KR20210058697A - Alignment apparatus, alignment method, film forming apparatus, film forming method, and manufacturing method of electronic device - Google Patents

Abstract

An objective of the present invention is to make high-precision alignment possible even if the optical axis of a mark photographing means is inclined with respect to a surface parallel with a mask. An alignment apparatus relatively moves a mask stage holding a mask and a substrate stage holding a substrate to align the substrate and the mask and comprises: a mark photographing means photographing a substrate-side mark formed on the substrate and a mask-side mark formed on the mask; and a control means determining a movement amount for relatively moving the substrate stage and the mask stage based on image information obtained by the mark photographing means, optical axis inclination information of the mark photographing means, and gap information between a surface of the substrate and a surface of the mask.

Description

An alignment apparatus, an alignment method, a film forming apparatus, a film forming method, and a manufacturing method of an electronic device TECHNICAL FIELD [ALIGNMENT APPARATUS, ALIGNMENT METHOD, FILM FORMING APPARATUS, FILM FORMING METHOD, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE]

The present invention relates to an alignment apparatus for aligning a substrate and a mask, an alignment method, a film forming apparatus, a film forming method, and a method for manufacturing an electronic device.

As a conventional alignment method, one as described in Patent Document 1 is known, for example. In this patent document 1, the measurement of the positional deviation of the relative position of the substrate and the mask in the plane direction is performed by using an alignment mark (substrate-side mark) formed on the substrate and an alignment mark (mask-side mark) formed on the mask. It is carried out by photographing with a camera (mark photographing means) from a direction orthogonal to.

Patent Document 1: Japanese Patent Laid-Open Publication No. 2010-67705

However, when the optical axis of the optical system of the camera that photographs the alignment mark is inclined with respect to a plane parallel to the mask or the substrate, the mask may appear to match the positions of the substrate-side mark and the mask-side mark on the display of the camera. The positions of the substrate-side mark and the mask-side mark orthogonally projected on the surface are shifted. Hereinafter, this positional shift is referred to as a shift due to the optical axis angle. In attempting to increase the precision of the pixel pattern to be formed, the shift due to the angle of the optical axis cannot be ignored.

From this point of view, Patent Document 1 corrects an error that can be confirmed in an image of an alignment camera, and does not take into account a shift due to an optical axis angle that cannot be confirmed in an image of an alignment camera.

In addition, since it is considered to prepare an error table in advance using the measurement result of the evaluation substrate as a method of correction, the influence of the thickness error of the substrate cannot be taken into account when a substrate having a different thickness is entered each time.

The present invention has been made to solve the problems of the prior art, and even if the optical axis of the mark photographing means is inclined with respect to a surface parallel to the mask, an alignment device capable of high-precision alignment, an alignment method, a film forming device, and a film forming device. It is an object of the present invention to provide a method and a method of manufacturing an electronic device.

In order to achieve the above object, the present invention,

An alignment device for aligning the substrate and the mask by relatively moving a substrate stage for holding a substrate and a mask stage for holding a mask,

A mark photographing means for photographing a substrate-side mark formed on the substrate and a mask-side mark formed on the mask,

Based on image information obtained by the mark photographing means, optical axis inclination information of the mark photographing means, and gap information between the surface of the substrate and the surface of the mask, a movement amount for relative movement of the substrate stage and the mask stage is determined. It characterized in that it comprises a control means.

In addition, the alignment method of the present invention,

Place the substrate and the mask so that they can be moved relative to each other,

A substrate-side mark formed on the substrate and a mask-side mark formed on the mask are photographed by a mark photographing means,

Image information of a mark photographed by the mark photographing means;

Optical axis inclination information of the mark photographing means,

Using the gap information between the surface of the substrate and the surface of the mask,

It characterized in that the relative movement of the substrate and the mask.

In addition, the film forming apparatus of the present invention,

In a vacuum container, a mask is superimposed on a substrate or held in close proximity, and a film forming apparatus is formed by depositing a film forming material on the surface of the substrate not covered by the mask,

An alignment device for aligning the substrate and the mask by relatively moving a substrate stage for holding the substrate and a mask stage for holding the mask,

A mark photographing means for photographing a substrate-side mark formed on the substrate and a mask-side mark formed on the mask,

Based on image information obtained by the mark photographing means, optical axis inclination information of the mark photographing means, and gap information between the surface of the substrate and the surface of the mask, a movement amount for relative movement of the substrate stage and the mask stage is determined. It is characterized in that it is provided with an alignment device having a control means to perform.

In addition, the film forming method of the present invention,

A film-forming method in which a film-forming material is deposited on a surface of the substrate that is not covered by the mask while holding a mask over or close to a substrate in a vacuum container,

Arranging the substrate and the mask to be relatively movable,

A substrate-side mark formed on the substrate and a mask-side mark formed on the mask are photographed by a mark photographing means,

Image information of a mark photographed by the mark photographing means;

Optical axis inclination information of the mark photographing means,

Using the gap information between the surface of the substrate and the surface of the mask,

It is characterized in that it is carried out by an alignment method in which the substrate and the mask are moved relative to each other.

In addition, the electronic device manufacturing method of the present invention,

It is characterized by forming a film on a substrate of an electronic device by the above film forming method.

According to the present invention, even if the optical axis of the mark photographing means is inclined with respect to a surface parallel to the mask and the substrate, the deviation due to the optical axis angle (the deviation between the substrate side mark and the mask side mark orthogonally projected on the mask surface) can be corrected Therefore, high-precision alignment becomes possible.

1 is a schematic diagram of a film forming apparatus including an alignment device according to the present invention.
2 is a plan view of a fine moving stage mechanism.
3 is a partial cross-sectional view of a fine moving stage mechanism.
4 is a schematic diagram of an alignment device.
5 is a schematic explanatory diagram of an optical axis tilt detection means.
6 is a schematic explanatory diagram of mark gap detection means.
7 is a diagram showing a basic sequence of an alignment process.
8 is a schematic configuration diagram of a film forming apparatus for explaining a sequence.
9 is an explanatory diagram of a process of a sequence.
10 is an explanatory diagram of a process of a sequence.
11 is a detailed flowchart of the second alignment process.
12 is an explanatory diagram of a process in a flowchart.
13 is an explanatory diagram of a positional shift between a substrate-side mark and a mask-side mark.
14 is a diagram illustrating an example of an electronic device.

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. However, the following embodiments are merely illustrative of preferred configurations, and the scope of the present invention is not limited to these configurations. In the following description, the configuration of the apparatus, the processing procedure, the material, the shape, and the like are not intended to limit the scope of the present invention only to these, unless otherwise specifically limited.

The alignment device according to the present invention can be applied to a device that deposits various materials on the surface of a substrate to perform film formation, and in this embodiment, it is applied to a device that forms a thin film (material layer) of a desired pattern by vacuum evaporation. It can be applied preferably.

As the material of the substrate, any material such as a semiconductor (eg, silicon), glass, a film made of a polymer material, or a metal can be selected, and the substrate is, for example, a silicon wafer or polyimide on a glass substrate. It may be a substrate on which films such as are laminated. Further, as the film forming material, an arbitrary material such as an organic material and a metallic material (metal, metal oxide, etc.) can be selected.

In addition, in this embodiment, it can be applied to a film forming apparatus including a sputtering apparatus and a CVD (Chemical Vapor Deposition) apparatus in addition to the vacuum vapor deposition apparatus. The technology of this embodiment is specifically applicable to various electronic devices such as semiconductor devices, magnetic devices, and electronic parts, and manufacturing apparatuses such as optical parts. As a specific example of an electronic device, a light-emitting element, a photoelectric conversion element, a touch panel, etc. are mentioned. This embodiment can be preferably applied to an apparatus for manufacturing an organic light-emitting element such as an OLED or an organic photoelectric conversion element such as an organic thin-film solar cell, among others. In addition, the electronic device in this embodiment is a display device (for example, an organic EL display device) equipped with a light-emitting element, a lighting device (for example, an organic EL lighting device), and a sensor provided with a photoelectric conversion element. It also includes (for example, an organic CMOS image sensor).

First, a schematic configuration of a film forming apparatus 11 provided with an alignment device according to the present embodiment will be described with reference to FIG. 1. In the following description, an XYZ Cartesian coordinate system in which the vertical direction (the vertical direction of the paper) is the Z direction and the horizontal plane (the surface perpendicular to the vertical direction of the paper) is the XY plane is used. Also shows the rotation angle around the X-axis the angle of rotation around the θ _X, Y-axis rotational angle around θ _Y, θ _Z Z axis.

The film forming apparatus 11 has a vacuum container 21 held in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas. In the vacuum container 21, the substrate adsorption unit 24 for adsorbing and holding the substrate W, the mask support unit 23 for supporting the mask M, and the substrate adsorption unit 24 are positioned. A fine-moving stage mechanism 22 is provided for positioning in at least the X direction, the Y direction, and the θ _{Z direction.} In addition, in the vacuum container 21, a film formation source 25 is provided which houses a film formation material and sublimates and discharges the film formation material during film formation. Further, the film forming apparatus 11 may further include a magnetic force application unit 26 for bringing the mask M into close contact with the substrate W side by magnetic force. The magnetic force applying unit 26 is movable in the Z direction by the lifting stage 261, and the magnetic force can be adjusted according to the position in the Z direction.

The vacuum container 21 of the film forming apparatus 11 includes a first vacuum container portion 211 in which a fine moving stage mechanism 22 for holding the substrate W is disposed, and a second vacuum container portion 25 in which the film forming source 25 is disposed. It includes a vacuum container part 212. And, for example, the internal space of the whole vacuum container 21 can be maintained in a high vacuum state by a vacuum pump (not shown) connected to the second vacuum container part 212.

In addition, a stretchable member 213 is provided between at least the first vacuum container part 211 and the second vacuum container part 212. The expandable member 213 is configured to prevent vibration from a vacuum pump connected to the second vacuum container part 212 or from a floor or floor on which the film forming device 11 is installed, through the second vacuum container part 212. It reduces the transmission to the first vacuum container part 211.

The vacuum container 21 further includes a reference plate 214 to which a micro-moving stage mechanism 22, which is a substrate stage supporting the substrate W, is fixedly connected. A reference plate support part 215 for supporting the reference plate 214 at a predetermined height is connected to the reference plate 214. In an example of the present embodiment, as shown in FIG. 1, a stretchable member 213 may be further provided between the reference plate 214 and the first vacuum container portion 211. Thereby, it is possible to further reduce the transmission of external vibration to the fine moving stage mechanism 22 via the reference plate 214.

Between the reference plate support 215 and the mounting base 217 of the film forming device 11, vibration is transmitted from the floor or floor to the reference plate support 215 through the mounting base 217 of the film forming device 11 A vibration suppression unit 216 is installed to reduce the occurrence.

The fine moving stage mechanism 22 is a fine moving stage mechanism for positioning the position of the substrate adsorption unit 24 that magnetically levitates and adsorbs the substrate W by a linear motor. Substrate adsorption unit 24 in at least three directions in the X direction, Y direction, and θ _Z direction, preferably in the X direction, Y direction, Z direction, θ _X direction, θ _Y direction, and θ _{Z direction.} The position of can be determined.

The fine-moving stage mechanism 22 includes a stage reference plate part 221 functioning as a fixed base, a fine-moving stage plate part 222 functioning as a movable base, and a fine-moving stage plate part 222 as a stage reference plate part 221. It includes a magnetic levitation unit 223 for magnetic levitation and movement.

The mask holding unit 23, which is a mask stage that holds the mask M, is a means for receiving and holding the mask M conveyed by a transport robot (not shown). The mask support unit 23 is installed so as to be able to move up and down at least in the vertical direction (Z direction). Thereby, the gap in the vertical direction between the surface of the substrate W and the surface of the mask M can be adjusted. In the case of positioning the substrate W with high precision by the fine moving stage mechanism 22, the mask support unit 23 supporting the mask M is provided with a ball screw driven rolling guide (not shown) or the like. As a result, it is good if it can be mechanically driven up and down in the vertical direction.

The mask support unit 23 may be provided so as to be movable in the horizontal direction (that is, in the XY-θ _{Z direction).} Thereby, even when the mask M deviates from the field of view of the alignment camera, it can be quickly moved into the field of view.

The mask support unit 23 further includes a mask pickup 231 for temporarily receiving the mask M carried in the vacuum container 21 by a transport robot (not shown). The mask pickup 231 is configured to be able to move up and down relative to the mask support surface of the mask support unit 23.

The mask pickup 231, which has received the mask M from the hand of the transport robot (not shown), is lowered relative to the mask support surface of the mask support unit 23 to transfer the mask M to the mask support unit 23. Be witty. Conversely, in the case of carrying out the used mask M, the mask M is lifted from the mask support surface of the mask support unit 23, so that the hand of the transport robot (not shown) can receive the mask M. To be there.

The mask M has an opening pattern corresponding to a thin film pattern to be formed on the substrate W, and is mounted on the mask support unit 23. The opening pattern of the mask M is defined by a blocking pattern that does not allow the sublimated film-forming material to pass through. Further, the mask support unit 23 has a structure having an opening so that the film formation material discharged from the film formation source 25 does not obstruct the path leading to the substrate W through the mask M.

The substrate adsorption unit 24 is a means for adsorbing and holding the substrate W as a film-forming body carried by a transfer robot (not shown). The substrate adsorption unit 24 is installed in the fine moving stage plate portion 222 which is a movable table of the fine moving stage mechanism 22.

The substrate adsorption unit 24 is an electrostatic chuck having a structure in which an electric circuit such as a metal electrode is embedded in a matrix of, for example, a dielectric material or an insulator (for example, a ceramic material).

The film forming apparatus 11 is installed on the upper outside (atmospheric side) of the vacuum container 21, and is an alignment mark formed on the substrate W and the mask M, a substrate-side mark (not shown) and a mask-side mark (shown Not included), and further includes a camera unit 27 for alignment, which is a mark photographing means for photographing.

The alignment camera unit 27 is provided at positions corresponding to the substrate-side marks and the mask-side marks formed on the substrate W and the mask M. For example, the four alignment camera units 27 are installed at a position equal to 90° on the outer periphery of the circular substrate. However, the present embodiment is not limited thereto, and different numbers or different arrangements may be made according to the positions of the alignment marks of the substrate W and the mask M.

The camera unit 27 for alignment is installed so as to enter the inside of the vacuum container 21 through the reference plate 214 from the upper atmospheric side of the vacuum container 21. To this end, the alignment camera unit 27 includes an alignment camera disposed on the atmosphere side, and a cylindrical portion (not shown) that surrounds and seals the alignment camera. Even if the substrate W and the mask M are supported relatively far away from the reference plate 214 by the interposition of the fine moving stage mechanism 22, the alignment mark formed on the substrate W and the mask M will be focused. I can. The position of the lower end of the tubular portion can be appropriately determined according to the depth of field of the alignment camera and the distance between the substrate W and the mask M from the reference plate 214.

Although not shown, since the inside of the vacuum container 21 that is sealed during the film forming process is dark, alignment from the lower side (-Z direction) in order to photograph the alignment mark by the alignment camera that enters the inside of the vacuum container 21 An illumination light source for illuminating the mark may be provided.

Further, the magnetic force application unit 26 and the fine moving stage plate portion 222 are structured so as not to obstruct the view of the alignment camera. For example, a hole may be provided so as not to obstruct the field of view, or a part corresponding to the field of view may be configured as a member that transmits the wavelength of light received by the camera.

Next, the fine moving stage mechanism 22 will be described with reference to FIGS. 2 and 3.

Fig. 2 is a schematic plan view of the fine moving stage mechanism 22, Fig. 3 is a partial cross-sectional view of the fine moving stage mechanism 22, Fig. 3A is a main sectional view taken along line AA of Fig. 2, and Fig. 3B is 2 is a main cross-sectional view taken along line BB, and FIG. 3 is a main cross-sectional view taken along line CC of FIG. 2.

The magnetic levitation unit 223 includes a magnetic levitation linear motor 31 for generating a driving force that moves the fine moving stage plate part 222 as a movable table with respect to the stage reference plate part 221 as a fixed stand, and a fine moving stage plate part ( By providing a position measuring means for measuring the position of the 222 and a levitation force that causes the fine moving stage plate part 222 to float with respect to the stage reference plate part 221, the gravity applied to the fine moving stage plate part 222 is compensated. It includes a self-weight compensation means (33) and an origin positioning means (34) for determining the origin position of the fine moving stage plate portion (222).

The magnetic levitation linear motor 31 is a driving source that generates a driving force for moving the fine moving stage plate unit 222, and is two X-direction magnetism generating driving force for moving the fine moving stage plate unit 222 in the X direction. Two Y-direction magnetic levitation linear motors 312 generating driving force for moving the floating linear motor 311, the fine moving stage plate part 222 in the Y direction, and the fine moving stage plate part 222 in the Z direction. It includes three Z-direction magnetic levitation linear motors 313 that generate driving force for moving.

Using a plurality of these magnetic levitation linear motors 31, the fine moving stage plate portion 222 is rotated in six degrees of freedom (X direction, Y direction, Z direction, θ _X direction, θ _Y direction, θ in the _Z direction).

The magnetic levitation linear motor 31 includes a stator provided on the stage reference plate part 221 and a mover provided on the fine moving stage plate part 222. The stator of the magnetic levitation linear motor 31 includes a magnetic field generating means, for example, a coil through which an electric current flows, and the movable member includes a magnetic material, for example, a permanent magnet.

Further, the stage reference plate portion 221 is provided with a position sensor 32. The position sensor 32 uses, for example, a laser interferometer, and irradiates the measuring beam to the reflecting unit 324 provided on the fine moving stage plate unit 222 to detect the reflected beam, thereby detecting the position of the reflecting unit 324. (The position of the fine moving stage plate part 222) is measured. The position sensor 32 includes an X-direction position measuring unit that measures the position of the fine moving stage plate portion 222 in the X direction, a Y-direction position measuring unit that measures the position in the Y direction, and a Z-direction. It includes a Z-direction position measuring unit for measuring the position in. With such a configuration of the position sensor 32, it is possible to accurately measure the position of the fine moving stage plate portion 222 in six degrees of freedom.

The self-weight compensating means 33 are, as shown in Fig. 3C, a first magnet part 331 provided on the stage reference plate part 221 side and a second magnet provided on the fine moving stage plate part 222 side. By using the repulsive force or suction force between the parts 332, a levitation force of a size corresponding to the gravity applied to the fine moving stage plate part 222 is provided.

The origin positioning means 34 is a means for determining the origin position of the fine moving stage plate portion 222 as shown in FIG. 3B, and includes a triangular pyramid-shaped concave portion 341 and a hemispherical convex portion ( 342). In addition to the triangular pyramid-shaped concave portion 341 and the hemispherical convex portion 342, the micro-moving stage plate was formed by contacting three combinations of a V-groove and a hemispherical convex portion, and a flat and hemispherical convex portion. The position of the unit 222 may be determined.

Further, as the stage mechanism for moving the substrate adsorption unit 24, a magnetic levitation mechanism of 6-axis drive has been exemplified, but other stage mechanisms such as a rolling stage driven by a ball screw or a rolling stage driven by a linear motor may be used.

Next, the alignment device of the present embodiment incorporated in the film forming device will be described with reference to FIG. 4. Fig. 4A is a schematic configuration diagram of an alignment device, and Fig. 4B is an enlarged view of the vicinity of the mask-side mark and the substrate-side mark in Fig. 4A. In addition, the positional relationship in the Z direction in Fig. 4B is schematically shown, and is different from the actual size.

As shown in Fig. 4A, the alignment device relatively moves the fine-moving stage plate portion 222 holding the substrate W and the mask holding unit 23, which is a mask stage holding the mask M, relative to each other. The substrate W and the mask M are aligned. The mask M is mounted on the mask supporting unit 23 and the substrate W is adsorbed on the substrate adsorption unit 24.

As an apparatus configuration, an alignment camera as a mark photographing means for converting and detecting an optically photographed image of the substrate-side mark ma formed on the substrate W and the mask-side mark mb formed on the mask M into an electrical signal ( 271) and a control unit 100 that executes an alignment process. .

In addition, in FIG. 4A, the mask support unit 23 and the mask frame M2 supporting the mask body M1 are used to pass illumination light from below through the substrate-side mark ma and the mask-side mark mb. A case where the hole 55 is provided and further, the hole 56 is provided in the substrate adsorption unit 24 so as not to obstruct the view of the alignment camera 271 is illustrated.

The control unit 100 includes a position shift information calculating unit 101, a correction value calculating unit 102 that calculates a correction value of the position shift information and feeds back the position shift information, and a fine moving stage plate unit in a direction in which the position shift information decreases. It is provided with the movement control part 103 which moves 222 and the mask support unit 23 relative to each other.

The positional shift information calculation unit 101 processes the images of the substrate-side mark ma and the mask-side mark mb acquired by the alignment camera 271, and provides positional shift information between the substrate W and the mask M. Computes The positional shift information calculation unit 101 acquires the coordinates of the substrate-side mark ma and the coordinates of the mask-side mark mb in the horizontal plane from the images of the substrate-side mark ma and the mask-side mark mb. Can also be done. The position shift information calculating unit 101 also calculates the difference between the coordinates of the substrate-side mark ma and the mask-side mark mb in the horizontal plane as the positional shift information between the substrate W and the mask M. do. The coordinates of the substrate-side mark ma and the coordinates of the mask-side mark mb in the horizontal plane are examples of image information.

The correction value calculating unit 102 calculates a correction value of the positional displacement information using the optical axis inclination information of the alignment camera 271 and the gap information in the vertical direction of the substrate-side mark (ma) and the mask-side mark (mb). Then, the positional shift information is fed back.

The movement control unit 103 corrects the positional displacement information calculated by the positional displacement information calculating unit 101 with a correction value calculated by the correction value calculating unit 102, so that the corrected positional displacement information falls within a predetermined range, The fine moving stage plate portion 222 and the mask support unit 23 are moved relative to each other in the direction in which the positional shift information is reduced. The movement control unit 103 corrects the coordinates of the substrate-side mark (ma) in the horizontal plane or the coordinates of the mask-side mark (mb) with a correction value calculated by the correction value calculating unit 102, and the positional deviation information is previously The fine moving stage plate portion 222 and the mask support unit 23 may be moved relative to each other in a direction in which the positional shift information decreases so as to fall within a predetermined range.

Further, the control unit 100 has not only a function of controlling alignment, but also functions such as transport of the substrate W and the mask M, control of film formation, and the like.

The control unit 100 may be configured by, for example, a computer having a processor, memory, storage, I/O, and the like. In this case, the function of the control unit 100 is realized by the processor executing a program stored in a memory or storage. As the computer, a general-purpose personal computer may be used, or an embedded computer or PLC (Programmable Logic Controller) may be used. Alternatively, some or all of the functions of the control unit may be configured with a circuit such as an ASIC or an FPGA. Further, a control unit may be provided for each film forming apparatus, or a single control unit may be configured to control a plurality of film forming apparatuses.

Next, with reference to Fig. 4B, a shift due to the angle of the optical axis (a shift between the substrate-side mark and the mask-side mark orthogonally projected on the mask surface) will be described.

When the optical axis N of the alignment camera 271 has an inclination with respect to an axis V orthogonal to a plane parallel to the mask M, in the camera image, the mask-side mark (mb) and the substrate-side mark Even if (ma) is aligned, the substrate-side mark (ma') and the mask-side mark (mb) orthogonally projected on the mask surface are shifted by δ. When this shift (δ) is called a shift due to the optical axis angle, when the optical axis inclination is φ and the gap in the vertical direction between the mask-side mark (mb) and the substrate-side mark (ma) is d, the amount of shift due to the optical axis angle ( δ) becomes “d×tanφ”. For example, when d = 50 µm and φ = 10 mrad, the amount of shift (δ) that is the optical axis angle is 500 nm. In the recent high precision of pixel patterns, this value is a value that cannot be ignored.

According to the present embodiment, in the control unit 100, the optical axis inclination φ of FIG. 4B corresponding to the optical axis inclination information of the alignment camera 271 and the mark gap in FIG. 4B corresponding to the gap information in the vertical direction ( "d x tan phi" is calculated from d) to obtain a shift amount δ that is an optical axis angle as a correction value of the position shift information. Then, the fine-moving stage plate portion 222 and/or the mask support unit 23 are moved by an amount of "d x tan phi", so that the substrate-side mark ma and the mask-side mark mb are moved relative to each other. In this way, the positions of the substrate-side mark ma' and the mask-side mark mb orthogonally projected on the mask surface can be matched.

Since the film-forming material emitted from the film-forming source 25 enters substantially perpendicular to the mask surface, in the case where the shift due to the optical axis angle remains as it is, the film formation position on the substrate is shifted by the shift amount due to the optical axis angle. According to the alignment device of the present embodiment, the amount of shift due to the angle of the optical axis can be corrected, and since the film formation position is made highly accurate, the pixel pattern becomes highly accurate.

Correcting the shift attributable to the optical axis angle is particularly preferable when a plurality of colors are formed by a plurality of film forming devices, such as an organic EL display device. This is because the optical axis inclination φ is generally different for each film forming apparatus. In addition, since the thickness of the substrate W, which is a film-forming target, generally has an error of several tens of µm, when a substrate-side mark is formed on the back surface of the substrate W (the (-Z) side in FIG. 4B), the substrate Each time (W) changes, the mark gap (d) changes. Whenever the substrate W is changed, the gap information corresponding to the mark gap d is updated and “d×tanφ” is calculated, so that the influence of the substrate thickness error can also be corrected.

In addition, when the substrate W of FIG. 4B is a silicon wafer, it is preferable that the alignment camera 271 be a near-infrared camera capable of capturing near-infrared rays. By setting it as a near-infrared camera, the substrate-side mark ma formed on the back surface of the substrate W (the surface on the (-Z) side in FIG. 4B) through the silicon wafer can be imaged with the camera 271 for alignment.

Next, a method of detecting the inclination of the optical axis angle will be described in detail with reference to FIG. 5.

5 is a schematic explanatory diagram of a method of detecting an optical axis inclination. 5A and 5B show the mask side before and after movement in which the mask support unit 23 is moved by a distance α in a direction perpendicular to the plane parallel to the mask M for detection of the optical axis inclination. The relationship between the mark mb and the alignment camera 271 is shown. In addition, FIG. 5(C) shows the position of the mask side mark mb in the field of view F of the alignment camera 271 in FIG. 5(A), and FIG. 5(D) shows the position of the mask side mark mb. The position of the mask-side mark mb in the field of view F of the alignment camera 271 in 5B is shown.

As shown in FIGS. 5C and 5D, by the movement of the mask support unit 23 by the distance α, within the field of view F, the mask-side mark mb is the movement amount β As much as it is moving.

Assuming that the mask support unit 23 is moved by a distance α in a direction orthogonal to the mask M on which the mask side mark mb is formed, the mask side mark mb in the camera field of view F at that time. If the movement amount β of) is known, the vertical line set on the plane parallel to the mask M and the optical axis inclination φ, which is the amount of shift of the optical axis of the alignment camera 271, can be calculated. The calculation expression is "φ = arcsin (β ÷ α)". When the angle is small, it may be calculated by φ≒β÷α. By such means, the optical axis inclination φ can be detected.

Using this detected optical axis inclination information φ and the mark gap d separately acquired, the deviation due to the optical axis angle at the time of alignment is corrected by the calculation formula ``d×tanφ'', whereby the film formation position is increased with high precision, and the pixel pattern This becomes high precision.

In addition, although the method of moving the mask (M) side has been described here, the fine moving stage plate portion 222 is moved by a distance α in a direction orthogonal to the mask M on which the mask side mark (mb) is formed, so that the camera field of view A method of acquiring the movement amount β of the substrate-side mark ma in the inside may be employed.

Further, the detection of the optical axis inclination φ may be a method of detecting the optical axis inclination φ by preparing a calibration plate with a known positional relationship and processing an image acquired with an alignment camera. Furthermore, a workpiece having two marks whose distance in the plane parallel to the mask M is known is prepared, and when the alignment camera is tilted with the two marks placed in the field of view F, 2 It may be a method of calculating and obtaining the optical axis inclination from the change in the distance of the marks of the dog.

6 is a schematic explanatory diagram of a mark gap detection process.

Z when the alignment camera 271 is scanned in the Z direction by a Z-direction moving means (not shown) with the substrate-side mark (ma) and the mask-side mark (mb) in the field of view (F). The relationship between the position of the direction and the contrast value of the alignment camera 271 is shown. Here, the Z direction is a vertical direction in FIG. 1, and is a direction orthogonal to a plane parallel to the mask M. A light ray incident on the alignment camera 271 is indicated by a dotted line, and the dotted line position farthest from the alignment camera 271 indicates the position at which the focus is most achieved. The contrast value is correlated with a state in which focus is achieved, and a higher contrast value indicates a state in which focus is achieved. When the alignment camera 271 is scanned in the Z direction with the substrate-side mark ma and the wafer-side mark mb in the field of view F, the position at which the substrate-side mark ma is focused ( Za), at the position Zb in which the mask side mark mb is in focus, the contrast value takes a maximum value. Position information in the Z direction of the alignment camera 271 can be easily obtained by installing a position sensor for positioning or a separate displacement sensor, which is provided by a non-shown Z-direction moving means, and marks from this position information. A gap (gap information in the vertical direction) is detected. That is, the difference between the position Za and the position Zb in the Z direction becomes the mark gap d. By using the optical axis tilt (φ) obtained separately from the detected mark gap (d) and correcting the shift due to the optical axis angle at the time of alignment by the calculation formula ``d×tanφ'', the film formation position is increased with high precision, and the pixel pattern is highly accurate. It becomes the road.

In addition, the method of obtaining the mark gap d may be a method obtained by calculating from the position information in the Z direction of the fine moving stage plate portion 222 and the mask supporting unit 23, and the thickness information of the substrate W. Here, the thickness information of the substrate W may be obtained by measuring a pinch with a displacement meter. In particular, in the case of a silicon wafer, laser interference information on the front and back of the silicon wafer is obtained by irradiating a near-infrared laser to penetrate the silicon. It may be obtained from.

<Alignment method>

Next, the alignment method will be described.

FIG. 7 is a flowchart showing the entire sequence, and FIG. 8 is a diagram showing the arrangement of constituent parts used in the description of the alignment method. In this arrangement, the configuration of the parts already described in the overall configuration diagram of FIG. 1 is omitted or simplified. And, it shows the configuration required for explanation of the alignment method.

First, the arrangement configuration of Fig. 8 will be described.

The alignment includes a first alignment process for roughly aligning the substrate W and the mask M, and a second alignment process for aligning the substrate W and the mask M with high precision. Two marks (ma) and mask-side marks (mb) are provided for the first alignment and two for the second alignment, and the alignment camera 271 is also provided with two cameras 271A for the first alignment. , Two second alignment cameras 271B are installed, and are driven in the Z-axis direction, respectively.

It is the 2nd alignment camera 271B to which this embodiment is applied. The first alignment camera 271A has a low resolution and a large field of view. On the other hand, the second alignment camera 271B has a small field of view, but has a high resolution, and is used for high-precision positioning with a small tolerance for the amount of position shift.

As described above, the micro-moving stage mechanism 22 is a six-axis driven magnetic levitation mechanism, and a position sensor for six axes is provided, and the micro-moving stage plate part 222 is provided with a substrate W through the substrate adsorption unit 24. ) Is held.

In the mask M, the peripheral portion of the mask body M1 on which the opening pattern is formed is held by the mask frame M2.

The mask support unit 23 supporting the mask M is provided with an illumination light source 57 that illuminates the mask side mark mb and the substrate side mark ma from below.

The mask support unit 23 is moved not only in the Z direction but also in the XY-θ _Z direction by the coarse motion stage mechanism 28. The coarse motion stage mechanism 28 includes _{a first coarse motion unit 281 that moves in the XY-θ Z} direction, and a second coarse motion unit 282 that moves up and down in the Z-axis direction. As the first coarse motion unit 281 and the second coarse motion unit 282, a non-floating mechanical transfer mechanism such as a rolling stage driven by a ball screw or a rolling stage driven by a linear motor is used.

In the fixed portion of the coarse motion stage mechanism 28, a plurality of mask lifting pins 283 for lifting the mask M are provided. The mask pick-up pin 283 functions as the mask pickup 231 shown in FIG. 1.

In addition, the coarse motion stage mechanism 28 is provided with a water release member 29 for picking up the substrate W. The holding member 29 has a post 292 extending in the Z-axis direction and a receiving finger 291 extending at a right angle from the tip of the post 292, and the coarse motion stage mechanism 28 It is driven in the XYZ-θ _Z direction by.

Next, the overall alignment sequence shown in FIG. 7 will be described with appropriate reference to FIGS. 9 and 10.

First, as shown in Fig. 9A, the substrate W is carried into the vacuum container of the film forming apparatus from a substrate stocker (not shown) by the robot hand 50 (S1). The carried-in substrate W rotates the receiving fingers 291 of the four lifting members 29 supported by the coarse motion stage mechanism 28, and raises the second coarse motion unit 282 in the Z-axis direction, It is transmitted from the robot hand 50 to the film forming apparatus side. After delivery, the robot hand 50 is evacuated (S2).

Next, the substrate side mark ma for the first alignment is photographed by the first alignment camera 271A, and as shown in Fig. 9B, the first coarse motion unit 281 allows the substrate (W) is moved in the XYθz direction to perform first alignment (S3). This first alignment is a step of approximately aligning the substrate W and the mask M by aligning the substrate W and the substrate adsorption unit 24. For example, the substrate-side mark ma is positioned so that it is located at the center of the field of view F of the first alignment camera 271A. The receiving finger 291 and the mask M supporting the substrate W are also moved in the XYθz direction by the first coarse motion unit 281 together with the substrate W.

When the alignment of the substrate W with respect to the substrate adsorption unit 24 is finished, as shown in Fig. 9C, the substrate W is electrostatically chucked to the substrate adsorption unit 24, and the receiving finger 291 ) To evacuate (S4).

Subsequently, the mask M is brought close to the substrate W by the second coarse motion unit 282 (S5), and the second alignment of the substrate W is performed by the fine motion stage mechanism 22 (S6).

Upon completion of the second alignment, the mask M is sucked by the magnetic force application unit 26. As shown in Figs. 10A and 10B, the magnetic force application unit 26 is lowered, the mask M is magnetically adsorbed with the substrate W interposed therebetween (S7), and evaporation is started ( S8). In FIG. 10B, the peripheral portion of the central region of the mask M is not in contact with the substrate W. However, the substrate W is formed so that the mask M overlaps the film formation range of the substrate W. ) And the mask (M) are held. When the evaporation is complete, the substrate W is taken out by the robot hand (S9).

Further, in the above sequence, the mask M is overlapped and held in contact with the substrate W by the magnetic force applying unit 26, but in a non-contact state without using the magnetic force applying unit 26, It may be held in close proximity. That is, in the present embodiment, the case where the substrate W and the mask M are held overlapping or close to each other is included.

Next, with reference to FIGS. 11 and 12, the above-described second alignment process will be described in detail.

First, the mask M is raised by the coarse motion stage mechanism 28, and from the state at the start shown in Fig. 12A, a predetermined position with respect to the substrate W as shown in Fig. 12B. Close to (S61). Next, by the fine movement stage mechanism 22, the board|substrate W is finely moved so that it may become a gap of 0.5 mm in a position where it does not come into contact with the mask M, in this example (S62).

Next, the fine moving stage plate part 222 and the mask frame M2 are made parallel by the fine moving stage mechanism 22 (S63). Since each position can be confirmed by the position sensor provided in the fine motion stage mechanism 22 and the position sensor of the coarse motion stage mechanism 28, it can control so that it may become parallel.

Next, the mark gap d between the substrate-side mark ma and the mask-side mark mb for the second alignment at this time is measured (S64). That is, the second alignment camera 271B is reciprocated in the Z-axis direction, and from the data of the contrast, the mark gap d from the positional information of the driving stage of the second alignment camera 271B, which becomes the maximum value of the contrast curve. Computes

Next, parallel matching is checked (S65). In parallel matching, the mark gap d measured in S64 is compared with the distance obtained from the position sensor provided in the fine motion stage mechanism 22 and the position sensor in the coarse motion stage mechanism 28. If they are not matched, it is thought that dust is intervening between the substrate W and the substrate adsorption unit, so the process proceeds to step S80, and the mask M is lowered by the coarse motion unit 282. Then, the receiving finger 291 is prepared, the substrate W is separated from the electrostatic chuck exemplified as the substrate adsorption unit 24 and received by the receiving finger 291, and electrostatic chucking is performed again. If they are matched, the process proceeds to the next step S66. In step S66, the fine moving stage mechanism 22 keeps the substrate W in the -Z direction (downward) until the gap with the mask M becomes a predetermined value while maintaining parallelism with the mask M. Move to ).

Next, the mark gap is checked (S67). Confirmation of this mark gap is measured by moving the second alignment camera 271B back and forth, and it is checked whether or not the mark gap is less than or equal to a predetermined value, for example, less than or equal to 10 µm.

When the mark gap has not reached the predetermined value or less, the process proceeds to step S80, the second coarse motion unit 282 is driven to lower the mask M, and electrostatic chucking is performed again (S80).

When the mark gap is equal to or less than the predetermined value, the process proceeds to step S68, and the second alignment of the substrate W is performed.

The control unit 100 processes the images of the second alignment substrate-side mark ma and the mask-side mark mb acquired by the second alignment camera 271B, and processes the image of the substrate W and the mask M. Position shift information is calculated and temporarily stored in a memory or the like.

Furthermore, the optical axis inclination information of the second alignment camera 271B measured and stored in advance, and the verticality of the substrate-side mark ma and the mask-side mark mb for the second alignment measured in step S67. Using the gap information in the direction, a correction value of the position shift information is calculated. This correction value is fed back to the positional displacement information to correct the positional displacement information.

Then, the movement control unit 103, based on the corrected positional deviation information and the positional information in the XYθz direction of the substrate obtained by the position sensor of the fine moving stage mechanism 22, the positional deviation information to be within a preset range. , The fine motion stage mechanism 22 is driven to move in the direction in which the positional shift information decreases.

Next, the alignment position is confirmed (S69). If the second alignment is within the target value, the second alignment ends. If it is not within the target, the process proceeds to step S80, the substrate W is separated from the electrostatic chuck, and the substrate is adsorbed by the electrostatic chuck again.

The correction of the positional shift in this mark alignment is performed by setting conditions as shown in FIG. Fig. 13A is a perspective view showing the relationship between the substrate-side mark ma and the mask-side mark mb, and Fig. 13B is a plan view of Fig. 13A.

Here, as a premise, the number of marks that are simultaneously referred to at the time of alignment is set to two marks on the substrate side (ma) and two marks on the mask side (mb). In addition, the positions of the substrate-side mark ma and the mask-side mark mb are the outer peripheral portions of each of the substrate W and the mask M (at a radius of 150 mm).

In addition, mark alignment is more specifically, when considering the line segment (A) connecting the substrate-side marks (ma, ma) and the line segment (B) connecting the mask-side marks (mb, mb), the line segment (A) and Regarding the line segment B, the relative position of the substrate and the mask is controlled so as to satisfy the following (1) and (2).

(1) The distance (ε) between the midpoint (Oa) of the line segment (A) and the midpoint (Ob) of the line segment (B) is brought close to zero.

(2) The angle (γ) formed by both line segments (A, B) is brought close to zero.

In addition, the amount of positional shift in mark alignment is defined by the following (1') and (2').

(1') The distance (ε) between the midpoint Oa of the line segment A connecting the two substrate-side marks ma and the midpoint Ob of the line segment B connecting the two mask-side marks mb.

(2') "Angle (γ) formed by the line segment (A) and the line segment (B)" × "Representative position of the mark (at a radius of 150 mm)".

In the mark alignment described above, the error of the magnification component is not considered. Since the difference in thermal displacement between the substrate W and the mask M affects the magnification component, it is suppressed by other means such as temperature control.

<Film formation process>

When the alignment process is completed, the shutter (not shown) of the film formation source 25 shown in Fig. 1 is opened, and a film formation material is deposited on the substrate W through the mask M. After depositing a film-forming material having a desired thickness on the substrate W, the magnetic force application unit 26 is raised to separate the mask M, and the mask support unit 23 is lowered.

Subsequently, a robot hand of a transfer robot (not shown) enters the vacuum container 21 of the film forming apparatus 11, and a substrate separation voltage of zero (0) or reverse polarity is applied to the electrode portion of the substrate adsorption unit 24. , The substrate W is separated from the substrate adsorption unit 24. The separated substrate W is carried out from the vacuum container 21 by a transfer robot.

In addition, in the above description, the film forming apparatus 11 has a configuration of a so-called upward vapor deposition method (Depo-up), in which a film is formed while the film forming surface of the substrate W faces downward in the vertical direction. Is not limited thereto, and the substrate W may be disposed in a state vertically erected on the side surface of the vacuum container 21, and the film may be formed in a state in which the film-forming surface of the substrate W is parallel to the gravitational direction.

Next, an example of a method of manufacturing an electronic device using the film forming apparatus of the present embodiment will be described. Hereinafter, the configuration and manufacturing method of an organic EL display device are illustrated as examples of electronic devices.

First, an organic EL display device to be manufactured will be described. Fig. 14A is an overall view of the organic EL display device 60, and Fig. 14B shows a cross-sectional structure of one pixel.

As shown in Fig. 14A, in the display area 61 of the organic EL display device 60, a plurality of pixels 62 including a plurality of light emitting elements are arranged in a matrix form. Details will be described later, but each of the light-emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. In addition, the pixel referred to herein refers to a minimum unit capable of displaying a desired color in the display area 61. In the case of the organic EL display device according to the present embodiment, the pixel 62 is constituted by a combination of the first light-emitting element 62R, the second light-emitting element 62G, and the third light-emitting element 62B that exhibit different light emission. Has been. The pixel 62 is often composed of a combination of a red light-emitting element, a green light-emitting element, and a blue light-emitting element, but may be a combination of a yellow light-emitting element, a cyan light-emitting element, and a white light-emitting element. no.

Fig. 14B is a schematic partial cross-sectional view taken along line A-B in Fig. 14A. The pixel 62 has an organic EL element including an anode 64, a hole transport layer 65, an emission layer 66R, 66G, 66B, an electron transport layer 67, and a cathode 68 on the substrate 63. . Among these, the hole transport layer 65, the light emitting layers 66R, 66G, and 66B, and the electron transport layer 67 correspond to the organic layer. In the present embodiment, the light emitting layer 66R is an organic EL layer emitting red, the light emitting layer 66G is an organic EL layer emitting green, and the light emitting layer 66B is an organic EL layer emitting blue. The light-emitting layers 66R, 66G, and 66B are formed in patterns corresponding to light-emitting elements emitting red, green, and blue colors (sometimes referred to as organic EL elements), respectively. In addition, the anode 64 is formed separately for each light emitting device. The hole transport layer 65, the electron transport layer 67, and the cathode 68 may be formed in common with the plurality of light emitting elements 62R, 62G, 62B, or may be formed for each light emitting element. In addition, in order to prevent the anode 64 and the cathode 68 from being short-circuited by foreign substances, an insulating layer 69 is provided between the anode 64. Further, since the organic EL layer is deteriorated by moisture or oxygen, a protective layer 70 for protecting the organic EL element from moisture or oxygen is provided.

In FIG. 14B, the hole transport layer 65 or the electron transport layer 67 is illustrated as a single layer, but is formed of a plurality of layers including a hole block layer or an electron block layer according to the structure of the organic EL display device. It could be. In addition, a hole injection layer having an energy band structure capable of smoothly injecting holes from the anode 64 to the hole transport layer 65 may be formed between the anode 64 and the hole transport layer 65. . Likewise, an electron injection layer may be formed between the cathode 68 and the electron transport layer 67.

Next, an example of a method of manufacturing an organic EL display device will be described in detail.

First, a substrate 63 on which a circuit (not shown) for driving an organic EL display device and an anode 64 are formed is prepared.

On the substrate 63 on which the anode 64 is formed, an acrylic resin is formed by spin coating, and the acrylic resin is patterned to form an opening in the portion where the anode 64 is formed by a lithography method to form the insulating layer 69. This opening corresponds to a light-emitting region in which the light-emitting element actually emits light.

The substrate 63 on which the insulating layer 69 is patterned is carried into the first organic material film forming apparatus, and the substrate 63 is held by an electrostatic chuck, and the hole transport layer 65 is common on the anode 64 of the display area. It is formed as a layer. The hole transport layer 65 is formed by vacuum evaporation. Actually, since the hole transport layer 65 is formed to have a size larger than that of the display area 61, a high-precision mask is not required.

Next, the substrate 63 formed up to the hole transport layer 65 is carried into the second organic material film forming apparatus, and is held by an electrostatic chuck. The substrate 63 and the mask are aligned, and a light emitting layer 66R emitting red is formed on a portion of the substrate 63 in which an element emitting red is disposed.

Similar to the film formation of the light-emitting layer 66R, the light-emitting layer 66G emitting green is formed by the third organic material film forming device, and further, the light-emitting layer 66B emitting blue color is formed by the fourth organic material film-forming device. After deposition of the light emitting layers 66R, 66G, and 66B is completed, the electron transport layer 67 is formed over the entire display area 61 by the fifth organic material deposition apparatus. The electron transport layer 67 is formed as a layer common to the three color light emitting layers 66R, 66G, and 66B.

The substrate 63 formed up to the electron transport layer 67 is moved to a metal material film forming apparatus to form a cathode 68. At this time, the metal material film forming apparatus may be a film forming apparatus of a heat evaporation method or a film forming apparatus of a sputtering method.

After that, the substrate 63 is moved to a plasma CVD apparatus to form a protective layer 70 to complete the organic EL display device 60.

From the time when the substrate 63 on which the insulating layer 69 is patterned is carried into the film forming apparatus until the film formation of the protective layer 70 is completed, when exposed to an atmosphere containing moisture or oxygen, the light-emitting layer made of an organic EL material is There is a risk of deterioration due to moisture or oxygen. Therefore, in this example, the carrying in and carrying out of the substrate 63 between the film forming apparatuses is performed in a vacuum atmosphere or an inert gas atmosphere.

11: tabernacle device
21: vacuum vessel
22: fine moving stage mechanism (moving means)
23: mask support unit (mask stage)
24: substrate adsorption unit
25: Tabernacle
27: camera unit for alignment
28: coarse motion stage mechanism (mask stage)
29: substrate support unit
100: control unit
101: position misalignment information operation unit
102: correction value calculation unit
103: movement control unit
M: mask
W: substrate
ma: board side mark
mb: mask side mark
N: optical axis
φ: optical axis tilt
α: distance, β: moving amount
d: mark gap
Za, Zb: peak position
δ: amount of deviation due to the angle of the optical axis

Claims (20)

An alignment device for aligning the substrate and the mask by relatively moving a substrate stage for holding a substrate and a mask stage for holding a mask,
A mark photographing means for photographing a substrate-side mark formed on the substrate and a mask-side mark formed on the mask,
Based on the image information obtained by the mark photographing means, the optical axis tilt information of the mark photographing means, and the gap information between the surface of the substrate and the surface of the mask, a movement amount for moving the substrate stage and the mask stage relative to each other is determined. An alignment device comprising a control means for determining. The method of claim 1,
An alignment apparatus comprising using image information corrected by image information correction means for correcting the image information using the optical axis tilt information and the gap information. The method of claim 1,
A positional displacement information calculating means for obtaining positional displacement information between the substrate and the mask from the image information;
Information correction means for correcting the positional shift information using the optical axis tilt information and the gap information;
And a control means for moving the substrate stage and the mask stage relative to each other in a direction in which the corrected positional shift information is decreased based on the positional shift information corrected by the information correcting means. The method according to any one of claims 1 to 3,
The gap information is an alignment device, characterized in that it is measured every time the substrate is changed. The method according to any one of claims 1 to 3,
The alignment device, wherein the optical axis inclination information is obtained in advance before performing alignment. The method according to any one of claims 1 to 3,
And an optical axis tilt detection means for detecting the optical axis tilt information. The method of claim 6,
The optical axis tilt detection means includes a distance when the substrate stage or the mask stage is moved in a direction perpendicular to a plane parallel to the mask,
When the substrate stage or the mask stage is moved, a movement amount of the substrate-side mark or the mask-side mark obtained by the mark photographing means in a plane parallel to the mask is detected, and the detected distance and the movement amount An alignment device that obtains the optical axis tilt information from. The method according to any one of claims 1 to 3,
An alignment device comprising: mark gap detection means for detecting the gap information. The method of claim 8,
The mark gap detecting means obtains contrast information from the mark photographing means while moving the mark photographing means in a direction orthogonal to a plane parallel to the mask, and the mark when two maximum values of the contrast information are obtained. An alignment device that is a means for detecting the gap information from positional information of the photographing means in the optical axis direction. The method according to any one of claims 1 to 3,
The alignment includes a first alignment process and a second alignment process, and the mark photographing means is a mark photographing means for a second alignment process. Arrange the substrate and the mask so that they can be moved relative to each other,
A substrate-side mark formed on the substrate and a mask-side mark formed on the mask are photographed by a mark photographing means,
Relatively moving the substrate and the mask by using image information of a mark photographed by the mark photographing means, optical axis tilt information of the mark photographing means, and gap information between the surface of the substrate and the surface of the mask. Alignment method characterized by. The method of claim 11,
And correcting the image information using the optical axis tilt information and the gap information. The method of claim 11,
Obtaining positional shift information between the substrate and the mask from the image information,
Correcting the positional shift information using the optical axis tilt information and the gap information,
Alignment by moving the substrate and the mask relative to each other in a direction in which the positional shift information is reduced. The method according to any one of claims 11 to 13,
The gap information is an alignment method, characterized in that it is measured every time the substrate is changed. The method according to any one of claims 11 to 13,
The alignment method, wherein the optical axis inclination information is obtained in advance before the alignment process. The method according to any one of claims 11 to 13,
The optical axis tilt information includes a distance when the mask or the substrate is moved in a direction orthogonal to a plane parallel to the mask, and the substrate-side mark obtained by the mark photographing means when the substrate or the mask is moved An alignment method that is obtained from an amount of movement of the mask-side mark in the surface of the substrate or the mask. The method according to any one of claims 11 to 13,
The gap information is obtained when contrast information is obtained from the mark photographing means while moving the mark photographing means in a direction orthogonal to a plane parallel to the mask or the substrate, and two maximum values of the contrast information are obtained. The alignment method, which is detected from positional information in the optical axis direction of the mark photographing means. A film forming apparatus in which a film is formed by depositing a film-forming material on the surface of the substrate not covered by the mask while holding a mask over or close to a substrate in a vacuum container,
A film forming apparatus comprising the alignment apparatus according to any one of claims 1 to 3. A film-forming method in which a film-forming material is deposited on a surface of the substrate that is not covered by the mask while holding a mask over or close to a substrate in a vacuum container,
A film forming method, wherein the substrate and the mask are aligned by the alignment method according to any one of claims 11 to 13. A method for manufacturing an electronic device, comprising forming a film on a substrate of an electronic device by the film forming method according to claim 19.

Images