JP2015120982A - Thin film deposition device, method for manufacturing organic light-emitting display device utilizing the device, and organic light-emitting display device manufactured by using the method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thin film deposition device which is easy to manufacture, easily applicable to a mass production process of large substrates, and capable of improving manufacturing yield and deposition efficiency; a method for manufacturing an organic light-emitting display device by utilizing the thin film deposition device; and an organic light-emitting display device manufactured by utilizing the method.SOLUTION: The thin film deposition device includes a plurality of thin film deposition assemblies. Each of the thin film deposition assemblies includes a deposition source, a deposition source nozzle part in which a plurality of deposition source nozzles are formed, a patterning slit sheet in which a plurality of patterning slits are formed, and a partitioning plate assembly including a plurality of partitioning plates for dividing a space between the deposition source nozzle part and the patterning slit sheet into a plurality of deposition spaces. The thin film deposition device is separated from a substrate by a predetermined distance. The thin film deposition device and the substrate are formed so that either one of them can be moved relatively with respect to the other. Each evaporation source includes a red light-emitting layer material, a green light-emitting layer material, a blue light-emitting layer material, or an auxiliary layer material.

Description

  The present invention relates to a thin film deposition apparatus, an organic light emitting display device manufacturing method using the same, and an organic light emitting display device manufactured using the same, and more particularly, can be easily applied to a large-scale substrate mass production process. The present invention relates to a thin film deposition apparatus with improved yield, a method for manufacturing an organic light emitting display device using the same, and an organic light emitting display device manufactured using the same.

  Among display devices, an organic light emitting display device has an advantage of not only a wide viewing angle and excellent contrast but also a high response speed, and is attracting attention as a next generation display device.

  In general, an organic light emitting display device emits light between an anode and a cathode so that a color can be realized on the principle that holes and electrons injected from the anode and the cathode recombine in the light emitting layer to emit light. It has a stacked structure with layers inserted. However, since it is difficult to obtain high-efficiency light emission in such a structure, intermediate layers such as an electron injection layer, an electron transport layer, a hole transport layer, and a hole injection layer are selectively added between each electrode and the light emitting layer. Inserted and used.

  However, it is substantially very difficult to form a fine pattern of an organic thin film such as a light emitting layer and an intermediate layer, and the red, green, and blue light emission efficiency changes depending on the layer. Patterning of large area (5G or larger mother glass) is impossible, and large organic light emitting display devices with satisfactory levels of driving voltage, current density, brightness, color purity, luminous efficiency and lifetime cannot be manufactured. The improvement is an urgent need.

  Meanwhile, the organic light emitting display device includes a light emitting layer and an intermediate layer including the light emitting layer between a first electrode and a second electrode facing each other. At this time, the electrode and the intermediate layer can be formed by various methods, one of which is vapor deposition. In order to fabricate an organic light emitting display device using a vapor deposition method, a fine metal mask (FMM) having the same pattern as the thin film to be formed is formed on the substrate surface on which the thin film is formed. A thin film having a predetermined pattern is formed by depositing and depositing a material such as a thin film.

  INDUSTRIAL APPLICABILITY The present invention is easy to manufacture and can be easily applied to a mass production process of a large substrate, and a thin film deposition apparatus with improved production yield and deposition efficiency, a method for manufacturing an organic light emitting display using the same, and a method using the same. An object of the present invention is to provide an organic light emitting display device manufactured in the above manner.

  The present invention relates to a thin film deposition apparatus for forming a thin film on a substrate, wherein the thin film deposition apparatus includes a plurality of thin film deposition assemblies, each of the plurality of thin film deposition assemblies includes a deposition source that emits a deposition material; A vapor deposition source nozzle part disposed on one side of the vapor deposition source and formed with a plurality of vapor deposition source nozzles along the first direction, and disposed opposite the vapor deposition source nozzle part, along the first direction. A patterning slit sheet in which a plurality of patterning slits are formed, and disposed along the first direction between the deposition source nozzle part and the patterning slit sheet, and the deposition source nozzle part and the patterning slit sheet A barrier plate assembly including a plurality of barrier plates that divide the space between them into a plurality of vapor deposition spaces, and the thin film deposition apparatus is separated from the substrate by a predetermined distance. The thin film deposition apparatus and the substrate are formed such that one of the thin film deposition apparatus and the substrate is movable relative to the other, and each deposition source of the plurality of thin film deposition assemblies includes at least a red light emitting layer material. A thin film deposition apparatus comprising: a green light emitting layer material, a blue light emitting layer material, or an auxiliary layer material.

  The present invention according to another aspect provides a thin film deposition apparatus for forming a thin film on a substrate, wherein the thin film deposition apparatus includes a plurality of thin film deposition assemblies, and each of the plurality of thin film deposition assemblies emits a deposition material. A vapor deposition source, a vapor deposition source nozzle portion disposed on one side of the vapor deposition source and having a plurality of vapor deposition source nozzles formed along a first direction, and disposed opposite to the vapor deposition source nozzle portion; A patterning slit sheet in which a plurality of patterning slits are formed along a second direction perpendicular to the direction, and the substrate is deposited while moving along the first direction with respect to the thin film deposition apparatus. The deposition source, the deposition source nozzle unit, and the patterning slit sheet are integrally formed, and each deposition source of the plurality of thin film deposition assemblies has at least red light emission. Materials, green light emitting layer material, to provide a thin film deposition apparatus, wherein a blue light-emitting layer material or auxiliary layer material is provided.

  In the present invention, at least five thin film deposition assemblies are provided, and each of the deposition sources of the at least five thin film deposition assemblies includes a blue light emitting layer material, an auxiliary layer material, a green light emitting layer material, an auxiliary layer material, and a red light emitting device. Layer materials are provided in order.

  In the present invention, at least five thin film deposition assemblies are provided, and each of the at least five thin film deposition assemblies has a blue light emitting layer material, an auxiliary layer material, a red light emitting layer material, an auxiliary layer material, and a green light emitting source. Layer materials are provided in order.

  In the present invention, each deposition material provided in each deposition source of the plurality of thin film deposition assemblies is sequentially deposited on the substrate.

  In the present invention, one of the thin film deposition apparatus and the substrate moves relative to the other along a plane parallel to a plane on which the deposition material is deposited on the substrate.

  In the present invention, the patterning slit sheet of each thin film deposition assembly is formed smaller than the substrate.

  In the present invention, each deposition source of the plurality of thin film deposition assemblies is provided such that the deposition temperature can be controlled for each deposition source.

  In the present invention, the barrier plate assembly of each thin film deposition assembly guides a radiation path of the deposition material emitted from the deposition source.

  In the present invention, each of the plurality of blocking plates is formed in a second direction substantially perpendicular to the first direction, and a plurality of vapor deposition spaces are formed between the vapor deposition source nozzle portion and the patterning slit sheet. Divide into spaces.

  In the present invention, the shield plate assembly includes a first shield plate assembly including a plurality of first shield plates and a second shield plate assembly including a plurality of second shield plates.

  In the present invention, each of the plurality of first blocking plates and the plurality of second blocking plates is formed in a second direction substantially perpendicular to the first direction, and the deposition source nozzle portion and the patterning slit A space between the sheet is divided into a plurality of vapor deposition spaces.

  In the present invention, the vapor deposition source, the vapor deposition source nozzle part, and the patterning slit sheet are integrally formed by being coupled by a connecting member.

  Here, the connecting member guides a movement path of the deposition material.

  Here, the connection member is formed so as to seal the space between the deposition source and the deposition source nozzle part and the patterning slit sheet from the outside.

In the present invention, the thin film deposition apparatus is formed at a predetermined distance from the substrate.
In the present invention, the deposition material is continuously deposited on the substrate while the substrate moves along the first direction with respect to the thin film deposition apparatus.

  In the present invention, the plurality of vapor deposition source nozzles are formed to be tilted by a predetermined angle.

  Here, the plurality of vapor deposition source nozzles include two rows of vapor deposition source nozzles formed along the first direction, and the two rows of vapor deposition source nozzles are tilted in directions facing each other.

  Here, the plurality of vapor deposition source nozzles include two rows of vapor deposition source nozzles formed along the first direction, and the vapor deposition source nozzles disposed on the first side of the two rows of vapor deposition source nozzles are The vapor deposition source nozzle arranged on the second side of the two rows of vapor deposition source nozzles is directed toward the first side end of the patterning slit sheet. Arranged.

  According to another aspect of the present invention, in a method of manufacturing an organic light emitting display device using a thin film deposition apparatus for forming a thin film on a substrate, the substrate is disposed at a predetermined distance from the thin film deposition apparatus. And depositing a deposition material radiated from the thin film deposition apparatus on the substrate while moving either one of the thin film deposition apparatus and the substrate relative to the other, and The thin film deposition apparatus includes: a deposition source that radiates a deposition material; a deposition source nozzle unit that is disposed on one side of the deposition source and has a plurality of deposition source nozzles formed along a first direction; and the deposition source nozzle unit. A patterning slit sheet that is arranged opposite to each other and has a plurality of patterning slits formed along the first direction, and between the vapor deposition source nozzle part and the patterning slit sheet, A plurality of thin film deposition assemblies including a plurality of shielding plates arranged along one direction and partitioning a space between the deposition source nozzle portion and the patterning slit sheet into a plurality of deposition spaces. A method of manufacturing an organic light emitting display device, wherein each deposition source of the plurality of thin film deposition assemblies includes at least a red light emitting layer material, a green light emitting layer material, a blue light emitting layer material, or an auxiliary layer material. To do.

  According to another aspect of the present invention, in a method of manufacturing an organic light emitting display device using a thin film deposition apparatus for forming a thin film on a substrate, the substrate is disposed at a predetermined distance from the thin film deposition apparatus. And depositing a deposition material radiated from the thin film deposition apparatus on the substrate while moving either one of the thin film deposition apparatus and the substrate relative to the other, and The thin film deposition apparatus includes: a deposition source that radiates a deposition material; a deposition source nozzle unit that is disposed on one side of the deposition source and has a plurality of deposition source nozzles formed along a first direction; and the deposition source nozzle unit. A plurality of thin film deposition assemblies comprising: a patterning slit sheet that is arranged opposite to and that forms a plurality of patterning slits along a second direction perpendicular to the first direction; Provided is a method of manufacturing an organic light emitting display device, wherein each deposition source of the plurality of thin film deposition assemblies includes at least a red light emitting layer material, a green light emitting layer material, a blue light emitting layer material, or an auxiliary layer material. .

  In the present invention, the step of depositing the deposition material on the substrate includes a blue light emitting layer material, an auxiliary layer material, a green light emitting layer material, an auxiliary layer material, and a red light emitting layer material provided in the plurality of thin film deposition assemblies. Sequentially depositing on the substrate.

  In the present invention, the step of depositing the deposition material on the substrate includes a blue light emitting layer material, an auxiliary layer material, a red light emitting layer material, an auxiliary layer material, and a green light emitting layer material provided in the plurality of thin film deposition assemblies. Sequentially depositing on the substrate.

  In the present invention, each deposition material provided in each deposition source of the plurality of thin film deposition assemblies is sequentially deposited on the substrate.

  In the present invention, the step of depositing the deposition material on the substrate further includes controlling a deposition temperature for each of the plurality of thin film deposition assemblies.

  According to another aspect of the present invention, an organic light emitting display device manufactured by any one of the methods described above is provided.

  According to another aspect of the present invention, in the organic light emitting display device including a plurality of pixels, each of the pixels includes a subpixel in which a light emitting layer that emits blue, green, and red light is formed along one direction. A green auxiliary layer is further formed on the green subpixel, a red auxiliary layer is further formed on the red subpixel, and the green auxiliary layer is interposed between the blue light emitting layer and the green light emitting layer. An organic light emitting display device is provided in which the red auxiliary layer is interposed between the green light emitting layer and the red light emitting layer.

  In the present invention, one end of the green auxiliary layer is overlapped on one end of the blue light emitting layer, and the green light emitting layer is formed on the green auxiliary layer.

  In the present invention, one end of the red auxiliary layer is formed to overlap on one end of the green light emitting layer, and the red light emitting layer is formed on the red auxiliary layer.

  In the present invention, the blue light emitting layer and the green light emitting layer, and the green light emitting layer and the red light emitting layer are not in contact with each other.

  In the present invention, the organic light emitting display device further includes a substrate, a first electrode and a second electrode facing each other, and the blue, green and red light emitting layers, the green auxiliary layer and the red auxiliary layer are: It is formed between the first electrode and the second electrode.

  In the present invention, the thickness of the green auxiliary layer and the thickness of the red auxiliary layer are different from each other.

  According to another aspect of the present invention, in the organic light emitting display device including a plurality of pixels, each of the pixels extends along one direction along a subpixel in which a light emitting layer that emits blue, red, and green light is formed. The red subpixel further includes a red auxiliary layer, the green subpixel further includes a green auxiliary layer, and the red auxiliary layer is interposed between the blue light emitting layer and the red light emitting layer. The organic light emitting display device is characterized in that the green auxiliary layer is interposed between the red light emitting layer and the green light emitting layer.

  In the present invention, one end of the red auxiliary layer is overlapped on one end of the blue light emitting layer, and the red light emitting layer is formed on the red auxiliary layer.

  In the present invention, one end of the green auxiliary layer is overlapped on one end of the red light emitting layer, and the green light emitting layer is formed on the green auxiliary layer.

  In the present invention, the blue light emitting layer and the red light emitting layer, and the red light emitting layer and the green light emitting layer are not in contact with each other.

  The organic light emitting display device may further include a substrate, a first electrode and a second electrode facing each other, wherein the blue, red and green light emitting layers, the red auxiliary layer, and the green auxiliary layer are It is formed between the first electrode and the second electrode.

  In the present invention, the thickness of the green auxiliary layer and the thickness of the red auxiliary layer are different from each other.

  According to the thin film deposition apparatus of the present invention, the method of manufacturing an organic light emitting display device using the same, and the organic light emitting display device manufactured using the same, the manufacturing is easy, and it can be easily applied to a mass production process of a large substrate. The production yield and the effect of improving the deposition efficiency can be obtained.

1 is a perspective view schematically illustrating a thin film deposition assembly according to a first embodiment of the present invention. FIG. 2 is a schematic side view of the thin film deposition assembly of FIG. 1. FIG. 2 is a schematic plan view of the thin film deposition assembly of FIG. 1. 1 is a perspective view schematically illustrating a thin film deposition apparatus according to a first embodiment of the present invention. FIG. 5 is a cross-sectional view illustrating one pixel of the organic light emitting display device manufactured by the thin film deposition apparatus of FIG. 4. FIG. 5 is a cross-sectional view illustrating one pixel of the organic light emitting display device manufactured by the thin film deposition apparatus of FIG. 4. FIG. 5 is a perspective view schematically illustrating a thin film deposition assembly according to a second embodiment of the present invention. FIG. 5 is a perspective view schematically illustrating a thin film deposition assembly according to a third embodiment of the present invention. FIG. 8 is a schematic side view of the thin film deposition assembly of FIG. 7. FIG. 8 is a schematic plan view of the thin film deposition assembly of FIG. 7. 3 is a view illustrating a thin film deposition assembly according to another embodiment of the present invention. 3 is a schematic view illustrating a distribution pattern of a deposited film deposited on a substrate when a deposition source nozzle is not tilted in the thin film deposition assembly according to the present invention. 3 is a schematic view illustrating a distribution pattern of a deposited film deposited on a substrate when a deposition source nozzle is tilted in the thin film deposition assembly according to the present invention. 1 is a system configuration diagram schematically illustrating a thin film deposition apparatus according to an embodiment of the present invention. It is drawing which illustrated the example of a change of FIG. FIG. 14 is a schematic diagram illustrating an example of the electrostatic chuck of FIG. 13.

  Hereinafter, a thin film deposition apparatus according to the first embodiment of the present invention and an organic light emitting display device manufacturing method using the same will be described in detail.

(First embodiment)
FIG. 1 is a perspective view schematically illustrating a thin film deposition assembly according to a first embodiment of the present invention, FIG. 2 is a schematic side view of the thin film deposition assembly of FIG. 1, and FIG. 1 is a schematic plan view of one thin film deposition assembly. FIG.

  1 to 3, the thin film deposition assembly 100 according to the first embodiment of the present invention includes a deposition source 110, a deposition source nozzle unit 120, a blocking plate assembly 130, and a patterning slit sheet 150.

  Here, although the chamber is not illustrated in FIGS. 1 to 3 for convenience of explanation, all the configurations of FIGS. 1 to 3 may be disposed in a chamber in which an appropriate degree of vacuum is maintained. desirable. This is to ensure straightness of the vapor deposition material.

  In detail, in order to deposit the deposition material 115 emitted from the deposition source 110 through the deposition source nozzle unit 120 and the patterning slit sheet 150 in a desired pattern on the substrate 600, a chamber (not shown) is basically used. The inside of (1) must maintain the same high vacuum state as the FMM vapor deposition method. In addition, the temperature of the blocking plate 131 and the patterning slit sheet 150 must be sufficiently lower than the 110 temperature of the vapor deposition source (about 100 ° or less). This is because the phenomenon that the vapor deposition material 115 colliding with the blocking plate 131 evaporates again can be prevented only when the temperature of the blocking plate 131 is sufficiently low, and the temperature is not changed until the temperature of the patterning slit sheet 150 is sufficiently low. This is because the problem of thermal expansion of the patterning slit sheet 150 can be minimized. At this time, the barrier plate assembly 130 is directed to the high temperature vapor deposition source 110, and the temperature rises up to about 167 ° C. near the vapor deposition source 110. Therefore, a partial cooling device may be further provided if necessary. For this, a cooling member may be formed on the shield assembly 130.

  In such a chamber (not shown), a substrate 600 that is a deposition target is disposed. The substrate 600 may be a flat display device substrate, but may be a large area substrate such as mother glass that can form a plurality of flat display devices.

  Here, the first embodiment of the present invention is characterized in that deposition proceeds while the substrate 600 moves relative to the thin film deposition assembly 100.

  Specifically, in the existing FMM deposition method, the FMM size must be formed to be the same as the substrate size. Therefore, the FMM has to be enlarged as the substrate size increases, and therefore, it is not easy to manufacture the FMM, and it is not easy to pull the FMM to align it with a precise pattern.

  In order to solve this problem, the thin film deposition assembly 100 according to the first embodiment of the present invention is characterized in that deposition is performed while the thin film deposition assembly 100 and the substrate 600 move relative to each other. In other words, the substrate 600 disposed so as to face the thin film deposition assembly 100 moves continuously along the Y-axis direction and performs deposition continuously. That is, deposition is performed by a scanning method while the substrate 600 moves in the direction of arrow A in FIG. Here, the drawing shows that the deposition is performed while the substrate 600 moves in the Y-axis direction in a chamber (not shown), but the idea of the present invention is not limited to this, and the substrate 600 is It can be said that the thin film deposition assembly 100 itself can be deposited while moving in the Y-axis direction.

  Therefore, in the thin film deposition assembly 100 of the present invention, the patterning slit sheet 150 can be provided much smaller than the conventional FMM. That is, in the case of the thin film deposition assembly 100 of the present invention, since the substrate 600 is continuously deposited while moving along the Y-axis direction, that is, by the scanning method, the X-axis direction and the Y-axis direction of the patterning slit sheet 150 are used. Can be formed much smaller than the length of the substrate 600. Thus, since the patterning slit sheet 150 can be provided much smaller than the conventional FMM, the patterning slit sheet 150 of the present invention is easy to manufacture. That is, the small-sized patterning slit sheet 150 is more advantageous than the FMM deposition method in all processes such as the etching operation of the patterning slit sheet 150, the subsequent precision pulling and welding operation, the moving operation and the cleaning operation. In addition, this becomes more advantageous as the display device becomes larger.

  As described above, in order to perform deposition while the thin film deposition assembly 100 and the substrate 600 are moved relative to each other, it is desirable that the thin film deposition assembly 100 and the substrate 600 are separated from each other with a predetermined interval. This will be described later.

  Meanwhile, a deposition source 110 that stores and heats the deposition material 115 is disposed on the side of the chamber facing the substrate 600. Vapor deposition is performed on the substrate 600 by vaporizing the vapor deposition material 115 stored in the vapor deposition source 110.

  Specifically, the vapor deposition source 110 includes a crucible 111 filled with a vapor deposition material 115 therein, and the vapor deposition material 115 filled inside the crucible 111 by heating the crucible 111. And a heater 112 for evaporating on the vapor deposition source nozzle part 120 side.

  The vapor deposition source nozzle unit 120 is disposed on one side of the vapor deposition source 110, specifically, on the side facing the substrate 600 from the vapor deposition source 110. In the vapor deposition source nozzle unit 120, a plurality of vapor deposition source nozzles 121 are formed along the X-axis direction. Here, the plurality of vapor deposition source nozzles 121 may be formed at equal intervals. The vapor deposition material 115 vaporized in the vapor deposition source 110 passes through such a vapor deposition source nozzle portion 120 and travels toward the substrate 600 that is the deposition target.

  A barrier plate assembly 130 is provided on one side of the deposition source nozzle unit 120. The shield plate assembly 130 includes a plurality of shield plates 131 and a shield plate frame 132 provided outside the shield plate 131. The plurality of blocking plates 131 may be provided in parallel with each other along the X-axis direction. Here, the plurality of blocking plates 131 may be formed at equal intervals. In addition, each of the blocking plates 131 is formed to be parallel to the YZ plane in the drawing, in other words, to be perpendicular to the X-axis direction. The plurality of blocking plates 131 arranged in this manner serve to partition the space between the deposition source nozzle unit 120 and the patterning slit sheet 150 into a plurality of deposition spaces S. That is, the thin film deposition assembly 100 according to the first embodiment of the present invention is characterized in that the deposition space S is separated by the shielding plate 131 for each deposition source nozzle 121 to which a deposition material is injected.

  Here, each of the blocking plates 131 may be disposed between the vapor deposition source nozzles 121 adjacent to each other. In other words, it may be considered that one vapor deposition source nozzle 121 is disposed between the shielding plates 131 adjacent to each other. Desirably, the deposition source nozzle 121 may be located at the center between the shielding plates 131 adjacent to each other. As described above, when the blocking plate 131 divides the space between the vapor deposition source nozzle unit 120 and the patterning slit sheet 150 into a plurality of vapor deposition spaces S, the vapor deposition material discharged from the single vapor deposition source nozzle 121 The vapor deposition material discharged from the vapor deposition source nozzle 121 is not mixed and passes through the patterning slit 151 and is deposited on the substrate 600. In other words, the blocking plate 131 serves to guide the movement path of the vapor deposition material in the Z-axis direction so that the vapor deposition material discharged through the vapor deposition source nozzle 121 is not dispersed and maintains straightness.

  In this manner, by providing the barrier plate 131 to ensure the straightness of the deposition material, the size of the shadow formed on the substrate can be greatly reduced, and thus the thin film deposition assembly 100 and the substrate 600 can be reduced. Can be separated at a predetermined interval. This will be described later.

  Meanwhile, a shielding plate frame 132 may be further provided outside the plurality of shielding plates 131. The shielding plate frames 132 are respectively provided on the upper and lower surfaces of the plurality of shielding plates 131 to support the positions of the plurality of shielding plates 131 and at the same time, the deposition material discharged through the deposition source nozzle 121 is not dispersed. It plays the role of guiding the movement path in the Y-axis direction.

  On the other hand, in the drawing, the vapor deposition source nozzle part 120 and the shielding plate assembly 130 are illustrated as being spaced apart by a predetermined distance, but the idea of the present invention is not limited thereto. That is, in order to prevent the heat dissipated from the deposition source 110 from being transmitted to the shielding plate assembly 130, the deposition source nozzle unit 120 and the shielding plate assembly 130 may be formed at a predetermined interval. The deposition source nozzle unit 120 and the shielding plate assembly 130 may be combined and contacted if appropriate heat insulation means is provided between the deposition source nozzle unit 120 and the shielding plate assembly 130.

  Meanwhile, the barrier plate assembly 130 may be separable from the thin film deposition assembly 100. Specifically, the conventional FMM vapor deposition method has a problem that the vapor deposition efficiency is low. Here, the vapor deposition efficiency means the ratio of the material vaporized from the vapor deposition source to the material actually deposited on the substrate, and the vapor deposition efficiency in the conventional FMM vapor deposition method is about 32%. In addition, the conventional FMM vapor deposition method has a problem in that about 68% of organic substances that are not used for vapor deposition are deposited in various places inside the vapor deposition device, and thus recycling is not easy.

  In order to solve such a problem, in the thin film deposition assembly 100 according to the first embodiment of the present invention, the deposition space is separated from the external space using the blocking plate assembly 130, so that the deposition is not performed on the substrate 600. The vapor deposition material is substantially deposited in the barrier plate assembly 130. Accordingly, if the barrier plate assembly 130 is separable from the thin film deposition assembly 100 and a large amount of vapor deposition material is accumulated in the barrier plate assembly 130 after long-time deposition, the barrier plate assembly 130 is separated and a separate vapor deposition material recycling apparatus is provided. The deposited material can be recovered in Through such a configuration, it is possible to improve the vapor deposition efficiency and increase the cost reduction effect by increasing the vapor deposition material recycling rate.

  Meanwhile, a patterning slit sheet 150 and a frame 155 are further provided between the deposition source 110 and the substrate 600. The frame 155 is formed in a window frame shape, and the patterning slit sheet 150 is coupled to the inside thereof. A plurality of patterning slits 151 are formed in the patterning slit sheet 150 along the X-axis direction. The vapor deposition material 115 vaporized in the vapor deposition source 110 passes through the vapor deposition source nozzle portion 120 and the patterning slit sheet 150 and travels toward the substrate 600 that is the vapor deposition target. At this time, the patterning slit sheet 150 may be manufactured through etching, which is the same method as a manufacturing method of a conventional FMM, particularly a stripe type mask.

  Meanwhile, in the thin film deposition assembly 100 according to the first embodiment of the present invention, the total number of patterning slits 151 is formed more than the total number of deposition source nozzles 121. Further, the number of the patterning slits 151 is formed more than the number of the vapor deposition source nozzles 121 disposed between the two blocking plates 131 adjacent to each other.

  That is, one vapor deposition source nozzle 121 may be disposed between two shielding plates 131 adjacent to each other. At the same time, a plurality of patterning slits 151 may be disposed between the two blocking plates 131 adjacent to each other. And the space between the vapor deposition source nozzle part 120 and the patterning slit sheet 150 is divided by two blocking plates 131 adjacent to each other, and the vapor deposition space S is separated for each vapor deposition source nozzle 121. Accordingly, the vapor deposition material radiated from one vapor deposition source nozzle 121 passes through the patterning slit 151 in the substantially same vapor deposition space S and is deposited on the substrate 600.

  Meanwhile, the blocking plate assembly 130 and the patterning slit sheet 150 are formed to be spaced apart from each other by a predetermined distance, and the blocking plate assembly 130 and the patterning slit sheet 150 may be connected to each other by a connecting member 135. In detail, since the temperature of the barrier plate assembly 130 is increased by a maximum of 100 ° C. due to the deposition source 110 in a high temperature state, the barrier plate assembly 130 and the barrier plate assembly 130 are prevented from being conducted to the patterning slit sheet 150. The patterning slit sheet 150 is separated at a predetermined interval.

  As described above, the thin film deposition assembly 100 according to the first embodiment of the present invention performs deposition while moving relative to the substrate 600, and thus the thin film deposition assembly 100 is relative to the substrate 600. In order to move, the patterning slit sheet 150 is formed to be separated from the substrate 600 at a predetermined interval. Further, in order to solve the shadow problem that occurs when the patterning slit sheet 150 and the substrate 600 are separated from each other, a barrier plate 131 is provided between the deposition source nozzle unit 120 and the patterning slit sheet 150, and the straightness of the deposition material is achieved. By ensuring this, the size of the shadow formed on the substrate is greatly reduced.

  Specifically, in the conventional FMM vapor deposition method, the vapor deposition process was performed with a mask attached to the substrate in order to prevent the substrate from being shaded. However, when the mask is brought into close contact with the substrate in this way, there is a problem that a defect problem occurs due to contact between the substrate and the mask. In addition, since the mask cannot be moved with respect to the substrate, the mask must be formed in the same size as the substrate. Therefore, the size of the mask has to be increased as the display device becomes larger, but there is a problem that it is difficult to form such a large mask.

  In order to solve such a problem, in the thin film deposition assembly 100 according to the first embodiment of the present invention, the patterning slit sheet 150 is disposed so as to be separated from the substrate 600 that is the deposition target by a predetermined interval. This can be realized by providing the blocking plate 131 and reducing the shadow generated on the substrate 600.

  After the mask is formed smaller than the substrate according to the present invention, the mask can be easily manufactured by moving the mask relative to the substrate and performing deposition. In addition, it is possible to obtain an effect of preventing defects due to contact between the substrate and the mask. Further, since the time required for the step of bringing the substrate and the mask into close contact with each other is unnecessary, an effect of improving the manufacturing speed can be obtained. Further, by providing the blocking plate 131, a shadow generated on the substrate 600 is reduced, and thus the patterning slit sheet 150 can be separated from the substrate 600.

  FIG. 4 is a perspective view schematically illustrating a thin film deposition apparatus according to the first embodiment of the present invention.

  Referring to FIG. 4, the thin film deposition apparatus according to the first embodiment of the present invention includes a plurality of thin film deposition assemblies described with reference to FIGS. In other words, in the thin film deposition apparatus according to the first embodiment of the present invention, the blue light emitting layer material B, the green auxiliary layer material G ′, the green light emitting layer material G, the red auxiliary layer material R ′, and the red light emitting layer material R are sequentially deposited. One feature is that a multi-deposition source is provided.

  Specifically, the thin film deposition apparatus according to the first embodiment of the present invention includes a first thin film deposition assembly 100, a second thin film deposition assembly 200, a third thin film deposition assembly 300, a fourth thin film deposition assembly 400, and a fifth thin film deposition assembly. 500. The configurations of the first thin film deposition assembly 100, the second thin film deposition assembly 200, the third thin film deposition assembly 300, the fourth thin film deposition assembly 400, and the fifth thin film deposition assembly 500 have been described with reference to FIGS. Since it is the same as the thin film deposition assembly, its detailed description is omitted here.

  Here, the deposition sources of the first thin film deposition assembly 100, the second thin film deposition assembly 200, the third thin film deposition assembly 300, the fourth thin film deposition assembly 400, and the fifth thin film deposition assembly 500 are provided with different deposition materials. sell.

  For example, the first thin film deposition assembly 100 includes a deposition material B that is a material of a blue light emitting layer, and the second thin film deposition assembly 200 includes a deposition material G ′ that is a material of a green auxiliary layer. The thin film deposition assembly 300 includes a deposition material G that is a material of a green light emitting layer, the fourth thin film deposition assembly 400 includes a deposition material R ′ that is a material of a red auxiliary layer, and the fifth thin film deposition assembly 500 includes May be provided with a deposition material R which becomes a material of the red light emitting layer.

  Alternatively, although not shown in the drawings, the first thin film deposition assembly 100 includes a deposition material B that is a material of a blue light emitting layer, and the second thin film deposition assembly 200 is a deposition material that is a material of a red auxiliary layer. R ′, the third thin film deposition assembly 300 includes a deposition material R that is a material of a red light emitting layer, and the fourth thin film deposition assembly 400 includes a deposition material G ′ that is a material of a green auxiliary layer. The fifth thin film deposition assembly 500 may include a deposition material G that is a material of the green light emitting layer.

  With such a configuration, the green auxiliary layer (see 62G ′ in FIG. 5A) is arranged between the blue light emitting layer (see 62B in FIG. 5A) and the green light emitting layer (see 62G in FIG. 5A). A red auxiliary layer (see 62R ′ in FIG. 5A) may be disposed between the red light emitting layer (see 62R in FIG. 5A) and the red light emitting layer (see 62G in FIG. 5A). Alternatively, as illustrated in FIG. 5B, a red auxiliary layer may be disposed between the blue light emitting layer and the red light emitting layer, and a green auxiliary layer may be disposed between the green light emitting layer and the red light emitting layer. That is, since the intermediate layer is interposed between the light emitting layers adjacent to each other, the light emitting layers overlapping each other are not in direct contact with each other. This will be described in detail with reference to FIGS. 5A and 5B.

  Here, the vapor deposition materials R ′ and G ′ that are the materials of the auxiliary layer, the vapor deposition material R that is the material of the red light emitting layer, the vapor deposition material G that is the material of the green light emitting layer, and the vapor deposition that is the material of the blue light emitting layer. Since the materials B may be vaporized at different temperatures, the temperature of the deposition source 110 of the first thin film deposition assembly 100, the temperature of the deposition source 210 of the second thin film deposition assembly 200, and the third thin film deposition assembly. The temperature of the deposition source 310 of 300, the temperature of the deposition source 410 of the fourth thin film deposition assembly 400, and the temperature of the deposition source 510 of the fifth thin film deposition assembly 500 may be set differently. .

  Meanwhile, although the drawing shows that five thin film deposition assemblies are provided, the concept of the present invention is not limited thereto. That is, the thin film deposition apparatus according to the first embodiment of the present invention may include a plurality of thin film deposition assemblies, and each of the plurality of thin film deposition assemblies may include a different material.

  As described above, by providing a plurality of thin film deposition assemblies and enabling a plurality of thin film layers to be formed at once, it is possible to obtain an effect of improving manufacturing yield and deposition efficiency. Further, the manufacturing process is simplified, and the effect of cost reduction can be obtained.

  An organic film (see 62 in FIGS. 5A and 5B) including the light emitting layer of the organic light emitting display device can be manufactured using the thin film deposition apparatus having such a configuration. Here, the method of manufacturing the organic light emitting display device includes a step in which the substrate 600 is spaced apart from the thin film deposition apparatus by a predetermined distance, and one of the thin film deposition apparatus and the substrate is relative to the other. And depositing a deposition material emitted from the thin film deposition apparatus on the substrate.

  This will be described in more detail as follows.

  First, the substrate 600 is spaced apart from the thin film deposition apparatus by a predetermined distance. As described above, since the thin film deposition apparatus of the present invention includes the patterning slit sheet 150 that is smaller than the substrate 600 and easy to manufacture, the thin film deposition apparatus and the substrate 600 can be deposited while moving relative to each other. One feature is that it is performed. In other words, the deposition is continuously performed while the substrate 600 disposed so as to face the thin film deposition apparatus moves along the Y-axis direction. That is, vapor deposition is performed by a scanning method while the substrate 600 moves in the direction of arrow B in FIG. In order for the thin film deposition apparatus and the substrate 600 to move relative to each other, the thin film deposition apparatus and the substrate 600 must be separated from each other at a predetermined interval. Accordingly, the substrate 600 is disposed at a predetermined distance from the thin film deposition apparatus in a chamber (not shown).

  Next, while either one of the thin film deposition apparatus and the substrate 600 moves relative to the other, a deposition material emitted from the thin film deposition apparatus is deposited on the substrate. As described above, since the thin film deposition apparatus of the present invention includes the patterning slit sheet 150 that is smaller than the substrate 600 and easy to manufacture, the thin film deposition apparatus and the substrate 600 can be deposited while moving relative to each other. Done. 1 and the like show that the substrate 600 moves in the Y-axis direction of the drawing in a state where the thin film deposition apparatus is fixed, but the idea of the present invention is not limited to this, and the substrate is fixed. It can be said that the thin film deposition apparatus can move as a whole in the state.

  Here, the manufacturing method of the organic light emitting display device according to the first embodiment of the present invention includes a blue light emitting layer material B, a green auxiliary layer material G ′, a green light emitting layer material G, a red auxiliary layer material R ′, and a red light emitting layer material. A multi-deposition source in which R is sequentially deposited, and a plurality of organic layers are deposited at one time. That is, by providing a plurality of thin film deposition assemblies, a single multi-source blue light emitting layer (see 62B in FIGS. 5A and 5B), a green auxiliary layer (see 62G ′ in FIGS. 5A and 5B), a green light emitting layer (see FIG. 5A and 62B in FIG. 5B), a red auxiliary layer (see 62R ′ in FIGS. 5A and 5B), and a red light emitting layer (see 62R in FIGS. 5A and 5B) can be deposited at one time, and thus organic light emission The production time of the display device is remarkably shortened, and at the same time, the number of chambers to be provided is reduced, so that the effect of significantly reducing the equipment cost can be obtained.

  An organic film 62 of an organic light emitting display device, which will be described later, is formed by using such a thin film deposition apparatus. In addition, the thin film deposition apparatus can be used for deposition of an organic film or an inorganic film of an organic TFT. In addition, it can be applied to a film forming process of various materials.

  Hereinafter, the organic light emitting display device manufactured by the thin film deposition apparatus of FIG. 4 will be described in detail.

  5A and 5B are cross-sectional views illustrating one pixel of the organic light emitting display device manufactured by the thin film deposition apparatus of FIG.

  As shown in FIGS. 5A and 5B, a buffer layer 51 is formed on a glass or plastic substrate 50, on which a thin film transistor TFT and an organic electroluminescent element OLED are formed.

An active layer 52 having a predetermined pattern is provided on the buffer layer 51 on the substrate 50. A gate insulating film 53 is provided on the active layer 52, and a gate electrode 54 is formed in a predetermined region on the gate insulating film 53. The gate electrode 54 is connected to a gate line (not shown) for applying an on / off signal of the thin film transistor. An interlayer insulating film 55 is formed on the gate electrode 54, and source / drain electrodes 56 and 57 are formed in contact with the source / drain regions 52b and 52c of the active layer 52 through contact holes, respectively. A passivation film 58 made of SiO ₂ , SiNx, or the like is formed on the source / drain electrodes 56, 57. A planarization film 59 is formed on the passivation film 58 with an organic material such as acrylic, polyimide, or BCB (Benzocyclobutylene). Is formed. A first electrode 61 serving as an anode electrode of the organic electroluminescent element OLED is formed on the planarizing film 59, and a pixel definition film 60 is formed of an organic material so as to cover the first electrode 61. After a predetermined opening is formed in the pixel definition film 60, an upper portion of the pixel definition film 60 and an opening are formed, and an organic layer 62 is formed on the first electrode 61 exposed to the outside. The organic layer 62 includes a light emitting layer. The present invention is not necessarily limited to such a structure, and it goes without saying that various organic light emitting display device structures can be applied as they are.

  The organic electroluminescent element OLED emits red, green and blue light by current flow to display predetermined image information. The organic electroluminescent element OLED is connected to the drain electrode 56 of the thin film transistor and is supplied with positive power. A first electrode 61, a second electrode 63 provided so as to cover the entire pixel and supplying a negative power source, and an organic layer 62 disposed between the first electrode 61 and the second electrode 63 to emit light. Consists of.

  The first electrode 61 and the second electrode 63 are insulated from each other by the organic layer 62, and a reverse polarity voltage is applied to the organic layer 62 to cause the organic layer 62 to emit light.

  The organic layer 62 may be a low molecular or high molecular organic film. When a low molecular organic film is used, a hole injection layer (HIL), a hole transport layer (HTL), a light emitting layer are used. (EML: Emission Layer), electron transport layer (ETL: Electron Transport Layer), electron injection layer (EIL: Electron Injection Layer), etc. are formed by laminating single or composite structures, and usable organic materials are also copper. Various applications including phthalocyanine (CuPc), N, N-di (naphthalen-1-yl) -N, N′-diphenyl-benzidine (NPB), tris-8-hydroxyquinolinolato-aluminum (Alq3) so That. These low molecular organic films are formed by a vacuum deposition method.

  In the case of a polymer organic film, it can usually have a structure composed of a hole transport layer (HTL) and a light emitting layer (EML). At this time, PEDOT is used as the hole transport layer and PPV is used as the light emitting layer. High molecular organic materials such as (Poly-Phenylenevinylene) and polyfluorene can be used, and can be formed by screen printing or ink jet printing.

  Such an organic film is not necessarily limited to this, and it is needless to say that various embodiments can be applied.

  The first electrode 61 functions as an anode electrode, and the second electrode 63 functions as a cathode electrode. Of course, the polarities of the first electrode 61 and the second electrode 63 may be reversed.

The first electrode 61 may be provided as a transparent electrode or a reflective electrode. When used as a transparent electrode, the first electrode 61 is provided with ITO, IZO, ZnO, or In ₂ O ₃ , and when used as a reflective electrode, Ag, After forming a reflective film with Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr and their compounds, ITO, IZO, ZnO, or In ₂ O ₃ can be formed thereon.

On the other hand, the second electrode 63 can also be provided as a transparent electrode or a reflective electrode. However, when the second electrode 63 is used as a transparent electrode, the second electrode 63 is used as a cathode electrode. After depositing LiF / Ca, LiF / Al, Al, Ag, Mg, and their compounds in the direction of the organic layer 62, a transparent electrode such as ITO, IZO, ZnO, or In ₂ O _{3 is formed} thereon. An auxiliary electrode layer and a bus electrode line can be formed with the forming material. When used as a reflective electrode, the Li, Ca, LiF / Ca, LiF / Al, Al, Ag, Mg, and their compounds are deposited on the entire surface.

  In such an organic light emitting display device, the organic layer 62 including a light emitting layer can be formed by a thin film deposition apparatus (see 100 in FIG. 1) described in detail.

  Specifically, the organic layer 62 may include light emitting layers 62R, 62G, and 62B and auxiliary layers 62R ′ and 62G ′. Depending on the material used, the light emitting layers 62R, 62G, and 62B may emit red, green, or blue light. Meanwhile, the auxiliary layers 62R ′ and 62G ′ are formed of the same material as the hole transport layer (HTL) described above, and the intermediate layers including the auxiliary layers 62R ′ and 62G ′ have red, green, and green thicknesses. Sub-pixels that emit blue light are formed to have different thicknesses. This will be described in more detail as follows.

  One of the first electrode 61 and the second electrode 63 is a reflective electrode, and the other is a translucent electrode or a transparent electrode. Therefore, a resonance phenomenon occurs between the first electrode 61 and the second electrode 63 when the element is driven. Accordingly, when the organic light emitting display device is driven, light generated in the light emitting layers 62R, 62G, and 62B between the first electrode 61 and the second electrode 63 is transmitted between the first electrode 61 and the second electrode 63. Since it is taken out of the organic light emitting display device while resonating, the light emission luminance and the light emission efficiency can be increased. In order to form such a resonant structure, the organic light emitting display device according to the first embodiment of the present invention emits light of red, green and blue in which the thickness of the intermediate layer including the auxiliary layers 62R ′ and 62G ′. The subpixels may have different thicknesses. That is, among the organic layers provided between the first electrode 61 and the second electrode 63, the auxiliary layers 62R ′ and 62G ′ have excellent thicknesses optimized for each light emitting color of the light emitting layer. Drive voltage, current density, light emission luminance, color purity, light emission efficiency, life characteristics, and the like.

  However, in the conventional organic light emitting display device, auxiliary layers 62R ′ and 62G ′ are first formed on the first electrode 61, and then a red light emitting layer 62R, a green light emitting layer 62G, and a blue light emitting layer are formed thereon. It was common that 62B was formed in order. However, when the substrate and the patterning slit sheet are separated from each other as in the present invention, there is a problem that a shadow may occur on the substrate. When shadows are generated and adjacent light emitting layers are mixed with each other, problems such as a decrease in light emission efficiency and an increase in driving voltage occur.

  That is, as can be seen from Table 1 below, the external quantum efficiency of the blue light emitting layer 62B in the standard state without the overlapping region is 6.29%, while the red light emitting layer 62R or the green light emitting layer is included in the blue light emitting layer 62B. It can be seen that even when the layer G overlaps by only 1%, the external quantum efficiency rapidly decreases to 1.53% and 2.76%, respectively.

  In order to solve such a problem, an OLED display according to an exemplary embodiment of the present invention includes subpixels arranged in the order of blue (B), green (G), and red (R) in one pixel. The green auxiliary layer 62G ′ and one end of the green light emitting layer 62G overlap on one end of the light emitting layer 62B, and the red auxiliary layer 62R ′ and one end of the red light emitting layer 62R are on the other end of the green light emitting layer 62G. One feature is that they are formed to overlap.

  As described above, the first thin film deposition assembly (see 100 in FIG. 4) includes a deposition material to be the material of the blue light emitting layer 62B, and the second thin film deposition assembly (see 200 in FIG. 4) has a green auxiliary layer. The third thin film deposition assembly (see 300 in FIG. 4) is provided with a deposition material to be the material of the green light emitting layer 62G, and the fourth thin film deposition assembly (400 in FIG. 4) is provided. (See FIG. 4) may be provided with a deposition material to be a material for the red auxiliary layer 62R ′, and the fifth thin film deposition assembly (see 500 in FIG. 4) may be provided with a deposition material to be the material for the red light emitting layer 62R.

  In this case, the blue light emitting layer 62B is first deposited, and then the green auxiliary layer 62G 'is deposited. At this time, the left end portion of the green auxiliary layer 62G ′ is deposited on the right end portion of the blue light emitting layer 62B while the right end portion of the blue light emitting layer 62B and the left end portion of the green auxiliary layer 62G ′ overlap to some extent. The Next, the green light emitting layer 62G is deposited on the green auxiliary layer 62G '. That is, since the green auxiliary layer 62G 'is interposed between the blue light emitting layer 62B and the green light emitting layer 62G, the blue light emitting layer 62B and the green light emitting layer 62G adjacent to each other are not in direct contact with each other.

  Next, a red auxiliary layer 62R 'is deposited. At this time, the left end portion of the red auxiliary layer 62R ′ is deposited on the right end portion of the green light emitting layer 62G while the right end portion of the green light emitting layer 62G and the left end portion of the red auxiliary layer 62R ′ overlap to some extent. The Next, a red light emitting layer 62R is deposited on the red auxiliary layer 62R '. That is, since the red auxiliary layer 62R 'is interposed between the green light emitting layer 62G and the red light emitting layer 62R, the green light emitting layer G and the red light emitting layer R adjacent to each other are not in direct contact with each other.

  That is, as can be seen from Table 2 below, the external quantum efficiency of the blue light emitting layer 62B in the standard state without the overlapping region is 6.29%, and the red auxiliary layer R ′ and the red light emitting layer 62R are overlapped by 1%. The external quantum efficiency is 5.78%, and when the green auxiliary layer G ′ and the green light emitting layer 62G overlap each other by 1%, the external quantum efficiency is 5.42%, between the adjacent light emitting layers. It can be seen that the luminous efficiency of the light emitting layer is greatly improved as compared with Table 1 in which no intermediate layer is interposed between them, the color mixing phenomenon disappears, and the color coordinate improving effect is produced.

  Meanwhile, although not shown in the drawings, the first thin film deposition assembly is provided with a deposition material to be a material of the blue light emitting layer, and the second thin film deposition assembly is provided with a deposition material to be a material of the red auxiliary layer. The third thin film deposition assembly includes a deposition material that is a material for the red light emitting layer, the fourth thin film deposition assembly includes a deposition material that is a material for the green auxiliary layer, and the fifth thin film deposition assembly includes a green light emission. A vapor deposition material that becomes the material of the layer may be provided.

  In this case, a blue light emitting layer is first deposited and then a red auxiliary layer is deposited. At this time, the left end portion of the red auxiliary layer is deposited on the right end portion of the blue light emitting layer while the right end portion of the blue light emitting layer and the left end portion of the red auxiliary layer overlap each other to some extent. Next, a red light emitting layer is deposited on the red auxiliary layer. That is, since the red auxiliary layer is interposed between the blue light emitting layer and the red light emitting layer, the blue light emitting layer and the red light emitting layer adjacent to each other are not in direct contact with each other.

  A green auxiliary layer is then deposited. At this time, the left end of the green auxiliary layer is deposited on the right end of the red light emitting layer while the right end of the red light emitting layer and the left end of the green auxiliary layer overlap to some extent. Next, a green light emitting layer is deposited on the green auxiliary layer. That is, since the green auxiliary layer is interposed between the red light emitting layer and the green light emitting layer, the red light emitting layer and the green light emitting layer adjacent to each other do not come into direct contact with each other.

  According to the present invention, it is possible to obtain an effect of reducing the efficiency reduction and the influence of color mixing due to the generation of the overlapping region with the adjacent light emitting layer.

(Second Embodiment)
FIG. 6 is a perspective view schematically illustrating a thin film deposition assembly according to a second embodiment of the present invention.

  Referring to FIG. 6, a thin film deposition assembly 700 according to the second embodiment of the present invention includes a deposition source 710, a deposition source nozzle unit 720, a first blocking plate assembly 730, a second blocking plate assembly 740, a patterning slit sheet 750, and A substrate 600 is provided.

  Here, although the chamber is not illustrated in FIG. 6 for convenience of explanation, it is desirable that all the configurations in FIG. 6 are arranged in a chamber in which an appropriate degree of vacuum is maintained. This is to ensure straightness of the vapor deposition material.

  In such a chamber (not shown), a substrate 600 which is a deposition target is disposed. A deposition source 710 that stores and heats the deposition material 715 is disposed on the side facing the substrate 600 in a chamber (not shown). The vapor deposition source 710 includes a crucible 711 and a heater 712.

  A vapor deposition source nozzle unit 720 is disposed on one side of the vapor deposition source 710, specifically, on the side facing the substrate 600 from the vapor deposition source 710. In the vapor deposition source nozzle portion 720, a plurality of vapor deposition source nozzles 721 are formed along the X-axis direction.

  A first barrier plate assembly 730 is provided on one side of the deposition source nozzle unit 720. The first shield plate assembly 730 includes a plurality of first shield plates 731 and a first shield plate frame 732 provided outside the first shield plates 731.

  A second barrier plate assembly 740 is provided on one side of the first barrier plate assembly 730. The second shield plate assembly 740 includes a plurality of second shield plates 741 and a second shield plate frame 742 provided outside the second shield plate 741.

  A patterning slit sheet 750 and a frame 755 are further provided between the vapor deposition source 710 and the substrate 600. The frame 755 is formed in a lattice shape like a window frame, and a patterning slit sheet 750 is coupled to the inside thereof. In the patterning slit sheet 750, a plurality of patterning slits 751 are formed along the X-axis direction.

  Here, the thin film deposition assembly 700 according to the second embodiment of the present invention is characterized in that the barrier plate assembly is separated into a first barrier plate assembly 730 and a second barrier plate assembly 740.

  Specifically, the plurality of first blocking plates 731 may be provided in parallel with each other along the X-axis direction. The plurality of first blocking plates 731 may be formed at regular intervals. Each first blocking plate 731 is formed in parallel to the YZ plane as viewed from the drawing, in other words, perpendicular to the X-axis direction.

  The plurality of second blocking plates 741 may be provided in parallel with each other along the X-axis direction. The plurality of second blocking plates 741 may be formed at equal intervals. Each second blocking plate 741 is formed to be parallel to the YZ plane when viewed from the drawing, in other words, to be perpendicular to the X-axis direction.

  The plurality of first blocking plates 731 and second blocking plates 741 arranged in this manner serve to partition the space between the deposition source nozzle unit 720 and the patterning slit sheet 750. Here, in the thin film deposition assembly 700 according to the second embodiment of the present invention, the deposition space is separated for each deposition source nozzle 721 to which the deposition material is sprayed by the first blocking plate 731 and the second blocking plate 741. One of the features.

  Here, each of the second blocking plates 741 may be arranged to have a one-to-one correspondence with each of the first blocking plates 731. In other words, the second blocking plates 741 may be aligned with the first blocking plates 731 and parallel to each other. That is, the first blocking plate 731 and the second blocking plate 741 corresponding to each other are located on the same plane. As described above, the first blocking plate 731 and the second blocking plate 741 arranged in parallel with each other divides the space between the deposition source nozzle unit 720 and the patterning slit sheet 750 described later, thereby providing one deposition. The vapor deposition material discharged from the source nozzle 721 is not mixed with the vapor deposition material discharged from the other vapor deposition source nozzles 721, passes through the patterning slit 751, and is deposited on the substrate 600. In other words, the first blocking plate 731 and the second blocking plate 741 serve to guide the movement path of the deposition material in the Z-axis direction so that the deposition material discharged through the deposition source nozzle 721 is not dispersed.

  In the drawing, the width in the X-axis direction of the first blocking plate 731 and the width in the X-axis direction of the second blocking plate 741 are shown to be the same, but the idea of the present invention is limited to this. It is not a thing. That is, the second blocking plate 741 that requires precise alignment with the patterning slit sheet 750 is formed relatively thin, while the first blocking plate 731 that does not require precise alignment is formed relatively thick, It can be said that the manufacture can be facilitated.

  Meanwhile, although not shown in the drawings, the thin film deposition apparatus according to the second embodiment of the present invention may include a plurality of thin film deposition assemblies. That is, in the thin film deposition apparatus according to the second embodiment of the present invention, the blue light emitting layer material B, the green auxiliary layer material G ′, the green light emitting layer material G, the red auxiliary layer material R ′, and the red light emitting layer material R are sequentially deposited. A multi-vapor deposition source can also be provided. The substrate 600 is deposited in a scanning manner while moving in the direction of arrow C in FIG. Since such a plurality of thin film deposition assemblies have been described in detail in the first embodiment, detailed description thereof will be omitted in this embodiment.

(Third embodiment)
7 is a perspective view schematically illustrating a thin film deposition assembly according to a third embodiment of the present invention, FIG. 8 is a schematic side view of the thin film deposition assembly of FIG. 7, and FIG. 7 is a schematic plan view of 7 thin film deposition assembly. FIG.

  Referring to FIGS. 7, 8 and 9, a thin film deposition assembly 1100 according to the third embodiment of the present invention includes a deposition source 1110, a deposition source nozzle unit 1120 and a patterning slit sheet 1150.

  Here, the chamber is not shown in FIGS. 7, 8 and 9 for convenience of explanation, but all the configurations in FIGS. 7 to 9 are arranged in a chamber in which an appropriate degree of vacuum is maintained. It is desirable that This is to ensure straightness of the vapor deposition material.

  In such a chamber (not shown), a substrate 600 that is a deposition target is disposed. A deposition source 1110 that stores and heats the deposition material 1115 is disposed on the side facing the substrate 600 in a chamber (not shown). The vapor deposition source 1110 includes a crucible 1111 and a heater 1112.

  A deposition source nozzle unit 1120 is disposed on one side of the deposition source 1110, specifically, on the side facing the substrate 600 from the deposition source 1110. A plurality of vapor deposition source nozzles 1121 are formed in the vapor deposition source nozzle portion 1120 along the Y-axis direction, that is, the scan direction of the substrate 600. Here, the plurality of vapor deposition source nozzles 1121 can be formed at equal intervals. The vapor deposition material 1115 vaporized in the vapor deposition source 1110 passes through the vapor deposition source nozzle portion 1120 and moves toward the substrate 600 that is the vapor deposition target. As described above, when the plurality of vapor deposition source nozzles 1121 are formed on the vapor deposition source nozzle portion 1120 along the Y-axis direction, that is, the scanning direction of the substrate 600, each of the patterning slit sheets 1150 passes through the patterning slits 1151. Since the size of the pattern formed by the vapor deposition material is affected only by the size of one vapor deposition source nozzle 1121 (that is, only one vapor deposition source nozzle 1121 exists in the X-axis direction), no shadow is generated. . In addition, since a plurality of vapor deposition source nozzles 1121 exist in the scanning direction, even if a flux difference occurs between the individual vapor deposition source nozzles, the difference is offset and an effect of maintaining the deposition uniformity constant can be obtained. it can.

  Meanwhile, a patterning slit sheet 1150 and a frame 1155 are further provided between the vapor deposition source 1110 and the substrate 600. The frame 1155 is formed in a window frame shape, and a patterning slit sheet 1150 is coupled to the inside thereof. In the patterning slit sheet 1150, a plurality of patterning slits 1151 are formed along the X-axis direction. The vapor deposition material 1115 vaporized in the vapor deposition source 1110 passes through the vapor deposition source nozzle portion 1120 and the patterning slit sheet 1150 toward the substrate 600 that is the vapor deposition target. At this time, the patterning slit sheet 1150 may be manufactured through etching, which is the same method as the manufacturing method of a conventional FMM, particularly a stripe type mask.

  Meanwhile, the deposition source 1110 (and the deposition source nozzle unit 1120 coupled thereto) and the patterning slit sheet 1150 are formed to be spaced apart from each other by a predetermined distance, and the deposition source 1110 (and the deposition source 1110 coupled thereto) is formed. The deposition source nozzle unit 1120) and the patterning slit sheet 1150 may be connected to each other by a connecting member 1135. That is, the vapor deposition source 1110, the vapor deposition source nozzle unit 1120, and the patterning slit sheet 1150 may be connected to each other by the connecting member 1135 and integrally formed. Here, the connecting member 1135 can guide the movement path of the deposition material so that the deposition material discharged through the deposition source nozzle 1121 is not dispersed. The drawing shows that the connecting member 1135 is formed only in the horizontal direction of the vapor deposition source 1110, the vapor deposition source nozzle unit 1120 and the patterning slit sheet 1150 and guides only the X-axis direction of the vapor deposition material. For the convenience of illustration, the idea of the present invention is not limited to this, and the connecting member 1135 is formed in a box-shaped sealed type to simultaneously guide the movement of the deposition material in the X-axis direction and the Y-axis direction. May be.

  As described above, the thin film deposition assembly 1100 according to an embodiment of the present invention performs deposition while moving relative to the substrate 600, and thus the thin film deposition assembly 1100 moves relative to the substrate 600. Therefore, the patterning slit sheet 1150 is formed to be separated from the substrate 600 at a predetermined interval.

  After the mask is formed smaller than the substrate according to the present invention, the mask can be easily manufactured by moving the mask relative to the substrate and performing deposition. In addition, it is possible to obtain an effect of preventing defects due to contact between the substrate and the mask. Further, since the time required for the step of bringing the substrate and the mask into close contact with each other is unnecessary, an effect of improving the manufacturing speed can be obtained.

  Meanwhile, although not shown in the drawings, the thin film deposition apparatus according to the third embodiment of the present invention may include a plurality of thin film deposition assemblies. That is, in the thin film deposition apparatus according to the third embodiment of the present invention, the blue light emitting layer material B, the green auxiliary layer material G ′, the green light emitting layer material G, the red auxiliary layer material R ′, and the red light emitting layer material R are sequentially deposited. Multiple vapor deposition sources may be provided. The substrate 600 is deposited by a scanning method while moving in the direction of arrow A in FIG. Since such a plurality of thin film deposition assemblies have been described in detail in the first embodiment, detailed description thereof will be omitted in this embodiment.

(Fourth embodiment)
FIG. 10 illustrates a thin film deposition assembly according to a fourth embodiment of the present invention. Referring to the drawings, a thin film deposition assembly according to a fourth embodiment of the present invention includes a deposition source 1210, a deposition source nozzle unit 1220, and a patterning slit sheet 1250. Here, the vapor deposition source 1210 has a crucible 1211 filled with a vapor deposition material 1215 therein, and heats the crucible 1211 to evaporate the vapor deposition material 1215 filled inside the crucible 1211 to the vapor deposition source nozzle portion 1220 side. And a heater 1212. Meanwhile, a vapor deposition source nozzle unit 1220 is disposed on one side of the vapor deposition source 1210, and a plurality of vapor deposition source nozzles 1221 are formed in the vapor deposition source nozzle unit 1220 along the Y-axis direction. Meanwhile, a patterning slit sheet 1250 and a frame 1255 are further provided between the deposition source 1210 and the substrate 600, and a plurality of patterning slits 1251 are formed in the patterning slit sheet 1250 along the X-axis direction. The vapor deposition source 1210 and the vapor deposition source nozzle unit 1220 and the patterning slit sheet 1250 are coupled by a connecting member 1235.

  This embodiment is distinguished from the above-described embodiment in that a plurality of vapor deposition source nozzles 1221 formed in the vapor deposition source nozzle portion 1220 are arranged with a predetermined angle tilt. Specifically, the vapor deposition source nozzle 1221 is formed by two rows of vapor deposition source nozzles 1221a and 1221b, and the two rows of vapor deposition source nozzles 1221a and 1221b are alternately arranged. At this time, the deposition source nozzles 1221a and 1221b may be formed with a predetermined angle tilt on the XZ plane.

  Here, the first row deposition source nozzle 1221a is tilted to face the second row deposition source nozzle 1221b, and the second row deposition source nozzle 1221b faces the first row deposition source nozzle 1221a. Can be tilted. In other words, the vapor deposition source nozzles 1221a arranged in the left column are arranged to face the right end portion of the patterning slit sheet 1250, and the vapor deposition source nozzles 1221b arranged in the right column are arranged in the left end portion of the patterning slit sheet 1250. It can be arranged to go to.

  FIG. 11 is a schematic view illustrating a distribution pattern of a deposited film deposited on a substrate when the deposition source nozzle is not tilted in the thin film deposition assembly according to the present invention, and FIG. 12 is a thin film deposition according to the present invention. 6 is a diagram schematically illustrating a distribution form of a deposited film deposited on a substrate when the deposition source nozzle is tilted by the assembly. Comparing FIG. 11 and FIG. 12, when the deposition source nozzle is tilted, the thickness of the deposited film formed on both ends of the substrate is relatively increased, and the uniformity of the deposited film is increased. I understand that.

  With such a configuration, the deposition amount can be controlled so that the thickness of the entire deposition material is uniform by reducing the difference in film thickness between the center and the end of the substrate. The effect which improves can be acquired.

Hereinafter, the overall system configuration of the thin film deposition apparatus including the plurality of thin film deposition assemblies shown in FIG. 4 will be described in detail.

FIG. 13 is a system configuration diagram schematically illustrating a thin film deposition apparatus according to an embodiment of the present invention, and FIG. 14 illustrates a modification of FIG. FIG. 15 is a schematic view showing an example of the electrostatic chuck 800.

Referring to FIG. 13, the thin film deposition apparatus according to an embodiment of the present invention includes a loading unit 910, a deposition unit 930, an unloading unit 920, a first circulation unit 810 and a second circulation unit 820.

The loading unit 910 can include a first rack 912, an introduction robot 914, an introduction chamber 916, and a first inversion chamber 918.

A large number of substrates 600 before vapor deposition are loaded on the first rack 912, and the introduction robot 914 captures the substrates 600 from the first rack 912 and transfers them from the second circulation unit 820. After placing the substrate 600 on 800, the electrostatic chuck 800 to which the substrate 600 is attached is moved to the introduction chamber 916.

A first reversing chamber 918 is provided adjacent to the introduction chamber 916, and the first reversing robot 919 located in the first reversing chamber 918 reverses the electrostatic chuck 800, so that the electrostatic chuck 800 is attached to the first evaporation chamber 930. Attached to the circulation unit 810.

As can be seen from FIG. 15, the electrostatic chuck 800 has a body 801 made of ceramic embedded with an electrode 802 to which a voltage is applied, and the main body is applied by applying a high voltage to the electrode 802. The substrate 600 is attached to the surface 801.

13, the introduction robot 914 places the substrate 600 on the upper surface of the electrostatic chuck 800, and in this state, the electrostatic chuck 800 is transferred to the introduction chamber 916, and the first reversing robot 919 reverses the electrostatic chuck 800. By doing so, the substrate 600 is positioned in the vapor deposition section 930 so as to face downward.

The configuration of the unloading unit 920 is opposite to the configuration of the loading unit 910 described above. That is, the substrate 600 and the electrostatic chuck 800 that have passed through the vapor deposition section 930 are transferred to the carry-out chamber 926 by being reversed by the second reverse robot 929 in the second reverse chamber 928, and the carry-out robot 924 is moved from the carry-out chamber 926 to the substrate 600 and the static chuck 800. After the electric chuck 800 is taken out, the substrate 600 is separated from the electrostatic chuck 800 and loaded on the second rack 922. The electrostatic chuck 800 separated from the substrate 600 is sent to the loading unit 910 through the second circulation unit 820.

However, the present invention is not necessarily limited to this, and the substrate 600 is fixed to the lower surface of the electrostatic chuck 800 from the time when the substrate 600 is first fixed to the electrostatic chuck 800 and is transferred to the vapor deposition unit 930 as it is. You may let them. In this case, for example, the first inversion chamber 918, the first inversion robot 919, the second inversion chamber 928, and the second inversion robot 929 are not necessary.

The deposition unit 930 includes at least one deposition chamber. 1, the deposition unit 930 includes a first chamber 931 in which a plurality of thin film deposition assemblies 100, 200, 300, and 400 are disposed. 13, a first thin film deposition assembly 100, a second thin film deposition assembly 200, a third thin film deposition assembly 300, and a fourth thin film deposition assembly in the first chamber 931. Referring to FIG. There are 400 four thin film deposition assemblies, the number of which can vary depending on the deposition material and deposition conditions. The first chamber 931 is maintained in a vacuum while vapor deposition proceeds.

In addition, according to another embodiment of the present invention according to FIG. 14, the deposition unit 930 includes a first chamber 931 and a second chamber 932 that are linked to each other, and the first chamber 931 includes first and second thin film deposition assemblies. The third and fourth thin film deposition assemblies 300 and 400 may be disposed in the second chamber 932. At this time, it goes without saying that the number of chambers can be added.

Meanwhile, according to an exemplary embodiment of the present invention according to FIG. 13, the electrostatic chuck 800 to which the substrate 600 is fixed is at least the deposition unit 930 by the first circulation unit 810, preferably the loading unit 910 and the deposition unit. The electrostatic chuck 800 that sequentially moves to the unit 930 and the unloading unit 920 and is separated from the substrate 600 by the unloading unit 920 is returned to the loading unit 910 by the second circulation unit 820.

The first circulation unit 810 is provided to pass through the first chamber 931 when passing through the vapor deposition unit 930, and the second circulation unit 820 is provided to transfer an electrostatic chuck.

  Although the present invention has been described with reference to the embodiments illustrated in the drawings, this is merely exemplary, and various modifications and equivalent other embodiments may be made by those skilled in the art. You will understand that. Therefore, the true technical protection scope of the present invention must be determined by the technical idea of the claims.

  The present invention is suitably used in a technical field related to an organic light emitting display device.

DESCRIPTION OF SYMBOLS 100 Thin film vapor deposition assembly 110 Deposition source 120 Deposition source nozzle part 130 Blocking plate assembly 150 Patterning slit sheet

Claims (22)

In a thin film deposition apparatus for forming a thin film on a substrate,
The thin film deposition apparatus includes a plurality of thin film deposition assemblies,
Each of the plurality of thin film deposition assemblies includes:
A deposition source that radiates the deposition material;
A vapor deposition source nozzle part disposed on one side of the vapor deposition source, wherein a plurality of vapor deposition source nozzles are formed along a first direction;
A patterning slit sheet that is arranged opposite to the vapor deposition source nozzle part and has a plurality of patterning slits formed along a second direction perpendicular to the first direction,
The substrate is deposited while moving along the first direction with respect to the thin film deposition apparatus,
The deposition source, the deposition source nozzle part and the patterning slit sheet are integrally formed,
Each deposition source of the plurality of thin film deposition assemblies includes at least a red light emitting layer material, a green light emitting layer material, a blue light emitting layer material, or an auxiliary layer material,
An auxiliary layer material is provided between two deposition sources each including one of a red light emitting layer material, a green light emitting layer material, and a blue light emitting layer material among the plurality of thin film deposition assemblies. A thin film deposition apparatus, wherein at least one deposition source is disposed.   At least five thin film deposition assemblies are provided, and each of the deposition sources of the at least five thin film deposition assemblies includes a blue light emitting layer material, an auxiliary layer material, a green light emitting layer material, an auxiliary layer material, and a red light emitting layer material in order. The thin film deposition apparatus according to claim 1, wherein the thin film deposition apparatus is provided.   At least five thin film deposition assemblies are provided, and each of the deposition sources of the at least five thin film deposition assemblies includes a blue light emitting layer material, an auxiliary layer material, a red light emitting layer material, an auxiliary layer material, and a green light emitting layer material in order. The thin film deposition apparatus according to claim 1, wherein the thin film deposition apparatus is provided.   The thin film deposition apparatus according to claim 1, wherein each deposition material provided in each deposition source of the plurality of thin film deposition assemblies is sequentially deposited on the substrate.   The thin film deposition apparatus of claim 4, wherein one auxiliary layer material is deposited between at least two light emitting layer materials as the deposition material deposited on the substrate.   2. The thin film deposition apparatus and the substrate are configured such that one of the thin film deposition apparatus and the substrate moves relative to the other along a plane parallel to a plane on which the deposition material is deposited on the substrate. The thin film vapor deposition apparatus described in 1.   The thin film deposition apparatus of claim 1, wherein the patterning slit sheet of each thin film deposition assembly is formed smaller than the substrate.   The thin film deposition apparatus according to claim 1, wherein each deposition source of the plurality of thin film deposition assemblies is provided such that a deposition temperature can be controlled for each deposition source.   The thin film deposition apparatus according to claim 1, wherein the deposition source, the deposition source nozzle portion, and the patterning slit sheet are integrally formed by being coupled by a connecting member.   The thin film deposition apparatus of claim 9, wherein the connecting member guides a moving path of the deposition material.   The thin film deposition apparatus according to claim 9, wherein the connecting member is formed so as to seal a space between the deposition source and the deposition source nozzle part and the patterning slit sheet from the outside.   The thin film deposition apparatus according to claim 1, wherein the thin film deposition apparatus is formed at a predetermined distance from the substrate.   The thin film deposition apparatus according to claim 1, wherein the deposition material is continuously deposited on the substrate while the substrate moves along the first direction with respect to the thin film deposition apparatus.   The thin film deposition apparatus according to claim 1, wherein the plurality of deposition source nozzles are formed to be tilted at a predetermined angle.   The plurality of vapor deposition source nozzles includes two rows of vapor deposition source nozzles formed along the first direction, and the two rows of vapor deposition source nozzles are tilted in directions facing each other. Item 15. The thin film deposition apparatus according to Item 14. The plurality of vapor deposition source nozzles includes two rows of vapor deposition source nozzles formed along the first direction,
Of the two rows of vapor deposition source nozzles, the vapor deposition source nozzle disposed on the first side is disposed to face the second side end of the patterning slit sheet,
The thin film deposition according to claim 14, wherein the deposition source nozzle disposed on the second side of the two rows of deposition source nozzles is disposed toward the first side end of the patterning slit sheet. apparatus. In a method for manufacturing an organic light emitting display device using a thin film deposition apparatus for forming a thin film on a substrate,
Disposing the substrate at a predetermined distance from the thin film deposition apparatus;
Depositing a deposition material emitted from the thin film deposition apparatus on the substrate while moving either one of the thin film deposition apparatus and the substrate relative to the other, and
The thin film deposition apparatus comprises:
A deposition source that radiates the deposition material;
A vapor deposition source nozzle part disposed on one side of the vapor deposition source, wherein a plurality of vapor deposition source nozzles are formed along a first direction;
A plurality of thin film deposition assemblies comprising: a patterning slit sheet that is arranged opposite to the deposition source nozzle part and in which a plurality of patterning slits are formed along a second direction perpendicular to the first direction;
Each deposition source of the plurality of thin film deposition assemblies includes at least a red light emitting layer material, a green light emitting layer material, a blue light emitting layer material, or an auxiliary layer material,
An auxiliary layer material is provided between two deposition sources each including one of a red light emitting layer material, a green light emitting layer material, and a blue light emitting layer material among the plurality of thin film deposition assemblies. A method of manufacturing an organic light emitting display device, wherein at least one vapor deposition source is disposed. Depositing the deposition material on the substrate comprises:
The organic light emitting diode according to claim 17, comprising: sequentially depositing a blue light emitting layer material, an auxiliary layer material, a green light emitting layer material, an auxiliary layer material, and a red light emitting layer material provided on the plurality of thin film deposition assemblies on the substrate. Manufacturing method of light emitting display device. Depositing the deposition material on the substrate comprises:
The organic light emitting device of claim 17, further comprising: sequentially depositing a blue light emitting layer material, an auxiliary layer material, a red light emitting layer material, an auxiliary layer material, and a green light emitting layer material provided on the plurality of thin film deposition assemblies on the substrate. Manufacturing method of light emitting display device.   The method of claim 17, wherein the deposition materials provided in the deposition sources of the plurality of thin film deposition assemblies are sequentially deposited on the substrate. Depositing the deposition material on the substrate comprises:
The method of claim 17, further comprising controlling a deposition temperature for each of the plurality of thin film deposition assemblies.   An organic light emitting display device manufactured by the method according to claim 17.

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