KR101702762B1

KR101702762B1 - Subside prevention device

Info

Publication number: KR101702762B1
Application number: KR1020150105587A
Authority: KR
Inventors: 이명진; 이재진; 장정호; 박희재
Original assignee: 에스엔유 프리시젼 주식회사
Priority date: 2015-07-27
Filing date: 2015-07-27
Publication date: 2017-02-07

Abstract

The present invention relates to a substrate sag prevention device. The substrate sag prevention device is installed in a vapor deposition chamber and prevents sagging of a vapor deposition substrate arranged with the vapor deposition surface facing downward. The substrate sag prevention device includes: a plurality of support members installed in the vapor deposition chamber and supporting the vapor deposition substrate by being in contact with an edge portion of the vapor deposition surface of the vapor deposition substrate; and a pressing member installed to press an outer portion of the opposite surface of the vapor deposition substrate opposite to the deposition surface, rather than a portion of the opposite surface in contact with the support member, from above. Thus, when the vapor deposition substrate is placed in the vapor deposition chamber, the edge of the substrate is pressed alternately by the support member and the pressing member, thereby preventing the substrate from sagging. In addition, the support member is shaped to have a curved surface that gradually curves outwardly from bottom to top so that the substrate sag prevention device can be aligned even when the substrate is fixed with the pressing member from the upper side of the substrate.

Description

[0001] SUBSIDE PREVENTION DEVICE [0002]

The present invention relates to a substrate deflection preventing device, and more particularly, to a substrate deflection preventing device, which is configured to place a substrate on a supporting member when mounting a vapor deposition substrate in an evaporation chamber for manufacturing an organic electroluminescence device, To prevent sagging of the substrate.

In general, a flat panel display device includes a liquid crystal display (LCD), a plasma display panel (PDP), and an organic light emitting diode (OLED).

Among these organic electroluminescent devices, for example, OLEDs have very good advantages such as high response speed, lower power consumption than conventional LCD, light weight, no need for a separate backlight device, And has been attracting attention as a next generation display device.

Such an organic electroluminescent device is a principle in which an anode film, an organic thin film, and a cathode film are sequentially formed on a substrate, and a voltage is applied between the anode and the cathode to form a proper energy difference in the organic thin film and emit light by itself.

In other words, the injected electrons and holes are recombined, and the excitation energy generated is generated by light.

At this time, since the wavelength of light generated according to the amount of the dopant of the organic material can be controlled, full color can be realized.

1 is a structural view of an organic electroluminescent device. 1, an organic electroluminescent device includes an anode, a hole injection layer, a hole transport layer, an emitting layer, a hole blocking layer, an electron injection layer, a cathode, and the like are stacked in this order.

In this structure, ITO (Indium Tin Oxide), which has small surface resistance and good transparency, is mainly used as the anode.

The organic thin film is composed of a multilayer of a hole injecting layer, a hole transporting layer, a light emitting layer, a hole blocking layer, an electron transporting layer, and an electron injecting layer in order to increase the luminous efficiency.

The organic material used as the light emitting layer include _{Alq 3, TPD, PBD, m} -MTDATA, TCTA. As the cathode, a LiF-Al metal film is used.

And since the organic thin film is very weak to moisture and oxygen in the air, a sealing film for sealing is formed at the top to increase the lifetime of the device.

1, the organic electroluminescent device includes an anode, a cathode, and a light emitting layer interposed between the anode and the cathode. When the organic electroluminescent device is driven, holes are injected from the anode into the light emitting layer, The electrons are injected into the light emitting layer from the cathode. The holes and electrons injected into the light emitting layer are combined in the light emitting layer to generate excitons, and the excitons emit light while transitioning from the excited state to the ground state.

Such an organic electroluminescent device can be classified into a monochromatic or full color organic electroluminescent device according to the color to be realized. The full-color organic electroluminescent device includes red (R), green (G) and And a light emitting layer patterned for each blue (B) color is provided to realize a full color.

In the full-color organic electroluminescent device, the patterning of the light-emitting layer may be performed differently depending on the material forming the light-emitting layer.

OLED deposition methods for patterning the light emitting layer include a direct patterning method using a fine metal mask (hereinafter, referred to as a mask), a method using a LITI (Laser Induced Thermal Imaging) method, a method using a color filter, Mask Scanning) deposition method.

When a large-sized OLED is manufactured by applying a mask method, a so-called horizontal type upward deposition method is employed in which a substrate and a patterned mask are horizontally arranged in a chamber and then deposited.

The horizontal upward deposition method is a method of aligning a substrate horizontally arranged on a bottom surface of a chamber or the like and a mask, and then depositing the organic material on the large substrate in a horizontal state.

However, as the size of the OLED becomes larger, the size and weight of the mask are becoming larger and larger. In this case, since the mask is sagged in the direction of gravity and it is difficult to closely adhere the mask to the substrate, A difficult problem arises.

The most important issue in the process of OLED deposition is the particle issue.

As described above, the OLED deposits organic materials during the deposition process and realizes the display by the principle of emitting light by the deposited organic substances. Therefore, if particles are generated during the organic material deposition process, the OLEDs become a problem in the finished product as defects.

Meanwhile, in the SMS deposition method, which is one of the above-described OLED deposition methods, a carrier for transferring a substrate and a substrate from a loading position is attached before the glass enters the evaporation zone And the substrate is introduced into the evaporation zone in a state in which the substrate is attached to the carrier.

At this time, in the case of a large substrate, a problem such as sagging occurs, so that the following process flow is achieved.

To allow the substrate to adhere to the chuck of the carrier in a face-up state with the carrier positioned at the bottom and the substrate loaded at the top of the carrier.

When the substrate is attached, the carrier is turned upside down, that is, a flip process is performed so that the substrate faces downward.

In this state, the substrate and the carrier are moved to the evaporation zone, and when the process is completed, the flip process is performed again so that the substrate faces upward, then the substrate is unloaded and the carrier is returned to the original position.

However, in the case of such a conventional technique, tact time is increased because it is necessary to repeatedly perform the flipping process between the loading and unloading process and the evaporation process, There is a problem in that there is a concern that particles are generated.

If the substrate is attached to the carrier in a face-down state in order to simplify the process by removing the flip process, a slip phenomenon occurs due to spreading of the substrate while attaching the substrate, Thereby adversely affecting the alignment accuracy caused by the alignment.

Further, in the process of loading the substrate on the substrate mounting table, there is a problem that it is difficult to carry out the deposition operation as the enlarged substrate is deflected downward due to its own weight.

Korean Patent Publication No. 10-2007-0103353 Korean Patent Publication No. 10-2014-0086450

SUMMARY OF THE INVENTION The present invention has been made to solve the conventional problems as described above, and it is an object of the present invention to provide an apparatus and a method for preventing a substrate from being sagged by allowing a substrate edge to be staggered by a supporting member and a pressing member, And a substrate deflection preventing device.

Another object of the present invention is to provide a device for preventing sagging of a substrate which is formed so as to have a curved surface that curves outwardly as the shape of the supporting member increases toward the upper side so that the substrate can be aligned even when the substrate is fixed with the pressing member in the upward direction of the substrate.

According to an aspect of the present invention, there is provided an apparatus for preventing sagging of an evaporation donor substrate, the evaporation donor substrate being disposed in the evaporation chamber, the evaporation donor substrate facing downward, A plurality of support members provided to support the vapor deposition substrate so as to abut the edge portions of the vapor deposition surface of the vapor deposition substrate; And a pressing portion which is installed to press the outer portion of the opposite side of the vapor deposition surface of the evaporation donor substrate from the portion contacting with the supporting member from the upward direction.

Here, the support member may be formed to include a curved surface bent outwardly upward from the bottom surface.

The pressing portion may include a cylinder disposed to face the support member at an upper edge of the substrate and installed to move the cylinder shaft in the vertical direction, and a pressing member provided at the end of the cylinder.

In addition, the cylinder axis may be installed such that the center thereof is located outside the center of the support member.

The pressing member may be disposed eccentrically to the outside of the cylinder.

According to the present invention, there is provided a substrate deflection preventing device capable of preventing sagging of a substrate by causing the substrate edge to be staggered by the supporting member and the pressing member when the vapor deposition substrate is placed inside the vapor deposition chamber.

Further, the supporting member is formed so as to have a curved surface that curves outwardly as the shape of the supporting member is upward, so that the substrate can be prevented from sagging even when the substrate is fixed with the pressing member in the upward direction of the substrate.

1 is a structural view of an organic electroluminescent device,
FIG. 2 is a plan view of a substrate sag preventing device according to the first embodiment of the present invention,
Figure 3 is a side view of Figure 2,
Figs. 4 and 5 are operational state diagrams of Fig.

Prior to the description, components having the same configuration are denoted by the same reference numerals as those in the first embodiment. In other embodiments, configurations different from those of the first embodiment will be described do.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a substrate sag preventing device according to a first embodiment of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 2 is a plan view of the substrate sag prevention device according to the first embodiment of the present invention, and FIG. 3 is a side view of FIG.

2 and 3, a substrate deflection prevention device according to the first embodiment of the present invention is installed in a deposition chamber including a fingering 10 and a pressing portion 20. As shown in FIG.

In addition, the substrate deflection preventing device may be spaced apart along the edge of the long side or short side of the vapor deposition board 1 in the vapor deposition chamber (not shown), and preferably, As shown in FIG.

The fingering member 10 includes a support 11 and a support member 12. The support 11 is coupled to one side of the substrate seating base and a plurality of the fingers 10 are connected to the short side of the substrate 1 Are spaced apart.

At this time, a plurality of seating portions A capable of seating the substrate can be provided on the long side of the steam-worn substrate 1, and the seating portion A may be formed in the same shape as the supporting portion 11 according to the present invention .

The support member 12 is formed on an upper end surface of the support portion 11 and has an arc shape including a curved surface 12a bent outwardly upwardly from the bottom surface.

Conventionally, in the case of a closed curve shape such as an O-ring, movement of the substrate is difficult due to the rigidity and elasticity of the O-ring itself, and alignment is impossible in a state where the substrate is seated.

However, since it is formed in an arc shape including the curved surface 12a, it becomes possible to align the substrate in a state where it is seated.

On the other hand, the pressing portion 20 includes a cylinder 21 and a pressing member 23. The cylinder 21 is disposed to face the support member 12 and is installed such that the cylinder shaft 22 is movable in the up and down direction by a predetermined driving force.

The pressing member 23 is provided in a predetermined block shape and is provided at the end of the cylinder shaft 22 and moves in the vertical direction according to the driving of the cylinder 21. [

The center of the cylinder shaft 22 of the cylinder 21 may be located so as to be located outside the vapor deposition base 1 from the center of the support member 12, To the outside of the evaporation donor substrate 1 from the center of the evaporation donor substrate 1.

That is, the supporting member 12 supports the bottom surface of the evaporation donor substrate 1, and the urging member 23 pushes the upper side of the substrate positioned on the outer side portion of the supporting member 12, So that deflection of the substrate can be prevented.

Next, the operating state of the substrate sag preventing device according to the first embodiment of the present invention will be described. Figs. 4 and 5 are operational state diagrams of Fig.

First, the evaporation donor substrate 1 is loaded into the evaporation chamber, and the bottom surface of the evaporation donor substrate 1 is placed so as to be positioned on the support member 12 in a supported state. When the vapor deposition substrate 1 is disposed as described above, deflection occurs in the central portion of the vapor deposition substrate 1 as shown in FIG.

5, when the pressing member 23 of the pressing portion is moved so as to press the upper surface of the evaporation donor substrate 1, the same principle as the lever principle acts on the evaporation donor substrate 1 to prevent sagging at the center portion .

By using the apparatus for preventing sagging according to the present invention as described above, when the vapor deposition substrate 1 is placed inside the vapor deposition chamber, the substrate edge is staggered by the supporting member 12 and the pressing member 23 It is possible to prevent sagging of the substrate.

In addition, since the support member 12 is formed to have a curved surface 12a curved outward as it goes upward, the substrate can be physically struck by using the aligning apparatus even when the substrate is seated, It is possible to do the alignment.

After the alignment is completed, the substrate can be fixed to the pressing member 23 in the upward direction of the substrate.

The scope of the present invention is not limited to the above-described embodiments, but may be embodied in various forms of embodiments within the scope of the appended claims. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the appended claims.

[Description of Reference Numerals]
1: vapor deposition substrate 10:
11: Support part 12: Support member
12a: Curved surface 20:
21: cylinder 22: cylinder axis
23: pressing member

Claims

An apparatus for preventing sagging of an evaporation donor substrate, the evaporation donor substrate being disposed in the evaporation chamber,
A plurality of support members installed inside the vapor deposition chamber and installed to support the vapor deposition substrate in contact with an edge portion of the vapor deposition surface of the vapor deposition substrate; And
And a pressing portion provided to press the outer portion of the opposite side of the vapor deposition surface of the vapor deposition substrate from a portion contacting the supporting member from above,
Wherein the support member includes a first region having a curved surface to be in contact with the substrate in the sagittal state, and a second region provided at the end of the first region and having a flat surface so as to be in surface contact with the substrate,
Wherein the substrate is in contact with different positions of the first region as it is pressed by the pressing portion.

delete

The method according to claim 1,
Wherein the pressing portion includes a cylinder disposed to face the support member at an upper edge of the substrate and installed to move the cylinder shaft in a vertical direction, and a pressing member provided at a distal end of the cylinder.

The method of claim 3,
Wherein the cylinder shaft is installed so that its center is located outside the center of the support member.

The method of claim 3,
Wherein the pressing member is installed eccentrically to the outside of the cylinder.