-preventing plates, and the deposition-preventing plate unit 7 is constituted by using a plurality of deposition-preventing plates of the same type (same structure). Specifically, the deposition-preventing plate 71 and the deposition-preventing plate 78 are used by inverting the front and back sides of the deposition-preventing plate of the same type. The deposition prevention plate 72 and the deposition prevention plate 77 are also used by inverting the front and back sides of the deposition prevention plate of the same type. The deposition-preventing plate 73 and the deposition-preventing plate 76 are also used by reversing the front and back sides of the same type of deposition-proof plate. The deposition-preventing plate 74 and the deposition-proof plate 75 are also used by inverting the front and back of the deposition-proof plate of the same type. By such a configuration, it is possible to reduce the type of deposition-preventing plate. In this embodiment, although all two of the same type of anti-deposition boards are used each, you may use three or more three or more types of at least one type of anti-deposition boards of the same type.

<Equipment plate unit (8)>

The structure of the deposition-preventing plate unit 8 will be described in detail. The deposition-preventing plate unit 8 has a structure similar to that of the deposition-preventing plate unit 7 . The deposition-preventing plate unit 8 includes a plurality of deposition-preventing plates 81 to 88 arranged side by side in the circumferential direction of the deposition source 6 (in this embodiment, the X-direction and the Y-direction). By configuring the deposition-preventing plate unit 8 with a plurality of deposition-preventing plates 81 to 88, the size of each deposition-preventing plate can be made small, and maintenance workability when cleaning or replacing the deposition-preventing plate unit can be improved. have. The deposition-preventing plate unit 8 includes a pair of long sides along the extension direction (the Y direction in this embodiment) of the deposition source 6 in a plan view, and a direction intersecting the extension direction (this embodiment) has a pair of short sides along the X-direction), a pair of long sides are formed of deposition-preventing plates 82 to 87 , and a pair of short sides are formed of deposition-preventing plates 81 and 88 .

Also in the deposition-preventing plate unit 8 , the edge portions of the deposition-preventing plates adjacent in the circumferential direction of the deposition source 6 overlap each other, and the structure is similar to the structure described for the P1 to P8 portions of the deposition-preventing plate unit 7 . can do. However, in the deposition-preventing plate unit 7, the overlapping portions 72b to 77b are disposed inside the deposition-preventing plate unit 7 with respect to the main body parts 72a to 77a, but in the deposition-preventing plate unit 8, they are arranged outside. You can do it. According to this configuration, there is no step difference on the inner surface of the deposition-preventing plate unit 8, and with respect to the outer surface of the deposition-preventing plate unit 7 having no step, it is better to arrange each deposition-preventing plate of the deposition-preventing plate unit 8 closer to each other. it becomes possible This contributes to the prevention of leakage of the deposition-preventing material.

Also in the deposition-preventing plate unit 8, the deposition-preventing plates 81 to 88 include a plurality of types of deposition-preventing plates, and are constituted by using a plurality of deposition-preventing plates of the same type (same structure). Specifically, the deposition-preventing plate 81 and the deposition-preventing plate 88 are used by inverting the front and back sides of the same type of deposition-preventing plate. The deposition prevention plate 82 and the deposition prevention plate 87 are also used by inverting the front and back sides of the deposition prevention plate of the same type. The deposition prevention plate 83 and the deposition prevention plate 86 are also used by inverting the front and back sides of the deposition prevention plate of the same type. The deposition prevention plate 84 and the deposition prevention plate 85 are also used by inverting the front and back sides of the deposition prevention plate of the same type. By such a configuration, it is possible to reduce the type of deposition-preventing plate. In this embodiment, although all two of the same type of anti-deposition boards are used each, you may use three or more three or more types of at least one type of anti-deposition boards of the same type.

<Connection/Support Structure>

The connection and support structure of the deposition-preventing plate in the deposition-preventing plate unit 7 and the deposition-preventing plate unit 8 will be described with reference to FIGS. 5, 6 and 7 (A) to 7 (C). It is a perspective view which shows each support structure 12, 13 of the deposition-preventing plate unit 7 and the deposition-preventing plate unit 8. As shown in FIG.

The deposition preventing plate unit 7 is fixed to the source chamber 3a by a support structure 12 . The support structure 12 is provided with a pair of detachable support members 12a, a pair of fixed support members 12b, and the some arm member 12c. A rectangular frame is formed by the pair of detachable support members 12a and the pair of fixed support members 12b, and the deposition-preventing plate unit 7 is located inside the rectangular frame. The attachment/detachment support member 12a is a rod-shaped member extended along the long side of the attachment-preventing plate unit 7 (extended in the Y direction), and in the case of this embodiment, it is a square steel pipe. The fixed support member 12b is a rod-shaped member extended along the short side of the deposition-preventing plate unit 7 (extended in the X direction), and in the case of this embodiment, is a rectangular steel pipe. Each end of the detachable support member 12a and the fixed support member 12b is detachably fixed by a fastening structure, such as a bolt. The arm member 12c connects the fixed support member 12b and the wall portion of the source chamber 3a. Since the deposition-preventing plate unit 7 covers the entirety of each member of the detachable support member 12a, the fixed support member 12b, and the arm member 12c with respect to the deposition source 6, a vapor deposition material is applied to each of these members. This can be prevented from sticking.

Among the deposition-preventing plates 71 to 78 of the deposition-preventing plate unit 7 , the deposition-preventing plate 71 and the deposition-preventing plates 72 and 73 are detachably fixed by the connection part 10 , and the deposition-preventing plate 78 and the deposition-preventing plate Reference numerals 76 and 77 are detachably fixed by the connecting portion 10 . 7A is a cross-sectional view of the connection part 10 . The connection part 10 has a structure in which the fixing part 10a and the fixing part 10b are overlapped and fastened with a bolt 10c. The fixing part 10a is formed with a hole through which the threaded part of the bolt 10c is inserted, and the fixing part 10b is formed with a threaded hole through which the threaded part of the bolt 10c is screwed. In the fixing part 10 of the deposition prevention plate 71 and the deposition prevention plates 72 and 73, as illustrated in FIG. 8 to be described later, a plate-shaped fixing part 10a is provided on the deposition prevention plate 71, Concave-shaped fixing portions 10b are formed on the mounting plates 72 and 73, respectively, and the fixing portions 10a are superimposed on the fixing portions 10b. The connection part 10 of the deposition-preventing plate 78 and the deposition-preventing plates 76 and 77 is also the same. On the other hand, the structure of the fixing part 10 may be any structure as long as the deposition-preventing plate can be detachably fixed.

The deposition prevention plate 74 and the deposition prevention plate 75 of the deposition prevention plate unit 7 are not directly connected to other deposition prevention plates. The deposition-preventing plate 74 and the deposition-preventing plate 75 are connected to another deposition-preventing plate through a detachable support member 12a. The attachment portions 9 are provided on the attachment-preventing plates 72 to 77, these are arranged in the Y direction, and are removably fixed to the detachable support member 12a. 7B is a perspective view of the mounting part 9 . The mounting portion 9 is a plate-shaped member protruding outward from the outer surface of the deposition-preventing plates 72 to 77, and the end portion 9a is joined to the outer surface of the deposition-preventing plates 72 to 77. . The mounting portion 9 has a plate-shaped fixing plate portion 9b having a cutout portion 9c, and vertical wall portions 9d standing up from both ends of the fixing plate portion 9b in the Y direction.

Fig. 7C shows an example of the fixing structure of the mounting portion 9 and the detachable support member 12a. The fixing plate part 9b of the mounting part 9 is sandwiched between the detachable support member 12a and the pressing plate 15, and by fastening the bolt 14, the mounting part 9 is attached to the detachable support member 12a. is fixed The detachable support member 12a is provided with a screw hole into which the screw portion of the bolt 14 is screwed. The fixed plate portion 9b is adjustable in position relative to the bolt 14 by the size of the cut-out portion 9c. That is, it is possible to adjust the fixed positions of the attachment-preventing plates 72 to 77 in the X direction and the Y direction with respect to the detachable support member 12a. On the other hand, the fixing structure of the deposition-preventing plates 72 to 77 and the detachable support member 12a may be any structure as long as it can be fixedly separably from each other.

In this embodiment, the structure (connection part 10) which connects deposition-preventing boards, and the structure which connects the deposition-preventing boards via the detachable support member 12a were used together. However, the entire deposition prevention plate may have a structure directly connected to an adjacent deposition prevention plate. Conversely, a structure in which the entire deposition-preventing plate is connected via the detachable support member 12a may be employed.

The deposition preventing plate unit 8 is fixed to the source chamber 3a by a support structure 13 . The support structure 13 includes a pair of detachable support members 13a and a plurality of arm members 13b. The attachment-preventing plate unit 8 is located between a pair of attachment and detachment support members 13a. The detachable support member 13a is a rod-shaped member extended along the long side of the deposition-preventing plate unit 8 (extended in the Y direction), and in the case of this embodiment, is a rectangular steel pipe. The arm member 13b connects the detachable support member 13a and the wall portion of the source chamber 3a. The detachable support member 13a is being detachably fixed to the arm member 13b by a fastening structure such as bolts.

Since the deposition-preventing plate unit 8 covers the entirety of each member of the detachable support member 13a and the arm member 13b with respect to the deposition source 6, it is possible to prevent the deposition material from adhering to each of these members. have.

Among the anti-caking plates 81 to 88 of the anti-caking unit 8, the anti-caking plates 81 and 82 and 83 are detachably fixed by the connection part 10, and the anti-caking plates 88 and the anti-caking plates. Reference numerals 86 and 87 are detachably fixed by a connecting portion 10 . The structure of the connection part 10 is as shown in FIG. 7A. In the fixing part 10 of the deposition prevention plate 81 and the deposition prevention plates 82 and 83, as illustrated in FIG. 8 to be described later, a plate-shaped fixing part 10a is provided on the deposition prevention plate 81, A fixing portion 10b in the shape of a recess is formed on the mounting plates 82 and 83, respectively, and the fixing portion 10a is superimposed on (side) the fixing portion 10b. The connection part 10 of the deposition prevention plate 88 and the deposition prevention plates 86 and 87 is also the same. On the other hand, also in the deposition-preventing plate unit 8, the structure of the fixing portion 10 may have any structure as long as the deposition-preventing plate can be detachably fixed.

The deposition-preventing plate 84 and the deposition-preventing plate 85 of the deposition-preventing plate unit 8 are not directly connected to other deposition-proof plates. It is connected to the other mounting plate through the detachable support member (13a). The attachment portions 9 are provided on the attachment-preventing plates 82 to 87, these are arranged in the Y direction, and are removably fixed to the detachable support member 13a. The structure of the mounting portion 9 of the deposition-preventing plate unit 8 and the fixing structure of the mounting portion 9 and the detachable support member 13a are as illustrated in FIGS. 7B and 7C . On the other hand, also in the deposition-preventing plate unit 8, the fixing structure of the deposition-preventing plates 82 to 87 and the detachable support member 13a may be any structure as long as it can be fixedly separable from each other. In addition, also in the deposition-preventing plate unit 8, the structure in which all the deposition-preventing plates are directly connected to the adjacent deposition-proof plates may be sufficient, and conversely, the structure in which all the deposition-proof plates are connected via the detachable support member 13a may be sufficient.

<Separation of plate unit and separation of unit unit>

In the present embodiment, the deposition-preventing plates 71 to 78 of the deposition-preventing plate unit 7 may be individually removed, or the deposition-preventing plate unit 7 may be removed from the source chamber 3a as a whole. In this way, by being able to select the separation of the deposition-preventing plate unit and the separation of the unit unit, it is possible to improve the maintainability. For example, when there is a lot of deposition of the deposition material locally, it is possible to select and replace the separation of the deposition-preventing plate unit. The separation operation of the deposition prevention plate unit can be performed, for example, in the state of Fig. 4 (B) or the state of Fig. 4 (C), and the separation operation of the unit unit is, for example, in Fig. 4 (C) ) can be done under The deposition-preventing plate unit 8 is also the same.

8 shows an example of separation of the deposition-preventing plate unit. In the illustrated example, in the deposition preventing plate unit 7 , the deposition preventing plate 71 and the deposition preventing plate 72 are separated. The deposition-preventing plate 71 can be removed when the fixing portion 10 is released. The deposition-preventing plate 72 can be removed by releasing the fixing of the fixing part 10 and releasing the fixing of the detachable supporting member 12a and the attaching part 9 .

The deposition-preventing plate unit 7 includes the overlapping relationship of the edge portions in the P1 part to the P8 part, and the detachment direction from the attachment/detachment support member 12a (in the X direction in the present embodiment, the inside of the deposition-preventing plate unit 7 ) ), the order of disassembly of the deposition-preventing plates 71 to 78 is restricted to a predetermined order. If the order of decomposition is expressed in order of priority, the anti-caking plate 71 and the anti-caking plate 78 are the earliest (first priority). The deposition-preventing plate 72 is the next order (second priority) in that separation of the deposition-preventing plate 71 is required, and similarly, the deposition-preventing plate 77 is Next order (second priority). The deposition-preventing plate 74 is further in the next order (third priority) in that separation of the deposition-proof plate 72 is required, and similarly, the deposition-proof plate 75 is further in that separation of the deposition-proof plate 77 is required. This is the next order (third priority). The anti-chak plate 73 and the anti-chak plate 76 are the slowest in order (lowest priority). The order of assembly is reversed.

In the present embodiment, the deposition-preventing plate 71 and the deposition-preventing plate 78 are the earliest in the order of disassembly. These deposition-preventing plates 71 and 78 are located in the periphery of the end of the deposition source 6 in the extending direction. The periphery of the edge part of the extension installation direction of the evaporation source 6 becomes an arrangement space of other mechanisms (various sensors, actuators, etc.) in many cases. That is, the deposition-preventing plate 71 and the deposition-preventing plate 78 are portions that are highly likely to be removed during internal maintenance of the deposition apparatus 3 , and their disassembly priority is high (removal of other deposition-preventing plates is not required) As a result, maintenance workability can be improved.

In the example of FIG. 8 , in the deposition-preventing plate unit 8 , the deposition-preventing plate 81 is separated. The deposition-preventing plate 81 can be removed when the fixing of the fixing part 10 is released. Also in the deposition-preventing plate unit 8 , similarly to the deposition-preventing plate unit 7 , the overlapping relationship of the edge portion and the separation direction from the attachment/detachment support member 13a (in the X direction in the present embodiment, the deposition-preventing plate unit 8 ) (inside of ), the order of disassembly of the deposition-preventing plates 81 to 88 is restricted to a predetermined order. The order of precedence of the decomposition order is the same as that of the anti-caking plate unit 7, and the anti-caking plate 81 and the anti-caking plate 88 are the fastest (first priority), and the anti-caking plate 82 and the anti-caking plate 87 are It is the next order (second priority), and the anti-caking plate 84 and the anti-caking plate 85 are in the next order (the third priority), and the anti-caking plate 83 and the anti-caking plate 86 are the slowest in order. (lowest priority). The order of assembly is reversed. The reason why the deposition-preventing plate 81 and the deposition-preventing plate 88 have the fastest disassembly order is the same as that of the deposition-preventing plates 71 and 78 .

Fig. 9 shows an example of separation of the deposition-preventing plate unit 7 into units of units. By releasing the fixing of the detachable support member 12a and the detachable support member 12b, and lifting the attachment-preventing plate unit 7 together with the detachable support member 12a by a crane or the like, the entire attachment-preventing plate unit 7 is removed. It can be removed from the source chamber 3a.

Fig. 10 shows an example of separation of the deposition-preventing plate unit 8 into units of units. By releasing the fixing of the detachable support member 13a and the arm member 13b, and lifting the attachment-preventing plate unit 8 together with the detachable support member 13a by a crane or the like, the entire attachment-preventing plate unit 8 is removed from the source. It can be removed from the chamber 3a. In the present embodiment, when the entire deposition-preventing plate unit 8 is removed from the source chamber 3a, it is necessary to remove the deposition-preventing plate unit 7 first.

<Electronic device>

Next, an example of an electronic device is demonstrated. Hereinafter, the structure of an organic electroluminescent display is illustrated as an example of an electronic device.

First, an organic EL display device to be manufactured will be described. Fig. 11(A) is an overall view of the organic EL display device 500, and Fig. 11(B) is a view showing a cross-sectional structure of one pixel.

As shown in FIG. 11A , in the display area 51 of the organic EL display device 500 , a plurality of pixels 52 including a plurality of light emitting elements are arranged in a matrix shape. Although the details will be described later, each of the light emitting elements has a structure including an organic layer sandwiched between a pair of electrodes.

In addition, the pixel here refers to the minimum unit which enables display of a desired color in the display area 51 . In the case of a color organic EL display device, the pixel 52 is formed by a combination of a plurality of sub-pixels of the first light emitting element 52R, the second light emitting element 52G, and the third light emitting element 52B that emit light different from each other. Consists of. In many cases, the pixel 52 is composed of a combination of three types of sub-pixels: a red (R) light emitting element, a green (G) light emitting element, and a blue (B) light emitting element, but is not limited thereto. The pixel 52 may include at least one type of sub-pixel, preferably includes two or more types of sub-pixels, and more preferably includes three or more types of sub-pixels. As the sub-pixel constituting the pixel 52 , for example, a combination of four types of sub-pixels: a red (R) light-emitting element, a green (G) light-emitting element, a blue (B) light-emitting element, and a yellow (Y) light-emitting element. may be

Fig. 11B is a schematic partial cross-sectional view taken along line A-B of Fig. 11A. The pixel 52 is, on the substrate 53 , a first electrode (anode) 54 , a hole transport layer 55 , a red layer 56R, a green layer 56G, or a blue layer 56B. It has a plurality of sub-pixels composed of one, an electron transport layer 57 , and an organic EL element including a second electrode (cathode) 58 . Among them, the hole transport layer 55 , the red layer 56R, the green layer 56G, the blue layer 56B, and the electron transport layer 57 correspond to the organic layer. The red layer 56R, the green layer 56G, and the blue layer 56B are formed in a pattern corresponding to a light emitting element (which may be described as an organic EL element) emitting red, green, and blue, respectively.

In addition, the 1st electrode 54 is formed separately for each light emitting element. The hole transport layer 55 , the electron transport layer 57 , and the second electrode 58 may be formed in common over the plurality of light emitting elements 52R, 52G, and 52B, or may be formed for each light emitting element. That is, as shown in FIG. 11B , after the hole transport layer 55 is formed as a common layer over a plurality of sub-pixel regions, the red layer 56R, the green layer 56G, and the blue layer 56B are sub-pixels. Each region may be formed separately, and further, the electron transport layer 57 and the second electrode 58 may be formed thereon as a common layer over a plurality of sub-pixel regions.

On the other hand, in order to prevent a short circuit between the adjacent first electrodes 54 , an insulating layer 59 is provided between the first electrodes 54 . Furthermore, since the organic EL layer is deteriorated by moisture and oxygen, a protective layer 60 for protecting the organic EL element from moisture and oxygen is provided.

In FIG. 11B , the hole transport layer 55 and the electron transport layer 57 are shown as one layer, but depending on the structure of the organic EL display device, a plurality of layers having a hole blocking layer or an electron blocking layer are formed. may be In addition, between the first electrode 54 and the hole transport layer 55 , a hole injection layer having an energy band structure capable of smoothly injecting holes from the first electrode 54 to the hole transport layer 55 . may be formed. Similarly, an electron injection layer may be formed also between the second electrode 58 and the electron transport layer 57 .

Each of the red layer 56R, the green layer 56G, and the blue layer 56B may be formed by a single light emitting layer, or may be formed by laminating a plurality of layers. For example, the red layer 56R may be composed of two layers, the upper layer may be formed of a red light emitting layer, and the lower layer may be formed of a hole transporting layer or an electron blocking layer. Alternatively, the lower layer may be formed of a red light emitting layer, and the upper layer may be formed of an electron transporting layer or a hole blocking layer. By providing the layer below or above the light emitting layer in this way, there is an effect of improving the color purity of the light emitting element by adjusting the light emitting position in the light emitting layer and adjusting the optical path length.

In addition, although the example of the red layer 56R is shown here, the same structure may be employ|adopted also for the green layer 56G and the blue layer 56B. In addition, two or more layers may be sufficient as the number of lamination|stacking. Furthermore, layers of different materials such as the light emitting layer and the electron blocking layer may be laminated, or layers of the same material may be laminated, for example, by laminating two or more light emitting layers.

In manufacture of such an electronic device, the above-mentioned film forming apparatus 1 is applicable, and the said manufacturing method includes the conveyance process of conveying the board|substrate 53 by the conveyance apparatus 2, The board|substrate 53 being conveyed. It may include a deposition process of depositing at least one layer of each layer by the deposition apparatus 3 .

<Other embodiment>

The evaporation source 6 may be a spot source other than a line source. The deposition-preventing plate units 7 and 8 may be applied to a film forming apparatus other than the in-line film forming apparatus or a vapor deposition apparatus.

A structure other than the structure illustrated in FIG. 5 can also be employ|adopted for the structure which overlaps the edge part of the adjoining deposition prevention board. 12A to 12C show an example thereof. 12(A) to 12(C) show a planar view structure of a portion corresponding to part P1 in FIG. 5 , and a deposition-preventing plate 72' and an anti-caking plate instead of the deposition-preventing plate 72 The structure which overlaps each edge part of the deposition-preventing plate 74' in place of (74) is shown. 12(A) is an example in which the deposition-preventing plate 72' and the deposition-preventing plate 74' do not have a configuration corresponding to the overlapping portion 72b described above, and flat plates are stacked in the thickness direction. It has the advantage of being simple to configure. The example of FIG. 12(B) is a structure in which thin parts are provided at each end of the deposition-preventing plate 72' and the deposition-preventing plate 74', and the thin parts are overlapped. It is possible to increase the effect of preventing leakage of the deposition material. The example of FIG. 12(C) is a structure in which a convex part is provided in the edge part of the deposition preventing plate 72', a recessed part is provided in the edge part of the deposition preventing plate 74', and the convex part is inserted into the recessed part and overlapped. It is possible to increase the effect of preventing leakage of the deposition material.

The invention is not limited to the above embodiments, and various changes and modifications are possible without departing from the spirit and scope of the invention. Accordingly, the claims are appended to clarify the scope of the invention.

1: film forming device
2: conveying device
3: deposition apparatus
6: Evaporator
7: Mounting plate unit
8: installation plate unit

Claims (11)

an evaporation source for emitting a deposition material to the substrate;
As a film forming apparatus having a deposition preventing plate unit for regulating the emission range of the deposition material by the deposition source,
The anchoring plate unit,
and a plurality of deposition-preventing plates disposed adjacent to the deposition source in a circumferential direction,
The film-forming apparatus characterized in that the edge portions in the circumferential direction of the adjacent deposition-preventing plates overlap each other. According to claim 1,
The plurality of deposition-preventing plates,
a first deposition-preventing plate;
and a second deposition-preventing plate adjacent to the first deposition-preventing plate in the circumferential direction,
The second deposition-preventing plate,
A first portion including an edge portion overlapping the first deposition-preventing plate,
and a second portion that does not overlap the first deposition-preventing plate,
The said 1st part is shifted in the plate|board thickness direction with respect to the said 2nd part, The film-forming apparatus characterized by the above-mentioned. According to claim 1,
and a support member for supporting the deposition-preventing plate unit;
The deposition preventing plate unit, together with the supporting member, is detachable from the deposition device. 4. The method of claim 3,
The deposition-preventing plate unit covers the entire support member with respect to the deposition source. 4. The method of claim 3,
The plurality of deposition-preventing plates,
and a deposition preventing plate detachably mounted to the support member. 4. The method of claim 3,
The plurality of deposition-preventing plates,
a first mounting plate detachably mounted to the support member;
and a second deposition-preventing plate mounted on the first deposition-preventing plate without being mounted on the support member. According to claim 1,
The anchoring plate unit,
Including a plurality of types of anti-caking plates as the plurality of anti-caking plates, and
A film forming apparatus comprising a plurality of deposition-preventing plates of the same type. According to claim 1,
The deposition source is a line source,
The anchoring plate unit,
It has a rectangular cylindrical shape having a long side along an extension direction of the evaporation source and a short side along an intersection direction intersecting with the extension direction,
The anti-caking plate unit can be disassembled into the plurality of anti-caking plates in a predetermined order,
Among the plurality of deposition-preventing plates, the deposition-preventing plate constituting the short side portion is faster than the deposition preventing plate constituting the long side portion. According to claim 1,
and a transport device for transporting the substrate;
The film forming apparatus,
It is an in-line type film-forming apparatus which vapor-deposits while conveying the said board|substrate by the said conveyance apparatus, The film-forming apparatus characterized by the above-mentioned. A film forming method using the film forming apparatus according to claim 9, comprising:
a conveying step of conveying the substrate by the conveying device;
and a vapor deposition step of performing vapor deposition on the transferred substrate by the vapor deposition source. A method for manufacturing an electronic device using the film forming apparatus according to claim 9, comprising:
a conveying step of conveying the substrate by the conveying device;
and a vapor deposition step of performing vapor deposition on the transported substrate by the vapor deposition source.

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