KR101145200B1 - Thin layers deposition apparatus for manufacturing oled - Google Patents

Abstract

A thin film deposition apparatus for manufacturing an OLED is disclosed. The thin film deposition apparatus for manufacturing an OLED of the present invention includes a chamber; An alignment reference part provided in the chamber along a direction crossing the bottom surface of the chamber; A mask disposed in parallel with the alignment reference part and selectively contacting the alignment reference part; And a substrate holding alignment unit which is disposed to face the mask with respect to the alignment reference unit, and that aligns the substrate with respect to the mask with respect to the mask with respect to the alignment reference unit while holding the substrate arranged in parallel with the mask. It features. According to the present invention, it is possible to significantly reduce the deflection compared to the size of the mask, and to reduce the space of the chamber, as well as to precisely align the substrate and the mask, which is particularly suitable for large-scale OLED production. Can be applied.

Description

Thin film deposition apparatus for OLD manufacturing {THIN LAYERS DEPOSITION APPARATUS FOR MANUFACTURING OLED}

The present invention relates to a thin film deposition apparatus for manufacturing an OLED, and more particularly, it is possible to significantly reduce the deflection compared to the size of the mask, and to reduce the space of the chamber as compared to the conventional, as well as to align the substrate and the mask. The present invention relates to a thin film deposition apparatus for manufacturing OLED, which can be made precisely, and can be suitably applied to large-scale OLED production.

In general, an organic light emitting display (OLED), which is a flat panel display element, is an ultra-thin display device that realizes color images by self-emission of organic materials, and is promising next-generation in that its structure is simple and its light efficiency is high. It is attracting attention as a display device.

The organic light emitting display OLED includes an anode and a cathode, and organic layers interposed between the anode and the cathode. The organic layers may include at least a light emitting layer, and may further include a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer in addition to the light emitting layer.

The organic light emitting display device may be classified into a polymer organic light emitting device and a low molecular weight organic light emitting device according to an organic layer, in particular, a material forming a light emitting layer. In order to realize full color, the light emitting layer needs to be patterned. In order to manufacture a large OLED, a direct patterning method using a fine metal mask (FMM) and a laser induced thermal imaging (LITI) method are used. There is a method applied, a method using a color filter.

On the other hand, when manufacturing a large size OLED by applying a mask method, a so-called horizontal upward deposition method in which a substrate and a patterned mask are horizontally disposed in a chamber and then deposited is applied. The horizontal upward deposition method is a method of aligning a substrate and a mask disposed horizontally with respect to a bottom surface of a chamber or the like, bonding them together, and depositing organic material on a large substrate in a horizontal state.

However, as OLEDs become larger in size, masks are becoming larger and larger in weight, and in this case, deflection of the mask occurs in the direction of gravity, making it difficult to closely adhere the mask to the substrate, thereby eventually securing the precision required for mass production. There is a difficult problem.

In consideration of this problem, a method of aligning the substrate and the mask disposed in the horizontal direction with respect to the bottom surface of the chamber and bonding them together, and then rotating the bonded substrate and the mask, setting them in the vertical direction, and depositing organic materials may be considered. However, even in this case, there is a problem in that the space of the chamber is increased, that is, the foot print is increased because the substrate and the mask bonded in the horizontal direction in the chamber must be rotated to stand in the vertical direction.

It is an object of the present invention to significantly reduce the deflection compared to the size of the mask, and to reduce the space of the chamber, as well as to precisely align the substrate and the mask. It is to provide a thin film deposition apparatus for manufacturing an OLED that can be suitably applied.

The object is, according to the present invention, a chamber; An alignment reference part provided in the chamber along a direction crossing the bottom surface of the chamber; A mask disposed in parallel with the alignment reference part and selectively contacting the alignment reference part; And a substrate holding alignment arranged to face the mask with respect to the alignment reference portion, and to align the substrate with respect to the mask with respect to the mask with respect to the alignment reference portion in a state of holding a substrate disposed in parallel with the mask. It is achieved by a thin film deposition apparatus for producing an OLED, characterized in that it comprises a phosphorus unit.

The alignment reference part may be a plate type alignment reference plate which forms an alignment reference of the mask but is partially coupled to one side of an inner wall surface of the chamber.

The substrate holding alignment unit includes a unit body; A substrate support plate coupled to the unit body so as to be relatively movable, and supporting the substrate at one side facing the mask; A substrate holding part for holding the substrate in contact with the substrate supporting plate at a corresponding position; And a substrate aligner connected to the unit main body to align the substrate with respect to the mask.

The substrate supporting plate may be a cooling plate.

The substrate holding alignment unit is provided on the substrate supporting plate, and generates a magnetic force that pulls the mask toward the unit body with the substrate interposed therebetween such that the mask may be brought into surface contact with the substrate. It may further comprise an array.

The magnet array may be provided by an arrangement structure of a plurality of unit magnets to be embedded in the substrate supporting plate.

The substrate aligner may further include a vision unit to photograph an alignment mark of the mask.

A mask chucking unit provided at a position adjacent to the alignment reference unit to chuck the mask disposed in contact with the alignment reference unit at a corresponding position; A mask driver connected to the mask to drive the mask toward the alignment reference part; A tray transfer unit for transferring the tray supporting the substrate; And a source disposed on one side of the mask to provide a predetermined deposition material to the substrate through the mask.

On the other hand, the above object, according to the present invention; And a unit body and a mask disposed along a direction crossing the bottom surface of the chamber and fixedly coupled to the unit body, wherein the substrate is aligned with respect to the mask while the substrate is held in parallel with the mask. It is also achieved by a thin film deposition apparatus for manufacturing an OLED, characterized in that it comprises a substrate holding alignment unit.

The substrate holding alignment unit may include: a substrate supporting plate coupled to the unit main body so as to be relatively movable and supporting the substrate at one side facing the mask; A substrate holding part for holding the substrate in contact with the substrate supporting plate at a corresponding position; And a substrate aligner connected to the unit main body to align the substrate with respect to the mask.

The substrate support plate may be a cooling plate, and the substrate support plate may include a body part inserted into a through hole region of the alignment reference part; And a flange portion connected to the body portion and having a larger size than the body portion, and supported on a sidewall of the alignment reference portion when the body portion is inserted into a through hole region of the alignment reference portion.

The substrate holding alignment unit is provided on the substrate supporting plate, and generates a magnetic force that pulls the mask toward the unit body with the substrate interposed therebetween such that the mask may be brought into surface contact with the substrate. It may further comprise an array.

The magnet array may be provided by an arrangement structure of a plurality of unit magnets to be embedded in the substrate supporting plate.

The substrate aligner may further include a vision unit to photograph an alignment mark of the mask.

On the other hand, the above object, according to the present invention; A mask auto aligner for aligning a mask provided in the chamber along a direction crossing the bottom surface of the chamber; And a substrate holding alignment unit which aligns the substrate with respect to the mask in a state in which the substrate is held in parallel with the mask at a position adjacent to the mask. .

Here, the substrate holding alignment unit may include a unit body; A substrate support plate coupled to the unit body so as to be relatively movable, and supporting the substrate at one side facing the mask; A substrate holding part for holding the substrate in contact with the substrate supporting plate at a corresponding position; And a substrate aligner connected to the unit main body to align the substrate with respect to the mask.

The substrate supporting plate may be a cooling plate.

The substrate holding alignment unit is provided on the substrate supporting plate, and generates a magnetic force that pulls the mask toward the unit body with the substrate interposed therebetween such that the mask may be brought into surface contact with the substrate. It may further comprise an array.

The magnet array may be provided by an arrangement structure of a plurality of unit magnets to be embedded in the substrate supporting plate.

The substrate aligner may include a vision unit to photograph an alignment mark of the mask; And it may further include a displacement sensor for measuring the displacement of the mask.

According to the present invention, the deflection compared to the size of the mask can be significantly reduced compared to the conventional, the space of the chamber can be reduced as well as the conventional, and the alignment of the substrate and the mask can be made precisely, particularly suitable for large-scale OLED production Can be applied.

1 is a schematic structural diagram of a thin film deposition apparatus for manufacturing an OLED according to a first embodiment of the present invention.
2 is a diagram illustrating an operating state of FIG. 1.
3 is a plan view of the alignment reference unit.
4 is a schematic structural diagram of a thin film deposition apparatus for manufacturing an OLED according to a second embodiment of the present invention.
5 and 6 are views showing the structure and operation of the thin film deposition apparatus for manufacturing OLED according to the third embodiment of the present invention, respectively.
7 and 8 are views showing the structure and operation of the thin film deposition apparatus for manufacturing an OLED according to the fourth embodiment of the present invention, respectively.

In order to fully understand the present invention, the operational advantages of the present invention, and the objects achieved by the practice of the present invention, reference should be made to the accompanying drawings which illustrate preferred embodiments of the present invention and the contents described in the accompanying drawings.

Hereinafter, the present invention will be described in detail by explaining preferred embodiments of the present invention with reference to the accompanying drawings. Like reference numerals in the drawings denote like elements.

1 is a schematic structural diagram of a thin film deposition apparatus for manufacturing an OLED according to a first embodiment of the present invention, FIG. 2 is a view showing an operating state of FIG. 1, and FIG. 3 is a planar structural diagram of an alignment reference unit.

As shown in these figures, in the thin film deposition apparatus for manufacturing an OLED of the present embodiment, unlike the prior art, the mask 120 (Fine Metal Mask, FMM) and the substrate are respectively crossed with respect to the bottom surface 101 of the chamber 100, That is, by being disposed in a vertical direction and being folded, the deposition can be performed while maintaining a precise flatness with each other. Here, the precision flatness means that the mask 120 and the substrate are in uniform contact with each other over the entire area. As described above, the substrate may be an organic light emitting display (OLED).

As shown in FIGS. 1 and 2, the thin film deposition apparatus for manufacturing an OLED is an alignment reference provided in the chamber 100 along a direction crossing the chamber 100 and the bottom surface 101 of the chamber 100. The mask 110, which is disposed in parallel with the alignment reference unit 110 and selectively contacts the alignment reference unit 110, and the mask 120 around the alignment reference unit 110. ) And a substrate holding alignment unit 130 for aligning the substrate with respect to the mask 120 based on the alignment reference unit 110 while holding a substrate disposed to be parallel to the mask 120. ).

The chamber 100 is a portion indicated by dark dotted lines in FIGS. 1 and 2 to form a place where a deposition process for a substrate is performed. The interior of the chamber 100 forms a vacuum atmosphere so that the deposition process on the substrate can be performed reliably. Therefore, although not shown, a vacuum pump may be connected to one side of the chamber 100 to suck the air in the chamber 100 to maintain the vacuum in the chamber 100.

The alignment reference unit 110 is a portion that forms an alignment reference of the mask 120 and serves as a medium for the deposition process to be performed in a state where both the mask 120 and the substrate are perpendicular to each other in the chamber 100. .

As shown in FIG. 3, the alignment reference part 110 includes a plate type in which a through hole 111 is formed in a central region and an outer wall thereof is partially coupled to one side of an inner wall surface of the chamber 100. It may be provided as an alignment reference plate 110.

In particular, since the alignment reference plate 110 should form the alignment reference of the mask 120, one side wall of the alignment reference plate 110 to which the mask 120 is in contact with the mask 120 is manufactured as a surface plate. The mask 120 and the substrate on which the alignment is completed may be brought into surface contact with each other through the through hole 111. The outer wall of the alignment reference plate 110 may be coupled (fixed) to the inner wall surface of the chamber 100 by welding, fastening using a separate bracket, or the like.

The mask 120 is contact-supported to the surface of the substrate in order to proceed with deposition in a predetermined pattern on the surface of the substrate. As described above, the mask 120 is in contact support with the alignment reference plate 110 because the relative alignment to the substrate is very important. Although not shown in detail, the mask 120 is provided with a plurality of through holes (not shown) through which the deposition material from the source 150 passes. The size of the mask 120 is provided relatively larger than the size of the through hole 111 of the alignment reference plate 110.

In the present embodiment, since the mask 120 is also disposed in parallel with the alignment reference plate 110, that is, perpendicular to the direction crossing the bottom surface 101 of the chamber 100, the size of the mask 120 is increased. Even if it is larger, the deflection compared to the size of the mask 120 can be significantly reduced than before, and the space of the chamber 100 can be reduced as compared with the conventional, and the alignment between the substrate and the mask 120 can be made precisely. It can be suitably applied to large OLED mass production.

Means for driving (moving) the mask 120 toward the alignment reference plate 110, because the mask 120 should be in contact with the one side wall of the alignment reference plate 110, as shown in Figure 2 during the deposition process, And a means for chucking the mask 120 is required after the mask 120 is in contact with the one side wall of the alignment reference plate 110. The former is in charge of the mask driver (not shown), and the latter is in charge of the mask chucking unit 125 schematically shown in FIGS. 1 and 2.

In detail, the mask driving unit may be applied to a cylinder, a linear motor, a combination of a motor and a ball screw, or a robot. As shown in FIG. 2, the mask 120 is moved so that the mask 120 is in contact with and supported on one side wall of the alignment reference plate 110 forming the reference.

The mask chucking unit 125 may be applied to a cylinder, an actuator, or the like, and is provided at a position adjacent to the alignment reference plate 110 to be in contact with and supported on the alignment reference plate 110. It serves to chuck the mask 120 so that the mask 120 is not randomly displaced or repositioned.

For reference, in this embodiment, the mask 120 has been described as a structure that can be moved only toward the alignment reference plate 110 in the interior of the chamber 100, but if a replaceable mask (not shown) is applied separately The replacement mask (not shown) may move into and out of the chamber 100 by the mask moving unit (not shown), and thus may be involved in the deposition process.

One side of the mask 120 is provided with a source 150 for providing a predetermined deposition material required for deposition to the substrate through the mask 120.

On the other hand, the substrate holding alignment unit 130 is disposed to face the mask 120 around the alignment reference plate 110, and the alignment reference in the state in which the substrate is held in parallel with the mask 120. The substrate 110 serves to align the substrate with respect to the mask 120.

The substrate holding alignment unit 130 may include a unit main body 131, a substrate supporting plate 132 coupled to the unit main body 131 so as to be relatively movable, and having a substrate supported on one side toward the mask 120. In addition, the substrate holding part 133 holding the substrate in contact with the substrate supporting plate 132 at the corresponding position, and the substrate aligning operation of the substrate with respect to the mask 120 connected to the unit body 131. Liner 134.

The unit body 131 is provided with components for moving the substrate supporting plate 132 toward the alignment reference plate 110 or returning to the opposite home position, one region being inside the chamber 100, and The remaining area is disposed outside of the chamber 100.

The substrate support plate 132 is a place where the substrate is supported on the surface. For reference, the substrate may be transferred into the chamber 100 along the tray transfer part 140 in the form of a roller through a separate tray 141, and after the substrate is transferred, the substrate support plate 132 may be Is placed on the surface. As described above, the surface of the substrate supporting plate 132 is also in parallel with the mask 120 because the substrate is supported on the surface of the substrate supporting plate 132 after being fed vertically, ie, standing up like the mask 120. Keep it.

As shown in FIG. 1, the substrate supporting plate 132 includes a body portion 132a inserted into a through hole 111 (see FIG. 3) of the alignment reference plate 110, and a body portion 132a. ) And has a larger size than the body portion 132a, and the alignment reference plate 110 when the body portion 132a is inserted into the through hole 111 region of the alignment reference plate 110 as shown in FIG. 2. A flange portion 132b supported on the sidewall of the substrate. As the substrate supporting plate 132 has a body portion 132a and a flange portion 132b out of a simple block structure, the relative alignment of the substrate with respect to the mask 120 is relatively more convenient. There is an advantage that can be easily performed. That is, when the substrate is moved toward the mask 120 with respect to the mask 120 with respect to the mask 120, the body portion 132a of the substrate supporting plate 132 on which the substrate is supported is aligned with an alignment reference plate ( Since it is inserted into the through hole 111 region of the 110, the relative displacement of the substrate with respect to the mask 120 can be naturally matched.

In this embodiment, the substrate supporting plate 132 is applied as a cooling plate 132. The substrate supporting plate 132, which may be applied to the cooling plate 132, may improve the deposition efficiency by lowering the temperature of the substrate before the actual deposition process is performed on the surface of the substrate. Of course, since the scope of the present invention does not need to be limited thereto, instead of providing the substrate supporting plate 132 as the cooling plate 132, the cooling water or the cooling air injection line is disposed in the substrate supporting plate 132. It is also possible enough.

The magnet for generating a magnetic force that pulls the mask 120 toward the unit body 131 with the substrate interposed therebetween so that the metal mask 120 may be in surface contact with the substrate while being in contact with the substrate. The array 134 is further provided. That is, the magnet array 134 is deposited due to the lifting phenomenon between the mask 120 and the substrate such that the mask 120, which is a metal material, is more closely adhered to the substrate through magnetic field formation when the mask 120 is in contact with the substrate. To prevent the occurrence of defects. In the present embodiment, the magnet array 134 is provided by an array structure of a plurality of unit magnets (not shown) provided to be embedded in the substrate supporting plate 132, but the scope of the present invention is not limited thereto.

The board | substrate holding part 133 is a means for holding the board | substrate arrange | positioned at the surface of the board | substrate support plate 132 in the said position. In particular, in the case of the present embodiment, since the substrate is supplied vertically and the substrate is a large substrate, the substrate should be held without shaking. In this embodiment, the structure capable of elastically supporting the substrate is schematically illustrated, but the scope of the present invention is not necessarily limited thereto.

In the provision of the substrate holding part 133, since the substrate must be substantially in surface contact with the mask 120 as shown in FIG. 2, it is difficult for the substrate holding part 133 to interfere with it. Therefore, it is not preferable that the distal end portion of the substrate holding part 133 protrude more toward the mask 120 than the surface of the substrate.

The substrate aligner 134 is connected to the unit main body 131 and performs alignment of the substrate with respect to the mask 120. Although shown in a schematic box structure in the drawing, the substrate aligner 134 is connected to the unit main body 131 or the unit main body 131, and the substrate supporting plate 132 which is substantially in contact with the substrate. It may include a UVW driving force providing unit (not shown) for providing a driving force to move in the at least one direction selected from the X-axis, Y-axis, θ axis. In practice, the unit main body 131 or the substrate supporting plate 132 connected to the unit main body 131 to be substantially in contact with the substrate is moved in at least one direction selected from among X, Y, and θ axes. Since the structure may vary, a detailed description thereof will be omitted.

Since the alignment of the substrate with respect to the mask 120 is performed through the substrate aligner 134 as described above, the substrate aligner 134 captures an image of alignment marks formed on the mask 120. It may further include a portion (not shown). The image information photographed by the vision unit is transmitted to a controller (not shown), and the controller is connected to the unit main body 131 or the unit main body 131 through the control of the UVW driving force providing unit provided in the substrate aligner 134. Substantially, the substrate supporting plate 132 on which the substrate is in contact with the substrate is moved in at least one direction selected from the X-axis, the Y-axis, and the θ-axis so that the alignment of the substrate with respect to the mask 120 may proceed.

Referring to the operation of the thin film deposition apparatus for manufacturing an OLED having such a configuration is as follows.

First, when the substrate vertically transferred to the inside of the chamber 100 along the tray transfer part 140 in FIG. 1 to FIG. 2 is disposed on the surface of the substrate support plate 132, the substrate grip part 133 is used for substrate support. The substrate is held by the surface of the plate 132.

Next, as shown in FIG. 1, the mask driver is operated as shown in FIG. 2 to operate the mask 120 disposed in the vertical direction in the direction of arrow A of FIG. 2 so that the mask 120 is in contact with the alignment reference plate 110. do. After the mask 120 is in contact with the alignment reference plate 110, the mask chucking unit 125 chucks the mask 120 at a corresponding position so that the mask 120 is not randomly displaced or repositioned.

Subsequently, when the vision unit (not shown) provided on the substrate aligner 134 photographs an alignment mark formed on the mask 120, the controller controls the unit body 131 or the unit based on this information. Alignment operation of the substrate with respect to the mask 120 by moving the substrate support plate 132 connected to the main body 131 and substantially supporting the substrate in at least one direction selected from among X, Y, and θ axes. Proceed.

When the relative alignment of the substrate, which is also vertical with respect to the vertical mask 120 based on the alignment reference plate 110, is completed, the unit body 131 moves the substrate supporting plate 132 to the arrow of FIG. 2. By moving in the B direction through the through-hole 111 region of the alignment reference plate 110 so that the mask 120 and the substrate has been aligned with each other and the surface contact with each other. At this time, the magnet array 134 is a magnetic field forming when the mask 120 and the substrate is in contact with the alignment is completed to make the mask 120 of the metal material more tightly adhered to the substrate to lift up between the mask 120 and the substrate. It is possible to prevent the deposition failure due to the phenomenon.

When all preparation for deposition is complete, i.e., precise flatness of the mask 120 and the substrate, which are arranged perpendicularly, ie perpendicularly, to the bottom surface 101 of the chamber 100 using the alignment reference plate 110. After the deposition, the deposition material is provided through the source 150 and deposited through the vertically disposed mask 120 to the surface of the vertically arranged substrate, and when the deposition time is completed, the deposited substrate is extracted.

According to the thin film deposition apparatus for manufacturing an OLED of the present embodiment having such a structure and operation as described above, the deflection compared to the size of the mask 120 can be significantly reduced than before, and the space of the chamber 100 can be reduced as well as the substrate. And the alignment of the mask 120 can be made precisely, in particular, it can be suitably applied to large-scale OLED mass production.

4 is a schematic structural diagram of a thin film deposition apparatus for manufacturing an OLED according to a second embodiment of the present invention.

In the present exemplary embodiment, the alignment reference plate 110 is disposed to intersect with respect to the bottom surface 101 of the chamber 100, but the mask 120a is previously supported in contact with the alignment reference plate 110. That is, the structure is coupled to a predetermined position of the alignment reference plate 110 on the substrate side.

Meanwhile, in the case of FIG. 4, a simple block structure may be sufficient as the shape of the substrate supporting plate 132 ′, which may be equally applied to the following embodiments.

5 and 6 are views showing the structure and operation of the thin film deposition apparatus for manufacturing OLED according to the third embodiment of the present invention, respectively.

Referring to these drawings, the thin film deposition apparatus for manufacturing an OLED according to the present embodiment has substantially the same structure and operation as those of the above-described embodiments except that the substrate holding alignment unit 130b includes a mask 120b. same.

That is, in this embodiment, the substrate holding alignment unit 130b includes a unit body 131, a mask 120b fixedly coupled to an end portion of the extension part 131b extending from the unit body 131, and a unit body ( The substrate holding plate 132 coupled to the 131 so as to be movable relative to the mask 120b and holding the substrate in contact with the substrate supporting plate 132 at the corresponding position. 133 and a substrate aligner 134 connected to the unit main body 131 to align the substrate with respect to the mask 120b.

As such, when the mask 120b is fixed to the unit body 131, the mask chucking unit 125 described above may not be necessary. Even if the thin film deposition apparatus for manufacturing an OLED is manufactured with the structure as shown in FIGS. The deflection compared to the size of the 120b can be significantly reduced compared to the conventional one, and the space of the chamber 100 can be reduced more than the conventional one, and the alignment between the substrate and the mask 120b can be made precisely. It can be suitably applied to manufacturing.

In fact, in the present embodiment, since the driving time of the mask 120 is omitted, it is expected that the deposition process can be completed in a shorter time.

7 and 8 are views showing the structure and operation of the thin film deposition apparatus for manufacturing an OLED according to the fourth embodiment of the present invention, respectively.

Referring to these drawings, in the thin film deposition apparatus for manufacturing an OLED of the present embodiment, a mask 120c provided in the chamber 100 along a direction crossing the bottom surface 101 of the chamber 100 is a separate mask auto-aligner. The actual structure and operation are the same as those of the first embodiment except that it is auto-aligned by 170.

However, when the mask 120c is auto-aligned by the mask auto aligner 170 as described above, the vision portion (not shown) in which the substrate aligner 134c photographs the alignment mark of the mask 120c. In addition, it is preferable to further include a displacement sensor (not shown) for measuring the displacement of the mask (120c). At this time, the control unit is connected to the unit body 131 or the unit body 131 based on the information from the vision unit (not shown) and the displacement sensor (not shown) substrate support plate (substrate) The substrate aligner 134c may be controlled to move 132 in at least one direction selected from among an X-axis, a Y-axis, and a θ-axis.

As such, even when the thin film deposition apparatus for manufacturing an OLED is manufactured in a structure in which the mask 120c is auto-aligned by the mask auto aligner 170, the sag compared to the size of the mask 120c may be significantly reduced, and the chamber 100 may be Not only can the space be reduced, but the alignment of the substrate and the mask 120c can be precisely performed, and thus, it can be particularly suitable for large-scale OLED mass production.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Therefore, such modifications or variations will have to be belong to the claims of the present invention.

100: chamber 101: bottom surface
110: alignment reference unit 120: mask
125 mask chucking unit 130 substrate holding alignment unit
131: unit body 132: substrate support plate
133: substrate holding portion 134: substrate aligner
135: magnet array 140: tray transfer unit
150: Source 170: Mask Auto Aligner

Claims (20)

chamber;
An alignment reference part provided in the chamber along a direction crossing the bottom surface of the chamber;
A mask disposed in parallel with the alignment reference part and selectively contacting the alignment reference part; And
A substrate holding alignment arranged to face the mask with respect to the mask, and to align the substrate with respect to the mask with respect to the mask while the substrate disposed in parallel with the mask is held. Unit,
The substrate holding alignment unit,
Unit body;
A substrate support plate coupled to the unit body so as to be relatively movable, and supporting the substrate at one side facing the mask;
A substrate holding part for holding the substrate in contact with the substrate supporting plate at a corresponding position; And
And a substrate aligner connected to the unit body to align the substrate with respect to the mask. The method of claim 1,
The alignment reference unit is a thin film deposition apparatus for manufacturing an OLED, characterized in that the alignment reference plate of the plate type (plate type) which forms an alignment reference of the mask, but is partially coupled to one side of the inner wall surface of the chamber. delete The method of claim 1,
The substrate support plate is a cooling plate (cooling plate),
The substrate support plate,
A body part inserted into a through hole area of the alignment reference part; And
It is connected to the body portion and has a larger size than the body portion, characterized in that it comprises a flange portion which is supported on the side wall of the alignment reference portion when the body portion is inserted into the through hole region of the alignment reference portion Thin film deposition apparatus for OLED manufacturing. The method of claim 1,
The substrate holding alignment unit is provided on the substrate supporting plate, and generates a magnetic force that pulls the mask toward the unit body with the substrate interposed therebetween such that the mask may be brought into surface contact with the substrate. Thin film deposition apparatus for manufacturing an OLED, characterized in that it further comprises an array. The method of claim 5,
The magnet array is a thin film deposition apparatus for manufacturing an OLED, characterized in that provided by the array structure of a plurality of unit magnets provided to be embedded in the substrate support plate. The method of claim 5,
The substrate aligner further comprises a vision unit for photographing the alignment mark (align mark) of the mask. The method of claim 1,
A mask chucking unit provided at a position adjacent to the alignment reference unit to chuck the mask disposed in contact with the alignment reference unit at a corresponding position;
A mask driver connected to the mask to drive the mask toward the alignment reference part;
A tray transfer unit for transferring the tray supporting the substrate; And
And a source disposed on one side of the mask to provide a predetermined deposition material to the substrate through the mask. chamber; And
A unit body and a mask disposed along a direction crossing the bottom surface of the chamber and fixedly coupled to the unit body, the substrate being aligned with respect to the mask while the substrate is held in parallel with the mask. A substrate holding alignment unit,
The substrate holding alignment unit,
A substrate support plate coupled to the unit body so as to be relatively movable, and supporting the substrate at one side facing the mask;
A substrate holding part for holding the substrate in contact with the substrate supporting plate at a corresponding position; And
And a substrate aligner connected to the unit body to align the substrate with respect to the mask. delete 10. The method of claim 9,
The substrate supporting plate is a thin film deposition apparatus for manufacturing an OLED, characterized in that the cooling plate (cooling plate). 10. The method of claim 9,
The substrate holding alignment unit is provided on the substrate supporting plate, and generates a magnetic force that pulls the mask toward the unit body with the substrate interposed therebetween such that the mask may be brought into surface contact with the substrate. Thin film deposition apparatus for manufacturing an OLED, characterized in that it further comprises an array. The method of claim 12,
The magnet array is a thin film deposition apparatus for manufacturing an OLED, characterized in that provided by the array structure of a plurality of unit magnets provided to be embedded in the substrate support plate. 10. The method of claim 9,
The substrate aligner further comprises a vision unit for photographing the alignment mark (align mark) of the mask. chamber;
A mask auto aligner for aligning a mask provided in the chamber along a direction crossing the bottom surface of the chamber; And
A substrate holding alignment unit which aligns the substrate with respect to the mask in a state in which the substrate is held in parallel with the mask at a position adjacent to the mask,
The substrate holding alignment unit,
Unit body;
A substrate support plate coupled to the unit body so as to be relatively movable, and supporting the substrate at one side facing the mask;
A substrate holding part for holding the substrate in contact with the substrate supporting plate at a corresponding position; And
And a substrate aligner connected to the unit body to align the substrate with respect to the mask. delete 16. The method of claim 15,
The substrate supporting plate is a thin film deposition apparatus for manufacturing an OLED, characterized in that the cooling plate (cooling plate). 16. The method of claim 15,
The substrate holding alignment unit is provided on the substrate supporting plate, and generates a magnetic force that pulls the mask toward the unit body with the substrate interposed therebetween such that the mask may be brought into surface contact with the substrate. Thin film deposition apparatus for manufacturing an OLED, characterized in that it further comprises an array. The method of claim 18,
The magnet array is a thin film deposition apparatus for manufacturing an OLED, characterized in that provided by the array structure of a plurality of unit magnets provided to be embedded in the substrate support plate. 16. The method of claim 15,
The substrate aligner,
A vision unit to photograph an alignment mark of the mask; And
Thin film deposition apparatus for manufacturing an OLED, characterized in that it further comprises a displacement sensor for measuring the displacement of the mask.

Images