CN111321375B

CN111321375B - Vapor deposition apparatus, apparatus for manufacturing electronic device, and vapor deposition method

Info

Publication number: CN111321375B
Application number: CN201911280341.8A
Authority: CN
Inventors: 三村拓平
Original assignee: Canon Tokki Corp
Current assignee: Canon Tokki Corp
Priority date: 2018-12-14
Filing date: 2019-12-13
Publication date: 2023-03-14
Anticipated expiration: 2039-12-13
Also published as: CN111321375A; US20200189054A1; KR20200074006A; JP2020094263A; JP7316782B2

Abstract

The invention relates to a vapor deposition apparatus, an electronic device manufacturing apparatus, and a vapor deposition method. The substrate is transported in a clean environment in an inline deposition apparatus. The vapor deposition device is provided with: a transport mechanism including a transport carrier that holds and transports a substrate and a transport module that constitutes a transport path along which the transport carrier moves; an alignment chamber for feeding the substrate held by the carrier to the alignment chamber, and positioning and fixing the mask to the substrate fed to the alignment chamber; a vapor deposition chamber for feeding the substrate held by the carrier from the alignment chamber to the vapor deposition chamber and depositing a vapor deposition material on the substrate fed to the vapor deposition chamber; and a control means for controlling a magnetic force generated between the plurality of magnets arranged on the transport carrier along the transport direction of the substrate and the plurality of coils arranged on the transport module so as to face the plurality of magnets by applying a current or a voltage to the plurality of coils, thereby switching the transport mode between a mode in which the transport carrier is not in contact with the transport module and a mode in which the transport carrier is in contact with the transport module.

Description

Vapor deposition apparatus, apparatus for manufacturing electronic device, and vapor deposition method

Technical Field

The invention relates to a vapor deposition apparatus, an electronic device manufacturing apparatus, and a vapor deposition method.

Background

Conventionally, a vapor deposition apparatus that deposits a vapor deposition material on a film formation object such as a glass substrate to form a film, for example, an organic layer vapor deposition apparatus that deposits an organic layer at the time of manufacturing an organic EL panel, is known. These vapor deposition apparatuses include a so-called cluster (cluster) type vapor deposition apparatus and an in-line (in-line) type vapor deposition apparatus. In a group type vapor deposition apparatus, a plurality of vapor deposition chambers for forming a film on a glass substrate are arranged in a group, and a plurality of films are deposited by sequentially conveying the glass substrate to each vapor deposition chamber and performing vapor deposition. On the other hand, in the in-line type vapor deposition apparatus, a glass substrate for film formation is linearly conveyed while film formation is performed in a vapor deposition chamber. In the inline type, a plurality of vapor deposition chambers may be provided in the row direction.

Patent document 1 describes an in-line organic layer vapor deposition apparatus. The apparatus of patent document 1 includes a first circulation unit including a loading unit that feeds a glass substrate, a deposition unit that deposits a film on the glass substrate, and an unloading unit that feeds out the glass substrate in a row direction. The apparatus further includes a second circulation unit that recovers a transport carrier provided with an electrostatic chuck that transports the substrate.

In the vapor deposition process, first, the glass substrate is sent from the outside of the apparatus to the first holder of the loading unit of the first circulating unit. The glass substrate that is carried in is placed on the upper surface of the conveyance carrier disposed in the second circulation unit by the robot. The transport carrier holds the glass substrate by adsorption. Then, the substrate is reversed by the first reversing robot together with the transport carrier, and transported to the evaporation section. By this inversion, the glass substrate is disposed on the lower surface of the conveyance carrier. In the vapor deposition section, vapor deposition is performed by a vapor deposition source disposed below the substrate while the substrate is conveyed through a mask fixedly disposed in the vapor deposition section.

After completion of the evaporation, the transfer carrier holding the glass substrate transferred to the unloading chamber is inverted again by the second inversion robot. After the inversion, the conveyance carrier holding the glass substrate is sent out to the second circulation portion by the sending-out robot. The conveyance carrier moved to the second circulation unit releases the holding of the glass substrate. Subsequently, only the glass substrate is conveyed to the discharge chamber by the carrying-out robot, and carried out of the apparatus. The conveyance carrier released from holding the glass substrate is conveyed in the second circulation unit and returned to a position corresponding to the loading unit of the first circulation unit, for holding a new glass substrate. The side magnetic bearings are used for conveying the substrate in the deposition section.

Prior art documents

Patent document

Patent document 1: japanese patent laid-open publication No. 2013-016491

Problems to be solved by the invention

However, in patent document 1, a plurality of robots are used in addition to the side magnetic bearings for conveying the substrate. Therefore, the possibility that dust or dirt generated during substrate conveyance adheres to the substrate surface is high, and it is difficult to convey the substrate in a clean environment. Further, since the substrate is rotated in the planar direction by the robot, the substrate conveyance direction becomes complicated, which also causes adhesion of dust and dirt to the substrate.

Disclosure of Invention

The present invention has been made in view of the above problems, and an object thereof is to provide a technique for conveying a substrate in a clean environment in an inline vapor deposition device.

Means for solving the problems

The present invention adopts the following configuration. That is to say that the first and second electrodes,

a vapor deposition device is provided with:

a conveying mechanism, the conveying mechanism comprising: a transport carrier that holds and transports a substrate, and a transport module that constitutes a transport path along which the transport carrier moves;

an alignment chamber into which the substrate held by the transport carrier is fed, and a mask is positioned and fixed to the substrate fed into the alignment chamber;

a vapor deposition chamber into which the substrate held by the transport carrier is fed from the alignment chamber and on which a vapor deposition material is vapor deposited; and

a control member that controls a magnetic force generated between a plurality of magnets arranged on the transport carrier along a transport direction of the substrate and a plurality of coils arranged on the transport module in such a manner as to face the plurality of magnets by applying a current or a voltage to the plurality of coils,

it is characterized in that the preparation method is characterized in that,

the control means is capable of switching a conveyance mode of the conveyance mechanism between a first mode in which the magnetic force is generated to bring the conveyance carrier and the conveyance module into a non-contact state for conveyance and a second mode in which the conveyance carrier and the conveyance module are brought into contact for conveyance.

The present invention also adopts the following configuration. That is to say that the temperature of the molten steel,

a vapor deposition method for performing vapor deposition on a substrate while conveying the substrate by a conveying mechanism, the conveying mechanism comprising: a transport carrier that holds and transports the substrate, and a transport module that constitutes a transport path along which the transport carrier moves,

the transport carrier has a plurality of magnets arranged along a transport direction of the substrate, the transport module has a plurality of coils arranged to face the plurality of magnets, a magnetic force generated between the plurality of magnets and the plurality of coils is controlled by applying a current or a voltage to the plurality of coils,

the evaporation method comprises the following steps:

an alignment step of positioning and fixing a mask to the substrate held by the transport carrier; and

a vapor deposition step of vapor-depositing a vapor deposition material on the aligned substrate,

the transport mode of the transport mechanism is switchable between a first mode in which the magnetic force is generated to transport the transport carrier and the transport block in a non-contact state, and a second mode in which the transport carrier and the transport block are transported in contact.

Effects of the invention

According to the present invention, a technique for conveying a substrate in a clean environment in an inline deposition apparatus can be provided.

Drawings

Fig. 1 is a schematic view showing a production line of an organic EL panel.

Fig. 2 is a control block diagram of a production line of organic EL panels.

Fig. 3 is a schematic view showing a conveyance unit, (a) is an entire view, (B) is an enlarged view of a main portion, and (C) is a side view of a conveyance carrier.

Fig. 4 is an exploded perspective view of the transport carrier.

Fig. 5 (a) is a schematic view showing a mask chuck, and (B) is a schematic view showing a carrier.

Fig. 6 is a schematic view showing an alignment chamber, (a) is an overall view, (B) is an enlarged view of a main portion, and (C) is a plan view.

Fig. 7 is a diagram showing a state of conveyance by a magnet.

Fig. 8 (a) is a perspective view of the transport carrier, and (B) is a view showing an arrangement structure of the magnets.

Fig. 9 is a flowchart showing a procedure of alignment.

Fig. 10 (a) to (d) are schematic diagrams showing respective stages of progress of alignment.

Fig. 11 (a) to (d) are schematic diagrams showing the subsequent stages of the progress of alignment.

Fig. 12 (a) to (d) are schematic diagrams showing the subsequent stages of the progress of alignment.

FIG. 13 is an explanatory view of alignment, (a) and (b) are conceptual views of alignment marks on a substrate and a mask, and (c) is a conceptual view of an alignment system

Fig. 14 is a schematic diagram illustrating the control box.

Description of the reference numerals

103: alignment chamber, 300: conveying unit, 301: a conveying module, 302: transport carrier, 305: driving magnet, 306: driving coil, 700: operation management control unit

Detailed Description

Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. However, the dimensions, materials, shapes, relative arrangements thereof, hardware configurations, software configurations, process flows, manufacturing conditions, and the like of the components described below should be appropriately changed according to the configuration and various conditions of the apparatus to which the present invention is applied, and the scope of the present invention is not limited to the following description. In principle, the same components are denoted by the same reference numerals, and descriptions thereof are omitted.

The present invention is suitable for a deposition apparatus that forms a film on a film formation object by deposition, and is typically applicable to a deposition apparatus that deposits an organic material or the like on a glass substrate to form a film for manufacturing an organic EL panel. The material of the substrate as the object to be film-formed may be any material that can be electrostatically clamped, and a film of a polymer material, a metal, or the like may be selected in addition to glass. The substrate may be, for example, a glass substrate on which a film such as polyimide is laminated. As the vapor deposition material, a metallic material (metal, metal oxide, or the like) may be selected in addition to the organic material. The present invention is also known as a method for controlling a deposition apparatus, a deposition method, a film formation apparatus for forming a thin film, a method for controlling the same, and a film formation method. The present invention is also known as an apparatus for manufacturing an electronic device using an organic EL panel and a method for manufacturing an electronic device. The present invention is also grasped as a program for causing a computer to execute the control method and a storage medium storing the program. The storage medium may be a non-transitory storage medium that can be read by a computer.

(production line integral structure)

Fig. 1 is a conceptual diagram illustrating an overall configuration of an organic EL panel production line 100. In general, the production line 100 constitutes a circulating type conveyance path including a vapor deposition treatment process conveyance path 100a, a return conveyance path 100b, a mask delivery mechanism 100c, a carrier transfer device (shifter) 100d, a mask delivery mechanism 100e, and a carrier transfer device 100 f. The conveyance module 301 constituting the conveyance path is disposed in each component constituting the circulation type conveyance path, for example, the substrate loading chamber 101, the inversion chamber 102, the alignment chamber 103, the acceleration chamber 104, the vapor deposition chamber 105, the deceleration chamber 106, the mask separation chamber 107, the inversion chamber 108, the glass substrate discharge chamber 109, and the like. As will be described in detail later, this figure shows how the glass substrate G, the mask M, and the electrostatic chuck 308 (reference character C) are conveyed on the conveyance path in each step of the manufacturing process.

In the vapor deposition treatment step transport path 100a, the glass substrate G is fed from the outside in the transport direction (arrow a), the glass substrate G and the mask M are positioned and held on the transport carrier, vapor deposition treatment is performed while moving on the transport path together with the transport carrier 302, and then the film-formed glass substrate G is discharged. In the return conveyance path 100b, the mask M separated after the completion of the vapor deposition process and the conveyance carrier 302 from which the glass substrate is discharged are returned to the substrate introducing chamber side.

In the mask delivery mechanism 100c, the mask M separated from the transport carrier after the completion of the vapor deposition process is moved to the return transport path. The mask M moved to the return conveyance path is again placed on the conveyance carrier 302 from which the substrate is discharged and emptied. In the carrier transfer device 100d, the empty carrier 302 for conveyance after the glass substrate G is discharged to the next step is transferred to the return conveyance path 100 b. In the mask delivery mechanism 100e, the mask M separated from the transport carrier transported on the return transport path 100b is transported to the mask mounting position P2 on the vapor deposition treatment process transport path 100 a. In the carrier moving device 100f, the empty carrier after the separation of the mask M is conveyed from the return conveyance path 100b to the glass substrate carry-in position P1 at the start point of the vapor deposition process conveyance path 100 a. Details regarding the manufacturing process using the production line 100 are discussed later.

Fig. 2 is a conceptual diagram of a control block of the production line 100. The control frame includes: an operation management control unit 700 for managing the operation information of the entire production line 100, and an operation controller 20. In addition, a drive control unit for controlling a drive mechanism inside each chamber (each device) such as the substrate feeding chamber 101, the reversing chamber 102, the alignment chamber 103, the acceleration chamber 104, and the vapor deposition chamber 105 constituting the production line 100 is provided. That is, the substrate loading chamber 101 is provided with a substrate loading chamber control section 701a, the inversion chamber 102 is provided with an inversion chamber control section 701b, the alignment chamber 103 is provided with an alignment chamber control section 701c, the acceleration chamber 104 is provided with an acceleration chamber control section 701d, and the vapor deposition chamber 105 is provided with a vapor deposition chamber control section 701e. The control unit 701N is also provided in each of the other apparatuses (chambers). It is also conceivable that these drive control units and the operation management control unit 700 that manages the whole are included in the control means. In addition, it is also conceivable to include the operation controller 20 in the control means.

Further, the substrate loading chamber 101 is provided with a transport module a (301 a), the inversion chamber 102 is provided with a transport module b (301 b), the alignment chamber 103 is provided with a transport module c (301 c), the acceleration chamber 104 is provided with a transport module d (301 d), and the deposition chamber 105 is provided with a transport module e (301 e). The transport module 301N is also provided in each chamber other than the above. As will be described in detail later, in the transport module 301 disposed in each apparatus, a plurality of driving coils are linearly disposed along the transport direction of the glass substrate G and the transport carrier 302. The driving of the transport carrier 302 is controlled by controlling the current or voltage flowing through each driving coil based on the value of the encoder provided in each transport module 301. Since the magnets linearly arranged on the transport carrier 302 and the coils arranged on the transport module 301 so as to face the magnets of the transport carrier 302 cooperate to transport the substrate, the transport carrier 302 and the transport module 301 may be considered together as the transport unit 300 (transport mechanism).

Each of the transport modules 301 is provided with an encoder for detecting the position of the transport carrier 302. Based on the detection value of the encoder, the operation management control unit 700 sends an instruction to the drive control unit of each chamber to start or stop the control of the drive mechanism of each chamber, or change the control state. The triggering of the control is not limited to the detection value of the encoder, and any sensor may be used for the control.

(Structure of conveying Module)

The transport module 301 includes a main frame having an opening through which the transport carrier 302 passes, and a drive coil 306 and a coil driver which are linear along the transport direction of the transport carrier 302 and which are paired right and left with respect to the transport direction. Each of the transport paths along which the transport carriers 302 are moved is configured by arranging a plurality of transport modules 301 in series so that their openings are aligned with each other. Further, the conveyance module 301 includes: a guide mechanism that guides the transport carrier 302 in the transport direction, and a drive system that drives the transport carrier 302 by magnetic force and controls the posture. Thus, the transport carrier 302 can travel continuously on the transport path constituted by the plurality of transport modules 301 without being detached from the rail. In addition, a plurality of transport carriers 302 may be made to travel on the transport path simultaneously.

The conveying unit 300 is controlled by a linear motor, typically a moving magnet type linear motor. As shown in fig. 2, the conveyance unit 300 includes N conveyance modules 301a to 301N and an operation controller 20. The conveyance modules 301a to 301N are arranged in series to constitute one conveyance path. The transport carrier moves on a transport path formed by the transport modules 301a to 301N.

The operation controller 20 transmits a drive profile (profile) as a drive command indicating a correspondence relationship between time and a target position to all the conveyance carriers 302 existing in the linear motor control system. The operation controller 20 sends a start signal as a set of conveyance commands to the conveyance modules 301a to 301N to move the conveyance carriers 302 on the production line all at once. In addition, when the operation of the conveyance modules 301a to 301N is abnormal, the operation controller 20 performs control such as receiving an error signal from the conveyance modules 301a to 301N and stopping all the conveyance modules 301a to 301N.

(Linear motor control)

Here, the propulsion control of the linear motor will be described with reference to fig. 7. This figure is a schematic configuration diagram showing a part related to the control of the linear motor in one of the plurality of conveyance modules 301 provided in the production line and the control means thereof. The present drawing is for explaining the principle of the propulsion control of the moving magnet linear motor, and the positional relationship and the number of the components (for example, the vertical relationship between the coil and the magnet, the carrier transport direction, and the configuration of the control frame) in the following description are merely examples. In fig. 7, the X axis is defined as a traveling direction in which the transport carrier 302 moves, the Y axis is defined as a direction intersecting the X axis in a horizontal plane, and the Z axis is defined as a vertical direction when viewed from the coil unit 1501.

The transport module 301 includes a plurality of coil units 1501 to 1504. By arranging the plurality of coil units 1501 to 1504 in series, a transport path for transporting the carrier 302 is formed. For example, the track of the transport carrier 302 is defined by inserting a roller bearing attached to the transport module 301 into a guide groove provided in the transport carrier 302. The transport carrier 302 includes magnets 1514 to 1516 as movable elements, respectively.

The coil units 1501 to 1504 have a plurality of coils so as to be capable of three-phase driving including a plurality of phases, i.e., a U-phase, a V-phase, and a W-phase. The coil units 1501 to 1504 of the example in the figure are each constituted by six coils in which two coils of each of the U-phase, V-phase, and W-phase phases are connected in series. The coil unit 1501 is formed by combining a plurality of coils and an iron core formed of an electromagnetic steel sheet, but may be configured without using an iron core. The length of one coil unit 1501 may be formed to be, for example, 100mm, but is not limited thereto. The number of coils connected in series in the coil unit 1501 is not limited, and the coil unit 1501 may be formed of three coils forming three phases, i.e., U-phase, V-phase, and W-phase.

The current controllers 1521 to 1524 are electrically connected to the corresponding coil units 1501 to 1504 through a power line equal-potential path, and supply a U-phase current Iu to a U-phase coil, a V-phase current Iv to a V-phase coil, and a W-phase current Iw to a W-phase coil. As a result, the coils are excited by energization, and the coil units 1501 to 1504 can control the transport carrier 302.

The current controllers 1521 to 1524 are connected to a current information selector 1525, and the current controller selected by the current information selector 1525 supplies a drive current to the corresponding coil unit. The current information selector 1525 is connected to the

motor controllers

1530, 1540, 1550. The current information selector 1525 selects one or more of the current controllers 1521 to 1524 based on the current control information exchange signal transmitted from the

motor controller

1530, 1540, 1550, and switches the current control information to be output to the motor controller. The current control information exchange signal is a signal for the current information selector 1525 to select one or more current controllers for supplying current to the coil units for controlling the transport carrier 302 as a control object. Motor controller 1530 will be described below, but

motor controllers

1530, 1540, and 1550 each have the same configuration.

The motor controller 1530 includes: a position commander 1531 that controls the operation of the transport carrier 302, a control deviation calculator 1532, and a position controller 1533. The position commander 1531 outputs position command information of a target position of the transport carrier 302 to be controlled to the control deviation calculator 1532. The position commander 1531 outputs position command information of the transport carrier 302 to the control deviation calculator 1532 based on the drive profile transmitted from the operation controller 20. The control deviation calculator 1532 calculates a difference between the position command information output from the position command unit 1531 and the position of the transport carrier 302 output from any one of the plurality of optical encoders 1561 to 1564, and outputs the calculated difference as control deviation information.

The position Controller 1533 performs PID (Proportional Integral Derivative Controller) control based on the control deviation information calculated by the control deviation calculator 1532, and outputs current control information as a current control signal. The current control information exchange signal output by the motor controller 1530 may be generated by the position controller 1533. Similarly, the motor controller 1540 includes a position commander 1541, a control deviation calculator 1542, and a position controller 1543, and the motor controller 1550 includes a position commander 1551, a control deviation calculator 1552, and a position controller 1553, and the same functions are also provided. In the present figure, the number of motor controllers is set to three, but motor controllers corresponding to the number of conveyance carriers 302 to be controlled may be provided. The drive distribution transmitted from the operation controller 20 to each of the

motor controllers

1530, 1540, 1550 may be stored in a memory (not shown) accessible to each of the

position commanders

1531, 1541, 1551.

Optical encoders 1561 to 1564 are arranged corresponding to the control regions of coil units 1501 to 1504, respectively. The optical encoders 1561 to 1564 detect the positions of the scales disposed on the transport carrier 302, and determine the positions. It is preferable that the positions where the plurality of optical encoders 1561 to 1564 are arranged and the length of the scale 205 be determined so that the position can be detected even when the transport carrier 302 is located at an arbitrary position on the transport path. The optical encoders 1561 to 1564 preferably have a resolution of several μm per 1 count. The arrangement and the number of the optical encoders 1561 to 1564 are not limited to the illustrated examples. Further, a magnetic encoder or the like may be used as the position detection means. Further, as the optical encoders 1561 to 1564, either an absolute type or an incremental type may be used.

The position information selector 1565 is connected to the optical encoders 1561 to 1564, respectively. The reference numerals a, b, and c attached to the arrows extending from the position information selector 1565 correspond to the reference numerals a, b, and c of the

motor controllers

1530, 1540, and 1550, respectively. That is, the position information selector 1565 is connected to the

control deviation calculators

1532, 1542, 1552 provided in the

motor controllers

1530, 1540, 1550. The controller 1570 is connected to the position information selector 1565 and the

motor controllers

1530, 1540, and 1550 (not shown). The controller 1570 assigns the transport carrier 302 detected by the optical encoders 1561 to 1564 to any one of the

motor controllers

1530, 1540, and 1550, and transmits a position information selection signal, which is information related to the assignment, to the position information selector 1565. The position information selector 1565 communicably combines any of the

motor controllers

1530, 1540, and 1550 with any of the optical encoders 1561 to 1564 in accordance with a position information selection signal transmitted from the controller 1570. The controller 1570 receives control state information indicating a suspension state in which the transport carrier 302 is under control or not under control from each of the

motor controllers

1530, 1540, 1550. The controller 1570 stores control state information in a memory or the like, not shown, so that the position of the transport carrier 302 detected by the optical encoder can be sent to the motor controller in the pause state.

With the above-described configuration, the control system can detect the position of each transport carrier 302, control the current or voltage applied to the corresponding coil unit, and control the transport carrier.

(Structure of transport Carrier)

Fig. 3 (a) is a front view of a transport unit 300 including a transport block 301 as a fixed portion and a transport carrier 302 as a movable portion, as viewed from a transport direction indicated by an arrow a in fig. 1. Fig. 3 (b) is an enlarged view of a main portion surrounded by a frame S in fig. 3 (a), fig. 3 (c) is a side view of the transport carrier 302, and fig. 4 is an exploded perspective view of the transport carrier. The plurality of conveyance modules 301 are arranged in the entire area of the production line 100 to form a conveyance path. By controlling the current supplied to the driving coils of the respective transport modules 301, the plurality of transport modules can be controlled as a whole into a single transport path, and the transport carrier 302 can be continuously moved.

In the figure, a carrier body 302A of the carrier 302 is formed of a rectangular frame, and guide

grooves

303a and 303b opened in a shape of a cross section 1246767parallel to the conveying direction a are formed on both left and right side surfaces thereof, respectively. On the other hand, roller bearings (guide rollers) 304a and 304b formed of a plurality of roller rows are rotatably attached to the inner surfaces of the side plates 3011a and 3011b on the side of the transport module 301. Further, by inserting

roller bearings

304a and 304b into the

guide grooves

303a and 303b, respectively, the transport carrier 302 is supported movably in the direction of arrow a (transport direction) with respect to the transport module 301.

On the upper surfaces of the formation positions of the

guide grooves

303a, 303b on both sides of the carrier main body 302A of the transport carrier 302,

drive magnets

305a, 305b (magnet row) in which a plurality of magnets are arranged in a predetermined pattern are linearly arranged in parallel with the transport direction (traveling direction) of the substrate. Further, driving

coils

306a and 306b (coil arrays) in which a plurality of coils are arranged in a predetermined pattern are arranged on the side of the transport module 301. The driving

magnets

305a and 305b and the driving coils 306a and 306b are arranged so as to be opposed to and close to each other when the transport carrier 302 is supported by the transport module 301. The conveyance carrier 302 can be levitated or moved in the direction of the arrow a (conveyance direction) by an electromagnetic force acting between the driving

magnets

305a, 305b on the conveyance carrier 302 side and the driving

coils

306a, 306b on the conveyance module 301 side.

The

guide grooves

303a and 303b on the side of the transport carrier include a pair of upper and lower parallel guide surfaces sandwiching the rolling surfaces of the

roller bearings

304a and 304b, and the opening width 303W between the guide surfaces is formed to be larger than the diameter 304R of each of the

roller bearings

304a and 304b on the side of the transport module by a clearance CL (303w =304r + CL). With this configuration, the

roller bearings

304a and 304b can float within the guide groove within the range of the predetermined clearance CL.

With the above-described configuration, the moving magnet type linear motor control can be performed. That is, by controlling the currents supplied to the plurality of coils constituting the driving coils 306a and 306b constituting the driving system, the propulsive force in the traveling direction of the transport carrier 302 or the magnetic levitation force with respect to the transport module 301 can be generated. In addition, as long as the coil is disposed on one of the transport module and the transport carrier provided in the transport mechanism and the magnet is disposed on the other, the floating alignment of the transport carrier can be performed even in the moving coil type.

Further, according to the configuration of the transport module 301 and the transport carrier 302 as shown in fig. 3, the transport carrier 302 may be supported by rollers and transported using the

roller bearings

304a and 304b. That is, the transport carrier 302 can be moved without generating magnetic levitation on the transport carrier 302 (in a state where the transport carrier 302 sinks due to its own weight and the

guide grooves

303a and 303b are supported in contact with the

roller bearings

304a and 304 b).

(selection of transport mode)

When the transport carrier 302 is moved, either one of a magnetic levitation transport mode (first mode) and a roller transport mode (second mode) can be selected. The roller conveyance mode is as follows: in a state where the transport carrier 302 is supported by the contact between the guide grooves of the transport carrier 302 and the

roller bearings

304a and 304b on the side of the transport module 301, a driving force in the traveling direction is generated by an electromagnetic force generated between the magnet and the coil, and the transport carrier 302 is transported. The magnetic levitation transportation mode is as follows: the transport carrier is magnetically suspended, and the transport carrier 302 is transported by generating a driving force in the traveling direction by an electromagnetic force in a state where the

guide grooves

303a and 303b are not in contact with the

roller bearings

304a and 304b. In the magnetic levitation transport mode, since there is no mechanical contact portion, generation of dust, powder due to friction, and the like can be suppressed. Therefore, it is particularly suitable for preventing deterioration of the deposition quality in the vacuum deposition treatment. On the other hand, the roller conveyance mode can be used in a vapor deposition chamber or the like where dust and powder due to friction are relatively free from problems.

In fig. 3, a support structure in which

roller bearings

304a and 304b are inserted into

guide grooves

303a and 303b is adopted. Therefore, the following effects are also obtained: when a power failure, a trouble, or the like occurs during magnetic levitation transportation, the transportation carrier 302 is prevented from falling down on the transportation path to damage the mechanism or from coming off the transportation path.

Further, by controlling the arrangement pattern of the plurality of magnets constituting the driving

magnets

305a, 305b, the arrangement pattern of the plurality of coils constituting the driving

coils

306a, 306b, and the current or voltage supplied to each coil, it is possible to variously control the position and posture of the transport carrier 302 in the magnetic levitation transport mode. The position and posture are, for example, a position in a traveling direction (X axis) of the transport carrier 302, a position in a direction (Y axis) orthogonal to the traveling direction in the same plane (plane parallel to the plane of the glass substrate G) (i.e., a left-right position with respect to the traveling direction), a position in a height direction (Z axis) with respect to the transport module 301, a rotational position around the X axis, a rotational position around the Y axis, a rotational position around the Z axis, and the like. The position and posture of the transport carrier 302 can be controlled so as to correct the position of the transport carrier based on position information detected by a position sensor 310 (a linear encoder, a distance sensor, a scale, or the like) disposed between the transport module and the transport carrier. As an arrangement pattern of the magnets, for example, a pattern shown in fig. 8 is given. Although details will be described later, the position and orientation control using the magnet and the coil can be used for the alignment operation of the mask M with respect to the glass substrate G held by the transport carrier 302.

As shown in fig. 8 (B), when the transport direction of the transport carrier 302 is defined as the X axis, the direction orthogonal to the X axis in the plane parallel to the plane of the glass substrate G is defined as the Y axis, and the direction orthogonal to the X axis and the Y axis is defined as the Z axis, the drive magnets 305a and 305B are arranged in two rows on the left and right, and basically, the magnetic poles of the S pole and the N pole are alternately arranged along the X axis direction so as to form the X axis magnetic pole arrangement 305X that obtains the propulsive force to propel in the X axis direction. Further, the Y-axis magnetic pole arrangement 305Y is provided in which the magnetic poles of the S-pole and the N-pole are arranged in the Y-axis direction so as to obtain a thrust force for pushing in the Y-axis direction. In the Y-axis magnetic pole arrangement, two or four driving

magnets

305a and 305b are provided at positions separated from each other in the X-axis direction. The Y-axis magnetic pole arrangement 305Y is provided in one of the magnet rows provided in two rows on the left and right.

Although details will be described later, the positional and attitude control using the driving

magnets

305a and 305b and the driving coils 306a and 306b can be used for the alignment operation of the mask M with respect to the glass substrate G held by the carrier 302.

(holding mechanism for glass substrate G and mask M on Carrier)

Next, a mechanism for holding the glass substrate G on the transport carrier 302 and a mechanism for holding the mask M on the glass substrate will be described. According to the present invention, the glass substrate is held on the carrier in a stacked manner by the electrostatic chuck 308 as an electrostatic adsorbing member and the mask is held on the carrier in a stacked manner by the magnetic chuck 307 as a magnetic adsorbing member.

In fig. 4, a chuck frame 309 is attached to the lower surface of a carrier main body 302A of a rectangular frame-shaped transport carrier 302, the chuck frame 309 accommodates a magnetic chuck 307 for magnetically attracting a mask M and an electrostatic chuck 308 for attracting a glass substrate G by electrostatic force in a superposed manner, and an electrostatic chuck control unit (control box 312) incorporating a control section for charging the electrostatic chuck 308 is disposed on the upper surface of the rectangular frame of the carrier main body 302A.

The control box 312 is operated to charge the electrostatic chuck 308 in the chuck frame 309, thereby allowing the glass substrate G to be adsorbed and held.

As shown in fig. 3, the magnetic suction cup 307 has: a chuck main body 307x, and two guide bars 307a extending in the Z-axis direction from the back surface (the side opposite to the glass substrate G) of the chuck main body 307x toward the carrier main body 302. The guide rod 307a is slidably inserted into a cylindrical guide 307b provided in the frame of the carrier body 302A, and can move up and down in the chuck frame 309.

The magnetic attraction pad 307 has a coupling hook 307c, and the coupling hook 307c is a coupling portion that can be engaged with and disengaged from a driving side hook 307g provided at a driving side coupling end of a coupling end on the driving source side provided outside. By engaging the coupling hook 307c with the driving side hook 307g, the suction cup main body 307x is driven in the vertical direction via the guide rod 302a. The driving side hook 307g is controlled by an actuator 307h such as a fluid pressure cylinder disposed outside the apparatus or a driving apparatus using a ball screw.

In the illustrated example, a coupling hook 307c is provided on a cover 307i fixed to a distal end portion of the guide rod 307a, and a positioning piece 307d extending laterally is provided on a side surface of the cover 307 i. On the other hand, on the carrier main body 302A side, the positioning piece 307d can selectively engage with an upper end locking piece 307f abutting on the upper end position of the suction cup main body 307x and a lower end stopper 307e locking the lower end position. The upper end lock piece 307f is movable in the horizontal direction, and is movable between an engagement position where it engages with the lower surface of the positioning piece 307d at the upper end position, and a retracted position where it is separated from the positioning piece 307d, and where the positioning piece 307d is movable downward, and abuts against the lower end stopper 307e to restrict the lowering position. The descending limit is a position where the mask M is magnetically adsorbed, but some gap is provided between the chuck main body 307x and the electrostatic chuck 308. Thereby, the weight of the magnetic suction cup 307 is prevented from acting on the electrostatic chuck 308.

The driving of the upper end locking piece 307 is also driven by an external driving force, and for example, a pinion gear provided at the tip is rotationally driven by a rotationally driven actuator 307m, and the upper end locking piece 307 can be moved horizontally by meshing with a rack gear provided in the movable member of the conveying upper end locking piece 307 or the linear guide.

As shown in fig. 4, the upper end lock piece 307f is slidably supported on the upper surface of a base 307j provided on the carrier body 302A via a pair of linear guides 307k spaced apart from each other by a predetermined distance. A lower end stopper 307e is provided so as to protrude from the upper surface of the base 307j between the linear guides 307k, and the positioning piece 307d is configured to have a width that can pass between the linear guides 307k, and is configured to be movable downward and to abut against the lower end stopper 307e when the upper end locking piece 307f is moved to the retracted position.

Then, in a state where the glass substrate G is held by the electrostatic chuck 308 of the chuck frame 309, the mask M is brought close while being aligned with respect to the glass substrate G, and in a state where the mask M is in contact with the glass substrate G, the magnetic chuck 307 is moved toward the mask M side, whereby the mask M is magnetically adsorbed via the glass substrate G and the electrostatic chuck 308. Thus, the glass substrate and the mask are held by the chuck frame 309 in a state of being aligned with each other, and as a result, are held by the carrier 302.

Next, the shapes of the electrostatic chuck 308 and the magnetic chuck 307 will be described with reference to fig. 4. The chuck frame 309 is a rectangular member that is smaller than the carrier main body 302A by one turn, and constitutes a guide wall that holds the outer peripheral edge of the electrostatic chuck 308 and guides the magnetic chuck 307 and four sides of the lattice-shaped holder.

The electrostatic chuck 308 is a plate-like member such as ceramic, applies a voltage to the internal electrode, and attracts the glass substrate G by an electrostatic force acting between the internal electrode and the glass substrate G, and is fixed to the lower edge of the chuck frame 309 so as not to move up and down. As shown in fig. 4, the electrostatic chuck 308 is divided into a plurality of chuck plates 308a (six in the figure), and the sides of each chuck plate 308a are fixed to each other by a plurality of ribs 309 b. The rib 309b is divided into a plurality of ribs so as not to interfere with the support frame of the magnetic suction cup 307.

The suction cup main body 307x of the magnetic suction cup 307 has the following structure: a grid-like support 307x2 having a pattern corresponding to the mask pattern formed on the mask M in a rectangular frame 307x1, and an unillustrated attracting magnet attached to the support 307x 2. The attracting magnet has S-pole and N-pole magnets alternately arranged linearly along the grid on the support frame 307x2 via the yoke plate 307x 3.

Further, at a plurality of locations (10 locations in the embodiment) around the chuck frame 309 on the lower surface of the transport carrier 302, mask chucks 311 as mask holding members for holding the mask M are provided separately from the magnetic chuck 307. The mask chuck 311 is driven by an external driving force, and a driving source is not mounted on the transport carrier 302.

Fig. 5 shows the structure of the mask chuck 311. As shown in the drawing, the mask chuck 311 includes

chucks

311b and 311c for vertically sandwiching the mask frame MF around the periphery of the mask M on a base 311a attached to the lower surface of the carrier by four support columns 311 d. The upper chuck piece 311b is disposed at a position abutting on the upper surface of the mask frame MF at the peripheral edge of the mask M, and the lower chuck piece 311c is rotatably driven in the direction of an arrow 311g by a rotation shaft 311 f. That is, the lower chuck piece 311c can move to a clamping position shown in the figure, which clamps the mask frame MF together with the upper chuck piece 311b, and a retracted position shown by 311h, which is away from the mask frame MF and does not interfere with the vertical movement of the mask frame. These movements are performed by coupling the coupling portion 311i to a driving-side coupling end portion 311j extending from an actuator 311m (see fig. 3 a) disposed outside into the chamber and rotationally driving the rotation shaft 311 f.

The rotation shaft 311f includes a biasing member 311k that elastically biases the chuck piece 311c toward the carrier side in a state where the mask frame MF is sandwiched by the chuck piece 311b. The mask M can be reliably held on the carrier 302 by the biasing force of the biasing member 311k, and positional displacement can be prevented.

The mask chuck 311 is moved to the above-described retracted position before the mask is mounted, the mask M is raised toward the lower surface of the transport carrier 302 by a lifting device described later, and when the mask M comes into contact with the glass substrate G, the chuck piece 311c is rotated toward the mask and the glass substrate by the actuator shown in fig. 3 via the connection portion 311i to lock the peripheral edge portion of the mask, and the mask M is elastically clamped to the transport carrier 302.

Since the mask chuck 311 clamps and holds the glass substrate G by locking the mask frame MF at the peripheral edge of the mask M, the glass substrate G and the mask M can be maintained in a state of being mounted and held in a superposed manner even if the electrostatic chuck 308 for the glass substrate G and the magnetic chuck 307 for the mask M are released later.

Fig. 5 (b) is a conceptual diagram showing the simplified transport carrier. The same functional portions as those in fig. 3 (a) are denoted by the same reference numerals.

That is, the electrostatic chuck 308 is used for holding the glass substrate G to the carrier 302, the magnetic chuck 307 is used for holding the mask M, and both the chucks are mounted in the chuck frame 309. The mask M is held by the magnetic chuck 307 and is operated by the lifting and lowering operation of the magnetic chuck 307 in the chuck frame 309. In fig. 3, the upper end locking piece is moved horizontally, but in fig. 5, a rotary drive structure is adopted. The lock and unlock can be performed by either horizontal movement or rotational movement. After the magnetic attraction chucks 307 are completed, the mask frame MF is held to the carrier body 302A by a mechanical mask chuck 311. The mask chuck 311 is elastically held by a biasing member 311k such as a pressing spring. These three kinds of chucks or chucks, the electrostatic chuck 308, the magnetic chuck 307, and the mask chuck 311, are compactly assembled to the transport carrier 302.

Further, the control box 312 for controlling the electrostatic chuck 308 of the glass substrate G is mounted on the transport carrier 302 together with a rechargeable power supply, and is provided with a wireless communication means for communicating a command from the control system, and it is considered that a power supply cable, a communication cable, and the like are not required to be connected from the outside in the entire manufacturing process.

(control box)

The structure and function of the control box of the electrostatic chuck will be described with reference to fig. 14. In order to utilize the electrostatic chuck, it is necessary to supply power to the electrostatic chuck and transmit a control signal. However, when a wired cable is used for power supply or communication, the degree of freedom of movement of the transport carrier may be reduced. Therefore, the transport carrier 302 includes a control box for supplying power to the electrostatic chuck and transmitting a control signal in a non-contact manner.

Fig. 14 schematically shows the arrangement and structure of a control box in the vapor deposition device. The transport carrier 302 is transported by the transport module 301 in a vacuum chamber 1430 maintained at a predetermined vacuum degree. Here, the vacuum chamber 1430 may be any chamber within the production line 100. The transport carrier 302 is provided with an electrostatic chuck 308 held by a glass carrier frame 1420. As shown in fig. 14, when the carrier is viewed from above with the film formation surface of the substrate facing downward, various structures including a control box 1400 are disposed above the carrier. The inside of the control box is maintained at atmospheric pressure and sealed from the vacuum chamber 1430. The control box 1400 includes: a control circuit 1401, a battery 1402, an infrared communication unit 1403, a wireless communication unit 1404, a wireless communication antenna introduction terminal 1405, an optical window 1406, a non-contact power receiving coil 1407, a power supply 1408, and the like.

In addition, a power source 1431 and a coil 1432 for non-contact power supply are provided on the vacuum chamber side in order to supply power to the control box side. Further, a wireless communication unit 1433, a wireless communication antenna introduction terminal 1434, a window 1435, and an infrared communication unit 1436 are provided for communication.

The power supply from the outside to the control box 1400 is performed by a non-contact power supply method such as an electromagnetic induction method or a magnetic resonance method using a coil. A power supply 1431 (for example, a DC24V power supply) disposed outside the vacuum chamber causes a current to flow through the non-contact power supply coil 1432, thereby changing a magnetic field, generating a current in the non-contact power receiving coil 1407 inside the control box, and storing the current in the battery 1402 (for example, a lithium ion rechargeable battery). This ensures electric power necessary for operating the power supply 1408 for electrostatic chuck (e.g., 2kV high voltage power supply). In order to realize the non-contact power feeding, the distance between the coils needs to be close to a certain degree or less, and therefore, the hole 1430g and the like are provided, and the non-contact power feeding coil 1432 may be disposed as close to the carrier as possible.

It is also preferable that: a capacitance sensor for detecting a change in capacitance and interlocking the capacitance when a fault such as a short circuit occurs in the electrostatic chuck circuit, a barometer for detecting a leak of air from the control box and interlocking the capacitance. The power supply 1431 and the coil 1432 for non-contact power supply on the vacuum chamber side may be preferably arranged at various positions on the production line, particularly, at a position where the transport carrier is on standby.

The communication between the outside and the control box 1400 is also performed by a non-contact method such as infrared or wireless communication. As a configuration for wireless communication, the control box side is provided with a wireless communication unit 1404 and a wireless communication antenna introduction terminal 1405, and the vacuum chamber side is also provided with a wireless communication unit 14033 and a wireless communication antenna introduction terminal 1434. As a configuration for infrared communication, an infrared communication unit 1403 and a window 1406 are provided on the control box side, and an infrared communication unit 1436 and a window 1435 are also provided on the vacuum chamber side. Each window is an opening for infrared communication and is made of a material that transmits infrared rays. Each antenna introduction terminal for wireless communication has a sealing structure for maintaining the pressure inside the vacuum chamber or the inside of the control box. Thus, the action of the electrostatic chuck can be operated by remote communication. By using the control box having such a configuration, power supply and communication to the electrostatic chuck can be performed in a non-contact manner, and thus, a reduction in the degree of freedom of movement of the transport carrier and a failure in the connection portion can be avoided.

(production Process)

Next, a process of actually fixing the mask M to the glass substrate G, and depositing and discharging the organic EL light-emitting material in the deposition chamber will be described.

Fig. 1 shows the movement positions of the conveyance carriers 302 (electrostatic chucks 308) for conveying the glass substrate G and the mask M with respect to the respective manufacturing process steps in the production line 100 of the organic EL panel, as described above. In the drawings, the transport carriers are depicted at respective movement positions in control in the manufacturing process for easy understanding, but in practice, the transport carriers are not limited to the number shown in the drawings and are introduced into the transport path. The number of simultaneously introduced units is determined by the design of the manufacturing process and the tact time. In the figure, the carrier or the like is transported on the production line and moved in the counterclockwise direction on the paper surface, but the present invention is not limited to this direction.

In the production line 100, a magnetic drive system (linear motor system) is used as a propulsive force in a conveying direction of the conveyance carrier 302. In the vertical support of the transport carrier 302, either levitation by magnetic force or support of a guide by a roller is used. As described above, when the transport carrier 302 is transported while being magnetically levitated, the generation of dust and dirt is small, and therefore, the transport is very effective for a device requiring high vacuum degree and cleanliness, such as the production of an organic EL panel.

In the figure, the parts where the positional relationship of the respective components changes are denoted by the reference numerals P1 to P8 as shown below.

P1: glass substrate feeding position for holding glass substrate G on conveying carrier

P2: mask mounting position for mounting mask M on glass substrate G on carrier

P3: mask separation position for separating mask M from glass substrate G after vapor deposition treatment

P4: a substrate discharge position for separating and discharging the glass substrate G after the vapor deposition treatment from the transport carrier 302

P5: a carrier delivery position for delivering the empty carrier 302 to the return transport path after the glass substrate G is discharged

P6: the mask M separated after the vapor deposition process is attached to the mask delivery position of the transport carrier 302 on the return transport path

P7: a mask return position for separating the mask M from the conveying carrier 302 in the process of conveying on the return conveying path and conveying to the mask mounting position P2

P8: the carrier returning position (returning conveyance path end point) at which the conveyance carrier 302 from which the mask M has been separated is moved from the returning conveyance path to the glass substrate carrying position P1 on the conveyance path for vapor deposition treatment

While the transport carrier 302 is moved on the production line 100 by the transport module 301, the glass substrate G, the mask M, the electrostatic chuck 308 provided in the transport carrier, and the like are changed in the laminated relationship at various positions on the production line, or are turned upside down by 180 ° by the turning process. Therefore, in fig. 1, reference numerals are shown at respective main positions in order to facilitate understanding of the vertical relationship among the glass substrate G, the mask M, and the electrostatic chuck 308. That is, when the surface (film formation target surface) of the glass substrate G on the film formation side is positioned uppermost, the reference numeral G1 denotes the surface, and when the surface on the non-film formation side is positioned uppermost, the reference numeral G2 denotes the surface. Note that the electrostatic chuck 308 is denoted by reference numeral C1 when the substrate suction side is positioned uppermost, and denoted by reference numeral C2 when the substrate non-suction side is positioned uppermost. When the surface of the mask M on the film formation side is positioned uppermost, the reference numeral M1 denotes the same, and when the surface on which the film is not formed is positioned uppermost, the reference numeral M2 denotes the same. Reference numerals denote a state after inversion in each inversion chamber, and a state after feeding and discharging in the feeding chamber and the discharging chamber.

< feeding Process >

At the glass substrate feed position P1, the glass substrate G is fed from an external stocker into the substrate feed chamber 101 on the vapor deposition process transport path 100a, and is held by the electrostatic chuck at a predetermined holding position on the transport carrier 302. At the glass substrate carrying-in position P1, the conveyance carrier 302 and the conveyance module 301 supporting the same are disposed so that the conveyance module 301 is located below. At this time, the glass substrate holding surface (chuck surface) of the transport carrier 302 is oriented upward. The glass substrate G is vertically fed from above to the glass substrate feed position P1, and is placed on the chuck surface. At this time, the film formation surface of the glass substrate G faces upward in the vertical direction.

Subsequently, the transport carrier 302 holding the glass substrate is transported from the glass substrate carry-in position P1 to the reversing chamber 102. The conveyance is performed in a roller conveyance mode. That is, the transport carrier 302 advances in the traveling direction by the magnetic force generated between the driving

coils

306a and 306b to which a current or voltage is applied and the driving

magnets

305a and 305b while bringing the guide groove 303 into contact with the

roller bearings

304a and 304b serving as guides.

< procedure of switching over and mode >

In the reversing chamber 102, a rotation support mechanism as a reversing member rotates the conveyance module 301 supporting the conveyance carrier 302 holding the glass substrate by 180 degrees with respect to the traveling direction. Thereby, the vertical relationship between the conveyance carrier 302 and the conveyance module 301 is reversed, and the glass substrate G is positioned on the lower surface side. The film formation surface of the glass substrate G faces downward in the vertical direction. The rotation support mechanism enables the transport module 301 to rotate in units of 180 degrees in the traveling direction together with the transport carrier 302. Preferably, the rotation axis is located at the center of gravity so that the position of the transport carrier 302 and the transport module 301 does not shift during the rotation. In the figure, the transport carrier 302 and the transport module 301 are turned over in the direction of travel by the arrow R. It should be noted that a locking mechanism that mechanically locks the transport module 301 and the transport carrier 302 is also preferably used.

One of the reasons why the transport carrier 302 is rotated together with the transport module 301 is that

roller bearings

304a and 304b aligned on both sides of the transport module are inserted into

guide grooves

303a and 303b of the transport carrier to guide the transport carrier 302. Another reason is that, since the magnet on the transport carrier side and the coil on the transport module side are in a positional relationship of opposing each other, if a configuration is adopted in which only the transport carrier is reversed, the reversing weight becomes light, but the arrangement of the magnet on the transport carrier side and the guide mechanism between the magnet and the transport module become complicated.

After the reversing process in the reversing chamber, the current or voltage applied to the driving coil is controlled, and the supporting method of the transport carrier 302 is switched from the abutment of the

roller bearings

304a and 304b with the

guide grooves

303a and 303b to magnetic levitation. Thereby, as a control mode, the roller conveyance mode is shifted to the magnetic levitation conveyance mode. Next, the transport carrier 302 is moved toward the alignment chamber 103 (mask mounting position P2) in the magnetic levitation transport mode.

< alignment Process >

Fig. 6 (a) to (c) are diagrams for explaining the mask lifting and lowering device that performs the mask chucking operation in the alignment chamber 103 and the operation thereof.

In the alignment chamber 103, the transfer module 301 is fixed to the main frame 200 in the chamber, and the transfer carrier 302 is suspended from the transfer module 301 by magnetic levitation while the glass substrate G held by the electrostatic chuck is directed downward.

As shown in the figure, a lifting device 202 for holding and lifting the mask M is disposed below the transport carrier 302. The lifting device is configured to control the lifting of the mask tray 205 by supporting 4 points in front, rear, left, and right directions by lifting

rods

204a, 204b, 204c, and 204d which are moved up and down by the

jacks

203a, 203b, 203c, and 203d, respectively.

As shown in fig. 6 (c), the mask tray 205 is configured to be supported by a plurality of mask supporting portions 206 on the mask frame MF at the periphery of the mask M.

With the above configuration, the mask M placed on the mask tray 205 is raised by the jacks 203a to 203d to approach the glass substrate G held on the magnetically levitated carrier 302, and when the mask M reaches a predetermined approach distance, the glass substrate G and the mask M are aligned.

The alignment action proceeds as follows: the alignment marks formed in advance on the glass substrate and the mask are photographed by an alignment camera to detect the amount and direction of positional deviation therebetween, the position of the carrier is aligned while being minutely moved by a transport drive system of the magnetic levitation transport carrier 302, and the mask M is held by being attracted to the transport carrier by a magnetic attraction chuck in a state where the positions of the glass substrate and the mask are accurately aligned.

The holding state is locked by the 10-part mask chuck 311 as described above, and thereafter, even if the electrostatic chuck or the magnetic chuck is released, the glass substrate and the mask can be held on the carrier in a state aligned with each other.

Here, at the time of alignment, the position with respect to the transport module 301 is finely adjusted in a state where the transport carrier 302 is magnetically suspended. Therefore, since the alignment can be performed by the carrier transport drive system without providing a separate fine adjustment mechanism dedicated to the alignment, it is effective to simplify and reduce the weight of the carrier transport 302.

(details of alignment)

The method of photographing the alignment mark and aligning will be described in detail. Fig. 13 (a) is a schematic view of the glass substrate G, and fig. 13 (b) is an enlarged view of the alignment marks provided at the corners of the glass substrate G and the mask M. Alignment camera viewing ranges 1301 are set at the four corners of the glass substrate G shown in fig. 13 (a). Fig. 13 (b) shows a case where the glass substrate G and the mask M are photographed in a superposed manner within one alignment camera field of view 1301, and shows a glass substrate side alignment mark 1304 and a mask side alignment mark 1305 photographed through glass.

Fig. 13 (c) is a conceptual diagram of the alignment system. An alignment camera 1310 is disposed on a ceiling plate 1311 of a chamber of the alignment chamber. The alignment camera may be any camera capable of optical imaging, and for example, a camera having a sensor size of 2/3 inch may be used. A window 1313 through which light for imaging can pass in the optical axis direction of the alignment camera 1310 is provided in the top plate 1311 of the chamber. The alignment camera is provided on the mounting table 1312, and can be finely adjusted in position. As the mounting table, for example, a 6-axis adjustment mounting table can be used. The camera may include various components necessary for imaging such as a lens 1315, analog coaxial illumination 1316, and ring illumination 1317 as components.

As the control means, the alignment chamber control section 701c may be used as illustrated, or another control device may be used. The alignment chamber control unit 701c performs alignment processing based on image data captured by the alignment camera 1310. That is, the mask side alignment mark 1305 and the glass substrate side alignment mark 1304 are extracted from the image data by image processing, and the amount and direction of positional deviation between them are calculated. If the amount of positional deviation and the direction of positional deviation are not within the predetermined range, the position of the carrier 302 is finely adjusted by using a magnetic force based on the calculated amount of positional deviation, and the glass substrate G and the mask M are aligned.

(Structure of magnet)

Here, a structure for enabling an aligning operation by a magnetic force will be described. Fig. 8 shows details of the driving

magnets

305a and 305b disposed on the upper surface of the transport carrier 302. The driving

magnets

305a, 305b are arranged in a pair left and right with respect to the conveying direction. The driving

magnets

305a and 305b are basically configured as a magnet array in which magnets of N-pole and magnets of S-pole are alternately arranged in a linear shape. In the illustrated example, the pair of right and left driving

magnets

305a, 305b are provided so as to include two rows of magnet rows. In each of the two rows of magnet rows, the N-pole and S-pole are basically alternately arranged in a linear shape for control in the X-direction (conveyance direction) in the drawing. In addition, in a part of the magnet array, both the N-pole and the S-pole are disposed so as to be exposed on the facing surface facing the transport module 301, and are used not only for the X-direction but also for the Y-direction (direction intersecting the transport direction) control in the figure.

A row composed of a plurality of driving

coils

306a and 306b is provided at a position facing each magnet row of the transport carrier 302, and the transport carrier 302 can be moved in each direction of the X axis (transport direction), the Y axis (direction intersecting the transport direction), and the Z axis (direction in which the transport carrier and the transport module face each other) and in the rotational direction around each axis in fig. 8 by controlling the current or voltage of each coil. In particular, in order to control the Y-axis direction and the rotation direction around the Z-axis, it is effective to arrange at least one of the driving

magnets

305a and 305b in a plurality of rows.

(treatment procedure)

The details of the alignment operation in the alignment chamber 103 will be described with reference to the flowchart of fig. 9 and fig. 10 to 12. Fig. 10 (a) to 12 (d) correspond to steps S1 to S5 and S7 to S12 in fig. 9, respectively.

First, in step S1, as shown in fig. 10 (a), the mask M is sent from the pre-alignment chamber 100g by the mask delivery mechanism 100 e. The alignment chamber controller detects the completion of the feeding by a sensor provided in the alignment chamber 103.

Next, in step S2, as shown in fig. 10 (b), the transport carrier 302 holding the substrate is carried from the reversing chamber 102 to the alignment chamber 103 in a magnetic levitation transport mode. The conveying direction a here is a direction from the back side toward the near side. The alignment chamber control unit detects the position based on the value of the encoder of the transport module 301, and stops the transport carrier 302 at a predetermined alignment position. The gap (clearance) between the mask M and the glass substrate G at this time is CLS2. For example CLS2=68mm.

Next, in step S3, as shown in fig. 10 c, the mask M is raised by the raising and lowering device 202 (the jacks 203a to 203d and the raising and lowering rods 204a to 204 d) and is stopped immediately before coming into contact with the glass substrate G. The stop position is as follows: in the next step S4, the alignment camera can simultaneously measure the respective alignment marks of the glass substrate G and the mask M. When the gap between the mask M and the glass substrate G at this time is CLS3, CLS3=3mm, for example.

Next, in step S4, as shown in fig. 10 (d), the alignment marks of the glass substrate G and the mask M are simultaneously measured by the alignment camera 1310. Note that, on the transport carrier 302, a through hole is provided along the optical axis direction of the alignment camera. The alignment camera can measure the alignment marks provided to the glass substrate G and the mask M through the through-hole. In addition, as long as the alignment mark measurement is possible, for example, a notch or the like may be used instead of the through hole.

Next, in step S5, as shown in fig. 11 (a), the alignment chamber control unit calculates the amount of positional deviation between the glass substrate G and the mask M based on the measurement result in S4, and adjusts the position of the transport carrier 302 holding the glass substrate G so that the value of the positional deviation falls within a predetermined allowable range. At the time of the position adjustment, as indicated by reference numeral 331, the magnetic force with the driving

magnets

305a, 305b is adjusted by controlling the current or voltage applied to the driving

coils

306a, 306 b. In this way, the alignment operation in this step is performed in a state where the transport carrier 302 is floated. Next, in step S6, the alignment camera performs measurement again, and the alignment room control unit determines whether or not the value of the positional deviation is within a predetermined range. If it is out of range, go back to S5, and repeat alignment until the position offset value is within the range.

As described above, the alignment operation in the present flow is performed by adjusting the position of the transport carrier by magnetic force in a state where the transport carrier and the glass substrate G held by the transport carrier are magnetically suspended. In this configuration, since the transport carrier and the transport module are not in contact with each other, the influence of friction or the like can be suppressed, and high-precision positioning can be performed. Further, since the magnetic force generated by the driving coil and the driving magnet for conveying the conveyance carrier is used for the alignment, it is not necessary to provide another driving member for the alignment. As a result, the structure of the apparatus can be simplified and the cost can be reduced.

When the alignment operation is completed, the mask M is moved to a magnetic adsorption stroke, but in the present embodiment, first, the mask frame MF is clamped by the mask chuck 311.

That is, in S7, as shown in fig. 11 (b), the mask M is raised to approach the glass substrate G. When the mask M is raised, the mask tray 205 is raised by the lifting device 202, and the mask M supported by the mask support 206 is raised. The mask M itself is deflected as schematically shown, and the mask frame MF supported by the mask support portion 206 is raised to approach the glass substrate G to a predetermined gap. When the gap between the mask M and the glass substrate G at this time is CLS71, CLS71=0.5mm, for example. Further, since the transport carrier 302 is magnetically suspended, a gap CLS72 exists between the lower end of the carrier stage portion 302A1 and the reticle tray 205.

Next, in S8, as shown in fig. 11c, the magnetic levitation control is turned OFF (OFF), and the transport carrier 302 is seated on the reticle tray 205. The magnetic levitation control is turned OFF, and the transport carrier 302 from which the levitation force is eliminated falls by its own weight and is seated on the reticle tray 205. In the illustrated example, the lower end of the carrier stage portion 302A1 provided in the carrier body 302A abuts. When the gap between the mask M and the glass substrate G at this time is CLS8, CLS8=0.3mm, for example.

Next, in S9, as shown in fig. 11 (d), mask clamping is performed.

That is, the rotation shaft 311f is rotationally driven by the drive of the external drive device, and the chuck piece 311c is engaged with the mask frame MF and is chucked. In the illustrated example, the upper chuck 311b is omitted. At this time, the mask frame MF is fixed. This state is maintained even when the electrostatic chuck 308 and the magnetic chuck 307 are released.

Next, in S10, as shown in fig. 12 (a), the carrier 302 is raised to the floating start position while the mask M is held by the mask chuck 311. The raising of the conveyance carrier 302 is performed by a raising and lowering device of the mask tray. At the levitation start position, the distance between the driving coil 306 of the transport module 301 and the driving magnet 305 of the transport carrier 302 is set to a distance that generates an attractive force of such a degree that the transport carrier 302 can be levitated. In this step, the transport carrier 302 is raised by, for example, about 0.7 mm.

Next, in S11, as shown in fig. 12 (b), the magnetic levitation control is turned ON (ON), and the transport carrier 302 holding the mask M is floated from the mask tray 205. That is, the carrier 302 is lifted by a predetermined amount from the reticle tray 205 by the attraction force between the driving coil 306 of the carrier module 301 and the driving magnet 305 of the carrier 302. The amount of the rise is, for example, about 0.5mm. That is, when the gap between the mask tray 205 and the lower end of the carrier stage portion 302A1 of the carrier 302 at this time is CLS11, CLS11=0.5mm, for example.

Next, in S12, as shown in fig. 12 (c), the magnetic chuck 307 is lowered to magnetically adsorb the mask M. That is, the lock piece locked at the rising end is rotationally driven by an external actuator, moves to the retreat position, releases the lock in the descending direction, and the magnetic attraction pad 307 descends toward the electrostatic pad 308 holding the glass substrate G, and the attraction magnet of the magnetic attraction pad 307 and the mask M are magnetically attracted and held via the electrostatic pad 308 and the glass substrate G. Thereby, the mask M in the aligned state is held in close contact with the entire film formation surface of the glass substrate G. The downward movement of the magnetic suction cup 307 is achieved by an external driving force from the transport carrier 302. The amount of lowering of the magnetic suction cup at this time is, for example, 30mm.

Next, in S13, as shown in fig. 12 (d), the transport carrier 302 is sent out from the alignment chamber 103 to the acceleration chamber 104 in the transport direction a.

Through the above-described flow, the aligned mask M is held by the magnetic chuck 307 on the deposition surface of the glass substrate G held by the electrostatic chuck 308, and the mask frame MF is clamped by the mask chuck 311, and the carrier 302 is sent out in this state.

< vapor deposition Process >

The description is continued with reference back to fig. 1. The transport carrier that has completed the alignment operation and is discharged from the alignment chamber 103 is accelerated in the acceleration chamber 104 as described above and is fed to the evaporation chamber 105. By accelerating the transport carrier before it is fed into the evaporation chamber 105, it is possible to compensate for a delay in time required for the high-precision alignment process in the alignment chamber 103, and to suppress a reduction in tact time.

In the vapor deposition chamber, the organic EL light-emitting material is vacuum-deposited while the transport carrier is moved in the direction of arrow B in a magnetically suspended state at a predetermined vapor deposition speed. In this way, when the transport carrier is fed from the alignment chamber to the acceleration chamber and the deposition chamber or moved in the deposition chamber, the magnetic levitation transport mode is used, and generation of dust and generation of powder due to friction can be prevented, and therefore, high-quality film formation can be performed.

< separation/delivery Process >

The transport carrier discharged from the vapor deposition chamber 105 after the vapor deposition process is decelerated in the deceleration chamber 106, transported to the mask separation chamber 107 located at the mask separation position P3, and stopped at a predetermined position. Here, the mask chuck 311 is unlocked from the mask M, and the mask M is separated from the glass substrate.

The separated mask M is lowered by the same mechanism as the mask lifting and lowering device of fig. 6. The mask delivery mechanism 100c receives and holds the lowered mask M by the holding frame, and conveys the mask M to the retreat position between the vapor deposition process step conveyance path 100a and the return conveyance path 100 b. Then, when the empty transport carrier 302 after the substrate discharge moves to the mask receiving position P6 on the return transport path, the mask M is moved to the lower position of the transport carrier. Next, the mask M is raised toward the lower surface of the carrier by the same mechanism as the mask raising and lowering device, and is held by the magnetic chuck. The conveyance carrier 302 holding the mask M is thus conveyed back to the supply side.

On the other hand, the carrier 302 from which the mask M is separated in the mask separation chamber 107 moves to the inversion chamber 108 while holding the glass substrate G by the locking portion of the mask chuck. In the reversing chamber 108, the same rotary support mechanism as the reversing chamber 102 on the supply side rotates the transport carrier 302 together with the transport module 301 by 180 degrees in the traveling direction. Thereby, the glass substrate G is on the upper surface.

After the inversion in the inversion chamber 108, the transport mode of the transport carrier 302 is switched from the magnetic levitation transport mode to the roller transport mode again. Subsequently, the conveyance carrier 302 is conveyed by roller conveyance to the glass substrate discharge chamber 109 at the substrate discharge position P4. At the substrate discharge position P4, the mask chuck of the glass substrate G is released, and the glass substrate G is conveyed to the next process by a discharge mechanism not shown.

The conveyance carrier 302, which is discharged to empty the glass substrate G in the glass substrate discharge chamber 109, is rotated by 90 degrees counterclockwise in the drawing together with the conveyance module 301. Therefore, the glass substrate discharge chamber 109 is provided with a direction conversion mechanism for rotating the conveyance module in the planar direction. Subsequently, the transport carrier 302 is delivered from the transport module 301 to the carrier transfer apparatus 100d, and is transported to the carrier delivery position P5 which is the starting point of the return transport path 100 b. On the other hand, the transport module 301 that has delivered the transport carrier 302 to the carrier transfer device 100d is rotated 90 degrees in the direction of the hand and returned to the original direction. Thereby, the transport module 301 returns to a state capable of receiving the transport carrier that is next sent out from the reversing chamber 108.

The carrier moving apparatus 100d has the same transport mechanism as the transport module 301. The carrier moving device 100d receives the transport carrier 302 emptied by discharging the substrate from the transport module 301 rotated by 90 degrees in the glass substrate discharge chamber 109, and delivers the transport carrier to the direction switching mechanism (transport module for direction switching) 110 disposed at the starting point (carrier delivery position P5) of the return transport path 100 b. The direction switching mechanism 110 rotates the transport carrier by 90 degrees counterclockwise in a plan view, and transports the transport carrier to the transport module constituting the return transport path 100 b. After the conveyance is completed, the direction switching mechanism 110 is rotated by 90 degrees in the hand direction and returned to the original position, and a next conveyed carrier can be received from the carrier moving device 100 d.

< Return procedure >

The transport carrier 302 moves in a roller transport mode on the return transport path. In the reversing chamber 111, the rotary supporting mechanism rotates the transport carrier 302 by 180 degrees in the traveling direction together with the transport module. Thereby, the carrier 302 is conveyed to the mask receiving position P6 in a state where the mask mounting surface of the electrostatic chuck 308 is on the lower surface side. Next, the carrier 302 receives the mask M from the mask delivery mechanism 100c, and is held by the mask chuck 311 while being attracted by the magnetic attraction chuck 307. Subsequently, the carrier 302 is transported while holding the mask M by the mask chuck 311, and is continuously moved in the direction of arrow C in the roller transport mode.

The carrier 302 is stopped after moving to the mask separation position P7, and the mask chuck 311 is released to separate the mask M. The separated mask M is delivered to the mask delivery mechanism 100 e. The mask delivery mechanism 100e roughly aligns the mask M in the pre-alignment chamber 100g between the vapor deposition process step transport path 100a and the return transport path 100b, and then transports the mask M to the alignment chamber 103.

On the other hand, the transport carrier 302 after separating the mask M at the mask separation position P7 is rotated by 180 degrees in the traveling direction in the inversion chamber 113. Thereby, the glass substrate holding surface of the electrostatic chuck 308 faces the upper surface side. Then, the carrier 302 is rotated by 90 degrees in the hand direction by the direction conversion mechanism 114 located at the carrier return position P8 which is the end point of the return conveyance path 100 b. Subsequently, the substrate is transferred to the carrier moving device 100f and conveyed to the substrate loading chamber 101 located at the glass substrate loading position P1 which is the starting point of the vapor deposition treatment process conveying path 100 a. The direction switching mechanism 114 is rotated by 90 degrees counterclockwise after the transfer of the conveyance carrier 302 and returns to the original state. On the other hand, the conveyance carrier 302 carried into the substrate carrying-in chamber 101 is further rotated by 90 degrees counterclockwise, and returns to the initial position capable of holding the next glass substrate G carried in from the outside.

By performing the above-described process, a series of processes for depositing an organic EL light-emitting material on a glass substrate which is sequentially fed can be performed without stagnation.

Further, since the transport carrier 302 is transported in the magnetic levitation mode, generation of dust and powder due to friction can be suppressed, and this is effective particularly in the inside of the vapor deposition chamber, the feeding to and the feeding to the vapor deposition chamber, and the like. Further, according to the illustrated example, after the glass substrate G is carried into the production line 100, the glass substrate G is conveyed in only one direction until being discharged after alignment and vapor deposition, and the glass substrate G is required to be turned upside down in the traveling direction, but is not required to be turned around in the planar direction by a robot or the like. That is, the glass substrate G is conveyed on the linear conveyance path. Therefore, since it is not necessary to rotate the glass substrate G in the planar direction by a robot or the like, the possibility of dust and powder adhering to the substrate can be reduced.

In the illustrated example, the glass substrate G is fed into the production line with the film formation surface facing upward. Therefore, for example, when the surface of the glass substrate G on which no film is formed is placed on the support mechanism and conveyed, it is also effective to protect the film formation surface when the glass substrate is mounted on the conveyance carrier 302.

Here, in order to perform a film formation process by vaporizing or sublimating a deposition material by PVD or CVD in a vacuum in a deposition chamber, the deposition material needs to be disposed below. Therefore, during vapor deposition, it is necessary to control the film formation surface of the glass substrate to be in a downward position. According to the configuration of the present invention, the mask M is raised from the lower side toward the film formation surface of the glass substrate G held by the carrier 302 while the film formation surface is directed to the lower surface side, and is mounted on the glass substrate G through the alignment step. Therefore, the vapor deposition material can be deposited in a position at the time of mounting the mask M.

The glass substrate is held by the transfer carrier 302 using an electrostatic chuck, and the mask is held by a magnetic chuck and a mechanical mask chuck. The electrostatic chuck and the magnetic chuck are assembled in the chuck frame, and the magnetic chuck can switch between a clamping state and a non-clamping state through the lifting action of the magnet in the chuck frame. The mask is first elastically held by a mechanical mask chuck on the transport carrier 302 via the glass substrate. Thereafter, by lowering the magnetic adsorption chuck, the chucking of the mask is completed. According to the structure of the present invention, these three kinds of suction cups or chucks can be compactly assembled to the transport carrier 302.

An electrostatic chuck control unit for controlling the electrostatic chuck of the present invention is housed in a control box together with a rechargeable power supply and a wireless communication means for communicating a command from a control system, and is attached to a transport carrier. Therefore, it is not necessary to connect a power supply cable, a communication cable, or the like to the transport carrier 302 from the outside in the manufacturing process.

In the above embodiment, the following structure is adopted: the driving

magnets

305a and 305b are provided on the upper surface of the transport carrier 302, and are attracted from above by the driving

coils

306a and 306b arranged on the transport module 301 so as to face the driving

magnets

305a and 305 b. However, the arrangement of the magnet unit and the coil unit is not limited to this, and the driving magnet may be arranged on the side surface of the transport carrier 302, and a plurality of coils may be arranged at positions on the transport block 301 facing the driving magnet and held from the side surface of the transport carrier 302 by magnetic levitation.

According to the present invention, in a state where the glass substrate G and the mask M are held by the transport carrier 302, alignment is performed by magnetic force in a state where the alignment chamber is floated by magnetic force before vapor deposition is performed in the vapor deposition chamber. This makes it possible to perform highly accurate positioning. Further, since the current or voltage applied to the coil as the transport member for transporting the carrier is controlled, it is not necessary to provide another member for alignment, and the apparatus can be realized simply and at low cost.

Claims

1. A vapor deposition device is provided with:

a conveying mechanism, the conveying mechanism comprising: a transport carrier that holds and transports a substrate, and a transport module that constitutes a transport path along which the transport carrier moves in a traveling direction;

it is characterized in that the preparation method is characterized in that,

the control means is capable of switching a transport mode of the transport mechanism between a first mode in which the transport carrier is moved in the travel direction by a driving force in the travel direction generated by a magnetic force generated between the plurality of magnets and the plurality of coils in a state in which the guide groove provided in the transport carrier is not in contact with the roller on the transport module side, thereby transporting the substrate by the transport carrier, and a second mode in which the transport carrier is moved in the travel direction by a driving force in the travel direction generated by a magnetic force generated between the plurality of magnets and the plurality of coils in a state in which the transport carrier is supported by the contact of the guide groove with the roller, thereby transporting the substrate by the transport carrier,

in the alignment chamber, a magnetic force generated between the plurality of magnets and the plurality of coils is controlled so as to adjust a position of the transport carrier holding the substrate.

2. The vapor deposition apparatus according to claim 1,

the control member controls the transport mechanism in the first mode in the evaporation chamber.

3. The vapor deposition apparatus according to claim 1,

the vapor deposition apparatus further includes a turn-over chamber including a turn-over member for turning over the transport carrier holding the substrate in a vertical direction,

feeding the substrate from the inversion chamber to the alignment chamber by the transfer mechanism,

the conveying mechanism conveys in the second mode before inverting the conveying carrier, and conveys in the first mode after inverting the conveying carrier.

4. The vapor deposition apparatus according to claim 3,

the turning member turns the transport carrier up and down together with the transport module when the transport module supports the transport carrier.

5. The vapor deposition apparatus according to claim 4,

the inversion member inverts the transport carrier in a state in which the substrate is held with a film formation surface facing upward, into a state in which the film formation surface faces downward.

6. The vapor deposition apparatus according to claim 3,

the vapor deposition apparatus further includes a substrate feed chamber into which the substrate is fed and held by the transport carrier, and then fed to the reversing chamber,

the substrate transfer chamber, the inversion chamber, the alignment chamber, and the vapor deposition chamber are linearly arranged.

7. The vapor deposition apparatus according to claim 6,

the transport carrier moves on the vapor deposition treatment process transport path while holding the substrate, and after discharging the vapor deposited substrate, returns to the substrate loading chamber through a return transport path that forms a circulation type transport path together with the vapor deposition treatment process transport path.

8. The vapor deposition device according to any one of claims 1 to 7,

the rollers are disposed in the transport module along the transport direction, the guide grooves are formed in the transport carrier along the transport direction, and in the second mode, the transport carrier is transported while being inserted into and supported by the rollers of the transport module in the guide grooves of the transport carrier.

9. The vapor deposition apparatus according to claim 8,

the guide grooves of the transport carrier are formed in a left-right pair with respect to the transport direction of the transport carrier,

the plurality of magnets are arranged to form a plurality of magnet rows that are paired right and left with respect to the transport direction of the transport carrier.

10. An apparatus for manufacturing an electronic device, characterized in that,

an electronic device is manufactured by forming a film on the substrate using the vapor deposition apparatus according to claim 1.

11. A vapor deposition method for performing vapor deposition on a substrate while conveying the substrate by a conveying mechanism, the conveying mechanism comprising: a transport carrier that holds and transports the substrate, and a transport module that constitutes a transport path along which the transport carrier moves in a traveling direction,

the transport carrier has a plurality of magnets arranged along a transport direction of the substrate, the transport module has a plurality of coils arranged so as to face the plurality of magnets, magnetic force generated between the plurality of magnets and the plurality of coils is controlled by applying current or voltage to the plurality of coils,

the evaporation method comprises:

a transport mode of the transport mechanism is switchable between a first mode in which the transport carrier is moved in the travel direction by a driving force in the travel direction generated by a magnetic force generated between the plurality of magnets and the plurality of coils in a state where the guide groove provided in the transport carrier is not in contact with the roller on the transport module side, thereby transporting the substrate, and a second mode in which the transport carrier in a state where the transport carrier is supported by the contact of the guide groove with the roller is moved in the travel direction by a driving force in the travel direction generated by a magnetic force generated between the plurality of magnets and the plurality of coils, thereby transporting the substrate by the transport carrier,

in the alignment step, the magnetic force generated between the plurality of magnets and the plurality of coils is controlled so that the position of the transport carrier holding the substrate is adjusted by the magnetic force generated between the plurality of magnets and the plurality of coils.