CN112831753A - Multiple evaporation source shelters from mechanism and film evaporation equipment - Google Patents

Multiple evaporation source shelters from mechanism and film evaporation equipment Download PDF

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Publication number
CN112831753A
CN112831753A CN201911167254.1A CN201911167254A CN112831753A CN 112831753 A CN112831753 A CN 112831753A CN 201911167254 A CN201911167254 A CN 201911167254A CN 112831753 A CN112831753 A CN 112831753A
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CN
China
Prior art keywords
baffle plate
evaporation source
baffle
evaporation
along
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Withdrawn
Application number
CN201911167254.1A
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Chinese (zh)
Inventor
丁熙荣
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Hefei Sineva Intelligent Machine Co Ltd
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Hefei Sineva Intelligent Machine Co Ltd
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Priority to CN201911167254.1A priority Critical patent/CN112831753A/en
Publication of CN112831753A publication Critical patent/CN112831753A/en
Withdrawn legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12Organic material

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The invention relates to the field of evaporation process, and discloses a multiple evaporation source shielding mechanism and a film evaporation device, wherein the multiple evaporation source shielding mechanism comprises: a frame; the baffle plate assemblies are arranged on the rack in a staggered mode along a first direction and comprise one or two baffle plates, and the first direction is perpendicular to the shielding surfaces of the baffle plates; each baffle plate is movably arranged on the rack along a second direction, and the second direction is parallel to the shielding surface of the baffle plate; the driving device is used for driving the baffle to act; the problem that when an evaporation source is freely used, the distance separating a plurality of evaporation sources is shortened, and a baffle plate cannot completely avoid an opening part of the evaporation source when moving is solved.

Description

Multiple evaporation source shelters from mechanism and film evaporation equipment
Technical Field
The invention relates to the technical field of evaporation processes, in particular to a multiple evaporation source shielding mechanism and film evaporation equipment.
Background
The evaporation process is a process mode that substrates are distributed in a vacuum chamber, a mask plate with a certain pattern is aligned with the substrates, an evaporation source containing organic matters is heated, and the organic matters in the evaporation source are sublimated and evaporated onto the substrates.
The organic matter co-evaporation is a mixed evaporation method in which organic matters are respectively ejected from a main evaporation source and a doping evaporation source and uniformly mixed and evaporated in a certain ratio in the same range of a substrate.
However, since the main evaporation source and the doping evaporation source are separately provided, it is very difficult to mix and evaporate organic materials at a certain ratio, and in order to overcome such a difficulty, efforts have been made to shorten the distance separating the main evaporation source and the doping evaporation source.
When the substrate is evaporated, if one evaporation source cannot achieve the desired evaporation thickness, a plurality of evaporation sources are used, but it is difficult to control the organic matters in the plurality of evaporation sources to be uniformly evaporated to the same range of the substrate; in order to overcome such difficulties, efforts are being made to shorten the distance separating each of a plurality of evaporation sources.
In the prior art, the baffle plate for opening and closing the opening part is arranged at the tops of the evaporation sources, and the baffle plate is linearly moved or rotated at the upper part of the evaporation sources, but in the prior art, the baffle plate for opening and closing the opening part of the evaporation sources is arranged at the upper part of the evaporation sources, when the opening parts of the evaporation sources are required to be completely opened in use, the baffle plate is moved to the outermost part of the evaporation sources so that the opening parts of the evaporation sources are all opened, but when one or two of the evaporation sources are required to be opened, because the distance for separating the evaporation sources is shortened, when the baffle plate is moved, no redundant area at the top of the evaporation source positioned at the middle position in the evaporation sources can accommodate the baffle plate, and the position of the baffle plate can block other evaporation sources for evaporation.
When it is necessary to perform a vapor deposition process on an evaporation source at a specific position or simultaneously perform a vapor deposition process using a plurality of evaporation sources, since the respective distances separating the plurality of evaporation sources are shortened, when the evaporation sources are freely used, the shutter plate cannot completely avoid the opening portions of the evaporation sources when moving, which may affect the vapor deposition of the substrate by the evaporation sources.
Disclosure of Invention
The invention provides a multiple evaporation source shielding mechanism and a film evaporation device, which are used for solving the problem that when an evaporation source is freely used, a baffle plate cannot completely avoid an opening part of the evaporation source when moving due to the fact that the distance for separating a plurality of evaporation sources is shortened.
In order to achieve the purpose, the invention provides the following technical scheme:
the invention provides a multiple evaporation source shielding mechanism, comprising:
a frame;
the baffle plate assemblies are arranged on the rack in a staggered mode along a first direction and comprise one or two baffle plates, and the first direction is perpendicular to the shielding surfaces of the baffle plates;
each baffle plate is movably arranged on the rack along a second direction, and the second direction is parallel to the shielding surface of the baffle plate;
and the driving device is used for driving the baffle to act.
Be provided with a plurality of baffle subassemblies along first direction staggered floor in the frame, this kind of staggered floor setting mode for a plurality of baffle subassemblies when moving along the second direction, guarantee that motion path each other is different, every baffle subassembly includes simultaneously: the plurality of baffles are driven by the driving device, so that when the plurality of baffles move to be overlapped with each other along the first direction, the space in the second direction is saved, and when the plurality of baffles move to be not overlapped with each other along the first direction, namely when the plurality of baffles are completely opened, the arrangement increases the area of the baffles in the second direction;
specifically, the first direction is perpendicular to the shielding surface of the baffle, and the second direction is parallel to the shielding surface of the baffle. The baffle assembly is one or two baffles, different superposition modes can be combined, each baffle assembly can move along the second direction, the combination modes and the formation modes between the baffles are increased in such a mode, the baffle assembly is more flexible when in use, the projection area of the baffle assembly along the first direction can have different areas through the matching between the baffle assemblies with different baffle numbers, and the application range and the flexibility of the baffles in the baffle assembly are greatly increased.
Furthermore, a plurality of guide rails are arranged on the rack along the first direction staggered layer and are in sliding fit with the baffles, and each pair of guide rails in sliding fit with each other and the baffles are in the same layer.
Further, the driving device includes:
the rack is provided with driving components which are in one-to-one correspondence with the baffles and are driven independently, and each pair of driving components which are in mutual correspondence are in transmission connection with the baffles;
in each pair of the guide rail and the baffle plate which are in sliding fit with each other, the baffle plate is driven to slide along the length direction of the guide rail by the driving assembly.
Further, the drive assembly includes: a motor;
the gear is in transmission connection with the motor;
a rack engaged with the gear;
the rack matched with the guide rail slides along the length direction of the guide rail;
the rack is fixedly connected with the baffle.
Further, a cooling layer for preventing the baffles from thermal deformation is arranged inside each baffle in the baffle assembly.
In a second aspect, the present invention provides a thin film evaporation apparatus, including: a vacuum reaction chamber and a plurality of evaporation sources located in the vacuum reaction chamber, and the multiple evaporation source shielding mechanism according to any one of the first aspect;
wherein the baffle plate in the multiple evaporation source shielding mechanism is positioned at the top of the evaporation source;
the baffle plate has a first working state and a second working state relative to the evaporation source;
when the baffle plate is in a first working state, the baffle plate is positioned at the top of the opening part of the evaporation source so as to close the opening part;
when the baffle plate is in a second working state, the baffle plate moves along the second direction to open the opening part of the evaporation source.
When the baffle plates are in the first working state, each baffle plate in the baffle plate assembly is positioned at the top of the opening part of the evaporation source and ensures that the opening part is closed, and each baffle plate is not overlapped with each other along the first direction, namely the area of each baffle plate along the second direction reaches the maximum;
when the baffle plate is in the second working state, part of the baffle plates in the baffle plate assembly move along the second direction as required so as to open the opening parts of the evaporation sources, when individual evaporation sources need to be opened, the baffle plate at the top part of the opening part corresponding to the specific position of the evaporation source is moved as required, and the baffle plate is moved along the second direction, so that part of the baffle plates in the baffle plate assembly staggered in the first direction are overlapped along the first direction, and the space of the baffle plate along the second direction is saved, because the baffle plates are overlapped along the first direction, the phenomenon that the baffle plates cannot completely avoid the opening parts of the evaporation sources due to the close separation distance of a plurality of evaporation sources so as to influence the work of the evaporation sources is avoided, and different overlapping modes can be combined by the arrangement mode that the baffle plate assembly is one or two baffle plates, and each baffle plate assembly can move along the second direction, the combination modes and the composition modes of the baffles are increased, the baffle assemblies are more flexible when in use, the projection of the baffle assemblies along the first direction can have different areas through the matching of the baffle assemblies with different baffle numbers, and the evaporation sources at different positions can not be blocked for evaporation because of the positions of the baffles when the openings of the evaporation sources at different positions need to be opened or closed.
Further, in a direction toward the baffle plate assembly, a projection surface of the evaporation source is not larger than an area of any one of the baffle plates in the baffle plate assembly.
Further, the thin film evaporation apparatus includes: an angle adjusting plate;
the angle adjusting plate is arranged between the baffle plate assembly and the evaporation source and connected with the evaporation source, so that an evaporation path of the evaporation source extends along the direction of the angle adjusting plate.
Further, the thin film evaporation apparatus includes: the substrate is positioned in the vacuum reaction chamber and positioned at the top of the evaporation source;
the projection surface of the evaporation source at least partially overlaps the substrate in a direction toward the substrate.
Drawings
Fig. 1 to fig. 7 are schematic structural diagrams of different working states of a multiple evaporation source shielding mechanism according to an embodiment of the present invention;
fig. 8 is a top view of a multiple evaporation source shielding mechanism according to an embodiment of the present invention;
fig. 9 is a front view of a multiple evaporation source shielding mechanism according to an embodiment of the present invention;
fig. 10 is a partially enlarged view of a region a in a front view of the multiple evaporation source shielding mechanism provided in fig. 9;
fig. 11 is a sectional view of a plane B-B in a front view of the multiple evaporation source shielding mechanism provided in fig. 9;
fig. 12 is a front view of a thin film evaporation apparatus according to an embodiment of the present invention.
In the figure: 100-a vacuum reaction chamber; 110-a substrate; 200-a baffle plate; 300-an evaporation source; 400-angle adjusting plate; 500-a frame; 510-a guide rail; 520-a gear; 530-a driver; 540-electric machine.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In a first aspect, an embodiment of the present invention provides a multiple evaporation source shielding mechanism, including: a frame 500;
a plurality of baffle plate assemblies which are arranged on the machine frame 500 in a staggered manner along a first direction, wherein the baffle plate assemblies comprise one or two baffle plates 200, and the first direction is vertical to the shielding surface of the baffle plate 200;
each baffle 200 is movably mounted on the frame 500 along a second direction, and the second direction is parallel to the shielding surface of the baffle 200;
and a driving device for driving the baffle 200 to act.
It should be noted that, a plurality of baffle assemblies are arranged on the frame 500 in a staggered manner along the first direction, and this staggered arrangement manner ensures that the plurality of baffle assemblies have different movement paths when moving along the second direction, and each baffle assembly includes: one or two baffles 200, the plurality of baffles 200 are driven by the driving device, when the plurality of baffles 200 are moved to be overlapped with each other along the first direction, the space along the second direction is saved, and when the plurality of baffles 200 are moved to be not overlapped with each other along the first direction, namely when the baffles 200 are completely opened, the area of the baffles 200 along the second direction is increased;
specifically, the first direction is perpendicular to the shielding surface of the baffle 200, and the second direction is parallel to the shielding surface of the baffle 200. The baffle assembly is one or two baffle plates 200, different superposition modes can be combined, each baffle plate assembly can move along the second direction, the combination modes and the formation modes between the baffle plates 200 are increased in such a mode, the baffle plate assembly is more flexible in use, the projection of the baffle plate assembly along the first direction can have different areas through the matching between the baffle plate assemblies with different baffle plate 200 quantities, and the application range and the flexibility of the baffle plates 200 in the baffle plate assembly are greatly increased.
Fig. 1 to 7 are schematic structural diagrams of different working states of a multiple evaporation source shielding mechanism according to an embodiment of the present invention; here, the example is described in which the baffle plate assemblies disposed along the first direction staggered layer are two layers and the evaporation sources 300 are three, the baffle plate assembly may be one baffle plate 200, or may be two baffle plates 200, and the baffle plate 200 of the same layer is one layer;
as shown in fig. 1, when shielding of three evaporation sources 300 is required, the baffle plate 200 is driven by the driving means to move in the second direction, when the baffle plate 200 is moved to the top position of each evaporation source 300, i.e., the opening portions of the plurality of evaporation sources 300 are all closed by the baffle plate 200;
as shown in fig. 2-4, when one evaporation source 300 of the three evaporation sources 300 needs to be opened, one baffle plate 200 of one layer of baffle plate assembly can be moved to the outside of the evaporation source 300 or moved to the baffle plate 200 of another layer of baffle plate assembly by the driving device, so that the two baffle plates 200 are overlapped;
as shown in fig. 5 to 6, when it is necessary to open two evaporation sources 300 of three evaporation sources 300, then two baffles 200 can be moved by the driving device so that the opening portions of the two evaporation sources 300 are opened, and the state of the baffle 200 here can be such that two baffles 200 of different layers overlap and move together to the outside of the evaporation sources 300, or two baffles 200 of different layers overlap and move together to the top of the evaporation sources 300 and the remaining baffles 200 move to the outside of the evaporation sources 300;
as shown in fig. 7, when it is necessary to open all of the three evaporation sources 300, the shutter plate 200 is driven by the driving means to move in the second direction, at which time all of the shutter plate 200 moves to the outside of the evaporation sources 300, so that the opening portions of the evaporation sources 300 are all opened.
Specifically, the arrangement of the baffle 200 has various options:
in a first mode, the number of the baffles 200 can be the same as that of the evaporation sources 300, and one baffle 200 can block the outlet of one evaporation source 300;
in the second embodiment, the number of the baffles 200 is smaller than the number of the evaporation sources 300, and one baffle 200 can block the outlets of two evaporation sources 300.
As shown in fig. 8 and 9, a plurality of guide rails 510 are arranged on the frame 500 in a staggered layer along the first direction, and the guide rails 510 are slidably engaged with the baffle 200, and each pair of the guide rails 510 and the baffle 200 slidably engaged with each other is in the same layer.
In order to ensure the consistency of the moving path of the barrier 200, a guide rail 510 slidably engaged with the barrier 200 is provided on the frame 500, and the guide rail 510 is arranged in the same manner as the barrier 200 along the first direction.
Specifically, the driving device includes:
the frame 500 is provided with driving components which are in one-to-one correspondence with the baffles 200 and are driven independently, and each pair of driving components which are in mutual correspondence are in transmission connection with the baffles 200;
in each pair of the guide rail 510 and the baffle 200, which are slidably engaged with each other, the baffle 200 is driven by the driving assembly to slide along the length direction of the guide rail 510. In order to increase the flexibility of the movement of the baffle plate 200, the baffle plate can be used with evaporation sources 300 at different positions, and each driving assembly and each baffle plate 200 are independently controlled, so that the arrangement mode also facilitates the maintenance when a single driving assembly fails.
Further, in conjunction with fig. 10 and 11, the driving assembly includes: a motor 540; a gear 520 in driving connection with a motor 540; the driving assembly can also adopt a motor to replace the motor 540, the motor 540 is in transmission connection with the gear 520 through a transmission 530, and the transmission 530 has the functions of sealing and transmission; while the gear 520 meshes with the rack; the rack engaged with the guide rail 510 slides in the length direction of the guide rail 510; the rack is fixedly connected with the baffle 200.
Since the evaporation source 300 heats the evaporation material by the heater to evaporate the evaporation material, high heat is generated, and the baffle plate 200 may be thermally deformed by the high heat generated in the evaporation source 300 being transmitted to the baffle plate 200 through the opening portion, and in order to prevent the baffle plate 200 from being thermally deformed by the high heat generated in the evaporation source 300 and to block heat transfer to the upper substrate 110, a cooling layer for preventing the baffle plate 200 from being thermally deformed may be provided inside each baffle plate 200 in the baffle plate assembly.
In a second aspect, as shown in fig. 12, an embodiment of the present invention provides a thin film evaporation apparatus, including: a vacuum reaction chamber 100 and a plurality of evaporation sources 300 located in the vacuum reaction chamber 100, and a multiple evaporation source shielding mechanism according to the first aspect;
wherein, the baffle 200 in the multiple evaporation source shielding mechanism is positioned at the top of the evaporation source 300;
the baffle 200 has a first operating state and a second operating state with respect to the evaporation source 300;
when the baffle 200 is in the first working state, the baffle 200 is positioned at the top of the opening part of the evaporation source 300 to close the opening part;
when the baffle 200 is in the second operation state, the baffle 200 moves in the second direction to open the opening portion of the evaporation source 300.
It should be noted that, during the movement of the shielding mechanism located at the tops of the multiple evaporation sources 300, the baffle plates 200 of the shielding mechanism have a first operating state and a second operating state relative to the evaporation sources 300, when the baffle plates 200 are in the first operating state, each baffle plate 200 in the baffle plate assembly is located at the top of the opening portion of the evaporation source 300 and ensures that the opening portion is closed, and each baffle plate 200 does not overlap with each other along the first direction, that is, the area of each baffle plate 200 along the second direction reaches the maximum;
when the baffle plate 200 is in the second working state, part of the baffle plate 200 in the baffle plate assembly is moved in the second direction as required to open the opening portions of the evaporation sources 300, when individual evaporation sources 300 are required to be opened, the baffle plate 200 at the top of the opening portion corresponding to the specific position of the evaporation source 300 is moved as required, and the baffle plate 200 is moved in the second direction, so that part of the baffle plate 200 in the baffle plate assembly staggered in the first direction is overlapped in the first direction, thereby saving the space of the baffle plate 200 in the second direction, and because the baffle plate 200 is overlapped in the first direction, the situation that the baffle plate 200 cannot completely avoid the opening portions of the evaporation sources 300 because a plurality of evaporation sources 300 are close to each other is avoided, thereby affecting the working of the evaporation sources 300, and better preventing pollution among the evaporation sources 300, by the arrangement of the baffle plate assembly as one or two baffle plates 200, different superposition modes can be combined, each baffle plate assembly can move along the second direction, the combination modes and the composition modes among the baffle plates 200 are increased in such a mode, the baffle plate assemblies are more flexible when used, the projection of the baffle plate assemblies along the first direction can have different areas through the matching among the baffle plate assemblies with different baffle plate 200 numbers, and when the evaporation sources 300 at different positions need to open or close opening parts, the evaporation sources 300 cannot be blocked for evaporation due to the positions of the baffle plates 200.
In addition, the projection surface of the evaporation source 300 is not larger than the area of any one of the baffles 200 in the baffle assembly in the direction toward the baffle assembly.
The evaporation source 300 and the baffle 200 have two corresponding relations:
first, the projected area of the evaporation sources 300 is equal to the area of any one of the baffles 200 in the baffle assembly, the number of the baffles 200 can be the same as the number of the evaporation sources 300, and one baffle 200 can block the outlet of one evaporation source 300;
in the second mode, the projection area of the evaporation sources 300 is smaller than the area of any one of the baffles 200 in the baffle assembly, the number of the baffles 200 is smaller than the number of the evaporation sources 300, and one baffle 200 can block the outlets of two evaporation sources 300.
Specifically, the film evaporation equipment includes: an angle adjusting plate 400;
the angle adjusting plate 400 is disposed between the baffle assembly and the evaporation source 300, and is connected to the evaporation source 300 such that the evaporation path of the evaporation source 300 extends in the direction of the angle adjusting plate 400.
The film evaporation equipment includes: a substrate 110 positioned in the vacuum reaction chamber 100, and the substrate 110 is positioned on top of the evaporation source 300;
the projection surface of the evaporation source 300 at least partially overlaps the substrate 110 in the direction toward the substrate 110.
It will be apparent to those skilled in the art that various changes and modifications may be made in the embodiments of the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims (9)

1. The utility model provides a multiple evaporation source shelters from mechanism which characterized in that includes:
a frame;
the baffle plate assemblies are arranged on the rack in a staggered mode along a first direction and comprise one or two baffle plates, and the first direction is perpendicular to the shielding surfaces of the baffle plates;
each baffle plate is movably arranged on the rack along a second direction, and the second direction is parallel to the shielding surface of the baffle plate;
and the driving device is used for driving the baffle to act.
2. The multiple evaporation source shielding mechanism according to claim 1, wherein a plurality of guide rails are disposed on the rack in staggered layers along the first direction, and the guide rails are slidably engaged with the baffle plate, and each pair of the guide rails and the baffle plate slidably engaged with each other is on the same layer.
3. The multiple evaporation source blocking mechanism according to claim 2,
the driving device includes:
the rack is provided with driving components which are in one-to-one correspondence with the baffles and are driven independently, and each pair of driving components which are in mutual correspondence are in transmission connection with the baffles;
in each pair of the guide rail and the baffle plate which are in sliding fit with each other, the baffle plate is driven to slide along the length direction of the guide rail by the driving assembly.
4. The multiple evaporation source blocking mechanism according to claim 3, wherein the driving assembly comprises: a motor;
the gear is in transmission connection with the motor;
a rack engaged with the gear;
the rack matched with the guide rail slides along the length direction of the guide rail;
the rack is fixedly connected with the baffle.
5. The multiple evaporation source shielding mechanism according to any one of claims 1 to 4, wherein a cooling layer for preventing thermal deformation of the baffle plate is disposed inside each baffle plate in the baffle plate assembly.
6. A thin film evaporation apparatus, comprising: a vacuum reaction chamber and a plurality of evaporation sources located within the vacuum reaction chamber, and the multiple evaporation source shielding mechanism according to any one of claims 1 to 5;
wherein the baffle plate in the multiple evaporation source shielding mechanism is positioned at the top of the evaporation source;
the baffle plate has a first operating state and a second operating state with respect to the evaporation source,
when the baffle plate is in a first working state, the baffle plate is positioned at the top of the opening part of the evaporation source so as to close the opening part;
when the baffle plate is in a second working state, the baffle plate moves along the second direction to open the opening part of the evaporation source.
7. The thin film evaporation apparatus according to claim 6, wherein a projection surface of the evaporation source is not larger than an area of any one of the baffles in the baffle assembly in a direction toward the baffle assembly.
8. The thin film evaporation apparatus according to claim 6, comprising: an angle adjusting plate;
the angle adjusting plate is arranged between the baffle plate assembly and the evaporation source and connected with the evaporation source, so that an evaporation path of the evaporation source extends along the direction of the angle adjusting plate.
9. The thin film evaporation apparatus according to claim 6, comprising: the substrate is positioned in the vacuum reaction chamber and positioned at the top of the evaporation source;
the projection surface of the evaporation source at least partially overlaps the substrate in a direction toward the substrate.
CN201911167254.1A 2019-11-25 2019-11-25 Multiple evaporation source shelters from mechanism and film evaporation equipment Withdrawn CN112831753A (en)

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CN111455342A (en) * 2019-01-18 2020-07-28 北京铂阳顶荣光伏科技有限公司 Evaporation coating equipment, evaporation coating system and evaporation coating control method
CN115110038A (en) * 2022-06-29 2022-09-27 北海惠科半导体科技有限公司 Evaporation coating device and coating method

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CN206232800U (en) * 2016-12-14 2017-06-09 三峡大学 A kind of evaporation coating device for preparing organic light emitting diode device
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CN115110038A (en) * 2022-06-29 2022-09-27 北海惠科半导体科技有限公司 Evaporation coating device and coating method
CN115110038B (en) * 2022-06-29 2024-01-12 北海惠科半导体科技有限公司 Evaporation coating device and coating method

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