JP2022092406A - Film deposition apparatus, film deposition method and manufacturing method of electronic device - Google Patents

Film deposition apparatus, film deposition method and manufacturing method of electronic device Download PDF

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JP2022092406A
JP2022092406A JP2020205211A JP2020205211A JP2022092406A JP 2022092406 A JP2022092406 A JP 2022092406A JP 2020205211 A JP2020205211 A JP 2020205211A JP 2020205211 A JP2020205211 A JP 2020205211A JP 2022092406 A JP2022092406 A JP 2022092406A
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protective plate
film forming
protective
forming apparatus
plate unit
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JP7216064B2 (en
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貴宏 砂川
Takahiro Sunakawa
功康 佐藤
Kosuke Sato
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Canon Tokki Corp
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
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  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

To prevent the degradation of a deposition preventing property while the maintainability of a deposition preventing plate is improved.SOLUTION: A film deposition apparatus includes a vapor deposition source for discharging a vapor deposition material to a substrate, and a deposition preventing unit for controlling a discharge range of the vapor deposition material from the vapor deposition source. The deposition preventing unit includes multiple deposition preventing plates arranged adjacently in a peripheral direction of the vapor deposition source, edge parts of the adjacent deposition preventing plates overlapping each other.SELECTED DRAWING: Figure 5

Description

本発明は、成膜装置、成膜方法及び電子デバイスの製造方法に関する。 The present invention relates to a film forming apparatus, a film forming method, and a method for manufacturing an electronic device.

有機ＥＬディスプレイ等の製造においては、マスクを用いて基板上に有機材料や金属材料等の蒸着物質が蒸着される。蒸着源から放出される蒸着物質がチャンバ内壁やその他の機構に付着することを防止するため、蒸着源の周囲に防着板を設けた装置が知られている（特許文献１）。 In the manufacture of organic EL displays and the like, a vapor-deposited substance such as an organic material or a metal material is vapor-deposited on a substrate using a mask. An apparatus is known in which a protective plate is provided around the vapor deposition source in order to prevent the vapor deposition material discharged from the vapor deposition source from adhering to the inner wall of the chamber or other mechanisms (Patent Document 1).

特開２０１２－７７３７５号公報Japanese Unexamined Patent Publication No. 2012-7375

蒸着物質の付着が進むと防着板は清掃又は交換される。大型の成膜装置においては、防着板のサイズも大きくなり、そのメンテナンス作業性が悪化する。メンテナンス作業性を向上するため、小さなサイズの防着板を並べて配置することが考えられるが、隣接する防着板の隙間から蒸着物質が漏れ出て防着性能が低下する場合がある。 As the adhesion of the vapor-filmed material progresses, the protective plate is cleaned or replaced. In a large film forming apparatus, the size of the protective plate also becomes large, and the maintenance workability thereof deteriorates. In order to improve maintenance workability, it is conceivable to arrange small size protective plates side by side, but the deposited material may leak from the gaps between the adjacent protective plates and the protective performance may deteriorate.

本発明は、防着板のメンテナンス作業性を向上しつつ、防着性能の低下を防止できる技術を提供するものである。 INDUSTRIAL APPLICABILITY The present invention provides a technique capable of preventing deterioration of adhesion performance while improving maintenance workability of the adhesion plate.

本発明によれば、
基板に蒸着物質を放出する蒸着源と、
前記蒸着源による蒸着物質の放出範囲を規制する防着板ユニットと、
を備えた成膜装置であって、
前記防着板ユニットは、
前記蒸着源の周囲方向に隣接して配置された複数の防着板を備え、
隣接する前記防着板の、前記周囲方向の縁部が互いに重なっている、
ことを特徴とする成膜装置が提供される。 According to the present invention
A thin-film deposition source that releases a thin-film deposition material to the substrate,
A protective plate unit that regulates the emission range of the vapor-filmed material by the thin-film deposition source, and
It is a film forming device equipped with
The protective plate unit is
A plurality of protective plates arranged adjacent to each other in the peripheral direction of the vapor deposition source are provided.
The peripheral edges of the adjacent protective plates overlap each other.
A film forming apparatus characterized by this is provided.

本発明によれば、防着板のメンテナンス作業性を向上しつつ、防着性能の低下を防止できる。 According to the present invention, it is possible to prevent deterioration of the adhesive performance while improving the maintenance workability of the adhesive plate.

本発明の一実施形態に係る成膜装置の正面図。The front view of the film forming apparatus which concerns on one Embodiment of this invention. 図１の成膜装置の側面図。The side view of the film forming apparatus of FIG. 図１の成膜装置の内部構造を示す説明図。Explanatory drawing which shows the internal structure of the film forming apparatus of FIG. （Ａ）～（Ｃ）は移動装置による蒸着装置の移動動作の説明図。(A) to (C) are explanatory views of the moving operation of the vapor deposition apparatus by the moving apparatus. 上下の防着板ユニットの斜視図及び部分拡大図。A perspective view and a partially enlarged view of the upper and lower protective plate units. 図５の上下の防着板ユニットの各支持構造の説明図。Explanatory drawing of each support structure of the upper and lower protection plate units of FIG. （Ａ）は防着板間の固定構造の説明図、（Ｂ）は取付部の斜視図、（Ｃ）は支持部材と取付部との固定構造の説明図。(A) is an explanatory view of the fixing structure between the protective plates, (B) is a perspective view of the mounting portion, and (C) is an explanatory view of the fixing structure between the support member and the mounting portion. 一部の防着板を取り外した態様を示す図。The figure which shows the mode in which a part of the protective plate was removed. 図５の上側の防着板ユニットをユニット単位で取り外した態様を示す図。It is a figure which shows the mode that the upper side protection plate unit of FIG. 5 was removed unit by a unit. 図５の下側の防着板ユニットをユニット単位で取り外した態様を示す図。It is a figure which shows the mode which removed the protection plate unit on the lower side of FIG. 5 in a unit unit. （Ａ）は有機ＥＬ表示装置の全体図、（Ｂ）は１画素の断面構造を示す図。(A) is an overall view of an organic EL display device, and (B) is a view showing a cross-sectional structure of one pixel. （Ａ）～（Ｃ）は縁部の重なり構造の他の例を示す図。(A) to (C) are diagrams showing other examples of the overlapping structure of the edges.

以下、添付図面を参照して実施形態を詳しく説明する。尚、以下の実施形態は特許請求の範囲に係る発明を限定するものではない。実施形態には複数の特徴が記載されているが、これらの複数の特徴の全てが発明に必須のものとは限らず、また、複数の特徴は任意に組み合わせられてもよい。さらに、添付図面においては、同一若しくは同様の構成に同一の参照番号を付し、重複した説明は省略する。 Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. The following embodiments do not limit the invention according to the claims. Although a plurality of features are described in the embodiment, not all of the plurality of features are essential for the invention, and the plurality of features may be arbitrarily combined. Further, in the attached drawings, the same or similar configurations are given the same reference numbers, and duplicate explanations are omitted.

＜成膜装置の概要＞
図１は本発明の一実施形態に係る成膜装置１の正面図、図２は成膜装置１の側面図である。図３は成膜装置１の内部構造を示す説明図である。なお、各図において矢印Ｘ及びＹは互いに直交する水平方向を示し、矢印Ｚは垂直方向（鉛直方向）を示す。成膜装置１は、搬送装置２と、複数の蒸着装置３と、を備える。複数の蒸着装置３はＸ方向に並べて配置されており、搬送装置２はこれら蒸着装置３の上方に位置するよう、フレーム４に支持されている。フレーム４は複数の支柱４ａと複数の支柱４ａに支持された複数の梁４ｂとを備え、搬送装置２は梁４ｂに固定されている。 <Overview of film forming equipment>
FIG. 1 is a front view of the film forming apparatus 1 according to an embodiment of the present invention, and FIG. 2 is a side view of the film forming apparatus 1. FIG. 3 is an explanatory diagram showing the internal structure of the film forming apparatus 1. In each figure, the arrows X and Y indicate the horizontal direction orthogonal to each other, and the arrow Z indicates the vertical direction (vertical direction). The film forming apparatus 1 includes a transport device 2 and a plurality of vapor deposition apparatus 3. A plurality of thin-film deposition devices 3 are arranged side by side in the X direction, and the transfer device 2 is supported by the frame 4 so as to be located above the thin-film deposition devices 3. The frame 4 includes a plurality of columns 4a and a plurality of beams 4b supported by the plurality of columns 4a, and the transport device 2 is fixed to the beams 4b.

搬送装置２は、使用時に真空に維持される搬送室２０ｃを内部に形成する搬送チャンバ２０を備える。搬送チャンバ２０のＸ方向の一端部には搬入口２０ａが、他端部には搬出口２０ｂが設けられており、処理対象物は、搬入口２０ａから搬送室２０ｃ内に搬入され、処理後に搬出口２０ｂから外部へ搬出される。搬入口２０ａ及び搬出口２０ｂにはゲートバルブが設けられる。 The transfer device 2 includes a transfer chamber 20 that internally forms a transfer chamber 20c that is maintained in a vacuum during use. A carry-in inlet 20a is provided at one end of the transfer chamber 20 in the X direction, and a carry-out port 20b is provided at the other end. It is carried out from the exit 20b. Gate valves are provided at the carry-in inlet 20a and the carry-out port 20b.

搬送室２０ｃには、Ｘ方向に配列された複数の搬送ローラ２１が設けられている。この搬送ローラ２１の列は、Ｙ方向に離間して二列配置されている。各搬送ローラ２１はＹ方向の回転軸周りに回転する。搬送対象物は、二列の搬送ローラ２１の列に、そのＹ方向の両端部が載置され、搬送ローラ２１の回転によってＸ方向に水平姿勢で搬送される。本実施形態では処理対象物の搬送機構としてローラ機構を用いたが、磁気浮上搬送等、他の種類の搬送機構であってもよい。 The transport chamber 20c is provided with a plurality of transport rollers 21 arranged in the X direction. The rows of the transport rollers 21 are arranged in two rows separated in the Y direction. Each transport roller 21 rotates around a rotation axis in the Y direction. The objects to be transported are placed on both ends in the Y direction in two rows of transport rollers 21, and are transported in a horizontal posture in the X direction by the rotation of the transport rollers 21. In the present embodiment, the roller mechanism is used as the transport mechanism of the object to be processed, but other types of transport mechanisms such as magnetic levitation transport may be used.

各蒸着装置３は、使用時に真空に維持される内部空間を形成するソースチャンバ３ａを備える。ソースチャンバ３ａは、上部に開口部が形成された箱型を有しており、開口部を介して、搬送室２０ｃとソースチャンバ３ａの内部空間とが連通している。蒸着装置３は上方に蒸着物質６ａを放出する蒸着源６を備える。本実施形態の蒸着源６はいわゆるラインソースであり、搬送装置２での処理対象物の搬送方向（Ｘ方向）と交差する方向（本実施形態では搬送方向と直交するＹ方向）に延設されている。蒸着源６は、蒸着物質６ａの原材料を収容する坩堝や、坩堝を加熱するヒータ等を備え、原材料を加熱してその蒸気である蒸着物質を搬送室２０ｃへ放出する。 Each vapor deposition apparatus 3 includes a source chamber 3a that forms an internal space that is maintained in vacuum during use. The source chamber 3a has a box shape having an opening formed in the upper portion, and the transfer chamber 20c and the internal space of the source chamber 3a communicate with each other through the opening. The vapor deposition apparatus 3 includes a vapor deposition source 6 that discharges the vapor deposition substance 6a upward. The vapor deposition source 6 of the present embodiment is a so-called line source, and is extended in a direction intersecting the transport direction (X direction) of the object to be processed by the transport device 2 (in the present embodiment, the Y direction orthogonal to the transport direction). ing. The thin-film deposition source 6 includes a crucible for accommodating the raw material of the vapor-deposited substance 6a, a heater for heating the crucible, and the like, and heats the raw material to release the vapor-deposited substance which is the vapor to the transport chamber 20c.

蒸着源６の周囲には防着板ユニット７及び８が設けられている。防着板ユニット７及び８は蒸着源６からの蒸着物質６ａがソースチャンバ３ａの壁部や周辺の他の機構に付着しないようにその放出範囲を規制する遮蔽壁を構成している。防着板ユニット８は下側に位置し、防着板ユニット７は上側に位置し、防着板ユニット７の上部は搬送室２０ｃに進入している。本実施形態の場合、防着板ユニット７及び８はソースチャンバ３ａに支持されている。なお、本実施形態では、防着板ユニットとして二つのユニット７及び８を用いたが、一つのユニットを用いてもよい。 Anti-bonding plate units 7 and 8 are provided around the vapor deposition source 6. The protective plate units 7 and 8 constitute a shielding wall that regulates the emission range of the vapor-deposited substance 6a from the vapor deposition source 6 so as not to adhere to the wall portion of the source chamber 3a or other mechanisms around the source chamber 3a. The protective plate unit 8 is located on the lower side, the protective plate unit 7 is located on the upper side, and the upper portion of the protective plate unit 7 enters the transport chamber 20c. In the case of this embodiment, the protective plate units 7 and 8 are supported by the source chamber 3a. In this embodiment, two units 7 and 8 are used as the protective plate unit, but one unit may be used.

成膜装置１は、搬送装置２により処理対象物を搬送しながら（搬送工程）、蒸着装置３により処理対象物に蒸着物質を蒸着する（蒸着工程）、成膜方法を実行可能な、インライン型の成膜装置である。成膜装置１は、例えば、表示装置（フラットパネルディスプレイなど）や薄膜太陽電池、有機光電変換素子（有機薄膜撮像素子）等の電子デバイスや、光学部材等を製造する、電子デバイスの製造方法を実行する製造装置に適用可能である。図３では、処理対象物として基板１０が例示されている。基板１０はマスク１１と共にＸ方向に搬送され、基板１０の下側に位置するマスク１１を通して蒸着物質を基板１０に蒸着することにより、所定のパターンの蒸着物質の薄膜を基板１００に形成することができる。基板１０は例えばガラス、樹脂、金属等の材料からなる板材であり、蒸着物質としては、有機材料、無機材料（金属、金属酸化物など）などの物質である。 The film forming apparatus 1 is an in-line type capable of executing a film forming method while conveying the object to be processed by the conveying device 2 (conveying step) and depositing a vapor-deposited substance on the object to be processed by the vapor deposition apparatus 3 (depositing step). It is a film forming apparatus of. The film forming apparatus 1 is, for example, a method for manufacturing an electronic device for manufacturing an electronic device such as a display device (flat panel display or the like), a thin film solar cell, an organic photoelectric conversion element (organic thin film image pickup element), an optical member, or the like. Applicable to the manufacturing equipment to be executed. In FIG. 3, the substrate 10 is exemplified as a processing target. The substrate 10 is conveyed in the X direction together with the mask 11, and a thin film of the vapor-deposited substance having a predetermined pattern can be formed on the substrate 100 by depositing the vapor-deposited substance on the substrate 10 through the mask 11 located under the substrate 10. can. The substrate 10 is a plate material made of a material such as glass, resin, or metal, and the vapor deposition material is a substance such as an organic material or an inorganic material (metal, metal oxide, or the like).

本実施形態では、複数の蒸着装置３が基板１０の搬送方向に配置されている。蒸着装置３により異なる種類の蒸着物質を放出する場合、基板１０に異なる蒸着物質を連続的に蒸着することができる。なお、蒸着装置３の数は３つに限られず、１つあるいは２つでもよいし、４つ以上であってもよい。 In this embodiment, a plurality of thin-film deposition devices 3 are arranged in the transport direction of the substrate 10. When different types of vapor-deposited substances are discharged by the thin-film deposition apparatus 3, different vapor-deposited substances can be continuously vapor-deposited on the substrate 10. The number of the vapor deposition apparatus 3 is not limited to three, and may be one, two, or four or more.

各蒸着装置３には、それぞれ、蒸着装置３を移動させる移動装置７が設けられている。蒸着装置３を移動させることで、そのメンテナンスが容易になる。また、搬送装置２のメンテナンスも容易になる。移動装置７は、走行ユニット５ａと、一対の昇降ユニット５ｂとを備える。走行ユニット５ａは、例えば、モータ等の駆動源と、駆動源の駆動力により転動する車輪とを備え、工場の床に敷設されたレール部材などのガイド部５ｃに沿ってＹ方向に往復移動可能である。一対の昇降ユニット５ｂは、走行ユニット５ａに搭載されている。蒸着装置３は一対の昇降ユニット５ｂの間に位置し、一対の昇降ユニット５ｂによって昇降される。各昇降ユニット５ｂは、モータ等の駆動源と、駆動源の駆動力により蒸着装置３を昇降させる機構とを含み、一対の昇降ユニット５ｂは同期的に駆動される。 Each vapor deposition apparatus 3 is provided with a moving device 7 for moving the vapor deposition apparatus 3. By moving the vapor deposition apparatus 3, maintenance thereof becomes easy. In addition, maintenance of the transport device 2 becomes easy. The moving device 7 includes a traveling unit 5a and a pair of elevating units 5b. The traveling unit 5a includes, for example, a drive source such as a motor and wheels that are rotated by the drive force of the drive source, and reciprocates in the Y direction along a guide portion 5c such as a rail member laid on the floor of a factory. It is possible. The pair of elevating units 5b are mounted on the traveling unit 5a. The vapor deposition apparatus 3 is located between the pair of elevating units 5b and is elevated by the pair of elevating units 5b. Each elevating unit 5b includes a drive source such as a motor and a mechanism for elevating and lowering the vapor deposition apparatus 3 by the driving force of the drive source, and the pair of elevating units 5b are driven synchronously.

図４は移動装置７による蒸着装置３の移動動作の説明図である。図４（Ａ）は蒸着装置３が、成膜処理の際の位置に位置している状態を示している。この位置において、蒸着装置３と搬送装置２とは図３の位置関係にある。蒸着装置３を移動する場合、図４（Ａ）の位置から、図４（Ｂ）に示すように、一対の昇降ユニット５ｂにより下方へ蒸着装置３を降下する。これにより、上部が搬送室２０ｃに進入していた防着板ユニット７が搬送室２０ｃから退避する。続いて走行ユニット５ａを駆動して蒸着装置３をＹ方向に移動する。これにより図４（Ｃ）に示すように、蒸着装置３が搬送装置２の下側からＹ方向にずれた位置に移動する。搬送装置２、蒸着装置３はそれぞれ内部が露出した状態となり、これらのメンテナンスを効率的に行うことができる。 FIG. 4 is an explanatory diagram of the moving operation of the vapor deposition apparatus 3 by the moving device 7. FIG. 4A shows a state in which the vapor deposition apparatus 3 is located at a position during the film forming process. At this position, the vapor deposition apparatus 3 and the transfer apparatus 2 are in the positional relationship shown in FIG. When the vapor deposition apparatus 3 is moved, the vapor deposition apparatus 3 is lowered downward by a pair of elevating units 5b as shown in FIG. 4 (B) from the position of FIG. 4 (A). As a result, the protective plate unit 7 whose upper part has entered the transport chamber 20c is retracted from the transport chamber 20c. Subsequently, the traveling unit 5a is driven to move the vapor deposition apparatus 3 in the Y direction. As a result, as shown in FIG. 4C, the thin-film deposition apparatus 3 moves to a position displaced in the Y direction from the lower side of the transport apparatus 2. The insides of the transport device 2 and the vapor deposition device 3 are exposed, and maintenance thereof can be efficiently performed.

＜防着板ユニット＞
防着板ユニット７及び８の構成について図３及び図５を参照して説明する。図５は防着板ユニット７及び８の斜視図及び部分拡大図である。防着板ユニット７は、蒸着源６から基板１０へ至る蒸着物質の放出空間（換言すると蒸着源６の上方空間）を囲むように構成された筒形の部材であり、例えば、金属製である。本実施形態の場合、蒸着源６がＹ方向に延設されたラインソースの形態であるため、防着板ユニット７は、蒸着源６の形状に沿った角筒形状（本実施形態の場合、平面視で全体として長方形）を有している。 <Anti-bonding plate unit>
The configurations of the protective plate units 7 and 8 will be described with reference to FIGS. 3 and 5. FIG. 5 is a perspective view and a partially enlarged view of the protective plate units 7 and 8. The adhesive plate unit 7 is a tubular member configured to surround a space for releasing a vapor-deposited substance from the vapor deposition source 6 to the substrate 10 (in other words, a space above the vapor deposition source 6), and is made of metal, for example. .. In the case of the present embodiment, since the vapor deposition source 6 is in the form of a line source extending in the Y direction, the protective plate unit 7 has a rectangular tube shape along the shape of the vapor deposition source 6 (in the case of the present embodiment). It has a rectangular shape as a whole in a plan view).

防着板ユニット８は、蒸着源６から基板１０へ至る蒸着物質の放出空間及び蒸着源６を囲むように構成された筒形の部材であり、例えば、金属製である。本実施形態の場合、防着板ユニット７と同様、防着板ユニット８も角筒形状を有している。防着板ユニット７の下端部は、防着板ユニット８の内側に進入しており、防着板ユニット７の下端部と防着板ユニット８の上端部とは鉛直方向（Ｚ方向）において互いに重なっている。これにより防着板ユニット７と防着板ユニット８との間に、Ｚ方向の隙間が無くなり、防着板ユニット７と防着板ユニット８との間から蒸着物質が漏れ出ることを防止できる。 The adhesive plate unit 8 is a tubular member configured to surround the emission space of the vapor-deposited substance from the vapor deposition source 6 to the substrate 10 and the vapor deposition source 6, and is made of metal, for example. In the case of the present embodiment, like the protective plate unit 7, the protective plate unit 8 also has a square tube shape. The lower end of the protective plate unit 7 has entered the inside of the protective plate unit 8, and the lower end of the protective plate unit 7 and the upper end of the protective plate unit 8 are in the vertical direction (Z direction) with each other. overlapping. As a result, there is no gap in the Z direction between the protective plate unit 7 and the protective plate unit 8, and it is possible to prevent the vapor-filmed material from leaking from between the protective plate unit 7 and the protective plate unit 8.

＜防着板ユニット７＞
防着板ユニット７の構造について詳しく説明する。防着板ユニット７は、蒸着源６の周囲方向（本実施形態ではＸ方向及びＹ方向）に並べて配置された複数の防着板７１～７８を備える。防着板ユニット７を複数の防着板７１～７８で構成することで、個々の防着板のサイズを小さくすることができ、防着板単位で清掃又は交換する際のメンテナンス作業性を向上できる。防着板ユニット７は、平面視で、蒸着源６の延設方向（本実施形態ではＹ方向）に沿う一対の長辺部と、延設方向に交差した方向（本実施形態ではＸ方向）に沿う一対の短辺部とを有し、一対の長辺部は、防着板７２～７７で形成され、一対の短辺部は、防着板７１及び７８で形成されている。 <Anti-bonding plate unit 7>
The structure of the protective plate unit 7 will be described in detail. The protective plate unit 7 includes a plurality of protective plates 71 to 78 arranged side by side in the peripheral direction (X direction and Y direction in this embodiment) of the vapor deposition source 6. By configuring the protective plate unit 7 with a plurality of protective plates 71 to 78, the size of each protective plate can be reduced, and maintenance workability when cleaning or replacing each protective plate is improved. can. The protective plate unit 7 has a pair of long sides along the extension direction (Y direction in the present embodiment) of the vapor deposition source 6 and a direction intersecting the extension direction (X direction in the present embodiment) in a plan view. It has a pair of short side portions along the above, a pair of long side portions are formed of a protective plate 72 to 77, and a pair of short side portions are formed of a protective plate 71 and 78.

ここで、防着板を並べて防着板ユニット７を構成した場合、隣接する防着板間の隙間から蒸着物質が漏れる場合がある。本実施形態では蒸着源６の周囲方向に隣接する防着板の縁部は蒸着源６の周囲方向において互いに重ねられており、これにより隣接する防着板間の隙間を無くして防着物質の漏れを防止できる。本実施形態で採用されている構造例に説明する。 Here, when the protective plates are arranged side by side to form the protective plate unit 7, the vapor-filmed substance may leak from the gap between the adjacent protective plates. In the present embodiment, the edges of the protective plates adjacent to the peripheral direction of the vapor deposition source 6 are overlapped with each other in the peripheral direction of the vapor deposition source 6, thereby eliminating the gap between the adjacent protective plates and forming the protective material. Leakage can be prevented. The structural example adopted in this embodiment will be described.

Ｐ１部に着目する。防着板７２と防着板７４とは、蒸着源６の周囲方向（Ｙ方向）に隣接しており、その縁部がＹ方向において重なっている。防着板７２は、平面視でＬ字型の板状の本体部７２ａと重なり部７２ｂとを有している。重なり部７２ｂは、防着板７４と重なる縁部を形成し、本体部７２ａに対して、本体部７２ａの板厚方向（ここではＸ方向）で防着板ユニット７の内側にずれて形成されている。防着板７４は、板状の本体部７４ａの縁部が重なり部７２ｂと重なる。防着板７２と防着板７４との突合せ部分は、その隙間が平面視でＬ字型となるラビリンス構造を形成し、防着板ユニット７の内側から外側へ蒸着物質が漏れ出ることを防止する。本体部７２ａに対して重なり部７２ｂが防着板ユニット７の内側に位置しているので、防着板７２の本体部７２ａと、防着板７４の本体部７４ａとの外面は面一である。防着板７２の本体部７２ａと、防着板７４の本体部７４ａとの間のＹ方向には隙間があってもよいので、防着板７２と防着板７４とのＹ方向の位置精度が緩和され、防着板ユニット７の組み立て作業性が向上する。 Focus on the P1 part. The protective plate 72 and the protective plate 74 are adjacent to each other in the peripheral direction (Y direction) of the vapor deposition source 6, and their edges overlap in the Y direction. The adhesive plate 72 has an L-shaped plate-shaped main body portion 72a and an overlapping portion 72b in a plan view. The overlapping portion 72b forms an edge portion that overlaps with the protective plate 74, and is formed so as to be displaced inward of the protective plate unit 7 in the plate thickness direction (here, the X direction) of the main body portion 72a with respect to the main body portion 72a. ing. In the protective plate 74, the edge portion of the plate-shaped main body portion 74a overlaps with the overlapping portion 72b. The abutting portion between the protective plate 72 and the protective plate 74 forms a labyrinth structure in which the gap is L-shaped in a plan view, and prevents the vapor-filmed material from leaking from the inside to the outside of the protective plate unit 7. do. Since the overlapping portion 72b is located inside the protective plate unit 7 with respect to the main body portion 72a, the outer surfaces of the main body portion 72a of the protective plate 72 and the main body portion 74a of the protective plate 74 are flush with each other. .. Since there may be a gap in the Y direction between the main body portion 72a of the protective plate 72 and the main body portion 74a of the protective plate 74, the positional accuracy of the protective plate 72 and the protective plate 74 in the Y direction is correct. Is alleviated, and the workability of assembling the protective plate unit 7 is improved.

Ｐ２部に着目する。防着板７４と防着板７６とは、蒸着源６の周囲方向（Ｙ方向）に隣接しており、その縁部がＹ方向において重なっている。防着板７４は、板状の本体部７４ａと重なり部７４ｂとを有している。重なり部７４ｂは、防着板７６と重なる縁部を形成し、本体部７４ａに対して、本体部７４ａの板厚方向（ここではＸ方向）で防着板ユニット７の内側にずれて形成されている。防着板７６は、平面視でＬ字型の本体部７６ａの縁部が重なり部７４ｂと重なる。防着板７４と防着板７６との突合せ部分は、その隙間が平面視でＬ字型となるラビリンス構造を形成し、防着板ユニット７の内側から外側へ蒸着物質が漏れ出ることを防止する。本体部７４ａに対して重なり部７４ｂが防着板ユニット７の内側に位置しているので、防着板７４の本体部７４ａと、防着板７６の本体部７６ａとの外面は面一である。防着板７４の本体部７４ａと、防着板７６の本体部７６ａとの間のＹ方向には隙間があってもよいので、防着板７４と防着板７６とのＹ方向の位置精度が緩和され、防着板ユニット７の組み立て作業性が向上する。 Focus on the P2 part. The protective plate 74 and the protective plate 76 are adjacent to each other in the peripheral direction (Y direction) of the vapor deposition source 6, and their edges overlap in the Y direction. The adhesive plate 74 has a plate-shaped main body portion 74a and an overlapping portion 74b. The overlapping portion 74b forms an edge portion that overlaps with the protective plate 76, and is formed so as to be displaced inward of the protective plate unit 7 in the plate thickness direction (here, the X direction) of the main body portion 74a with respect to the main body portion 74a. ing. In the protective plate 76, the edge portion of the L-shaped main body portion 76a overlaps with the overlapping portion 74b in a plan view. The abutting portion between the protective plate 74 and the protective plate 76 forms a labyrinth structure in which the gap is L-shaped in a plan view, and prevents the vapor-filmed material from leaking from the inside to the outside of the protective plate unit 7. do. Since the overlapping portion 74b is located inside the protective plate unit 7 with respect to the main body portion 74a, the outer surfaces of the main body portion 74a of the protective plate 74 and the main body portion 76a of the protective plate 76 are flush with each other. .. Since there may be a gap in the Y direction between the main body portion 74a of the protective plate 74 and the main body portion 76a of the protective plate 76, the positional accuracy of the protective plate 74 and the protective plate 76 in the Y direction Is alleviated, and the workability of assembling the protective plate unit 7 is improved.

Ｐ３部に着目する。防着板７３と防着板７５とは、蒸着源６の周囲方向（Ｙ方向）に隣接しており、その縁部がＹ方向において重なっている。防着板７５は、板状の本体部７５ａと重なり部７５ｂとを有している。重なり部７５ｂは、防着板７３と重なる縁部を形成し、本体部７５ａに対して、本体部７５ａの板厚方向（ここではＸ方向）で防着板ユニット７の内側にずれて形成されている。防着板７３は、平面視でＬ字型の本体部７３ａの縁部が重なり部７５ｂと重なる。防着板７３と防着板７５との突合せ部分は、その隙間が平面視でＬ字型となるラビリンス構造を形成し、防着板ユニット７の内側から外側へ蒸着物質が漏れ出ることを防止する。本体部７５ａに対して重なり部７５ｂが防着板ユニット７の内側に位置しているので、防着板７３の本体部７３ａと、防着板７５の本体部７５ａとの外面は面一である。防着板７３の本体部７３ａと、防着板７５の本体部７５ａとの間のＹ方向には隙間があってもよいので、防着板７３と防着板７５とのＹ方向の位置精度が緩和され、防着板ユニット７の組み立て作業性が向上する。 Focus on the P3 part. The protective plate 73 and the protective plate 75 are adjacent to each other in the peripheral direction (Y direction) of the vapor deposition source 6, and their edges overlap in the Y direction. The adhesive plate 75 has a plate-shaped main body portion 75a and an overlapping portion 75b. The overlapping portion 75b forms an edge portion that overlaps with the protective plate 73, and is formed so as to be displaced inward of the protective plate unit 7 in the plate thickness direction (here, the X direction) of the main body portion 75a with respect to the main body portion 75a. ing. In the protective plate 73, the edge portion of the L-shaped main body portion 73a overlaps with the overlapping portion 75b in a plan view. The abutting portion between the protective plate 73 and the protective plate 75 forms a labyrinth structure in which the gap is L-shaped in a plan view, and prevents the vapor-filmed material from leaking from the inside to the outside of the protective plate unit 7. do. Since the overlapping portion 75b is located inside the protective plate unit 7 with respect to the main body portion 75a, the outer surfaces of the main body portion 73a of the protective plate 73 and the main body portion 75a of the protective plate 75 are flush with each other. .. Since there may be a gap in the Y direction between the main body portion 73a of the protective plate 73 and the main body portion 75a of the protective plate 75, the positional accuracy of the protective plate 73 and the protective plate 75 in the Y direction is correct. Is alleviated, and the workability of assembling the protective plate unit 7 is improved.

Ｐ４部に着目する。防着板７５と防着板７７とは、蒸着源６の周囲方向（Ｙ方向）に隣接しており、その縁部がＹ方向において重なっている。防着板７７は、平面視でＬ字型の板状の本体部７７ａと重なり部７７ｂとを有している。重なり部７７ｂは、防着板７５と重なる縁部を形成し、本体部７７ａに対して、本体部７７ａの板厚方向（ここではＸ方向）で防着板ユニット７の内側にずれて形成されている。防着板７５は、板状の本体部７５ａの縁部が重なり部７７ｂと重なる。防着板７５と防着板７７との突合せ部分は、その隙間が平面視でＬ字型となるラビリンス構造を形成し、防着板ユニット７の内側から外側へ蒸着物質が漏れ出ることを防止する。本体部７７ａに対して重なり部７７ｂが防着板ユニット７の内側に位置しているので、防着板７７の本体部７７ａと、防着板７５の本体部７５ａとの外面は面一である。防着板７５の本体部７５ａと、防着板７７の本体部７７ａとの間のＹ方向には隙間があってもよいので、防着板７５と防着板７７とのＹ方向の位置精度が緩和され、防着板ユニット７の組み立て作業性が向上する。 Focus on the P4 part. The protective plate 75 and the protective plate 77 are adjacent to each other in the peripheral direction (Y direction) of the vapor deposition source 6, and their edges overlap in the Y direction. The adhesive plate 77 has an L-shaped plate-shaped main body portion 77a and an overlapping portion 77b in a plan view. The overlapping portion 77b forms an edge portion that overlaps with the protective plate 75, and is formed so as to be displaced inward of the protective plate unit 7 in the plate thickness direction (here, the X direction) of the main body portion 77a with respect to the main body portion 77a. ing. In the protective plate 75, the edge portion of the plate-shaped main body portion 75a overlaps with the overlapping portion 77b. The butt portion between the protective plate 75 and the protective plate 77 forms a labyrinth structure in which the gap is L-shaped in a plan view, and prevents the vapor-filmed material from leaking from the inside to the outside of the protective plate unit 7. do. Since the overlapping portion 77b is located inside the protective plate unit 7 with respect to the main body portion 77a, the outer surfaces of the main body portion 77a of the protective plate 77 and the main body portion 75a of the protective plate 75 are flush with each other. .. Since there may be a gap in the Y direction between the main body portion 75a of the protective plate 75 and the main body portion 77a of the protective plate 77, the positional accuracy of the protective plate 75 and the protective plate 77 in the Y direction is correct. Is alleviated, and the workability of assembling the protective plate unit 7 is improved.

Ｐ５部に着目する。防着板７１と防着板７２とは、蒸着源６の周囲方向（Ｘ方向）に隣接しており、その縁部がＸ方向において重なっている。防着板７２は、平面視でＬ字型の板状の本体部７２ａと重なり部７２ｂとを有している。すなわち、防着板７２は重なり部７２ｂを蒸着源６の周囲方向の両縁部に有している。重なり部７２ｂは、防着板７１と重なる縁部を形成し、本体部７２ａに対して、本体部７２ａの板厚方向（ここではＹ方向）で防着板ユニット７の内側にずれて形成されている。防着板７１は、板状の本体部７１ａの縁部が重なり部７２ｂと重なる。防着板７１と防着板７２との突合せ部分は、その隙間が平面視でＬ字型となるラビリンス構造を形成し、防着板ユニット７の内側から外側へ蒸着物質が漏れ出ることを防止する。本体部７２ａに対して重なり部７２ｂが防着板ユニット７の内側に位置しているので、防着板７１の本体部７１ａと、防着板７２の本体部７２ａとの外面は面一である。防着板７１の本体部７１ａと、防着板７２の本体部７２ａとの間のＸ方向には隙間があってもよいので、防着板７１と防着板７２とのＸ方向の位置精度が緩和され、防着板ユニット７の組み立て作業性が向上する。 Focus on the P5 part. The protective plate 71 and the protective plate 72 are adjacent to each other in the peripheral direction (X direction) of the vapor deposition source 6, and their edges overlap in the X direction. The adhesive plate 72 has an L-shaped plate-shaped main body portion 72a and an overlapping portion 72b in a plan view. That is, the adhesive plate 72 has overlapping portions 72b on both edges in the peripheral direction of the vapor deposition source 6. The overlapping portion 72b forms an edge portion that overlaps with the protective plate 71, and is formed so as to be displaced inward of the protective plate unit 7 in the plate thickness direction (here, the Y direction) of the main body portion 72a with respect to the main body portion 72a. ing. In the protective plate 71, the edge portion of the plate-shaped main body portion 71a overlaps with the overlapping portion 72b. The abutting portion between the protective plate 71 and the protective plate 72 forms a labyrinth structure in which the gap is L-shaped in a plan view, and prevents the vapor-filmed material from leaking from the inside to the outside of the protective plate unit 7. do. Since the overlapping portion 72b is located inside the protective plate unit 7 with respect to the main body portion 72a, the outer surfaces of the main body portion 71a of the protective plate 71 and the main body portion 72a of the protective plate 72 are flush with each other. .. Since there may be a gap in the X direction between the main body portion 71a of the protective plate 71 and the main body portion 72a of the protective plate 72, the positional accuracy of the protective plate 71 and the protective plate 72 in the X direction is sufficient. Is alleviated, and the workability of assembling the protective plate unit 7 is improved.

Ｐ６部に着目する。防着板７１と防着板７３とは、蒸着源６の周囲方向（Ｘ方向）に隣接しており、その縁部がＸ方向において重なっている。防着板７３は、平面視でＬ字型の板状の本体部７３ａと重なり部７３ｂとを有している。重なり部７３ｂは、防着板７１と重なる縁部を形成し、本体部７３ａに対して、本体部７３ａの板厚方向（ここではＹ方向）で防着板ユニット７の内側にずれて形成されている。防着板７１は、板状の本体部７１ａの縁部が重なり部７３ｂと重なる。すなわち、防着板７１は、重なり部を有していない。防着板７１と防着板７３との突合せ部分は、その隙間が平面視でＬ字型となるラビリンス構造を形成し、防着板ユニット７の内側から外側へ蒸着物質が漏れ出ることを防止する。本体部７３ａに対して重なり部７３ｂが防着板ユニット７の内側に位置しているので、防着板７１の本体部７１ａと、防着板７３の本体部７３ａとの外面は面一である。防着板７１の本体部７１ａと、防着板７３の本体部７３ａとの間のＸ方向には隙間があってもよいので、防着板７１と防着板７３とのＸ方向の位置精度が緩和され、防着板ユニット７の組み立て作業性が向上する。 Focus on the P6 part. The protective plate 71 and the protective plate 73 are adjacent to each other in the peripheral direction (X direction) of the vapor deposition source 6, and their edges overlap in the X direction. The adhesive plate 73 has an L-shaped plate-shaped main body portion 73a and an overlapping portion 73b in a plan view. The overlapping portion 73b forms an edge portion that overlaps with the protective plate 71, and is formed so as to be displaced inward of the protective plate unit 7 in the plate thickness direction (here, the Y direction) of the main body portion 73a with respect to the main body portion 73a. ing. In the protective plate 71, the edge portion of the plate-shaped main body portion 71a overlaps with the overlapping portion 73b. That is, the adhesive plate 71 does not have an overlapping portion. The abutting portion between the protective plate 71 and the protective plate 73 forms a labyrinth structure in which the gap is L-shaped in a plan view, and prevents the vapor-filmed material from leaking from the inside to the outside of the protective plate unit 7. do. Since the overlapping portion 73b is located inside the protective plate unit 7 with respect to the main body portion 73a, the outer surfaces of the main body portion 71a of the protective plate 71 and the main body portion 73a of the protective plate 73 are flush with each other. .. Since there may be a gap in the X direction between the main body portion 71a of the protective plate 71 and the main body portion 73a of the protective plate 73, the positional accuracy of the protective plate 71 and the protective plate 73 in the X direction is sufficient. Is alleviated, and the workability of assembling the protective plate unit 7 is improved.

Ｐ７部に着目する。防着板７６と防着板７８とは、蒸着源６の周囲方向（Ｘ方向）に隣接しており、その縁部がＸ方向において重なっている。防着板７６は、平面視でＬ字型の板状の本体部７６ａと重なり部７６ｂとを有している。重なり部７６ｂは、防着板７１と重なる縁部を形成し、本体部７６ａに対して、本体部７６ａの板厚方向（ここではＹ方向）で防着板ユニット７の内側にずれて形成されている。防着板７８は、板状の本体部７８ａの縁部が重なり部７６ｂと重なる。防着板７６と防着板７８との突合せ部分は、その隙間が平面視でＬ字型となるラビリンス構造を形成し、防着板ユニット７の内側から外側へ蒸着物質が漏れ出ることを防止する。本体部７６ａに対して重なり部７６ｂが防着板ユニット７の内側に位置しているので、防着板７６の本体部７６ａと、防着板７８の本体部７８ａとの外面は面一である。防着板７６の本体部７６ａと、防着板７８の本体部７８ａとの間のＸ方向には隙間があってもよいので、防着板７６と防着板７８とのＸ方向の位置精度が緩和され、防着板ユニット７の組み立て作業性が向上する。 Focus on the P7 part. The protective plate 76 and the protective plate 78 are adjacent to each other in the peripheral direction (X direction) of the vapor deposition source 6, and their edges overlap in the X direction. The adhesive plate 76 has an L-shaped plate-shaped main body portion 76a and an overlapping portion 76b in a plan view. The overlapping portion 76b forms an edge portion that overlaps with the protective plate 71, and is formed so as to be displaced inward of the protective plate unit 7 in the plate thickness direction (here, the Y direction) of the main body portion 76a with respect to the main body portion 76a. ing. In the protective plate 78, the edge portion of the plate-shaped main body portion 78a overlaps with the overlapping portion 76b. The abutting portion between the protective plate 76 and the protective plate 78 forms a labyrinth structure in which the gap is L-shaped in a plan view, and prevents the vapor-filmed material from leaking from the inside to the outside of the protective plate unit 7. do. Since the overlapping portion 76b is located inside the protective plate unit 7 with respect to the main body portion 76a, the outer surfaces of the main body portion 76a of the protective plate 76 and the main body portion 78a of the protective plate 78 are flush with each other. .. Since there may be a gap in the X direction between the main body portion 76a of the protective plate 76 and the main body portion 78a of the protective plate 78, the positional accuracy of the protective plate 76 and the protective plate 78 in the X direction Is alleviated, and the workability of assembling the protective plate unit 7 is improved.

Ｐ８部に着目する。防着板７７と防着板７８とは、蒸着源６の周囲方向（Ｘ方向）に隣接しており、その縁部がＸ方向において重なっている。防着板７７は、平面視でＬ字型の板状の本体部７７ａと重なり部７７ｂとを有している。すなわち、防着板７７は重なり部７２ｂを蒸着源６の周囲方向の両縁部に有している。重なり部７７ｂは、防着板７８と重なる縁部を形成し、本体部７７ａに対して、本体部７７ａの板厚方向（ここではＹ方向）で防着板ユニット７の内側にずれて形成されている。防着板７８は、板状の本体部７８ａの縁部が重なり部７７ｂと重なる。すなわち、防着板７８は、重なり部を有していない。防着板７７と防着板７８との突合せ部分は、その隙間が平面視でＬ字型となるラビリンス構造を形成し、防着板ユニット７の内側から外側へ蒸着物質が漏れ出ることを防止する。本体部７７ａに対して重なり部７７ｂが防着板ユニット７の内側に位置しているので、防着板７７の本体部７７ａと、防着板７８の本体部７８ａとの外面は面一である。防着板７７の本体部７７ａと、防着板７８の本体部７８ａとの間のＸ方向には隙間があってもよいので、防着板７７と防着板７７とのＸ方向の位置精度が緩和され、防着板ユニット７の組み立て作業性が向上する。 Focus on the P8 part. The protective plate 77 and the protective plate 78 are adjacent to each other in the peripheral direction (X direction) of the vapor deposition source 6, and their edges overlap in the X direction. The adhesive plate 77 has an L-shaped plate-shaped main body portion 77a and an overlapping portion 77b in a plan view. That is, the adhesive plate 77 has overlapping portions 72b on both edges in the peripheral direction of the vapor deposition source 6. The overlapping portion 77b forms an edge portion that overlaps with the protective plate 78, and is formed so as to be displaced inward of the protective plate unit 7 in the plate thickness direction (here, the Y direction) of the main body portion 77a with respect to the main body portion 77a. ing. In the protective plate 78, the edge portion of the plate-shaped main body portion 78a overlaps with the overlapping portion 77b. That is, the adhesive plate 78 does not have an overlapping portion. The abutting portion between the protective plate 77 and the protective plate 78 forms a labyrinth structure in which the gap is L-shaped in a plan view, and prevents the vapor-filmed material from leaking from the inside to the outside of the protective plate unit 7. do. Since the overlapping portion 77b is located inside the protective plate unit 7 with respect to the main body portion 77a, the outer surfaces of the main body portion 77a of the protective plate 77 and the main body portion 78a of the protective plate 78 are flush with each other. .. Since there may be a gap in the X direction between the main body portion 77a of the protective plate 77 and the main body portion 78a of the protective plate 78, the positional accuracy of the protective plate 77 and the protective plate 77 in the X direction Is alleviated, and the workability of assembling the protective plate unit 7 is improved.

本実施形態では、防着板７１～７８が複数種類の防着板を含み、かつ、防着板ユニット７は同種（同構造）の防着板を複数用いて構成されている。具体的には、防着板７１と防着板７８は同じ種類の防着板の表裏を反転して用いている。防着板７２と防着板７７も同じ種類の防着板の表裏を反転して用いている。防着板７３と防着板７６も同じ種類の防着板の表裏を反転して用いている。防着板７４と防着板７５も同じ種類の防着板の表裏を反転して用いている。このような構成により、防着板の種類を減らことができる。本実施形態では、同種の防着板を全て２つずつ用いているが、同種の防着板の少なくとも一部の種類の防着板を３つ以上用いてもよい。 In the present embodiment, the protective plates 71 to 78 include a plurality of types of protective plates, and the protective plate unit 7 is configured by using a plurality of protective plates of the same type (same structure). Specifically, the protective plate 71 and the protective plate 78 are used by inverting the front and back of the same type of protective plate. The protective plate 72 and the protective plate 77 are also used by inverting the front and back of the same type of protective plate. The protective plate 73 and the protective plate 76 are also used by inverting the front and back of the same type of protective plate. The protective plate 74 and the protective plate 75 are also used by inverting the front and back of the same type of protective plate. With such a configuration, the types of protective plates can be reduced. In the present embodiment, two protective plates of the same type are used, but three or more protective plates of at least a part of the same type may be used.

＜防着板ユニット８＞
防着板ユニット８の構造について詳しく説明する。防着板ユニット８は、防着板ユニット７と同様の構造を有している。防着板ユニット８は、蒸着源６の周囲方向（本実施形態ではＸ方向及びＹ方向）に並べて配置された複数の防着板８１～８８を備える。防着板ユニット８を複数の防着板８１～８８で構成することで、個々の防着板をサイズを小さくすることができ、防着板単位で清掃又は交換する際のメンテナンス作業性を向上できる。防着板ユニット８は、平面視で、蒸着源６の延設方向（本実施形態ではＹ方向）に沿う一対の長辺部と、延設方向に交差した方向（本実施形態ではＸ方向）に沿う一対の短辺部とを有し、一対の長辺部は、防着板８２～８７で形成され、一対の短辺部は、防着板８１及び８８で形成されている。 <Anti-bonding plate unit 8>
The structure of the protective plate unit 8 will be described in detail. The protective plate unit 8 has the same structure as the protective plate unit 7. The protective plate unit 8 includes a plurality of protective plates 81 to 88 arranged side by side in the peripheral direction (X direction and Y direction in this embodiment) of the vapor deposition source 6. By configuring the protective plate unit 8 with a plurality of protective plates 81 to 88, the size of each protective plate can be reduced, and maintenance workability when cleaning or replacing each protective plate is improved. can. The protective plate unit 8 has a pair of long sides along the extending direction (Y direction in the present embodiment) of the vapor deposition source 6 and a direction intersecting the extending direction (X direction in the present embodiment) in a plan view. It has a pair of short side portions along the above, a pair of long side portions are formed of the protective plates 82 to 87, and a pair of short side portions are formed of the protective plates 81 and 88.

防着板ユニット８においても、蒸着源６の周囲方向に隣接する防着板の縁部は互いに重ねられ、その構造は防着板ユニット７のＰ１部～Ｐ８部について説明した構造と同様とすることができる。但し、防着板ユニット７においては、重なり部７２ｂ～７７ｂを、本体部７２ａ～７７ａに対して防着板ユニット７の内側に配置したが、防着板ユニット８においては外側に配置してもよい。この構成によると、防着板ユニット８の内面が面一になり、面一である防着板ユニット７の外面に対して、防着板ユニット８の各防着板をより近接して配置することが可能になる。これは防着物質の漏れの防止に寄与する。 Also in the protective plate unit 8, the edges of the protective plates adjacent to each other in the peripheral direction of the vapor deposition source 6 are overlapped with each other, and the structure thereof is the same as the structure described for the P1 to P8 portions of the protective plate unit 7. be able to. However, in the protective plate unit 7, the overlapping portions 72b to 77b are arranged inside the protective plate unit 7 with respect to the main body portions 72a to 77a, but in the protective plate unit 8, even if they are arranged outside. good. According to this configuration, the inner surface of the protective plate unit 8 is flush with each other, and the protective plates of the protective plate unit 8 are arranged closer to the outer surface of the protective plate unit 7 which is flush with each other. Will be possible. This contributes to the prevention of leakage of the adhesive substance.

防着板ユニット８においても、防着板８１～８８が複数種類の防着板を含み、かつ、同種（同構造）の防着板を複数用いて構成されている。具体的には、防着板８１と防着板８８は同じ種類の防着板の表裏を反転して用いている。防着板８２と防着板８７も同じ種類の防着板の表裏を反転して用いている。防着板８３と防着板８６も同じ種類の防着板の表裏を反転して用いている。防着板８４と防着板８５も同じ種類の防着板の表裏を反転して用いている。このような構成により、防着板の種類を減らことができる。本実施形態では、同種の防着板を全て２つずつ用いているが、同種の防着板の少なくとも一部の種類の防着板を３つ以上用いてもよい。 Also in the protective plate unit 8, the protective plates 81 to 88 include a plurality of types of protective plates, and are configured by using a plurality of protective plates of the same type (same structure). Specifically, the protective plate 81 and the protective plate 88 are used by inverting the front and back of the same type of protective plate. The protective plate 82 and the protective plate 87 are also used by inverting the front and back of the same type of protective plate. The protective plate 83 and the protective plate 86 are also used by inverting the front and back of the same type of protective plate. The protective plate 84 and the protective plate 85 are also used by inverting the front and back of the same type of protective plate. With such a configuration, the types of protective plates can be reduced. In the present embodiment, two protective plates of the same type are used, but three or more protective plates of at least a part of the same type may be used.

＜連結・支持構造＞
防着板ユニット７及び防着板ユニット８における防着板の連結・支持構造について図５、図６及び図７（Ａ）～図７（Ｃ）を参照して説明する。防着板ユニット７及び防着板ユニット８の各支持構造１２、１３を示す斜視図である。 <Connected / supported structure>
The connection / support structure of the protective plate in the protective plate unit 7 and the protective plate unit 8 will be described with reference to FIGS. 5, 6 and 7 (A) to 7 (C). It is a perspective view which shows the support structure 12, 13 of the protection plate unit 7 and the protection plate unit 8.

防着板ユニット７は、支持構造１２によってソースチャンバ３ａに固定されている。支持構造１２は、一対の着脱支持部材１２ａと、一対の固定支持部材１２ｂと、複数のアーム部材１２ｃとを備える。一対の着脱支持部材１２ａと一対の固定支持部材１２ｂとにより、矩形のフレームが形成され、防着板ユニット７はこの矩形のフレームの内側に位置している。着脱支持部材１２ａは、防着板ユニット７の長辺部に沿って延設された（Ｙ方向に延設された）棒状の部材であり、本実施形態の場合、角型の鋼管である。固定支持部材１２ｂは、防着板ユニット７の短辺部に沿って延設された（Ｘ方向に延設された）棒状の部材であり、本実施形態の場合、角型の鋼管である。着脱支持部材１２ａと固定支持部材１２ｂとは、これらの各端部がボルトなどの締結構造によって分離自在に固定されている。アーム部材１２ｃは、固定支持部材１２ｂとソースチャンバ３ａの壁部とを連結する。 防着板ユニット７は、蒸着源６に対して着脱支持部材１２ａ、固定支持部材１２及びアーム部材１２ｃの各部材の全体を覆っているため、これら各部材に蒸着物質が付着することを防止できる。 The protective plate unit 7 is fixed to the source chamber 3a by the support structure 12. The support structure 12 includes a pair of detachable support members 12a, a pair of fixed support members 12b, and a plurality of arm members 12c. A rectangular frame is formed by the pair of detachable support members 12a and the pair of fixed support members 12b, and the protective plate unit 7 is located inside the rectangular frame. The detachable support member 12a is a rod-shaped member extended (extended in the Y direction) along the long side portion of the protective plate unit 7, and is a square steel pipe in the case of the present embodiment. The fixed support member 12b is a rod-shaped member extended (extended in the X direction) along the short side portion of the protective plate unit 7, and is a square steel pipe in the case of the present embodiment. Each end of the detachable support member 12a and the fixed support member 12b is detachably fixed by a fastening structure such as a bolt. The arm member 12c connects the fixed support member 12b and the wall portion of the source chamber 3a. Since the adhesive plate unit 7 covers the entire members of the detachable support member 12a, the fixed support member 12, and the arm member 12c with respect to the vapor deposition source 6, it is possible to prevent the vapor deposition substance from adhering to each of these members. ..

防着板ユニット７の各防着板７１～７８のうち、防着板７１と防着板７２及び７３とは連結部１０で着脱自在に固定され、防着板７８と防着板７６及び７７とは連結部１０で着脱自在に固定されている。図７（Ａ）は連結部１０の断面図である。連結部１０は、固定部１０ａと固定部１０ｂとを重ねてボルト１０ｃで締結する構造である。固定部１０ａにはボルト１０ｃのネジ部が挿通する穴が形成され、固定部１０ｂにはボルト１０ｃのネジ部が螺合するネジ孔が形成されている。防着板７１と防着板７２及び７３との固定部１０においては、後述する図８に例示するように、防着板７１に板状の固定部１０ａが設けられ、防着板７２及び７３にそれぞれ凹部上の固定部１０ｂが形成され、固定部１０ｂの上に固定部１０ａが重ねられる。防着板７８と防着板７６及び７７との連結部１０も同様である。なお、固定部１０の構造は、防着板を分離可能に固定できればどのような構造でもよい。 Of the protective plates 71 to 78 of the protective plate unit 7, the protective plate 71 and the protective plates 72 and 73 are detachably fixed by the connecting portion 10, and the protective plate 78 and the protective plates 76 and 77 are fixed to each other. Is detachably fixed by the connecting portion 10. FIG. 7A is a cross-sectional view of the connecting portion 10. The connecting portion 10 has a structure in which the fixing portion 10a and the fixing portion 10b are overlapped and fastened with a bolt 10c. The fixing portion 10a is formed with a hole through which the screw portion of the bolt 10c is inserted, and the fixing portion 10b is formed with a screw hole into which the screw portion of the bolt 10c is screwed. In the fixing portion 10 between the protective plate 71 and the protective plates 72 and 73, as illustrated in FIG. 8 described later, the protective plate 71 is provided with a plate-shaped fixing portion 10a, and the protective plates 72 and 73 are provided. A fixing portion 10b is formed on each of the recesses, and the fixing portion 10a is superposed on the fixing portion 10b. The same applies to the connecting portion 10 between the protective plate 78 and the protective plates 76 and 77. The structure of the fixing portion 10 may be any structure as long as the protective plate can be fixed in a separable manner.

防着板ユニット７の防着板７４と防着板７５は、他の防着板には直接連結されていない。防着板７４と防着板７５は、着脱支持部材１２ａを介して他の防着板と連結されている。防着板７２～７７には、取付部９が設けられており、これらはＹ方向に配列されており、着脱支持部材１２ａに着脱自在に固定される。図７（Ｂ）は取付部９の斜視図である。取付部９は、防着板７２～７７の外側面から外側へ突出した板片状の部材であり、端部９ａが防着板７２～７７の外側面に接合されている。取付部９は切り欠き９ｃを有する板状の固定板部９ｂと、固定板部９ｂのＹ方向の両端部から立ち上がった縦壁部９ｄを有する。 The protective plate 74 and the protective plate 75 of the protective plate unit 7 are not directly connected to other protective plates. The protective plate 74 and the protective plate 75 are connected to another protective plate via the detachable support member 12a. The adhesive plates 72 to 77 are provided with mounting portions 9, which are arranged in the Y direction and are detachably fixed to the detachable support member 12a. FIG. 7B is a perspective view of the mounting portion 9. The mounting portion 9 is a plate-like member protruding outward from the outer surface of the protective plates 72 to 77, and the end portion 9a is joined to the outer surface of the protective plates 72 to 77. The mounting portion 9 has a plate-shaped fixing plate portion 9b having a notch 9c, and a vertical wall portion 9d rising from both ends of the fixing plate portion 9b in the Y direction.

図７（Ｃ）は取付部９と着脱支持部材１２ａとの固定構造の例を示している。取付部９の固定板部９ｂが、着脱支持部材１２ａと押圧板１５との間に差し込まれ、ボルト１４を締結することで取付部９が着脱支持部材１２ａに固定される。着脱支持部材１２ａにはボルト１４のネジ部が螺合するネジ孔が形成されている。固定板部９ｂは切り欠き９ｃの大きさの分だけ、ボルト１４に対する位置を調整可能である。つまり、着脱支持部材１２ａに対する防着板７２～７７のＸ方向及びＹ方向の固定位置の調整が可能である。なお、防着板７２～７７と着脱支持部材１２ａとの固定構造は互いに分離可能に固定できればどのような構造でもよい。 FIG. 7C shows an example of a fixed structure of the mounting portion 9 and the detachable support member 12a. The fixing plate portion 9b of the mounting portion 9 is inserted between the attachment / detachment support member 12a and the pressing plate 15, and the attachment portion 9 is fixed to the attachment / detachment support member 12a by fastening the bolt 14. The detachable support member 12a is formed with a screw hole into which the screw portion of the bolt 14 is screwed. The position of the fixing plate portion 9b with respect to the bolt 14 can be adjusted by the size of the notch 9c. That is, it is possible to adjust the fixed positions of the adhesive plates 72 to 77 with respect to the detachable support member 12a in the X direction and the Y direction. The fixing structure of the adhesive plates 72 to 77 and the detachable support member 12a may be any structure as long as they can be fixed separately from each other.

本実施形態では、防着板同士を連結する構造（連結部１０）と、着脱支持部材１２ａを介して防着板を連結する構造とを併用した。しかし、全防着板が隣接する防着板と直接連結された構造でもよい。逆に、全防着板が着脱支持部材１２ａを介して連結された構造であってもよい。 In the present embodiment, a structure for connecting the protective plates to each other (connecting portion 10) and a structure for connecting the protective plates via the detachable support member 12a are used in combination. However, a structure in which all the protective plates are directly connected to the adjacent protective plates may be used. On the contrary, the structure may be such that all the protective plates are connected via the detachable support member 12a.

防着板ユニット８は、支持構造１３によってソースチャンバ３ａに固定されている。支持構造１３は、一対の着脱支持部材１３ａと、複数のアーム部材１３ｂとを備える。防着板ユニット８は一対の着脱支持部材１３ａの間に位置している。着脱支持部材１３ａは、防着板ユニット８の長辺部に沿って延設された（Ｙ方向に延設された）棒状の部材であり、本実施形態の場合、角型の鋼管である。アーム部材１３ｂは、着脱支持部材１３ａとソースチャンバ３ａの壁部とを連結する。着脱支持部材１３ａは、ボルトなどの締結構造によって分離自在にアーム部材１３ｂに固定されている。 The protective plate unit 8 is fixed to the source chamber 3a by the support structure 13. The support structure 13 includes a pair of detachable support members 13a and a plurality of arm members 13b. The adhesive plate unit 8 is located between the pair of detachable support members 13a. The detachable support member 13a is a rod-shaped member extended (extended in the Y direction) along the long side portion of the protective plate unit 8, and is a square steel pipe in the case of the present embodiment. The arm member 13b connects the detachable support member 13a and the wall portion of the source chamber 3a. The detachable support member 13a is detachably fixed to the arm member 13b by a fastening structure such as a bolt.

防着板ユニット８は、蒸着源６に対して着脱支持部材１３ａ及びアーム部材１３ｂの各部材の全体を覆っているため、これら各部材に蒸着物質が付着することを防止できる。 Since the adhesive plate unit 8 covers the entire members of the detachable support member 13a and the arm member 13b with respect to the vapor deposition source 6, it is possible to prevent the vapor deposition substance from adhering to each of these members.

防着板ユニット８の各防着板８１～８８のうち、防着板８１と防着板８２及び８３とは連結部１０で着脱自在に固定され、防着板８８と防着板８６及び８７とは連結部１０で着脱自在に固定されている。連結部１０の構造は、図７（Ａ）に示した通りである。防着板８１と防着板８２及び８３との固定部１０においては、後述する図８に例示するように、防着板８１に板状の固定部１０ａが設けられ、防着板８２及び８３にそれぞれ凹部上の固定部１０ｂが形成され、固定部１０ｂの上（横）に固定部１０ａが重ねられる。防着板８８と防着板８６及び８７との連結部１０も同様である。なお、防着板ユニット８においても固定部１０の構造は、防着板を分離可能に固定できればどのような構造でもよい。 Of the protective plates 81 to 88 of the protective plate unit 8, the protective plate 81 and the protective plates 82 and 83 are detachably fixed by the connecting portion 10, and the protective plate 88 and the protective plates 86 and 87 are fixed to each other. Is detachably fixed by the connecting portion 10. The structure of the connecting portion 10 is as shown in FIG. 7 (A). In the fixing portion 10 between the protective plate 81 and the protective plates 82 and 83, as illustrated in FIG. 8 described later, the protective plate 81 is provided with a plate-shaped fixing portion 10a, and the protective plates 82 and 83 are provided. A fixing portion 10b is formed on each of the recesses, and the fixing portion 10a is overlapped on (horizontally) the fixing portion 10b. The same applies to the connecting portion 10 between the protective plate 88 and the protective plates 86 and 87. The structure of the fixing portion 10 of the protective plate unit 8 may be any structure as long as the protective plate can be fixed in a separable manner.

防着板ユニット８の防着板８４と防着板８５は、他の防着板には直接連結されていない。着脱支持部材１３ａを介して他の防着板と連結されている。防着板８２～８７には、取付部９が設けられており、これらはＹ方向に配列されており、着脱支持部材１３ａに着脱自在に固定される。防着板ユニット８の取付部９の構造と、取付部９と着脱支持部材１３ａとの固定構造は図７（Ｂ）、図７（Ｃ）に例示したものと同じである。なお、防着板ユニット８においても防着板８２～８７と着脱支持部材１３ａとの固定構造は互いに分離可能に固定できればどのような構造でもよい。また、防着板ユニット８においても全防着板が隣接する防着板と直接連結された構造でもよく、逆に、全防着板が着脱支持部材１３ａを介して連結された構造であってもよい。 The protective plate 84 and the protective plate 85 of the protective plate unit 8 are not directly connected to other protective plates. It is connected to another protective plate via the detachable support member 13a. The adhesive plates 82 to 87 are provided with mounting portions 9, which are arranged in the Y direction and are detachably fixed to the detachable support member 13a. The structure of the mounting portion 9 of the protective plate unit 8 and the fixing structure of the mounting portion 9 and the detachable support member 13a are the same as those illustrated in FIGS. 7 (B) and 7 (C). In the protective plate unit 8, the fixing structure of the protective plates 82 to 87 and the detachable support member 13a may be any structure as long as they can be fixed to each other so as to be separable from each other. Further, the protective plate unit 8 may also have a structure in which all the protective plates are directly connected to the adjacent protective plates, and conversely, all the protective plates are connected via the detachable support member 13a. May be good.

＜防着板単位の取り外しとユニット単位の取り外し＞
本実施形態では、防着板ユニット７の各防着板７１～７８を個別に取り外すこともできるし、防着板ユニット７を全体としてソースチャンバ３ａから取り外すこともできる。このように防着板単位の取り外しとユニット単位の取り外しが選択できることで、メンテナンス性を向上できる。例えば、局所的に蒸着物質の付着が多い場合は防着板単位の取り外しを選択して交換し、全体的に蒸着物質の付着が多い場合は一度に防着板ユニット７の全体を交換することもできる。防着板単位の取り外し作業は、例えば、図４（Ｂ）の状態又は図４（Ｃ）の状態で行うことができ、ユニット単位の取り外し作業は、例えば、図４（Ｃ）の状態で行うことができる。防着板ユニット８も同様である。 <Removal of the protective plate unit and removal of the unit unit>
In the present embodiment, each of the protective plates 71 to 78 of the protective plate unit 7 can be individually removed, or the protective plate unit 7 can be removed from the source chamber 3a as a whole. By selecting the removal of the protective plate unit and the removal of the unit unit in this way, maintainability can be improved. For example, if there is a large amount of thin-film deposition locally attached, select and replace the protective plate unit, and if there is a large amount of thin-film deposition, replace the entire protective plate unit 7 at once. You can also do it. The removal work of the protective plate unit can be performed in the state of FIG. 4B or the state of FIG. 4C, for example, and the removal work of the unit unit is performed in the state of FIG. 4C, for example. be able to. The same applies to the protective plate unit 8.

図８は、防着板単位の取り外しの例を示している。図示の例では、防着板ユニット７において、防着板７１と防着板７２とが取り外されている。防着板７１は固定部１０の固定を解除すれば取り外すことができる。防着板７２は、固定部１０の固定の解除と、着脱支持部材１２ａと取付部９との固定の解除により取り外すことができる。 FIG. 8 shows an example of removing the protective plate unit. In the illustrated example, the protective plate 71 and the protective plate 72 are removed from the protective plate unit 7. The protective plate 71 can be removed by releasing the fixing of the fixing portion 10. The adhesive plate 72 can be removed by releasing the fixing of the fixing portion 10 and releasing the fixing between the detachable support member 12a and the mounting portion 9.

防着板ユニット７は、Ｐ１部～Ｐ８部における縁部の重なり関係、及び、着脱支持部材１２ａからの取り外し方向（本実施形態ではＸ方向で防着板ユニット７の内側）に起因して、防着板７１～７８の分解順序が予め定めた順序に制約される。分解順序を優先順に示すと、防着板７１と防着板７８とが最も順序が早い（第一優先順位）。防着板７２は、防着板７１の取り外しが必要な点で次順序（第二優先順位）であり、同様に、防着板７７は、防着板７８の取り外しが必要な点で次順序（第二優先順位）である。防着板７４は、防着板７２の取り外しが必要な点で更に次の順序（第三優先順位）であり、同様に、防着板７５は、防着板７７の取り外しが必要な点で更に次の順序（第三優先順位）である。防着板７３と防着板７６とが最も順序が遅い（最低優先順位）。組み立て時の順序はこの逆となる。 The adhesive plate unit 7 is caused by the overlapping relationship of the edge portions in the P1 portion to the P8 portion and the removal direction from the detachable support member 12a (in the present embodiment, the inside of the protective plate unit 7 in the X direction). The disassembly order of the adhesive plates 71 to 78 is restricted to a predetermined order. When the disassembly order is shown in the order of priority, the protective plate 71 and the protective plate 78 have the earliest order (first priority). The protective plate 72 is in the next order (second priority) in that the protective plate 71 needs to be removed, and similarly, the protective plate 77 is in the next order in that the protective plate 78 needs to be removed. (Second priority). The protective plate 74 is in the following order (third priority) in that the protective plate 72 needs to be removed, and similarly, the protective plate 75 needs to be removed in that the protective plate 77 needs to be removed. Further, the order is as follows (third priority). The protective plate 73 and the protective plate 76 have the slowest order (lowest priority). The order at the time of assembly is the reverse of this.

本実施形態では、防着板７１と防着板７８とが最も分解の順序が早い。これらの防着板７１、７８は、蒸着源６の延設方向の端部周辺に位置している。蒸着源６の延設方向の端部周辺は、他の機構（各種センサやアクチュエータなど）の配置スペースとなることが多い。つまり、防着板７１と防着板７８とは蒸着装置３の内部メンテナンスの際に取り外される可能性が高い部位であり、その分解優先順位が高い（他の防着板の取り外しを要しない）ことで、メンテナンス作業性を向上できる。 In the present embodiment, the protective plate 71 and the protective plate 78 are disassembled in the earliest order. These adhesive plates 71 and 78 are located around the end portion of the vapor deposition source 6 in the extending direction. Around the end of the vapor deposition source 6 in the extending direction is often a space for arranging other mechanisms (various sensors, actuators, etc.). That is, the protective plate 71 and the protective plate 78 are parts that are likely to be removed during internal maintenance of the vapor deposition apparatus 3, and their disassembly priority is high (there is no need to remove other protective plates). Therefore, maintenance workability can be improved.

図８の例では、防着板ユニット８において、防着板８１が取り外されている。防着板８１は固定部１０の固定を解除すれば取り外すことができる。防着板ユニット８においても、防着板ユニット７と同様、縁部の重なり関係、及び、着脱支持部材１３ａからの取り外し方向（本実施形態ではＸ方向で防着板ユニット８の内側）に起因して、防着板８１～８８の分解順序が予め定めた順序に制約される。分解順序の優先順は防着板ユニット７と同様であり、防着板８１と防着板８８とが最も順序が早く（第一優先順位）、防着板８２と防着板８７は次順序（第二優先順位）であり、防着板８４と防着板８５は更に次の順序（第三優先順位）であり、防着板８３と防着板８６とが最も順序が遅い（最低優先順位）。組み立て時の順序はこの逆となる。防着板８１と防着板８８とが最も分解の順序が早い理由は、防着板７１、７８と同様である。 In the example of FIG. 8, in the protective plate unit 8, the protective plate 81 is removed. The protective plate 81 can be removed by releasing the fixing of the fixing portion 10. Similar to the protective plate unit 7, the protective plate unit 8 is also caused by the overlapping relationship of the edges and the removal direction from the detachable support member 13a (in the present embodiment, the inside of the protective plate unit 8 in the X direction). Therefore, the disassembly order of the adhesive plates 81 to 88 is restricted to a predetermined order. The priority order of the disassembly order is the same as that of the protective plate unit 7, the protective plate 81 and the protective plate 88 have the earliest order (first priority), and the protective plate 82 and the protective plate 87 have the next order. (Second priority), the protective plate 84 and the protective plate 85 are in the next order (third priority), and the protective plate 83 and the protective plate 86 are in the slowest order (lowest priority). Ranking). The order at the time of assembly is the reverse of this. The reason why the protective plate 81 and the protective plate 88 are disassembled in the earliest order is the same as that of the protective plates 71 and 78.

図９は防着板ユニット７のユニット単位での取り外しの例を示している。着脱支持部材１２ａと着脱支持部材１２ｂとの固定を解除し、クレーン等で防着板ユニット７を着脱支持部材１２ａと共に引き上げることで、防着板ユニット７の全体をソースチャンバ３ａから取り外すことができる。 FIG. 9 shows an example of removing the protective plate unit 7 in units. By releasing the fixing between the detachable support member 12a and the detachable support member 12b and pulling up the protective plate unit 7 together with the detachable support member 12a with a crane or the like, the entire protective plate unit 7 can be removed from the source chamber 3a. ..

図１０は防着板ユニット８のユニット単位での取り外しの例を示している。着脱支持部材１３ａとアーム部材１３ｂとの固定を解除し、クレーン等で防着板ユニット８を着脱支持部材１３ａと共に引き上げることで、防着板ユニット８の全体をソースチャンバ３ａから取り外すことができる。本実施形態では、防着板ユニット８の全体をソースチャンバ３ａから取り外す場合、防着板ユニット７を先に取り外しておくことが必要である。 FIG. 10 shows an example of removing the protective plate unit 8 in units. By releasing the fixing between the attachment / detachment support member 13a and the arm member 13b and pulling up the attachment / detachment plate unit 8 together with the attachment / detachment support member 13a with a crane or the like, the entire attachment / detachment plate unit 8 can be removed from the source chamber 3a. In the present embodiment, when the entire protective plate unit 8 is removed from the source chamber 3a, it is necessary to remove the protective plate unit 7 first.

＜電子デバイス＞
次に、電子デバイスの一例を説明する。以下、電子デバイスの例として有機ＥＬ表示装置の構成を例示する。 <Electronic device>
Next, an example of the electronic device will be described. Hereinafter, the configuration of an organic EL display device will be illustrated as an example of an electronic device.

まず、製造する有機ＥＬ表示装置について説明する。図１１（Ａ）は有機ＥＬ表示装置５００の全体図、図１１（Ｂ）は１画素の断面構造を示す図である。 First, the organic EL display device to be manufactured will be described. FIG. 11A is an overall view of the organic EL display device 500, and FIG. 11B is a diagram showing a cross-sectional structure of one pixel.

図１１（Ａ）に示すように、有機ＥＬ表示装置５００の表示領域５１には、発光素子を複数備える画素５２がマトリクス状に複数配置されている。詳細は後で説明するが、発光素子のそれぞれは、一対の電極に挟まれた有機層を備えた構造を有している。 As shown in FIG. 11A, a plurality of pixels 52 including a plurality of light emitting elements are arranged in a matrix in the display area 51 of the organic EL display device 500. Although the details will be described later, each of the light emitting elements has a structure including an organic layer sandwiched between a pair of electrodes.

なお、ここでいう画素とは、表示領域５１において所望の色の表示を可能とする最小単位を指している。カラー有機ＥＬ表示装置の場合、互いに異なる発光を示す第１発光素子５２Ｒ、第２発光素子５２Ｇ、第３発光素子５２Ｂの複数の副画素の組み合わせにより画素５２が構成されている。画素５２は、赤色（Ｒ）発光素子と緑色（Ｇ）発光素子と青色（Ｂ）発光素子の３種類の副画素の組み合わせで構成されることが多いが、これに限定はされない。画素５２は少なくとも１種類の副画素を含めばよく、２種類以上の副画素を含むことが好ましく、３種類以上の副画素を含むことがより好ましい。画素５２を構成する副画素としては、例えば、赤色（Ｒ）発光素子と緑色（Ｇ）発光素子と青色（Ｂ）発光素子と黄色（Ｙ）発光素子の４種類の副画素の組み合わせでもよい。 The pixel referred to here refers to the smallest unit that enables the display of a desired color in the display area 51. In the case of a color organic EL display device, the pixel 52 is composed of a combination of a plurality of sub-pixels of the first light emitting element 52R, the second light emitting element 52G, and the third light emitting element 52B, which emit light differently from each other. The pixel 52 is often composed of a combination of three types of sub-pixels of a red (R) light emitting element, a green (G) light emitting element, and a blue (B) light emitting element, but is not limited thereto. The pixel 52 may include at least one type of sub-pixel, preferably includes two or more types of sub-pixels, and more preferably includes three or more types of sub-pixels. As the sub-pixels constituting the pixel 52, for example, a combination of four types of sub-pixels of a red (R) light emitting element, a green (G) light emitting element, a blue (B) light emitting element, and a yellow (Y) light emitting element may be used.

図１１（Ｂ）は、図１１（Ａ）のＡ－Ｂ線における部分断面模式図である。画素５２は、基板５３上に、第１の電極（陽極）５４と、正孔輸送層５５と、赤色層５６Ｒ・緑色層５６Ｇ・青色層５６Ｂのいずれかと、電子輸送層５７と、第２の電極（陰極）５８と、を備える有機ＥＬ素子で構成される複数の副画素を有している。これらのうち、正孔輸送層５５、赤色層５６Ｒ、緑色層５６Ｇ、青色層５６Ｂ、電子輸送層５７が有機層に当たる。赤色層５６Ｒ、緑色層５６Ｇ、青色層５６Ｂは、それぞれ赤色、緑色、青色を発する発光素子（有機ＥＬ素子と記述する場合もある）に対応するパターンに形成されている。 11 (B) is a schematic partial cross-sectional view taken along the line AB of FIG. 11 (A). The pixel 52 has a first electrode (anode) 54, a hole transport layer 55, one of a red layer 56R, a green layer 56G, and a blue layer 56B, an electron transport layer 57, and a second electrode 52 on the substrate 53. It has a plurality of sub-pixels composed of an organic EL element including an electrode (cathode) 58. Of these, the hole transport layer 55, the red layer 56R, the green layer 56G, the blue layer 56B, and the electron transport layer 57 correspond to the organic layer. The red layer 56R, the green layer 56G, and the blue layer 56B are formed in a pattern corresponding to a light emitting element (sometimes referred to as an organic EL element) that emits red, green, and blue, respectively.

また、第１の電極５４は、発光素子ごとに分離して形成されている。正孔輸送層５５と電子輸送層５７と第２の電極５８は、複数の発光素子５２Ｒ、５２Ｇ、５２Ｂにわたって共通で形成されていてもよいし、発光素子ごとに形成されていてもよい。すなわち、図１１（Ｂ）に示すように正孔輸送層５５が複数の副画素領域にわたって共通の層として形成された上に赤色層５６Ｒ、緑色層５６Ｇ、青色層５６Ｂが副画素領域ごとに分離して形成され、さらにその上に電子輸送層５７と第２の電極５８が複数の副画素領域にわたって共通の層として形成されていてもよい。 Further, the first electrode 54 is formed separately for each light emitting element. The hole transport layer 55, the electron transport layer 57, and the second electrode 58 may be formed in common across the plurality of light emitting elements 52R, 52G, and 52B, or may be formed for each light emitting element. That is, as shown in FIG. 11B, the hole transport layer 55 is formed as a common layer over a plurality of sub-pixel regions, and the red layer 56R, the green layer 56G, and the blue layer 56B are separated for each sub-pixel region. The electron transport layer 57 and the second electrode 58 may be formed on the electron transport layer 57 as a common layer over a plurality of sub-pixel regions.

なお、近接した第１の電極５４の間でのショートを防ぐために、第１の電極５４間に絶縁層５９が設けられている。さらに、有機ＥＬ層は水分や酸素によって劣化するため、水分や酸素から有機ＥＬ素子を保護するための保護層６０が設けられている。 An insulating layer 59 is provided between the first electrodes 54 in order to prevent a short circuit between the first electrodes 54 that are close to each other. Further, since the organic EL layer is deteriorated by moisture and oxygen, a protective layer 60 for protecting the organic EL element from moisture and oxygen is provided.

図１１（Ｂ）では正孔輸送層５５や電子輸送層５７が一つの層で示されているが、有機ＥＬ表示素子の構造によって、正孔ブロック層や電子ブロック層を有する複数の層で形成されてもよい。また、第１の電極５４と正孔輸送層５５との間には第１の電極５４から正孔輸送層５５への正孔の注入が円滑に行われるようにすることのできるエネルギーバンド構造を有する正孔注入層を形成してもよい。同様に、第２の電極５８と電子輸送層５７の間にも電子注入層を形成してもよい。 In FIG. 11B, the hole transport layer 55 and the electron transport layer 57 are shown as one layer, but they are formed of a plurality of layers having a hole block layer and an electron block layer due to the structure of the organic EL display element. May be done. Further, between the first electrode 54 and the hole transport layer 55, an energy band structure capable of smoothly injecting holes from the first electrode 54 into the hole transport layer 55 is provided. You may form a hole injection layer having. Similarly, an electron injection layer may be formed between the second electrode 58 and the electron transport layer 57.

赤色層５６Ｒ、緑色層５６Ｇ、青色層５６Ｂのそれぞれは、単一の発光層で形成されていてもよいし、複数の層を積層することで形成されていてもよい。例えば、赤色層５６Ｒを２層で構成し、上側の層を赤色の発光層で形成し、下側の層を正孔輸送層又は電子ブロック層で形成してもよい。あるいは、下側の層を赤色の発光層で形成し、上側の層を電子輸送層又は正孔ブロック層で形成してもよい。このように発光層の下側又は上側に層を設けることで、発光層における発光位置を調整し、光路長を調整することによって、発光素子の色純度を向上させる効果がある。 Each of the red layer 56R, the green layer 56G, and the blue layer 56B may be formed by a single light emitting layer, or may be formed by laminating a plurality of layers. For example, the red layer 56R may be composed of two layers, the upper layer may be formed of a red light emitting layer, and the lower layer may be formed of a hole transport layer or an electron block layer. Alternatively, the lower layer may be formed of a red light emitting layer and the upper layer may be formed of an electron transport layer or a hole block layer. By providing the layer on the lower side or the upper side of the light emitting layer in this way, there is an effect of improving the color purity of the light emitting element by adjusting the light emitting position in the light emitting layer and adjusting the optical path length.

なお、ここでは赤色層５６Ｒの例を示したが、緑色層５６Ｇや青色層５６Ｂでも同様の構造を採用してもよい。また、積層数は２層以上としてもよい。さらに、発光層と電子ブロック層のように異なる材料の層が積層されてもよいし、例えば発光層を２層以上積層するなど、同じ材料の層が積層されてもよい。 Although the example of the red layer 56R is shown here, the same structure may be adopted for the green layer 56G and the blue layer 56B. Further, the number of layers may be two or more. Further, layers of different materials such as a light emitting layer and an electron block layer may be laminated, or layers of the same material may be laminated, for example, two or more light emitting layers may be laminated.

こうした電子デバイスの製造において、上述した成膜装置１が適用可能であり、当該製造方法は、搬送装置２により基板５３を搬送する搬送工程と、搬送されている基板５３に蒸着装置３によって各層の少なくともいずれか一つの層を蒸着する蒸着工程と、を含むことができる。 The above-mentioned film forming apparatus 1 can be applied in the manufacture of such an electronic device, and the manufacturing method includes a transport step of transporting the substrate 53 by the transport device 2 and a thin-film deposition device 3 on the transported substrate 53 for each layer. A vapor deposition step of depositing at least one layer can be included.

＜他の実施形態＞
蒸着源６はラインソース以外にスポットソースであってもよい。防着板ユニット７及び８はインライン式の成膜装置以外の成膜装置や、蒸着装置に適用されてもよい。 <Other embodiments>
The vapor deposition source 6 may be a spot source other than the line source. The adhesive plate units 7 and 8 may be applied to a film forming apparatus other than the in-line type film forming apparatus or a vapor deposition apparatus.

隣接する防着板の縁部を重ねる構造は、図５に例示した以外の構造も採用可能である。図１２（Ａ）～図１２（Ｃ）はその一例を示している。図１２（Ａ）～図１２（Ｃ）は、図５のＰ１部に相当する部分を平面視した構造を示しており、防着板７２に代わる防着板７２’と防着板７４に代わる防着板７４’との各縁部を重ねる構造を示している。図１２（Ａ）は防着板７２’と防着板７４’とが、上述した重なり部７２ｂに相当する構成を有しておらず、平板同士を厚み方向に重ねた例である。簡易に構成できる利点がある。図１２（Ｂ）の例は防着板７２’と防着板７４’の各端部に薄肉部を設けて薄肉部同士を重ねた構造である。蒸着物質の漏れの防止効果を高めることができる。図１２（Ｃ）の例は防着板７２’の端部に凸部を、防着板７４’の端部に凹部を設けて、凸部を凹部に挿入して重ねた構造である。蒸着物質の漏れの防止効果を高めることができる。 As the structure in which the edges of the adjacent protective plates are overlapped, a structure other than that illustrated in FIG. 5 can be adopted. 12 (A) to 12 (C) show an example. 12 (A) to 12 (C) show a structure in which the portion corresponding to the P1 portion of FIG. 5 is viewed in a plan view, and replaces the protective plate 72'and the protective plate 74 instead of the protective plate 72. It shows a structure in which each edge portion with the protective plate 74'is overlapped with each other. FIG. 12A is an example in which the protective plate 72'and the protective plate 74'do not have a configuration corresponding to the above-mentioned overlapping portion 72b, and the flat plates are overlapped with each other in the thickness direction. It has the advantage of being easy to configure. The example of FIG. 12B has a structure in which thin-walled portions are provided at each end of the protective plate 72'and the protective plate 74', and the thin-walled portions are overlapped with each other. The effect of preventing leakage of the vapor-filmed substance can be enhanced. The example of FIG. 12C has a structure in which a convex portion is provided at the end of the protective plate 72'and a concave portion is provided at the end of the protective plate 74', and the convex portion is inserted into the concave portion and stacked. The effect of preventing leakage of the vapor-filmed substance can be enhanced.

発明は上記実施形態に制限されるものではなく、発明の精神及び範囲から離脱することなく、様々な変更及び変形が可能である。従って、発明の範囲を公にするために請求項を添付する。 The invention is not limited to the above embodiment, and various modifications and modifications can be made without departing from the spirit and scope of the invention. Therefore, a claim is attached to publicize the scope of the invention.

１ 成膜装置、２ 搬送装置、３ 蒸着装置、６ 蒸着源、７ 防着板ユニット、８ 防着板ユニット 1 film forming equipment, 2 transfer equipment, 3 vapor deposition equipment, 6 vapor deposition source, 7 protective plate unit, 8 protective plate unit

Claims (11)

基板に蒸着物質を放出する蒸着源と、
前記蒸着源による蒸着物質の放出範囲を規制する防着板ユニットと、
を備えた成膜装置であって、
前記防着板ユニットは、
前記蒸着源の周囲方向に隣接して配置された複数の防着板を備え、
隣接する前記防着板の、前記周囲方向の縁部が互いに重なっている、
ことを特徴とする成膜装置。 A thin-film deposition source that releases a thin-film deposition material to the substrate,
A protective plate unit that regulates the emission range of the vapor-filmed material by the thin-film deposition source, and
It is a film forming device equipped with
The protective plate unit is
A plurality of protective plates arranged adjacent to each other in the peripheral direction of the vapor deposition source are provided.
The peripheral edges of the adjacent protective plates overlap each other.
A film forming apparatus characterized by this. 請求項１に記載の成膜装置であって、
前記複数の防着板は、
第一の防着板と、
前記第一の防着板に前記周囲方向に隣接する第二の防着板と、を含み、
前記第二の防着板は、
前記第一の防着板と重なる縁部を含む第一の部分と、
前記第一の防着板と重ならない第二の部分と、を備え、
前記第一の部分は、前記第二の部分に対して、板厚方向にずれて形成されている、
ことを特徴とする成膜装置。 The film forming apparatus according to claim 1.
The plurality of protective plates are
The first protective plate and
The first protective plate includes a second protective plate adjacent to the peripheral direction.
The second protective plate is
The first part including the edge part overlapping with the first protective plate, and
A second portion that does not overlap with the first protective plate is provided.
The first portion is formed so as to be offset in the plate thickness direction with respect to the second portion.
A film forming apparatus characterized by this. 請求項１に記載の成膜装置であって、
前記防着板ユニットを支持する支持部材を備え、
前記防着板ユニットは、前記支持部材と共に、前記成膜装置から着脱自在である、
ことを特徴とする成膜装置。 The film forming apparatus according to claim 1.
A support member for supporting the adhesive plate unit is provided.
The adhesive plate unit is detachable from the film forming apparatus together with the support member.
A film forming apparatus characterized by this. 請求項３に記載の成膜装置であって、
前記防着板ユニットは、前記蒸着源に対して前記支持部材の全体を覆っている、
ことを特徴とする成膜装置。 The film forming apparatus according to claim 3.
The protective plate unit covers the entire support member with respect to the vapor deposition source.
A film forming apparatus characterized by this. 請求項３に記載の成膜装置であって、
前記複数の防着板は、
前記支持部材に着脱自在に取り付けられた防着板を含む、
ことを特徴とする成膜装置。 The film forming apparatus according to claim 3.
The plurality of protective plates are
A protective plate detachably attached to the support member is included.
A film forming apparatus characterized by this. 請求項３に記載の成膜装置であって、
前記複数の防着板は、
前記支持部材に着脱自在に取り付けられた第一の防着板と、
前記支持部材には取り付けられず、前記第一の防着板に取り付けられた第二の防着板と、を含む、
ことを特徴とする成膜装置。 The film forming apparatus according to claim 3.
The plurality of protective plates are
A first protective plate detachably attached to the support member,
A second protective plate, which is not attached to the support member but is attached to the first protective plate, is included.
A film forming apparatus characterized by this. 請求項１に記載の成膜装置であって、
前記防着板ユニットは、
前記複数の防着板として複数種類の防着板を含み、かつ、
同種の防着板を複数用いて構成されている、
ことを特徴とする成膜装置。 The film forming apparatus according to claim 1.
The protective plate unit is
The plurality of protective plates include a plurality of types of protective plates, and
It is composed of multiple protective plates of the same type.
A film forming apparatus characterized by this. 請求項１に記載の成膜装置であって、
前記蒸着源は、ラインソースであり、
前記防着板ユニットは、
前記蒸着源の延設方向に沿う長辺部と、前記延設方向と交差する交差方向に沿う短辺部とを有する角筒形状を有しており、
前記防着板ユニットは予め定めた順序により前記複数の防着板に分解可能であり、
前記複数の防着板のうち、前記短辺部を構成する防着板が、前記長辺部を構成する防着板よりも、前記順序が早い、
ことを特徴とする成膜装置。 The film forming apparatus according to claim 1.
The vapor deposition source is a line source.
The protective plate unit is
It has a square tube shape having a long side portion along the extension direction of the vapor deposition source and a short side portion along the intersection direction intersecting the extension direction.
The protective plate unit can be disassembled into the plurality of protective plates in a predetermined order.
Of the plurality of protective plates, the protective plates constituting the short side portion have an earlier order than the protective plates constituting the long side portion.
A film forming apparatus characterized by this. 請求項１に記載の成膜装置であって、
前記基板を搬送する搬送装置を備え、
前記成膜装置は、
前記搬送装置により前記基板を搬送しながら蒸着を行うインライン型の成膜装置である、
ことを特徴とする成膜装置。 The film forming apparatus according to claim 1.
A transport device for transporting the substrate is provided.
The film forming apparatus is
It is an in-line type film forming apparatus that performs vapor deposition while conveying the substrate by the conveying device.
A film forming apparatus characterized by this. 請求項９に記載の成膜装置を用いた成膜方法であって、
前記搬送装置によって前記基板を搬送する搬送工程と、
搬送されている前記基板に、前記蒸着源によって蒸着を行う蒸着工程と、を有する、
ことを特徴とする成膜方法。 A film forming method using the film forming apparatus according to claim 9.
A transfer process in which the substrate is conveyed by the transfer device, and
It has a thin-film deposition step of performing thin-film deposition on the conveyed substrate by the thin-film deposition source.
A film forming method characterized by this. 請求項９に記載の成膜装置を用いた電子デバイスの製造方法であって、
前記搬送装置によって前記基板を搬送する搬送工程と、
搬送されている前記基板に、前記蒸着源によって蒸着を行う蒸着工程と、を有する、
ことを特徴とする電子デバイスの製造方法。 A method for manufacturing an electronic device using the film forming apparatus according to claim 9.
A transfer process in which the substrate is conveyed by the transfer device, and
It has a thin-film deposition step of performing thin-film deposition on the conveyed substrate by the thin-film deposition source.
A method of manufacturing an electronic device, characterized in that.
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0885872A (en) * 1994-09-20 1996-04-02 Mitsubishi Electric Corp Film forming device
JP2006199989A (en) * 2005-01-19 2006-08-03 Ulvac Japan Ltd Film deposition apparatus
JP2012224921A (en) * 2011-04-20 2012-11-15 Ulvac Japan Ltd Film forming apparatus
WO2015087505A1 (en) * 2013-12-12 2015-06-18 株式会社アルバック Film deposition preparation method for inline type film deposition device, inline type film deposition device, and carrier
WO2018186038A1 (en) * 2017-04-03 2018-10-11 株式会社アルバック Film forming device and film forming method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI460418B (en) * 2005-11-29 2014-11-11 Horiba Ltd Manufacturing method and manufacturing equipment of organic el element
JP5768210B2 (en) 2010-09-09 2015-08-26 パナソニックＩｐマネジメント株式会社 Vacuum deposition equipment
JP2014055342A (en) * 2012-09-14 2014-03-27 Hitachi High-Technologies Corp Film deposition apparatus
KR101901072B1 (en) * 2017-10-31 2018-09-20 캐논 톡키 가부시키가이샤 Evaporation source device, film formation apparatus, film formation method and manufacturing method of electronic device
KR102049668B1 (en) * 2018-05-28 2019-11-27 캐논 톡키 가부시키가이샤 Film formation apparatus
CN110578116A (en) * 2018-06-07 2019-12-17 佳能特机株式会社 Vapor deposition apparatus, vapor deposition method, and method for manufacturing electronic device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0885872A (en) * 1994-09-20 1996-04-02 Mitsubishi Electric Corp Film forming device
JP2006199989A (en) * 2005-01-19 2006-08-03 Ulvac Japan Ltd Film deposition apparatus
JP2012224921A (en) * 2011-04-20 2012-11-15 Ulvac Japan Ltd Film forming apparatus
WO2015087505A1 (en) * 2013-12-12 2015-06-18 株式会社アルバック Film deposition preparation method for inline type film deposition device, inline type film deposition device, and carrier
WO2018186038A1 (en) * 2017-04-03 2018-10-11 株式会社アルバック Film forming device and film forming method

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