KR20120004071A - Thin layers deposition apparatus for manufacturing oled - Google Patents

Abstract

PURPOSE: A thin film deposition apparatus for organic light emitting diode(OLED) manufacturing processes is provided to uniformly provide deposition materials to the surface of a substrate from a source while maintaining constant relative displacement from the substrate, thereby improving the quality of a deposition film. CONSTITUTION: A substrate gripping alignment unit(130) aligns a substrate with respect to a mask(120) while gripping the substrate. The substrate gripping alignment unit comprises a unit main body(131), a substrate gripping part(133), and an aligner(134). A source(150) supplies a predetermined deposition material to the substrate through a mask. A source alignment transfer unit(160) transfers the source to the whole surface of the substrate. A chamber supplies a space for performing a deposition process with respect to the substrate.

Description

Thin film deposition apparatus for OLD manufacturing {THIN LAYERS DEPOSITION APPARATUS FOR MANUFACTURING OLED}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin film deposition apparatus for manufacturing an OLED, and more particularly, to depositing material from a source toward a surface of a substrate while maintaining a constant displacement with a substrate standing up at a predetermined angle inclined with respect to a gravity direction. The present invention relates to a thin film deposition apparatus for manufacturing an OLED, which can provide a uniform thickness, can improve the quality of a deposited film, and can further prevent the waste of deposition materials.

In general, an organic light emitting display (OLED), which is a flat panel display element, is an ultra-thin display device that realizes color images by self-emission of organic materials, and is promising next-generation in that its structure is simple and its light efficiency is high. It is attracting attention as a display device.

The organic light emitting display OLED includes an anode and a cathode, and organic layers interposed between the anode and the cathode. The organic layers may include at least a light emitting layer, and may further include a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer in addition to the light emitting layer.

The organic light emitting display device may be classified into a polymer organic light emitting device and a low molecular weight organic light emitting device according to an organic layer, in particular, a material forming a light emitting layer. In order to realize full color, the light emitting layer needs to be patterned. In order to manufacture a large OLED, a direct patterning method using a fine metal mask (FMM) and a laser induced thermal imaging (LITI) method are used. There is a method applied, a method using a color filter.

When manufacturing a large OLED by applying a mask method, a so-called horizontal upward deposition method in which a substrate and a patterned mask are horizontally disposed in a chamber and then deposited is applied. The horizontal upward deposition method is a method of aligning a substrate and a mask disposed horizontally with respect to a bottom surface of a chamber or the like, bonding them together, and depositing organic material on a large substrate in a horizontal state.

However, as OLEDs become larger in size, masks are becoming larger and larger in weight, and in this case, deflection of the mask occurs in the direction of gravity, making it difficult to closely adhere the mask to the substrate, thereby eventually securing the precision required for mass production. There is a difficult problem.

Meanwhile, the most important issue in the OLED deposition process is the particle issue. As described above, the OLED deposits organic material during the deposition process and implements a display based on the principle of emitting light by the deposited organic material. Thus, when particles are generated during the organic material deposition process, it becomes a problem of defects in the finished product.

In addition to these reasons, in order to improve the disadvantages of the above-described horizontal upward deposition process, the substrate and the mask are transferred in a vertical direction by a conveyor transfer system or a magnetic levitation system, and the deposition process is applied by attaching the substrate to the mask standing in the vertical direction. I'm considering.

However, in this case, a fine gap is generated between the mask and the substrate standing in the vertical direction, so that organic matter is deposited between the fine gaps during the deposition process, thereby making it difficult to form a desired pattern.

When analyzing the cause of the minute gap between the mask and the substrate, when the mask is standing vertically, the convex bulge occurs over time in the inner part of the mask having a frame structure. As a result, a minute gap is generated between the mask and the substrate. The actual measurement resulted in a difference of about 300 μm between the flat edge and the flat edge.

Therefore, a method of depositing the mask and the substrate in an upright state inclined at a predetermined angle with respect to the gravity direction without completely standing the mask and the substrate in the vertical direction may be considered.

In this case, however, the relative displacement between the source and the substrate that provides the deposition material to the surface of the substrate through the mask is different for each position of the substrate, making it difficult to form a uniform deposition film, and the deposition material may be unnecessarily wasted. Is required.

SUMMARY OF THE INVENTION An object of the present invention is to improve the quality of a deposition film by uniformly providing a deposition material from a source toward the surface of the substrate while maintaining a constant displacement with a substrate standing up at a predetermined angle in the gravity direction. It is possible to provide a thin film deposition apparatus for manufacturing an OLED that can be made, and furthermore, to prevent a waste of deposition materials.

The above object is, according to the present invention, a substrate holding alignment unit for aligning the substrate with respect to the mask in a state of holding the substrate standing up with a predetermined angle inclined with respect to the gravity direction; A source disposed on one side of the mask to provide a predetermined deposition material to the substrate through the mask; And a source aligning unit connected to the source to move the source to the entire surface of the substrate, wherein the source aligning unit aligns the source so that the relative displacement with the source is substantially the same with respect to the entire surface of the substrate. It is achieved by a thin film deposition apparatus for manufacturing OLED.

Here, the source aligning unit may include a vertical movement unit for moving the source in the vertical direction of the gravity direction.

The up and down moving parts are arranged to be spaced apart from each other, a pair of up and down rails standing up along the vertical direction; A source coupling part detachably coupled to the source and connected to the pair of upper and lower rails to move up and down along the pair of upper and lower rails; And it may include a vertical power providing unit for providing power for the vertical movement of the source coupling portion.

The vertical power supply unit, a connecting portion for connecting the pair of upper and lower rails from the outside of the chamber; And a driving motor provided at one side of the connection part to operate the pair of upper and lower rails through the connection part.

The source coupling portion, a pair of rail connection bracket connected to the pair of upper and lower rails; A fixed frame connected to the pair of rail connecting brackets and operating together with the pair of rail connecting brackets; And a movable frame provided to be movable relative to the fixed frame between the fixed frames and supporting the source.

The source alignment moving unit is provided between the fixed frame and the movable frame, and moves left and right to move the movable frame supporting the source in a left and right direction intersecting the vertical direction in association with an operation of the vertical moving unit. Direction moving unit; And a controller for controlling operations of the vertical movement unit and the horizontal movement unit.

The left and right moving parts, the ball screw disposed along the direction in which the movable frame is moved; A movable piece rotatably coupled to the ball screw and having one side connected to the movable frame; And it may include a ball screw rotation motor for rotating the ball screw in the forward and reverse directions.

The left and right moving parts may further include a pair of guide parts disposed around the ball screw to guide the movement of the movable frame when the ball screw is operated.

The source alignment moving unit may further include a displacement sensor for detecting a displacement with the substrate.

The substrate holding alignment unit may be disposed in pairs on both sides with the source interposed therebetween, and the source alignment moving unit may rotate the source so that the source faces the pair of substrate holding alignment units. The apparatus may further include a source rotating part.

The substrate holding alignment unit includes a unit body; A substrate support plate coupled to the unit body so as to be relatively movable, and supporting the substrate at one side facing the mask; A substrate holding part for holding the substrate in contact with the substrate supporting plate at a corresponding position; And a substrate aligner connected to the unit main body to align the substrate with respect to the mask.

The substrate supporting plate may be a cooling plate.

The substrate holding alignment unit is provided on the substrate supporting plate, and generates a magnetic force that pulls the mask toward the unit body with the substrate interposed therebetween such that the mask may be brought into surface contact with the substrate. It may further comprise an array.

The magnet array may be provided by an array structure of a plurality of unit magnets to be embedded in the substrate support plate.

The substrate aligner may further include a vision unit to photograph an alignment mark of the mask.

According to the present invention, it is possible to uniformly provide the deposition material from the source toward the surface of the substrate while maintaining a constant displacement with the standing substrate in a state inclined at an angle with respect to the gravity direction to improve the quality of the deposition film. Can be further reduced the waste of the deposition material.

1 is a perspective view of a thin film deposition apparatus for manufacturing an OLED according to a first embodiment of the present invention.
2 to 4 are schematic internal structural diagrams of FIG. 1, respectively, illustrating the deposition process step by step.
5 is a partially enlarged perspective view of the source alignment moving unit.
FIG. 6 is a diagram conceptually illustrating a process of moving a source by the source aligning unit illustrated in FIG. 5.
7 is a schematic structural diagram of a thin film deposition apparatus for manufacturing an OLED according to a first embodiment of the present invention.

In order to fully understand the present invention, the operational advantages of the present invention, and the objects achieved by the practice of the present invention, reference should be made to the accompanying drawings which illustrate preferred embodiments of the present invention and the contents described in the accompanying drawings.

Hereinafter, the present invention will be described in detail by explaining preferred embodiments of the present invention with reference to the accompanying drawings. Like reference numerals in the drawings denote like elements.

1 is a perspective view of a thin film deposition apparatus for manufacturing an OLED according to a first embodiment of the present invention, Figures 2 to 4 is a schematic internal structure of Figure 1 showing the deposition process step by step, Figure 5 is a source alignment 6 is a partially enlarged perspective view of the mobile unit, and FIG. 6 conceptually illustrates a process of moving a source by the source aligning unit illustrated in FIG. 5.

As shown in these figures, in the thin film deposition apparatus for manufacturing an OLED of the present embodiment, the substrate and the mask 120 (Fine Metal Mask, FMM), which are standing up and placed in a state inclined at an angle with respect to the gravity direction, are in contact with each other. After maintaining a mutually accurate flatness, the source 150 uniformly provides the deposition material toward the surface of the substrate while maintaining a constant relative displacement with the standing substrate with the source inclined at an angle to the gravity direction. This allows the deposition to be made.

Here, the angle inclined by a certain angle with respect to the gravity direction refers to about 80 degrees to less than 90 degrees, but need not be limited thereto. The precision flatness means that the mask 120 and the substrate are in uniform contact with each other over the entire area. The substrate may be an organic light emitting display (OLED) as described above.

As shown in FIGS. 1 to 6, the thin film deposition apparatus for manufacturing an OLED, the substrate 100 with respect to the mask 120 in a state in which the chamber 100 and the substrate standing uprightly inclined with respect to the gravity direction are held. A substrate holding alignment unit 130 for aligning the source, a source 150 disposed on one side of the mask 120 to provide a predetermined deposition material to the substrate through the mask 120, and connected to the source 150. To move the source 150 to the entire surface of the substrate, so that the relative displacement with the source 150 with respect to the entire surface of the substrate may be substantially equal to the entire surface of the substrate, even if the substrate is standing up at an angled angle with respect to the gravity direction. And a source alignment moving unit 160 to align the 150.

The chamber 100 forms a place where the deposition process for the substrate proceeds. The interior of the chamber 100 forms a vacuum atmosphere so that the deposition process on the substrate can be performed reliably. Therefore, although not shown, a vacuum pump may be connected to one side of the chamber 100 to suck the air in the chamber 100 to maintain the vacuum in the chamber 100. One side of the chamber 100 is coupled to the gate valve 101 forming the access passage of the substrate.

Next, prior to the description of the substrate holding alignment unit 130, the mask 120 will be described first. The mask 120 is formed on the surface of the substrate in order to proceed with deposition in a predetermined pattern on the surface of the substrate. Contact is supported. Although not shown in detail, the mask 120 is provided with a plurality of through holes (not shown) through which the deposition material from the source 150 passes.

In the present embodiment, since the mask 120 is also erected side by side with the substrate, i.e., inclined at a predetermined angle with respect to the gravity direction, even if the size of the mask 120 is increased, deflection compared to the size of the mask 120 is conventional. It can be more significantly reduced and the space of the chamber 100 can be reduced as well as the alignment of the substrate and the mask 120 can be made precisely, it can be particularly suitable for large-scale OLED production.

Meanwhile, in the present exemplary embodiment, the substrate is moved toward the mask 120 to be in contact with the mask 120, but the mask 120 may move toward the substrate for a predetermined distance. For this purpose, the mask 120 is moved toward the substrate. Means for driving (moving) and means for chucking the mask 120 after the mask 120 has been moved are required. Although not specifically illustrated, the former may be in charge of the mask driving part and the latter may be in charge of the mask chucking part.

For reference, the mask driving unit may be applied to a cylinder, a linear motor, a combination of a motor and a ball screw, or a robot. In addition, the mask chucking unit may be applied as a cylinder or an actuator, and the mask 120 may be disposed at the final moving position of the mask 120 so that the mask 120 where the position movement is completed is not randomly displaced or changed in position. Chucking role. Of course, in contrast, when a replaceable mask (not shown) is applied, the replaceable mask (not shown) may be moved into and out of the chamber 100 by a separate mask moving means (not shown) to participate in the deposition process. Could be.

Next, the substrate holding alignment unit 130 is disposed to face the source 150 with respect to the mask 120, and is inclined at a predetermined angle with respect to the substrate disposed in parallel with the mask 120, that is, the gravity direction. It serves to align the substrate with respect to the mask 120 in a state of holding the substrate standing upright.

The substrate holding alignment unit 130 may include a unit main body 131, a substrate supporting plate 132 coupled to the unit main body 131 so as to be relatively movable, and having a substrate supported on one side toward the mask 120. In addition, the substrate holding part 133 holding the substrate in contact with the substrate supporting plate 132 at the corresponding position, and the substrate aligning operation of the substrate with respect to the mask 120 connected to the unit body 131. Liner 134.

The unit body 131 is provided with components for moving the substrate support plate 132 toward the mask 120 or returning to the opposite original position. One unit is inside the chamber 100 and the other is It may be disposed outside the chamber 100.

The substrate support plate 132 is a place where the substrate is supported on the surface. For reference, the substrate may be transferred into the chamber 100 along the tray transfer part 140 in the form of a roller through a separate tray 141, and after the substrate is transferred, the substrate support plate 132 may be Is placed on the surface. As described above, like the mask 120, the substrate is supported by the surface of the substrate supporting plate 132 after the substrate is erected and supplied at a predetermined angle with respect to the direction of gravity, and thus, the substrate supporting plate 132 is The surface also remains in parallel with the mask 120.

In this embodiment, the substrate support plate 132 may be applied as a cooling plate 132. The substrate supporting plate 132, which may be applied to the cooling plate 132, may improve the deposition efficiency by lowering the temperature of the substrate before the actual deposition process is performed on the surface of the substrate. Of course, since the scope of the present invention does not need to be limited thereto, instead of providing the substrate supporting plate 132 as the cooling plate 132, the cooling water or the cooling air injection line is disposed in the substrate supporting plate 132. It is also possible enough.

The magnet for generating a magnetic force that pulls the mask 120 toward the unit body 131 with the substrate interposed therebetween so that the metal mask 120 may be in surface contact with the substrate while being in contact with the substrate. The array 134 is further provided. That is, the magnet array 134 is deposited due to the lifting phenomenon between the mask 120 and the substrate such that the mask 120, which is a metal material, is more closely adhered to the substrate through magnetic field formation when the mask 120 is in contact with the substrate. To prevent the occurrence of defects. In the present embodiment, the magnet array 134 is provided by an array structure of a plurality of unit magnets (not shown) provided to be embedded in the substrate supporting plate 132, but the scope of the present invention is not limited thereto.

The board | substrate holding part 133 is a means for holding the board | substrate arrange | positioned at the surface of the board | substrate support plate 132 in the said position. In particular, in the case of this embodiment, the substrate is inclined and supplied, and since the substrate is a large substrate, the substrate should be held without shaking. In this embodiment, the structure capable of elastically supporting the substrate is schematically illustrated, but the scope of the present invention is not necessarily limited thereto. That is, the shape of the substrate holding part 133 may be replaced by an electrostatic chuck or an adsorption chuck.

In the provision of the substrate holding part 133, since the substrate must be substantially in surface contact with the mask 120 as shown in FIGS. 3 and 4, the substrate holding part 133 does not interfere with this. Therefore, it is not preferable that the distal end portion of the substrate holding part 133 protrude more toward the mask 120 than the surface of the substrate.

The substrate aligner 134 is connected to the unit main body 131 and performs alignment of the substrate with respect to the mask 120. In FIG. 1, a detailed box structure is shown in FIG. 2 and FIG. 4. The substrate aligner 134 is connected to the unit body 131 or to the unit body 131. It may include a UVW driving force providing unit (not shown) for providing a driving force to move the substrate support plate 132, which is substantially in contact with the substrate in at least one direction selected from the X-axis, Y-axis, θ axis have. In practice, the unit main body 131 or the substrate supporting plate 132 connected to the unit main body 131 to be substantially supported by the substrate is moved in at least one direction selected from among X, Y, and θ axes. The structure for the present invention may be variously implemented by a combination of a cylinder, a motor, and a gear, so a detailed description thereof will be omitted.

Since the alignment of the substrate with respect to the mask 120 is performed through the substrate aligner 134 as described above, the substrate aligner 134 captures an image of alignment marks formed on the mask 120. It may further include a portion (not shown). The image information captured by the vision unit is transmitted to a controller (not shown), and the controller is connected to the unit main body 131 or the unit main body 131 through the control of the UVW driving force providing unit provided in the substrate aligner 134. Substantially moving the substrate supporting plate 132 to which the substrate is in contact with the substrate in at least one direction selected from among the X-axis, Y-axis, and θ-axis allows the alignment of the substrate with respect to the mask 120 can proceed.

The source 150 is disposed on one side of the mask 120 to provide a predetermined deposition material required for deposition to the substrate through the mask 120. The source 150 may provide the deposition material toward the substrate at a fixed position. However, when the mask 120 and the substrate are vertically disposed at an angle with respect to the direction of gravity as in the present embodiment, the fixed source may be used. It is difficult. For example, when using a fixed source, it is difficult to obtain a uniform deposition film because the relative displacement with the source 150 relative to the entire surface of the substrate is changed. Therefore, in the present embodiment, the source 150 is moved by the source aligning unit 160.

The source alignment moving unit 160 is connected to the source 150 to move the source 150 to the entire surface of the substrate, so that relative displacement with the source 150 with respect to the entire surface of the substrate may be substantially the same. It serves to align the source 150. That is, since the mask 120 and the substrate are inclined at an angle with respect to the gravity direction, the source 150 is also inclined (T, FIGS. 4 and 6) of the mask 120 and the substrate by the source alignment moving unit 160. The deposition material may be uniformly provided on the entire surface of the substrate by moving along the substrate, thereby obtaining a uniform deposition film required for the process.

Mainly referring to FIGS. 5 and 6, the source alignment moving unit 160 includes an up and down moving unit 170 for moving the source 150 along a vertical direction, which is a gravity direction, and a left and right direction crossing the vertical direction. FIG. 6 includes a left and right moving unit 180 for moving the source 150 and a controller (not shown) for controlling operations of the up and down moving unit 170 and the left and right moving unit 180. .

 For reference, since the left and right directions are directions described with reference to FIG. 6, the left and right directions may be the front and rear directions depending on the viewing angle. In this case, the left and right moving parts 180 may be referred to as the front and back moving parts.

The vertical movement unit 170 is spaced apart from each other and a pair of upper and lower rails 171, which are erected along the vertical direction, and the source 150 is detachably coupled and connected to the pair of upper and lower rails 171. And a source coupler 172 which moves up and down along a pair of up and down rails 171, and a vertical power provider 173 that provides power for up and down movement of the source coupler 172. .

The pair of upper and lower rails 171 may be spaced apart from each other in the chamber 100 and stand up along the vertical direction, and the upper end thereof may be partially exposed through the upper end of the chamber 100 as shown in FIG. 1. The reason why the upper end of the pair of upper and lower rails 171 is partially exposed through the upper end of the chamber 100 is that the vertical power supply unit 173 should be connected thereto.

Prior to the description of the source coupling unit 172, the up and down power providing unit 173 (see FIG. 1) will be described first. The up and down power providing unit 173 is a source coupling unit 172 to which the source 150 is coupled. This part provides power for the vertical movement of As shown in FIG. 1, it may be provided in an upper end region of the chamber 100.

The vertical power supply unit 173 connects a pair of upper and lower rails 171 exposed from the outside of the chamber 100, that is, from the upper end region of the chamber 100 to the upper end region of the chamber 100. And a driving motor 173b provided on one side of the connecting portion 173a to operate the pair of upper and lower rails 171 through the connecting portion 173a.

Thus, when the driving motor 173b is operated, the driving force from the driving motor 173b is transmitted to both of the pair of upper and lower rails 171 through the connecting portion 173a, so that the driving motor 173b is connected to the pair of upper and lower rails 171 to supply the source. The source coupling part 172 supporting the 150 may be moved up and down along the pair of upper and lower rails 171.

The source coupler 172 is a portion to which the source 150 is detachably coupled, and moves up and down along the pair of upper and lower rails 171 together with the source 150. In fact, in FIG. 5, the center region of the source coupler 172 is empty, and the source 150 is placed in this empty space.

The source coupling part 172 is connected to a pair of rail connection brackets 175 connected to a pair of upper and lower rails 171, and a pair of rail connection brackets 175, and a pair of rail connection brackets ( A fixed frame 176 operated in conjunction with 175 and a movable frame 177 provided to be movable relative to the fixed frame 176 between the fixed frame 176 and supporting the source 150 are provided.

5, which is a form or structure of a source coupling portion 172 having a pair of rail connecting brackets 175, a fixed frame 176, and a movable frame 177, is only one extremely schematic embodiment thereof. The form or structure need not be limited to the scope of the present invention.

On the other hand, the left and right moving unit 180 is provided between the fixed frame 176 and the movable frame 177, the movable frame 177 to support the source 150 in conjunction with the operation of the vertical moving unit 170. It serves to move in the left and right direction crossing the vertical direction.

The left and right moving parts 180 are rotatably coupled to the ball screw 181 and the ball screw 181 disposed along the direction in which the movable frame 177 is moved, and one side thereof is connected to the movable frame 177. A movable piece 182, a ball screw rotating motor (not shown) for rotating the ball screw 181 in the forward and reverse directions, and a pair of guide portions 183 are provided. The pair of guides 183 is disposed around the ball screw 181 to guide the movement of the movable frame 177 when the ball screw 181 operates.

Accordingly, when the ball screw rotation motor (not shown) is operated based on the control signal of the controller, the ball screw 181 rotates, and thus the movable piece 182 connected to the movable frame 177 is connected to the ball screw 181. While moving in the axial direction, as a result, the source 150 is moved in the left and right directions.

The controller controls the operation of the vertical movement unit 170 and the horizontal movement unit 180. That is, as shown in Figure 6, by the operation of the vertical movement unit 170, the source 150 is raised in the Z-1 direction and Z-2 direction in the initial state of the left and right movement unit 180 By the operation, the source 150 is interlocked with each other to move in the X-1 direction and the X-2 direction. When the source 150 is sprayed with the deposition material while the source 150 is raised from the bottom to the top by such a control, the entire surface of the substrate is maintained while maintaining the relative displacement with the standing substrate in a state inclined at an angle with respect to the gravity direction. The deposition material can be uniformly provided from the source to improve the quality of the deposited film, and furthermore, it is possible to prevent waste of the deposited material. Of course, in some cases, the source alignment moving unit 160 may further include a displacement sensor that detects displacement with the substrate, and the controller moves horizontally with the vertical movement unit 170 based on the signal of the sensor. The operation of the unit 180 may be controlled.

Referring to the operation of the thin film deposition apparatus for manufacturing an OLED having such a configuration is as follows.

First, when the substrate to be inclined into the chamber 100 along the tray transfer unit 140 is disposed on the surface of the substrate support plate 132 as shown in FIG. 2, the substrate holding unit 133 is the substrate support plate 132. The substrate is held on the surface of the substrate.

Next, when the position of the mask 120 is fixed as shown in FIG. 2, the vision unit (not shown) provided on the substrate aligner 134 photographs an alignment mark formed on the mask 120. . Based on this information, the controller then connects the unit body 131 or the substrate support plate 132 to which the substrate is substantially in contact with the unit body 131 and is selected from at least one of X, Y, and θ axes. By moving in one direction, the substrate is aligned with respect to the mask 120.

When the alignment operation is completed, the unit body 131 moves the substrate support plate 132 as shown in FIG. 3 so that the mask 120 and the substrate may be in surface contact with each other. At this time, the magnet array 134 is a magnetic field forming when the mask 120 and the substrate is in contact with the alignment is completed to make the mask 120 of the metal material more tightly adhered to the substrate to lift up between the mask 120 and the substrate. It is possible to prevent the deposition failure due to the phenomenon.

Once all the preparation for deposition is complete, that is, to achieve a precise flatness between the mask 120 and the substrate that has been placed at an angle to the direction of gravity, the deposition material is provided through the source 150 to provide a direction of gravity. It is deposited to the surface of the substrate standing up in a state inclined at a predetermined angle with respect to the gravity direction through the mask 120 standing in a state inclined with respect to the gravity direction. That is, as shown in FIG. 6, the controller 150 moves in the Z-1 direction and the Z-2 direction from the initial state by the operation of the vertical movement unit 170. By controlling the movement of the source 150 in the X-1 direction and the X-2 direction by the operation of the), by this control source 150 maintains a constant displacement relative to the substrate from the bottom to the top As one goes up, the deposition material is evenly sprayed.

According to the thin film deposition apparatus for manufacturing an OLED of the present embodiment having such a structure and operation, the deposition material from the source toward the surface of the substrate while maintaining a constant displacement with the substrate placed at a predetermined angle inclined with respect to the gravity direction. It can be provided uniformly to improve the quality of the deposited film, it is possible to further suppress the waste of the deposition material.

7 is a schematic structural diagram of a thin film deposition apparatus for manufacturing an OLED according to a first embodiment of the present invention.

Referring to this figure, the substrate holding alignment unit 130 is disposed in pairs on both sides with the source 150 interposed therebetween.

In this case, two sources 150 may be provided to spray the deposition material toward the substrates on both sides. As illustrated in FIG. 7, the deposition process is performed on the substrate on the right side as the source 150 rises. Then it can be implemented to proceed with the substrate on the left as it comes down again. In this case, a source rotating unit (not shown) to which a rotating motor may be applied may be further provided as a means for rotating the source 150.

As described above, the present invention is not limited to the described embodiments, and various modifications and changes can be made without departing from the spirit and scope of the present invention, which will be apparent to those skilled in the art. Therefore, such modifications or variations will have to be belong to the claims of the present invention.

100: chamber 120: mask
130: substrate holding alignment unit 131: unit body
132: substrate support plate 133: substrate holding part
134: substrate aligner 135: magnet array
140: tray transfer unit 150: source
160: source alignment unit 170: up and down moving unit
171: upper and lower rail 172: source coupling portion
173: up and down power supply unit 180: left and right moving unit
181: ball screw 182: movable piece

Claims (15)

A substrate holding alignment unit for aligning the substrate with respect to a mask in a state in which the substrate standing upright is inclined at a predetermined angle with respect to a gravity direction;
A source disposed on one side of the mask to provide a predetermined deposition material to the substrate through the mask; And
A source align moving unit connected to the source to move the source to the entire surface of the substrate, wherein the source align moving unit aligns the source so that relative displacement with the source is substantially equal with respect to the entire surface of the substrate; Thin film deposition apparatus for producing an OLED, characterized in that. The method of claim 1,
The source alignment moving unit, the thin film deposition apparatus for manufacturing an OLED, characterized in that it comprises a vertical moving unit for moving the source in the vertical direction of the gravity direction. The method of claim 2,
The vertical movement unit,
A pair of vertical rails spaced apart from each other and vertically disposed along the vertical direction;
A source coupling part detachably coupled to the source and connected to the pair of upper and lower rails to move up and down along the pair of upper and lower rails; And
Thin film deposition apparatus for manufacturing an OLED, characterized in that it comprises a vertical power supply for providing power for the vertical movement of the source coupling portion. The method of claim 3,
The vertical power supply unit,
A connection part connecting the pair of upper and lower rails outside the chamber; And
The thin film deposition apparatus for manufacturing an OLED, characterized in that it comprises a drive motor provided on any one side of the connecting portion to operate the pair of upper and lower rails through the connecting portion. The method of claim 3,
The source coupling portion,
A pair of rail connection brackets connected to the pair of upper and lower rails;
A fixed frame connected to the pair of rail connecting brackets and operating together with the pair of rail connecting brackets; And
And a movable frame provided to be movable relative to the fixed frame between the fixed frames and supporting the source. The method of claim 5,
The source alignment moving unit,
A left and right moving unit provided between the fixed frame and the movable frame and moving the movable frame supporting the source in a left and right direction intersecting with the up and down direction, interlocked with the operation of the up and down moving unit; And
Thin film deposition apparatus for manufacturing an OLED, characterized in that further comprising a controller for controlling the operation of the vertical movement unit and the horizontal movement unit. The method of claim 6,
The horizontal movement unit,
A ball screw disposed along a direction in which the movable frame is moved;
A movable piece rotatably coupled to the ball screw and having one side connected to the movable frame; And
Thin film deposition apparatus for manufacturing an OLED comprising a ball screw rotating motor for rotating the ball screw in the forward and reverse directions. The method of claim 7, wherein
The horizontal movement unit, the thin film deposition apparatus for manufacturing an OLED, characterized in that it further comprises a pair of guides which are disposed around the ball screw to guide the movement of the movable frame when the ball screw is operated. The method of claim 1,
The source alignment moving unit further comprises a displacement sensor for detecting a displacement with the substrate. The method of claim 1,
The substrate holding alignment unit is disposed in pairs on both sides with the source interposed therebetween.
The source alignment moving unit further comprises a source rotating unit for rotating the source so that the source is directed toward the pair of substrate holding alignment unit. The method of claim 1,
The substrate holding alignment unit,
Unit body;
A substrate support plate coupled to the unit body so as to be relatively movable, and supporting the substrate at one side facing the mask;
A substrate holding part for holding the substrate in contact with the substrate supporting plate at a corresponding position; And
And a substrate aligner connected to the unit body to align the substrate with respect to the mask. The method of claim 11,
The substrate supporting plate is a thin film deposition apparatus for manufacturing an OLED, characterized in that the cooling plate (cooling plate). The method of claim 11,
The substrate holding alignment unit is provided on the substrate supporting plate, and generates a magnetic force that pulls the mask toward the unit body with the substrate interposed therebetween such that the mask may be brought into surface contact with the substrate. Thin film deposition apparatus for manufacturing an OLED, characterized in that it further comprises an array. The method of claim 13,
The mast array is a thin film deposition apparatus for manufacturing an OLED, characterized in that provided by the array structure of a plurality of unit magnets to be embedded in the substrate support plate. The method of claim 11,
The substrate aligner further comprises a vision unit for photographing the alignment mark (align mark) of the mask.

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