JP2023042908A - Alignment device, alignment method, film deposition apparatus, film deposition method and method for manufacturing electronic device - Google Patents

Abstract

To suppress the reduction of alignment accuracy resulting from the inclination of the optical axis of an alignment camera.SOLUTION: An alignment device includes: movement means for moving at least one of a substrate and a mask in a movement direction intersecting the film deposition surface of the substrate; measurement means for measuring a relative positional relationship between the substrate and the mask in a direction along the film deposition surface of the substrate using optical imaging means; alignment means for adjusting the relative positional relationship between the substrate and the mask on the basis of measurement results obtained by the measurement means; adjustment means for adjusting the inclination of at least one of the optical axis of the imaging means and the movement direction by the movement means; and control means for controlling the adjustment means on the basis of a relative inclination between the optical axis of the imaging means and the movement direction by the movement means.SELECTED DRAWING: Figure 3

Description

The present invention relates to an alignment apparatus, an alignment method, a film forming apparatus, a film forming method, and an electronic device manufacturing method.

In the manufacturing process of an organic EL display, a mask deposition method is used in which a film having a predetermined pattern is formed on a substrate through a mask having openings formed in a predetermined pattern. In the mask deposition method, after the mask and the substrate are aligned, the mask and the substrate are brought into close contact with each other to form a film. It is important to align the mask and the substrate with high precision in order to form a film with high precision by the mask film formation method.

After the alignment of the mask and the substrate is completed, there is a case where the mask and the substrate are misaligned due to the operation of the apparatus such as an up-and-down operation. In Japanese Patent Laid-Open No. 2004-100003, after the substrate and the mask are brought into close contact with each other after the alignment is completed, the alignment mark is imaged again by the alignment camera, the amount of positional deviation is measured based on the imaged image, the amount of positional deviation is measured, and the amount of offset is stored. A technique for suppressing positional deviation caused by mechanical operation by reflecting an offset amount on a target position in alignment is described.

The optical axis of a camera optical system that captures an image of an alignment mark may be tilted relative to the moving direction of a mask or substrate by an elevating mechanism. In this case, the amount of misalignment between the alignment marks in the captured image does not match the amount of actual misalignment between the alignment marks when the substrate and the mask are in close contact with each other. Therefore, alignment based on the captured image cannot be performed with high accuracy. In Patent Document 2, the inclination of the optical axis is measured in advance, the amount of positional deviation between alignment marks obtained from a captured image is corrected based on the inclination of the optical axis, and the mask and the mask are aligned based on the corrected amount of positional deviation. Techniques for aligning substrates are described.

JP 2020-105629 A JP 2021-080563 A

As a method for improving the alignment accuracy, a method of adjusting the optical axis of the alignment camera so that the inclination of the optical axis with respect to the moving direction by the lifting mechanism is reduced is also conceivable. For example, as an initial setting of the film forming apparatus, the inclination of the optical axis can be measured using a substrate and mask for measurement, and the optical axis of the alignment camera can be adjusted according to the measured inclination of the optical axis.

However, there are cases where multiple types of masks with different opening patterns are used for film formation in one deposition apparatus, and the moving direction of the lifting mechanism and the inclination of the substrate and mask near the alignment marks change when the types of masks differ. Therefore, the inclination of the optical axis also changes. The method of adjusting the tilt of the optical axis as the initial setting of the film forming apparatus cannot cope with the change in the tilt of the optical axis according to the type of mask.

SUMMARY OF THE INVENTION An object of the present invention is to suppress deterioration of alignment accuracy caused by tilting of an optical axis of an alignment camera.

The present invention includes moving means for moving at least one of the substrate and the mask along a moving direction that intersects the film formation surface of the substrate;
measuring means for measuring the relative positional relationship between the substrate and the mask in a direction along the film formation surface of the substrate using an optical imaging means;
alignment means for adjusting the relative positional relationship between the substrate and the mask based on the measurement results of the measurement means;
adjusting means for adjusting the inclination of at least one of the optical axis of the imaging means and the moving direction of the moving means;
a control means for controlling the adjustment means based on information on the relative inclination between the optical axis of the imaging means and the movement direction of the movement means;
An alignment apparatus characterized by comprising:

The present invention comprises a measuring step of measuring the relative positional relationship between the substrate and the mask in the direction along the film formation surface of the substrate using an optical imaging means;
an alignment step of adjusting the relative positional relationship between the substrate and the mask based on the measurement result of the measurement step;
a moving step of moving at least one of the substrate and the mask so that the substrate and the mask are brought closer after the alignment step;
An alignment method comprising:
Control is performed to adjust the tilt of at least one of the optical axis of the imaging means and the moving direction in the moving step based on information on the relative tilt between the optical axis of the imaging means and the moving direction in the moving step. a control process;
An alignment method characterized by having

ADVANTAGE OF THE INVENTION According to this invention, the fall of the alignment precision resulting from the inclination of the optical axis of an alignment camera can be suppressed.

1 is a diagram schematically showing the configuration of an electronic device manufacturing apparatus according to an embodiment; FIG. 1 is a diagram showing the configuration of an alignment device according to an embodiment; FIG. FIG. 4 is a diagram schematically showing the configuration of the camera adjustment mechanism of the embodiment; FIG. 4 is a diagram showing configurations of substrate marks and mask marks according to the embodiment; FIG. 4 is a diagram showing a support structure for a carrier and a mask in an alignment apparatus according to an embodiment; The figure which shows the optical axis deviation of the alignment camera of embodiment. FIG. 4 is a diagram for explaining a method of acquiring an optical axis deviation of the alignment camera according to the embodiment; FIG. 4 is a diagram showing changes in optical axis deviation of the alignment camera according to the embodiment; FIG. 4 is a diagram showing a flowchart of alignment processing according to the embodiment; 1 is a diagram showing the configuration of an organic EL display device according to an embodiment; FIG.

Embodiments for carrying out the present invention will be exemplified below with reference to the drawings. However, unless otherwise specified, the dimensions, materials, shapes, relative positions, etc. of the components are not intended to limit the scope of the present invention.

An alignment apparatus, an alignment method, a film forming apparatus, a film forming method, and an electronic device manufacturing method according to embodiments of the present invention will be described. The film forming apparatus of this embodiment is an apparatus for forming a thin film by depositing a film forming material on the surface of a substrate through a mask. Examples of film forming methods include vacuum deposition and sputtering. By aligning the substrate and the mask and forming the film, a thin film having a pattern corresponding to the opening pattern of the mask is formed on the substrate. When a plurality of layers are formed on a substrate, the term "substrate" may be used to include the layers already formed by the previous step. The alignment apparatus according to this embodiment performs alignment for adjusting the relative positions of the substrate and the mask in order to form a thin film via the mask with high accuracy. The present invention can be applied to general alignment apparatuses that align a substrate and a mask, and is not limited to film forming apparatuses.

Examples of substrate materials include glass, semiconductors such as silicon, polymeric films, and metals. Examples of the substrate include a silicon wafer and a substrate in which a film such as polyimide is laminated on the substrate. Examples of film-forming materials include organic materials and inorganic materials (metals and metal oxides). As the mask, a metal mask having an opening pattern corresponding to the thin film pattern to be formed on the substrate can be exemplified. Electronic devices manufactured by the manufacturing method of the present embodiment include semiconductor devices, magnetic devices, various electronic devices such as electronic components, optical components, light emitting elements, photoelectric conversion elements, touch panels, display devices equipped with light emitting elements (e.g. organic EL display device), a lighting device (for example, an organic EL lighting device), a sensor provided with a photoelectric conversion element (for example, an organic CMOS image sensor), and the like. In particular, it is suitable for manufacturing organic light-emitting devices such as OLEDs and organic photoelectric conversion devices such as organic thin-film solar cells.

<Embodiment 1>
FIG. 1 is a plan view schematically showing the configuration of an electronic device manufacturing apparatus according to this embodiment. Here, an in-line type organic EL display manufacturing apparatus including a film forming apparatus will be described as an example. A film forming apparatus is a vacuum vapor deposition apparatus that vapor-deposits a film forming material onto a substrate using an evaporation source. An organic EL display is manufactured by loading a substrate of a predetermined size into a manufacturing apparatus, forming an organic EL layer and a metal layer in a film forming apparatus, and performing post-processing such as cutting the substrate. done. FIG. 1 does not show the configuration of the post-treatment process. Hereinafter, the direction along the film formation surface of the substrate is defined as the X direction and the Y direction, and the direction intersecting the film formation surface of the substrate is defined as the Z direction. In this embodiment, the XY plane is parallel to the horizontal plane, and the Z direction is parallel to the vertical direction.

The manufacturing apparatus 1 includes a substrate loading chamber 101, a carrier merging chamber 102, a mask merging chamber 103, an alignment chamber 104, a film forming chamber 105, a mask separating chamber 106, a mask separating chamber 107, a carrier separating chamber 108, a substrate discharging chamber 109, a mask, and a It has a transfer chamber 110 , a carrier transfer chamber 111 , a mask loading chamber 112 , a mask unloading chamber 113 and a mask transfer chamber 114 .

In the substrate loading chamber 101, the substrate 10 transported from upstream is loaded into the manufacturing apparatus 1 and transported to the carrier merging chamber 102 downstream.
In the carrier merging chamber 102, the substrate 10 and the carrier 11 for holding the substrate 10 merge, the substrate 10 is clamped by the carrier 11, and transported to the mask merging chamber 103 downstream.
In the mask merging chamber 103, the carrier 11 and the mask 12 are merged and transported to the downstream alignment chamber 104, respectively.

Alignment of the substrate 10 and the mask 12 is performed in the alignment chamber 104 , and after the alignment is completed, the substrate 10 and the mask 12 are brought into close contact with each other and transported to the downstream film formation chamber 105 . Alignment is performed by aligning substrate marks, which are alignment marks provided on the substrate 10, and mask marks, which are alignment marks provided on the mask 12, with high accuracy. Details of the alignment will be described later.
In the film forming chamber 105 , a film forming process is performed on the film forming surface of the substrate 10 through the mask 12 using an evaporation source that heats and evaporates the film forming material.
In the mask separation chamber 106, the carrier 11 and the mask 12 holding the substrate 10 on which the film formation process is completed are loaded. When replacing the mask 12 , the mask 12 is separated from the carrier 11 in the mask separating chamber 106 and transported as the used mask 18 to the mask unloading chamber 113 . When the mask 12 is to be reused, the carrier 11 and the mask 12 pass through the mask separation chamber 106 and are conveyed to the mask separation chamber 107 .

Mask 12 is separated from carrier 11 in mask separation chamber 107 . The separated mask 12 is transferred again to the mask merging chamber 103 through the mask transfer chamber 110 and reused.
Carrier 11 and substrate 10 are separated in carrier separation chamber 108 . The separated carrier 11 is transported again to the carrier merging chamber 102 through the carrier transport chamber 111 and reused. The substrate 10 after the film formation process separated from the carrier 11 is unloaded from the substrate unloading chamber 109 to the next process.

As described above, the transport path A for the substrate 10, the transport path B for the carrier 11, and the transport path C for the mask 12 shown in FIG. 1 are constructed. The transport path B of the carrier 11 and the transport path C of the mask 12 form a circulation path, and the same carrier 11 and mask 12 are repeatedly used for film formation. The mask 12 that has been used for a certain number of film formation processes is separated in the mask separating chamber 106 and then conveyed as the used mask 18 to the mask unloading chamber 113 .

In the mask unloading chamber 113, the used mask 18 is moved to a position lower than the Z-direction positions of the substrate 10, the carrier 11 and the mask 12 on the transfer paths A, B, and C by the lift mechanism. After that, the used mask 18 is transferred to the alignment chamber 104 .
In the alignment chamber 104, the transport path D for the used mask 18 and the transport paths A, B, and C for the substrate 10, carrier 11, and mask 12 intersect. Since it passes through a low position in the Z direction, transport of the used mask 18 and transport of the substrate 10, carrier 11 and mask 12 can be controlled independently. The used mask 18 is transferred from the alignment chamber 104 to the mask transfer chamber 114 and transferred from the mask transfer chamber 114 to the next process.

When the mask 12 is introduced into the transport path D as the used mask 18 , a new mask 19 is transported from the mask loading chamber 112 to the mask separation chamber 107 along the transport path E. As a result, a new mask 19 is loaded onto the mask transport path C. As shown in FIG. A new mask 19 is carried from the mask stocker 115 to the mask loading chamber 112 . A plurality of types of masks with different opening patterns are stored in the mask stocker 115 , and film formation can be performed using different types of masks in the film formation chamber 105 .

As described above, in the manufacturing apparatus 1 of the present embodiment, by making the Z-direction positions of the plurality of independent transfer paths different from each other, the plurality of transfer paths can intersect in the same chamber. This makes it possible to flexibly design the transfer route even when the arrangement of the chambers is restricted by conditions such as the floor area and shape of the installation location of the manufacturing apparatus 1 . In this embodiment, a configuration in which two transport paths having different positions in the Z direction intersect in one chamber is exemplified, but the present invention is not limited to this example. If the positions in the Z direction are different, a plurality of independent systems of transport paths can coexist in one chamber, and the number of systems may be two or more. Both are possible. In this embodiment, the transport path D for the used mask 18 is lower than the transport paths A, B, and C for the substrate 10, carrier 11, and mask 12 in the Z direction. is not limited to this, and the transport path D may be positioned higher than the transport paths A, B, and C in the Z direction.

Each chamber constituting a transport path A for the substrate 10, a transport path B for the carrier 11, a transport path C for the mask 12, a transport path D for the used mask 18, and a transport path E for the new mask 19 is used for manufacturing an organic EL display. Sometimes maintained in a high vacuum state. The mask stocker 115 is maintained at atmospheric pressure. The present invention can also be applied to a cluster-type electronic device manufacturing apparatus in which a plurality of film forming apparatuses are arranged around a transport robot that transports substrates. The present invention can also be applied to an electronic device manufacturing apparatus that does not use a carrier. Since bending of the substrate can be suppressed by holding the substrate with a highly rigid carrier, the use of the carrier is suitable for film formation on a large substrate that is likely to bend.

FIG. 2 is a cross-sectional view showing the configuration of the alignment device 80 in the alignment chamber 104. As shown in FIG. A carrier 11 and a mask 12 are conveyed from the mask merging chamber 103 to the alignment chamber 104 on carrier conveying rollers 20 as the first conveying means and mask conveying rollers 21 as the second conveying means, respectively. The transport paths A and B of the carrier 11 and the substrate 10 by the carrier transport rollers 20 and the transport path C of the mask 12 by the mask transport rollers 21 are parallel to the +Y direction. After alignment for adjusting the relative positional relationship between the substrate 10 and the mask 12, the carrier 11 holding the substrate 10 is placed on the mask 12, and the substrate 10 and the mask 12 are in close contact with each other. , the substrate 10 on which the mask 12 is placed is carried out by the mask carrying rollers 21 which are carrying means for carrying the substrate 10 to the film forming chamber 105 .

In the alignment chamber 104, the used mask 18, which is a work different from the substrate 10 and the mask 12, which are conveyed from the mask unloading chamber 113 along the conveying paths A, B, and C, is carried by a conveying roller as a third conveying means. 36 and transported. A conveying path D of the used mask 18 by the conveying rollers 36 is parallel to the -X direction. A transport path D for the used mask 18 is a path that transports the used mask 18 at a position lower than the transport paths A, B, and C for the substrate 10, the carrier 11, and the mask 12 in the Z direction that intersects the film formation surface of the substrate 10. , and intersects the transport paths A, B, and C. Since the positions of the transport paths A, B, and C and the transport path D are different in the Z direction, the transport of the used mask 18 by the transport rollers 36 is performed by the carrier transport rollers 20 and the mask transport rollers 21 for the substrate 10, the carrier 11, and the mask 12. can be controlled independently of the transport of However, in this embodiment, the transport of the used mask 18 by the transport rollers 36 is stopped while the alignment device 80 is performing the alignment of the substrate 10 and the mask 12 . As a result, it is possible to suppress the influence of the vibration generated in the transport operation of the used mask 18 on the alignment.

The film formation surface of the rectangular substrate 10 is assumed to be parallel to the horizontal plane in an ideal state without bending. The orthogonal direction is the X direction, and the parallel direction is the Y direction. Also, rotation about the X axis is represented by θX, rotation around the Y axis is represented by θY, and rotation around the Z axis is represented by θZ.

The alignment device 80 has a vacuum chamber 22 . The inside of the vacuum chamber 22 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas. The term "vacuum" as used herein refers to a state in a space filled with a gas having a pressure lower than atmospheric pressure, typically a space filled with a gas having a pressure lower than 1 atm (1013 hPa). refers to the state of A mask support unit 16 and a carrier support unit 17 are provided inside the vacuum chamber 22 .

The carrier support unit 17 supports the carrier 11 transported by the carrier transport rollers 20 . The mask support unit 16 supports the mask 12 conveyed by the mask conveying rollers 21 . After the alignment of the substrate 10 and the mask 12 is completed, the carrier 11 is placed on the mask 12 and the substrate 10 and the mask 12 are brought into close contact with each other. The carrier 11 holding the substrate 10 and the mask 12 are transported out of the alignment chamber 104 by the mask transport rollers 21 in an integrated state. In the case of a configuration that does not use the carrier 11, a substrate support unit that directly supports the substrate 10 is provided instead of the carrier support unit 17. FIG.

An elevating base 23 , an elevating slider 24 , a clamp slider 25 , and an alignment stage 26 are provided outside the upper partition of the vacuum chamber 22 . The alignment stage 26 is connected to the elevating base 23 . The elevating slider 24 moves the carrier support unit 17 in the Z direction, and the alignment stage 26 moves the carrier support unit 17 in the X, Y and θZ directions. A drive mechanism for the elevation slider 24 and the alignment stage 26 is composed of, for example, an actuator such as a motor and a ball screw, or a motor and a linear guide.

The elevating slider 24 relatively moves the substrate 10 and the mask 12 in a direction intersecting the plane along the film formation surface of the substrate 10 . In this embodiment, the direction of relative movement between the substrate 10 and the mask 12 by the elevating slider 24 is the Z direction, that is, the vertical direction, which is the direction perpendicular to the plane along the film formation surface of the substrate 10 .

The alignment stage 26 is alignment means for adjusting the relative positional relationship between the substrate 10 held by the carrier 11 and the mask 12 in the direction along the film formation surface of the substrate 10 . In this embodiment, the alignment stage 26 adjusts the relative positional relationship between the substrate 10 and the mask 12 by moving the substrate 10 in the X direction, Y direction, and θZ direction. The alignment stage 26 includes a chamber fixing portion 37 fixed to the outside of the upper partition wall of the vacuum chamber 22, an actuator portion 28 for generating driving forces in the X direction, the Y direction and the θZ direction to the carrier support unit 17, and the alignment stage 26. and the carrier support unit 17 .

The actuator unit 28 is composed of an actuator that generates a driving force in the X direction, an actuator that generates a driving force in the Y direction, and an actuator that generates a driving force in the θZ direction. A UVW type actuator may be used in which a plurality of actuators cooperate to generate driving forces in the X, Y and θZ directions. The actuator section 28 operates according to a control signal transmitted from the control section 30 to move or rotate the carrier support unit 17 in the X direction, Y direction and θZ direction. As a result, the carrier 11 holding the substrate 10 moves or rotates in the X, Y and θZ directions. The control unit 30 transmits to the actuator unit 28 control signals indicating respective amounts of movement in the X direction, Y direction, and θZ direction. When the actuator section 28 is of the UVW type, the control section 30 transmits to the actuator section 28 a control signal indicating the operation amount of each UVW actuator.

Although the alignment stage 26 adjusts the position of the carrier 11 in this embodiment, the configuration is not limited to this as long as the relative positions of the substrate 10 and the mask 12 can be adjusted. For example, a configuration for adjusting the position of the mask 12 or a configuration for adjusting the positions of both the carrier 11 and the mask 12 may be used.

A plurality of alignment cameras 31, which are optical imaging means, are provided outside the upper partition wall of the vacuum chamber 22 . A through-hole for imaging is provided in the upper partition wall of the vacuum chamber 22 on the optical axis 33 of the alignment camera 31 . The through-hole is sealed with a window glass 32, so that both the imaging of the inside of the vacuum chamber 22 from the outside and the maintenance of the air pressure inside the vacuum chamber 22 are possible.

On the outside of the upper partition wall of the vacuum chamber 22, there is a camera adjustment mechanism which is adjustment means for adjusting the position of the alignment camera 31 in the X, Y and Z directions and the inclination of the optical axis 33 around the X and Y axes. 35 are provided for each of the plurality of alignment cameras 31 .

FIG. 3 is a diagram schematically showing the configuration of the camera adjustment mechanism 35. As shown in FIG. The camera adjustment mechanism 35 includes an actuator 48 that generates a driving force for moving the alignment camera 31 in the Z direction, a slider 40 provided with the actuator 48, and a drive that moves the slider 40 in the X direction with respect to the upper partition wall of the vacuum chamber 22. It has an actuator 46 that generates a force, an actuator 47 that generates a driving force to move in the Y direction, an actuator 43 that generates a driving force to rotate in the θX direction, and an actuator 45 that generates a driving force to rotate in the θY direction. The camera adjustment mechanism 35 adjusts the tilt of the optical axis 33 of the alignment camera 31 by moving the alignment camera 31 in the X direction, Y direction, Z direction, θX direction, and θY direction. Note that the configuration of the actuator is not limited to this, similarly to the actuator section 28 . The operations of the actuators 46 , 47 , 48 , 43 , 45 in the X, Y, Z, θX, and θY directions that constitute the camera adjustment mechanism 35 are controlled by control signals from the controller 30 .

FIG. 4A is a top view of the substrate 10 supported by the carrier 11. FIG. The outer edge of carrier 11 is indicated by dashed lines. Board marks 13 a , 13 b , 13 c , and 13 d are provided at the four corners of the board 10 . Each of the board marks 13a to 13d is simultaneously imaged by the corresponding four alignment cameras 31a to 31d, and the position of the center point of each of the board marks 13a to 13d is obtained based on the imaged images. Positional information of the substrate 10 can be acquired from the positional relationship of the four points.

FIG. 4B is a top view of the mask 12. FIG. The mask 12 has a structure in which a mask foil 12b having a thickness of several micrometers to several tens of micrometers is welded to a mask frame 12a. The mask frame 12a supports the mask foil 12b so that the mask foil 12b is not warped while being pulled in its surface direction (X direction and Y direction). The mask foil 12b has a boundary portion formed with openings corresponding to the pattern to be formed on the substrate 10. The boundary portion is in close contact with the substrate 10 when the mask 12 is placed on the substrate 10, and the substrate 12b is formed by evaporation or sputtering. The film-forming material flying toward 10 is shielded. When a glass substrate or a substrate having a resin film such as polyimide formed on a glass substrate is used as the substrate 10, the main material of the mask frame 12a and the mask foil 12b contains iron or an iron alloy such as nickel. Iron alloys can be used.

The mask frame 12a is provided with mask marks 14a, 14b, 14c and 14d at the four corners of the mask frame 12a. Each of the mask marks 14a to 14d is imaged by each of the corresponding four alignment cameras 31a to 31d, and the position of the center point of each of the mask marks 14a to 14d is obtained based on the imaged image. Position information of the mask 12 can be obtained from the positional relationship of the four points. do. The positions and numbers of the substrate marks 13, the mask marks 14, and the alignment cameras 31 are not limited to this example.

FIG. 4C is a diagram schematically showing the field of view 44 of the alignment camera 31 and a set of the substrate mark 13 and the mask mark 14 captured within the field of view 44 . If both the substrate mark 13 and the mask mark 14 are simultaneously within the field of view 44 of the alignment camera 31, the positional relationship between the center points of the substrate mark 13 and the mask mark 14 is obtained based on the image of the field of view 44. can be done. The coordinates of the center points of the substrate mark 13 and the mask mark 14 are obtained by image processing executed by the control unit 30 based on the image obtained by the alignment camera 31 . Note that the image processing may be performed by an image processing device provided separately from the control unit 30 . Further, the shapes of the substrate mark 13 and the mask mark 14 are not limited to the square or round shape illustrated in FIG. It is preferred to use shape.

A plurality of alignment cameras 31 are mounted on the substrate 10 supported inside the vacuum chamber 22 .
A substrate mark 13, which is an alignment mark provided on the mask 12, and a mask mark 14, which is an alignment mark provided on the mask 12, can be imaged. When aligning the substrate 10 and the mask 12 , the imaging field of the alignment camera 31 includes the substrate mark 13 and the mask mark 14 . The control unit 30 obtains the positions of the substrate 10 and the mask 12 based on the images of the substrate mark 13 and the mask mark 14 captured by the alignment camera 31, and determines the positions of the substrate 10 and the mask 12 in the direction along the film formation surface of the substrate 10. is a measuring means for measuring the relative positional relationship with

The control unit 30 analyzes the image captured by the alignment camera 31 to detect the substrate mark 13 and the mask mark 14 and obtain the positions of the substrate mark 13 and the mask mark 14 . The control unit 30 acquires the relative positional relationship between the substrate mark 13 and the mask mark 14 in the direction along the XY plane parallel to the film formation surface of the substrate 10 based on the positional information of the substrate mark 13 and the mask mark 14 . Information on the relative positional relationship is, for example, the distance and angle between the substrate mark 13 and the mask mark 14 . Based on the relative positional relationship between the substrate marks 13 and the mask marks 14, the control unit 30 calculates the amount of movement of the carrier 11 in the X, Y and θZ directions to bring the substrate marks 13 and the mask marks 14 closer to each other. . The calculated moving amounts in the X direction, the Y direction, and the θZ direction are converted into driving amounts of stepping motors, servo motors, and the like included in the actuators of the actuator section 28 of the alignment stage 26, and control signals are output. This causes the carrier 11 to move within the XY plane. At this time, the distance in the Z direction between the substrate 10 and the mask 12 does not change, and the position of the carrier 11 changes within the XY plane. The XY plane is a plane parallel to the film formation surface of the substrate 10 in an ideal state without bending, and is parallel to the horizontal plane in this embodiment. The alignment device 80 aligns the carrier 11 with the substrate 10 and the mask 12 in a separated state based on the measurement result of the relative positional relationship between the substrate 10 and the mask 12 in the direction along the film formation surface of the substrate 10. Alignment is performed to adjust the relative positions of the held substrate 10 and the mask 12 within the XY plane parallel to the film formation surface of the substrate 10 . After the alignment is completed, the substrate 10 is placed on the mask 12 by placing the carrier 11 on the mask 12 by the lifting slider 24 . The elevating slider 24 is a moving means for moving the substrate 10 in a direction intersecting the film formation surface so as to switch between the separated state and the mounted state. In this embodiment, the moving direction of the substrate 10 is substantially parallel to the Z direction.

In this embodiment, an example of performing alignment using one type of alignment camera 31 will be described, but alignment can also be performed using two or more types of cameras having different magnifications and fields of view. For example, there is an alignment method using a camera with a relatively wide field of view but low magnification and a camera with a relatively narrow field of view but high magnification. First, rough alignment is performed by using a low-magnification camera to roughly adjust the positions of the substrate mark 13 and the mask mark 14 so that both are within the field of view of the high-magnification camera. Fine alignment can also be performed to align the positions of the marks 14 with high accuracy.

The alignment apparatus 80 of the present embodiment drives the alignment stage 26 to move the substrate in a separated state in which the position of the carrier 11 in the Z direction is held at a predetermined position where the substrate 10 and the mask 12 do not come into contact in consideration of bending. 10 and the mask 12 are aligned. The position of the carrier 11 in the Z direction when alignment is performed is called an alignment position. After the alignment of the substrate 10 and the mask 12 is completed, the carrier 11 is lowered and placed on the mask 12, and the substrate 10 and the mask 12 are brought into close contact with each other. The position of the carrier 11 in the Z direction at this time is called a mask placement position. The alignment camera 31 takes images of the substrate marks 13 and the mask marks 14 when the carrier 11 is at the alignment position and at the mask placement position. The control unit 30 captures images of the substrate mark 13 and the mask mark 14 with the alignment camera 31 at the alignment position in the separated state, and performs alignment based on the captured image. After the alignment is completed, the substrate mark 13 and the mask mark 14 are imaged by the alignment camera 31 at the mask placement position in the placed state. It is confirmed whether there is any positional deviation due to contact of 12 or the like. If there is a positional deviation, alignment is performed again at the alignment position.

FIG. 5 is a cross-sectional view showing an enlarged support structure for the carrier 11 holding the substrate 10 and the mask 12 in the alignment device 80. As shown in FIG. The carrier support unit 17 for supporting the carrier 11 includes carrier receiving claws 41 projecting in the X direction from the lower ends of the support columns 38 extending in the Z direction, carrier receiving surfaces 42 arranged on the upper surfaces of the carrier receiving claws 41, and carrier clamps. 27. The carrier clamp 27 is lowered by the clamp slider 25 while the peripheral edge portion of the carrier 11 along the side parallel to the transport direction, that is, the Y direction, is placed on the carrier receiving surface 42, and the carrier clamp is clamped from above the peripheral edge portion of the carrier 11. The carrier 11 is fixed to the carrier support unit 17 by pressing 27 . By driving the alignment stage 26 in this state, the substrate 10 can be moved relative to the mask 12 .

When the mask 12 is loaded into the vacuum chamber 22 while being placed on the mask transport rollers 21 , the mask support unit 16 is raised to support the mask 12 . As a result, the mask 12 is transferred from the mask conveying rollers 21 to the mask support unit 16 . The mask support unit 16 has an elevating mechanism that moves the mask 12 in the Z direction. Alignment for moving the substrate 10 relative to the mask 12 along the film formation surface is performed while the mask 12 is transferred to and supported by the mask support unit 16 . Alignment may be performed with the mask 12 placed on the mask conveying rollers 21 without using the mask support unit 16, but with the mask 12 supported by the mask support unit 16 as in the present embodiment. By performing the alignment, it is possible to suppress deterioration in alignment accuracy due to the influence of vibration from the mask conveying roller 21 .

The influence of the tilt of the optical axis 33 of the alignment camera 31 on alignment will be described with reference to FIG. FIG. 6 is a diagram schematically showing the positional relationship among the substrate 10 at the alignment position, the mask 12 supported by the mask support unit 16, and the optical axis 33 of the alignment camera 31. As shown in FIG. It is assumed that the film formation surface of the substrate 10 is parallel to the XY plane, and the moving direction of the substrate 10 by the elevating slider 24 is parallel to the Z direction, that is, the vertical direction. Assume that the substrate 10 and the mask 12 at the alignment position are separated by a distance H in the Z direction. After the alignment is completed, the substrate 10 is lowered by the distance H by the elevating slider 24 and moved to the mask mounting position, so that the substrate 10 and the mask 12 are brought into close contact with each other.

The optical axis 33 of the alignment camera 31 and the moving direction when at least one of the substrate 10 and the mask 12 is moved so as to switch between the separated state and the placed state may be tilted relative to each other. This is called optical axis deviation. In FIG. 6, the optical axis 33 of the alignment camera 31 is tilted relative to the moving direction of the substrate 10 by the elevating slider 24, that is, the elevating direction of the substrate 10 (here, the Z direction). In this case, the image captured at the alignment position, that is, the substrate mark 13 at the coordinates (0, 0, H) on the substrate 10 and the coordinates (dx, dy, 0) on the mask 12 within the field of view of the alignment camera 31 and the mask mark 14 at . Let φx be the relative inclination between the projection 33x of the optical axis 33 onto the XZ plane and the elevation direction of the substrate 10, and φy be the relative inclination φy between the projection 33y of the optical axis 33 onto the YZ plane and the elevation direction of the substrate 10. There is a relationship of dx=tan(φx) and dy=tan(φy). Even if the positions of the substrate marks 13 and the mask marks 14 are aligned based on the image captured by the alignment camera 31 at the alignment position, when the substrate 10 is lowered to the mask placement position, the positions of the substrate marks 13 and the mask marks 14 are misaligned. dx in the X direction and dy in the Y direction. Therefore, when there is optical axis misalignment, alignment cannot be performed accurately based on the image captured by the alignment camera 31 .

Therefore, in the alignment device 80 of the present embodiment, the inclination of the optical axis 33 of the alignment camera 31 is adjusted by the camera adjustment mechanism 35 to reduce the optical axis deviation. Specifically, the control unit 30 acquires information about the optical axis misalignment of the alignment camera 31, and based on the information about the optical axis misalignment, controls the X-direction actuator 46 of the camera adjustment mechanism 35 to reduce the optical axis misalignment. , Y-direction actuator 47 , Z-direction actuator 48 , θX-direction actuator 43 , and θY-direction actuator 45 .

A method of measuring the optical axis deviation will be described with reference to FIG. 7A shows the substrate 10 at the first position in the Z direction, and FIG. 7B shows the substrate 10 at the second position in the Z direction. 7C shows the field of view 44 of the alignment camera 31 when the substrate 10 is at the first position, and FIG. 7D shows the field of view 44 of the alignment camera 31 when the substrate 10 is at the second position. show. A coordinate system within the field of view 44 is represented by xyz. The first position and the second position are separated by a distance D in the Z direction. Here, optical axis misalignment is assumed that the optical axis 33 of the alignment camera 31 is inclined by an angle φ around the Y-axis with respect to the elevation direction 39 of the substrate 10 by the elevation slider 24 .

First, the substrate mark 13 is imaged by the alignment camera 31 while the substrate 10 is at the first position. Next, the substrate 10 is lifted by the lift slider 24 by the distance H in the Z direction and moved to the second position. Then, the substrate mark 13 is imaged by the alignment camera 31 while the substrate 10 is at the second position.

The image 13a of the substrate mark 13 in the image taken at the first position and the image 13b of the substrate mark 13 in the image taken at the second position are the substrate mark 13 on the plane normal to the optical axis 33. in the projected position. As shown in FIG. 7D, within the field of view 44 of the alignment camera 31, that is, in the captured image, the image 13b of the substrate mark 13 at the second position is located at a distance δ from the image 13a of the substrate mark 13 at the first position. is in a position that has been moved only As shown in FIG. 7B, the moving distance δ of the board mark 13 in the captured image when the board 10 is moved from the first position to the second position, the first position and the second position The distance D in the Z direction and the optical axis shift φ have a relationship of φ=arcsin(δ/D). Based on this relationship, the optical axis deviation can be obtained from the amount of movement of the substrate mark 13 in the captured images when the substrate mark 13 is imaged at different heights. The controller 30, the alignment camera 31, the elevating slider 24, which moves the substrate 10 up and down, and the like, which perform processing for measuring the optical axis deviation as described above, constitute optical axis deviation measuring means. The control unit 30 can acquire information about the optical axis deviation based on the measurement result of the optical axis deviation by the optical axis deviation measuring means. The information about the optical axis misalignment is the value of the optical axis misalignment and the amount of movement of the camera adjustment mechanism 35 for reducing the optical axis misalignment. The control unit 30 controls the camera adjustment mechanism 35 based on the information about the optical axis misalignment to adjust the position of the alignment camera 31 in the X direction, Y direction and Z direction and angle adjustment in the θX direction and θY direction. Optical axis deviation can be reduced.

Here, if the weight of the substrate 10, the carrier 11, the mask 12, etc. is applied to the members constituting the alignment device 80, the operation of the alignment device 80 may be affected due to distortion of the members. As described above, the manufacturing apparatus 1 of the present embodiment can perform film formation by switching between multiple types of masks 12 having different opening patterns. The effect on movement also changes. For example, if the movement of the lift slider 24 or the mask support unit 16 is affected, if the type of the mask 12 changes, the lift direction of the substrate 10, carrier 11, mask 12, etc., or the direction of support by the carrier support unit 17 or the mask support unit 16 changes. The bending and inclination of the substrate 10, the carrier 11, the mask 12, and the like change. Therefore, when the type of mask 12 changes, the optical axis shift also changes.

FIG. 8 is a diagram schematically showing changes in optical axis deviation when the type of mask 12 is changed. In FIG. 8A, the elevation direction 39a of the substrate 10 is inclined at an angle φa relative to the optical axis 33 of the alignment camera 31. In FIG. It is assumed that when the type of mask 12 is changed, the elevation direction 39b of the substrate 10 is tilted by an angle φb relative to the optical axis 33 of the alignment camera 31, as shown in FIG. 8(B). In this case, the distance that the substrate mark 13 moves within the field of view 44 of the alignment camera 31 when the substrate 10 is moved up and down from the first position to the second position along the elevation direction is changed from δa to δb. Change. The moving distances δa and δb of the substrate mark 13 in the captured image, the lifting distance D of the substrate 10, and the optical axis deviations φa and φb are in the relationship of φa=arcsin(δa/D) and φb=arcsin(δb/D). be. Note that when the type of mask 12 is changed, depending on the configuration of the alignment device 80, the elevation direction of the mask 12 instead of the elevation direction of the substrate 10, the inclination of the substrate 10, the inclination of the mask 12, or a combination thereof may change. There is also

Conventionally, the operation of adjusting the position and angle of the alignment camera 31 to reduce the optical axis deviation has been manually performed as an initial setting of the manufacturing apparatus 1 . Therefore, it has been difficult to deal with changes in the optical axis shift caused by changes in the type of the mask 12 after the manufacturing apparatus 1 is put into operation.

Therefore, in the alignment apparatus 80 of the present embodiment, when the type of the mask 12 used for film formation is changed, the control unit 30 acquires information on the optical axis shift corresponding to the type of the mask 12 to be used, and based on that information, The actuator of the camera adjustment mechanism 35 is controlled. As a result, even if the type of mask 12 is changed, the positions of the alignment camera 31 in the X, Y and Z directions and the angles around the X and Y axes can be adjusted so that the optical axis deviation is reduced. can be done.

The information on the optical axis deviation corresponding to the type of mask 12 is the substrate mark in the captured image when the substrate 10 is moved from the first position to the second position each time the type of mask 12 is changed. It can be obtained by measuring the movement distance of 13. Further, for each of the plurality of types of masks 12, the type of mask and information on the optical axis deviation measured in advance when that type of mask is used are associated with each other and stored in the storage unit 34, which is storage means. You can The control unit 30 can acquire information on the type of the mask 12 used in the alignment device 80 and information on optical axis deviation corresponding to the type of mask from the storage unit 34 .

As a method of acquiring the information on the type of mask 12 carried into the alignment chamber 104, for example, when a new mask 12 is loaded into the manufacturing apparatus 1 from the mask loading chamber 112, the identification information of the mask 12 is sent to the control unit. 30, identification information may be attached to the mask 12, and the identification information may be read by a reading device installed in the alignment chamber 104 and transmitted to the control unit 30, or the like. Any method can be used.

The information regarding the optical axis deviation includes, for example, an X-direction actuator, a Y-direction actuator, a Z-direction actuator, a θX-direction actuator, and a θY-direction actuator of the camera adjustment mechanism 35 for making the optical axis 33 and the vertical direction of the substrate 10 parallel. can be exemplified as information on the amount of operation of Thereby, even when the type of mask 12 is changed, the position and angle of the alignment camera 31 can be automatically adjusted. Even after the manufacturing apparatus 1 has been put into operation, it is possible to perform film formation efficiently while switching among multiple types of masks 12 . The information about the optical axis deviation may be the value of the optical axis deviation. In this case, the control unit 30 calculates the amount of movement of each actuator of the camera adjustment mechanism 35 based on the value of the optical axis deviation and controls each actuator, thereby automatically adjusting the position and angle of the alignment camera 31. can be done.

The substrate 10 and the mask 12 are separated by a distance H in the Z direction.
The mounting state in which the substrate 10 and the mask 12 are in close contact with each other may be defined as the state in which the substrate 10 and the mask 12 are at the mask mounting position. In this case, the moving means for moving the substrate 10 and the mask 12 so as to switch between the separated state and the placed state may be means for moving at least one of the substrate 10 and the mask 12 . For example, any of the means for fixing the mask 12 and raising and lowering the substrate 10, the means for fixing the substrate 10 and raising and lowering the mask 12, and the means for raising and lowering both the substrate 10 and the mask 12 are possible.

When the mask 12 is raised and lowered, the relative inclination between the raising and lowering direction of the mask 12 and the optical axis 33 of the alignment camera 31 affects alignment accuracy. Therefore, information on the relative inclination between the vertical direction of the mask 12 and the optical axis 33 of the alignment camera 31 is acquired according to the type of the mask 12, and the camera adjustment mechanism 35 is driven based on this information to shift the X direction of the alignment camera 31. It is preferable to adjust the position and angle in the direction, Y direction, Z direction, θX direction, and θY direction.

When both the substrate 10 and the mask 12 are moved up and down, the relative inclination between the up-and-down direction of the substrate 10 and the optical axis 33 of the alignment camera 31 and the relative inclination of the up-and-down direction of the mask 12 and the optical axis 33 of the alignment camera 31 tilt affects the alignment accuracy. Therefore, information on the relative inclination between the elevation of the substrate 10 and the optical axis 33 of the alignment camera 31 according to the type of the mask 12, and the relative inclination between the elevation direction of the mask 12 and the optical axis 33 of the alignment camera 31 It is preferable to acquire tilt information and drive the camera adjustment mechanism 35 based on the tilt information to adjust the position and angle of the alignment camera 31 in the X direction, Y direction, Z direction, θX direction, and θY direction.

In this embodiment, the position and angle of the alignment camera 31 are adjusted by the camera adjustment mechanism 35 in order to reduce the optical axis deviation. You may adjust the moving direction when moving so that it may switch between and. For example, the elevation direction of the substrate 10 and the elevation direction of the mask 12 may be adjusted. Also, the adjustment of the position and angle of the alignment camera 31 and the adjustment of the elevation direction of the substrate 10 may be combined. For example, when adjusting the elevation direction of the substrate 10, an actuator for adjusting the position and angle of the elevation slider 24 for raising and lowering the substrate 10 with respect to the vacuum chamber 22 is provided in the same manner as the camera adjustment mechanism 35 shown in FIG. It is controlled by the controller 30 according to the type of the mask 12 . As a result, the optical axis 33 and the vertical direction of the substrate 10 become parallel to each other, and automatic adjustment can be performed so that the optical axis is not misaligned.

The control unit 30 controls the operations of the actuator unit 28 of the alignment stage 26, the actuator of the elevation slider 24, and the alignment camera 31, and performs image processing of the image captured by the alignment camera 31 to perform alignment between the substrate 10 and the mask 12. I do. The controller 30 also controls the transport of the substrate 10, the carrier 11, the mask 12, and the used mask 19 in the alignment chamber 104 by controlling the operations of the transport rollers 20, 21, 36, and the like. Further, the control unit 30 controls the lifting operation of the carrier 11 and the mask 12 by controlling the operation of the lifting slider 24 , the mask support unit 16 and the carrier support unit 17 . Further, the control unit 30 controls the operation of the actuators 43, 45, 46, 47, and 48 of the camera adjustment mechanism 35 according to the type of the mask 12, thereby controlling the inclination of the optical axis 33 of the alignment camera 31. conduct. The control unit 30 also performs various controls related to the operation of the alignment device 80 .

The control unit 30 is configured by, for example, a computer having a processor, memory, storage, I/O, and the like. The functions of the control unit 30 are implemented by the processor executing programs stored in the memory or storage of the storage unit 34 . As the computer, a general-purpose personal computer may be used, or a built-in computer or PLC (Programmable Logic Controller) may be used. Also, part or all of the functions of the control unit 30 may be configured by a circuit such as ASIC or FPGA. A controller 30 may be provided for each alignment device 80 , or one controller 30 may control a plurality of alignment devices 80 .

The storage unit 34 is storage means for storing an execution program and data used by the control unit 30 . Arbitrary storage means such as flash memory, non-volatile memory, SSD, and HDD can be used.

The flow of alignment processing according to this embodiment will be described with reference to FIG. FIG. 9 is a flow chart showing the flow of alignment processing in the alignment chamber 104. As shown in FIG. The processing shown in the flowchart of FIG. 9 is executed by the control section 30 controlling the operation of each section of the alignment device 80 .

In step S10, the control unit 30 separates the carrier 11 holding the substrate 10 that has been transported from the mask merging chamber 103 on the carrier transport rollers 20 and the mask 12 that has been transported on the mask transport rollers 21. , controls the operation of each part of the alignment chamber 104 so as to carry the substrate into the alignment chamber 104 .
In step S11, the control unit 30 acquires information on the type of mask 12 carried in in step S10.
In step S12, the control unit 30 determines whether the type of mask 12 acquired in step S11 has changed from the type of mask 12 used when performing the previous alignment process. If the type has changed, the process proceeds to step S13, and if the type has not changed, the process proceeds to step S14.

In step S13, the control unit 30 acquires from the storage unit 34 information about optical axis misalignment corresponding to the type of mask 12 acquired in step S11, and adjusts the camera based on the information. Actuators in the X, Y, Z, .theta.X and .theta.Y directions of the mechanism 35 are actuated. As a result, the position and angle of the alignment camera 31 are adjusted so as to eliminate optical axis deviation. The optical axis deviation is a device-specific value determined by the physical characteristics of the mask 12 and the physical characteristics of the alignment device 80, and does not change if the type of mask 12 changes. Therefore, if there is no change from the type of mask 12 used in the previous alignment process, the optical axis shift adjustment process in step S13 is not performed, and the process proceeds to step S14.

In step S<b>14 , the controller 30 transfers the carrier 11 from the carrier transport rollers 20 to the carrier support unit 17 by raising the carrier support unit 17 in the Z direction.
In step S<b>15 , the control section 30 transfers the mask 12 from the mask conveying rollers 21 to the mask support unit 16 by raising the mask support unit 16 in the Z direction.
In step S<b>16 , the controller 30 retracts the carrier transport roller 20 and lowers the carrier support unit 17 in the Z direction, thereby moving the carrier 11 to the alignment position and separating it.

In step S17, the control unit 30 captures images of the substrate marks 13 provided on the substrate 10 and the mask marks 14 provided on the mask 12 with the alignment camera 31, and based on the captured images, the substrate 10 and the mask 12 are positioned relative to each other. Get the amount of misalignment.
In step S18, the control unit 30 determines whether the positional deviation amount acquired in step S17 is equal to or less than a threshold. The threshold value is a preset value based on the upper limit of the amount of misalignment between the substrate 5 and the mask 6 at which film formation can be appropriately performed. The threshold is, for example, a value on the order of several μm, and is appropriately set according to the required device characteristics and film formation accuracy. If the amount of positional deviation is equal to or less than the threshold, it is determined that the relative positional relationship between the substrate 10 and the mask 12 has satisfied a predetermined target, and the process proceeds to step S20.If the amount of positional deviation is greater than the threshold, the process proceeds to step S19.

In step S19, the control unit 30 moves the alignment stage 26 in the X direction, the Y direction, and the θZ direction so that the substrate mark 13 and the mask mark 14 approach each other based on the positional deviation amount obtained in step S17, and again step S17. to run.
In step S20, the controller 30 moves the carrier 11 to the mask mounting position by lowering the carrier support unit 17 in the Z direction. As a result, the carrier 11 is placed on the mask 12, and the substrate 10 and the mask 12 are placed in close contact with each other.
In step S21, the controller 30 captures images of the substrate marks 13 provided on the substrate 10 and the mask marks 14 provided on the mask 12 with the alignment camera 31, and the relative alignment of the substrate 10 and the mask 12 based on the captured images. Get the amount of misalignment.

In step S22, the control unit 30 determines whether the positional deviation amount acquired in step S21 is equal to or less than a threshold. The threshold value is a preset value based on the upper limit of the amount of misalignment between the substrate 5 and the mask 6 at which film formation can be appropriately performed. The threshold may be the same as the threshold used in step S18, or may be set separately. If the amount of positional deviation is equal to or less than the threshold, the process proceeds to step S23, and if the amount of positional deviation is greater than the threshold, the process proceeds to step S16. When the process proceeds to step S16, the control unit 30 moves the carrier 11 to the alignment position by raising the carrier support unit 17 in the Z direction, and puts the carrier 11 in the separated state.
In step S<b>23 , the control unit 30 lowers the mask support unit 16 in the Z direction to transfer the mask 12 with the carrier 11 placed thereon to the mask transport rollers 21 and carry it out to the film forming chamber 105 .

<Embodiment 2>
A method of forming an organic film on a substrate and manufacturing an electronic device using the film forming apparatus of the above embodiment will be described. Here, a method for manufacturing an organic EL element used for an organic EL display as an electronic device will be described as an example. Note that the electronic device is not limited to this. For example, the present invention can be applied to the manufacture of thin film solar cells and organic CMOS image sensors. The method for manufacturing an electronic device according to the present embodiment has a step of forming an organic film on the substrate 5 using the film forming apparatus according to the above embodiments. Further, after forming the organic film on the substrate 5, a step of forming a metal film or a metal oxide film is included. The structure of the organic EL display device 600 using the organic EL elements manufactured by such steps will be described below.

FIG. 10A shows an overall view of the organic EL display device 600, and FIG. 10B shows a cross-sectional structure of one pixel of the organic EL display device 600. FIG. As shown in FIG. 10A, in a display region 61 of an organic EL display device 600, a plurality of pixels 62 each having a plurality of light emitting elements are arranged in a matrix. Each of the light emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. Note that the pixel here refers to a minimum unit capable of displaying a desired color in the display area 61 . In the organic EL display device 600, pixels 62 are configured by combinations of a first light emitting element 62R, a second light emitting element 62G, and a third light emitting element 62B that emit light in different colors. The first light emitting element 62R, the second light emitting element 62G, and the third light emitting element 62B are respectively a red light emitting element, a green light emitting element, and a blue light emitting element. Note that the number of light emitting elements per pixel and the combination of emission colors are not limited to this example. For example, a combination of a yellow light emitting element, a cyan light emitting element, and a white light emitting element, or at least one or more colors may be used. Further, each light-emitting element may be configured by laminating a plurality of light-emitting layers.

A single pixel 62 can display a desired color by using a color filter in which the pixels 62 are composed of a plurality of light emitting elements that emit light of the same color and different color conversion elements are arranged so as to correspond to the respective light emitting elements. may be For example, a color filter may be used in which the pixel 62 is composed of three white light emitting elements and color conversion elements of red, green, and blue are arranged so as to correspond to the respective light emitting elements. Alternatively, the pixel 62 may be composed of three blue light-emitting elements, and a color filter may be used in which red, green, and colorless color conversion elements are arranged so as to correspond to the respective light-emitting elements. Note that the number of light emitting elements per pixel and the combination of emission colors are not limited to these examples. In the latter case, by using a quantum dot color filter (QD-CF) using a quantum dot (QD) material as a material constituting the color filter, an organic EL display device that does not use a quantum dot color filter. The display color gamut can be widened.

FIG. 10B is a schematic partial cross-sectional view taken along the line AB of FIG. 10A. The pixel 62 is an organic EL device in which a first electrode (anode) 64, a hole transport layer 65, a light emitting layer 66R, 66G, or 66B, an electron transport layer 67, and a second electrode (cathode) 68 are formed on the substrate 5. have elements. The hole-transporting layer 65, the light-emitting layers 66R, 66G, 66B, and the electron-transporting layer 67 are organic layers. The light-emitting layer 66R is an organic EL layer that emits red, the light-emitting layer 66G is an organic EL layer that emits green, and the light-emitting layer 66B is an organic EL layer that emits blue. Note that when color filters or quantum dot color filters are used, the color filters or quantum dot color filters are arranged on the light emitting side of each light emitting layer, that is, on the upper or lower portion of FIG. 10B.

The light-emitting layers 66R, 66G, and 66B are organic EL elements that are light-emitting elements that emit red, green, and blue, respectively. The light emitting layers 66R, 66G, 66B are formed according to the pattern of the arrangement of the light emitting elements 62R, 62G, 62B. The first electrode 64 is formed for each light emitting element and separated from each other. The hole-transporting layer 65, the electron-transporting layer 67, and the second electrode 68 may be formed so as to be shared by the plurality of light-emitting elements 62R, 62G, and 62B, or may be formed separately for each light-emitting element. may An insulating layer 69 is provided between the first electrodes 64 to prevent short-circuiting between the first electrode 64 and the second electrode 68 due to foreign matter. Since the organic EL layer deteriorates due to moisture and oxygen, a protective layer P is provided to protect the organic EL element from moisture and oxygen.

A method for manufacturing an organic EL display device as an electronic device will be described.

First, a substrate 5 having a circuit (not shown) for driving the organic EL display device and a first electrode 64 formed thereon is prepared.

Next, a resin layer such as acrylic resin or polyimide is formed by spin coating on the substrate 5 on which the first electrode 64 is formed, and the resin layer is subjected to lithography to form an opening at the portion where the first electrode 64 is formed. An insulating layer 69 is formed by patterning as formed. This opening corresponds to a light emitting region where the light emitting element actually emits light.

Next, the substrate 5 on which the insulating layer 69 is patterned is carried into the first film forming apparatus, the substrate is held by the substrate holding unit, and the hole transport layer 65 is placed on the first electrode 64 in the display area. It is deposited as a common layer. The hole transport layer 65 is deposited by vacuum deposition. Since the hole transport layer 65 is actually formed to have a size larger than that of the display area 61, a high-definition mask is not required. Here, the film deposition apparatus used in the film formation in this step and in the film formation of each layer described below is the film formation apparatus described in any of the above embodiments.

Next, the substrate 5 with the hole transport layer 65 formed thereon is carried into the second film forming apparatus and held by the substrate holding unit. The substrate 5 and the mask 6 are aligned, the substrate 5 is placed on the mask 6, and the red-emitting light-emitting layer 66R is formed on the portion of the substrate 5 where the red-emitting element is to be arranged. By using the film forming apparatus of Embodiment 2, the alignment of the mask 6 and the substrate 5 can be performed with high precision, and the mask 6 and the substrate 5 can be brought into close contact with each other. It can be carried out.

Similarly to the deposition of the light emitting layer 66R, a green light emitting layer 66G is deposited by the third deposition apparatus, and a blue light emitting layer 66B is deposited by the fourth deposition apparatus. After the formation of the light-emitting layers 66R, 66G, and 66B is completed, the electron transport layer 67 is formed over the entire display area 61 by the fifth film forming apparatus. Each of the light emitting layers 66R, 66G, and 66B may be a single layer, or may be a layer in which a plurality of different layers are laminated. The electron transport layer 67 is formed as a layer common to the three color light-emitting layers 66R, 66G, and 66B. In Embodiment 2, the electron transport layer 67 and the light emitting layers 66R, 66G and 66B are formed by vacuum deposition.

Subsequently, a second electrode 68 is deposited on the electron transport layer 67 . The second electrode may be formed by vacuum deposition or may be formed by sputtering. After that, the substrate 5 with the second electrode 68 formed thereon is moved to a sealing device, and a sealing step is performed to form a protective layer P by plasma CVD, whereby the organic EL display device 600 is completed. Although the protective layer P is formed by the CVD method here, it is not limited to this, and may be formed by the ALD method or the inkjet method.

After the substrate 5 on which the insulating layer 69 is patterned is carried into the film forming apparatus until the film formation of the protective layer P is completed, the substrate 5 is exposed to an atmosphere containing moisture and oxygen. and can be degraded by oxygen. In Embodiment 2, the loading and unloading of the substrate 5 between the film forming apparatuses is performed under a vacuum atmosphere or an inert gas atmosphere.

According to the alignment apparatus, the film forming apparatus, or the electronic device manufacturing method according to the present embodiment, it is possible to form a good film with improved alignment accuracy.

10: substrate, 12: mask, 16: mask support unit, 24: elevating slider, 26: alignment stage, 28: actuator section, 30: control section, 31: alignment camera, 35: camera adjustment mechanism

Claims (16)

moving means for moving at least one of the substrate and the mask along a moving direction that intersects the film formation surface of the substrate;
measuring means for measuring the relative positional relationship between the substrate and the mask in a direction along the film formation surface of the substrate using an optical imaging means;
alignment means for adjusting the relative positional relationship between the substrate and the mask based on the measurement results of the measurement means;
adjusting means for adjusting the inclination of at least one of the optical axis of the imaging means and the moving direction of the moving means;
a control means for controlling the adjustment means based on information on the relative inclination between the optical axis of the imaging means and the movement direction of the movement means;
An alignment device comprising: 2. The alignment apparatus according to claim 1, wherein said control means controls said adjustment means so that said relative inclination becomes small. 3. The alignment apparatus according to claim 1, wherein the information about the relative tilt includes information about the amount of movement of the adjustment means. storage means for storing in association with the type of mask and the information about the relative tilt when using that type of mask;
3. The control means controls the adjustment means based on information on the relative tilt corresponding to the type of mask selected according to information on the type of mask used in the alignment apparatus. The alignment apparatus according to any one of 1 to 3. Having tilt measuring means for measuring the relative tilt,
4. The alignment apparatus according to any one of claims 1 to 3, wherein said control means controls said adjusting means based on information regarding said relative tilt obtained from a measurement result by said tilt measuring means. The alignment apparatus according to any one of claims 1 to 5, wherein said adjusting means has an actuator for adjusting the position and angle of said imaging means. An alignment apparatus according to any one of claims 1 to 6, wherein said adjusting means has an actuator for adjusting the position and angle of said moving means. 8. The method according to claim 1, wherein said measuring means measures the relative positional relationship between said substrate and said mask based on a photographed image obtained by photographing a substrate mark provided on said substrate and a mask mark provided on said mask. An alignment device according to any one of the preceding items. 9. The moving device according to claim 1, wherein the moving device places the substrate on the mask after the relative positional relationship between the substrate and the mask satisfies a predetermined target by the alignment device. alignment device. an alignment chamber having the alignment apparatus according to any one of claims 1 to 9;
a film forming chamber having film forming means for forming a film through the mask on the film forming surface of the substrate on which the mask is placed;
a transport means for transporting the substrate on which the mask is placed in the alignment chamber to the film formation chamber;
A film forming apparatus. The alignment chamber is
a first transport means for transporting the substrate;
a second transport means for transporting the mask;
The substrate and the mask are separated from each other in a direction intersecting the film formation surface of the substrate at a position different from a position at which the first transport means transports the substrate and a position at which the second transport means transports the mask. a third transport means for transporting different workpieces;
The film forming apparatus according to claim 10, comprising: 12. The film forming apparatus according to claim 11, wherein said third transport means stops transporting said workpiece when said substrate and said mask are aligned in said alignment chamber. 13. The film formation according to claim 11, wherein a direction in which the substrate and the mask are transported by the first transport means and the second transport means and a direction in which the work is transported by the third transport means intersect. Device. a measuring step of measuring the relative positional relationship between the substrate and the mask in the direction along the film formation surface of the substrate using an optical imaging means;
an alignment step of adjusting the relative positional relationship between the substrate and the mask based on the measurement result of the measurement step;
a moving step of moving at least one of the substrate and the mask so that the substrate and the mask are brought closer after the alignment step;
An alignment method comprising:
Control is performed to adjust the tilt of at least one of the optical axis of the imaging means and the moving direction in the moving step based on information on the relative tilt between the optical axis of the imaging means and the moving direction in the moving step. a control process;
An alignment method, comprising: 15. A film formation method for forming a film through the mask on a substrate on which a mask whose relative positional relationship is adjusted by the alignment method according to claim 14 is mounted. 16. A method of manufacturing an electronic device, comprising the step of forming an organic film on a substrate by using the film forming method according to claim 15.

Images