201044666 六、發明說明： 【發明所屬之技術領域】 本發明係有關有機電激發光製造裝置、成膜裝置及此 等之成膜方法、液晶顯示基板製造裝置以及校準裝置及校 準方法，特別是關於適合於大型基板之校準的有機電激發 光製造裝置以及成膜裝置及液晶顯示基板製造裝置。 〇 【先前技術】 作爲製造有機電激發光裝置之有力的方法，有著真空 蒸鑛法。在真空蒸鍍中，必須要有基板與光罩之校準。年 年處理基板的大型化之浪潮，G6世代的基板尺寸係成爲 1 5 00mmxl 8 00mm。当基板尺寸乃作爲大型化時，當然光 罩也大型化，其尺寸亦到達至2000mmx2000mm程度。特 別是使用鋼製的光罩時，在有機電激發光裝置係其重量亦 成爲3 00kg。在以往中，將基板及光罩做成水平，實施校 〇 v 準（位置調整）。另外，經由大型化，校準亦變爲嚴格， 其要求爲高。作爲關於如此之校準的以往技術，係有下述 之專利文獻1、2。另外，關於校準的補正，係於專利文 獻2揭示有：在經由水平之校準中，加進校準檢測量與實 際之補正量的差而進行校準之方法。 [專利文獻1]日本特開2006-302896號公報 [專利文獻2]日本特開2008-004358號公報 【發明內容】 -5- 201044666 [發明欲解決之課題] 但將揭示於專利文獻1之基板與光罩作爲橫向進行校 準之方法，係如圖1 4所示，基板及光罩係經由其薄度與 本身重量而有大彎曲。其彎曲如爲一樣，則考慮此而製 作光罩即可，但當然中心越大，而基板尺寸越大時，製作 係變爲困難。另外，一般而言，在其中心點的彎曲量係將 基板的彎曲作爲dl，將光罩的彎曲作爲d2時，成爲dl> d2。當基板彎曲大時，基板蒸鍍面乃與光罩接觸，於校準 時，在前工程產生接觸傷於蒸鎪之有機膜之故，有必要於 校準時，加大間隔基板與光罩。但間隔爲視野深度以上而 進行較準時，精確度則變差，而有成爲不良品之課題。特 別是在顯不裝置用基板中，無法得到商精彩的畫面者。 爲了應付其課題，有著將基板與光罩做成略垂直而蒸 鍍之方法。由作爲垂直者，可大幅度地減少經由基板或陰 蔽罩之自重的彎曲。 但陰蔽罩係其光罩部乃薄度2〇〜5〇Mm，於其製造時， 如圖11所示’光罩全體乃從中心朝周圍產生彎曲，在光 罩部端部中’其影響爲大。圖11乃誇張描繪其狀態的圖 ’其中’了解到於基板與陰蔽罩之間做成有數十μπ1之間 隙’其間隙乃引起蒸鍍模糊’而有無法高精確度地進行蒸 鑛之課題。 另外’記載於專利文獻1之以往方法係如圖1 5所示 ’爲了防止蒸鍍材料附著於校準標記，於與蒸鍍側相反側 ’使用接受從垂直或斜方進行照明的光源和其反射而配置 -6- 201044666 攝影機之所謂反射型光學系統，檢測校準標記，進行校準 。在以往之有機電激發光製造裝置中，如圖3之圈出圖所 示’將設置於鋼製之光罩的四角形之凹部與設置於透明基 板上之金屬部，作爲校準標記，做成金屬部呈來到四角形 的中心地進行校準。但反射型光學系統係有著以下的問題 ’有著無法精確度佳進行校準的課題。（1)光罩表面係 因做成鏡面而引起光暈等之故，無法提昇照明強度而降低 © 時’而無法檢測出金屬部。（2)在校準時，呈不傷及基 板表面地’有必要於與光罩之間設置〇.5mm程度之間隙 ，但反射型光學系統係視野深度爲小而像變爲模糊。 接著’在揭示於專利文獻1之方法中，爲將校準基板 與光罩之機構全體作爲真空內之設置之故，有著產生有伴 隨驅動部等之移動的粉塵及熱，或來自對於驅動部等之配 線的氣體、來自潤滑劑之氣體、來自構件表面之氣體乃降 低真空度之可能性。對於第1之真空內的粉塵係其粉塵乃 〇 附著於基板或光罩而引起蒸鍍不佳，第2的發熱係助長光 罩的熱膨脹而使蒸鑛尺寸變化，並且第3的空氣係降低真 空度之故，同時有著降低產率，即生產性的問題。 另外，爲將校準基板與光罩之機構全體作爲真空內之 設置之故，一旦在驅動部等產生故障時，維修上需要時間 ’而有裝置之稼動率下降之問題。 隨之，本發明之第1目的係提供可降低基板或光罩的 彎曲，高精確地進行蒸鍍之有機電激發光製造裝置及成膜 裝置以及液晶顯示基板製造裝置者。 201044666 另外，本發明之第2目的係提供可降低 影響，高精確地進行蒸鑛之有機電激發光製 裝置以及此等之成膜方法。 更且，本發明之第3目的係提供可精確 之校準裝置及校準方法。 另外，本發明之第4目的係提供使用上 校準方法，可高精確度地進行蒸鍍之有機電 置及成膜裝置。 更且，本發明之第5目的係提供由配置 氣側者，降低真空內之粉塵或氣體的產生， 機電激發光製造裝置及成膜裝置。 另外，本發明之第6目的係提供由配置 氣側者，提昇維護性，稼動率高之有機電激 及成膜裝置。 [爲解決課題之手段] 爲了達成上述任一之目的，其第1特徵 板保持成立起之姿勢的基板保持手段，和將 下之姿勢的陰蔽罩垂下手段，和攝影設置於 蔽罩之校準標記的校準光學手段，和在前述 態，驅動前述陰蔽罩之校準驅動手段，和依 學手段的結果’控制前述校準驅動手段之控 另外，爲了達成上述任一之目的，其第 於第1特徵’則述陰蔽罩垂下手段係於前述 陰蔽罩的彎曲 造裝置、成膜 度佳進行校準 述校準裝置或 激發光製造裝 驅動部等於大 生產性高之有 驅動部等於大 發光製造裝置 乃具有：將基 陰蔽罩保持垂 前述基板與陰 垂下姿勢之狀 據前述校準光 制手段。 2特徵乃加上 陰蔽罩或保持 -8 - 201044666 前述陰蔽罩之校準基底，具有可旋轉地支持前述陰蔽罩之 複數之旋轉支持部，前述校準驅動手段係具有前述複數之 旋轉支持部之中驅動至少一處之主動旋轉支持部的主動驅 動手段，前述有機電激發光製造裝置係更具有將前述主動 旋轉支持部以外之其他旋轉支持部的傳動旋轉支持部，隨 著前述主動旋轉支持部的動作之校準傳動手段。 更且，爲了達成上述任一之目的，其第3特徵乃加上 〇 於第2特徵，將前述主動旋轉支持部，設置於前述陰蔽罩 或保持前述陰蔽罩之校準基底之上部、兩端側之二處者。 另外，爲了達成上述任一之目的，其第4特徵乃加上 於第2特徵，前述校準驅動手段係具有··具備獨立驅動前 述二處於上下方向之上下驅動手段，和將前述二處之中， 一處驅動於左右方向之左右驅動手段的前述主動驅動手段 ，和前述其他一處係對於前述左右方向而言傳動之左右傳 動手段者。 〇 另外，爲了達成上述任一之目的，其第5特徵乃加上 於第1乃至第4特徵，前述校準驅動手段及/或校準傳動 手段係設置於前述真空室之外者。 更且，爲了達成上述任一之目的，其第6特徵乃加上 於第1乃至第5特徵，將前述校準驅動手段設置於前述陰 蔽罩之上部側，將前述校準傳動手段設置於前述陰蔽罩之 下部側者。 另外，爲了達成上述任一之目的，其第7特徵乃加上 於第1乃至第6特徵，前述基板保持手段係具有將前述基 201044666 板，從水平狀態立起之手段者。 另外，爲了達成上述任一之目的，其第8特徵乃加上 於第1乃至第6特徵，前述基板保持手段係具有在將前述 基板立起的狀態，接近或緊密於陰蔽罩之手段者。 更且，爲了達成上述任一之目的，其第9特徵乃針對 在具有在真空室內進行基板與陰蔽罩之校準的校準手段， 和將蒸發源內之蒸鍍材料，蒸鍍於基板之真空蒸鍍室的成 膜裝置，具有：載置前述基板，保持成立起姿勢之基板保 持器，和呈面對於前述立起姿勢之前述基板地，保持前述 陰蔽罩之陰蔽罩保持手段，和減低經由前述陰蔽罩之彎曲 的影響之補正手段者。 另外，爲了達成上述任一之目的，其第10特徵乃加 上於第9特徵，前述補正手段係具有按壓保持前述基板之 基板保持器，或前述陰蔽罩之按壓手段者。 更且，爲了達成上述任一之目的，其第11特徵乃加 上於第1 〇特徵，前述補正手段係具有測定前述基板保持 器與前述陰蔽罩間之距離的測定手段，依據前述測定手段 之結果，或依據預先所訂定之補正量，控制前述按壓手段 者。 另外，爲了達成上述任一之目的，其第12特徵乃加 上於第11特徵，前述按壓手段乃按壓前述基板保持器之 按壓位置係前述基板的端部蒸鍍部之外側周圍者，或者前 述按壓手段乃按壓前述陰蔽罩之按壓位置係對應於前述基 板的端部蒸鍍部之外側周圍之位置者。 -10- 201044666 更且，爲了達成上述任一之目的，其第13 上於第12特徵，前述按壓位置係設置於前述基 或前述陰蔽罩之四角附近的四處者。 另外，爲了達成上述任一之目的，其第14 對在真空室內進行基板與陰蔽罩之校準，將蒸鍍 於前述基板之成膜方法，具有補正前述陰蔽罩所 曲的補正工程者。 〇 更且，爲了達成上述任一之目的，其第15 上於第14特徵，前述補正工程乃於按壓保持基 保持器或前述陰蔽罩之情況所進行之工程者。 另外，爲了達成上述任一之目的，其第16 上於第14特徵，前述補正工程乃於進行校準之 進行校準之後加以實施者。 更且，爲了達成上述任一之目的，其第17 上於第14乃至第16任一之特徵，具有於進行校 〇 w 將前述基板全體緊密於陰蔽罩之工程者。 另外，爲了達成上述任一之目的，其第18 上於第10特徵，前述補正工程乃具有設置於中 將一端開放於前述中空罩體而另一端開放於大氣 連接部，於前述補正手段，藉由前述連接部而敷 配線者。 更且，爲了達成上述第1之目的，其第19 上於第9特徵，具有將前述基板保持手段與前述 ，從水平的狀態做成立起之狀態的基板旋轉手段 特徵乃加 板保持器 特徵乃針 材料蒸鍍 具有之彎 特徵乃加 板之基板 特徵乃加 前，或者 特徵乃加 準之後， 特徵乃加 空罩體， 之中空的 設必要之 特徵乃加 補正手段 者。 -11 - 201044666 另外’爲了達成上述任一之目的，其第20特徵乃加 上於第1 9特徵’前述基板旋轉手段係旋轉前述連接部之 手段者。 更且’爲了達成上述任一之目的，其第21特徵乃陰 蔽罩係具有校準用之貫通孔，校準部係具備：具有從前述 貫通孔之一端側射入光的光源與攝影前述另一端之攝影手 段的校準光學系統，和依據前述攝影手段的輸出，進行校 準之控制部者。 另外，爲了達成上述任一之目的，其第22特徵乃加 上於前述第21特徵，前述貫通孔乃於前述陰蔽罩之前後 貫通的孔，前述校準光學系統係具有前述至少於對於前述 基板的處理時，遮蔽對於前述貫通孔之處理材的附著之遮 蔽手段者。 另外，爲了達成上述任一之目的’其第23特徵乃加 上於前述第22特徵，前述校準光學系統係具有將前述遮 蔽手段，在處理時係移動至處理位置，在校準時係移動至 校準位置之遮蔽移動手段者。 另外，爲了達成上述任一之目的，其第24特徵乃加 上於前述第21特徵，前述貫通孔之一端乃校準用之開口 部，於另一端的開口部，連接或插入光纖’將前述光纖的 另一端連接於光源或攝影手段者° 更且，爲了達成上述任一之目的’其第25特徵乃加 上於前述第22特徵，前述貫通孔之一端乃校準用之開口 部，前述貫通孔係具有L字部者° -12- 201044666 另外，爲了達成上述任一之目的，其第26特徵乃具 有：具備照射光至設置於基板及陰蔽罩之校準標記的光源 ，和攝影前述校準標記的攝影手段之校準光學系統；前述 校準光學系統係具有前述光源或前述攝影手段之中至少一 方乃隨著前述基板或前述陰蔽罩之校準動作而移動之追隨 手段者。 更且，爲了達成上述任一之目的，其第27特徵乃加 Ο 上於前述第26特徵，前述追隨手段乃連結於驅動前述校 準動作之驅動部的移動之手段者。 另外，爲了達成上述任一之目的，其第28特徵乃具 有：具備照射光至設置於基板及陰蔽罩之校準標記的光源 ，和攝影前述校準標記的攝影手段之校準光學系統；各自 對應設置複數前述校準標記，對於各校準標記而言，設置 複數前述校準光學系統，依據前述複數之攝影手段的輸出 ，將前述基板的中心位置校準成基準者。 〇 更且，爲了達成上述任一之目的，其第29特徵乃加 上於前述第28特徵，前述複數乃4個，將前述校準，設 置於前述基板及前述陰蔽罩之四角附近者。 另外’爲了達成上述任一之目的，其第30特徵乃加 上於前述第21〜2 9特徵，加以立起設置前述校準前述基板 及陰蔽罩者。 更且’爲了達成上述任一之目的，其第31特徵乃加 上於前述第21〜3 0特徵，前述校準係在真空室內進行，具 有將蒸發源內的蒸鍍材料對於基板進行蒸鍍處理之真空蒸 -13- 201044666 鍍室者。 另外，爲了達成上述任一之目的，其第32特徵乃加 上於前述第31特徵，具有前述校準光學系統之中，至少 將前述攝影手段’從前述真空室的上部之大氣側內藏於突 出之凹部’對於前述凹前端係設有光學視窗者。 更且’爲了達成上述任一之目的，其第33特徵乃加 上於前述第31特徵’前述遮蔽移動手段係具有設置於大 氣側之驅動手段，和藉由真空密封手段而連結前述驅動手 段與前述遮蔽手段之連結手段者。 另外’爲了達成上述任一之目的，其第34特徵乃加 上於前述第31特徵’具有：爲了進行前述校準而驅動前 述陰蔽罩之驅動手段’和連接前述陰蔽罩或保持前述陰蔽 罩之校準基底與前述驅動手段之校準軸；前述驅動手段係 設置於大氣側，前述校準軸係藉由真空密封手段而動作者 〇 於最後’爲了達成上述任一之目的，其第35特徵乃 加上於前述第1】至14特徵，作爲前述蒸鍍材料而使用有 機電激發光材料者。 [發明之效果] 如根據本發明，可提供可降低基板或光罩之彎曲，高 精確度地蒸鍍之有機電激發光製造裝置或成膜裝置，或者 液晶顯示基板製造裝置者。 另外，如根據本發明，可提供可降低陰蔽罩之彎曲的 -14- 201044666 影響，高精確度地蒸鎪之有機電激發光製造裝置、成膜裝 置以及此等製造方法及成膜方法者。 更且，如根據本發明，可提供可精確度佳進行校準之 校準裝置及校準方法者。 另外，如根據本發明，可提供使用前述校準裝置或校 準方法，可高精確度地蒸鍍之有機電激發光製造裝置及成 膜裝置者。 更且，如根據本發明，可提供由配置驅動部等於大氣 側者，降低真空內的粉塵或氣體的產生，生產性高之有機 電激發光製造裝置或成膜裝置者。 另外，如根據本發明，可提供由配置驅動部等於大氣 側者，提昇維護性，稼動率高之有機電激發光製造裝置或 成膜裝置者。 【實施方式】 使用圖面說明發明之第1實施形態。有機電激發光製 造裝置係不只單形成發光材料層（電激發光層），以電極 夾持之構造，而於陽極之上方，將電洞植入層或輸送層， 於陰極之上方，將電子植入層或輸送層等，形成各種材料 作爲薄膜所成之多層構造，以及洗淨基板。圖1乃顯示其 製造裝置之一例的圖。 在本實施形態之有機電激發光製造裝置100係大致由 輸入處理對象之基板6之負載群組3、處理前述基板6之 4個的群組（A〜D )、各群組間或群組與負載群組3，或 -15- 201044666 者與接下來之工程（封閉工程）之間之所設置之6個遞送 室4所構成。在本實施形態中，將基板的蒸鍍面做成上面 而輸送，進行蒸鍍時，將基板立起進行蒸鍍。 負載群組3係由爲了於前後維持真空而具有閘閥i 〇 之負載室31’和從前述負載室31接受基板6(以下單稱 基板），進行旋轉將基板6輸入至遞送室4a之輸送機械 手臂5 R所成。各負載室3 1及各遞送室4係於前後具有閘 閥10，控制該閘閥10之開關而維持真空的同時，於負載 群組3或者接下來的群組等，遞送基板。 各群組（A〜D)係擁有：具有一台之輸送機械手臂§ 之輸送室2，和從輸送機械手臂5接受基板，在進行特定 處理之圖面上’配置於上下之2個處理室1(第1添加字 a〜d係顯示群組’第2添加字u，d係顯示上側下側）。對 於輸送室2與處理室1之間係設置有閘閥1 〇。 圖2係顯示輸送室2與處理室1之構成的槪要。處理 室1之構成係根據處理內容而有所差異，但舉例說明以真 空蒸鍍發光材料，形成電激發光層之真空蒸鍍室Ibu。圖 3乃此時輸送室2b與真空蒸鍍室lbu之構成的模式圖與 動作說明圖。在圖2之輸送機械手臂5係可將全體移動於 上下（參照圖3之箭頭59)，具有可旋轉於左右之連結 構造之支架57，對於其前端係於上下二段具有2支基板 運送用之梳狀柄部5 8。1支柄部的情況係爲了將基板交付 S接下來之工程的旋轉動作、爲了從先前的工程接受基板 的旋轉動作、以及隨著此等之閘閥的開閉動作乃於輸出入 -16- 201044666 處理之間而爲必要，但經由做成上下二段之時，維持著輸 入於單側之柄部的基板，以未保持基板側之柄部，從真空 蒸鍍室進行基板的輸出動作之後，可連續進行輸入動作者 〇 作爲2柄部或作爲1支柄部係經由所要求之生產能力 而決定。在以後的說明中，爲了將說明作爲簡單，以1支 柄部進行說明。 Ο 另一方面，真空蒸鍍室lbu係大致由使發光材料蒸發 ，蒸鍍於基板6之蒸鍍部7，和進行基板6與陰蔽罩之位 置調整，蒸鍍於基板6之必要部分之校準部8，和以及進 行輸送機械手臂5與基板之遞送，將基板6移動至蒸鍍部 7之處理遞送部9所成。校準部8與處理遞送部9係設置 有右側R線路與左側L線路之2系統。 因此，在本實施形態之處理的基本思考方法係於進行 一方之線路（例如R線路）蒸鍍之間，在另一方之L線 〇 ^ 路中，進行基板的輸出入，進行基板6與陰蔽罩81之校 準，結束進行蒸鍍之準備者。經由交互進行此處理之時， 可未蒸鍍於基板而減少多餘昇華之時間。 首先，第1，說明本發明之第1特徵之校準部8的實 施形態。在本實施形態中，如圖4所示，將基板6與陰蔽 罩大槪豎立成垂直而進行。另外，爲了進行校準之機構部 係盡可能，設置於真空蒸鍍室1之外側的大氣側’具體而 言係設置於真空蒸鑛室1之上部壁it上，或者下部壁ιγ 下。另外，必須設置於真空蒸鍍室lbu內之構成，係從大 -17- 201044666 氣部設置凸部而設置於其中。 在本實施形態中’校準時係固定基板6，移動陰蔽罩 8 1，呈可蒸鍍於基板6之必要部分地進行位置調整。 以下，對於校準部8之機構與其動作加以說明。 校準部8係由陰蔽罩81、固定陰蔽罩81之校準基底 82、保持校準基底82’規定校準基底82，即在陰蔽罩81 之XZ平面的姿勢之校準驅動部83、從下支持校準基底 8 2，與校準驅動部8 3進行協調而規定陰蔽罩8 1之姿勢的 校準傳動部84、檢測設置於基板6與前述陰蔽罩81之後 述的校準標記之校準光學系統85、處理校準標記之影像 ，求得校準量，控制校準驅動部8 3之控制裝置6 0 (參照 圖8)所成。 首先，圖5顯示陰蔽罩81。陰蔽罩81係由光罩81M 與框體8 1 F所成，例如對於G 6之基板尺寸1 5 0 0 m m X 1800mm而言之尺寸，係成爲2000mmx2000mm程度，其 重量亦成爲3 00Kg。對於光罩81M係有爲了規定蒸鍍位 置的窗。例如在形成發光成紅（R )的蒸鍍膜時，係於對 應於R的部份有窗。此窗的尺寸係根據顏色有所差異，但 平均爲寬度爲30μιη、高度爲150μιη程度。光罩81M之厚 度乃50μιη程度 '往後有成爲更薄之傾向。另一方面，對 於光罩8 1 Μ，係於精密校準標記8 1 m爲4處，粗校準標 記8 1 mr爲2處’計6處，設置有校準標記8 1 m。對應於 此’對於基板，亦於精密校準標記6ms爲4處，粗校準標 記6mr爲2處之計6處，設置有校準標記6m。 -18- 201044666 校準基底82係具有保持陰蔽罩81之上部及下部的保 持部82u、82d，陰蔽罩81之背側係呈可蒸鍍於基板6地 成爲有如回字狀之空洞。另外，校準基底82係經由接近 在其四角，於上部2處81a、81b，設置於其2處各下方 之81c、81d之計4處的旋轉支持部，可旋轉地加以支持 〇 接著，對於規定陰蔽罩81之姿勢的校準驅動部83與 0 校準傳動部84加以說明。首先，說明4個旋轉支持部的 動作，並說明4個旋轉支持部隨著驅動或旋轉支持部的動 作之校準驅動部83與校準傳動部84之構成與動作。 前述4個旋轉支持部之中，將旋轉支持部81a主動（ 主動地進行驅動）於Z方向，將旋轉支持部81b主動於Z 方向及X方向時，藉由校準基底82，旋轉支持部81a係 傳動於X方向，旋轉支持部8 1 c、8 1 d係將經由前述主動 之複合作用的旋轉支持部81a作爲支點，進行傳動旋轉。 〇 連結各旋轉支持部與後述之驅動部或傳動部之作用點 的校準軸83a、84a係未經由栓槽83s、84s而傾斜，垂直 於Z方向且/或平行移動於X方向。因此，各旋轉支持部 係對於校準基底82而言，可旋轉地加以安裝。隨之，前 述旋轉支持部81c、81d之傳動旋轉係成爲分解成X方向 及Z方向之動作。 即’在本實施形態中，經由旋轉支持部8 1 a、8 1 b之 Z方向的移動’進行Z位置之補正，另外經由兩者的差， 進行旋轉補正，更且經由旋轉支持部81b之X方向的移 -19- 201044666 動’進行X位置補正。另外’旋轉支持部81a、81b之兩 者間的距離爲長的情況，對於同樣Z方向的動作而言，有 著可精確度佳地進行旋轉補正之優點。 驅動上述之旋轉支持部81a、81b之陰蔽罩驅動部83 係由設置於真空蒸鍍室lbu之上壁部1T (亦參照圖2)上 的大氣中’具有移動旋轉指示部81a於Z方向之Z驅動部 83Z的左驅動部83L’和具有將旋轉支持部81b,與左驅 動部83L同樣地移動於z方向之Z驅動部83Z，與將前述 z驅動部全體移動於X方向（圖Z之左右方向）之X驅 動部83X的右驅動部83R所成。左右驅動部83L、83R之 Z驅動部係基本上爲相同構成之故，附上相同符號，且省 略一部分符號。以下’符號之附加方式，省略方式係在機 構部上亦爲相同。 將左驅動部83L舉例說明Z驅動部83Z。Z驅動部 83Z係加以固定於如前述，在軌道83r上傳動於X方向之 Z驅動部固定板83k，經由Z方向驅動馬達83zm，藉由滾 動螺旋83η、推拔83t，移動連結棒83j於Z方向。校準 軸83a係經由在其上部連結之連結棒83j，移動於Z方向 。推拔83t係利用校準基底82等之重力，爲了防止前述 Z方向之空轉而設置之構成，其結果，遲滯性消失而有及 早到達目標値之效果。另外，各校準軸83a，係藉由固定 一端於設置於真空蒸鍍室lbu之上部壁1T的密封部（未 圖示）之伸縮管83v而進行動作。 右驅動部83R係更加上於前述Z驅動部83Z，具有固 -20- 201044666 定於真空蒸鑛室Ibu之上部壁it，將搭載Z驅動部83Z 之Z驅動部固定板83k，沿著χ軸軌道83r上而進行驅動 之X驅動部83X。X驅動部83X的驅動方法係將X方向 驅動馬達83xm之旋轉力，藉由滾動螺旋83n等，基板上 與Z驅動部83Z相同，但其驅動力係需要將校準基底82 ’藉由旋轉驅動及校準基底而移動其他之驅動部或傳動部 的動力。右驅動部83R之校準軸83a係因亦移動於X方 ^ 向之故’其伸縮管83v亦具有對於X方向而言之自由度 ’在伸縮的同時，於左右具有柔軟性。 校準傳動部84係具有呈可對應於旋轉支持部8ic、 81d之前述的傳動旋轉地，將各校準軸8 4a移動於Z方向 、X方向之左右的傳動部84L、84R。傳動部係亦可於中 心部設置1處，但在本實施形態中，爲了安定進行動作而 設置2處。兩傳動部係基本上，於左右線對稱具有同一構 造之故，作爲代表加以說明84R。校準軸84a係與固定一 〇 端於設置於真空蒸鍍室lbu之下部壁1Y的密封部84c之 伸縮管83v同樣地，藉由密封處理室lbu之真空的伸縮管 84v、栓槽84s，加以固定於X軸傳動板84k。因此，X方 向之傳動係移動在敷設於固定校準傳動部84之校準支持 部固定台84b的軌道84r而進行’ Z方向之被動係經由前 述栓槽84s而進行。201044666 6. Technical Field of the Invention The present invention relates to an organic electroluminescence device, a film formation device, and a film formation method therefor, a liquid crystal display substrate manufacturing device, a calibration device, and a calibration method, and more particularly An organic electroluminescence manufacturing apparatus, a film forming apparatus, and a liquid crystal display substrate manufacturing apparatus suitable for calibration of a large substrate. 〇 [Prior Art] As a powerful method for manufacturing organic electroluminescent devices, there is a vacuum distillation method. In vacuum evaporation, calibration of the substrate and the mask must be performed. In the year of processing large-scale substrates, the substrate size of the G6 generation is 1 500 mmxl 800 mm. When the size of the substrate is increased, the size of the mask is also increased, and the size thereof is also about 2000 mm x 2000 mm. In particular, when a steel photomask is used, the weight of the organic electroluminescence device is also 300 kg. In the past, the substrate and the mask were horizontally leveled, and the calibration (position adjustment) was performed. In addition, through the enlargement, the calibration is also strict, and the requirement is high. As a prior art for such calibration, Patent Documents 1 and 2 below are available. Further, regarding the correction of the calibration, Patent Document 2 discloses a method of performing calibration by adding a difference between the calibration detection amount and the actual correction amount in the horizontal calibration. [Patent Document 1] JP-A-2006-302896 (Patent Document 2) JP-A-2008-004358 (Patent Document) - 5 - 201044666 [Problems to be Solved by the Invention] However, the substrate disclosed in Patent Document 1 will be disclosed. The method of calibrating with the reticle as a lateral direction is as shown in Fig. 14. The substrate and the reticle are greatly curved by their thinness and their own weight. If the curvature is the same, the mask can be made in consideration of this, but of course, the center is larger, and when the size of the substrate is larger, the production becomes difficult. Further, in general, the amount of bending at the center point is dl > d2 when the curvature of the substrate is d1 and the curvature of the reticle is d2. When the substrate is bent, the vapor deposition surface of the substrate is in contact with the photomask. During the calibration, the organic film which is in contact with the vaporization is damaged in the prior art, and it is necessary to enlarge the spacer substrate and the mask during the calibration. However, when the interval is equal to or greater than the depth of field of view, the accuracy is deteriorated, and there is a problem that it becomes a defective product. In particular, in the case where the substrate for display is not used, it is impossible to obtain a user who is fascinating. In order to cope with the problem, there is a method in which a substrate and a photomask are formed to be slightly vertical and vapor-deposited. By being a vertical person, the bending of the self weight through the substrate or the shadow mask can be greatly reduced. However, in the case of the mask, the thickness of the mask portion is 2 〇 to 5 〇 Mm, and when it is manufactured, as shown in FIG. 11, the entire reticle is bent from the center toward the periphery, and in the end portion of the reticle portion The impact is big. Fig. 11 is a diagram exaggerating the state of the 'in which it is understood that there is a gap of several tens of μπ1 between the substrate and the shadow mask. The gap is caused by vapor deposition blurring, and it is impossible to perform steaming with high precision. Question. In addition, the conventional method described in Patent Document 1 is as shown in Fig. 15. In order to prevent the vapor deposition material from adhering to the calibration mark, the light source that is illuminated from the vertical or the oblique direction and the reflection thereof are used on the side opposite to the vapor deposition side. The so-called reflective optical system of the -6-201044666 camera is configured to detect calibration marks and perform calibration. In the conventional organic electroluminescence manufacturing apparatus, as shown in the circled diagram of FIG. 3, the rectangular portion provided in the steel mask and the metal portion provided on the transparent substrate are used as calibration marks to form a metal. The part is calibrated to the center of the quadrangle. However, the reflective optical system has the following problems: 'There is a problem that calibration cannot be performed accurately. (1) The surface of the mask is caused by a mirror surface, which causes a halo, etc., and it is impossible to increase the illumination intensity and reduce the metal portion when the photo is lowered. (2) At the time of calibration, it is necessary to provide a gap of about 5 mm between the mask and the mask, but the depth of the field of view of the reflective optical system is small and the image becomes blurred. Next, in the method disclosed in Patent Document 1, in order to provide the whole of the calibration substrate and the photomask as vacuum, there is dust and heat accompanying the movement of the driving portion or the like, or from the driving unit or the like. The gas of the wiring, the gas from the lubricant, and the gas from the surface of the member reduce the possibility of vacuum. In the dust in the first vacuum, the dust is attached to the substrate or the mask to cause poor vapor deposition, and the second heat generation promotes thermal expansion of the mask to change the size of the vapor, and the third air system is lowered. The degree of vacuum also has the problem of reducing productivity, that is, productivity. Further, in order to provide the entire structure of the calibration substrate and the photomask as a vacuum, when a failure occurs in the driving portion or the like, it takes time to perform maintenance, and the rate of the device is lowered. In view of the above, a first object of the present invention is to provide an organic electroluminescence light-producing apparatus, a film-forming apparatus, and a liquid crystal display board manufacturing apparatus which can reduce the curvature of a substrate or a reticle and perform vapor deposition with high precision. Further, a second object of the present invention is to provide an organic electroluminescence device which can reduce the influence and perform high-precision distillation, and a film formation method therefor. Furthermore, a third object of the present invention is to provide an accurate calibration apparatus and calibration method. Further, a fourth object of the present invention is to provide an organic electric circuit and a film forming apparatus which can perform vapor deposition with high precision using the above-described calibration method. Furthermore, a fifth object of the present invention is to provide an electromechanical excitation light manufacturing apparatus and a film forming apparatus which are capable of reducing the generation of dust or gas in a vacuum by a gas side. Further, a sixth object of the present invention is to provide an organic electro-acoustic and film-forming apparatus which is improved in maintainability and high in productivity by arranging a gas side. [Means for Solving the Problem] In order to achieve the above-described object, the first characteristic plate holds the substrate holding means in the established posture, and the negative cover is placed in the lower posture, and the photographing is set in the mask. The calibration optical means of the mark, and the calibration driving means for driving the shadow mask in the foregoing state, and the result of the learning means 'controlling the control of the calibration driving means, and in order to achieve any of the above purposes, the first The feature "the shade cover hanging means is attached to the bending device of the shadow mask, the film formation degree is good, and the calibration device or the excitation light manufacturing device drive portion is equal to the high productivity. The drive portion is equal to the large light-emitting device. The method further comprises: aligning the base cover with the substrate and the hanging posture according to the calibration light means. 2 features a hood or a retaining -8 - 201044666 The calibrated base of the aforementioned hood, having a plurality of rotary support portions rotatably supporting the aforementioned hood, the calibrated drive means having the plurality of rotary support portions An active driving means for driving at least one active rotation support portion, wherein the organic electroluminescence manufacturing device further includes a transmission rotation support portion of the rotation support portion other than the active rotation support portion, and the active rotation support is provided The calibrated transmission of the action of the department. Furthermore, in order to achieve the above-described object, the third feature is added to the second feature, and the active rotation support portion is provided on the upper cover or the upper portion of the calibration base holding the female cover. The second side of the end. Further, in order to achieve the above object, the fourth feature is added to the second feature, and the calibration driving means has a driving means for independently driving the two in the up and down direction, and the above two The above-described active driving means for driving the right and left driving means in the left-right direction, and the other one of the above-mentioned left and right transmission means for the left and right direction. Further, in order to achieve the above object, the fifth feature is added to the first to fourth features, and the calibration driving means and/or the calibration transmission means are provided outside the vacuum chamber. Further, in order to achieve the above object, the sixth feature is added to the first to fifth features, and the calibration driving means is provided on the upper side of the shadow mask, and the calibration transmission means is provided in the Under the cover. Further, in order to achieve the above-described object, the seventh feature is added to the first to sixth features, and the substrate holding means has a means for raising the base 201044666 from a horizontal state. In addition, in order to achieve the above object, the eighth feature is added to the first to sixth features, and the substrate holding means has a means of bringing the substrate up and close to or close to the shadow mask. . Furthermore, in order to achieve the above object, the ninth feature is directed to a calibration means having a calibration of the substrate and the shadow mask in the vacuum chamber, and a vapor deposition of the vapor deposition material in the evaporation source on the substrate. The film forming apparatus of the vapor deposition chamber includes: a substrate holder that holds the substrate, holds the upright posture, and a shade cover holding means that holds the shadow mask in the substrate in the rising posture; and The means for correcting the influence of the bending through the aforementioned shadow mask is reduced. Further, in order to achieve the above object, the tenth feature is the ninth feature, and the correction means includes a substrate holder that presses and holds the substrate, or a pressing means for the shadow mask. Furthermore, in order to achieve the above object, the eleventh feature is added to the first feature, and the correction means has a measuring means for measuring a distance between the substrate holder and the shadow mask, and the measuring means is used according to the measuring means. As a result, the person who controls the pressing means is controlled according to the amount of correction prescribed in advance. Further, in order to achieve the above-described object, the twelfth feature is the eleventh feature, wherein the pressing means presses the pressing position of the substrate holder to be around the outer side of the end portion vapor deposition portion of the substrate, or the The pressing means presses the pressing position of the shadow mask to correspond to a position around the outer side of the end portion vapor deposition portion of the substrate. -10-201044666 Further, in order to achieve the above object, in the thirteenth aspect, the pressing position is provided at four places in the vicinity of the base or the four corners of the shadow mask. Further, in order to achieve the above object, the 14th pair of the substrate and the shadow mask are calibrated in the vacuum chamber, and the film forming method of vapor deposition on the substrate has a correction engineer who corrects the curvature of the shadow mask. Further, in order to achieve the above object, the fifteenth aspect is the fourteenth feature, wherein the correction works are performed by a member who presses the holding base holder or the shadow mask. Further, in order to achieve the above object, the 16th feature is the 14th feature, and the correction process is performed after the calibration is performed. Further, in order to achieve the above object, the feature of any one of the fourteenth to sixteenth aspects of the present invention is that the engineer who performs the correction of the entire substrate is closely attached to the shadow mask. Further, in order to achieve the above-described object, the ninth aspect of the present invention, wherein the correction project is provided, wherein the one end is opened to the hollow cover and the other end is open to the air connection portion, and the correction means is used. The wiring is applied by the aforementioned connecting portion. Further, in order to achieve the above-described first object, the ninth feature of the ninth aspect of the present invention includes the substrate holding means and the state of the substrate rotating means in a state in which the substrate holding means is established from the horizontal state. The evaporation characteristics of the needle material have the characteristics of the substrate which is added to the front of the board, or the feature is added after the feature is added to the cover, and the hollow features of the hollow are necessary to supplement the positive means. -11 - 201044666 Further, in order to achieve the above object, the twentieth feature is added to the ninth feature. The substrate rotating means is a means for rotating the connecting portion. Further, in order to achieve the above object, the twenty-first feature is that the shadow mask has a through hole for calibration, and the calibration portion includes a light source having light incident from one end side of the through hole and the other end of the photographing end. The calibration optical system of the photographing means and the control unit that performs calibration based on the output of the photographing means. Further, in order to achieve the above object, the twenty-second feature is the twenty-first feature, wherein the through hole is a hole that penetrates before and after the shadow mask, and the calibration optical system has the aforementioned at least for the substrate At the time of the treatment, the shielding means for shielding the adhesion to the processing material of the through hole is shielded. Further, in order to achieve the above-described object, the twenty-third feature is the twenty-second feature described above, wherein the calibration optical system has the shielding means moved to a processing position during processing, and moves to calibration during calibration. The position of the shadow moving means. Further, in order to achieve the above object, the twenty-fourth feature is the twenty-first feature, wherein one end of the through hole is an opening for calibration, and the other end of the opening is connected or inserted with an optical fiber. The other end is connected to the light source or the photographing means. Further, in order to achieve the above-mentioned object, the twenty-fifth feature is added to the twenty-second feature, and one end of the through hole is an opening for calibration, and the through hole In addition, in order to achieve the above object, the twenty-sixth feature includes a light source having irradiation light to a calibration mark provided on the substrate and the shadow mask, and photographing the calibration mark The calibrating optical system of the photographic means; wherein the calibrating optical system has a follow-up means in which at least one of the light source or the photographic means moves in accordance with a calibration operation of the substrate or the hood. Furthermore, in order to achieve the above object, the twenty-seventh feature is added to the twenty-sixth feature, and the following means is connected to a means for driving the driving of the calibration operation. Further, in order to achieve the above object, the twenty-eighth feature includes: a light source provided with a light source for irradiating light to a calibration mark provided on the substrate and the shadow mask; and a calibration optical system for photographing means for photographing the calibration mark; The plurality of calibration marks are provided, and for each of the calibration marks, a plurality of the calibration optical systems are provided, and the center position of the substrate is calibrated to a reference based on the output of the plurality of imaging means. Further, in order to achieve the above object, the twenty-ninth feature is added to the twenty-eighth feature, and the plural number is four, and the calibration is placed in the vicinity of the four corners of the substrate and the shadow mask. Further, in order to achieve the above object, the 30th feature is added to the above-mentioned 21st to 29th features, and the substrate and the shadow mask are erected. Furthermore, in order to achieve the above object, the thirty-first feature is added to the above-mentioned 21st to 30th features, and the calibration is performed in a vacuum chamber, and the vapor deposition material in the evaporation source is vapor-deposited on the substrate. Vacuum steaming-13- 201044666 Plating room. Further, in order to achieve the above object, the twenty-third feature is the same as the above-described 31st feature, and the at least the imaging means 'the inside of the upper part of the vacuum chamber is hidden from the atmosphere side of the vacuum chamber. The recessed portion is provided with an optical window for the concave front end. Further, in order to achieve the above-described object, the thirty-third feature is added to the above-described thirty-third feature, wherein the shielding movement means has a driving means provided on the atmosphere side, and the driving means is coupled to the driving means by a vacuum sealing means. The means for connecting the aforementioned shielding means. In addition, in order to achieve the above-described object, the 34th feature is added to the 31st feature 'the drive means for driving the female cover for performing the above-mentioned calibration, and to connect the above-mentioned shade cover or to maintain the aforementioned shade. a calibration substrate of the cover and a calibration axis of the driving means; the driving means is disposed on the atmosphere side, and the calibration axis is driven by a vacuum sealing means. In order to achieve any of the above purposes, the 35th feature is In addition to the above-mentioned features of the first to fourth aspects, an organic electroluminescent material is used as the vapor deposition material. [Effects of the Invention] According to the present invention, it is possible to provide an organic electroluminescence light-producing device or a film-forming device or a liquid crystal display substrate-manufacturing device which can reduce the curvature of a substrate or a reticle and which is highly vapor-deposited. Further, according to the present invention, it is possible to provide an organic electroluminescence light-producing device, a film-forming device, and a manufacturing method and a film-forming method which can reduce the influence of the bending of the shadow mask, and the high-precision evaporation of the organic electroluminescence. . Furthermore, according to the present invention, it is possible to provide a calibration apparatus and a calibration method which can perform calibration with high precision. Further, according to the present invention, it is possible to provide an organic electroluminescence light-producing device and a film-forming device which can be vapor-deposited with high precision by using the above-described calibration device or calibration method. Further, according to the present invention, it is possible to provide an organic electroluminescence light-producing device or a film-forming device which is capable of reducing the generation of dust or gas in a vacuum by the arrangement of the drive unit and the atmosphere side. Further, according to the present invention, it is possible to provide an organic electroluminescence light-producing device or a film-forming device which has a high degree of maintainability and a high rate of utilization by arranging the drive unit to be equal to the atmosphere side. [Embodiment] A first embodiment of the invention will be described with reference to the drawings. The organic electroluminescence excitation device not only forms a layer of luminescent material (electroluminescence layer), but also has an electrode clamping structure, and above the anode, a hole is implanted into the layer or the transport layer, and the electron is placed above the cathode. The implant layer or the transport layer or the like forms a multilayer structure in which various materials are formed as a film, and the substrate is cleaned. Fig. 1 is a view showing an example of a manufacturing apparatus. In the organic electroluminescence light-producing apparatus 100 of the present embodiment, the load group 3 of the substrate 6 to be processed is processed, and the groups (A to D) of the substrate 6 are processed, and the groups or groups are processed. It consists of six delivery rooms 4 set up between the load group 3, or -15- 201044666 and the next project (closed project). In the present embodiment, the vapor deposition surface of the substrate is transported on the upper surface, and when vapor deposition is performed, the substrate is lifted up and vapor-deposited. The load group 3 is a transfer machine that has a gate valve i 为了 for maintaining a vacuum before and after maintaining a vacuum, and a transfer machine that receives the substrate 6 (hereinafter referred to as a substrate) from the load chamber 31 and rotates to input the substrate 6 to the delivery chamber 4a. The arm 5 R is made. Each of the load chambers 31 and the respective delivery chambers 4 has a gate valve 10 in front and rear, and the switch of the gate valve 10 is controlled to maintain a vacuum, and the substrate is delivered to the load group 3 or the next group or the like. Each group (A to D) has a transfer chamber 2 having one transport robot arm §, and a substrate received from the transport robot 5, and is disposed on two upper and lower processing chambers on a plane for performing specific processing. 1 (The first added words a to d are the display group 'the second added word u, and the d is the upper side of the upper side). A gate valve 1 设置 is provided between the transfer chamber 2 and the processing chamber 1. Fig. 2 is a view showing the configuration of the transfer chamber 2 and the processing chamber 1. The configuration of the processing chamber 1 differs depending on the processing contents, but a vacuum vapor deposition chamber Ibu in which an electroluminescent layer is formed by vapor deposition of a luminescent material in a vacuum is exemplified. Fig. 3 is a schematic view and an operation explanatory view showing the configuration of the transfer chamber 2b and the vacuum vapor deposition chamber lbu at this time. The transport robot 5 of Fig. 2 can move the whole body up and down (see arrow 59 in Fig. 3), and has a bracket 57 that can be rotated to the left and right connection structure, and has two baseboards for the front and rear sections. The comb-like shank portion 5.8 is a shank portion in order to transfer the substrate to the next rotation of the project, to receive the rotation of the substrate from the previous work, and to open and close the gate valve. It is necessary to perform the processing between the input and the -16 - 201044666. However, when the upper and lower stages are formed, the substrate input to the one-side handle portion is maintained, so that the handle portion on the substrate side is not held, and the vacuum evaporation chamber is removed. After the output operation of the substrate is performed, the input of the actuator can be continuously performed as the two handle portions or as one handle portion, which is determined by the required production capacity. In the following description, in order to simplify the description, one handle portion will be described. Ο On the other hand, the vacuum vapor deposition chamber lbu is substantially vapor-deposited by the luminescent material, vapor-deposited on the vapor deposition portion 7 of the substrate 6, and the position of the substrate 6 and the shadow mask is adjusted, and vapor deposition is performed on the necessary portion of the substrate 6. The aligning unit 8, and the delivery of the transport robot 5 and the substrate, move the substrate 6 to the process delivery unit 9 of the vapor deposition unit 7. The calibration unit 8 and the processing delivery unit 9 are provided with two systems of a right R line and a left L line. Therefore, the basic method of the process of the present embodiment is to perform the vapor deposition between one line (for example, R line) and the input and output of the substrate in the other L line, and to perform the substrate 6 and the cathode. The calibration of the mask 81 ends the preparation for vapor deposition. When this process is performed by interaction, the time for excess sublimation may be reduced without evaporation on the substrate. First, an embodiment of the aligning unit 8 according to the first feature of the present invention will be described. In the present embodiment, as shown in Fig. 4, the substrate 6 and the shadow mask are erected vertically. Further, as far as possible, the mechanism portion to be calibrated is placed on the atmosphere side of the vacuum vaporization chamber 1 as much as possible on the upper wall it or the lower wall ιγ. Further, it is necessary to provide a configuration in the vacuum vapor deposition chamber 1bu, and a convex portion is provided from the large portion -17-201044666 to be provided therein. In the present embodiment, the substrate 6 is fixed during the calibration, and the moving mask 8 1 is moved to the necessary portion of the substrate 6 for position adjustment. Hereinafter, the mechanism of the calibration unit 8 and its operation will be described. The aligning portion 8 defines the calibration substrate 82 by the shadow mask 81, the calibration substrate 82 of the fixed shadow mask 81, and the calibration substrate 82', that is, the calibration driving portion 83 in the posture of the XZ plane of the shadow mask 81, and supports from below. The calibration substrate 82 is calibrated to coordinate with the calibration drive unit 83 to define the posture of the shadow mask 8 1 , and the calibration optical system 85 for detecting the calibration mark provided on the substrate 6 and the shadow mask 81 described later, The image of the calibration mark is processed, and the calibration amount is obtained, and the control device 6 0 (see FIG. 8) of the calibration drive unit 83 is controlled. First, FIG. 5 shows a shadow mask 81. The shadow mask 81 is formed of a mask 81M and a frame body 8 1 F. For example, the size of the substrate of G 6 is 1 500 mm × 1800 mm, and the size is about 2000 mm x 2000 mm, and the weight is also 300 Kg. The mask 81M is provided with a window for defining the vapor deposition position. For example, when a vapor deposited film which emits red (R) is formed, there is a window corresponding to the portion corresponding to R. The size of this window varies depending on the color, but the average width is 30 μm and the height is 150 μm. The thickness of the mask 81M is 50 μm, and there is a tendency to become thinner in the future. On the other hand, for the mask 8 1 Μ, the precision alignment mark 8 1 m is 4, and the coarse calibration mark 8 1 mr is 2 places, and the calibration mark 8 1 m is provided. Corresponding to this, for the substrate, the precision alignment mark is 6 ms, the coarse calibration mark 6mr is 6 places, and the calibration mark 6m is provided. -18- 201044666 The calibration substrate 82 has holding portions 82u and 82d for holding the upper and lower portions of the shadow mask 81, and the back side of the shadow mask 81 is a cavity which can be vapor-deposited on the substrate 6 and has a shape like a letter. Further, the calibration base 82 is rotatably supported by a rotation support portion which is disposed at four corners 81a and 81b at the upper portions 2 at positions 81a and 81b at the lower portions 81c and 81d. The calibration drive unit 83 and the zero calibration transmission unit 84 in the posture of the shadow mask 81 will be described. First, the operation of the four rotation support portions will be described, and the configuration and operation of the calibration drive unit 83 and the calibration transmission unit 84 in accordance with the operation of the drive or rotation support unit by the four rotation support portions will be described. Among the four rotation support portions, the rotation support portion 81a is actively (actively driven) in the Z direction, and when the rotation support portion 81b is activated in the Z direction and the X direction, the rotation support portion 81a is rotated by the calibration base 82. In the X direction, the rotation support portions 8 1 c and 8 1 d are driven to rotate by the rotation support portion 81a of the active composite action as a fulcrum.校准 The calibration axes 83a and 84a that connect the respective rotation support portions and the action points of the drive portion or the transmission portion to be described later are not inclined via the pin grooves 83s and 84s, and are perpendicular to the Z direction and/or parallel to the X direction. Therefore, each of the rotation support portions is rotatably attached to the calibration base 82. Accordingly, the drive rotation of the above-described rotation support portions 81c and 81d is decomposed into the X direction and the Z direction. In other words, in the present embodiment, the Z position is corrected by the movement of the rotation support portions 8 1 a and 8 1 b in the Z direction, and the rotation correction is performed via the difference between the two, and the rotation support portion 81b is further provided. Shift in the X direction -19- 201044666 Move 'X position correction. Further, the distance between the two of the rotation support portions 81a and 81b is long, and the movement in the same Z direction has an advantage that the rotation correction can be performed with high precision. The shade cover driving unit 83 that drives the above-described rotation support portions 81a and 81b is provided in the atmosphere in the upper portion 1T (see also FIG. 2) of the vacuum vapor deposition chamber 1bu, and has a movement rotation instruction portion 81a in the Z direction. The left drive unit 83L' of the Z drive unit 83Z and the Z drive unit 83Z that moves the rotation support unit 81b in the z direction in the same manner as the left drive unit 83L, and moves the entire z drive unit in the X direction (Fig. Z In the left-right direction, the right drive unit 83R of the X drive unit 83X is formed. The Z drive units of the left and right drive units 83L and 83R have substantially the same configuration, and the same reference numerals are attached, and a part of the symbols are omitted. The following additional descriptions of the symbols are omitted in the mechanism section. The Z drive unit 83Z will be described by exemplifying the left drive unit 83L. The Z driving unit 83Z is fixed to the Z driving unit fixing plate 83k that is driven in the X direction on the rail 83r as described above, and drives the motor 83zm via the Z direction, and the connecting rod 83j is moved by the rolling screw 83n and the 83t. direction. The calibration shaft 83a is moved in the Z direction via a connecting rod 83j connected at its upper portion. The 83t system is configured to prevent the idling of the Z direction by using the gravity of the calibration base 82 or the like, and as a result, the hysteresis disappears and the target 値 is reached early. Further, each of the calibration shafts 83a is operated by a telescopic tube 83v having a sealing portion (not shown) provided at one end portion 1T of the vacuum vapor deposition chamber 1bu. The right drive unit 83R is further connected to the Z drive unit 83Z, and has a solid wall -20- 201044666 fixed to the upper wall i of the vacuum distillation chamber Ibu, and a Z drive unit fixing plate 83k on which the Z drive unit 83Z is mounted, along the χ axis The X drive unit 83X that drives the rail 83r. The driving method of the X driving unit 83X is to rotate the driving force of the motor 83xm in the X direction by the rolling screw 83n or the like, and the substrate is the same as the Z driving unit 83Z. However, the driving force is required to drive the calibration substrate 82' by rotation. Calibrate the substrate to move the power of the other drive or transmission. Since the calibration axis 83a of the right driving portion 83R is also moved in the X direction, the bellows 83v also has a degree of freedom in the X direction, and has flexibility in the right and left sides. The calibration transmission portion 84 has transmission portions 84L and 84R that move the respective calibration shafts 8 4a to the left and right in the Z direction and the X direction in accordance with the above-described transmission rotation of the rotation support portions 8ic and 81d. The transmission unit may be provided at one center portion. However, in the present embodiment, two positions are provided for the operation in stability. The two transmission portions are basically the same in the left and right line symmetry, and 84R is explained as a representative. The calibration shaft 84a is attached to the bellows 84v and the pin groove 84s which seal the vacuum of the processing chamber lbu in the same manner as the bellows 83v which fixes the sealing portion 84c provided in the wall portion 1Y of the vacuum vapor deposition chamber 1bu. It is fixed to the X-axis drive plate 84k. Therefore, the X-direction drive train is moved to the rail 84r of the calibration support portion fixing table 84b of the fixed calibration transmission portion 84, and the passive movement in the Z direction is performed via the aforementioned bolt groove 84s.
在前述之校準部的實施形態中’經由將4處之旋轉支 持部81之中設置2處於真空蒸鍍室上部之旋轉支持部， 主動於Z方向’另外將其中1處主動（主動地驅動）於X -21 - 201044666 方向之時，實施陰蔽罩之校準。除此之外，可舉出各種驅 動方法。例如，於上部3處，設置旋轉支持部，旋轉中央 之旋轉支持部，由左右之旋轉支持部而主動或傳動於Z方 向與X方向進行校準。於下部，至少設置1處之傳動部 。或者與上述實施形態同樣地，設置2處上部旋轉支持部 ，於其1處進行旋轉，集中z方向及X方向之主動，其 他係亦有作爲傳動之方法。另外，在上述實施形態中，基 本上，將上部作爲主動，將下部作爲傳動，但亦可將此作 爲相反。 在前述校準部8的實施形態中，將校準驅動部83、 校準傳動部84、校準光學系統85，設置於真空蒸鍍室 1 bu之上部或下部之大氣側，但亦可設置於真空蒸鍍室 1 bu之側壁的大氣側。當然，亦可分散於上部、下部及側 壁部。 接著，說明本發明之第2特徵的校準光學系統8 5之 一實施形態。本實施形態之校準光學系統係呈可獨立攝影 前述之各校準標記地，由對於4個精密校準標記8 1 ms而 言之4個精密校準光學系統8 5 s，和對於2個粗校準標記 8 lmr而言之2個粗校準光學系統85ι之計6個光學系統 所構成。 於圖6顯示6個校準光學系統之基本構成。光學系統 之基本構成係設置夾持陰蔽罩81 ’於校準基底82側，具 有光學視窗85ws於前端’固定於真空蒸鍍室lbu之上部 1T，藉由光學視窗85w而照射的光源85k與固定於後述 -22- 201044666 之遮斷支架85as之光源側反射鏡85km，於基板6側，設 置安裝於從攝影機收納筒8 5 t之支架8 5 a的攝影機側反射 鏡85cm，及收納於攝影機收納筒85t之攝影手段之攝影 機85c，具有所謂透過型之構成。攝影機收納筒85t、支 架85a等係呈未成爲基板乃成爲垂直姿勢時之軌道κ的阻 礙地，至以虛線所示之支架8 5 a位置，可經由伸縮管8 5 v 等而移動。 因爲透過型之故，呈光可通過地，於光罩81M設置4 角形之貫通孔的校準標記8 1 m，更且對於框體8 1 F亦設置 圓同狀之貫通孔81k。另一方面’基板6之校準標記6ιη 係比較於在光透過性之基板的上方，作爲金屬性之四角形 的陰蔽罩之校準標記8 1 m，爲相當小的標記。 當設置貫通孔81k時，在蒸鍍時蒸鍍材料則進入貫通 孔，蒸鍍於校準標記上之故，從接下來的工程無法進行校 準。爲了防止此，對於在蒸鍍時，作爲蒸鍍材料呈不會進 入至貫通孔81k地進行遮蔽。在本實施形態中，於校準時 設置光源側反射鏡之支架乃於蒸鍍時係對於蒸鍍遮斷有效 的範圍之故，作爲將其支架作爲可移動，且對於蒸鍍時係 具有遮蔽貫通孔81k構造之遮蔽型支架85as。遮蔽型支 架8 5 as係經由對於設置於大氣側的驅動馬達（未圖示） ，驅動成上下之連結棒85b進行伸縮，將其一端，藉由固 定於密封部85s之伸縮管85v加以驅動。圖6所示之虛線 乃顯示遮蔽狀態，實線乃顯示校準狀態。 於圖7顯示其他的實施形態。如圖7 ( a )所示，陰 -23- 201044666 蔽罩之框體81F的厚度乃如充分，於框體8iF設置L字 形之貫通孔81k，將光源85k，與光源側反射鏡85km同 時內藏亦可。此情況，框體8 I F本身乃達成遮蔽體之作用 之故，無需遮蔽型之支架。 另外，如圖7 ( b )所示，於校準時，光源側反射鏡 8 5km乃未遮斷蒸鍍範圍之情況，係可於校準基底82，將 遮蔽型支架做成固定，可經常做成遮蔽狀態者。 另外，如圖7 ( b )所示，在攝影機側，加長攝影機 收納筒8 51，內藏光源側反射鏡8 5 km亦可。 更且，如圖7 ( c )所示，於光源側開口部，在遮蔽 光纖8H之一端的狀態進行固定，將另一端連接於設置於 大氣側的光源85k。在本實施形態中，可將發熱體之光源 ，以簡單的構造設置於大氣側，無需設置特別的遮蔽體。 更且，在其他的目的，設置於真空蒸鍍室lbu之構造 物乃在蒸鍍時，如達成遮蔽體之作用，無需設置新的遮蔽 體。 另一方面，攝影機收納筒85t係做成如圖4所示，具 有從真空蒸鍍室lbu之上部1T突出之構造，於前端設置 光學視窗8 5 w，將攝影機8 5 c維持於大氣側之同時，可攝 影校準標記6 m、8 1 m (符號係參照圖6 )。 另外，於蒸鍍面側設置光源，但改變位置而設置攝影 機亦可。 精密校準光學系統85s與粗校準光學系統85r之構成 上的不同係前者爲了高精確地進行校準，具有縮小視野， -24- 201044666 以高解析攝影校準之高倍率透鏡8 5 h的點。伴隨於此，圖 3所示之基板及陰蔽罩的校準標記6m、81m的尺寸乃不 同。視野係精密校準之情況，與粗校準做比較，小1位數 以上，最終可進行μιη等級之校準。 隨之，精密校準時係呈不離開視野地配合陰蔽罩81 之校準81m的移動，精密校準光學系統85s亦有跟隨移動 之必要。將各固定攝影機85c與光源85k之固定板85p、 〇 85ps，連接z驅動部固定板83k或X軸傳動板84k而進 行跟隨。另外，對於粗校準光學系統85r，係呈於初期的 安裝時，可進行位置調整地，設置攝影機位置調整平台 85d ° 在前述實施形態中，使用6個校準光學形態，經由校 準之要求精確度，係無需設置粗校準光學系統，更且對於 精密校準光學系統，亦無需4個，而包含粗·精密，最低 如有2個即可。 〇 接著，說明於本發明之第3特徵的校準實施前，將基 板立起，在校準結束後，將基板6接近於陰蔽罩之機構之 一實施形態。圖3所示之處理遞送部9係具有：作爲未與 輸送機械手臂5之梳狀手部58干擾，可遞送基板6之梳 狀手部91，和於前述梳狀手部91上，固定載置某基板6 ，將其基板6旋轉而立起之基板旋轉手段93，與更加地 ，接近於校準部8之基板接近手段93G所成之基板旋轉 接近手段93A。作爲前述固定之手段，係考慮爲真空中的 情況，由靜電吸付或機械性夾鉗等構成，設置於至少將基 -25- 201044666 板立起時之上部側94u。 圖8係詳細顯示基板旋轉接近手段9 3 A，並且，顯示 作爲呈未有來自配線之被覆材等之排氣的問題，或由配線 疲勞產生損傷之流體洩漏之虞等之真空內配線·配管機構 之適用圖。 首先，說明基板旋轉接近手段93A之基板旋轉手段 93。基板旋轉手段93係由載置基板6之載置台93d，和 蒸鍍時冷卻基板6之冷卻套93j，和將基板6、載置台93d 及冷卻套93j，成爲一體旋轉之基板旋轉驅動部93b、可 旋轉地支持冷卻套93j等之旋轉支持台93k加以構成。對 於冷卻套93j係敷設有冷卻水管43、44。另外，基板旋轉 驅動部9 3 b係具有設置於大氣側之旋轉用馬達9 3 sm，和 經由旋轉用馬達93sm，藉由齒輪93hl、93h2而旋轉於箭 頭A的方向之中空的第1連桿41，和於第1連桿41，呈 具有與第1連桿之中空部連續之中空部地加以固定，沿著 前述冷卻套93j的側面部加以設置之第2連桿42。然而， 第1連桿係於設置於真空蒸鍍室1 bu之側壁的密封部93 S ，介入存在有固定一端之伸縮管93v，經由旋轉支持台 93k，可旋轉地加以支持。然而，旋轉用馬達93 sm係由設 置於大氣側之控制裝置60加以控制。 在上述中，經由支持唯由圖3所示之固定手段94之 中，設置於基板上部之固定手段94u所立起之基板6之時 ，基板6係經由自重而消解彎曲。在消解其彎曲之後，由 設置於基板下部的固定手段94d，固定全體亦可。另外， -26- 201044666 當垂直地立起基板6時，因於基板6與載置台93d之間’ 亦有產生微小間隙之可能性之故，例如1度程度，多少傾 斜安定載置之同時，可確實地消除此等彎曲者。 在本實施形態中，將基板蒸鑛面做成上面而進行輸送 之故，如將基板6立起，可直接進行校準。 接著，對於基板接近手段93G加以說明。基板接近 手段93G (基板接近驅動部93g)係具有固定基板旋轉驅 〇 動部93b，於箭頭B方向，移動在軌道93r上之旋轉驅動 部載置台93t、將旋轉驅動部載置台93t，藉由滾動螺旋 9 3η而驅動之接近用馬達93dm。由將如此之機構，經由 控制裝置60而進行控制者，將基板6接近於陰蔽罩81， 如有必要可加以緊密。 如根據上述實施形態，在蒸鍍時可消解基板之彎曲。 另外，保持基板與陰蔽罩不會接觸之距離，可進行校準， 之後由將基板接近或緊密於陰蔽罩者，可降低在蒸鍍之模 ^ 糊，成爲可進行高精確度之蒸鍍。 更且’基板旋轉接近手段93A係具有作爲呈未有來 自配線之被覆材之排氣的問題，或由配線疲勞產生損傷之 流體洩漏之虞等之真空內配線•配管機構。真空內配線· 配管機構40係由上述第1連桿41及第2連桿42加以構 成’對於其中空部’係爲了流動冷卻水於冷卻套93j，配 設有供給用43與回收用44之冷卻水配管。各連桿係由具 有耐銹強’相當強度之金屬，例如不鏽鋼、鋁加以構成， 第1連桿41之中空部的旋轉用馬達93 sm側係開放於大氣 -27- 201044666 。前述2支冷卻水配管係一般由具有在大氣中所使用之柔 軟性的材料而構成，或由金屬性而構成，呈在連桿內未具 有可撓部地，配管成由第1連桿4 1及第2連桿42所形成 之形態的L字狀，可撓部係設置於大氣側。如使用後者， 更可構成疲勞傷害少之配管。另外，萬一冷卻水從冷卻水 配管43、44洩漏，亦可排水於大氣側地，將在前述真空 蒸鍍室1 bu之側壁的連接部，作爲較在冷卻套93j的連接 部爲低。 如根據本實施形態之真空內配線•配管機構40，於 將一端開放於大氣，將多端連接於移動部之連桿機構的中 空部，設置配管，前述連桿機構之旋轉部係加以真空密封 ，從真空側完全地遮斷之故，萬一即使有從冷卻水配管漏 水，亦不會漏水至真空側，另外，無需將連桿機構之中空 部做成真空。更且，因將連桿機構，由不鏽鋼或鋁所構成 之故，排氣之產生亦少。另外，真空內配線•配管機構乃 構成基板旋轉驅動部之一部分之故，作爲全體而可做成簡 單之構成。在前述的例中，有敷設配管於連桿的例，但即 使將信號線配線於連桿內，亦可提供不會招致從信號線產 生的排氣於真空內的構成。隨之，可保持高真空，進行信 賴性高的蒸鍍之處理者。 接著，將在具有上述之校準部8、校準光學系統85S 及基板旋轉接近手段93A之真空蒸鍍室之處理動作，以 校準動作爲主體進行說明。 以下，顯示基板在輸入至真空蒸鍍室1 bu之後的處理 -28- 201044666 流程圖。（1 )首先，將輸入至圖3所示之R線路的基板 6之上部，固定於基板載置台，之後大槪立起成垂直而消 解彎曲。（2 )由從基板6相距一定距離之狀態，經由粗 校準標記而實施粗校準，檢測在粗校準之位置偏移，求取 粗補正量。（2)依據其粗補正量，在圖4所示之ZX平 面，移動陰蔽罩81而進行粗位置調整。（3)由保持一定 的距離，以精密校準標記，實施精密校準，檢測在精密校 Ο 準之位置偏移，求取精密補正量。（4 )依據其精密補正 量，在圖4所示之ZX平面，移動陰蔽罩81而進行精密 位置調整。（5)緊密基板6與陰蔽罩81。（6)檢測（3 )的校準結果（位置偏移）。（7 )位置偏移量如爲容許 範圍，等待圖3所示之L線路之基板之蒸鍍結束。（8 ) 如L線路的蒸鍍結束之後，移動蒸發源71於R線路而進 行蒸鍍。（9)在（7)中，位置偏移量如爲容許範圍外， 暫時將兩者分離，爲了進行精密校準而返回至（3)。 〇 在上述中，粗校準的位置調整係由2台之攝影機85c 進行攝影，設置於基板6，如圖3之導引圖所示，攝影陰 蔽罩81與基板6之校準標記81 mr、6mr，將2個校準的 中間點，根本地位置調整成基準者。另一方面，精密校準 係於基板的四角附近，設置4個校準標記，將基板的中心 點補正成基準。理論上’對於以2個根本決定之情況而言 ，4個乃資訊過多。此係經由4角的資訊，四角的偏移乃 呈成爲最小地，經由將基板的中心點決定成中心之時，基 板6與陰蔽罩81之偏移變小，作爲製品爲了取得大的可 -29 201044666 有效利用之面積。如粗校準地’將上部中點做成基準時， 下部側的偏移變大，作爲製品可利用之面積變少。 如根據以上說明之本實施形態’可提供由將基板及陰 蔽罩做成垂直或大槪垂直之狀態’可進行校準之有機電激 發光製造裝置。其結果，可提供可排除經由基板或陰蔽罩 之自重的彎曲之影響，可消解位置偏移，或經由無法接近 基板與陰蔽罩之膜模糊，進而可高精確地蒸鍍，可製造高 精彩之基板的有機電激發光製造裝置。 另外，如根據本實施形態’在對於校準必要之機構， 由設置驅動裝置於大氣中者，抑制粉塵或氣體的產生，進 而可降低經由粉塵或氣體的蒸鍍不佳，可提供生產性高的 有機電激發光製造裝置。 更且，如根據本實施形態，在對於校準必要之機構， 由設置驅動裝置或發熱的機構，或者許多的校準光學系統 構成要素於大氣中者’可提供維護性佳，稼働率高之有機 電激發光製造裝置。 另外，可提供由實施將基板作爲中心之校準者，作爲 製品，可進行有效面積高的蒸鍍，即產率高，即生產性高 之有機電激發光製造裝置。 更且，如根據以上實施形態，可提供由將校準標記作 爲透過型者’可確實檢測基板與陰蔽罩之信賴性高之有機 電激發光製造裝置。 至今所說明之實施形態係將基板6與陰蔽罩81立起 進行校準’之後保持立起狀態’進行蒸鍍的實施例。未必 -30- 201044666 需要由立起之狀態進行蒸鍍，而經由附加將陰蔽罩遞送至 基板側的機構之時，保持校準之狀態，暫時做成水平，之 後進行蒸鍍亦可。例如，其第1之方法係經由圖8所示之 基板旋轉手段93，再次做成水平，從上部進行蒸鍍的方 法。 作爲第2之方法，圖3所示之2個處理線路之中，一 方作爲校準專用線路（例如R線路），將另一方的線路（ O L線路）作爲蒸鍍專用線路之方法。在R線路進行校準之 後，經由傳送機械手臂5而移動至L線路。之後，由設置 於L線路之基板旋轉手段93進行1 80度旋轉，從下進行 蒸鍍之方法。在本方法中，多少需要處理時間，但亦可於 校準專用線路之兩側，由設置蒸鍍專用線路，交互進行處 理者。 在做成上述之水平進行蒸鍍之實施形態，亦可得到與 由立起狀態進行蒸鍍之實施形態同樣之效果。 〇 在以上說明之實施形態中，說明過將基板做成水平輸 送至處理遞送部之情況，但垂直地輸送基板，之後實施校 準亦可。 更且，如根據本實施形態，可提供在對於校準需要之 機構中，將無法設置於真空中之驅動裝置，可設置於大氣 中之有機電激發光製造裝置。 更且’上述校準機構係亦可適用於在大氣中所進行之 液晶顯示裝置等之校準。 另外，可提供由實施將基板作爲中心之校準者，作爲 -31 - 201044666 製品，可進行有效面積高的蒸鍍，即產率高，即 之有機電激發光製造裝置。 更且，如根據以上實施形態，可提供由將校 爲透過型者，可確實檢測基板與陰蔽罩之信賴性 電激發光製造裝置。 至今所說明之實施形態係將基板6與陰蔽罩 進行校準，之後保持立起狀態，進行蒸鍍的實施 需要由立起之狀態進行蒸鍍，而經由附加將陰蔽 基板側的機構之時，保持校準之狀態，暫時做成 後進行蒸鍍亦可。例如，其第1之方法係經由圖 基板旋轉手段93，再次做成水平，從上部進行 法。 作爲第2之方法，圖3所示之2個處理線路 方作爲校準專用線路（例如R線路），將另一方 L線路）作爲蒸鍍專用線路之方法。在R線路進 後，經由傳送機械手臂5而移動至L線路。之後 於L線路之基板旋轉手段9 3進行1 8 0度旋轉， 蒸鍍之方法。在本方法中，多少需要處理時間， 校準專用線路之兩側，由設置蒸鍍專用線路，交 理者。 在做成上述之水平進行蒸鍍之實施形態，亦 由立起狀態進行蒸鍍之實施形態同樣之效果。 在以上說明之實施形態中，說明過將基板做 送至處理遞送部之情況，但垂直地輸送基板，之 生產性高 準標記作 高之有機 81立起 例。未必 罩遞送至 水平，之 8所示之 蒸鍍的方 之中，一 的線路（ 行校準之 ，由設置 從下進行 但亦可於 互進行處 可得到與 成水平輸 後實施校 -32- 201044666 準亦可。 在以上說明之實施形態中，雖在立起的狀態進行校準 ，但將校準標記作爲透過型者、伴隨於此而爲了進行蒸鍍 ，具有遮蔽構造者'設置校準光學系統於大氣側者、另外 ，其校準光學系統乃跟隨陰蔽罩或基板之校準動作者、設 置4個校準，將基板的中心位置，位置調整成基準者等， 係亦可適用於做成水平進行校準之方法或構造。 〇 接著，說明具有補正本發明之第4特徵的陰蔽罩之彎 曲的基板端部緊密手段之一實施形態。圖9係顯示輸入基 板至前述之真空蒸鍍室lbu之後的處理流程圖，更且顯示 加上補正陰蔽罩之彎曲的處理之處理流程圖。在本實施形 態中，如圖9所示，即使基板尺寸爲大，基板與陰蔽罩間 的間隙乃數μηι前後呈可蒸鍍地，首先，（1 )將基板輸 入至處理遞送部9，之後，（2)將前述基板立起成略垂 直’接著’ （3)將基板6，從陰蔽罩81接近至相距一定 〇 的距離’例如0.5mm之位置，（4)補正與經由陰蔽罩之 彎曲的基板之間隙，（5 )由此狀態進行校準。校準結束 後’ （6)緊密基板6與陰蔽罩81，（7)將蒸鍍材料蒸 鍍於基板。 蒸鍍結束後，（8)將基板6，從陰蔽罩81相距一定 的距離’ （9)解除（4)的補正，（1〇)將基板及其他做 成水平’ （11)從處理遞送部9輸出基板。 在上述步驟中，於（5)的校準前，實施步驟（4)， 但亦可於校準後或步驟（6)之後實施，另外，於（8)之 -33- 201044666 後實施步驟（9 )，但亦可於（8 )之前實施。 因此，依序說明上述本實施形態之步驟之中’實現（ 2)〜（6)及（8)〜（10)步驟之構成及動作。圖10係顯 示上述步驟之中，實現（2) (10)之基板旋轉手段93、 實現（3) ( 6) ( 8)之基板接近手段93G、及實現（4) (9)之基板端部緊密手段94之圖3所示之處理遞送部9 的圖，並且，顯示適用消解來自配線之被覆材的排氣問題 之真空內配線機構的圖。 首先，使用圖10，說明實現（2) (10)之基板旋轉 手段93。基板旋轉手段93係將載置、保持輸入至處理遞 送部9之基板6的基板保持器91、基板6及後述之基板 端部緊密手段94，在成爲一體實施校準前，立起成略垂 直，在校準結束後，係具有返回成水平狀態之機能。作爲 前述固定之手段係考慮爲真空中之情況，由靜電吸付或機 械性夾鉗等而構成。 在圖10中，基板旋轉手段93係大致由旋轉爲旋轉對 象之基板6、基板端部緊密手段94及基板保持器等之旋 轉部之真空內配線連桿機構92L、和將前述旋轉物，於箭 頭A的方向，藉由前述機構，進行旋轉驅動之基板旋轉 驅動部93b所成。 真空內配線連桿機構93L係由第1連桿93L1與第2 連桿93 L2，及將此等從真空側隔離，將此內部維持成大 氣環境之密封部93S所成。前述第1連桿93L1係將一端 支持於旋轉支持台93k，將另一端，呈於後述之基板端部 -34- 201044666 緊密手段94，具有中空部地加以連接。前述第2連桿 93 L2係對於前述基板端部緊密手段94而言，設置於與前 述第1連桿9 3 L1相反側，將一端，與第1連桿9 3 L1同 樣，呈具有中空部地加以連接於前述基板端部緊密手段 94，將另一端，加以連接於設置於圖1所示之間隔部11 的支持部1 1 A。前述密封部9 3 S係由將一端，連接於前述 基板端部緊密手段之連接部，將另一端，連接於各真空蒸 Ο 鍍室lbu之側壁，和支持部1 1A之第1密封部93S1，和 第2密封部93S2所成。各密封部93S1、93S2係具有連結 各兩端之伸縮管93Svl、93Sv2，另外，各密封部93S1、 93 S2之基板端部緊密手段94側的連接部係可旋轉地支持 第1連桿93L1與第2連桿93L2。 在上述實施形態中，爲了將配線94f敷設於連桿內， 而將連桿內做成中空，但密封部93S係因呈包含各連桿地 加以構成之故，於連桿與真空密封部之間，敷設配線亦可 〇 w 。此情況係未必需要將連桿做成中空。 另一方面，基板旋轉驅動部93b係具有設置於大氣側 之旋轉用馬達93sm，和由旋轉用馬達93sm，將旋轉傳達 至前述第1連桿93L1之齒輪93hl、93h2，和支持第1連 桿L1之一端的旋轉支持台93k。然而，旋轉用馬達93 sm 係由設置於大氣側之控制裝置6 0加以控制。 另外，圖10乃真空蒸鑛室lbu之R線路之故，將圖 1所示之間隔部1 1作爲面對象中心，於L線路亦配置有 同一構造。隨之，R線路之第1連桿93L1、基板端部緊 -35- 201044666 密手段94、第2連桿93L2及L線路之第1連桿93L1、 基板端部緊密手段94、第2連桿93 L2之中空部係成爲藉 由設置於間隔部1 1之支持部1 1 A而由大氣連結之構造。 第2連桿93 L2係未必需要爲中空，但如後述，第2連桿 9 3 L 2係有必要在間隔部1 1之中空部，移動至圖1 〇所示 之B方向之故，有可能在移動部出現粉塵，形成支持部 11A之中空部之一部分，作爲連結於大氣之構造。 在上述中，因將基板6立起成垂直時，於基板6與基 板保持器91之間，亦有可能產生微小的間隙之故，例如 1度程度，多少傾斜安定載置之同時，經由基板的自重， 可確實地消解基板的彎曲。在本實施形態中，將基板蒸鍍 面做成上面而進行輸送之故，如將基板6立起，可直接進 行前述之校準。 第2，對於達成步驟（5)之校準的構成與動作，既 已使用圖4說明過之故，在此省略說明。 接著’對於緊密（3) (6) (8)之基板6與陰蔽罩 81的基板接近手段93G之構成及動作，使用圖10加以說 明。基板接近手段93G係經由將基板旋轉手段93全體朝 箭頭B方向前後移動之時，將基板6，首先至陰蔽罩81 爲止接近一定距離’之後加以緊密，蒸錢後返回至原來的 位置之手段。因此’基板接近手段9 3 G (基板接近驅動部 93g)係具有載置基板旋轉手段93之旋轉驅動部載置台 93t、和旋轉驅動部載置台93t之運行用的軌道93r、和藉 由滾動螺旋93η而驅動旋轉驅動部載置台93t之接近用馬 -36- 201044666 達93m。對於間隔部11之中空部，亦有隨動於旋轉驅動 部載置台93t之動作，將基板旋轉手段93的第2連桿 93L2移動至B方向之軌道（未圖示）。雖說是軌道，其 稼働長度係頂多2mm程度。由經由控制裝置60而控制如 此之機構者，可將基板6接近、緊密及脫離於陰蔽罩81 者。 如根據上述實施形態，在蒸鍍時可消解基板之彎曲。 Ο 另外，保持基板與陰蔽罩未接觸距離，例如0.5mm前後 同時，可進行校準，之後，由將基板緊密於陰蔽罩者，可 降低在蒸鍍中之模糊，成爲可進行高精確度之蒸鍍。 最後，使用圖1 〇，說明實現更加緊密與經由（4 )( 9)之陰蔽罩的彎曲之基板的間隙之基板端部緊密手段94 。即使經由基板接近手段93G而將基板6緊密於陰蔽罩 81，如圖11所示，經由陰蔽罩81之具有的彎曲，在基板 端部中，於蒸鍍範圍與陰蔽罩8 1，亦產生數十μιη的間隙 ^ 。因此，在本實施形態中，測定基板保持器91與陰蔽罩 間的距離，按壓基板保持器91之上述端部蒸鍍範圍之外 側周圍，補正基板6與陰蔽罩81間的間隙，將基板6沿 著陰蔽罩8 1加以緊密。 於圖10顯示實現此之基板端部緊密手段94的實施形 態。基板端部緊密手段94係於罩體94Η的內部，爲了補 正陰蔽罩之彎曲而沿著基板，於上部2處，下部2處，設 置計4處之補正手段94Α〜94D。在計4處之補正手段 94A~94D中，將上部2處上部的彎曲，將下部2處下部的 -37- 201044666 彎曲’將右部2處右部的彎曲，並且將左部2處左部的彎 曲，各自進行補正。 圖1 1乃顯示補正手段94A〜94D之一實施形態的構成 圖’作爲代表而顯示94A。各手段構成均爲相同之故，各 構成要素的附加字（A〜D )係省略。補正手段94A係由測 定前述距離之測定感應部94K，和按壓基板保持器9 1之 按壓機構部94P，和以及密封真空之密封部94S所成。密 封部94S係由罩體94H，和設置於基板保持器91之密封 94sl、94s2，和連結此等之密封用伸縮管94sv所成。感 應部94K係由測定至陰蔽罩8 1爲止之距離的雷射距離計 94kr’和爲了確保光路而設置於基板保持器91之光路坑 94kh及光學視窗94kw所成。另一方面，按壓機構部（按 壓手段）94P係由基板保持器之按壓部94pp、於其按壓部 ，其前端可回動地安裝之按壓棒94pb、將其按壓棒移動 至前後之滾動螺旋94pn、螺帽94pt、驅動螺帽導件94pg 及滾動螺旋之伺服馬達94pm所成。 控制裝置60係依據來自雷射距離計94kr的檢測結果 ’按壓基板保持器91，將基板6沿著陰蔽罩81。作爲目 標間隙係例如作爲1 Ομιη以下。未成爲目標間隙以下時， 取4個間隙的平均而進行補正。 如根據上述實施形態之基板端部緊密手段，可高精確 地將基板沿著陰蔽罩所具有的彎曲，其結果，在基.板端部 中，未有膜模糊而可高精確地進行蒸鍍。 在上述實施形態中，在4處補正陰蔽罩之彎曲’但例 -38- 201044666 如上部的彎曲乃比較於目標間隙而爲小時，於上部中央， 設置一處即可。 另外，在上述實施形態中，將基板端部緊密手段94 與基板保持器91作爲一體化，但例如基板端部緊密手段 之感應部，如個別計測基板保持器與陰蔽罩之距離時，經 由此等的差，可測定基板與陰蔽罩間之距離之故，未必需 要作爲一體化。此情況，例如對於立起成略垂之基板保持 Ο 器91，將基板端部緊密手段94，於基板的上部具有旋轉 軸，從上部進行旋轉，沿著基板保持器91進行端部緊密 補正亦可。 更且，在上述實施形態中，將補正量由感應器測定基 板保持器與陰蔽罩之距離，但對於許多之陰蔽罩而言預先 測定前述距離，依據其統計的處理之距離，作爲補正量亦 可。 在以上的實施形態，亦可得到與詳細說明之實施形態 0 同樣的效果。 另外，在圖1 0所示之實施形態中，罩體9 4 Η內部係 如在基板旋轉手段93時所說明地，藉由第1連桿93L1而 加以開放於大氣側。其結果，伴隨著按壓，馬達等之粉塵 係排出大氣，未對於真空蒸鑛帶來不良影響。另外，因實 現將對於馬達之驅動線及來自感應部之信號線94f，藉由 罩體94H與第1連桿93 L1而連接於控制裝置之真空內配 線機構之故，未有經由來自配線之被覆材的排氣而產生真 空度下降之問題。更且，將前述罩體94H或前述連桿， -39- 201044666 由耐銹強，具有相當強度之金屬，例如不鏽鋼， 之故，亦未有排氣之產生。 隨之，如根據本實施形態，可保持高真空， 賴性高的蒸鍍處理。 以上說明之實施形態的基板端部緊密手段， 沿著陰蔽罩，但相反地亦可將陰蔽罩沿著基板。 圖12係顯示在基板端部緊密手段之第2實 校準部8的圖，圖13係顯示按壓陰蔽罩81的四 手段的圖。在圖12、圖13中，達成與第1實施 機能的構成，係附上相同的符號。 在圖12中，L字狀的補正手段罩體94H係 於陰蔽罩之4角（94A、94D係未圖示）將一端 陰蔽罩處，具有密封真空之圖13所示之密封部 另一端連接於大氣側之構造。 4個補正手段係基本上，具有相同構造之故 的補正手段爲例進行說明。在圖13中，與圖11 係於陰蔽罩設置光路坑94kh與光學視窗94kw 射距離計94kr係測定至基板保持器9 1爲止之距 和密封部94S係設置於補正手段罩體94H與陰 的點。對於其他的點，基本上係與圖1丨相同。 在本第2實施形態中，亦與第1實施形態相 ί寺高真空，可進行信賴性高的蒸鍍的處理。 另外，在上述說明中，以例說明過有機電激 ’但亦可適用於與有機電激發光裝置相同背景之 鋁而構成 可進行信 係將基板 施形態的 角之補正 形態相同 具有設置 ，在按壓 94 S，將 ’將上側 相異處， 的點，雷 離的點， 蔽罩之間 同，可保 發光裝置 進行蒸鍍 -40- 201044666 處理的成膜裝置及成膜方法。 另外’在上述說明中，以例說明過有機電激發光裝置 ’但亦可適用於與有機電激發光裝置相同背景之進行蒸鍍 處理的成膜裝置及成膜方法。 更且’上述校準機構係亦可適用於在大氣中所進行之 液晶顯示裝置等之校準。 〇 【圖式簡單說明】 圖1乃顯示本發明之實施形態之有機電激發光製造裝 置的圖。 圖2乃顯示本發明之實施形態之輸送室2與處理室1 之構成的槪要圖。 圖3乃顯示本發明之實施形態之輸送室與處理室之構 成的模式圖與動作說明圖。 圖4乃顯示本發明之實施形態的校準部之構成圖。 ^ 圖5乃顯示本發明之實施形態的陰蔽罩的圖。 圖6乃顯示本發明之實施形態的校準光學系統之基本 構成圖。 圖7乃顯示本發明之其他實施形態的校準光學系統之 基本構成圖。 圖8乃顯示本發明之實施形態的基板旋轉接近手段之 構成圖。 圖9乃顯示加上補正本發明之實施形態的陰蔽罩之彎 曲的補正手段之處理的動作流程圖。 -41 - 201044666 圖ι〇乃顯示本發明之實施形態的基板旋轉手段、基 板緊密手段及基板端部緊密手段的圖。 圖11乃顯示本發明之實施形態的補正手段之第1實 施形態圖。 圖1 2乃顯示具有本發明之實施形態的補正手段之第 2實施形態的校準部的圖。 圖1 3乃顯示本發明之實施形態的補正手段之第2實 施形態圖。 圖14乃說明以往技術（水平校準）之課題的圖。 圖1 5乃說明以往技術（經由反射型光學系統之校準 )之課題的圖。 【主要元件符號說明】 1 :處理室 lbu :真空蒸鍍室 2 :輸送室 3 :負載群組 6 :基板 6m :基板的校準標記 7 :蒸鍍部 8 :校準部 9 :處理遞送部 6 0 :控制裝置 7 1 :蒸發源 -42- 201044666 8 1 ·陰敝罩 81a〜d.旋轉支持部 8 1 m :陰蔽罩之校準標記 8 1 k :設置於陰蔽罩框體之貫通孔 8 2 :校準基底 83 :校準驅動部 8 3 Z : Z軸驅動部 〇 8 3 X : X軸驅動部 8 4 :校準傳動部 8 5 :校準光學系統 85as :遮蔽型支架 8 5 c :攝影機 8 5cm :攝影機側反射鏡 8 5 k :光源 8 5 k m :光源側反射鏡 ® 85r :粗校準光學系統 9 1 :基板保持器 9 3 :基板旋轉手段 93b :基板旋轉驅動部 93A :基板旋轉接近手段 93G :基板接近手段（93g :基板接近驅動部） 94 :基板端部緊密手段 94A-94D ：補正手段 94H :補正手段罩體 -43- 201044666 94K :測定感應部 94P :按壓機構部 94S :補正手段密封部 100:有機電激發光裝置之製造裝置 A~D :群組 -44 -In the embodiment of the calibrating unit described above, 'one of the four rotation support portions 81 is placed in the rotation support portion of the upper portion of the vacuum evaporation chamber, and one of the active directions in the Z direction is actively activated (actively driven). In the X-21 - 201044666 direction, the calibration of the mask is implemented. In addition to this, various driving methods can be cited. For example, at the upper portion 3, a rotation support portion is provided, and the rotation support portion at the center is rotated, and the left and right rotation support portions are actively or calibrated in the Z direction and the X direction. In the lower part, at least one transmission part is provided. Alternatively, in the same manner as in the above-described embodiment, two upper rotation support portions are provided, and one of them is rotated to concentrate the z-direction and the X-direction, and the other is also a method of transmission. Further, in the above embodiment, the upper portion is basically activated and the lower portion is used as a transmission, but this may be reversed. In the embodiment of the calibration unit 8, the calibration drive unit 83, the calibration transmission unit 84, and the calibration optical system 85 are provided on the atmosphere side of the upper portion or the lower portion of the vacuum deposition chamber 1bu, but may be provided in vacuum evaporation. The atmospheric side of the side wall of chamber 1 bu. Of course, it can also be dispersed in the upper part, the lower part and the side wall part. Next, an embodiment of the calibrating optical system 85 of the second feature of the present invention will be described. The calibration optical system of the present embodiment is capable of independently photographing each of the aforementioned calibration marks, from 4 precision calibration optical systems 8 5 s for 4 precision calibration marks 8 1 ms, and for 2 coarse calibration marks. In the case of 8 lmr, two coarse calibration optical systems are composed of six optical systems. The basic configuration of the six calibration optical systems is shown in FIG. The basic structure of the optical system is such that the nip cover 81' is disposed on the side of the calibration substrate 82, and the optical window 85ws is fixed to the upper portion 1T of the vacuum evaporation chamber lbu at the front end, and the light source 85k and the light irradiated by the optical window 85w are fixed. The light source side mirror 85 km of the blocking bracket 85 as described later in -22-201044666 is provided on the substrate 6 side, and is provided with a camera side mirror 85 cm attached to the holder 8 5 a of the camera housing tube 8 5 t, and stored in the camera. The camera 85c of the photographing means of the cylinder 85t has a so-called transmission type. The camera housing tube 85t, the holder 85a, and the like are not blocked by the track κ when the substrate is in the vertical posture, and can be moved to the position of the holder 85 5 a shown by the broken line via the bellows 8 5 v or the like. Because of the transmission type, the alignment mark 8 1 m of the through-hole of the four-corner shape is provided in the mask 81M, and the through-hole 81k of the same shape is also provided for the frame 8 1 F. On the other hand, the alignment mark 6ιη of the substrate 6 is a relatively small mark as a calibration mark 8 1 m which is a metallic quadrangular shadow mask over the light-transmitting substrate. When the through hole 81k is provided, the vapor deposition material enters the through hole at the time of vapor deposition, and is vapor-deposited on the calibration mark, so that calibration cannot be performed from the next process. In order to prevent this, at the time of vapor deposition, the vapor deposition material is shielded from entering the through hole 81k. In the present embodiment, the holder for providing the light source side mirror during the calibration is effective in the vapor deposition interruption during vapor deposition, and the holder is made movable, and the vapor deposition is shielded. A shield bracket 85as constructed of a hole 81k. The shield type bracket 8 5 as is extended and contracted by the drive motor (not shown) provided on the atmosphere side, and the upper and lower connecting rods 85b are stretched, and one end thereof is driven by the bellows 85v fixed to the seal portion 85s. The dotted line shown in Figure 6 shows the masked state, and the solid line shows the calibration state. Another embodiment is shown in FIG. As shown in Fig. 7 (a), the thickness of the frame body 81F of the yin-23-201044666 mask is sufficient, and the L-shaped through hole 81k is provided in the frame 8iF, and the light source 85k is simultaneously provided with the light source side mirror 85 km. It can also be hidden. In this case, the frame 8 I F itself functions as a shield, and a shield type bracket is not required. Further, as shown in Fig. 7 (b), at the time of calibration, the light source side mirror 85 km is not interrupted by the vapor deposition range, and the shield base bracket can be fixed on the calibration base 82, and can be often made. Shading the state. Further, as shown in Fig. 7 (b), on the camera side, the camera housing tube 8 51 is lengthened, and the light source side mirror may be housed in a distance of 85 km. Further, as shown in Fig. 7 (c), the light source side opening portion is fixed in a state where one end of the optical fiber 8H is shielded, and the other end is connected to the light source 85k provided on the atmosphere side. In the present embodiment, the light source of the heat generating body can be installed on the atmosphere side with a simple structure, and it is not necessary to provide a special shielding body. Further, for other purposes, the structure provided in the vacuum deposition chamber lbu is required to provide a shielding body when vapor deposition, and it is not necessary to provide a new shielding body. On the other hand, as shown in FIG. 4, the camera housing tube 85t has a structure protruding from the upper portion 1T of the vacuum vapor deposition chamber 1bu, and an optical window 8 5 w is provided at the distal end to maintain the camera 85 c on the atmosphere side. At the same time, the calibration marks 6 m, 8 1 m can be photographed (the symbol is referred to Fig. 6). Further, a light source is provided on the vapor deposition surface side, but a camera may be provided to change the position. The difference between the precision calibration optical system 85s and the coarse calibration optical system 85r is that the former has a narrow field of view for high-precision calibration, and -24-201044666 is a high-magnification lens that is calibrated with high-resolution photography for 8 5 h. Along with this, the dimensions of the alignment marks 6m and 81m of the substrate and the shadow mask shown in Fig. 3 are different. The field of view is precisely calibrated. Compared with the coarse calibration, it is less than one digit and can be calibrated at the μιη level. Accordingly, during the precision calibration, the movement of the alignment 81m of the shadow mask 81 is performed without leaving the field of view, and the precision calibration optical system 85s also has to follow the movement. The fixed cameras 85c and the fixed plates 85p and 〇 85ps of the light source 85k are connected to the z drive unit fixing plate 83k or the X-axis drive plate 84k to follow. Further, the rough calibration optical system 85r is provided with a position adjustment, and a camera position adjustment platform 85d is provided for initial adjustment. In the above embodiment, six calibration optical forms are used, and the accuracy required for calibration is obtained. There is no need to set a coarse calibration optical system, and for a precision calibration optical system, there are no need to use four, but coarse and precise, and at least two can be used. Next, an embodiment in which the substrate is raised and the substrate 6 is brought close to the shadow mask after the calibration is completed will be described before the calibration of the third feature of the present invention. The process delivery unit 9 shown in Fig. 3 has a comb-like hand 91 that can deliver the substrate 6 without interfering with the comb-like hand 58 of the transport robot 5, and is fixed on the comb-shaped hand 91. The substrate rotation means 93 for arranging the substrate 6 and rotating the substrate 6 and the substrate rotation approach means 93A formed by the substrate approach means 93G close to the calibration portion 8 are further provided. The means for fixing is a vacuum suction or a mechanical clamp, and is provided on the upper side 94u when at least the base - 25 - 201044666 is raised. FIG. 8 is a view showing the substrate rotation proximity means 9 3 A in detail, and shows a vacuum inner wiring and piping which is a problem of exhaust gas which is not provided with a wiring material such as wiring, or a fluid which is damaged by wiring fatigue. Applicable map of the organization. First, the substrate rotating means 93 of the substrate rotation approach means 93A will be described. The substrate rotating means 93 is a mounting table 93d on which the substrate 6 is placed, a cooling jacket 93j for cooling the substrate 6 during vapor deposition, and a substrate rotation driving portion 93b for integrally rotating the substrate 6, the mounting table 93d, and the cooling jacket 93j. The rotation support table 93k such as the cooling jacket 93j is rotatably supported. Cooling water pipes 43, 44 are applied to the cooling jacket 93j. Further, the substrate rotation driving unit 9.3b has a rotation motor 9 3 sm provided on the atmosphere side, and a first first link that is hollowed in the direction of the arrow A via the rotation motor 93sm by the gears 93hl and 93h2. 41 and the first link 41 are fixed to the hollow portion continuous with the hollow portion of the first link, and the second link 42 is provided along the side surface portion of the cooling jacket 93j. However, the first link is attached to the seal portion 93 S provided on the side wall of the vacuum vapor deposition chamber 1 bu, and the extension tube 93v having the fixed end is interposed therebetween, and is rotatably supported via the rotation support table 93k. However, the rotation motor 93 sm is controlled by the control device 60 provided on the atmospheric side. In the above, when the substrate 6 which is provided by the fixing means 94u on the upper portion of the substrate is supported by the fixing means 94 shown in Fig. 3, the substrate 6 is bent and bent by its own weight. After the bending is digested, the fixing means 94d provided on the lower portion of the substrate may be fixed. In addition, when the substrate 6 is vertically erected, there is a possibility that a slight gap is generated between the substrate 6 and the mounting table 93d, for example, at a degree of 1 degree, and how many tilts are stably placed, These benders can be reliably eliminated. In the present embodiment, since the substrate vapor deposition surface is formed as an upper surface and transported, the substrate 6 can be directly calibrated if it is raised. Next, the substrate approach means 93G will be described. The substrate approaching means 93G (substrate approaching drive unit 93g) has a fixed substrate rotation drive swaying portion 93b, and moves the rotation drive unit mounting table 93t on the rail 93r in the direction of the arrow B, and rotates the drive unit mounting table 93t. The proximity motor 93dm is driven by the rolling screw 9 3η. By controlling such a mechanism via the control device 60, the substrate 6 is brought close to the shadow mask 81, and if necessary, it can be tight. According to the above embodiment, the bending of the substrate can be eliminated at the time of vapor deposition. In addition, the distance between the substrate and the shadow mask can be kept, and the substrate can be calibrated. After the substrate is brought close to or close to the shadow mask, the vapor deposition can be reduced, and the vapor deposition can be performed with high precision. . Further, the "substrate rotation approach means 93A" has a problem of a vacuum inner wiring and a piping mechanism which is a problem of exhaust gas which is not provided with wiring material, or a fluid which is damaged by wiring fatigue. In the vacuum inner wiring, the piping mechanism 40 is configured by the first link 41 and the second link 42. The hollow portion is configured to supply the cooling water to the cooling jacket 93j, and the supply 43 and the recovery 44 are disposed. Cooling water piping. Each of the links is made of a metal having a high strength against rust, such as stainless steel or aluminum, and the motor 93 sm side of the hollow portion of the first link 41 is opened to the atmosphere -27-201044666. The two cooling water piping systems are generally composed of a material having flexibility which is used in the atmosphere, or are made of a metallic material, and have no flexible portion in the connecting rod, and the piping is formed by the first connecting rod 4 1 and the second link 42 are formed in an L shape, and the flexible portion is provided on the air side. If the latter is used, it can constitute a pipe with less fatigue damage. Further, in the case where the cooling water leaks from the cooling water pipes 43, 44, it can be drained to the atmosphere side, and the connection portion of the side wall of the vacuum vapor deposition chamber 1b is lower than the connection portion of the cooling jacket 93j. According to the vacuum inner wiring/pipe mechanism 40 of the present embodiment, the one end is opened to the atmosphere, the multi-end is connected to the hollow portion of the link mechanism of the moving portion, and the pipe is provided, and the rotating portion of the link mechanism is vacuum-sealed. Since the vacuum side is completely blocked, even if there is water leakage from the cooling water pipe, water leakage to the vacuum side is not caused, and it is not necessary to make the hollow portion of the link mechanism vacuum. Further, since the link mechanism is made of stainless steel or aluminum, the generation of exhaust gas is small. In addition, the wiring and the piping mechanism in the vacuum constitute a part of the substrate rotation driving unit, and can be simply formed as a whole. In the above-described example, there is an example in which the piping is laid on the connecting rod. However, even if the signal line is wired in the connecting rod, it is possible to provide a configuration in which the exhaust gas generated from the signal line is not generated in the vacuum. Accordingly, it is possible to maintain a high vacuum and perform a vapor deposition process with high reliability. Next, the processing operation of the vacuum vapor deposition chamber having the calibration unit 8, the calibration optical system 85S, and the substrate rotation approach means 93A described above will be mainly described with respect to the calibration operation. Hereinafter, a flow chart of the processing -28 - 201044666 after the substrate is input to the vacuum evaporation chamber 1 bu is shown. (1) First, the upper portion of the substrate 6 input to the R line shown in Fig. 3 is fixed to the substrate stage, and then erected vertically to be bent and bent. (2) A coarse calibration is performed via a coarse calibration mark from a state in which the substrate 6 is separated by a certain distance, and a positional deviation at the position of the rough calibration is detected to obtain a coarse correction amount. (2) The coarse position adjustment is performed by moving the shadow mask 81 on the ZX plane shown in Fig. 4 in accordance with the rough correction amount. (3) By maintaining a certain distance and performing precision calibration with a precision calibration mark, the positional deviation in the precision calibration is detected to obtain a precise correction amount. (4) According to the precision correction amount, the shadow mask 81 is moved in the ZX plane shown in Fig. 4 to perform precise position adjustment. (5) The compact substrate 6 and the shadow mask 81. (6) Test (3) calibration result (position offset). (7) If the positional shift amount is within the allowable range, the vapor deposition of the substrate of the L line shown in Fig. 3 is waited for. (8) After the vapor deposition of the L line is completed, the evaporation source 71 is moved on the R line to perform vapor deposition. (9) In (7), if the positional shift amount is outside the allowable range, the two are temporarily separated, and return to (3) for fine calibration.上述In the above, the position adjustment of the coarse calibration is performed by two cameras 85c, and is disposed on the substrate 6, as shown in the guide diagram of FIG. 3, and the calibration marks 81 mr, 6mr of the photographic mask 81 and the substrate 6 are shown. , adjust the intermediate point of the two calibrations to the base position. On the other hand, the precision calibration is performed near the four corners of the substrate, and four calibration marks are provided to correct the center point of the substrate as a reference. In theory, 4 is too much information for the case of two fundamental decisions. This is based on the information of the four corners, and the offset of the four corners is minimized. When the center point of the substrate is determined to be centered, the offset between the substrate 6 and the shadow mask 81 is reduced, and the product can be made large in order to obtain a large size. -29 201044666 Effective use of the area. When the upper midpoint is made into a reference as in the rough calibration, the offset on the lower side becomes large, and the area available as a product becomes small. According to the present embodiment described above, an organic electroluminescence manufacturing apparatus which can be calibrated by making the substrate and the shadow mask perpendicular or vertically perpendicular to each other can be provided. As a result, it is possible to eliminate the influence of the bending of the self-weight via the substrate or the shadow mask, to eliminate the positional deviation, or to blur the film through the inaccessible substrate and the shadow mask, thereby enabling high-precision evaporation and high fabrication. An organic electroluminescence manufacturing device for a wonderful substrate. Further, according to the present embodiment, in the mechanism necessary for the calibration, the generation of the driving device in the atmosphere suppresses the generation of dust or gas, and further reduces the vapor deposition by dust or gas, thereby providing high productivity. Organic electroluminescence excitation device. Further, according to the present embodiment, in the mechanism necessary for the calibration, a mechanism for providing a driving device or a heat generating device, or a plurality of components for calibrating the optical system in the atmosphere can provide a good maintainability and a high rate of organic electricity. Excitation light manufacturing device. Further, it is possible to provide a calibrator having a substrate as a center, and as a product, it is possible to carry out vapor deposition with a high effective area, that is, an organic electroluminescence light-producing device having a high yield, that is, high productivity. Further, according to the above embodiment, it is possible to provide an organic electroluminescence light-producing device which can reliably detect the reliability of the substrate and the shadow mask by using the calibration mark as the transmission type. The embodiment described so far is an embodiment in which the substrate 6 and the shadow mask 81 are erected and erected and then held in an upright state to be vapor-deposited. It is not necessary that -30-201044666 needs to be vapor-deposited from the standing state, and when the mechanism for delivering the female mask to the substrate side is attached, the state of the calibration is maintained, and the level is temporarily set, and then vapor deposition may be performed. For example, the first method is a method of performing vapor deposition from the upper portion via the substrate rotating means 93 shown in Fig. 8 again. As a second method, one of the two processing lines shown in Fig. 3 is used as a calibration dedicated line (for example, an R line), and the other line (OL line) is used as a dedicated line for vapor deposition. After the R line is calibrated, it is moved to the L line via the transfer robot 5. Thereafter, the substrate rotating means 93 provided on the L line is rotated at 180 degrees to perform vapor deposition from below. In this method, how much processing time is required, but it is also possible to perform processing on the sides of the calibration dedicated line by setting a dedicated evaporation line. In the embodiment in which the vapor deposition is performed at the above-described level, the same effects as those of the embodiment in which the vapor deposition is performed in the standing state can be obtained. 〇 In the embodiment described above, the case where the substrate is horizontally transported to the processing and delivery unit has been described. However, the substrate may be transported vertically and then calibrated. Further, according to the present embodiment, it is possible to provide an organic electroluminescence light-producing device which can be installed in the atmosphere in a mechanism which is required for calibration and which cannot be installed in a vacuum. Further, the above calibration mechanism can also be applied to calibration of a liquid crystal display device or the like performed in the atmosphere. Further, it is possible to provide a calibrator which implements the substrate as a center, and as a product of -31 - 201044666, it is possible to carry out vapor deposition with high effective area, that is, a high yield, that is, an organic electroluminescence light-emitting device. Further, according to the above embodiment, it is possible to provide a reliable electroluminescence manufacturing apparatus which can reliably detect a substrate and a shadow mask by being calibrated. In the embodiment described so far, the substrate 6 and the shadow mask are calibrated, and then the erected state is maintained, and the vapor deposition is performed by vapor deposition in a standing state, and the mechanism for attaching the substrate to the substrate is added. It is also possible to perform the vapor deposition after the temporary preparation. For example, the first method is again performed horizontally by the substrate substrate rotating means 93, and is performed from the upper portion. As a second method, the two processing lines shown in Fig. 3 are used as a calibration dedicated line (e.g., R line) and the other L line) as a vapor deposition dedicated line. After the R line is advanced, it is moved to the L line via the transfer robot 5. Thereafter, the substrate rotating means 9 3 of the L line is subjected to a 180 degree rotation and a vapor deposition method. In this method, how much processing time is required, and both sides of the dedicated line are calibrated, and the dedicated line for vapor deposition is set, the operator. The embodiment in which the vapor deposition is performed at the above-described level is also similar to the embodiment in which the vapor deposition is performed in the standing state. In the embodiment described above, the case where the substrate is sent to the processing and delivery portion has been described, but the substrate is transported vertically, and the productivity index is high. It is not necessary to deliver the hood to the horizontal, one of the vapor-deposited sides shown in Fig. 8 (the calibration is performed, the setting is performed from the bottom, but it can also be obtained from the mutual execution. In the embodiment described above, the calibration is performed in the upright state, but the calibration mark is used as the transmission type, and in order to perform vapor deposition, the shielding structure is provided to set the calibration optical system. The atmospheric side, in addition, the calibration optical system is followed by the calibration mask of the shadow mask or the substrate, setting four calibrations, adjusting the center position and position of the substrate to the reference, etc., and is also suitable for horizontal calibration. A method or a structure. Next, an embodiment of a substrate end compacting means for correcting the curvature of the shadow mask of the fourth feature of the present invention will be described. Fig. 9 shows the input substrate to the vacuum evaporation chamber lbu described above. The processing flow chart further shows a processing flowchart of the process of correcting the bending of the shadow mask. In the present embodiment, as shown in FIG. 9, even if the substrate size is large, the base is large. The gap between the mask and the shadow mask is vapor-deposited. First, (1) the substrate is input to the processing and delivery portion 9, and then (2) the substrate is raised to be slightly vertical 'then' (3) The substrate 6 is approached from the shadow mask 81 to a distance of a certain distance 'for example, 0. At a position of 5 mm, (4) the gap with the substrate bent through the shadow mask is corrected, and (5) the state is calibrated. After the completion of the calibration, (6) the compact substrate 6 and the shadow mask 81, (7) vapor-deposited the vapor deposition material on the substrate. After the vapor deposition is completed, (8) the substrate 6 is lifted from the shadow mask 81 by a certain distance '(9), and (4) is corrected, and (1) is used to deliver the substrate and other levels [11) from the process. The portion 9 outputs a substrate. In the above steps, step (4) is carried out before the calibration of (5), but it may be carried out after the calibration or after the step (6). In addition, after the step (8) -33- 201044666, the step (9) is carried out. , but can also be implemented before (8). Therefore, the configuration and operation of the steps (2) to (6) and (8) to (10) in the above-described steps of the present embodiment will be described in order. Fig. 10 is a view showing the substrate rotating means 93 for realizing (2) (10), the substrate approaching means 93G for realizing (3) (6) (8), and the substrate end portion of the realization (4) (9) among the above steps. A diagram of the processing delivery unit 9 shown in FIG. 3 of the close means 94 is shown, and a diagram showing a vacuum internal wiring mechanism for applying an exhaust problem of the covering material from the wiring is shown. First, the substrate rotating means 93 for realizing (2) and (10) will be described using Fig. 10 . The substrate rotating means 93 is a substrate holder 91 that mounts and holds the substrate 6 that is input to the processing and delivery unit 9, the substrate 6, and a substrate end closer means 94, which will be described later, and is vertically vertical before being integrally calibrated. After the calibration is completed, it has the function of returning to a horizontal state. The means for fixing as described above is considered to be in the case of vacuum, and is constituted by electrostatic suction or mechanical clamp or the like. In FIG. 10, the substrate rotating means 93 is a vacuum inner wiring link mechanism 92L which is substantially rotated by the substrate 6 to be rotated, the substrate end tight means 94, and the rotating portion of the substrate holder, and the rotating object. The direction of the arrow A is formed by the substrate rotation driving unit 93b that is rotationally driven by the above mechanism. The vacuum inner wiring link mechanism 93L is formed by the first link 93L1 and the second link 93 L2, and the seal portion 93S which is separated from the vacuum side and maintained in the atmosphere. The first link 93L1 has one end supported by the rotation support table 93k, and the other end is connected to the substrate end portion -34 - 201044666 tight means 94, which will be described later, and has a hollow portion. The second link 93 L2 is provided on the opposite side of the first link 913 L1 from the substrate end closer means 94, and has one end similar to the first link 913L1, and has a hollow portion. The ground end is connected to the substrate end tight means 94, and the other end is connected to the support portion 1 1 A provided in the spacer 11 shown in FIG. The sealing portion 913S has a connecting portion that connects one end to the substrate end close means, and the other end is connected to the side wall of each vacuum vapor deposition chamber lbu, and the first sealing portion 93S1 of the support portion 1 1A. And the second sealing portion 93S2. Each of the seal portions 93S1 and 93S2 has a telescopic tube 93Sv1 and 93Sv2 that connect the respective ends, and the connection portion on the side of the substrate end portion close means 94 of each of the seal portions 93S1 and 93 S2 rotatably supports the first link 93L1 and The second link 93L2. In the above embodiment, in order to lay the wiring 94f in the connecting rod, the inside of the connecting rod is made hollow, but the sealing portion 93S is configured to include the respective links, and is connected to the connecting rod and the vacuum sealing portion. Between, laying wiring can also be 〇w. In this case, it is not necessary to make the connecting rod hollow. On the other hand, the substrate rotation driving unit 93b includes a rotation motor 93sm provided on the atmosphere side, and a rotation motor 93sm that transmits rotation to the gears 93hl and 93h2 of the first link 93L1, and supports the first link. A rotation support table 93k at one end of L1. However, the rotation motor 93 sm is controlled by the control device 60 provided on the atmosphere side. In addition, in Fig. 10, the R line of the vacuum distillation chamber lbu is used, and the spacer 1 1 shown in Fig. 1 is used as the center of the surface object, and the same structure is also disposed on the L line. Accordingly, the first link 93L1 of the R line, the end portion of the substrate is tight -35 - 201044666, the dense means 94, the second link 93L2, and the first link 93L1 of the L line, the substrate end close means 94, and the second link The hollow portion of 93 L2 is a structure that is connected to the atmosphere by the support portion 1 1 A provided in the partition portion 1 1 . The second link 93 L2 is not necessarily required to be hollow. However, as will be described later, the second link 9 3 L 2 needs to move to the B direction shown in FIG. 1 in the hollow portion of the partition portion 1 1 . Dust may appear in the moving portion to form a part of the hollow portion of the support portion 11A as a structure connected to the atmosphere. In the above, when the substrate 6 is erected vertically, a slight gap may occur between the substrate 6 and the substrate holder 91. For example, the degree of tilting is stably placed at a distance of 1 degree, and the substrate is passed through the substrate. Its own weight can reliably eliminate the bending of the substrate. In the present embodiment, the substrate vapor deposition surface is formed as an upper surface and transported. If the substrate 6 is raised, the above calibration can be directly performed. Secondly, the configuration and operation of the calibration for achieving the step (5) have been described with reference to Fig. 4, and the description thereof is omitted here. Next, the configuration and operation of the substrate approaching means 93G of the substrate (6) (6) and (8) which are close (3) (6) and (8) will be described with reference to Fig. 10. When the substrate approaching means 93G moves back and forth in the direction of the arrow B in the entire direction of the arrow B, the substrate 6 is brought close to the predetermined distance from the first to the shadow mask 81, and then the battery is returned to the original position by steaming the money. . Therefore, the substrate approaching means 9 3 G (substrate approaching drive unit 93g) includes a rotary drive unit mounting table 93t on which the substrate rotating means 93 is placed, a track 93r for operating the rotary drive unit mounting table 93t, and a rolling spiral 93η is driven to drive the rotary drive unit mounting table 93t to be close to the horse-36-201044666 up to 93m. In the hollow portion of the partition portion 11, the second link 93L2 of the substrate rotating means 93 is moved to the track (not shown) in the B direction in accordance with the operation of the rotation driving portion mounting table 93t. Although it is a track, its length is about 2mm. The substrate 6 can be brought close to, tightly and detached from the shadow mask 81 by a mechanism controlled by the control device 60. According to the above embodiment, the bending of the substrate can be eliminated at the time of vapor deposition. Ο In addition, keep the substrate and the shadow mask untouched, for example, 0. At the same time as 5mm, it can be calibrated. After the substrate is tightly attached to the shadow mask, the blur in the vapor deposition can be reduced, and the vapor deposition can be performed with high precision. Finally, using FIG. 1A, a substrate end tight means 94 for achieving a tighter gap with the curved substrate via the shadow mask of (4)(9) will be described. Even if the substrate 6 is tightly attached to the shadow mask 81 via the substrate approaching means 93G, as shown in FIG. 11, the curvature of the shadow mask 81 is provided in the substrate end portion in the vapor deposition range and the shadow mask 81. There are also gaps of several tens of μm. Therefore, in the present embodiment, the distance between the substrate holder 91 and the shadow mask is measured, and the periphery of the outer surface of the end portion of the substrate holder 91 is pressed, and the gap between the substrate 6 and the shadow mask 81 is corrected. The substrate 6 is tightly packed along the shadow mask 8 1 . The embodiment of the substrate end compacting means 94 for accomplishing this is shown in FIG. The substrate end tight means 94 is attached to the inside of the cover 94, and the correction means 94A to 94D are provided at the upper portion 2 and the lower portion 2 along the substrate in order to correct the bending of the shadow mask. In the correction means 94A to 94D of the fourth place, the upper portion is bent at the upper portion, the lower portion of the lower portion of the lower portion of the -37-201044666 is bent, and the right portion 2 is bent at the right portion, and the left portion 2 is at the left portion. The curvature is corrected and each is corrected. Fig. 11 shows the configuration of one embodiment of the correcting means 94A to 94D. Fig. 11 shows a representative of 94A. The configuration of each means is the same, and the additional words (A to D) of the respective constituent elements are omitted. The correction means 94A is formed by the measurement sensing unit 94K for measuring the distance, the pressing mechanism portion 94P for pressing the substrate holder 9 1 , and the sealing portion 94S for sealing the vacuum. The sealing portion 94S is formed of a cover 94H, seals 94s1 and 94s2 provided in the substrate holder 91, and a sealing telescopic tube 94sv connected thereto. The sensing portion 94K is formed by a laser distance meter 94kr' which measures the distance from the shadow mask 8 1 and an optical path pit 94kh and an optical window 94kw which are provided in the substrate holder 91 to secure the optical path. On the other hand, the pressing mechanism portion (pressing means) 94P is a pressing portion 94pp of the substrate holder, and a pressing rod 94pb that is rotatably attached to the front end of the pressing portion, and a pressing screw 94p that moves the pressing rod to the front and rear. , the nut 94pt, the drive nut guide 94pg and the rolling screw servo motor 94pm. The control device 60 presses the substrate holder 91 in accordance with the detection result from the laser distance meter 94kr, and the substrate 6 is placed along the shadow mask 81. The target gap is, for example, 1 Ομηη or less. When it is not below the target gap, the average of the four gaps is taken and corrected. According to the substrate end compacting means according to the above embodiment, the substrate can be bent with high precision along the shadow mask, and as a result, in the base. In the end portion of the plate, vapor deposition can be performed with high precision without film blurring. In the above embodiment, the bending of the shadow mask is corrected at four places. However, the bending of the upper portion is smaller than the target gap, and one portion is provided at the center of the upper portion. Further, in the above-described embodiment, the substrate end portion fastening means 94 and the substrate holder 91 are integrated, but for example, when the sensing portion of the substrate end portion close means is measured by the distance between the substrate holder and the shadow mask, Such a difference can measure the distance between the substrate and the shadow mask, and does not necessarily need to be integrated. In this case, for example, the substrate holding device 91 is erected slightly, and the substrate end portion close means 94 has a rotating shaft on the upper portion of the substrate, rotates from the upper portion, and closely corrects the end portion along the substrate holder 91. can. Further, in the above-described embodiment, the distance between the substrate holder and the shadow mask is measured by the sensor from the amount of correction. However, the distance is measured in advance for many of the shadow masks, and the correction is based on the statistical processing distance. The amount is also OK. Also in the above embodiment, the same effects as those of the embodiment 0 described in detail can be obtained. Further, in the embodiment shown in Fig. 10, the inside of the cover body 94 is opened to the atmosphere side by the first link 93L1 as described in the case of the substrate rotating means 93. As a result, dust such as a motor is discharged to the atmosphere with the pressing, and this does not adversely affect the vacuum distillation. Further, since the driving line for the motor and the signal line 94f from the sensing portion are connected to the vacuum internal wiring mechanism of the control device by the cover 94H and the first link 93 L1, the wiring is not provided via the wiring. The exhaust of the coated material causes a problem of a decrease in the degree of vacuum. Further, the cover 94H or the aforementioned link, -39- 201044666, is made of a metal having a strong strength and a relatively strong strength, such as stainless steel, and there is no generation of exhaust gas. Accordingly, according to the present embodiment, it is possible to maintain a high vacuum and a high vapor deposition treatment. The substrate end portion of the embodiment described above is closely spaced along the shadow mask, but conversely the shadow mask may be along the substrate. Fig. 12 is a view showing the second solid aligning portion 8 at the end of the substrate, and Fig. 13 is a view showing four means for pressing the hood 81. In Figs. 12 and 13, the configuration of the first embodiment is achieved by the same reference numerals. In Fig. 12, an L-shaped correction means cover 94H is attached to the four corners of the female cover (94A, 94D are not shown), and one end of the cover is provided, and the seal portion shown in Fig. 13 having a vacuum is sealed. A structure in which one end is connected to the atmosphere side. The four correction means are basically described as an example of a correction means having the same structure. In Fig. 13, the distance between the projection cover optical path pit 94kh and the optical window 94kw transmission distance 94kr is measured to the substrate holder 91, and the sealing portion 94S is provided in the correction means cover 94H and the yin. Point. For other points, basically the same as Figure 1丨. In the second embodiment, it is also possible to perform a high-reliability vapor deposition process in accordance with the first embodiment. Further, in the above description, the organic electro-excitation is described by way of example, but it is also applicable to the aluminum having the same background as that of the organic electroluminescence device, and is configured to have the same shape of the correction of the angle at which the substrate can be applied. Pressing 94 S, the film forming device and film forming method of the process of vapor deposition -40- 201044666 can be maintained by the same point of the difference between the upper side, the point of the deviation, and the mask. Further, in the above description, the organic electroluminescence device is described by way of example, but it is also applicable to a film formation apparatus and a film formation method which perform vapor deposition treatment in the same background as the organic electroluminescence device. Further, the above calibration mechanism can also be applied to calibration of a liquid crystal display device or the like performed in the atmosphere. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing an apparatus for manufacturing an organic electroluminescence light according to an embodiment of the present invention. Fig. 2 is a schematic view showing the configuration of the transfer chamber 2 and the processing chamber 1 according to the embodiment of the present invention. Fig. 3 is a schematic view and an operation explanatory view showing the configuration of a transfer chamber and a processing chamber according to an embodiment of the present invention. Fig. 4 is a view showing the configuration of a aligning unit according to an embodiment of the present invention. Fig. 5 is a view showing a shadow mask according to an embodiment of the present invention. Fig. 6 is a view showing the basic configuration of a collating optical system according to an embodiment of the present invention. Fig. 7 is a view showing the basic configuration of a collating optical system according to another embodiment of the present invention. Fig. 8 is a view showing the configuration of a substrate rotation approaching means according to an embodiment of the present invention. Fig. 9 is a flow chart showing the operation of a process for correcting the bending of the shadow mask of the embodiment of the present invention. -41 - 201044666 Fig. 1 is a view showing a substrate rotating means, a substrate tight means, and a substrate end tight means according to an embodiment of the present invention. Fig. 11 is a view showing a first embodiment of a correction means according to an embodiment of the present invention. Fig. 12 is a view showing a calibration unit according to a second embodiment of the correction means according to the embodiment of the present invention. Fig. 13 is a view showing a second embodiment of the correction means according to the embodiment of the present invention. Fig. 14 is a view for explaining the problem of the prior art (horizontal calibration). Fig. 15 is a view showing the problem of the prior art (calibration via a reflective optical system). [Description of main component symbols] 1 : Processing chamber lbu : Vacuum evaporation chamber 2 : Transfer chamber 3 : Load group 6 : Substrate 6 m : Calibration mark 7 of substrate : Vapor deposition portion 8 : Calibration portion 9 : Process delivery portion 6 0 : Control device 7 1 : Evaporation source - 42 - 201044666 8 1 · Shadow cover 81a ~ d. Rotary support portion 8 1 m : calibration mark 8 1 k of the shadow mask: through hole 8 2 provided in the shadow mask frame: calibration base 83: calibration drive portion 8 3 Z : Z-axis drive portion 〇 8 3 X : X-axis drive unit 8 4 : Calibration drive unit 8 5 : Calibration optical system 85as : Shield type bracket 8 5 c : Camera 8 5cm : Camera side mirror 8 5 k : Light source 8 5 km : Light source side mirror ® 85r : Thick Calibration optical system 9 1 : substrate holder 9 3 : substrate rotation means 93b : substrate rotation drive unit 93A : substrate rotation approach means 93G : substrate approach means (93g : substrate proximity drive unit) 94 : substrate end close means 94A - 94D : Correction means 94H : Correction means cover - 43 - 201044666 94K : Measurement sensing part 94P : Pressing mechanism part 94S : Correction means Sealing part 100 : Manufacturing apparatus of organic electroluminescence device A - D : Group - 44 -