KR101508309B1 - Apparatus and method for attaching glass and mask - Google Patents

Abstract

This invention is related to an attachment apparatus for the glass substrate and mask and its operational method. According to an embodiment, the attachment apparatus for the glass substrate and mask can be transmitted to the vacuum chamber in order to proceed the deposition process on the glass substrate. The present invention includes: a complex carrier that attaches the glass substrate and metal mask based on electrostatic force and magnetic force; a glass substrate transmission module that delivers the glass substrate to the complex carrier; and a mask transmission module that delivers the mask to the complex carrier.

Description

Technical Field [0001] The present invention relates to an apparatus and a method for attaching a substrate and a mask,

The present invention relates to an apparatus and a method for attaching a substrate and a mask, and more particularly, to a method and apparatus for attaching a mask to a substrate after precisely aligning the mask even if the substrate becomes large, To an apparatus and a method for attaching a substrate and a mask capable of improving efficiency.

As a result of the rapid development of information and communication technology and the expansion of the market, a flat panel display is attracting attention as a display device.

Such flat panel display devices include liquid crystal display devices, plasma display panels, and organic light emitting diodes.

Among these organic electroluminescent devices, for example, OLEDs have very good advantages such as high response speed, lower power consumption than conventional LCD, light weight, no need for a separate backlight device, And has been attracting attention as a next generation display device.

Such an organic electroluminescent device is a principle in which an anode film, an organic thin film, and a cathode film are sequentially formed on a substrate, and a voltage is applied between the anode and the cathode to form a proper energy difference in the organic thin film and emit light by itself.

In other words, the injected electrons and holes are recombined, and the excitation energy generated is generated by light. At this time, since the wavelength of light generated according to the amount of the dopant of the organic material can be controlled, full color can be realized.

1 is a structural view of an organic electroluminescent device (OLED).

As shown in this figure, an organic electroluminescent device includes an anode, a hole injection layer, a hole transfer layer, an emitting layer, a hole blocking layer, an electron injection layer, a cathode, and the like are stacked in this order.

In this structure, ITO (Indium Tin Oxide), which has small surface resistance and good transparency, is mainly used as the anode. The organic thin film is composed of a multilayer of a hole injecting layer, a hole transporting layer, a light emitting layer, a hole blocking layer, an electron transporting layer, and an electron injecting layer in order to increase the luminous efficiency. Organic materials used as the light emitting layer include Alq3, TPD, PBD, m-MTDATA, and TCTA. As the cathode, a LiF-Al metal film is used. And since the organic thin film is very weak to moisture and oxygen in the air, a sealing film for sealing is formed at the top to increase the lifetime of the device.

1, the organic electroluminescent device includes an anode, a cathode, and a light emitting layer interposed between the anode and the cathode. When the organic electroluminescent device is driven, holes are injected from the anode into the light emitting layer , Electrons are injected into the light emitting layer from the cathode. The holes and electrons injected into the light emitting layer are combined in the light emitting layer to generate excitons, and the excitons emit light while transitioning from the excited state to the ground state.

Such an organic electroluminescent device can be classified into a monochromatic or full color organic electroluminescent device according to the color to be realized. The full-color organic electroluminescent device includes red (R), green (G) and And a light emitting layer patterned for each blue (B) color is provided to realize a full color.

In the full-color organic electroluminescent device, the patterning of the light-emitting layer may be performed differently depending on the material forming the light-emitting layer.

OLED deposition methods for patterning the light emitting layer include a horizontal deposition method using FMM (Fine Metal Mask), a method using a LITI (Laser Induced Thermal Imaging) method, a method using a color filter, an SMS (Small Mask Scanning) .

In order to apply the FMM horizontal deposition system, the substrate and the mask are first attached. In the conventional case, the substrate is transported in a face down state such that the substrate faces downward , A mask sheet (Mask Sheet) is brought into close contact with the substrate, and a magnet is brought close to the upper portion to attach the substrate and the mask, followed by the deposition process.

At this time, a method of using a tray and a method of using a chuck may be considered to transport the substrate in a face down state.

However, when the tray is used, the amount of deflection of the substrate increases together with the size of the substrate, which makes it difficult to carry or align the substrate. Therefore, usually, a chuck, for example, an electrostatic chuck or an adhesive chuck is used.

However, when the substrate is transported in a face down state using an electrostatic chuck or an adhesive chuck as before, it is very difficult to accurately align the mask and attach it to the substrate. It is necessary to develop the structure considering the issues.

Korea Patent Office Application No. 10-2011-0023958

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide an apparatus and a method for attaching a mask to a substrate, which can improve the process efficiency by aligning the mask precisely even after the substrate is enlarged, Apparatus and method.

According to an aspect of the present invention there is provided a method of manufacturing a composite carrier capable of transferring to a vacuum chamber for the deposition process on a substrate and attaching the substrate to a metal mask on the basis of electrostatic force and magnetic force, (carrier); A substrate transfer module for transferring the substrate to the composite carrier; And a mask transfer module for transferring the mask to the composite carrier can be provided.

The composite carrier comprising: a carrier body; An electrostatic chuck provided at one side of the carrier body to generate an electrostatic force for an attachment of the substrate; And a magnetic force chuck provided on the carrier body adjacent to the electrostatic chuck to generate a magnetic force for an attachment of the mask.

The electrostatic chuck may be a fixed electrostatic chuck having a ceramic or PI film coated on or adhered to its surface and fixed to a lower end portion of the carrier body. The magnetic chuck may be attached to the electrostatic chuck on the carrier body, It can be a movable magnetic force chuck which is moved in a detachable manner.

The composite carrier may further include a magnetic chuck guide provided on the carrier body to guide movement of the movable magnetic force chuck.

Wherein the movable magnetic force chuck comprises: a slider coupled to the magnetic force chuck guide and moved by the magnetic force chuck guide; And a plurality of magnets coupled to the slider.

The magnet may be a permanent magnet.

A substrate attaching zone where the substrate is attached to the composite carrier on the vacuum chamber and a mask attach zone where the mask is attached to the composite carrier can be distinguished from each other.

The substrate transfer module may be movably disposed in the substrate trap zone, and the mask transfer module may be movably disposed in the mask trap zone.

Wherein the substrate transfer module includes: a driving body for transferring a substrate that is moved toward or away from the composite carrier; And a plurality of substrate supporting pins provided on the substrate transfer driving body to support the substrate.

And the plurality of substrate supporting pins may be disposed on the substrate transfer driving body such that the projection height gradually decreases from a central region of the substrate transferring driver to a side region.

The mask transfer module may include a driver for transferring the mask, which is moved toward or away from the composite carrier; And a plurality of mask supporting pins which are movably coupled to the driver for driving the mask and which move the mask toward or away from the composite carrier independently of the operation of the driver for driving the mask .

The substrate transfer module may further include a controller for controlling operations of the composite carrier, the substrate transfer module, and the mask transfer module. The substrate may be an organic light emitting diode, And may be a large substrate having a length of about 2 m or so.

According to another aspect of the present invention, there is provided a method of manufacturing an electrostatic chuck, comprising: a substrate attaching step of transferring a substrate to an electrostatic chuck provided at one side of a composite carrier to attach the substrate with an electrostatic force of the electrostatic chuck; And a mask attaching step of transferring a metal mask to the substrate, and attaching the mask with a magnetic force of a magnetic force chuck provided in the composite carrier. have.

Wherein the mask attaching step comprises: pressing the side region of the mask to adhere to the substrate; And moving the magnetic force chuck to the electrostatic chuck area.

The substrate attaching step may be performed individually in a glass attachment zone, and the mask attaching step may proceed individually in a mask attach zone.

According to the present invention, even if the substrate is enlarged, the mask can be accurately aligned and then the mask can be attached to the substrate, thereby improving the process efficiency.

1 is a structural view of an organic electroluminescent device (OLED).
FIG. 2 is a diagram illustrating a substrate attach zone and a mask attach zone in a vacuum chamber to which an attach device for a substrate and a mask according to an embodiment of the present invention is applied.
FIGS. 3 to 10 are views showing steps of attaching the substrate and the mask, respectively.
11 is a control block diagram of an attach device of a substrate and a mask according to an embodiment of the present invention.

In order to fully understand the present invention, operational advantages of the present invention, and objects achieved by the practice of the present invention, reference should be made to the accompanying drawings and the accompanying drawings which illustrate preferred embodiments of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Like reference symbols in the drawings denote like elements.

FIG. 2 is a diagram illustrating a substrate attach zone and a mask attach zone in a vacuum chamber to which an attach device for a substrate and a mask according to an embodiment of the present invention is applied, and FIGS. 3 to 10 are views FIG. 11 is a control block diagram of an attach device of a substrate and a mask according to an embodiment of the present invention. FIG.

Referring to these drawings, the substrate and mask attaching apparatus according to the present embodiment can efficiently attach the substrate and the metal mask even if the substrate is enlarged, thereby improving the process efficiency A substrate transfer module 150 for transferring the substrate to the composite carrier 110, and a substrate transfer module 150 for transferring the mask to the composite carrier 110. [ A mask transfer module 160, and a controller 170 for controlling them.

In the case of FIG. 2, a plurality of process modules PM are arranged in the vacuum chamber 100 for depositing two kinds of organic or inorganic materials. However, the scope of the present invention can also be applied to a vacuum chamber in which only one process module (PM) is disposed.

2 will be described. The composite carrier 110 on which the substrate is mounted, that is, the substrate to which the substrate is attached, enters the first process module PM to perform the deposition process for the substrate. The composite carrier 110 is transferred to the first process module PM The mask is detached from the substrate after the mask is attached to the substrate and the mask is attached and the deposition process is completed through the process module PM.

In the same manner, the composite carrier 110 performs the deposition process by attaching or detaching the mask to the second process module PM.

For reference, the substrate used in the present embodiment is an organic light emitting diode (OLED), and may be a large substrate having a length of about 2 m or more. And the mask is applied as a mask sheet without a frame on the side.

As shown in the diagram in Fig. 2, in this embodiment, a substrate attachment zone (Glass Attach Zone) where a substrate is attached to the composite carrier 110 on the vacuum chamber 100 and a mask The mask attachment zones are distinguished from each other. That is, the substrate is attached to the composite carrier 110 in the substrate attach zone, and the mask is attached or detached in the mask attach zone.

After separating the substrate attaching zone and the mask attaching zone from each other, the substrate is flattened in the substrate attaching zone, and then the mask is closely attached to the flattened substrate in the mask attaching zone, / Even if a large substrate having a length of about 2 m is applied, it is possible to solve the problem that it is difficult to attach the substrate and the mask effectively due to the sagging phenomenon of the substrate.

Hereinafter, the composite carrier 110, the substrate transfer module 150, and the mask transfer module 160 will be described in detail.

The composite carrier 110 is a transfer body for transferring the vacuum chamber 100 for advancing the deposition process on the substrate, and attaches the substrate and the mask based on electrostatic force and magnetic force.

The composite carrier 110 includes a carrier body 120, an electrostatic chuck 130 provided at one side of the carrier body 120 to generate an electrostatic force for an attachment of the substrate, an electrostatic chuck 130 adjacent to the carrier body 130 120 for generating a magnetic force for an attachment of the mask.

The carrier body 120 is a structure for supporting the electrostatic chuck 130 and the magnetic force chuck 140. Although the carrier body 120 is schematically shown in the drawing, the carrier body 120 can be moved in and out of the vacuum chamber 100 by a rail transfer method, a magnetic levitation method, or the like.

The electrostatic chuck 130 is provided on one side of the carrier body 120 to generate an electrostatic force for an attachment of the substrate.

Particularly, in this embodiment, the electrostatic chuck 130 is provided with a stationary electrostatic chuck 130 which is fixed at the lower end of the carrier body 120.

Since the stationary electrostatic chuck 130 is fixed to the lower end of the carrier body 120 and the substrate is attached thereto, the substrate is attached to the face down state facing downward, and then, through the composite carrier 110 Lt; / RTI >

For reference, the electrostatic chuck 130 (ES-Chuck) is simplified briefly. A chuck is a device for holding a substrate during a process, mainly divided into an E-chuck and an M-chuck. The M-chuck mechanically presses the substrate, so it can generate particles on the substrate and also make the edge of the substrate useless.

However, the development of electrostatic chuck 130, which is being applied in this embodiment, has disappeared.

The electrostatic chuck 130, that is, the fixed electrostatic chuck 130, which is being applied in the present embodiment, is a device in which a substrate is held by an electrostatic force, that is, an electrostatic force, Improved the problem.

The electrostatic chuck 130 may have a Uni-polar, a Bi-polar, or a Tri-polar type.

In the Uni-polar type, only positive voltage is applied to the chuck, and it is attached to the ground by plasma generation. In order to detach it, reverse bias should be applied do. If the opposite reverse bias is not applied, the substrate is attracted for several to several tens of minutes even if the power supply is interrupted.

The Bi-polar type is a structure that becomes a dictation when the reverse bias of the applied voltage is applied to the chuck by applying the +/- DC voltage to the chuck. The chuck itself allows attachment or dictation, and has the advantage that no plasma is required.

The tri-polar type is similar to the Bi-polar type. One of the other is to read the DC self bias (Bias) generated in the plasma and compensate for the +/- voltage by Vdc, so that the net charge ) Should be zeroed.

The fixed electrostatic chuck 130 applied in the present embodiment applies Bi-polar type among the above-described types. This is advantageous because the substrate can be continuously adsorbed for several to several tens of minutes even if the power supply is interrupted while the substrate is in the attached state. However, uni-polar type or tri-polar type electrostatic chuck may be used.

Meanwhile, in the present embodiment, in order to maintain the flatness of the electrostatic chuck 130 when applying the electrostatic chuck 130, a thick Al plate may be used. In this case, the magnetic chuck 140 A space can be formed inside the magnet 142 so that the magnet 142 can move with a clearance.

Ceramic or PI film may be thinly coated or adhered to the surface of the electrostatic chuck 130.

In order to use the electrostatic chuck 130, a charge must be collected on the surface. For this purpose, a ceramic or a PI film may be coated or adhered thinly on the surface of the electrostatic chuck 130.

The magnetic force chuck 140 is provided on the carrier body 120 adjacent to the electrostatic chuck 130 and serves to generate a magnetic force for the attachment of the mask.

Since the mask is made of metal, it can be attracted to the substrate by the magnetic force of the magnetic force chuck 140 and attached to the substrate.

The electrostatic chuck 130 is provided as a fixed electrostatic chuck 130 while the magnetic force chuck 140 is disposed on the carrier body 120 so that the movable magnetic force chuck 130, (140).

A magnetic force chuck guide 145 for guiding the movement of the movable magnetic force chuck 140 is provided on the carrier body 120 for moving the movable magnetic chuck 140. The magnetic force chuck guide 145 may be applied, for example, as an LM guide or the like.

The movable magnetic force chuck 140 includes a slider 141 coupled to the magnetic force chuck guide 145 and moved by the magnetic chuck guide 145 and a plurality of magnets 142 coupled to the slider 141 .

The movable magnetic force chuck 140 having the slider 141 and the plurality of magnets 142 is a means for bringing a metal mask made of a metal into close contact with a substrate. Or Sm-Co may be used.

Before the movable magnetic force chuck 140 moves up and down to close the metal mask, the metal mask must be spaced apart from the metal mask so that the metal mask does not adhere to the substrate by the magnetic force. After the metal mask and the substrate are closely contacted, It is necessary to move the metal mask and the substrate firmly so that the shadow mask does not occur. This operation will be explained in the following operation.

In this embodiment, the magnet 142 is applied as a permanent magnet. However, if there is no interference with the surroundings and the magnetic force is easy to control, the magnet 142 may be replaced with an electromagnet.

As described above, in the vacuum chamber 100, a substrate attaching zone where a substrate is attached to the composite carrier 110, a mask attach zone where a mask is attached to the composite carrier 110, Attach Zone are distinguished from each other.

Thus, the substrate transfer module 150 is movably disposed in the substrate attach zone to transfer substrates from the substrate attach zone to the composite carrier 110, and the mask transfer module 160 is movably disposed in the mask attach zone Thereby transferring the mask to the substrate surface of the composite carrier 110.

The substrate transfer module 150 includes a substrate transfer actuator 151 that is moved toward or away from the composite carrier 110 and a plurality of substrate support pins 152 ).

Although the substrate transfer actuator 151 is shown in the form of a simple box, the substrate transfer actuator 151 may be provided with an up / down drive means. The up / down driving means may be implemented by a combination of a motor, a ball screw, a cylinder, or the like.

The substrate supporting pins 152 are used to bring the substrate into close contact with the surface of the stationary electrostatic chuck 130 and allow the substrate to adhere to the stationary electrostatic chuck 130 while bending the substrate.

To this end, the substrate supporting pins 152 are disposed on the substrate transfer driving body 151 such that the projecting height gradually decreases from the central area of the substrate transferring actuator 151 to the side area.

As the substrate supporting pins 152 are arranged in an arch shape, the central deflection of the large substrate can be prevented, and the substrate can be flatly extended and attached to the fixed electrostatic chuck 130.

For reference, the substrate supporting pins 152 can prevent a substrate from being damaged by providing a device having a cushion, for example, a spring.

The mask transfer module 160 includes a mask transfer actuator 161 that is moved toward or away from the composite carrier 110 and a mask transfer actuator And a plurality of mask supporting pins 162 for moving the mask toward or away from the composite carrier 110 separately from the operation of the mask carrier 161.

Although the mask transfer actuator 161 is also shown for simplicity, the mask transfer actuator 161 may also be provided with an up / down drive means or the like. The up / down driving means may be implemented by a combination of a motor, a ball screw, a cylinder, or the like.

The mask supporting pins 162 are coupled to the side of the mask driving actuator 161 so as to be movable up and down.

7, when the mask driving actuator 161 operates the mask up to a certain distance as shown in FIG. 6, the mask supporting pins 162 are moved in the same direction as the mask driving driving body 161 Independently of the operation, pushes up the end portion of the mask to make the end of the mask come into contact with the substrate.

In the state where the end of the mask is in contact with the substrate by the action of the mask supporting pins 162, the mask of the metal material is pulled by the magnetic force of the movable magnetic force chuck 140 to come into contact with the substrate, So that it can be attached.

As a result of the two-step operation, that is, the primary operation of the driving body 161 for mask delivery and the secondary operation of the mask supporting pins 162, the mask is contacted to the substrate all at once, Can be prevented.

The controller 170 controls the operation of the composite carrier 110, the substrate transfer module 150, and the mask transfer module 160.

Such a controller 170 may include a central processing unit 171 (CPU), a memory 172 (MEMORY), and a support circuit 173 (SUPPORT CIRCUIT) as shown in FIG.

The central processing unit 171 may be one of a variety of computer processors that are industrially applicable to control the operation of the composite carrier 110, the substrate transfer module 150 and the mask transfer module 160 in this embodiment .

The memory 172 (MEMORY) is connected to the central processing unit 171. The memory 172 may be a computer-readable recording medium and may be located locally or remotely and may be any of various types of storage devices, including, for example, random access memory (RAM), ROM, floppy disk, hard disk, At least one or more memories.

The support circuit 173 (SUPPORT CIRCUIT) is coupled with the central processing unit 171 to support the typical operation of the processor. Such a support circuit 173 may include a cache, a power supply, a clock circuit, an input / output circuit, a subsystem, and the like.

In this embodiment, the controller 170 controls the operation of the composite carrier 110, the substrate transfer module 150, and the mask transfer module 160, and such a series of processes and the like can be stored in the memory 172. Typically, a software routine may be stored in memory 172. The software routines may also be stored or executed by other central processing units (not shown).

Although processes according to the present invention are described as being performed by software routines, it is also possible that at least some of the processes of the present invention may be performed by hardware. As such, the processes of the present invention may be implemented in software executed on a computer system, or in hardware such as an integrated circuit, or in combination of software and hardware.

Although not shown in the drawing, a mask holder and an alignment stage may be further included in the attaching device of the substrate and the mask according to the present embodiment. The mask holder and the alignment stage can play a role of closely aligning the mask and the substrate after precisely aligning the mask and the substrate.

Hereinafter, the process of attaching the substrate and the mask will be sequentially described with reference to FIGS. 3 to 10. FIG.

First, the composite carrier 110 having the fixed electrostatic chuck 130 and the movable magnetic force chuck 140 enters the substrate attachment zone (Glass Attach Zone). The substrate transfer module 150 is disposed below the composite carrier 110 as shown in FIG.

Then, a separate fork type robot transfers the substrate to the substrate transfer module 150 as shown in FIG. The transferred substrate is bent and arranged in an arch shape by the structural characteristics of the substrate supporting pins 152.

In this state, the substrate transfer module 150 is operated up as shown in FIG. The substrate is flatly spread by the electrostatic force of the fixed electrostatic chuck 130 instantaneously as soon as the substrate is brought into contact with the fixed electrostatic chuck 130 of the composite carrier 110 by the up operation of the substrate transfer module 150, Can be worn. After the substrate is attached, the substrate transfer module 150 is returned to the original position.

Next, the composite carrier 110 to which the substrate is attached enters a mask attach zone.

The composite carrier 110 to which the substrate is attached may be transferred to a mask attachment zone, which is a separate chamber for attaching the mask via a roller or magnetic levitation manner.

In the mask attachment zone, the mask transfer module 160 is disposed below the composite carrier 110 as shown in FIG. A mask is disposed on the mask transfer module 160 by a separate transfer.

In this state, the mask transfer module 160 is operated as shown in FIG. In other words, the mask delivery actuator 161 stops the mask after a certain distance up operation as shown in FIG. 6 in FIG. The distance may be about 1 mm.

After the mask is driven up to a predetermined position by the driving body 161 for transferring the mask, the mask supporting pins 162 are separated from the operation of the mask driving actuator 161 And the end of the mask is pushed up. Then, the end portion of the mask can be brought into contact with the substrate while being in close contact with the substrate.

After the end of the mask is brought into contact with the substrate by the operation of the mask supporting pins 162 as shown in FIG. 8, the movable magnetic force chuck 140 is guided down by the magnetic force chuck guide 145 as shown in FIG. 9 And approaches the stationary electrostatic chuck 130.

As the magnets 142 of the movable magnetic force chuck 140 approach the stationary electrostatic chuck 130 as shown in FIG. 9, the magnetic force of the magnets 142 causes the mask of the metal material to be attracted to the substrate.

Particularly, since the entire mask is pulled by the magnetic force of the magnets 142 in the state where the end portion of the mask is in contact with the substrate in advance, the mask can be attached with flat contact with the substrate without crying.

As a result of the two-step operation, that is, the primary operation of the driving body 161 for mask delivery and the secondary operation of the mask supporting pins 162, the substrate is damaged and scratched Can be prevented.

In addition, since the sheet-like mask can be attached directly to the substrate without crying, there is no shadow, and the problem of lowering the pattern accuracy can be adequately solved. In addition, the substrate damage or substrate scratch problem It can be relieved.

The mask carrier module 160 is returned to the original position as shown in FIG. 10, and the composite carrier 110 enters the process module PM to perform the deposition process. Go ahead.

According to the present embodiment having such a structure and operation, even if the substrate is enlarged, the substrate and the mask can be efficiently attached, and the process efficiency can be improved.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Accordingly, such modifications or variations are intended to fall within the scope of the appended claims.

110: composite carrier 120: carrier body
130: electrostatic chuck 140: magnetic force chuck
141: Slider 142: Magnet
145: magnetic chuck guide 150: substrate transfer module
151: driving body for substrate transfer 152: pin for supporting a substrate
160: Mask transfer module 161: Mask transfer actuator
162: pin for holding mask 170: controller

Claims (15)

A composite carrier transportable to a vacuum chamber for the deposition process to the substrate and attaching the substrate and the metal mask based on electrostatic force and magnetic force;
A substrate transfer module for transferring the substrate to the composite carrier; And
And a mask delivery module for delivering the mask to the composite carrier,
A substrate attaching zone where the substrate is attached to the composite carrier on the vacuum chamber and a mask attach zone where the mask is attached to the composite carrier are distinguished from each other, Wherein the substrate and the mask are attached to each other. The method according to claim 1,
Wherein the composite carrier comprises:
Carrier body;
An electrostatic chuck provided at one side of the carrier body to generate an electrostatic force for an attachment of the substrate; And
And a magnetic force chuck provided on the carrier body adjacent to the electrostatic chuck to generate a magnetic force for an attachment value of the mask. 3. The method of claim 2,
Wherein the electrostatic chuck is a stationary electrostatic chuck in which a ceramic or PI film is coated or adhered to a surface thereof and is fixed to a lower end portion of the carrier body,
Wherein the magnetic force chuck is a movable magnetic force chuck that is moved on the carrier body so as to approach or move away from the electrostatic chuck. The method of claim 3,
Wherein the composite carrier comprises:
Further comprising a magnetic chuck guide provided on the carrier body for guiding the movement of the movable magnetic force chuck. 5. The method of claim 4,
Wherein the movable type magnetic force chuck comprises:
A slider coupled to the magnetic force chuck guide and moved by the magnetic force chuck guide; And
And a plurality of magnets coupled to the slider. ≪ Desc / Clms Page number 19 > 6. The method of claim 5,
Wherein the magnet is a permanent magnet. delete The method according to claim 1,
Wherein the substrate transfer module is movably disposed in the substrate trap zone,
Wherein the mask transfer module is movably disposed in the mask attach zone. The method according to claim 1,
The substrate transfer module includes:
A driving body for transferring a substrate which is moved toward or away from the composite carrier; And
And a plurality of substrate supporting pins provided on the driving body for substrate transfer to support the substrate. 10. The method of claim 9,
Wherein the plurality of substrate supporting pins are disposed on the substrate transfer driving body such that the projecting height gradually decreases from a central region of the substrate transfer driving body toward a side region. . The method according to claim 1,
The mask transfer module includes:
A driving body for transferring the mask, which is moved toward or away from the composite carrier; And
And a plurality of mask supporting pins which are movably coupled to the driving body for transmitting a mask and which move the mask toward or away from the composite carrier independently of the operation of the driving body for transmitting a mask. Wherein the substrate and the mask are attached to each other. The method according to claim 1,
Further comprising a controller for controlling operation of the composite carrier, the substrate transfer module, and the mask transfer module,
The substrate is an organic light emitting diode (OLED)
Wherein the substrate is a large substrate having a length / width of about 2 m. A substrate attaching step of transferring a substrate to an electrostatic chuck provided at one side of a composite carrier and attaching the substrate with an electrostatic force of the electrostatic chuck; And
And a mask attaching step of transferring a metal mask to the substrate, and attaching the mask with a magnetic force of a magnetic force chuck provided in the composite carrier,
Wherein the substrate attaching step is performed individually in a glass attach zone and the mask attaching step is performed individually in a mask attach zone. How to burn. 14. The method of claim 13,
The mask attaching step includes:
Pressing the side region of the mask to adhere to the substrate; And
And moving the magnetic force chuck to the electrostatic chuck area. delete

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