KR101570072B1 - Thin layers deposition apparatus - Google Patents

Abstract

A thin film deposition apparatus is disclosed. A thin film deposition apparatus according to an embodiment of the present invention includes: a process chamber in which a deposition process for a substrate is performed; A substrate holding unit provided inside the process chamber, the substrate holding unit holding the substrate; A mask frame disposed inside the process chamber so as to face the substrate holding unit, the mask frame supporting the mask; And a mask transfer unit connected to the mask frame for transferring the mask frame toward the substrate holding unit such that the mask is brought into close contact with the substrate, the mask being adjusted in parallel to the substrate and the mask.

Description

[0001] THIN LAYERS DEPOSITION APPARATUS [0002]

The present invention relates to a thin film deposition apparatus, and more particularly, to a thin film deposition apparatus capable of precisely aligning a substrate and a mask.

As a result of the rapid development of information and communication technology and the expansion of the market, a flat panel display is attracting attention as a display device.

Such flat panel display devices include liquid crystal display devices, plasma display panels, and organic light emitting diodes.

Of these organic electroluminescent devices, for example, OLEDs have very good advantages such as fast response speed, lower power consumption than conventional LCDs, light weight, no need for a separate backlight device, And has been attracting attention as a next generation display device.

Such an organic electroluminescent device is a principle in which an anode film, an organic thin film, and a cathode film are sequentially deposited on a substrate, and a voltage is applied between the anode and the cathode to form a difference in energy in the organic thin film and emit light by itself.

In other words, the injected electrons and holes are recombined, and the excitation energy generated is generated by light. At this time, since the wavelength of light generated according to the amount of the dopant of the organic material can be controlled, full color can be realized.

1 is a structural view of an organic electroluminescent device.

1, an organic electroluminescent device includes an anode, a hole injection layer, a hole transport layer, an emitting layer, an electron transport layer (electron transport layer) a transfer layer, an electron injection layer, and a cathode are laminated in this order.

Here, the anode is mainly composed of ITO (Indium Tin Oxide) having small surface resistance and good transparency, and the organic thin film is composed of a multilayer of a hole injecting layer, a hole transporting layer, a light emitting layer, an electron transporting layer, and an electron injecting layer Alq3, TPD, PBD, m-MTDATA, and TCTA are used as the organic material used as the light emitting layer. A LiF-Al metal film is used for the cathode.

And, since the organic thin film is very weak to moisture and oxygen in the air, a sealing film for sealing is formed at the top to increase the lifetime of the device.

On the other hand, as shown in FIG. 1, when the organic electroluminescent device is driven, holes are injected from the anode into the light emitting layer, and electrons are injected from the cathode into the light emitting layer.

The holes and electrons injected into the light emitting layer combine to form an exciton, and the excitons emit light while transitioning from the excited state to the ground state.

Such an organic electroluminescent device is classified into a single color or a full color organic electroluminescent device according to the hue to be realized.

On the other hand, the organic electroluminescent device can be divided into a polymer organic electroluminescent device and a low molecular weight organic electroluminescent device depending on an organic film, in particular, a material forming the light emitting layer.

In order to realize a full color, a light emitting layer must be patterned. As a method of manufacturing a large OLED, a direct patterning method using a fine metal mask (FMM) and a laser induced thermal imaging (LITI) And a method of using a color filter.

When a large OLED is manufactured by applying a mask method, a substrate and a patterned metal mask are horizontally disposed in the process chamber, and then a deposition material is sprayed toward the mask to deposit a deposition material on the substrate. Upward deposition method is widely applied.

The horizontal type upward deposition method is a method in which a substrate horizontally arranged with respect to a bottom surface of a process chamber and a mask are aligned with each other and then adhered to each other to deposit organic substances on the substrate in a horizontal state.

On the other hand, in order to improve the precision of the deposition pattern on the substrate in the OLED deposition process, the pattern of the mask itself must be precise, and the substrate and the mask must be precisely aligned.

When the substrate and the mask are adhered in an unaligned state, the deposition material may permeate between the substrate and the mask to cause a shadow phenomenon in which the deposition pattern is spread.

Particularly, in the horizontal type upward vapor deposition method, as the substrate and the mask are enlarged, a sagging phenomenon occurs, a slight error may occur when the operator aligns the substrate and the mask, and the substrate and the mask are aligned, The substrate and the mask may be twisted in the process of converting into the vacuum state, and when the substrate and the mask are attached together, a shadow phenomenon occurs due to the gap between the substrate and the mask.

[Patent Document 1] Korean Published Patent Application No. 2002-0064187 (published on August, 2002)

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a thin film deposition apparatus capable of preventing a gap between a substrate and a mask from being generated by adjusting a substrate and a mask in parallel.

According to an aspect of the present invention, there is provided a process chamber comprising: a process chamber in which a deposition process for a substrate is performed; A substrate holding unit provided inside the process chamber, the substrate holding unit holding the substrate; A mask frame disposed inside the process chamber so as to face the substrate holding unit, the mask frame supporting the mask; And a mask transfer unit connected to the mask frame for transferring the mask frame toward the substrate holding unit such that the mask is closely contacted to the substrate, wherein the mask transfer unit controls the substrate and the mask to be parallel to each other .

Wherein the mask transfer unit comprises: a plurality of transfer rods connected to the mask frame and reciprocating in the direction of the substrate holding unit; And a plurality of transporting rod driving modules respectively connected to the plurality of transporting rods and capable of reciprocating the plurality of transporting rods individually toward the substrate gripping unit so as to adjust the substrate and the mask to be parallel to each other .

The plurality of transfer rods are spaced apart from each other at an edge of the mask frame, and reciprocate in the direction of the substrate holding unit, thereby making the substrate and the mask parallel to each other.

The transferring rod includes an outer rod which is extended from the substrate holding unit through the process chamber in the direction of the mask frame and connected to the mask frame to reciprocate the mask frame toward the substrate holding unit The transporting rod driving module may include a first driving unit connected to the outer rod to individually reciprocate the outer rod toward the substrate grasping unit.

The transferring rod may further include a mask frame supporting part connected to the outer rod and supporting a rim of the mask frame.

The transporting rod may further include an inner rod inserted in the outer rod and reciprocating in the outer rod separately from the outer rod, wherein the transporting rod driving module is connected to the inner rod, Further comprising a second driving unit for allowing the inner rod to reciprocate individually in the direction of the substrate grasping unit, wherein when the inner rod is moved toward the substrate grasping unit, And a cooling unit that is brought into contact with the mask frame and cools the mask frame and the mask.

The cooling unit may include a panel part connected to the inner rod and contacting the edge of the mask frame; And a cooling unit installed on the panel unit to cool the mask frame contacting the panel unit. The panel unit is provided with an opening having a size corresponding to the size of the mask so that the evaporation material is injected in the mask direction .

The inner rod and the cooling unit may be interconnected by a ball joint.

The outer rod and the inner rod may be coupled by a ball spline.

And at least one distance sensor provided inside the process chamber for measuring the distance between the substrate and the mask when the mask frame is transferred toward the substrate grasping unit.

The substrate holding unit includes: a substrate holding plate for holding the substrate; A substrate holding unit for holding the substrate which is in contact with the substrate supporting plate; And a substrate aligner connected to the substrate supporting plate to move and rotate the substrate supporting plate in a plane to align the substrate with respect to the mask.

Wherein the substrate holding unit is provided on the plate for supporting a substrate and generates a magnetic force for attracting the mask in the direction of the substrate supporting plate with the substrate therebetween so that the mask is brought into close contact with the substrate, And may further include a magnet portion.

The magnet unit may include a plurality of magnet arrays embedded in the substrate supporting plate.

The substrate aligner may further include: a linear driving module connected to the substrate supporting plate to move the substrate supporting plate in a plane; And a rotation drive module connected to the substrate support plate and rotating the substrate support plate in a planar manner.

The substrate aligner may include a vision portion for photographing an alignment mark formed on the mask.

The plate for supporting the substrate may be a cooling plate.

An embodiment of the present invention provides a mask transfer unit that adjusts the substrate and the mask in parallel to each other while transferring the mask toward the substrate so as to prevent a gap between the substrate and the mask from being generated in attaching the substrate and the mask .

1 is a structural view of an organic electroluminescent device.
2 is a structural view illustrating a thin film deposition apparatus according to an embodiment of the present invention.
Fig. 3 is an enlarged view of part A of Fig. 2, and is a side view showing a substrate holding unit according to an embodiment of the present invention.
4 is a side view showing a mask frame and a mask transfer unit according to an embodiment of the present invention.
5 is a perspective view illustrating a mask frame and a mask transfer unit according to an embodiment of the present invention.
Fig. 5 is an enlarged view of part B of Fig. 4, which is a side view showing a mask transfer unit according to an embodiment of the present invention.
6 is a plan view showing a cooling unit according to an embodiment of the present invention.

In order to fully understand the present invention, operational advantages of the present invention, and objects achieved by the practice of the present invention, reference should be made to the accompanying drawings and the accompanying drawings which illustrate preferred embodiments of the present invention.

Hereinafter, the present invention will be described in detail with reference to the preferred embodiments of the present invention with reference to the accompanying drawings. Like reference symbols in the drawings denote like elements.

The substrate to be described below includes a substrate used for a flat panel display device such as an organic light emitting diode.

In the present embodiment, a horizontal upward deposition method is used in which a substrate is horizontally disposed and a deposition material is sprayed from a lower portion of the substrate to perform a deposition process on the substrate. However, the present invention is not limited to this, and the substrate may be vertically or obliquely inclined The present invention may be applied to a vertical deposition system in which a deposition material is deposited after deposition.

FIG. 2 is a structural view showing a thin film deposition apparatus according to an embodiment of the present invention. FIG. 3 is an enlarged view of a portion A of FIG. 2 and is a side view showing a substrate holding unit according to an embodiment of the present invention, FIG. 5 is a partially enlarged view of FIG. 4, showing a mask transfer unit according to an embodiment of the present invention, and FIG. 6 is a cross- 1 is a plan view showing a cooling unit according to an embodiment of the present invention.

Referring to FIG. 2, a thin film deposition apparatus according to an embodiment of the present invention includes a process chamber 100 in which a deposition process is performed on a substrate G, A mask frame 300 which is disposed inside the process chamber 100 so as to face the substrate holding unit 200 and supports the mask M and a mask frame 300 which supports the mask frame 300, For transferring the mask frame 300 toward the substrate holding unit 200 so that the mask M is brought into close contact with the substrate G while keeping the substrate G and the mask M parallel to each other, And a cooling unit 500 moved in the direction of the mask frame 300 and contacting the mask frame 300 to cool the mask frame 300 and the mask M. [

The thin film deposition apparatus according to the present embodiment is configured such that the substrate G and the mask M are parallel to each other while the mask M is transferred toward the substrate G in order to adhere the substrate G and the mask M. It is possible to prevent a gap between the substrate G and the mask M from being generated when the substrate G and the mask M are attached to each other in real time and to perform the deposition process on the substrate G. In addition, Can be prevented from being generated.

In addition, the thin film deposition apparatus according to the present embodiment can prevent product defects due to the shadow phenomenon and improve product productivity.

The thin film deposition apparatus according to the present embodiment can prevent the pattern of the mask M from being deformed by the heat generated during the deposition process by cooling the mask frame 300 and the mask M. [

Referring to FIG. 2, the process chamber 100 forms a space in which a deposition process for depositing a deposition material for the substrate G proceeds.

During the deposition process, the interior of the process chamber 100 maintains a vacuum so that the deposition process for the substrate G can proceed reliably.

To this end, a vacuum module (not shown) may be installed at one side of the process chamber 100 to maintain the interior of the process chamber 100 in a vacuum atmosphere.

Although not shown, the vacuum module may be connected to the process chamber 100 through vacuum lines and includes a vacuum pump, a pressure sensor, a pressure control valve, and the like.

An inlet port (not shown) in which the substrate G is carried and an outlet port (not shown) in which the substrate G carried in the process chamber 100 are carried out are installed at one side of the process chamber 100 do. A gate valve (not shown) is installed in each of the inlet and the outlet to open and close the inlet and the outlet.

3, the substrate holding unit 200 is disposed opposite to a mask frame 300 to be described later and holds the substrate G gripped by the mask M (Not shown).

The substrate holding unit 200 includes a substrate supporting plate 210 for supporting the substrate G, a substrate holding unit 230 for holding the substrate G which is in contact with the substrate supporting plate 210, A substrate aligner 250 connected to the support plate 210 to move and rotate the substrate support plate 210 in a plane to align the substrate G with respect to the mask M, A magnet M for generating a magnetic force for attracting the mask M toward the substrate supporting plate 210 with the substrate G interposed therebetween so that the mask M can be brought into surface contact with the substrate G, (270).

The substrate support plate 210 serves to support the substrate G in contact with it. The substrate G is transferred to the inside of the process chamber 100 and then attached to the surface of the substrate supporting plate 210 and disposed in parallel with a mask M to be described later.

The plate for supporting the substrate 210 is applied as a cooling plate.

By applying the substrate supporting plate 210 as a cooling plate, the temperature of the substrate G is lowered by performing the vapor deposition process on the substrate G, thereby preventing deformation of the substrate G, Type pattern thin film can be formed.

In this embodiment, the substrate supporting plate 210 is used as a cooling plate. However, the present invention is not limited to this, and a line for injecting cooling water or cooling air may be disposed on the substrate supporting plate 210 to cool the substrate G It is possible.

The substrate holding unit 230 serves to grip the substrate G disposed on the surface of the substrate supporting plate 210 at the corresponding position. Particularly, as the substrate G is enlarged, the substrate G must be gripped without shaking.

The substrate holding unit 230 may include a plurality of support panels 230 which are provided on one side of the substrate supporting plate 210 and on which the substrate G is seated and supported, But it may also be constituted by a vacuum chuck or the like which adsorbs the substrate G to the substrate supporting plate 210 without being limited thereto.

The substrate aligner 250 serves to align and align the substrate G with respect to the mask M by moving and rotating the substrate supporting plate 210 with the substrate G in contact with the substrate.

The substrate aligner 250 is moved in the X or Y direction in a plane (XY plane) by linearly moving the substrate supporting plate 210 on which the substrate G is attached before the mask M is bonded to the substrate G And a UVW driving force providing unit (not shown) for providing driving force for rotating the Z axis by a predetermined angle (?) To the rotation axis.

 Specifically, the UVW driving force providing unit includes a linear driving module (not shown) connected to the substrate supporting plate 210 to linearly move the substrate supporting plate 210 in the X-axis or Y-axis direction in the XY plane, And a rotation drive module (not shown) connected to the plate 210 for rotating the substrate support plate 210 by a predetermined angle? In the XY plane.

A pair of linear driving modules are disposed opposite to each other and mutually synchronized to move the substrate supporting plate 210 in the X axis or Y axis direction. The Z axis, which is perpendicular to the XY plane, 210 are rotated to rotate the substrate supporting plate 210.

The structure for constituting the driving module for rotating the substrate supporting plate 210 in the X axis direction or the Y axis direction and the driving module for rotating the substrate supporting plate 210 by a predetermined angle (?) May be various, so a detailed description thereof will be omitted.

Since the substrate G is aligned with respect to the mask M through the above-described UVW driving force providing unit, the substrate aligner 250 is provided with a vision unit (not shown) for taking an alignment mark formed on the mask M (Not shown).

The image information photographed by the vision unit is transmitted to a control unit (not shown), and the control unit controls the substrate supporting plate 210 to which the substrate G is attached through the control of the UVW driving force providing unit provided in the substrate aligner 250, To move in the X-axis or Y-axis direction or rotate the substrate W by a predetermined angle (?) So that the alignment operation of the substrate G with respect to the mask M can proceed.

The magnet portion 270 has a function of pulling the mask M toward the substrate supporting plate 210 so that the metal mask M can be brought into close contact with the substrate G to be in surface contact .

The magnet portion 270 includes a plurality of magnet arrays 270 embedded in the substrate supporting plate 210.

In order to prevent the occurrence of a shadow phenomenon due to the gap between the substrate G and the metal mask M when the substrate G and the mask M are attached to each other, G and the mask M come into tight contact with each other through the formation of the magnetic field.

In this embodiment, the magnet array 270 is formed by arranging a plurality of unit magnets embedded in the substrate supporting plate 210, but the scope of the right of the present invention is not limited thereto.

On the other hand, the mask M is brought into contact with the surface of the substrate G and adhered to the substrate G to advance the deposition in a predetermined pattern on the surface of the substrate G.

A plurality of through holes (not shown) through which a deposition material passes are formed in the mask M, and the size of the mask M is relatively larger than that of the substrate G.

Referring to FIG. 4, in this embodiment, the mask M is seated and supported on the mask frame 300. The mask frame 300 is transferred in the direction of the substrate G or the substrate supporting plate 210 to bring the mounted mask M into contact with and adhere to the substrate G. [

In this embodiment, a mask transfer unit 400 is provided for transferring the mask frame 300 in the direction of the substrate G or the substrate supporting plate 210.

2, 4, and 5, the mask transfer unit 400 transfers the mask frame 300 on which the mask M is mounted in the direction of the substrate G, G and the mask M in real time during the transfer of the mask M toward the substrate G in order to prevent the shadow phenomenon due to the gap between the substrate G and the mask M in contact and coalescence of the mask M, (M) in parallel with each other.

The mask transfer unit 400 is connected to the mask frame 300 to transfer the mask M and the mask frame 300 toward the substrate G. [

The mask transfer unit 400 includes a plurality of transfer rods 410 connected to the mask frame 300 and reciprocating in the direction of the substrate holding unit 200 and a plurality of transfer rods 410 connected to the plurality of transfer rods 410, And a plurality of feed rod driving modules 430 that individually reciprocate the feed rods 410 toward the substrate grip unit 200 so as to adjust the gap G and the mask M to be parallel to each other.

The plurality of conveying rods 410 are connected to the mask frame 300 to guide the mask M and the mask frame 300 toward the substrate holding unit 200 (specifically, the substrate G and the substrate supporting plate 210) And the substrate G and the mask M are reciprocally moved in parallel with each other while the mask M and the mask frame 300 reciprocate in the direction of the substrate G and the plate for supporting the substrate 210, .

The plurality of conveying rods 410 are disposed apart from each other at the edge of the mask frame 300.

For example, when the mask frame 300 is formed into a rectangular frame, as in the present embodiment, the plurality of feed rods 410 may be disposed one by one at the corners of the rectangular mask frame 300.

Each of the plurality of conveying rods 410 is extended in the direction of the mask frame 300 from the substrate holding unit 200 through the process chamber 100 and is connected to the mask frame 300, And an outer rod 411 for reciprocating the substrate holding unit 200 in the direction of the substrate holding unit 200 (specifically, in the direction of the substrate G and the substrate supporting plate 210).

The plurality of transporting rod driving modules 430 are connected to the plurality of transporting rods 410 in correspondence with the plurality of transporting rods 410 so that the plurality of transporting rods 410 are individually sandwiched between the masks M, And serves to provide a driving force for causing the frame 300 to reciprocate in the direction of the substrate holding unit 200 (specifically, in the direction of the substrate G and the plate for supporting the substrate 210).

Each of the plurality of feed rod driving modules 430 is connected to the outer rod 411 so that the outer rods 411 are individually driven in the direction of the substrate holding unit 200 (In the direction of the arrow 210).

Hereinafter, the operation of the plurality of outer rods 411 will be described.

One end of the plurality of outer rods 411 is disposed long in the direction of the mask frame 300 through the process chamber 100. One ends of the plurality of outer rods 411 are connected to the edges of the mask frame 300, respectively.

Here, the connection between one end of each outer rod 411 and the mask frame 300 is performed by a mask frame supporting part 415 connected to one end of the outer rod 411.

That is, one end of the outer rod 411 is connected to one side of the mask frame supporting part 415, and the edge of the mask frame 300 is seated and supported on the other side.

Therefore, when the plurality of outer rods 411 reciprocate in the direction of the substrate G or the substrate supporting plate 210, the mask M and the mask frame 300 connected to the plurality of outer rods 411 And reciprocates in the direction of the substrate (G) and the plate for supporting the substrate (210).

The reciprocating motion of the plurality of outer rods 411 is performed by the first driving unit 431 connected to the outer rods 411.

Since the first driving unit 431 may be arranged outside the process chamber 100 to reciprocate the outer rod 411 in the direction of the substrate G or the substrate supporting plate 210, A detailed description thereof will be omitted.

As described above, since the plurality of outer rods 411 are individually reciprocatable, when the substrate G and the mask M become large in size and sagging occurs, The substrate G and the mask M are swollen in the initial stage of the operation but the inside of the process chamber 100 is converted into a vacuum state The substrate G and the mask M can be adjusted so as to be parallel to each other while the mask M is transported toward the substrate G even when the substrate G and the mask M are deflected.

In order to adjust the substrate G and the mask M in parallel to each other in real time while transferring the mask M toward the substrate G, the thin film deposition apparatus according to the present embodiment includes a process chamber 100, And at least one distance sensor (not shown) provided inside the substrate G for measuring a distance between the substrate G and the mask M.

Specifically, the distance sensor is disposed at the edge of the substrate supporting plate 210 or the mask frame 300, and the distance between the substrate G and the mask M is measured in real time, So that a gap between the substrate G and the mask M can be prevented from occurring.

On the other hand, in this embodiment, a cooling unit 500 for cooling the mask M and the mask frame 300 is provided to prevent the pattern of the mask M from being deformed by the heat generated during the deposition process.

The cooling unit 500 prevents the pattern of the mask M from being deformed by the heat generated during the deposition process, so that the precise shape of the patterned thin film can be formed on the substrate G. [

In this embodiment, the cooling unit 500 is disposed below the mask frame 300 and contacts the lower portion of the mask frame 300 to cool the mask M and the mask frame 300.

4 and 6, the cooling unit 500 includes a panel unit 510 which is in contact with a rim of the mask frame 300, and a panel unit 510 which is provided on the panel unit 510 and which is in contact with the panel unit 510 And a cooling unit 530 for cooling the mask frame 300.

Since the mask M is seated on the center of the mask frame 300, the panel part 510 contacts the edge of the mask frame 300 to directly cool the mask frame 300, The mask M is indirectly cooled.

The panel part 510 is formed in a shape corresponding to the shape of the rim of the mask frame 300 and the entire edge of the mask frame 300 is contacted with the panel part 510 in a state where the mask frame 300 is seated. do.

An opening 511 having a size corresponding to the size of the mask M is formed in the central portion of the panel portion 510 so that the evaporation material can be injected in the direction of the mask M. [

 In this embodiment, the cooling unit 530 may cool the mask frame 300 by arranging a line for injecting cooling water or cooling air into the panel unit 510, but the present invention is not limited thereto, And any structure that can cool the contacted mask frame 300 can be used.

In order to prevent the robot from interfering with the panel unit 510 when the mask frame 300 is mounted on the mask frame support unit 415 by a robot or the like, As shown in FIG.

Since the panel unit 510 must be in contact with the mask frame 300 when performing the deposition process, the panel unit 510 must be transferred toward the mask frame 300.

Each of the plurality of conveying rods 410 according to the present embodiment includes an inner rod 411 inserted into the outer rod 411 and reciprocating inside the outer rod 411 separately from the outer rod 411, rod, 413).

The panel unit 510 is connected to the inner rod 413 and reciprocates in the direction of the mask frame 300.

Each of the plurality of feed rod driving modules 430 is connected to the inner rod 413 so that the inner rods 413 are individually moved in the direction of the substrate holding unit 200 (Direction of the mask frame 210) or in the direction of the mask frame 300.

As the inner rod 413 reciprocates inside the outer rod 411, the panel part 510 disposed at the lower part of the mask frame 300 is transferred in a direction in which it approaches and separates from the mask frame 300.

5, in this embodiment, the inner rod 413 and the outer rod 411 are coupled by a ball spline 414, so that the inner rod 413 is coupled to the inner rod 413 inside the outer rod 411 Allow smooth linear motion.

Since the plurality of inner rods 413 reciprocate individually, the transfer speed of the inner rods 413 is different and the panel portion 510 can not simultaneously contact the lower portion of the mask frame 300, 510 may be first contacted by the mask frame 300 and the remaining portions may be contacted later. Therefore, a portion of the edge of the panel portion 510, which first contacts the mask frame 300, can exert excessive pressure on the mask frame 300.

Accordingly, in this embodiment, the inner rod 413 and the panel portion 510 are connected to each other by a ball joint 550 so that the panel portion 510 can freely turn relative to the inner rod 413 .

This is because even if a part of the corners of the panel part 510 first come into contact with the mask frame 300, the contacted part is rotated outward around the ball joint 550 to apply excessive pressure to the mask frame 300 .

The operation of the thin film deposition apparatus according to an embodiment of the present invention will now be described.

First, in order to perform a deposition process for the substrate G, the substrate G and the mask M must be cemented together.

At this time, if there is a gap between the substrate G and the mask M, a shadow phenomenon may occur due to deposition of the evaporation material between the substrate G and the mask M during deposition, And the mask (M) are aligned with each other.

Particularly, in the case where a sagging phenomenon occurs due to the enlargement of the substrate G and the mask M, or when a slight error occurs when the operator aligns the substrate G and the mask M so as to swell, Or when the substrate G and the mask M are swung in the process of converting the inside of the process chamber 100 into a vacuum state after the substrate G and the mask M are swollen at the beginning of the operation, The substrate G and the mask M must be adjusted to be parallel to each other while transferring the mask M toward the substrate G in order to attach the mask M and the mask M to each other.

In this embodiment, the substrate G and the mask M are connected to a mask frame 300 on which the mask M is mounted so that the substrate G and the mask M can be adjusted in parallel with each other in real time, A mask transfer unit 400 is provided.

The mask transfer unit 400 connects the plurality of outer rods 411 to the mask frame 300 and individually adjusts the plurality of outer rods 411 to transfer the mask frame 300 to the substrate G Thereby making it possible to reciprocate in the direction of the plate 210 for use.

When the mask M and the substrate G are not parallel to each other, the movement speed of one or more outer rods 411 selected from the plurality of outer rods 411 is adjusted to transfer the mask frame 300 The mask M and the substrate G are adjusted to be mutually parallel.

In this embodiment, a cooling unit 500 for cooling the mask frame 300 is provided so as to contact the mask frame 300 to prevent the mask M from being deformed due to heat generated during the deposition process.

The panel unit 510 constituting the cooling unit 500 is connected to the plurality of inner rods 413 and moved in the direction of the mask frame 300 and contacts the mask frame 300 to indirectly cool the mask M .

The inner rod 413 according to the present embodiment reciprocates in such a manner that the panel unit 510 can be brought into contact with the mask frame 300 and spaced apart from the mask frame 300 while the inner rod 413 is inserted into the outer rod 411 .

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Accordingly, such modifications or variations are intended to fall within the scope of the appended claims.

100: process chamber 200: substrate holding unit
210: plate for supporting a substrate 230:
250: substrate aligner 270: magnet part
300: mask frame 400: mask transfer unit
410: Feed rod 411: Outer rod
413: Inner rod 415: mask frame supporting part
430: feed rod driving module 500: cooling unit
510: panel part 530: cooling part

Claims (16)

A substrate holding unit provided inside the process chamber in which the deposition process is performed on the substrate, the substrate holding unit holding the substrate;
A mask frame disposed inside the process chamber so as to face the substrate holding unit, the mask frame supporting the mask;
And a plurality of transfer rods connected to the mask frame and reciprocating in the direction of the substrate holding unit to transfer the mask frame toward the substrate holding unit so that the mask is in close contact with the substrate, A mask transferring unit for transferring the mask image; And
And a cooling unit connected to the mask transfer unit and moved in the direction of the mask frame and contacting the mask frame to cool the mask frame and the mask,
The conveying rod
An outer rod extending from the substrate grasping unit to the mask frame through the process chamber and connected to the mask frame to reciprocate the mask frame toward the substrate grasping unit; And
And an inner rod inserted in the outer rod and reciprocating within the outer rod separately from the outer rod,
The cooling unit includes:
And an opening having a size corresponding to the size of the mask so that the deposition material contacts the rim of the mask frame when the inner rod is moved toward the substrate grasping unit, A panel part formed; And
And a cooling unit installed on the panel unit for cooling the mask frame contacting the panel unit. The method according to claim 1,
Wherein the plurality of feed rods
Wherein the substrate and the mask are arranged to be spaced apart from each other at an edge of the mask frame, and the substrate and the mask are adjusted to be parallel to each other as the substrate reciprocates in the direction of the substrate holding unit. The method according to claim 1,
The conveying rod
And a mask frame supporting part connected to the outer rod and supporting a rim of the mask frame. The method according to claim 1,
Wherein the mask transfer unit comprises:
Further comprising a plurality of feed rod driving modules each connected to the plurality of feed rods to individually reciprocate the plurality of feed rods in the direction of the substrate grasping unit so as to adjust the substrate and the mask to be mutually parallel, ,
The feed rod drive module includes:
A first driving unit connected to the outer rod to individually reciprocate the outer rod in the direction of the substrate holding unit; And
And a second driving unit connected to the inner rod to individually reciprocate the inner rod toward the substrate grasping unit. The method according to claim 1,
Wherein the inner rod and the cooling unit are interconnected by a ball joint. The method according to claim 1,
Wherein the outer rod and the inner rod are coupled by a ball spline. The method according to claim 1,
And at least one distance sensor provided inside the process chamber for measuring a distance between the substrate and the mask when the mask frame is transferred toward the substrate grasping unit. The method according to claim 1,
Wherein the substrate holding unit comprises:
A substrate supporting plate for supporting the substrate;
A substrate holding unit for holding the substrate which is in contact with the substrate supporting plate; And
And a substrate aligner connected to the substrate supporting plate for moving and rotating the substrate supporting plate in a plane to align the substrate with respect to the mask. 9. The method of claim 8,
Wherein the substrate holding unit comprises:
And a magnet portion provided on the substrate supporting plate to generate a magnetic force to attract the mask in the direction of the substrate supporting plate with the substrate interposed therebetween such that the mask is brought into close contact with the substrate to be in surface contact therewith, Deposition apparatus. 10. The method of claim 9,
The magnet unit includes:
And a plurality of magnet arrays embedded in the substrate support plate. 9. The method of claim 8,
Wherein the substrate aligner comprises:
A linear driving module connected to the substrate supporting plate to move the substrate supporting plate in a plane; And
And a rotation drive module connected to the substrate support plate for rotating the substrate support plate in a planar manner. 12. The method of claim 11,
Wherein the substrate aligner comprises:
And a vision unit for photographing an alignment mark formed on the mask. 9. The method of claim 8,
Wherein the plate for supporting the substrate is a cooling plate. delete delete delete

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