TW201921760A - Methods of handling a mask device, apparatus for exchanging a mask device, mask exchange chamber, and vacuum system - Google Patents

Abstract

Methods of handling a mask device (10) are described. According to an embodiment, the method includes: Loading (X1) the mask device (10) on a holding arrangement (20) for holding the mask device; moving (X2) the holding arrangement (20) from a first state into a second state, the second state being a non-horizontal state; aligning (X3) the holding arrangement (20) with a mask carrier (15); and transferring (X4) the mask device (10) from the holding arrangement (20) to the mask carrier (15). Further, an apparatus (100) for exchanging a mask device from a mask carrier as well as a vacuum system including such an apparatus are described.

Description

Method for processing a masking device, equipment for exchanging a masking device, mask exchange chamber, and vacuum system

The several embodiments of the present disclosure are related to several methods for processing a radon mask device. In particular, the embodiments of the present disclosure are related to several methods for processing a masking device, the masking device is assembled for shielding deposition on a substrate in a vacuum system. Other embodiments relate to an apparatus for exchanging a masking device from a masking carrier, which is used in a vacuum system. Other embodiments relate to a vacuum system for depositing a material on a substrate, including a device for exchanging a masking device from a masking carrier.

Optoelectronic devices using organic materials have become more popular for many reasons. Many of the materials used to make such devices are relatively inexpensive, so organic optoelectronic devices have the potential to surpass the cost advantages of inorganic devices. The inherent properties of organic materials can be beneficial for several applications, such as for deposition on flexible or non-flexible substrates. The inherent characteristics of organic materials are, for example, flexibility. Examples of organic photovoltaic devices include organic light emitting devices (OLEDs), organic photovoltaic crystals, organic photovoltaic cells, and organic light detectors.

For OLEDs, organic materials can have performance advantages over traditional materials. For example, the wavelength of light emitted by the organic light-emitting layer can be easily adjusted with a suitable dopant. OLEDs use thin organic films, which emit light when voltage is supplied to the device. For applications such as flat panel displays, lighting, and backlighting, OLEDs have become a more interesting technology.

Under sub-atmospheric pressure, materials are generally deposited on a substrate in a vacuum system, especially organic materials. During the deposition period, the masking device may be arranged in front of the substrate, wherein the masking device may have at least one opening or several openings, and this opening or openings define the opening pattern, and the opening pattern corresponds to For the pattern of the material to be deposited on the substrate, the deposition is performed by, for example, evaporation. The substrate is generally disposed behind the masking device during the deposition period and is aligned with the masking device. For example, a mask carrier may be used to transfer a mask device into a deposition chamber of a vacuum system, and a substrate carrier may be used to transfer a substrate into a deposition chamber to configure a substrate behind the mask device.

It may be advantageous to remove used masking devices from the vacuum system at regular intervals, such as for cleaning, mask exchange, or maintenance of used masking devices. Furthermore, it may be advantageous to load a masking device into a vacuum system at regular intervals, such as for mask exchange or to provide a clean or unused mask in the system. However, mask exchange takes time and can lead to idle time of the system, which increases the cost of ownership.

Therefore, methods and equipment for fast and efficient mask processing in a vacuum system are needed. In particular, it would be advantageous to simplify and speed up mask exchange in a vacuum system, which is assembled for shielding deposition on a substrate.

In view of the above, several methods for processing a mask device are proposed, a method for exchanging a mask device from a mask carrier, a device for exchanging a mask device from a mask carrier, and a mask exchange cavity. Chamber, and a vacuum system for depositing a material on a substrate.

According to one aspect of the present disclosure, a method for processing a masking device is proposed. The method includes: loading a masking device on a support configuration for supporting the masking device; moving the support configuration from a first state to a second state, the second state being a non-horizontal state; aligning the support Arranged on a mask carrier; and transferring the masking device from the supporting arrangement to the mask carrier.

According to other aspects of the present disclosure, a method for processing a masking device is proposed. The method includes: loading a masking device on a support configuration, the support configuration is used to support the masking device; moving the support configuration from a first orientation or a first position into a second orientation or a second position, the second positioning or The second position is a non-horizontal orientation or non-horizontal position; the alignment support is disposed on a mask carrier; and the mask device is transferred from the support configuration to the mask carrier.

According to other aspects of the present disclosure, a method for processing a masking device is proposed. The method includes: aligning a support arrangement on a mask carrier, the mask carrier supporting the mask apparatus, and the support arrangement is in a second state; transferring the mask apparatus from the mask carrier to the support arrangement; and moving from the second state The support is arranged in a first state, and the second state is a non-horizontal state.

According to other aspects described in this disclosure, a method for processing a masking device is proposed. The method includes aligning a support arrangement on a mask carrier, the mask carrier supporting the mask apparatus, the support arrangement being in a second orientation or second position; transferring the mask apparatus from the mask carrier to the support arrangement; and The second orientation or second position moving support is configured into a first orientation or first position, and the second orientation or second position is a non-horizontal orientation or non-horizontal position.

According to other aspects described in this disclosure, a method for exchanging a mask device from a mask carrier is proposed. The method includes: aligning a support disposed on a mask carrier, the mask carrier supporting the mask device, the support arrangement is in a second state and the mask device is a first mask device; A mask device to a support configuration; and moving the support configuration from a second state to a first state, the second state being a non-horizontal state. Furthermore, the method includes loading a masking device on a support configuration, the support configuration is used to support the masking device, and the masking device is a second masking device; moving the support configuration from a first state to a second state The second state is a non-horizontal state; the alignment support is arranged on a mask carrier; and the second mask device is transferred from the support arrangement to the mask carrier.

According to other aspects described in this disclosure, a method for exchanging a mask device from a mask carrier is proposed. The method includes: aligning a support arrangement on a mask carrier, the mask carrier supporting the mask device, the support arrangement is in a second orientation or second position and the mask device is a first mask device; The cover carrier transfers the first masking device to the support configuration; and moves the support configuration from the second orientation or second position into a first orientation or first position, the second orientation or second position being a non-horizontal orientation or Non-horizontal position. Furthermore, the method includes loading a masking device on a supporting arrangement, the supporting arrangement supporting the masking device, the masking device being a second masking device; moving the supporting arrangement from a first orientation or a first position Out of a second orientation or second position, the second orientation or second position is a non-horizontal orientation or non-horizontal position; the alignment support is disposed on a mask carrier; and the second mask device is transferred from the support configuration to Mask carrier.

According to other aspects described in this disclosure, a device for exchanging a masking device from a masking carrier is proposed. The equipment includes: a supporting arrangement for supporting the masking device; a mechanism for moving the supporting arrangement between a first state and a second state, the second state being a non-horizontal state; and an alignment assembly , Used to align the support and dispose on the mask carrier.

According to other aspects described in this disclosure, an apparatus for exchanging a masking device from a masking carrier is proposed. The device includes: a supporting arrangement for supporting the masking device; a mechanism for moving the supporting arrangement between a first orientation or first position and a second orientation or second position, the second orientation or second The position is a non-horizontal orientation or non-horizontal position; and an alignment component for aligning the support and disposing on the mask carrier.

According to other aspects described in this disclosure, a mask exchange chamber is proposed. The mask exchange chamber includes a magnetic levitation system assembled to support a mask carrier; and an apparatus according to any of the embodiments described herein for exchanging a mask device from a mask carrier.

According to other aspects described in this disclosure, a vacuum system for depositing a material on a substrate is proposed. The vacuum system includes a mask exchange chamber according to one of any of the embodiments described herein; at least one deposition chamber; and a mask transfer system assembled for mask exchange chambers in a non-horizontal orientation and the A number of masking devices and a number of used masking devices are transferred between at least one deposition chamber.

Other aspects, advantages, and features of this disclosure will become clearer through the description and accompanying drawings. In order to have a better understanding of the above and other aspects of the present invention, the following specific examples are described in detail below in conjunction with the accompanying drawings:

Detailed reference will now be made in several embodiments, one or more examples of which are shown in the drawings. The examples are provided by way of illustration and are not meant to be limiting. For example, features illustrated or described as part of one embodiment may be used in or combined with any other embodiment to obtain yet other embodiments. This means that this disclosure includes such adjustments and changes.

In the description below the drawings, the same reference numerals refer to the same or similar elements. Generally, only the differences between the individual embodiments are described. Unless stated otherwise, the description of one part or aspect in one embodiment can also be applied to the corresponding part or aspect in another embodiment.

Before the embodiments of the present disclosure are explained in more detail, some aspects of the names and terms used herein are explained.

FIG. 1 is a schematic diagram showing successive stages (a), (b), (c), and (d) of a method of processing a masking device 10 according to an embodiment described herein. According to several embodiments that can be combined with any of the other embodiments described herein, the method includes: loading (X1) the mask device 10 on a support arrangement 20, the support arrangement 20 for supporting the mask device; moving from a first state (X2) Supporting arrangement 20 to the second state, the second state is a non-horizontal state; aligning (X3) supporting arrangement 20 on mask carrier 15; and transmitting (X4) masking device 10 to the mask from supporting arrangement 20 Hood carrier 15.

In this disclosure, the name "state" may mean "directional" and / or "location". In particular, "first state" may mean a first orientation and / or a first position. Thus, a "second state" may mean a second orientation and / or a second position.

Therefore, the continuation stages (a), (b), (c), and (d) of FIG. 1 show a method for processing a mask device, in which the mask device is loaded on a mask carrier, and the mask carrier is Used to carry the masking device. In particular, the method of processing a masking device as exemplarily described with reference to FIG. 1 advantageously provides an improved method of mounting a masking device on a mask carrier. Generally, loading (X1) the masking device 10 on the support arrangement 20 includes loading a new, unused or cleaned mask on the support arrangement.

FIG. 2 is a schematic diagram showing successive stages (a), (b), (c), and (d) of a method of processing a mask device according to other embodiments described herein. According to several embodiments that can be combined with any of the other embodiments described herein, the method includes: aligning (Y1) the support arrangement 20 on the mask carrier 15, the mask carrier 15 supporting the mask device 10, and the support arrangement on the first In the two states; transferring (Y2) the masking device 10 from the mask carrier 15 to the supporting arrangement 20; and moving (Y3) the supporting arrangement 20 from the second state to the first state, the second state is a non-horizontal state.

Therefore, the continuation stages (a), (b), (c), and (d) of FIG. 2 illustrate a method of processing a masking device, in which the masking device is unloaded from the mask carrier. In particular, as exemplarily described with reference to FIG. 2, the method of processing a masking device advantageously provides an improved method of unloading a masking device from a mask carrier. Generally, unloading a masking device from a mask carrier includes unloading a used mask, that is, a used mask for shielding substrate deposition.

In particular, it will be understood that several embodiments of the method of processing a masking device as described herein include utilizing a device 100 for exchanging the masking device 10 according to several embodiments described herein. Further, it will be understood that by combining the method of processing a mask device exemplarily described with reference to FIG. 2 and the method of processing a mask device exemplarily described with reference to FIG. Improve methods. Thus, by exchanging the mask device as described herein, used masks can be unloaded from the mask carrier for example for cleaning, and new or cleaned masks can be loaded on the mask carrier.

In this disclosure, "masking device" will be understood as a masking device that is assembled for shielding deposition on a substrate. In particular, the mask device is assembled and arranged in front of the substrate on which a material pattern is applied, and the material pattern is defined by the mask device. For example, the masking device can be assembled for masking the evaporation process, wherein the material pattern is formed on the substrate by evaporation. The evaporated material may include organic compounds in some embodiments. For example, organic light emitting diode (OLED) devices can be manufactured.

In some embodiments, the masking device may include a mask and a mask support. The mask support can be assembled for supporting and supporting the mask, and the mask is generally a precision component. For example, the mask support may be a mask frame that surrounds the mask and has the shape of a frame. The mask may be, for example, permanently fixed to the mask frame by welding, or the mask may be releasably fixed to the mask frame. The peripheral edge of the mask can be fixed to the mask frame.

The mask may include several openings. These openings form a pattern and are assembled to deposit a corresponding material pattern on the substrate by a shadow deposition process. During the deposition, the mask can be placed at a short distance in front of the substrate or directly contact the front surface of the substrate. For example, the mask may be a fine metal mask (FMM), which has several openings, such as 100,000 openings or more. For example, patterns of organic pixels may be deposited on a substrate. Other forms of masking are possible, for example edge exclusion masks.

In some embodiments, the masking device may be at least partially made of metal, for example, a metal having a small thermal expansion coefficient, such as invar. The mask may include a magnetic material so that the mask may be magnetically attracted toward the substrate during deposition. The mask frame may alternatively or additionally include a magnetic material so that the mask device may be attracted to the mask carrier via magnetic force.

The masking device may have an area of 0.5 m ² or more, especially an area of 1 m ² or more. For example, the height of the masking device may be 0.5 m or more, especially 1 m or more, and / or the width of the masking device may be 0.5 m or more, especially 1 m or more. The thickness of the masking device may be 1 cm or less, where the mask frame may be thicker than the mask.

Exemplarily referring to Figs. 1 (c) and 2 (a), according to several embodiments that can be combined with any of the other embodiments described herein, the (X3, Y1) support arrangement 20 is on the mask carrier 15 It includes moving (Z2) one or more alignment elements 22 relative to the support arrangement 20. In particular, as exemplarily shown in FIGS. 1 (c) and 2 (a), the one or more alignment elements 22 can be moved in one direction toward the mask carrier 15. Generally, the one or more alignment elements 22 of the support arrangement 20 are assembled for engaging with one or more corresponding alignment elements 16 of the mask carrier to provide the support arrangement 20 and the mask carrier. 15 alignment. For example, the one or more alignment elements 22 of the support arrangement 20 may include one or more alignment pins 27. The one or more corresponding alignment elements 16 of the mask carrier may include one or more grooves, which are adapted to receive the one or more alignment elements 22 of the support arrangement 20, in particular to accommodate this. One or more alignment pins 27.

As exemplarily shown in Figures 1 (d) and 2 (a), the mask carrier 15 can support the mask device 10 in a non-horizontal orientation (V). By way of example, the masking device 10 may be supported by the mask carrier 15 in a substantially vertical orientation during transfer and / or deposition.

The “essentially vertical orientation” described herein can be understood as an orientation of the masking device 10, wherein the angle between the main surface of the masking device 10 and the gravity vector is between + 10 ° and -10 °, especially It is between 0 ° and -5 °. In some embodiments, for example during the transfer and / or deposition, the orientation of the mask may not be (accurate) vertical, but slightly tilted with respect to the vertical axis, for example an inclination angle between 0 ° and -5 °. Negative angle means one orientation of the masking device, where the masking device is tilted downward. Deviation from the orientation of the mask (and substrate) of the gravity vector may be advantageous and may result in a more stable deposition process, or downward orientation may be suitable for reducing particles on the substrate during deposition. However, for example, during transfer and / or deposition, accurate vertical orientation (+/- 1 °) of the masking device is also possible.

For example, a larger angle system between the gravity vector and the masking device is also possible during transmission and / or deposition. The angle between 0 ° and +/- 80 ° can be understood as the "non-horizontal orientation of the masking device" as used herein. For example, transferring a masking device in a non-horizontal orientation may have advantages to save space and allow smaller vacuum chambers.

In particular, as exemplarily shown in FIGS. 1 and 2, the one or more alignment elements 22 may include two or more alignment elements. For example, referring to FIG. 1 (d) and FIG. 2 (b) by way of example, a first alignment element 22A which is an example of a first alignment pin may be provided. The first alignment element 22A is configured and assembled for engaging with the first corresponding alignment element 16A. The first corresponding alignment element 16A is, for example, a first groove provided in the mask carrier 15. Furthermore, a second alignment element 22B may be provided as a second alignment pin. The second alignment element 22B is configured and assembled for engaging with the second corresponding alignment element 16B. The second corresponding alignment element 16B is an example of a second groove provided in the mask carrier 15. According to an example, the device 100 for exchanging the masking device may include four alignment elements. The four alignment elements are coupled to individual actuators for moving each of the four alignment elements. Therefore, the mask carrier 15 may include four corresponding alignment elements, which are assembled for accommodating the four alignment elements, in particular, the individual alignment pins 27 of the four alignment elements.

As exemplarily shown in FIGS. 1 (d) and 2 (b), the first alignment element 22A of the support arrangement 20 may be provided at the first end 20A of the support arrangement 20, and the second alignment element 22B may be provided At the second end 20B of the support arrangement 20. Generally, the second end 20B of the support arrangement 20 is opposite to the first end 20A of the support arrangement 20. The first corresponding alignment element 16A of the mask carrier 15 may be provided at the first end 15A of the mask carrier 15, and the second corresponding alignment element 16B may be provided at the second end 15B of the mask carrier 15. Generally, the first end 15A of the mask carrier 15 is opposite to the second end 15B of the mask carrier 15. For example, the first end 15A of the mask carrier 15 may be the upper end of the mask carrier 15 and the second end 15B of the mask carrier 15 may be the lower end of the mask carrier 15 as shown in Figure 1 (d) and 2 (b) is shown as an example.

Therefore, according to several embodiments that can be combined with any of the other embodiments described herein, the alignment (X3, Y1) support arrangement 20 on the mask carrier 15 may include engaging one or more alignment elements 22 on the mask The carrier 15, in particular, the one or more alignment elements 22 are engaged with one or more corresponding alignment elements 16 of the mask carrier 15, as exemplarily shown in FIGS. 1 and 2.

According to several embodiments that can be combined with any of the other embodiments described herein, the alignment (X3, Y1) support arrangement 20 on the mask carrier may include a lift (Z1) mask carrier, as shown in Figure 1 (c) And the example shown in Figure 2 (a). In particular, the lifting (Z1) mask carrier may include utilizing an electromagnetic arrangement 35 for generating a magnetic force acting on the mask carrier 15. In the drawings of this disclosure, the activated electromagnetic configuration is indicated by a shadow and an apostrophe after the reference number, which is 35 ′. For example, the electromagnetic configuration 35 may be part of a mask transfer system that is used to transfer a mask carrier in a vacuum system as described herein. The electromagnetic arrangement 35 may additionally or alternatively be a magnetic levitation system, fitted to support at least a part of the weight of the mask carrier 15 by magnetic force from above.

In particular, lifting the mask carrier may include releasing the contact between the support element 18 of the mask carrier 15 and the support arrangement 40, in particular in a vertical direction, the support arrangement 40 being used to support the mask carrier 15. Furthermore, by lifting (Z1) the mask carrier, the carrier alignment pin 17 can be moved in the accommodation portion 13 which is provided in the mask device 10, as shown in FIG. 1 (c) and The example shown in Figure 2 (a). In particular, by lifting the cover (Z1), the carrier alignment pin 17 can be moved from the first surface of the accommodating portion 13 to the second surface of the accommodating portion 13. Generally, the first surface of the accommodating portion 13 and the second surface of the accommodating portion 13 provide abutting surfaces for the carrier alignment pins 17.

According to several embodiments that can be combined with any of the other embodiments described herein, the transmission (X4, Y2) masking device 10 includes the use of one or more electromagnetic elements 23 which are used to provide an effect Magnetic force on the masking device 10. In the drawings disclosed in this disclosure, the activated electromagnetic component is indicated by a shadow and an apostrophe after the reference number, which is 23 '.

In particular, as shown by way of example in FIG. 1 (d), in order to transfer the masking device 10 from the support arrangement 20 to the mask carrier 15, the electromagnetic element 23 of the support arrangement is not activated, and the electromagnetic of the mask carrier 15 Element 23 'is activated. Therefore, as exemplarily shown in FIG. 2 (b), in order to transfer the mask device 10 from the mask carrier 15 to the supporting arrangement 20, the electromagnetic element 23 of the mask carrier 15 is not activated, and the electromagnetic of the supporting arrangement 20 Element 23 'is activated.

Therefore, the support arrangement 20 may include one or more electromagnetic elements 23 that are assembled to support the masking device 10 in the support arrangement 20. Furthermore, the mask carrier 15 may include one or more electromagnetic elements 23, which are assembled to support the mask device 10 on the mask carrier 15. For example, the one or more electromagnetic elements 23 of the mask carrier 15 may be integrated in the mask carrier 15.

Exemplarily referring to Figure 2 (c), before moving (Y3) the support arrangement (20) from the second state to the first state, the method may include retracting (Y23) the one or more pairs from the mask carrier 15准 Element22.

According to several embodiments that can be combined with any of the other embodiments described herein, the first state is a substantially horizontal state (H), as exemplarily shown in Figs. 1 (a) and 2 (d). In particular, the first state is a state in which the angle between the main surface of the mask device and the horizontal plane is 30 ° or less.

According to several embodiments that can be combined with any of the other embodiments described herein, the second state is a substantially vertical state, such as Figures 1 (b), (c), (d), and 2 (a), (b), (c) Exemplary illustrations. In particular, as exemplarily shown in FIG. 3, the second state may be a state in which the angle α between the main surface 10A of the mask device 10 and the gravity vector G is between + 10 ° and -10 °. between. In particular, the angle α between the main surface 10A of the mask device 10 and the gravity vector G may be between + 5 ° and -5 °. According to an example, the angle α is α = + 3 ° or α = -3 °.

Exemplarily referring to Figs. 1 (b) and 2 (d), according to several embodiments that can be combined with any of the other embodiments described herein, the moving (X2, Y3) support arrangement 20 includes a rotation axis 25 Rotary (or oscillating) support arrangements, particularly by using the mechanism 24. The mechanism 24 is used to move a support arrangement 20 as described herein. In particular, the rotation shaft 25 may be in a horizontal plane.

In Figures 3 (a) and 3 (b), two stages of a method for exchanging a mask device from a mask carrier according to the embodiments described herein are shown. In particular, Fig. 3 (a) shows a stage in which an electromagnetic arrangement 35 'for generating a magnetic force acting on the mask carrier 15 is activated, and the mask carrier is suspended. Figure 3 (b) shows a stage in which the electromagnetic arrangement 35 used to generate the magnetic force acting on the mask carrier 15 is not activated, and the mask carrier is dropped onto the support arrangement 40. Therefore, after transferring (Y2) the mask device 10 from the mask carrier 15 to the support arrangement 20 and retracting (Y23) the one or more alignment elements 22, unloading the mask device from the mask carrier may include lowering (Z3 ) The mask carrier is exemplified by a support arrangement 40, which is used to support the mask carrier 15. In particular, the descending (Z3) mask carrier may include an unactivated electromagnetic configuration 35 for generating a magnetic force acting on the mask carrier 15.

As can be understood from the representative diagrams in FIG. 3 (c) of the mask device 10 and the mask carrier 15, the second state is provided so that the angle α between the main surface 10A of the mask device 10 and the gravity vector G is provided . That is, the mask device and the mask carrier are inclined relative to the gravity vector G, which has advantages. During the separation of the mask device from the mask area by descent (Z3) the mask carrier, the mask device and Friction caused by surface-to-surface contact between the mask carriers can be avoided.

FIG. 4 shows a flowchart of a method 400 for processing a masking device according to the embodiments described herein. Block 410 shows the operation of loading the masking device 10 on the supporting arrangement 20, and the supporting arrangement 20 is used to support the masking device, as exemplarily described with reference to FIG. 1 (a). Block 420 represents the movement of moving (X2) the support arrangement 20 from the first state to the second state. The second state is a non-horizontal state, as exemplarily described with reference to FIG. 1 (b). Block 430 represents the operation of aligning (X3) the support arrangement 20 on the mask carrier 15, as exemplarily described with reference to FIG. 1 (c). Block 440 represents the operation of transferring (X4) the mask device 10 to the mask carrier 15 from the support arrangement 20, as exemplarily explained with reference to FIG. 1 (d).

For example, referring to the flowchart shown in FIG. 5, a method 500 for processing a mask device according to other embodiments described herein is shown. Block 510 shows the operation of aligning (Y1) the support arrangement 20 on the mask carrier 15 of the support mask device 10, and the support arrangement is in the second state, as exemplarily described with reference to FIG. 2 (a). Block 520 represents the operation of transferring (Y2) the mask device 10 from the mask carrier 15 to the support arrangement 20, as exemplarily explained with reference to FIG. 2 (b). Block 530 represents moving (Y3) the support arrangement (20) from the second state to the first state, and the second state is a non-horizontal state, as exemplarily described with reference to FIG. 2 (d).

FIG. 6 is a flowchart of a method 600 for exchanging a mask device according to the embodiment described herein. The method 600 includes: performing a method 500 for processing a mask device exemplarily described with reference to FIGS. 2 and 5, wherein the mask device is a first mask device. Furthermore, the method 600 includes: performing a method 400 for processing a mask device exemplarily described with reference to FIGS. 1 and 4, wherein the mask device is a second mask device. For example, the first mask device may be a used mask device, and the second mask device may be a used mask device.

As used herein, a "masking device to be used" can be understood as a masking device that is transferred to at least one deposition chamber for masking deposition on a substrate. In some embodiments, the masking device to be used may be a new masking device, a cleaned masking device, or a masking device that has undergone service or maintenance.

As used herein, a "used masking device" can be understood as a masking device that has been used to shield deposition in a sedimentation chamber. The masking device has been used to transfer the delivery out of the deposition chamber, for example for cleaning or maintenance. For example, a masking device has been used to unload from a vacuum system, for example for cleaning under atmospheric pressure. By using a masking device to mask deposition on one or more substrates, the used masking device is changed to a used masking device. In general, the masking device is used to shield the deposition on ten or more substrates, so the masking device can be cleaned. After cleaning, the masking device can be reloaded in a vacuum system to be used to mask the deposition.

In particular, the method 600 of exchanging the mask device generally includes: aligning (Y1) the support arrangement 20 with the mask carrier 15 supporting the mask device 10, the support arrangement 20 is in the second state, and the mask device 10 is A first masking device; transmitting (Y2) the first masking device from the mask carrier 15 to the supporting arrangement 20; and moving (Y3) the supporting arrangement 20 from the second state to the first state, the second state being a non-horizontal state . Furthermore, the method 600 includes loading (X1) the masking device 10 on the supporting arrangement 20, the supporting arrangement 20 is used to support the masking device 10, and the masking device is a second masking device; moving from the first state (X2) Of the support arrangement 20 to the second state, the second state is a non-horizontal state; align (X3) the support arrangement 20 on the mask carrier 15; and transfer (X4) the second mask device from the support arrangement 20 to the mask carrier 15.

According to an exemplary description with reference to FIGS. 1-3, according to one aspect of the present disclosure, a device 100 for exchanging the mask device 10 from the mask carrier 15 is proposed. In particular, according to several embodiments that can be combined with any of the other embodiments described herein, the device 100 includes: a support arrangement 20 for supporting the masking device 10; and a mechanism 24 for use in a first state and a second state The support arrangement 20 is moved between, the second state is a non-horizontal state, and an alignment component 26 is used to align the support arrangement 20 on the mask carrier 15. For example, the mechanism 24 for moving the support arrangement 20 may be a rotation mechanism for rotating the support arrangement 20 around the rotation axis 25. More specifically, the mechanism 24 for moving the support arrangement 20 may be an automatic mechanism. For example, the support arrangement 20 may include a robotic arm, assembled to exemplify the use of magnetic force to support the masking device.

In particular, referring to Figures 1 (a) and 2 (d) as an example, the first state may be a substantially horizontal state. More specifically, the first state may be a state in which the angle between the main surface of the mask device and the horizontal plane is 30 ° or less. The second state may be a substantially vertical state, as exemplarily shown in FIGS. 1 (b) and 2 (a). More specifically, the second state may be a state in which the angle between the main surface of the mask device and the gravity vector is between + 10 ° and -10 °.

According to several embodiments that can be combined with any of the other embodiments described herein, the alignment assembly 26 includes one or more alignment elements 22 that are movable relative to the support arrangement 20 of. In particular, as exemplarily shown in FIGS. 1 (c) and 2 (a), the one or more alignment elements 22 may be assembled for being movable in a direction toward the mask carrier 15. Furthermore, as exemplarily shown in FIG. 2 (c), the one or more alignment elements 22 may be assembled to be movable in a direction away from the mask carrier 15. For example, the one or more alignment elements 22 may be provided with a driver, such as a linear actuator, to move the one or more alignment elements relative to the support arrangement 20.

According to several embodiments that can be combined with any of the other embodiments described herein, the one or more alignment elements 22 of the support arrangement 20 are assembled for snapping onto one or more corresponding pairs of mask carriers. A collimation element 16 is provided to provide alignment between the support arrangement 20 and the mask carrier 15. For example, the one or more alignment elements 22 of the support arrangement 20 may include one or more alignment pins 27. The one or more corresponding alignment elements 16 of the mask carrier may include one or more grooves, which are configured to receive the one or more alignment elements 22 of the support arrangement 20, in particular the one or more Alignment pin 27.

According to an example, the device 100 for exchanging the masking device 10 may include four alignment elements 22 coupled to individual actuators for moving the individual alignment elements. Therefore, the mask carrier 15 may include four corresponding alignment elements 16, which are assembled to receive the four alignment elements 22, particularly the individual alignment pins 27 of the four alignment elements 22.

According to several embodiments that can be combined with any of the other embodiments described herein, the support arrangement 20 includes one or more electromagnetic elements 23 for supporting the masking device 10 magnetically. Therefore, in this disclosure, the "supporting arrangement" is understood as a configuration that is assembled to support a masking device, and in particular, the magnetism between the masking support portion of the supporting arrangement and the masking device is used. Interaction.

It will be understood that the features described with respect to the embodiment of the apparatus 100 for exchanging masking devices may also be applied to embodiments of the method described herein.

FIG. 7 is a schematic diagram of the mask exchange chamber 300 according to the embodiment described herein. As exemplarily depicted in FIG. 7, the mask exchange chamber 300 includes a magnetic levitation system 350 that is assembled for supporting the mask carrier 15. Furthermore, the mask exchange chamber 300 includes a device 100 for exchanging a mask device 10 from a mask carrier 15 according to any embodiment described herein. Therefore, the apparatus 100 for exchanging the mask device may be disposed in the mask exchange chamber 300.

According to several embodiments that can be combined with any of the other embodiments described herein, the mask exchange chamber 300 may include a closable opening 310 provided in a side wall 305 of the mask exchange chamber 300. Therefore, the masking device 10 can be moved through the closable opening 310, for example, from a mask box or another mask storage device, or to a mask box or another mask storage device. The mask box or this other mask storage device is assembled to store several mask devices. For example, the mask cassette may be configured in a loading chamber. According to several embodiments that can be combined with any of the other embodiments described herein, the device 100 for exchanging the masking device 10 can be assembled to be moved into a masking box through an opening.

FIG. 8 is a schematic diagram of a vacuum system 700 for depositing material on a substrate according to the embodiments described herein. As exemplarily shown in FIG. 8, the vacuum system 700 includes: a mask exchange chamber 300 according to several embodiments described herein; at least one deposition chamber 710; and a mask transfer system 720, which is assembled for use. The transfer between the mask exchange device 300 and the at least one deposition chamber 710 in a non-horizontal orientation will use the mask device and the used mask device. For example, the mask delivery system 720 may be assembled as a magnetic levitation system.

Referring to FIG. 8 as an example, according to several embodiments that can be combined with other embodiments described herein, the mask exchange chamber 300 may include a first device 100A and a second device 100B. The first device 100A is used to exchange the mask device, and the second device 100B is used to exchange the mask device. For example, a first device 100A for exchanging masking devices may be disposed in the first mask processing area 701, and a second device 100B for exchanging masking devices may be disposed in the second mask processing area 702. .

The second mask processing area 702 and the first mask processing area 701 may correspond to different sections of the mask exchange chamber 300. Different sections of the mask exchange chamber 300 may be adjacent to each other or may be separated from each other. For example, the first mask processing region 701 and the second mask processing region 702 may be opposite parts of the mask exchange chamber 300. In some embodiments, the first mask processing area 701 and the second mask processing area 702 are located on opposite sides of the transport path. The transfer path is fitted for transferring the mask carrier 15. For example, the first mask processing area 701 and the first device 100A can be assembled for processing a mask device 711 to be used, and the second mask processing area 702 and the second device 100B can be assembled for processing a used device. Shielding device 712.

Therefore, the used mask device 711 can be processed separately from the used mask device 712, and has the advantage of reducing or avoiding contamination of the washed mask device. Examples of processing are attaching, detaching, loading, unloading, storing, moving, rotating and / or translating.

In some embodiments that can be combined with other embodiments described herein, the main transfer path Z of the vacuum system includes four or more transfer tracks, including a first mask track 731, a second mask track 732, and a first substrate. The track 733 and the second substrate track 734. Other tracks can be set. The tracks can extend parallel to each other in the main conveying direction of the vacuum system. The first substrate track 733 and the second substrate track 734 may serve as external tracks, and the first mask track 731 and the second mask track 732 may serve as internal tracks disposed between the substrate tracks. Other configurations are possible.

For example, the first mask track 731 and the second mask track 732 may be part of a magnetic mask levitation system, assembled for levitation and / or transporting a mask carrier through the vacuum system 700. The first substrate track 733 and the second substrate track 734 may be part of a magnetic substrate suspension system, which is assembled for suspending and / or transferring the substrate carrier through the vacuum system 700.

According to several embodiments that may be combined with any of the other embodiments described herein, a mask loading channel may be provided to extend to the first mask processing area 701 and may be assembled for example via the first loading chamber 703 Loading will use the masking device 711 into the vacuum system 700. Furthermore, a mask unloading channel may be provided to extend from the second mask processing area 702, and may be assembled for unloading a used masking device 712 from the vacuum system 700, for example via the second loading chamber 704.

The first loading chamber 703 and the second loading chamber 704 may be disposed adjacent to the mask exchange chamber 300 and located on two opposite sides of the mask exchange chamber 300. For example, as shown in FIG. 8, the first loading chamber 703 may be disposed on the first side of the mask exchange chamber 300, and the second loading chamber 704 may be disposed on the mask exchange chamber 300. On the second side. The second side is opposite to the first side. In particular, the first loading chamber 703 and the second loading chamber 704 may be disposed on opposite sides of the shield track. The mask track is assembled for guiding the mask carrier.

Generally, the vacuum system 700 includes one or more vacuum chambers. For example, the mask exchange chamber 300 and / or the at least one deposition chamber 710 may be assembled into a vacuum chamber. The "vacuum chamber" (also referred to as "vacuum module") as used herein can be understood as a specific area in a vacuum system and can be set under sub-atmospheric pressure. Generally speaking, the passage between two adjacent vacuum chambers or vacuum modules can be closed to perform service or maintenance of one vacuum chamber without flooding adjacent vacuum chambers, but this is not necessary . Therefore, sub-atmospheric pressure may be provided in the vacuum system 700. For example, the internal volume of the vacuum system 700 can be evacuated to a pressure of 100 mbar or less, especially a pressure of 10 mbar or less, more particularly a pressure of 1 mbar or less, or even a smaller pressure. In particular, during settling, the vacuum chamber of the vacuum system can provide a low absolute pressure of 10 mbar or less.

As exemplarily shown in FIG. 8, a deposition source 715 for shielding material deposition on the substrate may be disposed in the at least one deposition chamber 710. For example, the deposition source 715 may be an evaporation source. However, the disclosure is not limited to a vacuum system having an evaporation source. For example, a chemical vapor deposition (CVD) system, a physical vapor deposition (PVD) system such as a sputtering system, and / or an evaporation system are being developed for use in a deposition chamber. An example of coating is a substrate for display applications, and an example of a substrate is a thin glass substrate. In a typical vacuum system, the substrate may be supported by a substrate carrier, and the substrate carrier may be transferred through the vacuum chamber by a substrate transfer system. The substrate carrier can be moved by the substrate transfer system so that at least a part of the main surface of the substrate is exposed toward the coating device. The coating device is exemplified by a sputtering device or an evaporation source. When the substrate can be positioned in front of the evaporation source and the evaporation source can move past the substrate at a predetermined speed, the main surface of the substrate can be coated with a thin coating layer. Alternatively, the substrate may be conveyed through the coating device at a predetermined speed.

The substrate may be a non-flexible substrate, such as a wafer, for example, a transparent crystal wafer of sapphire or the like, a glass substrate, or a ceramic plate. However, the disclosure is not limited thereto, and the name substrate may also include a flexible substrate, such as a web or a foil, such as a metal foil or a plastic foil.

The substrate may be a large-area substrate in some embodiments. The large-area substrate may have a surface area of 0.5 m ² or more. In particular, large-area substrates can be used in display manufacturing and as glass or plastic substrates. For example, the substrate described herein should include substrates generally used in liquid crystal displays (LCDs), plasma display panels (PDPs), and the like. For example, a large-area substrate may have a main surface having an area of 1 m ² or more. In some embodiments, the large-area substrate may be a 4.5th generation, a 5th generation, or a higher generation. The 4.5th generation corresponds to a substrate (0.73 mx 0.92 m) of approximately 0.67 m ² , and the 5th generation corresponds to a substrate (1.1 mx 1.3 m) of approximately 1.4 m ² . Large-area substrates can be more than 7.5th generation, 8.5th generation, or even 10th generation. The 7.5th generation corresponds to a substrate of approximately 4.29 m ² (1.95 mx 2.2 m), the 8.5th generation corresponds to a substrate of approximately 5.7 m ² (2.2 mx 2.5 m), and the 10th generation corresponds to a substrate of approximately 8.7 m ² (2.85 m × 3.05 m). Even higher generations and corresponding substrates such as the 11th and 12th generation can be applied in a similar manner. In some applications, an array of smaller sized substrates with surface areas as low as several cm ² and / or several individual shapes may be located on a single substrate support. In some embodiments, the masking device may be larger than the substrate to completely cover the substrate during deposition.

In some applications, the thickness of the substrate in a direction perpendicular to the main surface of the substrate may be 1 mm or less, for example from 0.1 mm to 1 mm, especially from 0.3 mm to 0.6 mm, for example 0.5 mm . Even thinner substrates are possible.

In some embodiments that can be combined with other embodiments described herein, the vacuum system 700 may further include a routing chamber 708. The following path transfer chamber 708 is disposed between the mask exchange chamber 300, the at least one deposition chamber 710, and the second deposition chamber 713. The follow-path transfer chamber 708 may include a follow-path transfer device 709, and the follow-path transfer device 709 is, for example, a rotating device. The following path conveying device 709 is assembled to be used for following path transmission between the mask exchange chamber 300 and the at least one deposition chamber 710 and between the mask exchange chamber 300 and the second deposition chamber 713. The masking device 711 and the used masking device 712. For example, the orientation of the at least one deposition chamber 710 and the orientation of the second deposition chamber 713 may be perpendicular to the main transfer path Z of the vacuum system, so that the mask carrier and the substrate carrier are in the main transfer path Z and the deposition chamber. The intersections between the chambers rotate around an essentially vertical axis of rotation. The mask carrier and / or the substrate carrier can be rotated in the following path transfer chamber 708.

In some embodiments, other deposition chambers, transition chambers, and / or follow-path transfer chambers may be disposed on the other side of the mask exchange chamber 300, for example, on the upper side in FIG. 8.

According to several embodiments described herein, a lighter weight mask device can be loaded into the vacuum system from the surrounding environment, and the mask device can be quickly attached to the mask carrier in the vacuum system. As a result, mask processing can be accelerated and the idle time of the system can be reduced.

In particular, the mask frame of the mask device can be disassembled from the mask carrier directly in the vacuum system. Therefore, only the masking device will be transported outside the vacuum system, for example by an overhead transport vehicle. The mask carrier and the mask part will be maintained under vacuum, and can be maintained for a longer time than the mask device is maintained in the vacuum system. The maximum weight of each mask that must be handled on the outside of the vacuum system is greatly reduced, for example, from a mask carrier of about 300 kg or more to 150 kg or less of a mask device without a mask Hood carrier. Therefore, a general overhead carrier can easily transport 7 or more masking devices instead of a smaller number of masking carriers. The number of mask exchanges can speed up and overhead conveyor systems, the number of mask carriers, and / or the number of mask receptacles can be reduced. As a result, costs can also be reduced and space requirements can be improved. The mask carrier is exemplified as being able to be maintained under vacuum for a long time together with the mask fixed thereto, and the maintenance work is therefore greatly reduced. When the masking system is to be cleaned or exchanged, the mask carrier can be sent to the atmosphere. Therefore, the total number of mask carriers can be reduced.

According to several embodiments described herein, the masking device and / or the substrate are conveyed in a vacuum system in a substantially vertical orientation. Compared to the concept in which the masking device and / or substrate is transferred and processed in an essentially horizontal orientation, the concept of vertical transfer allows processing of larger substrate sizes. Transporting the masking device and / or substrate in an essentially vertical orientation can be assisted by fixing the masking device and / or substrate on an individual carrier. According to several embodiments described herein, attaching the mask device to the mask carrier or removing the mask device from the mask carrier is not performed under atmospheric conditions, but is performed inside the vacuum system. Therefore, the weight that must be handled outside the vacuum system can be reduced.

Therefore, in light of the above, it will be understood that the embodiments described herein provide fast and efficient mask exchange. In particular, the embodiments described herein have the advantage of simplifying and speeding up mask exchange in a vacuum system, and the mask is assembled for shielding deposition on a substrate.

In summary, although the present invention has been disclosed as above with the embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention pertains can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the scope of the attached patent application.

In particular, this written description uses several examples including the best mode to disclose this disclosure, and also enables anyone with ordinary knowledge in this technical field to implement the stated subject matter, including the manufacture and use of any device or system and implementation Any method of incorporation. When several specific embodiments have been disclosed in the foregoing, the non-exclusive features of the above embodiments may be combined with each other. The patentable scope is defined by the scope of the patent application, and if the scope of the patent application has structural elements that are not different from the literal language of the scope of the patent application, or if the scope of the patent application includes equivalent structural elements, and the equivalent structural elements and the application When the literal language of the patent scope has insubstantial differences, other examples are intended to be included in the scope of the patent scope.

10‧‧‧Mask device

10A‧‧‧Main surface

13‧‧‧accommodation department

15‧‧‧Mask carrier

15A, 20A‧‧‧First end

15B, 20B‧‧‧Second end

16‧‧‧ Corresponding alignment element

16A‧‧‧First corresponding alignment element

16B‧‧‧Second corresponding alignment element

17‧‧‧ carrier alignment pin

18‧‧‧ support element

20‧‧‧Support configuration

22‧‧‧ Alignment Element

22A‧‧‧First Alignment Element

22B‧‧‧Second alignment element

23, 23’‧‧‧ electromagnetic components

24‧‧‧ Agency

25‧‧‧rotation axis

26‧‧‧Alignment kit

27‧‧‧alignment pin

35, 35’‧‧‧ electromagnetic configuration

40‧‧‧Support configuration

100‧‧‧ Equipment

100A‧‧‧First Equipment

100B‧‧‧Second Equipment

300‧‧‧Mask exchange chamber

305‧‧‧ sidewall

310‧‧‧ can close the opening

350‧‧‧ Magnetic levitation system

400, 500, 600‧‧‧ methods

410-440, 510-530‧‧‧ blocks

700‧‧‧vacuum system

701‧‧‧First mask processing area

702‧‧‧Second mask processing area

703‧‧‧first loading chamber

704‧‧‧Second loading chamber

708‧‧‧ Follow the path to transfer the chamber

709‧‧‧Follow the path transmission device

710‧‧‧Deposition chamber

711‧‧‧ will use masking device

712‧‧‧ Masking device used

713‧‧‧Second deposition chamber

715‧‧‧ sedimentary source

720‧‧‧Mask transfer system

731‧‧‧First mask track

732‧‧‧Second Mask Track

733‧‧‧First substrate track

734‧‧‧Second substrate track

G‧‧‧ gravity vector

H‧‧‧ essentially horizontal

V‧‧‧ non-horizontal orientation

X1‧‧‧ Loading

X2, Y3, Z2‧‧‧ Mobile

X3, Y1‧‧‧ alignment

X4, Y2 ‧‧‧ teleport

Y23‧‧‧ retracted

Z‧‧‧ main transmission path

Z1‧‧‧Lift

Z3‧‧‧Descent

α‧‧‧ angle

In order to make the above features of the present disclosure understandable in detail, a more specific description, which is briefly extracted from the above disclosure, may refer to several embodiments. The attached drawings relate to several embodiments of the present disclosure and are described below. Exemplary embodiments are shown in the drawings and explained in detail in the description below.

FIG. 1 is a schematic diagram showing successive stages (a), (b), (c), and (d) of a method for processing a mask device according to the embodiment described herein;

FIG. 2 is a schematic diagram showing successive stages (a), (b), (c), and (d) of a method for processing a mask device according to other embodiments described herein;

Figures 3 (a) and 3 (b) are schematic diagrams showing two different stages of a method of processing a masking device according to the embodiments described herein;

Figure 3 (c) shows a schematic diagram of a masking device and a masking carrier according to the embodiments described herein, used to explain the stage of unloading the masking device from the masking carrier;

4 and 5 show flowcharts of a method of processing a mask device according to the embodiments described herein;

FIG. 6 is a flowchart of a method for exchanging a mask device according to the embodiment described herein; FIG.

FIG. 7 is a schematic diagram of a mask exchange chamber according to the embodiment described herein; and

FIG. 8 is a schematic diagram of a vacuum system according to the embodiment described herein.

Claims (20)

A method for processing a masking device (10), the method includes: Loading (X1) the masking device (10) on a supporting arrangement (20) for supporting the masking device; Moving (X2) the support arrangement (20) from a first state to a second state, the second state is a non-horizontal state; Align (X3) the support arrangement (20) with a mask carrier (15); and The masking device (10) is transferred (X4) from the support arrangement (20) to the mask carrier (15). A method for processing a masking device (10), the method includes: Align (Y1) a support arrangement (20) on a mask carrier (15), the mask carrier supporting the mask device (10), the support arrangement being in a second state; Transferring (Y2) the masking device (10) from the mask carrier (15) to the support arrangement (20); and Moving (Y3) the support arrangement (20) from the second state to a first state, the second state is a non-horizontal state. The method according to item 1 or 2 of the scope of patent application, wherein aligning (X3, Y1) the support configuration (20) on the mask carrier (15) includes moving (Z2) a relative to the support configuration (20). Or multiple alignment elements (22). The method according to item 1 or 2 of the scope of patent application, wherein the alignment (X3, Y1) of the support configuration (20) on the mask carrier (15) includes engaging one or more alignment elements (22) on The mask carrier (15). The method as described in item 1 or 2 of the patent application scope, wherein aligning (X3, Y1) the support arrangement (20) on the mask carrier includes lifting (Z1) the mask by using an electromagnetic arrangement (35) The cover carrier is configured to generate a magnetic force acting on the cover carrier (15). The method as described in item 1 or 2 of the patent application scope, wherein transmitting (X4, Y2) the masking device (10) includes using one or more electromagnetic elements (23) to provide an effect on the masking device ( 10) The previous magnetic force. The method according to item 1 or 2 of the scope of patent application, wherein the first state is a state where an angle between a major surface of the masking device and a horizontal plane is 30 ° or less. The method according to item 1 or 2 of the scope of patent application, wherein the first state is a horizontal state. The method according to item 1 or 2 of the scope of patent application, wherein the second state is an angle between + 10 ° and -10 ° between a major surface of the masking device (10) and a gravity vector A state. The method according to item 1 or 2 of the patent application scope, wherein the second state is a vertical state. The method according to item 1 or 2 of the scope of patent application, wherein moving (X2, Y2) the support arrangement (20) includes rotating the support arrangement about a rotation axis (25). The method according to item 1 or 2 of the scope of patent application, wherein moving (X2, Y2) the support arrangement (20) includes rotating the support arrangement about a rotation axis (25) in a horizontal plane. A method for exchanging a mask device (10) from a mask carrier (15), the method includes: Performing the method for processing the masking device as described in any one of claims 2 to 12, the masking device being a first masking device; and The method for processing the masking device as described in any one of claims 1 and 3 to 12 is performed, and the masking device is a second masking device. A device (100) for exchanging a masking device (10) from a mask carrier (15), the device comprising: A supporting arrangement (20) for supporting the masking device (10); A mechanism (24) for moving the support arrangement (20) between a first state and a second state, the second state being a non-horizontal state; and An alignment assembly (26) is used to align the supporting arrangement (20) on the mask carrier (15). The device (100) according to item 14 of the scope of patent application, wherein the alignment assembly (26) includes one or more alignment elements (22), the one or more alignment elements are arranged relative to the support ( 20) is removable. The device (100) according to item 14 or 15 of the scope of patent application, wherein the support arrangement (20) includes one or more electromagnetic elements (22) for supporting the masking device (10) by magnetic force. The device (100) according to item 14 or 15 of the scope of patent application, wherein the first state is a state where an angle between a main surface of the mask device and a horizontal plane is 30 ° or less. The device (100) according to item 14 or 15 of the scope of patent application, wherein the second state is an angle between a major surface of the masking device (10) and a gravity vector is + 10 ° and -10 A state between °. A mask exchange chamber (300) includes: A magnetic levitation system (350) fitted to support a mask carrier (15); and The device (100) as described in any one of claims 14-18 of the scope of patent application, the device being used to exchange the masking device (10) from the mask carrier (15). A vacuum system (700) for depositing a material on a substrate. The vacuum system includes: The mask exchange chamber (300) as described in item 19 of the scope of patent application; At least one deposition chamber (710); and A mask transfer system (720) configured for transferring a plurality of masking devices and a mask exchange chamber (300) and the at least one deposition chamber (710) in a non-horizontal orientation. A plurality of used masking devices.