KR101996435B1 - Organic light emitting display apparatus and method for manufacturing of the same - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an organic light emitting display and an organic light emitting diode (OLED) display manufactured thereby, and more particularly, And an organic light emitting diode display manufactured thereby.

Description

[0001] The present invention relates to an organic light emitting display device and a method of manufacturing the same,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an organic light emitting display and a method of manufacturing the same, and more particularly, to an organic light emitting display and a method of manufacturing the same.

Of the display devices, the organic light emitting display device has a wide viewing angle, excellent contrast, and fast response speed, and is receiving attention as a next generation display device.

The organic light emitting display includes a light emitting layer and an intermediate layer including the light emitting layer between the first electrode and the second electrode facing each other. At this time, the electrodes and the intermediate layer can be formed by various methods, one of which is the independent deposition method. In order to manufacture an organic light emitting display device using a deposition method, a fine metal mask (FMM) having the same pattern as that of an organic layer to be formed is closely contacted to a substrate surface on which an organic layer or the like is to be formed, A material is deposited to form an organic layer of a predetermined pattern.

However, the method using such a fine metal mask has a limitation in that it is not suitable for large-sized organic light emitting display devices using a large mother-glass. This is because, when a large area mask is used, the mask is warped due to its own weight, and distortion of the pattern due to the warping phenomenon may occur. This is also arranged with the current tendency to require fixed tax on the pattern.

Further, there is a problem that it takes a considerable time to separate the substrate and the fine metal mask from each other, and then takes a long time to manufacture and lowers the production efficiency .

The above-described background technology is technical information that the inventor holds for the derivation of the present invention or acquired in the process of deriving the present invention, and can not necessarily be a known technology disclosed to the general public prior to the filing of the present invention.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a method of manufacturing an organic light emitting display device that is more suitable for a mass production process of a large substrate, And a display device.

According to an aspect of the present invention, there is provided a semiconductor device comprising: a substrate; An insulating layer formed on the substrate and including first regions arranged in a first direction and second regions arranged in the first direction adjacent to the first regions; A first line formed on the insulating layer to cover the first regions and including a first organic light emitting layer; And a second line formed on the insulating layer to cover the second regions and including a second organic emission layer different from the first organic emission layer; And a portion of the first and second regions facing the first region and the second region is not parallel to the first direction.

And a portion of the first and second regions facing the first region and the second region is opposed to an edge of the first and second lines.

The first and second regions are angular in shape, and angles are located at portions of the first and second regions facing the first region and the second region.

The first and second regions are shaped to include a curve, and curves are located at portions of the first and second regions facing the first region and the second region.

Among the portions of the first and second regions, the portions where the first region and the second region face each other are opposed to each other.

The first line and the second line are at least partially overlapped.

The first and second regions comprise openings formed in the insulating film.

Wherein the first organic light emitting layer is formed by using an organic layer deposition apparatus and the first organic light emitting layer has a longer side of a hypotenuse farther from the center of the first region than a length of a hypotenuse closer to the center of the first region .

The first organic light emitting layer is formed using an organic layer deposition apparatus, and the first organic light emitting layer formed far from the center of the first region has a longer oblique side farther from the center of the first region.

The first organic light emitting layer is formed using an organic layer deposition apparatus, and the first organic light emitting layer disposed at the center of the first region is formed such that the lengths of the first and second organic light emitting layers are substantially the same.

The first organic emission layer is formed using an organic layer deposition apparatus,

The first organic emission layer disposed in the first region is symmetrically arranged with respect to the center of the first region.

And the substrate has a size of 40 inches or more.

The first and second organic emission layers may have a non-uniform thickness.

According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: forming an insulating film on a substrate; Forming openings in the insulating film defined by first regions arranged in a first direction and second regions arranged in the first direction adjacent to the first regions; A first organic luminescent material emitted from the first deposition assembly is deposited on the substrate while the substrate moves relative to the first deposition assembly with the first deposition assembly and the substrate spaced apart, Forming a first line including a first organic emission layer on the insulating layer so as to cover the first organic emission layer; And a second organic light emitting material different from the first organic light emitting material emitted from the second deposition assembly while the substrate moves relative to the second deposition assembly in a state where the second deposition assembly and the substrate are spaced apart from each other, Forming a second line, which is deposited on the substrate and includes a second organic emission layer different from the first organic emission layer, on the insulating layer so as to cover the second regions; Wherein the forming of the openings is such that a portion of the first and second regions facing the first region and the second region is not parallel to the first direction, A method of manufacturing a device is provided.

The forming of the openings may be such that the first and second regions are angled, and each of the portions of the first and second regions, where the first region and the second region face each other, .

The forming of the openings may be such that the first and second regions are in a shape including a curve and a curved line is formed at a portion of the first and second regions facing the first region and the second region, .

The forming of the openings may be such that portions of the first and second regions facing the first region and the second region are opposed to each other.

Wherein the first deposition assembly includes an evaporation source for emitting the first organic luminescent material, an evaporation source nozzle unit disposed at one side of the evaporation source and having a plurality of evaporation source nozzles, And a patterning slit sheet in which a plurality of patterning slits are formed, wherein the first organic luminescent material emitted from the evaporation source passes through the patterning slit sheet and is deposited onto the first organic luminescent layer.

The patterning slit sheet is formed to be smaller than the substrate in at least one of the first direction and the second direction intersecting with the first direction.

A plurality of evaporation source nozzles are formed in the evaporation source nozzle unit along the first direction, a plurality of patterning slits are formed in the patterning slit sheet along the first direction, and the first evaporation assembly includes a deposition source And a plurality of shielding plates disposed along the first direction between the nozzle unit and the patterning slit sheet and partitioning a space between the evaporation source nozzle unit and the patterning slit sheet into a plurality of deposition spaces, .

A plurality of evaporation source nozzles are formed along the first direction in the evaporation source nozzle portion and a plurality of patterning slits are formed in the patterning slit sheet along a second direction crossing the first direction.

Wherein the evaporation source, the evaporation source nozzle unit, and the patterning slit sheet are integrally formed by a coupling member.

And the connecting member guides the movement path of the evaporation material.

The forming of the first line and the second line may include a moving unit configured to move together with the substrate fixed to the substrate and a first conveying unit configured to move the moving unit in which the substrate is fixed in the first direction, And a second transporting unit for moving the moving unit, from which the substrate is separated, to a direction opposite to the first direction after the deposition is completed. A loading unit for fixing the substrate to the moving unit; A deposition unit including a chamber maintained in vacuum and first and second deposition assemblies for depositing first and second organic light emitting layers on the substrate fixed to the moving unit transferred from the loading unit; And an unloading unit that separates the substrate from the moving unit after the deposition of the substrate is completed while passing through the deposition unit, wherein the substrate is moved relative to the thin film deposition apparatus while the substrate is spaced apart And the first and second organic light emitting materials emitted from the evaporation source are deposited on the substrate to form the first and second lines.

The moving unit is configured to be circuable between the first transfer unit and the second transfer unit, and the substrate fixed to the moving unit is spaced apart from the first and second deposition assemblies by a predetermined distance while being moved by the first transfer unit. Is formed.

And the first transfer part and the second transfer part are provided to penetrate the vapor deposition part when passing through the vapor deposition part.

And the first transfer unit and the second transfer unit are arranged vertically side by side.

The first transfer unit sequentially moves the moving unit to the loading unit, the deposition unit, and the unloading unit.

Here, the organic light emitting diode display includes the organic light emitting display device manufactured by the method of manufacturing the organic light emitting display device described above.

According to the present invention, it is possible to realize an organic light emitting display device and a manufacturing method thereof which are more suitable for a mass production process of a large substrate and enable patterning of a fixed pattern.

1 is a plan view of a system configuration schematically showing a thin film deposition apparatus according to an embodiment of the present invention.
2 is a side view of a system configuration schematically showing a deposition unit of the thin film deposition apparatus of FIG.
3 is a perspective view schematically showing the deposition unit of FIG.
Figure 4 is a schematic cross-sectional view of the deposition section of Figure 3;
5 illustrates an organic layer deposition assembly in accordance with another embodiment of the present invention.
Figure 6 is a schematic side cross-sectional view of the organic layer deposition assembly of Figure 5;
Figure 7 is a schematic top cross-sectional view of the organic layer deposition assembly of Figure 5;
8 is a view showing an organic layer deposition assembly according to another embodiment of the present invention.
9 is a view showing an organic layer deposition assembly according to another embodiment of the present invention.
10 is a view showing a state in which patterning slits are formed on the patterning slit sheet at regular intervals in the thin film deposition apparatus of FIG.
11 is a view showing an organic layer formed on a substrate using the patterning slit sheet of Fig.
12 is a plan view of an OLED display according to an embodiment of the present invention.
Fig. 13 is a sectional view taken along line III-III in Fig. 12. Fig.
FIG. 14 is a plan view showing a phenomenon in which mixed color occurs in FIG.
Fig. 15 is a sectional view taken along line V-V in Fig. 14;
16 to 25 are plan views of an organic foot and a display according to another embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, which will be readily apparent to those skilled in the art to which the present invention pertains. The present invention may be embodied in many different forms and is not limited to the embodiments described herein.

FIG. 1 is a plan view of a system configuration schematically showing a thin film deposition apparatus according to an embodiment of the present invention, and FIG. 2 is a side view of a system configuration schematically showing a deposition unit of the thin film deposition apparatus of FIG.

1 and 2, a thin film deposition apparatus 1 according to an embodiment of the present invention includes a deposition unit 100, a loading unit 200, an unloading unit 300, and a transferring unit 400 .

The loading unit 200 may include a first rack 212, an introduction chamber 214, a first inverting chamber 218, and a buffer chamber 219.

A plurality of substrates 2 before deposition are deposited in the first rack 212 and an introduction robot provided in the introduction chamber 214 holds the substrate 2 from the first rack 212 to form a second transfer part The transfer unit 430 to which the substrate 2 is attached is transferred to the first inverting chamber 218 after the substrate 2 is placed on the transfer unit 430 transferred from the transfer unit 420.

A first inverting chamber 218 is provided adjacent to the introducing chamber 214 and a first inverting robot located in the first inverting chamber 218 inverts the moving unit 430 to move the moving unit 430 (410) of the first conveyance unit (100).

1, the introduction robot of the introduction chamber 214 places the substrate 2 on the upper surface of the moving part 430. In this state, the moving part 430 is transferred to the reversing chamber 218, The substrate 2 is positioned downward in the deposition unit 100 as the first inversion robot of the chamber 218 reverses the inversion chamber 218. [

The configuration of the unloading unit 300 is configured in reverse to the configuration of the loading unit 200 described above. That is, the substrate 2 and the moving unit 430 which have passed through the deposition unit 100 are reversed by the second inverting robot in the second inverting chamber 328 and transferred to the unloading chamber 324, The substrate 2 is removed from the moving part 430 and loaded on the second rack 322 after the substrate 2 and the moving part 430 are taken out from the moving parts 430 and 324. The moving part 430 separated from the substrate 2 is returned to the loading part 200 through the second conveying part 420.

However, the present invention is not limited thereto. The substrate 2 is fixed to the lower surface of the moving part 430 from the time when the substrate 2 is initially fixed to the moving part 430, . In this case, for example, the first inverting robot of the first inverting chamber 218 and the second inverting robot of the second inverting chamber 328 are unnecessary.

The deposition unit 100 has at least one vapor deposition chamber 101. 1 and 2, the deposition unit 100 includes a chamber 101, and a plurality of organic layer deposition assemblies 100-1, 100-2, 100-3, -2) ... 100-n. 1, the first organic layer deposition assembly 100-1, the second organic layer deposition assembly 100-2 to the eleventh organic layer deposition assembly 100-1, 11) are installed, but the number is variable depending on the deposition material and deposition conditions. The chamber 101 is kept in vacuum during deposition.

1, the moving unit 430, to which the substrate 2 is fixed, is moved by the first transfer unit 410 to at least the deposition unit 100, And the moving unit 430 separated from the substrate 2 in the unloading unit 300 is moved to the second transferring unit 420 To the loading unit (200).

The first transfer part 410 is provided to penetrate the chamber 101 when passing through the deposition part 100 and the second transfer part 420 is provided with a moving part 430 in which the substrate 2 is separated Respectively.

In the thin film deposition apparatus 1 according to an embodiment of the present invention, the first transfer part 410 and the second transfer part 420 are formed in the upper and lower parts, and the transfer part 410, after passing through the first transfer part 410, After the substrate 430 is separated from the substrate 2 at the unloading portion 300 and then transferred to the loading portion 200 through the second transfer portion 420 formed at the lower portion thereof, Effect can be obtained.

The deposition unit 100 of FIG. 1 may further include an evaporation source replacement unit 190 on one side of each organic layer deposition assembly 100-1. Although not shown in detail in the drawings, the evaporation source replacement portion 190 may be formed in a cassette type and formed to be drawn out from each of the organic layer deposition assemblies 100-1. Therefore, replacement of the evaporation source (see 110 in Fig. 3) of the organic layer deposition assembly 100-1 can be facilitated.

FIG. 3 is a perspective view schematically showing the deposition unit of FIG. 1, and FIG. 4 is a schematic cross-sectional view of the deposition unit of FIG.

3 and 4, the deposition unit 100 of the thin film deposition apparatus 1 according to an embodiment of the present invention includes at least one organic layer deposition assembly 100-1 and a transfer unit 400 do.

Hereinafter, the configuration of the entire vapor deposition unit 100 will be described.

The chamber 101 is formed in a hollow box shape, and one or more organic layer deposition assemblies 100-1 and a transfer unit 400 are accommodated therein. In another aspect, a foot 102 is formed to be fixed to the ground, a lower housing 103 is formed on a foot 102, and a lower housing 103 is formed on an upper portion of the lower housing 103, (104) are formed. The chamber 101 is formed so as to house both the lower housing 103 and the upper housing 104 therein. At this time, the connection between the lower housing 103 and the chamber 101 may be sealed to completely block the inside of the chamber 101 from the outside. The lower housing 103 and the upper housing 104 are formed on the foot 102 fixed to the ground so that the lower housing 103 and the upper housing 102 can be separated from each other even if the chamber 101 repeats shrinkage / The lower housing 103 and the upper housing 104 can serve as a kind of reference frame in the deposition unit 100. [

The organic layer deposition assembly 100-1 and the first transfer part 410 of the transfer part 400 are formed in the upper housing 104 and the second transfer part 410 of the transfer part 400 is formed in the lower part of the lower housing 103. [ (420) is formed. The moving part 430 is continuously deposited while circulating between the first transfer part 410 and the second transfer part 420.

Hereinafter, the detailed structure of the organic layer deposition assembly 100-1 will be described.

Each organic layer deposition assembly 100-1 includes an evaporation source 110, an evaporation source nozzle unit 120, a patterning slit sheet 130, a blocking member 140, a first stage 150, a second stage 160 A photographing member 170, a sensor 180, and the like. Here, it is preferable that all the configurations of Figs. 3 and 4 are disposed in the chamber 101 in which an appropriate degree of vacuum is maintained. This is to ensure the straightness of the deposition material.

In detail, in order for the deposition material 115 emitted from the deposition source 110 to pass through the deposition source nozzle part 120 and the patterning slit sheet 130 to be deposited in a desired pattern on the substrate 2, The inside of the chamber should be kept at the same high vacuum as the FMM deposition method. Further, the temperature of the patterning slit sheet 130 should be sufficiently lower than the temperature of the evaporation source 110. This is because the problem of thermal expansion of the patterning slit sheet 130 due to temperature can be minimized only when the temperature of the patterning slit sheet 130 is sufficiently low.

In this chamber 101, the substrate 2 to be evaporated is disposed. The substrate 2 may be a substrate for a flat panel display device, and a large-sized substrate having a size of 40 inches or more such as a mother glass capable of forming a plurality of flat panel display devices may be used.

Here, in one embodiment of the present invention, the deposition proceeds as the substrate 2 moves relative to the organic layer deposition assembly 100-1.

Specifically, in the conventional FMM deposition method, the FMM size must be formed equal to the substrate size. Therefore, as the substrate size increases, the FMM must be made larger, which makes it difficult to fabricate the FMM, and it is not easy to align the FMM with a precise pattern by pulling the FMM.

In order to solve such problems, the organic layer deposition assembly 100-1 according to an embodiment of the present invention is configured such that deposition is performed while the organic layer deposition assembly 100-1 and the substrate 2 are moved relative to each other . In other words, the substrate 2 disposed to face the organic layer deposition assembly 100-1 is continuously deposited while moving along the Y-axis direction. That is, the deposition is performed in a scanning manner while the substrate 2 moves in the direction of arrow A in FIG. Although the substrate 2 is illustrated as being deposited in the chamber (not shown) while moving in the Y-axis direction, the idea of the present invention is not limited thereto. The substrate 2 may be fixed, It is also possible that the assembly 100-1 itself is moved in the Y-axis direction to perform deposition.

Accordingly, the patterning slit sheet 130 can be made much smaller than the conventional FMM in the organic layer deposition assembly 100-1 of the present invention. That is, in the case of the organic layer deposition assembly 100-1 of the present invention, since the substrate 2 performs deposition in a scanning manner continuously while moving along the Y-axis direction, the patterning slit sheet 130, The length in at least one direction of the X-axis direction and the Y-axis direction of the substrate 2 can be formed to be much smaller than the length of the substrate 2. As described above, since the patterning slit sheet 130 can be made much smaller than the conventional FMM, the patterning slit sheet 130 of the present invention can be easily manufactured. That is, a small-sized patterning slit sheet 130 is advantageous over the FMM deposition method in all processes, such as etching of the patterning slit sheet 130, and subsequent precision tensioning and welding operations, movement and cleaning operations. Further, this becomes more advantageous as the display device becomes larger.

It is preferable that the organic layer deposition assembly 100-1 and the substrate 2 are spaced apart from each other in order to deposit the organic layer deposition assembly 100-1 and the substrate 2 relative to each other. This will be described later in detail.

On the other hand, on the side facing the substrate 2 in the chamber, an evaporation source 110 in which the evaporation material 115 is stored and heated is disposed. As the evaporation material 115 stored in the evaporation source 110 is vaporized, the evaporation is performed on the substrate 2.

In detail, the evaporation source 110 includes a crucible 111 in which an evaporation material 115 is filled, a evaporation material 115 filled in the crucible 111 by heating the crucible 111, And a heater 112 for evaporating the evaporation source toward the evaporation source nozzle unit 120 side.

The evaporation source nozzle unit 120 is disposed on one side of the evaporation source 110, specifically, on the evaporation source 110 side toward the substrate 2. Here, the organic layer deposition assembly according to the present invention may be formed such that the evaporation source nozzles are different from each other in depositing the common layer and the pattern layer. That is, although not shown in the figure, a plurality of evaporation source nozzles 121 may be formed in the evaporation source nozzle portion for forming the pattern layer in the Y-axis direction, that is, along the scanning direction of the substrate 2. Accordingly, by forming the evaporation source nozzle 121 so that there is only one evaporation source nozzle 121 in the X-axis direction, generation of a shadow can be greatly reduced. On the other hand, a plurality of evaporation source nozzles 121 may be formed along the X-axis direction in the evaporation source nozzle portion for forming the common layer. As a result, the uniformity of the thickness of the common layer can be improved.

A patterning slit sheet 130 is further provided between the evaporation source 110 and the substrate 2. The patterning slit sheet 130 further includes a frame 135 which is formed in the shape of a window frame. A plurality of patterning slits 131 are formed in the patterning slit sheet 130 along the X-axis direction. The evaporated material 115 vaporized in the evaporation source 110 is directed to the substrate 2 as the evaporation source through the evaporation source nozzle unit 120 and the patterning slit sheet 130. At this time, the patterning slit sheet 130 can be manufactured through etching, which is the same method as that of a conventional fine metal mask (FMM), particularly, a stripe type mask. At this time, the total number of the patterning slits 131 may be larger than the total number of the evaporation source nozzles 121.

Here, the deposition source 110 (and the deposition source nozzle unit 120 coupled thereto) and the patterning slit sheet 130 may be spaced apart from each other by a predetermined distance.

As described above, the organic layer deposition assembly 100-1 according to one embodiment of the present invention performs deposition while moving relative to the substrate 2, and thus the organic layer deposition assembly 100-1 is mounted on the substrate 2, the patterning slit sheet 130 is formed to be spaced apart from the substrate 2 by a certain distance.

In detail, in the conventional FMM deposition method, a mask is closely adhered to a substrate to prevent a shadow from being formed on the substrate, and a deposition process is performed. However, when the mask is brought into close contact with the substrate in this manner, there is a problem that a problem of defective due to contact between the substrate and the mask occurs. Further, since the mask can not be moved relative to the substrate, the mask must be formed to have the same size as the substrate. Therefore, as the size of the display device is increased, the size of the mask must be increased. Thus, there is a problem that it is not easy to form such a large mask.

In order to solve such a problem, in the organic layer deposition assembly 100-1 according to an embodiment of the present invention, the patterning slit sheet 130 is arranged so as to be spaced apart from the substrate 2 as a deposition target by a predetermined distance.

According to the present invention, after the mask is formed smaller than the substrate, the deposition can be performed while moving the mask relative to the substrate, so that it is possible to obtain an effect of facilitating the production of the mask. In addition, it is possible to obtain an effect of preventing defects due to contact between the substrate and the mask. Further, since the time required for the substrate and the mask to adhere to each other in the process becomes unnecessary, an effect of improving the manufacturing speed can be obtained.

Next, the specific arrangement of each component in the upper housing 104 is as follows.

First, the evaporation source 110 and the evaporation source nozzle unit 120 are disposed at the bottom of the upper housing 104. A seating part 104-1 is formed on both sides of the evaporation source 110 and the evaporation source nozzle part 120 and a first stage 150 and a second stage 160 And the above-described patterning slit sheet 130 are sequentially formed.

Here, the first stage 150 is formed to be movable in the X-axis direction and the Y-axis direction, and functions to align the patterning slit sheet 130 in the X-axis direction and the Y-axis direction. That is, the first stage 150 includes a plurality of actuators, and the first stage 150 is formed to move in the X-axis direction and the Y-axis direction with respect to the upper housing 104.

Meanwhile, the second stage 160 is formed to be movable in the Z-axis direction, and functions to align the patterning slit sheet 130 in the Z-axis direction. That is, the second stage 160 includes a plurality of actuators, and the second stage 160 is formed to move in the Z-axis direction with respect to the first stage 150.

On the other hand, a patterning slit sheet 130 is formed on the second stage 160. The patterning slit sheet 130 is formed on the first stage 150 and the second stage 160 so that the patterning slit sheet 130 is formed to be movable in the X axis direction, the Y axis direction, and the Z axis direction Thereby realizing alignment, particularly real-time alignment, between the substrate 2 and the patterning slit sheet 130.

Further, the upper housing 104, the first stage 150, and the second stage 160 may simultaneously guide the movement path of the evaporation material so that the evaporation material discharged through the evaporation source nozzle 121 is not dispersed . That is, the path of the evaporation material may be sealed by the upper housing 104, the first stage 150, and the second stage 160 to simultaneously guide the movement of the evaporation material in the X axis direction and the Y axis direction.

A blocking member 140 may be further disposed between the patterning slit sheet 130 and the evaporation source 110 to prevent organic substances from being deposited on the non-deposition region of the substrate 2. Although not shown in detail in the drawing, the blocking member 140 may be composed of two adjacent plates. The blocking member 140 shields the non-deposition region of the substrate 2, so that the organic matter can be prevented from being easily deposited on the non-deposition region of the substrate 2 without a separate structure.

Hereinafter, the transfer unit 400 for transferring the substrate 2, which is a deposition target, will be described in detail. 3 and 4, the transfer unit 400 includes a first transfer unit 410, a second transfer unit 420, and a moving unit 430.

The first transfer part 410 includes a moving part 430 including a carrier 431 and an electrostatic chuck 432 coupled thereto so that an organic layer can be deposited on the substrate 2 by the organic layer deposition assembly 100-1. And the substrate 2 attached to the moving unit 430 in a line-by-line manner. The first transfer portion 410 includes a coil 411, a guide portion 412, an upper magnetic levitation bearing 413, a side magnetic levitation bearing 414, and a gap sensor 415 and 416.

The second transfer part 420 transfers the moving part 430 separated from the substrate 2 to the loading part 200 by the unloading part 300 after one deposition is completed while passing through the deposition part 100 . The second conveyance unit 420 includes a coil 421, a roller guide 422, and a charging track 423.

The moving unit 430 includes a carrier 431 transported along the first transporting unit 410 and the second transporting unit 420 and an electrostatic chuck 432 coupled to one side of the carrier 431 and to which the substrate 2 is attached ).

Hereinafter, each component of the transfer unit 400 will be described in more detail.

First, the carrier 431 of the moving part 430 will be described in detail.

The carrier 431 includes a main body 431a, a linear motor system magnet 431b, a contactless power supply module 431c, a power source 431d and a guide groove 431e.

The body portion 431a forms the base of the carrier 431 and may be formed of a magnetic material such as iron. The carrier 431 can be maintained at a certain distance from the guide portion 412 by the repulsive force between the main body portion 431a of the carrier 431 and the magnetic levitation bearings 413 and 414 described later .

Guide grooves 431e may be formed on both sides of the body portion 431a and guide protrusions 412e of the guide portion 412 may be accommodated in the guide grooves 431e.

A magnetic rail 431b may be formed along the center line of the moving direction of the body portion 431a. The magnetic rail 431b of the main body 431a and the coil 411 to be described later are combined to constitute a linear motor and the carrier 431 can be transported in the direction A by the linear motor.

A CPS module 431c and a power source unit 431d may be formed on one side of the magnetic rail 431b in the main body 431a. The power supply unit 431d is a kind of rechargeable battery for providing power to allow the electrostatic chuck 432 to chuck and hold the substrate 2 and the CPS module 431c is used to charge the power supply unit 431d Wireless charging module. In detail, a charging track 423 formed in the second transporting unit 420 to be described later is connected to an inverter (not shown) so that when the carrier 431 is transported in the second transporting unit 420 A magnetic field is formed between the charging track 423 and the CPS module 431c to supply power to the CPS module 431c. The power supplied to the CPS module 431c charges the power source unit 431d.

The electrostatic chuck 432 has an electrode to which power is applied, and a high voltage is applied to the inside of the body to attach the substrate 2 to the surface of the body.

Next, the driving of the moving part 430 will be described in detail.

The magnetic rail 431b of the main body 431a and the coil 411 are coupled to each other to constitute a driving unit. Here, the driving unit may be a linear motor. The linear motor is a device with a very low degree of positioning because the friction coefficient is small and the position error is hardly generated as compared with the conventional sliding guidance system. As described above, the linear motor can be composed of the coil 411 and the magnetic rail 431b, and the magnetic rail 431b is arranged in a line on the carrier 431, and the coil 411 is arranged on the magnetic rail 431b, A plurality of chambers may be disposed at one side of the chamber 101 at regular intervals. Since the magnetic rail 431b is disposed on the carrier 431 as a moving object instead of the coil 411, the carrier 431 can be driven without applying power to the carrier 431. Here, the coil 411 is formed in an atmosphere box and is installed in a standby state, and the magnetic rail 431b is attached to the carrier 431 so that the carrier 431 travels in the vacuum chamber 101 It will be possible.

Next, the first transfer unit 410 and the moving unit 430 will be described in detail.

Referring to FIG. 4, the first transfer part 410 moves the electrostatic chuck 432 fixing the substrate 2 and the carrier 431 for transferring the electrostatic chuck 432. The first conveying unit 410 includes a coil 411, a guide unit 412, an upper magnetic levitation bearing 413, a side magnetic levitation bearing 414, and a gap sensor 415 and 416.

The coil 411 and the guide portion 412 are formed on the inner surface of the upper housing 104. The coil 411 is formed on the upper inner surface of the upper housing 104, And is formed on both inner side surfaces of the housing 104.

The guide portion 412 serves to guide the carrier 431 to be moved in one direction. At this time, the guide part 412 is formed to penetrate through the deposition part 100.

The side magnetic levitation bearings 414 are respectively disposed in the guide portion 412 so as to correspond to both sides of the carrier 431. The side magnetic levitation bearing 414 generates a gap between the carrier 431 and the guide portion 412 so that the guide portion 412 is not brought into contact with the guide portion 412 when the carrier 431 moves, To move along. That is, the repulsive force generated between the left side lateral magnetic levitation bearing 414 and the magnetic carrier 431 and the repulsive force generated between the right lateral magnetic levitation bearing 414 and the carrier 431, which is a magnetic body, Thereby generating a gap between the carrier 431 and the guide portion 412 and keeping the gap constant.

On the other hand, the upper magnetic levitation bearings 413 are disposed in the guide portion 412 so as to be positioned on the upper side of the carrier 431, respectively. The upper magnetic levitation bearing 413 serves to move the carrier 431 along the guide portion 412 while maintaining a constant spacing therebetween without contacting the first accommodating portion 412a and the second accommodating portion 412b . That is, the repulsive force and the gravity generated between the upper magnetic levitation bearing 413 and the carrier 431, which is a magnetic body, are parallel to each other while generating a gap between the carrier 431 and the guide portion 412, .

The guide portion 412 may further include a gap sensor 415. The gap sensor 415 can measure the distance between the carrier 431 and the guide portion 412. [ Also, a gap sensor 416 may be disposed on one side of the side magnetic levitation bearing 414. The gap sensor 416 disposed on the side magnetic levitation bearing 414 can measure the distance between the side surface of the carrier 431 and the side surface magnetic levitation bearing 414. [

The magnetic force of the magnetic levitation bearings 413 and 414 is changed in accordance with the value measured by the gap sensors 415 and 416 so that the interval between the carrier 431 and the guide portion 412 can be adjusted in real time. That is, the carrier 431 can be precisely moved by feedback control using the magnetic levitation bearings 413 and 414 and the gap sensors 415 and 416.

Next, the second transfer unit 420 and the moving unit 430 will be described in detail.

4, the second transfer unit 420 moves the electrostatic chuck 432 after the substrate is separated from the unloading unit 300 and the carrier 431 for transferring the electrostatic chuck 432 to the loading unit 200 again . Here, the second conveying unit 420 includes a coil 421, a roller guide 422, and a charging track 423.

In detail, the coil 421, the roller guide 422 and the charging track 423 are formed on the inner surface of the lower housing 103, respectively, and the double coil 421 and the charging track 423 are formed on the inner surface of the lower housing 103 And the roller guides 422 are formed on the inner surfaces on both sides of the lower housing 103. Here, the coil 421 may be formed in an atmosphere box like the coil 411 of the first transfer unit 410.

Similarly to the first transfer part 410, the second transfer part 420 also includes a coil 421. The magnetic rail 431b of the main body 431a of the carrier 431 and the coil 421 are coupled with each other, And the driving unit may be a linear motor. By this linear motor, the carrier 431 can move along the direction opposite to the direction A in Fig.

Meanwhile, the roller guide 422 serves to guide the carrier 431 to move in one direction. At this time, the roller guide 422 is formed through the vapor deposition unit 100.

As a result, the position of the second carrier 420 is not required to be higher than that of the first carrier 410 because it is a step of transferring the empty carrier 431, not the step of depositing the organic material on the substrate. Therefore, the second conveying unit 420, which requires a relatively high positional accuracy, is applied to the first conveying unit 410, which is required to have a high positional accuracy, And the structure of the thin film deposition apparatus is simplified. Of course, although not shown in the drawings, it is also possible to apply a magnetic levitation to the second conveying unit 420 as well as the first conveying unit 410.

Meanwhile, the organic layer deposition assembly 100-1 of the thin film deposition apparatus 1 according to an embodiment of the present invention may further include a camera 170 and a sensor 180 for aligning. In detail, the camera 170 can align a first mark (not shown) formed on the frame 155 of the patterning slit sheet 151 and a second mark (not shown) formed on the substrate 2 in real time. Meanwhile, the sensor 180 may be a confocal sensor. The distance between the substrate 2 and the patterning slit sheet 130 can be measured in real time by providing the camera 170 and the sensor 180 so that the substrate 2 and the patterning slit sheet 130 can be measured in real time. It is possible to obtain an effect that the positional accuracy of the pattern is further improved.

A thin film such as an organic layer of an organic light emitting display device can be formed using such a thin film deposition apparatus, which will be described in detail with reference to FIG.

Figure 5 is a schematic perspective view of an organic layer deposition assembly according to another embodiment of the present invention, Figure 6 is a schematic side cross-sectional view of the organic layer deposition assembly of Figure 5, Figure 7 is a schematic FIG.

5 to 7, an organic layer deposition assembly 700 according to an embodiment of the present invention includes an evaporation source 710, an evaporation source nozzle unit 720, a blocking plate assembly 730, and a patterning slit sheet 750 ).

The evaporation source 710 includes a crucible 711 filled with an evaporation material 715 and an evaporation material 715 filled in the crucible 711 by heating the crucible 711 to the evaporation source nozzle portion And a heater 712 for evaporating the refrigerant to the evaporator 720 side. An evaporation source nozzle unit 720 is disposed on one side of the evaporation source 710 and a plurality of evaporation source nozzles 721 are formed on the evaporation source nozzle unit 720 along the X axis direction.

Meanwhile, a blocking plate assembly 730 is provided on one side of the evaporation source nozzle unit 720. The blocking plate assembly 730 includes a plurality of blocking plates 731 and a blocking plate frame 732 provided outside the blocking plates 731. The plurality of blocking plates 731 may be arranged in parallel with each other along the X-axis direction. Here, the plurality of blocking plates 731 may be formed at regular intervals. In addition, each of the blocking plates 731 extends along the YZ plane as viewed in the drawing, and may preferably be provided in a rectangular shape. The plurality of blocking plates 731 arranged as described above divides the space between the evaporation source nozzle unit 720 and the patterning slit 750 into a plurality of evaporation spaces S. 5, the organic layer deposition assembly 700 according to an embodiment of the present invention includes a plurality of evaporation source nozzles 721, (S) is separated. The blocking plate 731 separates the space between the evaporation source nozzle unit 720 and the patterning slit sheet 750 into a plurality of evaporation spaces S so that the evaporation from the evaporation source nozzles 721 The material is not mixed with the evaporation materials discharged from the other evaporation source nozzles 721 but is deposited on the substrate 2 through the patterning slit 751. That is, the blocking plates 731 guide the movement path of the evaporation material so that the evaporation material discharged through each evaporation source nozzle 721 is not dispersed but goes straight in the Z-axis direction.

Thus, the size of the shadow formed on the substrate can be greatly reduced by providing the blocking plate 731 to secure the linearity of the evaporation material. Therefore, the organic layer deposition assembly 700 and the substrate 2 can be kept constant It is possible to make the distance between them.

A patterning slit sheet 750 is further provided between the evaporation source 710 and the substrate 2. The patterning slit sheet 750 further includes a frame 755 which is formed in the shape of a window frame. A plurality of patterning slits 751 are formed in the patterning slit sheet 750 along the X-axis direction. The vaporized evaporation material 715 in the evaporation source 710 is directed toward the substrate 2 as the evaporation source through the evaporation source nozzle unit 720 and the patterning slit sheet 750.

8 is a perspective view schematically showing an organic layer deposition assembly according to another embodiment of the present invention.

The organic layer deposition assembly 800 according to the embodiment shown in FIG. 8 includes an evaporation source 810, an evaporation source nozzle unit 820, a first blocking plate assembly 830, Sheet 850 as shown in FIG. Here, the detailed configuration of the evaporation source 810, the first blocking plate assembly 830, and the patterning slit sheet 850 is the same as the embodiment according to the above-described FIG. 5, and thus a detailed description thereof will be omitted. In this embodiment, the first blocking plate assembly 830 is distinguished from the above-described embodiment in that a second blocking plate assembly 840 is provided on one side of the first blocking plate assembly 830.

In detail, the second blocking plate assembly 840 includes a plurality of second blocking plates 841 and a second blocking plate frame 842 provided outside the second blocking plates 841. The plurality of second blocking plates 841 may be provided in parallel with each other along the X-axis direction. The plurality of second blocking plates 841 may be formed at regular intervals. Each second blocking plate 841 is formed so as to be parallel to the YZ plane as viewed in the drawing, that is, perpendicular to the X axis direction.

The plurality of first blocking plates 831 and the second blocking plates 841 arranged in this way serve to partition the space between the evaporation source nozzle unit 820 and the patterning slit sheet 850. That is, the deposition space is separated by each of the evaporation source nozzles 821 through which the evaporation material is injected by the first blocking plate 831 and the second blocking plate 841.

Here, each of the second blocking plates 841 may be disposed so as to correspond one-to-one with the respective first blocking plates 831. In other words, each of the second blocking plates 841 may be aligned with the respective first blocking plates 831 and disposed in parallel with each other. That is, the first blocking plate 831 and the second blocking plate 841 corresponding to each other are located on the same plane. Although the figure shows that the length of the first blocking plate 831 and the width of the second blocking plate 841 in the X-axis direction are the same, the spirit of the present invention is not limited thereto. That is, the second blocking plate 841, which requires precise alignment with the patterning slit 851, is relatively thin, while the first blocking plate 831, which does not require precise alignment, It is also possible to make it thick and easy to manufacture.

9 is a perspective view schematically illustrating an organic layer deposition assembly according to another embodiment of the present invention.

Referring to FIG. 9, an organic layer deposition assembly 900 according to another embodiment of the present invention includes an evaporation source 910, an evaporation source nozzle unit 920, and a patterning slit sheet 950.

The evaporation source 910 includes a crucible 911 filled with an evaporation material 915 and an evaporation material 915 filled in the crucible 911 by heating the crucible 911 to the evaporation source nozzle portion 920). An evaporation source nozzle unit 920 is disposed on one side of the evaporation source 910 and a plurality of evaporation source nozzles 921 are formed on the evaporation source nozzle unit 920 along the Y axis direction. A patterning slit sheet 950 and a frame 955 are further provided between the evaporation source 910 and the substrate 2. A plurality of patterning slits 951 are formed in the patterning slit sheet 950 along the X- And spacers 952 are formed. The deposition source 910, the evaporation source nozzle unit 920, and the patterning slit sheet 950 are coupled by a connecting member 935.

The present embodiment differs from the above-described embodiments in the arrangement of the plurality of evaporation source nozzles 921 provided in the evaporation source nozzle unit 920, which will be described in detail.

An evaporation source nozzle unit 920 is disposed on one side of the evaporation source 910, specifically, on the side of the evaporation source 910 that faces the substrate 2. A plurality of evaporation source nozzles 921 are formed in the evaporation source nozzle portion 920 along the Y axis direction, that is, the scanning direction of the substrate 2. [ Here, the plurality of evaporation source nozzles 921 may be formed at regular intervals. The evaporated material 915 vaporized in the evaporation source 910 passes through the evaporation source nozzle unit 920 and is directed toward the substrate 2 as the evaporation source. As a result, a plurality of evaporation source nozzles 921 are formed along the scanning direction of the substrate 2 in one organic layer deposition assembly 900-1. In this case, if a plurality of evaporation source nozzles 921 are provided in the X axis direction, the distances between the evaporation source nozzles 921 and the patterning slits 951 are different from each other. At this time, the distance between the patterning slits 951 and the distance A shadow is generated by the evaporation material emitted from the evaporation source nozzle 921 farther away. Therefore, by forming the evaporation source nozzle 921 such that there is only one evaporation source nozzle 921 in the X-axis direction as in the present invention, generation of shadows can be greatly reduced. In addition, since a plurality of evaporation source nozzles 921 exist in the scanning direction, even if a flux difference occurs between the individual evaporation source nozzles, the difference is canceled, and the uniformity of deposition is maintained constant.

Hereinafter, the structure of the organic layer formed by the thin film deposition apparatus according to one embodiment of the present invention will be described in detail.

FIG. 10 is a view showing a state where patterning slits are formed at equal intervals in a patterning slit sheet in a thin film deposition apparatus, and FIG. 11 is a view showing an organic layer formed on a substrate by using the patterning slit sheet of FIG.

10 and 11 show a patterning slit sheet 151 in which patterning slits 131 are arranged at regular intervals. That is, the relationship of l ₁ = l ₂ = l ₃ = l ₄ is established in Fig.

In this case, the angle of incidence of the deposition material passing through the center line C of the deposition space S is almost perpendicular to the substrate 2. [ Accordingly, the shadow of the organic layer P ₁ formed by the deposition material having passed through the patterning slit 131a has a minimum size, and the right shade SR ₁ and the left shadow SL ₁ are symmetric Respectively.

However, the critical incident angle [theta] of the deposition material passing through the patterning slit disposed away from the center line C of the deposition space S gradually becomes larger so that the critical value of the deposition material passing through the endmost patterning slit 131e The incident angle [theta] becomes about 55 [deg.]. Accordingly, the deposition material is inclined with respect to the patterning slit 131e, and the organic layer P ₅ formed by the deposition material passing through the patterning slit 131e has a maximum shadow size, The left shadow SR ₅ is formed longer than the right shadow SR ₅ .

That is, as the critical incident angle? Of the evaporation material increases, the size of the shadow increases. Particularly, the size of the shadow far from the center line C of the deposition space S is increased do. The critical incidence angle? Of the evaporation material increases as the distance from the central portion of the deposition space S to the patterning slit increases. Therefore, the shadow of the organic layer becomes larger as the distance from the center line C of the deposition space S to the patterning slit increases. Particularly, the shadow of both ends of the organic layer increases. The size of the shadow farther from the point C becomes larger.

11, the organic layers formed on the left side with respect to the center line C of the deposition space S are formed such that the left hypotenuse is longer than the right side hypotenuse, and the center line C of the deposition space S is defined as a reference The organic layers formed on the right side are formed so that the right hypotenuse is longer than the left hypotenuse.

The organic layers formed on the left side with respect to the center line C of the deposition space S are formed such that the length of the left hypotenuse is longer as the organic layer formed on the left side is longer, The longer the right hypotenuse is formed in the organic layer formed on the right side. As a result, the organic layers formed in the deposition space S may be formed to be symmetrical with respect to the center line of the deposition space S.

This will be described in more detail as follows.

Deposition material passing through the patterning slit (131b) are to pass through the patterning slit (131b) into the critical angle of incidence of θ _b, the left shade in this case the organic layer (P ₂₎ formed by the deposited material that has passed through the patterning slit (131b) the shadow is formed in the size of SL ₂ . Similarly, the deposition material passing through the patterning slits (131c) are to pass through the patterning slit (131c) to the threshold angle of incidence of θ _c, in this case the organic layer (P ₃₎ formed by the deposited material that has passed through the patterning slits (131c) The left shadow is formed with the size of SL ₃ . Similarly, the deposition material passing through the patterning slit (131d) are to pass through the patterning slit (131d) to the threshold angle of incidence of θ _d, the case of the organic layer (P ₄₎ formed by the deposited material that has passed through the patterning slit (131d) The left shadow is formed with a size of SL ₄ . Finally, the deposition material passing through the patterning slit (131e) are to pass through the patterning slit (131e) the critical angle of incidence of θ _e, in this case the organic layer formed by the vapor deposition material that has passed through the patterning slit (131e) (P ₅₎ The left shadow of the pixel is formed with the size of SL ₅ .

Here, θ _b <θ _c <Between θ _d <θ _e is, each of the shades of the organic layer was passed through the patterning slit (shadow), so establishing the size _{relationship, SL 1 <SL 2 <SL} 3 <SL 4 <SL 5 .

FIG. 12 is a plan view of an organic light emitting display according to an embodiment of the present invention manufactured using the thin film deposition apparatus as described above, and FIG. 13 is a sectional view of III-III of FIG. 12 . 12, only two of the first to third sub-pixels SP1, SP2 and SP3 are shown among the plurality of pixels formed on the substrate for convenience of explanation.

Referring to FIGS. 12 and 13, an organic light emitting display is formed on a lower substrate 21. The lower substrate 21 may be formed of a transparent material such as a glass material, a plastic material, or a metal material.

A plurality of pixels are formed on the lower substrate 21, and each pixel may include a plurality of sub-pixels SP1, SP2, and SP3 emitting different colors. 12 and 13, each pixel P includes a first sub-pixel SP1, a second sub-pixel SP2 and a third sub-pixel SP3. The first subpixel SP1, the second subpixel SP2, and the third subpixel SP3 may be subpixels emitting red, green, and blue, respectively. However, the present invention is not limited thereto, and the first sub-pixel SP1, the second sub-pixel SP2, and the third sub-pixel SP3 may be various color combinations that can realize white.

As shown in FIG. 13, the driving circuit portion 22 is located in each subpixel. Each driving circuit portion 22 may include at least one thin film transistor and at least one capacitor not shown.

The first insulating film 23 covers these driving circuit portions 22. A plurality of pixel electrodes 251 electrically connected to the driving circuit portions 22 are formed on the first insulating layer 23. Each pixel electrode 251 is positioned to be independent of each subpixel.

A second insulating layer 24 is formed on the first insulating layer 23. The second insulating layer 24 is formed to cover the pixel electrodes 251, and then the first to third openings are formed to expose the pixel electrodes 251 to define a light emitting region.

The first apertures, the second apertures, and the third apertures may be positioned to correspond to the first subpixel SP1, the second subpixel SP2, and the third subpixel SP3, respectively. On the other hand, the first openings define the first light emitting regions 241, the second openings define the second light emitting regions 242, and the third openings define the third light emitting regions 243.

A plurality of first lines 261, a plurality of second lines 261, and a plurality of second lines 262 are formed on the second insulating layer 24 so as to cover the first light emitting regions 241, the second light emitting regions 242, Two lines 262 and third lines 263 are formed.

The first lines 261 include a first organic light emitting layer, and may include, for example, a red organic light emitting layer.

The second lines 262 include a second organic light emitting layer, and may include, for example, a green organic light emitting layer.

The third lines 263 include a third organic light emitting layer, and may include, for example, a blue organic light emitting layer.

The counter electrode 252 is formed to cover the first lines 261, the second lines 262, and the third lines 263. The counter electrode 252 may be a common electrode formed to be common to all the pixels P.

The pixel electrode 251 may be formed of a transparent electrode or a reflective electrode, and may be formed of ITO, IZO, ZnO, or In ₂ O ₃ when used as a transparent electrode, and Ag, A transparent electrode can be formed thereon with ITO, IZO, ZnO, or In ₂ O ₃ after forming a reflective layer with Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, have. The pixel electrode 251 is formed by a sputtering method or the like, and then patterned by photolithography or the like.

When the counter electrode 252 is used as a transparent electrode, the counter electrode 252 is used as a cathode electrode. Therefore, a metal having a low work function, that is, Li, A supporting electrode layer or a bus electrode line is formed thereon with ITO, IZO, ZnO, In ₂ O ₃ or the like after forming a thin film of Ca, LiF / Ca, LiF / can do. When used as a reflective electrode, Li, Ca, LiF / Ca, LiF / Al, Al, Ag, Mg, and a compound thereof are thickly deposited on the entire surface. At this time, the counter electrode 252 may be deposited using the organic film deposition apparatus described above.

Functional organic layers may be further disposed between the pixel electrodes 251 and the counter electrode 252 in addition to the first lines 261, the second lines 262, and the third lines 263.

The functional organic layers may be formed by a single hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), an electron injection layer (EIL) And may be formed in a laminated structure.

The first lines 261, the second lines 262, and the third lines 263 are continuously deposited using the organic film deposition apparatus described above.

That is, the lower substrate 21 on which the second insulating film 24 including the first light emitting regions 241, the second light emitting regions 242, and the third light emitting regions 243 is formed, The first lines 261, the second lines 261, the second lines 262, the second lines 261, the second lines 262, Organic layers 262, third lines 263, and organic layers including functional organic layers are formed.

Since the film formation of the organic layers is continuously performed while being scanned in the direction of arrow A in FIG. 3, the first lines 261 (Y) are formed in the first direction Y, which is the same direction as the scanning direction A, ), Second lines 262 and third lines 263 are extended.

At this time, among the first lines 261, the second lines 262, and the third lines 263, adjacent to each other in the second direction X perpendicular to the first direction Y The first line 261 and the second line 262 can be partially overlapped with each other as shown in FIGS. 12 and 13. This is because the organic film formed as shown in FIG. 11 has a certain degree of shadow because the patterning slit sheet 130 and the substrate 2 are scanned at a predetermined distance.

When the first lines 261, the second lines 262 and the third lines 263 are formed by the deposition method as described above, the shading formed on the organic film is inevitable, 13, the first line 261 and the second line 262, which are located adjacent to each other in the second direction X, partially overlap each other and are positioned adjacent to each other in the second direction D2. The second line 262 and the third line 263 are partially overlapped with each other and the third line 263 and the first line 261 located adjacent to each other in the second direction D2 partially overlap each other .

At this time, the overlapping of the first line 261 and the second line 262, the overlapping of the second line 262 and the third line 263, and / or the overlapping of the third line 263 and the first line 262, (261) is formed on the second insulating film (24). In detail, the overlap of the first line 261 and the second line 262 is made in the first gap G1 between the first light emitting regions 241 and the second light emitting regions 242, The overlapping of the third line 262 and the third line 263 is performed in the second gap G2 between the second light emitting regions 242 and the third light emitting regions 243.

And the first lines 261 to the third lines 263 are not overlapped with the openings of the adjacent lines. That is, the first lines 261 do not overlap with the second openings 242 and the third openings 243, which are the openings covered by the adjacent second lines 262 and the third lines 263 . The second lines 262 do not overlap with the first openings 241 and the third openings 243 which are the openings covered by the adjacent first lines 261 and the third lines 263. The third lines 263 do not overlap with the second openings 242 and the first openings 241 which are the openings covered by the adjacent second lines 262 and the first lines 261. [

However, in the case where slight misalignment or misalignment between the substrate 2 and the patterning slit sheet 130 occurs or a shadow phenomenon occurs largely, the overlapping of the adjacent lines over the second insulating layer 24 The light emitting region is invaded. Accordingly, as shown in FIGS. 14 and 15F, the first line 261 penetrates the second light emitting regions 242 and causes color mixing and smearing in the second light emitting regions 242. Such problems such as deterioration of luminous efficiency due to color mixing and unevenness, and deterioration of the lifetime of the organic light emitting element occur. Also, there is a problem of producing defective products having a color coordinate which is separated, and visually recognizable spots are displayed.

Accordingly, the present invention provides a form of a light emitting region for reducing color mixing and smear in the first sub-pixels SP1, second sub-pixels SP2, and third sub-pixels SP3.

A portion of the first light emitting region 241 and the second light emitting region 242 facing the first light emitting region 241 and the second light emitting region 242 may be in a first direction Y, And the edge of the first or second line 261, 262 is not parallel to the edge of the first or second line 261, 262. 12 to 15, when the first light emitting region 241 and the second light emitting region 242 include an angle, the angle is the angle between the first light emitting region 241 and the second light emitting region 242, The region 242 is located at the opposite portion.

12 to 15, if the portion of the second light emitting region 242 adjacent to the first line 261 is parallel to the edge of the first line 261, for example, if the light emitting region is rectangular, 261 penetrate into the second light emitting regions 242, the color mixture and stain will occur in a wider area than in FIGS. However, in order to solve this problem, when the side of the second light emitting regions 242 is entirely reduced, that is, when the width of the second light emitting region in the second direction X is reduced, the light emitting area is reduced, There is a falling problem.

However, the present invention can minimize color mixing and smearing by adjacent lines without lowering the luminous efficiency.

In FIGS. 12 to 15, the first to third light emitting regions 241, 242 and 243 are hexagonal honeycomb shapes. FIG. 16 shows the first to third light emitting regions 241, 242 and 243 in a rhombic shape, 1 to the third light emitting regions 241, 242, and 243 are pentagonal. If the first to third light emitting regions 241, 242, and 243 are angular, the first light emitting region 241 and the second light emitting region 242 (among the portions of the first and second light emitting regions 241 and 242) 242) facing each other. Therefore, even if adjacent lines touch other light emitting regions as shown in FIG. 14, the area for generating the color mixture can be minimized.

If the first to third light emitting regions 241, 242 and 243 are triangular or the first to third light emitting regions 241, 242 and 243 are trapezoidal as shown in FIGS. 18 and 19, The first light emitting region 241 and the second light emitting region 242 are opposed to each other in the portions of the regions 241 and 242. As a result, even if the adjacent lines enter the light emitting region as shown in FIG. 14, the area for generating the color mixture can be minimized.

21, when the first to third light emitting regions 241, 242 and 243 are parallelograms, the first light emitting region 241 and the second light emitting portion 241, among the portions of the first and second light emitting regions 241 and 242, The portion of the region 242 opposite to the edge of each line (261, 262, 263 of Fig. 14) is antiparallel. As a result, even if the adjacent lines touch the other light emitting region as shown in FIG. 14, the area for generating the color mixture can be minimized.

22 to 25, when the first to third light emitting regions 241, 242, and 243 include a curved line, the first light emitting region 241, among the portions of the first and second light emitting regions 241 and 242, And the second light emitting region 242 are opposed to each other. As a result, even if the adjacent lines enter the light emitting region as shown in FIG. 14, the area for generating the color mixture can be minimized.

Although the first and second lines 261 and 262 and the first and second light emitting regions 241 and 242 are mainly described in FIGS. 12 to 24 for convenience of description, the present invention is applicable to the second and third lines 262 and 263 And the second and third light emitting regions 242 and 243 and the first and third lines 261 and 263 and the first and third light emitting regions 241 and 243 may be similarly applied.

The present invention is not limited to the embodiments shown in Figs. 12 to 25, and the shape of the light emitting region that can minimize the color mixing by the adjacent lines is not limited to the illustrated embodiment, but can be applied to the present invention. On the other hand, the shapes of the light emitting regions shown in each may be arranged in combination with each other on one substrate.

Meanwhile, the widths W1, W2 and W3 of the respective lines shown in Figs. 12 to 15 may be the same or may be different depending on the degree of effect generation. On the other hand, the gaps G1 and G2 can be variously determined according to the width of the line, the total pixel size, and the like.

Although the present invention has been described with reference to the limited embodiments, various embodiments are possible within the scope of the present invention. It will also be understood that, although not described, equivalent means are also incorporated into the present invention. Therefore, the true scope of protection of the present invention should be defined by the following claims.

1: Thin film deposition apparatus
100: evaporation unit 200: loading unit
300: unloading unit 400:

Claims (30)

Board;
An insulating layer formed on the substrate and including first regions arranged in a first direction and second regions arranged in the first direction adjacent to the first regions;
A first line formed on the insulating layer to cover the first regions and including a first organic light emitting layer; And
And a second line formed on the insulating layer to cover the second regions and including a second organic emission layer different from the first organic emission layer,
A portion where the first line and the second line overlap each other and a portion where the first line and the second line overlap with each other overlap with the first regions or a portion of the second regions, Wherein a portion of the second region that faces the first region and the second region is opposed to the first direction, and the portions of the first regions and the second regions, which are not parallel to the first direction, Wherein the first line and the second line pass through a portion overlapping each other. The method according to claim 1,
Wherein portions of the first and second regions facing the first region and the second region are opposed to edges of the first and second lines. The method according to claim 1,
Wherein the first and second regions are shaped to include an angle,
Wherein an angle is located at a portion of the first and second regions facing the first region and the second region. The method according to claim 1,
Wherein the first and second regions are shaped to include a curve,
Wherein a curve is located at a portion of the first and second regions facing the first region and the second region. The method according to claim 1,
Wherein portions of the first and second regions facing the first region and the second region are opposed to each other. delete The method according to claim 1,
And the first and second regions comprise openings formed in the insulating film. The method according to claim 1,
The first organic emission layer is formed using an organic layer deposition apparatus,
Wherein the first organic light emitting layer is formed such that the length of the oblique side farther from the center of the first region is longer than the length of the oblique side closer to the center of the first region. The method according to claim 1,
The first organic emission layer is formed using an organic layer deposition apparatus,
Wherein the first organic emission layer formed far from the center of the first region has a longer oblique length farther from the center of the first region. The method according to claim 1,
The first organic emission layer is formed using an organic layer deposition apparatus,
Wherein the first organic light emitting layer disposed at the center of the first region is formed such that the lengths of the first and second organic light emitting layers are substantially the same. The method according to claim 1,
The first organic emission layer is formed using an organic layer deposition apparatus,
Wherein the first organic emission layer disposed in the first region is symmetrically disposed with respect to a center of the first region. The method according to claim 1,
Wherein the substrate has a size of 40 inches or more. The method according to claim 1,
Wherein the first and second organic light emitting layers have a non-uniform thickness. Forming an insulating film on the substrate;
Forming openings in the insulating film defined by first regions arranged in a first direction and second regions arranged in the first direction adjacent to the first regions;
A first organic luminescent material emitted from the first deposition assembly is deposited on the substrate while the substrate moves relative to the first deposition assembly with the first deposition assembly and the substrate spaced apart, Forming a first line including a first organic emission layer on the insulating layer so as to cover the first organic emission layer; And
The substrate is moved relative to the second deposition assembly while the second deposition assembly and the substrate are spaced apart from each other, and the second organic luminescent material, which is different from the first organic luminescent material emitted from the second deposition assembly, Forming a second line including a second organic emission layer different from the first organic emission layer on the insulating layer so as to cover the second regions,
A portion where the first line and the second line overlap each other and a portion where the first line and the second line overlap with each other overlap with the first regions or a portion of the second regions, Wherein a portion of the second regions facing the first region and the second region is formed to be nonparallel to the first direction and the portions of the first regions and the portions of the second regions, Wherein the first line and the second line pass through a portion where the first line and the second line overlap with each other. 15. The method of claim 14,
Wherein forming the openings comprises:
Wherein the first and second regions are shaped to include an angle,
Wherein an angle is formed in a portion of the first and second regions facing the first region and the second region. 15. The method of claim 14,
Wherein forming the openings comprises:
Wherein the first and second regions are shaped to include a curve,
Wherein a curved line is formed at a portion of the first and second regions facing the first region and the second region. 15. The method of claim 14,
Wherein forming the openings comprises:
Wherein portions of the first and second regions facing the first region and the second region are formed so as to oppose each other. 15. The method of claim 14,
Wherein the first deposition assembly includes an evaporation source for emitting the first organic luminescent material, an evaporation source nozzle unit disposed at one side of the evaporation source and having a plurality of evaporation source nozzles, And a patterning slit sheet in which a plurality of patterning slits are formed,
Wherein the first organic light emitting material emitted from the evaporation source passes through the patterning slit sheet and is deposited onto the first organic light emitting layer. 19. The method of claim 18,
Wherein the patterning slit sheet is formed to be smaller than the substrate in at least one of a first direction and a second direction intersecting the first direction. 19. The method of claim 18,
A plurality of evaporation source nozzles are formed in the evaporation source nozzle portion along the first direction,
A plurality of patterning slits are formed in the patterning slit sheet along the first direction,
Wherein the first deposition assembly is disposed along the first direction between the evaporation source nozzle portion and the patterning slit sheet and divides a space between the evaporation source nozzle portion and the patterning slit sheet into a plurality of evaporation spaces A method of manufacturing an organic light emitting display device, the method comprising: forming a barrier plate assembly having a plurality of barrier plates; 19. The method of claim 18,
A plurality of evaporation source nozzles are formed in the evaporation source nozzle portion along a first direction,
Wherein the patterning slit sheet is formed with a plurality of patterning slits along a second direction crossing the first direction. 22. The method of claim 21,
Wherein the evaporation source, the evaporation source nozzle unit, and the patterning slit sheet are integrally formed by a coupling member. 23. The method of claim 22,
Wherein the connecting member guides the movement path of the evaporation material. 19. The method of claim 18,
Wherein forming the first line and the second line, respectively,
A moving part formed to be movable with the fixed substrate fixed to the substrate; a first conveying part for moving the moving part in which the substrate is fixed in a first direction; and a second conveying part for moving the moving part, A conveying part including a second conveying part for moving the conveying part in a direction opposite to the first direction;
A loading unit for fixing the substrate to the moving unit;
A deposition unit including a chamber maintained in vacuum and first and second deposition assemblies for depositing first and second organic light emitting layers on the substrate fixed to the moving unit transferred from the loading unit; And
And an unloading unit for separating the substrate from which the deposition is completed while passing through the deposition unit from the moving unit,
Each of the first and second organic luminescent materials emitted from the evaporation source is deposited on the substrate while the substrate is moved relative to the thin film deposition apparatus while the substrate is spaced apart, Is formed on the organic light emitting display device. 25. The method of claim 24,
Wherein the moving unit is configured to be circuable between the first transfer unit and the second transfer unit,
Wherein the substrate fixed to the moving unit is formed to be spaced apart from the first and second deposition assemblies by a predetermined distance while being moved by the first transfer unit. 25. The method of claim 24,
Wherein the first transferring part and the second transferring part are provided so as to pass through the vapor deposition part when passing through the vapor deposition part. 25. The method of claim 24,
Wherein the first transporting unit and the second transporting unit are arranged vertically and vertically. 25. The method of claim 24,
Wherein the first transfer unit sequentially moves the moving unit to the loading unit, the deposition unit, and the unloading unit. delete delete

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