KR20150074261A - Thin film forming apparatus - Google Patents

Abstract

The present invention provides a thin film forming apparatus to prevent an optical mask from being replaced in accordance with a type of pixel formed, comprising: a chamber providing a process space; a stage installed in the process space, supporting a target substrate wherein a pattern forming area is defined; a transfer material supported by the target substrate, wherein a transfer material transferred on the target substrate is formed; a mask module overlapping a light penetration unit passing light on the pattern forming area for the transfer material to be transferred to the pattern forming area; and a light source irradiating light to the transfer substrate through the light penetration unit. The mask module comprises a plurality of masks having an opening port, and overlaps each opening port by moving at least one of the masks to form the light penetration unit.

Description

[0001] THIN FILM FORMING APPARATUS [0002]

The present invention relates to a thin film forming apparatus.

2. Description of the Related Art In recent years, various flat panel display devices capable of reducing weight and volume, which are disadvantages of cathode ray tubes (CRTs), have been developed. Such flat panel display devices include a liquid crystal display (LCD), a field emission display (FED), a plasma display panel (PDP), and an electroluminescence device .

PDP has attracted attention as a display device which is advantageous for thinness and large size because of its simple structure and manufacturing process, but it has a disadvantage of low luminous efficiency, low luminance and high power consumption. Thin film transistor LCD (TFT LCD) is the most widely used but has a narrow viewing angle and low response speed. The electroluminescent device is roughly classified into an inorganic light emitting diode display device and an organic light emitting diode display device depending on the material of the light emitting layer. Among them, the organic light emitting diode display device is a light emitting device which emits itself, has a high response speed and high luminous efficiency, There are advantages.

An organic light emitting diode (OLED) of an organic light emitting diode display device includes an organic compound layer that electroluminesces and a cathode electrode and an anode electrode that face each other with an organic compound layer interposed therebetween. The organic compound layer includes an electron injection layer (EIL), an electron transport layer (ETL), an emission layer (EML), a hole transport layer (HTL), and a hole injection layer HIL). ≪ / RTI >

When driving voltage is applied to the anode electrode and the cathode electrode, holes passing through the hole transporting layer and electrons passing through the electron transporting layer move to the light emitting layer to form excitons, and as a result, the light emitting layer emits visible light.

The organic light emitting diode display device forms a light emitting layer at a position where OLEDs are to be arranged in R (red), G (green), and B (blue) pixels for full color implementation. The light emitting layer is patterned for each pixel.

Here, the optical mask for patterning the pixel on the substrate is fabricated to include a light transmitting portion of a certain size. Conventional thin film forming apparatuses for forming pixel thin films on a substrate require different optical masks according to pixels of various sizes. Such an optical mask is required to have high performance in order to increase the transfer efficiency according to the laser reflectance and the laser passing rate and to prevent damage to the optical mask due to light and heat. However, in the related art, when the shape or size of a pixel formed on a substrate is changed, the optical mask must be replaced with an optical mask capable of coping with the shape and size of the corresponding pixel. There is a problem that troubles occur.

SUMMARY OF THE INVENTION It is a general object of the present invention to provide a thin film forming apparatus for preventing replacement of an optical mask according to the shape of a pixel to be formed.

Other features and advantages of the invention will be set forth in the description which follows, or may be obvious to those skilled in the art from the description and the claims.

According to an aspect of the present invention, there is provided a thin film forming apparatus including a chamber for providing a processing space, a stage for supporting a substrate on which a pattern forming region is defined, the stage being provided in the processing space, A mask module for superimposing a light transmitting portion through which light is allowed to pass through the pattern forming region so that the transfer material is transferred to the pattern forming region, Wherein the mask module includes a plurality of masks having openings, wherein at least one of the plurality of masks is moved to form the light transmitting portions, .

According to the solution of the above-mentioned problems, the present invention does not need to replace the masks with different masks according to the shape of various pixels, and thus, it is not necessary to manufacture different masks, thereby reducing the manufacturing time and cost of masks.

Further, the present invention can shorten the overall time of the thin film forming process by omitting the mask replacing step, and effectively adjusts the positions of the pixels of various sizes from the minimum size to the maximum size by adjusting the positions of the plurality of masks by the iris method, Can be improved.

1 and 2 are sectional views schematically showing an operation state of a thin film forming apparatus according to the present invention.
3 is a cross-sectional view illustrating a light transmitting portion in the thin film forming apparatus according to the present invention.
4 is a view showing a pixel formed by the thin film forming apparatus according to the present invention.
5 is a perspective view schematically showing first and second moving means according to an example of the present invention.
6 is a perspective view schematically showing first and second moving means according to another example of the present invention.
7 to 9 are perspective views showing various types of masks used in the present invention.

It should be noted that, in the specification of the present invention, the same reference numerals as in the drawings denote the same elements, but they are numbered as much as possible even if they are shown in different drawings.

Meanwhile, the meaning of the terms described in the present specification should be understood as follows.

The word " first, "" second," and the like, used to distinguish one element from another, are to be understood to include plural representations unless the context clearly dictates otherwise. The scope of the right should not be limited by these terms.

It should be understood that the terms "comprises" or "having" does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

It should be understood that the term "at least one" includes all possible combinations from one or more related items. For example, the meaning of "at least one of the first item, the second item and the third item" means not only the first item, the second item or the third item, but also the second item and the second item among the first item, Means any combination of items that can be presented from more than one.

The term "on" means not only when a configuration is formed directly on top of another configuration, but also when a third configuration is interposed between these configurations.

The terms "X-axis direction "," Y-axis direction ", and "Z-axis direction" should not be construed solely by the geometric relationship in which the relationship between them is vertical, Directional.

Hereinafter, preferred embodiments of the thin film forming apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

3 is a cross-sectional view for explaining a light transmitting portion in the apparatus for forming a thin film according to the present invention, and FIG. 4 is a cross-sectional view illustrating a light transmitting portion according to an embodiment of the present invention. Film forming apparatus shown in Fig.

1 to 4, a thin film forming apparatus 1 according to the present invention includes a chamber 10, a stage 20, a transfer substrate 30, a mask module 40, and a light source 50, do.

The chamber 10 is provided with a process space 11 in which a process of transferring the organic thin film is performed. The process space 11 is preferably maintained in a high vacuum state during the process.

The stage 20 is installed in the process space 11 in the chamber 10 to support a substrate S to which a transfer material is to be transferred.

A pattern formation region P is defined in the target substrate S and the transfer material is transferred to the pattern formation region P. [ For example, the target substrate S may be a transistor array substrate included in the organic light emitting display panel.

The organic light emitting display panel includes a plurality of gate lines, a plurality of data lines, a plurality of driving power supply lines, a plurality of pixels, and a cathode power supply line. Each of the plurality of pixels includes a pixel driving circuit connected to a gate line, a data line, and a driving power supply line, and an organic light emitting diode connected to the pixel driving circuit and connected to the cathode power supply line.

The pixel driving circuit includes a switching transistor connected to the gate line and the data line, a switching transistor, a driving transistor connected to the driving power line, and a capacitor connected to a gate electrode and a source electrode of the driving transistor. In such a pixel driving circuit, a switching transistor is switched according to a gate signal supplied to a gate line, a data signal supplied to the data line is supplied to the driving transistor, and the gate-source voltage of the driving transistor corresponding to the data signal is stored in the capacitor , And supplies the data current corresponding to the data signal to the organic light emitting diode by turning on the driving transistor with the voltage stored in the capacitor.

Accordingly, the pattern formation region P may be defined as a region where the plurality of pixels E are formed.

The target substrate S is located opposite to the transfer substrate 30, and the transfer material is transferred. The stage 20 may include a first seating groove 21 on which the target substrate S is placed and a second seating groove 22 on which the transfer substrate 30 is placed. The first seating groove 21 may be concavely formed in a shape corresponding to the shape of the target substrate S to stably support the target substrate S. The second seating groove 22 is recessed in a shape corresponding to the integrated form of the transfer substrate 30 and the transfer tray 34 so that the transfer substrate 30 and the transfer tray 34 And can be stably supported. The second seating groove 22 is formed to be larger than the first seating groove 21 as the transfer substrate 30 is formed to have a larger size than the target substrate S. The second seating groove 22 is formed at the upper portion of the first seating groove 21 and has a step with the first seating groove 21.

A loading means 23 for loading the target substrate S and the transfer substrate 30 may be coupled to the stage 20. In this case, a guide groove for guiding the loading means 23 may be formed on the stage 20. The guide groove may be formed to pass through the stage 20 at the positions of the first seating groove 21 and the second seating groove 22.

The loading means 23 may include a first loading means 231 for loading the target substrate S and a second loading means 232 for loading the transfer substrate 30. The loading means 23 can load the target substrate S or the transfer substrate 30 as it moves up and down in the Z-axis direction.

The first loading means 231 may include a plurality of first rods 231a to balance the target substrate S and each of the plurality of first rods 231a may be spaced apart from each other, (S). Each of the plurality of first rods 231a is installed so that one side of the first rod 231a passes through the stage 20 and the other side of the stage 20 is positioned below the stage 20, And is connected to the first supporting member 231b. The first loading means 231 ascends from the lower side of the stage 20 through the guide groove to the upper side of the stage 20 to support the target substrate S, S to the first seating groove 21.

The second loading unit 232 includes a plurality of second rods 232a for supporting the transfer substrate 30 in a balanced manner and each of the plurality of second rods 232a is spaced apart from each other, It is possible to support the lower surface of the base 30. Each of the plurality of second rods 232a is installed such that one side of the second rod 232a passes through the stage 20 and the other side of the stage 20 is positioned below the stage 20, And are connected to each other. The second loading means 232 ascends from the lower side of the stage 20 through the guide groove to the upper side of the stage 20 to support the transfer substrate 30 and then descend again to transfer the transfer substrate 30) into the second seating groove (22). Here, the second loading unit 232 operates so as not to interfere with the target substrate S.

A transfer material to be transferred to the target substrate S is formed on the transfer substrate 30. The transfer material may be an organic material forming the organic light emitting display panel when the target substrate S is an organic light emitting display panel. Specifically, for example, the transfer substrate 30 is coated with an organic material for forming the first pixel R, the second pixel G, and the third pixel B on the transistor array substrate.

The thin film forming apparatus 1 according to the present invention can implement Laser Induced Thermal Imaging (LITI). For this, the transfer substrate 30 may include a support substrate 31, a photo-thermal conversion layer 32, and a transfer layer 33.

The support substrate 31 is formed to be transparent and can transmit light. The support substrate 31 may be formed in a plate shape so as to face the target substrate S. The support substrate 31 is formed to have a size larger than that of the target substrate S.

The photo-thermal conversion layer 32 is formed on one surface of the support substrate 31 opposite to the target substrate S. The light-to-heat conversion layer 32 converts the light emitted from the light source 50 into thermal energy to apply heat to the transfer layer 33.

The transfer layer 33 is formed on one surface of the photothermal conversion layer 32 facing the target substrate S and includes the transfer material. The transfer material may be an organic material as described above. The transfer layer 33 is heated by the photo-thermal conversion layer 32 to transfer the transfer material to the pattern formation region P.

This transfer substrate 30 can be fixed to the transfer tray 34 and used for a transfer process. The transfer tray 34 supports the transfer substrate 30 and may be formed in a frame shape to support the edge of the transfer substrate 30.

The mask module 40 superimposes a light transmitting portion L for allowing light to pass through the pattern region. Thus, the light passing through the light transmitting portion L reaches the transfer substrate 30, and the transfer material can be transferred to the pattern forming region P. Here, light reaches the transfer substrate 30 overlaid on the pattern formation region P. [

To this end, the mask module 40 comprises a plurality of masks having openings M2. The mask module 40 moves at least one of the plurality of masks to overlap each of the openings M2 to form the light transmitting portion L. [

The plurality of masks may be supported in respective trays. For example, the mask module 40 may include first and second masks 41 and 42, and the first and second masks 41 and 42 may include first and second trays 411 and 42, 421). The second mask 42 is disposed on the upper side of the first mask 41 in order to adjust the size of the light transmission portion L which is overlapped with the first mask 41 and the laser passes through.

Specifically, for example, the first tray 411 is formed in a frame shape so as to support an edge of the first mask 41, and is disposed on the upper side of the target substrate S. The second tray 421 is formed in a frame shape to support the edge of the second mask 42 and is disposed on the upper side of the first tray 411. The second tray 421 may be held in contact with the upper side of the first tray 411 or may be spaced upward from the first tray 411.

Each of the first and second masks 41 and 42 includes a base plate 41a and 42a that is transparent and transmits light and a reflective layer 41b that is formed on one surface of the base plate 41a and reflects light, 42b. The base plates 41a and 42a support the reflective layers 41b and 42b and constitute the body of the mask. The base plates 41a and 42a may be formed of a transparent glass. The reflective layers 41b and 42b are provided to substantially completely reflect the laser so as to prevent the base plate 41a and 42a from transmitting. For this, the reflective layers 41b and 42b may be formed of a metal material and may be formed of other materials as long as they can shield most of the lasers. Accordingly, the mask may be divided into the openings M2 in which the reflective layers 41b and 42b are not formed and the reflective portions M1 in which the reflective layers 41b and 42b are formed.

When the first and second masks 41 and 42 are overlapped with each other, the laser beam passes through the first and second masks 41 and 42, A light transmitting portion L is formed. The light transmitting portion L is defined as a portion where the opening M2 of the first mask 41 and the opening M2 of the second mask 42 overlap. The light transmitting portion L may be deformed (or adjusted) in shape and size depending on the pattern forming region P, for example, the shape of the pixel E to be formed on the target substrate S. At least one of the first and second masks 41 and 42 moves in a first direction (X-axis direction), a second direction (Y-axis direction), and a diagonal direction, Can be adjusted.

Accordingly, the thin film forming apparatus 1 according to the present invention does not have to be replaced with different masks according to the shape of various pixels E, and accordingly, it is not necessary to manufacture different masks, . In addition, the thin film forming apparatus 1 according to the present invention can shorten the overall time of the thin film forming process by omitting the mask replacing step. By adjusting the positions of the plurality of masks by the iris method, It is possible to effectively cope with the maximum size and improve the process capability. In the thin film forming apparatus 1 according to the present invention, since the first mask 41 is covered by the second mask 42, the damage of the mask due to the light and heat reached from the light source is reduced, The burden on the performance of the mask can be reduced, and the life of the mask can be prolonged.

The light transmitting portion L may be formed to correspond to the pattern formation region P.

The light source 50 emits light to the transfer substrate 30 through the light transmitting portion L and is disposed on the upper side of the second tray 421. The light source 50 emits light to transfer the transfer material (organic thin film) onto the target substrate S. When the light emitted from the light source 50 reaches the transfer substrate 30 through the light transmission portion L, the transfer material is transferred to the target substrate S according to the shape of the light transmission portion L . Specifically, for example, the light source 50 may emit a laser.

The thin film forming apparatus 1 according to the present invention may further comprise an optical member disposed between the stage 20 and the first tray 411. The optical member may be a sheet made of a prism, a lenticular lens, a microlens, or the like in order to emit the light emitted from the light source 50 and incident on the transfer substrate 30 in a vertical direction.

FIG. 5 is a perspective view schematically showing first and second moving means according to an example of the present invention, and FIG. 6 is a perspective view schematically showing first and second moving means according to another example of the present invention.

5 and 6, the thin film forming apparatus 1 according to the present invention further includes a first moving means 60 for moving at least one of the plurality of masks in a first direction (X-axis direction) Lt; / RTI >

For example, the first moving means 60 moves the first tray 411 supporting the first mask 41 in the first direction (X-axis direction) to form the shape of the light transmitting portion L Can be adjusted. Alternatively, the first moving means 60 may move the second tray 421 supporting the second mask 42 in the first direction (X-axis direction) to adjust the shape of the light transmitting portion L . Alternatively, the first moving means 60 moves the entire first tray 411 and the second tray 421 in the first direction (X-axis direction) to adjust the shape of the light transmitting portion L . Accordingly, the first moving means 60 can change the size of the light transmitting portion L in the first direction (X-axis direction).

The first moving means 60 may be a cylinder type using a hydraulic cylinder or a pneumatic cylinder, a ball screw type using a motor and a ball screw, a motor, a rack gear and a pinion gear A belt system using a motor, a pulley and a belt, a linear motor using a coil and a permanent magnet, and the like. The first moving means 60 includes an LM Guide Rail and an LM Guide Block for guiding the first tray 411 or the second tray 421 to linearly move It is possible.

The thin film forming apparatus 1 according to the present invention further includes second moving means 70 for moving at least one of the plurality of masks in a second direction (Y-axis direction) perpendicular to the first direction (X-axis direction) ). ≪ / RTI >

The second moving means 70 may adjust the shape of the light transmitting portion L by moving the first tray 411 supporting the first mask 41 in the second direction (Y axis direction) . Alternatively, the second moving means 70 may move the second tray 421 supporting the second mask 42 in the second direction (Y-axis direction) to adjust the shape of the light transmitting portion L . Alternatively, the second moving means 70 may move all of the first tray 411 and the second tray 421 in the second direction (Y-axis direction) to adjust the shape of the light transmitting portion L . Accordingly, the second moving means 70 can change the size of the light transmitting portion L in the second direction (Y-axis direction).

The second moving means 70 may be operated by using the cylinder type, the ball screw type, the gear type, the belt type, the linear motor, or the like. The second moving means 70 may include an LM guide rail and an LM guide block for guiding the first tray 411 or the second tray 421 to linearly move.

The first and second moving means 60 and 70 can adjust the size of the light transmitting portion L in real time.

2 and 3, the first tray 411 is shown suspended from the upper portion of the chamber 10, but the first tray 411 may be suspended from the first or second moving means 60, and 70, respectively.

The first moving means 60 may be configured to move the first tray 411 and the second moving means 70 may move the second tray 421 separately.

3 and 4 show that the tray is coupled to the second moving means 70 and the second moving means 70 is shown coupled to the first moving means 60, May be implemented by being coupled to the means 60 and the first moving means 60 being coupled to the second moving means 70.

Meanwhile, the first direction (X-axis direction) and the second direction (Y-axis direction) may be realized by exchanging. That is, the first moving means 60 is moved in the second direction (Y-axis direction) and the second moving means 70 is moved in the first direction (X-axis direction) And 412, respectively.

1 and 2, a thin film forming apparatus 1 according to the present invention includes a supply means 80 for supplying each of the target substrate S and the transfer substrate 30 to the process space 11 And the like.

The supply means 80 transfers the target substrate S into the chamber 10 and transfers the target substrate S to the first loading means 231 and then the target substrate S is transferred to the first mounting groove 21 Transferring the transfer substrate 30 into the chamber 10 and transferring the transfer substrate 30 to the second loading means 232 after the substrate is supported.

The supplying means 80 may be operated using the cylinder type, the ball screw type, the gear type, the belt type, the linear motor, or the like. The supply means 80 may include an LM guide rail and an LM guide block. The supplying means 80 can support the target substrate S and the transfer substrate 30 by an adsorption or adhesion method.

The thin film forming apparatus 1 according to the present invention may further comprise a pressing means for bringing the target substrate S and the transfer substrate 30 into close contact with each other. Specifically, for example, the pressing means can move at least one of the target substrate (S) and the transfer substrate (30). Alternatively, the pressing means may bring the target substrate S and the transfer substrate 30 into close contact with each other by moving the first tray 411 toward the stage 20. Accordingly, the pressing unit maintains the airtight state between the target substrate S and the transfer substrate 30 so that the boundaries of the transferred materials deposited on the target substrate S are not blurry, As shown in FIG.

The pressing means may be operated using the cylinder type, the ball screw type, the gear type, the belt type, the linear motor, or the like. The pressing unit may include an L guide rail and an L guide block for guiding the first tray 411 to linearly move.

The pressing means may be coupled to the first or second tray 411, 412. In this case, the pressing means can press the target substrate S and the transfer substrate 30 by moving the first or second tray 411 or 412 in the Z-axis direction. The pressing means according to this case may correspond to the numeral 90 shown in FIG. 1 and FIG.

Hereinafter, some embodiments for combining various types of masks to adjust the shape of the light transmitting portion L will be described in detail with reference to the accompanying drawings.

The a-type to h-type masks shown in Figs. 7 to 9 are as follows.

The a-type and b-type masks are formed such that straight opening portions M2 are longitudinally long and arranged side by side. The c-type mask is formed so that the reflective portion M1 and the opening portion M2 are bisected based on the horizontal line. The d-type mask is formed similarly to the c-type mask, but the positions of the reflective portion M1 and the opening M2 are reversed. The e-type and f-type masks are formed such that straight opening portions M2 are elongated horizontally and are aligned in a vertical direction. The g-type and h-type masks are formed such that the rectangular opening portions M2 are arranged in a matrix form.

7 is a view showing a light transmitting portion formed by alignment of the a-type to the d-type masks.

7, the method for adjusting the lateral width of the light transmitting portion L includes moving the a-type mask in the first direction (X-axis direction), moving the b-type mask in the first direction ), And moving the a-type mask and the b-type mask in a first direction (X-axis direction) opposite to each other.

Next, a method for adjusting the vertical width of the light transmitting portion L includes moving the c-type mask in the second direction (Y-axis direction), moving the d-type mask in the second direction (Y-axis direction) and moving all of the c-type mask and the d-type mask in the second direction (Y-axis direction) opposite to each other.

The method of changing the shape of the light transmitting portion L may be variously performed by combining the above-described width adjusting method and the vertical width adjusting method.

Fig. 8 is a view showing a combination of a type, b type, e type and f type masks.

8, the method for adjusting the lateral width of the light transmitting portion L includes moving the a-type mask in the first direction (X-axis direction), moving the b-type mask in the first direction ), And moving the a-type mask and the b-type mask in a first direction (X-axis direction) opposite to each other.

Next, a method for adjusting the vertical width of the light transmitting portion L includes moving the e-type mask in the second direction (Y-axis direction), moving the f-type mask in the second direction (Y-axis direction) and moving the e-type mask and the f-type mask in a second direction (Y-axis direction) opposite to each other.

The method of changing the shape of the light transmitting portion L may be variously performed by combining the above-described width adjusting method and the vertical width adjusting method.

FIG. 9 is a view showing a combination of g-type and h-type masks.

9, the method for adjusting the lateral width of the light transmission portion L includes moving the g-type mask in the first direction (X-axis direction), moving the h-type mask in the first direction ), And moving the g-type mask and the h-type mask in the first direction (X-axis direction) opposite to each other.

Next, a method for adjusting the vertical width of the light transmission portion L includes moving the g-type mask in the second direction (Y-axis direction), moving the h-type mask in the second direction (Y-axis direction) and moving the g-type mask and the h-type mask in the second direction (Y-axis direction) opposite to each other.

The method of changing the shape of the light transmitting portion L may be variously performed by combining the above-described width adjusting method and the vertical width adjusting method. At this time, each of the g-type and h-type masks can be moved in both the first and second directions (X-axis and Y-axis directions).

The thin film forming method using the thin film forming apparatus 1 according to the present invention may be performed by sequentially supporting the target substrate S and the transfer substrate 30 on the stage 20. Here, the first loading means 231 may receive the target substrate S from the supplying means 80 and load the target substrate S onto the stage 20. The second loading means 232 may receive the transfer substrate 30 from the supply means 80 and load the transfer substrate 30 onto the stage 20.

Next, the thin film forming method may be performed by forming the light transmitting portion L so that the mask module 40 overlaps the pattern forming region P. At least one of the first and second masks 41 and 42 is moved by at least one of the first and second moving means 60 and 70 so that the respective openings M2 can be positioned to overlap have.

Finally, in the thin film forming method, the transfer material may be transferred to the pattern formation region P by the light incident from the light source 50 and proceed.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Will be clear to those who have knowledge of. Therefore, the scope of the present invention is defined by the appended claims, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be interpreted as being included in the scope of the present invention.

1: Thin film forming apparatus 10: Chamber
11: process space 20: stage
21: first seating groove 22: second seating groove
23: loading means 30: transfer substrate
31: support substrate 32: photo-thermal conversion layer
33: transfer layer 34: transfer tray
40: mask module 41: first mask
42: second mask 50: light source
60: first moving means 70: second moving means
80: Supply means 90: Pressurizing means
231: first loading means 232: second loading means

Claims (7)

A chamber for providing a process space;
A stage installed in the process space for supporting a target substrate on which a pattern forming region is defined;
A transfer substrate supported on the target substrate and having a transfer material to be transferred to the target substrate;
A mask module for superimposing a light transmitting portion through which light is allowed to pass through the pattern formation region so that the transfer material is transferred to the pattern formation region; And
And a light source for irradiating light to the transfer substrate through the light transmitting portion,
Wherein the mask module comprises:
And a plurality of masks having openings, wherein at least one of the plurality of masks is moved to form the light transmitting portions, thereby overlapping the respective openings. The method according to claim 1,
Wherein the light transmitting portion corresponds to the shape of the pattern forming region. 3. The method of claim 2,
Wherein the mask module further comprises first moving means for moving at least one of the plurality of masks in a first direction. The method of claim 3,
Wherein the mask module further comprises second moving means for moving at least one of the plurality of masks in a second direction perpendicular to the first direction. The method according to claim 1,
Wherein the transfer substrate comprises:
A support substrate through which light is transmitted;
A photo-thermal conversion layer formed on one surface of the support substrate facing the target substrate; And
And a transfer layer formed on one surface of the photo-thermal conversion layer facing the target substrate, the transfer layer including the transfer material. 6. The method according to claim 1 or 5,
Wherein the transfer material is an organic material forming an organic thin film display panel. The method according to claim 1,
Further comprising feeding means for feeding each of the target substrate and the transfer substrate to the process space.

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