CN112740391A - Mask processing module for a queued substrate processing system and method for mask transfer - Google Patents
Mask processing module for a queued substrate processing system and method for mask transfer Download PDFInfo
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- CN112740391A CN112740391A CN201880097729.1A CN201880097729A CN112740391A CN 112740391 A CN112740391 A CN 112740391A CN 201880097729 A CN201880097729 A CN 201880097729A CN 112740391 A CN112740391 A CN 112740391A
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
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Abstract
A mask processing module for a inline substrate processing system, a vacuum processing system for inline processing of substrates, and a method for mask transfer are described. The mask processing module includes a vacuum rotation chamber provided within the inline substrate processing system between a first vacuum chamber and a second vacuum chamber; a rotating mechanism located in the vacuum rotating chamber; a first mask stage having a first mask holder assembly and mounted on the rotation mechanism for rotating the first mask stage, and a second mask stage having a second mask holder assembly and mounted on the rotation mechanism for rotating the second mask stage; a mask processing assembly configured for a first mask transfer between the first mask stage and a mask processing chamber; and a first substrate transport track associated with the first mask table, the first substrate transport track configured to support a first substrate carrier, the first mask holder assembly configured for a second mask transfer between the first mask table and the first substrate carrier; and a second substrate transport track associated with the second mask stage, the second substrate transport track configured to support a second substrate carrier.
Description
Technical Field
Embodiments of the present disclosure relate to inline (in-line) substrate processing systems. Embodiments of the present disclosure relate, inter alia, to mask processing modules for inline substrate processing systems, vacuum processing systems for inline processing of substrates, and methods for mask transfer (e.g., methods of inline material deposition on a substrate) or substrate processing.
Background
An Organic Light Emitting Diode (OLED) is a special type of light emitting diode in which the emissive layer comprises a thin film of a specific organic compound. OLEDs are used to manufacture television screens, computer displays, mobile phones, other handheld equipment, etc. for displaying information. OLEDs are also used for general space illumination. OLED displays can have a larger range of possible colors and brightness than traditional Liquid Crystal Displays (LCDs) because the OLED material emits light directly. The energy consumption of OLED displays is significantly lower than that of conventional LCD displays.
Furthermore, the fact that OLEDs can be manufactured on flexible substrates leads to further applications. For example, a typical OLED display may include a layer of organic material between two electrodes, such as electrodes made of metal materials. The OLED is typically placed between two glass panels, and the edges of the glass panels are sealed to encapsulate the OLED therein. Alternatively, the OLED may be encapsulated with thin film technology, for example with a barrier film.
The process of fabricating the OLED display includes thermally evaporating an organic material under a high vacuum and depositing the organic material on a substrate. It is advantageous to complement this process by using a mask in order to pattern the organic layer onto the substrate during deposition. Here, the mask is held near the substrate during deposition of the organic layer, and the substrate is generally disposed behind and aligned relative to the mask during deposition. However, the need for a mask during the deposition of the organic material increases the complexity of the manufacturing process of the OLED display. For example, the mask must be transferred to an OLED display manufacturing system under high vacuum before depositing the organic material. In addition, since any particle generation may degrade the OLED display manufacturing system, the mask must be transferred into the OLED display manufacturing system with reduced or minimized particle generation. However, further mask processing in the processing system may significantly impact the cost of ownership of the system.
Accordingly, there is a continuing need for new and improved apparatus and methods for transferring masks into OLED display manufacturing systems.
Disclosure of Invention
In view of the foregoing, a mask processing module for a inline substrate processing system, a vacuum processing system for inline processing of substrates, and a method for mask transfer are provided. The present disclosure is directed to simplifying the transportation of clean, unused masks into a queued substrate processing system. Thus, the footprint of the inline substrate processing system on the substrate is reduced. Furthermore, the present disclosure is directed to facilitating reuse of a mask after deposition of a material, such as an organic or metallic material, on a substrate without interrupting a queued substrate processing system. Further, the present disclosure is directed to mitigating mask transport in a queued substrate processing system. In addition, the present disclosure is directed to facilitating removal of used masks from a queued substrate processing system at regular intervals, such as to clean the masks or replace the masks.
Other aspects, benefits, and features of the disclosure are apparent from the claims, the description, and the drawings.
According to an aspect of the present disclosure, a mask processing module for a queued substrate processing system is provided. The mask processing module includes a vacuum rotation chamber provided within the inline substrate processing system between a first vacuum chamber and a second vacuum chamber. In addition, the mask processing module includes a rotation mechanism located within the vacuum rotation chamber. In addition, the mask processing module includes a first mask stage having a first mask holder assembly, and the first mask stage is mounted on the rotating mechanism to rotate the first mask stage. In addition, the mask processing module includes a second mask stage having a second mask holder assembly, and the second mask stage is mounted on the rotating mechanism to rotate the second mask stage. In addition, the mask processing module includes a mask processing assembly configured for a first mask transfer between the first mask stage and a mask processing chamber. Furthermore, the mask processing module comprises a first substrate transport track associated with the first mask stage, the first substrate transport track configured to support a first substrate carrier, the first mask holder assembly configured for a second mask transfer between the first mask stage and the first substrate carrier. In addition, the mask processing module includes a second substrate transport track associated with the second mask stage, the second substrate transport track configured to support a second substrate carrier.
In accordance with another aspect of the present disclosure, a vacuum processing system for inline processing of substrates is provided. The vacuum processing system includes a mask processing module, a substrate loading area, and a processing area according to an embodiment of the present disclosure.
According to a further aspect of the present disclosure, a method for mask transfer in a vacuum processing system is provided. A method of performing mask transfer in a vacuum processing system includes transferring a first substrate carrier into a vacuum spin chamber, transferring a first mask supported by a first mask holder assembly from a first mask stage onto the first substrate carrier, and transporting the first substrate carrier out of the vacuum spin chamber; and a rotation mechanism for rotating the first mask stage in the vacuum rotation chamber by an angle of about 180 deg.
According to a further aspect of the present disclosure, a method for mask transfer in a vacuum processing system is provided. A method of mask transfer in a vacuum processing system includes transporting a first substrate carrier into a vacuum rotation chamber along a first direction; transporting a second substrate carrier into the vacuum spin chamber in a second direction opposite the first direction; transferring a first mask supported by a first mask holder assembly from a first mask stage onto the first substrate carrier; transferring a second mask supported by the second substrate carrier from the second substrate carrier onto a second mask stage; transporting the first substrate carrier out of the vacuum spin chamber along the first direction; and transporting the second substrate carrier out of the vacuum spin chamber along the second direction.
According to yet a further aspect, a method for mask transfer in a vacuum processing system may be included, for example, in a method for substrate processing and/or a method for material deposition on a substrate in a vacuum processing system.
Drawings
So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the invention and are described below:
FIG. 1A shows a schematic top cross-sectional view of a mask processing module for a queued substrate processing system according to embodiments described herein;
FIG. 1B shows a schematic side cross-sectional view of a mask processing module for a queued substrate processing system according to embodiments described herein;
FIG. 1C illustrates a schematic cross-sectional view of a portion of a mask processing module of a queued substrate processing system according to embodiments described herein;
FIG. 2 illustrates a schematic top cross-sectional view of a mask processing module for a queued substrate processing system according to further embodiments described herein;
FIG. 3 illustrates a flow diagram of a method for mask transfer and/or a method for inline material deposition on a substrate according to embodiments described herein;
4A-4D illustrate schematic top cross-sectional views of a portion of a vacuum spin chamber for a inline substrate processing system during transport of a first substrate carrier and a second substrate carrier into the vacuum spin chamber, transport of a first mask from a first mask stage to the first substrate carrier, transport of a second mask from the second substrate carrier to a second mask stage, and transport of the first and second substrate carriers out of the vacuum spin chamber, according to embodiments described herein;
FIG. 5 illustrates a schematic top cross-sectional view of a portion of a vacuum spin chamber for an inline substrate processing system during rotation of a rotation mechanism supporting a first mask table in the vacuum spin chamber at an angle of approximately 180, according to embodiments described herein;
FIG. 6 illustrates a schematic top cross-sectional view of a portion of a vacuum spin chamber for an inline substrate processing system during rotation of a rotation mechanism supporting first and second mask tables in the vacuum spin chamber at an angle of approximately 90, according to embodiments described herein; and
fig. 7 illustrates a schematic top view of a vacuum processing system for inline processing of substrates according to embodiments described herein.
Detailed Description
Reference will now be made in detail to the various embodiments of the disclosure, one or more examples of which are illustrated in the figures. In the following description of the drawings, like reference numerals are used to indicate like parts. Generally, only the differences between the embodiments will be described. Each example is provided by way of explanation of the disclosure, and is not intended as a limitation of the disclosure. In addition, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. Such modifications and variations are intended to be included herein.
Processes for manufacturing OLED displays may include thermal evaporation of organic materials in a high vacuum, and deposition of organic materials on a substrate. Depending on the display technology, it may be provided to use a mask for patterning the organic layer onto the substrate during deposition. Accordingly, the OLED display manufacturing process using the mask may be complicated, for example, due to additional processes to be performed in order to transfer the mask to the OLED display manufacturing system in high vacuum. In addition, since the generation of particles may degrade the OLED display manufacturing system, the mask must be transferred into the OLED display manufacturing system with the generation of particles reduced or minimized.
Embodiments of the present disclosure relate to a mask processing module for a inline substrate processing system, a vacuum processing system for inline processing of substrates, and a method for mask transfer. Accordingly, the queued substrate processing system may be, or be part of, a display manufacturing system, particularly an OLED display manufacturing system, and more particularly an OLED display manufacturing system for large area substrates. The transportation of the mask or substrate carrier, i.e. the movement of the substrate carrier through the inline substrate processing system, may in particular be provided in a vertically oriented state of the substrate carrier. For example, the substrate carrier may be configured to hold a substrate, such as a glass plate, in a vertically oriented state.
In some embodiments, the mask may include a mask frame. Further, the mask may include a sheet having an opening or openings held by a mask frame. The mask frame may be a sheet configured to support and hold, in particular, the fragile portion. For example, the mask frame may surround the sheet. The sheet may be permanently secured to the mask frame, such as by welding, or the sheet may be releasably secured to the mask frame. The circumferential edge of the wafer may be fixed to the mask frame. The mask table may be configured to hold the mask by any means, such as by using a mechanical holder, an electromagnetic holder, and/or an electrically permanent holder.
The mask may include an opening or openings that may form a pattern for depositing a corresponding pattern of material on the substrate from a mask deposition process. During deposition, the mask may be disposed at a short distance in front of the substrate or in direct contact with the front surface of the substrate. For example, the mask may be, for example, an edge exclusion mask, or a mask that separates two or more devices fabricated on a large area display.
In some embodiments, the mask may be made at least partially of metal, for example of metal with a low coefficient of thermal expansion (e.g., invar). The mask may comprise a magnetic material such that during deposition the mask may be magnetically attracted towards the substrate. In some embodiments, the mask and/or the mask frame may comprise a magnetic material such that the mask and/or the mask frame may be attracted to the mask table or onto the substrate carrier by magnetic forces.
According to some embodiments, which can be combined with other embodiments described herein, the substrate carrier may be configured for holding or supporting the substrate or the substrate and the mask in a substantially vertical orientation. Furthermore, the mask table may be configured for holding or supporting the mask in a substantially vertical orientation. As used throughout this disclosure, when referring to substrate orientation, it is understood that "substantially perpendicular" in particular, to allow for deviations from perpendicular direction or orientation of ± 20 degrees or less, for example ± 10 degrees or less. This deviation may be provided, for example, because a substrate support with some deviation from a vertical orientation may result in a more stable substrate position. Furthermore, when the substrate is tilted forward, less particles will reach the substrate surface. However, during deposition of materials (e.g., organic or metallic materials) on a substrate, for example, under high vacuum, the substrate orientation is considered substantially vertical, which is considered to be different from a horizontal substrate orientation, which may be considered to be ± 20 degrees or less horizontal.
According to some embodiments, which can be combined with other embodiments described herein, the substrate carrier may be an electrostatic chuck (E-chuck) providing an electrostatic force for holding the substrate and optionally the mask on the substrate carrier, and in particular on the support surface. As an example, the substrate carrier comprises an electrode arrangement configured to provide an attractive force acting on the substrate.
Embodiments described herein may be used to deposit materials (e.g., organic or metallic materials) on large area substrates, such as for OLED display fabrication. In particular, the substrate providing the structures and methods according to embodiments described herein may be a large area substrate. For example, a large area substrate may have a corresponding surface area of about 0.67m2Passage 4.5 of (0.73m x 0.92.92 m), corresponding to a surface area of about 1.4m2Generation 5 of (1.1m x 1.3.3 m), corresponding to a surface area of about 4.29m2Generation 7.5 of (1.95m x 2.2.2 m), corresponding to a surface area of about 5.7m2Generation 8.5 of (2.2m x 2.5.5 m), or even a corresponding surface area of about 8.7m2Generation 10 of (2.85m x 3.05.05 m). Even larger generations, such as 11 th and 12 th generations, and corresponding surface areas may be similarly implemented. Half the size of a generation may also be provided in OLED display manufacturing.
According to some embodiments, which can be combined with other embodiments described herein, the substrate thickness can be 0.1 to 1.8 mm. The substrate thickness may be about 0.9mm or less, for example 0.5 mm. The term "substrate" as used herein may especially include a substantially inflexible substrate, such as a glass plate or other substrate. However, the present disclosure is not so limited, and the term "substrate" may also include flexible substrates, such as a mesh or foil. The term "substantially inflexible" is understood as being separate from the "flexible" region. In particular, the substantially inflexible substrate may be a glass plate having a certain degree of flexibility, for example a thickness of 0.9mm or less, for example 0.5mm or less, wherein the flexibility of the substantially inflexible substrate is smaller than that of the flexible substrate.
Referring exemplarily to fig. 1A and 1B, an embodiment of a mask processing module 100 for a queued substrate processing system is described. In particular, fig. 1A and 1B show a top sectional view and a side sectional view of the mask processing module 100, respectively. As exemplarily shown in fig. 1A and 1B, the mask processing module 100 may include a vacuum spin chamber 110. For example, a vacuum rotation chamber may be provided within a queued substrate processing system between the first vacuum chamber 102 and the second vacuum chamber 104. In particular, the vacuum spin chamber 110 is configured to provide vacuum conditions in the chamber. In addition, the mask processing module 100 may include a rotation mechanism 112 within the vacuum rotation chamber 110. The rotation mechanism 112 may further include a rotational support 118. In addition, the rotation mechanism 112 may also include an actuator 120 configured to rotate the rotary support 118 within the vacuum rotation chamber 110. The actuator 120 may include a lever 114, such as a central lever that includes a rotational axis 170.
In addition, the actuator 120 may include a motor 116 to rotate the rotational support 118 via the lever 114. Further, the actuator 120 may be responsive to energy to actuate the lever 114. Examples of the actuator 120 may include an electric motor, a pneumatic actuator, a hydraulic actuator, and the like. In particular, the actuator 120 may be configured for providing at least 40 ° of rotation of the rotary support 118 in a clockwise and/or counterclockwise direction. For example, the actuator 120 may be configured to provide a rotation of 180 °.
According to some embodiments, the mask processing module 100 may further comprise a first mask stage 122 and a second mask stage 124. With exemplary reference to FIG. 1C, the first mask stage 122 can have a first mask holder assembly 132. Similarly, the second mask stage 124 can have a second mask holder assembly 132. The first reticle holder assembly 132 and/or the second reticle holder assembly 132 may include at least one clamp from the group of: electromagnetic clamps, electromagnetic permanent clamps, and mechanical clamps.
The first mask holder assembly 132 can include at least one suction or clamping device for suction or clamping the mask to the holding surface of the first mask stage 122. The second mask holder assembly 132 can include at least one suction or clamping device for suction or clamping the mask to the holding surface of the second mask stage 124. For example, the first mask holder assembly 132 may comprise at least one clamp, in particular a plurality of clamps, for clamping the mask 50 onto the first mask table 122. In addition, the second mask holder assembly 132 can include at least one clamp, and in particular a plurality of clamps, for clamping the mask 50 to the second mask stage 124. Alternatively or additionally, the first mask holder assembly 132 may comprise an electromagnetic chuck, for example an electro-permanent magnet arrangement, for attracting the mask 50 to the first mask table 122. Similarly, the second mask holder assembly 132 may comprise an electromagnetic chuck, such as an electro-permanent magnet arrangement, for attracting the mask 50 to the second mask table 124. Further, the first and/or second mask holder assemblies 132, 132 can include a clamp actuator configured to move at least one clamp of the first and/or second mask holder assemblies 132, respectively, such as horizontally and/or vertically. The first mask stage 122 and/or the second mask stage 124 may be configured to support the mask 50 in a vertically oriented state.
In addition, the first mask stage 122 may be mounted to the rotation mechanism 112 for rotating the first mask stage 122. The first mask stage 122 may be coupled to the rotary support 118, that is, the first mask stage 122 may be fixed to the rotary support 118 and/or may be stationary relative to the rotary support 118. Further, the first mask stage 122 may be mounted to the rotary support 118 in a vertically oriented state. The term "mounted" refers to a state of being secured or fastened to the rotational mechanism 112 and/or the rotational support 118 by any securing method (e.g., by using a mechanical holder, an electromagnetic holder, and/or an electrically permanent holder). In particular, the first mask stage 122 may be coupled to the rotation support 118 by a mask stage support 128. In addition, the mask stage support 128 may be fixed to the rotation support 118 by a fixing bracket (e.g., a screw or bolt). According to yet further embodiments, which may be combined with other embodiments described herein, a second mask stage 124 may be provided which is similar to the first mask stage.
Furthermore, the mask processing module 100 may comprise in particular at least one connection flange configured for connecting at least one vacuum chamber and/or transport module. Generally, some or all of the different types of connection flanges have a housing frame-like structure that can be configured to provide vacuum conditions in the housing frame-like structure.
According to some embodiments, the mask processing module 100 may further include a mask processing component 142. The mask processing assembly 142 may be located in a mask processing chamber 140 attached to the vacuum spin chamber 110. In particular, the mask processing chamber 140 may be configured to provide vacuum conditions in the chamber. The mask processing assembly 142 may include a vacuum robot having one, two, or more individually movable robots. Each robot may include a mask holding portion configured to grasp or support the mask 50. Furthermore, this mask holding portion may be configured to transfer the mask 50 between the vacuum rotation chamber 110 and one or more mask holders (e.g., mask holders) in the mask processing chamber 140. Furthermore, the mask processing chamber 140 may be configured to transfer the mask 50 from the rotation mechanism 112, such as from the first mask stage 122 or from the second mask stage 124. In addition, the mask processing chamber 140 may be configured to transfer the mask 50 to the rotation mechanism 112, such as to the first mask stage 122 or the second mask stage 124.
In some embodiments, the vacuum robot may be provided with at least two individually movable mask holding portions. Accordingly, the second mask may be grasped by the second mask holding portion while the first mask is unloaded from the first mask stage 122 or the first mask is loaded to the second mask stage 124 by the first mask holding portion. Accordingly, mask exchange between the mask processing chamber 140 (particularly the mask processing assembly 142) and the vacuum rotation chamber 110 (particularly the rotation mechanism 112, and more particularly the first mask stage 122 and/or the second mask stage 124) may be accelerated. The robot may be movable in at least two directions, for example, a vertical and a horizontal direction. For example, the robot may move up and down. Furthermore, the robot arm may be extendable and retractable with respect to the central robot body towards/from the first mask table 122 or the second mask table 124.
In some embodiments, the vacuum robot may be located adjacent to the vacuum rotary chamber 110 (e.g., the rotary mechanism 112). For example, a vacuum robot may be positioned adjacent to first mask stage 122 and/or second mask stage 124. The vacuum robot may include two or more robot arms that are rotatable about axes, and include respective mask holding portions that are movable in vertical and/or horizontal directions.
According to some embodiments, the mask processing assembly 142 may be configured for a first mask transfer between the first mask stage 122 and the mask processing chamber 140. For example, the mask processing chamber 140, and in particular the mask processing assembly 142, may be configured for loading the mask 50 to the first mask stage 122. Furthermore, the mask processing chamber 140, in particular the mask processing assembly 142, may be configured to connect the mask 50 to the first mask stage 122. Furthermore, the mask processing chamber 140, in particular the mask processing assembly 142, may be configured to separate the mask 50 from the first mask stage 122.
According to some embodiments, the mask processing module 100 may further include a first substrate transport rail 152 associated with the first mask table 122. The first substrate transport track 152 may be configured to support a first substrate carrier 156. Accordingly, the first mask holder assembly 132 may be configured for a second mask transfer between the first mask table 122 and the first substrate carrier 156. For example, the mask 50 may be loaded or transferred from the first mask stage 122 to the first substrate carrier 156. In addition, the mask processing module 100 may further include a second substrate transport rail 154 associated with the second mask stage 124. The second substrate transport track 154 may be configured to support a second substrate carrier 158.
After deposition of material on the substrate 55 through the mask 50, the mask 50 may be transported back to the mask processing module 100, for example to the first mask stage 122 or the second mask stage 124, by the first substrate carrier 156 or the second substrate carrier 158, respectively. Thereafter, a third mask transfer may be performed between the second mask stage 124 and the mask processing chamber 140, for example. Accordingly, the second mask holder assembly 132 may be configured for a third mask transfer between the second mask stage 124 and the mask processing chamber 140. For example, the mask 50 may be transferred to the mask processing chamber 140, and particularly to the mask processing assembly 142, for example, for cleaning.
According to some embodiments, the second mask holder assembly 132 may be configured for a fourth mask transfer between the second mask table 124 and the second substrate carrier 158. For example, the mask 50 may be unloaded or transferred from the second substrate carrier 158 to the second mask stage 124, i.e., the mask 50 may be unloaded or transferred from the second substrate carrier 158 to the second mask stage 124 after a material (e.g., an organic material or a metallic material) is deposited onto the substrate 55 through the mask 50. Accordingly, the mask 50 may then be reused, or the mask 50 may be transferred to the mask processing chamber 140 (and in particular the mask processing assembly 142), for example for cleaning.
According to some embodiments, detaching the mask 50 from the first substrate carrier 156 or the second substrate carrier 158 may include separating the mask 50 from the first substrate carrier 156 or the second substrate carrier 158, for example, by releasing clamps securing the mask 50 to the first substrate carrier 156 or the second substrate carrier 158.
According to some embodiments, the substrate transport track may be configured for contactless transport of the substrate carrier. For example, the substrate transport track may be the first substrate transport track 152 and/or the second substrate transport track 154. Still further, the substrate carrier may be the first substrate carrier 156 and/or the second substrate carrier 158. Generally, the first substrate transport track 152 supports a first substrate carrier 156 and the second substrate transport track 154 supports a second substrate carrier 158. According to some embodiments, the second substrate transport track 154 may be configured for contactless transport of the second substrate carrier 158. According to some embodiments, the first substrate transport track 152 may be configured for contactless transport of the first substrate carrier 156. According to some embodiments, the second substrate transport track 154 may be configured for contactless transport of the second substrate carrier 158.
The contactless transport may be a magnetic levitation system. In particular, a magnetic levitation system may be provided such that at least a portion of the weight of the first substrate carrier 156 or the second substrate carrier 158 is carried by the magnetic levitation system. Next, the first substrate carrier 156 or the second substrate carrier 158 may be guided substantially non-contact along the first substrate transport track 152 or the second substrate transport track 154, respectively, by the inline substrate processing system. In particular, the first substrate transport track 152 or the second substrate transport track 154 may include a carrier holding structure 162 and a carrier holding structure 164, respectively, and a carrier driving structure 163 and a carrier driving structure 165, respectively. The carrier holding structure may be configured for non-contact holding of the substrate carrier. The carrier drive structure may be configured for non-contact displacement of a substrate carrier (e.g., the first substrate carrier 156 or the second substrate carrier 158). The carrier holding structures, such as carrier holding structure 162 and carrier holding structure 164, may include a magnetic levitation system for non-contact holding of the substrate carrier. In addition, the carrier drive structures, such as carrier drive structure 163 and carrier drive structure 165, may include a magnetic drive system for contactlessly driving the substrate carrier.
According to embodiments of the present disclosure, carrier holding structures, such as carrier holding structure 162 and carrier holding structure 164, may have magnetic elements, such as active magnetic elements. The active magnetic element may be disposed above a substrate carrier, such as above the first substrate carrier 156 or the second substrate carrier 158. The carrier holding structure may pull the substrate carrier, such as the first substrate carrier 156 or the second substrate carrier 158, from above. The active magnetic elements may be controlled to provide a gap between the carrier holding structure and the first substrate carrier 156 or the second substrate carrier 158. Providing non-contact retention.
Carrier drive structures, such as carrier drive structure 163 and carrier drive structure 165, may be provided to provide a driving force for transporting the first substrate carrier 156 or the second substrate carrier 158 along the transport direction 103. The carrier drive structure may include other active magnetic elements that provide a force on the first substrate carrier 156 or the second substrate carrier 158. A non-contact drive may be provided. The active magnetic elements of the carrier holding structure may be arranged in a row extending in the first direction, i.e. the transport direction 103. Further, a carrier retaining structure may be provided at the top wall of the rotational support 118 or attached to the top wall of the rotational support 118. According to some embodiments, a carrier holding structure, such as carrier holding structure 162 and/or carrier holding structure 164 (i.e., a suspension box), may be mounted on top of the rotational support 118.
According to some embodiments, the rotation mechanism 112 may be configured to rotate at least one of the first mask station 122, the second mask station 124, the first substrate transport track 152 associated with the first mask station 122, and the second substrate transport track 154 associated with the second mask station 124. For example, the rotation mechanism 112 may be configured to rotate the first mask stage 122, the second mask stage 124, a first substrate transport track 152 associated with the first mask stage 122, and a second substrate transport track 154 associated with the second mask stage 124. A first substrate carrier 156 may be provided on the first substrate transport track 152. A second substrate carrier 158 may be provided on the second substrate transport track 154. Accordingly, the first substrate carrier 156, the second substrate carrier 158, and/or the mask 50 may be transferred to an adjacent, connected vacuum chamber, such as a processing region. Accordingly, the orientation of the first mask stage 122, the second mask stage 124, the first substrate transport track 152 associated with the first mask stage 122, and/or the second substrate transport track 154 associated with the second mask stage 124 may be changed in the vacuum rotation chamber 110. In particular, the first mask station 122, the second mask station 124, the first substrate transport track 152 associated with the first mask station 122, and the second substrate transport track 154 associated with the second mask station 124 may be rotated in a position that enables transfer of the mask 50 into one of the adjacent vacuum chambers 102, 104, and more particularly into the mask processing chamber 140 of the inline substrate processing system.
Furthermore, during rotation of the rotation mechanism 112, in particular during rotation of the rotary support 118, the first substrate carrier 156 and/or the second substrate carrier 158 may be rotated while being levitated by the carrier holding structure. Furthermore, during rotation of the rotation mechanism 112, particularly during rotation of the rotary support 118, the first substrate carrier 156 and/or the second substrate carrier 158 may be rotated while being mechanically supported by the rotation mechanism 112. After rotation, the first substrate carrier 156 and/or the second substrate carrier 158 may be transported in a different direction, for example, in a direction that is at an angle of 90 ° or 120 ° from the direction before rotation.
Referring exemplarily to fig. 2, further embodiments of a mask processing module 100 for a queued substrate processing system are described. In particular, a top cross-sectional view of the mask processing module 100 is shown in FIG. 2. As exemplarily shown in fig. 2, the mask processing module 100 may include a chamber 140a, a chamber 140b, and/or a chamber 140 c. Accordingly, the chamber 140a, the chamber 140b, and/or the chamber 140c may be attached to the vacuum rotation chamber 110. For example, chamber 140a may be a mask chamber configured to store used masks. As an example, the mask that has been used may be a mask after depositing a material (e.g., an organic material) on the substrate. The used mask may be stored for post cleaning. Further, chamber 140b may be a mask chamber configured to store unused masks. For example, the unused mask may be a mask prior to depositing a material (e.g., an organic material) on the substrate. Further, the chamber 140c may be a chamber configured to store a substrate carrier. Further, the chamber 140c may be a substrate carrier exchanger. The substrate carrier exchanger may be configured to transfer the substrate carrier to the vacuum spin chamber 110, or from the vacuum spin chamber 110. For example, a substrate carrier may be transferred to the chamber 140c to clean or repair the substrate carrier. Further, the chamber 140c may be a chamber connected to other vacuum rotation chambers, such as a vacuum chamber having the rotation mechanism 112 according to embodiments described herein. According to some embodiments, which may be combined with embodiments described herein, additional vacuum spin chambers may be provided between the substrate loading chamber 712 and the vacuum spin chamber 110 in the vacuum processing system, for example, with reference to fig. 7. The chambers 140a, 140b, and/or 140c may also include a vacuum robot having one, two, or more individually movable robots. Each robot may include a mask holding portion configured to grasp a mask or substrate carrier. According to some embodiments, which can be combined with other embodiments described herein, the transport angle of the parts into and out of the chambers (140a, 140b, and/or 140C) can be 90 ° or can be different from 90 ° with respect to the in-line direction indicated by the arrows in fig. 2. For example, the angle between adjacent transport directions into and out of the vacuum spin chamber may be between 30 ° and 120 °.
FIG. 3 illustrates a flow chart of a method 300 for mask transfer and/or inline material deposition on a substrate, respectively, according to embodiments described herein. This method 300 may be implemented with devices and systems according to the present disclosure.
The method 300 beginning at start 301 may include transporting the first substrate carrier 156 into the vacuum spin chamber 110 (stage 302). Further, the method 300 may include transferring the first mask supported by the first mask holder assembly 132 from the first mask table 122 to the first substrate carrier 156 (stage 304). The method 300 may further include transporting the first substrate carrier 156 out of the vacuum spin chamber 110, particularly in the transport direction 103 (stage 306). Additionally, the method 300 may include rotating the rotation mechanism 112 supporting the first mask stage 122 in the vacuum rotation chamber 110 by an angle of approximately 180 ° (stage 308). Method 300 may end at end 310.
According to some embodiments, which may be combined with other embodiments described herein, the method 300 for mask transfer may further comprise an initial stage of grabbing the first mask from the mask processing chamber 140, in particular from the mask processing assembly 142, more in particular from a mask holder (e.g. a mask holder). Furthermore, the method may additionally include transferring the first mask to the vacuum rotation chamber 110, particularly to the rotation mechanism 112, and more particularly to the first mask stage 122. Furthermore, the method 300 may comprise rotating the rotation mechanism 112 supporting the mask table (e.g. the first mask table 122 and the second mask table 124 in the vacuum rotation chamber 110) by an angle of about 180 °.
According to some embodiments, which may be combined with other embodiments described herein, transporting the first substrate carrier 156 into the vacuum spin chamber 110 (stage 302) may comprise rotating the rotary support 118 within the vacuum spin chamber 110 to enable transporting the first substrate carrier 156 into the vacuum spin chamber 110, in particular in the first direction 103. According to some embodiments, the first substrate carrier 156 may support a first substrate. Further, transporting the first substrate carrier 156 into the vacuum rotation chamber 110 (stage 302) may include rotating the rotation support 118 within the vacuum rotation chamber 110 such that the first substrate carrier 156 may be positioned along the first substrate transport track 152. Transporting the first substrate carrier 156 into the vacuum rotation chamber 110 (stage 302) may include rotating the rotation support 118 within the vacuum rotation chamber 110 to align the first substrate transport track 152 with at least one of the transport tracks of an adjacently connected vacuum chamber (e.g., being a processing region).
Further, transferring the first mask supported by the first mask holder assembly 132 from the first mask table 122 to the first substrate carrier 156 (stage 304) may include horizontally moving at least one clamp of the first mask holder assembly 132. Further, transferring the first mask supported by the first mask holder assembly 132 from the first mask table 122 to the first substrate carrier 156 (stage 304) may include attaching the first mask to the first substrate carrier 156 in a substantially vertical orientation. Additionally, transferring the first mask supported by the first mask holder assembly 132 from the first mask table 122 to the first substrate carrier 156 (stage 304) may include holding or supporting the first substrate and the first mask in a substantially vertical orientation. Additionally, transfer of the first mask supported by the first mask holder assembly 132 from the first mask table 122 to the first substrate carrier 156 may be performed while non-contactingly holding the first substrate carrier 156 in the vacuum spin chamber 110, for example, while non-contactingly holding the first substrate carrier 156 parallel to the first mask table 122 in the vacuum spin chamber 110 (stage 304).
According to some embodiments, which may be combined with other embodiments described herein, transporting the first substrate carrier 156 out of the vacuum rotation chamber 110 (stage 306) may include rotating the rotation support 118 to align the first substrate transport track 152 with at least one of the transport tracks of an adjacently connected vacuum chamber (e.g., a processing region). Accordingly, the first substrate carrier 156 may support the first substrate and the first mask.
According to some embodiments, which may be combined with other embodiments described herein, the method 300 may further include transporting the second substrate carrier 158 into the vacuum spin chamber 110 in a second direction opposite to the first direction 103. Accordingly, the second substrate carrier 158 may support a second substrate and a second mask. Further, the method 300 may include transferring a second mask supported by the second substrate carrier 158 from the second substrate carrier 158 to the second mask table 124. In addition, the method 300 may include transporting the second substrate carrier 158 out of the vacuum spin chamber 110 in a second direction. Accordingly, the second substrate carrier 158 may support a second substrate.
According to some embodiments, which may be combined with other embodiments described herein, transporting the second substrate carrier 158 into the vacuum spin chamber 110 in a second direction opposite the first direction 103 may include rotating the spin support 118 within the vacuum spin chamber 110 to enable transporting the second substrate carrier 158 into the vacuum spin chamber 110, for example, in the second direction opposite the first direction 103. Accordingly, the second substrate carrier 158 may support a second substrate and a second mask. Further, transporting the second substrate carrier 158 into the vacuum spin chamber 110 in a second direction opposite the first direction 103 may include rotating the spin support 118 within the vacuum spin chamber 110. Accordingly, the second substrate carrier 158 may be positioned along the second substrate transport track. Further, transporting the second substrate carrier 158 into the vacuum spin chamber 110 in a second direction opposite the first direction 103 may include rotating the spin support 118 within the vacuum spin chamber 110. Accordingly, the second substrate transport track 154 may be at least one alignment with a transport track of an adjacently connected vacuum chamber (e.g., a processing region).
Further, transferring the second mask supported by the second substrate carrier 158 from the second substrate carrier 158 to the second mask stage 124 may include horizontally moving at least one clamp of the second mask holder assembly 132. Further, transferring the second mask supported by the second substrate carrier 158 from the second substrate carrier 158 to the second mask station 124 may include attaching the second mask to the second mask station 124 in a substantially vertical orientation. Additionally, transferring a second mask supported by the second substrate carrier 158 from the second substrate carrier 158 to the second mask station 124 may include holding or supporting the second substrate and the second mask in a substantially vertical orientation. In addition, the transfer of the second mask supported by the second substrate carrier 158 from the second substrate carrier 158 to the second mask stage 124 may be performed while the second substrate carrier 158 is held in the vacuum rotation chamber 110 in a non-contact manner, for example, while the second substrate carrier 158 parallel to the second mask stage 124 is held in the vacuum rotation chamber 110 in a non-contact manner.
According to some embodiments, which may be combined with other embodiments described herein, transporting the second substrate carrier 158 out of the vacuum rotation chamber 110 in the second direction may include rotating the rotary support 118 within the vacuum support chamber 110. The second substrate transport track 154 may be at least one alignment with a transport track of an adjacently connected vacuum chamber (e.g., a processing region).
According to some embodiments, the transporting of the first substrate carrier 156 into the vacuum spin chamber 110 in the first direction 103 and the transporting of the second substrate carrier 158 into the vacuum spin chamber 110 in the second direction may be performed simultaneously or independently. Further, the transfer of a first mask supported by the first mask holder assembly 132 from the first mask stage 122 to the first substrate carrier 156 and a second mask supported by the second substrate carrier 158 from the second substrate carrier 158 to the second mask stage 124 may be performed simultaneously or independently. Furthermore, the transportation of the first substrate carrier 156 out of the vacuum rotation chamber 110, in particular in the first direction 103, and the transportation of the second substrate carrier out of the vacuum rotation chamber 110 in the opposite direction, in particular in the opposite direction to the first direction 103, may be performed simultaneously or independently.
Fig. 4A-4D illustrate further schematic top cross-sectional views of a portion of a vacuum spin chamber 110 for a inline substrate processing system. Fig. 4A shows a further schematic top cross-sectional view of a portion of a vacuum spin chamber 110 for a inline substrate processing system during transport of a first substrate carrier 156 in a first direction 103 and transport of a second substrate carrier in a second direction opposite the first direction 103 to the vacuum spin chamber 110, according to embodiments described herein. Accordingly, the first substrate carrier 156 may support the first substrate. In addition, a second substrate carrier 158 may support a second substrate and a second mask. Further, fig. 4B illustrates a further schematic top cross-sectional view of a portion of the vacuum rotation chamber 110 for a inline substrate processing system during transfer of a first mask supported by the first mask holder assembly 132 (not shown) from the first mask stage 122 to the first substrate carrier 156, according to embodiments described herein. Further, fig. 4C illustrates a further schematic top cross-sectional view of a portion of the vacuum spin chamber 110 for a inline substrate processing system during transfer of a second mask supported by a second substrate carrier 158 from the second substrate carrier 158 to the second mask station 124, according to embodiments described herein. Additionally, fig. 4D illustrates a further schematic top cross-sectional view of a portion of the vacuum spin chamber 110 for a inline substrate processing system during transport of the first substrate carrier 156 in the first direction 103 and transport of the second substrate carrier out of the vacuum spin chamber 110 in a second direction opposite the first direction 103, according to embodiments described herein. Accordingly, the first substrate carrier 156 may support the first substrate and the first mask. In addition, a second substrate carrier 158 may support a second substrate.
Referring exemplarily to fig. 5 and 6, a further embodiment of a method 300 for mask-transfer and/or inline material deposition on a substrate is described. For example, fig. 5 illustrates a schematic top cross-sectional view of a portion of a vacuum spin chamber 110 for an inline substrate processing system during rotation of a rotation mechanism 112 supporting a first mask table 122 and a second mask table 124 in the vacuum spin chamber 110 at an angle of approximately 180 °, according to embodiments described herein. Accordingly, after rotation, the second mask stage 124 may become the first mask stage 122, and the second mask stage 124 may become the first mask stage 122. Thus, after rotation, the first mask stage 122 may support the first mask. Thus, after this rotation, this method stage shown in fig. 4A can be further implemented.
Fig. 6 illustrates a schematic top cross-sectional view of a portion of a vacuum spin chamber 110 for an inline substrate processing system during rotation of a rotation mechanism 112 supporting a first mask table 122 and a second mask table 124 in the vacuum spin chamber 110 at an angle of approximately 90 deg., in accordance with embodiments described herein. Accordingly, the second mask stage 124 may support the second mask. Furthermore, after rotating an angle of about 90 °, the first mask may be grasped from the mask processing chamber 140, in particular from the mask processing assembly 142. Further, the mask may be loaded or transferred into the vacuum rotation chamber 110, typically into the rotation mechanism 112, and more typically into the first mask stage 122 or the second mask stage 124. Simultaneously or independently, the second mask may be unloaded or transferred from the vacuum spin chamber 110, typically from the rotation mechanism 112, and more typically from the first mask table 122 or the second mask table 124, into the mask processing chamber 140, particularly the mask processing assembly 142, for example, for cleaning. Thus, the mask processing chamber 140, in particular the mask processing assembly 142, is configured to connect the first mask to the first mask stage 122 or the second mask stage 124. Furthermore, the mask processing chamber 140, in particular the mask processing assembly 142, is configured to separate the second mask from the first mask table 122 or the second mask table 124, for example for cleaning. According to yet further embodiments, which can be combined with other embodiments described herein, and as exemplarily shown in fig. 2, a further rotation of the rotation mechanism may be provided between the unloading of a used mask and the loading of a new (fresh) mask, and vice versa.
Additionally, fig. 7 shows a schematic top view of a vacuum processing system for inline processing of substrates, according to embodiments described herein. Accordingly, a vacuum processing system for in-line processing of substrates may include a mask processing module 100, a substrate loading area 702, and a processing area 706. The substrate loading region 702 may include a substrate loading chamber 712. In addition, the vacuum processing system for inline processing of substrates may include a transfer region 740 between the vacuum rotation chamber 110 and the mask processing chamber 140. Further, the vacuum processing system for inline processing of substrates may include a transfer region 752 between the mask processing module 100 and the substrate loading region 702. Further, a vacuum processing system for inline processing of substrates may include a transfer region 754 between the mask processing module 100 and the processing region 706. The transfer region 752 may be used to connect, disconnect, and/or replace the substrate loading region 702 from the vacuum processing system, for example, for cleaning. Similarly, the transfer region 754 may be used to connect to, disconnect from, and/or replace the vacuum spin chamber 110 and the processing region 706 from the vacuum processing system, for example, for cleaning. In addition, the substrate loading zone chamber, the vacuum rotation chamber 110, and the processing zone 706 may provide for a queued orientation. Further, the first mask pass may be provided along a mask pass direction different from the queued direction. Additionally, the processing region 706 may include a substrate rotation chamber 762, the substrate rotation chamber 762 being configured to provide a forward substrate processing direction and a reverse substrate processing direction. In addition, the processing region 706 may include one or more in-line processing chambers 760. The inline processing chambers 760 may provide a main transport path. In addition, the in-line processing chamber 760 may include a deposition module. For example, the deposition module may be a chamber configured for depositing material on a substrate.
While the foregoing is directed to embodiments, other and further embodiments may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.
Claims (20)
1. A mask processing module for a queued substrate processing system, comprising:
a vacuum rotation chamber provided within the inline substrate processing system between a first vacuum chamber and a second vacuum chamber;
a rotating mechanism located within the vacuum rotating chamber;
a first mask stage having a first mask holder assembly and mounted on the rotation mechanism to rotate the first mask stage;
a second mask stage having a second mask holder assembly and mounted on the rotation mechanism to rotate the second mask stage;
a mask processing assembly configured for a first mask transfer between the first mask stage and a mask processing chamber;
a first substrate transport track associated with the first mask table, the first substrate transport track configured to support a first substrate carrier, the first mask holder assembly configured for a second mask transfer between the first mask table and the first substrate carrier; and
a second substrate transport track associated with the second mask stage, the second substrate transport track configured to support a second substrate carrier.
2. The mask processing module according to claim 1, wherein the mask processing assembly is configured for a third mask transfer between the second mask table and the mask processing chamber, and in particular wherein the second mask holder assembly is configured for a fourth mask transfer between the second mask table and the second substrate carrier.
3. The mask processing module of any of claims 1 to 2, the first and second mask stages configured to support a mask in a vertically oriented state.
4. The mask processing module of any of claims 1 to 3, wherein the inline substrate processing system provides an inline direction and the first mask pass is provided along a mask pass direction different from the inline direction.
5. The mask processing module of any one of claims 1 to 4, wherein the rotation mechanism comprises:
a rotary support and an actuator configured to rotate the rotary support within the vacuum rotary chamber.
6. The mask processing module of claim 5, wherein the first and second mask stages are coupled to the rotary support.
7. The mask processing module of any of claims 5 to 6, wherein the first and second mask stages are stationary relative to the rotating support.
8. The mask processing module of any one of claims 1 to 7, the first substrate transport track comprising a carrier holding structure for a substrate carrier and a carrier drive structure for the substrate carrier.
9. The mask processing module of claim 8, wherein the carrier holding structure comprises a magnetic levitation system for contactlessly holding the substrate carrier and/or the carrier drive structure comprises a magnetic drive system for contactlessly driving the substrate carrier.
10. The mask processing module of any of claims 1 to 9, the first and/or second mask holder assembly comprising at least one clamp of the group: electromagnetic clamps, electromagnetic permanent clamps, and mechanical clamps.
11. The mask processing module of claim 10, wherein the first mask holder assembly comprises:
a clamp actuator configured to move the at least one clamp of the first mask holder assembly horizontally.
12. A vacuum processing system for inline processing of substrates, comprising:
the mask processing module according to any one of claims 1 to 11;
a substrate loading area; and
and (6) processing the area.
13. The vacuum processing system of claim 12, wherein the substrate loading region, the vacuum rotation chamber, and the processing region provide a queued direction and the first mask transfer is provided along a mask transfer direction different from the queued direction.
14. The vacuum processing system of any of claims 12 to 13, wherein the processing region comprises:
a vacuum spin chamber configured to provide a forward substrate processing direction and a reverse substrate processing direction.
15. A method for mask transfer in a vacuum processing system, comprising:
transporting a first substrate carrier into a vacuum spin chamber;
transferring a first mask supported by a first mask holder assembly from a first mask stage onto the first substrate carrier;
transporting the first substrate carrier out of the vacuum spin chamber; and
a rotation mechanism that supports the first mask stage in the vacuum rotation chamber to rotate at an angle of about 180 °.
16. The method of claim 15, further comprising:
transporting a second substrate carrier into the vacuum spin chamber in a second direction opposite the first direction;
transferring a second mask supported by a second substrate carrier from the second substrate carrier onto a second mask table; and
transporting the second substrate carrier out of the vacuum spin chamber along the second direction.
17. A method for mask transfer in a vacuum processing system, comprising:
transporting a first substrate carrier into a vacuum spin chamber along a first direction;
transporting a second substrate carrier into the vacuum spin chamber in a second direction opposite the first direction;
transferring a first mask supported by a first mask holder assembly from a first mask stage onto the first substrate carrier;
transferring a second mask supported by the second substrate carrier from the second substrate carrier onto a second mask table;
transporting the first substrate carrier out of the vacuum spin chamber along the first direction; and
transporting the second substrate carrier out of the vacuum spin chamber along the second direction.
18. The method of claim 17, further comprising:
a rotation mechanism that supports the first mask stage in the vacuum rotation chamber to rotate at an angle of about 180 °.
19. The method of any of claims 15 to 18, further comprising:
transporting at least one of the first mask and the second mask out of a vacuum spin chamber along a third direction different from the first direction and the second direction.
20. The method of any of claims 15 to 18, further comprising:
transporting at least one of the first mask and the second mask into a vacuum spin chamber along a fourth direction different from the first direction and the second direction.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP2018/075374 WO2020057738A1 (en) | 2018-09-19 | 2018-09-19 | Mask handling module for an in-line substrate processing system and method for mask transfer |
Publications (1)
| Publication Number | Publication Date |
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| CN112740391A true CN112740391A (en) | 2021-04-30 |
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| CN201880097729.1A Pending CN112740391A (en) | 2018-09-19 | 2018-09-19 | Mask processing module for a queued substrate processing system and method for mask transfer |
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| Country | Link |
|---|---|
| KR (1) | KR102553751B1 (en) |
| CN (1) | CN112740391A (en) |
| TW (1) | TW202025359A (en) |
| WO (1) | WO2020057738A1 (en) |
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| WO2024003604A1 (en) * | 2022-07-01 | 2024-01-04 | Applied Materials, Inc. | Mask module, substrate carrier, substrate processing system, and method of processing a substrate |
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| KR100842020B1 (en) * | 2007-03-16 | 2008-06-27 | 세메스 주식회사 | Apparatus and method for depositing organic film |
| US20170250379A1 (en) * | 2016-11-28 | 2017-08-31 | Applied Materials, Inc. | Evaporation source having multiple source ejection directions |
| CN108350572A (en) * | 2015-09-22 | 2018-07-31 | 应用材料公司 | The double base plate processing systems of large area |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1715078A1 (en) * | 2005-04-20 | 2006-10-25 | Applied Films GmbH & Co. KG | Continuous OLED coating apparatus |
| EP2098608A1 (en) * | 2008-03-05 | 2009-09-09 | Applied Materials, Inc. | Coating apparatus with rotation module |
| JP2014056830A (en) * | 2013-10-30 | 2014-03-27 | Hitachi High-Technologies Corp | Organic el device manufacturing apparatus and manufacturing method thereof |
| CN109715846B (en) * | 2016-12-14 | 2024-07-23 | 应用材料公司 | Deposition system |
| KR20180086715A (en) * | 2017-01-23 | 2018-08-01 | 어플라이드 머티어리얼스, 인코포레이티드 | Transfer module, substrate processing system having the same and substrate processing mehtod using the same |
-
2018
- 2018-09-19 KR KR1020217008312A patent/KR102553751B1/en active IP Right Grant
- 2018-09-19 CN CN201880097729.1A patent/CN112740391A/en active Pending
- 2018-09-19 WO PCT/EP2018/075374 patent/WO2020057738A1/en active Application Filing
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- 2019-09-16 TW TW108133181A patent/TW202025359A/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100842020B1 (en) * | 2007-03-16 | 2008-06-27 | 세메스 주식회사 | Apparatus and method for depositing organic film |
| CN108350572A (en) * | 2015-09-22 | 2018-07-31 | 应用材料公司 | The double base plate processing systems of large area |
| US20170250379A1 (en) * | 2016-11-28 | 2017-08-31 | Applied Materials, Inc. | Evaporation source having multiple source ejection directions |
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| KR102553751B1 (en) | 2023-07-07 |
| WO2020057738A1 (en) | 2020-03-26 |
| KR20210043684A (en) | 2021-04-21 |
| TW202025359A (en) | 2020-07-01 |
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