WO2022089746A1 - Magnetic fixture, substrate support assembly and method for fixing an edge support frame to a table frame - Google Patents

Magnetic fixture, substrate support assembly and method for fixing an edge support frame to a table frame Download PDF

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Publication number
WO2022089746A1
WO2022089746A1 PCT/EP2020/080405 EP2020080405W WO2022089746A1 WO 2022089746 A1 WO2022089746 A1 WO 2022089746A1 EP 2020080405 W EP2020080405 W EP 2020080405W WO 2022089746 A1 WO2022089746 A1 WO 2022089746A1
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WO
WIPO (PCT)
Prior art keywords
magnetic
magnet
table frame
members
frame
Prior art date
Application number
PCT/EP2020/080405
Other languages
French (fr)
Inventor
Ralph Lindenberg
Wolfgang Klein
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Priority to CN202080106801.XA priority Critical patent/CN116368435A/en
Priority to KR1020237017589A priority patent/KR20230096036A/en
Priority to PCT/EP2020/080405 priority patent/WO2022089746A1/en
Publication of WO2022089746A1 publication Critical patent/WO2022089746A1/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Definitions

  • Embodiments of the present disclosure relate to a magnetic fixture, particularly a magnetic fixture fixing an edge support frame (ESF) to a table frame of a deposition apparatus.
  • Embodiments of the present disclosure also relate to a substrate support assembly comprising a table frame, an ESF and a plurality of magnetic fixtures.
  • Embodiments of the present disclosure also relate to a method for fixing an ESF to a table frame, particularly by providing a plurality of first members and a plurality of second members of a magnetic fixture.
  • a substrate may be coated by using an evaporation process, a physical vapor deposition (PVD) process, such as a sputtering process, a spraying process, etc., or a chemical vapor deposition (CVD) process.
  • PVD physical vapor deposition
  • CVD chemical vapor deposition
  • a substrate on which material is deposited i.e. a substrate to be coated, is introduced into a vacuum chamber of a vacuum processing system and is positioned relative to a processing area of the vacuum chamber of the vacuum processing system.
  • a coating process can take place in the vacuum chamber.
  • Coating processes i.e. material deposition processes
  • large area substrates e.g. in display manufacturing technology.
  • Coated substrates can be used further in several technical fields with applications e.g. in microelectronics, in the production of semiconductor devices, for substrates with thin film transistors, but also for insulating panels, etc.
  • the tendency towards larger substrates, e.g. in manufacturing larger displays results in larger vacuum processing systems.
  • substrates may be held in a substrate support. Couplings of a substrate to a substrate support can involve mechanical fixtures which perform a clamping function. In light of the above, it is beneficial to provide an improved fixture for coupling an ESF to a table frame of a deposition apparatus.
  • a magnetic fixture for fixing an edge support frame to a table frame of a deposition apparatus.
  • the magnetic fixture includes a first member with a magnet and a second member with a magnetic element.
  • the first member and the second member are each coupled to at least one of the table frame and the edge support frame, wherein magnetic forces between the first member and the second member are configured to fix the edge support frame to the table frame.
  • a substrate support assembly includes a table body, a table frame coupled to the table body, and an edge support frame supported to be movable with respect to the table frame and having a plurality of recesses.
  • the substrate support assembly has a plurality of magnetic fixtures, including a plurality of first members including magnets, and a plurality of second members including magnetic elements. At least one of the first members and the second members are provided in the plurality of recesses.
  • a method for fixing an edge support frame to a table frame of a deposition apparatus includes providing a plurality of first members of a magnetic fixture coupled to the table frame.
  • the first members each include a magnet.
  • the method includes providing a plurality of second members of a magnetic fixture coupled to the edge support frame.
  • the second members each have a magnetic element.
  • the plurality of first members and the plurality of second members are arranged such that each first member faces a second member when the edge support frame is applied to the table frame.
  • the method further includes applying the edge support frame to the table frame. A plurality of magnetic forces between the first members and the second members fixes the edge support frame to the table frame.
  • FIG. 1 shows a schematic sectional side view of a fixture according to embodiments of the present disclosure
  • FIG. 2 shows a schematic sectional side view of a fixture according to embodiments of the present disclosure
  • FIG. 3 shows a schematic top-down view of a first member of a fixture according to embodiments of the present disclosure
  • FIG. 4 shows a schematic top-down view of a second member of a fixture according to embodiments of the present disclosure
  • FIG. 5 shows a schematic top-down view of a partial substrate support assembly according to embodiments of the present disclosure
  • FIG. 6 shows a schematic side view of a substrate support assembly with a plurality of fixtures according to embodiments of the present disclosure
  • Fig. 7 shows a flow chart illustrating one or more methods of fixing an ESF to a table frame of a deposition apparatus according to embodiments of the present disclosure.
  • Deposition systems can include a substrate support assembly, often including a substrate support table such as a table body, and a table frame coupled to the table body.
  • the table frame can be reversibly coupled to an edge support frame (ESF).
  • ESF edge support frame
  • the ESF can support a mask, such as a mask for edge exclusion.
  • a substrate can be positioned between the table body and the edge support frame or the mask.
  • a substrate is typically arranged between the table frame and the ESF, and the ESF is then coupled to the table frame. This holds the mask and the substrate in place for processing.
  • the processing can involve tilting of the substrate support assembly for coating.
  • the ESF is separated from the table frame and the coated substrate is exchanged.
  • the coupling between the table frame and the ESF should be stable during processing and easily separable for exchanging the substrate.
  • Embodiments described herein particularly relate to components of deposition systems for the deposition of materials, e.g. for display manufacturing on large area substrates.
  • large area substrates or carriers supporting one or more substrates may have a size of at least 0.5 m 2
  • the deposition system may be adapted for processing large area substrates, such as substrates of GEN 5, which corresponds to about 1.4 m 2 substrates (1.1 m x 1.3 m), GEN 7.5, which corresponds to about 4.29 m 2 substrates (1.95 m x 2.2 m), GEN 8.5, which corresponds to about 5.7 m 2 substrates (2.2 m x 2.5 m), or even GEN 10, which corresponds to about 8.7 m 2 substrates (2.85 m * 3.05 m).
  • Embodiments described herein can particularly relate to components of a deposition system in which substrates, which can be substrates as described above, are loaded and unloaded in a horizontal configuration and in which the substrates are processed, e.g. coated, in a vertical configuration.
  • the components of the deposition system according to embodiments described herein are suitable for use in a deposition apparatus in which a substrate is supported in different configurations, particularly in a deposition apparatus including a tilt drive for moving a substrate between a horizontal and a vertical configuration.
  • Embodiments described herein particularly relate to fixtures which can be reversibly coupled and decoupled.
  • the decoupling typically involves a motion which separates an ESF from a table frame.
  • the ESF and the table frame can be provided horizontally, and the motion of the ESF can be performed in a substantially vertical direction.
  • This direction shall, with respect to e.g. embodiments of a magnetic fixture described herein, be herein referred to as an axial direction.
  • a magnetic fixture 100 according to embodiments described herein is shown schematically in a sectional view.
  • the magnetic fixture 100 is shown in a possible configuration in which an ESF 130 is fixed to a table frame 140. This configuration will herein be referred to as a coupled state, a fixed state or a closed state.
  • the coupled state is a result of applying the ESF to the table frame.
  • the ESF and the table frame should not be understood as being a part of the fixture.
  • the magnetic fixture 100 includes a first member 110 and a second member 120.
  • the first member is coupled to the table frame 140, and the second member 120 is coupled to the ESF 130.
  • Either coupling can be provided by fasteners, by adhesives, by welding, screwing, or by other elements.
  • the coupling of the first member 110 to the table frame 140 and/or the coupling of the second member 120 to the ESF can be a permanent coupling, particularly a coupling that is only decoupled during maintenance or the like.
  • the first member 110 includes a magnet 112.
  • the magnet 112 produces a magnetic field, particularly when the magnetic fixture 100 is in the coupled state.
  • the magnet 112 can be a permanent magnet, such as a neodymium magnet, particularly a N38 NdFeB magnet. Other permanent magnets can be suitable, such as samarium-cobalt magnets or an alnico magnet.
  • the magnet can be an electromagnet, particularly a switchable electromagnet.
  • the electromagnet can have a coil.
  • the coil can be adapted for interacting with a magnetic element, such as ferromagnetic element, particularly a ferromagnetic pin.
  • the coil can be toroidal or a hollow cylinder, such that the coil has an interior hollow portion.
  • the coil can be adapted for having a ferromagnetic pin at least partially inserted into a central hollow portion of the coil, such that the ferromagnetic pin interacts with the magnetic field produced by the electromagnet, particularly such that the ferromagnetic pin is attracted by the electromagnet.
  • the electromagnet can be driven by a driving circuit.
  • the driving circuit can be adapted for driving the electromagnet such that the strength of the magnetic field produced by the electromagnet is adjustable and/or variable.
  • the adjustable and/or variable magnetic field can beneficially be used for tuning the attracting force between the electromagnet and the ferromagnetic element, particularly at specific timepoints.
  • the first member 110 can include one or more components which are not the magnet 112.
  • Such components can serve different purposes, such as housing, cooling, shielding and/or aligning the magnet 112, providing a contact surface for the ESF 130 when in the coupled state, serving as a spacer between the ESF 130 and the table frame 140, allowing the adjustment of the distance between the magnet 112 and the second member 120, or the like.
  • the second member 120 includes a magnetic element 122.
  • the magnetic element 122 can be the second member 120.
  • the magnetic element 122 can be a ferromagnetic component, e.g. a metal component, such as a steel component, particularly a stainless-steel component, such as a component including DIN 1.2083 steel.
  • the magnetic element 122 can comprise a ferromagnetic material.
  • the second member 120 can include further materials or material combinations, such as a ferrite material, provided that the second member 120 interacts with the magnetic field produced by magnet 112 when the magnetic fixture 100 is in the coupled state such that an attracting force, e.g.
  • the magnetic element 122 can be a magnet configured for interacting with the magnet 112 such that the magnetic element 122 and the magnet 112 attract each other, particularly in the coupled state of the magnetic fixture 100.
  • the magnet 112 and the magnetic element 122 are brought into close contact when the magnetic fixture 100 is in the coupled state, such that the magnetic force between the first member 110 and the second member 120 is highest.
  • the resulting magnetic force in the closed state can be tuned by arranging the magnet 112 and the magnetic element 122 such that a defined gap is present between the magnet 112 and the magnetic element 122.
  • the magnetic force can additionally be tuned by providing different size magnets 112 and/or magnetic elements 122; or by choosing magnets 112 with different grades of magnetization.
  • the magnet 112 and the magnetic element 122 can have similar dimensions and can be arranged such that they interact with one another across most or all of the surface facing the other component. This can have the beneficial effect that only an axial magnetic force, i.e. a force fixing the table frame 140 to the ESF 130 is exerted, and no radial or lateral forces arise.
  • the magnet and/or the magnetic element can be substantially disc-shaped and/or ring-shaped, e.g. toroidal and/or cylindrical and/or include a central hole/bore/indention or such.
  • Such features can be beneficial for mounting and/or aligning the magnet and/or the magnetic element. Furthermore, such features can affect the magnetic field in a beneficial manner.
  • combinations of different morphologies can be beneficial, e.g. a cylindrical magnet with a disc-shaped magnetic element or a ring-shaped magnet with a cylindrical magnetic element, or such.
  • the magnet and/or the magnetic element are substantially round, e.g. disc-shaped and/or ring-shaped, along the axial direction, the magnet and the magnetic element can be arranged coaxially. Additional beneficial shapes, such as cubes, circular sections such as hemispheres or calottes, flat ribbons, pins, and others can be provided for both the magnet and the magnetic elements.
  • the shape of the magnet and/or the magnetic element can be adapted to the respective portion of the table frame and/or ESF at which the fixture is provided, e.g. if the fixture is provided within a corner section, it can be beneficial for the magnet and/or the magnetic element to be L-shaped.
  • the second member 120 can be provided in a recess within the ESF 130 such that the second member is flush or slightly receded with respect to the surface of the ESF 130 opposite the table frame 140. This can be beneficial in that the ESF 130 will not contact the table frame 140 at a junction area between the magnet 112 and the magnetic element 122, such that the magnet 112 and/or the magnetic element 122 do not have to be particularly flat.
  • the first member can be partially or fully provided in a recess within the table frame, which can have the same beneficial effect as providing the second member within a recess.
  • the first member 110 can be coupled to the table frame 140 and the second member 120 can be coupled to the ESF 130.
  • the embodiments shown in the figures show this arrangement.
  • the first member 110 can be coupled to the ESF 130 and the second member 120 can be coupled to the table frame 140.
  • the table frame and/or the ESF can be made of nonmagnetic materials, such as aluminum, particularly ACP5080 aluminum, or a high chrome stainless steel. This can limit or prevent any unwanted interaction between the magnetic field produced by the magnet and the table frame and/or the ESF.
  • a magnetic fixture 200 according to embodiments described herein is shown schematically in a sectional view.
  • the magnetic fixture 200 includes several of the features of magnetic fixture 100 shown in Fig. 1; only new or different features shall be discussed in detail.
  • the magnetic fixture 200 includes a contact block 210.
  • the contact block 210 can be configured for providing the contact surfaces which contact the table frame 140 and, when the magnetic fixture 200 is in the coupled state, the ESF 130. This can be achieved by providing the further components of the first member 110 in a cavity or recess within the contact block 210, such that an edge of the contact block 210 protrudes, with respect to the further components of the first member 110, in the axial direction towards the ESF 130.
  • the contact block 210 can house the magnet 112 and/or further components of the first member 110, such as a magnet housing 230 and/or a holder 220.
  • the contact block 210 can be adapted for coupling the first member 110 to the table frame, e.g. by providing one or more openings for fasteners 240.
  • the contact block 210 can include a material at the contact surface which reduces abrasion at the contact surface, particularly the contact surface of the ESF 130, due to repeated coupling and decoupling of the magnetic fixture 200.
  • the contact block 210 can include a non-magnetic material, for example, a non-magnetic sliding material, e.g. a polymer, such as a polymer coating, or be made of a polymer.
  • the polymer can be PEEK and/or PI.
  • the contact block can be made of bronze.
  • the contact block can be made of a particulate material, such as a sintered material.
  • the contact block 210 can be configured for dampening shocks, e.g. when the ESF 130 is coupled to the table frame 140.
  • the magnet 112 can be provided within the first member 110 by arranging the magnet within and/or between a magnet housing 230 and a holder 220. Both the magnet housing 230 and the holder 220 can be provided within a contact block 210, such as the contact block described above. [0039] As shown in Fig. 2, according to embodiments, the holder 220 can have openings, such as bores, particularly counterbored holes, for providing fastening elements, such as fasteners 240 therein. The holder can be configured for providing fastening elements, such as fasteners 240, for coupling the first member 110 to the table frame 140.
  • the fasteners 240 can protrude in the axial direction, e.g. through the holder 220 and the contact block 210, towards the table frame 140, and be affixed to the table frame 140 inside bores 274 within the table frame 140, thus coupling the first member 110 to the table frame.
  • the holder 220 can have an opening, such as the recess 222 for providing the magnet 112 and/or a magnet housing 230 therein.
  • the shape of the recess 222 can be adapted to the shape of the magnet 112 and/or the magnet housing 230.
  • the recess 222 can be substantially cylindrical.
  • the recess 222 can be a blind hole, e.g. a blind hole extending along the axial direction.
  • the recess 222 can be configured to receive the magnet 112 and the magnet housing 230 from the side of the holder facing away from the second member 120.
  • the recess 222 can be configured such that, when assembled, the magnet 112 and/or the magnet housing 230 are fully shielded from the outside of the first member 110 by the holder 220.
  • the recess can include at least one protrusion 224, e.g. a protrusion protruding along the axial direction towards the table frame.
  • the at least one protrusion can engage with the magnet 112, particularly engage with the magnet 112 for fixing the magnet 112 and/or the magnet housing 230 within the holder against sideways movement, such as movement in a radial direction.
  • the protrusion 224 can be a pin configured for being at least partially inserted into a central hole of a ring magnet.
  • the magnet 112 can be provided within the recess 222 together with a magnet housing 230.
  • the magnet housing 230 can be configured to occupy at least some of the space within the recess 222 not filled by the magnet.
  • the magnet housing 230 can function as an adapter for allowing different sized magnets 112 to be provided within different sized holders 220, different sized recesses 222 and/or different sized first members 110.
  • the magnet housing 230 can, alone or in combination with the protrusion 224, fix the magnet against movement in a radial direction.
  • the magnet housing 230 can fix the magnet against movement in the axial direction, e.g.
  • the magnet housing 230 can limit an axial and radial motion of the magnet 112 within the first member 110.
  • the magnet housing 230 can be configured such that the magnet housing 230 does not directly contact the ESF-sided surface of the recess 222, as is shown in Fig. 2 by the resulting gap 260.
  • an axial force pushing the holder 220 to the contact block 210 is passed through the magnet 112 and can be utilized for fixing, particularly force-fitting the magnet 112 against movement in the axial direction.
  • the first member 110 can have an elastic element provided within the recess 222 between the contact block 210 and the magnet housing 230.
  • the elastic element can be a compressible component, particularly a spring or an elastomer.
  • the elastic element can be an O-ring 250.
  • the O-ring 250 can be provided within an annular groove within the surface of the magnet housing 230 adjacent to the inner surface of the contact block 210.
  • the O-ring 250 can be a rubber-type O-ring, such as an O-ring made of FKM 70.
  • the O-ring can be a spring-type O-ring, such as a Garter spring O-ring.
  • Other types of elastic elements such as rubber discs, coil springs or the like can be suitable.
  • the first member 110 is configured to elastically compress the elastic element in the axial direction by the action of the fasteners 240.
  • This compression leads to a pre- loading of the elastic element.
  • the magnet housing 230 for example, by utilizing the pre-loading, permanently pushes the magnet 112 against the holder 220.
  • the magnet 112 is force-fit between the magnet housing 230 and the holder 220 in the axial direction.
  • the pre-loading force is typically chosen such that the magnet is seated firmly within the first member 110, but without causing excessive mechanical stress within the magnet 112 that could lead to cracking of the magnet 112.
  • advantageous materials for the holder 220 include stainless steel, particularly DIN 1.4301 steel.
  • advantageous materials for the magnet housing 230 include stainless steel, particularly DIN 1.2083 steel. If the magnet housing 230 includes a magnetizable material, such as DIN 1.2083 steel, the magnetic field of magnet 112 can be advantageously affected by the magnet housing 230.
  • the magnet is secured against unfavorable movement during operation.
  • the magnet By force-fitting the magnet in the axial direction, some mechanical tolerances between components are possible, and differential expansion or contraction of the components of the fixture can be compensated.
  • the magnet is shielded from unwanted effects, such as high temperature variations, mechanical stress due to thermal expansion or mechanical impacts, chemical contamination etc., which could negatively affect the properties of the magnet over time, e.g. by loss of magnetization or material degradation.
  • the magnet can be easily accessed and exchanged, thus allowing maintenance of the fixture to be performed fast and cost- effectively.
  • the second member 120 can include a fastener and a magnetic element 122.
  • the magnetic element 122 can be the second member 120, such that the fastener portion is also a magnetic element portion.
  • the magnetic element can be at least partially disc-shaped.
  • the magnetic element can have a disc-shaped portion provided within a recess 270 within the ESF.
  • the second member 120 can have a fastener portion and a magnetic element portion.
  • the fastener portion can be configured for fastening the second member 120 within a bore 272 in the ESF.
  • the second member can have a socket 276 provided in the surface portion facing the first member for attaching a tool for driving the second member into the bore 272.
  • the second member 120 can be a low-cost part, such as a large diameter flat head screw.
  • a first member 300 of a magnetic fixture according to embodiments described herein is shown schematically in a top-down view.
  • the face of the first member 300 including the contacting surface for contacting the ESF in the coupled state is shown in an uncoupled configuration.
  • the first member 300 can be a first member 110 of a magnetic fixture 100 or a magnetic fixture 200 as discussed with reference to Fig. 1 or 2.
  • the first member 300 has a rectangular profile with a lengthwise and a traverse symmetry.
  • the first member 300 includes a holder 220 provided within a contact block 210.
  • the holder 220 has two counterbored holes provided for receiving fasteners 240 for coupling the first member to a table frame (not shown). As indicated in Fig. 3 by the dotted lines representing the magnet 112 and the magnet housing 230, these features lie on the inside of the first member behind the surface of the holder 220 and are not accessible in the configuration shown in Fig. 3.
  • the contacting surface of the first member 300 that contacts the ESF in the fixed state will be the portion of the contact block 210 which is visible in Fig. 3. This can be achieved by providing the other components of the first member 300, particularly the holder 220 and the fasteners 240, slightly receded within the contact block.
  • the holder 220 can be receded in a range of 0.05 mm to 1 mm.
  • the contacting surface can directly contact the ESF.
  • the holder 220 can be configured for including the contacting surface, in which case the holder 220 can be provided flush with the contact block 210 inside the contact block 210, or even protrude from the contact block 210.
  • a second member 400 of a magnetic fixture according to embodiments described herein is shown schematically in a top-down view.
  • the second member 400 is shown in a configuration in which the second member 400 is coupled to an ESF 130.
  • the ESF 130 is not part of the second member 400.
  • the second member 400 can be a second member 120 of a magnetic fixture 100 or a magnetic fixture 200 as discussed with reference to Fig. 1 or 2.
  • the second member 400 can be a single component, such that the magnetic element 122 consists of the second member 400.
  • the second member can include a magnetic element 122 and e.g. a fastener, a coating or the like.
  • the second member 400 can include a socket 276 for easily mounting the second member 400 to the ESF 130.
  • the magnet 112 of the first member 300 in combination with the magnet housing 230, and the magnetic element 122 of the second member 400 can both interact, via magnetic forces, across disc-shaped surface portions of the respective member when the fixture is in the coupled state.
  • these surface portions can have a similar or equal size, however, according to embodiments, the first member or the second member can be sized such that the respective surface portions have different sizes, e.g. the second surface portion may have a bigger or a smaller diameter than the first surface portion.
  • the substrate support assembly 500 includes a table body 510 and a table frame 540.
  • the table body 510 can be configured for supporting a substrate (not shown).
  • the table frame 540 can be a table frame according to embodiments described herein, such as table frame 140.
  • the table frame 540 can include a plurality of first members 110 of magnetic fixtures according to embodiments described herein, such as a magnetic fixture 100 or a magnetic fixture 200.
  • the plurality of first members 110 is evenly spaced around the table frame 540 such that the forces resulting from fixing an ESF (not shown) to the table frame 540 by means of the plurality of first members 110 interacting with a plurality of second members (not shown) to form a plurality of magnetic fixtures are evenly distributed around the substrate support assembly 500.
  • possible configurations of magnetic fixtures are not limited to the configuration shown in Fig. 5 and can include any number of magnetic fixtures in any configuration.
  • a substrate support assembly 600 with a plurality of fixtures is shown schematically in a side view.
  • the substrate support assembly 600 can include some or all of the elements of substrate support assembly 500.
  • the substrate support assembly 600 includes a table body with a table frame 540.
  • the table frame 540 can be a table frame according to the table frame 540 discussed with reference to Fig. 5.
  • the first members 110 of the plurality of magnetic fixtures are provided within recesses within the table frame.
  • the first members can be provided outside of any recesses, e.g. coupled to a flat table frame, such that the first members protrude in the axial direction towards the ESF 630.
  • the substrate support assembly includes an ESF 630.
  • the ESF 630 is drawn in a coupled configuration with solid lines.
  • the ESF 630 includes a plurality of second members of magnetic fixtures according to an embodiment described herein, e.g. a second member 120.
  • the second members can be arranged such that they are opposite the first members 110 when the substrate support assembly is in the coupled configuration, such that they, together with the adjacent first members 110, form a magnetic fixture in a coupled state according to an embodiment of the present disclosure.
  • the plurality of second members can be provided within a plurality of recesses within the ESF 630.
  • the substrate support assembly 600 can have a substrate (not shown) arranged between the table frame 540 and the ESF 630.
  • the substrate can be fixed between the table frame 540 and the ESF 630.
  • the substrate can be fixed, e.g. clamped between the table frame 540 and the ESF 630, by the force provided by the plurality of magnetic fixtures.
  • the substrate support assembly 600 can include a tilt drive 620 for tilting a portion of the substrate support assembly 600, particularly the portion including a substrate, e.g. the table body with table frame 540 and the ESF 630 in the coupled configuration. Tilting the portion of the substrate support assembly can involve a tilt motion 624. The tilt motion can involve rotating, along a defined angular range, the portion of the substrate support assembly around a common axis. Tilting of the substrate support assembly can bring the portion of the substrate support assembly from an essentially horizontal position into an essentially vertical position, such as the vertical position 626 shown in Fig. 6.
  • the vertical position 626 can be used advantageously for particular phases of a substrate processing operation, such as a material deposition operation.
  • the horizontal position can be used advantageously for other particular phases of a substrate processing operation, such as loading and/or unloading of the substrate.
  • the substrate support assembly 600 can include a lift pin assembly including lift pins 610 and lift pin drive 612.
  • the lift pin assembly can be configured for specifically lifting portions of the substrate support assembly 600, particularly for lifting the ESF 630 along a direction of ESF motion 614.
  • the direction of ESF motion 614 can be an axial direction according to embodiments described herein.
  • the action of the lift pin assembly can bring the substrate support assembly 600 from a coupled state into an uncoupled state 616 by lifting the ESF in an axial direction with respect to the table frame 540.
  • This can separate the first members 110 of the plurality of magnetic fixtures from the second members 120 of the plurality of magnetic fixtures. Separating the plurality of first members from the plurality of second members can bring each of the plurality of magnetic fixtures from a coupled state into an uncoupled state.
  • the uncoupled state 616 can be utilized for particular phases of a substrate processing method, such as loading and/or unloading of the substrate.
  • the lift pin assembly is configured for overcoming the magnetic force exerted by the plurality of magnetic fixtures between the table frame 540 and the ESF 630.
  • the magnetic force is typically highest when the fixture is in the coupled state and will diminish according to the local field strength of the magnetic field exhibited by the magnet within the plurality of first members 110.
  • the lift pin drive 612 can be configured for providing a controlled low-speed motion, particularly during the beginning of the separation process, to avoid a “bouncing” of the ESF 630 when the initial magnetic force has been overcome.
  • the lift pin drive 612 can be configured to not be overwhelmed by the increasing attractive forces and thus resulting in a “crash” of the ESF 630 against the table frame 540.
  • a substrate support assembly as described herein can be configured to be operated inside a vacuum chamber, particularly a vacuum chamber of a deposition apparatus.
  • the vacuum can be a constant vacuum, or the vacuum can be cycled, i.e. vary between a vacuum state and a pressurized state.
  • a flow chart illustrating one or more methods 700 of fixing an ESF to a table frame of a deposition apparatus is shown.
  • a plurality of first members of a magnetic fixture is provided.
  • the first members can be first members according to embodiments described herein, e.g. a first member 110.
  • the first members are coupled to the table frame.
  • the first members include a magnet.
  • the method 700 can include an operation 720.
  • operation 720 a plurality of second members of a magnetic fixture is provided.
  • the second members can be second members according to embodiments described herein, e.g. a second member 120.
  • the second members are coupled to the ESF.
  • the second members include a magnetic element.
  • the plurality of first members and the plurality of second members are arranged such that each first member faces a second member when the ESF is applied to the table frame. This can be implemented by arranging the plurality of first members and the plurality of second members according to an embodiment of a magnetic fixture or a substrate support assembly as described herein.
  • the method 700 can include an operation 730.
  • the ESF is applied to the table frame. Applying the ESF to the table frame results in a plurality of magnetic forces between the first members and the second members. The plurality of magnetic forces fixes the ESF to the table frame. Applying the ESF to the table frame can result in the ESF being coupled to the table frame.
  • the operation 730 can involve the action of a lift pin drive according to an embodiment described herein, particularly the lift pin assembly of the substrate support assembly 600.
  • the method 700 can include an operation for uncoupling the ESF from the table frame, such as by lifting the ESF off the table frame.
  • the method 700 can include an operation for processing a substrate.
  • a substrate can be fixed between the ESF and the table frame when the ESF is applied to the table frame.
  • the operation for processing the substrate can include tilting the ESF applied to the table frame, and the fixed substrate.
  • the operation for processing the substrate can include depositing a material onto the substrate.
  • the present disclosure refers to the use of a magnetic fixture according to an embodiment or embodiments described herein in a method for fixing an ESF to a table frame according to an embodiment or embodiments described herein.
  • the embodiments described herein can improve on known fixtures, such as mechanical fixtures, by providing a number of advantageous effects.
  • the embodiments described herein can function without additional mechanisms for interlocking the fixtures, and any drives for driving such an interlocking mechanism can be omitted. Since, according to embodiments, applying the ESF to the table frame or separating the ESF from the table frame already includes the coupling or decoupling of the magnetic fixture, no additional operation for coupling or decoupling, such as locking or unlocking the fixture needs to be performed. Furthermore, no sensor for sensing the correct locking or unlocking needs to be provided.
  • An embodiment of the present disclosure can therefore provide a more simple and robust solution for the described object, which can reduce cost and system complexity and/or increasing maintenance intervals, as well as the processing speed of related systems.

Abstract

A magnetic fixture for fixing an edge support frame (ESF) to a table frame of a deposition apparatus is described. The magnetic fixture comprises a first member with a magnet and a second member with a magnetic element. The first member and the second member are each coupled to at least one of the table frame and the ESF, wherein magnetic forces between the first member and the second member are configured to fix the ESF to the table frame.

Description

MAGNETIC FIXTURE, SUBSTRATE SUPPORT ASSEMBLY AND METHOD FOR FIXING AN EDGE SUPPORT FRAME TO A TABLE FRAME
FIELD
[0001] Embodiments of the present disclosure relate to a magnetic fixture, particularly a magnetic fixture fixing an edge support frame (ESF) to a table frame of a deposition apparatus. Embodiments of the present disclosure also relate to a substrate support assembly comprising a table frame, an ESF and a plurality of magnetic fixtures. Embodiments of the present disclosure also relate to a method for fixing an ESF to a table frame, particularly by providing a plurality of first members and a plurality of second members of a magnetic fixture.
BACKGROUND
[0002] Several methods are known for the deposition of a material on a substrate. For example, a substrate may be coated by using an evaporation process, a physical vapor deposition (PVD) process, such as a sputtering process, a spraying process, etc., or a chemical vapor deposition (CVD) process. A substrate on which material is deposited, i.e. a substrate to be coated, is introduced into a vacuum chamber of a vacuum processing system and is positioned relative to a processing area of the vacuum chamber of the vacuum processing system. For example, a coating process can take place in the vacuum chamber.
[0003] Coating processes, i.e. material deposition processes, may be considered for large area substrates, e.g. in display manufacturing technology. Coated substrates can be used further in several technical fields with applications e.g. in microelectronics, in the production of semiconductor devices, for substrates with thin film transistors, but also for insulating panels, etc. The tendency towards larger substrates, e.g. in manufacturing larger displays results in larger vacuum processing systems.
[0004] In a coating process, substrates may be held in a substrate support. Couplings of a substrate to a substrate support can involve mechanical fixtures which perform a clamping function. In light of the above, it is beneficial to provide an improved fixture for coupling an ESF to a table frame of a deposition apparatus.
SUMMARY
[0005] According to an aspect, a magnetic fixture for fixing an edge support frame to a table frame of a deposition apparatus is described. The magnetic fixture includes a first member with a magnet and a second member with a magnetic element. The first member and the second member are each coupled to at least one of the table frame and the edge support frame, wherein magnetic forces between the first member and the second member are configured to fix the edge support frame to the table frame.
[0006] According to an aspect, a substrate support assembly is described. The assembly includes a table body, a table frame coupled to the table body, and an edge support frame supported to be movable with respect to the table frame and having a plurality of recesses. The substrate support assembly has a plurality of magnetic fixtures, including a plurality of first members including magnets, and a plurality of second members including magnetic elements. At least one of the first members and the second members are provided in the plurality of recesses.
[0007] According to an aspect, a method for fixing an edge support frame to a table frame of a deposition apparatus is described. The method includes providing a plurality of first members of a magnetic fixture coupled to the table frame. The first members each include a magnet. The method includes providing a plurality of second members of a magnetic fixture coupled to the edge support frame. The second members each have a magnetic element. The plurality of first members and the plurality of second members are arranged such that each first member faces a second member when the edge support frame is applied to the table frame. The method further includes applying the edge support frame to the table frame. A plurality of magnetic forces between the first members and the second members fixes the edge support frame to the table frame. BRIEF DESCRIPTION OF THE DRAWINGS
[0008] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the disclosure and are described in the following.
[0009] Fig. 1 shows a schematic sectional side view of a fixture according to embodiments of the present disclosure;
[0010] Fig. 2 shows a schematic sectional side view of a fixture according to embodiments of the present disclosure;
[0011] Fig. 3 shows a schematic top-down view of a first member of a fixture according to embodiments of the present disclosure;
[0012] Fig. 4 shows a schematic top-down view of a second member of a fixture according to embodiments of the present disclosure;
[0013] Fig. 5 shows a schematic top-down view of a partial substrate support assembly according to embodiments of the present disclosure;
[0014] Fig. 6 shows a schematic side view of a substrate support assembly with a plurality of fixtures according to embodiments of the present disclosure;
[0015] Fig. 7 shows a flow chart illustrating one or more methods of fixing an ESF to a table frame of a deposition apparatus according to embodiments of the present disclosure.
DETAILED DESCRIPTION OF EMBODIMENTS
[0016] Deposition systems can include a substrate support assembly, often including a substrate support table such as a table body, and a table frame coupled to the table body. The table frame can be reversibly coupled to an edge support frame (ESF). The ESF can support a mask, such as a mask for edge exclusion. A substrate can be positioned between the table body and the edge support frame or the mask. [0017] For processing, a substrate is typically arranged between the table frame and the ESF, and the ESF is then coupled to the table frame. This holds the mask and the substrate in place for processing. The processing can involve tilting of the substrate support assembly for coating. After processing, the ESF is separated from the table frame and the coated substrate is exchanged. Hence, the coupling between the table frame and the ESF should be stable during processing and easily separable for exchanging the substrate.
[0018] Reference will now be made in detail to the various embodiments, one or more examples of which are illustrated in each figure. Each example is provided by way of explanation and is not meant as a limitation. For example, features illustrated or described as part of one embodiment can be used on or in conjunction with any other embodiment to yield yet a further embodiment. It is intended that the present disclosure includes such modifications and variations. Within the following description of the drawings, the same reference numbers refer to the same or to similar components. Generally, only the differences with respect to the individual embodiments are described. Unless specified otherwise, the description of a part or aspect in one embodiment can apply to a corresponding part or aspect in another embodiment as well.
[0019] Embodiments described herein particularly relate to components of deposition systems for the deposition of materials, e.g. for display manufacturing on large area substrates. According to some embodiments, large area substrates or carriers supporting one or more substrates may have a size of at least 0.5 m2 For instance, the deposition system may be adapted for processing large area substrates, such as substrates of GEN 5, which corresponds to about 1.4 m2 substrates (1.1 m x 1.3 m), GEN 7.5, which corresponds to about 4.29 m2 substrates (1.95 m x 2.2 m), GEN 8.5, which corresponds to about 5.7 m2 substrates (2.2 m x 2.5 m), or even GEN 10, which corresponds to about 8.7 m2 substrates (2.85 m * 3.05 m). Even larger generations such as GEN 11 and GEN 12 and corresponding substrate areas can similarly be implemented. According to yet further implementations, half sizes of the above- mentioned substrate generations can be processed. Alternatively or additionally, semiconductor wafers may be processed and coated in deposition systems according to the present disclosure. [0020] Embodiments described herein can particularly relate to components of a deposition system in which substrates, which can be substrates as described above, are loaded and unloaded in a horizontal configuration and in which the substrates are processed, e.g. coated, in a vertical configuration. Particularly, the components of the deposition system according to embodiments described herein are suitable for use in a deposition apparatus in which a substrate is supported in different configurations, particularly in a deposition apparatus including a tilt drive for moving a substrate between a horizontal and a vertical configuration.
[0021] Embodiments described herein particularly relate to fixtures which can be reversibly coupled and decoupled. The decoupling typically involves a motion which separates an ESF from a table frame. The ESF and the table frame can be provided horizontally, and the motion of the ESF can be performed in a substantially vertical direction. This direction shall, with respect to e.g. embodiments of a magnetic fixture described herein, be herein referred to as an axial direction.
[0022] Referring to Fig. 1, a magnetic fixture 100 according to embodiments described herein is shown schematically in a sectional view. In Fig. 1, the magnetic fixture 100 is shown in a possible configuration in which an ESF 130 is fixed to a table frame 140. This configuration will herein be referred to as a coupled state, a fixed state or a closed state.
[0023] According to embodiments, which can be combined with other embodiments described herein, the coupled state is a result of applying the ESF to the table frame. According to embodiments, which can be combined with other embodiments described herein, the ESF and the table frame should not be understood as being a part of the fixture.
[0024] As shown in Fig. 1, according to embodiments, the magnetic fixture 100 includes a first member 110 and a second member 120. The first member is coupled to the table frame 140, and the second member 120 is coupled to the ESF 130. Either coupling can be provided by fasteners, by adhesives, by welding, screwing, or by other elements. The coupling of the first member 110 to the table frame 140 and/or the coupling of the second member 120 to the ESF can be a permanent coupling, particularly a coupling that is only decoupled during maintenance or the like. [0025] As shown in Fig. 1, according to embodiments, the first member 110 includes a magnet 112. The magnet 112 produces a magnetic field, particularly when the magnetic fixture 100 is in the coupled state. The magnet 112 can be a permanent magnet, such as a neodymium magnet, particularly a N38 NdFeB magnet. Other permanent magnets can be suitable, such as samarium-cobalt magnets or an alnico magnet.
[0026] According to embodiments, which can be combined with other embodiments described herein, the magnet can be an electromagnet, particularly a switchable electromagnet. The electromagnet can have a coil. The coil can be adapted for interacting with a magnetic element, such as ferromagnetic element, particularly a ferromagnetic pin. The coil can be toroidal or a hollow cylinder, such that the coil has an interior hollow portion. The coil can be adapted for having a ferromagnetic pin at least partially inserted into a central hollow portion of the coil, such that the ferromagnetic pin interacts with the magnetic field produced by the electromagnet, particularly such that the ferromagnetic pin is attracted by the electromagnet. The electromagnet can be driven by a driving circuit. The driving circuit can be adapted for driving the electromagnet such that the strength of the magnetic field produced by the electromagnet is adjustable and/or variable. The adjustable and/or variable magnetic field can beneficially be used for tuning the attracting force between the electromagnet and the ferromagnetic element, particularly at specific timepoints.
[0027] As shown in Fig. 1, according to embodiments, the first member 110 can include one or more components which are not the magnet 112. Such components can serve different purposes, such as housing, cooling, shielding and/or aligning the magnet 112, providing a contact surface for the ESF 130 when in the coupled state, serving as a spacer between the ESF 130 and the table frame 140, allowing the adjustment of the distance between the magnet 112 and the second member 120, or the like.
[0028] According to embodiments, which can be combined with other embodiments described herein, the second member 120 includes a magnetic element 122. The magnetic element 122 can be the second member 120. The magnetic element 122 can be a ferromagnetic component, e.g. a metal component, such as a steel component, particularly a stainless-steel component, such as a component including DIN 1.2083 steel. The magnetic element 122 can comprise a ferromagnetic material. The second member 120 can include further materials or material combinations, such as a ferrite material, provided that the second member 120 interacts with the magnetic field produced by magnet 112 when the magnetic fixture 100 is in the coupled state such that an attracting force, e.g. a magnetic force, is exerted between the first member 110 and the second member 120. According to an embodiment, the magnetic element 122 can be a magnet configured for interacting with the magnet 112 such that the magnetic element 122 and the magnet 112 attract each other, particularly in the coupled state of the magnetic fixture 100.
[0029] As shown in Fig. 1, according to embodiments, the magnet 112 and the magnetic element 122 are brought into close contact when the magnetic fixture 100 is in the coupled state, such that the magnetic force between the first member 110 and the second member 120 is highest. According to a further embodiment, the resulting magnetic force in the closed state can be tuned by arranging the magnet 112 and the magnetic element 122 such that a defined gap is present between the magnet 112 and the magnetic element 122. The magnetic force can additionally be tuned by providing different size magnets 112 and/or magnetic elements 122; or by choosing magnets 112 with different grades of magnetization.
[0030] As shown in Fig. 1, according to embodiments, the magnet 112 and the magnetic element 122 can have similar dimensions and can be arranged such that they interact with one another across most or all of the surface facing the other component. This can have the beneficial effect that only an axial magnetic force, i.e. a force fixing the table frame 140 to the ESF 130 is exerted, and no radial or lateral forces arise.
[0031] According to embodiments, which can be combined with other embodiments described herein, the magnet and/or the magnetic element can be substantially disc-shaped and/or ring-shaped, e.g. toroidal and/or cylindrical and/or include a central hole/bore/indention or such. Such features can be beneficial for mounting and/or aligning the magnet and/or the magnetic element. Furthermore, such features can affect the magnetic field in a beneficial manner.
[0032] According to some embodiments, combinations of different morphologies can be beneficial, e.g. a cylindrical magnet with a disc-shaped magnetic element or a ring-shaped magnet with a cylindrical magnetic element, or such. According to a beneficial embodiment, if the magnet and/or the magnetic element are substantially round, e.g. disc-shaped and/or ring-shaped, along the axial direction, the magnet and the magnetic element can be arranged coaxially. Additional beneficial shapes, such as cubes, circular sections such as hemispheres or calottes, flat ribbons, pins, and others can be provided for both the magnet and the magnetic elements. According to embodiments, which can be combined with other embodiments described herein, the shape of the magnet and/or the magnetic element can be adapted to the respective portion of the table frame and/or ESF at which the fixture is provided, e.g. if the fixture is provided within a corner section, it can be beneficial for the magnet and/or the magnetic element to be L-shaped.
[0033] As shown in Fig. 1, according to embodiments, the second member 120 can be provided in a recess within the ESF 130 such that the second member is flush or slightly receded with respect to the surface of the ESF 130 opposite the table frame 140. This can be beneficial in that the ESF 130 will not contact the table frame 140 at a junction area between the magnet 112 and the magnetic element 122, such that the magnet 112 and/or the magnetic element 122 do not have to be particularly flat.
[0034] According to embodiments, which can be combined with other embodiments described herein, the first member can be partially or fully provided in a recess within the table frame, which can have the same beneficial effect as providing the second member within a recess.
[0035] According to embodiments, which can be combined with other embodiments described herein, the first member 110 can be coupled to the table frame 140 and the second member 120 can be coupled to the ESF 130. For clarity and conciseness, the embodiments shown in the figures show this arrangement. Alternatively, according to another embodiment, which can be combined with other embodiments described herein, the first member 110 can be coupled to the ESF 130 and the second member 120 can be coupled to the table frame 140.
[0036] According to embodiments, which can be combined with other embodiments described herein, the table frame and/or the ESF can be made of nonmagnetic materials, such as aluminum, particularly ACP5080 aluminum, or a high chrome stainless steel. This can limit or prevent any unwanted interaction between the magnetic field produced by the magnet and the table frame and/or the ESF. [0037] Referring to Fig. 2, a magnetic fixture 200 according to embodiments described herein is shown schematically in a sectional view. The magnetic fixture 200 includes several of the features of magnetic fixture 100 shown in Fig. 1; only new or different features shall be discussed in detail. In the embodiment shown in Fig. 2, the magnetic fixture 200 includes a contact block 210. The contact block 210 can be configured for providing the contact surfaces which contact the table frame 140 and, when the magnetic fixture 200 is in the coupled state, the ESF 130. This can be achieved by providing the further components of the first member 110 in a cavity or recess within the contact block 210, such that an edge of the contact block 210 protrudes, with respect to the further components of the first member 110, in the axial direction towards the ESF 130. The contact block 210 can house the magnet 112 and/or further components of the first member 110, such as a magnet housing 230 and/or a holder 220. The contact block 210 can be adapted for coupling the first member 110 to the table frame, e.g. by providing one or more openings for fasteners 240. By providing a contact block 210, mechanical forces within the magnetic fixture 200 in the coupled state, particularly the magnetic force pressing the ESF 130 to the table frame 140, are guided through the contact block. Thus, other components of the first member 110 are not subjected to these mechanical forces and thus do not need to be configured to withstand such mechanical stresses. Furthermore, the contact block 210 can include a material at the contact surface which reduces abrasion at the contact surface, particularly the contact surface of the ESF 130, due to repeated coupling and decoupling of the magnetic fixture 200. For this, the contact block 210 can include a non-magnetic material, for example, a non-magnetic sliding material, e.g. a polymer, such as a polymer coating, or be made of a polymer. The polymer can be PEEK and/or PI. The contact block can be made of bronze. The contact block can be made of a particulate material, such as a sintered material. The contact block 210 can be configured for dampening shocks, e.g. when the ESF 130 is coupled to the table frame 140.
[0038] As shown in Fig. 2, according to embodiments, the magnet 112 can be provided within the first member 110 by arranging the magnet within and/or between a magnet housing 230 and a holder 220. Both the magnet housing 230 and the holder 220 can be provided within a contact block 210, such as the contact block described above. [0039] As shown in Fig. 2, according to embodiments, the holder 220 can have openings, such as bores, particularly counterbored holes, for providing fastening elements, such as fasteners 240 therein. The holder can be configured for providing fastening elements, such as fasteners 240, for coupling the first member 110 to the table frame 140. The fasteners 240 can protrude in the axial direction, e.g. through the holder 220 and the contact block 210, towards the table frame 140, and be affixed to the table frame 140 inside bores 274 within the table frame 140, thus coupling the first member 110 to the table frame.
[0040] As shown in Fig. 2, according to embodiments, the holder 220 can have an opening, such as the recess 222 for providing the magnet 112 and/or a magnet housing 230 therein. The shape of the recess 222 can be adapted to the shape of the magnet 112 and/or the magnet housing 230. The recess 222 can be substantially cylindrical. The recess 222 can be a blind hole, e.g. a blind hole extending along the axial direction. The recess 222 can be configured to receive the magnet 112 and the magnet housing 230 from the side of the holder facing away from the second member 120. The recess 222 can be configured such that, when assembled, the magnet 112 and/or the magnet housing 230 are fully shielded from the outside of the first member 110 by the holder 220. The recess can include at least one protrusion 224, e.g. a protrusion protruding along the axial direction towards the table frame. The at least one protrusion can engage with the magnet 112, particularly engage with the magnet 112 for fixing the magnet 112 and/or the magnet housing 230 within the holder against sideways movement, such as movement in a radial direction. As shown in Fig. 2, the protrusion 224 can be a pin configured for being at least partially inserted into a central hole of a ring magnet.
[0041] As shown in Fig. 2, according to embodiments, the magnet 112 can be provided within the recess 222 together with a magnet housing 230. The magnet housing 230 can be configured to occupy at least some of the space within the recess 222 not filled by the magnet. The magnet housing 230 can function as an adapter for allowing different sized magnets 112 to be provided within different sized holders 220, different sized recesses 222 and/or different sized first members 110. The magnet housing 230 can, alone or in combination with the protrusion 224, fix the magnet against movement in a radial direction. Furthermore, as shown in Fig. 2, the magnet housing 230 can fix the magnet against movement in the axial direction, e.g. by pressing the magnet 112 in the axial direction against the holder 220. The magnet housing 230 can limit an axial and radial motion of the magnet 112 within the first member 110. The magnet housing 230 can be configured such that the magnet housing 230 does not directly contact the ESF-sided surface of the recess 222, as is shown in Fig. 2 by the resulting gap 260. Thus, an axial force pushing the holder 220 to the contact block 210 is passed through the magnet 112 and can be utilized for fixing, particularly force-fitting the magnet 112 against movement in the axial direction.
[0042] As shown in Fig. 2, according to embodiments, the first member 110 can have an elastic element provided within the recess 222 between the contact block 210 and the magnet housing 230. The elastic element can be a compressible component, particularly a spring or an elastomer. The elastic element can be an O-ring 250. The O-ring 250 can be provided within an annular groove within the surface of the magnet housing 230 adjacent to the inner surface of the contact block 210. The O-ring 250 can be a rubber-type O-ring, such as an O-ring made of FKM 70. The O-ring can be a spring-type O-ring, such as a Garter spring O-ring. Other types of elastic elements, such as rubber discs, coil springs or the like can be suitable.
[0043] According to embodiments, which can be combined with other embodiments herein, the first member 110, particularly the contact block 210, the holder 220, the magnet housing 230, the magnet 112 and the elastic element, which can be an O-ring 250, is configured to elastically compress the elastic element in the axial direction by the action of the fasteners 240. This compression leads to a pre- loading of the elastic element. The magnet housing 230, for example, by utilizing the pre-loading, permanently pushes the magnet 112 against the holder 220. Thus, the magnet 112 is force-fit between the magnet housing 230 and the holder 220 in the axial direction. The pre-loading force is typically chosen such that the magnet is seated firmly within the first member 110, but without causing excessive mechanical stress within the magnet 112 that could lead to cracking of the magnet 112.
[0044] According to embodiments, which can be combined with other embodiments described herein, advantageous materials for the holder 220 include stainless steel, particularly DIN 1.4301 steel. According to embodiments, which can be combined with other embodiments described herein, advantageous materials for the magnet housing 230 include stainless steel, particularly DIN 1.2083 steel. If the magnet housing 230 includes a magnetizable material, such as DIN 1.2083 steel, the magnetic field of magnet 112 can be advantageously affected by the magnet housing 230.
[0045] By providing the magnet and/or the magnet housing within a recess in the holder according to an embodiment described herein, the magnet is secured against unfavorable movement during operation. By force-fitting the magnet in the axial direction, some mechanical tolerances between components are possible, and differential expansion or contraction of the components of the fixture can be compensated. At the same time, the magnet is shielded from unwanted effects, such as high temperature variations, mechanical stress due to thermal expansion or mechanical impacts, chemical contamination etc., which could negatively affect the properties of the magnet over time, e.g. by loss of magnetization or material degradation. Furthermore, even if the magnet is degraded, the magnet can be easily accessed and exchanged, thus allowing maintenance of the fixture to be performed fast and cost- effectively.
[0046] As shown in Fig. 2, according to embodiments, the second member 120 can include a fastener and a magnetic element 122. The magnetic element 122 can be the second member 120, such that the fastener portion is also a magnetic element portion. As shown in Fig. 2, the magnetic element can be at least partially disc-shaped. The magnetic element can have a disc-shaped portion provided within a recess 270 within the ESF. The second member 120 can have a fastener portion and a magnetic element portion. The fastener portion can be configured for fastening the second member 120 within a bore 272 in the ESF. The second member can have a socket 276 provided in the surface portion facing the first member for attaching a tool for driving the second member into the bore 272. The second member 120 can be a low-cost part, such as a large diameter flat head screw.
[0047] Referring to Fig. 3, a first member 300 of a magnetic fixture according to embodiments described herein is shown schematically in a top-down view. The face of the first member 300 including the contacting surface for contacting the ESF in the coupled state is shown in an uncoupled configuration. The first member 300 can be a first member 110 of a magnetic fixture 100 or a magnetic fixture 200 as discussed with reference to Fig. 1 or 2. [0048] As shown in Fig. 3, the first member 300 has a rectangular profile with a lengthwise and a traverse symmetry. The first member 300 includes a holder 220 provided within a contact block 210. The holder 220 has two counterbored holes provided for receiving fasteners 240 for coupling the first member to a table frame (not shown). As indicated in Fig. 3 by the dotted lines representing the magnet 112 and the magnet housing 230, these features lie on the inside of the first member behind the surface of the holder 220 and are not accessible in the configuration shown in Fig. 3.
[0049] According to embodiments, which can be combined with other embodiments described herein, the contacting surface of the first member 300 that contacts the ESF in the fixed state will be the portion of the contact block 210 which is visible in Fig. 3. This can be achieved by providing the other components of the first member 300, particularly the holder 220 and the fasteners 240, slightly receded within the contact block. The holder 220 can be receded in a range of 0.05 mm to 1 mm. The contacting surface can directly contact the ESF. In another embodiment, the holder 220 can be configured for including the contacting surface, in which case the holder 220 can be provided flush with the contact block 210 inside the contact block 210, or even protrude from the contact block 210.
[0050] Referring to Fig. 4, a second member 400 of a magnetic fixture according to embodiments described herein is shown schematically in a top-down view. The second member 400 is shown in a configuration in which the second member 400 is coupled to an ESF 130. The ESF 130 is not part of the second member 400. The second member 400 can be a second member 120 of a magnetic fixture 100 or a magnetic fixture 200 as discussed with reference to Fig. 1 or 2.
[0051] As shown in Fig. 4, according to embodiments, the second member 400 can be a single component, such that the magnetic element 122 consists of the second member 400. Alternatively, according to embodiments, the second member can include a magnetic element 122 and e.g. a fastener, a coating or the like. As shown in Fig. 4, the second member 400 can include a socket 276 for easily mounting the second member 400 to the ESF 130.
[0052] Referring to both Fig. 3 and Fig. 4, according to embodiments, the magnet 112 of the first member 300 in combination with the magnet housing 230, and the magnetic element 122 of the second member 400 can both interact, via magnetic forces, across disc-shaped surface portions of the respective member when the fixture is in the coupled state. As shown in Fig. 3 and Fig. 4, these surface portions can have a similar or equal size, however, according to embodiments, the first member or the second member can be sized such that the respective surface portions have different sizes, e.g. the second surface portion may have a bigger or a smaller diameter than the first surface portion.
[0053] Referring to Fig. 5, a partial substrate support assembly 500 according to embodiments of the present disclosure is shown schematically in a top-down view. The substrate support assembly 500 includes a table body 510 and a table frame 540. The table body 510 can be configured for supporting a substrate (not shown).
[0054] As shown in Fig. 5, according to embodiments, the table frame 540 can be a table frame according to embodiments described herein, such as table frame 140. The table frame 540 can include a plurality of first members 110 of magnetic fixtures according to embodiments described herein, such as a magnetic fixture 100 or a magnetic fixture 200. According to embodiments, which can be combined with embodiments described herein, the plurality of first members 110 is evenly spaced around the table frame 540 such that the forces resulting from fixing an ESF (not shown) to the table frame 540 by means of the plurality of first members 110 interacting with a plurality of second members (not shown) to form a plurality of magnetic fixtures are evenly distributed around the substrate support assembly 500. According to embodiments, possible configurations of magnetic fixtures are not limited to the configuration shown in Fig. 5 and can include any number of magnetic fixtures in any configuration.
[0055] Referring to Fig. 6, a substrate support assembly 600 with a plurality of fixtures according to embodiments described herein is shown schematically in a side view. The substrate support assembly 600 can include some or all of the elements of substrate support assembly 500. The substrate support assembly 600 includes a table body with a table frame 540. The table frame 540 can be a table frame according to the table frame 540 discussed with reference to Fig. 5. According to the embodiment shown in Fig. 6, the first members 110 of the plurality of magnetic fixtures are provided within recesses within the table frame. According to another embodiment, which can be combined with other embodiments described herein, the first members can be provided outside of any recesses, e.g. coupled to a flat table frame, such that the first members protrude in the axial direction towards the ESF 630.
[0056] As shown in Fig. 6, according to embodiments, the substrate support assembly includes an ESF 630. The ESF 630 is drawn in a coupled configuration with solid lines. According to embodiments, which can be combined with other embodiments described herein, the ESF 630 includes a plurality of second members of magnetic fixtures according to an embodiment described herein, e.g. a second member 120. The second members can be arranged such that they are opposite the first members 110 when the substrate support assembly is in the coupled configuration, such that they, together with the adjacent first members 110, form a magnetic fixture in a coupled state according to an embodiment of the present disclosure. The plurality of second members can be provided within a plurality of recesses within the ESF 630.
[0057] According to embodiments, which can be combined with other embodiments described herein, the substrate support assembly 600 can have a substrate (not shown) arranged between the table frame 540 and the ESF 630. The substrate can be fixed between the table frame 540 and the ESF 630. The substrate can be fixed, e.g. clamped between the table frame 540 and the ESF 630, by the force provided by the plurality of magnetic fixtures.
[0058] As shown in Fig. 6, according to embodiments, the substrate support assembly 600 can include a tilt drive 620 for tilting a portion of the substrate support assembly 600, particularly the portion including a substrate, e.g. the table body with table frame 540 and the ESF 630 in the coupled configuration. Tilting the portion of the substrate support assembly can involve a tilt motion 624. The tilt motion can involve rotating, along a defined angular range, the portion of the substrate support assembly around a common axis. Tilting of the substrate support assembly can bring the portion of the substrate support assembly from an essentially horizontal position into an essentially vertical position, such as the vertical position 626 shown in Fig. 6. The vertical position 626 can be used advantageously for particular phases of a substrate processing operation, such as a material deposition operation. The horizontal position can be used advantageously for other particular phases of a substrate processing operation, such as loading and/or unloading of the substrate. [0059] As shown in Fig. 6, according to embodiments, the substrate support assembly 600 can include a lift pin assembly including lift pins 610 and lift pin drive 612. The lift pin assembly can be configured for specifically lifting portions of the substrate support assembly 600, particularly for lifting the ESF 630 along a direction of ESF motion 614. The direction of ESF motion 614 can be an axial direction according to embodiments described herein.
[0060] As shown in Fig. 6, according to embodiments, the action of the lift pin assembly can bring the substrate support assembly 600 from a coupled state into an uncoupled state 616 by lifting the ESF in an axial direction with respect to the table frame 540. This can separate the first members 110 of the plurality of magnetic fixtures from the second members 120 of the plurality of magnetic fixtures. Separating the plurality of first members from the plurality of second members can bring each of the plurality of magnetic fixtures from a coupled state into an uncoupled state.
[0061] According to embodiments, which can be combined with other embodiments described herein, the uncoupled state 616 can be utilized for particular phases of a substrate processing method, such as loading and/or unloading of the substrate.
[0062] According to embodiments, which can be combined with other embodiments described herein, the lift pin assembly, particularly the lift pin drive, is configured for overcoming the magnetic force exerted by the plurality of magnetic fixtures between the table frame 540 and the ESF 630. The magnetic force is typically highest when the fixture is in the coupled state and will diminish according to the local field strength of the magnetic field exhibited by the magnet within the plurality of first members 110. For this reason, the lift pin drive 612 can be configured for providing a controlled low-speed motion, particularly during the beginning of the separation process, to avoid a “bouncing” of the ESF 630 when the initial magnetic force has been overcome. Likewise, when lowering the ESF from the uncoupled state 616, the lift pin drive 612 can be configured to not be overwhelmed by the increasing attractive forces and thus resulting in a “crash” of the ESF 630 against the table frame 540.
[0063] According to embodiments, which can be combined with embodiments described herein, a substrate support assembly as described herein, particularly a substrate support assembly 500 or a substrate support assembly 600, can be configured to be operated inside a vacuum chamber, particularly a vacuum chamber of a deposition apparatus. The vacuum can be a constant vacuum, or the vacuum can be cycled, i.e. vary between a vacuum state and a pressurized state.
[0064] Referring to Fig. 7, a flow chart illustrating one or more methods 700 of fixing an ESF to a table frame of a deposition apparatus is shown. In operation 710, a plurality of first members of a magnetic fixture is provided. The first members can be first members according to embodiments described herein, e.g. a first member 110. The first members are coupled to the table frame. The first members include a magnet.
[0065] As shown in Fig. 7, according to embodiments which can be combined with other embodiments described herein, the method 700 can include an operation 720. In operation 720, a plurality of second members of a magnetic fixture is provided. The second members can be second members according to embodiments described herein, e.g. a second member 120. The second members are coupled to the ESF. The second members include a magnetic element.
[0066] According to embodiments of the method 700, which can be combined with other embodiments described herein, the plurality of first members and the plurality of second members are arranged such that each first member faces a second member when the ESF is applied to the table frame. This can be implemented by arranging the plurality of first members and the plurality of second members according to an embodiment of a magnetic fixture or a substrate support assembly as described herein.
[0067] As shown in Fig. 7, according to embodiments which can be combined with other embodiments described herein, the method 700 can include an operation 730. In operation 730, the ESF is applied to the table frame. Applying the ESF to the table frame results in a plurality of magnetic forces between the first members and the second members. The plurality of magnetic forces fixes the ESF to the table frame. Applying the ESF to the table frame can result in the ESF being coupled to the table frame.
[0068] According to embodiments of the method 700, which can be combined with other embodiments described herein, the operation 730 can involve the action of a lift pin drive according to an embodiment described herein, particularly the lift pin assembly of the substrate support assembly 600.
[0069] According to embodiments, which can be combined with other embodiments described herein, the method 700 can include an operation for uncoupling the ESF from the table frame, such as by lifting the ESF off the table frame.
[0070] According to embodiments, which can be combined with other embodiments described herein, the method 700 can include an operation for processing a substrate. Particularly, a substrate can be fixed between the ESF and the table frame when the ESF is applied to the table frame. The operation for processing the substrate can include tilting the ESF applied to the table frame, and the fixed substrate. The operation for processing the substrate can include depositing a material onto the substrate.
[0071] According to an aspect, the present disclosure refers to the use of a magnetic fixture according to an embodiment or embodiments described herein in a method for fixing an ESF to a table frame according to an embodiment or embodiments described herein.
[0072] The embodiments described herein, particularly a magnetic fixture, a substrate support assembly and/or a method for fixing an ESF to a table frame of a deposition apparatus according to embodiments described herein, can improve on known fixtures, such as mechanical fixtures, by providing a number of advantageous effects. Particularly, the embodiments described herein can function without additional mechanisms for interlocking the fixtures, and any drives for driving such an interlocking mechanism can be omitted. Since, according to embodiments, applying the ESF to the table frame or separating the ESF from the table frame already includes the coupling or decoupling of the magnetic fixture, no additional operation for coupling or decoupling, such as locking or unlocking the fixture needs to be performed. Furthermore, no sensor for sensing the correct locking or unlocking needs to be provided. An embodiment of the present disclosure can therefore provide a more simple and robust solution for the described object, which can reduce cost and system complexity and/or increasing maintenance intervals, as well as the processing speed of related systems. [0073] While the foregoing is directed to implementations of the present disclosure, other and further implementations of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims

1. A magnetic fixture for fixing an edge support frame to a table frame of a deposition apparatus, the magnetic fixture comprising: a first member comprising a magnet, a second member comprising a magnetic element, wherein the first member and the second member are each coupled to at least one of the table frame and the edge support frame, wherein magnetic forces between the first member and the second member are configured to fix the edge support frame to the table frame.
2. The magnetic fixture according to claim 1, wherein the magnet comprises a permanent magnet.
3. The magnetic fixture according to claim 1 or 2, wherein the magnetic element comprises a ferromagnetic material.
4. The magnetic fixture according to any of the preceding claims, wherein the first member comprises a contact block for housing the magnet, wherein the contact block contacts the edge support frame when the edge support frame is applied to the table frame.
5. The magnetic fixture according to any of the preceding claims, wherein the first member comprises a magnet housing, wherein the magnet housing secures the magnet within the first member, and wherein the magnet housing limits an axial and radial motion of the magnet within the first member.
6. The magnetic fixture according to claim 4, wherein the magnet housing is provided within a holder, and wherein the holder is configured according to one or more of the following:
- the holder is provided within the contact block;
- the holder has an opening for providing the magnet housing therein, the opening being open in an axial direction facing the table frame and closed in the axial direction facing the edge support frame; - the holder is configured for providing one or more fastening elements for coupling the first member to the table frame; and
- the holder is configured for pressing the magnet housing against the contact block in an axial direction.
7. The magnetic fixture according to claim 6, the magnetic fixture comprising an elastic element between the magnet housing and the contact block, wherein the elastic element is configured for being compressed between the magnet housing and the contact block, and wherein the elastic element is configured for providing a force along the axial direction between the magnet housing and the holder when the elastic element is compressed.
8. The magnetic fixture according to claim 7, wherein the elastic element is an Ciring provided within a groove within the magnet housing, wherein the groove is provided within a surface of the magnet housing adjacent to the contact block.
9. The magnetic fixture according to any of the preceding claims, wherein the magnetic element is at least partially disc-shaped.
10. The magnetic fixture according to any of the preceding claims, wherein the second member is provided within a recess in the edge support frame.
11. A substrate support assembly, comprising: a table body; a table frame coupled to the table body; an edge support frame supported to be movable with respect to the table frame and having a plurality of recesses; and a plurality of magnetic fixtures, comprising: a plurality of first members comprising magnets, a plurality of second members comprising magnetic elements, wherein at least one of the first members and the second members are provided in the plurality of recesses.
12. The substrate support assembly according to claim 11, the substrate support assembly comprising a plurality of lift pins for reversibly lifting and/or lowering the edge support frame with respect to the table frame, wherein lifting the edge support frame separates the plurality of magnetic fixtures between the table frame and the edge support frame, and wherein lowering the edge support frame applies the edge support frame to the table frame such that the plurality of magnetic fixtures is formed.
13. The substrate support assembly according to any of the claims 11 or 12, wherein the table frame and the edge support frame are provided within a vacuum chamber of a deposition apparatus.
14. The substrate support assembly according to any of the claims 11 to 13, wherein the substrate support assembly comprises a tilt drive, wherein the tilt drive is configured for tilting the table body between a horizontal and a vertical position.
15. A method for fixing an edge support frame to a table frame of a deposition apparatus, comprising:
- providing a plurality of first members of a magnetic fixture coupled to the table frame, the first members each comprising a magnet,
- providing a plurality of second members of the magnetic fixture coupled to the edge support frame, the second members each comprising a magnetic element, wherein the plurality of first members and the plurality of second members are arranged such that each first member faces a second member when the edge support frame is applied to the table frame,
- applying the edge support frame to the table frame, wherein a plurality of magnetic forces between the plurality of first members and the plurality of second members fixes the edge support frame to the table frame.
PCT/EP2020/080405 2020-10-29 2020-10-29 Magnetic fixture, substrate support assembly and method for fixing an edge support frame to a table frame WO2022089746A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN202080106801.XA CN116368435A (en) 2020-10-29 2020-10-29 Magnetic mount, substrate support assembly, and method for securing an edge support frame to a table frame
KR1020237017589A KR20230096036A (en) 2020-10-29 2020-10-29 Magnetic fixture, substrate support assembly and method for securing an edge support frame to a table frame
PCT/EP2020/080405 WO2022089746A1 (en) 2020-10-29 2020-10-29 Magnetic fixture, substrate support assembly and method for fixing an edge support frame to a table frame

Applications Claiming Priority (1)

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5224581A (en) * 1989-12-14 1993-07-06 Applied Materials, Inc. Magnetic semiconductor wafers with handling apparatus and method
US20060275547A1 (en) * 2005-06-01 2006-12-07 Lee Chung J Vapor Phase Deposition System and Method
US20070006807A1 (en) * 2005-04-20 2007-01-11 Dieter Manz Magnetic mask holder
US20100034625A1 (en) * 2008-08-08 2010-02-11 Applied Materials, Inc. Magnetic pad for end-effectors
KR20140038592A (en) * 2012-09-20 2014-03-31 주식회사 원익아이피에스 Substrate processing apparatus
WO2020164687A1 (en) * 2019-02-12 2020-08-20 Applied Materials, Inc. Holder for substrate processing in a vacuum chamber, holding arrangement, system and method
WO2020180334A1 (en) * 2019-03-07 2020-09-10 Applied Materials, Inc. Mask frame integration, carrier for mask frame and method of handling a mask
KR102165032B1 (en) * 2019-08-09 2020-10-13 주식회사 선익시스템 Substrate alignment apparatus and thin film deposition system including the same

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5224581A (en) * 1989-12-14 1993-07-06 Applied Materials, Inc. Magnetic semiconductor wafers with handling apparatus and method
US20070006807A1 (en) * 2005-04-20 2007-01-11 Dieter Manz Magnetic mask holder
US20060275547A1 (en) * 2005-06-01 2006-12-07 Lee Chung J Vapor Phase Deposition System and Method
US20100034625A1 (en) * 2008-08-08 2010-02-11 Applied Materials, Inc. Magnetic pad for end-effectors
KR20140038592A (en) * 2012-09-20 2014-03-31 주식회사 원익아이피에스 Substrate processing apparatus
WO2020164687A1 (en) * 2019-02-12 2020-08-20 Applied Materials, Inc. Holder for substrate processing in a vacuum chamber, holding arrangement, system and method
WO2020180334A1 (en) * 2019-03-07 2020-09-10 Applied Materials, Inc. Mask frame integration, carrier for mask frame and method of handling a mask
KR102165032B1 (en) * 2019-08-09 2020-10-13 주식회사 선익시스템 Substrate alignment apparatus and thin film deposition system including the same

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