KR102138625B1 - Thin film forming apparatus - Google Patents

Abstract

The present invention provides a thin film forming apparatus for preventing the replacement of an optical mask according to the form of a pixel to be formed, a chamber for providing a process space, a target substrate in which the pattern formation region is defined, provided in the process space A stage for supporting, a transfer substrate supported on the target substrate and having a transfer material to be transferred to the target substrate, and a light transmitting portion for passing light so that the transfer material is transferred to the pattern formation region, the pattern formation region And a light source for irradiating light onto the transfer substrate through the light transmission portion, and the mask module includes a plurality of masks having openings, and the plurality of masks to form the light transmission portion. Each of the openings is overlapped by moving at least one, and the plurality of masks includes a first mask in which a plurality of openings are formed in a first direction, and a second mask in which a plurality of openings are formed in the same or different directions from the first direction. Including, the first mask and the second mask is characterized in that only one of the masks are moved or moved in different directions so that the area of the overlapping opening is variable.

Description

Thin film forming device {THIN FILM FORMING APPARATUS}

The present invention relates to a thin film forming apparatus.

Recently, various flat panel display devices capable of reducing weight and volume, which are disadvantages of a cathode ray tube, have been developed. Such a flat panel display device includes a liquid crystal display (LCD), a field emission display (FED), a plasma display panel (PDP), and an electroluminescence device. .

The PDP has attracted attention as a display device that is thin and advantageous for large size due to its simple structure and manufacturing process, but has a disadvantage of low luminous efficiency, low luminance, and high power consumption. TFT LCD (Thin Film Transistor LCD) is the most widely used, but there is a problem that the viewing angle is narrow and the response speed is low. The electroluminescent device is roughly classified into an inorganic light emitting diode display device and an organic light emitting diode display device according to the material of the light emitting layer. Among them, the organic light emitting diode display device is a light emitting device that emits light by itself, and has a fast response speed, high luminous efficiency, high luminance, and wide viewing angle There are advantages.

An organic light emitting diode (OLED) of an organic light emitting diode display device includes an organic compound layer that emits light, and a cathode electrode and an anode electrode that face each other with an organic compound layer interposed therebetween. The organic compound layer includes an electron injection layer (EIL), an electron transport layer (ETL), an emission layer (EML), a hole transport layer (HTL) and a hole injection layer (Hole Injection Layer: HIL).

When a driving voltage is applied to the anode electrode and the cathode electrode, holes passing through the hole transport layer and electrons passing through the electron transport layer are moved to the emission layer to form excitons, and as a result, the emission layer emits visible light.

In order to realize full color, the organic light emitting diode display device forms a light emitting layer at positions where OLEDs are to be disposed in each of the R (red), G (green), and B (blue) pixels. The light emitting layer is patterned for each pixel.

Here, the optical mask for patterning the pixel on the substrate is manufactured to include a light transmission portion of a predetermined size. In the conventional thin film forming apparatus for forming a pixel thin film on a substrate, different optical masks must be applied according to pixels of various sizes. Such an optical mask is required to have high performance in order to increase the transfer efficiency according to laser reflectance, laser pass rate, and the like, and to prevent damage to the optical mask by light and heat. However, in the related art, when the shape or size of a pixel formed on a substrate is changed, it is necessary to replace it with an optical mask that can correspond to the shape or size of the corresponding pixel, which is expensive and requires replacing the optical mask whenever the pixel is changed. There is a hassle-prone problem.

The present invention has been devised to solve the above-mentioned problems, and it is a technical problem to provide a thin film forming apparatus for preventing the replacement of the optical mask according to the shape of the formed pixel.

In addition to the technical problems of the present invention mentioned above, other features and advantages of the present invention are described below, or it will be clearly understood by those skilled in the art from the description and description.

The thin film forming apparatus according to the present invention for achieving the above-described technical problem is installed in a chamber for providing a process space, a stage for supporting a target substrate in which a pattern formation region is defined, and supported by the target substrate, Through a transfer substrate on which a transfer material to be transferred is formed on the target substrate, a mask module overlapping a light transmitting portion passing light to the pattern forming region so that the transfer material is transferred to the pattern forming region, and the light transmitting portion A light source for irradiating light to the transfer substrate, the mask module includes a plurality of masks having openings, and at least one of the plurality of masks is moved to overlap each opening to form the light transmitting portion, , The plurality of masks include a first mask in which a plurality of openings are formed in a first direction, and a second mask in which a plurality of openings are formed in the same or different directions as the first direction, wherein the first mask and the second The mask may be moved only in one direction or in different directions so that the area of the overlapping opening is variable.

According to the solving means of the above problem, the present invention does not need to be replaced with different masks according to the shape of various pixels, and accordingly, there is no need to manufacture different masks, thereby reducing the mask production period and cost.

In addition, the present invention can reduce the overall time of the thin film formation process by omitting the mask replacement step, and by adjusting the positions of the plurality of masks in an aperture manner, it is possible to effectively respond to pixels of various sizes from minimum to maximum size. Improve it.

1 and 2 are cross-sectional views schematically showing an operating state of the thin film forming apparatus according to the present invention.
3 is a cross-sectional view for explaining a light transmitting portion in the thin film forming apparatus according to the present invention.
4 is a view showing a pixel formed by a thin film forming apparatus according to the present invention.
5 is a perspective view schematically showing first and second moving means according to an example of the present invention.
6 is a perspective view schematically showing first and second moving means according to another example of the present invention.
7 to 9 are perspective views showing various types of masks used in the present invention.

It should be noted that in this specification, when adding reference numerals to components of each drawing, the same components have the same number as possible, even if they are displayed on different drawings.

On the other hand, the meaning of the terms described in this specification should be understood as follows.

It should be understood that a singular expression includes a plurality of expressions unless the context clearly defines otherwise, and the terms "first", "second", etc. are intended to distinguish one component from another component, The scope of rights should not be limited by these terms.

It should be understood that terms such as "include" or "have" do not preclude the presence or addition possibility of one or more other features or numbers, steps, actions, components, parts or combinations thereof.

It should be understood that the term “at least one” includes all possible combinations from one or more related items. For example, the meaning of “at least one of the first item, the second item, and the third item” means 2 of the first item, the second item, or the third item, as well as the first item, the second item, and the third item, respectively. Any combination of items that can be presented from more than one dog.

The term "on" is meant to include not only the case where a certain component is formed on the upper surface of another component, but also when a third component is interposed between these components.

"X-axis direction", "Y-axis direction" and "Z-axis direction" should not be interpreted only as a geometric relationship in which the relationship between each other is vertical, and within a range in which the configuration of the present invention can function functionally It means having direction.

Hereinafter, a preferred embodiment of the thin film forming apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

1 and 2 are cross-sectional views schematically showing an operating state of the thin film forming apparatus according to the present invention, FIG. 3 is a cross-sectional view for explaining a light transmitting unit in the thin film forming apparatus according to the present invention, and FIG. It is a figure showing a pixel formed by a thin film forming apparatus.

1 to 4, the thin film forming apparatus 1 according to the present invention includes a chamber 10, a stage 20, a transfer substrate 30, a mask module 40 and a light source 50 do.

The chamber 10 provides a process space 11 in which a process of transferring an organic thin film is performed. The process space 11 is preferably maintained in a high vacuum state during the process.

The stage 20 is installed in the process space 11 in the chamber 10 to support the target substrate S to which the transfer material is to be transferred.

A pattern forming region P is defined in the target substrate S, and the transfer material is transferred to the pattern forming region P. For example, the target substrate S may be a transistor array substrate included in an organic light emitting display panel.

The organic light emitting display panel includes a plurality of gate lines, a plurality of data lines, a plurality of driving power lines, a plurality of pixels, and a cathode power line. Among them, each of the plurality of pixels includes a pixel driving circuit connected to a gate line, a data line, and a driving power supply line, and an organic light emitting diode connected to the cathode power supply line while being connected to the pixel driving circuit.

The pixel driving circuit includes a switching transistor connected to a gate line and a data line, a switching transistor and a driving transistor connected to the driving power supply line, and a capacitor connected to a gate electrode and a source electrode of the driving transistor. The pixel driving circuit supplies the data signal supplied to the data line to the driving transistor according to the switching of the switching transistor according to the gate signal supplied to the gate line to store the gate-source voltage of the driving transistor corresponding to the data signal in the capacitor, , Turn-on the driving transistor with the voltage stored in the capacitor to supply the data current corresponding to the data signal to the organic light emitting diode.

Accordingly, the pattern formation area P may be defined as an area in which the plurality of pixels E are formed.

The target substrate S is positioned to face the transfer substrate 30 so that the transfer material is transferred. To this end, the stage 20 may include a first seating groove 21 on which the target substrate S is seated and a second seating groove 22 on which the transfer substrate 30 is seated. The first seating groove 21 is concavely formed in a shape corresponding to the shape of the target substrate S to stably support the target substrate S. The second seating groove 22 is concavely formed in a shape corresponding to the integral shape of the transfer substrate 30 and the transfer tray 34 coupled to each other to transfer the transfer substrate 30 and the transfer tray 34. It can be stably supported. As the transfer substrate 30 is formed to have a larger size than the target substrate S, the second seating groove 22 is formed larger than the first seating groove 21. In addition, the second seating groove 22 is formed on an upper portion of the first seating groove 21 and has a step with the first seating groove 21.

A loading means 23 for loading the target substrate S and the transfer substrate 30 may be coupled to the stage 20. In this case, a guide groove for guiding the loading means 23 may be formed on the stage 20. The guide groove may be formed to pass through the stage 20 at positions of the first seating groove 21 and the second seating groove 22.

The loading means 23 may include a first loading means 231 for loading the target substrate S and a second loading means 232 for loading the transfer substrate 30. The loading means 23 may load the target substrate S or the transfer substrate 30 as it moves up and down in the Z-axis direction.

The first loading means 231 includes a plurality of first rods 231a to balancely support the target substrate S, and each of the plurality of first rods 231a is spaced apart from each other and the target substrate The lower surface of (S) can be supported. Each of the plurality of first rods 231a penetrates the stage 20 so that one side is installed on the upper side of the stage 20 and the other side is located on the lower side of the stage 20, and each other side has one. It is coupled to the first support member (231b) of each other. The first loading means 231 rises from the lower side of the stage 20 to the upper side of the stage 20 through the guide groove, supports the target substrate S, and then descends again to move the target substrate ( S) is loaded into the first seating groove 21.

The second loading means 232 includes a plurality of second rods 232a to balancely support the transfer substrate 30, and each of the plurality of second rods 232a is spaced apart from each other to transfer the substrate. The lower surface of (30) can be supported. Each of the plurality of second rods 232a penetrates the stage 20 so that one side is installed above the stage 20 and the other side is positioned below the stage 20, and each other has one It is coupled to the second support member (232b) of the each other. The second loading means 232 rises from the lower side of the stage 20 to the upper side of the stage 20 through the guide groove, supports the transfer substrate 30, and then descends again to transfer the transfer substrate ( 30) is loaded into the second seating groove (22). Here, the second loading means 232 is operated so as not to interfere with the target substrate (S).

A transfer material to be transferred to the target substrate S is formed on the transfer substrate 30. The transfer material may be an organic material forming an organic light emitting display panel when the target substrate S is an organic light emitting display panel. Specifically, for example, the transfer substrate 30 is coated with an organic material for forming the first pixel R, the second pixel G, and the third pixel B on the transistor array substrate.

The thin film forming apparatus 1 according to the present invention can implement a laser induced thermal imaging (LITI) method. To this end, the transfer substrate 30 may include a support substrate 31, a photothermal conversion layer 32 and a transfer layer 33.

The support substrate 31 is formed transparently and can transmit light. The support substrate 31 may be formed in a plate shape to face the target substrate S. The support substrate 31 is formed to a size larger than the target substrate (S).

The photothermal conversion layer 32 is formed on one surface of the support substrate 31 opposite to the target substrate S. The photothermal conversion layer 32 converts light emitted from the light source 50 into thermal energy to apply heat to the transfer layer 33.

The transfer layer 33 is formed on one surface of the photothermal conversion layer 32 facing the target substrate S, and includes the transfer material. The transfer material may be an organic material as described above. The transfer layer 33 is heated by the photothermal conversion layer 32 to transfer a transfer material to the pattern formation region P.

The transfer substrate 30 is fixed to the transfer tray 34 and can be used in the transfer process. The transfer tray 34 supports the transfer substrate 30 and may be formed in a frame shape to support an edge of the transfer substrate 30.

The mask module 40 overlaps the light transmitting portion L through which light passes through the pattern region. Accordingly, light passing through the light transmitting portion L reaches the transfer substrate 30 to transfer the transfer material to the pattern formation region P. Here, light is reached on the transfer substrate 30 overlapping the pattern formation region P.

To this end, the mask module 40 is configured to include a plurality of masks having an opening (M2). The mask module 40 overlaps each opening M2 by moving at least one of the plurality of masks to form the light transmitting portion L.

The plurality of masks may be supported on each tray. For example, the mask module 40 includes first and second masks 41 and 42, and the first and second masks 41 and 42 include first and second trays 411, 421). The second mask 42 overlaps with the first mask 41 to adjust the size of the light transmitting portion L through which the laser passes, and is positioned above the first mask 41.

Specifically, for example, the first tray 411 is formed in a frame shape to support the edge of the first mask 41 and is disposed above the target substrate S. The second tray 421 is formed in a frame shape to support the edge of the second mask 42 and is disposed above the first tray 411. The second tray 421 may be supported to contact the upper side of the first tray 411, or may be positioned to be spaced upward from the first tray 411.

Each of the first and second masks 41 and 42 is transparent to the base plates 41a and 42a through which light is transmitted, and a reflective layer 41b formed on one surface of the base plates 41a and 42a to reflect light. 42b). The base plates 41a and 42a are for supporting the reflective layers 41b and 42b and constitute the body of the mask. The base plates 41a and 42a may be formed of transparent glass. The reflective layers 41b and 42b are intended to block the base plate 41a and 42a from being transmitted by reflecting the laser almost completely. To this end, the reflective layers 41b and 42b may be formed of a metallic material, or may be formed of other materials as long as most lasers can be blocked. Accordingly, in the mask, regions in which the reflective layers 41b and 42b are not formed may be divided into openings M2 and regions in which the reflective layers 41b and 42b are formed are divided into reflective portions M1.

The openings M2 and the reflection parts M1 are formed in the first and second masks 41 and 42, respectively. When the first and second masks 41 and 42 overlap, the laser passes. The light transmitting portion L is formed. The light transmitting portion L is defined as a portion in which the opening M2 of the first mask 41 and the opening M2 of the second mask 42 overlap. The shape and size of the light transmitting portion L may be modified (or adjusted) according to the pattern formation region P, for example, the shape of the pixel E to be formed on the target substrate S. At least one of the first and second masks 41 and 42 moves in a first direction (X-axis direction), a second direction (Y-axis direction), and a diagonal direction, so that the size and shape of the light transmitting portion L Can be adjusted.

Accordingly, the thin film forming apparatus 1 according to the present invention does not need to be replaced with different masks according to the shape of various pixels E, and accordingly, it is not necessary to manufacture different masks, thereby reducing the mask production period and cost. It has an effect. In addition, the thin film forming apparatus 1 according to the present invention can shorten the overall time of the thin film forming process because the mask replacement step is omitted, and adjusts the position of the plurality of masks using the aperture method to minimize the size of pixels of various sizes from the minimum size. It can effectively respond to the maximum size to improve the process capability. In addition, in the thin film forming apparatus 1 according to the present invention, since the first mask 41 is covered by the second mask 42, damage to the mask due to light and heat reaching from the light source is reduced, which has been required in the related art. The burden on the performance of the mask can be lowered and the life of the mask can be extended.

The light transmitting portion L may be formed to correspond to the shape of the pattern forming region P.

The light source 50 emits light to the transfer substrate 30 through the light transmission portion L and is disposed above the second tray 421. The light source 50 emits light to transfer a transfer material (organic thin film) onto the target substrate S. When the light emitted from the light source 50 reaches the transfer substrate 30 through the light transmission portion L, the transfer material is transferred to the target substrate S according to the shape of the light transmission portion L. . Specifically, for example, the light source 50 may emit a laser.

The thin film forming apparatus 1 according to the present invention may further include an optical member disposed between the stage 20 and the first tray 411. The optical member is for vertically emitting light emitted from the light source 50 and incident on the transfer substrate 30, and may be a sheet composed of a prism shape, a lenticular lens shape, or a micro lens shape.

5 is a perspective view schematically showing first and second moving means according to an example of the present invention, and FIG. 6 is a perspective view schematically showing first and second moving means according to another example of the present invention.

5 and 6, the thin film forming apparatus 1 according to the present invention further includes first moving means 60 for moving at least one of the plurality of masks in a first direction (X-axis direction). Can be configured.

For example, the first moving means 60 moves the first tray 411 supporting the first mask 41 in the first direction (X-axis direction) to form the light transmitting portion L. Can be adjusted. Alternatively, the first moving means 60 adjusts the shape of the light transmitting portion L by moving the second tray 421 supporting the second mask 42 in the first direction (X-axis direction). Can. Alternatively, the first moving means 60 adjusts the shape of the light transmitting portion L by moving all of the first tray 411 and the second tray 421 in the first direction (X-axis direction). Can. Accordingly, the first moving means 60 may change the size of the first direction (X-axis direction) of the light transmitting portion L.

The first moving means 60 is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a ball screw method using a motor and a ball screw, a motor, a rack gear, a pinion gear, etc. It can be operated using a gear method using, a belt method using a motor and a pulley and a belt, and a linear motor using a coil and a permanent magnet. The first moving means 60 may include an LM guide rail and an LM guide block guiding the first tray 411 or the second tray 421 to move linearly. It may be.

In addition, the thin film forming apparatus 1 according to the present invention includes second moving means 70 for moving at least one of the plurality of masks in a second direction (Y-axis direction) perpendicular to the first direction (X-axis direction). ) May be further included.

The second moving means 70 may adjust the shape of the light transmitting portion L by moving the first tray 411 supporting the first mask 41 in the second direction (Y-axis direction). . Alternatively, the second moving means 70 adjusts the shape of the light transmitting portion L by moving the second tray 421 supporting the second mask 42 in the second direction (Y-axis direction). Can. Alternatively, the second moving means 70 adjusts the shape of the light transmitting portion L by moving all of the first tray 411 and the second tray 421 in the second direction (Y-axis direction). Can. Accordingly, the second moving means 70 may change the size of the second direction (Y-axis direction) of the light transmitting portion L.

The second moving means 70 may operate using the cylinder method, the ball screw method, the gear method, the belt method, the linear motor, and the like. The second moving means 70 may include an LM guide rail and an LM guide block for guiding the first tray 411 or the second tray 421 to move linearly.

The first and second moving means 60 and 70 may adjust the size of the light transmitting portion L in real time.

2 and 3, the first tray 411 is shown as suspended on the upper portion of the chamber 10, but as shown in FIGS. 4 and 5, the first or second moving means ( 60, 70).

In addition, the first moving means 60 may be implemented by moving the first tray 411 and the second moving means 70 separately moving the second tray 421.

And, in Figures 3 and 4, the tray is coupled to the second moving means 70, the second moving means 70 is shown as coupled to the first moving means 60, on the contrary, the tray is the first moving It may be implemented as being coupled to the means 60 and the first moving means 60 coupled to the second moving means 70.

Meanwhile, the above-described first direction (X-axis direction) and second direction (Y-axis direction) may be implemented interchangeably. That is, the first moving means 60 is in the second direction (Y-axis direction), the second moving means 70 is the first and second trays 411 in the first direction (X-axis direction) , 412).

1 and 2, the thin film forming apparatus 1 according to the present invention provides supply means 80 for supplying each of the target substrate S and the transfer substrate 30 to the process space 11. It may be configured to include more.

The supply means 80 transfers the target substrate S into the chamber 10 and transfers it to the first loading means 231, and then the target substrate S is transferred to the first seating groove 21. After being supported, the transfer substrate 30 may be implemented to be transferred into the chamber 10 and transferred to the second loading means 232.

The supply means 80 may operate using the cylinder method, the ball screw method, the gear method, the belt method, the linear motor, and the like. The supply means 80 may include an LM guide rail and an LM guide block. The supply means 80 may support the target substrate S and the transfer substrate 30 by adsorption or adhesion.

The thin film forming apparatus 1 according to the present invention may be further configured to further include pressing means for closely contacting the target substrate S and the transfer substrate 30. Specifically, for example, the pressing means may move at least one of the target substrate S and the transfer substrate 30. Alternatively, the pressing means may be in close contact between the target substrate S and the transfer substrate 30 by moving the first tray 411 toward the stage 20. Accordingly, the pressing means maintains an airtight state between the target substrate S and the transfer substrate 30 so that the boundary of the transfer material deposited on the target substrate S is not blurry and clear. It can function to be formed.

The pressing means may operate using the cylinder method, the ball screw method, the gear method, the belt method, the linear motor, and the like. The pressing means may include an LM guide rail and an LM guide block that guides the first tray 411 to move linearly.

The pressing means may be coupled to the first or second trays 411 and 412. In this case, the pressing means may press the target substrate S and the transfer substrate 30 by lifting the first or second trays 411 and 412 in the Z-axis direction. The pressing means according to this case may correspond to reference numeral 90 shown in FIGS. 1 and 2.

Hereinafter, some embodiments of combining masks having various shapes to adjust the shape of the light transmitting portion L will be described in detail with reference to the accompanying drawings.

The masks a to h shown in FIGS. 7 to 9 are as follows.

The a-type and b-type masks are formed such that the linear openings M2 are vertically elongated and arranged side by side. The c-type mask is formed such that the reflective portion M1 and the opening M2 are bisected based on a horizontal line. The d-type mask is formed similarly to the c-type mask, but the positions of the reflective portion M1 and the opening M2 are reversed. The e-type and f-type masks are formed such that the linear openings M2 are formed to be horizontally elongated and arranged side by side. The g-type and h-type masks are formed such that the square openings M2 are arranged in a matrix form.

7 is a view showing a light transmitting portion formed by the alignment of the a-d masks.

Referring to FIG. 7, first, a method for adjusting the horizontal width of the light transmitting portion L is to move the a-type mask in the first direction (X-axis direction), and the b-type mask in the first direction (X-axis direction) ), and the a-type mask and the b-type mask may be classified as moving in opposite first directions (X-axis direction).

Next, a method for adjusting the vertical width of the light transmitting portion L is to move the c-type mask in the second direction (Y-axis direction), move the d-type mask in the second direction (Y-axis direction), It can be classified as moving all of the c-type mask and the d-type mask in a second direction (Y-axis direction) opposite to each other.

The method of changing the shape of the light transmission portion L may be variously combined with the above-described width-width adjustment method and length-width adjustment method.

8 is a view showing a combination of a-type, b-type, e-type and f-type masks.

Referring to FIG. 8, first, a method for adjusting the horizontal width of the light transmitting portion L is to move the a-type mask in the first direction (X-axis direction), and the b-type mask in the first direction (X-axis direction) ), and the a-type mask and the b-type mask may be classified as moving in opposite first directions (X-axis direction).

Next, the method for adjusting the vertical width of the light transmitting portion L is to move the e-type mask in the second direction (Y-axis direction), to move the f-type mask in the second direction (Y-axis direction), It can be classified as moving all of the e-type mask and the f-type mask in a second direction (Y-axis direction) opposite to each other.

The method of changing the shape of the light transmission portion L may be variously combined with the above-described width-width adjustment method and length-width adjustment method.

9 is a view showing a combination of g-type and h-type masks.

Referring to FIG. 9, first, a method for adjusting the horizontal width of the light transmitting portion L is to move a g-type mask in a first direction (X-axis direction), and a h-type mask in a first direction (X-axis direction) ), and the g-type mask and all of the h-type mask may be classified as moving in a first direction (X-axis direction) opposite to each other.

Next, a method for adjusting the vertical width of the light transmitting portion L is to move the g-type mask in the second direction (Y-axis direction), move the h-type mask in the second direction (Y-axis direction), It can be classified as moving all of the g-type mask and the h-type mask in a second direction (Y-axis direction) opposite to each other.

The method of changing the shape of the light transmission portion L may be variously combined with the above-described width-width adjustment method and length-width adjustment method. At this time, each of the g-type and h-type masks may be moved in both the first and second directions (X-axis and Y-axis directions).

The method of forming a thin film using the thin film forming apparatus 1 according to the present invention may be performed by first supporting the target substrate S and the transfer substrate 30 on the stage 20. Here, the first loading means 231 may receive the target substrate S from the supply means 80 and load it on the stage 20. In addition, the second loading means 232 may receive the transfer substrate 30 from the supply means 80 and load it on the stage 20.

Next, the thin film forming method may be performed by forming the mask module 40 so that the light transmitting portion L overlaps the pattern forming region P. Here, at least one of the first and second masks 41 and 42 is moved by at least one of the first and second moving means 60 and 70 so that each of the openings M2 may be positioned to overlap. have.

Finally, in the thin film forming method, a transfer material may be transferred to the pattern formation region P by light incident from the light source 50 to proceed.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and it is common in the technical field to which the present invention pertains that various substitutions, modifications and changes are possible without departing from the spirit of the present invention. It will be clear to those who have the knowledge of Therefore, the scope of the present invention is indicated by the following claims, and all changes or modifications derived from the meaning and scope of the claims and equivalent concepts should be interpreted to be included in the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 Thin film forming apparatus 10 Chamber
11: process space 20: stage
21: first seating groove 22: second seating groove
23: loading means 30: transfer substrate
31: support substrate 32: light-heat conversion layer
33: transfer layer 34: transfer tray
40: mask module 41: first mask
42: second mask 50: light source
60: first moving means 70: second moving means
80: supply means 90: pressurization means
231: first loading means 232: second loading means

Claims (7)

A chamber providing a process space;
A stage installed in the process space and supporting a target substrate on which a pattern formation region is defined;
A transfer substrate supported on the target substrate, wherein a transfer material to be transferred is formed on the target substrate;
A mask module overlapping the light transmitting portion passing light to the pattern forming region so that the transfer material is transferred to the pattern forming region; And
And a light source irradiating light to the transfer substrate through the light transmitting portion,
The mask module,
It includes a plurality of masks having an opening, and by moving at least one of the plurality of masks to form the light transmitting portion, overlap each opening,
The plurality of masks include a first mask in which a plurality of openings are formed in a first direction, and a second mask in which a plurality of openings are formed in the same or different directions as the first direction,
The first mask and the second mask are thin film forming apparatuses in which only one mask is moved or moved in different directions so that the area of the overlapping opening is variable. According to claim 1,
The light transmitting portion is a thin film forming apparatus corresponding to the shape of the pattern forming region. According to claim 2,
The mask module further comprises a first moving means for moving at least one of the plurality of masks in a first direction. The method of claim 3,
The mask module further comprises a second moving means for moving at least one of the plurality of masks in a second direction perpendicular to the first direction. According to claim 1,
The transfer substrate,
A support substrate that transmits light;
A photothermal conversion layer formed on one surface of the support substrate opposite to the target substrate; And
A thin film forming apparatus formed on one surface of the photothermal conversion layer opposite to the target substrate, and including a transfer layer containing the transfer material, The method according to any one of claims 1 and 5,
The transfer material is a thin film forming apparatus that is an organic material forming an organic thin film display panel. According to claim 1,
And a supply means for supplying each of the target substrate and the transfer substrate to the process space.

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