KR102553751B1 - Mask handling module for in-line substrate processing system and method for mask transfer - Google Patents

Abstract

A mask handling module for an in-line substrate processing system, a vacuum processing system for in-line processing of a substrate, and a method for mask transfer are provided and described. The mask handling module includes a vacuum rotation chamber provided between a first vacuum chamber and a second vacuum chamber in an in-line substrate processing system, a rotation mechanism in the vacuum rotation chamber, and a first mask stage having a first mask holder assembly - a first mask stage. a mask stage mounted to a rotation mechanism for rotation of the first mask stage, and a second mask stage having a second mask holder assembly, the second mask stage mounted to the rotation mechanism for rotation of the second mask stage. a mask handling assembly configured for transporting a first mask between the first mask stage and the mask handling chamber, a first substrate transport track associated with the first mask stage and configured to support a first substrate carrier - a first mask holder assembly. , configured for second mask transport between the first mask stage and the first substrate carrier, and a second substrate transport track associated with the second mask stage and configured to support the second substrate carrier.

Description

Mask handling module for in-line substrate processing system and method for mask transfer

[0001] Embodiments of the present disclosure relate to an in-line substrate processing system. Embodiments of the present disclosure may be particularly useful in a mask handling module for an in-line substrate processing system, a vacuum processing system for in-line processing of a substrate, and, for example, an in-line material deposition method on a substrate or a substrate processing method. It relates to a method for mask transfer.

[0002] Organic light-emitting diodes (OLEDs) are a special type of light-emitting diode in which an emitting layer comprises a thin film of certain organic compounds. OLEDs are used in the manufacture of television screens, computer monitors, mobile phones, other hand-held devices and the like for displaying information. OLEDs can also be used for general space lighting. The range of colors and brightness possible using OLED displays is greater than that of conventional LCD displays because the OLED material emits light directly. The energy consumption of OLED displays is significantly less than that of conventional LCD displays.

Additionally, the fact that OLEDs can be fabricated on flexible substrates leads to additional applications. For example, a typical OLED display may include organic material layers positioned between two electrodes, eg, electrodes of a metallic material. An OLED is typically placed between two glass panels, and the edges of the glass panels are sealed to encapsulate the OLED therein. Alternatively, the OLED can be encapsulated using thin film technology, eg using a barrier film.

[0004] The process of manufacturing OLED displays includes thermal evaporation of organic materials in high vacuum and deposition of organic materials on a substrate. It is advantageous to complement this process by using a mask to pattern the organic layers on the substrate during deposition. Here, the mask is held close to the substrate during deposition of the organic layers, and the substrate is typically arranged behind the mask and aligned with respect to the mask during deposition. However, the need for a mask during deposition of organic materials increases the complexity of the OLED display manufacturing process. For example, prior to deposition of organic materials, the mask must be transferred into a high vacuum OLED display manufacturing system. Additionally, since any particle generation can degrade the OLED display manufacturing system, transfer of the mask into the OLED display manufacturing system should be performed with reduced or minimized particle generation. However, additional mask handling in the processing system can have a significant impact on the cost of ownership of the system.

Accordingly, there is a continuing need for new and improved apparatuses and methods for mask transfer into OLED display manufacturing systems.

[0006] In view of the foregoing, a mask handling module for an in-line substrate processing system, a vacuum processing system for in-line processing of a substrate, and a method for mask transfer are provided. The present disclosure aims to simplify the transfer of clean, unused masks into an in-line substrate processing system. Therefore, the footprint of the in-line substrate processing system on the substrates is reduced. Further, the present disclosure aims to enable reuse of a mask after deposition of materials, such as organic or metallic materials, on a substrate without interrupting the in-line substrate processing system. Further, the present disclosure aims to facilitate transport of masks in an in-line substrate processing system. Additionally, the present disclosure aims to help remove used masks from an in-line substrate processing system at regular time intervals, such as to clean used masks or exchange used masks.

[0007] Additional aspects, benefits and features of the present disclosure are apparent from the claims, detailed description and accompanying drawings.

[0008] According to an aspect of the present disclosure, a mask handling module for an in-line substrate processing system is provided. The mask handling module includes a vacuum rotation chamber provided between a first vacuum chamber and a second vacuum chamber in the in-line substrate processing system. Additionally, the mask handling module includes a rotation mechanism within the vacuum rotation chamber. The mask handling module also includes a first mask stage having a first mask holder assembly, the first mask stage being mounted to a rotation mechanism for rotation of the first mask stage. Additionally, the mask handling module includes a second mask stage having a second mask holder assembly, the second mask stage mounted to a rotation mechanism for rotation of the second mask stage. Additionally, the mask handling module includes a mask handling assembly configured for transferring a first mask between a first mask stage and a mask handling chamber. Additionally, the mask handling module includes a first substrate transport track associated with the first mask stage and configured to support the first substrate carrier, the first mask holder assembly comprising: a first mask holder assembly between the first mask stage and the first substrate carrier. configured for second mask transfer. The mask handling module also includes a second substrate transport track associated with the second mask stage and configured to support a second substrate carrier.

[0009] According to another aspect of the present disclosure, a vacuum processing system for in-line processing of a substrate is provided. A vacuum processing system includes a mask handling module, a substrate loading area and a processing area according to embodiments of the present disclosure.

[0010] According to a further aspect of the present disclosure, a method for mask transfer in a vacuum processing system is provided. A method for mask transfer in a vacuum processing system includes transferring a first substrate carrier into a vacuum rotation chamber, transferring a first mask supported by a first mask holder assembly from a first mask stage to the first substrate carrier. transporting the first substrate carrier out of the vacuum rotation chamber, and rotating a rotation mechanism supporting the first mask stage in the vacuum rotation chamber by an angle of about 180 degrees.

[0011] According to a further aspect of the present disclosure, a method for mask transfer in a vacuum processing system is provided. A method for mask transfer in a vacuum processing system includes transporting a first substrate carrier into a vacuum rotation chamber along a first direction; transporting the second substrate carrier into the vacuum rotation chamber along a second direction opposite the first direction; transferring the first mask supported by the first mask holder assembly from the first mask stage to the first substrate carrier; transferring a second mask supported by the second substrate carrier from the second substrate carrier to a second mask stage; transporting the first substrate carrier out of the vacuum rotation chamber along a first direction; and transporting the second substrate carrier out of the vacuum rotation chamber along a second direction.

[0012] According to still further aspects, methods for mask transfer in a vacuum processing system may be included in methods for material deposition on a substrate and/or methods for substrate processing, eg, in a vacuum processing system.

[0013] A more detailed description of the present disclosure briefly summarized above may be made by referring to the embodiments in such a way that the above-mentioned features of the present disclosure may be understood in detail. The accompanying drawings relate to embodiments and are described in the following:
1A shows a schematic cross-sectional plan view of a mask handling module for an in-line substrate processing system, in accordance with embodiments described herein;
1B shows a schematic cross-sectional side view of a mask handling module for an in-line substrate processing system, in accordance with embodiments described herein;
1C shows a schematic cross-sectional view of a section of a mask handling module for an in-line substrate processing system, in accordance with embodiments described herein;
2 shows a schematic cross-sectional plan view of a mask handling module for an in-line substrate processing system, in accordance with additional embodiments described herein;
3 shows a flow chart illustrating a method for mask transfer and/or in-line material deposition on a substrate, in accordance with embodiments described herein;
4A-4D show transport of a first substrate carrier and a second substrate carrier into a vacuum rotation chamber for an in-line substrate processing system, a first substrate carrier from a first mask stage, according to embodiments described herein. Schematic diagram of a section of a vacuum rotation chamber during transfer of the first mask to the furnace, transfer of the second mask from the second substrate carrier to the second mask stage, and transfer of the first substrate carrier and the second substrate carrier out of the vacuum rotation chamber. shows cross-sectional plan views;
5 is a view of a section of a vacuum rotation chamber during rotation by an angle of about 180° of a rotation mechanism supporting a first mask stage in a vacuum rotation chamber for an in-line substrate processing system, in accordance with embodiments described herein. show schematic cross-sectional plan views;
6 shows a vacuum during rotation by an angle of about 90° of a rotation mechanism supporting a first mask stage and a second mask stage in a vacuum rotation chamber for an in-line substrate processing system, in accordance with embodiments described herein. shows schematic cross-sectional plan views of a section of the rotation chamber; and
7 shows a schematic plan view of a vacuum processing system for in-line processing of a substrate, in accordance with embodiments described herein.

[0014] Reference will now be made in detail to various embodiments, one or more examples of which are illustrated in the drawings. Within the following description of the drawings, like reference numbers refer to like components. In general, only differences for individual embodiments are described. Each example is provided by way of explanation of the present disclosure, and is not to be construed as a limitation of the present disclosure. Additionally, features illustrated or described as part of one embodiment may be used on or in conjunction with other embodiments, yielding still further embodiments. The detailed description is intended to cover such modifications and variations.

[0015] The process of manufacturing OLED displays may include thermal evaporation of organic materials in high vacuum and deposition of organic materials on a substrate. Depending on the display technology, use of a mask to pattern organic layers on the substrate during deposition may be provided. Accordingly, OLED display manufacturing processes utilizing a mask can be complicated due to additional processes to be accomplished to transfer the mask into an OLED display manufacturing system, eg, in a high vacuum. Additionally, since particle generation can degrade the OLED display manufacturing system, transfer of the mask into the OLED display manufacturing system should be performed with reduced or minimized particle generation.

[0016] Embodiments of the present disclosure relate to a mask handling module for an in-line substrate processing system, a vacuum processing system for in-line processing of a substrate, and a method for mask transfer. Accordingly, the in-line substrate processing system may be a display manufacturing system or part of a display manufacturing system, in particular an OLED display manufacturing system, and more specifically an OLED display manufacturing system for large area substrates. Transport of the mask or substrate carrier, ie movement of the substrate carrier through the in-line substrate processing system, may be provided, in particular, in a vertical orientation of the substrate carrier. For example, substrate carriers may be configured to hold a substrate, such as a glass plate, in a homeotropic orientation.

[0017] In some embodiments, a mask may include a mask frame. Additionally, the mask may include a sheet having an aperture or a plurality of apertures, held by the mask frame. The mask frame may be configured to support and hold the sheet, which may be a particularly delicate component. For example, a mask frame may surround the sheet. The sheet may be permanently fixed to the mask frame, for example by welding, or the sheet may be releasably fixed to the mask frame. A circumferential edge of the sheet may be fixed to the mask frame. The mask stage may be configured to hold the mask by any means, such as through the use of mechanical holders, electromagnetic holders and/or electropermanent holders.

[0018] The mask may include an opening or plurality of openings, which may be formed into a pattern for depositing a corresponding material pattern on a substrate by a masked deposition process. During deposition, the mask may be arranged at a close distance to the front of the substrate or in direct contact with the front surface of the substrate. For example, the mask can be, for example, an edge exclusion mask or a mask that separates two or more devices being fabricated on a large area display.

[0019] In some embodiments, the mask may be at least partially made of a metal, eg, a metal having a small coefficient of thermal expansion, such as invar. The mask may include a magnetic material so that the mask can be magnetically attracted toward the substrate during deposition. In some embodiments, the mask and/or mask frame can include a magnetic material so that the mask and/or mask frame can be attracted to the mask stage or to the substrate carrier by magnetic forces.

[0020] According to some embodiments, which can be combined with other embodiments described herein, substrate carriers can be configured to hold or support a substrate or a substrate and mask in a substantially vertical orientation. Additionally, the mask stage can be configured to hold or support the mask in a substantially vertical orientation. As used throughout this disclosure, "substantially perpendicular", particularly when referring to a substrate orientation, refers to allowing for a deviation of ±20° or less, such as ±10° or less, from a vertical direction or orientation. I understand. This deviation may be provided, for example, because a substrate support having a slight deviation from homeotropic orientation may result in a more stable substrate position. Additionally, when the substrate is tilted in the forward direction, fewer particles reach the substrate surface. However, during deposition of materials such as organic or metallic materials on a substrate, for example in high vacuum, the substrate orientation is considered substantially vertical, which is different from horizontal substrate orientation, which may be considered horizontal ±20° or less.

[0021] According to some embodiments, which can be combined with other embodiments described herein, a substrate carrier is an electrostatic chuck that provides electrostatic force to hold a substrate and optionally a mask in the substrate carrier and in particular at a support surface. (E-chuck). By way of example, the substrate carrier includes an electrode arrangement configured to provide an attractive force acting on the substrate.

[0022] Embodiments described herein may be utilized for deposition of materials such as organic or metallic materials on large area substrates, for example for OLED display manufacturing. Specifically, substrates on which structures and methods according to embodiments described herein are provided may be large area substrates. For example, a large-area substrate may be GEN 4.5, which corresponds to a surface area of about 0.67 m² (0.73 x 0.92 m), and GEN 5, which corresponds to a surface area of about 1.4 m² (1.1 m x 1.3 m), about 4.29 m² (1.95 m x 2.2 m). GEN 7.5 corresponding to a surface area of about 5.7 m² (2.2 m x 2.5 m), GEN 8.5 corresponding to a surface area of about 5.7 m² (2.2 m x 2.5 m), or even GEN 10 corresponding to a surface area of about 8.7 m² (2.85 m x 3.05 m). Even larger generations, such as GEN 11 and GEN 12, and corresponding surface areas can similarly be implemented. Half sizes of GEN generations can also be provided in OLED display manufacturing.

[0023] According to some embodiments, which may be combined with other embodiments described herein, the substrate thickness may be 0.1 to 1.8 mm. The substrate thickness may be less than or equal to about 0.9 mm, such as 0.5 mm. The term "substrate" as used herein may encompass, among other things, substantially inflexible substrates, such as glass plates or other substrates. However, the present disclosure is not limited thereto, and the term "substrate" may also encompass flexible substrates, such as webs or foils. The term "substantially inflexible" is understood to be distinct from "flexible". Specifically, a substantially inflexible substrate, such as a glass plate having a thickness of 0.9 mm or less, such as 0.5 mm or less, may have some degree of flexibility, wherein, when compared to flexible substrates, substantially no The flexibility of the inflexible substrate is small.

Referring illustratively to FIGS. 1A and 1B , embodiments of a mask handling module 100 for an in-line substrate processing system are described. In particular, cross-sectional plan views and cross-sectional side views of the mask handling module 100 are shown in FIGS. 1A and 1B , respectively. As exemplarily shown in FIGS. 1A and 1B , the mask handling module 100 may include a vacuum rotation chamber 110 . For example, a vacuum rotation chamber may be provided between the first vacuum chamber 102 and the second vacuum chamber 104 in an in-line substrate processing system. In particular, vacuum rotation chamber 110 may be configured to provide vacuum conditions within the chamber. Additionally, the mask handling module 100 may include a rotation mechanism 112 within the vacuum rotation chamber 110 . Rotation mechanism 112 may further include a rotational support 118 . Further, the rotation mechanism 112 may also include an actuator 120 configured to rotate the rotatable support 118 within the vacuum rotation chamber 110 . Actuator 120 may include a pole 114 such as a central pole that includes a rotational axis 170 .

Additionally, the actuator 120 may include a motor 116 to rotate the rotatable support 118 via the pole 114 . Actuator 120 may also actuate pole 114 in response to energy. Examples of actuator 120 may include electric motors, pneumatic actuators, hydraulic actuators, and the like. In particular, actuator 120 may be configured to provide rotation of rotatable support 118 of at least 40° in a clockwise and/or counterclockwise direction. For example, actuator 120 may be configured to provide 180° of rotation.

[0026] According to some embodiments, the mask handling module 100 may further include a first mask stage 122 and a second mask stage 124. Referring to FIG. 1C as an example, the first mask stage 122 may have a first mask holder assembly 132 . Similarly, the second mask stage 124 can have a second mask holder assembly 132 . The first mask holder assembly 132 and/or the second mask holder assembly 132 may include at least one clamp from the group consisting of an electromagnetic clamp, an electropermanent magnetic clamp, and a mechanical clamp.

[0027] The first mask holder assembly 132 may include at least a chucking or clamping device for chucking or clamping a mask to the holding surface of the first mask stage 122. The second mask holder assembly 132 may include at least a chucking or clamping device for chucking or clamping the mask to the holding surface of the second mask stage 124 . For example, the first mask holder assembly 132 may include at least a clamp, in particular, a plurality of clamps for clamping the mask 50 to the first mask stage 122 . Additionally, the second mask holder assembly 132 may include at least a clamp, in particular, a plurality of clamps for clamping the mask 50 to the second mask stage 124 . Alternatively or additionally, the first mask holder assembly 132 may include a magnetic chuck, such as an electric permanent magnet arrangement, for chucking the mask 50 to the first mask stage 122 . Similarly, the second mask holder assembly 132 may include a magnetic chuck, such as an electric permanent magnet arrangement, for chucking the mask 50 to the second mask stage 124 . In addition, the first mask holder assembly 132 and/or the second mask holder assembly 132 may each clamp at least one clamp of the first mask holder assembly 132 and/or the second mask holder assembly 132, for example. A clamp actuator configured to move horizontally and/or vertically. The first mask stage 122 and/or the second mask stage 124 may be configured to support the mask 50 in a vertical orientation.

Additionally, the first mask stage 122 may be mounted to the rotation mechanism 112 for rotation of the first mask stage 122 . The first mask stage 122 can be coupled to the rotatable support 118 , that is, can be fixed and/or stationary relative to the rotatable support 118 . Additionally, the first mask stage 122 may be mounted on the rotational support 118 in a vertical orientation. The term "mounted" refers to fastening or fastening to rotation mechanism 112 and/or rotational support 118 by any fastening means, such as through the use of mechanical holders, electromagnetic holders and/or electrical permanent holders. refers to the state of being In particular, the first mask stage 122 can be coupled to the rotatable support 118 via mask stage supports 128 . Additionally, the mask stage supports 128 may be fastened to the rotatable support 118 by fixed mounts such as screws or bolts. According to still further embodiments, which may be combined with other embodiments described herein, the second mask stage 124 may be provided similarly to the first mask stage.

[0029] Additionally, the mask handling module 100 may include at least one connecting flange configured to connect, among other things, at least one vacuum chamber and/or transit module. Usually, some or all of the different types of connecting flanges have a casing frame-like structure, and the casing frame-like structure can be configured to provide vacuum conditions inside the casing frame-like structure.

According to some embodiments, the mask handling module 100 may also include a mask handling assembly 142 . The mask handling assembly 142 may be positioned in a mask handling chamber 140 attached to the vacuum rotation chamber 110 . In particular, mask handling chamber 140 may be configured to provide vacuum conditions within the chamber. The mask handling assembly 142 may include a vacuum robot with one, two or more individually movable robotic hands. Each robotic hand may include a mask holding portion configured to grab or support the mask 50 . Additionally, the mask holding portion may be configured to transfer the mask 50 between the vacuum rotation chamber 110 and one or more mask holders (eg, mask shelves) in the mask handling chamber 140 . Additionally, the mask handling chamber 140 may be configured to transfer the mask 50 from the rotation mechanism 112 , eg, from the first mask stage 122 or from the second mask stage 124 . Additionally, the mask handling chamber 140 may be configured to transfer the mask 50 to the rotation mechanism 112 , eg, to the first mask stage 122 or to the second mask stage 124 .

[0031] In some embodiments, the vacuum robot may be provided with at least two individually movable mask holding portions. Accordingly, while the first mask is being loaded into or unloaded from the first mask stage 122 by the first mask holding portion to the second mask stage 124, the second mask is loaded by the second mask holding portion. can be caught Thus, the mask handling chamber 140, in particular the mask handling assembly 142, the vacuum rotation chamber 110, in particular the rotation mechanism 112, and more specifically the first mask stage 122 and/or Mask exchange between the second mask stages 124 may be accelerated. The robotic hands may be movable in at least two directions, eg vertically and horizontally. For example, robotic hands may be movable up and down. Additionally, the robotic hands extend and contract towards/from the first mask stage 122 or toward/from the second mask stage 124 relative to the central robot body. can

[0032] In some embodiments, the vacuum robot may be positioned next to the vacuum rotation chamber 110, eg, the rotation mechanism 112. For example, the vacuum robot may be positioned right next to the first mask stage 122 and/or the second mask stage 124 . The vacuum robot may include two or more robotic hands, which are rotatable about an axis and include individual mask holding parts that are movable in vertical and/or horizontal directions.

[0033] According to some embodiments, the mask handling assembly 142 may be configured for first mask transfer between the first mask stage 122 and the mask handling chamber 140. For example, the mask handling chamber 140 , and in particular the mask handling assembly 142 , may be configured to load the mask 50 onto the first mask stage 122 . Additionally, the mask handling chamber 140 , and in particular the mask handling assembly 142 , may be configured to connect the mask 50 to the first mask stage 122 . Additionally, the mask handling chamber 140 , and in particular the mask handling assembly 142 , may be configured to separate the mask 50 from the first mask stage 122 .

According to some embodiments, the mask handling module 100 may further include a first substrate transport track 152 associated with the first mask stage 122 . The first substrate transport track 152 may be configured to support the first substrate carrier 156 . Accordingly, the first mask holder assembly 132 may be configured for second mask transfer between the first mask stage 122 and the first substrate carrier 156 . For example, the mask 50 may be loaded or transferred from the first mask stage 122 to the first substrate carrier 156 . Additionally, the mask handling module 100 may also include a second substrate transport track 154 associated with the second mask stage 124 . The second substrate transport track 154 may be configured to support the second substrate carrier 158 .

[0035] After depositing the material through the mask 50 onto the substrate 55, the mask 50 may be transported back to the mask handling module 100, eg, on the first substrate carrier 156 or the second substrate carrier 156. It can be transported back to the first mask stage 122 or to the second mask stage 124 by the two substrate carriers 158 , respectively. Thereafter, for example, a third mask transfer between the second mask stage 124 and the mask handling chamber 140 may be performed. Accordingly, the second mask holder assembly 132 may be configured for third mask transfer between the second mask stage 124 and the mask handling chamber 140 . For example, the mask 50 may be transported to the mask handling chamber 140 , in particular to the mask handling assembly 142 , for example for cleaning.

[0036] According to some embodiments, the second mask holder assembly 132 may be configured for a fourth mask transfer between the second mask stage 124 and the second substrate carrier 158. For example, the mask 50 is deposited on the substrate 55 from the second substrate carrier 158 to the second mask stage 124, ie through the mask 50, such as an organic material or a metallic material. Afterwards, it can be unloaded or transported. Accordingly, the mask 50 may be subsequently transported or reused to the mask handling chamber 140 , in particular to the mask handling assembly 142 , for example for cleaning.

[0037] According to some embodiments, unloading the mask 50 from the first substrate carrier 156 or the second substrate carrier 158 may, for example, remove the mask 50 from the first substrate carrier 156. or detaching the mask 50 from the first substrate carrier 156 or the second substrate carrier 158 by releasing a clamp securing it to the second substrate carrier 158 .

[0038] According to some embodiments, a substrate transport track may be configured for contactless transport of a substrate carrier. For example, the substrate transport track can be the first substrate transport track 152 and/or the second substrate transport track 154 . Still further, the substrate carrier can be a first substrate carrier 156 and/or a second substrate carrier 158 . Typically, a first substrate transport track 152 supports a first substrate carrier 156 and a second substrate transport track 154 supports a second substrate carrier 158 . According to some embodiments, the second substrate transport track 154 can be configured for contactless transport of the second substrate carrier 158 . According to some embodiments, the first substrate transport track 152 can be configured for contactless transport of the first substrate carrier 156 . According to some embodiments, the second substrate transport track 154 can be configured for contactless transport of the second substrate carrier 158 .

[0039] Contactless transport may be a magnetic levitation system. In particular, the magnetic levitation system may be provided such that at least a portion of the weight of the first substrate carrier 156 or the second substrate carrier 158 is carried by the magnetic levitation system. The first substrate carrier 156 or the second substrate carrier 158 then follows the first substrate transport track 152 or the second substrate transport track 154, respectively, through the in-line substrate processing system in an essentially contactless manner. can be guided. In particular, the first substrate transport track 152 or the second substrate transport track 154 includes a carrier holding structure 162 and a carrier holding structure 164, respectively, and a carrier driving structure 163 and a carrier driving structure 165, respectively. can include A carrier holding structure may be configured for non-contact holding of the substrate carrier. The carrier drive structure can be configured for non-contact translation of a substrate carrier, eg, first substrate carrier 156 or second substrate carrier 158 . Carrier holding structure, eg, carrier holding structure 162 and carrier holding structure 164 may include a magnetic levitation system for non-contact holding of a substrate carrier. Additionally, the carrier drive structure, eg, carrier drive structure 163 and carrier drive structure 165 may include a magnetic drive system for non-contact drive of the substrate carrier.

[0040] According to embodiments of the present disclosure, a carrier holding structure, eg, carrier holding structures 162 and 164 may be provided with magnetic elements, such as active magnetic elements. The active magnetic elements can be arranged above the substrate carrier, for example above the first substrate carrier 156 or the second substrate carrier 158 . A carrier holding structure can pull substrate carriers from above, eg, first substrate carrier 156 or second substrate carrier 158 . The active magnetic elements can be controlled to provide a gap between the carrier holding structures and either the first substrate carrier 156 or the second substrate carrier 158 . Non-contact holding is provided.

[0041] The carrier drive structures, eg, the carrier drive structure 163 and the carrier drive structure 165 are for transporting the first substrate carrier 156 or the second substrate carrier 158 along the transport direction 103. It may be provided to provide driving force. The carrier drive structures may include additional active magnetic elements that provide a force to either the first substrate carrier 156 or the second substrate carrier 158 . Non-contact actuation may be provided. The active magnetic elements of the carrier holding structures may be arranged to extend in a row in a first direction, ie transport direction 103 . Additionally, carrier holding structures may be provided or attached to the top wall of the rotational support 118 . According to some embodiments, carrier holding structures, eg carrier holding structure 162 and/or carrier holding structure 164 , ie floating boxes, may be mounted to the ceiling of rotational support 118 .

[0042] According to some embodiments, rotation mechanism 112 includes first mask stage 122, second mask stage 124, first substrate transport track 152 associated with first mask stage 122, and It may be configured to rotate at least one of the second substrate transport tracks 154 associated with the second mask stage 124 . For example, the rotation mechanism 112 may include a first mask stage 122 , a second mask stage 124 , a first substrate transport track 152 associated with the first mask stage 122 , and a second mask stage 124 . It may be configured to rotate the associated second substrate transport track 154 . A first substrate carrier 156 may be provided on the first substrate transport track 152 . A second substrate carrier 158 may be provided on the second substrate transport track 154 . Accordingly, the first substrate carrier 156, the second substrate carrier 158 and/or the mask 50 may be transferred to an adjacent coupled vacuum chamber, eg, a process zone. Accordingly, the first mask stage 122 , the second mask stage 124 , the first substrate transport track 152 associated with the first mask stage 122 and/or the second mask stage 124 associated with the first substrate transport track 152 . The orientation of the substrate transport track 154 can be changed inside the vacuum rotation chamber 110 . In particular, the first mask stage 122, the second mask stage 124, the first substrate transport track 152 associated with the first mask stage 122 and the second substrate transport track associated with the second mask stage 124 154 is in a position that allows transfer of the mask 50 to one of the adjacent vacuum chambers 102 and 104, and more specifically to the mask handling chamber 140 of the in-line substrate processing system. can be rotated

[0043] Additionally, during rotation of the rotation mechanism 112, in particular during rotation of the rotation support 118, the first substrate carrier 156 and/or the second substrate carrier 158 is lifted by the carrier holding structure. can be rotated while Additionally, during rotation of the rotation mechanism 112 , in particular during rotation of the rotation support 118 , the first substrate carrier 156 and/or the second substrate carrier 158 are mechanically supported by the rotation mechanism 112 . can be rotated while The first substrate carrier 156 and/or the second substrate carrier 158 may be transported in a different direction after rotation, eg, angled by 90° or 120° compared to the direction before rotation.

Referring illustratively to FIG. 2 , additional embodiments of a mask handling module 100 for an in-line substrate processing system are described. In particular, a cross-sectional plan view of the mask handling module 100 is shown in FIG. 2 . As exemplarily shown in FIG. 2 , the mask handling module 100 may include chambers 140a, 140b and/or 140c. Accordingly, the chambers 140a, 140b and/or 140c may be attached to the vacuum rotation chamber 110. For example, chamber 140a may be a mask chamber configured to stock used masks. As an example, the mask used may be a mask after deposition of materials, such as organic materials, on a substrate. Used masks can be stored to perform posterior cleaning. Additionally, chamber 140b may be a mask chamber configured to store unused masks. For example, the unused mask may be a mask prior to deposition of materials such as organic materials on the substrate. Additionally, chamber 140c may be a chamber configured to hold substrate carriers. Chamber 140c may also be a substrate carrier exchanger. The substrate carrier exchanger may be configured to transfer substrate carriers to or from the vacuum rotation chamber 110 . For example, to clean or repair the substrate carrier, the substrate carrier may be transported to the chamber 140c. Additionally, chamber 140c may be an additional vacuum rotation chamber, eg, a chamber coupled to a vacuum chamber having rotation mechanism 112 according to embodiments described herein. According to some embodiments, which may be combined with other embodiments described herein, an additional vacuum rotation chamber may be provided in the vacuum processing system between the substrate loading chamber 712 and the vacuum rotation chamber 110 (eg, , see Fig. 7). Chambers 140a, 140b and/or 140c may also include a vacuum robot with one, two or more individually movable robotic hands. Each robotic hand may include a mask holding portion configured to hold a mask or substrate carrier. According to some embodiments, which can be combined with other embodiments described herein, the angle of transport of components into or out of chambers 140a, 140b and/or 140C is the angle indicated by the arrows in FIG. - may be 90° relative to the line direction or may be different from 90°. For example, the angle between adjacent transport directions into or out of the vacuum rotation chamber may be between 30° and 120°.

3 shows a flow diagram illustrating a method 300 for mask transfer and/or in-line material deposition on a substrate, respectively, in accordance with embodiments described herein. Method 300 may be implemented using devices and systems in accordance with the present disclosure.

[0046] The method 300, starting at start 301, may include transporting a first substrate carrier 156 into a vacuum rotation chamber 110 (stage 302). Additionally, the method 300 includes transferring the first mask supported by the first mask holder assembly 132 from the first mask stage 122 to the first substrate carrier 156 (stage 304). can include The method 300 may also include transporting the first substrate carrier 156 out of the vacuum rotation chamber 110 (stage 306 ), particularly along the transport direction 103 . Additionally, the method 300 includes rotating the rotation mechanism 112 supporting the first mask stage 122 in the vacuum rotation chamber 110 by an angle of about 180° (stage 308). can do. Method 300 may conclude at end 310 .

[0047] According to some embodiments, which can be combined with other embodiments described herein, the method 300 for mask transfer is performed from a mask handling chamber 140, and in particular from a mask handling assembly 142. , and more specifically, an initial stage of holding the first mask from a mask holder (eg, a mask shelf). Additionally, the method may additionally include transferring the first mask to the vacuum rotation chamber 110 , in particular to the rotation mechanism 112 , and more specifically to the first mask stage 122 . there is. Method 300 also includes rotating mechanism 112 supporting mask stages, eg, first mask stage 122 and second mask stage 124, in vacuum rotation chamber 110 by an angle of about 180°. Rotation may be included.

[0048] According to some embodiments, which may be combined with other embodiments described herein, transporting the first substrate carrier 156 into the vacuum rotation chamber 110 (stage 302) may include, among other things, rotating the rotatable support 118 within the vacuum rotation chamber 110 to enable transport of the first substrate carrier 156 into the vacuum rotation chamber 110 along the first direction 103; can do. According to some embodiments, the first substrate carrier 156 can support a first substrate. Additionally, transporting the first substrate carrier 156 into the vacuum rotation chamber 110 (stage 302 ) may cause the first substrate carrier 156 to be positioned along the first substrate transport track 152 . rotating the rotatable support 118 within the vacuum rotation chamber 110 so as to In addition, the step of transporting the first substrate carrier 156 into the vacuum rotation chamber 110 (stage 302) may involve transporting the first substrate with at least one of the transport tracks of a neighboring connected vacuum chamber, eg, a process zone. Rotating the rotatable support 118 within the vacuum rotation chamber 110 to align the track 152 may be included.

[0049] Additionally, transferring the first mask supported by the first mask holder assembly 132 from the first mask stage 122 to the first substrate carrier 156 (stage 304) comprises: 1 may include horizontally moving at least one clamp of the mask holder assembly 132 . Additionally, the step of transferring the first mask supported by the first mask holder assembly 132 from the first mask stage 122 to the first substrate carrier 156 (stage 304) is performed in a substantially vertical orientation. and attaching the first mask to the first substrate carrier 156 . Additionally, transferring the first mask supported by the first mask holder assembly 132 from the first mask stage 122 to the first substrate carrier 156 (stage 304) is performed in a substantially vertical orientation. The step of holding or supporting the first substrate and the first mask may be included. Additionally, transferring the first mask supported by the first mask holder assembly 132 from the first mask stage 122 to the first substrate carrier 156 (stage 304) is performed in a vacuum rotation chamber. During contactless holding of the first substrate carrier 156 at 110, for example, during contactless holding of the first substrate carrier 156 parallel to the first mask stage 122 in the vacuum rotation chamber 110. can

[0050] According to some embodiments, which may be combined with other embodiments described herein, transporting the first substrate carrier 156 out of the vacuum rotation chamber 110 (stage 306) may include rotating the rotatable support 118 to align the first substrate transport track 152 with at least one of the transport tracks of an associated vacuum chamber, eg, a process zone. Accordingly, the first substrate carrier 156 may support the first substrate and the first mask.

[0051] According to some embodiments, which may be combined with other embodiments described herein, the method 300 may include a second substrate carrier 158 along a second direction opposite to the first direction 103. A step of transporting the into the vacuum rotation chamber 110 may be further included. Accordingly, the second substrate carrier 158 may support the second substrate and the second mask. Additionally, the method 300 can include transferring a second mask supported by the second substrate carrier 158 from the second substrate carrier 158 to the second mask stage 124 . The method 300 can also include transporting the second substrate carrier 158 out of the vacuum rotation chamber 110 along a second direction. Accordingly, the second substrate carrier 158 may support the second substrate.

[0052] According to some embodiments, which may be combined with other embodiments described herein, the second substrate carrier 158 is rotated in the vacuum rotation chamber 110 along a second direction opposite to the first direction 103. ) into the vacuum rotation chamber 110 to enable transport of the second substrate carrier 158 into the vacuum rotation chamber 110, for example along a second direction opposite to the first direction 103. ) may include rotating the rotatable support 118 within. Accordingly, the second substrate carrier 158 may support the second substrate and the second mask. Additionally, transporting the second substrate carrier 158 into the vacuum rotation chamber 110 along a second direction opposite to the first direction 103 may include a rotational support 118 within the vacuum rotation chamber 110. It may include the step of rotating. Accordingly, the second substrate carrier 158 can be positioned along the second substrate transport track 154 . Further, transporting the second substrate carrier 158 into the vacuum rotation chamber 110 along a second direction opposite to the first direction 103 may cause the rotational support 118 to move within the vacuum rotation chamber 110. Rotation may be included. Accordingly, the second substrate transport track 154 may be aligned with at least one of the transport tracks of a neighboring connected vacuum chamber, eg, a process zone.

[0053] Further, the step of transferring the second mask supported by the second substrate carrier 158 from the second substrate carrier 158 to the second mask stage 124 may include a second mask holder assembly 132 It may include the step of horizontally moving at least one clamp of the. Additionally, transferring the second mask supported by the second substrate carrier 158 from the second substrate carrier 158 to the second mask stage 124 may include placing the second mask in a substantially vertical orientation onto the second mask stage 124 . Attaching to the mask stage 124 may be included. In addition, transferring the second mask supported by the second substrate carrier 158 from the second substrate carrier 158 to the second mask stage 124 includes the second substrate and the second mask in a substantially vertical orientation. It may include holding or supporting the. Additionally, the step of transferring the second mask supported by the second substrate carrier 158 from the second substrate carrier 158 to the second mask stage 124 may include a second substrate in the vacuum rotation chamber 110. while non-contact holding the carrier 158 , for example, while non-contact holding the second substrate carrier 158 parallel to the second mask stage 124 in the vacuum rotation chamber 110 .

[0054] According to some embodiments, which can be combined with other embodiments described herein, transporting the second substrate carrier 158 out of the vacuum rotation chamber 110 along the second direction includes vacuum rotation. Rotating the rotatable support 118 within the chamber 110 may be included. Accordingly, the second substrate transport track 154 may be aligned with at least one of the transport tracks of a neighboring connected vacuum chamber, eg, a process zone.

[0055] According to some embodiments, transporting the first substrate carrier 156 into the vacuum rotation chamber 110, in particular along the first direction 103, and the second substrate carrier 158 along the second direction ) into the vacuum rotation chamber 110 may be performed simultaneously or independently. Additionally, transferring the first mask supported by the first mask holder assembly 132 from the first mask stage 122 to the first substrate carrier 156 and supported by the second substrate carrier 158 Transferring the second mask from the second substrate carrier 158 to the second mask stage 124 may be performed simultaneously or independently. In addition, transporting the first substrate carrier 156 out of the vacuum rotation chamber 110 along, in particular, a first direction (103), and vacuum rotation in an opposite direction, in particular, in a direction opposite to the first direction (103). Transporting the second substrate carrier out of the chamber 110 may be performed simultaneously or singly.

4A-4D show additional schematic cross-sectional plan views of a section of a vacuum rotation chamber 110 for an in-line substrate processing system. 4A shows transport of a first substrate carrier 156 along a first direction 103, and in-line, along a second direction opposite to the first direction 103, in accordance with embodiments described herein. Shows additional schematic cross-sectional plan views of a section of the vacuum rotation chamber 110 during transport of the second substrate carrier 158 into the vacuum rotation chamber 110 for the substrate processing system. Accordingly, the first substrate carrier 156 may support the first substrate. Additionally, the second substrate carrier 158 can support a second substrate and a second mask. 4B also shows a first supported by a first mask holder assembly 132 (not shown) from the first mask stage 122 to the first substrate carrier 156, in accordance with embodiments described herein. Additional schematic cross-sectional plan views of a section of a vacuum rotation chamber 110 for an in-line substrate processing system during transfer of a mask are shown. 4C is also shown during transfer of a second mask supported by the second substrate carrier 158 from the second substrate carrier 158 to the second mask stage 124, in accordance with embodiments described herein. -shows additional schematic cross-sectional plan views of a section of a vacuum rotation chamber 110 for an on-line substrate processing system. Additionally, FIG. 4D illustrates transport of the first substrate carrier 156 along a first direction 103, and along a second direction opposite to the first direction 103, according to embodiments described herein. Shows additional schematic cross-sectional plan views of a section of the vacuum rotation chamber 110 during transport of the second substrate carrier 158 out of the vacuum rotation chamber 110 for an in-line substrate processing system. Accordingly, the first substrate carrier 156 may support the first substrate and the first mask. Additionally, the second substrate carrier 158 can support a second substrate.

[0057] Referring illustratively to FIGS. 5 and 6, further embodiments of a method 300 for mask transfer and/or in-line material deposition on a substrate are described. 5 shows a rotation mechanism supporting a first mask stage 122 and a second mask stage 124 in a vacuum rotation chamber 110 for an in-line substrate processing system, according to embodiments described herein. Shows schematic cross-sectional plan views of a section of vacuum rotation chamber 110 during rotation of 112 by an angle of about 180°. Accordingly, after rotation, the second mask stage 124 may become the first mask stage 122 , and the second mask stage 124 may become the first mask stage 122 . Therefore, after rotation, the first mask stage 122 can support the first mask. Thus, the method stages shown in FIG. 4a may additionally be implemented after this rotation.

[0058] FIG. 6 shows rotation supporting a first mask stage 122 and a second mask stage 124 in a vacuum rotation chamber 110 for an in-line substrate processing system, in accordance with embodiments described herein. Schematic cross-sectional plan views of a section of the vacuum rotation chamber 110 during rotation of the mechanism 112 by an angle of about 90° are shown. Accordingly, the second mask stage 124 may support the second mask. Additionally, after rotation by an angle of about 90°, the first mask may be taken from the mask handling chamber 140 and, in particular, from the mask handling assembly 142 . Additionally, the mask may be loaded or transferred into the vacuum rotation chamber 110, typically to the rotation mechanism 112, and more typically to the first mask stage 122 or to the second mask stage 124. can Simultaneously or independently, for example for cleaning, from the vacuum rotation chamber 110, typically from the rotation mechanism 112, and more typically from the first mask stage 122 or from the second mask stage 124 A second mask may be unloaded or transferred to the mask handling chamber 140 , in particular the mask handling assembly 142 . Accordingly, the mask handling chamber 140 , and in particular the mask handling assembly 142 , is configured to connect a first mask to a first mask stage 122 or to a second mask stage 124 . Additionally, the mask handling chamber 140 , and in particular the mask handling assembly 142 , is configured to separate a second mask from the first mask stage 122 or from the second mask stage 124 , for example, for cleaning. According to still further embodiments, which can be combined with other embodiments described herein, and as exemplarily shown in FIG. 2 , further rotation of the rotation mechanism is associated with unloading of a used mask and a new (fresh) mask. It may be provided between loading of the mask or vice versa.

[0059] Additionally, FIG. 7 shows a schematic plan view of a vacuum processing system for in-line processing of a substrate, in accordance with embodiments described herein. Accordingly, a vacuum processing system for in-line processing of substrates may include a mask handling module 100 , a substrate loading area 702 and a processing area 706 . The substrate loading area 702 can include a substrate loading chamber 712 . Additionally, a vacuum processing system for in-line processing of substrates may include a transfer zone 740 between the vacuum rotation chamber 110 and the mask handling chamber 140 . Additionally, a vacuum processing system for in-line processing of substrates can include a transfer zone 752 between the mask handling module 100 and the substrate loading zone 702 . A vacuum processing system for in-line processing of substrates may also include a transfer zone 754 between the mask handling module 100 and the processing zone 706 . Transfer zone 752 can be used to connect, disconnect, and/or replace substrate loading zone 702 to a vacuum processing system, such as for cleaning. Similarly, transfer zone 754 can be used to connect, disconnect, and/or replace vacuum rotation chamber 110 and processing zone 706 to a vacuum processing system, such as for cleaning. Additionally, the substrate loading zone chamber, vacuum rotation chamber 110 and processing zone 706 can provide in-line orientation. Additionally, the first mask transfer may be provided along a mask transfer direction different from the in-line direction. Additionally, the processing region 706 can include a substrate rotation chamber 762 configured to provide a forward substrate processing direction and a reverse substrate processing direction. Additionally, processing region 706 may include one or more in-line processing chambers 760 . In-line processing chambers 760 may provide the main transport path. Also, the in-line processing chambers 760 may include deposition modules. For example, a deposition module can be a chamber configured to deposit material onto a substrate.

[0060] While the foregoing relates to some embodiments, other and additional embodiments may be devised without departing from its basic scope, the scope of which is determined by the following claims.

Claims (20)

As a mask handling module for an in-line substrate processing system,
a vacuum rotation chamber provided between a first vacuum chamber and a second vacuum chamber in the in-line substrate processing system;
a rotation mechanism within the vacuum rotation chamber;
a first mask stage having a first mask holder assembly, the first mask stage mounted to the rotation mechanism for rotation of the first mask stage;
a second mask stage having a second mask holder assembly, the second mask stage mounted to the rotation mechanism for rotation of the second mask stage;
a mask handling assembly configured for transferring a first mask between the first mask stage and a mask handling chamber;
A first substrate transport track associated with the first mask stage and configured to support a first substrate carrier, the first mask holder assembly configured to transfer a second mask between the first mask stage and the first substrate carrier. configured -; and
a second substrate transport track associated with the second mask stage and configured to support a second substrate carrier;
Mask handling module for in-line substrate processing systems. According to claim 1,
wherein the mask handling assembly is configured for transfer of a third mask between the second mask stage and the mask handling chamber;
Mask handling module for in-line substrate processing systems. According to claim 1 or 2,
The first mask stage and the second mask stage are configured to support a mask in a vertical orientation.
Mask handling module for in-line substrate processing systems. According to claim 1 or 2,
wherein the in-line substrate processing system provides an in-line direction, and the first mask transfer is provided along a mask transfer direction different from the in-line direction;
Mask handling module for in-line substrate processing systems. According to claim 1 or 2,
The rotation mechanism,
a rotatable support and an actuator configured to rotate the rotatable support within the vacuum rotation chamber;
Mask handling module for in-line substrate processing systems. According to claim 5,
the first mask stage and the second mask stage are coupled to the rotatable support;
Mask handling module for in-line substrate processing systems. According to claim 5,
The first mask stage and the second mask stage are stationary with respect to the rotational support,
Mask handling module for in-line substrate processing systems. According to claim 1 or 2,
The first substrate transport track comprises a carrier holding structure for a substrate carrier and a carrier driving structure for the substrate carrier.
Mask handling module for in-line substrate processing systems. According to claim 8,
The carrier holding structure comprises a magnetic levitation system for contactless holding of the substrate carrier, and/or the carrier drive structure comprises a magnetic drive system for contactless driving of the substrate carrier.
Mask handling module for in-line substrate processing systems. According to claim 1 or 2,
wherein at least one of the first mask holder assembly and the second mask holder assembly comprises at least one clamp from the group of electromagnetic clamps, electropermanent magnetic clamps and mechanical clamps;
Mask handling module for in-line substrate processing systems. According to claim 10,
The first mask holder assembly,
a clamp actuator configured to move the at least one clamp of the first mask holder assembly horizontally;
Mask handling module for in-line substrate processing systems. A vacuum processing system for in-line processing of substrates, comprising:
a mask handling module according to claim 1 or 2;
a substrate loading zone; and
Including the processing area,
A vacuum processing system for in-line processing of substrates. According to claim 12,
wherein the substrate loading zone, the vacuum rotation chamber, and the processing zone provide an in-line direction, and the first mask transfer is provided along a mask transfer direction different from the in-line direction;
A vacuum processing system for in-line processing of substrates. According to claim 12,
The processing section,
A vacuum rotation chamber configured to provide a forward substrate processing direction and a reverse substrate processing direction,
A vacuum processing system for in-line processing of substrates. As a method for mask transfer in a vacuum processing system,
transporting a first substrate carrier into a vacuum rotation chamber along a first direction;
transferring a first mask supported by a first mask holder assembly from a first mask stage to the first substrate carrier within the vacuum rotation chamber;
transporting the first substrate carrier out of the vacuum rotation chamber; and
rotating a rotation mechanism supporting the first mask stage in the vacuum rotation chamber by an angle of about 180°;
The first mask stage is fixedly mounted to the rotation mechanism for rotation of the first mask stage.
A method for mask transfer in a vacuum processing system. According to claim 15,
transporting a second substrate carrier into the vacuum rotation chamber along a second direction opposite to the first direction;
transferring a second mask supported by the second substrate carrier from the second substrate carrier to a second mask stage; and
further comprising transporting the second substrate carrier out of the vacuum rotation chamber along the second direction.
A method for mask transfer in a vacuum processing system. As a method for mask transfer in a vacuum processing system,
transporting a first substrate carrier into a vacuum rotation chamber along a first direction;
transporting a second substrate carrier into the vacuum rotation chamber along a second direction opposite to the first direction;
transferring a first mask supported by a first mask holder assembly from a first mask stage to the first substrate carrier within the vacuum rotation chamber;
transferring a second mask supported by the second substrate carrier from the second substrate carrier to a second mask stage within the vacuum rotation chamber;
transporting the first substrate carrier out of the vacuum rotation chamber along the first direction;
transporting the second substrate carrier out of the vacuum rotation chamber along the second direction; and
rotating a rotation mechanism supporting the first mask stage in the vacuum rotation chamber by an angle of about 180°;
The first mask stage is fixedly mounted to the rotation mechanism for rotation of the first mask stage.
A method for mask transfer in a vacuum processing system. According to claim 16 or 17,
Transporting at least one of the first mask and the second mask out of the vacuum rotation chamber along a third direction different from the first direction and the second direction,
A method for mask transfer in a vacuum processing system. According to claim 16 or 17,
Transporting at least one of the first mask and the second mask into the vacuum rotation chamber along a fourth direction different from the first direction and the second direction,
A method for mask transfer in a vacuum processing system. delete

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