JP2009019243A - Vapor deposition method and apparatus - Google Patents

Vapor deposition method and apparatus Download PDF

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JP2009019243A
JP2009019243A JP2007183242A JP2007183242A JP2009019243A JP 2009019243 A JP2009019243 A JP 2009019243A JP 2007183242 A JP2007183242 A JP 2007183242A JP 2007183242 A JP2007183242 A JP 2007183242A JP 2009019243 A JP2009019243 A JP 2009019243A
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substrate
deposition
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vapor
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JP5081516B2 (en
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Hiroyasu Matsuura
宏育 松浦
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Hitachi Displays Ltd
株式会社 日立ディスプレイズ
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process
    • C23C14/541Heating or cooling of the substrates
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
    • H01L51/0002Deposition of organic semiconductor materials on a substrate
    • H01L51/0008Deposition of organic semiconductor materials on a substrate using physical deposition, e.g. sublimation, sputtering
    • H01L51/001Vacuum deposition
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/50Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED];
    • H01L51/56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof

Abstract

<P>PROBLEM TO BE SOLVED: To provide a vacuum deposition method and a vapor deposition apparatus which cause little deposition misalignment even at continuous production, yield a good film thickness distribution within a pixel and cause little waste of materials. <P>SOLUTION: The vacuum deposition method comprises a step of fixing an evaporation source unit 100 inside a vacuum chamber 1; and, while moving a substrate 4 across vapor 3 from an evaporation source, depositing the vapor 3 from the evaporation source onto prescribed points of the substrate 4. The vacuum deposition apparatus has a deposition mask 5 placed on the substrate 4 at the side of the evaporation source unit 100, a means for moving a mask frame 7 by a plurality of rollers 13 inside a vacuum chamber 1 and a cooling plate 11 installed in the path of the mask frame 7, provided that the cooling plate 11 has a cooling means installed close to but out of contact with a surface of the mask frame 7 on the side of the evaporation source unit 100. The cooling plate 11 has apertures 60 formed locally near the evaporation source unit 100. The vapor 3 generated by the evaporation source 2 is sprayed onto the deposition mask 5 and the substrate 4 through an aperture 70 of a cooling plate 14 of the evaporation source unit 100. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、蒸着方法および蒸着装置にかかり、特に有機エレクトロルミネッセンス素子を構成する有機材料層の形成に好適なものである。 The present invention relates to a deposition method and the vapor deposition apparatus is suitable especially formation of the organic material layer constituting the organic electroluminescence element.

有機エレクトロルミネッセンス(以下、有機EL)表示素子は、電流駆動される有機EL素子を2次元に配置して画像を表示するものである。 Organic electroluminescence (hereinafter, organic EL) display device is to display an image by arranging the organic EL element is current driven two-dimensionally. 有機EL素子は、通常、ガラス等の絶縁性の基板(画素駆動用の薄膜トランジスタなどが形成されるアクティブ基板)に形成した一対の電極の一方の電極上に正孔注入層、正孔輸送層、発光層、電子輸送層、電子注入層の有機材料薄膜(有機膜)を順次成膜し、この積層膜の積層構造の最上層に一対の電極の他方の電極膜を形成したものである。 The organic EL element is generally a hole injection layer on the one electrode of the pair of electrodes formed on an insulating substrate such as glass (active substrate such as thin film transistors for driving pixels are formed), a hole transport layer, emitting layer, an electron transport layer, an organic material thin film (organic film) are sequentially deposited the electron injection layer, and forming the other electrode film of the pair of electrodes on the uppermost layer of the laminated structure of the laminated film. 他方の電極膜の上方には、有機EL素子を外部雰囲気から遮断して湿気等の侵入を抑制する封止缶とも呼ばれる封止基板が設置される。 Above the other electrode film, a sealing substrate, also referred to as inhibiting sealing can intrusion of such moisture to protect the organic EL element from the outside atmosphere is established.

この積層構造を挟持して形成される前記一対の電極により当該積層構造の積層方向に電流を流す。 Flowing a current in the lamination direction of the laminated structure by the pair of electrodes formed to sandwich the laminated structure. 当該一対の電極の少なくとも一方は、アクティブ基板側に表示光を出射する、所謂ボトムエミッション型では透明な(可視光を通し易い)電極で構成される。 At least one of the pair of electrodes emits display light to the active substrate, and a transparent (likely through visible light) electrode is a so-called bottom emission type. 封止基板もまた透明基板であることは言うまでもない。 It goes without saying sealing substrate is also transparent substrate.

より具体的には、ガラスやプラスチックスからなる透明基板上に画素毎に形成された一方の電極である第1電極(通常は陽極)の上に正孔注入層、正孔輸送層、発光層、電子輸送層、電子注入層を積層して発光層を構成する。 More specifically, a hole injection layer on the first electrode which is one electrode formed for each pixel on a transparent substrate made of glass or plastic (usually an anode), a hole transport layer, luminescent layer , an electron transport layer, by laminating the electron injection layer constituting the light emitting layer. そして、電子注入層(上記積層構造の最上層)の上を他方の電極である第2電極(通常は陰極)で覆って、当該第1電極と第2電極の間に電流を流す。 Then, covered with the electron injection layer and the second electrode is the other electrode on the (top layer of the laminated structure) (usually a cathode), a current flows between the said first and second electrodes. これにより、当該積層構造(発光層)に注入されたキャリア(電子と正孔)が再結合し、光が発せられる。 Accordingly, the multilayer structure carriers injected into (light emitting layer) (electrons and holes) are recombined, light is emitted. 表示光を封止基板と反対側に出射する、所謂トップエミッション型の場合は第1では金属膜からなる反射性電極であり、アクティブ基板もまた透明でなくてもよい。 Emits display light to the sealing substrate opposite in the case of so-called top emission type is reflective electrode made of the first in the metal film, may not be active substrate is also transparent. なお、以下では、特に必要な場合を除いてアクティブ基板を単に基板と称する。 In the following, simply referred to as a substrate an active substrate except where particularly necessary.

有機膜は、一般的に真空蒸着法により形成される。 The organic film is formed by a general vacuum deposition method. 基板上に形成される上記積層構造をなす有機材料層の各々は、真空雰囲気を保持した容器である真空チャンバ内に設置された蒸着源ユニットの蒸着坩堝内の有機材料を材料の蒸発温度付近まで加熱して蒸発させ、これを当該真空チャンバ内に導入された基板の主面上に蒸着させて、形成される。 Each of the organic material layer constituting the laminated structure formed on the substrate, the organic material deposition crucible of the deposition source unit installed in the vacuum chamber is a container holding a vacuum atmosphere to near material evaporation temperature of heating to evaporate, which is evaporated on the main surface of the substrate introduced into the vacuum chamber, is formed. 詳細には、真空チャンバ内に導入された基板の主面上に、当該主面における画素配置に対応したパターンで開口された所謂メタルマスクと呼ばれる金属材料で構成したマスクが配置される。 Specifically, on the main surface of the substrate that has been introduced into the vacuum chamber, the mask is constituted by a metal material called apertured so-called metal mask in a pattern corresponding to a pixel arrangement in the major surface is arranged.

前記蒸発した有機材料は、このマスクの開口を通して、当該基板の主面における指定された領域(例えば、個々の画素に対応する部分)に当該有機材料の薄膜として蒸着される。 The organic materials mentioned above evaporation through openings in the mask, the area specified in the main surface of the substrate (e.g., a portion corresponding to each pixel) is deposited as a thin film of the organic material. なお、前記した発光層を蒸着する場合には、主材料となる有機材料と添加材料(例えば、他の有機材料)とを、基板主面の前記指定された領域に同時に蒸着することもある。 In the case of depositing the light emitting layer described above is an organic material and additive material as a main material (e.g., other organic materials) and, sometimes simultaneously deposited on the designated area of ​​the substrate major surface.

メタルマスクは、その平面の平坦性を維持するために、金属製の枠であるマスクフレームにテンションをかけた状態で接着または溶接される。 Metal mask, in order to maintain the planarity of the plane, are bonded or welded while applying a tension to the mask frame is a metal frame. 以下、メタルマスクとマスクフレームの複合体を蒸着マスクと記述する。 Hereinafter referred to as the vapor deposition mask a complex of the metal mask and the mask frame.

前記蒸着坩堝は、有機材料を収容する蒸発用容器を備え、その蒸発用容器に収容された有機材料を蒸発させて、真空チャンバ内に置かれた基板上に有機化合物の蒸着膜を形成する。 The deposition crucible is provided with evaporation vessel containing organic material, the the organic material contained in the evaporation vessel is evaporated to form a deposited film of an organic compound on a substrate placed in a vacuum chamber. この蒸発用容器には、その内部で蒸発された有機材料が真空チャンバ内へ蒸散する方向性と量を規制する噴出口(ノズル部)が設けられる。 This evaporation container spout organic material evaporated in the inside thereof to regulate the direction and amount of evaporation into the vacuum chamber (nozzle portion) is provided.

一般的に、真空蒸着法には、クラスタ方式とインライン方式の2つに大別できる。 Generally, the vacuum deposition method can be divided into two clusters method and line system. 特許文献1に記載されたクラスタ方式では、中央に搬送用の真空チャンバ(搬送室)を有し、それを中心に成膜用の真空チャンバ(成膜室)が配置される。 In a cluster system described in Patent Document 1, it has a vacuum chamber for conveying the center (transport chamber), a vacuum chamber for film deposition (film forming chamber) is placed in the center it. 中央搬送室にはロボットが設けられ、基板のみを枚葉搬送する。 Robot is provided in the central transfer chamber, to single wafer convey the substrate only. 基板を最初に加熱室で加熱し、次に酸素プラズマ処理室に搬送して表面のコンディショニングを行い、その後、冷却室で基板を冷却した後に別のクラスタ装置に搬送して成膜処理を行う。 Initially heated in the heating chamber substrate performs conditioning of the surface and then transported to an oxygen plasma treatment chamber, then, the film formation process is transported to another cluster device after cooling the substrate in the cooling chamber.

成膜する時には、各成膜室内では、まず成膜室毎に用意した蒸着マスクと基板とをアライメントし、重ね合わせてから成膜する。 When film formation in each deposition chamber, aligns first deposition mask prepared for each film forming chamber and the substrate is deposited from superposed. 特許文献1では成膜前に基板を事前に冷却することにより、基板の熱膨張によるずれを防止していた。 By cooling the substrate in advance before patent deposited in Document 1, it has been prevented displacement due to thermal expansion of the substrate. 成膜については、基板側を固定して蒸着源をスキャンして成膜する方法と基板側を固定させて蒸着源を固定する方法が実用化されている。 For film formation, a method of fixing the evaporation source is fixed to the method and the substrate-side of forming a film by scanning the evaporation source to fix the substrate side has been put into practical use.

特許文献2に記載されたインライン方式では、成膜処理する順番に成膜室を配置し、蒸着マスクと基板を重ね合わせた複合体をキャリアに固定し、各成膜室に設置した搬送ローラによってキャリアを搬送する。 In the line system described in Patent Document 2, the film forming chamber is arranged in the order of film forming process, a composite superposed deposition mask and the substrate was fixed to the carrier by the transfer roller installed in respective film forming chambers to convey the carriers. 各成膜室には固定した蒸着源を有し、キャリアが蒸着源の前を通過することにより成膜が行われる。 Each deposition chamber has a fixed vapor deposition source, the carrier film is formed by passing in front of the deposition source.

クラスタ方式では、搬送室と成膜室との間で基板の受渡しがあり、その後各成膜室で蒸着マスクとのアライメントする動作必要があり、連続的に基板を処理する場合、インライン方式の方がスループットおよび材料の利用面で効率がよい。 In a cluster system, there is transfer of the substrate between the transport chamber and the deposition chamber, there is then required operation of aligning the deposition mask in each deposition chamber, when continuously processing a substrate, who line system There is efficient in use surface of throughput and material.

一方、真空蒸着では、画素毎に成膜する膜を変更する場合、基板と蒸着マスクの双方が温度上昇し、熱膨張によりずれが生じることが問題となる。 On the other hand, in the vacuum deposition, when changing the film formed for each pixel, a substrate with both deposition mask is increased temperature, displacement due to thermal expansion that may occur a problem. 特許文献3では、基板と対向する坩堝に基板方向に向けた突出部を設け、突出部に蒸気を放出する穴を設け、突出部の周囲に放射熱を阻止する構造物を設け、基板や蒸着マスクへの温度上昇を低減する方法が提案されている。 In Patent Document 3, a protrusion directed toward the substrate provided in the crucible to the substrate and the counter, a hole for releasing steam formed in the protruding portion, provided with a structure which prevents radiant heat around the protruding portion, the substrate and deposition how to reduce the temperature rise of the mask has been proposed.
特開2006−260939号公報 JP 2006-260939 JP 特開2002−348659号公報 JP 2002-348659 JP 特開2004−214185号公報 JP 2004-214185 JP

図8は、インライン方式の従来の蒸着装置を説明する基板進行方向の模式断面図である。 Figure 8 is a schematic cross-sectional view of the substrate traveling direction illustrating a conventional deposition apparatus of an inline type. 図9は、蒸着マスクに起因するシャドー効果による画素周辺部の膜厚減少を説明する図である。 Figure 9 is a diagram illustrating the decrease in film thickness of the pixel peripheral portion by the shadow effect due to the evaporation mask. なお、図9の(a)は図8の一つのキャリアユニット200部分を、図9の(b)は図9の(a)の丸で囲んだ1画素部分の拡大図である。 Incidentally, FIG. 9 (a) is a single carrier unit 200 portion in FIG. 8, (b) in FIG. 9 is an enlarged view of one pixel portion surrounded by a circle in (a) of FIG. 図8において、真空チャンバー1の内部に蒸着源ユニット100が設置されている。 8, the deposition source unit 100 is installed in the vacuum chamber 1. 蒸着源ユニット100は、蒸着源2と冷却板14およびリフレクタ15で構成される。 Deposition source unit 100 is composed of deposition source 2 and the cooling plate 14 and the reflector 15. 冷却板14の上方を搬送される基板4側には上記噴出口が形成され、この噴出口から蒸気3が噴出す。 The substrate 4 that is conveyed over the cooling plate 14 the spout is formed, the steam 3 to jet from the spout. 基板4の蒸着源ユニット100側に近接して蒸着マスク5が配置される。 Vapor deposition mask 5 is arranged close to the deposition source unit 100 side of the substrate 4. 蒸着マスク5は、メタルマスク6とこのメタルマスク6を架張保持するマスクフレーム7で構成される。 Evaporation mask 5 is composed of a mask frame 7 which stretched holding the metal mask 6 the metal mask 6.

蒸着マスク5はプレート9と磁石10でメタルマスク6に密着される。 Evaporation mask 5 is adhered to the metal mask 6 by the plate 9 and the magnet 10. この蒸着マスク5は搬送ローラ13上を矢印A方向に移動するキャリア8に載置されてら噴出する蒸気3の上を搬送される。 The evaporation mask 5 is conveyed over the vapor 3 is ejected is placed on the carrier 8 moving on the conveying rollers 13 in the direction of arrow A et. 基板4を載せたキャリア8をキャリアユニット200と称する。 The carrier 8 which carries the substrate 4 is referred to as a carrier unit 200. 図8に示すように、成膜処理を重ねて行く過程でキャリア8に搭載された蒸着マスク5と基板4は、250℃から400℃に加熱した蒸着源2からの放射熱によって温度が上昇する。 As shown in FIG. 8, the evaporation mask 5 and the substrate 4 mounted on the carrier 8 in the process of overlapping the deposition process, the temperature is increased by radiant heat from the evaporation source 2 was heated from 250 ° C. to 400 ° C. .

一般的に、ガラスを好適とする基板4と金属である蒸着マスク5とは熱膨張率が異なる。 Generally, the thermal expansion coefficient different from the substrate 4 and the evaporation mask 5 is a metal which is preferably glass. そのため、双方の温度上昇により目標とする画素に対する蒸着ずれが生じる。 Therefore, deposition deviation for the pixel as a target by the temperature increase of both results. また、成膜は真空で行われ、キャリア8、蒸着マスク5、基板4は温度上昇して行く。 Further, the deposition is carried out in a vacuum, the carrier 8, the evaporation mask 5, the substrate 4 rises temperature. さらに、キャリア8と蒸着マスク5は真空雰囲気下で保管しておいて、繰り返し使用するため、キャリア8と蒸着マスク5の放熱は困難であり、長期間の連続運転で、成膜開始時と終了時で画素に対する成膜位置のずれが生じてしまう。 Further, a carrier 8 evaporation mask 5 Retain in a vacuum atmosphere, for repeated use, the heat radiation between the carrier 8 evaporation mask 5 is difficult, long-term continuous operation, the start and end deposition displacement of the deposition positions for the pixels occurs when.

また、蒸着源から発生する蒸気の指向性が小さく、幅広い範囲に蒸気が到達する場合、図9の(b)に示すように、基板4が蒸着源2から遠い時点から蒸着が始まると、メタルマスクの影32が生じ、蒸着膜30については画素内の周辺部の膜厚が薄くなる現象(シャドー効果)が生じる。 Also, small directivity of the steam generated from the evaporation source, if the steam to a wide range is reached, as shown in (b) of FIG. 9, the substrate 4 is deposited starts from a distant point from the evaporation source 2, the metal mask shadow 32 occurs, the phenomenon that the film thickness of the peripheral portion of the pixel is reduced (shadow effect) occurs for deposition film 30. 膜厚に分布が生じると、一対の電極間に電流を流した時に、膜内で電流密度に分布が生じ、膜の薄い部分の発光量が大きく、部分的に劣化が促進される。 If the film thickness distribution occurs, when a current is passed between the pair of electrodes, the distribution of current density in the film occurs, large light emission amount of the thin portion of the film, partially degraded is promoted.

シャドー効果を防ぐためには、メタルマスク6の蒸着源側の孔の開口部を拡大させてテーパ角31を持たせ、メタルマスク6の影が生じないようにするか、蒸着源2の蒸気3の指向性を高くして蒸着できる範囲を狭める方法が挙げられる。 To prevent a shadow effect, by enlarging the opening of the deposition source side of the holes of the metal mask 6 to have a taper angle 31, or to prevent the occurrence the shadow of the metal mask 6, the steam 3 in the evaporation source 2 how narrow the range that can be increased to depositing the directivity and the like. しかし、有機ELパネルの高精細化に伴いメタルマスク6の孔ピッチは狭まるが、メタルマスク6の板厚は強度の問題があるため、薄くすることが困難であり、対応に限界がある。 However, although narrow hole pitch of the metal mask 6 due to the high definition of the organic EL panel, for the plate thickness of the metal mask 6 have a strength problem, it is difficult to thin, there is a limit to the corresponding. 蒸気3の指向性を高くするためには、蒸着源2における坩堝の噴出口(ノズル)の深さを大きくとり、ノズルの径(または幅)を小さくすることで対応するが、ノズル内面の微小な凹凸により所望よりも広い範囲に蒸気が拡散する。 In order to increase the directivity of the vapor 3 is made large the depth of the crucible ejection ports (nozzles) in the evaporation source 2, corresponding by reducing the diameter of the nozzle (or width) of the nozzle inner surface micro vapor is diffused into a wider range than desired irregularities.

本発明の目的は、基板、蒸着マスク、キャリアの温度上昇を低減し、基板への蒸着位置のずれが押さえて製品品質を安定化した有機EL表示装置の製造に好適な蒸着方法および蒸着装置を提供することにある。 An object of the present invention, a substrate, a deposition mask, reduces the temperature rise of the carrier, a preferred deposition method and the vapor deposition apparatus to manufacture an organic EL display device to stabilize the product quality pressing the deviation of deposition position of the substrate It is to provide.

上記の目的を達成するための本発明の代表的な蒸着方法および蒸着装置は以下の通りである。 Exemplary deposition methods and deposition apparatus of the present invention for achieving the above object are as follows. 本発明は有機EL素子の発光層を構成する有機材料の積層構造の形成に好適なものである。 The present invention is suitable for the formation of the laminated structure of the organic material constituting the light emitting layer of the organic EL element. すなわち、 That is,
方法1:真空雰囲気を保持した容器内に設置した蒸着源ユニット内に蒸着源となる材料を固定し、該蒸着源ユニットの蒸気噴出口から噴出する蒸気を横切って蒸着対象の基板を移動させている間に該基板の所定個所に前記材料を蒸着する。 Method 1: a material comprising a deposition source within the deposition source unit installed in the container which holds the vacuum atmosphere is fixed, by moving the substrate of the deposition target across the steam jetted from the steam jetting port of the vapor deposition source unit the material is deposited in a predetermined location of the substrate while in. この際、前記基板に対して、前記材料を蒸着する個所に対応した孔が開いたシートと該シートを平面に保持するマスクフレームを備えた蒸着マスクを密着させて設置し、 At this time, with respect to the substrate, is placed in close contact with the deposition mask comprising a mask frame for holding the sheet and the sheet of holes corresponding opens in place of depositing the material plane,
前記真空雰囲気を保持する容器に設けた複数のローラを有する移動手段で前記マスクフレームを移動し、 The mask frame to move with the moving means having a plurality of rollers provided in the container for holding the vacuum atmosphere,
前記マスクフレームが移動する軌道上で、前記マスクフレームの前記蒸着源側の面に対して非接触かつ近接して設けた冷却手段を持ち、前記蒸着源の近傍に部分的に開口部を有する冷却プレートの該開口部を通じて前記蒸着源ユニットの上記蒸気噴出口から噴出した前記材料の蒸気を前記蒸着マスク及び前記基板に吹き付けることを特徴とする。 In orbit the mask frame is moved, cooled with the non-contact and to the plane of the evaporation source side has a cooling means arranged in close proximity, partially opening in the vicinity of the deposition source of the mask frame wherein the blowing vapor of the material ejected from the steam ejection port of the deposition source unit through the opening of the plate in the deposition mask and the substrate.

方法2:真空雰囲気を保持した容器内に設置した蒸着源ユニット内に蒸着源となる材料を固定し、該蒸着源ユニットの蒸気噴出口から噴出する蒸気を横切って蒸着対象の基板の移動させることにより、該基板の所定個所に前記材料を蒸着する。 Method 2: The material comprising an evaporation source in a vapor deposition source unit was placed in a container holding the vacuum atmosphere is fixed, moving the substrate of the deposition target across the steam jetted from the steam jetting port of the vapor deposition source unit by, depositing said material in a predetermined location of the substrate. この際、前記基板に対して、前記材料を蒸着する個所に対応した孔が開いたシートと該シートを平面に保持するマスクフレームを備えた蒸着マスクを密着させて設置し、 At this time, with respect to the substrate, is placed in close contact with the deposition mask comprising a mask frame for holding the sheet and the sheet of holes corresponding opens in place of depositing the material plane,
前記真空雰囲気を保持する容器に設けた複数のローラと開口部を有して前記蒸着マスクを密着させて搬送するキャリアで前記マスクフレームを移動し、 Wherein moving the mask frame a vacuum atmosphere having a plurality of rollers and an opening portion provided in the container for holding a carrier to transport in close contact with the deposition mask,
前記マスクフレームが移動する軌道上で、前記マスクフレームの前記蒸着源側の面に対して非接触かつ近接して設けた冷却手段を持ち、前記蒸着源の近傍に部分的に開口部を有する冷却プレートの該開口部を通じて前記蒸着源ユニットの上記蒸気噴出口から噴出した前記材料の蒸気を前記蒸着マスク及び前記基板に吹き付けることを特徴とする。 In orbit the mask frame is moved, cooled with the non-contact and to the plane of the evaporation source side has a cooling means arranged in close proximity, partially opening in the vicinity of the deposition source of the mask frame wherein the blowing vapor of the material ejected from the steam ejection port of the deposition source unit through the opening of the plate in the deposition mask and the substrate.

本発明の蒸着方法では、上記方法1又は2において、前記蒸着源の近傍に設ける前記冷却プレートの開口部の前記基板の進行方向の幅が、前記蒸着源のユニットの前記蒸気噴出口の前記基板の進行方向の幅より大きく、前記基板の進行方向の長さよりも小さいことを特徴とする。 The deposition method of the present invention, in the above method 1 or 2, wherein the width of the traveling direction of the substrate of the opening of the cooling plate, the substrate of the steam ejection port of the unit of the evaporation source provided in the vicinity of the deposition source greater than the traveling direction of the width, and wherein the less than the length of the traveling direction of the substrate. 前記真空雰囲気を形成する容器の外側から前記搬送用のローラ内部に冷却液を循環させて冷却することを特徴とする。 Wherein the outside of the container to form a vacuum atmosphere by circulating a cooling fluid to the roller interior for the transport, characterized in that cooling.

蒸着装置1:真空雰囲気を保持した容器内に設置した蒸着源ユニット内に蒸着源となる材料を固定し、該蒸着源ユニットの蒸気噴出口から噴出する前記材料の蒸気を横切って蒸着対象の基板を移動させている間に該基板の所定個所に前記材料を蒸着する装置である。 Deposition apparatus 1: a material for the deposition source within the deposition source unit installed in the container which holds the vacuum atmosphere is fixed, the substrate across the vapor deposition target of the material to be ejected from the steam ejection port of the vapor deposition source unit a device for depositing the material in a predetermined location of the substrate while moving the. そして、前記基板へ前記材料を蒸着する個所に対応した孔が開いたシートと該シートを平面に保持するマスクフレームを備えた蒸着マスクと、 Then, a deposition mask having a mask frame for holding the sheet and the sheet of holes corresponding opens in place of depositing the material into the substrate in a plane,
前記基板の前記蒸着源側に設置して該基板と該蒸着マスクを密着させる蒸着マスク密着手段と、 A deposition mask contact means for adhering the the vapor deposition mask and the installed substrate in the deposition source side of the substrate,
前記真空雰囲気を保持する容器に設けた複数のローラによるマスクフレームの移動手段と、 And moving means of the mask frame by a plurality of rollers provided in the container for holding the vacuum atmosphere,
前記マスクフレームの前記蒸着源側の面に対して非接触かつ近接するように設けた冷却手段を持つと共に該蒸着源の近傍に部分的な開口部を有して前記マスクフレームが移動する軌道上に設けた冷却プレートとを有し、 Orbit said mask frame has a partial opening in the vicinity of the vapor deposition source with respect to the surface of the deposition source side with cooling means which is provided to non-contact and close proximity to the movement of the mask frame and a cooling plate provided in,
前記冷却プレートの前記開口部を通じて前記蒸着源で発生した前記材料の蒸気を前記蒸着マスク及び前記基板に吹き付けることを特徴とする。 Wherein the blowing vapor of the material generated in the deposition source through the opening of the cooling plate on the deposition mask and the substrate.

蒸着装置2:真空雰囲気を保持した容器内に設置した蒸着源ユニット内に蒸着源となる材料を固定し、該蒸着源の蒸気を横切るように蒸着対象の基板の移動させることにより、該基板の所定個所に前記材料を蒸着する装置である。 Deposition apparatus 2: a material comprising a deposition source within the deposition source unit installed in the container which holds the vacuum atmosphere is fixed, by moving the substrate in the deposition target across the vapor of the vapor deposition source, the substrate a device for depositing the material into a predetermined position. そして、この蒸着装置は、前記基板へ前記材料を蒸着する個所に対応した孔が開いたシートと該シートを平面に保持するマスクフレームを備えた蒸着マスクと、 Then, the deposition apparatus includes a deposition mask comprising a mask frame for holding the sheet and the sheet of holes corresponding opens in place of depositing the material into the substrate in a plane,
前記基板の前記蒸着源側に設置して該基板と該蒸着マスクを密着させる蒸着マスク密着手段と、 A deposition mask contact means for adhering the the vapor deposition mask and the installed substrate in the deposition source side of the substrate,
前記基板の前記蒸着源側に前記蒸着マスクを密着し、開口部を有して搬送するキャリアと、 The deposition mask in close contact with the evaporation source side of the substrate, and a carrier for transporting has an opening,
前記真空雰囲気を保持する容器には複数のローラによる前記キャリアの移動手段と、 And moving means of the carrier by a plurality of rollers in a container for holding the vacuum atmosphere,
前記マスクフレームが移動する軌道上に設けて前記キャリアの前記蒸着源側の面に対して非接触かつ近接して設けた冷却手段を持つと共にがい蒸着源の近傍に部分的に開口部を有する冷却プレートとを有し、 Cooling with partial opening in the vicinity of the outer deposition source with with a non-contact and close proximity to the cooling means arranged to the plane of the deposition source side of the carrier is provided on the track of the mask frame moves and a plate,
前記冷却プレートの前記開口部を通じて蒸着源ユニットの前記噴出口から噴出した前記材料の蒸気を前記蒸着マスク及び前記基板に吹き付けることを特徴とする。 Wherein the blowing vapor of the material ejected from the ejection port of the deposition source unit through the opening of the cooling plate on the deposition mask and the substrate.

本発明の蒸着装置では、上記装置1又は2において、前記蒸着源の近傍に設ける前記冷却プレートの前記開口部の前記基板の進行方向の幅が、前記蒸着源ユニットの前記噴出口の幅より大きく、前記基板の進行方向の長さよりも小さいことを特徴とする。 In the vapor deposition apparatus of the present invention, in the apparatus 1 or 2, wherein the width of the traveling direction of the substrate of the opening of the cooling plate provided in the vicinity of the deposition source is greater than a width of the ejection port of the deposition source unit , characterized in that less than the length of the traveling direction of the substrate. また、前記真空雰囲気を形成する容器の外側から搬送用のローラ内部に冷却液を循環させて冷却する機能を持つことを特徴とする。 Further, characterized by having a function of cooling by circulating a cooling fluid to the roller inside the conveyance from the outside of the container forming the vacuum atmosphere.

なお、本発明の蒸着装置では、前記マスクフレームと前記冷却プレートの該マスクフレーム側、および/または、前記マスクフレームと前記キャリアの該マスクフレームに対向する面および前記冷却プレートの前記キャリア側に黒色の皮膜を有することを特徴とする。 In the vapor deposition apparatus of the present invention, the said mask frame side of the mask frame and the cooling plate, and / or black in the carrier side of the opposing surfaces and said cooling plate to the mask frame of the said mask frame carrier It characterized in that it has a coating.

本発明によれば、いわゆるインライン式の真空蒸着において、真空チャンバに設置した冷却板をキャリア又は蒸着マスクのフレームに対して、その搬送と成膜中には近接させた状態となる。 According to the present invention, in the vacuum deposition of a so-called line type, a cooling plate that is placed in a vacuum chamber with respect to the frame of the carrier or deposition mask, the state of being close during its transport and deposition. このため、従来に比べて高温の蒸着源からの放射熱が基板、蒸着マスク、キャリアへ伝達するのを抑制でき、同時に蒸着マスク又はキャリアについては、冷却板への放射による冷却が期待できる。 Therefore, radiant heat substrate from the hot evaporation source as compared with the conventional evaporation mask, can be prevented from being transmitted to the carrier, for simultaneous evaporation mask or carrier, cooling can be expected by radiation to the cooling plate. また、搬送用のローラ自体に冷却機能を持たせれば、更に冷却効果が高くなる。 Also, if no cooling function on the roller itself for transport, further cooling effect is increased.

これらにより、基板、蒸着マスク、キャリアへのプロセス中での温度上昇が低減されるため、蒸着位置のずれが抑制される。 These substrate, the evaporation mask, the temperature rise in the process of the carrier is reduced, the deviation of the deposition position is suppressed. さらに、蒸着マスクとキャリアを繰り返し使用した場合の温度変化も低減できるため、成膜開始時と終了時で蒸着ずれの変化も低減でき、製品品質が安定化する。 Furthermore, since it is possible to temperature change be reduced when using repeated deposition mask and the carrier, the elapse of deposition shifted in at the beginning and end deposition can be reduced, product quality is stabilized.

蒸着源上方の蒸着したい領域に冷却板の開口部を設けることにより、蒸発源のノズルで制御しきれずに幅広く拡散してしまう蒸気をカットし、必要な範囲だけに蒸着できるようになる。 By providing the opening of the cooling plate in the region to be deposited in the deposition source upwardly to cut a wide spread to become vapor without being completely controlled by the nozzle of the evaporation source, it becomes possible to deposition only on the extent necessary. これにより、基板の進行方向におけるシャドー効果が低減できるため、画素内の蒸着膜厚の分布が低減し、素子特性が安定化し、超寿命な素子を製造することが可能になる。 Thus, it is possible to shadow effect is reduced in the traveling direction of the substrate, to reduce the distribution of the deposited film thickness in the pixels, device characteristics is stabilized, it is possible to manufacture a long-life elements.

以下、本発明にかかる蒸着方法と蒸着装置の最良の実施形態について、蒸着装置の実施例の図面を参照して詳細に説明する。 DETAILED DESCRIPTION embodiment of the deposition apparatus and the deposition method according to the present invention will be described in detail with reference to the drawings showing the embodiments of the deposition apparatus.

図1は、本発明にかかる蒸着装置の実施例1を説明する断面図である。 Figure 1 is a sectional view for explaining an embodiment 1 of a vapor deposition device according to the present invention. また、図2は、図1を上側からみた平面図である。 2 is a plan view of the FIG. 1 from above. 真空雰囲気を保持する容器である真空チャンバ1の内部には蒸着源ユニット100が設置される。 The interior of the vacuum chamber 1 is a container for holding a vacuum atmosphere deposition source unit 100 is installed. 蒸着源ユニット100の内部には蒸着源となる材料が固定され、蒸着源ユニット100には蒸気の噴出ノズルである蒸気噴出口70を有する。 Inside the deposition source unit 100 is a material which serves as an evaporation source is fixed, the deposition source unit 100 has a vapor jet port 70 is a spray nozzle of the steam. 真空チャンバ1の内部で蒸着源ユニット100の上方には搬送ローラ13で矢印Aで示した移動方向に搬送されるキャリアセット200が配置される。 Above the deposition source unit 100 inside the vacuum chamber 1 carrier set 200 is conveyed in the direction of movement indicated by the arrow A by the transport roller 13 is disposed.

搬送されるキャリアセット200の上記蒸着源ユニット100側に近接して冷却板11が一体に設置される。 Close to the deposition source unit 100 side of the carrier set 200 to be conveyed cooling plate 11 is installed integrally. 冷却板11の蒸着源ユニット100側には、冷却板11への蒸気の付着を防止する防着板12が設けてある。 The deposition source unit 100 side of the cooling plate 11, are deposition preventing plate 12 for preventing adhesion of vapor to the cooling plate 11 is provided. 蒸気噴出口70から噴出する蒸気3を横切って蒸着対象の基板4を矢印A方向に移動させている間に、冷却版11の開口部60を通して、かつ蒸着マスク5を通して該基板4の所定個所に前記材料を蒸着する。 The substrate 4 of a deposition target across the steam 3 to be ejected from the steam ejection port 70 while moving in the direction of arrow A, through the opening 60 of the cooling plate 11, and a predetermined position of the substrate 4 through a vapor deposition mask 5 depositing the material. 蒸着源2を固定し、該蒸着源2の真空チャンバ1への取り付け面に対して、蒸着源2は垂直方向に蒸気3を供給する。 The evaporation source 2 is fixed relative to the mounting surface of the vacuum chamber 1 of the vapor deposition source 2, the evaporation source 2 supplies steam 3 in the vertical direction.

上記したように、中央部に開口部を持つキャリア8の上に蒸着マスク5と成膜される基板4が固定される。 As described above, the substrate 4 to be formed and evaporation mask 5 on a carrier 8 having an opening at the center portion is fixed. キャリアセット200は、キャリア8、メタルマスクとフレーム7からなる蒸着マスク5、プレート9、磁石10で構成される。 Carrier set 200, carrier 8, the evaporation mask 5 consisting of a metal mask and the frame 7, the plate 9, and a magnet 10. 蒸着マスク5は基板4の所定の画素又は領域に成膜できるように孔加工が施されているメタルマスク6とメタルマスク6に弛みが生じないようにテンションをかけるための枠であるマスクフレーム7を接着あるいは溶接して構成される。 Mask frame 7 evaporation mask 5 is a frame for tensioning to prevent looseness caused in the metal mask 6 and the metal mask 6 hole processing is given so as to be deposited in a predetermined pixel or region of the substrate 4 composed bonding or welding to the. メタルマスク6やマスクフレーム7などは、処理中に温度変化するので、精度を補償するために、インバー材などの低膨張率金属材料を用いるのが好ましい。 Such as a metal mask 6 and the mask frame 7, since the temperature changes during the process, in order to compensate for the accuracy, it is preferable to use a low expansion coefficient metal material such as Invar. また、メタルマスクに関しては磁石で吸着できる材質が好ましい。 Also, preferably the material which can be adsorbed by the magnet with respect to the metal mask.

基板4は蒸着マスク5に対して位置決めし、基板4を撓ませないようにするプレート9をあてがいながら、更にプレート9に磁石10を接近させてそれぞれを固定する。 Board 4 is positioned with respect to the evaporation mask 5, while Ategai the plate 9 so as not to deflect the substrate 4, to fix the respective by approaching a magnet 10 further plate 9. 磁石10は基板4とメタルマスク6とを密着させるために用いる。 Magnet 10 is used in order to close contact with the substrate 4 and the metal mask 6.

キャリア8は蒸着源2から放出する蒸気2を横切るように搬送することで、蒸着マスク5を介して基板4に成膜して行く。 Carrier 8 by transport across the steam 2 to release from the evaporation source 2, go deposited on the substrate 4 through an evaporation mask 5. キャリア8の搬送を行うためには複数個の搬送ローラ13を真空チャンバ1に設置する。 Installing a plurality of conveying rollers 13 into the vacuum chamber 1 in order to perform the conveyance of the carrier 8. 搬送ローラ13は外部からの動力により、所定の速度で同期させながら回転させて搬送ローラ13上のキャリア8を矢印A方向に移動させる。 Conveying rollers 13 by the power from the outside to move the carrier 8 on the conveying roller 13 in the arrow A direction by rotating while synchronizing at a predetermined speed. 搬送ローラ13同士の同期を取るための機構としては、歯車やタイミングベルトを用いるのが一般的であるが、それぞれのローラ毎にモータを用意し、電気的に同期をとる機構を採用してもよい。 The mechanism for synchronizing between the conveying roller 13, but to use a gear and timing belt is generally prepared motor for each roller, electrically it is adopted a mechanism to synchronize good. しかし、真空チャンバ1内部での真空度の確保、汚染の防止の観点から、この同期を取るための機構やモータなどの駆動系は真空チャンバ1外部に設けるのが好ましい。 However, securing the degree of vacuum inside the vacuum chamber 1, from the viewpoint of prevention of pollution, a drive system, such as mechanisms and motors for the synchronization is preferably provided in the vacuum chamber 1 outside.

従来から、一般的に蒸着源2の熱をキャリア8、蒸着マスク5、基板4への放射熱として伝播させないように蒸着源2の周辺をリフレクタ15や冷却板14で覆う。 Conventionally, the heat carrier 8 generally deposition source 2, the evaporation mask 5 covers the periphery of the deposition source 2 so as not to propagate as radiant heat to the substrate 4 by the reflector 15 and the cooling plate 14. 蒸着源ユニット100は、蒸着源2とリフレクタ15と冷却板14のセットである。 Deposition source unit 100 is a set of the deposition source 2 and the reflector 15 and the cooling plate 14. 本発明者の検討によれば、このような蒸着源ユニット100を採用しても、3〜4段階の蒸着を行うと5〜30℃程度温度上昇が起こる。 According to the studies of the present inventors, such be employed deposition source unit 100, 5 to 30 ° C. about a temperature rise Doing deposition of 3-4 stages occurs. このため、次のような手段を採用した。 For this reason, we adopted the following means.

キャリア8の蒸着源2側の面の近傍に冷却手段を講じた冷却板11を近接して設置する。 The cooling plate 11 has taken a cooling means in the vicinity of the surface of the deposition source 2 side of the carrier 8 is placed in close proximity to. 冷却板11には真空チャンバ1外部から冷却液を導入し、その内部を循環させる。 The cooling plate 11 introduces a cooling fluid from the vacuum chamber 1 outside, circulating therein. 冷却液は水でも良いが、より大きな効果を得るには、真空チャンバ1外部に冷却水の冷却手段を設け、プロセス開始時と終了時の蒸着マスク5の温度変化が無いように冷却水温度を調整することが望ましい。 The coolant may be water, but in order to obtain a larger effect, a cooling means of the cooling water in the vacuum chamber 1 outside the coolant temperature so that the temperature change of the evaporation mask 5 at the end of the time of process start is not it is desirable to adjust. 冷却板11には蒸着源ユニット100と対峙する部分に開口部60を設け、蒸着処理中に必要以上にキャリア8、蒸着マスク5、基板4への放射熱の伝播を防ぐことができた。 The cooling plate 11 is an opening 60 provided in a portion facing the deposition source unit 100, the carrier 8 more than necessary during the deposition process, the deposition mask 5, it was possible to prevent transmission of radiant heat to the substrate 4. また、キャリア8と冷却板11を現実的な構造上の設置限界である0.5から3mmの範囲で近接させ、キャリア8の軌道と平行させて設置することにより、キャリアセット200が移動中に放射による放熱も図ることができる。 Moreover, the the carrier 8 the cooling plate 11 is close in the range of installation limit is 0.5 of 3mm on realistic structure, by installing by parallel with the trajectory of the carrier 8, carrier set 200 is on the move it is possible to achieve heat radiation by radiation.

図2に示したように、蒸着源2の近傍に設ける冷却プレート14の開口部60の基板4の進行方向Aの方向の幅W1は、蒸着源ユニット100の蒸気噴出口70の基板4の進行方向の幅W2より大きく、基板4の上記進行方向の長さW3よりも小さい。 As shown in FIG. 2, the width W1 in the direction of the traveling direction A of the substrate 4 of the opening 60 of the cooling plate 14 provided in the vicinity of the evaporation source 2, the progress of the substrate 4 of the steam ejection port 70 of the deposition source unit 100 greater than width W2, smaller than the traveling direction of the length W3 of the substrate 4.

また、キャリア8の放熱の効率を高めるために、キャリア8と冷却板11と対向する面に黒色の皮膜を形成することが望ましい。 Further, in order to increase the efficiency of heat dissipation of the carrier 8, it is desirable to form a coating of black on the surface facing the carrier 8 and the cooling plate 11. 黒色の皮膜としては、黒色クロムめっき、黒色アルマイト、アルミナ‐チタニア溶射が有効であるが、真空中でガス放出が少なく、有機物の汚染が発生しないものであれば使用可能である。 The coating of black, black chromium plating, black anodized alumina - although titania spraying is effective, less outgassing in a vacuum, organic contamination can be used as long as it does not occur. 同様に、蒸着マスク5とキャリア8の対向面についても黒色の表面処理を施すのが好ましい。 Similarly, preferably subjected to a surface treatment of the black also facing surface of the evaporation mask 5 and the carrier 8.

冷却板11を設けて、図1に示すように基板の進行方向に関して蒸気3の指向性を狭めることにより、進行方向の画素内の膜厚分布変動を引き起こすシャドー効果を抑制できる。 The cooling plate 11 is provided, by narrowing the directivity of the vapor 3 with respect the traveling direction of the substrate shown in FIG. 1, it is possible to suppress the shadow effect which causes the film thickness distribution variation in the pixel in the direction of travel.

実施例1に示したキャリアセット200を1台用いて単独で蒸着処理したのでは製造効率が悪い。 The carrier set 200 shown in Example 1 is prepared inefficient than the deposition process alone using one. しかし、キャリアセット200を複数台用意し、間隔を狭めた状態で走行させて蒸着処理させることにより、スループットを向上することができると共に、蒸着材料が基板4へ付着する効率も向上し、基板あたりに必要な材料コストを低減させることができる。 However, the carrier set 200 and a plurality prepared by depositing process is run in a state of narrowing the interval, it is possible to improve the throughput, even better efficiency evaporation material from adhering to the substrate 4, per substrate it is possible to reduce the material cost required.

また、冷却板11を設けたことにより基板への蒸着に用いられない材料の蒸気は冷却板11にトラップされる。 Further, the vapor of the material not used for deposition on a substrate by providing the cooling plate 11 are trapped by the cooling plate 11. このため、真空チャンバ1、キャリア8や搬送ローラ13などの部材に蒸着源2の蒸気3が付着するのを低減でき、真空チャンバ1内部への有機物汚染が小さくなる。 Therefore, the vacuum chamber 1 can be reduced that the steam 3 in the deposition source 2 to the members such as the carrier 8 and the conveying roller 13 is attached, the organic contamination into the vacuum chamber 1 inside decreases. その結果、基板に成膜した膜の純度が向上し、表示素子の特性や寿命も向上する。 This increases the purity of film deposited on the substrate is also improved characteristics and lifetime of the display device. 一方、蒸気の進行を制限しているため、冷却板11の側に材料が集中して堆積してゆく。 Meanwhile, since the limit the progression of the steam, the material on the side of the cooling plate 11 slide into the deposition concentrated. そこで、防着板12を冷却板11の蒸着源ユニット100に対向する面に装着することにより、高価な蒸着源材料の回収を図ることができる。 Therefore, by mounting the deposition preventing plate 12 in a surface facing the deposition source unit 100 of the cooling plate 11, it is possible to recover the expensive evaporation source material.

図3は、本発明にかかる蒸着装置の実施例2を説明する搬送ローラの冷却構造の断面図である。 Figure 3 is a cross-sectional view of a cooling structure of a conveying roller for explaining a second embodiment of a vapor deposition apparatus in the present invention. 図3において、搬送ローラ13とキャリア8の基本的な構成、および蒸着源ユニット100やキャリアセット200の構造は実施例1と同様である。 3, the basic configuration of a conveying roller 13 and the carrier 8, and the structure of the deposition source unit 100 and carrier set 200 is the same as in Example 1. 図1に示した実施例1の冷却構造は、キャリア8、蒸着マスク5、基板4の熱を放射することで冷却する構造としてある。 Cooling structure of Embodiment 1 shown in FIG. 1, the carrier 8, the evaporation mask 5, is a structure for cooling by radiating heat of the substrate 4. 一般的に、接触による熱伝導での冷却の方が放射による冷却よりも効率が良いので、実施例2では搬送ローラ13自体に冷却機能を持たせるようにした。 Generally, towards the cooling in the heat conduction by contact because efficient than cooling by radiation, and so as to have a cooling function to Example 2, the conveying roller 13 itself.

図3において、真空チャンバ1と搬送ローラ13の真空シールは、搬送ローラ13の軸部外側に磁性流体真空シール23及び搬送ローラ13の回転を可能とする軸受28を組合せてケース27に収容した磁性流体シールユニット16により実現する。 3, the vacuum seal of the vacuum chamber 1 and the conveying roller 13, and housed in a case 27 in combination a bearing 28 on the shaft outwardly to allow rotation of the magnetic fluid vacuum sealing 23 and the conveying rollers 13 of the conveying roller 13 magnetic realized by a fluid seal unit 16. ケース27と真空チャンバ1はOリング26で気密に封止される。 Case 27 and the vacuum chamber 1 is hermetically sealed by O-ring 26.

搬送ローラ13のキャリア8に接触する円筒部と軸部は金属材料で一体形成したものとする。 Cylindrical portion and the shaft portion in contact with the carrier 8 of the conveying roller 13 and those formed integrally from a metal material. 金属材料以外でも、十分に強度が保て、かつ熱伝導率が比較的良好なもの、更に比熱が小さいものであればなお良い。 Other than the metal material, sufficiently maintain strength, and relatively good thing thermal conductivity, even better as long as more specific heat is small. ここでは、SUS303を用いた。 Here, using the SUS303. 搬送ローラ13は搬送ローラ駆動機構17で駆動される。 Conveying rollers 13 are driven by the transport roller drive mechanism 17.

搬送ローラ13の軸の内部には、大気雰囲気の側から見て筒状の穴があり、その内側に回転しない固定軸20を設ける。 Inside the shaft of the conveying roller 13, there is a cylindrical hole as viewed from the side of the atmosphere, providing a fixed shaft 20 which does not rotate therein. 固定軸20に対して搬送ローラ13は、その軸内部に設けた軸受25によって自由に回転する。 Conveying roller with respect to the fixed shaft 20 13 is free to rotate by a bearing 25 provided inside the shaft. 固定軸20には2個の孔があけてあり、搬送ローラ13の円筒部内に冷却液22を送り込める構造となっている。 The fixed shaft 20 have kept the two holes, and has a Okurikomeru structure coolant 22 in the cylindrical portion of the transport roller 13. 冷却液22が固定軸20と搬送ローラ13の間の隙間から漏れないようにメカニカルシール24を施す。 Coolant 22 is subjected to a mechanical seal 24 to prevent leakage from the gap between the fixed shaft 20 and the conveying roller 13. 冷却液22が搬送ローラ13内部をうまく循環できるように、固定軸20の搬送ローラ13側の端部において、冷却液循環用の2つの孔の間に邪魔板21を設置することで、冷却液22は効率よく搬送ローラ13を冷却することができる。 As coolant 22 it can be successfully circulated inner transfer roller 13, at the end of the conveying roller 13 side of the fixed shaft 20, by installing a baffle plate 21 between the two holes for coolant circulation, the cooling fluid 22 can be efficiently cooled transport rollers 13.

図4は、本発明にかかる蒸着装置の実施例3を説明する断面図である。 Figure 4 is a sectional view for explaining a third embodiment of a vapor deposition apparatus in the present invention. キャリアセット200は、図4の紙面から手前に搬送される。 Carrier set 200 is conveyed to the front plane of the paper in FIG. また、図5は、図4を基板側からみた側面図である。 Further, FIG. 5 is a side view of the FIG. 4 from the substrate side. なお、実施例3ではマスクフレーム7にキャリア8の機能を持たせてキャリア8を省略することも可能である。 It is also possible to have a function of carrier 8 to the mask frame 7 in the third embodiment is omitted carrier 8. 実施例1では、キャリア8、蒸着マスク5、基板4を有するキャリアセット200を水平に搬送していたが、実施例3では、キャリアセット200を上下に立てて搬送しながら成膜する構成としたものである。 In Example 1, the carrier 8, the evaporation mask 5, but the carrier set 200 having a substrate 4 has been transported horizontally, in Example 3, was configured to deposit while conveying make a carrier set 200 in the vertical it is intended. そして、蒸着源ユニット100を真空チャンバ1の側壁面に取り付け、基板4全体に蒸気3が到達するようにする。 Then, attach the deposition source unit 100 to the side wall surface of the vacuum chamber 1, the steam 3 to reach the entire substrate 4.

キャリアセット200を立てて搬送するのに伴い、搬送ローラ13はキャリアセット200の上下に設ける。 Along to convey make a carrier set 200, the conveying roller 13 is provided above and below the carrier set 200. なお、キャリアセット200が走行中に脱落しないように、適宜のガイドを設けるとよい。 Note that as the carrier set 200 does not fall off during driving, may be provided with appropriate guides. キャリアセット200は必ずしも垂直に立てる必要はなく、ある程度は斜めに立てて移動させる厚生とすることもできる。 Carrier set 200 need not necessarily stand perpendicularly, can be a welfare to move to some extent upright diagonally. また、キャリアセット200に対して蒸着源ユニット100を下に設置し、斜めに搬送しても効果は同様である。 Further, the deposition source unit 100 is placed under the carrier set 200, it is transported obliquely effects are the same. 実施例3のローラ13の部分に図3に示した冷却構造を採用することもできる。 It is also possible to employ a cooling structure shown in FIG. 3 in the portion of the roller 13 of the third embodiment.

図6は、本発明の蒸着方法および蒸着装置で製造される有機EL表示素子を説明する要部断面図である。 Figure 6 is a fragmentary cross-sectional view illustrating an organic EL display device manufactured by the vapor deposition method and the vapor deposition apparatus of the present invention. また、図7は、図6におけるアクティブ基板の斜視図である。 7 is a perspective view of an active substrate in FIG. 有機EL表示素子は、アクティブ基板40と封止基板50をシール材52で気密封止されている。 The organic EL display device is hermetically sealed active substrate 40 and the sealing substrate 50 with a sealant 52. アクティブ基板40の主面には薄膜トランジスタ41が形成されており、絶縁膜42、平坦化膜43の部分で発光駆動回路48を構成する。 The main surface of the active substrate 40 and the thin film transistor 41 is formed, the insulating film 42, constituting the light emitting driving circuit 48 at a portion of the planarizing film 43. 平坦化膜43の上に第1電極44が形成され、この第1電極44の上に前記で説明した実施例の何れかによる有機発光膜45が蒸着されている。 First electrode 44 is formed on the planarization layer 43, the organic light-emitting film 45 is deposited by any of the embodiments described above on the first electrode 44. この有機発光膜45を覆って第2電極47が成膜されている。 The second electrode 47 is formed to cover the organic light-emitting layer 45.

有機発光膜45は、隣接する画素49との間に絶縁材料で形成されたバンク46の間に形成される。 The organic light emitting film 45 is formed between the bank 46 formed of an insulating material between adjacent pixels 49. なお、封止基板50の内側には、気密容器内の湿気を吸着する乾燥剤51が封入される。 Note that the inside of the sealing substrate 50, the desiccant 51 is enclosed to adsorb moisture in the hermetic container.

本発明は、有機EL表示装置の有機発光層の形成に好適であるが、有機材料を蒸着する種々の装置の製造における蒸着装置に適用することができる。 The present invention is suitable for the formation of the organic light-emitting layer of the organic EL display device can be applied to the deposition apparatus in the manufacture of various devices for depositing an organic material.

本発明にかかる蒸着装置の実施例1を説明する断面図である。 It is a cross-sectional view illustrating a first embodiment of a vapor deposition apparatus in the present invention. 図1を上側からみた平面図である。 Figure 1 is a plan view from above. 本発明にかかる蒸着装置の実施例2を説明する搬送ローラの冷却構造の断面図である。 It is a cross-sectional view of a cooling structure of a conveying roller for explaining a second embodiment of a vapor deposition apparatus in the present invention. 本発明にかかる蒸着装置の実施例3を説明する断面図である。 It is a sectional view for explaining a third embodiment of a vapor deposition apparatus in the present invention. キャリアセット200は、図4の紙面から手前に搬送される。 Carrier set 200 is conveyed to the front plane of the paper in FIG. 図4を基板側からみた側面図である。 Figure 4 is a side view as viewed from the substrate side. 本発明の蒸着方法および蒸着装置で製造される有機EL表示素子を説明する要部断面図である。 It is a fragmentary cross-sectional view illustrating an organic EL display device manufactured by the vapor deposition method and the vapor deposition apparatus of the present invention. 図6におけるアクティブ基板の斜視図である。 It is a perspective view of an active substrate in FIG. インライン方式の従来の蒸着装置を説明する基板進行方向の模式断面図である。 It is a schematic cross-sectional view of the substrate traveling direction illustrating a conventional deposition apparatus of an inline type. 蒸着マスクに起因するシャドー効果による画素周辺部の膜厚減少を説明する図である。 It is a diagram illustrating a decrease in film thickness of the pixel peripheral portion by the shadow effect due to the evaporation mask.

符号の説明 DESCRIPTION OF SYMBOLS

1・・・真空チャンバ、2・・・蒸着源、3・・・蒸気、4・・・基板、5・・・蒸着マスク、6・・・メタルマスク、7・・・マスクフレーム、8・・・キャリア、9・・・プレート、10・・・磁石、11・・・冷却板、12・・・防着板、13・・・搬送ローラ、14・・・冷却板、15・・・リフレクタ、16・・・磁性流体シールユニット、17・・・搬送ローラ駆動機構、20・・・固定軸、21・・・邪魔板、23・・・冷却液、24・・・メカニカルシール、25・・・軸受、26・・・Oリング、27・・・ケース、28・・・軸受、30・・・蒸着膜、31・・・テーパ角、32・・・マスクの影、60・・・冷却板開口部、70・・・噴出口、1000・・・蒸着源ユニット、200・・・キャリアセット。 1 ... vacuum chamber, 2 ... vapor deposition source, 3 ... steam, 4 ... substrate, 5 ... deposition mask, 6 ... metal mask 7 ... mask frame, 8 ... carrier, 9 ··· plate, 10 ... magnet, 11 ... cooling plate, 12 ... deposition preventing plate, 13 ... conveying roller, 14 ... cooling plate, 15 ... reflector, 16 ... magnetic fluid seal unit, 17 ... transport roller drive mechanism, 20 ... fixed shaft, 21 ... baffles 23 ... coolant, 24 ... mechanical seal, 25 ... bearing, 26 ... O-ring, 27 ... case, 28 ... bearing, 30 ... vapor deposition film, 31 ... taper angle, 32 ... shadow mask, 60 ... cooling plate opening parts, 70 ... spout 1000 ... deposition source unit, 200 ... carrier sets.

Claims (12)

  1. 真空雰囲気を保持した容器内に設置した蒸着源ユニット内に蒸着源となる材料を固定し、該蒸着源ユニットの蒸気噴出口から噴出する蒸気を横切って蒸着対象の基板を移動させている間に該基板の所定個所に前記材料を蒸着する方法であって、 The material serving as the evaporation source in a vapor deposition source unit was placed in a container holding the vacuum atmosphere is fixed, while moving the substrate in the deposition target across the steam jetted from the steam jetting port of the vapor deposition source unit a method of depositing said material in a predetermined location of the substrate,
    前記基板に対して、前記材料を蒸着する個所に対応した孔が開いたシートと該シートを平面に保持するマスクフレームを備えた蒸着マスクを密着させて設置し、 To the substrate, is placed in close contact with the deposition mask comprising a mask frame for holding the sheet and the sheet of holes corresponding opens in place of depositing the material plane,
    前記真空雰囲気を保持する容器に設けた複数のローラを有する移動手段で前記マスクフレームを移動し、 The mask frame to move with the moving means having a plurality of rollers provided in the container for holding the vacuum atmosphere,
    前記マスクフレームが移動する軌道上で、前記マスクフレームの前記蒸着源側の面に対して非接触かつ近接して設けた冷却手段を持ち、前記蒸着源の近傍に部分的に開口部を有する冷却プレートの該開口部を通じて前記蒸着源ユニットの上記蒸気噴出口から噴出した前記材料の蒸気を前記蒸着マスク及び前記基板に吹き付けることを特徴とする蒸着方法。 In orbit the mask frame is moved, cooled with the non-contact and to the plane of the evaporation source side has a cooling means arranged in close proximity, partially opening in the vicinity of the deposition source of the mask frame evaporation wherein the blowing vapor of the material ejected from the steam ejection port of the deposition source unit through the opening of the plate in the deposition mask and the substrate.
  2. 真空雰囲気を保持した容器内に設置した蒸着源ユニット内に蒸着源となる材料を固定し、該蒸着源ユニットの蒸気噴出口から噴出する蒸気を横切って蒸着対象の基板の移動させることにより、該基板の所定個所に前記材料を蒸着する方法であって、 The material serving as the evaporation source in a vapor deposition source unit was placed in a container holding the vacuum atmosphere is fixed, by moving the substrate in the deposition target across the steam jetted from the steam jetting port of the vapor deposition source unit, the a method of depositing said material in a predetermined location of the substrate,
    前記基板に対して、前記材料を蒸着する個所に対応した孔が開いたシートと該シートを平面に保持するマスクフレームを備えた蒸着マスクを密着させて設置し、 To the substrate, is placed in close contact with the deposition mask comprising a mask frame for holding the sheet and the sheet of holes corresponding opens in place of depositing the material plane,
    前記真空雰囲気を保持する容器に設けた複数のローラと開口部を有して前記蒸着マスクを密着させて搬送するキャリアで前記マスクフレームを移動し、 Wherein moving the mask frame a vacuum atmosphere having a plurality of rollers and an opening portion provided in the container for holding a carrier to transport in close contact with the deposition mask,
    前記マスクフレームが移動する軌道上で、前記マスクフレームの前記蒸着源側の面に対して非接触かつ近接して設けた冷却手段を持ち、前記蒸着源の近傍に部分的に開口部を有する冷却プレートの該開口部を通じて前記蒸着源ユニットの上記蒸気噴出口から噴出した前記材料の蒸気を前記蒸着マスク及び前記基板に吹き付けることを特徴とする蒸着方法。 In orbit the mask frame is moved, cooled with the non-contact and to the plane of the evaporation source side has a cooling means arranged in close proximity, partially opening in the vicinity of the deposition source of the mask frame evaporation wherein the blowing vapor of the material ejected from the steam ejection port of the deposition source unit through the opening of the plate in the deposition mask and the substrate.
  3. 請求項1又は2において、 According to claim 1 or 2,
    前記蒸着源の近傍に設ける前記冷却プレートの開口部の前記基板の進行方向の幅が、前記蒸着源のユニットの前記蒸気噴出口の前記基板の進行方向の幅より大きく、前記基板の進行方向の長さよりも小さいことを特徴とする蒸着方法。 The width of the traveling direction of the substrate of the opening of the cooling plate provided in the vicinity of the deposition source is greater than the traveling direction of the width of the substrate of the steam injection ports of the unit of the evaporation source, the traveling direction of the substrate evaporation wherein the less than the length.
  4. 請求項1又は2において、 According to claim 1 or 2,
    前記真空雰囲気を形成する容器の外側から前記搬送用のローラ内部に冷却液を循環させて冷却することを特徴とする蒸着方法。 Deposition method characterized in that cooling by circulating a cooling fluid to the roller interior for the transport from the outside of the container forming the vacuum atmosphere.
  5. 請求項1又は2において、 According to claim 1 or 2,
    前記蒸着源となる材料が有機エレクトロルミネッセンス表示素子の発光層を構成する有機材料であることを特徴とする蒸着方法。 Evaporation wherein the material serving as the evaporation source is an organic material constituting the light emitting layer of an organic electroluminescent display device.
  6. 真空雰囲気を保持した容器内に設置した蒸着源ユニット内に蒸着源となる材料を固定し、該蒸着源ユニットの蒸気噴出口から噴出する前記材料の蒸気を横切って蒸着対象の基板を移動させている間に該基板の所定個所に前記材料を蒸着する装置であって、 The material serving as the evaporation source in a vapor deposition source unit was placed in a container holding the vacuum atmosphere is fixed, by moving the substrate across a vapor deposition target of the material to be ejected from the steam ejection port of the vapor deposition source unit an apparatus for depositing said material in a predetermined location of the substrate while in,
    前記基板へ前記材料を蒸着する個所に対応した孔が開いたシートと該シートを平面に保持するマスクフレームを備えた蒸着マスクと、 A deposition mask comprising a mask frame for holding the sheet and the sheet of the punched corresponding to positions of depositing the material into the substrate in a plane,
    前記基板の前記蒸着源側に設置して該基板と該蒸着マスクを密着させる蒸着マスク密着手段と、 A deposition mask contact means for adhering the the vapor deposition mask and the installed substrate in the deposition source side of the substrate,
    前記真空雰囲気を保持する容器に設けた複数のローラによるマスクフレームの移動手段と、 And moving means of the mask frame by a plurality of rollers provided in the container for holding the vacuum atmosphere,
    前記マスクフレームの前記蒸着源側の面に対して非接触かつ近接するように設けた冷却手段を持つと共に該蒸着源の近傍に部分的な開口部を有して前記マスクフレームが移動する軌道上に設けた冷却プレートとを有し、 Orbit said mask frame has a partial opening in the vicinity of the vapor deposition source with respect to the surface of the deposition source side with cooling means which is provided to non-contact and close proximity to the movement of the mask frame and a cooling plate provided in,
    前記冷却プレートの前記開口部を通じて前記蒸着源で発生した前記材料の蒸気を前記蒸着マスク及び前記基板に吹き付けることを特徴とする蒸着装置。 Deposition apparatus characterized by blowing vapor of the material generated in the deposition source through the opening of the cooling plate on the deposition mask and the substrate.
  7. 真空雰囲気を保持した容器内に設置した蒸着源ユニット内に蒸着源となる材料を固定し、該蒸着源の蒸気を横切るように蒸着対象の基板の移動させることにより、該基板の所定個所に前記材料を蒸着する装置であって、 The material serving as the evaporation source in a vapor deposition source unit was placed in a container holding the vacuum atmosphere is fixed, by moving the substrate in the deposition target across the vapor of the vapor deposition source, wherein the predetermined position of the substrate materials an apparatus for depositing,
    前記基板へ前記材料を蒸着する個所に対応した孔が開いたシートと該シートを平面に保持するマスクフレームを備えた蒸着マスクと、 A deposition mask comprising a mask frame for holding the sheet and the sheet of the punched corresponding to positions of depositing the material into the substrate in a plane,
    前記基板の前記蒸着源側に設置して該基板と該蒸着マスクを密着させる蒸着マスク密着手段と、 A deposition mask contact means for adhering the the vapor deposition mask and the installed substrate in the deposition source side of the substrate,
    前記基板の前記蒸着源側に前記蒸着マスクを密着し、開口部を有して搬送するキャリアと、 The deposition mask in close contact with the evaporation source side of the substrate, and a carrier for transporting has an opening,
    前記真空雰囲気を保持する容器には複数のローラによる前記キャリアの移動手段と、 And moving means of the carrier by a plurality of rollers in a container for holding the vacuum atmosphere,
    前記マスクフレームが移動する軌道上に設けて前記キャリアの前記蒸着源側の面に対して非接触かつ近接して設けた冷却手段を持つと共にがい蒸着源の近傍に部分的に開口部を有する冷却プレートとを有し、 Cooling with partial opening in the vicinity of the outer deposition source with with a non-contact and close proximity to the cooling means arranged to the plane of the deposition source side of the carrier is provided on the track of the mask frame moves and a plate,
    前記冷却プレートの前記開口部を通じて蒸着源ユニットの前記噴出口から噴出した前記材料の蒸気を前記蒸着マスク及び前記基板に吹き付けることを特徴とする蒸着装置。 Deposition apparatus characterized by blowing vapor of the material ejected from the ejection port of the deposition source unit through the opening of the cooling plate on the deposition mask and the substrate.
  8. 請求項6又は7において、 According to claim 6 or 7,
    前記蒸着源の近傍に設ける前記冷却プレートの前記開口部の前記基板の進行方向の幅が、前記蒸着源ユニットの前記噴出口の幅より大きく、前記基板の進行方向の長さよりも小さいことを特徴とする蒸着装置。 Wherein the width of the traveling direction of the substrate of the opening of the cooling plate provided in the vicinity of the deposition source is greater than a width of the ejection port of the deposition source unit, less than the length of the traveling direction of the substrate and the vapor deposition apparatus.
  9. 請求項6又は7において、 According to claim 6 or 7,
    前記真空雰囲気を形成する容器の外側から搬送用のローラ内部に冷却液を循環させて冷却する機能を持つことを特徴とする蒸着装置。 Deposition apparatus characterized by having a function of cooling by circulating a cooling fluid to the roller inside the conveyance from the outside of the container forming the vacuum atmosphere.
  10. 請求項6において、 According to claim 6,
    前記マスクフレームと前記冷却プレートの該マスクフレーム側に黒色の皮膜を有することを特徴とする蒸着装置。 Vapor deposition apparatus characterized by having a coating of black on the mask frame side of the mask frame and the cooling plate.
  11. 請求項7において、 According to claim 7,
    前記マスクフレームと前記キャリアの該マスクフレームに対向する面および前記冷却プレートの前記キャリア側に黒色の皮膜を有することを特徴とした蒸着装置。 Deposition apparatus characterized by having a coating of black on the carrier side surface and the cooling plate opposed to the mask frame of the carrier and the mask frame.
  12. 請求項6又は7において、 According to claim 6 or 7,
    前記蒸着源となる材料が有機エレクトロルミネッセンス表示素子の発光層を構成する有機材料であることを特徴とする蒸着装置。 Vapor deposition apparatus, wherein a material serving as the evaporation source is an organic material constituting the light emitting layer of an organic electroluminescent display device.
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