KR101801351B1 - Apparatus for thin layer deposition and method for manufacturing of organic light emitting display apparatus using the same and organic light emitting display apparatus using the same - Google Patents

Abstract

In order to provide a thin film deposition apparatus which is easy to manufacture, can be easily applied to a large-scale substrate mass production process, and has improved manufacturing yield and deposition efficiency, a method of manufacturing an organic light emitting display using the same, and an organic light emitting display , The present invention is a thin film deposition apparatus for forming a thin film on a substrate, wherein the thin film deposition apparatus includes a plurality of thin film deposition assemblies, each of the plurality of thin film deposition assemblies comprising: an evaporation source for emitting a deposition material; An evaporation source nozzle unit disposed at one side of the evaporation source and having a plurality of evaporation source nozzles formed along a first direction; A patterning slit sheet disposed opposite to the evaporation source nozzle unit and having a plurality of patterning slits formed along the first direction; And a plurality of shielding plates disposed along the first direction between the evaporation source nozzle unit and the patterning slit sheet and partitioning a space between the evaporation source nozzle unit and the patterning slit sheet into a plurality of evaporation spaces Wherein the thin film deposition apparatus and the substrate are formed such that one side of the thin film deposition apparatus and the substrate are relatively movable with respect to the other side, Wherein each evaporation source of the plurality of thin film deposition assemblies is provided with at least a red light emitting layer material, a green light emitting layer material, a blue light emitting layer material, and an auxiliary layer material.

Description

TECHNICAL FIELD The present invention relates to a thin film deposition apparatus, a method of manufacturing an organic light emitting display apparatus using the same, and an organic light emitting display apparatus using the same. same}

The present invention relates to a thin film deposition apparatus, a method of manufacturing an organic light emitting display using the same, and an organic light emitting display manufactured using the same. More particularly, the present invention relates to a thin film deposition apparatus which can be easily applied to a large- A method of manufacturing an organic light emitting display using the same, and an organic light emitting display manufactured using the same.

Of the display devices, the organic light emitting display device has a wide viewing angle, excellent contrast, and fast response speed, and is receiving attention as a next generation display device.

2. Description of the Related Art In general, an organic light emitting display device has a stacked structure in which a light emitting layer is interposed between an anode and a cathode so that holes and electrons injected from the anode and cathode recombine to emit light on the principle of emitting light. However, since it is difficult to obtain high-efficiency light emission with such a structure, an intermediate layer such as an electron injection layer, an electron transport layer, a hole transport layer, and a hole injection layer is selectively inserted between each electrode and a light emitting layer.

However, since it is practically very difficult to form fine patterns of organic thin films such as a light emitting layer and an intermediate layer, and the luminous efficiency of red, green, and blue differs depending on the layer, conventional thin film deposition apparatuses require a large- It is impossible to fabricate a large-sized organic light emitting display device having a satisfactory level of driving voltage, current density, luminance, color purity, luminous efficiency and lifetime, etc., Urgent.

The organic light emitting display device includes a light emitting layer and an intermediate layer including the light emitting layer between the first electrode and the second electrode facing each other. At this time, the electrodes and the intermediate layer may be formed by various methods, one of which is a deposition. In order to manufacture an organic light emitting display device using a deposition method, a fine metal mask (FMM) having the same pattern as that of a thin film to be formed is closely adhered to a substrate surface on which a thin film or the like is to be formed, A material is deposited to form a thin film of a predetermined pattern.

The present invention relates to a thin film deposition apparatus which is easy to manufacture, can be easily applied to a large-scale substrate mass production process, and has improved manufacturing yield and deposition efficiency, a method of manufacturing an organic light emitting display using the same, and an organic light emitting display The purpose is to provide.

A thin film deposition apparatus for forming a thin film on a substrate, the thin film deposition apparatus comprising a plurality of thin film deposition assemblies, each of the thin film deposition assemblies comprising: an evaporation source for emitting a deposition material; An evaporation source nozzle unit disposed at one side of the evaporation source and having a plurality of evaporation source nozzles formed along a first direction; A patterning slit sheet disposed opposite to the evaporation source nozzle unit and having a plurality of patterning slits formed along the first direction; And a plurality of shielding plates disposed along the first direction between the evaporation source nozzle unit and the patterning slit sheet and partitioning a space between the evaporation source nozzle unit and the patterning slit sheet into a plurality of evaporation spaces Wherein the thin film deposition apparatus and the substrate are formed such that one side of the thin film deposition apparatus and the substrate are relatively movable with respect to the other side, Wherein each evaporation source of the plurality of thin film deposition assemblies is provided with at least a red light emitting layer material, a green light emitting layer material, a blue light emitting layer material, and an auxiliary layer material.

According to another aspect of the present invention, there is provided a thin film deposition apparatus for forming a thin film on a substrate, wherein the thin film deposition apparatus includes a plurality of thin film deposition assemblies, each of the plurality of thin film deposition assemblies An evaporation source; An evaporation source nozzle unit disposed at one side of the evaporation source and having a plurality of evaporation source nozzles formed along a first direction; And a patterning slit sheet disposed opposite to the evaporation source nozzle unit and having a plurality of patterning slits formed along a second direction perpendicular to the first direction, Wherein the evaporation source, the evaporation source nozzle portion, and the patterning slit sheet are integrally formed, and each evaporation source of the plurality of thin film deposition assemblies includes at least a red light emitting layer material, a green light emitting layer material , A blue light emitting layer material, and an auxiliary layer material.

In the present invention, at least one evaporation source provided with an auxiliary layer material between two evaporation sources provided with any one of the red light emitting layer material, the green light emitting layer material and the blue light emitting layer material among the evaporation sources of the plurality of thin film deposition assemblies, Can be arranged.

In the present invention, at least five thin film deposition assemblies are provided, and each of the evaporation sources of the at least five thin film deposition assemblies includes a blue light emitting layer material, an auxiliary layer material, a green light emitting layer material, an auxiliary layer material and a red light emitting layer material In order.

In the present invention, at least five thin film deposition assemblies are provided, and each of the evaporation sources of the at least five thin film deposition assemblies includes a blue light emitting layer material, an auxiliary layer material, a red light emitting layer material, an auxiliary layer material and a green light emitting layer material In order.

In the present invention, each deposition material provided in each evaporation source of the plurality of thin film deposition assemblies may be deposited on the substrate in turn.

Here, the deposition materials deposited on the substrate may be deposited with at least one auxiliary layer material between at least two light-emitting layer materials.

In the present invention, the thin film deposition apparatus and the substrate may move relative to the other side along a plane parallel to the surface on which the evaporation material is deposited on the substrate.

In the present invention, the patterning slit sheet of each of the thin film deposition assemblies may be formed smaller than the substrate.

In the present invention, each of the evaporation sources of the plurality of thin film deposition assemblies may be provided so that the deposition temperature can be controlled for each evaporation source.

In the present invention, the blocking plate assembly of each of the thin film deposition assemblies may guide a radiation path of the evaporation material emitted from the evaporation source.

In the present invention, each of the plurality of blocking plates is formed in a second direction substantially perpendicular to the first direction, and the space between the evaporation source nozzle portion and the patterning slit sheet is divided into a plurality of deposition spaces can do.

In the present invention, the blocking plate assembly may include a first blocking plate assembly having a plurality of first blocking plates, and a second blocking plate assembly having a plurality of second blocking plates.

Here, each of the plurality of first blocking plates and the plurality of second blocking plates is formed in a second direction substantially perpendicular to the first direction, and the space between the evaporation source nozzle portion and the patterning slit sheet Can be partitioned into a plurality of deposition spaces.

In the present invention, the evaporation source, the evaporation source nozzle unit, and the patterning slit sheet may be integrally formed by a coupling member.

Here, the connection member may guide the movement path of the evaporation material.

Here, the connection member may be formed to seal the space between the evaporation source and the evaporation source nozzle unit and the patterning slit sheet from the outside.

In the present invention, the thin film deposition apparatus may be spaced apart from the substrate by a predetermined distance.

In the present invention, while the substrate moves along the first direction with respect to the thin film deposition apparatus, the deposition material may be continuously deposited on the substrate.

In the present invention, the plurality of evaporation source nozzles may be formed to tilt a predetermined angle.

Here, the plurality of evaporation source nozzles include two rows of evaporation source nozzles formed along the first direction, and the evaporation source nozzles of the two rows may be tilted in directions opposite to each other.

Here, the plurality of evaporation source nozzles include two rows of evaporation source nozzles formed along the first direction, and the evaporation source nozzles disposed on the first one of the evaporation source nozzles of the two rows Are arranged to face the second side edge of the patterning slit sheet and the evaporation source nozzles disposed on the second side of the two rows of evaporation source nozzles are arranged to face the first side edge of the patterning slit sheet .

According to still another aspect of the present invention, there is provided a method of manufacturing an organic light emitting display device using a thin film deposition apparatus for forming a thin film on a substrate, the substrate being disposed at a predetermined distance from the thin film deposition apparatus; And depositing a deposition material to be radiated from the thin film deposition apparatus on the substrate while moving either one of the thin film deposition apparatus and the substrate relative to the other side, An evaporation source that emits the material; An evaporation source nozzle unit disposed at one side of the evaporation source and having a plurality of evaporation source nozzles formed along a first direction; A patterning slit sheet disposed opposite to the evaporation source nozzle unit and having a plurality of patterning slits formed along the first direction; And a plurality of shielding plates disposed along the first direction between the evaporation source nozzle unit and the patterning slit sheet and partitioning a space between the evaporation source nozzle unit and the patterning slit sheet into a plurality of evaporation spaces Wherein at least one of the plurality of thin film deposition assemblies is provided with a red light emitting layer material, a green light emitting layer material, a blue light emitting layer material, and an auxiliary layer material in each evaporation source of the plurality of thin film deposition assemblies And a method of manufacturing the organic light emitting display device.

According to still another aspect of the present invention, there is provided a method of manufacturing an organic light emitting display device using a thin film deposition apparatus for forming a thin film on a substrate, the substrate being disposed at a predetermined distance from the thin film deposition apparatus; And depositing a deposition material to be radiated from the thin film deposition apparatus on the substrate while moving either one of the thin film deposition apparatus and the substrate relative to the other side, An evaporation source that emits the material; An evaporation source nozzle unit disposed at one side of the evaporation source and having a plurality of evaporation source nozzles formed along a first direction; And a patterning slit sheet disposed to face the evaporation source nozzle unit and having a plurality of patterning slits formed along a second direction perpendicular to the first direction, wherein the plurality of thin film deposition assemblies include a plurality of thin film deposition assemblies, Wherein each of the evaporation sources of the two thin film deposition assemblies is provided with at least a red light emitting layer material, a green light emitting layer material, a blue light emitting layer material, and an auxiliary layer material.

In the present invention, the deposition of the deposition material on the substrate may be performed by sequentially depositing the blue light emitting layer material, the auxiliary layer material, the green light emitting layer material, the auxiliary layer material and the red light emitting layer material, Lt; RTI ID = 0.0 > a < / RTI >

In the present invention, the deposition of the deposition material on the substrate may be performed by sequentially depositing the blue light emitting layer material, the auxiliary layer material, the red light emitting layer material, the auxiliary layer material and the green light emitting layer material, Lt; RTI ID = 0.0 > a < / RTI >

In the present invention, each deposition material provided in each evaporation source of the plurality of thin film deposition assemblies may be deposited on the substrate in turn.

In the present invention, the step of depositing the deposition material on the substrate may further include controlling the deposition temperature for each of the plurality of thin film deposition assemblies.

According to another aspect of the present invention, there is provided an organic light emitting display device manufactured by any one of the above-described methods.

According to still another aspect of the present invention, there is provided an organic light emitting display device having a plurality of pixels, wherein each of the pixels includes sub-pixels in which light emitting layers emitting blue, green, and red light are formed, Pixel is further provided with a green auxiliary layer, a red auxiliary layer is further formed in the red sub-pixel, the green auxiliary layer is interposed between the blue emitting layer and the green emitting layer, and the green auxiliary layer is provided between the green emitting layer and the red emitting layer. And a red auxiliary layer interposed therebetween.

In the present invention, each of the pixels may sequentially include sub-pixels in which light-emitting layers emitting blue, green, and red light are formed, respectively, in one direction.

In the present invention, one end of the green auxiliary layer may be formed to overlap with one end of the blue light emitting layer, and the green light emitting layer may be formed on the green auxiliary layer.

In the present invention, one end of the red auxiliary layer overlaps with one end of the green emitting layer, and the red emitting layer is formed on the red auxiliary layer.

In the present invention, the blue light emitting layer, the green light emitting layer, the green light emitting layer, and the red light emitting layer may not contact each other.

In the present invention, the organic light emitting display device includes a substrate; And a first electrode and a second electrode facing each other, wherein the blue, green, and red light emitting layers, the green auxiliary layer, and the red auxiliary layer may be formed between the first electrode and the second electrode.

In the present invention, the thickness of the green auxiliary layer and the thickness of the red auxiliary layer may be different from each other.

According to still another aspect of the present invention, there is provided an organic light emitting diode display having a plurality of pixels, wherein each of the pixels includes sub-pixels in which light emitting layers emitting blue, red and green light are formed, Pixel, a red auxiliary layer is further formed in the red sub-pixel, a green auxiliary layer is further formed in the green sub-pixel, the red auxiliary layer is interposed between the blue light emitting layer and the red light emitting layer, And the green auxiliary layer is interposed between the green light emitting layers.

In the present invention, each of the pixels may sequentially include sub-pixels in which light-emitting layers emitting blue, red, and green light are formed, respectively, in one direction.

In the present invention, one end of the red auxiliary layer overlaps with one end of the blue light emitting layer, and the red light emitting layer is formed on the red auxiliary layer.

In the present invention, one end of the green auxiliary layer overlaps with one end of the red emitting layer, and the green emitting layer is formed on the green auxiliary layer.

In the present invention, the blue light emitting layer, the red light emitting layer, the red light emitting layer, and the green light emitting layer may not contact each other.

In the present invention, the organic light emitting display device includes a substrate; And a first electrode and a second electrode facing each other, wherein the blue, red and green light emitting layers, the red auxiliary layer, and the green auxiliary layer may be formed between the first electrode and the second electrode.

In the present invention, the thickness of the green auxiliary layer and the thickness of the red auxiliary layer may be different from each other.

According to the thin film deposition apparatus of the present invention, the method of manufacturing an organic light emitting display using the same, and the organic light emitting display manufactured using the thin film deposition apparatus of the present invention, it is easy to manufacture and can be easily applied to a large- An effect of improving the production yield and the deposition efficiency can be obtained.

1 is a perspective view schematically showing a thin film deposition assembly according to a first embodiment of the present invention.
2 is a schematic side view of the thin film deposition assembly of FIG.
Figure 3 is a schematic plan view of the thin film deposition assembly of Figure 1;
4 is a perspective view schematically showing a thin film deposition apparatus according to a first embodiment of the present invention.
5A and 5B are cross-sectional views illustrating one pixel in an organic light emitting display device manufactured by the thin film deposition apparatus of FIG.
6 is a perspective view schematically showing a thin film deposition assembly according to a second embodiment of the present invention.
7 is a perspective view schematically showing a thin film deposition assembly according to a third embodiment of the present invention.
8 is a schematic side view of the thin film deposition assembly of FIG.
Figure 9 is a schematic plan view of the thin film deposition assembly of Figure 7;
10 is a view showing a thin film deposition assembly according to another embodiment of the present invention.
11 is a view schematically showing a distribution shape of a deposition film deposited on a substrate when the evaporation source nozzle is not tilted in the thin film deposition assembly according to the present invention.
12 is a view schematically showing a distribution pattern of a deposition film deposited on a substrate when the evaporation source nozzle is tilted in the thin film deposition assembly according to the present invention.
13 is a system configuration diagram schematically showing a thin film deposition apparatus according to an embodiment of the present invention.
14 is a view showing a modification of Fig.
15 is a schematic view showing an example of the electrostatic chuck of Fig.

Hereinafter, a thin film deposition apparatus according to a first embodiment of the present invention and a method of manufacturing the organic light emitting display apparatus using the same will be described in detail.

1 is a schematic perspective view of a thin film deposition assembly according to a first embodiment of the present invention, FIG. 2 is a schematic side view of the thin film deposition assembly of FIG. 1, and FIG. 3 is a schematic side view of the thin film deposition assembly of FIG. FIG.

Referring to FIGS. 1, 2 and 3, a thin film deposition assembly 100 according to a first embodiment of the present invention includes an evaporation source 110, an evaporation source nozzle unit 120, a shutdown plate assembly 130, And a slit sheet 150.

Here, although the chambers are not shown in FIGS. 1, 2, and 3 for convenience of explanation, it is preferable that all the configurations of FIGS. 1 to 3 are disposed in a chamber in which an appropriate degree of vacuum is maintained. This is to ensure the straightness of the deposition material.

More specifically, in order to allow the deposition material 115 emitted from the deposition source 110 to be deposited on the substrate 600 in a desired pattern through the deposition source nozzle unit 120 and the patterning slit sheet 150, The inside of the chamber should be kept at the same high vacuum as the FMM deposition method. Also, the temperature of the blocking plate 131 and the patterning slit sheet 150 should be sufficiently lower than the temperature of the evaporation source 110 (about 100 DEG C or less). This is because the temperature of the blocking plate 131 should be sufficiently low to prevent evaporation of the evaporation material 115 that has collided with the blocking plate 131. If the temperature of the patterning slit sheet 150 is sufficiently low, The problem of thermal expansion of the patterning slit sheet 150 due to the thermal expansion coefficient can be minimized. At this time, since the blocking plate assembly 130 faces the high-temperature evaporation source 110 and the temperature near the evaporation source 110 rises up to about 167 ° C, a partial cooling device may be further provided if necessary. To this end, a cooling member may be formed in the blocking plate assembly 130.

In this chamber (not shown), a substrate 600 as a deposition target is disposed. The substrate 600 may be a substrate for a flat panel display device, and a large-area substrate such as a mother glass capable of forming a plurality of flat panel display devices may be used.

Here, in the first embodiment of the present invention, the deposition proceeds as the substrate 600 moves relative to the thin film deposition assembly 100.

Specifically, in the conventional FMM deposition method, the FMM size must be formed equal to the substrate size. Therefore, as the substrate size increases, the FMM must also be made larger, which makes it difficult to fabricate the FMM, and it is not easy to align the FMM with a precise pattern by pulling the FMM.

In order to solve such a problem, the thin film deposition assembly 100 according to the first embodiment of the present invention is characterized in that the deposition is performed while the thin film deposition assembly 100 and the substrate 600 move relative to each other . In other words, the substrate 600 arranged to face the thin film deposition assembly 100 performs the deposition continuously while moving along the Y axis direction. That is, the deposition is performed in a scanning manner while the substrate 600 moves in the direction of arrow A in FIG. Although the substrate 600 is illustrated as being deposited in a Y-axis direction in a chamber (not shown), the idea of the present invention is not limited thereto, and the substrate 600 may be fixed, It is also possible that the assembly 100 itself performs the deposition while moving in the Y-axis direction.

Accordingly, the patterning slit sheet 150 can be made much smaller than the conventional FMM in the thin film deposition assembly 100 of the present invention. That is, in the case of the thin film deposition assembly 100 of the present invention, since the substrate 600 performs the deposition in a scanning manner while moving along the Y-axis direction, the X of the patterning slit sheet 150 The length in the axial direction and the Y-axis direction can be formed to be much smaller than the length of the substrate 600. [ As described above, since the patterning slit sheet 150 can be made much smaller than the conventional FMM, the patterning slit sheet 150 of the present invention can be easily manufactured. That is, the patterning slit sheet 150 of a small size is advantageous compared to the FMM deposition method in all the processes such as the etching operation of the patterning slit sheet 150, the subsequent precision tensioning and welding operation, the movement and the cleaning operation. Further, this becomes more advantageous as the display device becomes larger.

In order to deposit the thin film deposition assembly 100 and the substrate 600 relative to each other, it is preferable that the thin film deposition assembly 100 and the substrate 600 are spaced apart to some extent. This will be described later in detail.

On the other hand, on the side facing the substrate 600 in the chamber, an evaporation source 110 in which the evaporation material 115 is stored and heated is disposed. As the deposition material 115 stored in the deposition source 110 is vaporized, the deposition is performed on the substrate 600.

In detail, the evaporation source 110 includes a crucible 111 in which an evaporation material 115 is filled, a evaporation material 115 filled in the crucible 111 by heating the crucible 111, And a heater 112 for evaporating the evaporation source toward the evaporation source nozzle unit 120 side.

The evaporation source nozzle unit 120 is disposed on one side of the evaporation source 110, specifically, on the evaporation source 110 side toward the substrate 600. A plurality of evaporation source nozzles 121 are formed in the evaporation source nozzle portion 120 along the X axis direction. Here, the plurality of evaporation source nozzles 121 may be equally spaced. The evaporated material 115 vaporized in the evaporation source 110 passes through the evaporation source nozzle unit 120 and is directed toward the substrate 600 as a deposition target.

A blocking plate assembly 130 is provided on one side of the evaporation source nozzle unit 120. The blocking plate assembly 130 includes a plurality of blocking plates 131 and a blocking plate frame 132 provided outside the blocking plates 131. The plurality of blocking plates 131 may be provided in parallel with each other along the X-axis direction. Here, the plurality of blocking plates 131 may be equally spaced. Each of the blocking plates 131 is formed so as to be parallel to the YZ plane as seen in the drawing, that is, perpendicular to the X axis direction. The plurality of blocking plates 131 arranged in this manner serves to partition the space between the evaporation source nozzle unit 120 and the patterning slit sheet 150 into a plurality of evaporation spaces S. That is, in the thin film deposition assembly 100 according to the first embodiment of the present invention, the deposition space S is separated by each of the evaporation source nozzles 121 through which the evaporation material is injected by the blocking plates 131 .

Here, each of the blocking plates 131 may be disposed between neighboring evaporation source nozzles 121. In other words, it can be considered that one evaporation source nozzle 121 is disposed between the barrier plates 131 adjacent to each other. Preferably, the evaporation source nozzles 121 may be located at the center between the adjacent barrier plates 131. In this way, the blocking plate 131 divides the space between the evaporation source nozzle unit 120 and the patterning slit sheet 150 into a plurality of evaporation spaces S, The material is deposited on the substrate 600 through the patterning slit 151 without being mixed with the deposition materials discharged from the other evaporation source nozzles 121. In other words, the blocking plates 131 serve to guide the movement path of the evaporation material in the Z-axis direction so that the evaporation material discharged through the evaporation source nozzle 121 is not dispersed but maintains the linearity.

The thickness of the shadow formed on the substrate can be greatly reduced by providing the blocking plate 131 to secure the linearity of the evaporation material so that the thin film deposition assembly 100 and the substrate 600 can be constantly It is possible to make the distance between them. This will be described later in detail.

In addition, a blocking plate frame 132 may be further provided on the outer side of the plurality of blocking plates 131. The blocking plate frame 132 is provided on the upper and lower surfaces of the plurality of blocking plates 131 to support the positions of the plurality of blocking plates 131 and to prevent the evaporation material discharged through the evaporation source nozzle 121 from being dispersed So as to guide the movement path of the evaporation material in the Y-axis direction.

Although the evaporation source nozzle unit 120 and the blocking plate assembly 130 are shown as spaced apart from each other by a certain degree, the present invention is not limited thereto. That is, the evaporation source nozzle unit 120 and the shutoff plate assembly 130 may be spaced apart from each other by a predetermined distance to prevent the heat emitted from the evaporation source 110 from being conducted to the shutoff plate assembly 130, The evaporation source nozzle unit 120 and the blocking plate assembly 130 may be in contact with each other when the heat insulating means is provided between the circular nozzle unit 120 and the blocking plate assembly 130.

Meanwhile, the blocking plate assembly 130 may be detachable from the thin film deposition assembly 100. In detail, the conventional FMM deposition method has a problem that the deposition efficiency is low. Here, the deposition efficiency refers to the ratio of material actually deposited on the substrate among the materials vaporized in the deposition source. The deposition efficiency in the conventional FMM deposition method is about 32%. In addition, in the conventional FMM deposition method, about 68% of the organic material not used for the deposition is deposited on the inside and the inside of the deposition chamber, so that there is a problem that the recycling is not easy.

In order to solve such a problem, in the thin film deposition assembly 100 according to the first embodiment of the present invention, since the deposition space is separated from the outer space by using the blocking plate assembly 130, Most of the deposition material is deposited in the blocking plate assembly 130. Therefore, when the blocking plate assembly 130 is detachable from the thin film deposition assembly 100 and a large amount of the evaporation material is accumulated in the blocking plate assembly 130 after the long time deposition, the blocking plate assembly 130 is separated, The deposition material can be recovered by putting it in a deposition material recycling apparatus. Through such a configuration, the deposition efficiency can be improved and the manufacturing cost can be reduced by increasing the recycling rate of the deposition material.

A patterning slit sheet 150 and a frame 155 are further provided between the evaporation source 110 and the substrate 600. The frame 155 is formed substantially in the shape of a window frame, and a patterning slit sheet 150 is coupled to the inside of the frame 155. A plurality of patterning slits 151 are formed in the patterning slit sheet 150 along the X-axis direction. The evaporated material 115 vaporized in the evaporation source 110 passes through the evaporation source nozzle unit 120 and the patterning slit sheet 150 and is directed toward the substrate 600 as a deposition target. At this time, the patterning slit sheet 150 can be manufactured through etching, which is the same method as that of a conventional fine metal mask (FMM), particularly, a stripe type mask.

In the thin film deposition assembly 100 according to the first embodiment of the present invention, the total number of the patterning slits 151 is larger than the total number of the evaporation source nozzles 121. In addition, the number of the patterning slits 151 is larger than the number of the evaporation source nozzles 121 disposed between the two adjacent blocking plates 131.

 That is, one evaporation source nozzle 121 may be disposed between two adjacent barrier plates 131. At the same time, a plurality of patterning slits 151 may be disposed between two adjacent blocking plates 131. The space between the evaporation source nozzle unit 120 and the patterning slit sheet 150 is divided by the two blocking plates 131 adjacent to each other so that the evaporation space S is formed for each evaporation source nozzle 121, Respectively. Accordingly, the deposition material emitted from one evaporation source nozzle 121 is mostly deposited on the substrate 600 through the patterning slits 151 in the same deposition space S.

The blocking plate assembly 130 and the patterning slit sheet 150 may be spaced apart from each other by a predetermined distance. The blocking plate assembly 130 and the patterning slit sheet 150 are connected to each other by a connecting member 135 Can be connected. In detail, since the temperature of the blocking plate assembly 130 is raised by at most 100 ° C by the evaporation source 110 at a high temperature, the temperature of the raised blocking plate assembly 130 is prevented from being conducted to the patterning slit sheet 150 The blocking plate assembly 130 and the patterning slit sheet 150 are spaced apart to some extent.

As described above, the thin film deposition assembly 100 according to the first embodiment of the present invention performs deposition while relatively moving relative to the substrate 600, and thus the thin film deposition assembly 100 is mounted on the substrate 600 The patterning slit sheet 150 is formed to be spaced apart from the substrate 600 by a certain distance. A shield plate 131 is provided between the evaporation source nozzle unit 120 and the patterning slit sheet 150 in order to solve a shadow problem caused when the patterning slit sheet 150 and the substrate 600 are separated from each other. To secure the linearity of the evaporation material, thereby greatly reducing the size of the shadow formed on the substrate.

In detail, in the conventional FMM deposition method, a mask is closely adhered to a substrate to prevent a shadow from being formed on the substrate, and a deposition process is performed. However, when the mask is brought into close contact with the substrate in this manner, there is a problem that a problem of defective due to contact between the substrate and the mask occurs. Further, since the mask can not be moved relative to the substrate, the mask must be formed to have the same size as the substrate. Therefore, as the size of the display device is increased, the size of the mask must be increased. Thus, there is a problem that it is not easy to form such a large mask.

In order to solve such a problem, in the thin film deposition assembly 100 according to the first embodiment of the present invention, the patterning slit sheet 150 is disposed to be spaced apart from the substrate 600, which is the deposition target, by a predetermined distance. This can be realized by providing the blocking plate 131 so that the shadow produced in the substrate 600 becomes small.

According to the present invention, after the mask is formed smaller than the substrate, the deposition can be performed while moving the mask relative to the substrate, so that it is possible to obtain an effect of facilitating the production of the mask. In addition, it is possible to obtain an effect of preventing defects due to contact between the substrate and the mask. Further, since the time required for the substrate and the mask to adhere to each other in the process becomes unnecessary, an effect of improving the manufacturing speed can be obtained. In addition, by providing the blocking plate 131, the shadow produced on the substrate 600 becomes small, and the patterning slit sheet 150 can be separated from the substrate 600. [

4 is a perspective view schematically showing a thin film deposition apparatus according to a first embodiment of the present invention.

Referring to FIG. 4, the thin film deposition apparatus according to the first embodiment of the present invention is characterized in that a plurality of thin film deposition assemblies described in FIGS. 1 to 3 are provided. In other words, in the thin film deposition apparatus according to the first embodiment of the present invention, the blue light emitting layer material B, the green auxiliary layer material G ', the green light emitting layer material G, the red auxiliary layer material R' And a multi-source in which the light-emitting layer material (R) is deposited in order.

In detail, the thin film deposition apparatus according to the first embodiment of the present invention includes a first thin film deposition assembly 100, a second thin film deposition assembly 200, a third thin film deposition assembly 300, a fourth thin film deposition assembly 400, And a fifth thin film deposition assembly 500. The configuration of each of the first, second, third, and fourth thin film deposition assemblies 100, 200, 400, and 500, respectively, The thin film deposition assembly is the same as the thin film deposition assembly described with reference to FIGS. 1 to 3, and thus a detailed description thereof will be omitted.

Here, the evaporation sources of the first thin film deposition assembly 100, the second thin film deposition assembly 200, the third thin film deposition assembly 300, the fourth thin film deposition assembly 400, and the fifth thin film deposition assembly 500 Different deposition materials may be provided.

For example, the first thin film deposition assembly 100 is provided with a deposition material B which is a material of the blue light emitting layer and the second thin film deposition assembly 200 is provided with a deposition material G ' The third thin film deposition assembly 300 is provided with a deposition material G which is a material of the green light emitting layer and the fourth thin film deposition assembly 400 is provided with a deposition material R ' And the fifth thin film deposition assembly 500 may be provided with a deposition material R which is a material of the red light emitting layer.

Alternatively, although not shown in the drawing, the first thin film deposition assembly 100 is provided with a deposition material B which is a material of a blue light emitting layer, and the second thin film deposition assembly 200 is provided with a deposition material The third thin film deposition assembly 300 is provided with a deposition material R which is a material of a red light emitting layer and the fourth thin film deposition assembly 400 is provided with a deposition material (G '), and the fifth thin film deposition assembly 500 may be provided with a deposition material G which is a material of the green light emitting layer.

5A) is arranged between the blue light emitting layer (see 62B in FIG. 5A) and the green light emitting layer (see 62G in FIG. 5A) ) And a red auxiliary layer (see 62R 'in FIG. 5A) may be disposed between the red emitting layer (see 62R in FIG. 5A). Alternatively, as shown in FIG. 5B, a red auxiliary layer may be disposed between the blue light emitting layer and the red light emitting layer, and a green auxiliary layer may be disposed between the green light emitting layer and the red light emitting layer. That is, since the intermediate layer is interposed between the adjacent light emitting layers, the light emitting layers overlapping each other do not directly contact each other. This will be described in detail in Figs. 5A and 5B.

Here, the evaporation material (R ', G') to be the material of the auxiliary layer, the evaporation material (R) to be the material of the red emission layer, the evaporation material (G) to be the material of the green emission layer, The temperature of the evaporation source 110 of the first thin film deposition assembly 100 and the temperature of the evaporation source 210 of the second thin film deposition assembly 200 may be different from each other, The temperature of the evaporation source 310 of the third thin film deposition assembly 300, the temperature of the evaporation source 410 of the fourth thin film deposition assembly 400, and the temperature of the fifth thin film deposition assembly It is also possible that the temperatures of the evaporation sources 510 of the evaporation sources 500 and 500 are set to be different from each other.

In the figure, five thin film deposition assemblies are shown, but the spirit of the present invention is not limited thereto. That is, the thin film deposition apparatus according to the first embodiment of the present invention may have a plurality of thin film deposition assemblies, and each of the plurality of thin film deposition assemblies may have different materials.

By providing a plurality of thin film deposition assemblies so that a plurality of thin film layers can be formed all at once, an effect of improving the production yield and the deposition efficiency can be obtained. Further, the manufacturing process can be simplified and the manufacturing cost can be reduced.

An organic film (see 62 in FIGS. 5A and 5B) including the light emitting layer of the organic light emitting display device can be manufactured using the thin film deposition apparatus having such a structure. Here, the method for manufacturing the organic light emitting display device may include a step of disposing the substrate 600 so as to be spaced apart from the thin film deposition apparatus by a predetermined distance, and a step in which the thin film deposition apparatus and the substrate are moved relative to the other side, And depositing a deposition material that is emitted from the deposition apparatus on the substrate.

This will be described in more detail as follows.

First, the substrate 600 is disposed so as to be spaced apart from the thin film deposition apparatus by a predetermined distance. As described above, the thin film deposition apparatus of the present invention includes a patterning slit sheet 150 formed to be smaller than the substrate 600 and easy to manufacture, so that the thin film deposition apparatus and the substrate 600 are relatively moved And the deposition is performed. In other words, the deposition is continuously performed while moving the substrate 600 disposed to face the thin film deposition apparatus along the Y-axis direction. That is, as the substrate 600 moves in the direction of arrow B in FIG. 1, the deposition is performed by a scanning method. In order for the thin film deposition apparatus and the substrate 600 to move relative to each other, the thin film deposition apparatus and the substrate 600 must be spaced apart to some extent. Accordingly, the substrate 600 is arranged to be spaced apart from the thin film deposition apparatus by a predetermined distance in a chamber (not shown).

Next, the deposition material, which is emitted from the thin film deposition apparatus, is deposited on the substrate while moving one side of the thin film deposition apparatus and the substrate 600 relative to the other side. As described above, the thin film deposition apparatus of the present invention includes a patterning slit sheet 150 formed to be smaller than the substrate 600 and easy to manufacture, so that the thin film deposition apparatus and the substrate 600 are moved relative to each other, . Although the substrate 600 is illustrated as moving in the Y-axis direction in the state where the thin film deposition apparatus is fixed, the idea of the present invention is not limited to this. In the state where the substrate is fixed, It would also be possible for the device to move globally.

A method of manufacturing an organic light emitting display device according to a first embodiment of the present invention includes the steps of forming a blue light emitting layer material (B), a green auxiliary layer material (G '), a green light emitting layer material (G) ), And a red light emitting layer material (R) are sequentially deposited on the substrate. 5A and 5B), a green auxiliary layer (see 62G 'in FIGS. 5A and 5B), a green light emitting layer (FIGS. 5A and 5B), and a blue light emitting layer (See 62G in FIG. 5B), red auxiliary layers (see 62R 'in FIGS. 5A and 5B) and red light emitting layers (see 62R in FIGS. 5A and 5B) can be deposited at the same time, The number of chambers to be provided is decreased, and the facility cost is also remarkably reduced.

The organic film 62 of the organic light emitting display device to be described later may be formed by using the thin film deposition apparatus. In addition, the thin film deposition apparatus may be used for deposition of an organic film or an inorganic film of the organic TFT, It is also applicable to various film forming processes of various materials.

Hereinafter, the organic light emitting display device manufactured by the thin film deposition apparatus of FIG. 4 will be described in detail.

5A and 5B are cross-sectional views illustrating one pixel in an organic light emitting display device manufactured by the thin film deposition apparatus of FIG.

5A and 5B, a buffer layer 51 is formed on a glass or plastic substrate 50, and a thin film transistor (TFT) and an organic light emitting diode (OLED) are formed on the buffer layer 51 .

An active layer 52 of a predetermined pattern is provided on the buffer layer 51 of the substrate 50. A gate insulating film 53 is formed on the active layer 52 and a gate electrode 54 is formed on a predetermined region of the gate insulating film 53. The gate electrode 54 is connected to a gate line (not shown) for applying a thin film transistor ON / OFF signal. An interlayer insulating film 55 is formed on the gate electrode 54 and source / drain electrodes 56 and 57 are connected to the source / drain regions 52b and 52c of the active layer 52 through contact holes, Respectively. A passivation film 58 made of SiO ₂ , SiNx or the like is formed on the source / drain electrodes 56 and 57 and an upper portion of the passivation film 58 is formed of acryl, polyimide, BCB A flattening film 59 is formed of an organic material such as benzocyclobutene. A first electrode 61 to be an anode electrode of the organic electroluminescent device OLED is formed on the planarization film 59 and a pixel defining layer 60 is formed of organic material to cover the first electrode 61. After the predetermined opening is formed in the pixel defining layer 60, the organic layer 62 is formed on the upper portion of the pixel defining layer 60 and the first electrode 61 formed with the opening and exposed to the outside. The organic layer 62 includes a light emitting layer. The present invention is not necessarily limited to such a structure, and it goes without saying that the structure of various organic light emitting display devices can be applied as it is.

The organic electroluminescent device OLED emits red, green, and blue light according to the current flow to display predetermined image information. The organic electroluminescent device OLED is connected to the drain electrode 56 of the thin film transistor, A first electrode 61, a second electrode 63 provided to cover all the pixels and supplying negative power, and an organic layer 63 disposed between the first electrode 61 and the second electrode 63, (62).

The first electrode 61 and the second electrode 63 are insulated from each other by the organic layer 62 and voltages of different polarities are applied to the organic layer 62 to cause the organic layer 62 to emit light.

When a low molecular organic film is used, a hole injection layer (HIL), a hole transport layer (HTL), an emission layer (EML), an electron transport layer An electron transport layer (ETL), and an electron injection layer (EIL) may be laminated in a single or a composite structure. The organic materials that can be used include copper phthalocyanine (CuPc), N, N-di (naphthalen-1-yl) -N, N'-diphenyl-benzidine: NPB), tris-8 - tris-8-hydroxyquinoline aluminum (Alq3), and the like. These low-molecular organic films are formed by a vacuum deposition method.

In the case of the polymer organic film, the hole transport layer (HTL) and the light emitting layer (EML) may have a structure. In this case, PEDOT is used as the hole transport layer and polyphenylenevinylene (PPV) ) Based polymer organic materials, and they can be formed by screen printing, inkjet printing, or the like.

It is needless to say that such an organic film is not necessarily limited thereto, and various embodiments may be applied.

The first electrode 61 functions as an anode electrode and the second electrode 63 functions as a cathode electrode. Of course, when the polarities of the first electrode 61 and the second electrode 63 are reversed It is acceptable.

The first electrode 61 may be a transparent electrode or a reflective electrode. When the first electrode 61 is used as a transparent electrode, it may be formed of ITO, IZO, ZnO, or In ₂ O _3. When used as a reflective electrode, ITO, IZO, ZnO, or In ₂ O ₃ can be formed thereon after forming a reflective film with Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr and a compound thereof.

When the second electrode 63 is used as a transparent electrode, the second electrode 63 is used as a cathode electrode. Therefore, a metal having a low work function, that is, Li, Ca , LiF / Ca, LiF / Al, Al, Ag, Mg, and a compound thereof are oriented in the direction of the organic layer 62 and then a transparent electrode such as ITO, IZO, ZnO, or In ₂ O ₃ An auxiliary electrode layer or a bus electrode line can be formed. Li, Ca, LiF / Ca, LiF / Al, Al, Ag, Mg, and a compound thereof are deposited on the entire surface when the electrode is used as a reflective electrode.

In such an organic light emitting display device, the organic layer 62 including the light emitting layer may be formed by the above-described thin film deposition apparatus (see 100 in FIG. 1).

In detail, the organic layer 62 may include the light emitting layers 62R, 62G and 62B and the auxiliary layers 62R 'and 62G'. Depending on the material used, the light emitting layers 62R, 62G, and 62B may emit red, green, or blue light. On the other hand, the auxiliary layers 62R 'and 62G' are formed of the same material as the hole transport layer (HTL) described above, and the thickness of the intermediate layer including the auxiliary layers 62R 'and 62G' And are formed to have different thicknesses in the sub-pixels that emit blue light. This will be described in more detail as follows.

One of the first electrode 61 and the second electrode 63 is a reflective electrode and the other is a translucent electrode or a transparent electrode. Therefore, a resonance phenomenon may occur between the first electrode 61 and the second electrode 63 when the device is driven. When light is emitted from the light emitting layers 62R, 62G and 62B between the first electrode 61 and the second electrode 63 during driving of the organic light emitting display device, The light emission luminance and the efficiency of light emission can be increased. In order to form such a resonance structure, the organic light emitting display device according to the first embodiment of the present invention is characterized in that the thickness of the intermediate layer including the auxiliary layers 62R 'and 62G' is red, green, They may be formed to have different thicknesses in the cows. That is, since the auxiliary layers 62R 'and 62G' among the organic layers provided between the first electrode 61 and the second electrode 63 have a thickness optimized for each emission color of the light emitting layer, excellent driving voltage, current density, A light emission luminance, a color purity, a light emission efficiency, a life characteristic, and the like.

However, in the conventional organic light emitting display device, the auxiliary layers 62R 'and 62G' are formed on the first electrode 61, and the red, green and blue light emitting layers 62R, 62G, ) Are formed in this order. However, when the substrate and the patterning slit sheet are spaced apart from each other as in the present invention, a slight shadow may be generated on the substrate. When shadows are generated and neighboring light emitting layers are mixed with each other, the light emitting efficiency is lowered and the driving voltage is increased.

That is, as shown in Table 1 below, the external quantum efficiency of the blue light-emitting layer 62B in the standard state without the overlap region is 6.29%, while the red light-emitting layer 62R or the red light- Even when only 1% of the green light emitting layer (G) is overlapped, the external quantum efficiency is rapidly reduced to 1.53% and 2.76%, respectively.

Blue
(R 1% overlap) Blue
(Standard) Blue
(G 1% overlap) Green
(Standard) Green
(R 1% overlap) Efficiency (EQE,%) 1.53 6.29 2.76 12.29 6.37 Efficiency (cd / A) 0.9 3.7 5.3 50.5 26.4 Cx 0.159 0.144 0.170 0.223 0.233 Cy 0.068 0.057 0.222 0.711 0.708 Peak wavelength (nm) 456 456 455 529 529

In order to solve such problems, an organic light emitting display device according to an embodiment of the present invention includes subpixels arranged in blue (B), green (G), and red (R) One end of the green auxiliary layer 62G 'and the green emitting layer 62G are overlapped on one end of the blue emitting layer 62B and the red auxiliary layer 62R' and the red emitting layer 62G are formed on the other end of the green emitting layer 62G, (62R) are formed so as to overlap each other.

As described above, the first thin film deposition assembly (see 100 in FIG. 4) is provided with a deposition material that is the material of the blue light emission layer 62B, and the second thin film deposition assembly (see 200 in FIG. 4) The first thin film deposition assembly (see FIG. 4) is provided with a deposition material that is a material of the green emission layer 62G, and the fourth thin film deposition assembly 400) may be provided with a deposition material which is a material of the red auxiliary layer 62R ', and a fifth thin film deposition assembly (see 500 of FIG. 4) may be provided with a deposition material which is a material of the red emission layer 62R .

In this case, the blue light emitting layer 62B is first deposited, and then the green auxiliary layer 62G 'is deposited. At this time, the left end portion of the green auxiliary layer 62G 'is deposited on the right end portion of the blue light emitting layer 62B while the right end portion of the blue light emitting layer 62B overlaps with the left end portion of the green auxiliary layer 62G' . Then, a green light emitting layer 62G is deposited on the green auxiliary layer 62G '. That is, the green auxiliary layer 62G 'is interposed between the blue light emitting layer 62B and the green light emitting layer 62G, so that the blue light emitting layer 62B and the green light emitting layer 62G which are adjacent to each other are not in direct contact with each other.

A red auxiliary layer 62R 'is then deposited. At this time, the left end portion of the red auxiliary layer 61R 'is deposited on the right end portion of the green light emitting layer 62G while the right end portion of the green light emitting layer 62G and the left end portion of the red auxiliary layer 62R' . Then, a red light emitting layer 62R is deposited on the red auxiliary layer 62R '. That is, the red auxiliary layer 62R 'is interposed between the green emitting layer 62G and the red emitting layer R so that the green emitting layer G and the red emitting layer R, which are adjacent to each other, are not in direct contact with each other.

That is, as shown in the following Table 2, the external quantum efficiency of the blue light emitting layer 62B in the standard state without the overlap region is 6.29%, the red auxiliary layer R 'and the red light emitting layer 62R, And the external quantum efficiency is 5.42% when the green auxiliary layer (G ') and the green emitting layer (62G) overlap each other by 1%, and the external quantum efficiency is 5.42% Compared with Table 1, which is not interposed, the luminous efficiency of the light emitting layer is greatly improved, the color mixing phenomenon disappears, and the effect of improving the color coordinates is obtained.

Blue
(R 1%, R 'overlapping 1%) Blue
(Standard) Blue
(G 1%, G 'overlapping 1%) Green
(B 1%
Overlapping) Green
(Standard) Green
(R 1%,
R '1%
Overlapping) Red
(G 1%
Overlapping) Red
(Standard) Red
(B 1%
Overlapping) Efficiency (EQE,%) 5.78 6.29 5.42 11.83 12.29 10.29 26.34 27.86 28.19 Efficiency (cd / A) 3.5 3.7 3.3 49.6 50.5 43.6 23.6 33.2 32.9 Cx 0.140 0.144 0.142 0.238 0.223 0.252 0.688 0.677 0.679 Cy 0.060 0.057 0.059 0.702 0.711 0.693 0.304 0.310 0.310 Peak wavelength (nm) 457 456 456 531 529 533 640 629 629

Although not shown in the drawing, the first thin film deposition assembly is provided with a deposition material which is a material of a blue light emitting layer, the second thin film deposition assembly is provided with a deposition material which is a material of a red auxiliary layer, The fourth thin film deposition assembly is provided with a deposition material which is a material of the green auxiliary layer and the fifth thin film deposition assembly is provided with a deposition material which is a material of the green emission layer have.

In this case, the blue light emitting layer is first deposited, and then the red auxiliary layer is deposited. At this time, the left end portion of the red auxiliary layer is deposited on the right end portion of the blue light emitting layer while the right end portion of the blue light emitting layer overlaps the left end portion of the red auxiliary layer to some extent. Then, a green light emitting layer is deposited on the red auxiliary layer. That is, since the red auxiliary layer is interposed between the blue light emitting layer and the red light emitting layer, the blue light emitting layer adjacent to each other and the red light emitting layer are not in direct contact with each other.

A green auxiliary layer is then deposited. At this time, the left end portion of the green auxiliary layer is deposited on the right end portion of the red light emitting layer while the right end portion of the red light emitting layer overlaps the left end portion of the green auxiliary layer to some extent. Then, a green light emitting layer is deposited on the green auxiliary layer. That is, since the green auxiliary layer is interposed between the red light emitting layer and the green light emitting layer, the red light emitting layer and the green light emitting layer adjacent to each other do not directly contact each other.

According to the present invention, it is possible to obtain an effect of minimizing the efficiency deterioration and the influence of the color mixture due to the occurrence of the overlap region with the adjacent light emitting layer.

(Second Embodiment)

6 is a perspective view schematically showing a thin film deposition assembly according to a second embodiment of the present invention.

6, the thin film deposition assembly 700 according to the second embodiment of the present invention includes an evaporation source 710, an evaporation source nozzle unit 720, a first blocking plate assembly 730, A substrate 740, a patterning slit sheet 750, and a substrate 600.

Here, although the chamber is not shown in FIG. 6 for convenience of explanation, it is preferable that all the configurations of FIG. 6 are disposed in a chamber in which an appropriate degree of vacuum is maintained. This is to ensure the straightness of the deposition material.

In this chamber (not shown), a substrate 600 as a deposition target is disposed. An evaporation source 710 in which the evaporation material 715 is stored and heated is disposed on the side opposite to the substrate 600 in the chamber (not shown). The evaporation source 710 includes a crucible 711 and a heater 712.

An evaporation source nozzle unit 720 is disposed on one side of the evaporation source 710, specifically, on the evaporation source 710 side toward the substrate 600. A plurality of evaporation source nozzles 721 are formed in the evaporation source nozzle portion 720 along the X axis direction.

A first blocking plate assembly 730 is provided on one side of the evaporation source nozzle unit 720. The first blocking plate assembly 730 includes a plurality of first blocking plates 731 and a first blocking plate frame 732 provided outside the first blocking plates 731.

The first blocking plate assembly 730 includes a second blocking plate assembly 740 on one side thereof. The second blocking plate assembly 740 includes a plurality of second blocking plates 741 and a second blocking plate frame 742 provided outside the second blocking plates 741.

A patterning slit sheet 750 and a frame 755 are further provided between the evaporation source 710 and the substrate 600. The frame 755 is formed in a lattice shape such as a window frame, and the patterning slit sheet 750 is coupled to the inside of the frame 755. A plurality of patterning slits 751 are formed in the patterning slit sheet 750 along the X-axis direction.

Here, the thin film deposition assembly 700 according to the second embodiment of the present invention is characterized in that the shield plate assembly is divided into a first shield plate assembly 730 and a second shield plate assembly 740.

In detail, the plurality of first blocking plates 731 may be provided in parallel with each other along the X-axis direction. The plurality of first blocking plates 731 may be formed at regular intervals. Each of the first blocking plates 731 is formed so as to be parallel to the YZ plane as viewed in the drawing, that is, perpendicular to the X axis direction.

In addition, the plurality of second blocking plates 741 may be provided in parallel with each other along the X-axis direction. The plurality of second blocking plates 741 may be formed at regular intervals. Each second blocking plate 741 is formed so as to be parallel to the YZ plane as seen in the drawing, that is, perpendicular to the X axis direction.

The plurality of first blocking plates 731 and the second blocking plates 741 arranged in this way serve to define a space between the evaporation source nozzle unit 720 and the patterning slit sheet 750. The thin film deposition assembly 700 according to the second embodiment of the present invention includes the evaporation source nozzles 721 through which the evaporation material is ejected by the first blocking plate 731 and the second blocking plate 741, And the deposition space is separated.

Here, each of the second blocking plates 741 may be disposed so as to correspond one-to-one with the respective first blocking plates 731. In other words, each of the second blocking plates 741 may be aligned with the first blocking plates 731 and arranged in parallel with each other. That is, the first blocking plate 731 and the second blocking plate 741 corresponding to each other are located on the same plane. The space between the evaporation source nozzle portion 720 and a later-described patterning slit sheet 750 is partitioned by the first blocking plates 731 and the second blocking plates 741 arranged in parallel with each other, The deposition material discharged from one evaporation source nozzle 721 is not mixed with the evaporation materials discharged from the other evaporation source nozzle 721 but is deposited on the substrate 600 through the patterning slit 751. In other words, the first blocking plates 731 and the second blocking plates 741 serve to guide the movement path of the evaporation material in the Z axis direction so that the evaporation material discharged through the evaporation source nozzle 721 is not dispersed .

Although the figure shows that the width of the first blocking plate 731 in the X axis direction is the same as the width of the second blocking plate 741 in the X axis direction, the idea of the present invention is not limited to this. That is, the second blocking plate 741, which requires precise alignment with the patterning slit sheet 750, is relatively thin, whereas the first blocking plate 731, which does not require precise alignment, It is also possible to make it thick and easy to manufacture.

Although not shown in the drawings, the thin film deposition apparatus according to the second embodiment of the present invention may include a plurality of thin film deposition assemblies. That is, in the thin film deposition apparatus according to the second embodiment of the present invention, the blue light emitting layer material B, the green auxiliary layer material G ', the green light emitting layer material G, the red auxiliary layer material R' (R) may be sequentially deposited on the substrate. Then, the substrate 600 is moved in the direction of arrow C in FIG. 6, and deposition is performed by a scanning method. Since the plurality of thin film deposition assemblies are described in detail in the first embodiment, a detailed description thereof will be omitted in the present embodiment.

(Third Embodiment)

FIG. 7 is a perspective view schematically illustrating a thin film deposition assembly according to a third embodiment of the present invention, FIG. 8 is a schematic side view of the thin film deposition assembly of FIG. 7, and FIG. 9 is a schematic view of the thin film deposition assembly of FIG. FIG.

7, 8 and 9, a thin film deposition assembly 1100 according to the third embodiment of the present invention includes an evaporation source 1110, an evaporation source nozzle unit 1120, and a patterning slit sheet 1150 do.

Here, although the chambers are not shown in FIGS. 7, 8, and 9 for convenience of explanation, it is preferable that all the configurations of FIGS. 7 to 9 are disposed in a chamber in which an appropriate degree of vacuum is maintained. This is to ensure the straightness of the deposition material.

In this chamber (not shown), a substrate 600 as a deposition target is disposed. An evaporation source 1110 in which the evaporation material 1115 is stored and heated is disposed on the side opposite to the substrate 600 in the chamber (not shown). The evaporation source 1110 includes a crucible 1111 and a heater 1112.

An evaporation source nozzle unit 1120 is disposed on one side of the evaporation source 1110, specifically, on the evaporation source 1110 side toward the substrate 600. A plurality of evaporation source nozzles 1121 are formed in the evaporation source nozzle portion 1120 along the Y axis direction, that is, the scanning direction of the substrate 600. Here, the plurality of evaporation source nozzles 1121 may be formed at regular intervals. The evaporated material 1115 vaporized in the evaporation source 1110 is directed to the substrate 600 as a deposition source through the evaporation source nozzle unit 1120. When a plurality of evaporation source nozzles 1121 are formed on the evaporation source nozzle portion 1120 along the Y axis direction, that is, along the scanning direction of the substrate 600, the patterning slits 1150 of the patterning slit sheet 1150 1151 are influenced only by the size of one evaporation source nozzle 1121 (i.e., there is only one evaporation source nozzle 1121 in the X-axis direction) , And no shadow occurs. In addition, since a plurality of evaporation source nozzles 1121 exist in the scanning direction, even if a flux difference between the individual evaporation source nozzles occurs, the difference is canceled, and the uniformity of deposition is maintained constant.

A patterning slit sheet 1150 and a frame 1155 are further provided between the evaporation source 1110 and the substrate 600. The frame 1155 is formed substantially in the shape of a window frame, and a patterning slit sheet 1150 is coupled to the inside of the frame 1155. A plurality of patterning slits 1151 are formed in the patterning slit sheet 1150 along the X-axis direction. The vaporized evaporation material 1115 in the evaporation source 1110 is directed toward the substrate 600 as the evaporation source through the evaporation source nozzle portion 1120 and the patterning slit sheet 1150. At this time, the patterning slit sheet 1150 can be manufactured through etching, which is the same method as that of a conventional fine metal mask (FMM), particularly, a stripe type mask.

The deposition source 1110 (and the deposition source nozzle unit 1120 associated therewith) and the patterning slit sheet 1150 may be formed to be spaced apart from each other by a certain distance. The deposition source 1110 (and the The evaporation source nozzle portion 1120) and the patterning slit sheet 1150 can be connected to each other by the connecting member 1135. [ That is, the evaporation source 1110, the evaporation source nozzle unit 1120, and the patterning slit sheet 1150 are connected by the connecting member 1135 and can be integrally formed with each other. Here, the connection members 1135 can guide the movement path of the evaporation material so that the evaporation material discharged through the evaporation source nozzle 1121 is not dispersed. Although the connecting member 1135 is formed only in the right and left direction of the evaporation source 1110, the evaporation source nozzle unit 1120 and the patterning slit sheet 1150 so as to guide only the X axis direction of the evaporation material, For convenience of illustration, the spirit of the present invention is not limited thereto, and the connecting member 1135 may be formed as a box-shaped closed type to simultaneously guide the movement of the evaporation material in the X axis direction and the Y axis direction.

As described above, the thin film deposition assembly 1100 according to an embodiment of the present invention performs deposition while relatively moving relative to the substrate 600, and thus the thin film deposition assembly 1100 is mounted on the substrate 600 In order to move relatively, the patterning slit sheet 1150 is formed to be spaced apart from the substrate 600 to some extent.

According to the present invention, after the mask is formed smaller than the substrate, the deposition can be performed while moving the mask relative to the substrate, so that it is possible to obtain an effect of facilitating the production of the mask. In addition, it is possible to obtain an effect of preventing defects due to contact between the substrate and the mask. Further, since the time required for the substrate and the mask to adhere to each other in the process becomes unnecessary, an effect of improving the manufacturing speed can be obtained.

Though not shown in the drawings, the thin film deposition apparatus according to the third embodiment of the present invention may include a plurality of thin film deposition assemblies. That is, in the thin film deposition apparatus according to the third embodiment of the present invention, the blue light emitting layer material B, the green auxiliary layer material G ', the green light emitting layer material G, the red auxiliary layer material R' (R) may be sequentially deposited on the substrate. Then, the substrate 600 is moved in the direction of arrow A in FIG. 7, and deposition is performed by a scanning method. Since the plurality of thin film deposition assemblies are described in detail in the first embodiment, a detailed description thereof will be omitted in the present embodiment.

(Fourth Embodiment)

10 is a view showing a thin film deposition assembly according to a fourth embodiment of the present invention. Referring to the drawings, a thin film deposition assembly according to a fourth embodiment of the present invention includes an evaporation source 1110, an evaporation source nozzle unit 1120, and a patterning slit sheet 1150. The evaporation source 1110 includes a crucible 1111 filled with an evaporation material 1115 therein and an evaporation material 1115 filled in the crucible 1111 by heating the crucible 1111 to the evaporation source nozzle portion And a heater 1112 for evaporating the refrigerant to the evaporator 1120 side. An evaporation source nozzle unit 1120 is disposed on one side of the evaporation source 1110 and a plurality of evaporation source nozzles 1121 are formed on the evaporation source nozzle unit 1120 along the Y axis direction. A patterning slit sheet 1150 and a frame 1155 are further provided between the evaporation source 1110 and the substrate 600. A plurality of patterning slits 1151 are formed in the patterning slit sheet 1150 along the X- . The deposition source 1110 and the evaporation source nozzle unit 1120 and the patterning slit sheet 1150 are coupled by a connecting member 1135.

In this embodiment, a plurality of evaporation source nozzles 1121 formed in the evaporation source nozzle unit 1120 are distinguished from the above-described embodiments in that they are arranged in a predetermined angle tilt. In detail, the evaporation source nozzle 1121 may be composed of two rows of evaporation source nozzles 1121a and 1121b, and the evaporation source nozzles 1121a and 1121b of the two rows are alternately arranged. At this time, the evaporation source nozzles 1121a and 1121b may be tilted so as to be inclined at a predetermined angle on the XZ plane.

The evaporation source nozzles 1121a of the first row are tilted so as to face the evaporation source nozzles 1121b of the second row and the evaporation source nozzles 1121b of the second row are tilted so as to face the evaporation source nozzles 1121a of the first row, . In other words, the evaporation source nozzles 1121a disposed in the left column are arranged to face the right end of the patterning slit sheet 1150, and the evaporation source nozzles 1121b disposed in the right column are arranged to face the left end of the patterning slit sheet 1150 It can be arranged to look at.

FIG. 11 is a schematic view showing a distribution pattern of a deposition layer deposited on a substrate when the deposition source nozzle is not tilted in the thin film deposition assembly according to the present invention. FIG. 12 is a cross- FIG. 3 is a view schematically showing a distribution pattern of a deposited film deposited on a substrate when tilted. FIG. 11 and 12, it can be seen that when the evaporation source nozzle is tilted, the thickness of the evaporation film formed on both end portions of the substrate increases relatively and the uniformity of the evaporation film increases.

According to this structure, the difference in the film thickness between the center and the end of the substrate is reduced, and the deposition amount can be controlled so that the thickness of the entire deposition material can be controlled uniformly. In addition, .

Hereinafter, the overall system configuration of the thin film deposition apparatus including the plurality of thin film deposition assemblies shown in FIG. 4 will be described in detail.

FIG. 13 is a system configuration diagram schematically showing a thin film deposition apparatus according to an embodiment of the present invention, and FIG. 14 shows a modification of FIG. 15 is a schematic view showing an example of the electrostatic chuck 800. Fig.

13, a thin film deposition apparatus according to an embodiment of the present invention includes a loading unit 910, a deposition unit 930, an unloading unit 920, a first circulation unit 810, and a second circulation unit 820).

The loading section 910 may include a first rack 912, an introduction robot 914, an introduction chamber 916, and a first reversing chamber 918.

A plurality of substrates 600 before deposition is deposited on the first rack 912 and the introduction robot 914 holds the substrate 600 from the first rack 912 and transfers the substrate 600 from the second circulation unit 820 After the substrate 600 is placed on the transferred electrostatic chuck 800, the electrostatic chuck 800 to which the substrate 600 is attached is transferred to the introduction chamber 916.

A first inverting chamber 918 is provided adjacent to the introducing chamber 916 and a first inverting robot 919 located in the first inverting chamber 918 inverts the electrostatic chuck 800 to rotate the electrostatic chuck 800, To the first circulation unit 810 of the deposition unit 930.

As shown in FIG. 15, the electrostatic chuck 600 has an electrode 802 to which power is applied, and a high voltage is applied to the electrode 802, Thereby attaching the substrate 600 to the surface of the main body 801.

13, the introduction robot 914 places the substrate 600 on the upper surface of the electrostatic chuck 800. In this state, the electrostatic chuck 800 is transferred to the introduction chamber 916, The substrate 600 is positioned downward in the deposition unit 930 as the substrate 919 reverses the electrostatic chuck 800. [

The configuration of the unloading unit 920 is configured in reverse to the configuration of the loading unit 910 described above. That is, the substrate 600 and the electrostatic chuck 800 having passed through the deposition unit 930 are reversed by the second inversion chamber 929 in the second inversion chamber 928 and transferred to the discharge chamber 926, 924 remove the substrate 600 and the electrostatic chuck 800 from the discharge chamber 926 and then remove the substrate 600 from the electrostatic chuck 800 and load it on the second rack 922. The electrostatic chuck 800 separated from the substrate 600 is returned to the loading unit 910 through the second circulation unit 820.

However, the present invention is not limited thereto. The substrate 600 may be fixed to the lower surface of the electrostatic chuck 800 from the time when the substrate 600 is first fixed to the electrostatic chuck 800, . In this case, for example, the first inverting chamber 918 and the first inverting robot 919, the second inverting chamber 928 and the second inverting robot 929 are not necessary.

The deposition section 930 has at least one vapor deposition chamber. 13, the deposition unit 930 includes a first chamber 931, and a plurality of thin film deposition assemblies 100 (200) are formed in the first chamber 931. In addition, ) 300 and 400 are disposed. 13, a first thin film deposition assembly 100, a second thin film deposition assembly 200, a third thin film deposition assembly 300, and a third thin film deposition assembly 300 are provided in the first chamber 931. In this embodiment, Four thin film deposition assemblies 400 are installed, but the number is variable depending on the deposition material and deposition conditions. The first chamber 931 is kept in vacuum during deposition.

14, the deposition unit 930 includes a first chamber 931 and a second chamber 932 connected to each other. In the first chamber 931, The first and second thin film deposition assemblies 100 and 200 may be disposed in the second chamber 932 and the third and fourth thin film deposition assemblies 300 and 400 may be disposed in the second chamber 932. [ Needless to say, the number of chambers can be added at this time.

13, the electrostatic chuck 800 to which the substrate 600 is fixed is transferred to the deposition unit 930 by the first circulation unit 810, and preferably to the deposition unit 930 by the first circulation unit 810. In other words, The electrostatic chuck 800 separated from the substrate 600 in the unloading unit 920 is sequentially moved to the loading unit 910, the deposition unit 930 and the unloading unit 920. The second circulation unit 820 To the loading unit 910. [0156]

The first circulation unit 810 is provided to pass through the first chamber 931 when passing through the deposition unit 930 and the second circulation unit 820 is provided to transfer the electrostatic chuck.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

100: thin film deposition assembly 110: evaporation source
120: evaporation source nozzle unit 130: blocking plate assembly
150: patterning slit sheet

Claims (43)

A thin film deposition apparatus for forming a thin film on a substrate,
The thin film deposition apparatus includes a plurality of thin film deposition assemblies,
Wherein each of the plurality of thin film deposition assemblies includes:
An evaporation source for emitting a deposition material;
An evaporation source nozzle unit disposed at one side of the evaporation source and having a plurality of evaporation source nozzles formed along a first direction;
A patterning slit sheet disposed opposite to the evaporation source nozzle unit and having a plurality of patterning slits formed along the first direction; And
And a plurality of blocking plates disposed along the first direction between the evaporation source nozzle unit and the patterning slit sheet and partitioning a space between the evaporation source nozzle unit and the patterning slit sheet into a plurality of evaporation spaces A blocking plate assembly,
The thin film deposition apparatus is formed to be spaced apart from the substrate by a predetermined distance,
Wherein the thin film deposition apparatus and the substrate are formed such that one side is movable in a linear direction relative to the other side,
Wherein each evaporation source of the plurality of thin film deposition assemblies is provided with at least a red light emitting layer material, a green light emitting layer material, a blue light emitting layer material, and an auxiliary layer material. A thin film deposition apparatus for forming a thin film on a substrate,
The thin film deposition apparatus includes a plurality of thin film deposition assemblies,
Wherein each of the plurality of thin film deposition assemblies includes:
An evaporation source for emitting a deposition material;
An evaporation source nozzle unit disposed at one side of the evaporation source and having a plurality of evaporation source nozzles formed along a first direction; And
And a patterning slit sheet disposed opposite to the evaporation source nozzle unit and having a plurality of patterning slits formed along a second direction perpendicular to the first direction,
The deposition is performed while the substrate moves along the first direction with respect to the thin film deposition apparatus,
Wherein the evaporation source, the evaporation source nozzle portion, and the patterning slit sheet are integrally formed,
Wherein each evaporation source of the plurality of thin film deposition assemblies is provided with at least a red light emitting layer material, a green light emitting layer material, a blue light emitting layer material, and an auxiliary layer material. 3. The method according to any one of claims 1 to 3,
At least one evaporation source provided with an auxiliary layer material is disposed between two evaporation sources provided with any one of the red light emitting layer material, the green light emitting layer material and the blue light emitting layer material among the evaporation sources of the plurality of thin film deposition assemblies . 3. The method according to any one of claims 1 to 3,
At least five of the thin film deposition assemblies are provided, and each of the evaporation sources of the at least five thin film deposition assemblies is characterized in that a blue light emitting layer material, an auxiliary layer material, a green light emitting layer material, an auxiliary layer material and a red light emitting layer material are sequentially provided . 3. The method according to any one of claims 1 to 3,
At least five thin film deposition assemblies are provided, and each of the evaporation sources of the at least five thin film deposition assemblies is characterized by being provided with a blue light emitting layer material, an auxiliary layer material, a red light emitting layer material, an auxiliary layer material and a green light emitting layer material, . 3. The method according to any one of claims 1 to 3,
Wherein the deposition materials of each of the plurality of thin film deposition assemblies are sequentially deposited on the substrate. The method according to claim 6,
Wherein the deposition materials deposited on the substrate are deposited with at least one auxiliary layer material between the at least two light emitting layer materials. 3. The method according to any one of claims 1 to 3,
Wherein the thin film deposition apparatus and the substrate move relative to the other side along a plane parallel to the surface on which the deposition material is deposited on the substrate. 3. The method according to any one of claims 1 to 3,
Wherein the patterning slit sheet of each of the thin film deposition assemblies is formed to be smaller than the substrate. 3. The method according to any one of claims 1 to 3,
Wherein each evaporation source of the plurality of thin film deposition assemblies is provided so that a deposition temperature can be controlled for each evaporation source. The method according to claim 1,
Wherein the shield plate assembly of each of the thin film deposition assemblies guides a radiation path of the evaporation material emitted from the evaporation source. The method according to claim 1,
Wherein each of the plurality of blocking plates is formed in a second direction perpendicular to the first direction so that a space between the evaporation source nozzle unit and the patterning slit sheet is divided into a plurality of evaporation spaces Device. The method according to claim 1,
Wherein the blocking plate assembly includes a first blocking plate assembly having a plurality of first blocking plates, and a second blocking plate assembly having a plurality of second blocking plates. 14. The method of claim 13,
Wherein the plurality of first blocking plates and the plurality of second blocking plates are formed in a second direction perpendicular to the first direction so that a space between the evaporation source nozzle portion and the patterning slit sheet is formed by a plurality of deposition Wherein the substrate is divided into spaces. 3. The method of claim 2,
Wherein the evaporation source, the evaporation source nozzle unit, and the patterning slit sheet are integrally joined by a connection member. 16. The method of claim 15,
Wherein the connection member guides the movement path of the deposition material. 16. The method of claim 15,
Wherein the connection member is formed to seal the space between the evaporation source and the evaporation source nozzle portion and the patterning slit sheet from the outside. 3. The method of claim 2,
Wherein the thin film deposition apparatus is spaced apart from the substrate by a predetermined distance. 3. The method of claim 2,
Wherein the deposition material is continuously deposited on the substrate while the substrate moves along the first direction with respect to the thin film deposition apparatus. 3. The method of claim 2,
Wherein the plurality of evaporation source nozzles are formed to be tilted by a predetermined angle. 21. The method of claim 20,
Wherein the plurality of evaporation source nozzles include two rows of evaporation source nozzles formed along the first direction and the evaporation source nozzles of the two rows are tilted in directions opposite to each other. Film deposition apparatus. 21. The method of claim 20,
Wherein the plurality of evaporation source nozzles include two rows of evaporation source nozzles formed along the first direction,
The evaporation source nozzles disposed on the first one of the two rows of the evaporation source rows are arranged to face the second side edge of the patterning slit sheet,
Wherein the evaporation source nozzles disposed on a second side of the two rows of evaporation source rows are arranged to face the first side edge of the patterning slit sheet. A method of manufacturing an organic light emitting display device using a thin film deposition apparatus for forming a thin film on a substrate,
The substrate being spaced apart from the thin film deposition apparatus by a predetermined distance; And
Wherein a deposition material emitted from the thin film deposition apparatus is deposited on the substrate while the one side of the thin film deposition apparatus and the substrate moves in a linear direction relative to the other side,
The thin film deposition apparatus includes:
An evaporation source for emitting a deposition material;
An evaporation source nozzle unit disposed at one side of the evaporation source and having a plurality of evaporation source nozzles formed along a first direction;
A patterning slit sheet disposed opposite to the evaporation source nozzle unit and having a plurality of patterning slits formed along the first direction; And
And a plurality of blocking plates disposed along the first direction between the evaporation source nozzle unit and the patterning slit sheet and partitioning a space between the evaporation source nozzle unit and the patterning slit sheet into a plurality of evaporation spaces A plurality of thin film deposition assemblies including a barrier plate assembly,
Wherein each evaporation source of the plurality of thin film deposition assemblies is provided with at least a red light emitting layer material, a green light emitting layer material, a blue light emitting layer material, and an auxiliary layer material. A method of manufacturing an organic light emitting display device using a thin film deposition apparatus for forming a thin film on a substrate,
The substrate being spaced apart from the thin film deposition apparatus by a predetermined distance; And
Wherein a deposition material emitted from the thin film deposition apparatus is deposited on the substrate while the one side of the thin film deposition apparatus and the substrate moves in a linear direction relative to the other side,
The thin film deposition apparatus includes:
An evaporation source for emitting a deposition material;
An evaporation source nozzle unit disposed at one side of the evaporation source and having a plurality of evaporation source nozzles formed along a first direction; And
And a patterning slit sheet disposed opposite to the evaporation source nozzle unit and having a plurality of patterning slits formed along a second direction perpendicular to the first direction,
Wherein each evaporation source of the plurality of thin film deposition assemblies is provided with at least a red light emitting layer material, a green light emitting layer material, a blue light emitting layer material, and an auxiliary layer material. 25. A method according to any one of claims 23 to 24,
Wherein the deposition material is deposited on the substrate,
Wherein the blue light emitting layer material, the auxiliary layer material, the green light emitting layer material, the auxiliary layer material, and the red light emitting layer material, which are provided in the plurality of thin film deposition assemblies, are sequentially deposited on the substrate. 25. A method according to any one of claims 23 to 24,
Wherein the deposition material is deposited on the substrate,
Wherein the blue light emitting layer material, the auxiliary layer material, the red light emitting layer material, the auxiliary layer material, and the green light emitting layer material are sequentially deposited on the substrate in the plurality of thin film deposition assemblies. 25. A method according to any one of claims 23 to 24,
Wherein the deposition materials of each of the plurality of thin film deposition assemblies are sequentially deposited on the substrate. 25. A method according to any one of claims 23 to 24,
Wherein the deposition material is deposited on the substrate,
And controlling the deposition temperature for each of the plurality of thin film deposition assemblies. An organic light emitting display device manufactured by the method of any one of claims 23 to 24. An organic light emitting display device having a plurality of pixels,
Each of the pixels includes sub-pixels in which light-emitting layers emitting blue, green, and red light are formed,
A green auxiliary layer is further formed on the green sub-pixel, a red auxiliary layer is further formed on the red sub-pixel,
Wherein the green auxiliary layer is interposed between the blue light emitting layer and the green light emitting layer,
Wherein the red auxiliary layer is interposed between the green light emitting layer and the red light emitting layer,
Wherein one end of the red auxiliary layer is overlapped on one end of the green light emitting layer and the red light emitting layer is formed on the red auxiliary layer. 31. The method of claim 30,
Wherein each of the pixels sequentially includes sub-pixels in which light-emitting layers emitting blue, green, and red light are formed, respectively, along one direction. 31. The method of claim 30,
Wherein one end of the green auxiliary layer is overlapped on one end of the blue light emitting layer, and the green light emitting layer is formed on the green auxiliary layer. delete 31. The method of claim 30,
Wherein the blue light emitting layer, the green light emitting layer, the green light emitting layer, and the red light emitting layer are not in contact with each other. 31. The method of claim 30,
The organic light emitting display device includes:
Board; And
Further comprising a first electrode and a second electrode which are opposed to each other,
Wherein the blue, green, and red light emitting layers, the green auxiliary layer, and the red auxiliary layer are formed between the first electrode and the second electrode. 31. The method of claim 30,
Wherein the thickness of the green auxiliary layer and the thickness of the red auxiliary layer are different from each other. An organic light emitting display device having a plurality of pixels,
Wherein each of the pixels includes sub-pixels in which light-emitting layers emitting blue, red, and green light are formed,
A red auxiliary layer is further formed on the red sub-pixel, a green auxiliary layer is further formed on the green sub-pixel,
Wherein the red auxiliary layer is interposed between the blue light emitting layer and the red light emitting layer,
Wherein the green auxiliary layer is interposed between the red light emitting layer and the green light emitting layer,
Wherein one end of the red auxiliary layer is overlapped on one end of the blue light emitting layer and the red light emitting layer is formed on the red auxiliary layer. 39. The method of claim 37,
Wherein each of the pixels sequentially includes sub-pixels in which light-emitting layers emitting blue, red, and green light are formed, respectively, along one direction. delete 39. The method of claim 37,
Wherein one end of the green auxiliary layer is overlapped on one end of the red emitting layer and the green emitting layer is formed on the green auxiliary layer. 39. The method of claim 37,
Wherein the blue light emitting layer, the red light emitting layer, the red light emitting layer, and the green light emitting layer are not in contact with each other. 39. The method of claim 37,
The organic light emitting display device includes:
Board; And
Further comprising a first electrode and a second electrode which are opposed to each other,
Wherein the blue, red and green light emitting layers, the red auxiliary layer, and the green auxiliary layer are formed between the first electrode and the second electrode. 39. The method of claim 37,
Wherein the thickness of the green auxiliary layer and the thickness of the red auxiliary layer are different from each other.

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