KR101530027B1 - Inline deposition apparatus for manufacturing oled - Google Patents

Abstract

An inline deposition apparatus for OLED manufacturing is disclosed. An inline deposition apparatus for manufacturing an OLED according to an embodiment of the present invention includes a plurality of partitions arranged in a space in an upper region in a chamber in which a deposition process for a substrate proceeds, An evaporation source disposed in a lower region within the chamber to provide evaporation material toward the spacing space; And a plurality of vertical rotating shutter units coupled to the partition and selectively opening and closing the spaced apart space while being rotated along a direction crossing the plate surface of the substrate.

Description

[0001] INLINE DEPOSITION APPARATUS FOR MANUFACTURING OLED [0002]

The present invention relates to an inline deposition apparatus for manufacturing an OLED, and more particularly, to an inline deposition apparatus for manufacturing an OLED, which can easily obtain a coolant circulation path through a simple structure and can solve the disadvantage that a footprint of a chamber is increased, To a deposition apparatus.

Description of the Related Art [0002] Organic light emitting displays (OLEDs), which are flat panel display devices, are generally used to realize a color image by self-emission of organic materials. Has attracted attention as a display device.

The organic light emitting display OLED includes an anode, a cathode, and organic layers interposed between the anode and the cathode.

Here, the organic layers include at least a light emitting layer and may further include a hole injecting layer, a hole transporting layer, an electron transporting layer, and an electron injecting layer in addition to the light emitting layer.

The organic electroluminescent display device can be divided into a polymer organic electroluminescent device and a low molecular weight organic electroluminescent device depending on an organic film, particularly a material forming the light emitting layer. In order to realize a full color, a light emitting layer must be patterned. As a method of manufacturing a large OLED, a direct patterning method using a fine metal mask (FMM) and a laser induced thermal imaging (LITI) And a method of using a color filter.

When a large-size OLED is manufactured by applying a mask method, a so-called horizontally upward deposition method in which a substrate and a patterned mask are horizontally disposed in a chamber, and then an evaporation material is sprayed toward the mask to deposit a substrate is widely used .

Meanwhile, an inline deposition apparatus is divided into an open section opened between an evaporation source and a substrate and a closed section closed (closed) for a continuous deposition process on a substrate.

In the open section, a substantial deposition process is carried out in which evaporation material evaporated from the evaporation source is coated on the substrate.

On the other hand, during the close interval, the substrate is transferred while preventing evaporation material evaporated from the evaporation source from being coated on the substrate, and in addition, stable evaporation from the evaporation source is generated.

In the inline deposition apparatus, the open interval and the closed interval are switched to each other for the continuous deposition process on the substrate. A shutter is required between the evaporation source and the substrate in order to realize the open interval and the close interval.

Since the shutter serves to cover the evaporation source, the circulation path of the coolant such as water must be connected to the outside of the chamber. Depending on the driving method of the shutter, Which is difficult to apply or causes space limitation.

For example, although the sliding type shutter may have a high space utilization in terms of structure, the refrigerant circulation path must be connected to the outside of the chamber, so sealing is not possible for the portion penetrating the inside and the outside of the chamber.

In addition, although the shutter is rotated in parallel with the substrate, it is not difficult to secure the circulation path of the refrigerant. However, since the footprint of the chamber must be increased to secure the rotation space, It is urgent to develop a structure considering problems.

Korea Patent Office Publication No. 10-2012-0077382

SUMMARY OF THE INVENTION Accordingly, the present invention has been made in view of the above problems, and it is an object of the present invention to provide an inline deposition apparatus for OLED manufacturing, which can solve the disadvantage that a coolant circulation path can be easily secured through a simple structure and a footprint of a chamber is increased.

According to an aspect of the present invention, there is provided a plasma display panel comprising: a plurality of barrier ribs disposed in an upper region in a chamber in which a deposition process for a substrate proceeds, An evaporation source disposed in a lower region of the chamber to provide evaporation material toward the spacing space; And a plurality of vertical rotating shutter units coupled to the barrier ribs and rotating along the direction crossing the plate surface of the substrate to selectively open and close the spaced spaces. have.

The vertical rotation shutter unit may be arranged in a pair for each of the spaced spaces.

Wherein the vertical rotation shutter unit includes a rotation shaft for cooling water flow which passes through the inside and outside of the chamber and in which a main cooling line through which cooling water flows is formed; And a shutter which is connected to the rotary shaft for cooling water flow and is disposed in the space in the interior of the chamber and in which a sub cooling line communicating with the main cooling line of the cooling water flow rotary shaft is formed .

The sub-cooling line in the shutter may have a zigzag shape such that it is disposed over the entire section of the shutter.

The vertical rotation shutter unit includes a pair of rotary supports connected to both ends of the rotation shaft serving as the cooling water flow both sides of the chamber and rotatably supporting the rotation shaft serving as the cooling water flow; And a rotation motor connected to one end of the rotation shaft serving as the cooling water flow at one side outer wall of the chamber to rotate the rotation shaft serving as the cooling water flow.

The evaporation process may proceed while either the evaporation source or the substrate is moved relative to the other.

And a substrate support module disposed in the chamber and supporting the substrate.

The substrate support module comprising: a movable module body; A substrate supporting plate connected to the movable module body and supporting the substrate on one side toward the mask; And a substrate holding unit for holding the substrate, which is in contact with the substrate supporting plate, at a corresponding position.

The plate for supporting the substrate may be a cooling plate.

The substrate support module includes a magnet array that is provided on the substrate support plate and generates a magnetic force to attract the mask toward the movable module body with the substrate interposed therebetween so that the mask contacts the substrate while being in close contact with the substrate, As shown in FIG.

The evaporation source includes a crucible in which the evaporation material having a creep property at a high temperature is filled therein, an upper portion is opened, and an insulation material is manufactured; A plurality of heaters (heaters) are disposed in the periphery of the crucible and arranged in a plurality of directions along the height direction of the crucible so as to evaporate the vaporized material while being vapor- ); And a controller for individually controlling the operation of the plurality of heaters.

Further comprising a first evaporation monitor sensor disposed on an upper side of the crucible for sensing a vapor shape of the evaporation material, wherein the controller controls the first evaporation monitor sensor based on the sensing signal of the first evaporation monitor sensor The operation of a plurality of heaters can be individually controlled.

The controller can individually control the operation of the plurality of heaters so that the vapor shape of the evaporation material can be kept constant even if the evaporation material is consumed while being evaporated in the crucible.

And a second evaporation monitor sensor disposed apart from the first evaporation monitor sensor and sensing an evaporation amount of the evaporation material for controlling the evaporation rate of the evaporation material.

The arrangement angle of the first evaporation monitor sensor and the second evaporation monitor sensor may be different from each other on the basis of the crucible.

The plurality of heaters being disposed in a peripheral lower region of the crucible, the lower heater heating the lower region of the crucible for controlling the evaporation rate of the evaporation material; And an upper heater disposed in an upper region of the lower heater and heating the upper region of the crucible for adjusting the vapor shape of the vaporized material.

And a cold region disposed above the upper heater in a peripheral upper region of the crucible.

The evaporation material may include aluminum (Al), barium (Ba), germanium (Ge), molybdenum (Mo), selenium (Se), or tin (Sn).

The vertical rotation shutter unit may be opened to the opposite side of the evaporation source so as not to collide with the evaporation source during the opening operation.

The vertical rotation shutter unit may be opened in the normal state of the evaporation source and closed during the evaporation preparation, but this operation may be repeated so that the process is continuously performed.

According to the present invention, the refrigerant circulation path can be easily secured through a simple structure, and the drawback that the footprint of the chamber is increased can be solved.

1 is a schematic structural view of an organic light emitting display device in which an organic film and an inorganic film are alternately deposited in 10 layers.
2 and 3 are views schematically showing the operation of an inline deposition apparatus for manufacturing an OLED according to the first embodiment of the present invention.
FIG. 4 is a view showing a state in which the vertical rotation shutter unit corresponding to FIG. 2 is opened.
5 is a view showing a state in which the vertical rotation shutter unit corresponding to FIG. 3 is closed.
6 is a structural view of an evaporation source applied to an inline deposition apparatus for manufacturing an OLED according to a second embodiment of the present invention.
Figure 7 is a control block diagram of the evaporation source of Figure 6;
8 is a structural view of an evaporation source applied to an inline deposition apparatus for manufacturing an OLED according to a third embodiment of the present invention.

In order to fully understand the present invention, operational advantages of the present invention, and objects achieved by the practice of the present invention, reference should be made to the accompanying drawings and the accompanying drawings which illustrate preferred embodiments of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Like reference symbols in the drawings denote like elements.

1 is a schematic structural view of an organic light emitting display device in which an organic film and an inorganic film are alternately deposited in 10 layers.

Referring to this figure, an organic light emitting display (OLED) 1 may include a substrate and an organic light emitting element 3 stacked on the substrate.

The substrate may be a glass substrate provided with glass. The organic light emitting element 3 has a stacked structure of an anode, three organic layers (a hole transporting layer, a light emitting layer, and an electron transporting layer), and a cathode. An organic molecule, when energized (and excited), tries to return to its original state (ground state), and has the property of emitting the energy it receives as light.

In the organic light emitting diode 3, when a voltage is applied, the hole (+) injected from the anode and the electrons injected from the cathode (-) recombine in the light emitting layer. (Red), G (Green), and B (Blue) light are emitted depending on the organic material on the organic light emitting device 3. In this case, (Full Color) is implemented using the characteristic of emitting a color.

On the other hand, since the organic light emitting element 3 can be easily damaged by gas or moisture in the atmosphere, life thereof may become a problem. To solve this problem, a plurality of organic layers and inorganic layers are alternately stacked The organic light emitting element 3 has been protected from the inflow of gas or moisture.

In Fig. 1, a total of ten organic films and inorganic films are alternately stacked. That is, a first organic film, a first inorganic film, a second organic film, a second inorganic film, a fifth organic film, and a fifth inorganic film are sequentially deposited from the organic light emitting element 3 in layers.

In detail, the first inorganic film completely covers the first organic film, the second organic film partially surrounds the first inorganic film, and the second inorganic film completely covers the second organic film. And the following inline deposition apparatus for OLED manufacturing is required for such deposition.

FIGS. 2 and 3 are views schematically showing the operation of an inline deposition apparatus for manufacturing an OLED according to the first embodiment of the present invention, FIG. 4 is a cross-sectional view of the vertical rotation shutter unit corresponding to FIG. And FIG. 5 is a view showing a state in which the vertical rotation shutter unit corresponding to FIG. 3 is closed.

Referring to these drawings, the inline deposition apparatus for OLED manufacturing according to the present embodiment can solve the drawback that the footprint of the chamber 100 becomes large while easily securing the circulation path of the refrigerant through a simple structure, A deposition process for the substrate proceeds and includes a chamber 100 in which a plurality of partition walls 102 are formed in an upper region, a plurality of evaporation sources 110 disposed in a lower region in the chamber 100, And a shutter unit 180.

The substrate used in the present embodiment may be a substrate for an organic light emitting display (OLED) as described above.

The chamber 100 is the location where the deposition process for the substrate proceeds. In the case of this embodiment, a horizontal upward deposition method is proposed in which a deposition process is performed on a substrate by an evaporation material that is directed upward after the substrate is horizontally disposed.

However, the scope of the present invention may also be applied to a deposition apparatus to which a vertical type deposition method, in which substrates such as a mask 110 are vertically or obliquely arranged and then deposited, is applied.

The interior of the chamber 100 forms a vacuum atmosphere so that the deposition process for the substrate can proceed reliably.

To this end, a vacuum pump 101a is connected to the lower portion of the chamber 100 as means for maintaining the interior of the chamber 100 in a vacuum atmosphere. The vacuum pump 101a may be a so-called cryopump.

The side walls of the chamber 100 are provided with gates 101c and 101d through which the substrate enters and exits.

A plurality of partition walls 102 are disposed in the upper region in the chamber 100 with a space S interposed therebetween. A plurality of partition walls 102 are provided so as to provide four spacing spaces S and a plurality of partition walls 102 are formed in the lower portion of the spacing spaces S by the number of the spacing spaces S, ).

The evaporation source 110 is disposed in a lower region in the chamber 100 and serves to provide evaporation material toward the spacing space S.

In this embodiment, the evaporation source 110 injects the evaporation material upwardly in a fixed position, and instead is deposited in an inline manner as the substrate moves. To this end, a substrate support module 105 for supporting the substrate is provided.

The substrate support module 105, which may be referred to as a so-called carrier, allows the deposition process to proceed within the chamber 100 as it moves along the gates 101c and 101d of the chamber 100 while supporting the substrate.

The substrate support module 105 will now be briefly described with reference to FIG. The substrate support module 105 serves to support the substrate to be deposited in the chamber 100.

As described above, in this embodiment, the substrate supporting module 105 may be provided in a movable manner to be moved to the upper region of the chamber 100.

The substrate supporting module 105 includes a movable module body 105a, a substrate supporting plate 105b connected to the movable module body 105a and supporting the substrate on one side toward the mask 110, And a substrate grasping portion 105c for grasping the substrate, which is in contact with the plate 105b, at the corresponding position.

The movable module body 105a forms the main skeleton of the substrate supporting module 105. The remaining configurations can be supported by the mobile module body 105a.

The substrate supporting plate 105b is a place where the substrate is supported on the surface. For reference, the substrate can be transferred to the inside of the chamber 100 along a tray transferring unit (not shown) in the form of a roller through a separate tray (not shown) (105b).

In this embodiment, the substrate support plate 105b is applied as a cooling plate 105b. The substrate support plate 105b, which can be applied as a cooling plate 105b, can improve the deposition efficiency by lowering the temperature of the substrate before the actual deposition process is performed on the surface of the substrate.

It is needless to say that the scope of the present invention is not limited to this, so that instead of providing the plate 105b for supporting the substrate with the cooling plate 105b, the cooling water or the cooling air injection line is arranged in the plate 105b for supporting the substrate It is quite possible.

A magnetic force for attracting the mask 110 to the movable module body 105a is generated through the substrate so that the metal mask 110 is in contact with the substrate while the metal mask 110 is in contact with the substrate A magnet array 105d may be further provided. The magnet array 105d allows the mask 110, which is a metal material, to more closely adhere to the substrate through magnetic field formation when the mask 110 and the substrate are in contact with each other, So that it can be prevented from occurring.

The substrate grasping portion 105c is means for holding the substrate placed on the surface of the substrate supporting plate 105b at the corresponding position. Although the substrate grasp portion 105c is shown schematically in the figure, the shape and structure of the substrate grasp portion 105c may vary.

In providing the substrate holding portion 105c, since the substrate has to be substantially in surface contact with the mask 110, it is difficult for the substrate holding portion 105c to obstruct it. Therefore, it is not preferable that the tip end of the substrate holding portion 105c is provided so as to protrude further toward the mask 110 than the surface of the substrate.

The vertical rotation shutter unit 180 is coupled to the barrier ribs 102 and rotates along a direction intersecting the surface of the substrate to selectively open and close the spacing space S. [

As described above, in the inline deposition apparatus according to the present embodiment, an open section (see FIG. 2) opened between the evaporation source 110 and the substrate (see FIG. 2) and a close section See Fig. 3).

As shown in FIG. 2, in the open section where the spacing S is opened, a substantial deposition process is performed in which the evaporation material evaporated in the evaporation source 110 is coated on the substrate. 3, the substrate is transferred while the evaporation material evaporated in the evaporation source 110 is not coated on the substrate, and further, stable evaporation from the evaporation source 110 occurs Be prepared to be.

Meanwhile, in the inline deposition apparatus, the open interval and the close interval are switched for the continuous deposition process on the substrate. In order to realize the open interval and the close interval, the refrigerant circulation path can be easily secured, A plurality of vertical rotating shutter units 180 are applied to solve the disadvantage that the foot print of the chamber 100 becomes large.

In this embodiment, the vertical rotation shutter units 180 are arranged in pairs in the spacing space S. Since four total spacing spaces S are provided in FIGS. 2 and 3, four vertical shutter units 180 may be provided, and they may be operated simultaneously. Of course, it may be considered to operate the vertical rotating shutter unit 180 individually, but it may be desirable to have them operate together for cost and efficiency.

4 and 5, in this embodiment, the vertical rotation shutter unit 180 includes a rotation shaft 181 serving as a cooling water flow, a shutter 182, a pair of rotary supports 183, and a rotary motor 184 ).

The rotation shaft 181 serving as a cooling water flow is a shaft passing through the inside and outside of the chamber 100, and a main cooling line 185 through which cooling water flows is formed therein.

The shutter 182 is connected to the rotation shaft 181 serving as a cooling water flow and is disposed in the space S in the interior of the chamber 100. [ And is opened as shown in FIG. 4 or shielded as shown in FIG. 5 according to the rotating operation of the rotating shaft 181 serving as the cooling water flow.

This shutter 182 is formed with a sub cooling line 186 communicating with the main cooling line 185 of the rotation shaft 181 serving as the cooling water flow.

The sub cooling line 186 provided in the shutter 182 unlike the linear main cooling line 185 has a zigzag shape so as to be arranged over the entire section of the shutter 182. [

The pair of rotary supports 183 are connected to both ends of the rotary shaft 181 serving as a cooling water flow in both outer walls of the chamber 100 to rotatably support the rotary shaft 181 serving as a cooling water flow.

The rotation motor 184 is connected to one end of the rotation shaft 181 serving as a cooling water flow in one outer wall of the chamber 100 to provide power for rotating the rotation shaft 181 serving as a cooling water flow.

It is not necessary to increase the footprint of the chamber 100 as before because the shutter 182 is operated in the direction crossing the plate surface of the substrate by the rotation motor 184 as shown in Figs. 4 and 5, Since the shaft 181 operates the shutter 182 while crossing the inside and outside of the chamber 100, there is no problem in securing the circulation path of the refrigerant. That is, as described above, when the sub cooling line 186 is formed in the shutter 182 by using the inside of the rotation shaft 181 serving as the cooling water flow as the main cooling line 185 to communicate with the main cooling line 185, The circulation path can be easily implemented.

2) and the close section (see FIG. 3) are switched to each other based on the operation of the plurality of vertical rotating shutter units 180 as shown in FIGS. 2 and 3, A continuous vapor deposition process can be performed.

Particularly, according to the inline deposition apparatus for OLED manufacturing according to the present embodiment in which the vertical rotation shutter unit 180 like this embodiment is applied, it is possible to easily obtain the circulation path of the refrigerant through the simple structure, foot print) becomes large.

FIG. 6 is a structural view of an evaporation source applied to an inline deposition apparatus for manufacturing an OLED according to a second embodiment of the present invention, and FIG. 7 is a control block diagram of the evaporation source of FIG.

Referring to these drawings, an evaporation source 210 applied to an inline deposition apparatus for manufacturing an OLED of this embodiment includes a crucible 220, a heater 231, a heater 232, a first evaporation monitor sensor 260, 2 evaporation monitor sensor 270, and a controller 250. [

The crucible 220 is a cup-shaped crucible that is filled with evaporation material deposited on a substrate.

The upper portion of the crucible 220 is opened. The crucible 220 can be made to be narrowed downward, and a lip portion 221 is formed in the upper opening region. The lip portion 221 is a kind of flange having a large surface area.

The evaporation material used in this embodiment may be, for example, a metal evaporation material followed by melting before the evaporation process proceeds.

Particularly, the evaporation material applied in the present embodiment is formed of evaporation materials having high creep characteristics such as aluminum (Al), barium (Ba), germanium (Ge), molybdenum (Mo), selenium (Se) The evaporation device of the flat panel display device of the present embodiment may be formed by injecting the evaporation material into the crucible 220 and then heating the crucible 220 to evaporate the molten metal evaporation material The vapor is produced and deposited on a substrate.

For reference, when the evaporation material in the crucible 220 is reduced due to evaporation during the evaporation process, that is, when the evaporation material is consumed, the uppermost level of the evaporation material is lowered. At this time, As exposure occurs, the vapor is more likely to interfere with the walls in the crucible and the area in which the dissolved material creeps will vary. So that the vapor shape changes.

The heaters 231 and 232 heat the crucible 220 so that the evaporated material contained in the crucible 220 is evaporated while being phase-changed into vapor.

At this time, a plurality of heaters 231 and 232 are arranged along the height direction of the crucible 220 at the periphery of the crucible 220, and the heaters 231 and 232 are individually controlled and operated by the controller 250.

In this embodiment, the heaters 231 and 232 are disposed in the lower peripheral region of the crucible 220 and include a lower heater 231 for heating the lower region of the crucible 220 for controlling the evaporation rate of the evaporative material, And an upper heater 232 disposed in the upper region of the lower heater 231 to heat the upper region of the crucible 220 for adjusting the shape of the vapor of the evaporated material.

In other words, the lower heater 231 is operated while being controlled by the controller 250 for control of the evaporation rate, that is, the amount of evaporation, and the upper heater 232 is operated for vapor shape adjustment, The steam is controlled while being controlled by the controller 250 so that the steam shape can be constant irrespective of the amount of the steam evaporated and consumed.

The second evaporation monitor sensor 170 senses the evaporation amount of the evaporation material to control the evaporation rate of the evaporation material.

The first evaporation monitor sensor 160 is spaced apart from the second evaporation monitor 170 and serves to sense the vapor shape of the evaporation material. The primary function of the first evaporation monitor sensor 160 is to sense the evaporation amount like the second evaporation monitor sensor 170. However, when the vapor shape is changed, the evaporation amount sensed by the first evaporation monitor sensor 160 changes. This phenomenon also occurs when the evaporation amount at which the same evaporation amount is sensed by the second evaporation monitor sensor 170 is the same. That is, when monitoring the sensor in real time with the evaporation process, the evaporation amount is continuously and constantly sensed in the second evaporation monitor sensor 170, whereas when the evaporation amount is continuously increased or decreased in the first evaporation monitor sensor 160, (vapor shape) is changed.

The controller 250 controls the operation time and the heating temperature of the lower heater 231 and the upper heater 232 based on the sensing signals of the first evaporation monitor sensor 260 and the second evaporation monitor sensor 270 do. At this time, the operation time of the lower heater 231 and the upper heater 232, the heating temperature, and the like can be controlled individually.

In particular, the controller 250 controls the operation time, the heating temperature, and the like of the upper heater 232 based on the sensing signal of the first evaporation monitor sensor 260. The controller 250 controls the first evaporation monitor sensor 260 based on the sensing signal of the first evaporation monitor sensor 260 so that the vapor shape of the evaporation material can be maintained constant without being changed even if the evaporation material is consumed while being evaporated in the crucible 220. [ Thereby controlling the operation time of the upper heater 232, the heating temperature, and the like.

The reason why the control of the controller 250 is possible is that the shape of the creeping material varies depending on the temperature gradient of the crucible 220 as described repeatedly, Because.

In addition, the controller 250 can control the operation time and the heating temperature of the lower heater 231 based on the sensing signal of the second evaporation monitor sensor 270.

The controller 250 performing such a role may include a central processing unit 251 (CPU), a memory 252 (MEMORY), and a support circuit 253 (SUPPORT CIRCUIT).

The operation of the evaporation source 210 having such a configuration will be briefly described.

Any material such as aluminum (Al) or silver (Ag) is injected into the crucible 220 and heated by the heaters 231 and 232 to proceed the deposition process.

The first and second evaporation monitor sensors 260 and 270 sense the evaporation amount and transmit the sensing information to the controller 250.

Then, the controller 250 controls the operation time and the heating temperature of the upper and lower heaters 232 and 231 based on the sensing signals of the first and second evaporation monitor sensors 260 and 270.

Even if the evaporation source 210 is applied, the shutter unit 180 can easily provide a refrigerant circulation path through a simple structure and can solve the disadvantage that the foot print of the chamber 100 becomes large. .

Even if the evaporation source 210 as described above is applied, the refrigerant circulation path can be easily secured through a simple structure, and the drawback that the footprint of the chamber 100 becomes large can be solved.

8 is a structural view of an evaporation source applied to an inline deposition apparatus for manufacturing an OLED according to a third embodiment of the present invention.

Referring to this figure, an evaporation source 310 applied to an inline deposition apparatus for manufacturing an OLED according to this embodiment is also provided with a crucible 320, lower and upper heaters 331 and 332, a first evaporation monitor sensor 360, An evaporation monitor sensor 370, and a controller 250 (see FIG. 7).

In this structure, the controller 250 controls the operation time of the upper heater 332, the heating temperature, and the like based on the sensing signal of the first evaporation monitor sensor 360. The controller 250 controls the first evaporation monitor 360 based on the sensing signal of the first evaporation monitor 360 so that the vapor shape of the evaporation material can be maintained constant without being changed even if the evaporation material is consumed while being evaporated in the crucible 320. [ Thereby controlling the operation time of the upper heater 332, the heating temperature, and the like.

In addition, the controller 250 can control the operation time and the heating temperature of the lower heater 331 based on the sensing signal of the second evaporation monitor sensor 370.

At this time, in the present embodiment, a cold region 333 is further disposed on the upper portion of the upper heater 332 in the upper peripheral region of the crucible 320.

The cooling section 333 is formed at a low temperature so that the evaporated material does not evaporate in the section where the lower and upper heaters 331 and 332 are present and the partially diffused material does not overflow, The evaporation source 310 can be prevented from being burned and its durability can be improved.

As described above, when the evaporation source 310 of the present embodiment is applied, even if the evaporation material having the creep characteristic at high temperature is evaporated in the crucible 320 and is consumed, the shape of the vapor remains unchanged, The thickness distribution of the thin film between the chamber 100 and the thin film can be maintained constant. Even if the evaporation source 310 is applied, the refrigerant circulation path can be easily secured through the simple structure, ) Is increased.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Accordingly, such modifications or variations are intended to fall within the scope of the appended claims.

100: chamber 102: partition wall
105: substrate support module 110: evaporation source
180: Vertical rotary shutter unit 181: Rotary shaft for cooling water flow
182: shutter 183:
184: rotation motor 185: main cooling line
186: sub-cooling line

Claims (20)

A plurality of partitions disposed in the upper region of the chamber in which the deposition process for the substrate proceeds, with spaced-apart spaces therebetween;
An evaporation source disposed in a lower region of the chamber to provide evaporation material toward the spacing space; And
And a plurality of vertical rotating shutter units coupled to the partition walls and selectively opening and closing the spaced apart spaces while being rotated along a direction crossing the plate surface of the substrate,
The vertical rotation shutter unit includes:
A rotating shaft for cooling water flowing through the inside and outside of the chamber and having a main cooling line through which cooling water flows; And
And a shutter which is connected to the rotation shaft serving as the cooling water flow and which is disposed in the space in the interior of the chamber and in which a sub cooling line communicating with the main cooling line of the rotation shaft serving as the cooling water flow is formed, Inline deposition apparatus for OLED manufacturing. The method according to claim 1,
Wherein the vertical rotation shutter unit is arranged in a pair in the spaced apart space. delete The method according to claim 1,
Wherein the sub-cooling line in the shutter has a zigzag shape such that it is disposed over the entire section of the shutter. The method according to claim 1,
The vertical rotation shutter unit includes:
A pair of rotating supporters connected to both ends of the rotating shaft serving as the cooling water flow both sides of the chamber and rotatably supporting the rotating shaft serving as the cooling water flow; And
Further comprising a rotation motor connected to one end of the rotation shaft serving as the cooling water flow at one side of the outer wall of the chamber to rotate the rotary shaft serving as the cooling water flow. The method according to claim 1,
Wherein the evaporation process is performed while one of the evaporation source and the substrate is moved relative to the other. The method according to claim 1,
Further comprising a substrate support module disposed in the chamber and supporting the substrate. ≪ RTI ID = 0.0 > 11. < / RTI > 8. The method of claim 7,
The substrate supporting module includes:
Mobile module body;
A substrate support plate coupled to the mobile module body and supporting the substrate on one side toward the mask; And
And a substrate grasping unit for grasping the substrate, which is in contact with the substrate supporting plate, at a corresponding position. 9. The method of claim 8,
Wherein the plate for supporting the substrate is a cooling plate. 9. The method of claim 8,
The substrate supporting module includes:
And a magnet array provided on the substrate supporting plate and generating a magnetic force to attract the mask toward the movable module body with the substrate interposed therebetween such that the mask is in surface contact with the substrate while being in close contact with the substrate In-line deposition apparatus for manufacturing an OLED. The method according to claim 1,
Wherein the evaporation source comprises:
A crucible in which the evaporation material having a creep property at a high temperature is filled inside, an upper portion is opened and made of an insulating material;
A plurality of heaters (heaters) are disposed in the periphery of the crucible and arranged in a plurality of directions along the height direction of the crucible so as to evaporate the vaporized material while being vapor- ); And
And a controller for individually controlling the operation of the plurality of heaters. 12. The method of claim 11,
And a first evaporation monitor sensor disposed at an upper side of the crucible for sensing a vapor shape of the evaporation material,
Wherein the controller individually controls the operation of the plurality of heaters based on a sensing signal of the first evaporation monitor sensor. 13. The method of claim 12,
The controller comprising:
Wherein the operation of the plurality of heaters is controlled individually so that the vapor shape of the vaporized material can be kept constant even if the evaporated material is consumed while being evaporated in the crucible. . 13. The method of claim 12,
Further comprising a second evaporation monitor sensor spaced apart from the first evaporation monitor sensor and sensing evaporation amount of the evaporation material for controlling the evaporation rate of the evaporation material. 15. The method of claim 14,
Wherein the arrangement angles of the first evaporation monitor sensor and the second evaporation monitor sensor are different from each other on the basis of the crucible. 12. The method of claim 11,
Wherein the plurality of heaters comprises:
A lower heater disposed in a peripheral lower region of the crucible and heating a lower region of the crucible to control an evaporation rate of the evaporated material; And
And an upper heater disposed in an upper region of the lower heater for heating an upper region of the crucible in order to adjust a vapor shape of the evaporated material. 17. The method of claim 16,
Further comprising a cold region disposed above the upper heater in a peripheral upper region of the crucible. ≪ RTI ID = 0.0 > 11. < / RTI > The method according to claim 1,
Wherein the evaporation material comprises aluminum (Al), barium (Ba), germanium (Ge), molybdenum (Mo), selenium (Se) or tin (Sn). The method according to claim 1,
Wherein the vertical rotation shutter unit is opened to the opposite side of the evaporation source so as not to collide with the evaporation source during an opening operation. The method according to claim 1,
Wherein the vertical rotating shutter unit is opened in a normal state of the evaporation source and is closed during evaporation preparation so that the operation is repeated so that the process is continuously performed.

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