KR101176838B1 - Transfer for thin layers deposition system of oled - Google Patents

Abstract

Disclosed is a transfer apparatus of a thin film deposition system for manufacturing an OLED. The transfer apparatus of the thin film deposition system for manufacturing an OLED of the present invention, the upper roller guide for guiding the upper end of the substrate (carrier) on which the substrate or substrate is seated; A lower conveying roller for conveying the substrate or carrier together with the upper roller guide in an upright state inclined at an angle with respect to the gravity direction; And an inclination guide roller for supporting an inclined state of the substrate or the carrier. According to the present invention, since the substrate can be transferred in a standing state inclined at a certain angle with respect to the gravity direction, even if particles are attached to the surface of the mask or the substrate during transfer, the particles attached to the surface of the mask or the substrate are automatically dropped. In addition, the contact between the mask and the substrate may be more easily performed in a state in which the deposition of the organic material between the fine gaps during the deposition process may be reduced than before.

Description

Transfer device for thin film deposition system for manufacturing OLEDs {TRANSFER FOR THIN LAYERS DEPOSITION SYSTEM OF OLED}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer apparatus for a thin film deposition system for manufacturing an OLED, and more particularly, to transfer a substrate in a standing state inclined at an angle with respect to the gravity direction. Even if it is attached, particles adhered to the surface of the mask or the substrate may automatically fall, and the deposition between the mask and the substrate may be more easily performed in a state in which organic matter is deposited between the fine gaps during the deposition process. The present invention relates to a transfer device of a thin film deposition system for manufacturing an OLED that can be in close contact.

In general, organic light emitting display (OLED), which is a flat panel display element, is an ultra-thin display device that realizes color images by self-emission of organic materials. It is attracting attention as a display device.

The OLED includes an anode and a cathode, and organic layers interposed between the anode and the cathode. The organic layers may include at least a light emitting layer, and may further include a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer in addition to the light emitting layer.

The OLED may be classified into a polymer organic light emitting device and a low molecular organic light emitting device according to an organic layer, in particular, a light emitting layer. In order to realize full color, the light emitting layer needs to be patterned. In order to manufacture a large OLED, a direct patterning method using a fine metal mask (FMM) and a laser induced thermal imaging (LITI) method are used. There is a method applied, a method using a color filter.

Meanwhile, the most important issue in the OLED process is the particle issue. As described above, the OLED deposits organic material during the deposition process and implements a display based on the principle of emitting light by the deposited organic material. Thus, when particles are generated during the organic material deposition process, it becomes a problem of defects in the finished product.

In consideration of this problem, that is, in order to minimize particle issues, consider applying a deposition process by attaching a substrate to a vertically mounted mask by transferring a mask vertically by a conveyor conveying system or a magnetic levitation system. Doing.

However, in this case, a fine gap may be generated between the mask and the substrate standing vertically, and a phenomenon in which an organic material is deposited between the mask and the substrate during the deposition process may occur to form a desired pattern. Since a difficult problem occurs, a countermeasure is required.

For reference, when analyzing the cause of the minute gap between the mask and the substrate, when the mask is standing vertically, the convex bulge occurs over time in the inner part of the mask having a frame structure. It is known that a small gap is generated between the mask and the substrate due to the deformation, and the difference in the flatness between the edge and the filled region has been observed to be about 300 μm as a result of the actual measurement.

In addition, when the mask and the substrate are vertically transferred, there is a problem that particles adhered to the surface of the mask or the substrate remain intact during the transfer, so that countermeasures are required.

An object of the present invention is that, even when particles are attached to the surface of the mask or the substrate during transfer, the particles are automatically attached to the surface of the mask or the substrate because the substrate can be transferred in an upright state inclined at an angle to the direction of gravity. A transfer device of a thin film deposition system for manufacturing OLEDs, which can fall down and can be brought into close contact between a mask and a substrate more easily in a state in which organic matters can be reduced between fine gaps during the deposition process. To provide.

The object, according to the present invention, the upper roller guide for guiding the upper end of the substrate (carrier) on which the substrate or the carrier is seated; A lower transfer roller configured to transfer the substrate or the carrier together with the upper roller guide in an upright state inclined at an angle with respect to the gravity direction; And an inclination guide roller for supporting an inclined state of the substrate or the carrier.

Here, the tilt guide roller may be a lower tilt guide roller disposed adjacent to the lower transfer roller.

It may further include a lower angle adjusting plate coupled to the lower conveying roller to adjust the angle of the lower conveying roller.

It may further include an upper angle adjusting plate coupled to the upper roller guide to adjust the angle of the upper roller guide.

A drive motor for providing power; And a bevel gear driven by the driving motor and connected to the lower feed roller.

The transfer device may transfer the substrate or the carrier in an upright state inclined at a predetermined angle with respect to the gravity direction so that the particles may fall in the downward direction, which is the gravity direction.

The conveying apparatus may convey the carrier in an upright state inclined at an angle with respect to the gravity direction.

The predetermined angle may be 70 degrees to 89 degrees.

On the other hand, the above object, according to the present invention, the magnet guide; A magnetic levitation module for magnetic levitation of a substrate or a carrier on which the substrate is mounted together with the magnet guide; And a control unit for controlling the magnetic levitation module to magnetically float the substrate or the carrier in a standing state inclined at a predetermined angle with respect to the gravity direction.

Here, the magnet guide is adjustable in angle but can be controlled by the controller.

The predetermined angle may be 70 degrees to 89 degrees.

According to the present invention, since the substrate can be transported in an upright state inclined at a certain angle with respect to the direction of gravity, even if particles are attached to the surface of the mask or the substrate during transport, the particles attached to the surface of the mask or the substrate are automatically dropped. In addition, the contact between the mask and the substrate may be more easily performed in a state in which the deposition of the organic material between the fine gaps during the deposition process may be reduced than before.

1 is a perspective view of a chamber applied to a thin film deposition system for manufacturing an OLED to which a transfer device according to a first embodiment of the present invention may be applied.
2 and 3 are schematic side structural diagrams of FIG. 1 showing the deposition process step by step.
4 is a schematic side structure diagram of a transfer apparatus of a thin film deposition system for manufacturing OLED according to a first embodiment of the present invention.
5 is a schematic side structure diagram of a transfer device of a thin film deposition system for manufacturing OLED according to a second embodiment of the present invention.
6 is a schematic diagram for calculation of displacement according to tilting.

In order to fully understand the present invention, operational advantages of the present invention, and objects achieved by the practice of the present invention, reference should be made to the accompanying drawings and the accompanying drawings which illustrate preferred embodiments of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Like reference symbols in the drawings denote like elements.

1 is a perspective view of a chamber applied to a thin film deposition system for manufacturing an OLED to which a transfer device according to a first embodiment of the present invention may be applied, and FIGS. 2 and 3 are schematic side views of FIG. 4 is a schematic side view of a transfer apparatus of a thin film deposition system for manufacturing an OLED according to a first embodiment of the present invention.

As shown in these drawings, the transfer device 160 (refer to FIG. 4) according to the first embodiment of the present invention can be applied to the thin film deposition system for manufacturing OLED shown in FIGS. 1 to 3.

That is, the transfer device 160 according to the first embodiment of the present invention transfers the mask 120 (Fine Metal Mask, FMM) and the substrate in the standing state, which are inclined at an angle with respect to the gravity direction, into the chamber 100, and then the deposition process. This can be done.

As a result, a thin film deposition system for manufacturing an OLED to which the transfer device 160 according to the first embodiment of the present invention can be applied, unlike in the prior art, the mask 120 in a standing state inclined at an angle with respect to the gravity direction (Fine Metal Mask, FMM) ) And the substrate are transported into the chamber 100 and placed in the respective positions, and then the mask 120 and the substrate are brought into contact with each other to maintain precise flatness, and then the source 150 controls the mask 120. By providing a deposition material on the substrate through the deposition process can proceed.

Here, the angle of the standing state inclined by a certain angle with respect to the gravity direction may be 70 degrees to 89 degrees. If the angle is less than 70 degrees, it is difficult to transfer. If the angle is larger than 89 degrees, the particles fall and the fine gap during the deposition process. It can be difficult to reduce the deposition of organic material between the layers. The precision flatness means that the mask 120 and the substrate are in uniform contact with each other over the entire area. The substrate may be an organic light emitting display (OLED) as described above.

Hereinafter, after the thin film deposition system for manufacturing an OLED to which the transfer device 160 according to the first embodiment of the present invention can be applied, the transfer device 160 will be described in detail with reference to FIG. 4.

As shown in FIGS. 1 to 4, a thin film deposition system for manufacturing an OLED includes a mask support unit 121 that supports a chamber 100 in which a deposition process is performed, and a mask 120 in an upright state inclined at an angle with respect to a gravity direction. ), A mask driver (not shown) for approaching the mask 120 toward the mask support unit 121, and a substrate opposed to the mask 120 and supplied into the chamber 100, and then held on the mask 120. The deposition material is provided on the substrate through the substrate holding alignment unit 130 for aligning the substrate with respect to the substrate, and the mask 120 when the substrate is in contact with the mask 120 in a standing state inclined at an angle with respect to the gravity direction. And a source 150 for forming the thin film.

The chamber 100 forms a place where the deposition process for the substrate proceeds. It is also commonly referred to as a process chamber.

The interior of the chamber 100 forms a vacuum atmosphere so that the deposition process on the substrate can be performed reliably. Therefore, although not shown, a vacuum pump may be connected to one side of the chamber 100 to suck the air in the chamber 100 to maintain the vacuum in the chamber 100.

One side of the chamber 100 is coupled to the gate valve 101 forming the access passage of the substrate. As the gate valve 101 opens or closes, the substrate may enter and exit the chamber 100.

Next, the mask 120 is contacted and supported on the surface of the substrate in order to proceed with deposition in a predetermined pattern on the surface of the substrate. Although not shown in detail, the mask 120 is provided with a plurality of through holes (not shown) through which the deposition material from the source 150 passes.

In the present embodiment, the mask 120 is also transported in parallel with the substrate, that is, in an upright state inclined at an angle with respect to the gravity direction, and then supported at the corresponding position in the chamber 100, that is, the mask support unit 121. As such, when the mask 120 has a structure supported by the mask support unit 121 after being transported in an upright state inclined at an angle with respect to the gravity direction, the mask 120 sags relative to the size of the mask 120 even though the size of the mask 120 increases. It can be significantly reduced than the conventional and the space of the chamber 100 can be reduced as well as the conventional alignment of the substrate and the mask 120 can be made precisely, in particular, it can be applied to large-scale OLED mass production .

Although not shown, the mask driving unit serves to approach the mask 120 toward the mask support unit 121. The mask driving unit may be applied to a cylinder, a linear motor, or a combination of a motor and a ball screw, a robot, or the like. The structure may be dedicated as it is.

In addition, the mask support unit 121 illustrated in the drawings may be applied as a cylinder or an actuator, and the mask 120 having the position movement completed at the final movement position of the mask 120 may be arbitrarily selected. It serves to support or chuck the mask 120 so as not to be displaced or repositioned. Meanwhile, in the present exemplary embodiment, the substrate is moved toward the mask 120 to be in contact with the mask 120 as shown in FIGS. 2 and 3, but the mask 120 may be moved toward the substrate for a predetermined distance.

Next, the substrate holding alignment unit 130 is disposed to face the source 150 with respect to the mask 120, and is standing up at a predetermined angle with respect to the substrate disposed in parallel with the mask 120, that is, the gravity direction. It serves to align the substrate with respect to the mask 120 in the state of holding the substrate.

The substrate holding alignment unit 130 applied in the present embodiment is not maintained vertically and is disposed with a predetermined angle of inclination with respect to the gravity direction as shown in FIGS. 2 and 3, and the first carrier having the substrate mounted thereon. After holding the substrate from 141 (see FIG. 4), the substrate is aligned with respect to the mask 120.

The substrate holding alignment unit 130 may include a unit main body 131, a substrate supporting plate 132 coupled to the unit main body 131 so as to be relatively movable, and having a substrate supported on one side toward the mask 120. In addition, the substrate holding part 133 holding the substrate in contact with the substrate supporting plate 132 at the corresponding position, and the substrate aligning operation of the substrate with respect to the mask 120 connected to the unit body 131. Liner 134.

The unit body 131 is provided with components for moving the substrate support plate 132 toward the mask 120 or returning to the opposite original position. One unit is inside the chamber 100 and the other is It may be disposed outside the chamber 100.

The substrate support plate 132 is a place where the substrate is supported on the surface. As described above, the substrate may be transferred by a transfer device 160 (see FIG. 4) for transferring the substrate 100 into the chamber 100 in a state inclined at an angle to the gravity direction through a separate first carrier 141, After the transfer, it is disposed on the surface of the substrate supporting plate 132. As described above, the substrate is also supported on the surface of the substrate support plate 132 after being supplied in an upright state inclined at an angle with respect to the direction of gravity as with the mask 120, so that the surface of the substrate support plate 132 is also masked. Maintain parallel with 120.

In this embodiment, the substrate support plate 132 may be applied as a cooling plate 132. The substrate supporting plate 132, which may be applied to the cooling plate 132, may improve the deposition efficiency by lowering the temperature of the substrate before the actual deposition process is performed on the surface of the substrate. Of course, since the scope of the present invention does not need to be limited thereto, instead of providing the substrate supporting plate 132 as the cooling plate 132, the cooling water or the cooling air injection line is disposed in the substrate supporting plate 132. It is also possible enough. The substrate support plate 132 does not necessarily need to be the cooling plate 132.

The magnet for generating a magnetic force that pulls the mask 120 toward the unit body 131 with the substrate interposed therebetween so that the metal mask 120 may be in surface contact with the substrate while being in contact with the substrate. The array 135 is further provided. That is, the magnet array 134 is deposited due to the lifting phenomenon between the mask 120 and the substrate such that the mask 120, which is a metal material, is more closely adhered to the substrate through magnetic field formation when the mask 120 is in contact with the substrate. To prevent the occurrence of defects. The magnet array 134 may be provided by an arrangement structure of a number of unit magnets (not shown), but it is not necessary.

The board | substrate holding part 133 is a means for holding the board | substrate arrange | positioned at the surface of the board | substrate support plate 132 in the said position. In particular, in the case of this embodiment, the substrate is inclined and supplied, and since the substrate is a large substrate, the substrate should be held without shaking. In this embodiment, the structure capable of elastically supporting the substrate is schematically illustrated, but the scope of the present invention is not necessarily limited thereto. That is, the shape of the substrate holding part 133 may be replaced by an electrostatic chuck or an adsorption chuck.

In the provision of the substrate holding part 133, since the substrate must be substantially in surface contact with the mask 120 as shown in FIGS. 2 and 3, it is difficult for the substrate holding part 133 to interfere with it. Therefore, it is not preferable that the distal end portion of the substrate holding part 133 protrude more toward the mask 120 than the surface of the substrate.

The substrate aligner 134 is connected to the unit main body 131 and performs alignment of the substrate with respect to the mask 120. In FIG. 1, a relatively detailed box structure is shown in FIG. 2 and FIG. 3. The substrate aligner 134 is connected to the unit body 131 or to the unit body 131. It may include a UVW driving force providing unit (not shown) for providing a driving force to move the substrate support plate 132, which is substantially in contact with the substrate in at least one direction selected from the X-axis, Y-axis, θ axis have. In practice, the unit main body 131 or the substrate supporting plate 132 connected to the unit main body 131 to be substantially supported by the substrate is moved in at least one direction selected from among X, Y, and θ axes. The structure for the present invention may be variously implemented by a combination of a cylinder, a motor, and a gear, so a detailed description thereof will be omitted.

Since the alignment of the substrate with respect to the mask 120 is performed through the substrate aligner 134 as described above, the substrate aligner 134 captures an image of alignment marks formed on the mask 120. It may further include a portion (not shown). The image information photographed by the vision unit is transmitted to a controller (not shown), and the controller is connected to the unit main body 131 or the unit main body 131 through the control of the UVW driving force providing unit provided in the substrate aligner 134. Substantially moving the substrate supporting plate 132 to which the substrate is in contact with the substrate in at least one direction selected from among the X-axis, Y-axis, and θ-axis allows the alignment of the substrate with respect to the mask 120 can proceed.

The source 150 is disposed on one side of the mask 120 to provide a predetermined deposition material required for deposition to the substrate through the mask 120. Source 150 may provide the deposition material towards the substrate at a fixed location. However, when the mask 120 and the substrate are in the standing state inclined at an angle with respect to the gravity direction as in the present embodiment, it may be difficult to use the fixed source. For example, when using a fixed source, it is difficult to obtain a uniform deposition film because the relative displacement with the source 150 relative to the entire surface of the substrate is different, in which case a separate source alignment unit (not shown) is provided. By connecting the source 150 to move the source 150 to the entire surface of the substrate, the source 150 is aligned so that the relative displacement with the source 150 with respect to the entire surface of the substrate is substantially the same do.

On the other hand, the transfer device 160 according to the first embodiment of the present invention that can be applied to the above-described thin film deposition system for manufacturing an OLED, as described repeatedly, the first carrier 141 on which the substrate is mounted is fixed with respect to the gravity direction. It serves to transfer into the chamber 100 in an inclined angle.

In other words, since the substrate can be transferred in a standing state inclined at a predetermined angle with respect to the gravity direction by the transfer apparatus 160 according to the first embodiment of the present invention, the particles are formed on the surface of the mask 120 or the substrate during transfer. ) May be automatically dropped particles attached to the surface of the mask 120 or the substrate, and the mask 120 in a state that can reduce the deposition of organic matter between the fine gaps during the deposition process than in the prior art ) And the substrate can be in close contact with each other more easily.

The transfer device 160 is a standing state in which the upper roller guide 161 guides the upper end of the first carrier 141 on which the substrate is seated, and the substrate is inclined at a predetermined angle with respect to the gravity direction together with the upper roller guide 161. And a lower guide roller 162 for feeding the sheet, and a tilting guide roller 163 for supporting an inclined state of the substrate.

At this time, the tilt guide roller 163 is provided with a lower tilt guide roller 163 disposed adjacent to the lower feed roller 162. However, the tilt guide roller 163 may be provided on the upper roller guide 161 side.

In practice, the substrate is conveyed by the lower feed roller 162, and the upper roller guide 161 and the tilt guide roller 163 serve to guide the transfer of the substrate.

In order to transfer the substrate by the lower feed roller 162, the transfer device 160 of the present embodiment is driven by the drive motor 166 for providing power, the drive motor 166, and the lower feed roller 162. And a bevel gear 167 connected thereto.

As shown, the driving motor 166 may also be assembled at a predetermined angle. The drive shaft 166a is rotatably connected to the drive motor 166, and a bevel gear 167 is provided between the end of the drive shaft 166a and the roller shaft 162a of the lower feed roller 162. Therefore, when the drive shaft 166a of the drive motor 166 rotates, its rotation direction is changed by the bevel gear 167 to be transmitted to the roller shaft 162a, whereby the lower feed roller 162 rotates to be supported by it. The first carrier 141 may be transported while being guided by the upper roller guide 161 and the tilt guide roller 163.

On the other hand, the transfer device 160 tilts the substrate so that the deposition surface is directed downward, in order to allow particles to be generated to fall in the downward direction in the direction of gravity.

The conveying device 160 of the present embodiment is coupled to the lower conveying roller 162 to adjust the angle of the lower conveying roller 162, the lower angle adjusting plate 164, the upper roller guide 161 is coupled to the upper roller guide The upper angle adjusting plate 165 for adjusting the angle of 161 is further provided. Of course, not all of the lower angle adjustment plate 164 and the upper angle adjustment plate 165 need be provided.

The lower angle adjustment plate 164 is mounted on the lower bed 171 provided at the lower portion of the transfer device 160 so that the angle can be adjusted, and supports the lower transfer roller 162 and the tilt guide roller 163.

Similarly, the upper angle adjusting plate 165 is mounted on the upper bed 172 provided on the upper portion of the transfer device 160 to be adjustable in angle, and supports the upper roller guide 161.

Since the lower angle adjustment plate 164 and the upper angle adjustment plate 165 can adjust the angle with respect to the lower bed 171 and the upper bed 172, respectively, the standing state inclined at a predetermined angle with respect to the gravity direction as in the present embodiment. The first carrier 141 carrying the substrate or the substrate may be transferred.

Of course, if it is necessary to transfer the substrate or the first carrier 141 upright as necessary, the lower angle adjustment plate 164 and the upper angle adjustment plate 165, respectively, the lower bed 171 and the upper bed 172 The first carrier 141 may be raised by adjusting the angle with respect to the first carrier 141.

As such, the lower angle adjusting plate 164 and the upper angle adjusting plate 165 are provided to adjust the angles of the lower feed roller 162 and the upper roller guide 161, thereby inclining the substrate at a predetermined angle with respect to the direction of gravity. Can be transferred.

Referring to the operation of the thin film deposition system for manufacturing an OLED having such a configuration as follows.

As illustrated in FIG. 4, the substrate is transferred into the chamber 100 with the substrate inclined at an angle with respect to the gravity direction. That is, the driving motor 166 is operated so that the lower feed roller 162 is rotated by the action of the bevel gear 167 to transfer the substrate along the lower feed roller 162, and tilts the upper roller guide 161. The guide roller 163 guides the transfer of the substrate.

When the substrate is transferred into the chamber 100 by being inclined at a predetermined angle with respect to the gravity direction by the transfer device 160 and disposed on the surface of the substrate supporting plate 132, the substrate holding part 133 is the substrate supporting plate 132. The substrate is held on the surface of the substrate.

In parallel with or before or after the process of finding the substrate, the mask 120 is also transferred into the chamber 100 by a mask driver (not shown) in an inclined angle with respect to the direction of gravity to provide a mask support unit ( By being supported by 121, the mask 120 and the substrate remain in parallel with each other.

As shown in FIG. 2, when the substrate and the mask 120 are disposed in position, a vision mark (not shown) provided on the substrate aligner 134 photographs an alignment mark formed on the mask 120. Then, the controller controls the unit main body 131 or the substrate supporting plate 132 which is connected to the unit main body 131 to substantially support the substrate, and is selected from at least one of an X axis, a Y axis, and a θ axis. By moving in one direction, the substrate is aligned with respect to the mask 120.

When the alignment operation is completed, the unit body 131 moves the substrate support plate 132 as shown in FIG. 3 so that the mask 120 and the substrate may be in surface contact with each other. At this time, the magnet array 134 is a magnetic field forming when the mask 120 and the substrate is in contact with the alignment is completed to make the mask 120 of the metal material more tightly adhered to the substrate to lift up between the mask 120 and the substrate. It is possible to prevent the deposition failure due to the phenomenon.

Once all the preparation for deposition is complete, that is to say the precise flatness between the substrate 120 and the standing mask inclined at an angle to the direction of gravity, the deposition material is provided through the source 150 to provide the direction of gravity. It is deposited on the surface of the substrate, which is also standing at a predetermined angle with respect to the gravity direction, through the mask 120 which is standing at a predetermined angle with respect to the gravity direction.

As described above, according to the present exemplary embodiment, since the substrate may be transferred in an upright state inclined at a predetermined angle with respect to the gravity direction, even if particles are attached to the surface of the mask 120 or the substrate during the transfer, the mask 120 or the substrate Particles adhered to the surface of the particles can automatically fall, and in close contact between the mask 120 and the substrate more easily in a state that it is possible to reduce the deposition of organic matter between the fine gaps during the deposition process than in the prior art. You can do it.

FIG. 5 is a schematic side view structural diagram of a transfer apparatus of a thin film deposition system for manufacturing an OLED according to a second exemplary embodiment of the present invention, and FIG. 6 is a schematic diagram for displacement calculation according to tilting.

Referring to FIG. 5, a transfer device 260 applied to a thin film deposition system for manufacturing an OLED according to a second exemplary embodiment of the present invention seats a substrate in a vertical state together with a magnet guide 261 and a magnet guide 261. Control unit (not shown) to control the magnetic levitation module 262 to magnetically levitate the carrier 142, and the levitation module 262 to magnetically levitate the carrier 142 in a standing state inclined at an angle with respect to the gravity direction. ).

At this time, the magnet guide 261 can be adjusted by the angle control, but can be controlled by the controller. In other words, the value B of the displacement according to the inclined angle may be calculated by the following Equation 1 including FIG. 6, and the displacement of the magnetic levitation module 262 is changed by the controller based on the calculated data. This makes it possible to adjust the angle of the magnetic injury. At this time, the magnet guide 261 is able to adjust the angle according to the displacement change of the magnetic levitation module 262 by the control unit.

[Equation 1]

Even if the transfer device 260 as shown in FIG. 5 is applied to form a thin film deposition system for manufacturing an OLED, the substrate can be transferred in an upright state inclined at a predetermined angle with respect to the gravity direction. Even when particles are attached, the particles adhered to the surface of the mask 120 or the substrate may automatically fall, and the organic matter may be deposited between the fine gaps during the deposition process. The mask 120 and the substrate can be brought into close contact with each other more easily.

100: chamber 120: mask
130: substrate holding alignment unit 131: unit body
132: substrate support plate 133: substrate holding part
134: substrate aligner 135: magnet array
141: first carrier 150: source
160: conveying device 161: upper roller guide
162: lower feed roller 163: tilt guide roller
164: lower angle adjustment plate 165: upper angle adjustment plate
166: drive motor 167: bevel gear

Claims (11)

An upper roller guide for guiding an upper end of a substrate or a carrier on which the substrate is mounted;
A lower transfer roller configured to transfer the substrate or the carrier together with the upper roller guide in an upright state inclined at an angle with respect to the gravity direction;
An inclination guide roller supporting an inclined state of the substrate or the carrier;
A lower angle adjusting plate coupled to the lower conveying roller to adjust an angle of the lower conveying roller;
An upper angle adjusting plate coupled to the upper roller guide to adjust an angle of the upper roller guide; And
And the tilt guide roller is a lower tilt guide roller disposed adjacent to the lower transfer roller. delete delete delete The method of claim 1,
A drive motor for providing power; And
And a bevel gear driven by the drive motor and connected to the lower transfer roller. The method of claim 1,
The transfer device for OLED manufacturing, characterized in that for transferring the substrate or the carrier in an upright state inclined at an angle to the gravity direction so that the deposition surface is directed downward so that possible particles can fall in the downward direction of the gravity direction Transfer device of thin film deposition system. The method of claim 6,
The transfer device is a transfer device of the thin film deposition system for manufacturing an OLED, characterized in that for transporting the carrier in a standing state inclined at a predetermined angle with respect to the gravity direction. The method of claim 1,
The constant angle is a transfer device of the thin film deposition system for manufacturing OLED, characterized in that 70 degrees to 89 degrees. delete delete delete

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