KR101514214B1 - Apparatus for attaching glass and mask - Google Patents

Abstract

Disclosed are an apparatus for attaching a substrate and a mask. According to an embodiment of the present invention, the apparatus attaching a substrate and a mask comprises: a mask comprising a plurality of mask sheets having a plurality of layers, adhering to the substrate while supporting the substrate, and a mask frame welded with the plurality of mask sheets having the plurality of layers; and a carrier being capable of being transferred to a vacuum chamber for deposition process for the glass, and attaching the substrate and the mask by a magnetic force.

Description

[0001] Apparatus for attaching glass and mask [0002]

The present invention relates to a substrate and a mask attaching apparatus, and more particularly, to a substrate attaching apparatus capable of stably supporting a substrate even when the substrate is made large, and in particular, To a substrate and a mask attaching device.

As a result of the rapid development of information and communication technology and the expansion of the market, a flat panel display is attracting attention as a display device.

Such flat panel display devices include liquid crystal display devices, plasma display panels, and organic light emitting diodes.

Among these organic electroluminescent devices, for example, OLEDs have very good advantages such as high response speed, lower power consumption than conventional LCD, light weight, no need for a separate backlight device, And has been attracting attention as a next generation display device.

Such an organic electroluminescent device is a principle in which an anode film, an organic thin film, and a cathode film are sequentially formed on a substrate, and a voltage is applied between the anode and the cathode to form a proper energy difference in the organic thin film and emit light by itself.

In other words, the injected electrons and holes are recombined, and the excitation energy generated is generated by light. At this time, since the wavelength of light generated according to the amount of the dopant of the organic material can be controlled, full color can be realized.

1 is a structural view of an organic electroluminescent device (OLED).

As shown in this figure, an organic electroluminescent device includes an anode, a hole injection layer, a hole transfer layer, an emitting layer, a hole blocking layer, an electron injection layer, a cathode, and the like are stacked in this order.

In this structure, ITO (Indium Tin Oxide), which has small surface resistance and good transparency, is mainly used as the anode. The organic thin film is composed of a multilayer of a hole injecting layer, a hole transporting layer, a light emitting layer, a hole blocking layer, an electron transporting layer, and an electron injecting layer in order to increase the luminous efficiency. Organic materials used as the light emitting layer include Alq3, TPD, PBD, m-MTDATA, and TCTA. As the cathode, a LiF-Al metal film is used. And since the organic thin film is very weak to moisture and oxygen in the air, a sealing film for sealing is formed at the top to increase the lifetime of the device.

1, the organic electroluminescent device includes an anode, a cathode, and a light emitting layer interposed between the anode and the cathode. When the organic electroluminescent device is driven, holes are injected from the anode into the light emitting layer , Electrons are injected into the light emitting layer from the cathode. The holes and electrons injected into the light emitting layer are combined in the light emitting layer to generate excitons, and the excitons emit light while transitioning from the excited state to the ground state.

Such an organic electroluminescent device can be classified into a monochromatic or full color organic electroluminescent device according to the color to be realized. The full-color organic electroluminescent device includes red (R), green (G) and And a light emitting layer patterned for each blue (B) color is provided to realize a full color.

In the full-color organic electroluminescent device, the patterning of the light-emitting layer may be performed differently depending on the material forming the light-emitting layer.

OLED deposition methods for patterning the light emitting layer include a horizontal deposition method using FMM (Fine Metal Mask), a method using a LITI (Laser Induced Thermal Imaging) method, a method using a color filter, an SMS (Small Mask Scanning) .

Meanwhile, a conventional mask applied to the FMM horizontal deposition system has been manufactured by welding a mask sheet having a predetermined thickness to a mask frame.

When attaching the conventional mask manufactured in this manner to the substrate, it is necessary to use a mask having a thickness of about 1 to 2 mm between the substrate and the mask so as not to cause a substrate damage or a scratch problem due to contact between the mask frame and the substrate A method of attaching only a mask sheet to a substrate after forming a gap has been applied.

However, in the case of the FMM horizontal deposition method, there is no serious problem when the substrate is small. However, when the substrate is a large substrate having a length of about 2 m or more, the conventional thin mask is used So that it is difficult to effectively attach the substrate and the mask.

In addition, when a large substrate is used, it is necessary to support the substrate by thickening the mask sheet to be welded by stretching the mask frame so that the substrate is stably supported, and the substrate and the mask sheet closely contact each other, You can proceed.

When the thickness of the mask sheet is increased, the magnetic flux of the magnet must be increased in order to strongly pull the thick mask sheet. If the magnetic flux of the magnet is increased, the thick mask sheet is attracted to the substrate with strong magnetic force, ) Or substrate scratch problems can be caused.

In order to prevent such a phenomenon, when a magnet having a weak magnetic flux is used, a gap between the substrate and the mask sheet is caused due to a decrease in the adhesion of the thick magnet sheet. This gap causes a problem of pattern accuracy deterioration due to a shadow .

In particular, when a large-sized substrate is used, it is difficult to precisely match the flatness of the mask itself because the mask is large when a large-size mask, that is, a large metal mask is used in close contact with the substrate. There is a problem that it is difficult to accurately adhere the mask to the substrate due to deflection of the substrate.

Korea Patent Office Application No. 10-2011-0023958

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide an apparatus and an apparatus for attaching a substrate and a mask, which can stably support a substrate even when the substrate is enlarged, and can attach the mask closely to the substrate at an accurate position .

According to an aspect of the present invention, there is provided a plasma display panel comprising: a plurality of multi-layered mask sheets, which are in contact with the substrate while supporting a glass substrate; and a mask frame A mask (Mask) provided with a mask (not shown); And a carrier that is transferable to a vacuum chamber for the deposition process to the substrate and attaches the substrate and the mask by a magnetic force. A device may be provided.

Wherein the multi-layer mask sheet comprises: a mask support sheet for supporting the substrate; And a mask sheet for substrate adhering to the substrate supporting mask sheet and in close contact with the substrate.

The thickness of the mask sheet for substrate adhesion may be thinner than the thickness of the mask sheet for supporting the substrate.

The thickness of the substrate support mask sheet may be 0.2 mm-0.3 mm, and the thickness of the substrate adhesion mask sheet may be 0.02 mm-0.02 mm.

The substrate support mask sheet and the substrate contact mask sheet are made of INVAR material and can be welded to each other.

The substrate support mask sheet may be formed with a plurality of holes to allow warping.

The plurality of holes have a shape of an elongated hole and can be continuously arranged around the mask support mask sheet.

A mask / substrate transfer module for supporting the mask and the substrate, and transferring the mask and the substrate to the carrier while being moved relative to the carrier; And a controller for controlling the operation of the mask / substrate transfer module.

Wherein the mask / substrate transfer module comprises: a module support that supports the mask frame and is moved relative to the carrier; And a connection portion connecting the carrier and the module support.

The mask / substrate transfer module may further include a rotatable clamp rotatably coupled to the module support and clamping the mask and the substrate to the module support.

The carrier comprising: a carrier body; And a magnetic force chuck provided at one side of the carrier body to generate a magnetic force for an attachment of the mask.

The magnetic force chuck includes a chuck plate; And a plurality of magnets coupled to the chuck plate.

The magnet may be a permanent magnet.

The substrate may be an organic light emitting diode (OLED), and the substrate may be a large substrate having a length and width of about 2 m.

According to another aspect of the present invention, there is provided a plasma display apparatus comprising: a plurality of multi-layered mask sheets, which are in contact with a substrate while supporting a glass substrate; ) Is disposed in the mask / substrate transfer module; A substrate placement step of loading the substrate onto an upper portion of the mask; And a substrate / mask attaching step in which the substrate and the mask are attached to one side of a carrier while the mask is pulled by a magnetic force. .

Wherein the multi-layer mask sheet comprises: a mask support sheet for supporting the substrate; And a mask sheet for substrate adhering to the substrate supporting mask sheet and in close contact with the substrate.

The thickness of the substrate-supporting mask sheet may be thinner than the thickness of the substrate-supporting mask sheet, and the substrate-supporting mask sheet and the substrate-closing mask sheet may be welded to each other with an INVAR material.

According to the present invention, the substrate can be stably supported even if the substrate is enlarged, and the mask can be attached to the substrate in a particularly accurate position.

1 is a structural view of an organic electroluminescent device (OLED).
FIG. 2 is a diagram illustrating the interior of a vacuum chamber to which a substrate and a mask attaching device according to an embodiment of the present invention are applied.
FIGS. 3 to 7 are views showing steps of attaching the substrate and the mask, respectively.
8 is a coupling diagram for a substrate and a mask.
9 is an exploded view of Fig.
10 is an exploded view of the mask in Fig.
11 is a plan structural view of a supporting mask sheet.
12 is a control block diagram of an attachment apparatus of a substrate and a mask according to an embodiment of the present invention.

In order to fully understand the present invention, operational advantages of the present invention, and objects achieved by the practice of the present invention, reference should be made to the accompanying drawings and the accompanying drawings which illustrate preferred embodiments of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Like reference symbols in the drawings denote like elements.

FIG. 2 is a diagram illustrating the interior of a vacuum chamber to which an attaching device for a substrate and a mask according to an embodiment of the present invention is applied. FIGS. 3 to 7 illustrate the process of attaching a substrate and a mask, FIG. 9 is an exploded view of FIG. 8, FIG. 10 is an exploded view of the mask in FIG. 9, FIG. 11 is a plan view of the supporting mask sheet, and FIG. 12 is a cross- FIG. 6 is a control block diagram of an attach device of a substrate and a mask according to an embodiment of the present invention. FIG.

Referring to these drawings, the substrate and mask attaching apparatus according to the present embodiment can stably support the substrate G even if the substrate G is enlarged, and in particular, at the correct position, A carrier 110, a mask / substrate transfer module 140, and a controller 150. The mask / substrate transfer module 140 includes a mask 110 and a carrier 110. The mask /

For reference, the substrate G used in the present embodiment is an organic light emitting diode (OLED), and may be a large substrate having a length / width of about 2 m or so. As shown in FIGS. 8 to 10, the substrate G is formed with a deposition region G1 in which deposition is substantially performed.

Referring to FIGS. 8 to 10, the mask 100 will be described in detail. The mask 100 applied in this embodiment is not a simple sheet shape.

That is, the mask 100 applied in the present embodiment includes a plurality of mask sheets 101 and 102 (mask sheets) formed in a plurality of layers and in close contact with the substrate G while supporting the substrate G, 102, and a mask frame 103 (Mask Frame) welded to the frame.

The multiple-layered mask sheets 101 and 102 are composed of a mask support sheet 101 for supporting the substrate G and a mask sheet 101 for contact with the substrate G which is in contact with the substrate support mask sheet 101 102).

That is, in the case of the present embodiment, the multiple-layer mask sheets 101 and 102 are applied with a dual structure of a substrate supporting mask sheet 101 and a substrate-contacting mask sheet 102.

The substrate support mask sheet 101 plays a role of supporting the substrate G and the substrate support mask sheet 102 plays a role of preventing the substrate sheet G from being closely contacted with the substrate G as described above.

Therefore, in the case of this embodiment, the thickness of the substrate-contacting mask sheet 102 is made thinner than the thickness of the mask sheet 101 for supporting the substrate.

The thickness of the substrate support mask sheet 101 may be 0.2 mm-0.3 mm, and the thickness of the substrate support mask sheet 102 may be 0.02 mm-0.02 mm.

A plurality of holes (H) are formed in the substrate supporting mask sheet 101, which is made relatively thick, as means for allowing bending in the attaching process, that is, for bending the substrate G and attaching the substrate G .

The holes H at this time have a shape of a long hole as shown in FIG. 11, and can be continuously arranged around the mask support 101 for supporting a substrate.

In the present embodiment, both the substrate support mask sheet 101 and the substrate contact mask sheet 102 are made of INVAR material and welded to each other.

The INVAR material is an alloy with 63.5% of iron and 36.5% of nickel added and having a small thermal expansion coefficient. It can be used in machines that cause errors if the dimensions change due to temperature changes, such as parts of precision machines or optical machines like this embodiment.

The mask frame 103 is welded to the multiple layers of mask sheets 101, 102 around the multiple layers of mask sheets 101, 102. When the multiple-layer mask sheets 101 and 102 are welded to the mask frame 103, the multi-layer mask sheets 101 and 102 can be welded while being stretched.

The carrier 110 is transportable to the vacuum chamber C for the progress of the deposition process for the substrate G and serves to attach the substrate 100 to the substrate G by a magnetic force, .

2, the internal structure of the vacuum chamber C for the deposition of two kinds of organic substances or inorganic substances is schematically shown. In the arrow direction, the carrier 110 contacts the substrate G and the mask 100 After the deposition, the deposition process can be carried out through the process module (PM).

The carrier 110 includes a carrier body 120 and a magnetic force chuck 130 provided on one side of the carrier body 120 to generate a magnetic force for an attachment value of the mask 100.

The carrier body 120 is a structure for supporting the magnetic force chuck 130. Although the carrier body 120 is schematically shown in the drawing, the carrier body 120 can be moved in and out of the vacuum chamber C by a rail transfer system, a magnetic levitation system, or the like.

The magnetic force chuck 130 includes a chuck plate 131 and a plurality of magnets 132 coupled to the chuck plate 131.

In this embodiment, the magnet 132 is applied as a permanent magnet. However, if there is no interference with the surroundings and the magnetic force is easy to control, the magnet 132 may be replaced with an electromagnet.

The mask / substrate transfer module 140 supports the mask 100 and the substrate G and serves to transfer the mask 100 and the substrate G to the carrier 110 while being moved relative to the carrier 110 do.

The mask / substrate transfer module 140 supports the mask frame 103 and includes a module support 141 that is moved relative to the carrier 110 and a connection portion 141 that connects the carrier 110 and the module support 141 142).

Although the module support 141 is shown in the form of a simple box, the module support 141 may be provided with an up / down driving means or the like. The up / down driving means may be implemented by a combination of a motor, a ball screw, a cylinder, or the like.

A rotary clamp 143 is coupled to the module support 141. The rotary clamp 143 is rotatably coupled to the module support 141 to clamp the mask 100 and the substrate G to the module support 141 side. 6, the mask 100 and the substrate G are clamped to the module support 141 side.

Finally, the controller 150 controls the operation of the carrier 110 and the mask / substrate transfer module 140.

Such a controller 150 may include a central processing unit 151, a memory 152, a memory 152, and a support circuit 153, as shown in FIG.

The central processing unit 151 may be one of a variety of computer processors that are industrially applicable to control the operation of the carrier 110 and the mask / substrate transfer module 140 in this embodiment.

The memory 152 (MEMORY) is connected to the central processing unit 151. The memory 152 may be a computer-readable recording medium and may be located locally or remotely, and may be any of various types of storage devices, such as random access memory (RAM), read-only memory (ROM), floppy disk, hard disk, At least one or more memories.

A support circuit 153 (SUPPORT CIRCUIT) is coupled with the central processing unit 151 to support the typical operation of the processor. Such a support circuit 153 may include a cache, a power supply, a clock circuit, an input / output circuit, a subsystem, and the like.

In this embodiment, the controller 150 controls the operation of the carrier 110 and the mask / substrate transfer module 140, and such a series of processes and the like can be stored in the memory 152. Typically, a software routine may be stored in the memory 152. The software routines may also be stored or executed by other central processing units (not shown).

Although processes according to the present invention are described as being performed by software routines, it is also possible that at least some of the processes of the present invention may be performed by hardware. As such, the processes of the present invention may be implemented in software executed on a computer system, or in hardware such as an integrated circuit, or in combination of software and hardware.

Hereinafter, the process of attaching the substrate and the mask will be sequentially described with reference to FIGS. 3 to 7. FIG.

3, the mask frame 103 of the mask 100 is disposed on the module support 141 of the mask / substrate transfer module 140 as shown in FIG. In the mask frame 103, the double-structured substrate supporting mask sheet 101 and the substrate-contacting mask sheet 102 are already tightly stretched and welded.

Next, as shown in FIG. 5, the substrate G is transferred to the upper portion of the mask 100 and is seated. 5, it is assumed that the substrate G and the substrate sheet 102 for close contact with each other are already in close contact with each other, but this will be represented for the sake of convenience.

In particular, the substrate G and the mask sheet 102 for substrate adherence are not yet in a completely close contact state.

After the substrate G is seated on the upper side of the mask 100, the rotary clamp 143 is rotated in place as shown in FIG. 5 to FIG. 6 to clamp the mask 100 and the substrate G to the side of the module support 141 .

When the clamping process is completed, the mask / substrate transfer module 140 is operated up to the carrier 110 as shown in FIG. Of course, in the opposite case, i.e., the carrier 110 may be operated downward toward the mask / substrate transfer module 140.

When the mask / substrate transfer module 140 including the mask 100 and the substrate G is operated up to the carrier 110, the magnetic force of the magnets 132 provided on the carrier 110 causes the substrate / The mask sheet 101 and the substrate masking mask sheet 102 are pulled together and brought into close contact with the magnetic force chuck 130 together with the substrate G. [

Particularly, as described above, since the substrate support mask sheet 101 plays a role of supporting the substrate G and the substrate contact mask sheet 102 plays a role of keeping the substrate sheet G in close contact with the substrate G, Even if the magnetic force of the magnets 132 is strong, the substrate G and the mask 100 can be attached to the carrier 110 without a problem of substrate G damage or scratch of the substrate G. [

After the substrate G and the mask 100 are closely attached to the carrier 110, the carrier 110 enters the process module PM and proceeds with the deposition process.

According to this embodiment having such a structure and operation, even if the substrate G is enlarged, the substrate G can be stably supported. In particular, in a precise position, the mask 100 is brought into close contact with the substrate G, (not shown).

In addition, according to the present embodiment, it is possible to effectively prevent the substrate G damage or the scratching of the substrate G from occurring during the process of attaching the substrate G and the mask 100 .

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Accordingly, such modifications or variations are intended to fall within the scope of the appended claims.

100: mask 101: mask support sheet for supporting a substrate
102: substrate-adhering mask sheet 103: mask frame
110: Carrier 120: Carrier body
130: magnetic force chuck 131: chuck plate
132: Magnet 140: Mask / substrate transfer module
141: module support 142: connection
143: Rotary clamp 150: Controller

Claims (17)

A plurality of mask sheets having a plurality of layers and supporting a substrate while being in contact with the substrate and a mask frame having a mask frame welded to the plurality of layers of the mask sheet, ;
A carrier transportable to a vacuum chamber for the deposition process on the substrate and attaching the substrate to the mask by a magnetic force; And
And a mask / substrate transfer module for supporting the mask and the substrate and transferring the mask and the substrate to the carrier while being relatively moved with respect to the carrier. The method according to claim 1,
The multi-layered mask sheet is characterized in that,
A mask sheet for supporting the substrate; And
And a substrate-contact mask sheet which is in contact with the substrate-supporting mask sheet and is in close contact with the substrate. 3. The method of claim 2,
Wherein the thickness of the substrate-contacting mask sheet is thinner than the thickness of the substrate-supporting mask sheet. 3. The method of claim 2,
Wherein the thickness of the substrate support mask sheet is 0.2 mm-0.3 mm, and the thickness of the substrate adhesion mask sheet is 0.02 mm-0.02 mm. 3. The method of claim 2,
Wherein the substrate support mask sheet and the substrate contact mask sheet are made of INVAR material and are welded to each other. 3. The method of claim 2,
Wherein the substrate support mask sheet is formed with a plurality of holes that allow bending thereof. The method according to claim 6,
Wherein the plurality of holes have a shape of an elongated hole and are continuously disposed around the mask support sheet for supporting the substrate. The method according to claim 1,
Further comprising a controller for controlling the operation of the mask / substrate transfer module. 9. The method of claim 8,
Wherein the mask /
A module support supporting the mask frame and being moved relative to the carrier; And
And a connecting portion connecting the carrier and the module support. 10. The method of claim 9,
Wherein the mask /
Further comprising a rotatable clamp rotatably coupled to the module support for clamping the mask and the substrate to the module support. ≪ Desc / Clms Page number 17 > The method according to claim 1,
The carrier
Carrier body; And
And a magnetic force chuck provided on one side of the carrier body for generating a magnetic force for an attachment value of the mask. 12. The method of claim 11,
The magnetic force chuck comprises:
Chuck plate; And
And a plurality of magnets coupled to the chuck plate. ≪ Desc / Clms Page number 15 > 13. The method of claim 12,
Wherein the magnet is a permanent magnet. The method according to claim 1,
The substrate is an organic light emitting diode (OLED)
Wherein the substrate is a large substrate having a length / width of about 2 m. delete delete delete

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