KR20150084297A - Inline deposition apparatus for manufacturing oled - Google Patents

Abstract

Disclosed is an inline deposition apparatus for manufacturing an OLED. An inline deposition apparatus for manufacturing an OLED according to the present invention includes a partition wall which is separated by a separation space from an upper region in a chamber for processing a deposition process on a substrate; an evaporation source which is arranged in a lower region in the chamber and provides an evaporation material to the separation space in order to deposit it on the substrate; a shutter which is adjacent to the partition wall and selectively opens/closes the separation space; and a heat blocking part which is prepared in the chamber and shields heat transmitted to the substrate from the other regions in the chamber except the evaporation source.

Description

[0001] INLINE DEPOSITION APPARATUS FOR MANUFACTURING OLED [0002]

The present invention relates to an inline deposition apparatus for manufacturing an OLED, and more particularly, to an inline deposition apparatus for manufacturing an OLED, and more particularly, To an inline deposition apparatus for OLED manufacturing capable of improving quality.

Description of the Related Art [0002] Organic light emitting displays (OLEDs), which are flat panel display devices, are generally used to realize a color image by self-emission of organic materials. Has attracted attention as a display device.

The organic light emitting display OLED includes an anode, a cathode, and organic layers interposed between the anode and the cathode.

Here, the organic layers include at least a light emitting layer and may further include a hole injecting layer, a hole transporting layer, an electron transporting layer, and an electron injecting layer in addition to the light emitting layer.

The organic electroluminescent display device can be divided into a polymer organic electroluminescent device and a low molecular weight organic electroluminescent device depending on an organic film, particularly a material forming the light emitting layer.

In order to realize a full color, a light emitting layer must be patterned. As a method of manufacturing a large OLED, a direct patterning method using a fine metal mask (FMM), a laser induced thermal imaging (LITI) , A method using a color filter, and the like.

When a large-size OLED is manufactured by applying a mask method, a so-called horizontally upward deposition method in which a substrate and a patterned mask are horizontally disposed in a chamber, and then an evaporation material is sprayed toward the mask to deposit a substrate is widely used .

Meanwhile, an inline deposition apparatus is divided into an open section opened between an evaporation source and a substrate and a closed section closed (closed) for a continuous deposition process on a substrate.

In the open section, a substantial deposition process is carried out in which evaporation material evaporated from the evaporation source is coated on the substrate.

On the other hand, during the close interval, the substrate is transferred while preventing evaporation material evaporated from the evaporation source from being coated on the substrate, and in addition, stable evaporation from the evaporation source is generated.

In the inline deposition apparatus, the open interval and the closed interval are switched to each other for the continuous deposition process on the substrate. The continuous deposition process for the substrate is performed through the implementation of the open interval and the close interval.

On the other hand, as the size of the substrate used in the deposition process gradually increases in recent years, the total pitch change of the substrate due to heat during the deposition process and the resulting alignment error of the substrate, The alignment error of the substrate with respect to the mask (Metal Mask) becomes increasingly large.

In order to reduce the total pitch change of the substrate and the alignment error of the substrate with respect to the metal mask, heat is removed as a fundamental cause. However, It is urgent to supplement the structure considering these issues.

Korea Patent Office Publication No. 10-2012-0077382

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a method of manufacturing an OLED capable of improving the total quality of a substrate by reducing the total pitch change of the substrate due to heat during the vapor deposition process and the alignment error of the substrate, And an inline deposition apparatus.

According to an aspect of the present invention, there is provided a plasma display panel comprising: a barrier rib disposed in a top region in a chamber in which a deposition process for a substrate proceeds, An evaporation source disposed in a lower region within the chamber, the evaporation source providing evaporation material toward the spacing space to deposit the substrate; A shutter disposed adjacent to the partition and selectively opening and closing the space; And a heat shielding portion provided in the chamber, the heat shielding portion shielding heat transmitted to the substrate from another region in the chamber except for the evaporation source.

The heat interrupter may include a chiller disposed on the opposite side of the spacing space between the substrate and the substrate so as to block heat reflected from the backside of the substrate and transferred to the substrate.

A plurality of chillers may be continuously disposed in the chamber along the direction in which the substrate advances.

The chiller may include a cooling plate disposed in parallel with the substrate in an area adjacent to the spacing space.

A cooling water flow path arranged in a zigzag shape may be formed inside the cooling plate.

The chiller may further include a plurality of plate holders for circulating the cooling water through the cooling water channel while fixing the cooling plate to the wall surface of the chamber.

The chiller may further include a heat transfer plate coupled to the cooling plate toward the spacing space.

Wherein the heat transfer plate comprises: a heat transfer plate main body which is in contact with one surface of the cooling plate; And an inclined wing portion formed to be inclined upward from an end of the heat transfer plate main body.

The area of the cooling plate may be larger than the area of the spacing space.

The heat shield may further include a thermal reflector for a shutter coupled to a side wall of the shutter toward the evaporation source.

The heat shield may further include a thermal reflector for a barrier rib coupled to a side wall of the barrier rib toward the evaporation source.

The evaporation source includes a crucible in which the evaporation material having a creep property at a high temperature is filled therein, an upper portion is opened, and an insulation material is manufactured; A plurality of heaters (heaters) are disposed in the periphery of the crucible and arranged in a plurality of directions along the height direction of the crucible so as to evaporate the vaporized material while being vapor- ); And a controller for individually controlling the operation of the plurality of heaters.

Further comprising a first evaporation monitor sensor disposed on an upper side of the crucible for sensing a vapor shape of the evaporation material, wherein the controller controls the first evaporation monitor sensor based on the sensing signal of the first evaporation monitor sensor The operation of a plurality of heaters can be individually controlled.

The controller can individually control the operation of the plurality of heaters so that the vapor shape of the evaporation material can be kept constant even if the evaporation material is consumed while being evaporated in the crucible.

And a second evaporation monitor sensor disposed apart from the first evaporation monitor sensor and sensing an evaporation amount of the evaporation material for controlling the evaporation rate of the evaporation material.

The arrangement angle of the first evaporation monitor sensor and the second evaporation monitor sensor may be different from each other on the basis of the crucible.

The plurality of heaters being disposed in a peripheral lower region of the crucible, the lower heater heating the lower region of the crucible for controlling the evaporation rate of the evaporation material; And an upper heater disposed in an upper region of the lower heater and heating the upper region of the crucible for adjusting the vapor shape of the vaporized material.

And a cold region disposed above the upper heater in a peripheral upper region of the crucible.

Wherein the evaporation material comprises aluminum (Al), barium (Ba), germanium (Ge), molybdenum (Mo), selenium (Se) or tin (Sn) But this operation is repeated so that the process can be continuously performed.

According to the present invention, the total pitch change of the substrate due to heat during the deposition process and the resulting alignment error of the substrate can be reduced compared to the conventional case, thereby improving the deposition quality.

1 is a schematic structural view of an organic light emitting display device in which an organic film and an inorganic film are alternately deposited in 10 layers.
2 is a schematic structural view of an inline deposition apparatus for manufacturing an OLED according to the first embodiment of the present invention.
3 is an enlarged view of the main part of Fig.
Fig. 4 is an enlarged view of the chiller.
5 is a structural view of a cooling plate.
6 is a structural view of an evaporation source applied to an inline deposition apparatus for manufacturing an OLED according to a second embodiment of the present invention.
Figure 7 is a control block diagram of the evaporation source of Figure 6;
8 is a structural view of an evaporation source applied to an inline deposition apparatus for manufacturing an OLED according to a third embodiment of the present invention.

In order to fully understand the present invention, operational advantages of the present invention, and objects achieved by the practice of the present invention, reference should be made to the accompanying drawings and the accompanying drawings which illustrate preferred embodiments of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Like reference symbols in the drawings denote like elements.

1 is a schematic structural view of an organic light emitting display device in which an organic film and an inorganic film are alternately deposited in 10 layers.

Referring to this figure, an organic light emitting display (OLED) 1 may include a substrate and an organic light emitting element 3 stacked on the substrate.

The substrate may be a glass substrate provided with glass. The organic light emitting element 3 has a stacked structure of an anode, three organic layers (a hole transporting layer, a light emitting layer, and an electron transporting layer), and a cathode. An organic molecule, when energized (and excited), tries to return to its original state (ground state), and has the property of emitting the energy it receives as light.

In the organic light emitting diode 3, when a voltage is applied, the hole (+) injected from the anode and the electrons injected from the cathode (-) recombine in the light emitting layer. (Red), G (Green), and B (Blue) light are emitted depending on the organic material on the organic light emitting device 3. In this case, (Full Color) is implemented using the characteristic of emitting a color.

On the other hand, since the organic light emitting element 3 can be easily damaged by gas or moisture in the atmosphere, life thereof may become a problem. To solve this problem, a plurality of organic layers and inorganic layers are alternately stacked The organic light emitting element 3 has been protected from the inflow of gas or moisture.

In Fig. 1, a total of ten organic films and inorganic films are alternately stacked. That is, a first organic film, a first inorganic film, a second organic film, a second inorganic film, a fifth organic film, and a fifth inorganic film are sequentially deposited from the organic light emitting element 3 in layers.

In detail, the first inorganic film completely covers the first organic film, the second organic film partially surrounds the first inorganic film, and the second inorganic film completely covers the second organic film. And the following inline deposition apparatus for OLED manufacturing is required for such deposition.

FIG. 2 is a schematic structural view of an inline deposition apparatus for manufacturing an OLED according to a first embodiment of the present invention, FIG. 3 is an enlarged view of a main part of FIG. 2, FIG. 4 is an enlarged view of a chiller, .

Referring to these drawings, the inline deposition apparatus for manufacturing an OLED according to the present embodiment reduces the total pitch change of the substrate due to heat during the deposition process and the resulting alignment error of the substrate, The evaporation source 110, the shutter 120, and the heat shield 140, 150, and 160, in which the barrier ribs 102 are provided.

The substrate used in this embodiment may be a large substrate for an organic light emitting display (OLED) as described above.

The chamber 100 is the location where the deposition process for the substrate proceeds. In the case of this embodiment, a horizontal upward deposition method is proposed in which a deposition process is performed on a substrate by an evaporation material that is directed upward after the substrate is horizontally disposed.

However, the scope of the present invention may also be applied to a deposition apparatus to which a vertical type deposition method, in which substrates such as a mask 110 are vertically or obliquely arranged and then deposited, is applied.

The interior of the chamber 100 forms a vacuum atmosphere so that the deposition process for the substrate can proceed reliably.

To this end, a vacuum pump 101a is connected to the lower portion of the chamber 100 as means for maintaining the interior of the chamber 100 in a vacuum atmosphere. The vacuum pump 101a may be a so-called cryopump.

On the side wall of the chamber 100, gates 102a and 102b through which the substrate is introduced are provided.

The barrier ribs 102 are arranged in the upper region in the chamber 100 with a space S interposed therebetween.

A plurality of partition walls 102 are provided so as to provide four spacing spaces S and a plurality of partition walls 102 are formed in the lower portion of the spacing spaces S by the number of the spacing spaces S, ).

The evaporation source 110 is disposed in the lower region in the chamber 100 and serves to evaporate the substrate by providing evaporation material toward the space S.

Although not necessarily, the evaporation material may include aluminum (Al), barium (Ba), germanium (Ge), molybdenum (Mo), selenium (Se), or tin (Sn).

In this embodiment, the evaporation source 110 injects the evaporation material upwardly in a fixed position, and instead is deposited in an inline manner as the substrate moves.

Thus, although not shown in the drawings, the substrate may be mounted on a moving body called a carrier, and then moved in the chamber 100 to perform the deposition process.

As described above, in the inline deposition apparatus for manufacturing an OLED according to the present embodiment, the open interval and the close interval are switched to each other for the continuous deposition process on the substrate. Through the implementation of the open interval and the close interval, A continuous deposition process is performed.

To this end, a shutter 120 for selectively opening and closing the spacing space S is provided. 2 is a state in which the shutter 120 partially opens the spacing S, where the spacing S is fully opened by the shutter 120 and the opposite state is the closed interval.

In this embodiment, the shutter 120 is applied as a sliding type shutter, but the shutter 120 may be applied as a rotation type.

On the other hand, if the size of the substrate is small, there is no significant effect. However, when a large substrate is used as in the present embodiment, the total pitch change of the substrate due to heat during the deposition process and the resulting misalignment of the substrate, , Not shown) of the substrate is gradually increased.

In order to reduce the total pitch change of the substrate and the alignment error of the substrate with respect to the metal mask, heat is removed as a fundamental cause. However, The heat shielding portions 140, 150 and 160 are provided to block the heat transmitted to the substrate from other regions in the chamber 100 excluding the evaporation source 110. [

When the heat transmitted to the substrate in the other region in the chamber 100 excluding the evaporation source 110 is blocked through the heat interrupting portions 140, 150 and 160, the substrate is not affected by the additional heat or is received less, And the resulting alignment error of the substrate can be greatly reduced.

In this embodiment, the heat shields 140, 150 and 160 may include a chiller 140, a thermal reflector 150 for a shutter, and a thermal reflector 160 for a barrier.

Of course, the chiller 140, the thermal reflector 150 for the shutters, and the thermal reflector 160 for the bulkhead may be applied, but one or more selected ones may be applied, It is advantageous in efficiency.

In this embodiment, the chiller 140 is disposed on the opposite side of the spacing space S with the substrate interposed therebetween in order to block the heat that is reflected from the back side of the substrate and transferred to the substrate.

At this time, a plurality of chillers 140 are continuously arranged in the chamber 100 along the direction in which the substrate advances. When a plurality of chillers 140 are arranged in the chamber 100 along the direction in which the substrate advances, the chillers 140 are advantageous in blocking heat reflected from the backside of the substrate and transferred to the substrate, And thus the alignment error of the substrate can be greatly reduced.

The chiller 140 includes a cooling plate 141 arranged in parallel with the substrate in an area adjacent to the spacing space S, and a plate holder 143 for cooling water circulation.

At this time, the area of the cooling plate 141 may be larger than the area of the spacing space S, thereby improving the efficiency of blocking the heat transmitted to the substrate by being reflected from the back side of the substrate.

Inside the cooling plate 141, a cooling water flow path 142 arranged in a zigzag shape is formed.

A heat transfer plate 144 may be coupled to one side of the cooling plate 141 facing the spacing space S. The heat transfer plate 144 may include a heat transfer plate main body 144a which is in contact with one surface of the cooling plate 141 and an inclined wing portion 144b which is inclined upward from the end of the heat transfer plate main body 144a have.

When the heat transfer plate 144 is coupled to one side of the cooling plate 141, the heat toward the rear side of the substrate may be transmitted to the heat transfer plate 144 and may be destroyed by the cooling water of the cooling plate 141, It is possible to increase the efficiency of cutting off heat transmitted to the substrate from the back side.

The plate holder 143 for cooling water circulates the cooling water to the cooling water flow path 142 while fixing the cooling plate 141 to the wall surface of the chamber 100.

The heat reflecting plate 150 for the shutter is coupled to one side wall of the shutter 120 toward the evaporation source 110 and the heat reflecting plate 160 for the partitioning wall is coupled to one side wall of the partition wall 102 toward the evaporation source 110 As a result, it is possible to prevent the heat from the evaporation source 110 from being transferred to the substrate in advance during the close interval, for example.

As described above, when the thermal reflector 150 for the shutters and the thermal reflector 160 for the barrier ribs are applied, the efficiency may be good, but they are not necessarily applied.

According to this configuration, the continuous deposition process can be performed on the substrate as the open section and the closed section are switched based on the operation of the plurality of shutters 120. In the deposition process, Thereby blocking heat transmitted to the substrate from other regions within the chamber 100 except for the evaporation source 110. [

According to the inline deposition apparatus for manufacturing an OLED of this embodiment having such a structure and an action, the heat transmitted to the substrate in the other region in the chamber 100 excluding the evaporation source 110 can be blocked, so that the total pitch Pitch change and the resulting alignment error of the substrate can be reduced compared with the prior art, thereby improving the deposition quality.

FIG. 6 is a structural view of an evaporation source applied to an inline deposition apparatus for manufacturing an OLED according to a second embodiment of the present invention, and FIG. 7 is a control block diagram of the evaporation source of FIG.

Referring to these drawings, an evaporation source 210 applied to an inline deposition apparatus for manufacturing an OLED of this embodiment includes a crucible 220, a heater 231, a heater 232, a first evaporation monitor sensor 260, 2 evaporation monitor sensor 270, and a controller 250. [

The crucible 220 is a cup-shaped crucible that is filled with evaporation material deposited on a substrate.

The upper portion of the crucible 220 is opened. The crucible 220 can be made to be narrowed downward, and a lip portion 221 is formed in the upper opening region. The lip portion 221 is a kind of flange having a large surface area.

The evaporation material used in this embodiment may be, for example, a metal evaporation material followed by melting before the evaporation process proceeds.

Particularly, the evaporation material applied in the present embodiment is formed of evaporation materials having high creep characteristics such as aluminum (Al), barium (Ba), germanium (Ge), molybdenum (Mo), selenium (Se) The evaporation device of the flat panel display device of the present embodiment may be formed by injecting the evaporation material into the crucible 220 and then heating the crucible 220 to evaporate the molten metal evaporation material The vapor is produced and deposited on a substrate.

For reference, when the evaporation material in the crucible 220 is reduced due to evaporation during the evaporation process, that is, when the evaporation material is consumed, the uppermost level of the evaporation material is lowered. At this time, As exposure occurs, the vapor is more likely to interfere with the walls in the crucible and the area in which the dissolved material creeps will vary. So that the vapor shape changes.

The heaters 231 and 232 heat the crucible 220 so that the evaporated material contained in the crucible 220 is evaporated while being phase-changed into vapor.

At this time, a plurality of heaters 231 and 232 are arranged along the height direction of the crucible 220 at the periphery of the crucible 220, and the heaters 231 and 232 are individually controlled and operated by the controller 250.

In this embodiment, the heaters 231 and 232 are disposed in the lower peripheral region of the crucible 220 and include a lower heater 231 for heating the lower region of the crucible 220 for controlling the evaporation rate of the evaporative material, And an upper heater 232 disposed in the upper region of the lower heater 231 to heat the upper region of the crucible 220 for adjusting the shape of the vapor of the evaporated material.

In other words, the lower heater 231 is operated while being controlled by the controller 250 for control of the evaporation rate, that is, the amount of evaporation, and the upper heater 232 is operated for vapor shape adjustment, The steam is controlled while being controlled by the controller 250 so that the steam shape can be constant irrespective of the amount of the steam evaporated and consumed.

The second evaporation monitor sensor 170 senses the evaporation amount of the evaporation material to control the evaporation rate of the evaporation material.

The first evaporation monitor sensor 160 is spaced apart from the second evaporation monitor 170 and serves to sense the vapor shape of the evaporation material. The primary function of the first evaporation monitor sensor 160 is to sense the evaporation amount like the second evaporation monitor sensor 170. However, when the vapor shape is changed, the evaporation amount sensed by the first evaporation monitor sensor 160 changes. This phenomenon also occurs when the evaporation amount at which the same evaporation amount is sensed by the second evaporation monitor sensor 170 is the same. That is, when monitoring the sensor in real time with the evaporation process, the evaporation amount is continuously and constantly sensed in the second evaporation monitor sensor 170, whereas when the evaporation amount is continuously increased or decreased in the first evaporation monitor sensor 160, (vapor shape) is changed.

The controller 250 controls the operation time and the heating temperature of the lower heater 231 and the upper heater 232 based on the sensing signals of the first evaporation monitor sensor 260 and the second evaporation monitor sensor 270 do. At this time, the operation time of the lower heater 231 and the upper heater 232, the heating temperature, and the like can be controlled individually.

In particular, the controller 250 controls the operation time, the heating temperature, and the like of the upper heater 232 based on the sensing signal of the first evaporation monitor sensor 260. The controller 250 controls the first evaporation monitor sensor 260 based on the sensing signal of the first evaporation monitor sensor 260 so that the vapor shape of the evaporation material can be maintained constant without being changed even if the evaporation material is consumed while being evaporated in the crucible 220. [ Thereby controlling the operation time of the upper heater 232, the heating temperature, and the like.

The reason why the control of the controller 250 is possible is that the shape of the creeping material varies depending on the temperature gradient of the crucible 220 as described repeatedly, Because.

In addition, the controller 250 can control the operation time and the heating temperature of the lower heater 231 based on the sensing signal of the second evaporation monitor sensor 270.

The controller 250 performing such a role may include a central processing unit 251 (CPU), a memory 252 (MEMORY), and a support circuit 253 (SUPPORT CIRCUIT).

The operation of the evaporation source 210 having such a configuration will be briefly described.

Any material such as aluminum (Al) or silver (Ag) is injected into the crucible 220 and heated by the heaters 231 and 232 to proceed the deposition process.

The first and second evaporation monitor sensors 260 and 270 sense the evaporation amount and transmit the sensing information to the controller 250.

Then, the controller 250 controls the operation time and the heating temperature of the upper and lower heaters 232 and 231 based on the sensing signals of the first and second evaporation monitor sensors 260 and 270.

Even when the evaporation source 210 as described above is applied, the total pitch variation of the substrate due to heat and the resulting alignment error of the substrate can be reduced as compared with the prior art, thereby improving the deposition quality.

8 is a structural view of an evaporation source applied to an inline deposition apparatus for manufacturing an OLED according to a third embodiment of the present invention.

Referring to this figure, an evaporation source 310 applied to an inline deposition apparatus for manufacturing an OLED according to this embodiment is also provided with a crucible 320, lower and upper heaters 331 and 332, a first evaporation monitor sensor 360, An evaporation monitor sensor 370, and a controller 250 (see FIG. 7).

In this structure, the controller 250 controls the operation time of the upper heater 332, the heating temperature, and the like based on the sensing signal of the first evaporation monitor sensor 360. The controller 250 controls the first evaporation monitor 360 based on the sensing signal of the first evaporation monitor 360 so that the vapor shape of the evaporation material can be maintained constant without being changed even if the evaporation material is consumed while being evaporated in the crucible 320. [ Thereby controlling the operation time of the upper heater 332, the heating temperature, and the like.

In addition, the controller 250 can control the operation time and the heating temperature of the lower heater 331 based on the sensing signal of the second evaporation monitor sensor 370.

At this time, in the present embodiment, a cold region 333 is further disposed on the upper portion of the upper heater 332 in the upper peripheral region of the crucible 320.

The cooling section 333 is formed at a low temperature so that the evaporated material does not evaporate in the section where the lower and upper heaters 331 and 332 are present and the partially diffused material does not overflow, The evaporation source 310 can be prevented from being burned and its durability can be improved.

As described above, when the evaporation source 310 of the present embodiment is applied, even if the evaporation material having the creep characteristic at high temperature is evaporated in the crucible 320 and is consumed, the shape of the vapor remains unchanged, It is possible to keep the thickness distribution of the thin film including the thin film between the evaporation source 310 and the substrate 310 constant. Even when the evaporation source 310 is applied, the total pitch variation of the substrate due to heat and the resulting alignment error of the substrate can be reduced, Can be improved.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Accordingly, such modifications or variations are intended to fall within the scope of the appended claims.

100: chamber 102: partition wall
110: evaporation source 120: shutter
140: Chiller 141: Cooling plate
142: cooling water channel 143: plate holder for cooling water circulation
144: heat transfer plate 144a: heat transfer plate body
144b: oblique wing 150: thermal reflection plate for shutter
160: Thermal reflector for bulkhead

Claims (19)

A barrier disposed in the upper region of the chamber in which the deposition process for the substrate proceeds, with a spacing space therebetween;
An evaporation source disposed in a lower region within the chamber, the evaporation source providing evaporation material toward the spacing space to deposit the substrate;
A shutter disposed adjacent to the partition and selectively opening and closing the space; And
And a heat shielding portion provided in the chamber for shielding heat transmitted to the substrate from another region in the chamber except for the evaporation source. The method according to claim 1,
The heat-
And a chiller disposed on the opposite side of the spaced space with the substrate interposed therebetween for blocking heat reflected from the backside of the substrate and transferred to the substrate. 3. The method of claim 2,
Wherein the plurality of chillers are continuously disposed in the chamber along the direction in which the substrate advances. 3. The method of claim 2,
In the chiller,
And a cooling plate disposed in parallel with the substrate in an area adjacent to the spacing space. 5. The method of claim 4,
And a cooling water flow path arranged in a zigzag shape is formed in the inside of the cooling plate. 6. The method of claim 5,
In the chiller,
Further comprising a plurality of cooling water circulating plate holders for circulating the cooling water through the cooling water channel while fixing the cooling plate to the wall surface of the chamber. 5. The method of claim 4,
In the chiller,
And a heat transfer plate coupled to the cooling plate toward the spacing space. 8. The method of claim 7,
Wherein the heat transfer plate comprises:
A heat transfer plate main body which is in contact with one surface of the cooling plate; And
And an inclined wing formed to be inclined upward from an end of the heat transfer plate main body. 5. The method of claim 4,
Wherein an area of the cooling plate is larger than an area of the spacing space. The method according to claim 1,
The heat-
Further comprising a thermal reflector for a shutter coupled to one side wall of the shutter toward the evaporation source. The method according to claim 1,
The heat-
Further comprising a thermal reflector for the barrier ribs coupled to one side wall of the barrier rib toward the evaporation source. The method according to claim 1,
Wherein the evaporation source comprises:
A crucible in which the evaporation material having a creep property at a high temperature is filled inside, an upper portion is opened and made of an insulating material;
A plurality of heaters (heaters) are disposed in the periphery of the crucible and arranged in a plurality of directions along the height direction of the crucible so as to evaporate the vaporized material while being vapor- ); And
And a controller for individually controlling the operation of the plurality of heaters. 13. The method of claim 12,
And a first evaporation monitor sensor disposed at an upper side of the crucible for sensing a vapor shape of the evaporation material,
Wherein the controller individually controls the operation of the plurality of heaters based on a sensing signal of the first evaporation monitor sensor. 14. The method of claim 13,
The controller comprising:
Wherein the operation of the plurality of heaters is controlled individually so that the vapor shape of the vaporized material can be kept constant even if the evaporated material is consumed while being evaporated in the crucible. . 14. The method of claim 13,
Further comprising a second evaporation monitor sensor spaced apart from the first evaporation monitor sensor and sensing evaporation amount of the evaporation material for controlling the evaporation rate of the evaporation material. 16. The method of claim 15,
Wherein the arrangement angles of the first evaporation monitor sensor and the second evaporation monitor sensor are different from each other on the basis of the crucible. 13. The method of claim 12,
Wherein the plurality of heaters comprises:
A lower heater disposed in a peripheral lower region of the crucible and heating a lower region of the crucible to control an evaporation rate of the evaporated material; And
And an upper heater disposed in an upper region of the lower heater for heating an upper region of the crucible in order to adjust a vapor shape of the evaporated material. 18. The method of claim 17,
Further comprising a cold region disposed above the upper heater in a peripheral upper region of the crucible. ≪ RTI ID = 0.0 > 11. < / RTI > The method according to claim 1,
The evaporation material includes aluminum (Al), barium (Ba), germanium (Ge), molybdenum (Mo), selenium (Se)
Wherein the shutter is opened in a normal situation of the evaporation source and is closed during evaporation preparation so that the operation is repeated so that the process is continuously performed.

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