WO2018197009A1

WO2018197009A1 - Vacuum system and method of depositing one or more materials on a substrate

Info

Publication number: WO2018197009A1
Application number: PCT/EP2017/060240
Authority: WO
Inventors: Oliver Heimel
Original assignee: Applied Materials, Inc.
Priority date: 2017-04-28
Filing date: 2017-04-28
Publication date: 2018-11-01
Also published as: JP2019518863A; CN109154067A

Abstract

A vacuum system (100) for depositing one or more materials on a substrate is described. The vacuum system (100) comprises a first transport system (110) configured to transport a substrate (10) along a main transport path (101) in a main transport direction (P), and at least one deposition module (104) extending in a transverse direction (T) with respect to the main transport direction (P). The first transport system (110) is configured to hold the substrate (10) in an orientation which is essentially parallel to the transverse direction (T) during the transport. Further, a method of depositing one or more materials on a substrate is described, particularly by evaporation.

Description

VACUUM SYSTEM AND METHOD OF DEPOSITING ONE OR MORE

MATERIALS ON A SUBSTRATE

TECHNICAL FIELD

[0001] Embodiments of the present disclosure relate to a vacuum system for depositing one or more materials on a substrate. More specifically, a vacuum system for depositing one or more organic materials on a plurality of substrates in one or more deposition modules by evaporation is described. Embodiments further relate to methods of depositing one or more materials on a substrate, particularly by evaporation.

BACKGROUND

[0002] Opto-electronic devices that make use of organic materials are becoming increasingly popular for a number of reasons. Many of the materials used to make such devices are relatively inexpensive, so organic opto-electronic devices have the potential for cost advantages over inorganic devices. The inherent properties of organic materials, such as their flexibility, may be advantageous for applications such as for the deposition on flexible or inflexible substrates. Examples of organic opto-electronic devices include organic light emitting devices, organic phototransistors, organic photovoltaic cells, and organic photodetectors.

[0003] The organic materials of OLED devices may have performance advantages over conventional materials. For example, the wavelength at which an organic emissive layer emits light may be readily tuned with appropriate dopants. OLED devices make use of thin organic films that emit light when a voltage is applied across the device. OLED devices are becoming an increasingly interesting technology for use in applications such as flat panel displays, illumination, and backlighting.

[0004] Materials, particularly organic materials, are typically deposited on a substrate in a vacuum system under sub-atmospheric pressure. During deposition, a mask device may be arranged in front of the substrate, wherein the mask device may have a plurality of openings that define an opening pattern corresponding to a material pattern to be deposited on the substrate, e.g. by evaporation. The substrate is typically arranged behind the mask device during the deposition and is aligned relative to the mask device. For example, a mask carrier carrying the mask device may be transported into a deposition module of the vacuum system, and a substrate carrier carrying the substrate may be transported into the deposition module for arranging the substrate behind the mask device.

[0005] Typically, two, three or more materials are subsequently deposited on a substrate, e.g. for manufacturing a color display. It may be challenging to handle a vacuum system with a plurality of deposition modules for depositing different materials on a plurality of substrates. In particular, such vacuum systems tend to be very complex, expensive and occupy a lot of space.

[0006] Accordingly, it would be beneficial to provide a compact and space-saving vacuum system configured to reliably deposit one or more materials on a substrate. In particular, simplifying and accelerating the substrate and/or mask transport and exchange in a vacuum system configured for the deposition of materials on substrates would be beneficial.

SUMMARY

[0007] In light of the above, vacuum systems for depositing one or more materials on a substrate as well as methods of depositing one or more materials on a substrate are provided.

[0008] According to one aspect of the present disclosure, a vacuum system for depositing one or more materials on a substrate is provided. The vacuum system includes a first transport system configured to transport a substrate along a main transport path in a main transport direction; and at least one deposition module extending in a transverse direction with respect to the main transport direction, wherein the first transport system is configured to hold the substrate in an orientation which is essentially parallel to the transverse direction during the transport along the main transportation path. [0009] The first transport system may be configured to hold the substrate such that the main surface of the substrate is essentially perpendicular to the main transport direction, e.g. during the transport of the substrate along the main transport path.

[0010] According to an aspect of the present disclosure, a vacuum system for depositing one or more materials on a substrate is provided. The vacuum system includes a first transport system comprising a transport cart configured to transport one or more substrate carriers and/or mask carriers along a main transport path extending in a main transport direction; a plurality of deposition modules arranged adjacent to the main transport path on a first side and/or on a second side of the main transport path; one or more second transport systems configured to transport the one or more substrate carriers and/or mask carriers between the transport cart and the plurality of deposition modules in a transverse direction, wherein the transport cart is configured to hold the one or more substrate carriers and/or mask carriers in an orientation which is essentially parallel to the transverse direction during the transport. [0011] The transport cart may be configured to hold the one or more substrate carriers and/or mask carriers such that the main surfaces of the substrate carriers and/or mask carriers are essentially perpendicular to the main transport direction, and/or essentially vertical. The one or more second transport systems may be configured to transport the one or more substrate carriers and/or mask carriers such that the main surfaces of the substrate carriers and/or mask carriers are oriented in the transport direction of the one or more second transport systems, and/or essentially vertical.

[0012] According to an aspect of the present disclosure, a method of depositing one or more materials on a substrate is provided. The method includes transporting a substrate along a main transport path in a main transport direction; transporting the substrate from the main transport path into at least one deposition module in a transverse direction; and depositing a material on the substrate in the at least one deposition module, particularly by evaporation, wherein the substrate is held in an orientation essentially parallel to the transverse direction during the transport along the main transport path.

[0013] During the transport of the substrate along the main transport path, the main surface of the substrate may be perpendicular to the main transport direction. Further, the main surface of the substrate may be essentially vertical during the transport along the main transport path and during the transport in the transverse direction.

[0014] Further aspects, advantages and features of the present disclosure are apparent from the description and the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0015] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the present disclosure, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the disclosure and are described in the following. Typical embodiments are depicted in the drawings and are detailed in the description which follows.

[0016] FIG. 1 is a schematic view of a vacuum system according to embodiments described herein;

[0017] FIG. 2 is a schematic view of a vacuum system according to embodiments described herein;

[0018] FIG. 3 is a schematic view of a deposition module of a vacuum system according to embodiments described herein; and

[0019] FIG. 4 is a flow diagram illustrating a method of depositing one or more layers on a substrate according to embodiments described herein.

DETAILED DESCRIPTION OF EMBODIMENTS

[0020] Reference will now be made in detail to the various embodiments, one or more examples of which are illustrated in the figures. Each example is provided by way of explanation and is not meant as a limitation. For example, features illustrated or described as part of one embodiment can be used on or in conjunction with any other embodiment to yield yet a further embodiment. It is intended that the present disclosure includes such modifications and variations. [0021] Within the following description of the drawings, same reference numbers refer to the same or to similar components. Generally, only the differences with respect to the individual embodiments are described. Unless specified otherwise, the description of a part or aspect in one embodiment applies to a corresponding part or aspect in another embodiment as well.

[0022] FIG. 1 is a schematic view of a vacuum system 100 for depositing one or more materials on a substrate 10 according to embodiments described herein. The vacuum system 100 includes a first transport system 110 configured to transport a substrate 10 along a main transport path 101 in a main transport direction P. The vacuum system further includes at least one deposition module 104 which extends in a transverse direction T with respect to the main transport direction P. In particular, a substrate track 30 extends in the transverse direction T from the main transport path 101 into the at least one deposition module 104, particularly essentially perpendicular to the main transport path 101.

[0023] In some embodiments, the vacuum system 100 may include one or more transit modules 108 arranged next to each other in an essentially linear arrangement along the main transport direction P, wherein the transit modules 108 provide the main transport path

101 along which the substrates can be transported by the first transport system 110.

[0024] One, two or more deposition modules 102 may be arranged adjacent to the main transport path 101, e.g. on a first side SI and/or on a second side S2 of the main transport path 101. For example, the at least one deposition module 104 may be arranged on the first side SI of a transit module and a further deposition module may be arranged on the second side S2 of the transit module, e.g. opposite the at least one deposition module 104. In particular, at least one deposition module may be arranged on each side of the main transport path 101 of the vacuum system. In the exemplary embodiment of FIG. 1, two deposition modules are provided on each side of the main transportation path. Further deposition modules may be provided, as is schematically depicted in FIG. 2.

[0025] Passages, e.g. slit openings, may be provided in a chamber wall between the transit modules 108 which form the main transport path 101 and the deposition modules

102 such that substrates can be moved between the main transport path 101 and the deposition modules 102 through the passages. For example, substrates can be moved along a substrate track 30 between the main transport path 101 and the at least one deposition module 104 through a slit opening in a chamber wall in the transverse direction T.

[0026] A "deposition module" as used herein can be understood as a vacuum chamber or a vacuum compartment of the vacuum system 100 which houses a deposition source, particularly an evaporation source 105, configured to deposit a material on the substrate 10, particularly by evaporation. For example, in the embodiment depicted in FIG. 1, an evaporation source 105 is arranged in each of the deposition modules 102. In some embodiments, two or more evaporation sources may be arranged in a deposition module.

[0027] The evaporation source 105 may be configured to direct evaporated material toward one or more substrates. In some embodiments, the evaporation source 105 may be movable along a source transportation path in the deposition module. The evaporation source may linearly move along the source transportation path, particularly in the transverse direction T, while directing evaporated material toward a substrate. During deposition, a mask device may be arranged in front of the substrate. The deposition module may be configured for masked deposition of a material on a substrate. At least some of the deposition modules may be configured to deposit different materials on a substrate, e.g. a first material, a second material and/or a third material.

[0028] A first material may be a first color material of an array of pixels, e.g. a blue color material, a second material may be a second color material of an array of pixels, e.g. a red color material, and/or a third material may be a third color material of an array of pixels, e.g. a green color material. Further materials may be deposited on the substrate in further deposition modules. At least some of the materials, e.g. the first material and the second material, may be organic materials. At least one material may be a metal. For example, one or more of the following metals may be deposited in some of the deposition modules: Al, Au, Ag, and/or Cu. At least one material may be a transparent conductive oxide material, e.g. ITO. At least one material may be a transparent material.

[0029] A deposition module may include a deposition area for arranging a substrate during deposition. In some embodiments, the at least one deposition module and/or further deposition modules may include two deposition areas, i.e. a first deposition area 131 configured to arrange a substrate 10 and a second deposition area 132 configured to arrange a second substrate 11. The first deposition area 131 may be arranged opposite the second deposition area 132 in the deposition module. The evaporation source 105 may be configured to subsequently direct evaporated material toward the substrate 10 arranged in the first deposition area 131 and toward the second substrate 11 arranged in the second deposition area 132. For example, an evaporation direction of the evaporation source 105 may be reversible, e.g. by rotating at least a part of the evaporation source 105, for example by an angle of 180°.

[0030] During the deposition on the substrate 10 arranged in the first deposition area 131 of a deposition module, the second deposition area 132 may be used for at least one or more of: moving a second substrate to be coated into the second deposition area; moving a coated second substrate out of the second deposition area; aligning the second substrate in the second deposition area 132, e.g. with respect to a mask device provided in the second deposition area. Similarly, during the deposition on a second substrate 11 arranged in the second deposition area 132 of a deposition module, the first deposition area may be used for at least one or more of: moving a first substrate to be coated into the first deposition area; moving a coated first substrate out of the first deposition area; aligning a first substrate in the first deposition area, e.g. with respect to a mask device provided in the first deposition area. Accordingly, by providing two deposition areas in a deposition module, the number of coated substrates in a given time interval can be increased. Further, idle times of the deposition source can be reduced, for example, because the deposition source may not be in an idle position during the alignment of a substrate to be coated with respect to a mask, but may be used for the deposition on another substrate.

[0031 ] According to embodiments described herein, the at least one deposition module 104 extends in a transverse direction T with respect to the main transport path 101 of the vacuum system. The extension direction of a deposition module may be the direction of one or more substrate tracks within the deposition module and/or the extension direction of one or more deposition areas of the deposition module where substrates are arranged during deposition. In some embodiments, the extension direction of a deposition module may correspond to the movement direction of the evaporation source 105 in the deposition module. In some embodiments, an angle between the extension direction of the at least one deposition module 104 and the main transport direction P may be 30° or more, particularly 60° or more, more particularly about 90°. In particular, the at least one deposition module 104 may extend in a direction essentially perpendicular to the main transport direction P, as is schematically depicted in FIG. 1.

[0032] For example, a substrate track 30 and/or a second substrate track 31 within the at least one deposition module 104 may extend in a transverse manner, particularly essentially in a perpendicular manner with respect to the main transport path 101. As is schematically depicted in FIG. 1, an angle between the main transport direction P and the substrate track 30 and/or a second substrate track 31 in the at least one deposition module 104 is about 90°. [0033] Substrates to be coated may be loaded into the vacuum system at a first end of the main transport path 101, e.g. via a first load lock chamber, the substrates may be transported along the main transport path 101 by the first transport system 110, and the coated substrates may be unloaded from the vacuum system 100 at a second end of the main transport path 101, e.g. via a second load lock chamber. [0034] The substrates may be transported from the main transport path 101 into the at least one deposition module 104 in the transverse direction T, may be coated in the at least one deposition module 104, and may be transported back into the main transport path 101 in the transverse direction T to be transported into another deposition module.

[0035] According to embodiments described herein, the first transport system 110 is configured to hold the substrate in an orientation which is essentially parallel to the transverse direction T during the transport. For example, as is schematically depicted in FIG. 1, the substrate 12 is held by the first transport system 110 in an orientation which is essentially perpendicular to the main transport direction P and essentially parallel to the transverse direction T. [0036] The "orientation" of a substrate may be understood as the orientation of the main surface of the substrate. In other words, when the orientation of the substrate is essentially parallel to the transverse direction T, the main surface of the substrate is essentially parallel (+/-10⁰) to the transverse direction T. In FIG. 1, the orientation of the substrate 12 that is being transported by the first transport system 110 is parallel to the transverse direction T and perpendicular to the main transport direction P.

[0037] In some embodiments, the main transport direction P and the transverse direction T may be essentially horizontal directions. In other words, the first transport system 110 may be configured to transport the substrate in a first horizontal direction, and the substrate may be transported from the main transport path into the at least one deposition module 104 in a second horizontal direction different from the first horizontal direction. During the transport, the orientation of the substrate may be continuously essentially parallel to the transverse direction and/or essentially perpendicular to the main transport direction. In particular, the orientation of the substrate may be maintained essentially constant during the transport along the main transport path and during the transport between the main transport path and the at least one deposition module and/or further deposition modules.

[0038] In some embodiments, the orientation of the substrate during the transport may be essentially vertical. In other words, the main surface of the substrate may be essentially parallel to the gravity vector during the transport, e.g. during the transport by the first transport system and/or during the transport by the second transport system. In particular, both the first and second transport systems may be configured to hold substrates and/or mask devices in an essentially vertical orientation. In particular, the main surface of the substrate 10 during the transport along the main transport path 101 and/or during the transport in the transverse direction T may be essentially parallel to the gravity vector (+/- 10°), essentially parallel to the transverse direction T and essentially perpendicular to the main transport direction P.

[0039] Since the orientation of the substrate 12 is parallel to the transverse direction T during the transport along the main transport path P, the substrate 12 can be moved into and out of the at least one deposition module 104 from the main transport path 101 without any rotation or swing movement of the substrate. In particular, the directions of the substrate track 30 and/or of the second substrate track 31 in the at least one deposition module 104 may correspond to the orientation of the substrate 12 during the transport along the main transport path 101. Accordingly, the first transport system 110 may transport the substrate 10 along the main transport path 101 to an intersection point with the at least one deposition module 104. From there, the substrate 12 may be transported in the transverse direction T into the deposition module along the substrate track 30 or along the second substrate track 31. When the direction of the substrate track 30 corresponds to the orientation of the substrate 12, no orientation change of the substrate, particularly no rotation, swing or pivot movement of the substrate may be needed for moving the substrate from the main transport path into the deposition module along the substrate track 30 or along the second substrate track 31.

[0040] In particular, no substrate rotation module, substrate swing module, robot device configured for pivoting the substrate or another device for changing the orientation of the substrate may be provided at the intersection between the main transport path 101 and the at least one deposition module 104.

[0041] When no substrate rotation module is provided at the intersections of the main transport path and the deposition modules, a compact and cost-efficient vacuum system can be provided. Further, the cycle rate of the vacuum system can be reduced, since no time-consuming substrate rotation is to be performed for routing the substrates into the deposition modules 102 from the main transport path 101.

[0042] In some embodiments, which may be combined with other embodiments described herein, a second transport system 120 may be provided for transporting the substrate in the transverse direction T from the main transport path 101 into the at least one deposition module 104 and/or back into the main transport path 101. The second transport system 120 may be configured to transport the substrate along a substrate track extending in the transverse direction while the orientation of the substrate essentially corresponds to the direction of the substrate track.

[0043] The first transport system 110 and the second transport system 120 may be configured to continuously maintain the orientation of the substrate essentially parallel (+/- 20°, particularly +/-10⁰) to the transverse direction T during the transport and/or essentially perpendicular to the main transport direction P. In particular, the first transport system 110 and the second transport system 120 may be configured to maintain an essentially constant substrate orientation. Also during a transferal of the substrate between the first transport system 110 and the second transport system 120, the orientation of the substrate may remain essentially constant. In other words, an inclination of the main surface of the substrate and the transverse direction T may be continuously smaller than 20°, particularly smaller than 10° during the substrate transport. In particular, the orientation of the substrate may not change when transporting the substrate between two, three or more deposition modules of the vacuum system. [0044] The second transport system 120 may include the substrate track 30 and a transport device for moving the substrate along the substrate track 30. The substrate track 30 may extend from the main transport path 101 into the at least one deposition module 104 in the transverse direction T.

[0045] In some embodiments, the second transport system 120 may be configured for contactlessly holding the substrate 10 during the transport in the transverse direction T along the substrate track 30. For example, the second transport system may include a magnetic levitation device configured for contactlessly holding the substrate.

[0046] In some embodiments, the substrate track 30 (indicated as a dashed line in FIG. 1) may extend from the main transport path 101 into the first deposition area 131 of the at least one deposition module 104, and a second substrate track 31 (indicated as a dashed line in FIG. 1) may extend from the main transport path 101 into the second deposition area 132 of the at least one deposition module 104. The substrate track 30 and the second substrate track 31 may extend parallel to each other in the transverse direction T. Second transport systems may be provided for transporting substrates between the main transport path 101 and the first deposition area 131 along the substrate track 30 as well as between the main transport path 101 and the second deposition area 132 along the second substrate track 31 in the transverse direction T. In some embodiments, the second transport systems may include a magnetic levitation device configured to contactlessly hold the substrates during the transport in the transverse direction T. Thus, particle generation can be reduced during the transport into and out of the deposition module, and the deposition results can be improved.

[0047] In some embodiments, which can be combined with other embodiments described herein, the first transport system 110 includes a transport cart 111 which is movable along the main transport path 101. For example, the transport cart 111 may be movable along cart tracks extending along the main transport path 101 in the main transport direction P. [0048] In some embodiments, the first transport system 110 may include a drive unit configured for moving the transport cart 111 along the main transport path 101. The drive unit may include a linear drive, e.g. a linear motor or a spindle drive, particularly an electric motor. [0049] The drive unit of the first transport system 110 may be provided as a stationary component of the vacuum system and may not move together with the transport cart 111. Accordingly, the transport cart 111 may carry no battery, no power supply and/or no electric cable. In particular, the transport cart 111 may be passively guided along cart tracks which extend along the main transport path. The weight and the complexity of the transport cart 111 can be reduced when the transport cart 111 is driven by a stationary drive component.

[0050] In some embodiments, which may be combined with other embodiments described herein, a magnetic levitation device may be provided for contactlessly holding the transport cart 111 at the cart tracks during the movement of the transport cart 111 along the main transport path 101. Alternatively, the transport cart 111 may be mechanically supported on the cart tracks. For example, the transport cart 111 may include a plurality of rollers configured to be guided along the cart tracks.

[0051] It is to be noted that, according to some embodiments described herein, the substrate is attached to a substrate carrier during the processing of the substrate in the vacuum system. A "substrate carrier" as used herein may be understood as a device configured for carrying a substrate, wherein the substrate may be attached to a holding surface of the substrate carrier. The substrate carrier may be configured for stabilizing the substrate during transport and during deposition. Stabilizing and holding the substrate by a substrate carrier during processing may be reasonable because the substrate itself may be a delicate and thin component, e.g. a thin glass plate having a thickness of less than 1 mm.

[0052] The substrate 10 may be attached to the substrate carrier during the transport along the main transport path, during the transport into and out of the deposition modules, and during the deposition. In some embodiments, the substrate may be attached to the substrate carrier in a non-horizontal orientation, particularly in an essentially vertical orientation during the transport and/or during the deposition. For example, the substrate may be electrostatically attached to a vertical holding surface of the substrate carrier.

[0053] The term "carrier" as used herein may refer to a substrate carrier configured for carrying a substrate or to a mask carrier configured for carrying a mask device. A mask carrier is configured to carry a mask device during processing, i.e. during transport in the vacuum system and/or during deposition. In some embodiments, the mask device may be held at the mask carrier in an essentially vertical orientation.

[0054] A carrier may include a carrier body with a holding surface configured to carry a substrate or a mask device, particularly in an essentially vertical orientation. For example, a substrate may be attached to a substrate carrier by a chucking device, e.g. by an electrostatic chuck and/or by a magnetic chuck. For example, a mask device may be attached to a mask carrier by a chucking device, e.g. an electrostatic chuck and/or a magnetic chuck. Other types of chucking devices may be used.

[0055] "Transporting", "moving", or "routing" of substrates or mask devices as used herein typically refers to a respective movement of a carrier which holds the substrate or the mask device at a holding surface of the carrier, particularly in an essentially vertical orientation.

[0056] In some embodiments, which may be combined with other embodiments described herein, the transport cart 1 11 may include a first carrier support 112 extending in the transverse direction T and configured to support a carrier, i.e. a substrate carrier or a mask carrier. The first carrier support 112 may include a support surface of the transport cart 111 on which a substrate carrier holding a substrate (e.g., the substrate 12 in FIG. 1) can be placed during the movement of the transport cart 111 along the main transport path 101. [0057] In some embodiments, the first carrier support 112 may be configured as a slot extending in the transverse direction T, wherein a earner can be placed in the slot during the transport along the main transport direction P, e.g. next to a second carrier which may be placed in a second slot of the transport cart. In some embodiments, a passive guiding element such as a magnetic guiding element may be provided adjacent to the first carrier support 112, in order to safely guide the carrier from the transport cart 111 in the transverse direction T. For example, when the carrier is moved from the transport cart 111 into a deposition module in the transverse direction T, or when the carrier is moved from a deposition module back onto the transport cart 111, the passive guiding element may guarantee a correct placement of the carrier on the first carrier support 112. In some embodiments, a plurality of passive guiding elements may be provided at the transport cart 111 next to respective carrier supports.

[0058] During the movement of the transport cart 111 along the main transport path 101, the weight of the substrate carrier holding the substrate 12 may be carried by the first carrier support 112 of the transport cart 111. In particular, no magnetic levitation system may be provided for carrying the weight of the substrate carrier during the movement of the substrate along the main transport path. As no magnetic levitation devices may be provided for a transport in the main transport direction P, the complexity of the vacuum system can be reduced and a cost-efficient first transport system can be provided. In particular, a first transport system 110 including a movable transport cart which carries the substrate carrier holding the substrate during the transport is simple and effective and may allow for a fast substrate transport.

[0059] In some embodiments, which may be combined with other embodiments described herein, the transport cart 111 may include two, four, six or more carrier supports extending in the transverse direction, respectively. For example, the transport cart 111 depicted in FIG. 1 includes the first carrier support 112 and a second carrier support 113 extending parallel to the first carrier support 112. The first carrier support 112 may be configured for supporting a first substrate carrier which holds a first substrate, and the second carrier support 113 may be configured to support a second substrate carrier which holds a second substrate. Alternatively or additionally, at least one of the first and second carrier supports may be configured to support a mask carrier holding a mask device. Accordingly, the transport cart 111 may be configured to support and transport two or more substrates or mask devices at the same time.

[0060] The transport cart 111 may include a plurality of carrier supports. For example, a carrier support configured to support a mask carrier may be provided adjacent to a carrier support configured to support a substrate carrier. A distance between said carrier supports may correspond to a distance between a mask track and a substrate track in a deposition module. Accordingly, a mask device and a substrate can be simultaneously routed from the transport cart 111 into a deposition module or vice versa.

[0061] In some embodiments, a carrier support may be configured to support an empty carrier which is to be returned to an upstream portion of the main transport path from a downstream portion of the main transport path.

[0062] A drive box including a drive unit such as a linear drive may be provided for moving a carrier from the transport cart 111 into a deposition module in the transverse direction T or vice versa. In particular, for moving a carrier which is supported on a carrier support from the transport cart 111, the carrier may first be levitated by a magnetic levitation unit and may then be linearly moved in the transverse direction via a drive unit. The drive unit may be a stationary component, i.e. the drive unit may not be transported with the transport cart 1 11. Rather, the drive unit may be located in a stationary drive box arranged below the carrier, when the carrier is correctly positioned with respect to the respective deposition module. The magnetic levitation units as well as the drive units are part of the second transport system. The magnetic levitation units may be arranged in drop- in boxes at a top wall of the vacuum system, and the drive units may be arranged in drop-in boxes protruding into the vacuum system from a bottom wall. Alternatively, the drive units may also be arranged in drop-in boxes at the top wall. [0063] In some embodiments, two or more carrier supports may be arranged for transporting substrates and/or mask devices into and from the first deposition area 131, and two or more further carrier supports may be arranged for transporting substrates and/or mask devices into and from the second deposition area 132 of the at least one deposition module. Alternatively or additionally, at least one carrier support may be configured to support a substrate carrier carrying a coated substrate, and at least one carrier support may be configured to support a substrate carrier carrying a substrate to be coated. Alternatively or additionally, at least one carrier support may be configured to support a mask carrier carrying a mask device to be used, and at least one carrier support may be configured to support a mask device that is to be unloaded from the vacuum system. A quick and easy exchange of mask devices and/or substrates from deposition areas of a deposition module may be possible. [0064] Providing a transport cart 111 with a plurality of carrier supports for supporting a plurality of mask carriers and/or substrate carriers increases the flexibility of the vacuum system and further reduces the cycle rate of the vacuum system, because a plurality of mask carriers, substrate carriers and/or empty carriers can be simultaneously transported by the transport cart 111, as may be appropriate. For example, the transport cart 111 may include at least six carrier supports, wherein at least two carrier supports may be arranged adjacent to an upstream edge of the transport cart 111 and configured for transporting carriers to and from the first deposition area 131 of a deposition module, and at least two carrier supports may be arranged adjacent to a downstream edge of the transport cart 111 and configured for transporting carriers to and from the second deposition area 132 of a deposition module.

[0065] In some embodiments, one carrier support of the transport cart 111 may be configured to transport substrate carriers and mask earners, e.g. when a dimension such as a height and/or a thickness of mask carriers essentially corresponds to a dimension such as a height and/or a thickness of substrate carriers.

[0066] In some embodiments, which may be combined with other embodiments described herein, the at least one deposition module 104 may include a first deposition area 131 with a substrate track 30 and a second deposition area 132 with a second substrate track 31, and the transport cart 111 may include a first carrier support 112 for supporting a first substrate carrier and a second carrier support 113 for supporting a second substrate carrier. In some embodiments, a first distance Dl between the substrate track 30 and the second substrate track 31 essentially corresponds to a second distance D2 between the first earlier support 112 and the second carrier support 113. Accordingly, the transport cart 111 may be used for a substrate exchange in the first deposition area 131 and in the second deposition area 132 at the same time.

[0067] In some embodiments, which may be combined with other embodiments described herein, the first transport system 110 may be configured to hold one or more mask devices in an orientation parallel to the orientation of the substrate, i.e. parallel to the transverse direction T, during the transport along the main transport path. In particular, the first transport system 110 may include a transport cart 111 with one or more carrier supports configured to support mask carriers. The carrier supports may extend in the transverse direction such as to support the mask carriers having an orientation parallel to the transverse direction T.

[0068] In some embodiments, which may be combined with other embodiments described herein, the main transport path 101 extends essentially linearly in the main transport direction P. It is to be noted that the main transport path may have a non-linear setup in some embodiments, and the linear setup depicted in FIG. 1 is only an example. The main transport path can be understood as a path along which the substrates are transported, and which includes one or more intersection points, at which the substrates can be routed out of the main transport path into one or more deposition modules for being coated with a material. The substrates can be routed back into the main transport path at the one or more intersection points for continuing with the transport of the substrates along the main transport path.

[0069] In some embodiments, the transverse direction T is essentially perpendicular to the main transport direction P. In some embodiments, the main surface of the substrates and/or of the mask devices is essentially vertical (+/-10⁰) during the transport.

[0070] In some embodiments, which may be combined with other embodiments described herein, an evaporation source 105 may be provided in the at least one deposition module 104. The evaporation source may be movable in the transverse direction T and/or configured to direct an organic material toward the substrate. [0071] As is schematically depicted in FIG. 1, the vacuum system 100 may include a plurality of first-side deposition modules on the first side SI of the main transport path 101 and a plurality of second-side deposition modules on the second side S2 of the main transport path 101, wherein the first-side and second-side deposition modules may extend in the transverse direction T, respectively. In particular, substrate tracks in the deposition modules may extend in the transverse direction T, respectively. In some embodiments, the second-side deposition modules may be arranged opposite the first-side deposition modules, respectively, as is depicted in FIG. 1. In particular, a substrate track 30 may extend linearly from the first deposition area of a first-side deposition module through the main transport path 101 and into a first deposition area of a second- side deposition module. Alternatively or additionally, a second substrate track 31 may extend linearly from the second deposition area 132 of the first-side deposition module through the main transport path 101 and into the second deposition area of the second-side deposition module. Accordingly, substrates may be routed from the transport cart 11 1 into the first-side deposition module and/or into the second-side deposition module when the transport cart 111 is in a position in which the carrier supports of the transport cart are aligned with the respective tracks on both sides of the main transport path.

[0072] A substrate may subsequently be routed from the main transport path 101 into a plurality of first-side deposition modules and/or into a plurality of second-side deposition modules for depositing a material stack on the substrate, particularly while continuously maintaining the orientation of the substrate parallel to the transverse direction T.

[0073] A plurality of second transport systems may be provided for transporting substrate caniers holding substrates between the main transport path and the first- side and/or second-side deposition modules. The second transport systems may include magnetic levitation devices configured for contactlessly holding the substrates carriers during the transport in the transverse direction.

[0074] A vacuum system 100 for depositing one or more materials on a substrate according to embodiments described herein may include a first transport system 110 with a transport cart 111 configured to transport one or more substrate carriers and/or mask carriers along a main transport path 101 extending in a main transport direction P. The one or more substrate carriers may carry a respective substrate and the one or more mask carriers may carry a respective mask device. The vacuum system may further include a plurality of deposition modules 102 arranged adjacent to the main transport path 101 on the first side SI and on the second side S2 of the main transport path 101, and a plurality of second transport systems configured to transport the one or more substrate earners and/or mask carriers from the transport cart 111 into the plurality of deposition modules in a transverse direction (T). The transverse direction T may extend at an angle of 30° or more with respect to the main transport direction P, particularly at an angle of about 90°.

[0075] The transverse direction T may correspond to the direction of one or more substrate tracks in the plurality of deposition modules. The transport cart 111 may be configured to hold the one or more substrate carriers and/or mask carriers in an orientation which is essentially parallel to the transverse direction T during the transport. In particular, the transport cart 111 may include one or more carrier supports for supporting a carrier, wherein the earner supports extend in the transverse direction T. The routing of substrates and mask devices from the main transport path into the deposition modules can be accelerated, as the orientation of the substrates and mask devices may not be changed at the transition between the main transport path and the deposition modules. The orientation of the substrates and/or the orientation of the mask devices during the transport along the main transport path 101 may correspond to the orientation of the substrates and/or mask devices during the deposition in the deposition modules. [0076] In some embodiments, the orientation of a substrate may remain essentially constant (+/-10⁰) during the transport of the substrate in the vacuum system through a plurality of subsequent deposition modules where a plurality of materials may subsequently be deposited on the substrate. The cycle time of the vacuum system may be reduced, since less processing time may be needed for substrate rotations. [0077] FIG. 2 is a schematic view of a vacuum system 200 according to embodiments described herein. The vacuum system 200 of FIG. 2 may include some features or all features of the vacuum system 100 of FIG. 1, so that reference can be made to the above explanations which are not repeated here.

[0078] For example, the vacuum system 200 may include a plurality of vacuum systems 100 as depicted in FIG. 1 as constituent parts thereof, wherein the vacuum systems 100 may be arranged next to each other along the main transport direction P such that a large number of materials or layers can subsequently be deposited on a substrate in the vacuum system 200. For example, a layer stack including five, ten or more layers can be deposited on a substrate in the vacuum system 200. [0079] The vacuum system 200 may include a first transport system configured to transport one or more substrates and/or mask devices along a main transport path 101 in a main transport direction P. The vacuum system 200 may further include a plurality of second transport systems configured to transport the one or more substrates and/or mask devices in the transversal direction T between the main transport path 101 and a plurality of deposition modules 102 and/or other modules arranged adjacent to the main transportation path 101.

[0080] For example, second transport systems as described herein may be configured to transport the one or more substrates in the transversal direction between the main transport path 101 and one or more substrate loading or unloading modules and/or substrate swing modules arranged next to the main transport path. Alternatively or additionally, second transport systems as described herein may be configured to transport one or more mask devices between the main transport path 101 and one or more mask handling modules arranged next to the main transport path. Alternatively or additionally, second transport systems as described herein may be configured to transport empty carriers between the main transport path 101 and one or more carrier storage modules arranged next to the main transport path.

[0081] In some embodiments, which may be combined with other embodiments described herein, the second transport systems may include a magnetic levitation device configured to contactlessly hold a substrate carrier or a mask carrier, and a drive unit configured to move the substrate carrier or the mask carrier along a track while being held by the magnetic levitation device. For example, each second transport system may include a levitation box configured to provide a magnetic force for carrying the weight of the substrate carrier or mask carrier, and a drive box configured to move the levitated carrier along a track. The levitation devices may be arranged in drop-in boxes provided at a top wall of the vacuum system. For example, the magnetic levitation devices may be arranged in depressed slots provided in the top walls of the vacuum system.

[0082] The vacuum system 200 may include a plurality of first-side deposition modules arranged on the first side SI of the main transport path and a plurality of second-side deposition modules arranged on the second side S2 of the main transport path.

[0083] In some embodiments, the vacuum system 200 is configured as a mirror-line in which a first subset of substrates is coated in only the first-side deposition modules and another subset of substrates is subsequently coated in only the second-side deposition modules. In a mirror-line, the first-side deposition modules may be essentially a mirror image of the second-side deposition modules, and two oppositely aixanged deposition modules may be configured for depositing the same material. In other embodiments, each substrate may be subsequently routed through first-side and second-side deposition modules.

[0084] The first transport system may include one or more transport carts 111 configured to be movable along the main transport path 101. For example, the first transport system may include two or more transport carts 111, as is schematically depicted in FIG. 2. The transport carts may be movable along cart tracks extending along the main transport path 101. Each of the transport carts may be associated to predetermined vacuum modules arranged next to the main transport path, e.g. on a first side S 1 and/or on a second side S2 of the main transport path. For example, during the operation of the vacuum system, each transport cart may move in a predetermined section of the main transport path.

[0085] For example, a first transport cart may move in an upstream section of the main transport path 101 and be configured for transporting substrates along the main transport path between a substrate loading module 201 which may include a substrate swing station and first-side and second-side deposition modules 202. No mask transport may be needed in this section. In some embodiments, the first transport cart includes two or four carrier supports configured to support up to four substrate carriers extending in the transverse direction T.

[0086] One or more transport carts may move in a respective intermediate section of the main transport path 101 and be configured for transporting substrates and/or mask devices along the main transport path between a respective plurality of first-side and second-side deposition modules 203 and/or mask handling modules 211. The one or more transport carts may include more than four carrier supports, e.g. six or more carrier supports. Accordingly, the one or more transport carts may transport a plurality of mask devices and/or substrates at the same time.

[0087] A further transport cart may move in a downstream section of the main transport path 101 and be configured for transporting substrates along the main transport path between a substrate unloading module 205, which may include a substrate swing station and first-side and second-side deposition modules 204. No mask transport may be needed in this section. In some embodiments, the further transport cart may include two or four carrier supports configured to support up to four substrate carriers extending in the transverse direction T.

[0088] Each transport cart 111 may include a plurality of carrier supports extending in the transverse direction. A carrier support may be configured for supporting a substrate carrier carrying a substrate having an orientation which is transverse, particularly perpendicular to the movement direction of the transport cart 111. In particular, while the transport cart is moved along the main transport path 101, the orientation of the substrate may be parallel to the transversal direction. Alternatively or additionally, a carrier support may be configured for supporting a mask carrier carrying a mask device having an orientation which is transverse, particularly perpendicular to the movement direction of the transport cart 111.

[0089] In some embodiments, the vacuum system 200 may include one or more mask handling modules 211 arranged adjacent to the main transport path 101 on the first side S I and/or on the second side S2 of the main transport path 101. The mask handling modules 211 may include mask handling assemblies, e.g. a robot arm, configured to load mask devices into the vacuum system and/or to unload mask devices from the vacuum system, e.g. into a load lock chamber. The mask handling assemblies may be configured to attach and/or detach mask devices from mask carriers in the mask handling module.

[0090] For example, mask devices to be used may be loaded into the vacuum system 200 on the first side SI of the vacuum system, where first- side mask handling modules may be provided. In the first-side mask handling modules, the mask devices may be attached to mask carriers. The mask carriers may be oriented parallel to the transverse direction T in the mask handling modules 211. For example, the mask carriers may be provided on mask tracks extending in the transverse direction T in the mask handling modules 211. [0091] When a mask device has been attached to a mask carrier in a first- side mask handling module, the mask carrier may be transported in the transverse direction T into the main transport path 101 onto a carrier support of one of the transport carts 111 by a second transport system. The transport cart may transport the mask carrier along the main transport path 101 toward one of the deposition modules 102 where the mask device is to be used. The mask carrier is then transported from the carrier support of the transport cart

11 111 along a mask track in the transverse direction into the deposition module by a second transport system. Prior to this, a used mask device may be moved out of the deposition module.

[0092] In some embodiments, used mask devices are unloaded from the vacuum system on the second side S2 of the vacuum system, where second- side mask handling modules may be provided. In the second-side mask handling modules, the used mask devices may be detached from mask carriers by mask handling assemblies, e.g. by robot arms, and unloaded from the vacuum system. Prior to the detachment, the mask carrier carrying the used mask device may be transported from a carrier support of one of a transport cart 111 into a second-side mask handling module by a second transport system, particularly on a mask track extending in the transverse direction into the second-side mask handling assembly.

[0093] In some embodiments, the transport carts 111 may include a carrier support configured to support an empty carrier. The empty carrier may be transported from a downstream section of the main transport path to an upstream section of the main transport path. In particular, coated substrates may be detached from substrate carriers in the substrate unloading module 205, where the coated substrates may be unloaded from the vacuum system 200. The empty carriers may be transported back toward the substrate loading module 201 where a new substrate to be coated may be attached to the carrier. [0094] In some embodiments, a carrier storage module or "empty carrier parking module" may be provided adjacent to the main transport path 101 on the first side SI and/or on the second side S2. The carrier storage module(s) may be used for temporarily storing empty carriers, particularly for handing over empty carriers from one transport cart to another transport cart which moves in a more upstream section of the main transport path 101. In some embodiments, one or more mask handling modules 211 can be used as a carrier storage module or as an empty carrier parking module.

[0095] In some embodiments, a first subset of the mask handling modules 211 is configured for handling mask devices which are utilized in first deposition areas of the deposition modules, and a second subset of the mask handling modules 21 1 is configured for handling mask devices which are utilized in second deposition areas of the deposition modules.

[0096] In some embodiments, no power supplies are provided on the transport carts 1 11. Rather, the transport carts 111 may be passively guided along cart tracks, e.g. by stationary drive units such as linear drives. A passive guiding may be fixed to the transport carts. In some embodiments, no media supply for supplying the transport carts with electricity, cooling liquids or other fluids may be provided. Lightweight and simple transport carts may be provided.

[0097] In some embodiments, a service module (not shown in the figures) may be connected to one or more deposition modules 102. The evaporation source may be movable from the deposition module into the service module where the evaporation source may be serviced or repaired. For example, the crucibles of the evaporation source may be exchanged in the service module.

[0098] According to embodiments described herein, the number of rotation modules for changing the orientation of the substrate may be reduced, as the orientation of the substrates and/or of the mask devices may be maintained essentially constant during the transport through the vacuum system. Because there may be no constraint regarding an interfering contour of a rotor, it will be possible to increase the number of deposition modules per unit of length of the vacuum system in the main transport direction P. This will reduce the costs of the vacuum system and the number of components for the transport of the substrate carriers and/or mask carriers.

[0099] In some embodiments, magnetic levitation devices may be provided at positions where the substrate carriers and mask carriers move along tracks in the length direction of the respective carrier, i.e. in the transverse direction T with respect to the main transportation path. For example, magnetic levitation boxes may be provided for the transversal carrier transport into and from the deposition modules, the substrate loading and unloading modules and/or the mask handling modules which are arranged on a side of the main transport path. No magnetic levitation boxes may be provided for transporting the carriers along the main transport path. Costs can be saved by providing the transport carts configured for the transport of the carriers along the main transport path. [00100] During the transport of carriers by the transport cart 111 along the main transport path, the carriers may be in contact with the transport cart 111 (no levitation), i.e. the weight of the carriers may be carried by the transport cart 111.

[00101] As is schematically depicted in FIG. 2, at least four tracks may extend from the main transport path 101 into each deposition module in the transverse direction T, respectively. The two outer tracks may be substrate tracks configured for the transport of substrate carriers, and the two inner tracks may be mask tracks configured for the transport of mask carriers. Accordingly, substrates and mask devices can be transported from the transport carts 111 into the first and second deposition areas of the deposition modules along the substrate tracks and mask tracks.

[00102] Second transport systems may be provided for a contactless transport of substrate carriers along substrate tracks and mask carriers along mask tracks. The orientation of a substrate may be parallel to the direction of the substrate track during the transport along the substrate track, and the orientation of a mask device may be parallel to the direction of a mask track during the transport along the mask track. The second transport systems may be configured for a contactless transport of carriers in the transverse direction along the respective tracks.

[00103] FIG. 3 is a schematic view of a deposition module 300 of a vacuum system according to embodiments described herein. The deposition module 300 may be arranged next to a main transport path 101 of a vacuum system described herein. Substrate carriers carrying substrates and/or mask carriers carrying mask devices can be transported from a transport cart 111 which is movable along the main transport path 101 into deposition areas of the deposition module and vice versa.

[00104] The transport cart 111 may include a plurality of carrier supports 301 for supporting mask carriers and/or substrate carriers during the movement of the transport cart 111 in the main transport direction P. The carrier supports 301 may extend in the transverse direction T such as to support earners having an orientation parallel to the transverse direction T. [00105] A substrate track 30 may extend in the transverse direction T from the main transport path 101 into the first deposition area 131, and/or a second substrate track 31 may extend in the transverse direction T from the main transport path 101 into the second deposition area 132. A second transport system is provided for transporting a substrate carrier carrying a substrate 10 along the substrate track 30 from the transport cart 111 into the first deposition area 131. A second transport system is provided for transporting a second substrate carrier carrying a second substrate 11 along the second substrate track 31 from the transport cart 111 into the second deposition area 132.

[00106] A mask track 32 may extend in the transverse direction T from the main transport path 101 into the first deposition area 131, and/or a second mask track 33 may extend in the transverse direction T from the main transport path 101 into the second deposition area 132. A second transport system is provided for transporting a mask carrier carrying a mask device 13 along the mask track 32 from the transport cart 111 into the first deposition area 131. A second transport system is provided for transporting a second mask carrier carrying a second mask device 14 along the second mask track 33 from the transport cart 111 into the second deposition area 132. The mask track 32 may be arranged between the evaporation source 105 and the substrate track 30 in the deposition module such that the mask device 13 may be arranged in front of the substrate 10 during the deposition to allow for a masked deposition on the substrate 10. The second mask track 33 may be arranged between the evaporation source 105 and the second substrate track 31 in the deposition module such that the second mask device 14 may be arranged in front of the second substrate 11 during the deposition to allow for a masked deposition on the second substrate 11.

[00107] The transport cart 111 may be movable along the main transport path 101 in the main transport direction P, while a plurality of substrate carriers and/or mask carriers is supported on the carrier support 301.

[00108] The deposition module 300 may include a vacuum chamber 302 with one or two deposition areas for arranging a substrate. A sub-atmospheric pressure may be provided in the vacuum chamber 302, e.g. a pressure of 10 mbar or less. [00109] In the exemplary embodiment of FIG. 3, two deposition areas are provided in the vacuum chamber 302, namely a first deposition area 131 for arranging the substrate 10 and a second deposition area 132 for arranging the second substrate 11. Further, an evaporation source 105 is arranged in the vacuum chamber 302. The first deposition area 131 and the second deposition area 132 may be provided on opposite sides of the evaporation source 105.

[00110] In some embodiments, the evaporation source 105 includes one or more distribution pipes having one or more vapor outlets for directing plumes of evaporated material toward the substrate. [00111] The evaporation source 105 may optionally include an idle shield 303. The evaporation source 105 can be moved from a deposition position that is shown in FIG. 3 into an idle position in which the one or more vapor outlets are directed toward the idle shield 303. In the deposition position, the one or more vapor outlets are directed to the first deposition area 131 or to the second deposition area 132. [00112] In some embodiments, which may be combined with other embodiments described herein, the evaporation source 105 may be movable past the first deposition area 131, rotatable between the first deposition area 131 and the second deposition area 132, and movable past the second deposition area 132. The idle position may be an intermediate rotation position of the evaporation source 105 between the first deposition area 131 and the second deposition area 132.

[00113] The evaporation source 105 may be movable along a source path 331, which may be a linear path extending in the transverse direction T. In particular, a first drive may be provided for moving the evaporation source 105 along the source path 331 past the first deposition area 131 and/or past the second deposition area 132. [00114] The evaporation source 105 may include one, two or more distribution pipes which may extend in an essentially vertical direction. Each distribution pipe of the one, two or more distribution pipes may be in fluid connection with a crucible configured for evaporating a material. Further, each distribution pipe of the one, two or more distribution pipes may include a plurality of vapor outlets, e.g. nozzles, arranged along the length of the one, two or more distribution pipes. For example, ten, twenty or more vapor outlets may be provided along the length of the distribution pipe, e.g. in an essentially vertical direction. The idle shield 303 may extend at least partially around the one, two or more distribution pipes of the vapor source. In some embodiments, an opening angle of the plumes of evaporated material propagating from the vapor outlets in a horizontal sectional plane may be between 30° and 60°, particularly about 45°.

[00115] As is depicted in more detail in FIG. 3, the deposition module 300 may be configured for the subsequent coating of the substrate 10 arranged in the first deposition area 131 and the second substrate 11 arranged in the second deposition area 132. When the evaporation source 105 moves between the deposition areas, the evaporation source 105 may stop in the idle position in which the one or more vapor outlets are directed toward the idle shield 303. For example, the evaporation source 105 may stop for at least one of: service, maintenance, cleaning, waiting, aligning of the substrate or the mask. Alternatively, the evaporation source 105 moves continuously between the deposition areas, without stopping in the idle position. In particular, the idle shield 303 is an optional feature.

[00116] The deposition module 300 may be configured for masked deposition on one or more substrates. The mask device 13 may be arranged in the first deposition area 131 in front of the substrate 10, and/or the second mask device 14 may be arranged in the second deposition area 132 in front of the second substrate 11.

[00117] An "essentially vertical orientation" as used herein may be understood as an orientation with a deviation of 10° or less, particularly 5° or less from a vertical orientation, i.e. from the gravity vector. For example, an angle between a main surface of a substrate (or mask device) and the gravity vector may be between +10° and -10° during transport. In some embodiments, the orientation of the substrate (or mask device) may not be exactly vertical during transport and/or during deposition, but slightly inclined with respect to the vertical axis, e.g. by an inclination angle between - 1° and -5°. A negative angle refers to an orientation of the substrate (or mask device) wherein the substrate (or mask device) is inclined downward. A deviation of the substrate orientation from the gravity vector during deposition may be beneficial and might result in a more stable deposition process, or a facing down orientation might be suitable for reducing particles on the substrate during deposition. However, also an exactly vertical orientation (+/- 1⁰) during transport and/or during deposition is possible.

[00118] In some embodiments, an evaporation source 105 may be provided in the at least one deposition module for masked deposition of a material on the substrate. The present disclosure is however not restricted to vacuum systems with an evaporation source. For example, chemical vapor deposition (CVD) systems, physical vapor deposition (PVD) systems, e.g. sputter systems, and/or evaporation systems have been developed to coat substrates, e.g. thin glass substrates, e.g. for display applications, in a deposition chamber. In typical vacuum systems, the substrates may be held by substrate carriers, and the substrate carriers may be transported through the vacuum chamber by substrate transport systems.

[00119] The substrate may be an inflexible substrate, e.g., a wafer, slices of transparent crystal such as sapphire or the like, a glass substrate, or a ceramic plate. However, the present disclosure is not limited thereto, and the term substrate may also embrace flexible substrates such as a web or a foil, e.g. a metal foil or a plastic foil.

[00120] The substrate may be a large area substrate in some embodiments. A large area substrate may have a surface area of 0.5 m² or more. Specifically, a large area substrate may be used for display manufacturing and be a glass or plastic substrate. For example, substrates as described herein shall embrace substrates which are typically used for an LCD (Liquid Crystal Display), a PDP (Plasma Display Panel), and the like. For instance, a large area substrate can have a main surface with an area of 1 m² or larger. In some embodiments, a large area substrate can be GEN 4.5, which corresponds to about 0.67 m² substrates (0.73 x 0.92m), GEN 5, which corresponds to about 1.4 m² substrates (1.1 m x 1.3 m), or larger. A large area substrate can further be GEN 7.5, which corresponds to about 4.29 m² substrates (1.95 m x 2.2 m), GEN 8.5, which corresponds to about 5.7m² substrates (2.2 m x 2.5 m), or even GEN 10, which corresponds to about 8.7 m² substrates (2.85 m x 3.05 m). Even larger generations such as GEN 11 and GEN 12 and corresponding substrate areas can similarly be implemented. The mask devices may be larger than the substrates in some embodiments in order to provide for a complete overlap with the substrates during deposition. [00121] In some implementations, a thickness of the substrate in a direction perpendicular to the main surface of the substrate may be 1 mm or less, e.g. from 0.1 mm to 1 mm, particularly from 0.3 mm to 0.6 mm, e.g. 0.5 mm. Even thinner substrates are possible. [00122] In some embodiments, a mask device may include a mask and a mask frame. The mask frame may be configured to stabilize the mask which is typically a delicate component. For example, the mask frame may surround the mask in the form of a frame. The mask may be permanently fixed to the mask frame, e.g. by welding, or the mask may be releasably fixed to the mask frame. A circumferential edge of the mask may be fixed to the mask frame.

[00123] The mask may include a plurality of openings formed in a pattern and configured to deposit a corresponding material pattern on a substrate by a masked deposition process. During deposition, the mask may be arranged at a close distance in front of the substrate or in direct contact with the front surface of the substrate. For example, the mask may be a fine metal mask (FMM) with a plurality of openings, e.g. 100.000 openings or more. For example, a pattern of organic pixels may be deposited on the substrate. Other types of masks are possible, e.g. edge exclusion masks.

[00124] In some embodiments, the mask device may be at least partially made of a metal, e.g. of a metal with a small thermal expansion coefficient such as invar. The mask may include a magnetic material so that the mask can be magnetically attracted toward the substrate during deposition.

[00125] The mask device may have an area of 0.5 m² or more, particularly 1 m² or more. For example, a height of the mask device may be 0.5 m or more, particularly 1 m or more, and/or a width of the mask device may be 0.5 m or more, particularly 1 m or more. A thickness of the mask device may be 1 cm or less, wherein the mask frame may be thicker than the mask.

[00126] According to an aspect described herein, a method of depositing one or more materials on a substrate is described. FIG. 4 is a flow diagram illustrating a method according to embodiments described herein. [00127] In box 410, a substrate is transported along a main transport path 101 in a main transport direction P.

[00128] In box 420, the substrate is transported from the main transport path into a deposition module in a transverse direction T, e.g. in a direction essentially perpendicular to the main transport direction. In particular, the substrate is transported along a substrate track 30 into the deposition module, wherein the substrate track 30 may extend in the transverse direction T.

[00129] In box 430, a material is deposited on the substrate in the deposition module, particularly by evaporation. [00130] During the transport of the substrate along the main transport path in box 410, the substrate is held in an orientation essentially parallel to the transverse direction T. In particular, the main surface of the substrate may be essentially parallel (+/- 10°) to the transverse direction T during the transport of the substrate along the main transport path. Further, during the transport of the substrate into the deposition module in the transverse direction, the substrate may also be held essentially parallel to the transverse direction, i.e. in the direction of the substrate track 30. In particular, the orientation of the substrate may not change during the transport and the deposition in boxes 410, 420, and 430.

[00131] In some embodiments, the substrate is supported on a transport cart 111 of a first transport system in box 410, i.e. during the transport of the substrate along the main transport path. The transport cart moves in the main transport direction along the main transport path while the substrate is supported thereon. In particular, the substrate may be supported on a first carrier support of the transport cart 111, and the transport cart may include at least one second carrier support which may be empty.

[00132] In some embodiments, the substrate is contactlessly held by a second transport system, e.g. including a magnetic levitation system, in box 420, i.e. during the transport from the main transport path into the deposition module.

[00133] According to embodiments described herein, the substrate may be continuously held in the orientation parallel to the transverse direction during the transport and deposition in two, three, five or more subsequent deposition modules into which the substrate is subsequently routed from the main transport path. Accordingly, the cycle time of the system can be reduced.

[00134] In box 410, the substrate may be supported on a first carrier support of a transport cart. Before transporting the substrate into the deposition module in box 420, a previously coated substrate may be moved out of the deposition module onto the transport cart. In particular, the previously coated substrate may be transported from the deposition module into the main transport path onto a second carrier support of the transport cart which may be unoccupied. Thereupon, the transport cart moves in the main transport direction P until the first carrier support is aligned with the substrate track. Thereupon, the substrate can be transported from the first carrier support of the transport cart into the deposition module in the transverse direction along the substrate track. No substrate rotation may be required for exchanging a substrate in a deposition module, since the orientation of the substrates in the main transport path may correspond to the orientation of the substrates in the deposition modules. [00135] The substrates may be attached to substrate carriers during the processing of the substrates in the vacuum system. Accordingly, "transporting a substrate" may refer to the transport of a substrate carrier which carries the substrate.

[00136] According to an aspect described herein, a method of transporting a mask device in a vacuum system is described. The mask device may be transported along the main transport path 101 in the main transport direction P. The mask device may then be transported from the main transport path into the deposition module in the transverse direction T, e.g. in a direction essentially perpendicular to the main transport direction P. In particular, the mask device may be transported along a mask track extending in the transverse direction into the deposition module. [00137] The mask device may be arranged in front of the substrate during the deposition of a material on the substrate. During the transport of the mask device along the main transport path, the mask device may be held in an orientation parallel to the transverse direction T. Also during the transport along the mask track, the orientation of the mask device may be essentially parallel to the transverse direction. In particular, the main surface of the mask device may be continuously essentially parallel (+/- 10°) to the transverse direction T during the transport of the mask device along the main transport path and along the mask track.

[00138] In some embodiments, a mask device and a substrate may be transported on a transport cart along the main transport path, while both the substrate and the mask device have an orientation parallel to the transverse direction. A simultaneous exchange of a substrate and a mask device in a deposition module may be provided.

[00139] In some embodiments, the main surfaces of the substrates and the mask devices may be essentially vertical during the transport in boxes 410 and 420 and during the deposition in box 430.

[00140] While the foregoing is directed to embodiments of the disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims

1. A vacuum system (100) for depositing one or more materials on a substrate, comprising: a first transport system (110) configured to transport a substrate along a main transport path (101) in a main transport direction (P); and at least one deposition module (104) extending in a transverse direction (T) with respect to the main transport direction (P), wherein the first transport system (110) is configured to hold the substrate in an orientation which is essentially parallel to the transverse direction (T) during the transport in the main transport direction (P).

2. The vacuum system of claim 1, further comprising: a second transport system (120) configured to transport the substrate (10) in the transverse direction (T) from the main transport path (101) into the at least one deposition module (104) and back into the main transport path (101).

3. The vacuum system of claim 2, wherein the first transport system (110) and the second transport system (120) are configured to continuously maintain the orientation of the substrate essentially perpendicular to the main transport direction

(P).

4. The vacuum system of claim 2 or 3, wherein the second transport system (120) comprises a substrate track (30) extending in the transverse direction (T) and/or a magnetic levitation device configured for contactlessly holding the substrate (10).

5. The vacuum system of any of claims 1 to 4, wherein the first transport system (110) comprises a transport cart (111) which is movable along the main transport path (101).

6. The vacuum system of claim 5, wherein the transport cart (111) comprises one, two, four, six or more carrier supports (301) extending in the transverse direction (T), wherein each carrier support is configured to support a substrate carrier or a mask carrier.

7. The vacuum system of claim 5 or 6, wherein the at least one deposition module (104) comprises a first deposition area (131) with a first substrate track (30) and a second deposition area (132) with a second substrate track (31), and the transport cart ( 111) comprises a first earner support (112) for supporting a first substrate carrier and a second carrier support (113) for supporting a second substrate carrier, particularly wherein a first distance (Dl) between the first substrate track (30) and the second substrate track (31) essentially corresponds to a second distance (D2) between the first earner support (112) and the second carrier support (113).

8. The vacuum system of any of claims 1 to 7, wherein the main transport path (101) extends essentially linearly in the main transport direction (P), the transverse direction (T) is essentially perpendicular to the main transport direction (P), and/or the orientation of the substrate (10) is an essentially vertical orientation.

9. The vacuum system of any of claims 1 to 8, wherein an evaporation source (105) is provided in the at least one deposition module (104), particularly wherein the evaporation source ( 105) is movable in the transverse direction (T) and configured to direct an organic material toward the substrate.

10. The vacuum system of any of claims 1 to 9, comprising a plurality of first- side deposition modules on a first side (SI) of the main transport path (101) and a plurality of second-side deposition modules on a second side (S2) of the main transport path (101) opposite the plurality of first-side deposition modules, wherein a plurality of second transport systems is provided for transporting substrates and/or mask devices between the main transport path and the first-side and second-side deposition modules in the transverse direction (T).

11. The vacuum system of any of claims 1 to 10, further comprising one or more mask handling modules (211) arranged adjacent to the main transport path (101) and comprising mask handling assemblies configured to load or unload mask devices into or from the vacuum system.

12. A vacuum system for depositing one or more materials on a substrate, comprising: a first transport system (110) comprising a transport cart (111) configured to transport one or more substrate carriers and/or mask carriers along a main transport path (101) extending in a main transport direction (P); a plurality of deposition modules (102) arranged adjacent to the main transport path (101) on a first side (SI) and/or on a second side (S2) of the main transport path (101); and a plurality of second transport systems configured to transport the one or more substrate carriers and/or mask carriers between the transport cart (111) and the plurality of deposition modules in a transverse direction (T), wherein the transport cart (111) is configured to hold the one or more substrate carriers and/or mask carriers in an orientation which is essentially parallel to the transverse direction (T).

13. A method of depositing one or more materials on a substrate, comprising: transporting a substrate (10) along a main transport path (101) in a main transport direction (P); transporting the substrate from the main transport path (101) into at least one deposition module (104) in a transverse direction (T); and depositing a material on the substrate in the at least one deposition module, particularly by evaporation, wherein the substrate is held in an orientation parallel to the transverse direction (T) during the transport along the main transport path ( 101).

14. The method of claim 13, wherein the substrate is continuously held in the orientation parallel to the transverse direction (T) during the transport and deposition in two or more subsequent deposition modules.

15. The method of claim 13 or 14, wherein the substrate is supported on a transport cart (111) of a first transport system (110) during the transport along the main transport path (101), and/or wherein the substrate is contactlessly held by a second transport system (120) during the transport between the main transport path and the at least one deposition module.